Substrate processing system and substrate processing method

Abstract

The disclosed substrate processing system includes a vacuum transport module, a control unit, multiple processing modules, an alignment unit, a storage unit, and a determination unit. The alignment unit includes a stage and an optical sensor. The stage is configured to mount a ring component. The optical sensor is configured to detect the shape of the ring component mounted on the stage. The storage unit contains a table storing feature information associated with the identifiers of the multiple processing modules. The feature information represents the characteristics of each of the multiple ring components. The determination unit extracts the feature information of the ring component based on the shape detected by the optical sensor, and, referring to the table in the storage unit, determines the processing module among the multiple processing modules from which the ring component should be transported based on the identifiers stored in association with the feature information.

Description

Technical Field

[0001] The exemplary embodiments disclosed herein relate to a substrate processing system and a substrate processing method. Background Technology

[0002] Substrate processing systems capable of performing various processes such as plasma processing on substrates are known. These systems include processing modules with a processing chamber and a substrate support. The substrate support is disposed within the processing chamber and supports a ring member disposed thereon. Patent Document 1 discloses a technique for replacing the ring member disposed on the substrate support.

[0003] Existing technical documents Patent documents Patent Document 1: Japanese Patent Application Publication No. 2022-02255 Summary of the Invention

[0004] The problem that the invention aims to solve This disclosure provides techniques for determining the processing module corresponding to the ring component.

[0005] Methods for solving problems In one exemplary embodiment, a substrate processing system is provided. The substrate processing system includes a vacuum transport module, a control unit, multiple processing modules, an aligner, a storage unit, and a determination unit. The vacuum transport module has a transport chamber and a transport robot. The transport chamber is depressurized. The transport robot is configured to transport the substrate via the transport chamber. The control unit is configured to control the transport robot. Each of the multiple processing modules has a processing chamber and a substrate support. The processing chamber is connected to the transport chamber. The substrate support is disposed within the processing chamber. Each of the multiple processing modules is configured to perform substrate processing on the substrate on the substrate support. The aligner has a mounting stage and an optical sensor. The mounting stage is configured to mount a ring member thereon. The optical sensor is configured to detect the shape of the ring member mounted on the mounting stage. The storage unit includes a table storing feature information associated with the respective identifiers of the multiple processing modules. The feature information represents the characteristics of each of the multiple ring members. The determination unit extracts the feature information of the ring component from the shape detected by the optical sensor, and determines the processing module that should deliver the ring component among multiple processing modules based on the identifier stored in the storage unit and associated with the feature information, referring to the table in the storage unit.

[0006] Invention Effects According to an exemplary implementation, a processing module corresponding to the ring component is determined. Attached Figure Description

[0007] Figure 1 This is a diagram illustrating a substrate processing system of an exemplary embodiment.

[0008] Figure 2 This is a diagram that schematically illustrates a plasma processing apparatus of an exemplary embodiment.

[0009] Figure 3 This is a partially enlarged cross-sectional view of the substrate support portion of a plasma processing apparatus according to an exemplary embodiment.

[0010] Figure 4 This is a perspective view of a storage module according to one embodiment.

[0011] Figure 5 This is an end view of the storage module according to one embodiment.

[0012] Figure 6 This is a plan view of the edge ring and aligner in one embodiment.

[0013] Figure 7 This is a plan view of the cover ring and aligner according to one embodiment.

[0014] Figure 8 This is a flowchart illustrating a substrate processing method of an exemplary embodiment. Detailed Implementation

[0015] Hereinafter, various exemplary embodiments will be described in detail with reference to the accompanying drawings. Furthermore, in each drawing, the same or equivalent parts are labeled with the same reference numerals.

[0016] Figure 1 This is a diagram illustrating a substrate processing system of an exemplary embodiment. For example... Figure 1 As shown, the substrate processing system PS includes a vacuum transport module VTM, a control unit MC, multiple processing modules PM1 to PM6, an aligner RAN, a storage unit MU, and a determination unit IU. In one embodiment, the substrate processing system PS may further include a storage module RSM, a loading module LM, and at least one loading locking module. The substrate processing system PS includes two loading locking modules LL1 and LL2 as at least one loading locking module. The substrate processing system PS may also include at least one loading port, a substrate inspection module CM, an aligner AN, and a storage unit SR. The substrate processing system PS includes four loading ports LP1 to LP4 as at least one loading port.

[0017] The loading module LM is an example of an atmospheric conveying module. In one embodiment, the loading module LM includes a conveying chamber ACH. The conveying chamber ACH is an example of other conveying chambers. The pressure within the conveying chamber ACH of the loading module LM can be set to atmospheric pressure. The loading module LM may have an FFU (Fan Filter Unit). The loading module LM is, for example, an EFEM (Equipment Front End Module). The loading module LM is disposed between each loading port LP1-LP4 and each loading locking module LL1, LL2. The loading ports LP1-LP4 are arranged along one of a pair of edges along the long side of the loading module LM. The loading locking modules LL1, LL2 are arranged along the other of a pair of edges along the long side of the loading module LM. The loading ports LP1-LP4 are respectively configured to support a cassette CST placed thereon. The cassette CST is a container in which multiple substrates W are housed. The CST housing is, for example, FOUP (Front-Opening Unified Pod).

[0018] In one embodiment, the loading module LM includes a transport robot TR3. The transport robot TR3 is an example of other transport robots. The transport robot TR3 is disposed within the transport chamber ACH of the loading module LM. The transport robot TR3 may include a multi-joint arm AR31 and an end effector FK31. The end effector FK31 is mounted at the front end of the multi-joint arm AR31 and configured to support the substrate W placed thereon. The transport robot TR3 is configured to transport the substrate W via the transport chamber ACH. For example, the transport robot TR3 transports the substrate W based on an action instruction output by the control unit MC (described later). The transport robot TR3 transports the substrate W between any two of the following: a housing CST placed on at least one of the loading ports LP1 to LP4, loading locking modules LL1 and LL2, an aligner AN, and a storage device SR.

[0019] The aligner AN is disposed along one of a pair of edges of the loading module LM along its short side. Alternatively, the aligner AN may be disposed along an edge of the loading module LM along its long side. Furthermore, the aligner AN may be disposed within the transport chamber ACH of the loading module LM. The aligner AN includes a stage, an optical sensor, etc. The stage of the aligner AN is rotatable, supporting the substrate W placed thereon. The aligner AN uses the optical sensor to detect the angular position of a mark (e.g., a notch) on the substrate W on the stage and the center position of the substrate W on the stage. The control unit MC controls the rotation of the stage of the aligner AN to correct the angular position of the mark (e.g., a notch) on the substrate W on the stage to a reference angular position, thereby correcting the offset of the angular position of the substrate W. Additionally, to ensure that the center of the substrate W is located at a predetermined position on the end effector FK31, the control unit MC controls the position of the end effector FK31 when receiving the substrate W from the aligner AN on the end effector FK31.

[0020] The storage device SR is disposed along the edge of the loading module LM in the long side direction. The storage device SR may also be disposed along the edge of the loading module LM in the short side direction. Alternatively, the storage device SR may be disposed inside the loading module LM. The storage device SR is configured to house the substrate W therein.

[0021] The substrate inspection module CM can be installed inside the loading module LM or the vacuum transport module VTM. The substrate inspection module CM can be connected to the loading module LM below the loading ports LP1 to LP4. It is not limited to the above-mentioned location and can be installed in any location. The substrate inspection module CM is configured to acquire an image of the substrate W.

[0022] In one embodiment, loading locking modules LL1 and LL2 are connected to loading module LM. Each loading locking module LL1, LL2 and loading module LM can be connected via a gate valve G3. Figure 1 In the example shown, each loading locking module LL1, LL2 is connected to the vacuum delivery module VTM via gate valve G2. Each loading locking module LL1, LL2 can be configured between the vacuum delivery module VTM and the loading module LM. Each loading locking module LL1, LL2 provides a pre-decompression chamber.

[0023] The vacuum transport module (VTM) has at least one transport chamber and at least one transport manipulator. Figure 1In the example shown, the vacuum transport module VTM has a transport chamber VCH and a transport manipulator TR, which serve as at least one transport chamber and at least one transport manipulator. The transport chamber VCH is configured to depressurize. The transport manipulator TR is configured to transport a substrate W via the transport chamber VCH. In one embodiment, an aligner RAN is connected to the transport chamber VCH of the vacuum transport module VTM.

[0024] Multiple processing modules PM1 to PM6 each have a processing chamber 10 and a substrate support portion 16 (see reference). Figure 2 The processing chamber 10 is connected to the vacuum delivery module VTM. Figure 1 In the example shown, processing modules PM1 to PM6 are connected to the vacuum delivery module VTM via gate valve G1.

[0025] The transport robot TR may include articulated arms AR11 and AR12, and end effectors FK11 and FK12. End effector FK11 is mounted at the front end of articulated arm AR11 and configured to support the substrate W placed thereon. End effector FK12 is mounted at the front end of articulated arm AR12 and configured to support the substrate W placed thereon. For example, the transport robot TR transports the substrate W based on an action instruction output by the control unit MC (described later). The transport robot TR holds the substrate W via end effectors FK11 and FK12. The transport robot TR is configured to transport the substrate W or ring component R between paths with loading locking modules LL1 and LL2, processing modules PM1 to PM6, and storage module RSM. In one embodiment, the ring component R is an edge ring ER (focusing ring) or a cover ring CR. The edge ring ER is used to surround the substrate W on the substrate support 16. The cover ring CR is used to surround the edge ring ER. Details regarding the edge ring ER and the cover ring CR will be described later.

[0026] In one embodiment, the storage module RSM is connected to the delivery chamber VCH of the vacuum delivery module VTM. In one example, the storage module RSM is connected to the delivery chamber VCH via a gate valve G1. The storage module RSM is configured to house a ring component R within it. The storage module RSM is also referred to as a ring accumulator. Figure 1 In the example shown, the aligner RAN is configured within the storage module RSM. Details regarding the storage module RSM and the aligner RAN will be described later.

[0027] In one embodiment, each of the processing modules PM1 to PM6 is configured to perform dedicated processing on the substrate W. At least one of the processing modules PM1 to PM6 is a substrate processing apparatus such as the plasma processing apparatus 1 described later.

[0028] The control unit (MC) is configured to control each part of the substrate processing system (PS). The control unit (MC) can be a computer equipped with a processor, storage device, input device, display device, etc. The control unit (MC) executes a control program stored in the storage device, controlling each part of the substrate processing system (PS) based on the process data (recipe data) stored in the storage device. The transport methods described in the various exemplary embodiments below are executed in the substrate processing system (PS) through the control unit (MC) controlling each part of the PS. The control unit (MC) is configured to control the transport robots TR and TR3. The control unit (MC) can also function as both the storage unit (MU) and the determination unit (IU). Details regarding the storage unit (MU) and the determination unit (IU) will be described later.

[0029] The following is for reference Figure 2 . Figure 2 This is a diagram that schematically illustrates a plasma processing apparatus of an exemplary embodiment. Figure 2 The plasma processing apparatus 1 shown is used as at least one of the processing modules PM1 to PM6. The plasma processing apparatus 1 is an example of a substrate processing apparatus.

[0030] The plasma processing apparatus 1 is a capacitively coupled plasma processing apparatus. The plasma processing apparatus 1 includes a processing chamber 10. The processing chamber 10 provides an internal space 10s therein. The central axis of the internal space 10s is an axis AX extending vertically.

[0031] In one embodiment, the processing chamber 10 includes a chamber body 12. The chamber body 12 has a generally cylindrical shape. An internal space 10s is provided within the chamber body 12. The chamber body 12 is made of, for example, aluminum. The chamber body 12 is electrically grounded. A plasma-resistant membrane is formed on the inner wall surface of the chamber body 12, i.e., the wall surface that divides the internal space 10s. This membrane can be a ceramic membrane formed by anodizing or by forming a yttrium oxide membrane.

[0032] A passage 12p is formed on the side wall of the chamber body 12. The substrate W or the ring member R passes through the passage 12p when it is transported between the processing chamber 10 and the transport chamber VCH. A gate valve G1 is provided along the side wall of the chamber body 12 for opening and closing the passage 12p.

[0033] The plasma processing apparatus 1 also includes a substrate support 16. The substrate support 16 is disposed within the processing chamber 10. The substrate support 16 is configured to support a substrate W placed thereon. The substrate W has a generally disc-shaped form. Details regarding the substrate support 16 will be described later.

[0034] The plasma processing apparatus 1 may further include an upper electrode 30. The upper electrode 30 is disposed above the substrate support portion 16. The upper electrode 30, together with the component 32, seals the upper opening of the chamber body 12. The component 32 is insulating. The upper electrode 30 is supported on the upper part of the chamber body 12 via the component 32.

[0035] The upper electrode 30 includes a top plate 34 and a support 36. The lower surface of the top plate 34 defines an internal space 10s. The top plate 34 is provided with a plurality of pores 34a. The plurality of pores 34a penetrate the top plate 34 along the thickness direction (vertical direction) and open toward the internal space 10s. The top plate 34 is formed, for example, of silicon. Alternatively, the top plate 34 may have a structure in which a plasma-resistant film is formed on the surface of an aluminum component. This film may be a ceramic film formed by anodizing or a film formed of yttrium oxide.

[0036] The support body 36 detachably supports the top plate 34. The support body 36 is formed of a conductive material, for example, aluminum. The support body 36 provides a gas diffusion chamber 36a and a plurality of vents 36b therein. The plurality of vents 36b extend downward from the gas diffusion chamber 36a and communicate with the plurality of vents 34a respectively. The support body 36 has a gas inlet 36c. The gas inlet 36c is connected to the gas diffusion chamber 36a. A gas supply pipe 38 is connected to the gas inlet 36c.

[0037] Gas source group 40 is connected to gas supply pipe 38 via valve group 41, flow controller group 42, and valve group 43. Gas source group 40, valve group 41, flow controller group 42, and valve group 43 constitute gas supply unit GS. Gas source group 40 includes multiple gas sources. Valve group 41 and valve group 43 each include multiple valves (e.g., on / off valves). Flow controller group 42 includes multiple flow controllers. The multiple flow controllers of flow controller group 42 are either mass flow controllers or pressure-controlled flow controllers. The multiple gas sources of gas source group 40 are connected to gas supply pipe 38 via corresponding valves of valve group 41, corresponding flow controllers of flow controller group 42, and corresponding valves of valve group 43. Plasma processing device 1 can supply gas from one or more gas sources selected from the multiple gas sources of gas source group 40 at individually adjusted flow rates to the internal space for 10 seconds.

[0038] The processing chamber 10 provides an exhaust path around the substrate support 16. Below the exhaust path, at the bottom of the processing chamber 10, an exhaust pipe 52 is connected. An exhaust device 50 is connected to the exhaust pipe 52. The exhaust device 50 has a pressure controller such as an automatic pressure control valve and a vacuum pump such as a turbomolecular pump, which can reduce the pressure in the internal space 10s.

[0039] The plasma processing apparatus 1 also includes a high-frequency power supply 61. The high-frequency power supply 61 is a power source that generates source high-frequency electricity. This source high-frequency electricity is used to generate plasma from the gas within the processing chamber 10. The frequency of the source high-frequency electricity (source frequency) is in the range of 27 to 100 MHz. The high-frequency power supply 61 is connected to the upper electrode 30 via a matching circuit 61m. The matching circuit 61m is configured to match the impedance of the load side (upper electrode 30 side) of the high-frequency power supply 61 with the output impedance of the high-frequency power supply 61. Alternatively, the high-frequency power supply 61 may not be connected to the upper electrode 30, but instead be connected to the substrate support 16 (e.g., a lower electrode such as a base 18) via the matching circuit 61m.

[0040] The plasma processing apparatus 1 also includes a bias power supply 62. The bias power supply 62 is electrically coupled to a substrate support 16 (e.g., a lower electrode such as a base 18), supplying an electrical bias to the substrate support 16 for attracting ions from the plasma to the substrate W. The electrical bias has a bias frequency. The bias frequency can be lower than the source frequency. The bias frequency is, for example, a frequency in the range of 100 kHz to 13.56 MHz.

[0041] Electrical bias can also be a high-frequency bias power supply with a bias frequency. In this case, the bias power supply 62 is connected to the substrate support 16 (e.g., the lower electrode such as the base 18 or other electrodes of the substrate support 16) via a matching circuit 62m. The matching circuit 62m is configured to match the impedance on the load side of the bias power supply 62 with the output impedance of the bias power supply 62. Alternatively, electrical bias can also be a sequence of voltage pulses. The voltage pulses can be pulses of DC voltage. In this case, the plasma processing apparatus 1 does not include the matching circuit 62m.

[0042] The substrate support 16 includes a base 18 and an electrostatic chuck 20. The base 18 has a generally disc-shaped form. The substrate support 16 may also include a base 17 and an insulator 27. The base 18 may be formed of a metal such as aluminum and may form the lower electrode. The base 17 is disposed on the bottom of the processing chamber 10. The insulator 27 is disposed on the base 17. The insulator 27 is formed of an insulating material such as quartz and extends to surround the outer periphery of the base 18. The electrostatic chuck 20 is disposed on the base 18.

[0043] The following is for reference Figure 2 and Figure 3 . Figure 3 This is a partially enlarged cross-sectional view of the substrate support portion of an exemplary embodiment of a plasma processing apparatus. The upper surface of the electrostatic chuck 20 includes a substrate support surface 20a and a ring support surface 20b. The substrate support surface 20a is a generally circular surface with its central axis being axis AX. The electrostatic chuck 20 supports the substrate W placed on the substrate support surface 20a.

[0044] The ring support surface 20b is an annular surface extending about the axis AX outside the substrate support surface 20a. An electrostatic chuck 20 supports an edge ring ER placed on the ring support surface 20b. The edge ring ER has a ring shape. The substrate W is disposed within the area surrounded by the edge ring ER. The edge ring ER is formed, for example, of a conductive material such as silicon or silicon carbide. The edge ring ER may also be formed of an insulating material such as quartz.

[0045] The electrostatic chuck 20 has a dielectric portion 20c, a first chuck electrode 20d, and a second chuck electrode 20e. The dielectric portion 20c is formed of a ceramic such as alumina. The dielectric portion 20c has a generally disk-shaped form and provides a substrate support surface 20a and a ring support surface 20b.

[0046] The first chuck electrode 20d and the second chuck electrode 20e are disposed within the dielectric portion 20c and below the substrate support surface 20a. When a voltage is applied to the first chuck electrode 20d, the electrostatic chuck 20 generates electrostatic attraction, attracting and holding the substrate W to the substrate support surface 20a. The second chuck electrode 20e is disposed within the dielectric portion 20c and below the ring support surface 20b. When a voltage is applied to the second chuck electrode 20e, the electrostatic chuck 20 generates electrostatic attraction, attracting and holding the edge ring ER to the ring support surface 20b. Furthermore, in the illustrated example, the electrostatic chuck 20 includes a unipolar electrostatic chuck for holding the substrate W and a bipolar electrostatic chuck for holding the edge ring ER. However, a bipolar electrostatic chuck can be used instead of a unipolar electrostatic chuck, or vice versa.

[0047] A cover ring CR is disposed outside the edge ring ER, surrounding the edge ring ER. The cover ring CR has a ring shape. The cover ring CR covers the upper surface of the insulator 27. The cover ring CR is formed of an insulating material, such as quartz. The cover ring CR may also be formed of a conductive material such as silicon or silicon carbide. The outer periphery of the edge ring ER is disposed such that it overlaps with the inner periphery of the cover ring CR when viewed from above. Furthermore, the outer periphery of the cover ring CR is disposed outside the outer periphery of the edge ring ER, surrounding the outer periphery of the edge ring ER.

[0048] The plasma processing apparatus 1 also includes a lifter 70. The lifter 70 includes a lifter 71 and a lifter 72. The lifter 71 includes a plurality of lifting pins 711 and an actuator 712. The plurality of lifting pins 711 are respectively inserted into a plurality of through holes 161 formed in the base 18 and the electrostatic chuck 20. The actuator 712 causes the plurality of lifting pins 711 to move up and down. Through the movement achieved by the actuator 712, the plurality of lifting pins 711 can protrude upward from the substrate support surface 20a and can retract downward relative to the substrate support surface 20a. The actuator 712 can be, for example, a DC motor, a stepper motor, a linear motor, a pneumatic mechanism such as a cylinder, or a piezoelectric actuator. The lifter 71 causes the plurality of lifting pins 711 to move up and down when the substrate W is transferred between the transport robot TR and the substrate support 16.

[0049] The lifting device 72 includes a plurality of lifting pins 721 and an actuator 722. The plurality of lifting pins 721 are respectively inserted into a plurality of through holes 162 formed in the insulator 27 and a plurality of through holes CRh formed in the cover ring CR. The actuator 722 causes the plurality of lifting pins 721 to move up and down. As the actuator 722, for example, the same actuator as the actuator 712 can be used.

[0050] Multiple lifting pins 721 each include a lower portion 723 and an upper portion 724. The lower portion 723 and the upper portion 724 are each rod-shaped. The diameter of the lower portion 723 is larger than the diameter of the upper portion 724. The upper portion 724 extends upward from the lower portion 723.

[0051] The diameter of each of the multiple through holes 162 is slightly larger than the diameter of the lower portion 723 of each of the multiple lifting pins 721. The diameter of each of the multiple through holes CRh is slightly larger than the diameter of the upper portion 724 of each of the multiple lifting pins 721, but smaller than the diameter of the lower portion 723 of each of the multiple lifting pins 721.

[0052] Multiple lifting pins 721 can be positioned in a standby position, a first support position, and a second support position, respectively. The standby position is where the upper end face 724t of the upper portion 724 is lower than the lower surface of the edge ring ER. When the multiple lifting pins 721 are in the standby position, the edge ring ER and the cover ring CR are supported by the electrostatic chuck 20 and the insulator 27, respectively, without being lifted by the multiple lifting pins 721.

[0053] The first support position is located above the standby position. With the multiple lifting pins 721 respectively positioned in the first support position, the upper end face 724t of the upper portion 724 is above the upper surface of the cover ring CR, and the upper end face 723t of the lower portion 723 is below the lower surface of the cover ring CR. With the multiple lifting pins 721 positioned in the first support position, the upper end face 724t of the upper portion 724 abuts against the surface that defines the recess ERr formed on the lower surface of the edge ring ER. Thus, the multiple lifting pins 721 support the edge ring ER.

[0054] The second support position is located above the first support position. With the multiple lifting pins 721 respectively positioned in the second support position, the upper end face 723t of the lower portion 723 is positioned above the upper surface of the insulator 27. With the multiple lifting pins 721 positioned in the second support position, the upper end face 723t of the lower portion 723 abuts against the lower surface of the cover ring CR. Thus, the multiple lifting pins 721 support the cover ring CR. Furthermore, when the edge ring ER is located on the inner periphery of the cover ring CR, the upper end face 724t of the upper portion 724 abuts against the surface that divides the recess ERr, and the multiple lifting pins 721 support both the cover ring CR and the edge ring ER.

[0055] When the lifting device 72 only connects the edge ring ER between the conveying robot TR and the substrate support 16, it moves the plurality of lifting pins 721 to the first support position. When the lifting device 72 connects both the edge ring ER and the cover ring CR, or only the cover ring CR, between the conveying robot TR and the substrate support 16, it moves the plurality of lifting pins 721 to the second support position.

[0056] The following is for reference Figure 4 and Figure 5 This section provides detailed information about the alignment unit (RAN) and the storage module (RSM). Figure 4 This is a perspective view of a storage module according to one embodiment. Figure 4 This is a 3D view showing a partial cut-out of the interior of the RSM storage module. Figure 5 This is an end view of the storage module according to one embodiment.

[0057] The storage module RSM includes a chamber RC. The chamber RC is configured to depressurize its internal space. Figure 4 To illustrate the internal space, a portion of the chamber RC is shown as being removed. An aligner RAN and a housing module CTM are disposed within the chamber RC. The aligner RAN is positioned above the housing module CTM. The housing module CTM contains multiple housing CTs. Each housing CT is configured to house a ring component R.

[0058] The housing module CTM contains multiple ring components R. These ring components R may include edge rings ER and cover rings CR. For example... Figure 5 As shown, in the housing module CTM, edge rings ER and cover rings CR are arranged alternately. The aligner RAN and housing module CTM can be configured to move vertically. For example, ring components R are removed from the housing CT located at a delivery position within the chamber RC. The housing module CTM is capable of vertical movement to position the removed ring components R at the delivery position within the chamber RC. In the housing module CTM, ring components R can be removed sequentially, starting with the lowest-positioned ring component R among multiple ring components R.

[0059] The aligner RAN has a stage ST and an optical sensor S1. The stage ST is configured to mount a ring component R on it. The optical sensor S1 is configured to detect the shape of the ring component R mounted on the stage ST.

[0060] In one embodiment, the stage ST is configured to rotate together with the ring component R mounted thereon. For example, the stage ST may include a support portion RST configured to rotate and support the ring component R. The support portion RST is formed of a material that is permeable to visible light. In one example, the support portion RST is formed of glass. The support portion RST may include multiple pads PD. The multiple pads may include pads for the edge ring ER and pads for the cover ring CR. The pads for the edge ring ER are disposed inside the pads for the cover ring CR. The aligner RAN is movable in the vertical direction to position the support portion RST of the stage ST in the transport position within the chamber RC.

[0061] In one embodiment, the optical sensor S1 includes a line sensor LS and a light source L. The line sensor LS is configured to detect the outer and inner edges of the ring member R. The light source L emits light toward the line sensor LS. In one example, the light source L may emit a laser. For example, the line sensor LS and the light source L are arranged vertically opposite each other with a stage ST positioned between them. The line sensor LS may be arranged below the support RST such that it intersects the inner and outer edges of the ring member R when viewed from the light source L. In one example, when the stage ST and the ring member R placed on the stage rotate together, the light source L emits light toward the line sensor LS. The line sensor LS detects the light projected onto the inner and outer edges of the ring member R. The optical sensor S1 detects the shape of the ring member R based on the light detected by the line sensor LS.

[0062] The aligner RAN can be configured to adjust (align) the position of the ring member R disposed on the stage ST. The optical sensor S1 can be configured to optically detect the position of the ring member on the support RST. The aligner RAN can be configured to adjust the position of the ring member R based on the position detected by the optical sensor S1. In one embodiment, the aligner RAN is configured to detect and align the edge ring ER and the cover ring CR. In one example, the aligner RAN can be configured to align the edge ring ER on the inner portion of the online sensor LS and align the cover ring CR on the outer portion of the online sensor LS.

[0063] In one embodiment, the storage module RSM may further include an optical sensor S2. The optical sensor S2 is configured to detect the thickness of the ring component R. In one example, the optical sensor S2 is a mapping sensor. The optical sensor S2 may include a light source that emits laser light in a horizontal direction and a photosensitive sensor that receives the laser light emitted from the light source. The housing CT may include a side surface with a cutout. This cutout allows laser light to be irradiated onto the ring component R housed within the housing CT.

[0064] The following is for reference Figure 6 and Figure 7 The shape of the ring component R and the feature information of the ring component R extracted from its shape are described. Figure 6 This is a plan view of the edge ring and aligner in one embodiment. Figure 6 The edge ring ER is shown mounted on the support RST of the aligner RAN. Figure 7 This is a plan view of the cover ring and aligner according to one embodiment. Figure 7 The cover ring CR is shown mounted on the support RST of the aligner RAN.

[0065] The determining unit IU obtains feature information representing the characteristics of the ring component R based on the shape of the ring component R obtained by the optical sensor S1. In one embodiment, the characteristics of the ring component R may include at least one of the inner diameter, outer diameter, and thickness of the ring component. "Including at least one" means that the ring component R may include one or more of the inner diameter, outer diameter, or thickness as its features. The inner diameter and outer diameter of the ring component can be determined based on the curvature of the inner and outer edges of the ring component.

[0066] exist Figure 6 and Figure 7 In the example, the ring component R has a first notch NT1 and a second notch NT2. The ring component is characterized in that, as at least one notch, it includes a first notch NT1 and a second notch NT2. For example... Figure 6 As shown, in the edge ring ER, a first notch NT1 and a second notch NT2 are formed at its outer edge. Figure 7As shown, in the cover ring CR, a first notch NT1 and a second notch NT2 are formed on its inner edge. In one embodiment, the determination unit IU can obtain the thickness of the ring component R detected by the optical sensor S2 as feature information representing the characteristics of the ring component R.

[0067] In one embodiment, the ring member R may include the number of notches formed in the ring member R. Figure 6 and Figure 7 In the example, the number of at least one notch is two. When no notches are formed in the ring component R, the number of notches is 0. In one embodiment, the ring component R may include the relative positional relationship between a first notch NT1 and a second notch NT2. The relative positional relationship between the first notch NT1 and the second notch NT2 is, for example, the angle between the first notch NT1 and the second notch NT2 relative to the center of the ring component R. The relative positional relationship between the first notch NT1 and the second notch NT2 may also be the distance between the first notch NT1 and the second notch NT2.

[0068] The multiple ring components R are ring components R used by the corresponding processing modules PM1 to PM6. In the substrate processing system PS, the multiple ring components R are respectively transported to the corresponding processing modules. The storage unit MU contains a table that stores feature information representing the characteristics of each of the multiple ring components R in association with the identifiers of the multiple processing modules PM1 to PM6. For example, in this table, feature information representing the characteristics of a specific ring component R and the identifier of the specific processing module corresponding to the specific ring component R are stored correspondingly.

[0069] The determination unit IU refers to the table in the storage unit MU and, based on the identifier stored in association with the feature information representing the characteristics of the ring component R, determines the processing module among the multiple processing modules PM1 to PM6 that should deliver the ring component R. The processing module that should deliver the ring component R refers to the processing module among the multiple processing modules PM1 to PM6 that corresponds to the ring component R.

[0070] The feature information representing the characteristics of the ring component R is associated with the identifier of the processing module corresponding to the ring component R and stored in a table in the storage unit MU. According to the substrate processing system PS, by referring to the table in the storage unit MU, the processing module corresponding to the ring component R is determined based on the feature information representing the characteristics of the ring component R extracted from the shape of the ring component R.

[0071] The control unit MC controls the conveying robot TR. Alternatively, the control unit MC can control the conveying robot TR to transport the ring component R between the box module CTM and the aligner RAN within the storage module RSM. Or, the control unit MC can control the conveying robot TR to transport the ring component R to a designated processing module among the multiple processing modules PM1 to PM6.

[0072] In one embodiment, the control unit MC transports the ring component R to the mounting stage ST of the alignment unit RAN before transporting it to a designated processing module among the plurality of processing modules PM1 to PM6. The control unit MC obtains the identifier of the processing module among the plurality of processing modules PM1 to PM6 that should be transported to the mounting stage ST. This identifier is determined in the determination unit 1U using a feature information reference table of the ring component R transported to the mounting stage ST. The control unit MC determines whether the identifier of the designated processing module matches the identifier of the processing module to be transported.

[0073] In one embodiment, after removing the ring component R from the processing module, the control unit MC transports the ring component R to the mounting stage ST of the alignment unit RAN. The control unit MC obtains the identifier of the processing module from among the multiple processing modules PM1 to PM6 that should transport the ring component R to the mounting stage ST. This identifier is determined in the determination unit IU using a feature information reference table of the ring component R transported to the mounting stage ST. The control unit MC determines whether the identifier of the processing module from which the ring component R was removed matches the identifier of the processing module to be transported.

[0074] Figure 8 This is a flowchart illustrating a substrate processing method according to an exemplary embodiment. Hereinafter, refer to... Figure 8 An example of a substrate processing method (hereinafter referred to as "Method MT") will be described. Method MT is performed using a substrate processing system PS. The structure and control of each part of the substrate processing system PS in Method MT will also be described below. Furthermore, Method MT can also be performed using a substrate processing system other than the substrate processing system PS.

[0075] Method MT begins in step ST1. In step ST1, the ring component R is conveyed to the aligner RAN. In one example, the ring component R is conveyed by the transport robot TR from the lowermost housing CT in the housing module CTM to the mounting stage ST of the aligner RAN. In one embodiment, step ST1 can be performed before conveying the ring component R to a designated processing module among the multiple processing modules PM1 to PM6. Figure 8 In the example, process ST1 is performed before process ST5 is sent to the specified processing module.

[0076] Step ST2 is performed after step ST1. In step ST2, the shape of the ring component R, which is being conveyed to the alignment unit RAN, is detected. For example, the shapes of the inner and outer edges of the ring component R are detected by optical sensor S1. In one embodiment, the shape of the ring component R can be the thickness of the ring component R. The thickness of the ring component R can be detected by optical sensor S2 disposed in the storage module RSM before step ST2.

[0077] Step ST3 is performed after step ST2. In step ST3, feature information representing the characteristics of the ring component R is extracted from the shape of the ring component R. After extracting the feature information, the processing module that should deliver the ring component R is determined from among multiple processing modules PM1 to PM6 based on the identifier of the processing module stored in the table of the storage unit MU in association with the feature information, referring to the table of the storage unit MU.

[0078] For example, in the table of the storage unit MU, the identifier of the processing module PM1 and the characteristic information of the ring component R corresponding to the processing module PM1 are stored together. In the table of the storage unit MU, the identifier of the processing module PM1 and the identifier of the ring component R corresponding to the processing module PM1 can also be stored together, and the identifier of the ring component R and the characteristic information of the ring component R can also be stored together.

[0079] In one embodiment, method MT may include step ST4. Step ST4 is performed after step ST3. In step ST4, it is determined whether the identifier of the designated processing module of the conveying ring component R is consistent with the identifier of the processing module of the conveying ring component R determined in step ST3. If they are not consistent in step ST4 ( Figure 8 If the determination result in process ST4 is "No", method MT can end. In this case, for example, method MT ends abnormally. It is possible that, before method MT ends abnormally, the substrate processing system PS notifies the operator that the identifier of the specified processing module is inconsistent with the identifier of the processing module of the ring component R to be transported. If the determination in process ST4 is consistent ( Figure 8 If the result of the judgment in process ST4 is "yes", then process ST5 can be executed.

[0080] In one example, method MT may include steps ST5 and ST6. In step ST5, the ring component R is conveyed to a designated processing module among a plurality of processing modules PM1 to PM6. For example, the cover ring CR is conveyed via lift 70 to the insulator 27 of the substrate support 16 in the processing chamber 10 of the designated processing module. For example, the edge ring ER is conveyed via lift 70 to the ring support surface 20b of the substrate support 16 in the processing chamber 10 of the designated processing module.

[0081] After step ST5, the substrate W can be transported to a designated processing module (not shown). For example, the substrate W is transported onto the substrate support surface 20a in such a way that it is surrounded by the edge ring ER transported in step ST5.

[0082] Step ST6 is performed after step ST5. In step ST6, substrate processing is performed on the substrate W on the substrate support 16. The substrate processing may be plasma processing. The substrate processing may include etching and film deposition processes.

[0083] After step ST6, substrate W (not shown) can be removed from the designated processing module. For example, substrate W is transported to transport chamber ACH via transport chamber VCH.

[0084] In one embodiment, method MT may include steps ST7, ST8, ST9, and ST10. Step ST7 is performed after step ST6. In step ST7, after the ring component R is removed from the designated processing module, the ring component R is transported to the alignment device RAN. In one example, the ring component R is transported from the substrate support 16 in the processing chamber 10 of the designated processing module to the mounting stage ST of the alignment device RAN by a transport robot TR.

[0085] Step ST8 is performed after step ST7. In step ST8, similar to step ST2, the shape of the ring component R being conveyed to the aligner RAN is detected. Step ST9 is performed after step ST8. In step ST9, similar to step ST3, feature information representing the characteristics of the ring component R is extracted from its shape, and the processing module to which the ring component R should be conveyed is determined.

[0086] Step ST10 is performed after step ST9. In step ST10, it is determined whether the identifier of the processing module for the moved-out ring component R matches the identifier of the processing module for the ring component R to be transported, as determined in step ST9. If the identifier does not match in step ST10 (…), then… Figure 8 If the determination result in process ST4 is "No", method MT can end. In this case, in one example, method MT ends abnormally. Alternatively, before method MT ends abnormally, the substrate processing system PS notifies the operator that the identifier of the designated processing module is inconsistent with the identifier of the processing module of the removed ring component R. If the determination is consistent in process ST10 ( Figure 8 If the decision result in step ST4 is "yes", method MT can terminate. In this case, in one example, method MT terminated normally.

[0087] The above descriptions have illustrated various exemplary embodiments, but the embodiments are not limited to these exemplary embodiments. Various additions, omissions, substitutions, and modifications are possible. Furthermore, elements from different embodiments can be combined to form other embodiments.

[0088] The substrate processing system PS is not necessarily limited to Figure 1 As shown. For example, the number of processing modules and / or the number of transport modules in the substrate processing system can also be related to... Figure 1 The differences are as shown. For example, the number of loading ports can be 5 or more, and the number of loading ports can be arbitrary. Furthermore, the substrate processing system can also be a system in which multiple module groups, each including a processing module and a loading locking module, are connected to a loading module (so-called a loading-type system). Alternatively, the substrate processing system can also be a system in which two or more processing modules are arranged and connected around a transport module in a manner that surrounds the transport module (so-called a cluster-type system).

[0089] In one embodiment, the alignment device RAN can also be connected to the delivery chamber ACH of the loading module LM. In this case, the storage module RSM can be connected to the delivery chamber ACH.

[0090] Method MT may also exclude operations ST5 to ST10. Method MT may also exclude operations ST1 to ST6. In the case where method MT excludes operations ST1 to ST6, method MT begins in operation ST7.

[0091] Various exemplary embodiments included in this disclosure are described below in [E1] to [E14].

[0092] [E1] A substrate processing system, have: A vacuum transport module has a transport chamber capable of depressurization and a transport manipulator configured to transport a substrate via the transport chamber; The control unit is configured to control the conveying robot arm; Multiple processing modules, each having a processing chamber connected to the conveying chamber and a substrate support portion disposed within the processing chamber, are configured to perform substrate processing on the substrate support portion. An aligner having a stage and an optical sensor, the stage being configured to mount a ring component thereon, and the optical sensor being configured to detect the shape of the ring component mounted on the stage; The storage unit includes a table that stores feature information associated with the identifiers of the plurality of processing modules, the feature information representing the features of the plurality of ring components; and The determination unit extracts the feature information of the ring component from the shape of the ring component detected by the optical sensor, and determines the processing module among the plurality of processing modules that should deliver the ring component based on the identifier stored in association with the feature information, referring to the table of the storage unit.

[0093] [E2] According to the substrate processing system described in E1 The feature includes at least one of the inner diameter, outer diameter, or thickness of the ring component.

[0094] [E3] According to the substrate processing system described in E1 or E2 The feature includes the number of notches formed in the ring component.

[0095] [E4] The substrate processing system according to any one of E1 to E3 The ring component has a first notch and a second notch. The feature includes the relative positional relationship between the first notch and the second notch.

[0096] [E5] The substrate processing system according to any one of E1 to E4 The ring component is an edge ring used to surround the substrate on the substrate support or a cover ring used to surround the edge ring.

[0097] [E6] The substrate processing system according to any one of E1 to E5 The platform is configured to rotate together with the ring component mounted thereon. The optical sensor includes: A wire sensor, configured to detect the outer and inner edges of the ring component; and The light source is configured to emit light toward the line sensor.

[0098] [E7] The substrate processing system according to any one of E1 to E6 The substrate processing system also features: A locking module is installed and connected to the delivery chamber of the vacuum delivery module; and An atmospheric conveying module includes additional conveying chambers connected to the loading and locking module, and additional conveying manipulators configured to convey the substrate via these additional conveying chambers. The aligner is connected to the other delivery chambers of the atmospheric delivery module.

[0099] [E8] The substrate processing system according to any one of E1 to E6 The alignment device is connected to the delivery chamber of the vacuum delivery module.

[0100] [E9] According to the substrate processing system described in E8 The substrate processing system also includes a material storage module that is connected to the delivery chamber of the vacuum delivery module and houses the ring component therein. The aligner is configured within the storage module.

[0101] [E10] According to the substrate processing system described in E9 The feature includes the thickness of the ring component. The storage module includes other optical sensors configured to detect the thickness.

[0102] [E11] The substrate processing system according to any one of E1 to E10 The control unit is configured as follows: Before conveying the ring component to a designated processing module among the plurality of processing modules, the transport robot is controlled to transport the ring component onto the mounting stage of the aligner. The identifier of the processing module among the plurality of processing modules that should be conveyed to the mounting stage is obtained. This identifier of the processing module is determined in the determination unit by referring to the table using the characteristic information of the ring component conveyed to the mounting stage. Determine whether the identifier of the specified processing module is consistent with the identifier of the processing module to be delivered.

[0103] [E12] The substrate processing system according to any one of E1 to E11 The control unit is configured as follows: The conveying robot is controlled so that, after the ring component is removed from the processing module, it is conveyed to the mounting stage of the alignment device. The determination unit, by extracting the feature information of the ring component being transported to the mounting platform and referring to the table in the storage unit, obtains the identifier of the processing module among the plurality of processing modules that should transport the ring component being transported to the mounting platform. Determine whether the identifier of the processing module that moved out of the ring component is consistent with the identifier of the processing module that should be delivered.

[0104] [E13] A substrate processing method is performed in a substrate processing system. The substrate processing system includes: Multiple processing modules are configured to perform substrate processing; Aligner, a feature constituting the detection ring component; and The storage unit includes tables that store feature information associated with the identifiers of the plurality of processing modules, the feature information representing the characteristics of each of the plurality of ring components. The substrate processing method includes the following steps: Step (a): feeding a ring component into the aligner; Step (b), following step (a), involves detecting the shape of the ring component being conveyed to the aligner; and Step (c): After step (b), the feature information of the ring component is extracted from the detected shape of the ring component, and the processing module to which the ring component should be delivered is determined by referring to the table in the storage unit and according to the identifier stored in association with the feature information.

[0105] [E14] According to the substrate processing method described in E13 Step (a) is performed before the ring component is transported to the designated processing module. The substrate processing method further includes step (d), namely: after step (c), determining whether the identifier of the specified processing module is consistent with the identifier of the processing module to be delivered.

[0106] [E15] The substrate processing method according to E13 or E14 Step (a) is performed after the ring component is removed from the processing module. The substrate processing method further includes step (e), namely: after step (c), determining whether the identifier of the processing module that has been moved out of the ring component is consistent with the identifier of the processing module to be delivered.

[0107] The processing methods described in E13 to E15 can be performed in the substrate processing systems described in E1 to E12.

[0108] As can be seen from the above description, various embodiments of this disclosure have been described in this specification for illustrative purposes, and various modifications can be made without departing from the scope and spirit of this disclosure. Therefore, the various embodiments disclosed in this specification are not intended to be limiting, and the true scope and spirit are shown in the appended claims.

[0109] Explanation of reference numerals in the attached figures 10…processing chamber, 16…substrate support, ACH, VCH…transportation chamber, CR…covering ring, ER…edge ring, IU…determining section, L…light source, LL1, LL2…loading locking module, LM…loading module, LS…line sensor, MC…control section, MU…storage section, NT1…first notch, NT2…second notch, PM1~PM6…multiple processing modules, PS…substrate processing system, R…ring component, RAN…aligner, RSM…material storage module, S1, S2…optical sensor, ST…stage, TR…transport robot, VTM…vacuum transport module, W…substrate.

Claims

1. A substrate processing system, have: A vacuum transport module has a transport chamber capable of depressurization and a transport manipulator configured to transport a substrate via the transport chamber; The control unit is configured to control the conveying robot arm; Multiple processing modules, each having a processing chamber connected to the conveying chamber and a substrate support portion disposed within the processing chamber, are configured to perform substrate processing on the substrate support portion. An aligner having a stage and an optical sensor, the stage being configured to mount a ring component thereon, and the optical sensor being configured to detect the shape of the ring component mounted on the stage; The storage unit includes a table that stores feature information associated with the identifiers of the plurality of processing modules, the feature information representing the features of the plurality of ring components; and The determination unit extracts the feature information of the ring component from the shape of the ring component detected by the optical sensor, and determines the processing module among the plurality of processing modules that should deliver the ring component based on the identifier stored in association with the feature information, referring to the table of the storage unit.

2. The substrate processing system according to claim 1, The feature includes at least one of the inner diameter, outer diameter, and thickness of the ring component.

3. The substrate processing system according to claim 1, The feature includes the number of notches formed in the ring component.

4. The substrate processing system according to claim 1, The ring component has a first notch and a second notch. The feature includes the relative positional relationship between the first notch and the second notch.

5. The substrate processing system according to claim 1, The ring component is an edge ring used to surround the substrate on the substrate support or a cover ring used to surround the edge ring.

6. The substrate processing system according to claim 1, The platform is configured to rotate together with the ring component mounted thereon. The optical sensor includes: A wire sensor, configured to detect the outer and inner edges of the ring component; and The light source is configured to emit light toward the line sensor.

7. The substrate processing system according to any one of claims 1 to 6, The substrate processing system also features: A locking module is installed and connected to the delivery chamber of the vacuum delivery module; and An atmospheric conveying module includes additional conveying chambers connected to the loading and locking module, and additional conveying manipulators configured to convey the substrate via these additional conveying chambers. The aligner is connected to the other delivery chambers of the atmospheric delivery module.

8. The substrate processing system according to any one of claims 1 to 6, The alignment device is connected to the delivery chamber of the vacuum delivery module.

9. The substrate processing system according to claim 8, The substrate processing system also includes a storage module configured to connect to the delivery chamber of the vacuum delivery module and house the ring component therein. The aligner is configured within the storage module.

10. The substrate processing system according to claim 9, The feature includes the thickness of the ring component. The storage module includes other optical sensors configured to detect the thickness.

11. The substrate processing system according to any one of claims 1 to 6, The control unit is configured as follows: Before conveying the ring component to a designated processing module among the plurality of processing modules, the transport robot is controlled to transport the ring component onto the mounting stage of the aligner. The identifier of the processing module among the plurality of processing modules that should be conveyed to the mounting stage is obtained. This identifier of the processing module is determined in the determination unit by referring to the table using the characteristic information of the ring component conveyed to the mounting stage. Determine whether the identifier of the specified processing module is consistent with the identifier of the processing module to be delivered.

12. The substrate processing system according to any one of claims 1 to 6, The control unit is configured as follows: The conveying robot is controlled so that, after the ring component is removed from the processing module, it is conveyed to the mounting stage of the alignment device. The identifier of the processing module among the plurality of processing modules that should be conveyed to the mounting stage is obtained. This identifier of the processing module is determined in the determination unit by referring to the table using the characteristic information of the ring component conveyed to the mounting stage. Determine whether the identifier of the processing module that has been removed from the ring component matches the identifier of the processing module that should be delivered.

13. A substrate processing method, performed in a substrate processing system, The substrate processing system includes: Multiple processing modules are configured to perform substrate processing; Aligner, a feature constituting the detection ring component; and The storage unit includes tables that store feature information associated with the identifiers of the plurality of processing modules, the feature information representing the characteristics of each of the plurality of ring components. The substrate processing method includes the following steps: Step (a): feeding a ring component into the aligner; Step (b), following step (a), involves detecting the shape of the ring component being conveyed to the aligner; and Step (c): After step (b), the feature information of the ring component is extracted from the detected shape of the ring component, and the processing module to which the ring component should be delivered is determined by referring to the table in the storage unit and according to the identifier stored in association with the feature information.

14. The substrate processing method according to claim 13, The step (a) is performed before the ring component is transported to the designated processing module. The substrate processing method further includes step (d), namely: after step (c), determining whether the identifier of the specified processing module is consistent with the identifier of the processing module to be delivered.

15. The substrate processing method according to claim 13 or 14, The process (a) is performed after the ring component is removed from the processing module. The substrate processing method further includes step (e), namely: after step (c), determining whether the identifier of the processing module that has been moved out of the ring component is consistent with the identifier of the processing module to be delivered.

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