Resin composition, electronic component device, and method for manufacturing electronic component device

Abstract

A resin composition comprising a curable resin and an inorganic filler, wherein the resin composition has a melt viscosity greater than or equal to 5000 Pa·s at 20°C and a minimum melt viscosity less than or equal to 200 Pa·s.

Description

Technical Field

[0001] This disclosure relates to resin compositions, electronic component devices, and methods for manufacturing electronic component devices. Background Technology

[0002] In electronic component devices such as printed wiring boards and semiconductor packages, resin compositions containing curable resins are used to protect or electrically insulate electronic components and wiring mounted on a substrate.

[0003] In addition to liquid resin compositions, resin compositions that can be molded into arbitrary shapes such as sheets and plates have been developed for use in electronic component devices.

[0004] For example, International Publication No. 2023 / 282313 discloses a resin composition molded into a film.

[0005] Existing technical documents

[0006] Patent documents

[0007] Patent Document 1: International Publication No. 2023 / 282313 Summary of the Invention

[0008] The problem that the invention aims to solve

[0009] The resin composition, when molded into a film, exhibits reduced viscosity and fluidity upon heating. Therefore, by simultaneously heating and pressurizing the film-like resin composition in contact with the substrate, an insulating layer can be formed on the surface of the substrate.

[0010] On the other hand, film-like resin compositions tend to have low fluidity in directions other than the pressurization direction (e.g., perpendicular to the pressurization direction). Therefore, liquid resin compositions are used instead of film-like resin compositions to fill the gaps between the substrate and the electronic components disposed thereon.

[0011] If it is possible to use resin compositions molded into arbitrary shapes to perform the formation of an insulating layer on the surface of a substrate and the filling of gaps between the substrate and the electronic components disposed thereon in the same process, a significant increase in the productivity of electronic component devices can be expected.

[0012] In view of the above, one objective of this disclosure is to provide a resin composition that can be maintained in a state of being molded into any shape and has excellent flowability in a direction different from the direction of pressure, as well as an electronic component device using the resin composition and a method for manufacturing the electronic component device.

[0013] Methods for solving problems

[0014] The specific means to solve the above problems include the following methods.

[0015] <1> A resin composition comprising a curable resin and an inorganic filler, wherein the resin composition has a melt viscosity greater than or equal to 5000 Pa·s at 20°C and a minimum melt viscosity less than or equal to 200 Pa·s.

[0016] <2> according to <1> The resin composition is in the form of a film.

[0017] <3> according to <1> or <2> The resin composition wherein the curable resin comprises a curable resin that is liquid at 25°C and a curable resin that is solid at 25°C.

[0018] <4> according to <1> ~ <3> The resin composition described in any one of the above statements is used to fill the space between the substrate and the electronic component.

[0019] <5> An electronic component device includes a substrate, an electronic component, and a space disposed between the substrate and the electronic component. <1> ~ <4> The cured product of the resin composition described in any one of the above statements.

[0020] <6> A method for manufacturing an electronic component device, the electronic component device comprising a substrate and electronic components,

[0021] The method for manufacturing the electronic component device includes using... <1> ~ <4> The process of filling the space between the substrate and the electronic component with the resin composition described in any one of the above statements.

[0022] <7> according to <6> In the method for manufacturing the electronic component device, the filling of the resin composition is carried out by introducing a portion of the film-like resin composition into the space.

[0023] Invention Effects

[0024] According to one embodiment of the present disclosure, a resin composition capable of maintaining a state molded into any shape and exhibiting excellent flowability in a direction different from the direction of pressure can be provided, as well as an electronic component device using the resin composition and a method for manufacturing the electronic component device. Attached Figure Description

[0025] Figure 1 This is a diagram that schematically illustrates an example of a method for manufacturing an electronic component device according to the present disclosure.

[0026] Figure 2 This is a diagram that roughly illustrates an example of a conventional method for manufacturing electronic components. Detailed Implementation

[0027] In this disclosure, the term "process" includes not only processes that are independent of other processes, but also processes that can be clearly distinguished from other processes, as long as the purpose of the process can be achieved.

[0028] In this disclosure, within the numerical range represented by "~", the values ​​recorded before and after "~" are respectively the minimum and maximum values.

[0029] In the numerical ranges described in this disclosure, the upper or lower limit of one numerical range can be replaced by the upper or lower limit of another numerical range described in other stages. Furthermore, the upper or lower limit of the numerical range described in this disclosure can also be replaced by the values ​​shown in the embodiments.

[0030] In this disclosure, each component may comprise multiple corresponding substances. In the presence of multiple substances equivalent to each component in the composition, unless otherwise specified, the content or percentage of each component refers to the total content or percentage of the multiple substances present in the composition.

[0031] In this disclosure, "resin composition" refers to a mixture containing at least two or more components of a resin. When the resin composition includes a curing component, the state in which at least a portion of the curing component has reacted is also included in the resin composition.

[0032] In this disclosure, "solid components" refers to components other than volatile components such as solvents.

[0033] In this disclosure, "(meth)acrylate" means "acrylate" or "methacrylate", "(meth)acrylic acid" means "acrylic acid" or "methacrylic acid", and "(meth)acryloyl" means "acryloyl" or "methacryloyl".

[0034] Regarding the "molecular weight" of the compounds in this disclosure, if the compound is not a polymer but its structural formula can be determined, it refers to the molecular weight that can be calculated from the structural formula; if the compound is a polymer, it is the exponential average molecular weight.

[0035] The mechanisms of action described in this specification are speculative and do not limit the mechanisms by which the resin compositions involved in this embodiment exert their effects.

[0036] This embodiment also includes any combination of the items described in this specification.

[0037] <Resin Composition>

[0038] The resin composition disclosed herein comprises a curable resin and an inorganic filler, wherein the resin composition has a melt viscosity greater than or equal to 5000 Pa·s at 20°C and a minimum melt viscosity less than or equal to 200 Pa·s.

[0039] The resin composition of the present invention has a melt viscosity greater than or equal to 5000 Pa·s when measured at 20°C. Therefore, the resin composition disclosed herein can be maintained in a state that can be molded into any shape. For example, the resin composition of the present invention can be used as a film-like resin composition.

[0040] Furthermore, the resin composition of this disclosure has a minimum melt viscosity of less than or equal to 200 Pa·s. As shown in the examples described later, the resin composition with a minimum melt viscosity of less than or equal to 200 Pa·s exhibits excellent flowability in a direction different from the pressurization direction. Therefore, the resin composition of this disclosure can coat the surface of a substrate and fill the space (gap) between the substrate and the electronic components disposed thereon.

[0041] Therefore, according to the resin composition disclosed herein, it is possible to perform the formation of an insulating layer on the surface of a substrate and the filling of the space between the substrate and the electronic components disposed thereon in the same process.

[0042] There is no particular limitation on the upper limit of the melt viscosity of the resin composition disclosed herein, measured at 20°C.

[0043] From the viewpoint of maintaining the state of being molded into any shape while exhibiting excellent flowability in a direction different from the direction of pressure, the melt viscosity of the resin composition measured at 20°C is preferably less than or equal to 50,000 Pa·s, more preferably less than or equal to 20,000 Pa·s, and even more preferably less than or equal to 15,000 Pa·s.

[0044] From the viewpoint of exhibiting excellent flowability in a direction different from the direction of pressure, the minimum melt viscosity of the resin composition is preferably less than or equal to 100 Pa·s, more preferably less than or equal to 50 Pa·s, even more preferably less than or equal to 10 Pa·s, and particularly preferably less than or equal to 8 Pa·s.

[0045] There is no particular limitation on the lower limit of the minimum melt viscosity of the resin composition. For example, the minimum melt viscosity of the resin composition may be greater than or equal to 0.1 Pa·s, greater than or equal to 0.5 Pa·s, or greater than or equal to 1 Pa·s.

[0046] There are no particular limitations on the ratio (A / B) of the melt viscosity A to the minimum melt viscosity B of the resin composition as measured at 20°C.

[0047] From the viewpoint of maintaining the state of being molded into any shape while exhibiting excellent flowability in a direction different from the direction of pressure, the ratio (A / B) of the melt viscosity A to the minimum melt viscosity B of the resin composition measured at 20°C is preferably greater than or equal to 100, more preferably greater than or equal to 1000, and even more preferably greater than or equal to 2000.

[0048] The ratio (A / B) of the melt viscosity A to the minimum melt viscosity B of the resin composition measured at 20°C can be less than or equal to 20000, less than or equal to 15000, or less than or equal to 12000.

[0049] In this disclosure, the melt viscosity of the resin composition is measured using a viscoelasticity measuring device under the conditions described in the examples.

[0050] The resin composition can be in an uncured state (stage A) or a semi-cured state (stage B). The melt viscosity of the above-mentioned resin composition is the melt viscosity of the resin composition before it becomes a cured state (stage C).

[0051] In this disclosure, "semi-cured product" is synonymous with resin composition in the B-stage state in JIS K 6800 (2006), and "cured product" is synonymous with resin composition in the C-stage state in JIS K 6800 (2006).

[0052] The following describes the components that may be contained in the resin composition disclosed herein.

[0053] (Curing resin)

[0054] The resin composition contains a curable resin.

[0055] In this disclosure, a curable resin refers to a resin that exhibits the property of undergoing a chemical reaction and thus curing through treatment such as heating or irradiation with active rays.

[0056] Examples of curable resins that can be included in a resin composition include compounds having functional groups such as epoxy, N-substituted maleimide, vinyl, (meth)acryloyl, hydroxyl, carboxyl, and amino as reactive groups.

[0057] From the viewpoint of suitability for the manufacturing process of electronic components and devices, heat resistance, etc., curable resins are preferably thermosetting resins that exhibit the property of curing by heating.

[0058] The resin composition may contain only one type of curable resin or two or more types.

[0059] From the viewpoint of maintaining the state of being molded into any shape while exhibiting excellent flowability in a direction different from the direction of pressure, the resin composition preferably includes a curable resin that is solid at 25°C and a curable resin that is liquid at 25°C.

[0060] (Epoxy resin)

[0061] The resin composition may contain an epoxy resin as a curing resin, or it may contain an epoxy resin as a curing resin and a curing agent for the epoxy resin.

[0062] In this disclosure, epoxy resin refers to a compound having an epoxy group as a reactive group.

[0063] From the viewpoint of curing reactivity, epoxy resins are preferably compounds having two epoxy groups (hereinafter also referred to as diepoxy) or compounds having three or more epoxy groups (hereinafter also referred to as polyepoxy).

[0064] In this disclosure, "curing agent of epoxy resin" refers to a compound having at least one functional group capable of reacting with an epoxy group.

[0065] Specific examples of epoxy resins include: phenolic varnish-type epoxy resins (phenolic varnish-type epoxy resins, o-cresol varnish-type epoxy resins, etc.), which are obtained by epoxidizing phenolic varnish resins obtained by condensing or co-condensing phenolic compounds with aliphatic aldehyde compounds such as formaldehyde, acetaldehyde, and propionaldehyde under an acidic catalyst. The phenolic compounds are selected from at least one group consisting of phenolic compounds such as phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, and bisphenol F, and naphthol compounds such as α-naphthol, β-naphthol, and dihydroxynaphthol; and triphenylmethane-type epoxy resins, which are obtained by condensing or co-condensing the above-mentioned phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst. Epoxy resins are formed by epoxidation; copolymer epoxy resins are formed by epoxidation of phenolic varnish resins obtained by co-condensing the above-mentioned phenolic compounds and naphthol compounds with aldehyde compounds under an acidic catalyst; diphenylmethane-type epoxy resins as diglycidyl ethers of bisphenol A, bisphenol F, etc.; biphenyl-type epoxy resins as diglycidyl ethers of alkyl-substituted or unsubstituted biphenols; stilbene-type epoxy resins as diglycidyl ethers of stilbene phenol compounds; sulfur-containing atom-type epoxy resins as diglycidyl ethers of bisphenol S, etc.; epoxy resins as glycidyl ethers of alcohols such as butanediol, polyethylene glycol, and polypropylene glycol; and glycidyl ester-type epoxy resins as glycidyl esters of polycarboxylic acid compounds such as phthalic acid, isophthalic acid, and tetrahydrophthalic acid. Epoxy resins; glycidylamine-type epoxy resins formed by replacing aniline, diaminodiphenylmethane, isocyanuric acid, etc. with active hydrogen atoms bonded to nitrogen atoms using glycidyl groups; dicyclopentadiene-type epoxy resins formed by epoxidizing a co-condensation resin of dicyclopentadiene and phenol compounds; alicyclic epoxy resins such as vinylcyclohexene diepoxide, 3,4-epoxycyclohexylmethyl-3,4-epoxycyclohexane carboxylate, and 2-(3,4-epoxy)cyclohexyl-5,5-spiro(3,4-epoxy)cyclohexane-m-dioxane formed by epoxidizing the olefin bonds within the molecule; p-xylene-modified epoxy resins as glycidyl ethers of p-xylene-modified phenolic resins; m-xylene-modified epoxy resins as glycidyl ethers of m-xylene-modified phenolic resins. Terpene-modified epoxy resins as glycidyl ethers of terpene-modified phenolic resins; dicyclopentadiene-modified epoxy resins as glycidyl ethers of dicyclopentadiene-modified phenolic resins; cyclopentadiene-modified epoxy resins as glycidyl ethers of cyclopentadiene-modified phenolic resins; polycyclic aromatic ring-modified epoxy resins as glycidyl ethers of polycyclic aromatic ring-modified phenolic resins; naphthalene-type epoxy resins as glycidyl ethers of naphthalene-containing phenolic resins; halogenated phenolic varnish-type epoxy resins; hydroquinone-type epoxy resins; trimethylolpropane-type epoxy resins; linear aliphatic epoxy resins obtained by oxidizing olefin bonds with peracetic acid such as peracetic acid; aralkyl-type epoxy resins obtained by epoxidizing aralkyl-type phenolic resins such as phenol aralkyl resins and naphthol aralkyl resins; etc.Epoxy resin can be used alone or in combination of two or more types.

[0066] There are no particular limitations on the epoxy equivalent (molecular weight / number of epoxy groups) of the epoxy resin. From the viewpoint of balancing the moldability, electrical reliability, and other properties of the resin composition, a value of 100 g / eq to 1000 g / eq is preferred, and 150 g / eq to 500 g / eq is more preferred. The epoxy equivalent of the epoxy resin is a value determined according to the method in JIS K 7236:2009.

[0067] From the viewpoint of maintaining the state of being molded into any shape while exhibiting excellent flowability in a direction different from the direction of pressure, the resin composition preferably contains an epoxy resin having an oxyalkylene structure, and more preferably contains a dieoxy resin having an oxyalkylene structure.

[0068] In this disclosure, the oxoalkylene structure refers to -[OC m H 2m ] n The molecular structure is shown in the diagram. In the formula, n can be 1 or a number greater than or equal to 2 (i.e., polyepoxide). In the formula, m can be 2 (ethylene), 3 (propylene), or a number greater than or equal to them, or a combination of m different structural units. m is preferably 2 or 3.

[0069] Epoxy resins having an oxyalkylene structure preferably contain an aromatic ring, more preferably contain a bisphenol structure, and even more preferably contain a bisphenol A (diphenylmethane) structure.

[0070] Epoxy resins having an oxyalkylene structure can be compounds having the structure shown in the following general formula (1).

[0071] [Chemistry 1]

[0072]

[0073] In the formula, R 1 R 2 R 3 and R 4 Each can be independently represented by a methyl or hydrogen atom, preferably a methyl atom.

[0074] k and l are each independently a number greater than or equal to 0 (where k+l is greater than or equal to 1), preferably each independently a number greater than or equal to 1.

[0075] Examples of curing agents for epoxy resins include phenol curing agents, amine curing agents, acid anhydride curing agents, polythiol curing agents, polyaminoamide curing agents, isocyanate curing agents, and end-capped isocyanate curing agents.

[0076] The resin composition preferably contains a phenolic curing agent as a curing agent.

[0077] Examples of phenolic curing agents include: resorcinol, catechol, bisphenol A, bisphenol F, substituted or unsubstituted biphenols, and other polyphenolic compounds; phenolic resins for varnishes, which are obtained by condensing or co-condensing phenolic compounds with aldehydes such as formaldehyde, acetaldehyde, propionaldehyde, benzaldehyde, and salicylaldehyde under an acidic catalyst, wherein the phenolic compounds are selected from at least one of the following groups: phenol, cresol, xylenol, resorcinol, catechol, bisphenol A, bisphenol F, phenylphenol, aminophenol, and other phenolic compounds, and naphthols such as α-naphthol, β-naphthol, and dihydroxynaphthol; and compounds composed of the above phenolic compounds and dimethoxy-p-xylene, bis(methoxy-p-xylene), etc. Aryl alkyl phenolic resins such as phenolic aralkyl resins and naphthol aralkyl resins synthesized from phenolic compounds such as biphenyl; p-xylene and / or m-xylene modified phenolic resins; melamine modified phenolic resins; terpene modified phenolic resins; dicyclopentadiene-type phenolic resins and dicyclopentadiene-type naphthol resins synthesized by copolymerization of the above phenolic compounds and dicyclopentadiene; cyclopentadiene modified phenolic resins; polycyclic aromatic ring modified phenolic resins; biphenyl-type phenolic resins; triphenylmethane-type phenolic resins obtained by condensing or co-condensing the above phenolic compounds with aromatic aldehyde compounds such as benzaldehyde and salicylaldehyde under an acidic catalyst; and phenolic resins obtained by copolymerizing two or more of these. A single phenolic curing agent can be used, or two or more can be used in combination.

[0078] In one embodiment, the resin composition may also include a phenolic resin containing a biphenyl structure as a curing agent.

[0079] When the curing agent is a solid, its softening point or melting point is not particularly limited. For example, from the viewpoint of moldability and reflow resistance when the resin composition is used as a sealing material, the softening point or melting point of the curing agent is preferably 40°C to 180°C, and more preferably 50°C to 130°C from the viewpoint of operability when manufacturing the resin composition.

[0080] The melting point or softening point of the curing agent is a value measured in the same manner as the melting point or softening point of the epoxy resin.

[0081] There are no particular limitations on the functional group equivalent of the curing agent (hydroxyl equivalent in the case of phenol curing agents, and active hydrogen equivalent in the case of amine curing agents). From the viewpoint of balancing various properties such as moldability, reflow resistance, and electrical reliability, the functional group equivalent of the curing agent is preferably 70 g / eq to 1000 g / eq, and more preferably 80 g / eq to 500 g / eq.

[0082] In the case of phenolic curing agents, the hydroxyl equivalent is a value calculated based on the hydroxyl value determined according to JIS K 0070:1992. Similarly, in the case of amine curing agents, the active hydrogen equivalent is a value calculated based on the amine value determined according to JIS K 7237:1995.

[0083] When the resin composition contains epoxy resin and phenolic curing agent, the mass ratio of epoxy resin A to phenolic curing agent B (A:B) is preferably selected from the range of 1:0.05 to 1:0.2.

[0084] When the resin composition contains epoxy resin and phenolic curing agent, the resin composition preferably contains epoxy resin that is liquid at 25°C and phenolic curing agent that is solid at 25°C.

[0085] The resin composition may also contain an amine curing agent as a curing agent.

[0086] As an amine curing agent, a compound having an aromatic ring (aromatic amine compound) is preferred, more preferably an aromatic amine compound that is liquid at 25°C, and even more preferably an aromatic amine compound that is liquid at 25°C and has two amino groups in one molecule.

[0087] Examples of aromatic amine compounds that are liquid at 25°C include 3,5-diethyltoluene-2,4-diamine, 3,5-diethyltoluene-2,6-diamine, 1-methyl-3,5-diethyl-2,4-diaminobenzene, 1-methyl-3,5-diethyl-2,6-diaminobenzene, 1,3,5-triethyl-2,6-diaminobenzene, 3,3'-diethyl-4,4'-diaminodiphenylmethane, and 3,5,3',5'-tetramethyl-4,4'-diaminodiphenylmethane.

[0088] From the viewpoint of storage stability, 3,3'-diethyl-4,4'-diaminodiphenylmethane and diethyltoluenediamine are preferred among the above compounds.

[0089] When the resin composition contains a phenolic curing agent and an amine curing agent, the mass ratio (A:B) of phenolic curing agent A to amine curing agent B is preferably selected from the range of 1:1 to 1:2.5.

[0090] The curable resin contained in the resin composition may be a free radical polymerizable curable resin.

[0091] Resin compositions containing curable resins with free radical polymerization properties, such as those containing epoxy resins, are less prone to changes in properties during storage. Therefore, they have advantages such as being able to be stored at room temperature.

[0092] Among free radical polymerizable curable resins, maleimide resins are preferred from the viewpoint of heat resistance and dielectric properties (low dielectric constant).

[0093] In this disclosure, maleimide resin refers to a compound having an N-substituted maleimide group as a reactive group.

[0094] From the viewpoint of curing reactivity, maleimide resins are preferably compounds having two N-substituted maleimide groups (hereinafter also referred to as bismaleimide resins) or compounds having three or more N-substituted maleimide groups (hereinafter also referred to as polymaleimide resins).

[0095] From the viewpoint of heat resistance, maleimide resins are preferably compounds having N-substituted maleimide groups directly bonded to the aromatic ring (hereinafter also referred to as aromatic maleimide resins), and more preferably compounds having two or three or more N-substituted maleimide groups directly bonded to the aromatic ring (hereinafter also referred to as aromatic bismaleimide resins or aromatic polymaleimide resins).

[0096] The maleimide resin contained in the resin composition may be only one type or two or more types.

[0097] The maleimide resin contained in the resin composition can be a compound having N-substituted maleimide groups at both ends of the molecule. Examples of compounds having N-substituted maleimide groups at both ends of the molecule include compounds represented by the following formula (A1).

[0098] [Chemistry 2]

[0099]

[0100] In the formula, X a11 It is a divalent organic group. X a11 The structure of the divalent organic group shown is not particularly limited. X a11 The divalent organic groups shown can include structures formed by the linkage of the same structural units, or can further include N-substituted maleimide groups.

[0101] Maleimide resins can contain fused rings of aromatic and aliphatic rings. A preferred example of a fused ring of aromatic and aliphatic rings is the indane ring. An indane ring refers to a condensed bicyclic structure of an aromatic 6-membered ring and a saturated aliphatic 5-membered ring. The indane ring contained in the maleimide resin is preferably contained in the form of a divalent group as shown in the following general formula (A1-1).

[0102] [Chemistry 3]

[0103]

[0104] In the formula, R a1 It can be an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a hydroxyl group, or a mercapto group. a1 Integers between 0 and 3. R a2 ~R a4 Each is an alkyl group having 1 to 10 carbon atoms. * indicates a bonding site (the same applies below).

[0105] As R a1 Examples of alkyl groups with 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl. These alkyl groups can be either straight-chain or branched.

[0106] As R a1 The alkyl groups contained in the alkoxy groups having 1 to 10 carbon atoms and the alkylthio groups having 1 to 10 carbon atoms shown can be alkyl groups that are the same as the alkyl groups having 1 to 10 carbon atoms mentioned above.

[0107] As R a1 Examples of aryl groups with 6 to 10 carbon atoms include phenyl and naphthyl groups.

[0108] As R a1 The aryl groups contained in the aryloxy groups with 6 to 10 carbon atoms and the arylthio groups with 6 to 10 carbon atoms shown can be aryl groups that are the same as the aryl groups with 6 to 10 carbon atoms mentioned above.

[0109] As R a1 Examples of cycloalkyl groups with 3 to 10 carbon atoms include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, and cyclodecyl.

[0110] From the perspective of solubility and reactivity in solvents, R a1 Preferably, it is an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms, and more preferably an alkyl group having 1 to 4 carbon atoms.

[0111] As R a2 ~R a4 Examples of alkyl groups with 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl. These alkyl groups can be either straight-chain or branched. Wherein, R... a2 ~R a4 Preferably, it is an alkyl group having 1 to 4 carbon atoms, more preferably methyl or ethyl, and even more preferably methyl.

[0112] n a1 Integers between 0 and 3. In na1 In the case of 2 or 3, 2 or 3 R a1 They can be the same or different.

[0113] From the viewpoint of ease of manufacture, the divalent group represented by general formula (A1-1) is preferably n-valent. a1 =0, R a2 ~R a4 The divalent group is methyl. Specifically, the divalent group shown in formula (A1-1a) is preferred, and the divalent group shown in formula (A1-1a') or formula (A1-1a”) is more preferred.

[0114] [Chemistry 4]

[0115]

[0116] Maleimide resins containing indanium rings are preferably aromatic maleimide resins, more preferably aromatic bismaleimide resins, and even more preferably compounds represented by the following general formula (A1-2).

[0117] [Chemistry 5]

[0118]

[0119] In the formula, R a1 ~R a4 and n a1 Same as in general formula (A1-1). R a5 Each of the following is independently an alkyl group having 1 to 10 carbon atoms, an alkoxy group having 1 to 10 carbon atoms, an alkylthio group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an aryloxy group having 6 to 10 carbon atoms, an arylthio group having 6 to 10 carbon atoms, a cycloalkyl group having 3 to 10 carbon atoms, a halogen atom, a nitro group, a hydroxyl group, or a mercapto group. a2 Each is an independent integer between 0 and 4. a3 Numbers ranging from 0.95 to 10.0.

[0120] In the formula, multiple R a1 Multiple n a1 Multiple R a5 or multiple n a2 They can be the same or different.

[0121] In n a3 In cases where the number of R exceeds 1, multiple R a2 Multiple R a3 or multiple R a4 They can be the same or different.

[0122] As R a5Examples of alkyl groups with 1 to 10 carbon atoms include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, and decyl. These alkyl groups can be either straight-chain or branched.

[0123] As R a5 The alkyl groups contained in the alkoxy groups having 1 to 10 carbon atoms and the alkylthio groups having 1 to 10 carbon atoms shown can be alkyl groups that are the same as the alkyl groups having 1 to 10 carbon atoms mentioned above.

[0124] As R a5 Examples of aryl groups with 6 to 10 carbon atoms include phenyl and naphthyl groups.

[0125] As R a5 The aryl groups contained in the aryloxy groups with 6 to 10 carbon atoms and the arylthio groups with 6 to 10 carbon atoms shown can be aryl groups that are the same as the aryl groups with 6 to 10 carbon atoms mentioned above.

[0126] As R a5 Examples of cycloalkyl groups with 3 to 10 carbon atoms include cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl, cycloheptyl, cyclooctyl, cyclononyl, and cyclodecyl.

[0127] From the perspective of solvent solubility and ease of manufacture, R a5 Preferably, it is an alkyl group having 1 to 4 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 10 carbon atoms; more preferably, it is an alkyl group having 1 to 3 carbon atoms; and even more preferably, it is a methyl group.

[0128] n in the formula a2 The value is an integer from 0 to 4. From the viewpoint of compatibility with other resins, dielectric properties, conductor adhesion and ease of manufacture, it is preferably an integer from 1 to 3, more preferably 2 or 3, and even more preferably 2.

[0129] It should be noted that by making n a2 A value greater than or equal to 1 results in a distorted conformation of the benzene ring and the N-substituted maleimide group, which tends to further improve solvent solubility by suppressing intermolecular stacking. From the perspective of suppressing intermolecular stacking, in n a2 When R is greater than or equal to 1, a5 The substitution position is preferably ortho relative to the N-substituted maleimide group.

[0130] From the perspectives of dielectric properties, conductor adhesion, solvent solubility, processability, and heat resistance, n in the formula... a3 The number is preferably in the range of 0.98 to 8.0, more preferably in the range of 1.0 to 7.0, and even more preferably in the range of 1.1 to 6.0. It should be noted that n a3 This represents the average number of structural units containing indrin rings.

[0131] From the viewpoints of dielectric properties, conductor adhesion, solvent solubility and ease of manufacture, the maleimide resin represented by general formula (A1-2) is more preferably the maleimide resin represented by general formula (A1-3) or the maleimide resin represented by general formula (A1-4).

[0132] [Chemistry 6]

[0133]

[0134] In the formula, R a1 ~R a5 n a1 and n a3 Same as in general formula (A1-2).

[0135] [Chemistry 7]

[0136]

[0137] In the formula, R a1 ~R a4 n a1 and n a3 Same as in general formula (A1-2).

[0138] Examples of maleimide resins represented by general formula (A1-3) include maleimide resins represented by general formula (A1-3-1), maleimide resins represented by general formula (A1-3-2), and maleimide resins represented by general formula (A1-3-3).

[0139] [Chemistry 8]

[0140]

[0141] In the formula, n a3 Same as in general formula (A1-2).

[0142] The maleimide resin (A1) represented by general formula (A1-4) is preferably the maleimide resin represented by the following general formula (A1-4-1).

[0143] [Chemistry 9]

[0144]

[0145] In the formula, n a3 Same as in general formula (A1-2).

[0146] Maleimide resins containing indanium rings can be synthesized by known methods. For example, maleimide resins containing indanium rings can be synthesized by the method described in International Publication No. 2023 / 282313.

[0147] When the resin composition contains maleimide resin as a curing resin and also contains maleimide resin comprising an indane ring as a maleimide resin, the content of the maleimide resin comprising an indane ring is preferably greater than or equal to 50% by mass of the total maleimide resin, more preferably greater than or equal to 70% by mass, and even more preferably greater than or equal to 80% by mass. The content of the maleimide resin comprising an indane ring can be 100% by mass of the total maleimide resin.

[0148] The number-average molecular weight of maleimide resins containing indane rings is not particularly limited. From the viewpoint of compatibility with other resins, conductor adhesion, and heat resistance, the number-average molecular weight of maleimide resins is preferably 600 to 3,000, more preferably 800 to 2,000, and even more preferably 1,000 to 1,500.

[0149] In this invention, the number-average molecular weight of the compounds was determined by gel permeation chromatography (GPC) converted to polystyrene. The determination conditions for GPC are shown below.

[0150] Device: High-speed GPC device HLC-8320GPC

[0151] Detector: UV-8320 ultraviolet absorbance detector [manufactured by Tosoh Corporation]

[0152] Columns: Protective column; TSK Guardcolumn SuperHZ-L+ column; TSKgel SuperHZM-N+ TSKgel SuperHZM-M+ TSKgel SuperH-RC (all manufactured by Tosoh Corporation, trade names)

[0153] Column dimensions: 4.6×20mm (protective column), 4.6×150mm (column), 6.0×150mm (reference column)

[0154] Eluent: Tetrahydrofuran

[0155] Sample concentration: 10 mg / 5 mL

[0156] Injection volume: 25μL

[0157] Flow rate: 1.00 mL / min

[0158] Measurement temperature: 40℃

[0159] The standard curve is approximated using standard polystyrene: TSKstandard POLYSTYRENE (Type: A-2500, A-5000, F-1, F-2, F-4, F-10, F-20, F-40) (manufactured by Tosoh Corporation, trade name) through a cubic equation.

[0160] The maleimide resin included in the resin composition as a curable resin may be a maleimide resin other than a maleimide resin containing an inden ring.

[0161] Specific examples of maleimide resins other than those containing an indane ring include N,N'-ethylidene bismaleimide, N,N'-hexamethylene bismaleimide, N,N'-(1,3-phenylene)bismaleimide, N,N'-[1,3-(2-methylphenylene)bismaleimide, N,N'-[1,3-(4-methylphenylene)]bismaleimide, N,N'-(1,4-phenylene)bismaleimide, bis(4-maleimidephenyl)methane, and bis(3-methyl-4-maleimide)... 3,3'-Dimethyl-5,5'-diethyl-4,4'-diphenylmethane bismaleimide, bis(4-maleimidephenyl) ether, bis(4-maleimidephenyl) sulfone, bis(4-maleimidephenyl) sulfide, bis(4-maleimidephenyl) ketone, bis(4-maleimidecyclohexyl)methane, 1,4-bis(4-maleimidephenyl)cyclohexane, 1,4-bis(maleimidemethyl)cyclohexane, 1,4-bis(maleimidemethyl)benzene, 1,3-bis(4-maleimidephenoxy)benzene, 1,3-Bis(3-maleimidephenoxy)benzene, bis[4-(3-maleimidephenoxy)phenyl]methane, bis[4-(4-maleimidephenoxy)phenyl]methane, 1,1-bis[4-(3-maleimidephenoxy)phenyl]ethane, 1,1-bis[4-(4-maleimidephenoxy)phenyl]ethane, 1,2-bis[4-(3-maleimidephenoxy)phenyl]ethane, 1,2-bis[4-(4-maleimidephenoxy)phenyl]ethane, 2,2-bis[4-(3-maleimidephenoxy)phenyl]ethane [Phenyl]propane, 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane, 2,2-bis[4-(3-maleimidephenoxy)phenyl]butane, 2,2-bis[4-(4-maleimidephenoxy)phenyl]butane, 2,2-bis[4-(3-maleimidephenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 2,2-bis[4-(4-maleimidephenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane, 4,4-bis(3-maleimidephenoxy)biphenyl, 4,4-Bis(4-maleimidephenoxy)biphenyl, bis[4-(3-maleimidephenoxy)phenyl]one, bis[4-(4-maleimidephenoxy)phenyl]one, bis(4-maleimidephenyl)disulfide, bis[4-(3-maleimidephenoxy)phenyl]sulfide, bis[4-(4-maleimidephenoxy)phenyl]sulfide, bis[4-(3-maleimidephenoxy)phenyl]sulfide, bis[4-(3-maleimidephenoxy)phenyl] Sulfoxide, bis[4-(4-maleimidephenoxy)phenyl] sulfoxide, bis[4-(3-maleimidephenoxy)phenyl] sulfone, bis[4-(4-maleimidephenoxy)phenyl] sulfone, bis[4-(3-maleimidephenoxy)phenyl] ether, bis[4-(4-maleimidephenoxy)phenyl] ether, 1,4-bis[4-(4-maleimidephenoxy)-α,α-dimethylbenzyl]benzene, 1 3-Bis[4-(4-maleimidephenoxy)-α,α-dimethylbenzyl]benzene, 1,4-Bis[4-(3-maleimidephenoxy)-α,α-dimethylbenzyl]benzene, 1,3-Bis[4-(3-maleimidephenoxy)-α,α-dimethylbenzyl]benzene, 1,4-Bis[4-(4-maleimidephenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3- Bis[4-(4-maleimidephenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,4-bis[4-(3-maleimidephenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, 1,3-bis[4-(3-maleimidephenoxy)-3,5-dimethyl-α,α-dimethylbenzyl]benzene, polyphenylmethane maleimide, biphenyl aralkyl maleimide, etc.

[0162] The resin composition may comprise an aminomaleimide resin having structural units from maleimide resins and structural units from diamine compounds as a maleimide resin.

[0163] The resin composition may contain a compound having a (meth)acryloyl group as a curable resin.

[0164] When a resin composition contains maleimide resin as a curable resin, from the viewpoint of balancing the properties of the resin composition, the resin composition preferably contains maleimide resin and a compound having (meth)acryloyl groups, respectively.

[0165] The resin composition may contain only one compound having a (meth)acryloyl group, or it may contain two or more compounds.

[0166] Examples of compounds having a (meth)acryloyl group include di(meth)acrylates, (meth)acrylates with three or more functions, and other (meth)acrylates.

[0167] Examples of di(meth)acrylates include 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, tricyclodecane di(meth)acrylate, 1,12-dodecanediol di(meth)acrylate, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polypropylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, ethoxylated bisphenol A di(meth)acrylate, ethoxylated bisphenol F di(meth)acrylate, and dioxanediol di(meth)acrylate.

[0168] Examples of dioxanediol di(meth)acrylates include 2-[5-ethyl-5-[(acryloyloxy)methyl]-1,3-dioxane-2-yl]-2,2-dimethyl ethyl acrylate.

[0169] Examples of trifunctional or higher (meth)acrylates include trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0170] From the viewpoint of balancing the properties of the resin composition, the resin composition preferably contains di(meth)acrylate, more preferably di(meth)acrylate containing alkylene groups, and even more preferably di(meth)acrylate containing (meth)acryloyl groups bonded to both ends of the alkylene groups.

[0171] As di(meth)acrylates containing alkylene groups, diacrylates of general formula (B-1) and dimethacrylates of general formula (B-2) are preferred, and dimethacrylates of general formula (B-2) are more preferred.

[0172] [Chemistry 10]

[0173]

[0174] In the formula, R b1 It is an alkylene group having 1 to 20 carbon atoms.

[0175] In the above general formulas (B-1) and (B-2), R b1 The alkylene groups with 1 to 20 carbon atoms shown preferably have 4 to 18 carbon atoms, more preferably 6 to 15 carbon atoms, and even more preferably 8 to 12 carbon atoms.

[0176] Examples of alkylene compounds with 1 to 20 carbon atoms include methylene, ethylene, propylene, butylene, pentylene, hexylene, heptylene, octylene, nonylene, decylene, undecylene, dodecylene, tetradecylene, and pentadecylene. The alkylene compounds can be linear, branched, or cyclic, preferably linear.

[0177] (Inorganic filler material)

[0178] The resin composition contains inorganic filler materials.

[0179] If the resin composition contains inorganic fillers, there is a tendency for the cured resin composition to have a lower coefficient of thermal expansion and improved heat resistance and flame retardancy.

[0180] The inorganic filler contained in the resin composition may be only one type or two or more types.

[0181] Examples of inorganic filler materials include silica, alumina, titanium dioxide, beryllium oxide, barium titanate, potassium titanate, strontium titanate, calcium titanate, aluminum carbonate, magnesium hydroxide, aluminum hydroxide, aluminum silicate, calcium carbonate, calcium silicate, magnesium silicate, silicon nitride, boron nitride, aluminum borate, and silicon carbide. Among these, silica and alumina are preferred from the perspectives of low thermal expansion, heat resistance, and flame retardancy.

[0182] The average particle size of the inorganic filler is not particularly limited, but from the viewpoint of dispersibility in the resin composition and suitability for micro-wires, it is preferably 0.01 μm to 20 μm, more preferably 0.1 μm to 10 μm, and even more preferably 0.5 μm to 5 μm.

[0183] In this disclosure, the average particle size of the inorganic filler material refers to the particle size at which the volume accumulation in the volume-based particle size distribution curve reaches 50% (volume-average particle size, D50). The volume-based particle size distribution curve is obtained, for example, by laser diffraction scattering.

[0184] The shape of the inorganic filler material is not particularly limited, but it is preferably spherical.

[0185] To improve dispersibility and adhesion to organic components, inorganic fillers can be surface-treated with coupling agents. Examples of coupling agents include silane coupling agents and titanate coupling agents. Silane coupling agents are preferred. Examples of silane coupling agents include aminosilane coupling agents, vinylsilane coupling agents, and epoxysilane coupling agents.

[0186] (Curing accelerator)

[0187] The resin composition may contain a curing accelerator. By including a curing accelerator in the resin composition, there is a tendency to improve the curability of the resin composition, as well as the dielectric properties and heat resistance of the cured product.

[0188] There are no particular restrictions on the type of curing accelerator; it can be selected based on the type of curable resin contained in the resin composition.

[0189] Examples of curing accelerators include acidic catalysts such as p-toluenesulfonic acid; amine compounds such as triethylamine, pyridine, tributylamine, and dicyandiamide; imidazole compounds such as methylimidazole, phenylimidazole, and 1-cyanoethyl-2-phenylimidazole; isocyanate-blocked imidazole compounds such as the addition reaction product of hexamethylene diisocyanate resin and 2-ethyl-4-methylimidazole; tertiary amine compounds; quaternary ammonium compounds; phosphorus compounds such as triphenylphosphine; and dicumyl peroxide and 2,5-dimethyl-2,5-bis(tert-butylperoxide). Organic peroxides such as 3,5-dimethyl-2,5-bis(tert-butylperoxy)hexane and tert-butylperoxyisopropyl monocarbonate; organic peroxides such as 1,3-bis(tert-butylperoxyisopropyl)benzene; inorganic peroxides such as potassium persulfate, sodium persulfate, and ammonium persulfate; azo compounds such as 2,2'-azobisisobutyronitrile, 2,2'-azobis(2,4-dimethylpentanitrile), and 2,2'-azobis(4-methoxy-2'-dimethylpentanitrile); and carboxylates such as manganese, cobalt, and zinc.

[0190] When the resin composition contains a curable resin with free radical polymerization properties, it is preferable to include a free radical polymerization initiator as a curing accelerator. Examples of free radical polymerization initiators include organic peroxides, inorganic peroxides, and azo compounds. From the viewpoint of improving curability, organic peroxides are preferred.

[0191] The resin composition may contain only one type of curing accelerator or two or more types.

[0192] When the resin composition contains a curing accelerator, its content is not particularly limited, but is preferably 0.1 to 15 parts by mass relative to the total amount of resin components (100 parts by mass), more preferably 1 to 10 parts by mass, and even more preferably 4 to 8 parts by mass.

[0193] If the content of the curing accelerator is greater than or equal to 0.1 parts by weight, there is a tendency to obtain a sufficient curing promotion effect. If the content of the curing accelerator is less than or equal to 15 parts by weight, there is a tendency for the storage stability of the resin composition to become better.

[0194] When the resin composition contains a free radical polymerization initiator as a curing accelerator, its content is not particularly limited, but is preferably 0.05 to 7 parts by mass relative to the total amount of resin components (100 parts by mass), more preferably 0.5 to 5 parts by mass, and even more preferably 2 to 4 parts by mass.

[0195] If the content of the free radical polymerization initiator is greater than or equal to the lower limit mentioned above, there is a tendency to easily obtain a sufficient curing promotion effect. Conversely, if the content of the free radical polymerization initiator is less than or equal to the upper limit mentioned above, there is a tendency for better storage stability.

[0196] (Other ingredients)

[0197] The resin composition may include components other than those listed above (other components) as needed. Examples of other components include flame retardants, antioxidants, heat stabilizers, antistatic agents, ultraviolet absorbers, colorants, lubricants, etc.

[0198] The resin composition may contain only one other component or two or more components.

[0199] (Various properties of resin compositions)

[0200] There are no particular restrictions on the content of the components in the resin composition, and the content can be selected according to the intended use of the resin composition.

[0201] From the viewpoint of maintaining the state of molding into any shape while exhibiting excellent flowability in a direction different from the direction of pressure, the content of inorganic filler in the resin composition can be 40% to 90% by volume, 45% to 85% by volume, or 50% to 80% by volume.

[0202] From the viewpoint of maintaining the state of being molded into any shape while exhibiting excellent flowability in a direction different from the direction of pressure, the content of organic components in the resin composition can be 10 vol% to 60 vol%, 15 vol% to 55 vol%, or 20 vol% to 50 vol%.

[0203] The “content of organic components” mentioned above refers to the content of non-volatile organic components in the organic components contained in the resin.

[0204] The shape of the resin composition is not particularly limited and can be selected according to the intended use of the resin composition. In one embodiment, the resin composition of this disclosure may be in film form.

[0205] Hereinafter, the film-like resin composition will also be referred to as "resin film".

[0206] There are no particular limitations on the thickness of the resin film; it can be selected based on the intended use of the resin film. For example, the thickness of the resin film can be greater than or equal to 10 μm, greater than or equal to 50 μm, greater than or equal to 80 μm, or greater than or equal to 100 μm.

[0207] The thickness of the resin film can be, for example, less than or equal to 1,000 μm, less than or equal to 700 μm, or less than or equal to 500 μm.

[0208] From the viewpoint of the operability of the resin membrane, the resin membrane is preferably disposed on the support.

[0209] There are no particular restrictions on the material of the support; examples include resin, metal, and paper. If necessary, the surface of the support in contact with the resin film can also be demolded.

[0210] The thickness of the support is not particularly limited, but from the point of view of operability and economy, it is preferably 10μm to 150μm, more preferably 20μm to 100μm, and even more preferably 25μm to 50μm.

[0211] A resin film disposed on a support can be made, for example, by coating a resin varnish obtained by adding an organic solvent to a resin composition onto the support and drying it to remove the organic solvent.

[0212] The content of organic solvent in the dried resin film is preferably less than or equal to 2% by mass relative to the total amount of the resin film (100% by mass), more preferably less than or equal to 1% by mass, even more preferably less than or equal to 0.5% by mass, and may also be 0% by mass.

[0213] If the content of organic solvent in the resin film is within the above range, the volatilization of organic solvent during heat curing can be sufficiently suppressed.

[0214] A resin film can be a state in which at least a portion of the curable components contained in the resin film have reacted.

[0215] The resin film may have a protective film disposed on its surface. For example, the resin film may have a support disposed on one side and a protective film disposed on the other side.

[0216] There are no particular restrictions on the material of the protective film; examples include resin, metal, and paper. If necessary, the surface of the protective film in contact with the resin film can be treated for release.

[0217] The thickness of the protective film is not particularly limited, but from the point of view of operability and economy, it is preferably 10μm to 150μm, more preferably 20μm to 100μm, and even more preferably 25μm to 50μm.

[0218] The uses of the resin compositions disclosed herein are not particularly limited. Examples of preferred uses include the formation of insulating layers in printed wiring boards and the sealing of semiconductor elements contained in semiconductor packages.

[0219] <Manufacturing Method of Electronic Components and Devices>

[0220] The method for manufacturing an electronic component device disclosed herein is a method for manufacturing an electronic component device having a substrate and an electronic component, including a step of filling the space between the substrate and the electronic component with the resin composition disclosed herein.

[0221] In the above method, the space between the substrate and the electronic component can be filled using a resin composition while heat and pressure are being applied to the resin composition. The conditions for applying heat and pressure are not particularly limited and can be selected based on the composition of the resin composition, etc.

[0222] In the above method, the space between the substrate and the electronic components can be filled using a resin composition while the pressure is reduced. There are no particular limitations on the method of reducing the pressure; it can be carried out using known methods such as vacuum lamination.

[0223] In the above method, filling the space between the substrate and the electronic component with the resin composition can also be done by introducing a portion of the film-like resin composition into the space between the substrate and the chip.

[0224] Hereinafter, an example of a method for manufacturing an electronic component device using a film-like resin composition will be described with reference to the accompanying drawings.

[0225] Figure 1 This is a process diagram that schematically illustrates an example of a method for manufacturing an electronic component device according to the present disclosure.

[0226] First, such as Figure 1 As shown in (A), electronic components 20 are disposed on substrate 10. Examples of electronic components 20 include semiconductor chips, interpolators, etc.

[0227] Next, as Figure 1 As shown in (B), protrusions 30 are formed around the electronic component 20. Examples of protrusions 30 include metal pillars, metal posts, solder balls, wiring patterns, etc. The protrusions 30 may also be portions that bulge relative to each other between recesses in the substrate 10 having recesses such as grooves. The spacing between adjacent protrusions 30 can be selected, for example, from 10 μm to 200 μm. The height of the protrusions 10 can be selected, for example, from 10 μm to 200 μm.

[0228] Next, as Figure 1 As shown in (C), a resin film 40 is disposed on a substrate 10 on which electronic components 20 and protrusions 30 are disposed, and pressure is applied while the resin film 40 is heated. The arrows in the figure indicate the direction of pressure application.

[0229] like Figure 1As shown in (D), the resin film 40, which exhibits fluidity upon heating, flows in the direction of pressure to fill the space between the protrusions 30, while forming an insulating layer on the surface of the substrate 10. Furthermore, a portion of the resin film 40 also flows in a direction perpendicular to the direction of pressure to fill the space between the electronic component 20 and the substrate 10.

[0230] Figure 2 This is a process diagram that roughly illustrates an example of a conventional method for manufacturing electronic components.

[0231] First, such as Figure 2 As shown in (A), electronic components 20 are disposed on substrate 10. Figure 1 (A) Different, in Figure 2 In (A), the space between the substrate 10 and the electronic component 20 is filled with a bottom filler material 50.

[0232] Figure 2 The explanations of (B), (C) and (D) are as follows: Figure 1 The explanations for (B), (C), and (D) are the same, so they are omitted.

[0233] As mentioned above, in Figure 2 In the conventional method shown, a process is performed to fill the space between the substrate and the electronic components with a bottom filler material. In contrast, in... Figure 1 In the method of this disclosure, instead of filling the space between the substrate and the electronic components with a bottom filler material, a resin film is used for filling. Therefore, Figure 1 The method shown is the same as Figure 2 Compared to the method shown, this method has fewer steps and superior productivity.

[0234] <Electronic Components and Devices>

[0235] The electronic component device disclosed herein includes a substrate, an electronic component, and a cured product of the resin composition disclosed herein disposed between the substrate and the electronic component.

[0236] As a substrate included in an electronic component device, there are no particular limitations on using known substrates such as glass epoxy substrates, metal substrates, polyester substrates, polyimide substrates, BT resin (bismaleimide-triazine resin) substrates, and thermosetting polyphenylene ether substrates. The substrate can also be a substrate (circuit substrate) on which a conductor layer for circuitry is formed in a pattern on its surface.

[0237] As an electronic component device, electronic components include semiconductor chips, interpolators, and other components mounted on a substrate without particular restriction.

[0238] Example

[0239] The following examples illustrate this implementation method. However, this implementation method is not limited to the following examples.

[0240] (Preparation of resin film)

[0241] The materials shown in Table 1 were mixed with methyl ethyl ketone to prepare a resin composition with a solid content of 50% by mass. This resin composition was coated onto the demolded side of a PET film and dried by heating (105°C for 5 minutes) to produce a resin film with a thickness of 0.15 mm.

[0242] (Determination of melt viscosity)

[0243] The melt viscosity and minimum melt viscosity of the resin film at 20°C were determined using a viscoelasticity measuring apparatus (trade name: ARES-G2, manufactured by TA Instruments). The measurement conditions were set as follows: heating rate: 5°C / min, temperature range: 20°C~170°C, frequency: 0.5Hz, strain: 5.0%.

[0244] (Evaluation of fillability)

[0245] An apparatus is fabricated in which glass plates simulating electronic components are arranged on a glass plate simulating a substrate with gaps between them. Specifically, spacers with a thickness of 30 μm (2 mm × 2 mm) are attached to the four corners of glass plate A (20 mm × 20 mm) simulating electronic components. Glass plate A is placed on glass plate B (70 mm × 45 mm) simulating a substrate and fixed with the spacers between them.

[0246] A resin film was placed on glass plate A and then pressurized. The pressurization was performed using a vacuum lamination device under the following conditions: 120 seconds of vacuuming, 30 seconds of pressurization, 0.2 MPa of pressure, and 100°C. After pressurization, the state of the gap between glass plate A and glass plate B was observed from the glass plate B side to evaluate the filling performance of the resin film.

[0247] Specifically, the filling performance of the resin film was evaluated when the proportion of the total area of ​​voids observed from side B of the glass plate that was filled by the resin film was greater than or equal to 50%, and when it was less than 50%, it was evaluated as NG. The results are shown in Table 1.

[0248] [Table 1]

[0249]

[0250] [Table 2]

[0251]

[0252] The details of the components recorded in Tables 1 and 2 are as follows.

[0253] Epoxy resin: liquid at 25℃, in general formula (1) R 1 R 2 R 3 and R 4 The epoxy resins are methyl-based, with an epoxy equivalent of 260 g / eq and a viscosity of 1800 mPa·s at 25°C (ADEKA Co., Ltd., EP-4000S).

[0254] Curing agent 1: Phenolic resin containing biphenyl structure that is solid at 25°C (UBE Corporation, MEHC-7851SS).

[0255] Curing agent 2: A curing agent containing 3,3'-diethyl-4,4'-diaminodiphenylmethane (KAYAHARD AA, Nippon Kayaku Co., Ltd.) that is liquid at 25°C.

[0256] Curing agent 3: Liquid at 25°C, diethyltoluenediamine (Mitsubishi Chemical Corporation, jERCURE WA)

[0257] Methacrylates: Liquid at 25°C; 1,9-nonanediol dimethacrylate (NOD-N, Shin-Nakamura Chemical Industry Co., Ltd.)

[0258] Maleimide resin: An aromatic bismaleimide resin containing an indane ring, which is solid at 25°C, with a number average molecular weight of 1,300.

[0259] Thermoplastic elastomers: Styrene-based thermoplastic elastomers (P1500, Asahi Kasei Corporation)

[0260] Curing accelerator 1: 1,3-Di(tert-butylperoxyisopropyl)benzene (NOF Corporation)

[0261] Curing accelerator 2: Isocyanate-blocked imidazole (G8009L, Daiichi Kogyo Pharmaceutical Co., Ltd.)

[0262] Inorganic filler material 1: Silica particles with a volume average particle size of 2.4 μm (EQ2410-SMC, Tird Age Technologies Co, Ltd.)

[0263] Inorganic filler material 2: Silica particles with a volume average particle size of 1.0 μm (EQ1010-SMC, Tird Age Technologies Co, Ltd.)

[0264] Inorganic filler material 3: Silica particles with a volume average particle size of 1.3 μm (SE5050-SEJ, Admatechs Co., Ltd.)

[0265] As shown in Tables 1 and 2, the resin compositions of Examples 1 to 3, with melt viscosity greater than or equal to 5000 Pa·s and minimum melt viscosity less than or equal to 200 Pa·s measured at 20°C, can maintain the film shape well and have excellent filling properties.

[0266] Explanation of reference numerals in the attached figures

[0267] 10: Substrate,

[0268] 20: Electronic components,

[0269] 30: Protrusions,

[0270] 40: Resin film,

[0271] 50: Bottom filler material.

Claims

1. A resin composition comprising a curable resin and an inorganic filler, wherein the resin composition has a melt viscosity greater than or equal to 5000 Pa·s at 20°C and a minimum melt viscosity less than or equal to 200 Pa·s.

2. The resin composition according to claim 1, wherein it is in the form of a film.

3. The resin composition according to claim 1, wherein the curable resin comprises a curable resin that is liquid at 25°C and a curable resin that is solid at 25°C.

4. The resin composition according to claim 1, used to fill the space between the substrate and the electronic component.

5. An electronic component device comprising a substrate, an electronic component, and a cured resin composition of any one of claims 1 to 4 disposed between the substrate and the electronic component.

6. A method for manufacturing an electronic component device, the electronic component device comprising a substrate and electronic components, The method for manufacturing the electronic component device includes a step of filling the space between the substrate and the electronic component with the resin composition according to any one of claims 1 to 4.

7. The method of manufacturing an electronic component device according to claim 6, wherein the filling of the resin composition is performed by introducing a portion of the film-like resin composition into the space.

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