Chuck assembly, planarization processing, apparatus and method of manufacturing articles

Abstract

A chuck assembly for holding a plate includes: a plate holding member configured to hold the plate, the plate holding member including a central opening; a rigid member configured to hold the plate holding member; a first channel formed by the plate holding member; a second channel formed by the rigid member; a first fluid conduit communicating with the second channel; and a second fluid conduit at least partially disposed in the second channel and communicating with the first channel.

Description

Technical Field

[0001] This disclosure relates to substrate processing, and more particularly to chuck assemblies used for surface planarization in semiconductor manufacturing. Background Technology

[0002] Planarization techniques are applicable to the fabrication of semiconductor devices. For example, processes used in semiconductor device fabrication involve the repeated addition and removal of material relative to a substrate. This process produces stacked substrates with irregular height variations (i.e., morphology), and these height variations increase with the addition of more layers. Height variations negatively impact the ability to add more layers to the stacked substrate. Furthermore, semiconductor substrates (e.g., silicon wafers) are not always perfectly flat and may include initial surface height variations (i.e., morphology). One approach to address this problem is to planarize the substrate between individual lamination steps. Various photolithographic patterning methods benefit from patterning on flat surfaces. In ArFi laser-based lithography, planarization reduces the effects of depth-of-focus (DOF) limitations and improves critical dimension (CD) and critical dimension uniformity. In extreme ultraviolet (EUV) lithography, planarization improves feature placement and reduces the effects of DOF limitations. In nanoimprint lithography (NIL), planarization improves feature filling and CD control after pattern transfer.

[0003] Planarization techniques, sometimes referred to as inkjet-based adaptive planarization (IAP), involve distributing a variable droplet pattern of polymerizable material between a substrate and a top plate, wherein the droplet pattern varies depending on the substrate morphology. The top plate is then brought into contact with the polymerizable material, which is subsequently polymerized on the substrate, and the top plate is removed. Improvements to planarization techniques (including IAP) are expected to enhance, for example, whole-wafer processing and semiconductor device fabrication.

[0004] Current planarization methods may present difficulties in controlling the curvature of the upper plate and the diffusion of polymerizable materials near the edge of the upper plate. Furthermore, separation of the upper plate from the cured film can be challenging, particularly when the upper plate has dimensions similar to the substrate. There is a need in the art for improved control of the upper plate curvature and for improved chuck assemblies and planarization methods for separation from the cured film. More specifically, there is a need in the art for a chuck assembly capable of improving control of the upper plate curvature during the diffusion of formable materials, while simultaneously providing a consistent separation front propagation during separation of the upper plate from the cured material. Summary of the Invention

[0005] A chuck assembly for holding a plate includes: a plate holding member configured to hold a plate, the plate holding member including a central opening; a rigid member configured to hold the plate holding member; a first channel formed by the plate holding member; a second channel formed by the rigid member; a first fluid conduit communicating with the second channel; and a second fluid conduit at least partially disposed within the second channel and communicating with the first channel.

[0006] A planarization system includes: a chuck assembly for holding a plate, the chuck assembly including: a plate holding member configured to hold the plate, the plate holding member including a central opening; a rigid member configured to hold the plate holding member; a first channel formed by the plate holding member; a second channel formed by the rigid member; a first fluid conduit communicating with the second channel; and a second fluid conduit at least partially disposed within the second channel and communicating with the first channel; a substrate chuck configured to hold a substrate; a fluid dispenser configured to dispense a moldable material onto the substrate; a positioning system configured to contact the moldable material with the plate; and a curing system configured to cure the moldable material under the plate to form a cured moldable material on the substrate.

[0007] A method of manufacturing an article includes: dispensing a moldable material onto a substrate; holding the plate with a plate chuck assembly, the plate chuck assembly including: a plate holding member configured to hold the plate, the plate holding member including a central opening; a rigid member configured to hold the plate holding member; a first channel formed by the plate holding member; a second channel formed by the rigid member; a first fluid conduit communicating with the second channel; and a second fluid conduit at least partially disposed within the second channel and communicating with the first channel; contacting the plate with the moldable material dispensed on the substrate; curing the moldable material with a curing source; separating the plate from the cured moldable material; and processing the cured moldable material to form an article.

[0008] These and other objects, features, and advantages of this disclosure will become apparent from the following detailed description of exemplary embodiments of the disclosure, taken in conjunction with the accompanying drawings and claims. Attached Figure Description

[0009] To gain a detailed understanding of the features and advantages of this disclosure, embodiments of this disclosure can be described in more detail with reference to the accompanying drawings. However, it should be noted that the drawings are merely illustrative of typical embodiments of this disclosure and should not be considered as limiting the scope of this disclosure, as this disclosure allows for other equally effective embodiments.

[0010] Figure 1 This is a schematic diagram illustrating an exemplary flattening system according to one aspect of this disclosure.

[0011] Figures 2A to 2CA schematic cross-section of an exemplary planarization process according to one aspect of this disclosure is shown.

[0012] Figure 3A This is a bottom view of an exemplary chuck assembly according to one aspect of this disclosure.

[0013] Figure 3B yes Figure 3A A top view of an exemplary chuck component.

[0014] Figure 4A It is along Figure 3B A cross-sectional view of an exemplary chuck assembly taken from line 4A-4A.

[0015] Figure 4B yes Figure 4A Enlarged view of part 4B.

[0016] Figure 4C yes Figure 4A A three-dimensional view of part 4B.

[0017] Figure 4D yes Figure 4B An enlarged schematic diagram of the 4D part.

[0018] Figure 5A It is along Figure 3A A cross-sectional view of an exemplary chuck assembly taken from line 5A-5A.

[0019] Figure 5B yes Figure 5A Enlarged view of section 5B.

[0020] Figure 5C yes Figure 5A A three-dimensional view of part 5B.

[0021] Figure 5D This is an exploded perspective view of an exemplary chuck component.

[0022] Figure 6A It is along Figure 3B A cross-sectional view of an exemplary chuck assembly taken from lines 6A-6A.

[0023] Figure 6B yes Figure 6A Enlarged view of part 6B.

[0024] Figure 6C yes Figure 6A A three-dimensional view of part 6B.

[0025] Figure 7 This is an exploded bottom view of an exemplary chuck component.

[0026] Figure 8A yes Figure 4A Enlarged view of section 8A.

[0027] Figure 8B yes Figure 4A A three-dimensional view of section 8A.

[0028] Figure 9 A flowchart of an exemplary flattening method according to one aspect of this disclosure is shown.

[0029] Figures 10A to 10N It shows Figure 9 A series of schematic cross sections of the planarization method.

[0030] Although the subject matter disclosure will now be described in detail with reference to the accompanying drawings, this is done in connection with the exemplary embodiments illustrated. It is intended that changes and modifications can be made to the described exemplary embodiments without departing from the true scope and spirit of the subject matter disclosure as defined by the appended claims. Detailed Implementation

[0031] Flattening system

[0032] Figure 1 An exemplary system for planarization according to one aspect of the present disclosure is shown. The planarization system 100 is used to planarize a film on a substrate 102. The substrate 102 may be coupled to a substrate chuck 104. The substrate chuck 104 may be, but is not limited to, a vacuum chuck, a pin chuck, a slot chuck, an electrostatic chuck, an electromagnetic chuck, and / or the like.

[0033] The substrate 102 and substrate chuck 104 may be further supported by a substrate positioning stage 106. The substrate positioning stage 106 may provide translational and / or rotational motion along one or more of the x-axis, y-axis, z-axis, θ-axis, ψ-axis, and φ-axis. The substrate positioning stage 106, substrate 102, and substrate chuck 104 may also be located on a base (not shown). The substrate positioning stage may be part of a positioning system.

[0034] An upper plate 108 (also referred to as a plate) is spaced apart from a substrate 102, and the upper plate has a working surface 112 facing the substrate 102. The upper plate 108 may be formed of materials including, but not limited to, fused silica, quartz, silicon, organic polymers, siloxane polymers, borosilicate glass, fluorocarbon polymers, metals, hardened sapphire, ceramics, glass, and / or the like. In one embodiment, the upper plate is translucent to ultraviolet light. The working surface 112 has a substantially the same area size as or slightly smaller than the surface of the substrate 102.

[0035] The upper plate 108 can be coupled to or held by the upper plate chuck assembly 118, which will be discussed in more detail below. The upper plate chuck assembly 118 can be coupled to the planarization head 120, which is part of the positioning system. The planarization head 120 can be movably coupled to the bridging member. The planarization head 120 may include one or more actuators, such as voice coil motors, piezoelectric motors, linear motors, nut and screw motors, etc., configured to move the upper plate chuck assembly 118 relative to the base plate 102 at least in the z-axis direction and possibly in other directions (e.g., x-axis, y-axis, θ-axis, ψ-axis, and φ-axis).

[0036] The planarization system 100 may also include a fluid dispenser 122. The fluid dispenser 122 may also be movably coupled to a bridging member. In one embodiment, the fluid dispenser 122 and the planarization head 120 share one or more of all positioning components. In an alternative embodiment, the fluid dispenser 122 and the planarization head move independently of each other. The fluid dispenser 122 may be used to deposit droplets of liquid moldable material 124 (e.g., a photocurable polymerizable material) onto a substrate 102, the volume of the deposited material varying over the area of ​​the substrate 102 at least in part based on the topographic profile of the substrate. Different fluid dispensers 122 may use different techniques to dispense the moldable material 124. When the moldable material 124 is jettable, an inkjet dispenser may be used to dispense the moldable material. For example, thermal inkjet, microelectromechanical system (MEMS) based inkjet, valve inkjet, and piezoelectric inkjet are common techniques for dispensing jettable liquids.

[0037] The planarization system 100 may further include a curing system comprising a radiation source 126 that directs photochemical energy, such as ultraviolet radiation, along an exposure path 128. The planarization head 120 and substrate positioning stage 106 may be configured to position an upper plate 108 and a substrate 102 overlapping the exposure path 128. After the upper plate 108 has contacted the formable material 124, the radiation source 126 delivers photochemical energy along the exposure path 128. Figure 1 The exposure path 128 is shown when the upper plate 108 is not in contact with the formable material 124. This is done for illustrative purposes so that the relative positions of the various components can be easily identified. Those skilled in the art will understand that the exposure path 128 does not substantially change when the upper plate 108 is in contact with the formable material 124.

[0038] The planarization system 100 may also include a camera 136 positioned to observe the diffusion of the formable material 124 as the upper plate 108 contacts the formable material 124 during the planarization process. Figure 1 The optical axis 138 of the imaging field of the field camera is shown. (Example) Figure 1As shown, the planarization system 100 may include one or more optical components (dial mirror, beam combiner, prism, lens, mirror, etc.) that combine photochemical radiation with light to be detected by the camera 136. The camera 136 may include one or more of a CCD, sensor array, linear array camera, and photodetector, configured to collect light of a specific wavelength contrasting an area below the display upper plate 108 that is in contact with the moldable material 124 with an area below the upper plate 108 that is not in contact with the moldable material 124. The camera 136 may be configured to provide an image of the moldable material 124 diffusing below the upper plate 108, and / or an image of the upper plate 108 separating from the cured moldable material 124. The camera 136 may also be configured to measure interference fringes that vary with the diffusion of the moldable material 124 between the working surface 112 and the substrate surface, and with the distance between the working surface 112 and the substrate surface.

[0039] The planarization system 100 can be regulated, controlled, and / or directed by one or more processors 140 (controllers) communicating with one or more components and / or subsystems, such as substrate chuck 104, substrate positioning stage 106, upper board chuck assembly 118, planarization head 120, fluid dispenser 122, radiation source 126, and / or camera 136. The processor 140 can operate based on instructions in a computer-readable program stored in non-transitory computer memory 142. The processor 140 can be one or more of a CPU, MPU, GPU, ASIC, FPGA, DSP, and general-purpose computer. The processor 140 can be a dedicated controller or a general-purpose computing device adapted to serve as a controller. Examples of non-transitory computer-readable memory include, but are not limited to, RAM, ROM, CD, DVD, Blu-ray disc, hard disk, network attached storage (NAS), intranet-connected non-transitory computer-readable storage devices, and internet-connected non-transitory computer-readable storage devices. All method steps described herein can be performed by the processor 140.

[0040] In operation, the planarization head 120, the substrate positioning stage 106, or both, alter the distance between the upper plate 108 and the substrate 102 to define a desired space (a three-dimensional bounded physical extent) for filling the formable material 124. For example, the planarization head 120 may move toward the substrate and apply force to the upper plate 108 such that the upper plate contacts and diffuses droplets of the formable material 124, as described in further detail herein.

[0041] Flattening

[0042] Flattening process includes Figures 2A-2C The steps are illustrated schematically. For example... Figure 2AAs shown, the formable material 124 is dispensed onto the substrate 102 in the form of droplets. As previously described, the substrate surface has a certain morphology, which can be known based on previous processing operations or measured using a profilometer, AFM, SEM, or an optical surface profilometer based on optical interference effects (such as the Zygo NewView 8200). The local bulk density of the deposited formable material 124 varies depending on the substrate morphology. The upper plate 108 is then positioned to contact the formable material 124.

[0043] Figure 2B The diagram illustrates the post-contact steps after the upper plate 108 has fully contacted the moldable material 124 but before the polymerization process begins. As the upper plate 108 contacts the moldable material 124, droplets coalesce to form a moldable material film 144 that fills the space between the upper plate 108 and the substrate 102. Preferably, the filling process occurs uniformly, without any air or bubbles being trapped between the upper plate 108 and the substrate 102, to minimize unfilled defects. The polymerization process or curing of the moldable material 124 can be initiated using photochemical radiation (e.g., ultraviolet radiation). For example, Figure 1 The radiation source 126 can provide photochemical radiation to cure, solidify, and / or crosslink the formable material film 144, thereby defining a cured planarization layer 146 on the substrate 102. Alternatively, curing of the formable material film 144 can be initiated by using heat, pressure, chemical reactions, other types of radiation, or any combination thereof. Once the cured planarization layer 146 has been formed, the upper plate 108 can be separated from it. Figure 2C The planarization layer 146 after curing is shown on the substrate 102 after separation from the upper plate 108. Further known steps and processes for device (article) manufacturing can then be performed on the substrate and the cured layer, including, for example, patterning, curing, oxidation, layer formation, deposition, doping, planarization, etching, formable material removal, slicing, bonding, encapsulation, etc. The substrate can be processed to produce multiple articles (devices).

[0044] Planarization material is diffused, filled, and cured between the top plate and the substrate.

[0045] One approach to minimize air or bubble trapping between the upper plate 108 and the substrate 102 as the formable material 124 droplets diffuse, merge, and fill the gap between the upper plate 108 and the substrate 102 is to position the upper plate 108 to make initial contact with the formable material 124 at the center of the substrate 102, followed by further radial contact in a center-to-periphery manner. This requires the upper plate 108 or the substrate 102, or both, to be deflected or bent to create curvature in the upper plate 108 relative to the substrate 102. The curvature of the upper plate 108 helps to expel air or bubbles as the formable material 124 diffuses. Such an upper plate 108 profile can be obtained, for example, by applying back pressure to an inner region of the upper plate. However, in doing so, a peripheral retaining region is still required to hold the upper plate 108 on the upper plate chuck assembly 118. Given that the upper plate 108 typically has the same or similar area dimensions as the substrate 102, if the peripheral edges of both the upper plate 108 and the substrate 102 are flattened during the diffusion and coalescence of the formable material 124 droplets, no upper plate curvature profile will be available in the flattened area. This will impair droplet diffusion and coalescence, and consequently lead to unfilled defects in this area. To minimize unfilled defects, the upper plate curvature needs to be controlled across the entire upper plate diameter during the fluid diffusion process. Furthermore, once the diffusion and filling of the formable material is complete, the resulting stack of the upper plate chuck, the clamped upper plate, the formable material, the substrate, and the substrate chuck can become an over-constrained system. This will result in a non-uniform planarization profile in the resulting planarization film layer. That is, in such an over-constrained system, all flatness errors or deviations from the upper plate chuck (including front and rear surface flatness) will be transmitted to the upper plate and affect the uniformity of the planarization film layer. Additionally, when separating the upper plate from the cured film, it is desirable to achieve a consistent circumferential separation front between the upper plate and the cured film.

[0046] To solve the above problems, the following is provided: Figures 3A to 8B The upper plate chuck assembly 118 shown provides: 1) improved diffusion of the formable material when the upper plate comes into contact with the formable material and 2) improved separation front propagation when the upper plate is separated from the cured material.

[0047] Figure 3A A bottom view of the upper plate chuck assembly 118 is shown. Figure 3B A top view of the upper plate chuck assembly 118 is shown. Figure 4A It shows along Figure 3B The cross section taken from line 4A-4A. Figure 4B It shows Figure 4A The enlarged section 4B. Figure 4C It shows Figure 4A A three-dimensional view of the enlarged part 4B. Figure 4D It shows Figure 4B An enlarged schematic diagram of the 4D part.

[0048] The upper plate chuck assembly 118 generally includes a rigid member 188 (also referred to as a support ring), a plate retaining member 130 (also referred to herein as a member) connected to the rigid member 188, and a light-transmitting member 150.

[0049] The rigid member 188 is preferably an annular shape with a central opening. The rigid member 188 may be made of a material that is opaque to ultraviolet light or a material that is transparent to ultraviolet light. The rigid member 188 may be made of plastic (e.g., acrylic), glass (e.g., fused silica, borosilicate), metal (e.g., aluminum, stainless steel) or ceramic (e.g., zirconium oxide, sapphire, aluminum oxide).

[0050] Similarly, the plate holding member 130 is preferably an annular shape with a central opening 132. The plate holding member 130 may be made of a transparent material that allows ultraviolet light to pass through, or it may not be made of a transparent material that allows ultraviolet light to pass through. That is, the plate holding member 130 may be made of a material that is opaque to ultraviolet light, or it may not be made of a material that is opaque to ultraviolet light. The plate holding member 130 may be made of polymers (e.g., acrylic, fluororubber), glass (e.g., fused silica, borosilicate), metals (e.g., aluminum, stainless steel), or ceramics (e.g., zirconium oxide, sapphire, alumina). The plate holding member 130 may be configured such that the plate holding member 130 is generally flexible. However, as discussed in more detail below, when held against a rigid member 188 using a vacuum, portions of the plate holding member 130 may become effectively rigid. The portions of the plate holding member 130 not held against the rigid member 188 can be considered flexible portions. The flexible portions of the plate holding member 130 may vary, as discussed below. However, although the active flexible portion and active rigid portion of the plate retaining member 130 can vary, the composition of the plate retaining member 130 is uniform, i.e., the same throughout the entire plate retaining member. In an exemplary embodiment, the plate retaining member 130 may have a uniform thickness of 0.2 to 5 mm or 0.3 to 2 mm. That is, all portions of the plate retaining member 130 (whether effectively flexible or effectively rigid) may have the same thickness. A thicker material with a low modulus of elasticity will be similarly flexible to a thinner material with a high modulus of elasticity. The plate retaining member 130 may be made of a material having a modulus of elasticity (Young's modulus) of 0.1 to 210 GPa, 50 to 150 GPa, or 60 to 100 GPa. In an exemplary embodiment, the modulus of elasticity may be 70 GPa.

[0051] The plate retaining member 130 may also have a Pa·m of 0.01 to 5 Pa. 3 0.1 to 4 Pa·m 3 0.5 to 3 Pa·m 3Or 1.0 to 2 Pa·m 3 The bending stiffness. Furthermore, the ratio of the bending stiffness of the plate retaining member to the bending stiffness of the upper plate is 0.01:1 to 5:1, 0.05:1 to 4:1, 0.1:1 to 3:1, or 0.5:1 to 1:1, preferably less than 1:1. The bending stiffness D is defined by the following formula (1), where: H is the thickness of the upper plate 108 or the plate retaining member 130; ν is the Poisson's ratio of the material of the upper plate 108 or the plate retaining member 130; and E is the Young's modulus of the material of the upper plate 108 or the plate retaining member 130. For example, the bending stiffness of the upper plate may be 2.12, while the bending stiffness of the plate retaining member 130 may be 0.29, 0.68, 0.82, or 2.30 Pa·m. 3 Furthermore, the ratio of the bending stiffness of the plate retaining member 130 to the bending stiffness of the upper plate 108 can be: 0.14:1; 0.32:1; 0.39:1; or 1.09:1.

[0052]

[0053] The plate retaining member 130 includes a first channel 148 ( Figure 4B , Figure 4C , Figure 4D , Figure 5B , Figure 5C , Figure 6B , Figure 6C The first channel 148 is configured to hold a portion of the upper plate 108 to the underside of the plate retaining member 130. The first channel 148 may be an annular channel concentrically surrounding the central opening 132. The first channel 148 may be positioned adjacent to the inner edge 133 of the plate retaining member 130. The first channel 148 may be formed as a recess within the thickness of the plate retaining member 130. The inner edge 133 of the member is also a sidewall of the plate retaining member 130 extending from the underside surface of the plate retaining member 130.

[0054] The light-transmitting member 150 covers the central opening 132 of the retaining member 130. In one exemplary embodiment, the light-transmitting member 150 is preferably transparent to ultraviolet light and has a high ultraviolet light transmittance. That is, the material composition of the light-transmitting member 150 can be selected such that ultraviolet light used to cure the moldable material passes through the light-transmitting member 150. In one exemplary embodiment, when the light-transmitting member 150 transmits ultraviolet light, the light-transmitting member can be made of a material that transmits more than 80% of light with a wavelength of 310-700 nm (i.e., ultraviolet and visible light), such as sapphire or fused silica. In another exemplary embodiment, the light-transmitting member does not necessarily need to be transparent to ultraviolet light. When the light-transmitting member does not need to be transparent to ultraviolet light, the light-transmitting member can be made of a material that transmits more than 80% of light with a wavelength of 400-700 nm (i.e., visible light), such as glass or borosilicate. That is, the light-transmitting member 150 should still transmit visible light even when ultraviolet light transmission is not required. For clarity, the light-transmitting member 150 is shown from... Figures 4A to 6C , Figure 8A and Figure 8B Omitted in the middle, but Figure 3A , Figure 3B and Figure 7 It is shown in the diagram, and schematically illustrated in the diagram. Figures 10A to 10N In the exemplary embodiment shown, the light-transmitting member (if shown) abuts against the innermost step 137 of the rigid member 188. The light-transmitting member 150 can be one of the following: magnesium fluoride (MgF2) window; lithium fluoride (LiF) window; barium fluoride (BaF2); calcium fluoride (CaF2) window; fused silica window; polycrystalline CVD diamond window; sodium chloride (NaCl) window; potassium bromide (Br) window; sapphire window; zinc sulfide (ZnS) window; zinc selenide (ZnSe) window; thallium bromide (TlBr) window. x I 1-x The light-transmitting member 150 may be made of: gallium arsenide (GaAs) window; cadmium telluride (CdTe) window; silicon (Si) window; diamond-like carbon (DLC) coated silicon window; germanium (Ge) window; BK7 window; plastic window; metal window; ceramic window; or glass window. The light-transmitting member 150 may have one or more coatings, such as an anti-reflective coating or a protective coating. In an alternative embodiment, the light-transmitting member 150 may be optimized to transmit infrared light.

[0055] like Figure 4B , Figure 4C and Figure 4D As best shown, the upper plate chuck assembly 118 may include a second channel 152 defined by a rigid member 188. More specifically, the second channel 152 includes a first region 152a and a second region 152b, wherein the first region 152a and the second region 152b are continuous. Because Figure 4B and Figure 4C Draw to scale, therefore in Figure 4B and Figure 4C The second region 152b is not visible. However, Figure 4D It shows Figure 4B The schematic diagram of the 4D section shows an exaggerated depiction of the dimensions of the first region 152a and the second region 152b, making the second region 152b more clearly visible. (See diagram for example.) Figure 4D As seen, the first region 152a is defined by two opposing concentric inner sidewalls 153a and 153b of the rigid member 188. The first sidewall 153a (i.e., the more radially outward sidewall) extends further downward relative to the first surface 153c of the first region 152a compared to the second sidewall 153b (i.e., the more radially outward sidewall). The second region 152b is defined by the intersection of the edge of the second sidewall 153b with the second surface 153e, a third sidewall 153d, and the second surface 153e. The third sidewall 153d is positioned more radially outward than the second sidewall 153b. The second surface 153e extends radially from the second sidewall 153b to the third sidewall 153d. The third sidewall 153d extends downward and terminates at the same relative height as the first sidewall 153a. The second region 152b has the same height as the third sidewall 153d.

[0056] Height H1 is the vertical distance from the first surface 153c, which serves as a reference point, to the bottom of the second sidewall 153b (i.e., the distance from the first surface 153c to the second surface 153e). Height H2 is the vertical distance from the first surface 153c to the bottom of the first sidewall 153a, which is also the distance from the first surface 153c to the bottom of the third sidewall 153d. Figure 4D As seen, height H2 is greater than height H1. Height H2 can be 6.5 mm, and distance from H1 can be 6.4 mm. The heights of H1 and H2 can be between 2 and 20 mm. Height H3 is the distance in the vertical direction from the second surface 153e to the bottom of the third sidewall 153d. Height H3 is selected based on the material and mechanical properties of the upper plate and the mechanical and material properties of the flexible part 134. Height H3 can be selected based on finite element simulations of the upper plate and the flexible part during separation. If height H3 is too large, the flexible part will bend too much, and the first channel will not be able to maintain a vacuum with the upper plate, causing the upper plate to detach from the bent chuck and potentially be damaged. If height H3 is too small, the separation front will not propagate around the circumference of the substrate. In an exemplary embodiment, height H3 can be from 5 μm to 100 μm. Therefore, in an exemplary embodiment, the first sidewall 153a can extend 5 μm to 100 μm beyond the second sidewall 153b. H2 is equal to H1 plus H3. Therefore, as Figure 4DAs seen, the distance difference between H1, H2, and H3 creates a step from the first region 152a to the second region 152b. This step structure provides advantage in the step of separating the upper plate from the cured layer, as described below. Figure 4D As can also be seen, the second channel 152, when in a closed state, can also be considered to be partially defined by the upper surface of the plate retaining member 130. Furthermore, the first sidewall 153a forms the innermost rigid member boss of the rigid member 188, which overlaps with the innermost plate retaining member boss formed by the inner edge / sidewall 133 of the plate retaining member 130.

[0057] The upper plate chuck assembly 118 also includes a first fluid conduit 154 communicating with the second channel 152 for pressurizing the second channel 152 and the chamber 170 described below. The upper plate chuck assembly 118 includes a second fluid conduit 166 communicating with the first channel 148, such that the upper plate can be held by the plate holding member 130 by reducing the pressure in the first channel 148. One way to reduce the pressure in the first channel 148 is to provide a vacuum via the second fluid conduit 166 and the channel 148. The second conduit 166 may include a connector 166a and a tube 166b. The second conduit 166 is best shown in… Figure 4B and Figure 4C In the middle. The second conduit 166 includes a first plate within the connector 166a maintaining a vacuum passage 172, its end being a connector through-hole 186. The connector through-hole 186 is located within the bottom portion of the connector 166a. (As shown) Figure 4B Ideally, the bottom of connector 166a does not extend beyond the range of the second channel 152, and more specifically, it lies within the range of the first region 152a. In one embodiment, the bottom of connector 166a does not extend beyond the second surface 153e. In other words, connector 166a does not extend beyond the first sidewall 153a of rigid member 188. This is true regardless of the usage state of plate retainer 130. That is, connector 166a will not move relative to rigid member 188 regardless of whether plate retainer 130 is fully retracted or fully extended. The different states of plate retainer 130 are discussed in more detail below. Connector 166a can be sealed within rigid member 188 via sealing member 184. Sealing member can be a gasket or O-ring, which prevents air leakage when the pressure in second channel 152 is changed.

[0058] The connector through-hole 186 leads into the pipe 166b. Pipe 166b is best shown in... Figures 5A to 5D middle. Figure 5A It is along Figure 3A A sectional view of the upper plate chuck assembly 118 taken from line 5A-5A. Figure 5B yes Figure 5A Enlarged view of section 5B. Figure 5C yes Figure 5AA three-dimensional view of part 5B. Figure 5D This is an exploded perspective view of the upper plate chuck assembly 118. The second conduit 166 may include components that collectively allow the first channel 148 to apply a vacuum to the upper plate 108. In the exemplary embodiment shown, the second conduit 166 includes a port 168 connectable to a vacuum source (not shown). For example, the port 168 may be connected to the vacuum source via a tube (not shown). The tube 166b may be a flexible tube having a first end 180 connected to the bottom end of a connector 166a and a second end 182 connected to a second connector attached to a channel through-hole 187 formed through the plate retaining member 130 and entering the first channel 148. That is, by connecting to both the connector 166a and the channel through-hole 187, the tube 166b directs vacuum suction downward into the first channel 148 via the channel through-hole 187. Therefore, when the connector 166a is connected to the vacuum source, a vacuum can be applied to the first channel 148 to provide suction capable of engaging the upper plate 108 in the region below the first channel 148. Similarly, positive pressure can be applied to the first channel 148 in the same manner.

[0059] One or more additional conduits may be implemented with the same structure as the second conduit 166 described above, wherein each conduit communicates with the same first channel 148 and / or with a corresponding additional channel (not shown) formed in the plate retaining member 130. One or more additional channels may be arranged concentrically around the first channel 148. That is, one or more additional channels may also be arranged concentrically around the central opening 132, but may be located at a greater radial distance from the inner edge of the plate retaining member 130 compared to the first channel 148 shown. In one embodiment, the inner diameter of the plate retaining member 130 may be smaller and / or the first channel 148 may have an additional boss. Figure 4A As best shown, an additional conduit 167 having the same structure as the second conduit 166 can be located at a position radially opposite to the second conduit 166. The additional conduit communicating with the first channel 148 helps to fully retain the upper plate to the plate retaining member 130. On the other hand, the additional channels corresponding to the first channel 148 at various concentric positions allow the same upper plate chuck assembly 118 to be used with upper plates of various different sizes.

[0060] In another embodiment, the first channel 148 and the second conduit 166 can be replaced with other mechanisms for connecting the plate retaining member 130 to the upper plate. For example, instead of a channel / vacuum configuration, electrodes for applying electrostatic forces can be included. Another option is mechanical locking, wherein a mechanical structure on the underside of the plate retaining member 130 can engage with the upper plate.

[0061] As described above, the first fluid conduit 154 communicates with the second channel 152 to pressurize the second channel 152 and the chamber 170. The first fluid conduit 154 may include various components that collectively allow the second channel 152 to be selectively subjected to positive or negative pressure. Figures 6A to 6C The first fluid conduit 154 is best shown. Figure 6A It is along Figure 3B A sectional view of the upper plate chuck assembly 118 taken from line 6A-6A. Figure 6B yes Figure 6A Enlarged view of part 6B. Figure 6C yes Figure 6A A perspective view of part 6B. In the example shown, the first fluid conduit 154 includes a first port 156 connectable to a pressurization source (not shown). For example, the first port 156 may be connected to the pressurization source via a tube (not shown). The first port 156 includes a first chamber pressure control passage 158 communicating with a second chamber pressure control passage 160, wherein a first end 162 of the second chamber pressure control passage 160 is connected to the first chamber pressure control passage 158, and a second end 164 of the second chamber pressure control passage 160 is connected to a second channel 152. More specifically, the second end 164 may extend into a first region 152a of the second channel 152. Therefore, when the first port 156 is connected to the pressurization source, positive pressure can be applied via the first fluid conduit 154 to pressurize the second channel 152 (including both the first region 152a and the second region 152b).

[0062] One or more additional fluid conduits may be implemented having the same structure as the first fluid conduit 154 described above. For example, as Figure 6A Ideally, an additional fluid conduit 155 having the same structure as the first fluid conduit 154 can be located radially opposite to the first fluid conduit 154. One or more additional fluid conduits corresponding to the first fluid conduit 154 can perform the same function by being inserted into the second channel 152.

[0063] Figure 7 An exploded view is shown, illustrating that the rigid member 188 is separated from the plate retaining member 130 and the light-transmitting member 150. (As shown...) Figure 7As best viewed from the center, the rigid member 188 may generally comprise a circular body 190 defining an open central region 192. The outer periphery of the rigid member 188 may be uniform. The rigid member 188 holds the light-transmitting member 150 such that the light-transmitting member 150 overlaps with the open central region 192. For example, the light-transmitting member 150 may be secured to the rigid member 188 at the innermost step 137 using an adhesive. In this way, when the light-transmitting member 150 is positioned / secured to overlap with the central region 192, a chamber 170 is defined by the lower surface of the light-transmitting member and the inner surface of the rigid member 188. The second channel 152 is in fluid communication with the chamber 170 when the flexible portion of the plate retaining member 130 located below the second channel 152 extends away from the rigid member 188.

[0064] The edge of the plate retaining member 130 can be attached to the lower surface of the rigid member 188 using connecting members such as screws, nuts / bolts, or adhesives. The connecting member can preferably be positioned adjacent to the outer edge of the rigid member 188 and adjacent to the outer edge of the plate retaining member 130. When the connecting member is a screw, it preferably passes through the plate retaining member 130 adjacent to its outer edge and enters the rigid member 188 adjacent to its outer edge, for example, through a plurality of receiving holes 189. When the connecting member is an adhesive, it is preferably positioned between the outer edge of the plate retaining member 130 adjacent to its outer edge and the outer edge of the rigid member 188 adjacent to its outer edge. In this way, the upper surface of the plate retaining member 130 contacts and is secured to the lower surface of the circular body of the rigid member 188 adjacent to its outer edge. As part of a planarization process, additional surface areas of the plate retaining member 130 can be selectively attached to the rigid member 188. The following discussion, in more detail, discusses how to selectively attach additional surface areas of the plate retainer 130 to the rigid member 188.

[0065] like Figures 6A to 6C As shown, the first catheter 154 and / or a portion of an additional catheter performing the same function as the first catheter 154 may be contained within the rigid member 188; and, as Figures 4A to 5CAs shown, a portion of the second conduit 166 and / or an additional conduit performing the same function as the second conduit 166 may be contained within the rigid member 188. More specifically, a portion of the connector 166a and a portion of the tube 166b are located within the rigid member 188. Notably, the second channel 152 within the rigid member 188 provides two functions. First, the second channel 152 holds a portion of the connector 166a and a portion of the tube 166b. Second, the first conduit 154 extends into the second channel 152 to control the pressure within the second channel 152 to extend or retract the plate retaining member 130. Thus, the second channel 152 performs the function of retaining a specific structure and also functions as a pressure control space acting on the plate retaining member 130.

[0066] The upper plate chuck assembly 118 may also include an additional fluid conduit communicating with an additional channel for selectively securing portions of the plate retaining member 130 to the lower surface of the rigid member 188. While the aforementioned fluid conduit communicates with either the first channel 148 or the second channel 152 of the plate retaining member 130, the fluid conduit selectively securing portions of the plate retaining member 130 to the lower surface of the rigid member 188 communicates with an additional annular chamber in the rigid member 188 that is open on the lower surface of the rigid member 188.

[0067] Figure 8A and Figure 8B An example of a third fluid conduit 200 for selectively securing the plate retaining member 130 to the rigid member 188 is shown. Figure 8A It shows Figure 4A The magnified section 8A. Figure 8B It shows Figure 4A A side perspective view of the enlarged portion 8A. The third fluid conduit 200 may include components for jointly applying a vacuum suction force to the upper surface of the plate holding member 130 to further secure the plate holding member 130 to the lower surface of the rigid member 188. In the example embodiment shown, the third fluid conduit 200 includes a first port 204 connectable to a vacuum source (not shown). For example, the first port 204 of the third fluid conduit 200 may be connected to the vacuum source via a tube (not shown). Figure 8A and Figure 8B As best viewed, the third fluid conduit 200 includes a first component vacuum holding passage 206 connected to the second component vacuum holding passage 208, and the second component vacuum holding passage 208 is connected to the third component vacuum holding passage 210. Figure 8A and Figure 8BIdeally, the first component vacuum holding passage 206 can be vertically oriented to guide the vacuum downwards, the second component vacuum holding passage 208 of the third fluid conduit 200 can be horizontally oriented to guide the vacuum radially, and the third component vacuum holding passage 210 of the third fluid conduit 200 can be vertically oriented to guide the vacuum downwards. The third component vacuum holding passage 210 of the third fluid conduit 200 can be connected to a third channel 212, which has an open end facing downwards toward the plate holding member 130. Therefore, when the first port 204 of the third fluid conduit 200 is connected to a vacuum source and the upper surface of the plate holding member 130 contacts the lower surface of the rigid member 188, a vacuum can be applied to the third channel 212 of the rigid member 188 via the third fluid conduit 200 to secure the plate holding member 130 to the rigid member 188. The third channel 212 can be an annular channel located radially outside the second channel 152.

[0068] The same principle by which the third fluid conduit 200 controls the pressure in the third channel 212 can be applied to additional channels in the rigid member 188. For example, as Figure 4B , Figure 4C , Figure 5B , Figure 5C , Figure 6B , Figure 6C , Figure 8A , Figure 8B As shown, a fourth channel 214 may be present in the rigid member 188. The fourth channel 214 is also an annular channel and is located radially outside the third channel 212. A corresponding fourth fluid conduit 216 is also included, which has the same structure and function as the third fluid conduit 200. The only difference between the fourth fluid conduit 216 and the third fluid conduit 200 is that the fourth fluid conduit provides fluid communication between the vacuum source and the fourth channel 214. Since each channel is located at a different radial position, each channel applies suction to a different annular segment of the upper surface of the plate holding member 130. Furthermore, since each channel communicates with the vacuum source via a different flow path, a vacuum can be applied to each channel independently. For example, if only the vacuum is applied to the third channel 212, the suction will only be applied to the portion of the upper surface of the plate holding member 130 that contacts the third channel 212. However, if a vacuum is applied to both the third channel 212 and the fourth channel 214 simultaneously, the suction force will be applied to a wider area of ​​the upper surface of the plate holding member 130, that is, the portion of the upper surface of the plate holding member 130 that contacts the third channel 212 and the portion of the upper surface of the plate holding member 130 that contacts the fourth channel 214.

[0069] Although the illustrated exemplary embodiment shows two channels in addition to the second channel 152, more channels and corresponding fluid conduits may be included to provide finer control over how much of the component is drawn against the rigid member 188 at a given time during the planarization process. The number of additional channels may be selected to provide optimal control over how much surface area of ​​the plate retaining member 130 is drawn beneath the rigid member 188. For example, the number of channels may be from 1 to 10, from 3 to 7, or from 4 to 6. Each channel may have varying dimensions. The ratio of the cross-sectional area of ​​one channel to the cross-sectional area of ​​another channel may be from 10:1 to 1:1, from 8:1 to 4:1, or from 5:1 to 3:1. Some channels may have the same dimensions and shape. Channels may have rectangular or square cross-sectional shapes. The rigid member 188 may also include a boss 218 between each adjacent annular chamber. The boss 218 is the portion of the rigid member 188 that contacts the upper surface of the plate retaining member 130.

[0070] Now refer to Figure 9 and Figures 10A to 10N The operation of the upper plate chuck assembly 118 as part of the planarization process is described. Figure 9 A flowchart of a planarization method 900 is shown. The method begins at step S902, in which a substrate 102, on which droplets of moldable material 124 are dispensed, is brought below an upper plate 108 connected to a plate holding member 130 of an upper plate chuck assembly 118. Thus, droplets of moldable material are dispensed onto the substrate in the manner described above before step S902 is performed. Figure 10A The state of step S902 is shown. Figure 10A This is a schematic cross-section of the upper plate chuck assembly 118.

[0071] Additionally, prior to step S902, the upper plate chuck assembly 118 is prepared by applying vacuum suction to the first channel 148 of the plate holding member 130 and bringing the first channel 148 into contact with the upper surface of the upper plate 108, thereby connecting the upper plate 108 to the plate holding member 130. In cases where multiple vacuum channels (e.g., two) exist in the flexible portion 134 of the plate holding member 130, in one embodiment, fewer than all (e.g., only one) of the vacuum channels will have the vacuum applied during step S902. For example, in one embodiment, only the first channel, radially outermost relative to the central opening 132, may have an applied vacuum. However, in another embodiment, all vacuum channels (e.g., two) may have the vacuum applied during step S902.

[0072] Figures 10A to 10N A schematic cross-sectional view of the chuck assembly is shown during the planarization process, from film formation to film curing and finally to the separation of the upper plate from the cured layer. Figure 10AAs shown, when the substrate 102 is placed below the upper plate 108, the chamber 170 is not yet pressurized. Figure 10A At the indicated moment, the pressure P in the second channel and chamber is preferably equal to atmospheric pressure. Furthermore, before positioning the substrate 102 below the upper plate 108 or before step S904, a vacuum force V may be applied to all channels 212, 214, and 152. The vacuum applied to channels 212 and 214 may be strong enough to connect the plate holding member 130 to the rigid member so that a portion of the member is effectively rigid, i.e., creating a rigid portion 135. However, the vacuum applied to the second channel 152 may be selected such that although the inner edge 133 of the member contacts the rigid member 188, the vacuum is not strong enough to pull the plate holding member 130 into the second channel 152. This results in the portion of the plate holding member 130 below the second channel 152 being effectively flexible, i.e., creating a flexible portion 134.

[0073] The method may proceed to step S904, in which the chamber 170 of the upper plate chuck assembly 118 is pressurized with positive pressure. Figure 10B A schematic cross-section of the upper plate chuck assembly 118 is shown after chamber 170 has been pressurized. Chamber 170 can be pressurized by applying a positive pressure P via the second channel 152 and the first fluid conduit 154. The magnitude of the pressure P can be selected to be sufficient to cause the upper plate 108 to bend at a desired curvature, such as... Figure 10B As shown. The pressure P can be set from 0.1 to 10 kPa. Simultaneously, vacuum suction is applied to the first channel 148, the third channel 212, and the fourth channel 214. Therefore, during step S904, the plate holding member 130 is held attached to the upper plate 108 via the first channel 148, and the plate holding member 130 is held attached to the rigid member 188 in the region below the third channel 212 and the fourth channel 214. As described above, the portion of the plate holding member 130 that is drawn into contact with the lower side of the rigid member 188 is the effectively rigid portion 135, while the portion of the plate holding member 130 that is not drawn into contact with the lower side of the rigid member 188 is the effectively flexible portion 134. In this context, effective rigidity means that the portion of the plate holding member fixed to the rigid member is prevented from deflecting in the z-direction toward or away from the rigid member beyond a deflection threshold (which can be 0.1-10 μm, depending on the planarization system) under the force available in the planarization system. Effective rigidity allows a portion of the plate holding member to deflect beyond a deflection threshold when fixed to a rigid member. In this context, effective flexibility refers to a portion of the plate holding member being able to deflect beyond a deflection threshold in the z-direction toward and away from the rigid member and toward the base plate chuck under forces available in the planarization system. For example... Figure 10BAs shown, due to the positive pressure P and the bending of the upper plate 108, the flexible portion 134 of the plate holding member 130 will also bend / buckle, while the rigid portion 135 will not bend. The second channel 152 can be pressurized to pressure P before or during the movement of the upper plate chuck assembly 118 toward the substrate 102. When pressurization is applied while the upper plate chuck assembly 118 is moving toward the substrate 102, the target pressure should be reached before the upper plate 108 contacts the formable material 124.

[0074] The method may proceed to step S906, in which the upper plate 108 is brought into contact with droplets of formable material 124 on the substrate 102 to form a film layer 144. Figure 10C A schematic cross-section of the upper plate chuck assembly 118 is shown just before the curved upper plate 108 contacts the droplet of formable material 124. Figure 10C As shown, the positive pressure P remains maintained in the second channel 152 and chamber 170, while vacuum suction is still applied to the first channel 148, the third channel 212, and the fourth channel 214. In one embodiment, as the upper plate 108 conforms to the formable material 124, the pressure P in the second channel 152 and chamber 170 is increased to maintain the desired curvature. Typically, as the misfit area of ​​the upper plate decreases, greater pressure is required to maintain a certain upper plate curvature. During step S906, as the contact area of ​​the upper plate increases, the contact area begins to conform to the shape of the upper plate below the contact area, while the portion of the upper plate outside the contact area is the misfit area where curvature needs to be controlled. Maintaining this curvature is important for minimizing gas trapping that may cause unfilled defects. In one embodiment, the curvature of the upper plate is controlled just beyond the conformation (contact area). In other words, the curvature of the upper plate is controlled in the annular region just outside the contact area. In one embodiment, the desired upper plate curvature profile in the annular region is controlled while the formable material diffuses below the contact area. This requires maintaining and / or increasing the pressure P during step S906. In one embodiment, the upper plate 108 is "flat" (conforming to the shape of the substrate 102) after the formable material has stopped diffusing.

[0075] Figure 10D A schematic cross-section of the upper plate chuck assembly 118 is shown as it continues to move downward toward the substrate 102 to form the film 144. Figure 10DAs shown, as the upper plate chuck assembly 118 continues to move the upper plate 108 downward, a film 144 of the formable material 124 begins to form in the region between the center of the upper plate 108 and the substrate 102. Simultaneously with this action, the positive pressure P in the second channel 152 and the chamber 170 can be maintained or increased, such that as the upper plate 108 is pressed against the formable material 124, the upper plate 108 maintains the desired curvature in the upper plate region where it will soon conform to the formable material. Preferably, the pressure P is increased. That is, with... Figure 10C In comparison, such as Figure 10D As seen in the image, the upper board is 108. Figure 10D The upper plate has a small curvature to maintain the desired curvature in the area that will soon conform to the formable material. At the same time, the flexible portion 134 of the plate retaining member 130 can begin to flatten together with the upper plate 108.

[0076] Figure 10E A schematic cross-section of the upper plate chuck assembly 118 is shown at a point when the upper plate 108 has been further pushed towards the substrate 102. (See diagram below.) Figure 10E As seen in the image, as the upper plate 108 continues to press downwards, the film 144 of the formable material 124 extends further along the surface of the substrate 102 toward the edge. The positive pressure P is further increased or maintained in the second channel 152 and chamber 170 to maintain the desired curvature in the substrate region where it will soon conform to the formable material. Preferably, the pressure P is further increased. Therefore, as the upper plate 108 continues to press downwards toward the substrate 102, the upper plate 108 continues to bend to maintain the desired curvature in the substrate region where it will soon conform to the formable material. That is, Figure 10E The upper plate in the 108 ratio Figure 10D The middle section has a small curvature, ensuring that the upper plate area, which will soon conform to the formable material, maintains the required curvature. Simultaneously, with... Figure 10C and Figure 10D In contrast, the flexible section 134 also continues to flatten. That is to say, Figure 10E The flexible part in the middle is 134 times Figure 10D The middle is flatter. Figure 10D and Figure 10E At all the locations shown, vacuum suction is still applied to the first channel 148, the third channel 212, and the fourth channel 214.

[0077] Figure 10F A schematic cross-section of the upper plate chuck assembly 118 is shown at the point when the upper plate 108 has been fully pressed against the formable material 124, allowing the membrane 144 to be fully formed. (See diagram below.) Figure 10FAs shown, the upper plate 108 has been pressed until it is flat again. That is, the upper plate 108 no longer has curvature or lacks significant curvature. Similarly, the flexible portion 134 of the plate retaining member 130 is flat or lacks significant curvature. At this stage, there may be a small gap between the innermost boss of the rigid member 188 and the plate retaining member 130, allowing for fluid connection between the chamber 170 and the second channel. At this point, the positive pressure in the second channel 152 and the chamber 170 is completely removed or opened to the atmosphere. Vacuum suction is still applied to the first channel 148, the third channel 212, and the fourth channel 214 because... Figure 10E The time shown is before curing and before the release process described below. As the formation of membrane 144 nears completion, a small amount of positive pressure may be present in the second channel 152 to counteract any small upward force on the portion of the plate holding member 130 located below the second channel 152 caused by the upper plate 108 pressing against the formable membrane 144. This small amount of positive pressure will be just sufficient to counteract the upward force. Once membrane 144 is fully formed and no force is pressing the upper plate 108 against the formable membrane 144, the pressure in the second channel 152 can be atmospheric pressure without any applied positive or negative pressure.

[0078] Because the flexible portion 134 of the plate retaining member 130 is connected to the upper plate 108, the aforementioned difficulties in controlling the curvature of the upper plate and the diffusion of the polymerizable material near the edge of the upper plate are reduced or avoided compared to chuck assemblies lacking a flexible portion. This is because the bending stiffness of the flexible portion 134 of the plate retaining member 130 is less than that of the upper plate 108, and it bends together with the upper plate 108 during the diffusion of the formable material 124. Therefore, by controlling the pressure in the second channel 152 and the chamber 170, the flexible portion 134 is provided, and the curvature of the upper plate 108 can be controlled throughout the diffusion process from the center to the outer edge of the upper plate 108. In addition to the feature of controlling the curvature of the upper plate described above, the upper plate chuck assembly 118 can also provide consistent crack propagation during the time it takes to separate the upper plate from the cured material. This separation aspect of the upper plate chuck assembly 118 begins with Figure 10J The description.

[0079] The method can then proceed to step S908, in which the film 144 formed between the upper plate 108 and the substrate 102 is cured. Figure 10GA schematic cross-section of the upper plate chuck assembly 118 during the curing step in step S908 according to a first example embodiment is shown. In the first example embodiment, the curing step can be performed using a curing system as described above. Radiation source 126 can, for example, emit ultraviolet radiation directed through the light-transmitting members and through the upper plate 108, both of which allow the ultraviolet radiation to pass through. In one embodiment, the plate holding member 130 can be transparent to ultraviolet radiation so that the member does not obstruct the curing process. In one embodiment, the rigid member 188 can be transparent to ultraviolet radiation so that the member does not obstruct the curing process. In another embodiment, the plate holding member 130 does not necessarily have to be transparent relative to ultraviolet radiation. If the plate holding member 130 is opaque relative to ultraviolet radiation, the plate holding member 130 will need to move relative to the multilayer structure (substrate 102; uncured formable material film 144; and upper plate 108) while the uncured formable material film 144 is cured during step S908. In this first example embodiment of ultraviolet radiation passing through the light-transmitting member, the light-transmitting member 150 may be made of a material that transmits more than 80% of light with wavelengths of 310-700 nm (i.e., ultraviolet and visible light), such as sapphire or fused silica. After exposure to ultraviolet radiation, the film 144 of the formable material is cured, thereby forming a hardened cured layer 146. In one embodiment, vacuum suction is not applied to the first channel 148 during the curing process.

[0080] Figure 10H and Figure 10I A schematic cross-section of the upper plate chuck assembly 118 during the curing step S908 according to a second exemplary embodiment is shown. In the second exemplary embodiment, as Figure 10H As shown, the upper plate 108 is first released from the plate holding member 130. Therefore, at this moment, the vacuum applied to the first channel 148 has been terminated. After the upper plate 108 has been released from the plate holding member 130, the multilayer structure (the combination of upper plate 108 / film 144 / substrate 102 / substrate chuck 104) can be moved to another location via a stage. Figure 10IAs shown, once the multilayer structure is in another location, curing can be performed. As in the first embodiment, curing can be performed by exposing the film 144 to ultraviolet light passing through the upper plate 108. However, since the multilayer structure is in another location and is no longer connected to the upper plate chuck assembly 118, the ultraviolet light does not need to pass through the light-transmitting member 150 or the plate holding member 130. In this second example embodiment where ultraviolet radiation does not pass through the light-transmitting member, the light-transmitting member 150 can be made of a material that transmits more than 80% of light with a wavelength of 400-700 nm (i.e., visible light, not ultraviolet light), such as glass or borosilicate, and does not need to be made of a material that transmits ultraviolet light. After curing is complete, the multilayer structure can be brought back to the upper plate chuck assembly 118, and the upper plate 108 can be reconnected to the plate holding member 130 by providing a vacuum to the first channel 148.

[0081] The method can then proceed to step S910, in which the upper plate 108 is separated from the cured layer 146. Figure 10G In the illustrated embodiment, the upper plate 108 is never separated from the upper plate chuck assembly 118 and is therefore positioned for separation. Figure 10H and Figure 10I In the illustrated embodiment, after curing is complete, as described above, the upper plate 108 is reconnected to the upper plate chuck assembly 118 and is ready to be separated.

[0082] The separation of the upper plate 108 from the cured layer 146 can be performed by lifting the upper plate chuck assembly 118 upwards away from the substrate 102 and simultaneously propagating a separation front between the upper plate 108 and the cured layer 146. A process for initiating the separation front can be performed before lifting the upper plate chuck assembly 118 begins. A vacuum suction force is maintained on the third channel 212 and the fourth channel 214 just before the process for initiating the separation front begins. Additionally, a vacuum is also applied to the second channel 152. Figure 10J The upper plate chuck assembly 118 is shown in an example embodiment prior to the initiation of the separation leading edge, with vacuum applied to the first channel 148, the second channel 152, the third channel 212, and the fourth channel 214. That is, as... Figure 10J As shown, even when a vacuum force is applied to the second channel 152, the portion of the plate holding member 130 located below the second channel 152 remains substantially flat and is not pulled into the space of the second channel 152. Simultaneously, the upper plate 108 is in complete contact with the cured layer 146. Therefore, in Figure 10J At the moment shown, no separation of the upper plate 108 from the cured layer 146 has occurred; that is, the separation front has not yet been initiated.

[0083] Figure 10KThe upper plate chuck assembly 118 is shown at the point in time when the separation front is initiated between the upper plate 108 and the cured layer 146. This separation front can be initiated by raising the pin 194, which passes through the orientation feature of the substrate, until it contacts the bottom side of the upper plate 108 and pushes it upward against the bottom side of the upper plate. Simultaneously, a vacuum is maintained in the second channel 152. Figure 10K As shown, once pin 194 pushes upward against upper plate 108 to initiate the separation front, upper plate 108 rises from cured layer 146, thereby releasing the portion of plate retaining member 130 below the second channel 152. Because a vacuum is maintained in the second channel 152 and because plate retaining member 130 is flexible, the portion of plate retaining member 130 below the second channel 152 is drawn upward until the upper side of plate retaining member 130 contacts the second surface 153e of the second channel 152. Once plate retaining member 130 contacts the second surface 153e of the second channel 152, the portion of plate retaining member 130 below the second channel 152 becomes effectively rigid. In other words, because the vacuum force holds said portion of plate retaining member 130 against the second surface 153e, plate retaining member 130 is no longer able to function as a flexible member. Initially, only the smaller arc segment of the upper side of the flexible portion opposite the pin approaches or contacts the second surface 153e. Following this initial state and with a vacuum supplied to the second channel 152, a larger portion of the upper side of the flexible section contacts the second surface, which facilitates the circumferential propagation of the separation front along the substrate 102. The flexible section of the plate holding member 130 deflects in a specific manner that facilitates the propagation of the separation front, whereas such propagation would be lacking if the deflection of the plate holding member 130 were not restricted.

[0084] Figure 10L It shows Figure 10K The separation front initiated in the middle has propagated circumferentially around the substrate 102 after the upper plate chuck assembly 118. Due to the vacuum maintained in the second channel 152, optionally accompanied by some lifting and / or tilting of the upper plate chuck assembly 118, the separation front between the upper plate 108 and the cured layer 146 continues to propagate. Propagation first occurs circumferentially. Therefore, as... Figure 10K As shown, the separation between the upper plate 108 and the cured layer 146 has been achieved. Figure 10K On the opposite side of the pin side, but with almost no separation in the radial direction toward the center of the substrate 102. As described above, as the edge of the upper plate 108 is lifted from the cured layer 146, the corresponding portion of the plate holding member 130 is lifted due to the vacuum and comes into contact with the second surface 153e, thereby limiting the ability of the flexible portion to deflect beyond a certain amount. As mentioned above for Figure 4DThe second surface 153e is positioned at a distance H3 relative to the bottom of the sidewalls 153a and 153d. Distance H3 is chosen to provide sufficient elevation for the plate retaining member 130 to allow the separation front to propagate circumferentially, while also limiting the amount of deflection of the plate retaining member 130. In other words, distance H3 is specifically chosen to provide sufficient space for the portion of the plate retaining member 130 below the second channel 152 to be elevated as part of the circumferentially propagating separation front, but distance H3 also provides a stop to keep the plate retaining member 130 and the first channel at a specific distance from the substrate and in a specific orientation that facilitates the propagation of the separation front from the pin to around the substrate.

[0085] Figure 10M It shows Figure 10L The moment after the upper plate 108 further separates from the cured layer 146. Figure 10M In the middle, the upper plate chuck assembly 118 has been raised to propagate the separation front radially toward the center of the upper plate 108. For example... Figure 10M As shown, since the portion of the plate holding member 130 below the second channel 152 is secured to the second surface by vacuum, there is no additional deflection of the flexible portion. That is, the upper plate chuck assembly 118 can continue to be raised to propagate the separation of the upper plate 108 from the cured layer 146 without flexing the plate holding member 130. In one embodiment, the vacuum in the second channel 152 can be reduced after the separation front has propagated circumferentially around the substrate 102. The flexible portion 134 of the plate holding member 130 is fixed against the second surface 153e to ensure that the first channel 148 of the plate holding member 130 is held in the desired position and orientation to ensure successful circumferential propagation of the separation front around the substrate.

[0086] Figure 10N This illustrates the moment when separation in step S910 is complete after the upper plate 108 has been released from the cured layer 146. (As shown) Figure 10N As shown, after separation is complete, the upper plate chuck assembly 118 holds the upper plate 108, and the substrate 102 holds the cured layer 146. Then, by returning to... Figure 10A The orientation shown allows for the restart of planarization 900 on another substrate. As described above, planarization 900 can be repeated many times (up to tens of thousands of times). When it is desired to remove the upper plate 108 from the upper plate chuck assembly 118 (e.g., after a predetermined number of planarization processes have been completed, or if other indicators suggest that the upper plate should be replaced), the vacuum applied to the first channel 148 can be released.

[0087] In view of this specification, those skilled in the art will understand other variations and alternative embodiments of various aspects. Therefore, this specification should be construed as merely illustrative. It should be understood that the forms shown and described herein should be considered as examples of embodiments. Elements and materials shown and described herein may be substituted, components and processes may be reversed, and certain features may be employed independently, all of which will be apparent to those skilled in the art upon benefiting from this specification.

Claims

1. A chuck assembly for holding a plate, comprising: A plate retaining member configured to retain a plate, the plate retaining member including a central opening; Rigid members, configured as retaining plates to retain members; The first channel is formed by a plate retaining member; The second channel is formed by rigid components; A first fluid conduit, connected to a second channel; and The second fluid conduit is at least partially disposed within the second channel and communicates with the first channel.

2. The chuck assembly of claim 1, wherein, The plate is held in place by reducing the pressure in the first channel via a second fluid conduit.

3. The chuck assembly of claim 1, wherein, The plate retaining member is made of flexible material.

4. The chuck assembly according to claim 1, wherein, A portion of the plate retaining member is movable by adjusting the pressure in the second channel via the first fluid conduit.

5. The chuck assembly according to claim 4, wherein, The second channel overlaps with a portion of the plate retaining member.

6. The chuck assembly according to claim 1, further comprising: Third fluid conduit, Among them, the rigid member includes a third channel facing the plate retaining member, and The third fluid conduit is connected to the third channel.

7. The chuck assembly according to claim 1, wherein, The first fluid conduit has a first end that opens into a second channel and a second end that connects to a pressure source.

8. The chuck assembly according to claim 1, wherein, The second channel overlaps with the first channel.

9. The chuck assembly according to claim 1, wherein, The second fluid conduit has a first end that opens into the first channel and a second end that connects to a pressure source.

10. The chuck assembly according to claim 9, in, The second fluid conduit includes a fixing device and a tube extending from the fixing device. The pipe includes a first end that opens into the first channel, and The fixing device includes a second end that is connected to the pressure source.

11. The chuck assembly according to claim 10, wherein, A portion of the fixing device is positioned within the second channel.

12. The chuck assembly according to claim 11, wherein, The portion of the fixing device positioned within the second channel does not extend beyond the bottom surface of the rigid member.

13. The chuck assembly according to claim 10, wherein, A portion of the tube is positioned within the second channel.

14. The chuck assembly of claim 10 further includes a sealing member connected to the fixing device.

15. The chuck assembly according to claim 1, in, The second channel is partially defined by a first sidewall extending from a first surface of the rigid member and a second sidewall extending from the first surface of the rigid member, and The first sidewall extends further from the first surface than the second sidewall.

16. The chuck assembly according to claim 15, wherein, The first sidewall is located radially inside the second sidewall.

17. The chuck assembly according to claim 16, in, The first channel is partially defined by a third sidewall extending from the first surface of the plate retaining member, and The first sidewall overlaps with the third sidewall.

18. The chuck assembly of claim 15, wherein the first sidewall extends beyond the second sidewall by 5 to 100 μm.

19. A planarization system, comprising: A chuck assembly for holding the plate, the chuck assembly including: A plate retaining member, configured to retain a plate, the plate retaining member including a central opening; Rigid members, configured as retaining plate retaining members; The first channel is formed by a plate retaining member; The second channel is formed by rigid components; A first fluid conduit, connected to a second channel; and The second fluid conduit is at least partially disposed within the second channel and communicates with the first channel; A substrate chuck, configured to hold the substrate; A fluid dispenser configured to dispense formable material onto a substrate; A positioning system configured to bring the formable material into contact with the sheet; and A curing system configured to cure a formable material under a board to form a cured formable material on a substrate.

20. A method of manufacturing an article, comprising: Dispensing formable materials onto a substrate; The board is held in place by a chuck assembly, which includes: A plate retaining member, configured to retain a plate, the plate retaining member including a central opening; Rigid members, configured as retaining plate retaining members; The first channel is formed by a plate retaining member; The second channel is formed by rigid components; A first fluid conduit, connected to a second channel; and The second fluid conduit is at least partially disposed within the second channel and communicates with the first channel; Make the plate come into contact with the formable material distributed on the substrate; Curing moldable materials using a curing source; Separating the plate from the cured, moldable material; and Processing cured moldable materials to make products.

Images