Raw material supply equipment, substrate processing equipment and raw material supply methods

Abstract

This disclosure relates to a material supply apparatus, a substrate processing apparatus, and a material supply method for supplying raw materials to a chamber for performing a processing process on a substrate. The material supply apparatus includes: a plurality of tanks for storing raw materials; a connector, one side of which is connected to the plurality of tanks and the other side of which is connected to the chamber; and a plurality of supply valves that selectively connect or disconnect the interior of the connector from each of the plurality of tanks, wherein each of the plurality of tanks includes a heater for heating the raw materials, and each of the plurality of tanks is detachably mounted to the connector.

Description

Technical Field

[0001] This disclosure relates to a substrate processing apparatus for performing processing techniques such as deposition and etching on a substrate. Background Technology

[0002] Generally, to manufacture semiconductor devices, display devices, solar cells, etc., thin film layers, thin film circuit patterns, or optical patterns should be formed on a substrate. For this purpose, processing techniques are performed on the substrate. Examples of processing techniques include deposition processes that deposit thin films containing specific materials on the substrate, optical processes that selectively expose thin films using photosensitive materials, and etching processes that remove selectively exposed portions of the thin film to form patterns. These processing techniques are performed using substrate processing equipment.

[0003] According to related technologies, substrate processing equipment includes a chamber for performing processing on a substrate and a supplier for supplying a container to the chamber. The supplier includes a container for storing raw materials and a connector for connecting the container to the chamber.

[0004] Here, because the tank should be replaced when the raw material stored in it is depleted, the supply should stop supplying raw material to the chamber when the tank replacement operation is performed. Therefore, according to related technologies, the substrate processing equipment should also stop the processing process during the tank replacement operation, which leads to a decrease in the productivity of substrates that have already undergone processing. Summary of the Invention

[0005] Technical issues

[0006] This disclosure aims to solve the above-mentioned problems and provide a raw material supply device, a substrate processing device, and a raw material supply method that can supply raw materials when performing a tank replacement operation.

[0007] Technical solution

[0008] To achieve the above objectives, this disclosure may include the following elements.

[0009] The raw material supply apparatus according to this disclosure is used to supply raw materials to a chamber for performing a processing procedure on a substrate. The raw material supply apparatus may include: a plurality of tanks for storing raw materials; a connector, one side of which is connected to the plurality of tanks and the other side of which is connected to the chamber; and a plurality of supply valves, each selectively connecting or disconnecting each of the plurality of tanks from the interior of the connector. Each of the plurality of tanks may include a heater for heating the raw materials. Each of the plurality of tanks may be detachably mounted in the connector.

[0010] In the raw material supply equipment according to this disclosure, the connector may include a heater for heating the raw material.

[0011] In the raw material supply equipment according to this disclosure, each of the plurality of tanks may include a supply block equipped in a connector. A plurality of supply valves may be connected to the plurality of supply blocks respectively for operation.

[0012] The raw material supply equipment according to this disclosure may include: an injector, one side of which is connected to a plurality of tanks and the other side of which is connected to a carrier gas storage unit containing carrier gas; and a plurality of injection valves, which selectively connect or disconnect each of the plurality of tanks from the interior of the injector.

[0013] In the raw material supply equipment according to this disclosure, each of the plurality of tanks may include an injection block equipped in an injector. Injection valves may be individually connected to the injection blocks for operation.

[0014] In the raw material supply equipment according to this disclosure, each of the plurality of tanks may include a body for storing raw materials. The heater may include a first heater that heats the body at its lower part and a second heater that heats the body at its upper part.

[0015] In the raw material supply equipment according to this disclosure, the main body may include a first sidewall and a second sidewall arranged to be spaced apart from each other and facing each other in a first axial direction. The tank may include a plurality of partition walls arranged to be spaced apart from each other in a second axial direction perpendicular to the first axial direction, such that the interior of the main body forms a flow path that changes the flow direction.

[0016] In the raw material supply equipment according to this disclosure, a first partition wall, which is disposed at a plurality of odd-numbered positions relative to a second axis, can protrude from a first sidewall toward a second sidewall and can be spaced apart from the second sidewall relative to the first axis. A second partition wall, which is disposed at a plurality of even-numbered positions relative to the second axis, can protrude from a second sidewall toward a first sidewall and can be spaced apart from the first sidewall relative to the first axis.

[0017] In the raw material supply equipment according to this disclosure, the first partition wall and the second partition wall can be arranged to be spaced apart from each other by a first interval relative to a second axial direction. Each of the first partition walls can be arranged to be spaced apart from the second sidewall by a first interval relative to the first axial direction. Each of the second partition walls can be arranged to be spaced apart from the first sidewall by a first interval relative to the first axial direction.

[0018] In the raw material supply equipment according to the present disclosure, each of the partition walls may be configured to be spaced apart from the first sidewall by a first interval relative to the first axial direction, and may also be spaced apart from the second sidewall by a first interval relative to the first axial direction.

[0019] In the raw material supply equipment according to the present disclosure, each of the tanks may include: a third sidewall and a fourth sidewall, configured to be spaced apart from each other and facing each other in a second axial direction; an inflow section for allowing raw material to flow in; and an outflow section for discharging raw material.

[0020] In the raw material supply equipment according to this disclosure, each of the inflow section and the outflow section may be formed adjacent to the first sidewall relative to the first axial direction.

[0021] In the raw material supply equipment according to the present disclosure, one of the inflow section and the outflow section may be formed adjacent to a first sidewall relative to a first axial direction, and the other of the inflow section and the outflow section may be formed adjacent to a second sidewall relative to a first axial direction.

[0022] In the raw material supply equipment according to this disclosure, at least one of the first heater and the second heater may include a plurality of heating lines arranged parallel to a first axis. The plurality of heating lines may be respectively arranged at positions spaced equidistant from a plurality of partition walls relative to a second axis.

[0023] In the raw material supply equipment according to this disclosure, at least one of the first heater and the second heater may include a plurality of heating lines arranged parallel to a first axis. Each of the plurality of heating lines may be arranged relative to a second axis at a location where a partition wall is formed.

[0024] In the raw material supply equipment according to this disclosure, the heater may include a third heater that heats the body on the side surface of the body.

[0025] In the raw material supply equipment according to this disclosure, a plurality of partition walls may be incorporated into the body to contact each of the lower part and the upper part of the body.

[0026] The raw material supply equipment according to this disclosure may include: a receiver for obtaining the internal temperature of each of the tanks; and a controller for controlling each of the heaters such that the heating temperature of the heated raw material is adjusted according to the temperature obtained by the receiver.

[0027] The raw material supply equipment according to this disclosure may include a receiver for obtaining the amount of raw material stored in each of the tanks. A supply valve may close a tank with less than a predetermined reference amount of raw material remaining, and may open a tank with more than or equal to the predetermined reference amount of raw material remaining, based on the amount of raw material obtained by the receiver.

[0028] The substrate processing apparatus according to this disclosure may include a chamber, a substrate support disposed in the chamber and supporting one or more substrates, an injector for spraying raw materials toward the substrate support, and a raw material supply device for supplying raw materials to the injector.

[0029] The substrate processing apparatus according to this disclosure may include a connection line connected to an ejector and a switch connected to the connection line. Multiple raw material supply devices may be connected to the connection line. One of the first and second raw material supply devices may, according to the switch, supply raw materials via the ejector.

[0030] The raw material supply method of the raw material supply device including multiple tanks according to the present disclosure may include the steps of vaporizing the raw material in the first tank and supplying it to a chamber, monitoring whether the obtained value of at least one of the internal pressure of the first tank and the vaporization amount of the first tank is less than or equal to a predetermined value, when the obtained value is less than or equal to the predetermined value, vaporizing the raw material in the second tank and supplying it to a chamber, and stopping the supply from the first tank.

[0031] In the raw material supply method according to this disclosure, the step of stopping the supply to the first tank involves reducing the supply amount of the first tank within a predetermined reference time when the obtained value is less than or equal to a predetermined value, and then stopping the supply to the first tank after the predetermined reference time has elapsed. Similarly, the step of vaporizing the raw material in the second tank and supplying it to the chamber involves increasing the supply amount of the raw material in the second tank to a predetermined reference supply amount within a predetermined reference time when the obtained value is less than or equal to a predetermined value, and then supplying the raw material in the second tank to the chamber at the predetermined reference supply amount after the reference time has elapsed.

[0032] Beneficial effects

[0033] According to this disclosure, the following effects can be achieved.

[0034] By implementing this disclosure, when the material in one tank is depleted, another tank is connected to the chamber via a connector to allow fluid flow, thus continuously supplying material to the chamber. Therefore, even when a tank is depleted, this disclosure allows for continuous supply of material to the chamber without stopping the supply operation, and thus allows for continuous execution of the processing steps performed in the chamber without interruption. Therefore, this disclosure can improve the productivity of substrates for which processing steps have been performed.

[0035] By implementing this disclosure, since each of the cans is detachably mounted in a connector, when a replacement operation is performed on a portion of the cans, material is supplied to the chamber using other cans. Therefore, in this disclosure, when a replacement operation is performed on a portion of the cans, the processing steps performed in the chamber can be executed continuously without interruption. Thus, this disclosure can improve the productivity of substrates that have undergone processing, and furthermore, it can improve the ease of can replacement operations. Attached Figure Description

[0036] Figure 1 This is a schematic configuration diagram of the substrate processing apparatus according to the present disclosure.

[0037] Figure 2 This is a schematic perspective view of the raw material supply equipment according to this disclosure.

[0038] Figure 3 This is a schematic front view of the raw material supply equipment according to this disclosure.

[0039] Figure 4 This is a conceptual block diagram of a raw material supply facility according to this disclosure.

[0040] Figure 5 This is a schematic exploded perspective view of a tank in a raw material supply facility according to this disclosure.

[0041] Figure 6 This is a schematic plan view of the main body of the tank in the raw material supply equipment according to this disclosure.

[0042] Figure 7 For along Figure 6 A schematic cross-sectional view taken from line II.

[0043] Figure 8 for Figure 6 A magnified view of part A.

[0044] Figure 9 For the raw material supply equipment according to this disclosure, relative to Figure 6 A schematic enlarged sectional view of the tank body along line II-II.

[0045] Figure 10 This is a schematic plan view of the main body of the tank in a modified embodiment of the raw material supply equipment according to the present disclosure.

[0046] Figure 11 This is a schematic block diagram of the raw material supply equipment according to this disclosure.

[0047] Figure 12 This is a schematic block diagram of a substrate processing apparatus according to the present disclosure. Detailed Implementation

[0048] In the following, embodiments of the substrate processing apparatus according to the present disclosure will be described in detail with reference to the accompanying drawings. The raw material supply equipment according to the present disclosure may be included in the substrate processing apparatus according to the present disclosure; therefore, the raw material supply equipment will be described concurrently with the description of embodiments of the substrate processing apparatus according to the present disclosure. Furthermore, Figure 6 and Figure 10 This is not a sectional view, but rather a use of shaded lines to distinguish spaces. Figure 8 The image shows a first heater used to describe the arrangement relationship between the first heater and the partition wall.

[0049] Reference Figure 1 The substrate processing apparatus 10 of this disclosure performs processing processes on a substrate 100. The substrate 100 may be a silicon substrate, a glass substrate, a metal substrate, etc. The substrate processing apparatus 10 of this disclosure can perform deposition processes on the substrate 100, such as depositing a thin film, and etching processes to remove a portion of the thin film deposited on the substrate 100. Hereinafter, embodiments of the deposition process performed by the substrate processing apparatus 10 of this disclosure will be primarily described. Based on this, it will be apparent to those skilled in the art that embodiments of other processing processes, such as etching processes, can be designed according to the substrate processing apparatus 10 of this disclosure.

[0050] Reference Figure 1 The substrate processing apparatus 10 according to this disclosure may include a chamber 11.

[0051] The chamber 11 can provide a processing space 111. Processing processes can be performed on the substrate 100 within the processing space 111. The processing space 111 can be disposed within the chamber 11. An exhaust port (not shown) for discharging gas from the processing space 111 can be connected to the chamber 11. A substrate support 12 can be disposed within the chamber 11.

[0052] Reference Figure 1 The substrate processing apparatus 10 according to this disclosure may include a substrate support 12.

[0053] The substrate support 12 can support the substrate 100. The substrate support 12 can support one substrate 100 or two or more substrates 100. When multiple substrates 100 are supported by the substrate support 12, processing can be performed on multiple substrates 100 simultaneously. The substrate support 12 can be integrated into the chamber 11. The substrate support 12 can be disposed in the chamber 11.

[0054] Reference Figure 1 The substrate processing apparatus 10 according to this disclosure may include a sprayer 13.

[0055] The ejector 13 can eject material toward the substrate support 12. The ejector 13 can be disposed in the chamber 11. The ejector 13 can be disposed opposite to the substrate support 12. The ejector 13 can be disposed on the substrate support 12. A processing space 111 can be disposed between the ejector 13 and the substrate support 12. The ejector 13 can be attached to a cover (not shown). The cover can be attached to the chamber 11 to cover the upper part of the chamber 11.

[0056] Reference Figures 1 to 4 The substrate processing apparatus 10 according to this disclosure may include a raw material supply apparatus 1. The raw material supply apparatus 1 may be implemented as a raw material supply apparatus according to this disclosure.

[0057] Raw material supply equipment 1 can supply raw materials to chamber 11. Raw material supply equipment 1 can also supply raw materials to ejector 13, thus allowing raw materials to be supplied to chamber 11 via ejector 13. Raw material supply equipment 1 can supply source gas as raw material. Raw material supply equipment 1 can supply reaction gas as raw material. Raw material supply equipment 1 can sublimate or vaporize solid or liquid raw materials to form a gas, and then supply the gaseous raw material. The raw material can be a precursor. The raw material can be molybdenum, parylene, perylene, organic polymers, etc.

[0058] The raw material supply equipment 1 may include a connector 2, multiple supply valves 3 and multiple tanks 4.

[0059] Connector 2 can be connected to chamber 11. Multiple tanks 4 storing raw materials can be connected to one side of connector 2, and the other side of connector 2 can be connected to chamber 11. Therefore, raw materials stored in each of the multiple tanks 4 can be supplied to chamber 11 via connector 2. Connector 2 can be connected to chamber 11 via connecting conduit 14. Connecting conduit 14 can be implemented using at least one of pipes, hoses, and holes formed in the block.

[0060] Each of the plurality of tanks 4 can be detachably mounted to the connector 2. Therefore, when a replacement operation is performed on a portion of the plurality of tanks 4, the substrate processing apparatus 10 according to the present disclosure is implemented to supply raw materials to the chamber 11 using the other tanks 4. Therefore, in the substrate processing apparatus 10 according to the present disclosure, when a replacement operation is performed on a portion of the plurality of tanks 4, the processing process performed in the chamber 11 can be continuously executed without stopping the processing process. Therefore, the substrate processing apparatus 10 according to the present disclosure can improve the productivity of the substrate 100 for which processing has been performed, and furthermore, can improve the ease of performing the tank 4 replacement operation. The plurality of tanks 4 can be detachably mounted to the connector 2 separately via a fastening method (or forced engagement method) using fastening means such as bolts.

[0061] Multiple tanks 4 can be connected in parallel to connector 2. In this case, multiple tanks 4 can be connected to chamber 11 respectively via connector 2. Therefore, connector 2 can be implemented such that connector 2 is connected to only a portion of the multiple tanks 4 to allow fluid flow and supply the raw material stored in the corresponding tank 4 to chamber 11. Therefore, compared with the comparative example where multiple tanks 4 are connected in series to connector 2, when the raw material in the tank 4 connected to chamber 11 via connector 2 to allow fluid flow is exhausted, the substrate processing apparatus 10 according to the present disclosure can connect another tank 4 to chamber 11 via connector 2 to allow fluid flow, thus allowing the raw material to be continuously supplied to chamber 11. Therefore, even when the raw material in tank 4 is exhausted, the substrate processing apparatus 10 according to the present disclosure can still continuously supply the raw material to chamber 11 without stopping the operation of supplying the raw material to chamber 11, and thus the processing process performed in the chamber can be continuously executed without stopping the processing process. Therefore, the substrate processing apparatus 10 according to the present disclosure can improve the productivity of the substrate 100 that has undergone processing.

[0062] Connector 2 may include multiple supply ports 21 and supply paths 22.

[0063] Multiple supply ports 21 can be connected to multiple tanks 4 respectively. Multiple tanks 4 can be detachably mounted on multiple supply ports 21 respectively. Multiple supply ports 21 can be combined with a connecting body 20. The connecting body 20 can constitute the overall appearance of the connector 2. The connecting body 20 can be formed into a rectangular shape extending in the vertical direction (Z-axis direction), but is not limited thereto. When multiple tanks 4 can be connected to the chamber 11 to allow fluid flow, the connecting body 20 can also be formed into another shape such as a rectangular cylinder.

[0064] Supply path 22 can be connected to chamber 11. Supply path 22 can be connected to injector 13, and raw materials can be supplied to processing space 111 through injector 13. Multiple supply ports 21 can be connected to supply path 22 to allow fluid flow. Therefore, all tanks 4 of the multiple tanks 4 can be connected in parallel to supply path 22 through multiple supply ports 21, so that raw materials can be supplied to chamber 11 through multiple supply ports 21 and supply path 22. Therefore, when raw materials are depleted or a replacement operation is required in one of the multiple tanks 4, the substrate processing apparatus 10 according to this disclosure is implemented to supply raw materials to chamber 11 through other tanks 4. Supply path 22 can be provided in connecting body 20. Supply path 22 can be implemented as a groove formed in connecting body 20. In this case, multiple supply ports 21 can include port holes for allowing raw materials to flow and can be connected to supply path 22 through port holes.

[0065] The supply path 22 can be configured to extend in the vertical direction (Z-axis direction). In this case, the plurality of supply ports 21 in the connecting body 20 can be arranged to be spaced apart from each other in the vertical direction (Z-axis direction). The plurality of supply ports 21 can be arranged to be spaced apart from each other in the vertical direction (Z-axis direction) and can be connected to different portions of the supply path 22 to allow fluid flow. Therefore, the plurality of tanks 4 can be detachably equipped with the plurality of supply ports 21 and can be stacked in the vertical direction (Z-axis direction). Therefore, the substrate processing apparatus 10 according to the present disclosure can reduce the installation area occupied by the tanks 4 in the workplace relative to the horizontal direction perpendicular to the vertical direction (Z-axis direction). Furthermore, in the substrate processing apparatus 10 according to the present disclosure, even if the number of tanks 4 increases, the installation area occupied by the tanks 4 in the workplace relative to the horizontal direction does not increase. Therefore, when including the tanks 4, the substrate processing apparatus 10 according to the present disclosure can help improve the space utilization of the installation area in the workplace.

[0066] Connector 2 may include heater 23 ( Figure 4 (As shown in the image).

[0067] Heater 23 can heat the raw material. Therefore, the raw material supply device 1 according to this disclosure can prevent the raw material from undergoing a phase change due to temperature drop as it flows through connector 2. Therefore, the raw material supply device 1 according to this disclosure can prevent deterioration of the raw material during its supply from tank 4 to chamber 11 via connector 2, thereby improving the quality of the substrate 100 after processing. Heater 23 can be integrated with connector 20. Heater 23 can heat at least one of connector 20 and supply path 22, thus heating the raw material flowing through supply path 22. Heater 23 can heat the raw material by using electrothermal methods, emitting heating light, or circulating a heating medium such as water.

[0068] Reference Figures 1 to 4 Multiple supply valves 3 ( Figure 4 (As shown in the diagram) Each of the plurality of tanks 4 can be selectively connected to or disconnected from the interior of the connector 2. When a tank 4 needs to be replaced due to material depletion, the supply valve 3 can disconnect the fluid flow connection between the corresponding tank 4 and the interior of the connector 2, and can also connect another tank 4 to the interior of the connector 2. Therefore, even when a replacement operation is performed on a portion of the tanks 4, the substrate processing apparatus 10 according to this disclosure can continue to perform the processing process in the chamber 11 without stopping the processing process. Thus, the productivity of the substrate 100 that has undergone processing can be improved, and the ease of tank 4 replacement operation can also be improved.

[0069] Multiple supply valves 3 can selectively connect or disconnect each of the multiple tanks 4 from the supply path 22. The multiple supply valves 3 can individually open or close the fluid flow path connecting the tanks 4 and the supply path 22, thus selectively connecting or disconnecting the supply path 22 from the multiple tanks 4. Multiple supply valves 3 can be connected to each of the multiple tanks 4. Therefore, a tank 4 separated from the connector 2 for changeover operations can remain in a state where the path is closed by the supply valves 3. Supply valves 3 can be connected to connector 2. In this case, supply valves 3 can be connected to supply port 21. Supply valves 3 can be connected to all of the multiple tanks 4 and supply port 21.

[0070] For example, such as Figure 4 As shown, when three tanks 4a, 4b, and 4c are connected in parallel to connector 2, three supply valves 3a, 3b, and 3c can be installed. Multiple supply valves 3a, 3b, and 3c can selectively connect or disconnect the supply path 22 from each of the multiple tanks 4a, 4b, and 4c. Although not shown, two or more tanks 4 can be connected in parallel to connector 2. In this case, the raw material supply device 1 may include a number of supply valves 3 equal to the number of tanks 4.

[0071] Reference Figures 1 to 4 Each of the plurality of tanks 4 can store raw materials. Tanks 4 can be connected to connector 2 and can be detachably mounted to connector 2. Therefore, implementing the substrate processing apparatus 10 according to this disclosure allows the supply of raw materials to chamber 11 through another tank 4 simultaneously with the replacement operation of the corresponding tank 4 when a tank 4 requires replacement due to material depletion. Thus, even when a portion of the tanks 4 require replacement, the substrate processing apparatus 10 according to this disclosure can continue to perform the processing in chamber 11 without stopping the processing, thereby increasing the productivity of the substrate 100 that has undergone processing and improving the ease of tank replacement operations. Tanks 4 can be connected to connector 2 in parallel. Tanks 4 can be detachably mounted to supply port 21 and can be stacked in the vertical direction (Z-axis direction). Each of the plurality of tanks 4 can sublimate or vaporize solid or liquid raw materials to form a gas, and then the gaseous phase-change raw materials can be supplied to connector 2.

[0072] Reference Figures 1 to 4 Each of the multiple tanks 4 may include a supply block 41.

[0073] A supply block 41 can be fitted into a connector 2. A tank 4 can be fitted into a connector 2 via the supply block 41. When the supply block 41 is fitted into the connector 2, the internal space of the tank 4 and the supply port 21 can be connected to each other to allow fluid flow. Therefore, the internal space of the tank 4 can be connected to a supply path 22 via the supply block 41 and the supply port 21 to allow fluid flow, and thus can be connected to the chamber 11 via the supply path 22 to allow fluid flow. The supply block 41 may include multiple supply holes for allowing material flow and multiple port holes that can be connected to multiple supply ports 21. Supply valves 3 can be connected to the supply block 41 individually for operation. In this case, the supply valves 3 can be individually coupled to the supply block 41 and can be individually opened or closed by the supply block 41 and the supply port 21. The supply valves 3 can individually open or close the supply holes.

[0074] Reference Figures 1 to 4 Each of the multiple tanks 4 may include a guide pin (not shown).

[0075] Guide pins can be inserted into connector 2. In this case, guide grooves (not shown) can be formed in connector 2. Guide pins can be inserted into guide grooves respectively, and can guide the installation position of can 4. Therefore, the substrate processing apparatus 10 according to the present disclosure can improve the ease and accuracy of the assembly operation of detachably assembling can 4 in connector 2.

[0076] Guide pins can be combined to protrude from supply block 41. Multiple guide pins can be individually coupled to supply block 41. Guide pins and supply block 41 can be integrated. Guide pins and guide slots can be formed into corresponding shapes. Guide slots can be formed in connecting body 20.

[0077] Reference Figures 1 to 9 Each of the plurality of tanks 4 may include a body 42. The plurality of tanks 4 may be implemented with the same structure as each other. In the following description, a single tank 4 will be used as an example.

[0078] The main body 42 can store raw materials. A storage section 40 can be provided in the main body 42. The storage section 40 can correspond to the internal space of the tank 4. The storage section 40 can be formed in the main body 42. The main body 42 can be formed into a hollow rectangular parallelepiped shape, but is not limited to this. If the main body 42 can accommodate raw materials through the storage section 40, the main body 42 can be formed into other shapes such as a disc.

[0079] The storage section 40 can be implemented as a groove of a specific depth formed in the upper surface of the body 42. The upper surface of the body 42 can be formed to open through the storage section 40. In this case, the body 42 may include a cover 43. The cover 43 can be disposed on the body 42 and can cover the storage section 40. The cover 43 can be disposed on the storage section 40 relative to the vertical direction (Z-axis direction). The cover 43 can be formed as a quadrilateral plate, but is not limited thereto; if the cover 43 can cover the storage section 40, the cover 43 can be formed in other shapes such as a disc.

[0080] The main body 42 may include a first sidewall 421 and a second sidewall 422. The first sidewall 421 and the second sidewall 422 may be arranged to be separated from each other in a facing manner in a first axial direction (X-axis direction). The first sidewall 421 and the second sidewall 422 may be formed to protrude upward from the bottom wall 420. The storage portion 40 may be disposed between the first sidewall 421 and the second sidewall 422 relative to the first axial direction (X-axis direction). The bottom wall 420 may be disposed below the storage portion 40 relative to the vertical direction (Z-axis direction). The bottom wall 420 may be formed into a plate-like shape that lies flat in the horizontal direction, and the first sidewall 421 and the second sidewall 422 may be formed into a plate-like shape that stands upright in the vertical direction (Z-axis direction).

[0081] The main body 42 may include a third sidewall 423 and a fourth sidewall 424. The third sidewall 423 and the fourth sidewall 424 may be arranged to face each other in a manner that separates them in the second axial direction (Y-axis direction). The second axial direction (Y-axis direction) and the first axial direction (X-axis direction) may be axial directions that are perpendicular to each other in a horizontal plane. The third sidewall 423 and the fourth sidewall 424 may be formed to protrude upward from the bottom wall 420. The storage portion 40 may be disposed between the third sidewall 423 and the fourth sidewall 424 relative to the second axial direction (Y-axis direction). The third sidewall 423 and the fourth sidewall 424 may be formed as plates that stand upright in the vertical direction (Z-axis direction). The third sidewall 423 and the fourth sidewall 424 may be respectively connected to the first sidewall 421 and the second sidewall 422. The third sidewall 423 and the fourth sidewall 424 can be configured parallel to the first axis direction (X-axis direction), and the first sidewall 421 and the second sidewall 422 can be configured parallel to the second axis direction (Y-axis direction). The first sidewall 421, the second sidewall 422, the third sidewall 423, the fourth sidewall 424, and the bottom wall 420 can be integrally formed. Figure 6 In this regard, the third sidewall 423 can be located on the right side, and the fourth sidewall 424 can be located on the left side. The supply block 41 can be attached to the third sidewall 423.

[0082] The main body 42 may include an outlet 425. The outlet 425 may be connected to each of the storage section 40 and the supply block 41 to allow fluid flow. Thus, raw material stored in the storage section 40 can be discharged through the outlet 425 to the supply block 41, and then supplied to the connector 2 through the supply block 41. The outlet 425 may project upward from the bottom wall 420. The outlet 425 may be located at the portion where the first side wall 421 contacts the third side wall 423. In this case, the outlet 425 may project towards the storage section 40 from each of the first side wall 421 and the third side wall 423.

[0083] The outlet 425 may include a discharge channel 425a and a discharge port 425b.

[0084] A discharge groove 425a can be formed on the upper surface of the outlet 425. The discharge groove 425a can be implemented as a groove with a specific depth formed in the upper surface of the outlet 425. The discharge groove 425a can be formed to connect to each of the storage section 40 and the discharge port 425b to allow fluid flow. The length of the discharge groove 425a relative to the vertical direction (Z-axis direction) can be formed to be shorter than the distance between the lower end of the discharge groove 425a and the upper surface of the bottom wall 420. Therefore, a discharge jaw 425c can be formed relative to the vertical direction (Z-axis direction) between the lower end of the discharge groove 425a and the upper surface of the bottom wall 420. Thus, the outlet 425 can be implemented such that when the raw material stored in the storage section 40 undergoes a phase change and is raised to a height higher than the discharge jaw 425c, the raw material passes over the discharge jaw 425c and enters the discharge groove 425a. In other words, the discharge jaw 425c can prevent raw materials that undergo a lower degree of phase change from entering the discharge groove 425a. Therefore, the raw material supply device 1 according to this disclosure can increase the phase change rate of the raw materials stored in the storage section 40, thereby improving the quality of the raw materials supplied to the chamber 11.

[0085] The discharge port 425b can discharge raw material. The discharge port 425b can be connected to each of the discharge channel 425a and the supply block 41 to allow fluid flow. Therefore, raw material that has passed over the discharge jaw 425c and entered the discharge channel 425a can be discharged from the storage section 40 through the discharge port 425b and can be supplied to the connector 2 through the supply block 41. The discharge port 425b can be formed to pass through the third sidewall 423. The discharge port 425b can be connected to the supply hole of the supply block 41 to allow fluid flow. Relative to the vertical direction (Z-axis direction), the discharge port 425b can be positioned at a distance spaced from the lower surface of the body 42 greater than the distance spaced from the upper surface of the body 42. That is, the discharge port 425b can be positioned closer to the upper surface of the body 42 than the lower surface of the body 42.

[0086] Reference Figures 1 to 9 The tank body 4 may include multiple partition walls 44.

[0087] The partition walls 44 can be configured to separate each other in the second axial direction (Y-axis direction), and can form a flow path with a changed flow direction inside the main body 42. According to the partition walls 44, the tank 4 can increase the flow distance of the raw material until the raw material stored in the storage section 40 undergoes a phase change and is supplied to the connector 2. Therefore, the tank 4 can increase the residence time of the raw material in the main body 42, thereby further increasing the phase change rate of the raw material stored in the main body 42. In this case, the partition walls 44 can form a flow path with a changed flow direction in the storage section 40. The partition walls 44 can be provided in the storage section 40 and attached to the main body 42. The partition walls 44 can be formed as a plate standing vertically in the vertical direction (Z-axis direction). The partition walls 44 can be configured parallel to the first axial direction (X-axis direction).

[0088] The first partition wall 441 of the partition wall 44 can protrude from the first side wall 421 toward the second side wall 422. The first partition wall 441 can be spaced apart from the second side wall 422 relative to the first axis direction (X-axis direction). Therefore, the tank body 4 allows the raw materials stored in the storage section 40 to flow through the space between the first partition wall 441 and the second side wall 422, thereby increasing the flow distance and residence time of the raw materials.

[0089] The second partition wall 442 in the partition wall 44 can protrude from the second side wall 422 toward the first side wall 421. The second partition wall 442 can be spaced apart from the first side wall 421 relative to the first axis direction (X-axis direction). Therefore, the tank body 4 allows the raw materials stored in the storage section 40 to flow through the space between the second partition wall 442 and the first side wall 421, thereby increasing the flow distance and residence time of the raw materials.

[0090] The second partition wall 442 can be positioned at an even number of locations in the partition wall 44 relative to the second axial direction (Y-axis direction). In this case, the first partition wall 441 can be positioned at an odd number of locations in the partition wall 44 relative to the second axial direction (Y-axis direction). Therefore, the storage section 40 can include a first path through which raw material supplied between the first partition wall 441 and the second side wall 422 can pass, and a second path through which raw material supplied between the second partition wall 442 and the first side wall 421 can pass. Furthermore, the storage section 40 can be formed in a zigzag shape where the first path and the second path are alternately arranged in the second axial direction (Y-axis direction).

[0091] As described above, the tank 4 can be configured such that the raw material undergoes a phase change as it flows along a flow path having a relatively narrow width and a relatively long flow distance using the first partition wall 441 and the second partition wall 442. Therefore, the raw material supply device 1 can increase the phase change rate of the raw material stored in the storage section 40, thereby improving the quality of the raw material supplied to the chamber 11, which in turn helps to improve the quality of the substrate for which the processing has been performed.

[0092] like Figure 8 As shown, the gap 44a between the second partition wall 442 and the first partition wall 441 relative to the second axis direction (Y-axis direction) can be formed as a first gap. In this case, the second partition wall 442 and the first partition wall 441 can be set to be spaced apart from each other by the first gap relative to the second axis direction (Y-axis direction). The gap 441a between each of the plurality of first partition walls 441 and the second side wall 422 relative to the first axis direction (X-axis direction) can be formed as a first gap. In this case, each of the plurality of first partition walls 441 and the second side wall 422 can be spaced apart by the first gap relative to the first axis direction (X-axis direction). The gap 442a between each of the plurality of second partition walls 442 and the first side wall 421 relative to the first axis direction (X-axis direction) can be formed as a first gap. In this case, each of the plurality of second partition walls 442 and the first side wall 421 can be spaced apart by the first gap relative to the first axis direction (X-axis direction). Therefore, tank 4 can be configured to allow the raw material to flow along a flow path with a uniform width, thereby improving the uniformity of the phase change of the raw material.

[0093] Reference Figures 1 to 9 The tank 4 may include a heater 5.

[0094] Heater 5 can heat the raw material. When heater 5 heats the raw material, the raw material can change phase to gas. Heater 5 can heat at least one of the lower part and the upper part of the main body 42, thus heating the raw material stored in the storage section 40. In this case, heater 5 can heat at least one of the main body 42 and the cover 43. Heater 5 can heat the raw material by using electrothermal methods, emitting heating light, or circulating a heating medium such as water.

[0095] Heater 5 may include a first heater 51.

[0096] The first heater 51 can heat the lower part of the main body 42. The first heater 51 can be attached to the main body 42. Since the first heater 51 can heat the lower part of the main body 42, the raw materials stored in the storage section 40 can be heated through the lower part of the main body 42. The first heater 51 can extend to correspond to the shape of the storage section 40 and can be disposed below the storage section 40. For example, as... Figure 6 As shown by the dashed lines, the first heater 51 can be formed to extend in a zigzag shape to correspond to the zigzag shape of the storage section 40. Therefore, the first heater 51 can improve the uniformity of heating of the raw materials stored in the storage section 40.

[0097] The first heater 51 may include multiple first heating lines 511.

[0098] The first heating line 511 can be configured parallel to the first axis direction (X-axis direction). The first heating lines 511 can be configured to be spaced apart from each other in the second axis direction (Y-axis direction). Each of the plurality of first heating lines 511 can be disposed between a plurality of partition walls 44 relative to the second axis direction (Y-axis direction). In this case, relative to the second axis direction (Y-axis direction), one first heating line 511 can be disposed between two partition walls 44.

[0099] Each of the plurality of first heating lines 511 can be positioned relative to the second axial direction (Y-axis direction) and spaced equidistant from the partition wall 44. Therefore, each of the plurality of first heating lines 511 can uniformly heat the space between the partition walls 44 relative to the second axial direction (Y-axis direction). If the partition wall 44 is implemented as a first partition wall 441 and a second partition wall 442, then each of the plurality of first heating lines 511 can be positioned at a distance 511a spaced from the first partition wall 441 (e.g., ...). Figure 8 As shown) is equal to the distance 511b between it and the second partition wall 442 (as shown). Figure 8 (as shown in the image)

[0100] The first heater 51 may include a plurality of first connection lines 512.

[0101] The first connection line 512 can connect the first heating lines 511 to each other. Each of the plurality of first connection lines 512 can be connected to the first heating lines 511 on both sides thereof. The first heater 51 can be configured as a connected heating line via the first connection lines 512 and the first heating lines 511. Each of the plurality of first connection lines 512 can connect two first heating lines 511 to each other.

[0102] Relative to the first axial direction (X-axis direction), the first connecting line 512 disposed between the first partition wall 441 and the second side wall 422 can be disposed at a position spaced equidistant from each of the first partition wall 441 and the second side wall 422. Therefore, each of the plurality of first connecting lines 512 can uniformly heat the space between the first partition wall 441 and the second side wall 422 relative to the first axial direction (X-axis direction).

[0103] Relative to the first axial direction (X-axis direction), the first connecting line 512 disposed between the second partition wall 442 and the first side wall 421 can be disposed at a position spaced equidistant from each of the second partition wall 442 and the first side wall 421. Therefore, each of the plurality of first connecting lines 512 can uniformly heat the space between the second partition wall 442 and the first side wall 421 relative to the first axial direction (X-axis direction).

[0104] Each of the plurality of first bonding lines 512 can be formed as a curve. Each of the plurality of first heating lines 511 can be formed as a straight line. The plurality of first bonding lines 512 and the plurality of first heating lines 511 can be integrated into one unit.

[0105] The first heater 51 may include a first heating plate 510. A first bonding line 512 and a first heating line 511 may be coupled to the first heating plate 510. The first bonding line 512 and the first heating line 511 may be embedded in the first heating plate 510. The first heating plate 510 may be disposed below the body 42. The first heating plate 510 may contact the lower surface of the body 42. The first heating plate 510 may correspond to the lower portion of the body 42. The first bonding line 512 and the first heating line 511 may heat the first heating plate 510, and the body 42 may be heated through the first heating plate 510. The first heater 51 may be directly coupled to the body 42 without the need for the first heating plate 510. In this case, the first heater 51 may be embedded in the bottom wall 420.

[0106] Heater 5 may include a second heater 52.

[0107] The second heater 52 can heat the upper part of the main body 42. The second heater 52 can be attached to the main body 42. If the main body 42 includes a cover 43, the second heater 52 can be attached to the cover 43. The second heater 52 can heat the upper part of the main body 42, thus allowing heating of the raw materials stored in the storage section 40 via the upper part of the main body 42. The second heater 52 can extend to correspond to the shape of the storage section 40 and can be provided on the storage section 40. For example, as... Figure 6 As shown by the dashed lines, the second heater 52 can be formed to extend in a zigzag shape to correspond to the zigzag shape of the storage section 40. Therefore, the second heater 52 can improve the uniformity of heating of the raw materials stored in the storage section 40. When the heater 5 includes all the heaters in the second heater 52 and the first heater 51, the heater 5 can heat the raw materials stored in the storage section 40 more uniformly through all parts of the upper and lower parts of the main body 42.

[0108] The second heater 52 may include multiple second heating lines 521.

[0109] The second heating line 521 can be configured parallel to the first axis direction (X-axis direction). The second heating lines 521 can be configured to be spaced apart from each other in the second axis direction (Y-axis direction). Each of the second heating lines 521 can be disposed between the partition walls 44 relative to the second axis direction (Y-axis direction). In this case, one second heating line 521 can be disposed between two partition walls 44 relative to the second axis direction (Y-axis direction).

[0110] Each of the second heating lines 521 can be positioned at a distance equidistant from the partition wall 44 relative to the second axial direction (Y-axis direction). Therefore, each of the second heating lines 521 can uniformly heat the space between the partition walls 44 relative to the second axial direction (Y-axis direction). In the case where the partition wall 44 is implemented with a first partition wall 441 and a second partition wall 442, each of the second heating lines 521 can be positioned at a distance from the first partition wall 441 equal to the distance from the second partition wall 442.

[0111] The second heater 52 may include a plurality of second connection lines 522.

[0112] The second connecting lines 522 can be connected to each other with the second heating lines 521. Each of the second connecting lines 522 can be connected to the second heating lines 521 at both ends. The second heater 52 can be configured as a connected heating line via the second connecting lines 522 and the second heating lines 521. Each of the second connecting lines 522 can connect two second heating lines 521 to each other.

[0113] Relative to the first axial direction (X-axis direction), the second connecting line 522 disposed between the first partition wall 441 and the second side wall 422 can be positioned at a distance equal to that between the first partition wall 441 and the second side wall 422. Therefore, each of the second connecting lines 522 can uniformly heat the space between the first partition wall 441 and the second side wall 422 relative to the first axial direction (X-axis direction).

[0114] The second connecting line 522 disposed between the second partition wall 442 and the first side wall 421 can be disposed at a position spaced equidistant from each of the second partition wall 442 and the first side wall 421 relative to the first axial direction (X-axis direction). Therefore, each of the second connecting lines 522 can uniformly heat the space between the second partition wall 442 and the first side wall 421 relative to the first axial direction (X-axis direction).

[0115] Each of the second bonding lines 522 can be formed as a curve. Each of the second heating lines 521 can be formed as a straight line. The second bonding lines 522 and the second heating lines 521 can be integrated into one unit.

[0116] The second heater 52 may include a second heating plate 520. A second bonding line 522 and a second heating line 521 may be coupled to the second heating plate 520. The second bonding line 522 and the second heating line 521 may be embedded in the second heating plate 520. The second heating plate 520 may be disposed on the cover 43. The second heating plate 520 may contact the upper surface of the cover 43. The second bonding line 522 and the second heating line 521 may heat the second heating plate 520, and the cover 43 may be heated through the second heating plate 520. Alternatively, the second heater 52 may be directly coupled to the cover 43 without the need for a second heating plate 520. In this case, the second heater 52 may be embedded inside the cover 43. The second heating plate 520 may correspond to the upper part of the main body 42.

[0117] When the second heater 52 heats the upper part of the main body 42 and the first heater 51 heats the lower part of the main body 42, the second heater 52 and the first heater 51 can be implemented to heat the partition wall 44. In this case, the partition wall 44 can be attached to the main body 42 to contact each of the upper and lower parts of the main body 42. Therefore, when the second heater 52 heats the upper part of the main body 42, the partition wall 44 can be heated through the upper part of the main body 42. When the first heater 51 heats the lower part of the main body 42, the partition wall 44 can be heated through the lower part of the main body 42. Therefore, the tank 4 can be implemented to heat the storage section 40 more uniformly by using the heater 5 as a whole, thereby further improving the vaporization rate of the raw materials stored in the storage section 40. When the main body 42 includes a cover 43, the cover 43 can be attached to the main body 42 and contact the partition wall 44. Therefore, when the second heater 52 heats the cover 43, the partition wall 44 can be heated through the cover 43.

[0118] Furthermore, according to a modified embodiment of heater 5, each of the first heating lines 511 can be positioned relative to the second axial direction (Y-axis direction) at the location where the partition wall 44 is formed. In this case, as... Figure 9 As shown, each of the first heating lines 511 can heat the lower part of the main body 42 located below the partition wall 44. Therefore, the first heating lines 511 can improve the heating efficiency of the partition wall 44.

[0119] Furthermore, according to a modified embodiment of heater 5, each of the second heating lines 521 can be positioned relative to the second axial direction (Y-axis direction) at the location where the partition wall 44 is formed. In this case, as... Figure 9As shown, each of the second heating circuits 521 can heat the upper part of the main body 42 located above the partition wall 44. Therefore, the second heating circuits 521 can improve the heating efficiency of the partition wall 44.

[0120] Furthermore, the heater 5 can be implemented such that at least one of the first heater 51 and the second heater 52 includes multiple heating lines arranged parallel to the first axial direction (X-axis direction). In this case, the first heater 51 can be implemented only to include heating lines, the second heater 52 can be implemented only to include heating lines, and all heaters in the first heater 51 and the second heater 52 can be implemented to include heating lines. When the first heater 51 includes heating lines, the heating lines can correspond to the first heating line 511. When the second heater 52 includes heating lines, the heating lines can correspond to the second heating line 521. Each of the heating lines can be positioned relative to the second axial direction (Y-axis direction) at a distance spaced from the partition wall 44. Each of the heating lines can be positioned relative to the second axial direction (Y-axis direction) at the location where the partition wall 44 is formed.

[0121] Reference Figures 1 to 10 Heater 5 may include a third heater 53.

[0122] like Figure 10 As shown, the third heater 53 can heat the body 42 at the side surface of the body 42. The third heater 53 can be attached to the side surface of the body 42 at the outside of the body 42. The third heater 53 can be arranged to surround the side surface of the body 42. The third heater 53 can heat the side surface of the body 42, therefore, the raw materials stored in the storage section 40 can be heated through the side surface of the body 42. When the heater 5 includes all the heaters of the third heater 53, the second heater 52 and the first heater 51, the raw materials stored in the storage section 40 can be heated more uniformly through all parts of the side surface of the body 42, the upper part of the body 42 and the lower part of the body 42.

[0123] Reference Figures 1 to 10 The raw material supply equipment 1 may include an injector 6 and multiple injection valves 7.

[0124] The injector 6 can be connected to the carrier gas storage section 200. The injector 6 can be connected to one side of the tank 4, and the other side of the injector 6 can be connected to the carrier gas storage section 200 containing the carrier gas. Therefore, the carrier gas stored in the carrier gas storage section 200 can be supplied to each of the tanks 4 via the injector 6. The injector 6 can be connected to the carrier gas storage section 200 via an injection conduit 6a. The injection conduit 6a can be implemented using at least one of pipes, hoses, and holes formed in the block. The carrier gas can be an inert gas such as argon (Ar). The carrier gas provides the flow force for the material stored in the tank 4 to flow towards the chamber 11, thus allowing for a smooth supply of material towards the chamber 11.

[0125] Furthermore, when supplying raw materials to chamber 11, the raw material supply device 1 can selectively use a carrier gas depending on the type, liquid, or solid state of the raw materials stored in tank 4. In this case, the types of raw materials stored in tank 4 may include molybdenum, parylene, perylene, organic polymers, etc. When a carrier gas is required to supply the raw materials stored in tank 4 to chamber 11, the raw material supply device 1 can supply the carrier gas to tank 4 using injector 6 and injection valve 7. When a carrier gas is not required to supply the raw materials stored in tank 4 to chamber 11, the raw material supply device 1 may not supply a carrier gas to tank 4.

[0126] Tank 4 can be connected in parallel to injector 6. In this case, tank 4 can be connected to carrier gas storage unit 200 via injector 6 respectively. Therefore, injector 6 can be implemented such that injector 6 is connected to only a portion of tank 4 to allow fluid flow, and carrier gas supplied from carrier gas storage unit 200 is supplied to the corresponding tank 4. Therefore, compared to the comparative example where tank 4 is connected in series to injector 6, when the material in tank 4 connected to carrier gas storage unit 200 via injector 6 to allow fluid flow is exhausted, the substrate processing apparatus 10 according to this disclosure can connect another tank 4 to carrier gas storage unit 200 via injector 6 to allow fluid flow, and thus, material can be continuously supplied to chamber 11 by using carrier gas. Therefore, even when tank 4 is depleted of raw materials, the substrate processing apparatus 10 according to this disclosure can still continuously perform the operation of supplying carrier gas to tank 4 and supplying raw materials to chamber 11 by using the carrier gas storage unit 200 without stopping the operation of supplying raw materials to chamber 11. Therefore, the processing process performed in the chamber can also be continuously performed without stopping the processing process. Therefore, the substrate processing apparatus 10 according to this disclosure can improve the productivity of the substrate 100 that has undergone processing.

[0127] Each of the tanks 4 can be detachably mounted to the injector 6. Therefore, when a replacement operation is performed on a portion of the tanks 4, the substrate processing apparatus 10 according to this disclosure is implemented to continuously perform the operation of supplying carrier gas to the tanks 4 and the operation of supplying raw materials to the chamber using other tanks 4. Therefore, in the substrate processing apparatus 10 according to this disclosure, when a replacement operation is performed on a portion of the tanks 4, the processing process performed in the chamber can also be continuously performed without stopping the processing process. Therefore, the substrate processing apparatus 10 according to this disclosure can improve the productivity of the substrates 100 that have undergone processing, and furthermore, can improve the ease of the tank 4 replacement operation. The tanks 4 can be individually and detachably mounted to the injector 6 by means of fastening such as bolts via a fastening method or a forced fit method.

[0128] The injector 6 may include multiple injection ports 61 and injection paths 62.

[0129] The injection port 61 can be connected to the tank 4. The tank 4 can be detachably mounted to the injection port 61. The injection port 61 can be combined with the injection body 60. The injection body 60 can form the overall appearance of the injector 6. The injection body 60 can be formed into a rectangular shape extending in the vertical direction (Z-axis direction), but is not limited thereto. When the tank 4 can be connected to the carrier gas storage section 200 to allow fluid flow, it can also be formed into another shape such as a rectangular cylinder.

[0130] The injection path 62 can be connected to the carrier gas storage unit 200. Multiple injection ports 61 can be connected to the injection path 62 to allow fluid flow. Therefore, all tanks 4 in the tank body 4 can be connected in parallel to the injection path 62 via the injection ports 61, thus allowing all tanks 4 in the tank body 4 to be supplied with carrier gas from the carrier gas storage unit 200 via the injection ports 61 and the injection path 62. The injection path 62 can be provided in the injection body 60. The injection path 62 can be implemented as a groove formed in the injection body 60. In this case, the injection ports 61 can include port holes for allowing carrier gas flow and can be connected to the injection path 62 via the port holes. The injection path 62 can be formed to extend in the vertical direction (Z-axis direction). In this case, the injection ports 61 in the injection body 60 can be arranged to be spaced apart from each other in the vertical direction (Z-axis direction). The injection ports 61 can be arranged to be spaced apart from each other in the vertical direction (Z-axis direction) and can be connected to different portions of the injection path 62 to allow fluid flow. Therefore, the tank 4 can be detachably mounted on the spray port 61 and can be stacked in the vertical direction (Z-axis direction). Thus, the substrate processing apparatus 10 according to this disclosure can reduce the mounting area occupied by the tank 4 in the workplace relative to the horizontal direction perpendicular to the vertical direction (Z-axis direction). Furthermore, in the substrate processing apparatus 10 according to this disclosure, even if the number of tanks 4 increases, the mounting area occupied by the tanks 4 in the workplace relative to the horizontal direction does not increase. Therefore, including the tank 4, the substrate processing apparatus 10 according to this disclosure can help improve the space utilization of the mounting area in the workplace.

[0131] Reference Figures 1 to 10 Injection valve 7 (e.g.) Figure 4 As shown, the interior of the ejector 6 can be selectively connected to or disconnected from each of the tanks 4. When a tank 4 requires replacement due to material depletion, the ejector valve 7 can disconnect the fluid flow connection between the corresponding tank 4 and the interior of the ejector 6, and can also establish a fluid flow connection between another tank 4 and the interior of the ejector 6. Therefore, even when a replacement operation is performed on a portion of the tanks 4, the substrate processing apparatus 10 according to this disclosure can continue to perform the processing process in the chamber 11 without stopping the processing process. Thus, the productivity of the substrate 100 that has undergone processing can be improved, and the ease of tank replacement operation can also be improved.

[0132] The injection valve 7 can selectively connect or disconnect the injection path 62 from each of the tanks 4. The injection valve 7 can open or close the path connecting the tank 4 to the injection path 62, thus selectively connecting or disconnecting the injection path 62 from the tank 4. The injection valve 7 can be connected to each of the tanks 4. Therefore, a tank 4 separated from the injector 6 for operational changes can remain in a closed path state via the injection valve 7. The injection valve 7 can be connected to the injector 6. In this case, the injection valve 7 can be connected to the injection port 61. The injection valve 7 can be connected to all tanks 4 and injection ports 61 within the tank 4.

[0133] For example, such as Figure 4 As shown, when three tanks 4a, 4b, and 4c are connected in parallel to the injector 6, three injection valves 7a, 7b, and 7c can be provided. Injection valves 7a, 7b, and 7c can selectively connect or disconnect the injection path 62 from each of the tanks 4a, 4b, and 4c. Although not shown, two or more tanks 4 can be connected in parallel to the injector 6. In this case, the raw material supply device 1 may include an equal number of injection valves 7 as the number of tanks 4.

[0134] Furthermore, if the injector 6 is provided, each of the tanks 4 may include an injection block 45.

[0135] The injection block 45 can be installed in the injector 6. The tank 4 can be installed in the injector 6 via the injection block 45. When the injection block 45 is installed in the injector 6, the internal space of the tank 4 can be connected to the injection port 61 to allow fluid flow. Therefore, the internal space of the tank 4 can be connected to the injection path 62 via the injection block 45 and the injection port 61 to allow fluid flow, and thus can be connected to the carrier gas storage section 200 via the injection path 62 to allow fluid flow. The injection block 45 can include a plurality of injection holes for allowing carrier gas flow, and can be connected to a plurality of port holes of the injection port 61 via the injection holes. The injection valve 7 can be connected to the injection block 45 for operation. In this case, the injection valve 7 can be connected to the injection block 45 respectively, and can open or close the injection block 45 and the injection port 61 respectively. The injection valve 7 can open or close the injection holes respectively.

[0136] Furthermore, when the injector 6 is provided, the main body 42 may include an inlet 426. The inlet 426 may be connected to each of the storage section 40 and the injection block 45 to allow fluid flow. Thus, carrier gas can flow through the injection block 45 and the inlet 426 into the storage section 40, and then be supplied to the connector 2 along with the raw material through the outlet 425 and the supply block 41. The inlet 426 may protrude upward from the bottom wall 420. The inlet 426 may be located at the portion where the first side wall 421 contacts the fourth side wall 424. In this case, the inlet 426 may protrude towards the storage section 40 from each of the first side wall 421 and the fourth side wall 424.

[0137] The inflow section 426 may include an inflow channel 426a and an inflow port 426b.

[0138] An inflow groove 426a can be formed on the upper surface of the inflow portion 426. The inflow groove 426a can be implemented as a groove with a specific depth formed in the upper surface of the inflow portion 426. The inflow groove 426a can be formed to connect to each of the storage portion 40 and the inflow port 426b to allow fluid flow. The length of the inflow groove 426a relative to the vertical direction (Z-axis direction) can be formed to be shorter than the distance between the lower end of the inflow groove 426a and the upper surface of the bottom wall 420. Therefore, an inflow jaw 426c can be formed relative to the vertical direction (Z-axis direction) between the lower end of the inflow groove 426a and the upper surface of the bottom wall 420. Therefore, the inflow portion 426 can be implemented such that when the raw material stored in the storage portion 40 is raised to a height higher than the inflow jaw 426c, the raw material passes over the inflow jaw 426c and enters the inflow groove 426a. That is, the inflow jaw 426c can prevent the raw material stored in the storage cavity 40 from flowing back into the inflow groove 426a.

[0139] The inlet port 426b allows raw material to flow in. The inlet port 426b can be connected to each of the inlet channel 426a and the injection block 45 to allow fluid flow. The inlet port 426b can be formed through the fourth sidewall 424. In this case, the inlet port 426b and the outlet port 425b can be formed in the sidewalls of the body 42, which are arranged opposite to each other. Therefore, the tank 4 can increase the flow distance of the raw material flowing along the storage section 40. The inlet port 426b can be connected to the injection hole of the injection block 45 to allow fluid flow. Relative to the vertical direction (Z-axis direction), the inlet port 426b can be positioned at a distance spaced from the lower surface of the body 42 than from the upper surface of the body 42. That is, the inlet port 426b can be positioned closer to the upper surface of the body 42 than to the lower surface of the body 42.

[0140] like Figure 6As shown, each of the inflow portion 426 and the outflow portion 425 can be formed adjacent to the first sidewall 421 relative to the first axial direction (X-axis direction). In this case, each of the inflow portion 426 and the outflow portion 425 can be positioned such that the distance between them and the first sidewall 421 is shorter than the distance between them and the second sidewall 422 relative to the first axial direction (X-axis direction). That is, each of the inflow portion 426 and the outflow portion 425 can be positioned closer to the first sidewall 421 than the second sidewall 422. The inflow portion 426 and the outflow portion 425 can be arranged on the same line relative to the first axial direction (X-axis direction). In this case, the same line can be parallel to the second axial direction (Y-axis direction). When each of the inflow portion 426 and the outflow portion 425 is formed adjacent to the first sidewall 421 relative to the first axial direction (X-axis direction), the tank body 4 can include an odd number of partition walls 44.

[0141] Furthermore, based on the arrangement of the partition walls, a modified embodiment of tank 4 can be implemented as follows. The modified embodiment of tank 4 can be implemented to substantially match the embodiment of tank 4 described above; therefore, the differences will be primarily described below.

[0142] Reference Figures 1 to 10 According to a modified embodiment of tank 4, each of the partition walls 44 can be configured to be spaced apart from each of the first sidewall 421 and the second sidewall 422 relative to the first axial direction (X-axis direction). Figure 10 As shown, the spacer 44b between each of the partition walls 44 and the first sidewall 421 relative to the first axial direction (X-axis direction) can be formed as a first spacer. In this case, each of the partition walls 44 and the first sidewall 421 can be spaced apart by the first spacer relative to the first axial direction (X-axis direction). The spacer 44c between each of the partition walls 44 and the second sidewall 422 relative to the first axial direction (X-axis direction) can be formed as a first spacer. In this case, each of the partition walls 44 can be configured to be spaced apart by the second sidewall 422 relative to the first axial direction (X-axis direction) by the first spacer. The spacer 44a between the partition walls 44 and each other relative to the second axial direction (Y-axis direction) can be formed as a first spacer. In this case, the partition walls 44 can be spaced apart by the first spacer relative to the second axial direction (Y-axis direction). Therefore, the modified embodiment of the tank 4 can be implemented such that the raw material flows along a flow path with a uniform width, thereby improving the uniformity of the raw material phase change. Furthermore, in a modified embodiment of the tank 4, the partition wall 44 can be configured to be spaced apart from all the sidewalls of the first sidewall 421 and the second sidewall 422, thereby preventing heat from being lost to the outside through the first sidewall 421 and the second sidewall 422.

[0143] According to a modified embodiment of the tank 4, the inlet 426 and the outlet 425 can be positioned spaced apart from each other relative to the first axial direction (X-axis direction). Therefore, a path for material flow can be provided at each of the two sides of the partition wall 44 relative to the first axial direction (X-axis direction). Thus, even if the residence time of the material is shortened, the modified embodiment of the tank 4 can still compensate for the residence time of the material because the inlet 426 and the outlet 425 can be positioned spaced apart from each other relative to the first axial direction (X-axis direction). Therefore, the modified embodiment of the tank 4 can increase the vaporization rate of the material stored in the storage section 40. In this case, relative to the first axial direction (X-axis direction), one of the inlet 426 and the outlet 425 can be formed adjacent to the first sidewall 421 and the other can be formed adjacent to the second sidewall 422. According to the modified embodiment of the tank 4, the distance 426d between the inlet 426 and the second sidewall 422 relative to the first axial direction (X-axis direction) is (e.g., ...). Figure 10 (As shown) can be equal to the distance 425d between the outlet 425 and the first sidewall 421 (as shown) Figure 10 (As shown). The distance 426d between the inflow portion 426 and the second sidewall 422 can correspond to the distance between the inflow port 426b and the second sidewall 422. The distance 425d between the outflow portion 425 and the first sidewall 421 can correspond to the distance between the discharge port 425b and the first sidewall 421.

[0144] A modified embodiment of tank 4 may include a first partition 40a and a second partition 40b.

[0145] The first partition 40a can protrude from the second sidewall 422 toward the first sidewall 421. The first partition 40a can be spaced apart from the first sidewall 421 relative to the first axial direction (X-axis direction). Therefore, a modified embodiment of the tank 4 can be implemented such that the carrier gas flowing in through the inlet 426 flows toward the first sidewall 421 along the space between the fourth sidewall 424 and the first partition 40a, and then passes through the first partition 40a only through the space between the first partition 40a and the first sidewall 421. Therefore, the modified embodiment of the tank 4 can increase the flow distance and residence time of each of the carrier gas and the raw material by using the first partition 40a. The first partition 40a and the first sidewall 421 can be spaced apart from each other with a first interval relative to the first axial direction (X-axis direction).

[0146] The second baffle 40b can protrude from the first sidewall 421 toward the second sidewall 422. The second baffle 40b can be spaced apart from the second sidewall 422 relative to the first axial direction (X-axis direction). Therefore, the modified embodiment of the tank 4 can be implemented such that the carrier gas and raw materials can only pass through the second baffle 40b through the space between the second baffle 40b and the second sidewall 422, and the carrier gas and raw materials passing through the second baffle 40b can flow toward the first sidewall 421 along the space between the third sidewall 423 and the second baffle 40b, thus reaching the outlet 425. Therefore, the modified embodiment of the tank 4 can increase the flow distance and residence time of each of the carrier gas and raw materials by using the second baffle 40b.

[0147] Reference Figures 1 to 11 The raw material supply equipment 1 may include a receiver 8.

[0148] The receiver 8 can obtain the amount of raw material stored in each of the tanks 4. The receiver 8 can obtain the amount of stored raw material using at least one of the vaporization rate and the internal pressure of each of the tanks 4. The amount of stored raw material based on the internal pressure of each of the tanks 4 and the amount of stored raw material based on the vaporization rate of each of the tanks 4 can be calculated through prior testing and can be pre-stored in the receiver 8. When the receiver 8 obtains the amount of stored raw material using the internal pressure of each of the tanks 4, the receiver 8 may include a pressure sensor installed in each of the tanks 4. When the receiver 8 obtains the amount of stored raw material using the vaporization rate of each of the tanks 4, the receiver 8 may include a mass flow meter (MFM) installed in the supply block 41.

[0149] The receiver 8 can supply the amount of stored raw material obtained to the supply valve 3. The receiver 8 can supply the amount of stored raw material obtained to the supply valve 3 via wired or wireless communication. By using the amount of stored raw material obtained by the receiver 8, the supply valve 3 can close tanks 4 with remaining raw material less than a predetermined reference amount and open tanks 4 with remaining raw material greater than or equal to the reference amount. Therefore, the raw material supply device 1 can prevent raw material from tanks 4 with remaining raw material less than the reference amount from being supplied to the chamber 11, thus preventing low-quality raw material from being supplied to the chamber 11. Furthermore, when the amount of stored raw material in tanks 4 supplying raw material to the chamber 11 is less than the reference amount, the raw material supply device 1 can automatically connect tanks 4 with stored raw material amounts greater than or equal to the reference amount to the chamber 11 using the receiver 8 and the supply valve 3 to allow fluid flow. Therefore, the raw material supply device 1 can improve the stability of the raw material supply to the chamber 11.

[0150] The temperature sensor 8 can measure the internal temperature of each of the tanks 4. In this case, the temperature sensor 8 may include temperature sensors installed in multiple tanks 4. The temperature sensor 8 can provide the obtained temperature to the heater 5. The temperature sensor 8 can provide the obtained temperature to the heater 5 via wired or wireless communication. The heater 5 can adjust the heating temperature used to heat the raw material by using the temperature obtained by the temperature sensor 8. Therefore, the raw material supply device 1 can improve the vaporization stability of the raw material stored in the tanks 4, and thus improve the stability of the raw material supply to the chamber 11.

[0151] Reference Figures 1 to 11 The raw material supply equipment 1 may include a controller 9.

[0152] The controller 9 can control each of the heaters 5, thereby adjusting the heating temperature for heating the raw material based on the temperature obtained by the receiver 8. The controller 9 can receive the temperature from the receiver 8 and can transmit control signals to each of the heaters 5 via wired or wireless communication.

[0153] The controller 9 can control each of the supply valves 3 based on the amount of stored raw material obtained by the receiver 8. The controller 9 can receive the amount of stored raw material from the receiver 8 and can transmit control signals to each of the supply valves 3 via wired or wireless communication.

[0154] Reference Figures 1 to 12 The substrate processing apparatus 10 according to this disclosure may include a connection conduit 14 and a switch 15.

[0155] Connecting pipe 14 can be connected to chamber 11. Connecting pipe 14 can be connected to injector 13 disposed in chamber 11. Multiple raw material supply devices 1 can be connected to connecting pipe 14. For example, such as Figure 12 As shown, the two raw material supply devices 1a and 1b can be connected to the connecting pipe 14. In this case, the connector 2 included in each of the raw material supply devices 1a and 1b can be connected to the connecting pipe 14.

[0156] Switch 15 can be connected to connecting conduit 14. Switch 15 can be connected to connecting conduit 14 and disposed between chamber 11 and raw material supply device 1. Based on switch 15, one of the first raw material supply device 1a and the second raw material supply device 1b in raw material supply device 1 can be supplied with raw material through injector 13. In this case, switch 15 can connect one of the first raw material supply device 1a and the second raw material supply device 1b to injector 13. For example, when the first raw material supply device 1a is connected to injector 13, if a defect such as a malfunction occurs in the first raw material supply device 1a, switch 15 can disconnect the connection between the first raw material supply device 1a and injector 13, and can also connect the second raw material supply device 1b and injector 13. As described above, the substrate processing apparatus 10 according to the present disclosure is implemented such that when a defect occurs in the raw material supply device 1 connected to injector 13 in raw material supply device 1, one of the other raw material supply devices 1 can still be connected to injector 13, thus enabling continuous supply of raw material to chamber 11. Therefore, the substrate processing apparatus 10 according to this disclosure can improve the stability of the raw material supply to the chamber 11, thereby improving the stability of the processing. The switch 15 may include a valve.

[0157] If switch 15 is provided, connecting pipe 14 may include multiple branch pipes. One side of each branch pipe may be connected to each of the raw material supply devices 1. The other side of each branch pipe may be connected to switch 15. Switch 15 may be connected to injector 13 via a single connecting pipe 14.

[0158] In the following, embodiments of the raw material supply method according to the present disclosure will be described in detail with reference to the accompanying drawings.

[0159] Reference Figures 1 to 12 The raw material supply method according to this disclosure is used to supply raw materials to chamber 11. The raw material supply method according to this disclosure can be performed by the raw material supply device 1 included in the substrate processing apparatus 10 according to this disclosure as described above. The raw material supply method according to this disclosure may include the following steps.

[0160] First, the raw material in the first tank 4a of the plurality of tanks 4 is vaporized and supplied to the chamber 11. This step can be performed by vaporizing the raw material stored in the storage section 40 of the first tank 4a and supplying it to the chamber 11 via the connector 2. In this case, only the first supply valve 3a of the supply valves 3 can be opened to connect the first tank 4a to the supply path 22 to allow fluid flow. The other supply valves 3 of the supply valves 3 can be closed to connect the tank 4 to the supply path 22 to allow fluid flow. Therefore, only the raw material stored in the first tank 4a of the tanks 4 can be vaporized and supplied to the chamber 11. The step of vaporizing the raw material in the first tank and supplying it to the chamber can supply carrier gas to the first tank 4a. In this case, only the first injection valve 7a of the injection valves 7 can be opened to connect the first tank 4a to the injection path 62 to allow fluid flow. The other injection valves 7 of the injection valves 7 can be closed to connect the tank 4 to the injection path 62 to allow fluid flow.

[0161] Next, it is possible to monitor whether the obtained value of at least one of the internal pressure of the first tank 4a and the vaporization amount of the first tank 4a is less than or equal to a predetermined value. This step can be performed using a receiver 8 by measuring at least one of the internal pressure of the first tank 4a and the vaporization amount of the first tank 4a, obtaining the obtained value, and comparing the obtained value with the predetermined value. The predetermined value can be an obtained value that affects the processing process as the raw material supply status of chamber 11 changes according to the amount of raw material stored in tank 4, which can be calculated through pre-testing and can be pre-stored in the receiver 8.

[0162] Next, when the obtained value is less than or equal to a predetermined value, the raw material in the second tank 4b of the tank 4 is vaporized and supplied to the chamber. This step can be performed by vaporizing the raw material stored in the storage section 40 of the second tank 4b and supplying it to the chamber 11 through the connector 2. In this case, the second supply valve 3b in the supply valve 3 can be opened to connect the second tank 4b to the supply path 22 to allow fluid flow. The first supply valve 3a can be in the state where the path connecting the first tank 4a to the supply path 22 to allow fluid flow is open, so that the raw material stored in the second tank 4b and the raw material stored in the first tank 4a can be supplied to the chamber 11 together. The step of vaporizing the raw material in the second tank 4b and supplying it to the chamber can supply carrier gas to the second tank 4b. In this case, the second injection valve 7b in the injection valve 7 can be opened to connect the second tank 4b to the injection path 62 to allow fluid flow.

[0163] Next, the supply to the first tank 4a is stopped. This step can be performed by using the first supply valve 3a to close the path connecting the first tank 4a to the supply path 22 to allow fluid flow. Therefore, only the raw material in the second tank 4b within the tank 4 can be vaporized and supplied to the chamber 11. With the second tank 4b supplying raw material to the chamber 11, the operation of disconnecting the first tank 4a from the connector 2 and replacing it with another tank 4 can be performed. The step of stopping the supply to the first tank can stop the supply of carrier gas to the first tank 4a. In this case, the first injection valve 7a can close the path connecting the first tank 4a to the injection path 62 to allow fluid flow.

[0164] Here, the step of stopping the supply to the first tank can be achieved by reducing the supply amount of the first tank 4a within a predetermined reference time when the obtained value is less than or equal to a predetermined value, and then stopping the supply to the first tank 4a when the predetermined reference time has elapsed. The predetermined reference time can be the time required from the start of vaporization of the raw material in tank 4 until the vaporization of the raw material reaches a stable state, and the predetermined reference time can be calculated through pre-testing and can be stored in the controller 9 in advance.

[0165] In this scenario, the steps of vaporizing the raw material in the second tank 4b and supplying it to the chamber can be performed by increasing the supply of raw material in the second tank 4b to a predetermined reference supply amount within a predetermined reference time when the obtained value is less than or equal to a predetermined value, and then supplying the raw material in the second tank 4b to the chamber 11 at the predetermined reference supply amount after the predetermined reference time has elapsed. The predetermined reference supply amount can be the flow rate of the raw material required to perform the processing procedure, and the predetermined reference supply amount can be calculated through pre-testing and can be pre-stored in the controller 9.

[0166] As described above, the raw material supply method according to this disclosure can be implemented such that when the amount of raw material stored in the first tank 4a supplying raw material to chamber 11 is exhausted and the supply is switched to the second tank 4b, the raw material is supplied only by the second tank 4b during the period when the supply amount of raw material to chamber 11 is reduced by the first tank 4a and the supply amount of raw material to the second tank 4b is increased. Therefore, the raw material supply method according to this disclosure can stably supply raw material during the process of changing the tank 4 supplying raw material to chamber 11, thereby helping to increase the quality of the substrate for which the processing has been performed.

[0167] As described above, this disclosure is not limited to the above embodiments and drawings, and those skilled in the art will clearly understand that various changes, modifications and substitutions can be made without departing from the scope and spirit of this disclosure.

Claims

1. A raw material supply device for supplying raw materials to a chamber for performing a processing procedure on a substrate, the raw material supply device comprising: Multiple tanks are used to store the raw materials; A connector, one side of which is connected to the plurality of tanks and the other side of which is connected to the chamber; as well as Multiple supply valves selectively connect or disconnect each of the multiple tanks from the interior of the connector. Each of the plurality of tanks includes a heater for heating the raw material, and Each of the plurality of tanks is detachably fitted into the connector.

2. The raw material supply apparatus according to claim 1, wherein The connector includes a heater for heating the raw material.

3. The raw material supply apparatus according to claim 1, wherein Each of the plurality of tanks includes a supply block equipped in the connector. The plurality of supply valves are respectively connected to the plurality of supply blocks to perform operations.

4. The raw material supply equipment as described in claim 1, comprising: An injector, one side of which is connected to the plurality of tanks and the other side of which is connected to a carrier gas storage unit containing carrier gas; as well as Multiple injection valves selectively connect or disconnect each of the multiple tanks from the interior of the injector.

5. The raw material supply equipment as described in claim 4, wherein, Each of the plurality of tanks includes a spray block equipped in the injector, and The injection valves are respectively connected to the injection blocks to perform their functions.

6. The raw material supply equipment as described in claim 1, wherein, Each of the plurality of tanks includes a body for storing the raw materials, and The heater includes a first heater that heats the lower part of the body and a second heater that heats the upper part of the body.

7. The raw material supply equipment as described in claim 6, wherein, The main body includes a first sidewall and a second sidewall that are spaced apart from each other and face each other in a first axial direction, and The tank body includes multiple partition walls, which are arranged to be separated from each other in a second axis direction perpendicular to the first axis direction, thereby forming a flow path inside the body that changes the flow direction.

8. The raw material supply equipment as described in claim 7, wherein, Of the plurality of partition walls, the first partition wall, positioned at an odd number of locations relative to the second axis, protrudes from the first sidewall toward the second sidewall and is spaced apart from the second sidewall relative to the first axis. The second partition wall, which is located at an even number of positions relative to the second axis, protrudes from the second side wall toward the first side wall and is spaced apart from the first side wall relative to the first axis.

9. The raw material supply equipment as described in claim 8, wherein, The first partition wall and the second partition wall are configured to be spaced apart from each other by a first interval relative to the second axial direction. Each of the first partition walls is configured to be spaced apart from the second sidewall by the first interval relative to the first axial direction, and Each of the second partition walls is configured to be spaced apart from the first sidewall by the first interval relative to the first axial direction.

10. The raw material supply equipment as described in claim 7, wherein, Each of the partition walls is configured to be spaced apart from the first sidewall by a first interval relative to the first axial direction, and spaced apart from the second sidewall by the first interval relative to the first axial direction.

11. The raw material supply equipment as described in claim 10, wherein, Each of the tanks includes: The third sidewall and the fourth sidewall are configured to be spaced apart from each other and face each other in the second axial direction; The inlet section allows the raw material to flow in; and The outflow section discharges the raw material.

12. The raw material supply equipment as described in claim 11, wherein, Each of the inflow portion and the outflow portion is formed adjacent to the first sidewall relative to the first axial direction, or One of the inflow portion and the outflow portion is formed adjacent to the first sidewall relative to the first axis direction, and the other of the inflow portion and the outflow portion is formed adjacent to the second sidewall relative to the first axis direction.

13. The raw material supply equipment as described in claim 7, wherein, At least one of the first heater and the second heater includes multiple heating lines arranged parallel to the first axis direction, and The multiple heating lines are respectively positioned at a distance from the partition wall relative to the second axis direction.

14. The raw material supply equipment as described in claim 7, wherein, At least one of the first heater and the second heater includes multiple heating lines arranged parallel to the first axis direction, and Each of the plurality of heating lines is positioned relative to the second axis at the location where the partition wall is formed.

15. The raw material supply equipment as described in claim 6, wherein, The heater includes a third heater that heats the body on the side surface of the body.

16. The raw material supply equipment as described in claim 7, wherein, The plurality of partition walls are joined to the body to contact each of the lower part and the upper part of the body.

17. The raw material supply equipment as described in claim 1, comprising: A temperature sensor is used to obtain the internal temperature of each of the tanks. as well as A controller controls each of the heaters to adjust the heating temperature of the raw material according to the temperature obtained by the receiver.

18. The raw material supply equipment of claim 1, further comprising a device for obtaining the amount of raw material stored in each of the tanks. in, The supply valve closes tanks with remaining raw materials less than a predetermined baseline amount and opens one or more tanks with remaining raw materials greater than or equal to the predetermined baseline amount, based on the amount of stored raw materials obtained by one or more of the receivers.

19. A substrate processing apparatus, comprising: Chamber; A substrate support is disposed in the chamber and supports one or more substrates; The injector sprays raw materials toward the substrate support; as well as The raw material supply device according to any one of claims 1 to 20 is used to supply the raw material to the injector.

20. The substrate processing apparatus of claim 19, further comprising a connection conduit connected to the ejector and a switch connected to the connection conduit. in, Multiple raw material supply devices are connected to the connecting pipeline, and One of the first raw material supply device and the second raw material supply device in the raw material supply equipment supplies the raw material through the injector according to the switch.

21. A method for supplying raw materials to a raw material supply device, the raw material supply device comprising a plurality of tanks, the method comprising: The step of vaporizing the raw material in the first tank of the tank and supplying the raw material to the chamber; The step of monitoring whether the obtained value of at least one of the internal pressure of the first tank and the vaporization amount of the first tank is less than or equal to a predetermined value; When the obtained value is less than or equal to the predetermined value, the step of vaporizing the raw material in the second tank in the tank and supplying the raw material to the chamber; as well as The step of stopping the supply to the first tank.

22. The raw material supply method as described in claim 21, wherein, The step of stopping the supply of the first tank involves reducing the supply amount of the first tank within a predetermined reference time when the obtained value is less than or equal to the predetermined value, and then stopping the supply of the first tank after the predetermined reference time has elapsed. The step of vaporizing the raw material in the second tank in the tank and supplying the raw material to the chamber is as follows: when the obtained value is less than or equal to the predetermined value, the supply amount of the raw material in the second tank is increased to the predetermined reference supply amount within the predetermined reference time, and then the raw material in the second tank is supplied to the chamber at the predetermined reference supply amount after the predetermined reference time has elapsed.

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