An arrayed independent jetting electrofluidic chip and method of forming

Abstract

The application relates to an array type independent jetting electrofluidic chip and a forming method, which comprises the following steps: a first substrate is integrally formed with a plurality of bosses on the bottom surface, a plurality of jetting holes are formed on the top surface of the first substrate, and the jetting holes penetrate to the bottom surface of the bosses; a second substrate is provided with a plurality of penetrating jetting grooves, the second substrate is connected to the bottom surface of the first substrate, and the plurality of bosses are located in the plurality of jetting grooves; an electrode structure comprises a plurality of first electrodes and a plurality of second electrodes, the plurality of first electrodes are arranged on the top of the first substrate, and the plurality of second electrodes are arranged on the bottom of the second substrate; the plurality of first electrodes are connected with an external power supply device, the plurality of second electrodes are grounded, and the plurality of jetting holes are located in independent electric fields. According to the application, a plurality of upper and lower electrode pairs are arranged, each jetting hole is located in an independently formed electric field area, the electric field crosstalk between the jetting holes is eliminated, the jetting holes are completely controlled independently, and the printing precision is improved.

Description

Technical Field

[0001] This application relates to the field of inkjet printing technology, and in particular to an array-type independently jetted electrofluid chip and its forming method. Background Technology

[0002] Inkjet printing, as a direct-write additive manufacturing technology, boasts advantages such as no need for masks, flexible production, and high material utilization, showing promising application prospects in fields such as printed displays, printed circuits, and printed solar cells. Electrohydraulic inkjet printing, in particular, uses an electric field as the primary driving force, significantly enhancing the ink's driving power and enabling the printing of high-viscosity inks. Furthermore, because the ink is ejected locally from the meniscus, the resulting droplet size can be much smaller than the nozzle diameter, thus significantly improving printing resolution. Electrohydraulic inkjet printing technology overcomes two major drawbacks of traditional inkjet printing technologies and has broad application prospects.

[0003] In related technologies, a boss is formed by machining an annular groove on the bottom surface of a substrate, and then the boss is thinned so that the bottom surface of the boss is higher than the bottom surface of the substrate. A through-hole spraying hole is opened on the boss, and then electrodes are arranged on the bottom surface of the substrate, thereby applying voltage and using an electric field force to spray out the functional liquid.

[0004] Electrodes are arranged on the bottom surface of the substrate, forming an electric field between the electrodes and the substrate. This electric field force causes the functional liquid in the injection holes to be ejected. However, the injection holes are close together, and the electrodes at each injection hole generate relatively divergent electric fields. As a result, the electric field generated by the corresponding electrode at each injection hole can easily exert an electric field force on the functional liquid in adjacent injection holes, leading to crosstalk between electric fields. This adversely affects printing accuracy and independent control of the injection holes. Summary of the Invention

[0005] This application provides an array-type independently jetted electrohydrodynamic chip and a molding method to solve the technical problem in related technologies where crosstalk between electric fields at the jet holes adversely affects printing accuracy and independent control of the jet holes.

[0006] In a first aspect, an array-type independently ejected current-carrying chip is provided, comprising: The first substrate has multiple protrusions integrally formed on its bottom surface and multiple through-holes formed on its top surface. The multiple through-holes correspond one-to-one with the multiple protrusions in the vertical direction and the through-holes extend to the bottom surface of the protrusions. The second substrate has a plurality of through-hole spray grooves and is connected to the bottom surface of the first substrate. The plurality of protrusions are respectively located in the plurality of spray grooves. An electrode structure comprising a plurality of first electrodes and a plurality of second electrodes, wherein the plurality of first electrodes are arranged on the top of the first substrate and are respectively located at the plurality of spray holes, and the plurality of second electrodes are arranged on the bottom of the second substrate and are respectively located at the plurality of spray grooves; In this configuration, multiple first electrodes are connected to an external power supply device, multiple second electrodes are grounded, an electric field is formed between the first electrode and the corresponding second electrode, and multiple injection holes are located in independent electric fields.

[0007] In some embodiments, the positions of the plurality of protrusions are reserved on the bottom surface of the first substrate, and the remaining portion of the bottom surface of the first substrate is etched and thinned to form the plurality of protrusions.

[0008] In some embodiments, the first electrode includes a first electrode ring, the second electrode includes a second electrode ring, the first electrode ring surrounds the injection hole, and the second electrode ring surrounds the injection groove.

[0009] In some embodiments, the orthographic projection of the first electrode ring onto the plane containing the bottom of the spray groove falls entirely within the bottom of the spray groove.

[0010] In some embodiments, the electrode structure further includes a plurality of leads, each of the first electrode rings and each of the second electrode rings being connected to the leads, the leads being connected to an external flexible circuit board.

[0011] In some embodiments, the height of the boss is less than the depth of the spray groove.

[0012] In some embodiments, the first substrate includes a glass substrate, and the second substrate includes a silicon substrate.

[0013] In some embodiments, the array-type independently ejected current-carrying chip further includes a passivation layer covering the first electrode ring, the second electrode ring, and the lead surface.

[0014] In some embodiments, the array-type independently jetted current-current chip further includes a hydrophobic layer covering the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.

[0015] The beneficial effects of the technical solution provided in this application include: This application provides an array-type independently ejected electrochemical chip. Multiple vertically aligned electrode pairs are formed by arranging first electrodes corresponding one-to-one with the ejection holes on the top of a first substrate and second electrodes corresponding one-to-one with the first electrodes on the bottom of a second substrate. This ensures that each ejection hole is located within an independently formed electric field region. Compared to traditional solutions where the divergent electric fields generated by electrodes at adjacent ejection holes superimpose and interfere with each other, this method eliminates crosstalk between ejection holes by confining the electric field within a specific space between the first and second electrodes. This achieves completely independent control of the ejection from each hole, providing a reliable guarantee for high-precision parallel printing with multiple ejection holes.

[0016] By eliminating electric field crosstalk, the droplet ejection process of each nozzle is no longer affected by changes in the electric field of adjacent nozzles. The ejection threshold, droplet volume, and flight trajectory of each nozzle can be precisely and stably controlled. This significantly improves the uniformity, positioning accuracy, and edge sharpness of the printed dot matrix, avoiding problems such as inconsistent droplet volume and landing point offset caused by electric field interference in traditional technologies. It can meet the manufacturing needs of sub-micron or even nanometer-level high-resolution patterns in fields such as printed displays and printed circuits, significantly improving the printing quality of electrohydraulic inkjet printing technology.

[0017] By arranging the first and second electrodes to form a vertical electrode pair, this arrangement allows the electric field lines to pass through the injection hole more concentratedly, and the electric field intensity distribution to be more uniform and controllable. This enables the stable injection of functional liquid with a lower driving voltage, reducing the system's energy consumption and the design difficulty of the high-voltage circuit, while improving the utilization efficiency of electric field energy.

[0018] In addition, by forming spray holes and bosses on the first substrate and spray grooves on the second substrate, and then combining them to form a chip, the processing accuracy and efficiency of the bosses, spray holes and spray grooves are ensured, which is more in line with the needs of mass production.

[0019] Secondly, a method for forming an array-type independently jetted current fluid chip is provided, for forming the array-type independently jetted current fluid chip as described above, comprising the following steps: A glass substrate is obtained as the first substrate, and an array of jet holes are processed on the surface of the first substrate, with the jet holes arranged through the first substrate. The bottom surface of the first substrate is etched to partially thin the first substrate and form multiple protrusions. A silicon substrate is obtained as a second substrate, and multiple through-hole spray grooves are processed on the surface of the second substrate; The second substrate is fixed to the bottom surface of the first substrate, and the multiple protrusions are respectively located in the multiple spray grooves; A first electrode is patterned on the top surface of a first substrate; A second electrode is patterned on the bottom surface of the second substrate; A passivation layer is deposited on the surfaces of the first and second electrodes; A hydrophobic layer is formed on the surface of the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.

[0020] Another embodiment of this application provides a method for forming an array-type independently jetted current fluid chip. Since this method for forming an array-type independently jetted current fluid chip is used to form the aforementioned array-type independently jetted current fluid chip, the beneficial effects of this method are the same as those of the aforementioned array-type independently jetted current fluid chip, and will not be repeated here. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of an array-type independently ejected current-carrying chip provided in an embodiment of this application.

[0023] In the figure: 1. First substrate; 11. Boss; 1a. Spray hole; 2. Second substrate; 2a. Spray groove; 3. Electrode structure; 31. First electrode; 32. Second electrode; 33. Lead wire; 4. Passivation layer; 5. Hydrophobic layer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] This application provides an array-type independently ejected electrochemical chip and its molding method. By arranging multiple vertically aligned electrode pairs, each ejection orifice is located within an independently formed electric field region, eliminating electric field crosstalk between ejection orifices and achieving completely independent control of the ejection from each orifice, thus improving printing accuracy. This application solves the technical problem in related technologies where mutual crosstalk at the ejection orifices adversely affects printing accuracy and independent control of the ejection orifices.

[0026] Reference Figure 1An array-type independently ejected electrofluid chip includes a first substrate 1, a second substrate 2, and an electrode structure 3. The first substrate 1 and the second substrate 2 are stacked to form the main body of the chip, and the electrode structure 3 is disposed on the first substrate 1 and the second substrate 2 to form an electric field.

[0027] Reference Figure 1 The first substrate 1 has multiple protrusions 11 integrally formed on its bottom surface, and multiple through-holes 1a are formed on its top surface. The multiple through-holes 1a correspond one-to-one with the multiple protrusions 11 in the vertical direction, and the through-holes 1a extend to the bottom surface of the protrusions 11. The functional liquid enters the through-holes 1a from the top of the first substrate 1 and is then ejected from the openings of the through-holes 1a on the bottom surface of the protrusions 11.

[0028] Specifically, multiple injection holes 1a are arranged in an array, and the multiple injection holes 1a are arranged in multiple rows, with each row of injection holes 1a interleaved.

[0029] This configuration, with its multiple rows of staggered jet holes 1a, increases the spacing between adjacent jet holes 1a in each row, thereby mitigating electric field crosstalk between jet holes 1a. Furthermore, the interpolation of each row of jet holes 1a ensures a high density of jet holes 1a, meeting the high-efficiency printing requirements of large-size panels.

[0030] In this embodiment, the center line of the injection hole 1a and its corresponding boss 11 are collinear to ensure that the functional liquid flows out from the middle of the bottom surface of the boss 11, and to ensure that the functional liquid forms a stable Taylor cone on the bottom surface of the boss 11, thereby improving printing stability and accuracy.

[0031] In this embodiment, the diameter of the bottom surface of the boss 11 is 1.5-3 times the diameter of the injection hole 1a.

[0032] Reference Figure 1 Specifically, positions for multiple bosses 11 are reserved on the bottom surface of the first substrate 1, and the remaining portion of the bottom surface of the first substrate 1 is thinned by etching to form multiple bosses 11. It can be understood that the bosses 11 are integrally formed by thinning the first substrate 1 by etching.

[0033] With this configuration, the boss 11 and the first substrate 1 have good integrity. Since the boss 11 is part of the first substrate 1, it is easier to ensure the positional accuracy of the boss 11 and the injection hole 1a, thereby ensuring printing accuracy.

[0034] The bottom surface of the boss 11 is the original bottom surface of the first substrate 1. There is no need to etch the bottom surface of the boss 11. Since the bottom surface of the boss 11 has not been further processed, its flatness is guaranteed. Therefore, the functional liquid can be formed more stably on the bottom surface of the boss 11, thus ensuring the printing quality.

[0035] The second substrate 2 has multiple through-hole spray grooves 2a on its surface. The second substrate 2 is connected to the bottom surface of the first substrate 1, and multiple bosses 11 are located in the multiple spray grooves 2a respectively.

[0036] This configuration, by forming the injection hole 1a and the boss 11 on the first substrate 1 and the injection groove 2a on the second substrate 2, and then assembling them to form a chip, ensures the processing accuracy and efficiency of the boss 11, injection hole 1a, and injection groove 2a, which is more in line with the needs of mass production. It reduces the processing difficulty of the injection hole 1a and injection groove 2a and makes it easier to ensure the forming accuracy of the injection hole 1a and injection groove 2a.

[0037] Due to the arrangement of the spray groove 2a, the boss 11 is isolated, ensuring that the functional liquid forms a stable Taylor cone on the bottom surface of the boss 11. Furthermore, the distance between the boss 11 and the groove wall of the spray groove 2a can accommodate the functional liquid overflowing from the boss 11, preventing the functional liquid from spreading to the bottom of the second substrate 2.

[0038] Preferably, the center line of the spray groove 2a is aligned with that of its corresponding boss 11 to ensure that the distance between each part of the boss 11 and the wall of the spray groove 2a is consistent, thus avoiding the functional liquid from spreading due to the boss 11 being too close to the wall of the spray groove 2a.

[0039] In this embodiment, preferably, the diameter of the spray groove 2a is 1.5-3 times the diameter of the boss 11.

[0040] Reference Figure 1 The electrode structure 3 includes multiple first electrodes 31 and multiple second electrodes 32. The multiple first electrodes 31 are arranged on the top of the first substrate 1 and are respectively located at multiple spray holes 1a. The multiple second electrodes 32 are arranged on the bottom of the second substrate 2 and are respectively located at multiple spray grooves 2a.

[0041] Specifically, multiple first electrodes 31 are connected to an external power supply device, multiple second electrodes 32 are grounded, an electric field is formed between the first electrode 31 and the corresponding second electrode 32, and multiple injection holes 1a are located in independent electric fields.

[0042] This configuration, by arranging first electrodes 31 corresponding one-to-one with the jet holes 1a at the top of the first substrate 1 and second electrodes 32 corresponding one-to-one with the first electrodes 31 at the bottom of the second substrate 2, forms multiple vertically aligned electrode pairs, ensuring that each jet hole 1a is located within an independently formed electric field region. Compared to the traditional scheme where the divergent electric fields generated by the electrodes at adjacent jet holes 1a superimpose and interfere with each other, by confining the electric field within a specific space between the first electrode 31 and the second electrode 32, crosstalk between the electric fields of the jet holes 1a is eliminated, achieving completely independent control of the jetting of each jet hole 1a and providing a reliable guarantee for high-precision parallel printing of multiple jet holes 1a.

[0043] By eliminating electric field crosstalk, the droplet ejection process of each ejection orifice 1a is no longer affected by changes in the electric field of adjacent ejection orifices 1a. The ejection threshold, droplet volume, and flight trajectory of each ejection orifice 1a can be precisely and stably controlled. This significantly improves the uniformity, positioning accuracy, and edge sharpness of the printed dot matrix, avoiding problems such as inconsistent droplet volume and landing point offset caused by electric field interference in traditional technologies. It can meet the manufacturing needs of sub-micron or even nanometer-level high-resolution patterns in fields such as printed displays and printed circuits, significantly improving the printing quality of electrohydraulic inkjet printing technology.

[0044] By arranging the first electrode 31 and the second electrode 32 to form a vertical electrode pair, this arrangement allows the electric field lines to pass through the injection hole 1a more concentratedly, and the electric field intensity distribution to be more uniform and controllable. This enables the stable injection of functional liquid with a lower driving voltage, reduces the system's energy consumption and the design difficulty of the high-voltage circuit, and improves the utilization efficiency of electric field energy.

[0045] The first substrate 1 includes a glass substrate, and the second substrate 2 includes a silicon substrate. The first substrate 1 and the second substrate 2 are fixed together by anodic bonding.

[0046] With this configuration, since a voltage is applied to the first electrode 31, the first substrate 1, made of glass, can act as an insulating layer to prevent voltage breakdown of the first substrate 1, thus ensuring the normal operation of the chip. A silicon substrate 2 is used as the second substrate. Due to its high conductivity and equal potential with the grounded second electrode 32, the silicon substrate acts as a shield, further preventing electric field crosstalk. Simulation of the electric field has proven that the crosstalk problem between the injection holes 1a is under control, ensuring the injection control accuracy of each injection hole 1a.

[0047] Reference Figure 1 Furthermore, the height of the boss 11 is less than the depth of the spray groove 2a.

[0048] By fully arranging the boss 11 within the spray groove 2a and increasing the height difference between the bottom surface of the boss 11 and the second electrode 32, the spray position of the functional liquid at the bottom surface of the boss 11 is ensured to be in the middle of the electric field formed by the first electrode 31 and the second electrode 32. Therefore, the electric field strength at the spray point of the functional liquid is more stable, and it is easier to accurately and sensitively control the spray of each spray hole 1a.

[0049] Specifically, the first electrode 31 includes a first electrode ring, and the second electrode 32 includes a second electrode ring. The first electrode ring surrounds the injection hole 1a, and the second electrode ring surrounds the injection groove 2a. The first electrode ring is electrically connected to an external flexible circuit board for connection to an external power supply device, and the second electrode ring is grounded through connection to the flexible circuit board. This achieves the formation of an electric field between the first and second electrode rings.

[0050] This configuration ensures that each jet hole 1a is within an independent electric field formed by the first and second electrode rings, preventing the electric field force from easily diverging and avoiding electric field crosstalk to the functional liquid in adjacent jet holes 1a. This improves the jetting control accuracy of each jet hole 1a and guarantees printing accuracy.

[0051] Reference Figure 1 The electrode structure 3 also includes multiple leads 33, each first electrode ring and each second electrode ring is connected to a lead 33, and the lead 33 is connected to an external flexible circuit board.

[0052] Understandably, each first electrode ring and each second electrode ring are connected to an external flexible circuit board via lead 33.

[0053] Specifically, the first electrode ring, the second electrode ring, and the lead wire 33 are all formed by deposition, and the materials of the first electrode ring, the second electrode ring, and the lead wire 33 include one or more of gold, silver, copper, aluminum, and chromium.

[0054] The orthographic projection of the first electrode ring onto the plane of the bottom of the spray groove 2a falls entirely within the bottom of the spray groove 2a.

[0055] This configuration limits the electric field range at each injection hole 1a by restricting the size and arrangement of the first electrode ring, thus preventing the electric field range from becoming too large and affecting adjacent injection holes 1a.

[0056] Reference Figure 1 The array-type independently jetted current fluid chip also includes a passivation layer 4, which covers the surfaces of the first electrode ring, the second electrode ring, and the lead 33.

[0057] In this embodiment, the passivation layer 4 is made of silicon dioxide. It is formed by patterning the surfaces of the first electrode ring, the second electrode ring, and the lead 33 using a spray adhesive and metal stripping process to protect these components. In this embodiment, the ends of the lead 33 furthest from the first and second electrode rings are not covered by the passivation layer 4, leaving space for connection to the flexible circuit board.

[0058] The array-type independently jetted current fluid chip also includes a hydrophobic layer 5, which covers the passivation layer 4, the bottom surface of the boss 11, and the bottom surface of the second substrate 2.

[0059] Reference Figure 1 Specifically, the hydrophobic layer 5 is made of materials including phenelzine or Teflon, and is applied to the bottom of the second substrate 2 by sputtering to cover the structure of the bottom surface of the second substrate 2, namely, the passivation layer 4 surface, the bottom surface of the second substrate 2, and the bottom surface of the boss 11. In this embodiment, the hydrophobic layer 5 can be formed by sputtering by blocking the ends of the leads 33 away from the first and second electrode rings with a mask. The ends of the leads 33 are not covered by the hydrophobic layer 5 to leave space for connection with the flexible circuit board.

[0060] This arrangement of the hydrophobic layer 5 makes the functional liquid more stable in forming a meniscus on the bottom surface of the boss 11, preventing the functional liquid from overflowing.

[0061] This application provides an array-type independently ejected electrochemical chip. Multiple vertically aligned electrode pairs are formed by arranging first electrodes 31 corresponding one-to-one with ejection holes 1a on the top of a first substrate 1 and second electrodes 32 corresponding one-to-one with the first electrodes 31 on the bottom of a second substrate 2. This ensures that each ejection hole 1a is located within an independently formed electric field region. Compared to conventional solutions where the divergent electric fields generated by electrodes at adjacent ejection holes 1a superimpose and interfere with each other, this method eliminates electric field crosstalk between ejection holes 1a by confining the electric field within a specific space between the first electrode 31 and the second electrode 32. This achieves completely independent control of the ejection of each ejection hole 1a, providing a reliable guarantee for high-precision parallel printing of multiple ejection holes 1a.

[0062] By eliminating electric field crosstalk, the droplet ejection process of each ejection orifice 1a is no longer affected by changes in the electric field of adjacent ejection orifices 1a. The ejection threshold, droplet volume, and flight trajectory of each ejection orifice 1a can be precisely and stably controlled. This significantly improves the uniformity, positioning accuracy, and edge sharpness of the printed dot matrix, avoiding problems such as inconsistent droplet volume and landing point offset caused by electric field interference in traditional technologies. It can meet the manufacturing needs of sub-micron or even nanometer-level high-resolution patterns in fields such as printed displays and printed circuits, significantly improving the printing quality of electrohydraulic inkjet printing technology.

[0063] By arranging the first electrode 31 and the second electrode 32 to form a vertical electrode pair, this arrangement allows the electric field lines to pass through the injection hole 1a more concentratedly, and the electric field intensity distribution to be more uniform and controllable. This enables the stable injection of functional liquid with a lower driving voltage, reduces the system's energy consumption and the design difficulty of the high-voltage circuit, and improves the utilization efficiency of electric field energy.

[0064] In addition, by forming the spray hole 1a and the boss 11 on the first substrate 1 and the spray groove 2a on the second substrate 2 respectively, and then combining them to form a chip, the processing accuracy and efficiency of the boss 11, the spray hole 1a and the spray groove 2a are guaranteed, which is more in line with the needs of mass production.

[0065] Another embodiment of this application provides a method for forming an array-type independently sprayed current fluid chip, which is used to form an array-type independently sprayed current fluid chip as described above, including steps S100-S800.

[0066] S100. Obtain a glass substrate as a first substrate 1, and process an array of spray holes 1a on the surface of the first substrate 1. The spray holes 1a are arranged through the first substrate 1.

[0067] S200: Etching process is performed on the bottom surface of the first substrate 1 to partially thin the first substrate 1 and form a plurality of bosses 11.

[0068] S300: Obtain a silicon plate as a second substrate 2, and process multiple through-hole spray grooves 2a on the surface of the second substrate 2.

[0069] S400, the second substrate 2 is fixed to the bottom surface of the first substrate 1, and the plurality of protrusions 11 are respectively located in the plurality of spray grooves 2a.

[0070] S500, a first electrode 31 is patterned on the top surface of the first substrate 1.

[0071] S600, pattern the second electrode 32 on the bottom surface of the second substrate 2.

[0072] S700, a passivation layer 4 is deposited on the surfaces of the first electrode 31 and the second electrode 32.

[0073] S800, a hydrophobic layer 5 is formed on the surface of the passivation layer 4, the bottom surface of the boss 11, and the bottom surface of the second substrate 2.

[0074] In step S100, a glass substrate is obtained as the first substrate 1, and an array of spray holes 1a are processed on the surface of the first substrate 1, with the spray holes 1a arranged through the first substrate 1.

[0075] Specifically, a glass substrate is used as the first substrate 1, and multiple through-holes 1a are processed on the surface of the first substrate 1 by laser-induced etching process.

[0076] With this configuration, since the first electrode 31 for applying voltage is arranged on the surface of the first substrate 1, the insulation effect of the glass substrate is used to prevent the chip from being damaged and to ensure the normal operation of the chip.

[0077] In step S200, etching is performed on the bottom surface of the first substrate 1 to partially thin the first substrate 1 and form a plurality of protrusions 11.

[0078] Specifically, laser-induced etching is used to partially thin the bottom surface of the first substrate 1, thereby forming a plurality of first protrusions 11.

[0079] With this configuration, the first boss 11 and the first substrate 1 have better overall integrity, and the bottom surface of the first substrate 1 is retained as the bottom surface of the boss 11, ensuring the flatness of the bottom surface of the boss 11. The functional fluid can more stably form a Taylor cone on the bottom surface of the boss 11, thereby ensuring printing quality.

[0080] In step S300, a silicon plate is obtained as the second substrate 2, and multiple through-hole spray grooves 2a are processed on the surface of the second substrate 2.

[0081] Specifically, a silicon substrate is selected as the second substrate 2, and multiple spray grooves 2a are etched on the surface of the second substrate 2. Since the spray grooves 2a are arranged through the entire substrate, the processing accuracy of the multiple spray grooves 2a is more consistent.

[0082] Subsequently, the second electrode 32 is installed on the bottom surface of the second substrate 2. Since the second substrate 2 is made of silicon, the silicon has high conductivity and is at the same potential as the grounded second electrode 32, thus playing a shielding role and further avoiding electric field crosstalk. Through simulation of the electric field, it has been proven that the crosstalk problem between the injection holes 1a has been controlled to a usable state, ensuring the injection control accuracy of each injection hole 1a.

[0083] In step S400, the second substrate 2 is fixed to the bottom surface of the first substrate 1, and the plurality of protrusions 11 are respectively located in the plurality of spray grooves 2a.

[0084] Specifically, the second substrate 2 is connected to the first substrate 1 by anodic bonding. After the first substrate 1 and the second substrate 2 are fixed, the center lines of the spray groove 2a and the corresponding boss 11 are collinear.

[0085] Preferably, the distance between the outer circumferential surface of the boss 11 and the spray groove 2a is not less than 80 micrometers.

[0086] With this configuration, the second substrate 2 provides a mounting position for the second electrode 32 and also increases the distance between the boss 11 and the second electrode 32, ensuring that the spray position of the functional liquid on the bottom surface of the boss 11 is in the middle of the electric field formed by the first electrode 31 and the second electrode 32. Therefore, the electric field strength at the spray point of the functional liquid is more stable, and it is easier to accurately and sensitively control the spray of each spray hole 1a.

[0087] In step S500, the first electrode 31 is patterned on the top surface of the first substrate 1.

[0088] Specifically, a deposition process is used to pattern the first electrode 31 and simultaneously form the lead wire 33. That is, multiple first electrode rings are formed on the top of the first substrate 1, and the multiple first electrode rings and multiple injection holes 1a are coaxially corresponding. And the lead wire 33, which is electrically connected to the first electrode rings, is formed.

[0089] In step S600, the second electrode 32 is patterned on the bottom surface of the second substrate 2.

[0090] Specifically, a deposition process is used to pattern the second electrode 32 and simultaneously form the lead wire 33. That is, multiple second electrode rings are formed on the bottom of the second substrate 2, and the multiple second electrode rings and multiple spray grooves 2a are coaxially corresponding. And the lead wire 33, which is electrically connected to the second electrode rings, is formed.

[0091] In step S700, a passivation layer 4 is deposited on the surface of the first electrode 31 and the second electrode 32.

[0092] Specifically, a passivation layer 4 is deposited on the surfaces of the first electrode ring, the second electrode ring, and the lead 3333. The passivation layer 4 is preferably silicon dioxide, and its thickness is preferably 300-500 nanometers. A spray adhesive and metal stripping process is used to cover the surface of the first electrode ring, the second electrode ring, and the lead 33 with the passivation layer 4 to protect them. In this embodiment, each lead 33 is not covered with the passivation layer 4 away from the first or second electrode ring it is connected to, to reserve a connection position with the flexible circuit board.

[0093] In step S800, a hydrophobic layer 5 is formed on the surface of the passivation layer 4, the bottom surface of the boss 11, and the bottom surface of the second substrate 2.

[0094] Specifically, the hydrophobic layer 5 is made of materials including phenelzine or Teflon, and is applied to the bottom surface of the second substrate 2 by a sputtering process to cover the structure of the bottom surface of the second substrate 2, namely, covering the surface of the passivation layer 4 at the bottom of the second substrate 2 and the bottom surface of the second substrate 2. It also covers the bottom surface of the boss 11. Preferably, the thickness of the hydrophobic layer 5 is 1-5 micrometers. In this embodiment, the hydrophobic layer 5 is formed by sputtering by masking the ends of the leads 33.

[0095] This arrangement of the hydrophobic layer 5 allows the functional liquid to form a Taylor cone on the bottom surface of the boss 11, preventing the functional liquid from overflowing.

[0096] Another embodiment of this application provides a method for forming an array-type independently jetted current fluid chip. Since this method for forming an array-type independently jetted current fluid chip is used to form the aforementioned array-type independently jetted current fluid chip, the beneficial effects of this method are the same as those of the aforementioned array-type independently jetted current fluid chip, and will not be repeated here.

[0097] In the description of this application, it should be noted that the terms "upper," "lower," etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Unless otherwise expressly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two elements. For those skilled in the art, the specific meaning of the above terms in this application can be understood according to the specific circumstances.

[0098] It should be noted that in this application, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0099] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. An array-type independently ejected current-carrying chip, characterized in that, It includes: The first substrate has multiple protrusions integrally formed on its bottom surface and multiple through-holes formed on its top surface. The multiple through-holes correspond one-to-one with the multiple protrusions in the vertical direction and the through-holes extend to the bottom surface of the protrusions. The second substrate has a plurality of through-hole spray grooves and is connected to the bottom surface of the first substrate. The plurality of protrusions are respectively located in the plurality of spray grooves. An electrode structure comprising a plurality of first electrodes and a plurality of second electrodes, wherein the plurality of first electrodes are arranged on the top of the first substrate and are respectively located at the plurality of spray holes, and the plurality of second electrodes are arranged on the bottom of the second substrate and are respectively located at the plurality of spray grooves; In this configuration, multiple first electrodes are connected to an external power supply device, multiple second electrodes are grounded, an electric field is formed between the first electrode and the corresponding second electrode, and multiple injection holes are located in independent electric fields.

2. The array-type independently ejected current-carrying chip according to claim 1, characterized in that, The positions of the multiple protrusions are reserved on the bottom surface of the first substrate, and the remaining part of the bottom surface of the first substrate is etched and thinned to form the multiple protrusions.

3. The array-type independently injected current-carrying chip according to claim 1, characterized in that, The first electrode includes a first electrode ring, and the second electrode includes a second electrode ring. The first electrode ring surrounds the injection hole, and the second electrode ring surrounds the injection groove.

4. The array-type independently ejected current-carrying chip according to claim 3, characterized in that, The orthographic projection of the first electrode ring onto the plane containing the bottom of the spray groove falls entirely within the bottom of the spray groove.

5. The array-type independently ejected current-carrying chip according to claim 3, characterized in that, The electrode structure also includes multiple leads, each of the first electrode rings and each of the second electrode rings is connected to the leads, and the leads are connected to an external flexible circuit board.

6. The array-type independently ejected current-carrying chip according to claim 1, characterized in that, The height of the boss is less than the depth of the spray groove.

7. The array-type independently ejected current-carrying chip according to claim 1, characterized in that, The first substrate includes a glass substrate, and the second substrate includes a silicon substrate.

8. The array-type independently ejected current-carrying chip according to claim 4, characterized in that, It also includes a passivation layer that covers the first electrode ring, the second electrode ring, and the lead surface.

9. The array-type independently ejected current-carrying chip according to claim 8, characterized in that, It also includes a hydrophobic layer that covers the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.

10. A method for molding an array-type independently jetted current fluid chip, for molding an array-type independently jetted current fluid chip as described in any one of claims 1 to 9, comprising the following steps: A glass substrate is obtained as the first substrate, and an array of jet holes are processed on the surface of the first substrate, with the jet holes arranged through the first substrate. The bottom surface of the first substrate is etched to partially thin the first substrate and form multiple protrusions. A silicon substrate is obtained as a second substrate, and multiple through-hole spray grooves are processed on the surface of the second substrate; The second substrate is fixed to the bottom surface of the first substrate, and the multiple protrusions are respectively located in the multiple spray grooves; A first electrode is patterned on the top surface of a first substrate; A second electrode is patterned on the bottom surface of the second substrate; A passivation layer is deposited on the surfaces of the first and second electrodes; A hydrophobic layer is formed on the surface of the passivation layer, the bottom surface of the boss, and the bottom surface of the second substrate.

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