Tooling fixture and water guide laser cutting machining device and machining method with same

Abstract

This application relates to a tooling fixture and a water-guided laser cutting processing apparatus and method having the same. The tooling fixture includes a negative pressure mechanism, a clamping mechanism, and an adjusting table. The negative pressure mechanism includes a negative pressure generator and an adsorption tube connected to the negative pressure generator. The adsorption tube is used to adsorb the workpiece to be cut. The clamping mechanism includes a mounting base and a chuck for clamping the adsorption tube. The chuck is mounted on the mounting base via a mounting shaft. When the chuck is clamping the adsorption tube, the adsorption tube is coaxially arranged with the mounting shaft. The chuck is arranged to drive the adsorption tube to rotate around the axis of the mounting shaft, and the adsorption tube maintains its connection with the negative pressure generator during rotation. The adjusting table includes a base, a first rotary table rotatably mounted on the base, and a second rotary table rotatably mounted on the first rotary table. The mounting base is mounted on the second rotary table. The workpiece to be cut does not need to be repeatedly clamped and positioned, and the paths of the two cuts can be ensured to coincide, thus optimizing the production process, improving production efficiency, and reducing production costs.

Description

Technical Field

[0001] This application relates to the field of diamond processing technology, and in particular to a tooling fixture and a water-guided laser cutting processing device and processing method having the same. Background Technology

[0002] In the diamond industry, the cutting and processing of diamond blanks is a crucial step. Diamond blanks usually need to be cut into pieces, and the cutting quality of the diamond directly affects the application of the cut diamond pieces.

[0003] Traditional diamond cutting methods include dry laser cutting and water-guided laser cutting. Dry laser cutting cuts diamond blanks by focusing a laser beam to ablate the material surface, while water-guided laser cutting confines the laser beam within a water column. When the diamond blank is large, the kerf depth is deep when cutting through the material. Because the laser beam path of dry laser cutting is tapered, the kerf width also needs to be larger. Therefore, using dry laser cutting to cut large diamond blanks into slices in one go results in waste of diamond material and increased production costs. Water-guided laser cutting has a virtually taper-free laser beam path, but when the cutting depth is deep, the water column is affected by both the friction of the kerf surface and the surface tension of the water, causing the laser energy confined within the water column to weaken significantly, making it difficult to cut large diamond blanks into slices in one go.

[0004] In existing technology, when cutting large-sized diamonds into slabs, the diamond blank is clamped and fixed using a fixture. Following the cutting path of the diamond blank, at least half the depth is cut from one side of the blank. The blank is then removed from the fixture, rotated 180°, and re-clamped. Cutting is then performed from the other side until the diamond blank is completely cut through. However, since the surface of the diamond blank material is usually uneven, the laser cutting paths may misalign during the two clamping processes. Therefore, after disassembling and reclamping the diamond blank, it needs to be repositioned, increasing the number of production steps, reducing production efficiency, and increasing production costs. Summary of the Invention

[0005] Therefore, it is necessary to provide a tooling fixture and a water-guided laser cutting processing device and processing method, so that the workpiece to be cut does not need to be repeatedly clamped and positioned when flipped and cut.

[0006] This application provides a tooling fixture, including a negative pressure mechanism, a clamping mechanism, and an adjusting platform. The negative pressure mechanism includes a negative pressure generator and an adsorption tube connected to the negative pressure generator. The adsorption tube is used to adsorb the workpiece to be cut. The clamping mechanism includes a mounting base and a chuck for clamping the adsorption tube. The chuck is mounted on the mounting base via a mounting shaft. When the chuck is clamping the adsorption tube, the adsorption tube is coaxially arranged with the mounting shaft. The chuck is arranged to drive the adsorption tube to rotate around the axis of the mounting shaft, and the adsorption tube maintains its connection with the negative pressure generator during rotation. The adjusting platform includes a base, a first rotating platform rotatably mounted on the base, and a second rotating platform rotatably mounted on the first rotating platform. The mounting base is mounted on the second rotating platform. The direction of rotation of the first rotating platform relative to the base is defined as a first direction X, and the direction of rotation of the second rotating platform relative to the first rotating platform is defined as a second direction Y. The first direction X and the second direction Y form an angle with each other.

[0007] In one embodiment, the inner radius of the adsorption tube is greater than the radial wall thickness of the adsorption tube.

[0008] In one embodiment, the chuck is a three-jaw chuck, and the coaxiality tolerance between the centering axis of the three-jaw chuck and the mounting axis is less than 0.003 mm.

[0009] In one embodiment, the angle between the first direction X and the second direction Y is 89.99°~90.01°.

[0010] In one embodiment, the chuck is provided with a flexible protective layer. When the chuck clamps the adsorption tube, the protective layer comes into contact with the adsorption tube. The protective layer is made of one of copper, aluminum, polytetrafluoroethylene, or rubber.

[0011] In one embodiment, a first measuring unit is provided between the first rotating stage and the base, the first measuring unit being used to measure the rotation angle of the first rotating stage relative to the base, and a second measuring unit is provided between the first rotating stage and the second rotating stage, the second measuring unit being used to measure the rotation angle of the second rotating stage relative to the first rotating stage.

[0012] In one embodiment, the first measuring unit has an angular resolution of 0.001°, and the second measuring unit has an angular resolution of 0.001°.

[0013] This application also provides a water-guided laser cutting processing apparatus, including a water-guided laser cutting machine and the tooling fixture described above, wherein the water-guided laser cutting machine generates a laser beam constrained in a water column, and the laser beam is perpendicular to the mounting axis.

[0014] This application also provides a water-guided laser cutting method, which uses the water-guided laser cutting device described above to cut the workpiece. The method includes the following cutting steps:

[0015] S101: Adjust the orientation of the clamping mechanism via the adjustment table so that the axis of the mounting shaft extends along the third direction Z;

[0016] S102: The workpiece to be cut is adsorbed and fixed by negative pressure adsorption through the adsorption tube clamped in the chuck;

[0017] S103: The water-guided laser cutting machine is running and the water-guided laser is turned on. The laser beam is coupled with the water column and the laser beam is located in the water column. The laser beam extends along the fourth direction to cut the workpiece. The fourth direction is perpendicular to the third direction Z. The cutting depth of the laser beam on the workpiece along the fourth direction is at least half the thickness of the workpiece along the fourth direction.

[0018] S104: Turn off the water-guided laser, keep the workpiece to be cut in an adsorption state and keep the adsorption tube in a clamped state, rotate the chuck 180° around the rotation axis extending along the third direction Z, and drive the adsorption tube and the workpiece to be cut to rotate 180°.

[0019] S105: The water-guided laser is turned on again, and the laser beam cuts the workpiece along the fourth direction again until the workpiece is cut off along the fourth direction.

[0020] In one embodiment, the following calibration step is also included prior to the cutting step:

[0021] S201: Install the base onto the worktable of the water-guided laser cutting machine;

[0022] S202: Rotate the first rotary table relative to the base and rotate the second rotary table relative to the first rotary table so that the axis of the mounting shaft is substantially perpendicular to the extension direction of the laser beam;

[0023] S203: The adsorption tube is held by a chuck, and the adsorption tube adsorbs a polished silicon wafer along the thickness direction of the silicon wafer.

[0024] S204: Input current into the laser source of the water-guided laser cutting machine and turn on the water-guided laser;

[0025] S205: Move the laser source along the third direction Z to make the water-guided laser move closer to the silicon wafer along the third direction Z until the water column flows over the surface of the silicon wafer away from the adsorption tube along the fourth direction.

[0026] S206: If the water column fluctuates, rotate the first and / or second rotating stages until the water column flows along the fourth direction from the side of the silicon wafer away from the adsorption tube without fluctuation.

[0027] S207: Move the laser source along the directions perpendicular to the third direction Z and the fourth direction, so that the water-guided laser moves toward one side edge of the silicon wafer until the water column flows along the surface of the corresponding side edge of the silicon wafer;

[0028] S208: If the water column fluctuates, rotate and adjust the first and / or second rotating platforms until the water column flows through the two edge surfaces of the silicon wafer in the fourth direction without fluctuation. At this point, the adsorption tube is in place.

[0029] S209: Turn off the water-guided laser and record the rotation angle of the first rotating stage relative to the base and the rotation angle of the second rotating stage relative to the first rotating stage.

[0030] Compared with the prior art, the tooling fixture and the water-guided laser cutting processing device and method provided in this application have at least the following advantages: the clamping mechanism in the tooling fixture clamps the negative pressure tube through a chuck, and the negative pressure tube is fixed by negative pressure adsorption. The tooling fixture is provided with an adjustment platform, which includes a first rotating platform and a second rotating platform. The rotation axis of the first rotating platform relative to the base extends in the first direction X, and the rotation axis of the second rotating platform relative to the first rotating platform extends in the second direction Y. The first direction X and the second direction Y form an angle with each other. The rotation of the second rotary table adjusts the extension direction of the mounting shaft in the clamping mechanism, making the extension direction of the mounting shaft perpendicular to the extension direction of the laser beam. After the laser beam cuts half the depth of the workpiece to be cut, the mounting shaft is rotated 180°, thereby driving the adsorption tube and the workpiece to be cut to rotate 180° synchronously. The laser beam cuts the workpiece again from the other side until the workpiece is completely cut. During the cutting process, the workpiece does not need to be repeatedly clamped and positioned, and the paths of the two cuts can be ensured to overlap, thus optimizing the production process, improving production efficiency, and reducing production costs. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a perspective view of a tooling fixture according to an embodiment of this application;

[0033] Figure 2 This is a schematic diagram of a tooling fixture according to an embodiment of this application along the first direction X;

[0034] Figure 3 This is an axial schematic diagram of an adsorption tube according to an embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the silicon wafer, laser beam, and water column along the first direction X after step S205 in the calibration process of an embodiment of this application.

[0036] Figure 5 This is a schematic diagram of the silicon wafer, laser beam, and water column along the first direction X after step S206 in the calibration process of an embodiment of this application.

[0037] Figure 6 This is a schematic diagram of the silicon wafer, laser beam, and water column along the second direction Y before step S207 is performed in the calibration process of an embodiment of this application.

[0038] Figure 7 This is a schematic diagram of the silicon wafer, laser beam, and water column along the second direction Y after step S207 in the calibration process of an embodiment of this application.

[0039] Figure 8 This is a schematic diagram of the silicon wafer, laser beam, and water column along the second direction Y after step S208 in the calibration process of an embodiment of this application.

[0040] Figure 9 This is a schematic diagram of the workpiece to be cut, the laser beam, and the water column along the first direction X after step S103 in the cutting process of an embodiment of this application.

[0041] Figure 10 This is a schematic diagram of the workpiece to be cut, the laser beam, and the water column along the first direction X before step S105 in the cutting process of an embodiment of this application.

[0042] Figure 11 This is a schematic diagram of the workpiece to be cut along the first direction X after the cutting steps according to an embodiment of this application.

[0043] Reference numerals: 100, part to be cut; 101, split part; 200, silicon wafer; 300, water column; 400, laser beam; 501, adsorption tube; 502, clamping mechanism; 503, mounting base; 504, chuck; 505, mounting shaft; 506, handle; 507, adjusting platform; 508, base; 509, first rotating platform; 510, second rotating platform; 511, protective layer; 512, first measuring unit; 513, second measuring unit. Detailed Implementation

[0044] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0045] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," "side," "top," "bottom," and similar expressions used in this application's specification are merely for describing various exemplary structural parts and elements of this application. However, their use herein is for illustrative purposes only and is determined based on the exemplary orientations shown in the accompanying drawings, and does not represent the only possible implementation. Since the embodiments disclosed in this application can be arranged in different orientations, these terms indicating orientation are for illustrative purposes only and should not be considered as limitations. For example, "upper" and "lower" are not necessarily limited to directions opposite to or consistent with the direction of gravity.

[0046] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0047] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0048] It should be noted that "axial arrangement" means that the overall arrangement direction is along the axial direction, including but not limited to axial extension, and may be at an angle to the axial direction.

[0049] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used in this application includes any and all combinations of one or more of the associated listed items.

[0050] In current production activities, there is a high demand not only for cutting large-sized diamonds, but also for brittle, large-sized materials such as sapphire and cemented carbide. Traditional laser cutting equipment struggles to achieve a single cut for these large, brittle materials, typically requiring multiple flipping, clamping, and cutting cycles to extract a portion of the material. Each re-clamping requires repositioning; otherwise, the cut surface will be uneven, potentially affecting the material's subsequent applications. This repetitive positioning not only reduces production efficiency but also complicates the process and increases costs.

[0051] In existing technologies, repair processes such as grinding and polishing are also used to repair the cut surfaces of materials after cutting. However, the addition of repair processes will still significantly reduce production efficiency and cause a sharp increase in production costs.

[0052] To address the aforementioned problems, this application provides a tooling fixture, including a negative pressure mechanism, a clamping mechanism 502, and an adjusting table 507. The workpiece to be cut does not require repeated clamping and positioning during multiple flipping cuts, thus optimizing the production process while ensuring production quality, improving production efficiency, and reducing production costs. Please refer to... Figure 1 and Figure 2 The negative pressure mechanism includes a negative pressure generator (not shown) and an adsorption tube 501. The adsorption tube 501 is connected to the negative pressure generator and is used to adsorb the workpiece 100 to be cut. It is understood that by operating the negative pressure generator, a negative pressure is created at the adsorption tube 501, thereby adsorbing the workpiece 100 to be cut. The negative pressure generator can also be called a vacuum generator. Any existing product of suitable specifications can be selected according to the adsorption requirements of the workpiece 100 to be cut; this application does not impose any limitations.

[0053] The clamping mechanism 502 includes a mounting base 503 and a chuck 504. The chuck 504 is mounted on the mounting base 503 via a mounting shaft 505. The chuck 504 is used to clamp the adsorption tube 501. When the chuck 504 is clamping the adsorption tube 501, the adsorption tube 501 is coaxially arranged with the mounting shaft 505. The chuck 504 is arranged so that the adsorption tube 501 can rotate around the axis of the mounting shaft 505. It can be understood that the adsorption tube 501 is tubular and has its own axis. The coaxial arrangement of the adsorption tube 501 and the mounting shaft 505 means that the axis of the adsorption tube 501 is coaxial with the rotation axis of the mounting shaft 505. In this way, by rotating the mounting shaft 505 relative to the mounting base 503, the chuck 504, the adsorption tube 501, and the workpiece 100 to be cut can be rotated. The adsorption tube 501 rotates on its own axis, reducing eccentricity and improving the rotational stability of the workpiece 100 adsorbed on the adsorption tube 501. At the same time, it can accurately position the workpiece 100 after it has rotated.

[0054] In other words, if the axis of the adsorption tube 501 is significantly deviated from the rotation axis of the mounting shaft 505, when the mounting shaft 505 rotates relative to the mounting base 503, the adsorption tube 501 and the workpiece 100 to be cut will undergo significant revolution around the axis of the mounting shaft 505, resulting in a large eccentric effect. This can easily cause the workpiece 100 to fall off, and various parts of the workpiece 100 to be cut will change, increasing the requirements for cutting positioning.

[0055] Please continue reading Figure 1 and Figure 2 In one specific embodiment of this application, the adsorption tube 501 is inserted through the mounting shaft 505 along the axial direction of the mounting shaft 505, and the insertion position of the adsorption tube 501 is located at the axial direction of the mounting shaft 505. Furthermore, both axial ends of the adsorption tube 501 penetrate the mounting shaft 505, so that one axial end of the adsorption tube 501 is used to adsorb the workpiece 100 to be cut, and the other end is convenient to connect to the negative pressure generator.

[0056] Furthermore, the adsorption tube 501 maintains its connection with the negative pressure generator during rotation, ensuring that the adsorption tube 501 can maintain the adsorption of the workpiece 100 during rotation. The workpiece 100 does not require repeated disassembly and reassembly, eliminating machining accuracy issues caused by clamping position shifts due to repeated disassembly and reassembly. It is understood that a rotary joint (not shown) can be used to connect the adsorption tube 501 and the negative pressure generator. The rotary joint maintains the connection between the adsorption tube 501 and the negative pressure generator while allowing the adsorption tube 501 to rotate relative to the negative pressure generator around its own axis. Rotary joints are existing, mature products; a suitable rotary joint of appropriate specifications can be selected according to the connection requirements of the adsorption tube 501 and the negative pressure generator. This application does not impose any limitations on this.

[0057] The adjustment platform 507 includes a base 508, a first rotating platform 509, and a second rotating platform 510. The first rotating platform 509 is rotatably mounted on the base 508, and the second rotating platform 510 is rotatably mounted on the first rotating platform 509. The mounting seat 503 in the clamping mechanism 502 is mounted on the second rotating platform 510. Furthermore, the direction of the rotation axis of the first rotating platform 509 relative to the base 508 is defined as the first direction X, and the direction of the rotation axis of the second rotating platform 510 relative to the first rotating platform 509 is defined as the second direction Y. The first direction X and the second direction Y form an angle with each other. When the first rotating platform 509 rotates relative to the base 508, it can drive the second rotating platform 510, the clamping mechanism 502, and the adsorbed workpiece 100 to be cut to rotate around the rotation axis of the first rotating platform 509. When the second rotating platform 510 rotates relative to the first rotating platform 509, it can drive the clamping mechanism 502 and the adsorbed workpiece 100 to be cut to rotate around the rotation axis of the second rotating platform 510, thereby adjusting the axial extension direction of the adsorption tube 501 on the clamping mechanism 502 (which can also be considered as adjusting the axial extension direction of the mounting shaft 505), and finally adjusting the position and orientation of the workpiece 100 adsorbed on the adsorption tube 501 so that the workpiece 100 to be cut can be cut along a preset cutting path.

[0058] After the workpiece 100 to be cut is adsorbed and fixed by the adsorption tube 501 in the negative pressure mechanism, the first rotary table 509 and the second rotary table 510 are rotated to adjust the position and orientation of the workpiece 100 to be cut so that the cutting path is perpendicular to the axis of the adsorption tube 501 (or the axis of the mounting shaft 505), and the workpiece 100 is cut along the direction perpendicular to the axis of the adsorption tube 501. Then, the mounting shaft 505 is rotated 180°, thereby driving the chuck 504, the adsorption tube 501 and the workpiece 100 to be cut to rotate 180°, and the workpiece is cut again along the axis of the adsorption tube 501 until the workpiece 100 is cut off. In this cutting method, the workpiece 100 does not need to be clamped repeatedly, optimizing the production process, improving production efficiency and reducing production costs.

[0059] In addition, the cutting paths of the workpiece 100 before and after rotation with the adsorption tube 501 and the mounting shaft 505 are aligned, which can reduce the slit marks after the two cuts and ensure the cutting quality.

[0060] The cutting depth of the workpiece 100 before and after flipping is at least half the length of the workpiece 100 along the axis of the vertical adsorption tube 501, so that the workpiece 100 can be cut and separated into two parts 101 after flipping.

[0061] It is also worth mentioning that during the two cutting processes of the workpiece 100, the workpiece 100 is fixed by negative pressure adsorption, and the workpiece 100 does not need to be removed from the adsorption tube 501 and re-clamped, reducing clamping misalignment and material wear caused by secondary clamping.

[0062] In some embodiments of this application, a handle 506 is provided on the mounting shaft 505 for easy manual operation. Of course, in other embodiments, the mounting shaft 505 can be connected to a drive source such as a motor to realize the electrically controlled rotation of the mounting shaft 505 and improve the accuracy of the mounting shaft 505 when rotating 180°.

[0063] In some embodiments of this application, the inner radius of the adsorption tube 501 is larger than the radial wall thickness of the adsorption tube 501. See also... Figure 3 Specifically, the inner radius of the adsorption tube 501 is R, and the radial wall thickness of the adsorption tube 501 is D, where R is greater than D. It is understood that when the adsorption tube 501 adsorbs and fixes the workpiece 100 to be cut, the solid portion at the end of the adsorption tube 501 will contact the surface of the workpiece 100. When the surface of the workpiece 100 is uneven, the larger the contact area between the solid portion at the end of the adsorption tube 501 and the surface of the workpiece 100, the easier it is for the adsorption to detach, and it will also affect the alignment of the workpiece 100 during the two cuts before and after rotation of the adsorption tube 501 and the mounting shaft 505. In this embodiment, the inner radius R of the adsorption tube 501 is made greater than the radial wall thickness D of the adsorption tube 501, reducing the contact area between the solid portion at the end of the adsorption tube 501 and the surface of the workpiece 100 to be cut, thereby minimizing the probability of the solid portion at the end of the adsorption tube 501 contacting the uneven parts of the surface of the workpiece 100.

[0064] In one specific embodiment of this application, the adsorption tube 501 is a metal tube with an inner diameter of 10 mm and an outer diameter of 16 mm. The inner radius of the adsorption tube 501 is half of the inner diameter, that is, the inner radius R of the adsorption tube 501 is 5 mm; the radial wall thickness of the adsorption tube 501 is half of the difference between the outer diameter and the inner diameter of the adsorption tube 501, that is, the radial wall thickness D of the adsorption tube 501 is 3 mm.

[0065] Please continue reading Figure 1 and Figure 2In some embodiments of this application, the chuck 504 is a three-jaw chuck, and the coaxiality tolerance between the centering axis of the three-jaw chuck and the mounting shaft 505 is less than 0.003 mm. It should be noted that after the adsorption tube 501 is clamped by the three-jaw chuck, the centering axis of the three-jaw chuck coincides with the axis of the adsorption tube 501. In other words, after the adsorption tube 501 is clamped by the three-jaw chuck, the coaxiality between the axis of the adsorption tube 501 and the rotation axis of the mounting shaft 505 is less than 0.003 mm. During the rotation of the mounting shaft 505, the rotation of the adsorption tube 501 is essentially a self-rotation, reducing the radial runout and eccentricity of the adsorption tube 501 during rotation.

[0066] In some embodiments of this application, the angle between the first direction X and the second direction Y is 89.99°~90.01°. In other words, the perpendicularity tolerance between the first direction X and the second direction Y is 0.01°, that is, the first direction X and the second direction Y are basically perpendicular. Thus, by rotating the first rotating table 509 and the second rotating table 510, the axial extension direction adjustment requirement of the adsorption tube 501 is met, thereby meeting the position and posture adjustment requirement of the workpiece 100 to be cut.

[0067] Please continue reading Figure 1 and Figure 2 In one specific embodiment of this application, the first direction X is the horizontal direction and the second direction Y is the vertical direction. The horizontal tilt angle of the workpiece 100 to be cut is adjusted by rotating the first rotating table 509, and the horizontal rotation angle of the workpiece 100 to be cut is adjusted by rotating the second rotating table 510.

[0068] In some embodiments of this application, the chuck 504 is provided with a flexible protective layer 511. When the chuck 504 clamps the adsorption tube 501, the protective layer 511 comes into contact with the adsorption tube 501, reducing wear on the adsorption tube 501. The protective layer 511 is made of one of copper, aluminum, polytetrafluoroethylene, or rubber. For more details, please refer to [link to previous document]. Figure 1 When the chuck 504 is a three-jaw chuck, each of the three jaws of the three-jaw chuck is provided with a protective layer 511 at the center end, so that after the three-jaw chuck clamps the adsorption tube 501, the protective layer 511 comes into contact with the adsorption tube 501.

[0069] Please continue reading Figure 1 and Figure 2A first measuring unit 512 is provided between the first rotating stage 509 and the base 508. The first measuring unit 512 is used to measure the rotation angle of the first rotating stage 509 relative to the base 508. A second measuring unit 513 is provided between the first rotating stage 509 and the second rotating stage 510. The second measuring unit 513 is used to measure the rotation angle of the second rotating stage 510 relative to the first rotating stage 509. The rotation angles of the first rotating stage 509 and the second rotating stage 510 are precisely controlled by the two measuring units, thereby precisely controlling the position and posture adjustment of the workpiece 100 to be cut.

[0070] The first measuring unit 512 and the second measuring unit 513 can be electronic or mechanical measuring units, as long as they can perform angle measurement functions. This application does not impose any restrictions.

[0071] Furthermore, the angular resolution of the first measuring unit 512 is 0.001°, and the angular resolution of the second measuring unit 513 is 0.001°. Here, angular resolution refers to the smallest unit of angle measurement being 0.001°. It should be noted that since the workpiece 100 needs to be cut twice through rotation, rotational offsets between the first rotating stage 509 and the second rotating stage 510 are inevitable during this process. Therefore, before the workpiece 100 rotates with the adsorption tube 501 and the mounting shaft 505, the measurement readings of the first measuring unit 512 and the second measuring unit 513 can be recorded. After the workpiece 100 rotates with the adsorption tube 501 and the mounting shaft 505, the rotation angles of the first rotating stage 509 and the second rotating stage 510 can be fine-tuned based on the previously recorded readings of the first measuring unit 512 and the second measuring unit 513, so that the readings of the measuring units remain essentially the same before and after the workpiece 100 rotates. Therefore, the lower the angular resolution of the measuring unit, the higher the accuracy of the fine-tuning of the first rotary table 509 and the second rotary table 510. In this embodiment, the resolution of both the first measuring unit 512 and the second measuring unit 513 is 0.001°, which meets the cutting requirements of the workpiece 100 to be cut.

[0072] This application also provides a water-guided laser cutting processing apparatus, including a water-guided laser cutting machine (not shown) and a tooling fixture according to any of the above embodiments. Please see below. Figures 4 to 11 The water-guided laser cutting machine can generate a laser beam 400 confined within a water column 300. This laser beam 400 has virtually no taper, which is a mature technology of existing water-guided laser cutting machines, and will not be elaborated upon in this application. The laser beam 400 is perpendicular to the mounting axis 505; that is, the laser beam 400 performs laser cutting on the workpiece 100 along the axis perpendicular to the mounting axis 505 (or the axis perpendicular to the adsorption tube 501).

[0073] During the actual cutting process, the laser beam 400 performs laser cutting on the workpiece 100 along the axial direction perpendicular to the mounting shaft 505. By controlling the modulation current input to the laser beam 400, the cutting depth of the laser beam 400 on the workpiece 100 is controlled, ensuring that the cutting depth is at least half the thickness of the workpiece 100 along the cutting direction of the laser beam 400. After completing a cut of half the thickness, the mounting shaft 505 is rotated, causing the adsorption tube 501 and the workpiece 100 to rotate 180°. Since the laser beam 400 is perpendicular to the mounting shaft 505, the cutting paths on the workpiece 100 are aligned during the two cuts, thereby reducing the kerf on the cut surface of the workpiece 100 and ensuring cutting quality.

[0074] This application also provides a water-guided laser cutting method, which uses the water-guided laser cutting device described in the above embodiment to cut the workpiece 100. The method includes the following cutting steps:

[0075] S101: Adjust the orientation of the clamping mechanism 502 via the adjustment table 507 so that the axis of the mounting shaft 505 extends along the third direction Z;

[0076] S102: The workpiece 100 to be cut is adsorbed and fixed by negative pressure adsorption through the adsorption tube 501 held in the chuck 504.

[0077] S103: The water-guided laser cutting machine is running and the water-guided laser is turned on. The laser beam 400 is coupled with the water column 300 and the laser beam 400 is located in the water column 300. The laser beam 400 extends along the fourth direction to cut the workpiece 100. The fourth direction is perpendicular to the third direction Z. The cutting depth of the laser beam 400 on the workpiece 100 along the fourth direction is at least half the thickness of the workpiece 100 along the fourth direction.

[0078] S104: Turn off the water-guided laser, keep the workpiece 100 to be cut in an adsorption state and keep the adsorption tube 501 in a clamped state, rotate the chuck 504 180° around the rotation axis extending along the third direction Z, and drive the adsorption tube 501 and the workpiece 100 to be cut to rotate 180°.

[0079] S105: The water-guided laser is turned on again, and the laser beam 400 cuts the workpiece 100 along the fourth direction again until the workpiece 100 is cut off along the fourth direction.

[0080] In some embodiments of this application, the laser beam 400 extends vertically from top to bottom, i.e., the fourth direction is vertical, and the axis of the mounting shaft 505 extends horizontally, i.e., the third direction Z is horizontal. It should be noted that, in a specific embodiment of this application, the fourth direction and the second direction Y are both vertical, and the third direction Z is perpendicular to both the first direction X and the second direction Y.

[0081] More specifically, in one embodiment of this application, the part to be cut 100 is a CVD (chemical vapor deposition) single-crystal diamond sheet with a side length of 20mm × 20mm and a thickness of 1mm. The purpose is to cut the diamond sheet into two diamond slices with a side length of 20mm × 20mm and a thickness of 0.45mm. It is understood that laser cutting will cause wear on the diamond sheet. In this embodiment of the application, the laser beam 400 cuts along the side length direction of the diamond sheet, and the wear thickness caused to the diamond sheet is 0.10mm.

[0082] See Figure 9 and Figure 10 In this embodiment, the orientation of the clamping mechanism 502 is adjusted by the adjusting table 507 so that the axis of the mounting shaft 505 is in a horizontal position. At this time, the axis of the first rotating table 509 is also in a horizontal position, and the axis of the second rotating table 510 is in a vertical position. The readings of the first measuring unit 512 and the second measuring unit 513 are both 0.000°. The diamond sheet is then adsorbed and fixed along the thickness direction of the diamond sheet by the adsorption tube 501, and the adsorption position of the adsorption tube 501 can be as close as possible to the center of the diamond sheet. The water-guided laser cutting machine is run and the water-guided laser is turned on. The laser beam 400 cuts the diamond sheet in the vertical direction until the cutting depth reaches 10mm. At this time, the water-guided laser is turned off, and the mounting shaft 505 is rotated 180°, thereby causing the adsorption tube 501 and the diamond sheet to rotate 180° as well. It is important to note that after the diamond sheet has been rotated 180°, if the readings of the first measuring unit 512 and / or the second measuring unit 513 change (i.e., one of the readings is not 0.000°), the adjustment stage 507 needs to be adjusted to readjust the readings of the first measuring unit 512 and the second measuring unit 513 to 0.000°. Conversely, if the readings of the first measuring unit 512 and the second measuring unit 513 are both 0.000° after the diamond sheet has been rotated 180°, then no adjustment of the adjustment stage 507 is necessary. At this point, the water-guided laser is turned on again, and the laser beam 400 cuts the diamond sheet vertically again. When the cutting depth reaches 10mm, the diamond sheet is completely cut into pieces.

[0083] Of course, in other embodiments of this application, see Figure 11As shown, the dimensions of the split piece 101 cut from the workpiece 100 can be determined based on actual cutting requirements, and this application does not impose any limitations.

[0084] In some embodiments of this application, the processing method further includes the following calibration step prior to the cutting step:

[0085] S201: Install the base 508 onto the worktable (not shown) of the water-guided laser cutting machine;

[0086] S202: Rotate the first rotary stage 509 relative to the base 508, and rotate the second rotary stage 510 relative to the first rotary stage 509, so that the axis of the mounting shaft 505 is substantially perpendicular to the extension direction of the laser beam 400.

[0087] S203: The adsorption tube 501 is held by the chuck 504. The adsorption tube 501 adsorbs a polished silicon wafer 200. The adsorption tube 501 adsorbs the silicon wafer 200 along the thickness direction.

[0088] S204: Input current into the laser source of the water-guided laser cutting machine and turn on the water-guided laser;

[0089] S205: Move the laser source along the third direction Z, so that the water-guided laser moves closer to the silicon wafer 200 along the third direction Z, until the water column 300 flows over the surface of the silicon wafer 200 away from the adsorption tube 501 along the fourth direction.

[0090] S206: If the water column 300 fluctuates, rotate the first rotating stage 509 and / or the second rotating stage 510 until the water column 300 flows over the surface of the silicon wafer 200 away from the adsorption tube 501 along the fourth direction without fluctuating.

[0091] S207: Move the laser source along the directions perpendicular to the third direction Z and the fourth direction, so that the water-guided laser moves toward one side edge of the silicon wafer 200 until the water column 300 flows along the surface of the corresponding side edge of the silicon wafer 200.

[0092] S208: If the water column 300 fluctuates, rotate the first rotating stage 509 and / or the second rotating stage 510 until the water column 300 does not fluctuate when it flows over the two edge surfaces of the silicon wafer 200 along the fourth direction.

[0093] S209: Turn off the water-guided laser, and record the rotation angle of the first rotating stage relative to the base 508 and the rotation angle of the second rotating stage relative to the first rotating stage.

[0094] For some embodiments of this application, please refer to Figure 4 and Figure 5In steps S205 and S206, the third direction Z extends in the left-right direction, and the water-guided laser approaches the silicon wafer 200 from left to right. When the water column 300 approaches the left side surface of the silicon wafer 200, if the left side surface of the silicon wafer 200 has a significant angle with the vertical direction, the water column 300 will fluctuate as it flows from top to bottom across the left side surface of the silicon wafer 200. The fluctuation of the water column 300 can be observed from the shape of the laser beam 400. At this time, it indicates that there is a significant tilt angle between the mounting shaft 505 and the horizontal direction. In this embodiment, the horizontal tilt angle of the mounting shaft 505 needs to be adjusted by rotating the first rotating table 509, thereby adjusting the position and orientation of the silicon wafer 200 until the left side surface of the silicon wafer 200 is basically parallel to the vertical direction, and the water column 300 will not fluctuate significantly as it flows from top to bottom across the left side surface of the silicon wafer 200. At this time, the reading of the first measuring unit 512 is recorded. During the subsequent cutting process of the workpiece 100, the reading of the first measuring unit 512 needs to maintain this recorded reading.

[0095] Please see Figure 6 , Figure 7 and Figure 8 In steps S207 and S208, the laser source is moved along the directions perpendicular to the third direction Z and the fourth direction. In this embodiment, the laser source is moved along the first direction X, causing the water-guided laser to move towards one side edge of the silicon wafer 200. When the water column 300 flows over the corresponding side edge surface of the silicon wafer 200 (i.e., the side edge of the silicon wafer 200 along the first direction X), fluctuations occur, and there is a significant angle in the horizontal direction of the surface silicon wafer 200. In this embodiment, the horizontal angle of the mounting shaft 505 needs to be adjusted by rotating the second rotary table 510, thereby adjusting the position and orientation of the silicon wafer 200 until there are no significant fluctuations when the water column 300 flows over the side edge surface of the silicon wafer 200 along the first direction X from top to bottom. At this time, the reading of the second measuring unit 513 is recorded. During the subsequent cutting process of the workpiece 100, the reading of the second measuring unit 513 needs to maintain the recorded reading.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the scope of protection of this application. Therefore, the patent protection scope of this application should be determined by the appended claims.

Claims

1. A tooling fixture, characterized by, include: A negative pressure mechanism, comprising a negative pressure generator and an adsorption tube (501) connected to the negative pressure generator, wherein the adsorption tube (501) is used to adsorb the workpiece (100) to be cut. The clamping mechanism (502) includes a mounting base (503) and a chuck (504) for clamping the adsorption tube (501). The chuck (504) is mounted on the mounting base (503) via a mounting shaft (505). When the chuck (504) is clamping the adsorption tube (501), the adsorption tube (501) is coaxially arranged with the mounting shaft (505). The chuck (504) is arranged to drive the adsorption tube (501) to rotate around the axis of the mounting shaft (505), and the adsorption tube (501) remains connected to the negative pressure generator during the rotation. as well as An adjustment platform (507) includes a base (508), a first rotary table (509) rotatably mounted on the base (508), and a second rotary table (510) rotatably mounted on the first rotary table (509). A mounting base (503) is mounted on the second rotary table (510). The direction of rotation of the first rotary table (509) relative to the axis of rotation of the base (508) is defined as the first direction X, and the direction of rotation of the second rotary table (510) relative to the axis of rotation of the first rotary table (509) is defined as the second direction Y. The first direction X and the second direction Y are at an angle to each other.

2. The tooling fixture according to claim 1, characterized in that, The inner radius of the adsorption tube (501) is greater than the radial wall thickness of the adsorption tube (501).

3. The tooling fixture according to claim 1, characterized in that, The chuck (504) is a three-jaw chuck, and the coaxiality tolerance between the centering axis of the three-jaw chuck and the mounting shaft (505) is less than 0.003 mm.

4. The tooling fixture according to claim 1, characterized in that, The angle between the first direction X and the second direction Y is 89.99°~90.01°.

5. The tooling fixture according to claim 1, characterized in that, The clamp (504) is provided with a flexible protective layer (511). When the clamp (504) holds the adsorption tube (501), the protective layer (511) is in contact with the adsorption tube (501). The material of the protective layer (511) is one of copper, aluminum, polytetrafluoroethylene or rubber.

6. The tooling fixture according to claim 1, characterized in that, A first measuring unit (512) is provided between the first rotating stage (509) and the base (508). The first measuring unit (512) is used to measure the rotation angle of the first rotating stage (509) relative to the base (508). A second measuring unit (513) is provided between the first rotating stage (509) and the second rotating stage (510). The second measuring unit (513) is used to measure the rotation angle of the second rotating stage (510) relative to the first rotating stage (509).

7. The tooling fixture according to claim 6, characterized in that, The first measuring unit (512) has an angular resolution of 0.001°, and the second measuring unit (513) has an angular resolution of 0.001°.

8. A water-guided laser cutting processing device, characterized in that, The invention includes a water-guided laser cutting machine and a tooling fixture as described in any one of claims 1 to 7, wherein the water-guided laser cutting machine generates a laser beam (400) constrained in a water column (300), the laser beam (400) being perpendicular to the mounting axis (505).

9. A water-guided laser cutting method, characterized in that, The water-guided laser cutting processing device as described in claim 8 is used to cut the workpiece (100), and the processing method includes the following cutting steps: S101: Adjust the orientation of the clamping mechanism (502) by adjusting the adjustment table (507) so that the axis of the mounting shaft (505) extends along the third direction Z; S102: The workpiece to be cut (100) is adsorbed and fixed by negative pressure adsorption through the adsorption tube (501) held in the chuck (504). S103: The water-guided laser cutting machine is running and the water-guided laser is turned on. The laser beam (400) and the water column (300) are coupled and the laser beam (400) is located in the water column (300). The laser beam (400) extends along the fourth direction to cut the workpiece (100). The fourth direction is perpendicular to the third direction Z. The cutting depth of the laser beam (400) on the workpiece (100) along the fourth direction is at least half the thickness of the workpiece (100) along the fourth direction. S104: Turn off the water-guided laser, keep the workpiece to be cut (100) in an adsorption state and keep the adsorption tube (501) in a clamping state, rotate the chuck (504) 180° around the rotation axis extending along the third direction Z, and drive the adsorption tube (501) and the workpiece to be cut (100) to rotate 180°. S105: Turn on the water-guided laser again, and the laser beam (400) cuts the workpiece (100) along the fourth direction again until the workpiece (100) is cut off along the fourth direction.

10. The water-guided laser cutting method according to claim 9, characterized in that, It also includes the following calibration steps that occur before the cutting step: S201: Install the base (508) on the worktable of the water-guided laser cutting machine; S202: Rotate the first rotary stage (509) relative to the base (508) and rotate the second rotary stage (510) relative to the first rotary stage (509) so that the axis of the mounting shaft (505) is substantially perpendicular to the extension direction of the laser beam (400); S203: The adsorption tube (501) is held by the chuck (504), and the adsorption tube (501) adsorbs a polished silicon wafer (200). The adsorption tube (501) adsorbs the silicon wafer (200) along the thickness direction of the silicon wafer (200). S204: Input current into the laser source of the water-guided laser cutting machine and turn on the water-guided laser; S205: Move the laser source along the third direction Z, so that the water-guided laser moves closer to the silicon wafer (200) along the third direction Z, until the water column (300) flows over the side of the silicon wafer (200) away from the adsorption tube (501) along the fourth direction; S206: If the water column (300) fluctuates, rotate the first rotating stage (509) and / or the second rotating stage (510) until the water column (300) flows over the side of the silicon wafer (200) away from the adsorption tube (501) in the fourth direction without fluctuation. S207: Move the laser source along the direction perpendicular to the third direction Z and the fourth direction, so that the water-guided laser moves toward one side edge of the silicon wafer (200) until the water column (300) flows along the surface of the corresponding side edge of the silicon wafer (200); S208: If the water column (300) fluctuates, rotate the first rotating stage (509) and / or the second rotating stage (510) until the water column (300) does not fluctuate when it flows through the two edge surfaces of the silicon wafer (200) along the fourth direction. At this time, the adsorption tube (501) is adjusted to the correct position. S209: Turn off the water-guided laser and record the rotation angle of the first rotating stage relative to the base (508) and the rotation angle of the second rotating stage relative to the first rotating stage.

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