Card connector

Abstract

This invention provides a card connector that allows a heat transfer portion to properly contact an inserted card and efficiently dissipates heat to the outside. The card connector includes: a base member that houses an external card; a plurality of contacts mounted on the base member and contacting terminal members of the external card when it is housed; a cover member that forms a housing space for the external card with the base member; and a stack portion that, together with the base member and the cover member, defines the housing space. The cover member has a top plate portion with a heat transfer portion that contacts the external card when it is housed within the housing space. The heat transfer portion is a spring-shaped cantilever structure bending towards the housing space, and a portion of the free end of the cantilever structure facing the housing space abuts against the stack portion when the external card is not housed.

Description

Technical Field

[0001] This invention relates to card connectors, and more particularly to card connectors with a heat dissipation mechanism. Background Technology

[0002] In recent years, a card connector has been known in electronic devices such as portable phones. This connector inserts a memory card or function expansion card (hereinafter referred to as "IC card") with a built-in integrated circuit, and electrically connects the IC card to the electronic device. This card connector is required to be miniaturized and thinner, while also requiring high-speed signal transmission and large-capacity storage between the electronic device and the IC card. As a result of high-speed signal transmission and large-capacity storage, power consumption increases. This leads to heat generation in the IC card, causing expansion, strain, or damage to the molded IC card itself, or poor electrical connection between the external contacts of the IC card and the contacts of the card connector.

[0003] Therefore, as in Patent Document 1, a structure is known in which a heat dissipation component (heat transfer section) is provided on the card connector to dissipate the heat generated by the card to the outside.

[0004] Prior art literature

[0005] Patent documents

[0006] Patent Document 1: Japanese Patent No. 7376915

[0007] Summary of the invention

[0008] The problem that the invention aims to solve

[0009] However, the heat dissipation component (heat transfer section) in Patent Document 1 is a structure that is arranged with the card face separated by an air layer, so the heat transfer efficiency is reduced compared with contact transfer.

[0010] Furthermore, since the card is repeatedly inserted and removed from the connector, reliable contact between the heat transfer part of the card connector and the card is required each time the heat transfer part comes into contact with the card. On the other hand, if the card cannot be properly inserted into the receiving space of the card connector, the internal components of the connector may deform. Summary of the Invention

[0011] In view of the above, the object of the present invention is to provide a card connector that allows the heat transfer part to make proper contact with the inserted card and can efficiently dissipate heat to the outside.

[0012] Solution for solving the problem

[0013] To address the aforementioned issues, a card connector according to one embodiment of the present invention comprises:

[0014] The base component houses the external card;

[0015] Multiple contacts are mounted on the base component and contact the terminal components of the external card when the external card is received;

[0016] A cover member that, together with the base member, forms a receiving space for the outer card; and

[0017] The stack section, together with the base component and the cover component, defines the receiving space.

[0018] The cover component has a top plate portion.

[0019] The top plate portion includes a heat transfer section, which contacts the external card when the external card is housed within the receiving space.

[0020] The heat transfer section is a spring-shaped cantilever structure that bends toward the receiving space. When the external card is not received, a portion of the free end of the cantilever structure facing the receiving space abuts against the stack section.

[0021] Invention Effects

[0022] The present invention provides a card connector that enables the heat transfer part to make proper contact with the inserted card and can efficiently dissipate heat to the outside. Attached Figure Description

[0023] Figure 1 (a) is a perspective view of a card connector 100 according to an embodiment of the present invention. Figure 1 (b) is a perspective view of the state in which the IC card 500 is inserted into the card connector 100.

[0024] Figure 2 This is an exploded view of a card connector 100 according to an embodiment of the present invention.

[0025] Figure 3 (a) is a perspective view of the card connector 110 according to the first embodiment of the present invention. Figure 3 (b) is a front view of the card connector 110 according to the first embodiment of the present invention. Figure 3 (c) is an exploded view of the card connector 110 according to the first embodiment of the present invention.

[0026] Figure 4 (a) is a perspective view of the card connector 120 according to the second embodiment of the present invention. Figure 4 (b) is a front view of the card connector 120 according to the second embodiment of the present invention. Figure 4 (c) is a rear view of the cover member 320 of the card connector 120 according to the second embodiment of the present invention.

[0027] Figure 5 (a) is a perspective view of the card connector 130 according to the third embodiment of the present invention. Figure 5 (b) is a front view of the card connector 130 according to the third embodiment of the present invention. Figure 5 (c) is a rear view of the cover member 330 of the card connector 130 according to the third embodiment of the present invention.

[0028] Figure 6 This is a perspective view of the card connector 140 according to the fourth embodiment of the present invention.

[0029] Figure 7 (a) is a top view of the card connector 110 according to the first embodiment of the present invention. Figure 7 (b) is Figure 7 A sectional view at line VIIb-VIIb in (a). Figure 7 (c) is Figure 7 Enlarged view of part VIIc in (b).

[0030] Figure 8 (a) is a top view of the IC card 500 inserted into the card connector 110. Figure 8 (b) is Figure 8 A cross-sectional view at line VIIIb-VIIIb in (a). Figure 8 (c) is Figure 8 Enlarged view of section VIIIc in (b). Figure 8 (d) is a side view of the state in which the IC card 500 is inserted into the card connector 110 and the heat transfer part 312 is in contact with the external component 600. Detailed Implementation

[0031] The embodiments of the present invention will be described in detail below, but the present invention is not limited thereto.

[0032] 1. Card connector

[0033] Figure 1 (a) is a perspective view of a card connector 100 according to an embodiment of the present invention. The card connector 100 includes a base member 200, a cover member 300 and a stack portion 400, and the base member 200 includes a plurality of contacts 202.

[0034] like Figure 1 As shown in (b), the card connector 100 is capable of accommodating an external IC card (hereinafter referred to simply as "IC card" or "card") 500 within the accommodating space V of the base member 200. The card connector 100 is fixed to a printed circuit board (not shown) by means of soldering or the like, and electrically connects the accommodated IC card 500 to the printed circuit board.

[0035] Figure 2 This is an exploded view of a card connector 100 according to an embodiment of the present invention. The structure of the card connector will be described below in sequence.

[0036] (Base components)

[0037] The base component 200 has a plurality of contacts 202, which contact the terminal component 552 of the external IC card 500 when the external IC card 500 is housed in the base component 200.

[0038] The base component 200 of this embodiment includes a housing 201, multiple contacts 202, a spring 204, a slider 206, and a locking pin 208.

[0039] In one embodiment, the housing 201 is molded from an insulating synthetic resin. Additionally, in this embodiment, the housing 201 includes a front wall (the innermost wall surface measured from the insertion port of the IC card 500) 203 facing the insertion port of the IC card 500, and a pair of side walls 205a and 205b parallel to the insertion direction of the IC card 500.

[0040] Multiple contacts 202 are fixed to the front wall 203 of the housing 201 in a manner that is arranged parallel to each other. For example, multiple elongated slots (not shown) extending parallel to the card insertion direction are formed in the housing 201, and the contacts 202 can be fixed by pressing them in.

[0041] Each of the multiple contacts 202 has a cantilever beam shape that allows it to contact the terminal component of the external IC card 500. Therefore, the contact 202a at the free end of the contact 202 can be elastically displaced up and down, enabling it to make electrical contact with the terminal component 552 of the inserted IC card 500 with a desired contact pressure. On the other hand, the end 202b of the fixed end of the contact 202 is electrically connected to an external contact (not shown) of the mounted substrate.

[0042] Spring 204, slider 206, and locking pin 208 constitute a push-type ejection mechanism for facilitating the insertion and ejection of IC card 500. Other ejection mechanisms may also be used as the mechanism for inserting and ejecting IC card 500.

[0043] (Cover component)

[0044] The cover member 300 and the base member 200 together form the receiving space V of the external IC card 500. The cover member 300 has a top plate portion 301, and the top plate portion 301 has a heat transfer portion 302. When the external IC card 500 is received in the receiving space V, the heat transfer portion 302 contacts the external IC card 500.

[0045] The heat transfer section 302 has a spring-like cantilever structure that bends toward the receiving space V. When the card connector 100 is not receiving the IC card 500, the heat transfer section 302 also allows a portion of the free end 302a of the cantilever structure on the surface facing the receiving space V to abut against the stack section 400 (described later). Preferably, as described later, the heat transfer section 302 applies a preload when abutting against the stack section 400.

[0046] The cover member 300 can be formed of metal. For example, the cover member 300 can be formed from a sheet metal by stamping. Preferably, the metal used for the cover member 300 has high heat dissipation properties. As a metal with high heat dissipation properties, copper alloys are preferred, and Corson copper alloys are particularly preferred.

[0047] The heat transfer section 302 can be formed by cutting a notch in the top plate portion 301 of the cover member 300. In this way, the cover member 300 and the heat transfer section 302 are integrally formed, so it is not necessary to separately install the heat transfer section 302 onto the cover member 300, which makes it easier to manufacture. The heat transfer section 302 can be a single piece or formed from multiple pieces.

[0048] The direction in which the heat transfer portion 302 is cut from the fixed end side to the free end side can be arbitrary. For example, the heat transfer portion 302 can be formed by providing a slot-shaped cut parallel to the movement direction of the external IC card 500 from the opening of the receiving space V. In this case, as the IC card 500 is inserted, a portion of the bent portion 304 of the heat transfer portion 302 contacts the IC card 500, and at the same time, the free end 302a moves in a direction protruding from the receiving space V of the IC card 500. When the IC card 500 is received, the free end 302a can protrude beyond the top plate portion 301. Preferably, the free end 302a of the heat transfer portion 302 is located on the opening side of the receiving space V of the IC card 500. In addition, regarding heat dissipation, it is preferable that the width of the heat transfer portion 302 in the direction orthogonal to the insertion direction of the IC card 500 is approximately the same as or slightly narrower than the width of the heat dissipation pad 550 of the IC card 500.

[0049] (Stack)

[0050] The stack portion 400, together with the base member 200 and the cover member 300, defines the receiving space V of the IC card 500. When the external IC card 500 is not received within the receiving space V, the free end 302a of the heat transfer portion 302 abuts against the stack portion 400, as described above. Preferably, the stack portion 400, together with the base member 200 and the cover member 300, defines the opening of the receiving space V of the IC card 500.

[0051] The stack 400 divides the receiving space V, and the free end 302a of the heat transfer section 302 abuts against the stack 400, thereby guiding the IC card 500 appropriately into the receiving space V when it is inserted. Furthermore, contact between the front end of the IC card 500 and the free end 302a is avoided, thus suppressing undesirable deformation (bending) of the heat transfer section 302 when the IC card 500 is inserted.

[0052] Furthermore, it is preferable that the stack portion is arranged on the base member or cover member in a manner that spans the movement direction of the IC card 500. For example, in this embodiment, the stack portion 400 is mounted between the sidewalls 205a and 205b of the base member 200. Hereinafter, the first to fourth embodiments will be described, but are not limited thereto.

[0053] (First Implementation)

[0054] exist Figure 3 (a) ~ Figure 3 (c) shows the card connector 110 of the first embodiment. In this embodiment, the stack 410 is a component that is separate from the base member 210 and is mounted between the side walls 215a and 215b of the base member 210, dividing the opening of the receiving space V of the external IC card 500.

[0055] The cover member 310 has a heat transfer section 312, which is formed by cutting out the top plate section 311 and is bent toward the receiving space V. The card connector 110 is assembled such that the cover member 310 covers the base member 210. At this time, the free end 312a of the heat transfer section 312 abuts against the stack section 410, and a pre-pressure is applied to the heat transfer section 312.

[0056] For example, the card connector 110 of this embodiment can be formed by fitting a metal stack 410 onto a base member 210 made of insulating synthetic resin, and then placing a metal cover member 310 thereon. In this way, after integrating the stack 410 with the base member 210, which is a resin component, assembly is performed, thereby making processing and assembly easier.

[0057] (Second Implementation)

[0058] exist Figure 4 (a) ~ Figure 4 (c) shows the card connector 120 of the second embodiment. In this embodiment, the stack portion 420 is integrally formed on a portion of the cover member 320. For example, as Figure 4As shown in (c), the front end of the top plate portion 321 can be folded back towards the receiving space V to form the stack portion 420. At this time, the free end 322a of the heat transfer portion 322 abuts against the stack portion 420, and a pre-pressure is applied to the heat transfer portion 322. The stack portion 420, together with the base member 220 and the cover member 320, defines the opening of the receiving space V of the external IC card 500.

[0059] In this embodiment, the cover member 320 is made of metal and is integrated with the stack portion 420, thus the two ends of the stack portion 420 are more firmly fixed, and the deflection of the stack portion 420 and the housing 221 caused by pre-compression can be suppressed. Furthermore, since the stack portion 420 and the cover member 320 are integrated, the number of parts can be reduced. Moreover, similar to the first embodiment, the card connector 120 can be formed by placing the cover member 320 on the base member 220, making assembly easy.

[0060] (Third implementation method)

[0061] exist Figure 5 (a) ~ Figure 5 (c) shows the card connector 130 of the third embodiment. In this embodiment, the stack 430 is a component that is separate from the cover member 330 and is erected across the cutouts of the top plate 331. At this time, the free end 332a of the heat transfer section 332 abuts against the stack 430, and a pre-pressure is applied to the heat transfer section 332.

[0062] Next, the cover member 330 is placed on the base member 230 to assemble the card connector 130. The stack portion 430, together with the base member 230 and the cover member 330, defines the opening of the receiving space V of the external IC card 500.

[0063] In this embodiment, both the cover member 330 and the stack portion 430 are made of metal, which can directly and firmly join the metal to each other, thus further suppressing the deflection of the stack portion 430 and the housing 231 caused by pre-compression. In addition, similar to the first embodiment, the card connector 130 can be formed by placing the cover member 330 on the base member 230, making assembly easy.

[0064] (Fourth Implementation)

[0065] In the fourth embodiment, the heat transfer section 342 is formed of multiple pieces of material. Figure 6 The card connector 140 of the fourth embodiment is shown in the figure.

[0066] The free ends 342a of the heat transfer section 342 abut against the stack section 440 and are subjected to pre-pressure. The heat transfer section 342 is formed of multiple pieces, thereby dispersing the effects of unwanted deformation and strain of the heat transfer section 342 even if the IC card 500 is inserted in the wrong direction, thus improving contact reliability. The fourth embodiment can be combined with the first to third embodiments.

[0067] 2. Contact between the heat transfer part and the IC card

[0068] Next, the contact between the card connector of one embodiment of the present invention and an external IC card will be described. It should be noted that although the following description uses the card connector 110 of the first embodiment, the same applies to the card connectors of other embodiments.

[0069] Figure 7 (a) is a top view of the card connector 110 according to the first embodiment of the present invention. Figure 7 (b) is Figure 7 A sectional view along line VIIb-VIIb in (a). Additionally, Figure 7 (c) is Figure 7 Enlarged view of part VIIc in (b).

[0070] like Figure 7 As shown in (b), the heat transfer section 312 bends toward the receiving space V, and the free end 312a abuts against the stack section 410. At this time, the position of the free end 312a moves upward, that is, away from the receiving space V, compared to the case where the stack section 410 is not present. Therefore, the heat transfer section 312, which is a cantilever structure, is subjected to a preload corresponding to this movement. The phrase "subject to preload" here means that, in the state before the IC card 500 is inserted into the receiving space V, the heat transfer section 312, which is a cantilever structure, is preloaded.

[0071] In other words, the force required to move in the direction of the receiving space V always acts on the heat transfer section 312. Compared to the case where no pre-pressure is applied, the contact force of the heat transfer section 312 is higher when the IC card 500 is inserted, resulting in higher contact reliability. As a result, a more stable contact between the IC card 500 and the heat transfer section 312 can be provided.

[0072] Figure 8 (a) ~ Figure 8 (d) shows the state in which the IC card 500 is inserted into the card connector 110. Figure 8 (a) is a top view of the IC card 500 inserted into the card connector 110. Figure 8 (b) is Figure 8 A cross-sectional view at line VIIIb-VIIIb in (a). Figure 8 (c) is Figure 8 An enlarged view of section VIIIc in (b). Additionally, Figure 8 (d) is a side view of the state in which the IC card 500 is inserted into the card connector 110 and the heat transfer part 312 is in contact with the external component 600.

[0073] In this embodiment, such as Figure 8 (b) and Figure 8 As shown in (c), when the IC card 500 is inserted into the receiving space V, the heat transfer portion 312 protrudes from the card connector 110 beyond the top plate portion 311 of the cover member 310 while the bent portion 314 contacts the heat dissipation pad 550 of the IC card 500. Figure 8 In (c), D1 represents the range of the heat dissipation pad, and d1 represents the contact position of the heat transfer section 312. For heat dissipation and contact stability, it is preferable to form a curved portion 314 that widens the contact position d1 of the heat transfer section. The heat generated by the IC card 500 is released from the heat dissipation pad 550 through the heat transfer section 312 of the card connector 110. Since the heat transfer section 312 is integrated with the cover member 310, heat can also be released from the cover member 310 as a whole.

[0074] In this embodiment, the heat dissipation pad 550 is positioned away from the terminal member 552. When the side containing the terminal member 552 is considered the front end, the range D1 of the heat dissipation pad extends from the center to the rear end of the IC card. To ensure that the heat transfer portion 312 contacts the range D1 of the heat dissipation pad, the free end 312a is preferably located on the opening side of the receiving space V of the IC card 500. When the heat transfer portion 312 is cut out from the opening side of the top plate 311 toward the center, the free end 312a is located near the center of the top plate 311, therefore the contact position d1 of the heat transfer portion may not be located within the range D1 of the heat dissipation pad.

[0075] When the heat dissipation pad 550 is located near the terminal member 552, the heat transfer section 312 can also be cut out from the opening side of the top plate 311 toward the center. In this case, a stack section 410 is also provided, and a portion of the surface of the free end 312a facing the receiving space V abuts against the stack section 410, thereby applying pre-pressure and providing stable contact between the IC card 500 and the heat transfer section 312.

[0076] Moreover, such as Figure 8 As shown in (d), when the protruding heat transfer part 312 is in contact with the external member 600, heat can also be dissipated from the external member 600 in addition to the cover member 310.

[0077] As described above, various embodiments and modifications have been illustrated, but the present invention is not limited to these descriptions. Other embodiments conceivable within the scope of the technical concept of the present invention are also included within the scope of the present invention.

[0078] Alternatively, one or more of the above-described embodiments and variations can be appropriately combined.

[0079] Symbol explanation:

[0080] Connectors for 100, 110, 120, 130, and 140 cards

[0081] 200, 210, 220, 230, 240 base components

[0082] 201, 211, 221, 231, 241 Casing

[0083] Contacts 202, 212, 222, 232, and 242

[0084] 202a, 212a contacts

[0085] 202b, 212b Fixed end side end

[0086] 203 Anterior Wall

[0087] 204 and 214 springs

[0088] 205a, 205b sidewalls

[0089] Sliders 206, 216, 226, 236

[0090] 208, 218 Locking pins

[0091] 300, 310, 320, 330, 340 cover components

[0092] Top plate section 301, 311, 321, 331, 341

[0093] Heat transfer sections 302, 312, 322, 332, and 342

[0094] 302a, 312a, 322a, 332a, 342a Free End

[0095] 304, 314 bending section

[0096] Stack section 400, 410, 420, 430, 440

[0097] 500 External IC Card

[0098] 550 thermal pad

[0099] 552 terminal components

[0100] 600 External Components

[0101] d1 Contact position of heat transfer part

[0102] D1 Thermal Pad Range

[0103] V containment space

Claims

1. A card connector, wherein, The card connector includes: The base component houses the external card; Multiple contacts are mounted on the base component and contact the terminal components of the external card when the external card is received; A cover member that, together with the base member, forms a receiving space for the outer card; and The stack section, together with the base component and the cover component, defines the receiving space. The cover component has a top plate portion. The top plate portion includes a heat transfer section, which contacts the external card when the external card is housed within the receiving space. The heat transfer section is a spring-shaped cantilever structure that bends toward the receiving space. When the external card is not received, a portion of the free end of the cantilever structure facing the receiving space abuts against the stack section.

2. The card connector according to claim 1, wherein, The heat transfer section applies pre-pressure when the free end comes into contact with the stack section.

3. The card connector according to claim 1, wherein, The stack section, together with the base component and the cover component, defines the opening of the receiving space.

4. The card connector according to claim 1, wherein, The heat transfer section is configured such that its free end is located on the opening side of the containment space.

5. The card connector according to claim 1, wherein, When the outer card is housed within the housing space, a portion of the heat transfer section protrudes from the cover member and contacts the outer member.

6. The card connector according to claim 1, wherein, The cover component is made of metal.

7. The card connector according to claim 1, wherein, The heat transfer section contacts the outer card at a portion of the curved section.

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