Antenna and electronic device including the same

Abstract

According to various embodiments, an electronic device may include: a conductive side member; a conductive extension member extending from the conductive side member into an internal space; a non-conductive region disposed between the conductive side member and the conductive extension member; a conductive portion disposed by a segment extending from the non-conductive region into the side member; a slit extending a specified length from the non-conductive region in a direction opposite to the conductive portion, the slit corresponding to the segment; and a wireless communication circuit electrically connected via a first point of the conductive portion and configured to transmit or receive a wireless signal in a first frequency band.

Description

Technical Field

[0001] Embodiments of this disclosure relate to antennas and electronic devices including such antennas. Background Technology

[0002] As the functional differences between manufacturers narrow, electronic devices are becoming increasingly thinner to meet consumer purchasing desires, and are being developed to increase rigidity, enhance design, and differentiate their functional components. An electronic device may include at least one antenna, which should provide communication between its components (i.e., constituent elements). The at least one antenna can be implemented through a metal frame (e.g., a side member) that serves as part of the device's housing and needs to be improved to enhance radiation performance.

[0003] The above information may be provided as relevant technology to enhance understanding of this disclosure. No assertion or determination is made regarding the applicability of any of the foregoing content as prior art in relation to this disclosure. Summary of the Invention

[0004] Technical issues

[0005] The electronic device may include at least one housing (e.g., a housing structure) comprising space for accommodating electronic components (i.e., parts). The housing may include side members (i.e., side profile members) (e.g., side frames or borders) that serve as at least a portion of the side surface of the electronic device. The side members may include a metallic material (e.g., a conductive member, conductive portion, or conductive material) for enhancing the rigidity of the electronic device and / or performing a specific function (e.g., an antenna function). The side members may include a polymer (e.g., a non-conductive member, non-conductive portion, or non-conductive material) bonded to the metallic material. For example, the side member may include at least one conductive portion segmented by at least one segment (e.g., a non-conductive portion). The at least one conductive portion is electrically connected to the wireless communication circuitry of the electronic device, thereby enabling it to operate as at least one antenna operating in at least one frequency band.

[0006] Meanwhile, the at least one conductive portion used as a side member can operate as an antenna capable of achieving ideal radiation performance through the symmetrical arrangement (i.e., arrangement) of the left and right segments and the center feeding of the conductive portion.

[0007] However, as electronic devices become increasingly thinner, conductive sections are arranged in asymmetrical segmented structures based on the placement of peripheral electronic components such as cameras or speakers, and can be configured with off-center feed positions. In conductive sections with such a placement structure, in a specific frequency band (e.g., the low-frequency band (approximately 600 MHz to 960 MHz)), a relative surge in current occurs in higher modes such as mode 3 (e.g., mode j3), mode 4 (e.g., mode j4), and mode 5 (e.g., mode j5) compared to mode 1 (e.g., mode j1) and mode 2 (e.g., mode j2), thus potentially reducing the antenna's radiation efficiency.

[0008] Furthermore, another antenna (e.g., a slot antenna) can be placed close to the frame antenna, which operates by using conductive parts. Even if it operates in a frequency band different from the frame antenna, this other antenna may operate at a harmonic frequency and may reduce the radiation performance of the frame antenna depending on its proximity.

[0009] Various embodiments of this disclosure can provide an antenna and electronic devices including the antenna, which can help improve antenna radiation performance even if the segments and / or feed locations are asymmetrically positioned.

[0010] Embodiments of this disclosure may provide an antenna and electronic devices including the antenna, which may help improve isolation from another antenna located close to the antenna.

[0011] However, the purpose of this disclosure is not limited to the above-mentioned purposes, but can be extended in various ways without departing from the technical teachings and scope of this disclosure.

[0012] Solution to the problem

[0013] According to various embodiments, an electronic device may include: a conductive side member; a conductive extension member extending from the conductive side member into an internal space; a non-conductive region disposed between the conductive side member and the conductive extension member; a conductive portion disposed by a segment extending from the non-conductive region into the side member; a slit extending a specified length from the non-conductive region in a direction opposite to the conductive portion, the slit corresponding to the segment; and a wireless communication circuit electrically connected via a first point of the conductive portion and configured to transmit or receive a wireless signal in a first frequency band.

[0014] Beneficial effects of the invention

[0015] An electronic device according to an exemplary embodiment of the present disclosure may include a conductive portion disposed through a non-conductive region and a segmented portion for operation as an antenna, and the conductive portion may help improve the radiation performance of the antenna by reducing higher modes through a current distribution induced via a slit extending a specified length from the non-conductive region, and may also help improve the isolation between other antennas disposed nearby.

[0016] In addition, various effects that can be directly or indirectly identified through this document can be provided.

[0017] The effects obtained through this disclosure are not limited to those described above, and those skilled in the art to which this disclosure pertains will clearly understand from the following description other effects not mentioned above. Attached Figure Description

[0018] In conjunction with the description of the accompanying drawings, the same or similar reference numerals may be used for the same or similar constituent elements.

[0019] Figure 1 This is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

[0020] Figure 2a This is a front perspective view of an electronic device according to various embodiments of the present disclosure.

[0021] Figure 2b Various embodiments according to this disclosure Figure 1 Rear perspective view of the electronic device.

[0022] Figure 3 Various embodiments according to this disclosure Figure 1 An exploded perspective view of an electronic device.

[0023] Figure 4a This is a configuration diagram of the side members according to various embodiments of the present disclosure.

[0024] Figure 4b Various embodiments according to this disclosure Figure 4a Partial configuration diagram of the side components.

[0025] Figure 4c Various embodiments according to this disclosure Figure 4a A magnified view of region 4c.

[0026] Figure 5a This is a view showing the current distribution of each mode according to the slit length based on various embodiments of the present disclosure.

[0027] Figure 5b This is a graph comparing the radiation performance of the first antenna based on the length of the slit according to various embodiments of the present disclosure.

[0028] Figure 6 This is a graph comparing the isolation between the first antenna and the second antenna based on the presence or absence of a slit, according to various embodiments of this disclosure.

[0029] Figure 7a and Figure 7b This is a configuration diagram of side members with different power supply positions according to various embodiments of the present disclosure.

[0030] Figure 7c Based on various embodiments of this disclosure Figure 7a and Figure 7b A view comparing the current distribution of each mode, indicating whether there is a slit in the antenna.

[0031] Figure 7d Based on various embodiments of this disclosure Figure 7a and Figure 7b The presence or absence of a slit in the antenna is compared with the antenna radiation performance curves. Detailed Implementation

[0032] Various exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. However, the present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. In the description taken in conjunction with the accompanying drawings, the same or similar reference numerals may be used to denote the same or similar elements. Furthermore, for the sake of clarity and brevity, descriptions of known functions and configurations will be omitted in the drawings and related descriptions.

[0033] Figure 1 This is a block diagram illustrating an electronic device 101 in a network environment 100 according to various embodiments.

[0034] Reference Figure 1In network environment 100, electronic device 101 can communicate with electronic device 102 via a first network 198 (e.g., a short-range wireless communication network), or with at least one of electronic device 104 or server 108 via a second network 199 (e.g., a long-range wireless communication network). According to an embodiment, electronic device 101 can communicate with electronic device 104 via server 108. According to an embodiment, electronic device 101 may include a processor 120, memory 130, input module 150, sound output module 155, display module 160, audio module 170, sensor module 176, interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, user identification module (SIM) 196, or antenna module 197. In some embodiments, at least one of the above components (e.g., connection terminal 178) may be omitted from electronic device 101, or one or more other components may be added to electronic device 101. In some embodiments, some of the components described above (e.g., sensor module 176, camera module 180, or antenna module 197) may be implemented as a single integrated component (e.g., display module 160) 11.

[0035] Processor 120 may run software (e.g., program 140) to control at least one other component (e.g., hardware or software component) of electronic device 101 connected to processor 120, and may perform various data processing or calculations. According to one embodiment, as at least part of the data processing or calculation, processor 120 may store commands or data received from another component (e.g., sensor module 176 or communication module 190) in volatile memory 132, process the commands or data stored in volatile memory 132, and store the resulting data in non-volatile memory 134. According to embodiments, processor 120 may include a main processor 121 (e.g., central processing unit (CPU) or application processor (AP)) or an auxiliary processor 123 (e.g., graphics processing unit (GPU), neural processing unit (NPU), image signal processor (ISP), sensor central processor, or communication processor (CP)) that is operationally independent of or combined with the main processor 121. For example, when electronic device 101 includes a main processor 121 and an auxiliary processor 123, the auxiliary processor 123 may be adapted to consume less power than the main processor 121, or to be dedicated to a specific function. The auxiliary processor 123 may be implemented separately from the main processor 121, or may be implemented as part of the main processor 121.

[0036] When the main processor 121 is inactive (e.g., in sleep mode), the auxiliary processor 123 (rather than the main processor 121) can control at least some of the functions or states associated with at least one component of the electronic device 1011 (e.g., display module 160, sensor module 176, or communication module 190), or when the main processor 121 is active (e.g., running an application), the auxiliary processor 123 can work with the main processor 121 to control at least some of the functions or states associated with at least one component of the electronic device 101 (e.g., display module 160, sensor module 176, or communication module 190). According to embodiments, the auxiliary processor 123 (e.g., an image signal processor or a communication processor) may be implemented as part of another component (e.g., camera module 180 or communication module 190) functionally associated with the auxiliary processor 123. According to embodiments, the auxiliary processor 123 (e.g., a neural processing unit) may include hardware architecture dedicated to artificial intelligence model processing. Artificial intelligence models can be generated through machine learning. For example, such learning can be performed via electronic device 101 where artificial intelligence is performed or via a separate server (e.g., server 108). The learning algorithm may include, but is not limited to, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), or a deep Q-network, or a combination of two or more thereof, but is not limited thereto. Additionally or optionally, the artificial intelligence model may include software structures in addition to hardware structures.

[0037] Memory 130 may store various data used by at least one component of electronic device 101 (e.g., processor 120 or sensor module 176). The various data may include, for example, software (e.g., program 140) and input or output data for commands associated with it. Memory 130 may include volatile memory 132 or non-volatile memory 134.

[0038] The program 140 may be stored as software in the memory 130, and the program 140 may include, for example, an operating system (OS) 142, middleware 144, or application 146.

[0039] The input module 150 can receive commands or data from outside the electronic device 101 (e.g., a user) that will be used by other components of the electronic device 101 (e.g., processor 120). The input module 150 may include, for example, a microphone, mouse, keyboard, keys (e.g., buttons), or digital pen (e.g., stylus).

[0040] The sound output module 155 can output sound signals to the outside of the electronic device 101. The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as playing multimedia or playing records. The receiver can be used to receive incoming calls. According to an embodiment, the receiver can be implemented separately from the speaker or as part of the speaker.

[0041] Display module 160 can visually provide information to the outside of electronic device 101 (e.g., to a user). Display device 160 may include, for example, a display, a holographic device, or a projector, and control circuitry for controlling a respective one of the display, holographic device, and projector. According to an embodiment, display module 160 may include a touch sensor adapted to detect touch or a pressure sensor adapted to measure the intensity of the force caused by touch.

[0042] The audio module 170 can convert sound into electrical signals and vice versa. According to an embodiment, the audio module 170 can obtain sound via the input module 150, or via the sound output module 155, or directly (e.g., wired) with the electronic device 101.

[0043] The headphone output sound from an external electronic device (e.g., electronic device 102) that is connected or wirelessly connected.

[0044] Sensor module 176 can detect the operating state of electronic device 101 (e.g., power or temperature) or the environmental state outside electronic device 101 (e.g., user state), and then generate an electrical signal or data value corresponding to the detected state. According to embodiments, sensor module 176 may include, for example, a gesture sensor, gyroscope sensor, atmospheric pressure sensor, magnetic sensor, accelerometer, grip sensor, proximity sensor, color sensor, infrared (IR) sensor, biometric sensor, temperature sensor, humidity sensor, or illuminance sensor.

[0045] Interface 177 may support one or more specific protocols used to enable electronic device 101 to connect directly (e.g., wired) or wirelessly to external electronic devices (e.g., electronic device 102). According to embodiments, interface 177 may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) interface, or an audio interface.

[0046] Connection 178 may include a connector, through which electronic device 101 may be physically connected to an external electronic device (e.g., electronic device 102). According to embodiments, connection 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0047] The haptic module 179 can convert electrical signals into mechanical stimuli (e.g., vibration or motion) or electrical stimuli that can be recognized by a user through his touch or kinesthesia. According to embodiments, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulator.

[0048] Camera module 180 can capture still or moving images. According to an embodiment, camera module 180 may include one or more lenses, an image sensor, an image signal processor, or a flash.

[0049] The power management module 188 manages the power supply to the electronic device 101. According to an embodiment, the power management module 188 may be implemented as at least part of, for example, a power management integrated circuit (PMIC).

[0050] Battery 189 can power at least one component of electronic device 101. According to an embodiment, battery 189 may include, for example, a non-rechargeable primary battery, a rechargeable rechargeable battery, or a fuel cell.

[0051] Communication module 190 can support the establishment of a direct (e.g., wired) or wireless communication channel between electronic device 101 and external electronic devices (e.g., electronic device 102, electronic device 104, or server 108), and perform communication via the established communication channel. Communication module 190 may include one or more communication processors capable of operating independently of processor 120 (e.g., application processor (AP)) and support direct (e.g., wired) or wireless communication. According to embodiments, communication module 190 may include wireless communication module 192 (e.g., cellular communication module, short-range wireless communication module, or Global Navigation Satellite System (GNSS) communication module) or wired communication module 194 (e.g., local area network (LAN) communication module or power line communication (PLC) module). One of these communication modules can communicate with an external electronic device via a first network 198 (e.g., a short-range communication network such as Bluetooth, Wi-Fi Direct, or Infrared Data Association (IrDA)) or a second network 199 (e.g., a long-range communication network such as a traditional cellular network, 5G network, next-generation communication network, the Internet, or a computer network (e.g., a LAN or a wide area network (WAN))). These various types of communication modules can be implemented as a single component (e.g., a single chip) or as multiple components separate from each other (e.g., multiple chips). The wireless communication module 192 can identify and verify the electronic device 101 in the communication network (such as the first network 198 or the second network 199) using user information (e.g., the International Mobile Subscriber Identity (IMSI)) stored in the user identification module 196.

[0052] Wireless communication module 192 can support 5G networks following 4G networks and next-generation communication technologies (such as new radio (NR) access technologies). NR access technologies can support enhanced mobile broadband (eMBB), massive machine-type communication (mMTC), or ultra-reliable low-latency communication (URLLC). Wireless communication module 192 can support high-frequency bands (e.g., millimeter-wave bands) to achieve, for example, high data transmission rates. Wireless communication module 192 can support various technologies used to ensure performance in high-frequency bands, such as, for example, beamforming, massive MIMO, full-dimensional MIMO (FD-MIMO), array antennas, analog beamforming, or massive antennas. Wireless communication module 192 can support various requirements specified in electronic device 101, external electronic devices (e.g., electronic device 104), or network systems (e.g., second network 199). According to an embodiment, the wireless communication module 192 may support peak data rates (e.g., 20 Gbps or greater) for implementing eMBB, lost coverage (e.g., 164 dB or less) for implementing mMTC, or U-plane latency (e.g., 0.5 ms or less for each of the downlink (DL) and uplink (UL), or 1 ms or less round trip) for implementing URLLC.

[0053] Antenna module 197 can transmit or receive signals or power to or from the exterior of electronic device 101 (e.g., external electronic device). According to an embodiment, antenna module 197 may include an antenna comprising a radiating element formed of a conductive material or conductive pattern formed in or on a substrate (e.g., a printed circuit board (PCB)). According to an embodiment, antenna module 197 may include multiple antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network (such as a first network 198 or a second network 199) can be selected from the multiple antennas by, for example, communication module 190 (e.g., wireless communication module 192). Signals or power can then be transmitted or received between communication module 190 and the external electronic device via the selected at least one antenna. According to an embodiment, additional components besides the radiating element (e.g., a radio frequency integrated circuit (RFIC)) may be additionally incorporated into antenna module 197.

[0054] According to various embodiments, antenna module 197 may form a millimeter-wave antenna module. According to embodiments, the millimeter-wave antenna module may include a printed circuit board, a radio frequency integrated circuit (RFIC), and multiple antennas (e.g., an array antenna), wherein the RFIC is disposed on or adjacent to a first surface (e.g., a bottom surface) of the printed circuit board and is capable of supporting a specified high-frequency band (e.g., a millimeter-wave band), and the multiple antennas are disposed on or adjacent to a second surface (e.g., a top surface or a side surface) of the printed circuit board and are capable of transmitting or receiving signals in the specified high-frequency band.

[0055] At least some of the aforementioned components can be interconnected and communicate signals (e.g., commands or data) between them via an inter-peripheral communication scheme (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), or mobile industrial processor interface (MIPI)).

[0056] According to an embodiment, commands or data can be sent or received between electronic device 101 and external electronic device 104 via server 108 connected to a second network 199. Each of electronic device 102 or electronic device 104 can be a device of the same type as electronic device 101, or a device of a different type. According to an embodiment, all or some operations that would be performed on electronic device 101 can be performed on one or more of external electronic devices 102, external electronic devices 104, or server 108. For example, if electronic device 101 is required to automatically perform a function or service, or is required to perform a function or service in response to a request from a user or another device, electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service, instead of running the function or service, or electronic device 101 may request the one or more external electronic devices to perform at least a portion of the function or service in addition to running the function or service. Upon receiving the request, one or more external electronic devices may perform at least a portion of the requested function or service, or perform additional functions or services related to the request, and transmit the result of the execution to electronic device 101. Electronic device 101 may provide the result as at least a partial response to the request, with or without further processing of the result. For this purpose, technologies such as cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing may be used. Electronic device 101 may use, for example, distributed computing or mobile edge computing to provide ultra-low latency services. In another embodiment, external electronic device 104 may include an Internet of Things (IoT) device. Server 108 may be an intelligent server using machine learning and / or neural networks. According to embodiments, external electronic device 104 or server 108 may be included in a second network 199. Electronic device 101 may be applied to intelligent services based on 5G communication technology or IoT-related technologies (e.g., smart homes, smart cities, smart cars, or healthcare).

[0057] Figure 2a A perspective view showing the front surface of a mobile electronic device according to an embodiment of the present disclosure is shown. Figure 2b The illustration shows embodiments according to this disclosure. Figure 2a A perspective view of the rear surface of the mobile electronic device shown.

[0058] Figure 2a and Figure 2b The mobile electronic device 200 in the middle can be at least partially similar to Figure 1 The electronic device 101 may further include other embodiments.

[0059] Reference Figure 2a and Figure 2b The mobile electronic device 200 may include a housing 210, which includes a first surface (or front surface) 210A, a second surface (or rear surface) 210B, and a side surface 210C surrounding the space between the first surface 210A and the second surface 210B. The housing 210 may refer to a structure forming a portion of the first surface 210A, the second surface 210B, and the side surface 210C. The first surface 210A may be formed of a front panel 202 (e.g., a glass or polymer plate coated with various coatings), at least a portion of which is substantially transparent. The second surface 210B may be formed of a substantially opaque rear panel 211. The rear panel 211 may be formed of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or any combination thereof. The side surface 210C may be formed of a side frame structure (or “side member”) 218, which is combined with the front panel 202 and the rear panel 211 and includes metal and / or polymer. The back panel 211 and the side frame structure 218 can be integrally formed and can be made of the same material (e.g., a metal material such as aluminum).

[0060] The front panel 202 may include two first regions 210D, each disposed at a long edge of the front panel 202, and extending seamlessly from a first surface 210A toward the rear panel 211. Similarly, the rear panel 211 may include two second regions 210E, each disposed at a long edge of the rear panel 211, and extending seamlessly from a second surface 210B toward the front panel 202. The front panel 202 (or the rear panel 211) may include only one of the first regions 210D (or the second regions 210E). Either the first region 210D or the second region 210E may be partially omitted. When viewed from the side of the mobile electronic device 200, the side frame structure 218 may have a first thickness (or width) on the side excluding the first region 210D or the second region 210E, and may have a second thickness less than the first thickness on the other side including the first region 210D or the second region 210E.

[0061] The mobile electronic device 200 may include at least one of the following: a display 201, audio modules 203, 207 and 214, sensor modules 204 and 219, camera modules 205, 212 and 213, a key input device 217, a light-emitting device, and connector holes 208 and 209. The mobile electronic device 200 may omit at least one of the aforementioned components (e.g., the key input device 217 or the light-emitting device), or may further include other components.

[0062] For example, the display 201 may be exposed through a large portion of the front panel 202. At least a portion of the display 201 may be exposed through the front panel 202 forming a first region 210D of the first surface 210A and side surfaces 210C. The display 201 may be combined with or adjacent to touch sensing circuitry, a pressure sensor capable of measuring touch intensity (pressure), and / or a digitizer for detecting a stylus. At least a portion of sensor modules 204 and 219 and / or at least a portion of key input device 217 may be disposed in the first region 210D and / or the second region 210E.

[0063] According to some embodiments, input device 203 may include a microphone. In some embodiments, input device 203 may include a plurality of microphones positioned to detect the direction of sound. Sound output devices 207, 214 may include speakers. Speakers may include an external speaker 207 and a call receiver 214. In some embodiments, the microphone, speaker, and connector 208 may be located within the space of electronic device 200 and may be exposed to the external environment through at least one aperture formed in housing 210. In some embodiments, the aperture formed in housing 210 may be used for both the microphone and the speaker. In some embodiments, sound output devices 207, 214 may include speakers (e.g., piezoelectric speakers) that operate without the aperture formed in housing 210. In some embodiments, electronic device 200 may include a tray member positioned through at least a portion of side frame structure 218.

[0064] Sensor modules 204 and 219 can generate electrical signals or data corresponding to the internal operating state or external environmental conditions of the mobile electronic device 200. Sensor modules 204 and 219 may include: a first sensor module 204 (e.g., a proximity sensor) and / or a second sensor module (e.g., a fingerprint sensor) disposed on a first surface 210A of the housing 210; and / or a third sensor module 219 (e.g., a heart rate monitor (HRM) sensor) and / or a fourth sensor module (e.g., a fingerprint sensor) disposed on a second surface 210B of the housing 210. The fingerprint sensor may be disposed on both the second surface 210B and the first surface 210A (e.g., the display 201) of the housing 210. The mobile electronic device 200 may further include at least one of a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0065] Camera modules 205, 212, and 213 may include a first camera device 205 disposed on a first surface 210A of the mobile electronic device 200, a second camera device 212 disposed on a second surface 210B, and / or a flash 213. Camera module 205 or camera module 212 may include one or more lenses, an image sensor, and / or an image signal processor. Flash 213 may include, for example, a light-emitting diode or a xenon lamp. Two or more lenses (infrared camera, wide-angle and telephoto lenses) and an image sensor may be disposed on one side of the mobile electronic device 200.

[0066] The key input device 217 may be disposed on the side surface 210C of the housing 210. The mobile electronic device 200 may exclude some or all of the key input devices 217 described above, and the excluded key input devices 217 may be implemented on the display 201 in another form such as soft keys. The key input device 217 may include a sensor module disposed on the second surface 210B of the housing 210.

[0067] An indicator may be disposed on a first surface 210A of the housing 210. For example, a light-emitting device may provide status information of the mobile electronic device 200 in an optical form. The light-emitting device may provide a light source associated with the operation of the camera module 205. The light-emitting device may include, for example, a light-emitting diode (LED), an IR LED, or a xenon lamp.

[0068] The connector hole 208 may include: a first connector hole 208, adapted for a connector (e.g., a USB connector) for transmitting power and / or data to and from an external electronic device; and / or a second connector hole 209 (e.g., a headphone jack), adapted for a connector for transmitting audio signals to and from an external electronic device.

[0069] Some camera modules in camera modules 205 and 212, and some sensor modules or indicators in sensor modules 204 and 219, may be arranged to be exposed through display 201. For example, camera module 205, sensor module 204, or indicator may be arranged within the internal space of an electronic device (e.g., mobile electronic device 200) to contact the external environment through perforations in display 201 to an opening in front panel 202. According to an embodiment, the area corresponding to a certain camera module 105 of display 201 is part of the area displaying content and may be formed as a transmissive area with a specified transmittance. For example, the transmissive area may be formed with a transmittance ranging from about 5% to about 20%. For example, the transmissive area of ​​display 201 may include areas with a lower pixel density and / or wiring density than the surrounding pixel density and / or wiring density. Camera module 205 may include, for example, an under-display camera (UDC). In another embodiment, some sensor modules 204 may be arranged within the internal space of the electronic device to perform their functions without being visually exposed through front panel 202. For example, in this case, the area of ​​the display 201 facing the sensor module may not require a perforated opening.

[0070] Figure 3 Various embodiments according to this disclosure Figure 1 An exploded perspective view of an electronic device.

[0071] Reference Figure 3 The electronic device 200 may include side members (i.e., side side members) 218 ​​(e.g., Figure 2a and Figure 2b The electronic device 200 includes a side frame structure 218), an extension member 2181 (e.g., a bracket or support member), a front panel 202 (e.g., a front cover), a display 201, a substrate 240, a battery 250, a support bracket 260 (e.g., a rear cover or support member), an antenna 270, and a rear panel 211 (e.g., a rear cover). In some embodiments, the electronic device 200 may omit at least one component (e.g., the extension member 2181 or the support bracket 260), or may additionally include other components. At least one component of the electronic device 200 may be connected to... Figure 2a or Figure 2b At least one component of the electronic device 200 is the same as or similar to that of the other component, and redundant descriptions will be omitted below.

[0072] According to various embodiments, the extension member 2181 may be disposed within the electronic device 200 to be structurally coupled to the side member 218, or may be integrally formed with the side member 218. The extension member 2181 may be formed of, for example, a metallic material and / or a non-metallic material (e.g., a polymer). Within the extension member 2181, the display 201 may be coupled to one surface, and the substrate 240 may be coupled to another surface. A processor, memory, and / or interface may be mounted on the substrate 240. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor central processor, or a communication processor. In embodiments, the display 201 may be configured to be supported by the extension member 2181.

[0073] The memory may include, for example, volatile memory or non-volatile memory.

[0074] The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, and / or an audio interface. For example, the interface can electrically or physically connect the electronic device 200 to an external electronic device, and may include a USB connector, an SD card / Multimedia Card (MMC) connector, or an audio connector.

[0075] Battery 250 is a means for supplying power to at least one component of electronic device 200, and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of battery 250 may be disposed, for example, on a plane substantially the same as substrate 340. Battery 250 may be integrally disposed within electronic device 200. In another embodiment, battery 250 may be detachably disposed from electronic device 200.

[0076] Antenna 270 may be disposed between rear panel 211 and battery 250. Antenna 270 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetically secure transmission (MST) antenna. Antenna 270 may, for example, perform short-range communication with external devices, or may wirelessly transmit or receive power required for charging. In another embodiment, the antenna structure may be formed by a portion or combination of side member 218 and / or extension member 2181.

[0077] Figure 4a This is a configuration diagram of the side members according to various embodiments of the present disclosure. Figure 4b Various embodiments according to this disclosure Figure 4a Partial configuration diagram of the side components. Figure 4c Various embodiments according to this disclosure Figure 4a A magnified view of region 4c.

[0078] Reference Figures 4a to 4c Side member 218 (e.g., Figure 2a The side member 218 can be formed by a combination of conductive member 218-1 (e.g., metal) and / or non-conductive member 218-2 (e.g., polymer). In embodiments, the side member 218 may include at least partially derived from an electronic device (e.g., Figure 2a The side surface of the electronic device 200 (e.g., Figure 2a The side surface 210C of the electronic device 200 extends into the internal space as an extension member 2181. In an embodiment, the side member 218 may be configured such that at least a portion of the side surface of the electronic device 200 and the extension member 2181 is formed of a conductive member 218-1, and at least a portion of the extension member 2181, as well as the segments 321, 322, 323, 324, 325 and 326 (e.g., non-conductive portions or gaps), which will be described later, are formed of a non-conductive material. In an embodiment, the side member 218 may include: a first side surface 218a having a first length; a second side surface 218b extending from one end of the first side surface 218a in a direction perpendicular to the first side surface 218a (e.g., the -y-axis direction) to have a second length; a third side surface 218c extending from the second side surface 218b to be substantially parallel to the first side surface 218a and having a first length; and a fourth side surface 218d extending from the third side surface 218c to be substantially parallel to the second side surface 218b, having a second length, and extending to the other end of the first side surface 218a.

[0079] According to various embodiments, the side member 218 may include conductive portions 311, 312, 313, 314, 315, and 316, which are configured to be segmented by spaced-apart segments 321, 322, 323, 324, 325, and 326 (e.g., non-conductive portions or gaps). In embodiments, the conductive portions 311, 312, 313, 314, 315, and 316 form at least a portion of the side surface of the electronic device 200 and may be configured to be visible from the outside. For example, at least one of the first side surface 218a, the second side surface 218b, the third side surface 218c, and the fourth side surface 218d of the side member 218 may be configured to be electrically connected via the conductive portions 311, 312, 313, 314, 315, and 316 to a substrate disposed on the electronic device 200 (e.g., ...). Figure 3 Wireless communication circuits (e.g., on substrate 240) Figure 1 The wireless communication module 192 operates in a specified frequency band (e.g., a conventional frequency band in the range of about 600MHz to 6000MHz).

[0080] According to various embodiments, conductive portions 311, 312, 313, 314, 315, and 316 may include a first conductive portion 310 disposed between a spaced-apart first segment 321 and a second segment 322, a second conductive portion 312 disposed between a spaced-apart second segment 322 and a third segment 323, a third conductive portion 313 disposed between a spaced-apart third segment 323 and a fourth segment 324, a fourth conductive portion 314 disposed between a spaced-apart fourth segment 324 and a fifth segment 325, a fifth conductive portion 315 disposed between a spaced-apart fifth segment 325 and a sixth segment 326, and / or a sixth conductive portion 316 disposed between a spaced-apart sixth segment 326 and a first segment 321. In one embodiment, the first conductive portion 311 can be disposed from a portion of the first side surface 218a to a portion of the second side surface 218b via a first segment 321 disposed on the first side surface 218a and a second segment 322 disposed on the second side surface 218b. In another embodiment, the second conductive portion 312 can be disposed on a portion of the second side surface 218b via a second segment 322 and a third segment 323 disposed on the second side surface 218b. In another embodiment, the third conductive portion 313 can be disposed from a portion of the second side surface 218b to a portion of the third side surface 218c via a third segment 323 and a fourth segment 324 disposed on the third side surface 218c. In yet another embodiment, the fourth conductive portion 314 can be disposed on a portion of the third side surface 218c via a fourth segment 324 and a fifth segment 325 disposed on the third side surface 218c. In one embodiment, the fifth conductive portion 315 may be configured to extend from a portion of the third side surface 218c to a portion of the fourth side surface 218d via a fifth segment 325 and a sixth segment 326 disposed on the fourth side surface 218d. In another embodiment, the sixth conductive portion 316 may be configured to extend from a portion of the fourth side surface 218d to a portion of the first side surface 218a via a sixth segment 326 and a first segment 321.

[0081] According to various embodiments, the electronic device 200 may include a first antenna SA1 operating through a first conductive portion 311, a second antenna SA2 operating through a slot 3122 disposed adjacent to the first antenna SA1 near a second conductive portion 312, a third antenna SA3 and a fourth antenna SA4 operating through a sixth conductive portion 316, a fifth antenna SA5 operating through a portion of a fifth conductive portion 315, and / or a sixth antenna SA6 operating through a slot disposed near the fifth conductive portion 315. In embodiments, the first to sixth antennas SA1, SA2, SA3, SA4, SA5, and SA6 may be configured to be disposed in the electronic device (e.g., Figure 2aAn upper antenna is located on the upper side of an electronic device 200. In an embodiment, the electronic device 200 may include a seventh antenna MA1 operating through a fourth conductive portion 314 and / or a third conductive portion 313, an eighth antenna MA2 operating through a portion of the third conductive portion 313, and / or a ninth antenna MA3 operating through a portion of the second conductive portion 312. In an embodiment, the seventh to ninth antennas MA1, MA2, and MA3 may be configured to be located on the upper side of the electronic device (e.g., Figure 2a The lower antenna is located on the lower side of the electronic device 200. In an embodiment, antennas SA1, SA2, SA3, SA4, SA5, SA6, MA1, MA2, and MA3 can operate in at least one of the following frequency bands: a low frequency band of about 600 MHz to 960 MHz, a mid frequency band of about 1700 MHz to 2200 MHz, a high frequency band of about 2300 MHz to 2800 MHz, a sub-6 frequency band of about 5 GHz to 6 GHz, a UHB frequency band of about 3.2 GHz to 4.5 GHz, Bluetooth (BT), Global Positioning System (GPS), or Wi-Fi.

[0082] According to various embodiments, the first conductive portion 311 can be connected at a first point L1 to a substrate (e.g., ...). Figure 3 The wireless communication circuit F1 on the substrate 240 (e.g., Figure 1 The wireless communication module 192 is electrically connected to operate as a first antenna SA1 (e.g., a metal-framed antenna). In an embodiment, the first conductive portion 311 can be provided by a first segment 321 provided at a second point L2 on the first side surface 218a, a second segment 322 provided at a third point L3 on the second side surface 218b, and a non-conductive region 2182 provided between the first side surface 218a and the second side surface 218b and the extension member 2181 formed by the conductive member 218-1. In some embodiments, the first segment 321 can be omitted. In an embodiment, the first point L1 can be located between the second point L2 and the third point L3. In an embodiment, the non-conductive region 2182 can be filled with a non-conductive member 218-2, such as a polymer. In an embodiment, the non-conductive member 218-2 can seamlessly fill from the non-conductive region 2182 into the first segment 321 and / or the second segment 322. In some embodiments, the non-conductive region 2182 and the segments 321 and 322 may be filled with non-conductive components of different materials. In some embodiments, at least one of the non-conductive region 2182 or the segments 321 and 322 may be in a state where there is no non-conductive component 218-2, thus maintaining a blank space.

[0083] According to various embodiments, the electronic device 200 may include a slit 3121 in the side member 218 that extends a specified length d from a non-conductive region 2182 near the second segmentation portion 322. In an embodiment, the slit 3121 may extend in the longitudinal direction of the second side surface 218b (e.g., the ±y-axis direction) in a direction opposite to the first conductive portion 311 (e.g., the -y-axis direction) with a length d. In an embodiment, the slit 3121 may seamlessly extend from the non-conductive region 2182 and be filled with a non-conductive member 218-2. For example, the non-conductive region 2182, the second segmentation portion 322, and the slit 3121 may be formed as part of an extended member 3181 by seamlessly extending and filling with a non-conductive member 218-2 (e.g., a polymer). In an embodiment, based on the frequency band of the first antenna SA1 operated by using the first conductive portion 311, the length d of the slit 3121 may be formed to have a length within a range of, for example, about 0 < d ≤ λ / 4.

[0084] According to various embodiments, in the first conductive portion 311, as current is fed at an asymmetric position through the asymmetrically arranged segmentation portions 321 and 322 in the side member 218, the current distribution increases in higher modes such as mode 3 (j3), mode 4 (j4), and mode 5 (j5), and thus the radiation performance of the first antenna SA1 may deteriorate.

[0085] According to an exemplary embodiment of the present disclosure, the first antenna SA1 can be helped to improve its radiation performance by guiding the operation of the first antenna SA1 through a slit 3121 that extends from a non-conductive region 2182 in a direction opposite to the first conductive portion 311 near the second segmentation portion 322 to have a specific length, thereby increasing the current distribution in mode 1 (j1) and mode 2 (j2), rather than the current distribution in higher modes such as mode 3 (j3), mode 4 (j4), and mode 5 (j5).

[0086] According to various embodiments, the electronic device 200 may include a slot 3122 in the side member 218, and the slot 3122 is formed to have a length in a direction substantially parallel to the second side surface 218b. In an embodiment, the slot 3122 may be formed by a shape change of a conductive portion of the extended member 2181 and may be filled with a non-conductive member 218-2. In an embodiment, the slot 3122 may operate as a second antenna SA2 (e.g., a slot antenna) by being electrically connected to a wireless communication circuit F2 (e.g., Figure 3 the wireless communication module 192) provided on a substrate (e.g., Figure 1 the substrate 240) across the slot 3122 at a fourth point L4. In an embodiment, the second antenna SA2 may operate in a frequency band of about 600 MHz to 2.4 GHz.

[0087] According to various embodiments, the electronic device 200 may include a keypad device 217 disposed through at least a portion of the slot 3122 (e.g., Figure 2a The key input device 217). In an embodiment, the key button device 217 may include a button substrate 2171 housed in at least a portion of the slot 3122 and extending from the button substrate 2171 into the internal space of the electronic device 200 and electrically connected to the substrate (e.g., Figure 3 The connector cable 2172 of the substrate 240. In an embodiment, the key button device 217 may include at least one key button 2173 configured to penetrate from the outside of the side member 218 into the groove 3122.

[0088] According to various embodiments, the slot 3122 can be positioned close to the first conductive portion 311 used as the first antenna SA1 by the arrangement of the key button device 217, and by such close arrangement, the first antenna SA1 may be subject to interference and its radiation performance may be degraded. For example, when the second antenna SA2 operates in a frequency band similar to the operating frequency band of the first antenna SA1 (e.g., a low frequency band) (e.g., when resonance occurs), the radiation performance may be further degraded.

[0089] According to an exemplary embodiment of the present disclosure, by including a slit 3121 extending a specific length d from the non-conductive region 2182 in the vicinity of the second segment 322 in a direction opposite to the first conductive portion 311, the first antenna SA1 can improve its radiation performance by reducing interference from the second antenna SA2 and improving isolation.

[0090] Figure 5a This is a view showing the current distribution of each mode according to the slit length based on various embodiments of the present disclosure. Figure 5b This is a graph comparing the radiation performance of the first antenna based on the length of the slit according to various embodiments of the present disclosure.

[0091] Reference Figure 5a and Figure 5b, when the first antenna SA1 operating in a frequency band in the range of about 900 MHz operates without the slit 3121 (graph 501), it exhibits a current distribution of about 36.8% in modes 1 and 2, and a relatively high current distribution of about 63.2% in the higher modes of modes 3, 4, and 5. When it operates through the slit 3121 with a length d of about 20 mm (graph 502), it exhibits a relatively increased current distribution of about 54.1% in modes 1 and 2, and a relatively decreased current distribution of about 45.9% in the higher modes of modes 3, 4, and 5. Therefore, it can be confirmed that the radiation performance of the first antenna SA1 is improved. In addition, when the first antenna SA1 operates through the slit 3121 with a length d of 30 mm (which has a length of about λ / 4 based on the operating frequency band of about 900 MHz) (graph 503), it exhibits a relatively further increased current distribution of about 63.8% in modes 1 and 2, and a relatively further decreased current distribution of about 36.3% in the higher modes of modes 3, 4, and 5. Therefore, it can be confirmed that the radiation performance of the first antenna SA1 is further improved.

[0092] According to various embodiments, in addition, when the first antenna SA1 operates through the slit 3121 with a length of about 40 mm, which is longer than 30 mm (which has a length of about λ / 4 based on the operating frequency band of about 900 MHz) (graph 504), it exhibits a current distribution of about 23% in modes 1 and 2, and a relatively increased current distribution of about 77% in the higher modes of modes 3, 4, and 5. Therefore, it can be confirmed that the radiation performance of the first antenna SA1 deteriorates. In addition, when the first antenna SA1 operates through the slit 3121 with a length of about 50 mm, which is longer than 30 mm (graph 505), it exhibits a current distribution of about 9.2% in modes 1 and 2, and a relatively increased current distribution of about 90.8% in the higher modes of modes 3, 4, and 5. Therefore, it can be confirmed that the radiation performance of the first antenna SA1 further deteriorates.

[0093] This may mean that even when the first antenna SA1 operates through the slit 3121, when the first antenna SA1 operates through the slit 3121 with a length d (which is in the range of about 0 < d ≤ λ / 4 based on the operating frequency band), it exhibits relatively excellent radiation performance compared to when there is no slit 3121.

[0094] Figure 6 is a graph comparing the isolation between the first antenna and the second antenna based on the presence or absence of a slit according to various embodiments of the present disclosure.

[0095] In Figure 6In the S21 curve diagram, when slit 3121 is excluded (curve 601), the signal intensity induced from the second antenna SA2 to the first antenna SA1 is approximately -17.38 dB, while when slit 3121 is included (curve 602), the signal intensity induced from the second antenna SA2 to the first antenna SA1 is approximately -22.05 dB. Therefore, it can be confirmed that the signal intensity has decreased by approximately 4.67 dB. This could mean that when the first antenna SA1 operates through slit 3121, the isolation from the nearby second antenna SA2 is improved, and the radiation performance of the first antenna SA1 is also improved.

[0096] Figure 7a and Figure 7b This is a configuration diagram of side members with different power supply positions according to various embodiments of the present disclosure.

[0097] In description Figure 7a and Figure 7b When referring to side member 218, the same reference numerals are assigned to it. Figure 4a The side member 218 is essentially the same component, and its detailed description can be omitted.

[0098] Reference Figure 7a and Figure 7b Electronic devices (e.g.) Figure 2a The electronic device 200 may include a side member 218, which includes an extension member 2181 extending into an internal space. In an embodiment, the side member 218 may include a first conductive portion 311 extending from a portion of a first side surface 218a to a portion of a second side surface 218b, and is provided by a first segment 321 disposed on the first side surface 218a and a second segment 322 disposed on the second side surface 218b. In an embodiment, the first conductive portion 311 may be provided by a non-conductive region 2182 (or a non-conductive member 218-2 filled in the non-conductive region 2182) disposed between a portion of the first side surface 218a and a portion of the second side surface 218b and the conductive member 218-1 of the extension member 2181. In an embodiment, the first conductive portion 311 may be connected to a wireless communication circuit F1 (e.g., at a designated point (e.g., L1 or L5)). Figure 1 The wireless communication module 192 is electrically connected and operates as the first antenna SA1 in the low-frequency band. For example, as... Figure 7a As shown, the first conductive portion 311 can be connected at the first point L1 to a substrate (e.g., Figure 3 The wireless communication circuit F1 on the substrate 240 is electrically connected and operates as a first antenna SA1 in a frequency band of approximately 900MHz. In an embodiment, as... Figure 7bAs shown, the first conductive portion 311 can be connected to the substrate (e.g., at a fifth point L5, which is closer to the second segment 322 than the first point L1) by means of a fifth point L5. Figure 3 The wireless communication circuit F1 on the substrate 240 is electrically connected and operates as a first antenna SA1 in a frequency band of approximately 700 MHz. In an embodiment, the radiation performance of the first antenna SA1 can be improved by including a slit 3121 extending a specific length from the non-conductive region 2182.

[0099] Figure 7c Based on various embodiments of this disclosure Figure 7a and Figure 7b A view comparing the current distribution of each mode, indicating whether there is a slit in the antenna. Figure 7d Based on various embodiments of this disclosure Figure 7a and Figure 7b The presence or absence of a slit in the antenna is compared with the antenna radiation performance curves.

[0100] Reference Figure 7c and Figure 7d When the first antenna SA1, operating in the frequency band of approximately 700 MHz and 900 MHz, operates without slit 3121 (Graph 701), it exhibits current distributions of approximately 80.1% and 36.8% in Mode 1 and Mode 2, respectively, and 19.9% ​​and 63.2% in the higher modes of Mode 3, Mode 4, and Mode 5, respectively. However, when the first antenna SA1, operating in the frequency band of approximately 700 MHz and 900 MHz, operates through slit 3121 extending approximately 20 mm from the non-conductive region 2182 (Graph 702), it can be confirmed that it exhibits relatively high current distributions of approximately 91% and 54.1% in Mode 1 and Mode 2, respectively, and relatively low current distributions of 9% and 45.9% in the higher modes of Mode 3, Mode 4, and Mode 5, respectively. This could mean that even if the first antenna operates in a different frequency band in the low frequency band, it can still exhibit superior radiation performance when using slit 3121 compared to when not using slit 3121.

[0101] Although not shown, it is evident that it can be applied to various electronic devices, such as foldable and / or rollable electronic devices, where a portion of a conductive side member (e.g., a conductive side frame) is used as an antenna.

[0102] According to various embodiments, the electronic device may include: a conductive side member (e.g., Figure 4a Side member 218); conductive extension member (e.g., Figure 4a The extension member 2181 extends from the conductive side member into the interior space; the non-conductive region (e.g., Figure 4aa non-conductive region 2182), disposed between the conductive side member and the conductive extension member; a conductive portion (e.g., Figure 4a a first conductive portion 311 of Figure 4a is provided through a segmented portion (e.g., Figure 4a a second segmented portion 322 of Figure 4c that extends from the non-conductive region to the side member; a slit (e.g., Figure 4a a slit 3121 of Figure 4a extends a specified length (e.g.,

[0103] a length d) in a direction opposite to the conductive portion from the non-conductive region, and the slit corresponds to the segmented portion; and a wireless communication circuit (e.g., Figure 4c a wireless communication circuit F1 of

[0104] is electrically connected through a first point (e.g., Figure 4a a first point L1 of

[0105] and is configured to transmit or receive a wireless signal in a first frequency band. Figure 4a Figure 4a Figure 4a According to various embodiments, the length of the slit (e.g., Figure 4a a length d) can be configured to have a length within the range of 0 < d ≤ λ / 4 based on the first frequency band. Figure 4a

[0106] According to various embodiments, the segmented portion may include a first segmented portion (e.g.,

[0107] a first segmented portion 321 of Figure 4a and a second segmented portion (e.g., Figure 4a a second segmented portion 322 of

[0108] The first segmented portion is formed at a second point (e.g.,

[0109] According to various embodiments, the first point may be located at a point other than the center of the first side surface.

[0110] According to various embodiments, the conductive side member and the conductive extension member are formed of metal, and the non-conductive regions and segments may be filled with polymer.

[0111] According to various embodiments, a groove (e.g., extending in the longitudinal direction of the side member near the slit) is included. Figure 4a Slot 3122), wireless communication circuit (e.g., Figure 4a The wireless communication circuit F2) passes through the fourth point of the slot (e.g., Figure 4a The fourth point (L4) is electrically connected and can be configured to transmit or receive wireless signals in the second frequency band.

[0112] According to various embodiments, the wireless communication circuit can be connected across the slot to the fourth point.

[0113] According to various embodiments, the first frequency band and the second frequency band may be different from each other.

[0114] According to various embodiments, the second frequency band may include a 2.4 GHz band.

[0115] According to various embodiments, a key button device disposed via a slot may be included (e.g., Figure 4a (Key button device 217).

[0116] According to various embodiments, the keypad device includes a button substrate (e.g., Figure 4a The button substrate 2171), and the connector cable (e.g., extending from the button substrate and connected to the substrate of the electronic device) Figure 4a The connector cable 2172), and at least one key button connected to the button substrate (e.g., Figure 4a The key button 2173), at least a portion of the button substrate can be arranged in such a way that it is received in a groove.

[0117] According to various embodiments, the at least one key button is connected to the button substrate in a manner that penetrates the side member, and at least a portion of it may be exposed to the outside of the side member.

[0118] According to various embodiments, the first frequency band may include a frequency band in the range of 600MHz to 960MHz.

[0119] According to various embodiments, a front panel connected to the side members and facing a first direction (e.g., Figure 2a The front plate 202) and the rear plate (e.g., connected to the side members and facing a second direction opposite to the first direction) Figure 2b The rear panel 211), and through the front panel, rear panel, and side members, a shell including an internal space can be formed (e.g., Figure 2a (shell 210).

[0120] According to various embodiments, the interior space may include a display configured to be visible from the outside via the front panel (e.g., Figure 3 Display 201).

[0121] According to various embodiments, the display may be configured to be supported by at least a portion of a conductive extension member.

[0122] Furthermore, the embodiments of this disclosure disclosed herein and illustrated in the accompanying drawings are provided as specific examples to readily illustrate the technical content of the embodiments according to this disclosure and to aid in understanding the embodiments of this disclosure, but are not intended to limit the scope of the embodiments of this disclosure. Therefore, the scope of the various embodiments of this disclosure should be interpreted as including, in addition to the disclosed embodiments, all changes or modifications derived from the technical teachings of the various embodiments of this disclosure.

Claims

1. An electronic device, comprising: A conductive side member (218); A conductive extension member (2181) extending from the conductive side member into the internal space; A non-conductive region (2182) provided between the conductive side member and the conductive extension member; A conductive portion (311) provided through a segmented portion (322) extending from the non-conductive region to the side member; A slit (3121) extending a specified length (d) from the non-conductive region in a direction opposite to the conductive portion, the slit corresponding to the segmented portion; And A wireless communication circuit (F1) electrically connected through a first point (L1) of the conductive portion and configured to transmit or receive wireless signals in a first frequency band. 2.The electronic device of claim 1, wherein, The length (d) of the slit is configured to have a length within the range of 0 < d ≤ λ / 4 based on the first frequency band. 3.The electronic device of claim 1, wherein The conductive portion is formed as at least a part of the side surface (218a, 218b) of the electronic device and is provided to be visible from the outside.

4. The electronic device according to claim 1, wherein, The segmented portion includes: A first segmented portion (321) formed at a second point (L2) spaced apart from the first point toward one side; and A second segmented portion (322) formed at a third point (L3) spaced apart from the first point toward the other side.

5. The electronic device according to claim 4, wherein, The slit extends from the non-conductive region near the second segmented portion.

6. The electronic device according to claim 4, wherein, The side member includes a first side surface (218a) and a second side surface (218b) extending in a direction perpendicular to the first side surface, and the conductive portion is provided through a part of the first side surface and a part of the second side surface.

7. The electronic device according to claim 6, wherein, The first segmented portion is located on the first side surface, and the second segmented portion is located on the second side surface.

8. The electronic device according to claim 6, wherein, The first point is located at a point other than the center of the first side surface.

9. The electronic device according to claim 1, wherein, The conductive side member and the conductive extension member are formed of metal, and the non-conductive region and the segmented portion are filled with a polymer.

10. The electronic device according to claim 1, comprising: A groove (3122) extending along the longitudinal direction of the side member near the slit, wherein, a wireless communication circuit (F2) is electrically connected through a fourth point (L4) of the groove and is configured to transmit or receive wireless signals in a second frequency band.

11. The electronic device according to claim 10, wherein, The wireless communication circuit is electrically connected across the groove to the fourth point.

12. The electronic device according to claim 10, comprising: A key button device (217) provided through the groove.

13. The electronic device according to claim 12, wherein, The key button device includes: A button substrate (2171); A connector cable (2172) extending from the button substrate and connected to the substrate of the electronic device; and At least one key button (2173) connected to the button substrate, and wherein, at least a part of the button substrate is provided in a manner to be accommodated in the groove.

14. The electronic device according to claim 1, comprising: A front plate (202) coupled to the side member and facing a first direction; And A rear plate (211) coupled to the side member and facing a second direction opposite to the first direction, The shell (210) including the internal space is formed by the front plate, the rear plate and the side members.

15. The electronic device of claim 14, comprising: The display (201) is configured to be visible from the outside through the front panel within the interior space.

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