Display device and method for manufacturing a display device

Abstract

The display device includes: a pixel circuit layer, including pixel circuits disposed on a substrate layer; and a light-emitting element layer, disposed on the pixel circuit layer, and including a light-emitting unit. The light-emitting unit includes a first anode electrode, a first connecting electrode, a second anode electrode, a first light-emitting element disposed on the first anode electrode, and a second light-emitting element disposed on the second anode electrode. The first light-emitting element and the second light-emitting element include a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer. The first connecting electrode electrically connects the first end of the first light-emitting element to the second anode electrode, such that the first light-emitting element and the second light-emitting element are connected in series.

Description

Technical Field

[0001] The disclosure relates to a display device and a method for manufacturing the display device. Background Technology

[0002] Recently, with the increasing interest in information display, research and development of display devices are ongoing. Summary of the Invention

[0003] Technical issues The disclosed aspect is to provide a display device and a method of manufacturing the display device, the display device being able to reduce or prevent the possibility of pixel (e.g., light-emitting element) failure, thereby reducing the need for repair processes and improving process efficiency.

[0004] Technical solution According to one or more disclosed embodiments, a display device may include: a pixel circuit layer including pixel circuits above a substrate layer; and a light-emitting element layer above the pixel circuit layer, including a light-emitting unit, the light-emitting unit including a first anode electrode, a first connecting electrode, a second anode electrode, a first light-emitting element above the first anode electrode, and a second light-emitting element above the second anode electrode, wherein the first light-emitting element and the second light-emitting element include a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer, and wherein the first connecting electrode electrically connects the first end of the first light-emitting element to the second anode electrode, such that the first light-emitting element and the second light-emitting element are connected in series.

[0005] Multiple first light-emitting elements and multiple second light-emitting elements can be connected in series.

[0006] The first light-emitting element and the second light-emitting element can together form a sub-pixel.

[0007] The light-emitting element layer may further include a first electrode and a second electrode, wherein the pixel circuit layer further includes a first power line electrically connected to the first electrode and a second power line electrically connected to the second electrode.

[0008] The first electrode and the first anode electrode can be integrated.

[0009] The first light-emitting element may further include a first bonding electrode adjacent to the first end and electrically connected to the first anode electrode, wherein the second light-emitting element further includes a second bonding electrode adjacent to the first end and electrically connected to the second anode electrode.

[0010] The first and second light-emitting elements can have a trapezoidal cross-section.

[0011] The display device may further include a first organic layer covering the first anode electrode and the second anode electrode, wherein the first connecting electrode is electrically connected to the second anode electrode through a contact portion passing through the first organic layer.

[0012] The display device may also include a second organic layer above the first organic layer and having a substantially flat structure.

[0013] The first connecting electrode may not be superimposed on the second light-emitting element in the plan view, and may include the electrical path between the first light-emitting element and the second light-emitting element.

[0014] The display device may further include an insulating layer that covers portions of the side surfaces of the first light-emitting element and the second light-emitting element, and covers the second end of the first light-emitting element but not the second end of the second light-emitting element.

[0015] The display device may further include a second connecting electrode, which electrically connects a second end of the second light-emitting element to the second electrode.

[0016] According to one or more disclosed embodiments, a display device may include: a substrate layer; pixel circuitry above the substrate layer; a first electrode, a first anode electrode, a second anode electrode, and a second electrode electrically connected to the first electrode, the first electrode, the first anode electrode, the second anode electrode, and the second electrode being above the substrate layer and on the same layer as each other; a light-emitting element including a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer, the light-emitting element including a first light-emitting element above the first anode electrode and including a first bonding electrode, and a second light-emitting element above the second anode electrode and including a second bonding electrode; a first connecting electrode electrically connecting the first end of the first light-emitting element to the second bonding electrode; and a second connecting electrode electrically connecting the first end of the second light-emitting element to the second electrode, wherein the first connecting electrode and the second anode electrode are physically spaced apart from each other.

[0017] The display device may further include: a first organic layer covering a first anode electrode and a second anode electrode; a second organic layer above the first organic layer and covering a portion of the second bonding electrode; and a third organic layer above the second organic layer and covering a portion of the second light-emitting element where the second bonding electrode is not positioned.

[0018] The first bonding electrode may be electrically connected to the first anode electrode, wherein the second bonding electrode is electrically connected to the second anode electrode, and wherein the first bonding electrode and the second bonding electrode have different shapes.

[0019] The second bonding electrode can be positioned around the side of the second light-emitting element in the plan view.

[0020] According to one or more disclosed embodiments, a method of manufacturing a display device may include the following steps: manufacturing a pixel circuit layer; and manufacturing a light-emitting element layer above the pixel circuit layer by the following steps: patterning a first anode electrode and a second anode electrode on the pixel circuit layer; transferring a first light-emitting element onto the first anode electrode; transferring a second light-emitting element onto the second anode electrode; patterning a first organic layer, the first organic layer defining an aperture that exposes the second anode electrode; and patterning a first connection electrode, the first connection electrode being at least partially electrically connected to the first light-emitting element, physically spaced apart from the second light-emitting element, and disposed in the aperture to form a contact portion electrically connecting the first light-emitting element and the second anode electrode.

[0021] The steps of manufacturing the light-emitting element layer may further include: forming an insulating layer covering the first connecting electrode; and patterning a second organic layer covering the insulating layer over the first organic layer.

[0022] The step of manufacturing the light-emitting element layer may further include exposing at least a portion of the second light-emitting element by removing another portion of the insulating layer that overlaps with the second light-emitting element without removing the portion of the insulating layer that overlaps with the first light-emitting element.

[0023] The step of manufacturing the light-emitting element layer may further include: patterning a second connection electrode, the second connection electrode being electrically connected to at least a portion of the second light-emitting element exposed by the insulating layer.

[0024] Beneficial effects According to one or more disclosed embodiments, a display device and a method of manufacturing the display device can be provided, the display device being able to reduce or prevent the possibility of pixel (e.g., light-emitting element) failure, thereby reducing the need for repair processes and improving process efficiency. Attached Figure Description

[0025] The above and other aspects of the disclosure will become more apparent from the description of the disclosed embodiments with reference to the accompanying drawings, in which: Figure 1 This is a schematic plan view illustrating a display device according to one or more embodiments; Figure 2 This is a schematic cross-sectional view illustrating a display device according to one or more embodiments; Figure 3 This is a schematic block diagram illustrating an electrical connection structure for a light-emitting element according to one or more embodiments; Figure 4 and Figure 5 This is a block diagram schematically illustrating the electrical connection structure associated with the light-emitting unit according to one or more embodiments; Figure 6and Figure 7 This is a schematic cross-sectional view illustrating a display device according to one or more embodiments; and Figures 8 to 15 This is a schematic cross-sectional view illustrating a method for manufacturing a display device according to one or more embodiments, for each process operation. Detailed Implementation

[0026] Aspects of some embodiments of this disclosure and methods of implementing them can be more readily understood by referring to the detailed description and accompanying drawings of the embodiments. The described embodiments are provided as examples so that this disclosure will be thorough and complete, and will fully convey aspects of this disclosure to those skilled in the art. Therefore, redundant processes, elements, and techniques that are irrelevant or unrelated to the description of the embodiments, or that are not essential for those skilled in the art to fully understand aspects of this disclosure, may be omitted. Unless otherwise stated, the same reference numerals, designations, or combinations thereof denote the same elements throughout the drawings and written description, and therefore, their repeated description may be omitted.

[0027] The described embodiments may have various modifications and may be implemented in different forms, and should not be construed as being limited to the embodiments shown herein. In describing embodiments, the use of "can," "may," or "may not (will not)" corresponds to one or more embodiments of this disclosure. This disclosure covers all modifications, equivalents, and substitutions within the concept and scope of this disclosure. Furthermore, each of the features of the various embodiments of this disclosure may be combined with each other in part or in whole, and various technical interlocks and drives are possible. Each embodiment may be implemented independently of each other or may be implemented together in association.

[0028] In the accompanying drawings, the relative dimensions of elements, layers, and regions may be exaggerated for clarity and / or descriptive purposes. Additionally, crosshairs and / or shading are typically used in the drawings to clarify boundaries between adjacent elements. Thus, unless otherwise stated, the presence or absence of crosshairs or shading does not convey or indicate any preference or requirement for the specific material, material properties, dimensions, scale, commonalities between the elements shown, or any other characteristics, properties, or attributes.

[0029] Various embodiments are described herein with reference to cross-sectional views that serve as schematic diagrams of examples and / or intermediate structures. Thus, variations in the shapes shown in the drawings will be anticipated due to factors such as manufacturing techniques and / or tolerances. Furthermore, the specific structural or functional descriptions disclosed herein are illustrative only for the purpose of describing embodiments according to the concept of this disclosure. Therefore, the embodiments disclosed herein should not be construed as limited to the shapes shown for elements, layers, or regions, but will include shape deviations caused, for example, by manufacturing processes.

[0030] For example, an injection region shown as rectangular will typically have rounded or curved features at its edges and / or a gradient of injection concentration, rather than a binary variation from the injection region to the non-injection region. Similarly, the embedded region formed by injection may result in some injection in the region between the embedded region and the surface through which the injection occurs.

[0031] For ease of explanation, spatial relative terms such as “below,” “under,” “lower,” “below,” “below,” “above,” “upper,” “above,” etc., are used herein to describe the relationship of one element or feature to another (other) element or feature as shown in the accompanying drawings. It will be understood that, in addition to the orientations depicted in the drawings, the spatial relative terms are intended to cover different orientations of the device in use or operation. For example, if the device in the drawings is flipped, an element described as “below,” “under,” or “below” another element or feature will subsequently be oriented “above” said other element or feature. Thus, the example terms “below” and “below” can cover both above and below orientations. The device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and the spatial relative descriptive terms used herein should be interpreted accordingly. Similarly, when a first part is described as being arranged “on” a second part, this means that the first part is arranged above or below the second part, not limited to its upper side based on the direction of gravity.

[0032] Furthermore, the phrase "in a plan view" means when viewing a portion of the object from above, and the phrase "in a schematic sectional view" means when viewing a schematic section taken by vertically cutting the portion of the object from the side. The term "overlay" or variations thereof means that the first object may be above, below, or to the side of the second object, or vice versa. Additionally, the term "overlay" can include stacking, facing or oriented, extending over (through), covering or partially covering, or any other suitable term as will be understood and appreciated by one of ordinary skill in the art. The expression "not overlay" can include meanings such as "spaced apart from," "offset from," or "offset from," and any other suitable equivalent as will be understood and appreciated by one of ordinary skill in the art. The terms "facing" and "oriented" can mean that the first object may be directly or indirectly opposite the second object. In the case where a third object is located between the first and second objects, the first and second objects, although still facing each other, can be understood as being indirectly opposite each other.

[0033] It will be understood that when an element, layer, region, or component is referred to as being "formed on," "on," "connected to," or "(operably or communicatively) incorporated into" another element, layer, region, or component," the element, layer, region, or component may be directly formed on, directly on, directly connected to, or directly incorporated into the other element, layer, region, or component, or indirectly formed on, indirectly on, indirectly connected to, or indirectly incorporated into the other element, layer, region, or component, such that one or more intermediary elements, layers, regions, or components may exist. Furthermore, this can collectively mean direct or indirect incorporation or connection, as well as integral or non-integral incorporation or connection. For example, when a layer, region, or component is referred to as "electrically connected" or "electrically coupled" to another layer, region, or component, the layer, region, or component may be directly electrically connected or directly electrically coupled to the other layer, region, and / or component, or one or more intermediary layers, regions, or components may exist. One or more intermediary components may include switches, resistors, capacitors, etc. In describing embodiments, unless explicitly described as a direct connection, the expression "connection" indicates an electrical connection, and "directly connected / directly coupled" or "directly on" means that a component is directly connected or directly coupled to another component, or directly on another component, without any intermediate components.

[0034] Furthermore, in this specification, when a portion of a layer, film, region, plate, etc., is formed on another portion, the formation direction is not limited to the upward direction, but includes forming the portion on a side surface or in the downward direction. Conversely, when a portion of a layer, film, region, plate, etc., is formed "below" another portion, this includes not only the case where the portion is "directly" "below" the other portion, but also the case where another portion exists between the portion and the other portion. Similarly, other expressions describing relationships between components, such as "between," "immediately between," "adjacent to," and "directly adjacent to," can be interpreted similarly. It will be understood that when an element or layer is referred to as "between" two elements or layers, the element or layer may be the only element or layer between the two elements or layers, or there may be one or more intervening elements or layers.

[0035] For the purposes of this disclosure, when expressions such as “at least one of…” or “any one of…” or “one or more of…” follow a list of elements, they modify the entire list of elements without modifying any individual elements within that list. For example, “at least one of X, Y, and Z” and “at least one of the groups consisting of X, Y, and Z” can be interpreted as any combination of only X, only Y, only Z, two or more of X, Y, and Z (such as XYZ, XY, YZ, and XZ), or any variation thereof. Similarly, the expression “at least one of A and B” can include A, B, or A and B. As used herein, “or” generally means “and / or”, and the term “and / or” includes any and all combinations of one or more of the associated listed items. For example, the expression “A and / or B” can include A, B, or A and B. Similarly, when expressions such as “at least one of…”, “multiple,” “one of…” and other prepositional phrases precede or follow a list of elements, they modify the entire list of elements but not individual elements within that list.

[0036] It will be understood that although the terms “first,” “second,” “third,” etc., may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms do not correspond to a specific order, position, or priority, and are used only to distinguish one element, component, assembly, region, area, layer, segment, or part from another. Therefore, without departing from the spirit and scope of this disclosure, the first element, component, region, layer, or part described below may be referred to as a second element, component, region, layer, or part. Describing an element as a “first” element may not require or imply the presence of a second element or other elements. The terms “first,” “second,” etc., may also be used herein to distinguish elements of different categories or sets. For the sake of brevity, the terms “first,” “second,” etc., may respectively represent “first category (or first set),” “second category (or second set),” etc.

[0037] In this example, the x-axis, y-axis, and / or z-axis are not limited to the three axes of a Cartesian coordinate system and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be perpendicular to each other, or they can represent different directions that are not perpendicular to each other. The same applies to the first direction, the second direction, and / or the third direction.

[0038] The terminology used herein is for the purpose of describing embodiments only and is not intended to limit this disclosure. As used herein, unless the context clearly indicates otherwise, the singular forms “a” and “an” are also intended to include the plural forms, and the plural forms are also intended to include the singular forms. It will also be understood that when the terms “comprising” and variations thereof, “having” and variations thereof, and “including” and variations thereof are used in this specification, they indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0039] When one or more embodiments can be implemented differently, a particular process sequence can be performed differently than the described sequence. For example, two consecutively described processes can be performed substantially simultaneously or in the reverse order of their description.

[0040] As used herein, the terms “basic,” “about,” “approximately,” and similar terms are used as approximate terms rather than terms of degree and are intended to account for inherent deviations in measured or calculated values ​​that would be recognized by one of ordinary skill in the art. For example, “basic” can include a range of ±5% of the corresponding value. As used herein, “about” or “approximately” includes the stated value and means within an acceptable range of deviations for the specific value as determined by one of ordinary skill in the art, taking into account the measurement in question and the errors associated with the measurement of the specific quantity (i.e., limitations of the measurement system). For example, “about” can mean within one or more standard deviations, or within ±30%, ±20%, ±10%, ±5% of the stated value. Furthermore, when describing embodiments of this disclosure, the use of “may” refers to “one or more embodiments of this disclosure.”

[0041] In some embodiments, well-known structures and arrangements may be described in the accompanying drawings with respect to one or more functional blocks (e.g., block diagrams), units, and / or modules to avoid unnecessarily obscuring the various embodiments. Those skilled in the art will understand that such blocks, units, and / or modules are physically implemented by logic circuitry, discrete components, microprocessors, hardwired circuitry, memory elements, wiring connections, and other electronic circuitry. This can be formed using semiconductor-based manufacturing techniques or other manufacturing techniques. Blocks, units, and / or modules implemented by microprocessors or other similar hardware can be programmed and controlled using software to perform the various functions discussed herein, optionally driven by firmware and / or software. Additionally, each block, unit, and / or module may be implemented by dedicated hardware or a combination of dedicated hardware performing some functions and processors performing functions different from those of the dedicated hardware (e.g., one or more programmed microprocessors and associated circuitry). Furthermore, in some embodiments, blocks, units, and / or modules may be physically divided into two or more interacting separate blocks, units, and / or modules without departing from the scope of this disclosure. In addition, in some embodiments, blocks, units and / or modules may be physically combined into more complex blocks, units and / or modules without departing from the scope of this disclosure.

[0042] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having the same meaning as they have in the context of the relevant field and / or in this specification, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein.

[0043] This disclosure relates to a display device and a method of manufacturing the display device. Hereinafter, a display device and a method of manufacturing the display device according to one or more embodiments are described with reference to the accompanying drawings.

[0044] Figure 1 This is a schematic plan view illustrating a display device according to one or more embodiments.

[0045] Reference Figure 1 The display device DD may include a substrate layer BSL and pixels PXL located on the substrate layer BSL (as used herein, "located on" may mean "above"). In one or more embodiments, the display device DD may also include driving circuitry units (e.g., scan drivers and data drivers), lines, and pads (or "solder pads") for driving the pixels PXL.

[0046] The display device DD (or substrate layer BSL) may include a display area DA and a non-display area NDA. The non-display area NDA may refer to an area other than the display area DA. The non-display area NDA may (e.g., in a plan view) surround at least a portion of the display area DA.

[0047] The substrate layer (BSL) can form the substrate surface of the display device (DD). The substrate layer (BSL) can be a rigid substrate or film, or a flexible substrate or film. For example, the substrate layer (BSL) can include a glass material. Optionally, the substrate layer (BSL) can include a silicon material. Optionally, the substrate layer (BSL) can include polyimide. However, the disclosure is not limited thereto.

[0048] The display area DA can be defined as the area where pixel PXL is located. The non-display area NDA can be defined as the area where pixel PXL is not located. The driving circuit units, wires, and pads of the pixel PXL connected to the display area DA can be located in the non-display area NDA.

[0049] According to one or more embodiments, the pixel PXL (or sub-pixel SPX) can be arranged according to a stripe or PENTILE™ arrangement structure (PENTILE™ is a registered trademark of Samsung Display Ltd., Korea), but is not limited thereto, and various embodiments may be applied to the disclosure.

[0050] According to one or more embodiments, a pixel PXL (or sub-pixel SPX) may include a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may be a sub-pixel. At least one of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 may form a pixel unit PXU configured to emit light of various colors.

[0051] Each of the first sub-pixel SPX1, the second sub-pixel SPX2, and the third sub-pixel SPX3 can emit light of a single color.

[0052] For example, the first sub-pixel SPX1 can be a red pixel for emitting red (e.g., a first color) light, the second sub-pixel SPX2 can be a green pixel for emitting green (e.g., a second color) light, and the third sub-pixel SPX3 can be a blue pixel for emitting blue (e.g., a third color) light. The red pixel can provide light in a wavelength range of approximately 600 nm to approximately 750 nm. The green pixel can provide light in a wavelength range of approximately 480 nm to approximately 560 nm. The blue pixel can provide light in a wavelength range of approximately 370 nm to approximately 460 nm.

[0053] According to one or more embodiments, the number of second sub-pixels SPX2 may be greater than the number of first sub-pixels SPX1 and the number of third sub-pixels SPX3. However, the color, type, number, etc. of the first sub-pixels SPX1, second sub-pixels SPX2, and third sub-pixels SPX3 forming each pixel unit PXU are not limited to the specific examples.

[0054] Figure 2 This is a schematic cross-sectional view showing a display device according to one or more embodiments.

[0055] Reference Figure 2 The display device DD may include a pixel circuit layer PCL, a light-emitting element layer LEL, and an upper layer UPL.

[0056] The pixel circuit layer (PCL) may include a substrate layer (BSL) and pixel circuitry (PXC) (e.g., see...). Figure 3 ).

[0057] A substrate layer (BSL) can be formed on which pixel circuits (PXCs) are positioned. The pixel circuits (PXCs) can be located on the substrate layer (BSL) and can be configured to drive light-emitting elements (LDs) (e.g., see...). Figure 4 The pixel circuit layer (PCL) may include a conductive layer and an insulating layer, and the conductive layer may form the pixel circuit (PXC).

[0058] The light-emitting element layer (LEL) can be located on the pixel circuit layer (PCL). The LEL can include a light-emitting element (LD). The LD can include an inorganic light-emitting diode containing inorganic materials. For example, the LD can include a micro light-emitting diode (LED).

[0059] The upper UPL may be located on the light-emitting element layer LEL. The upper UPL may transmit light. According to one or more embodiments, the upper UPL may include a cover window. The upper UPL may include a color filter and may include an upper substrate, etc. However, the disclosure is not limited to the specific examples.

[0060] Figure 3 This is a schematic block diagram illustrating an electrical connection structure for a light-emitting element according to one or more embodiments. For example, Figure 3 The electrical connection structure including the pixel circuit PXC corresponding to each sub-pixel SPX can be shown. Figure 3 The light-emitting unit (EMU) including the light-emitting element LD is shown. Figure 3 The description of the light-emitting unit (EMU) in the text can be similarly applied to the light-emitting element (LD).

[0061] Reference Figure 3The display device DD (e.g., sub-pixel SPX) may include a pixel circuit PXC, a scan line SL, a data line DL, a first power line PL1, a second power line PL2, a first electrode ELT1, and a second electrode ELT2, which are configured to drive the light-emitting element LD of the light-emitting unit EMU.

[0062] A pixel circuit (PXC) may include one or more circuit elements. For example, a pixel circuit (PXC) may include a driving transistor, a switching transistor, and a storage capacitor. However, the disclosure is not limited thereto.

[0063] The pixel circuit PXC can be electrically connected to the scan line SL and the data line DL. The scan line SL can supply scan signals to the pixel circuit PXC and, according to one or more embodiments, can be electrically connected to the gate electrode of the switching transistor of the pixel circuit PXC. The light-emitting element LD can be configured to emit light corresponding to the data signal supplied from the data line DL.

[0064] The pixel circuit PXC can be electrically connected to a first power line PL1 and a second power line PL2. For example, a first electrode ELT1 can be electrically connected to the pixel circuit PXC and the first power line PL1. A second electrode ELT2 can be electrically connected to the second power line PL2. The first power line PL1 and the second power line PL2 can be located on the substrate layer BSL, and according to one or more embodiments, can be included in the pixel circuit layer PCL.

[0065] The power of the first power line PL1 and the power of the second power line PL2 can have different potentials. For example, the power of the first power line PL1 can be a high-potential pixel power from a first voltage potential VDD, while the power of the second power line PL2 can be a low-potential pixel power from a second voltage potential VSS. The potential difference between the power of the first power line PL1 and the power of the second power line PL2 can be set to be equal to or greater than the threshold voltage of the light-emitting element LD.

[0066] The first power line PL1 can be electrically connected to the pixel circuit PXC (e.g., a driving transistor). The second power line PL2 can be electrically connected to the cathode electrode of the light-emitting element LD (e.g., the second electrode ELT2). According to one or more embodiments, the second power line PL2 can be electrically connected to the second electrode ELT2.

[0067] Each of the light-emitting elements (LDs) included in the light-emitting unit (EMU) can be connected in the forward direction between the first electric field line PL1 and the second electric field line PL2 to form each effective light source. These effective light sources can be grouped together to construct the light-emitting elements (LDs) of the sub-pixel SPX.

[0068] The light-emitting element (LD) can emit light with a brightness corresponding to the driving current supplied through the pixel circuit (PXC). During each frame cycle, the pixel circuit (PXC) can supply a driving current corresponding to the data signal to the light-emitting element (LD). The light-emitting element (LD) can then emit light with a brightness corresponding to the current flowing within it.

[0069] In the following text, refer to Figures 4 to 7 This describes a display device DD comprising a light-emitting unit (EMU) with a series / parallel structure, according to one or more embodiments. Content that may overlap with the foregoing is briefly described or not repeated.

[0070] Figure 4 and Figure 5 This is a block diagram schematically illustrating the electrical connection structure associated with the light-emitting unit according to one or more embodiments.

[0071] Reference Figure 4 and Figure 5 The light-emitting unit (EMU) may include multiple light-emitting elements (LDs) electrically connected in series with each other. The light-emitting unit (EMU) may also include multiple light-emitting elements (LDs) electrically connected in parallel. The light-emitting unit (EMU) may also include multiple light-emitting elements (LDs) electrically connected in series / parallel.

[0072] The light-emitting unit (EMU) may include a first anode electrode AE1, a second anode electrode AE2, a first connecting electrode COE1, and a second connecting electrode COE2 that are electrically connected to multiple light-emitting elements (LDs).

[0073] Multiple light-emitting elements (LDs) can be electrically connected between a first electrode ELT1 and a second electrode ELT2. The multiple light-emitting elements (LDs) may include a first light-emitting element LD1 and a second light-emitting element LD2.

[0074] For ease of description, the disclosure is based on one or more of the following embodiments: a plurality of light-emitting elements including a first light-emitting element LD1 and a second light-emitting element LD2 that are electrically connected in series with each other and electrically connected in parallel.

[0075] However, the number of parallel structures included in multiple light-emitting elements (LDs) is not limited to this. For example, a third light-emitting element electrically connected to the second light-emitting element (LD) may also be included.

[0076] The first anode electrode AE1 can be electrically connected to the first electrode ELT1. The first anode electrode AE1 can be the anode for the first light-emitting element LD1.

[0077] The first light-emitting element LD1 can be connected in parallel with each other. The first light-emitting element LD1 can be connected in series with the second light-emitting element LD2.

[0078] The first connecting electrode COE1 can be electrically connected to the first light-emitting element LD1. The first connecting electrode COE1 can also be electrically connected to the second anode electrode AE2.

[0079] The second anode electrode AE2 can be electrically connected to the first light-emitting element LD1. The second anode electrode AE2 can be the anode for the second light-emitting element LD2.

[0080] The second light-emitting element LD2 can be connected in parallel with each other. The second light-emitting element LD2 can also be connected in series with the first light-emitting element LD1.

[0081] The second connecting electrode COE2 can be electrically connected to the second light-emitting element LD2. The second connecting electrode COE2 can also be electrically connected to the second electrode ELT2.

[0082] Therefore, the light-emitting unit (EMU) can form a sub-pixel (SPX), and the electrical signal supplied by the pixel circuit (PXC) can be supplied to the first light-emitting element (LD1) and the second light-emitting element (LD2). Furthermore, due to the series / parallel structure according to one or more embodiments, even if the first light-emitting element (LD1) malfunctions, the second light-emitting element (LD2) can still operate normally, and even if the second light-emitting element (LD2) malfunctions, the first light-emitting element (LD1) can still operate normally.

[0083] According to one or more embodiments, the likelihood of light-emitting element (LD) failure can be reduced or prevented, thus reducing the risk of abnormal pixel operation. For example, in a sub-pixel SPX, where all LDs in a plurality of LDs are located on a single anode electrode, a short-circuit defect in one of the LDs may make it difficult for all LDs on the corresponding anode electrode to emit light normally.

[0084] However, according to one or more embodiments, as described above, the first anode electrode AE1 and the second anode electrode AE2 can be disposed separately. The first light-emitting element LD1 and the second light-emitting element LD2 can be disposed on the first anode electrode AE1 and the second anode electrode AE2, respectively. Therefore, the possibility of sub-pixel SPX (e.g., light-emitting element LD) failure can be reduced or prevented.

[0085] For example, when a subpixel SPX fails, a separate repair process is performed, which complicates the process and increases costs. However, it is possible to reduce the risk of subpixel SPX failure, thereby reducing costs.

[0086] Next, refer to Figure 6 and Figure 7 This describes the cross-sectional structure of a display device DD according to one or more embodiments. Figure 6 and Figure 7 This is a schematic cross-sectional view illustrating a display device according to one or more embodiments. Content that may overlap with the foregoing is briefly described or not repeated.

[0087] First, refer to Figure 6 DD describes a display device according to one or more embodiments.

[0088] According to one or more embodiments, the pixel circuit layer PCL may include a substrate layer BSL, pixel circuits PXC located on the substrate layer BSL, a first power line PL1, and a second power line PL2.

[0089] The first power line PL1 can be electrically connected to the pixel circuit PXC and can supply power from the first voltage potential VDD to the pixel circuit PXC. The second power line PL2 can be spaced apart from the first power line PL1 and can supply power from the second voltage potential VSS to the second electrode ELT2.

[0090] The light-emitting element layer (LEL) may include a first electrode ELT1, a second electrode ELT2, and a light-emitting unit (EMU) electrically connected between the first electrode ELT1 and the second electrode ELT2. The LEL (or EMU) may include a first anode electrode AE1, a second anode electrode AE2, a first connecting electrode COE1, and a second connecting electrode COE2. The LEL may also include a first organic layer OL1, an insulating layer INF, and a second organic layer OL2.

[0091] The first electrode ELT1 and the second electrode ELT2 can be located on the pixel circuit layer PCL. According to one or more embodiments, the first electrode ELT1 and the second electrode ELT2 can be patterned in the same process and can comprise the same material. For example, the first electrode ELT1 and the second electrode ELT2 can be formed in the same deposition process.

[0092] The first electrode ELT1 and the second electrode ELT2 may include conductive materials and can be electrically connected to another layer in the pixel circuit layer PCL via contact structures. For example, the first electrode ELT1 may be electrically connected to the pixel circuit PXC, and the second electrode ELT2 may be electrically connected to the second power line PL2.

[0093] The first anode electrode AE1 and the second anode electrode AE2 can be located on the pixel circuit layer PCL. According to one or more embodiments, the first anode electrode AE1 and the second anode electrode AE2 can be patterned in the same process and can comprise the same material. For example, the first anode electrode AE1 and the second anode electrode AE2 can be formed in the same deposition process.

[0094] The first electrode ELT1 and the second electrode ELT2, as well as the first anode electrode AE1 and the second anode electrode AE2, can be patterned in the same process and can include the same material.

[0095] According to one or more embodiments, the first anode electrode AE1 may be integrally formed with the first electrode ELT1. For example, a portion of the electrode layer patterned on the pixel circuit layer PCL may be the first electrode ELT1, and another portion may be the first anode electrode AE1.

[0096] The first light-emitting element LD1 can be located on the first anode electrode AE1. The first light-emitting element LD1 can be in contact with the first anode electrode AE1. For example, multiple first light-emitting elements LD1 can be located on the same first anode electrode AE1 and can emit light based on the same electrical signal.

[0097] The second light-emitting element LD2 can be located on the second anode electrode AE2. The second light-emitting element LD2 can be in contact with the second anode electrode AE2. For example, multiple second light-emitting elements LD2 can be located on the same second anode electrode AE2 and can emit light based on the same electrical signal.

[0098] According to one or more embodiments, the light-emitting element (LD) may include a first semiconductor layer SCL1, a second semiconductor layer SCL2, an active layer AL, an insulating layer EINF, and a bonding electrode BE. The light-emitting element (LD) may include a first end EP1 adjacent to the first semiconductor layer SCL1 and a second end EP2 adjacent to the second semiconductor layer SCL2.

[0099] Light-emitting elements (LDs) can be manufactured based on epitaxial processes, etching processes, etc., performed on individual wafers, and can be transferred to the pixel circuit layer (PCL) by various methods.

[0100] The light-emitting element (LD) can be vertically aligned on the first anode electrode AE1 and the second anode electrode AE2. For example, the direction from the first end EP1 to the second end EP2 can correspond to the thickness direction of the substrate layer BSL.

[0101] The light-emitting element (LD) can have various shapes. For example, the LD can have a trapezoidal cross-section. The cross-sectional area at the first end EP1 of the LD can be smaller than the cross-sectional area at the second end EP2. However, the disclosure is not limited to the specific examples. According to one or more embodiments, the LD can have a columnar shape extending in one direction.

[0102] Light-emitting elements (LDs) can have various sizes. For example, LDs can have sizes ranging from nanometers to micrometers. However, the disclosure is not limited to this.

[0103] The first semiconductor layer SCL1 may include a semiconductor of a first conductivity type. The first semiconductor layer SCL1 may be located on the active layer AL and may include a semiconductor layer of a different type than the second semiconductor layer SCL2. For example, the first semiconductor layer SCL1 may include a P-type semiconductor layer. For example, the first semiconductor layer SCL1 may include one or more semiconductor materials selected from the group consisting of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include a P-type semiconductor layer doped with a first conductivity type dopant such as Ga, B, or Mg. However, the disclosure is not limited to the examples described above. The first semiconductor layer SCL1 may include various materials.

[0104] The first semiconductor layer SCL1 may be adjacent to the bonding electrode BE and may face the first anode electrode AE1.

[0105] According to one or more embodiments, the first semiconductor layer SCL1 may include a first-1 semiconductor layer SCL1-1 contained in the first light-emitting element LD1 and a first-2 semiconductor layer SCL1-2 contained in the second light-emitting element LD2.

[0106] The active layer AL can be located between the second semiconductor layer SCL2 and the first semiconductor layer SCL1. The active layer AL can include a single quantum well structure or a multiple quantum well structure. The location of the active layer AL is not limited to a specific example and can vary depending on the type of light-emitting element (LD).

[0107] A capping layer doped with a conductive dopant can be formed on one side and / or the other side of the active layer. For example, the capping layer may include one or more of AlGaN and InAlGaN. However, the disclosure is not limited to the examples above.

[0108] According to one or more embodiments, the active layer AL may include a first active layer AL1 contained in the first light-emitting element LD1 and a second active layer AL2 contained in the second light-emitting element LD2.

[0109] The second semiconductor layer SCL2 may include a semiconductor of a second conductivity type. The second semiconductor layer SCL2 may be located on the active layer AL and may include a semiconductor layer of a different type than the first semiconductor layer SCL1. For example, the second semiconductor layer SCL2 may include an N-type semiconductor layer. For example, the second semiconductor layer SCL2 may include one or more selected from the group consisting of InAlGaN, GaN, AlGaN, InGaN, AlN, and InN, and may include an N-type semiconductor layer doped with a second conductivity type dopant such as Si, Ge, or Sn. However, the disclosure is not limited to the examples described above. The second semiconductor layer SCL2 may include various materials.

[0110] The second semiconductor layer SCL2 may be adjacent to the first connection electrode COE1 or the second connection electrode COE2, and may face the first connection electrode COE1 or the second connection electrode COE2.

[0111] According to one or more embodiments, the second semiconductor layer SCL2 may include a second-1 semiconductor layer SCL2-1 contained in the first light-emitting element LD1 and a second-2 semiconductor layer SCL2-2 contained in the second light-emitting element LD2.

[0112] The light-emitting element LD can be electrically connected to the first anode electrode AE1 and the second anode electrode AE2 via the first terminal EP1 (e.g., the bonding electrode BE). The light-emitting element LD can be electrically connected to the first connecting electrode COE1 and the second connecting electrode COE2 via the second terminal EP2.

[0113] When a voltage equal to or greater than the threshold voltage is applied to the first terminal EP1 and the second terminal EP2 of the light-emitting element (LD), electron-hole pairs can recombine with each other in the active layer AL, and the LD can emit light. By controlling the light emission of the LD using this principle, the LD can be used as a light source in various devices.

[0114] When manufacturing a light-emitting element (LD), the bonding electrode BE can be patterned onto a first semiconductor layer SCL1. The bonding electrode BE can be a layer used to transfer the light-emitting element LD onto a first anode electrode AE1 and a second anode electrode AE2.

[0115] For example, the light-emitting element LD can be located on the first anode electrode AE1 and the second anode electrode AE2, such that the bonding electrode BE faces the first anode electrode AE1 and the second anode electrode AE2, so that heat can be applied to the bonding electrode BE, and thus the light-emitting element LD can be combined with the first anode electrode AE1 and the second anode electrode AE2.

[0116] The bonding electrode BE can include various conductive materials. The bonding electrode BE can include a first bonding electrode BE1 contained in the first light-emitting element LD1 and a second bonding electrode BE2 contained in the second light-emitting element LD2.

[0117] The insulating layer EINF can be located on the outer surfaces of the first semiconductor layer SCL1, the active layer AL, and the second semiconductor layer SCL2. The insulating layer EINF can surround the outer surface of the active layer AL, and can also surround a portion of each of the first semiconductor layer SCL1 and the second semiconductor layer SCL2. The insulating layer EINF can have a single-layer structure or a multi-layer structure. The insulating layer EINF can expose the first end EP1 and the second end EP2 of the light-emitting element LD, which have different corresponding polarities.

[0118] According to one or more embodiments, the element insulating layer EINF may include silicon oxide (SiO2). x Silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), aluminum oxide (Al) x O y ) and titanium dioxide (TiO2) x One or more of the groups. However, the disclosure is not limited to the examples above.

[0119] The element insulating layer EINF may include a first element insulating layer EINF1 contained in the first light-emitting element LD1 and a second element insulating layer EINF2 contained in the second light-emitting element LD2.

[0120] The first organic layer OL1 may be located on the pixel circuit layer PCL. The first organic layer OL1 may cover the first anode electrode AE1 and the second anode electrode AE2. The first organic layer OL1 may fill the space between the light-emitting elements LD. The first organic layer OL1 may surround the area where the contact portion CNP and the first light-emitting element LD1 and the second light-emitting element LD2 are positioned.

[0121] The first organic layer OL1 may be a first via layer. The first organic layer OL1 may include organic materials. For example, the first organic layer OL1 may include one or more of the group consisting of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. However, the disclosure is not limited thereto.

[0122] The first organic layer OL1 can electrically separate the first anode electrode AE1 and the first connecting electrode COE1. Therefore, the second end EP2 of the first light-emitting element LD1 can be electrically connected to the second anode electrode AE2 through the first connecting electrode COE1 and the contact portion CNP.

[0123] The contact portion CNP can be formed in the first organic layer OL1. The contact portion CNP can be manufactured in the same process as the first connecting electrode COE1, can pass through the first organic layer OL1, and can electrically connect the first connecting electrode COE1 and the second anode electrode AE2.

[0124] The first connecting electrode COE1 can be located on the first light-emitting element LD1 and the first organic layer OL1. The first connecting electrode COE1 can be electrically connected to the second end EP2 of the first light-emitting element LD1, and can be electrically separated (or physically spaced) from the second light-emitting element LD2 in a plan view without being superimposed on it. The first connecting electrode COE1 can be electrically connected to the second anode electrode AE2 through the contact portion CNP.

[0125] The first connecting electrode COE1 can be patterned after the light-emitting element LD is transferred onto the first anode electrode AE1 and the second anode electrode AE2. The first connecting electrode COE1 can be an intermediate electrode for electrically connecting the first light-emitting element LD1 and the second light-emitting element LD2 in series with each other; that is, the first connecting electrode COE1 can include an electrical path between the first light-emitting element LD1 and the second light-emitting element LD2.

[0126] The first connecting electrode COE1 may include a conductive material. According to one or more embodiments, the first connecting electrode COE1 may include a transparent conductive material. For example, the first connecting electrode COE1 may include one or more of the group consisting of silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc antimony oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene.

[0127] The insulating layer INF can be located on the first connecting electrode COE1, the first organic layer OL1, the first light-emitting element LD1, and the second light-emitting element LD2. The insulating layer INF can cover the first connecting electrode COE1 and each side surface of the second light-emitting element LD2.

[0128] The insulating layer INF may include inorganic materials. For example, the insulating layer INF may include silicon oxide (SiO2). x Silicon nitride (SiN) x ), silicon oxynitride (SiO) x N y ), aluminum oxide (Al) x O y ) and titanium dioxide (TiO2) x One or more of the groups. However, the disclosure is not limited to the examples above.

[0129] The insulating layer INF can be a protective layer for the first connection electrode COE1. For example, the insulating layer INF can cover the upper surface of the first connection electrode COE1 and reduce the risk that the first connection electrode COE1 may be removed by etchants or the like during the etching process used to pattern the second connection electrode COE2.

[0130] The second organic layer OL2 can be located on the pixel circuit layer PCL. The second organic layer OL2 can cover the insulating layer INF. The second organic layer OL2 can fill the space between the light-emitting elements LD.

[0131] The second organic layer OL2 may be a planarization layer. The second organic layer OL2 may include organic materials. For example, the second organic layer OL2 may include one or more of the group consisting of acrylic resin, epoxy resin, phenolic resin, polyamide resin, and polyimide resin. However, the disclosure is not limited thereto.

[0132] The second organic layer OL2 can expose the second terminal EP2 of the second light-emitting element LD2. The second organic layer OL2 can reduce the step between the second organic layer OL2 and the pixel circuit layer PCL, so the second connection electrode COE2 can be appropriately patterned.

[0133] The second connecting electrode COE2 may be located on the second light-emitting element LD2 and the second organic layer OL2. The second connecting electrode COE2 may be electrically connected to the second end EP2 of the second light-emitting element LD2. According to one or more embodiments, the second connecting electrode COE2 may not be superimposed on the first light-emitting element LD1 in a plan view. The second connecting electrode COE2 may be electrically connected to the second electrode ELT2.

[0134] The second connecting electrode COE2 can be patterned after the fabrication of the second organic layer OL2. The second connecting electrode COE2 can be an intermediate electrode for connecting the first light-emitting element LD1 and the second light-emitting element LD2 in series to the second electrode ELT2.

[0135] The second connecting electrode COE2 may include a conductive material. According to one or more embodiments, the second connecting electrode COE2 may include a transparent conductive material. For example, the second connecting electrode COE2 may include one or more of the group consisting of silver nanowires (AgNW), indium tin oxide (ITO), indium zinc oxide (IZO), indium gallium zinc oxide (IGZO), zinc antimony oxide (AZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), tin oxide (SnO2), carbon nanotubes, and graphene.

[0136] According to one or more embodiments, the light-emitting unit (EMU) can form a sub-pixel SPX. Furthermore, the electrical structure in which the light-emitting elements (LDs) are connected in series / parallel can be implemented as a structure in which the light-emitting elements (LDs) are aligned in the vertical direction. In this case, the defect risk of the sub-pixel SPX can be significantly reduced.

[0137] Next, refer to Figure 7 DD describes a display device according to one or more other embodiments. Figure 7 A display device DD according to one or more other embodiments is shown.

[0138] The display device DD according to one or more other embodiments differs from the display device DD according to one or more of the above embodiments in that: the first connecting electrode COE1 is electrically connected to the second light-emitting element LD2 through the second bonding electrode BE2.

[0139] According to one or more embodiments, the first bonding electrode BE1 and the second bonding electrode BE2 may have different shapes. For example, the first bonding electrode BE1 may have a generally flat shape, and the second bonding electrode BE2 may have a shape corresponding to the shape of the second element insulating layer EINF2 of the corresponding second light-emitting element LD2. The second bonding electrode BE2 may (e.g., in a plan view) surround the side of the second light-emitting element LD2 and may be formed to correspond to the side shape of the second light-emitting element LD2. For example, at least a portion of the second bonding electrode BE2 may be electrically connected to the first-second semiconductor layers SCL1-2, and another portion of the second bonding electrode BE2 may be located on the second element insulating layer EINF2.

[0140] According to one or more embodiments, the first connecting electrode COE1 may be electrically connected to the second bonding electrode BE2. For example, the first connecting electrode COE1 may be physically spaced apart from the second anode electrode AE2 and may be in contact with the second bonding electrode BE2. Therefore, electrical signals provided from the pixel circuit PXC can be provided to each of the second light-emitting elements LD2 through the first connecting electrode COE1 and the second bonding electrode BE2.

[0141] According to one or more embodiments, the light-emitting element layer LEL may further include a third organic layer OL3. The third organic layer OL3 may be located on the second organic layer OL2 and may include one or more of the organic materials described above with reference to the second organic layer OL2. The third organic layer OL3 may cover the side of the unpositioned second bonding electrode BE2 of the second light-emitting element LD2.

[0142] The third organic layer OL3 can electrically separate the first connecting electrode COE1 and the second bonding electrode BE2 from the second connecting electrode COE2. For example, at least a portion of the third organic layer OL3 can be located between the first connecting electrode COE1 / the second bonding electrode BE2 and the second connecting electrode COE2.

[0143] Because the first connecting electrode COE1 is electrically connected to the second bonding electrode BE2 but not to the first anode electrode AE1, it is not necessary to electrically connect a portion of the first anode electrode AE1 to the first connecting electrode COE1. In this case, since the area of ​​the first anode electrode AE1 can be effectively utilized, process convenience can be improved, and the area where the second light-emitting element LD2 can be positioned can be further ensured more extensively.

[0144] Next, refer to Figures 8 to 15 This describes a method of manufacturing a display device DD according to one or more embodiments. Content that may overlap with the foregoing will be described briefly or without repetition.

[0145] Figures 8 to 15 This is a schematic cross-sectional view illustrating each process operation of a method for manufacturing a display device according to one or more embodiments. For ease of description, references are made above. Figure 6 Described one or more embodiments Figures 8 to 15 .

[0146] Reference Figure 8 It is possible to fabricate a pixel circuit layer PCL, and to pattern the first electrode ELT1, the second electrode ELT2, the first anode electrode AE1, and the second anode electrode AE2 on the pixel circuit layer PCL.

[0147] According to one or more embodiments, a pixel circuit layer (PCL) can be fabricated by patterning conductive and insulating layers on a substrate layer (BSL). According to one or more embodiments, the conductive or insulating layers on the substrate layer (BSL) can be formed based on typical processes used for fabricating semiconductor devices. For example, the conductive or insulating layers on the substrate layer (BSL) can be formed by photolithography, etched by various methods (wet etching, dry etching, etc.), and deposited by various methods (sputtering, chemical vapor deposition, etc.). The disclosure is not limited to the specific examples.

[0148] In this operation, the first electric field line PL1 and the second electric field line PL2, as well as the pixel circuit PXC, can be patterned on the substrate layer BSL.

[0149] In this operation, the first electrode ELT1 and the second electrode ELT2, as well as the first anode electrode AE1 and the second anode electrode AE2, can be patterned. As described above, according to one or more embodiments, the first anode electrode AE1 and the first electrode ELT1 can be integrally formed. Therefore, the first anode electrode AE1 and the second anode electrode AE2 can be provided spaced apart from each other.

[0150] After this operation, the first electrode ELT1 can be electrically connected to the pixel circuit PXC1, and the second electrode ELT2 can be electrically connected to the second power line PL2.

[0151] Reference Figure 9 The light-emitting element (LD) can be transferred to the pixel circuit layer (PCL).

[0152] In this operation, the light-emitting element (LD) can be transferred onto the pixel circuit layer (PCL) such that the first end EP1 faces the first anode electrode AE1 and the second anode electrode AE2. For example, the first bonding electrode BE1 and the second bonding electrode BE2 can be positioned on the first anode electrode AE1 and the second anode electrode AE2, respectively, and a thermal melting process can be performed, so that the first bonding electrode BE1 and the second bonding electrode BE2 can be bonded to the first anode electrode AE1 and the second anode electrode AE2, respectively. However, the disclosure is not limited to this, and the light-emitting element (LD) can be transferred by various methods.

[0153] In this operation, the first light-emitting element LD1 can be electrically connected to the first anode electrode AE1, and the second light-emitting element LD2 can be electrically connected to the second anode electrode AE2.

[0154] Reference Figure 10 The first organic layer OL1 can be patterned on the pixel circuit layer PCL.

[0155] In this stage, the first organic layer OL1 may cover (e.g., a portion of) the side surface of each of the first light-emitting element LD1 and the second light-emitting element LD2, and may fill the space between the light-emitting elements LD. The first organic layer OL1 may also cover the side surfaces of the first bonding electrode BE1 and the second bonding electrode BE2.

[0156] In this operation, the first organic layer OL1 may have a hole H formed therein to expose the second anode electrode AE2.

[0157] Reference Figure 11 This allows the first connecting electrode COE1 to be patterned.

[0158] In this operation, the first connecting electrode COE1 can be electrically connected to the second end EP2 of the first light-emitting element LD1. Additionally, a conductive material formed (e.g., deposited) in the same process as the first connecting electrode COE1 can be disposed in the hole H to form a contact portion CNP. Therefore, in this operation, the first light-emitting element LD1 can be electrically connected to the second anode electrode AE2 via the first connecting electrode COE1 and the contact portion CNP.

[0159] In this operation, the first connecting electrode COE1 can be patterned so that it is not superimposed on the second light-emitting element LD2 in a planar view.

[0160] Reference Figure 12 This allows for the patterning of the insulating layer INF.

[0161] In this operation, the insulating layer INF can cover the first connection electrode COE1. Additionally, the insulating layer INF can cover at least a portion of the second light-emitting element LD2. Therefore, the insulating layer INF can appropriately passivate the first connection electrode COE1 and reduce the risk of potential damage to the first connection electrode COE1.

[0162] Reference Figure 13 The second organic layer OL2 can be patterned on the first organic layer OL1 and the insulating layer INF.

[0163] In this operation, the second organic layer OL2 can cover the side surfaces of each of the first light-emitting element LD1 and the second light-emitting element LD2, and can fill the space between the light-emitting elements LD. Therefore, the second organic layer OL2 can mitigate the steps formed due to other constructions.

[0164] Reference Figure 14 At least a portion of the insulating layer INF can be etched, thus exposing the second end EP2 of the second light-emitting element LD2.

[0165] In this operation, the portion of the insulating layer INF on the first light-emitting element LD1 can be removed without removing the portion of the insulating layer INF on the second light-emitting element LD2.

[0166] Reference Figure 15 This allows for the patterning of the second connecting electrode COE2.

[0167] In this operation, the second connecting electrode COE2 can be electrically connected to the second terminal EP2 of the second light-emitting element LD2. Additionally, the second connecting electrode COE2 can be electrically connected to the second electrode ELT2. Therefore, in this operation, a series / parallel electrical connection structure between the first light-emitting element LD1 and the second light-emitting element LD2 can be defined between the first electrode ELT1 and the second electrode ELT2.

[0168] Subsequently, according to one or more embodiments, an upper UPL layer can be formed on the light-emitting element layer LEL, thereby enabling the fabrication of a display device DD according to one or more embodiments.

[0169] As described above, although the disclosure has been described with reference to one or more embodiments, those skilled in the art or those with common general knowledge in the art will understand that the disclosure may be modified and altered in different ways without departing from the spirit and technical field of the disclosure described in the claims.

[0170] Therefore, the scope of the disclosed technology should not be limited to what is described in the detailed description of the specification, but should be defined by the claims and its functional equivalents included therein.

Claims

1. A display device, the display device comprising: Pixel circuit layer, including pixel circuits above the substrate layer; as well as A light-emitting element layer is provided above the pixel circuit layer, and includes light-emitting units. Each light-emitting unit includes a first anode electrode, a first connection electrode, a second anode electrode, a first light-emitting element above the first anode electrode, and a second light-emitting element above the second anode electrode. The first light-emitting element and the second light-emitting element each include a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer. The first connecting electrode electrically connects the first end of the first light-emitting element to the second anode electrode, thereby connecting the first light-emitting element and the second light-emitting element in series.

2. The display device according to claim 1, wherein, Multiple first light-emitting elements and multiple second light-emitting elements are connected in series.

3. The display device according to claim 1, wherein, The first light-emitting element and the second light-emitting element together constitute a sub-pixel.

4. The display device according to claim 1, wherein, The light-emitting element layer also includes a first electrode and a second electrode. The pixel circuit layer further includes a first power line electrically connected to the first electrode and a second power line electrically connected to the second electrode.

5. The display device according to claim 4, wherein, The first electrode and the first anode electrode are integrated.

6. The display device according to claim 1, wherein, The first light-emitting element further includes a first bonding electrode adjacent to the first end and electrically connected to the first anode electrode. The second light-emitting element further includes a second bonding electrode that is adjacent to the first end and electrically connected to the second anode electrode.

7. The display device according to claim 1, wherein, The first light-emitting element and the second light-emitting element have trapezoidal cross-sections.

8. The display device according to claim 1, further comprising a first organic layer covering the first anode electrode and the second anode electrode. in, The first connecting electrode is electrically connected to the second anode electrode through a contact portion that passes through the first organic layer.

9. The display device according to claim 8, further comprising a second organic layer above the first organic layer and having a planar structure.

10. The display device according to claim 1, wherein, The first connecting electrode is not superimposed on the second light-emitting element in the plan view, and includes the electrical path between the first light-emitting element and the second light-emitting element.

11. The display device according to claim 1, further comprising an insulating layer covering portions of the side surfaces of the first light-emitting element and the second light-emitting element, and covering the second end of the first light-emitting element but not the second end of the second light-emitting element.

12. The display device according to claim 4, the display device further comprising a second connecting electrode, the second connecting electrode electrically connecting the second end of the second light-emitting element to the second electrode.

13. A display device, the display device comprising: Matrix layer; Pixel circuitry, located above the substrate layer; A first electrode, a first anode electrode electrically connected to the first electrode, a second anode electrode, and a second electrode, wherein the first electrode, the first anode electrode, the second anode electrode, and the second electrode are above the substrate layer and are in the same layer as each other; A light-emitting element includes a first semiconductor layer, a second semiconductor layer, an active layer between the first semiconductor layer and the second semiconductor layer, a first end adjacent to the first semiconductor layer, and a second end adjacent to the second semiconductor layer. The light-emitting element includes a first light-emitting element above the first anode electrode and including a first bonding electrode, and a second light-emitting element above the second anode electrode and including a second bonding electrode. The first connecting electrode electrically connects the first end of the first light-emitting element to the second bonding electrode. as well as The second connecting electrode electrically connects the first end of the second light-emitting element to the second electrode. The first connecting electrode and the second anode electrode are physically spaced apart from each other.

14. The display device according to claim 13, further comprising: A first organic layer covers the first anode electrode and the second anode electrode; A second organic layer is placed above the first organic layer and covers a portion of the second bonding electrode; as well as A third organic layer is placed above the second organic layer and covers the portion of the second light-emitting element where the second bonding electrode is not positioned.

15. The display device according to claim 13, wherein, The first bonding electrode is electrically connected to the first anode electrode. Wherein, the second bonding electrode is electrically connected to the second anode electrode, and The first bonding electrode and the second bonding electrode have different shapes.

16. The display device according to claim 15, wherein, The second bonding electrode surrounds the side of the second light-emitting element in the plan view.

17. A method for manufacturing a display device, the method comprising the following steps: Fabricating pixel circuit layers; as well as A light-emitting element layer is fabricated above the pixel circuit layer by the following steps: patterning a first anode electrode and a second anode electrode on the pixel circuit layer; transferring a first light-emitting element onto the first anode electrode; The second light-emitting element is transferred onto the second anode electrode; The first organic layer is patterned, and the first organic layer defines a hole that exposes the second anode electrode; The first connecting electrode is patterned, being at least partially electrically connected to the first light-emitting element, physically spaced apart from the second light-emitting element, and disposed in the hole to form a contact portion electrically connecting the first light-emitting element and the second anode electrode.

18. The method according to claim 17, wherein, The steps for manufacturing the light-emitting element layer further include: Forming an insulating layer covering the first connecting electrode; and A second organic layer covering the insulating layer is patterned above the first organic layer.

19. The method according to claim 18, wherein, The step of manufacturing the light-emitting element layer further includes exposing at least a portion of the second light-emitting element by removing another portion of the insulating layer that overlaps with the second light-emitting element without removing the portion of the insulating layer that overlaps with the first light-emitting element.

20. The method according to claim 19, wherein, The step of manufacturing the light-emitting element layer further includes: patterning a second connection electrode, the second connection electrode being electrically connected to the at least portion of the second light-emitting element exposed by the insulating layer.

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