A middle frame assembly for an intelligent automobile cockpit

Abstract

The application relates to the field of automobile technology, in particular to a middle frame assembly for an automobile intelligent cabin, which comprises an assembling frame, the top of the assembling frame is provided with an assembling top cover, a plurality of air exchange plates are arranged in the assembling top cover, the air exchange plates are matched with the assembling frame, a plurality of supporting columns are arranged in the assembling frame and connected with the air exchange plates, the assembling frame comprises a frame body arranged at the bottom of the assembling top cover, a plurality of fixed plates are arranged at the four corners of the frame body, and a plurality of fixed holes are formed in the middle of the fixed plates. The middle frame assembly for the automobile intelligent cabin is designed, the fixed plates and the fixed holes of the assembling frame are used for realizing stable assembly with a support of the automobile intelligent cabin, the concentrated stress at the four corners of the frame body is dispersed by cooperating with a reinforcing frame, the local strength deficiency of the frame body is compensated, and the overall torsional rigidity and fatigue resistance of the assembling frame are improved.

Description

Technical Field

[0001] This invention relates to the field of automotive technology, and more particularly to a mid-frame assembly for an automotive smart cockpit. Background Technology

[0002] With the continuous development of automotive intelligence and connectivity technologies, automotive intelligent cockpits, as the core carrier of in-vehicle electronic equipment, are widely used in the intelligent control systems of various passenger cars and commercial vehicles. The internal frame components serve as key support and assembly structures for the in-vehicle host, PCB board, and various electronic components. The frame components used in automotive intelligent cockpits are key components for achieving precise assembly, efficient heat dissipation, and reliable fixation of in-vehicle electronic components. Their core function is to provide stable mounting support for the core chip of the in-vehicle host, auxiliary electronic components, and PCB board, dissipate the heat generated by the equipment during operation, resist the impact of long-term random vibrations in the vehicle, and achieve precise docking with the automotive intelligent cockpit bracket to meet automotive-grade electromagnetic compatibility requirements.

[0003] However, most existing mid-frame components used in automotive smart cockpits lack a complete three-dimensional heat dissipation system in actual use. They mostly adopt a single bottom heat dissipation or side heat dissipation structure, which cannot quickly dissipate the heat generated by the core chip. Long-term use can easily lead to heat accumulation, causing the vehicle host to lag and shorten its lifespan. It cannot effectively solve the high temperature hazard of long-term operation of vehicle equipment. At the same time, the connection between the mid-frame and the PCB board is mostly simple bolt fixation, lacking a precise anti-vibration positioning structure. When exposed to random vibration environment in the vehicle for a long time, the PCB board is prone to displacement and solder joint detachment. Furthermore, stress concentration at the four corners of the frame leads to deformation and cracking, and the overall structure has insufficient torsional stiffness and fatigue resistance.

[0004] No effective solutions have yet been proposed to address the problems in the relevant technologies. Summary of the Invention

[0005] The purpose of this invention is to address the shortcomings of existing technologies by proposing a mid-frame assembly for automotive smart cockpits.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a mid-frame assembly for an automotive intelligent cockpit, comprising an assembly frame, an assembly top cover being provided on the top of the assembly frame, a plurality of ventilation plates being provided inside the assembly top cover, and the ventilation plates cooperating with the assembly frame, and a plurality of support columns being provided inside the assembly frame, and the support columns being connected to the ventilation plates.

[0007] As a further description of the above technical solution: the assembly frame includes a frame body disposed at the bottom of the assembly top cover. Several fixing plates are disposed at the four corners of the frame body, and several fixing holes are opened in the middle of the fixing plates. A reinforcing frame is disposed on one side of the fixing plates and is connected to the frame body. The assembly frame also includes a mounting lug disposed at one end of the frame body, and a signal port and a power port are opened at the other end of the frame body. Several heat dissipation fins are disposed on both sides of the frame body, and several heat dissipation holes are opened between adjacent heat dissipation fins. By setting the fixing plates and fixing holes, the assembly frame is connected to the automotive intelligent system. The cockpit bracket is assembled, while the reinforcing frame is integrated with the frame, distributing the stress on the fixing plate, compensating for stress concentration at the four corners of the frame, and improving the overall torsional stiffness and fatigue resistance of the assembled frame. At the same time, the mounting ears are installed for auxiliary positioning and fixing of the middle frame components to improve assembly stability. Meanwhile, the signal port and power port are used to run the signal harness and power harness of the vehicle host respectively, realizing the docking of external devices with the host and avoiding scratches when the harness is inserted. The heat dissipation fins and heat dissipation holes on both sides work together to increase the heat dissipation area, accelerate the dissipation of heat from inside the frame to the outside, and solve the high temperature risk of long-term operation of the vehicle host.

[0008] As a further description of the above technical solution: The top of the frame is provided with several mating plates, each with a mating hole in its center, which mates with the assembled top cover. The interior of the frame is provided with a chip bonding platform and a support frame, with several support holes between the chip bonding platform and the support frame. The bottom of the frame has several ventilation holes. The top of the chip bonding platform is provided with several positioning posts, with several venting holes between adjacent positioning posts. Each positioning post has a through hole in its center. The platform height of the chip bonding platform is higher than that of the support frame. Both the chip bonding platform and the support frame are made of die-cast aluminum alloy. By using mating plates and mating holes, a positioning reference is provided for the assembled top cover and frame, ensuring flatness during assembly and preventing gaps or defects after assembly. The offset design features a chip bonding platform to support the core heat-generating chip of the vehicle's main unit, while the support frame holds auxiliary electronic components. The height difference between the two platforms accommodates electronic component packages of varying heights, enabling partitioned assembly and improving space utilization. The die-cast aluminum alloy material combines excellent thermal conductivity with structural rigidity, quickly conducting the heat generated by the chip and preventing deformation of the bonding platform or support frame due to vehicle vibration. Positioning posts prevent PCB displacement and solder joint detachment during vehicle vibration, and through holes allow for the insertion of fixing bolts to further reinforce the PCB. Ventilation holes connect with the ventilation holes at the bottom of the frame, forming a vertically integrated airflow channel. Combined with heat sink fins and ventilation holes, this creates a complete three-dimensional heat dissipation system, preventing heat buildup at the chip bonding area. Support holes provide a mounting base for the support posts, ensuring a secure connection.

[0009] As a further description of the above technical solution: the assembled top cover includes a cover body disposed on the top of the frame. The top of the cover body has several assembly holes, the middle of the cover body has a handle groove, the top of the handle groove has a handle rod, the two sides of the cover body are provided with assembly plates, and the bottom of the cover body has several placement grooves. The cover body is used to seal and protect the electronic components and PCB board inside the frame, improving the environmental adaptability of the middle frame assembly. The assembly holes and docking holes correspond to each other, providing connection points for fixing the assembled top cover to the frame body. The handle groove and handle rod cooperate to provide convenient force points for the assembly top cover to be disassembled and assembled, reducing the difficulty of later maintenance and improving assembly and maintenance efficiency. At the same time, the assembly plates are used for fitting and positioning with the interior of the car's intelligent cockpit, ensuring that the middle frame assembly is seamlessly connected with the interior of the cockpit after installation, improving the overall aesthetics. The placement grooves are used to position the ventilation plate, preventing the ventilation plate from shifting when the vehicle vibrates, ensuring that the ventilation plate's heat dissipation and ventilation functions are stable.

[0010] As a further description of the above technical solution: the assembly hole and the docking hole are connected by bolts, the placement groove cooperates with the ventilation plate, and the top of the ventilation plate is made of metal and has several air outlets. The bolt connection method realizes the detachable fixing of the assembly top cover and the frame, while ensuring the sealing after assembly. The cooperation between the placement groove and the ventilation plate limits the installation position of the ventilation plate and prevents it from moving laterally. At the same time, the ventilation plate is made of metal, which helps to conduct heat inside the frame. It works with the air outlets and the ventilation holes and vents of the frame to form airflow circulation, accelerate heat dissipation, and the rigidity of the metal material can improve the load-bearing capacity of the ventilation plate and prevent it from deforming due to the pressure of the support column.

[0011] As a further description of the above technical solution: the bottom of the support column is provided with threads, the support hole is provided with a threaded groove, and the threaded groove inside the support hole cooperates with the thread at the bottom of the support column. The support column and the frame are detachably connected through the threaded cooperation, which makes it easy to adjust the height of the support column according to the thickness of the PCB board and the ventilation plate, ensuring that the support column can firmly clamp the ventilation plate and the PCB board, improving the installation stability of the two. At the same time, the rigidity of the threaded connection is strong, which can disperse the stress generated by vehicle vibration, prevent the support column from loosening, and further ensure the connection reliability of each component inside the middle frame assembly.

[0012] As a further description of the above technical solution: the mounting lug has an integrally formed limiting boss on the side near the frame, and the limiting boss abuts against the vehicle mounting bracket for limiting. The mounting lug is provided with a grounding mounting hole, and the grounding mounting hole is treated with exposed copper. By setting the limiting boss to abut against the vehicle mounting bracket, the lateral movement of the assembly frame is limited during vehicle vibration, achieving anti-loosening positioning, avoiding overall displacement of the middle frame assembly or abnormal noise, and improving assembly stability. The grounding mounting hole is used to achieve reliable grounding of the middle frame assembly and the vehicle body, and the exposed copper treatment reduces the grounding resistance, enhances conductivity, shields electromagnetic interference generated by vehicle electronic equipment, and avoids external electromagnetic signals from interfering with the vehicle host, meeting automotive-grade EMC electromagnetic compatibility requirements and ensuring the normal operation of the vehicle host.

[0013] The present invention has the following beneficial effects:

[0014] 1. The mid-frame assembly for automotive intelligent cockpits designed in this invention achieves stable assembly with the automotive intelligent cockpit bracket through the fixing plate and fixing holes of the assembly frame. The reinforcing frame disperses the concentrated stress at the four corners of the frame, compensating for insufficient local strength and improving the overall torsional stiffness and fatigue resistance of the assembly frame. This prevents the frame from deforming or cracking due to long-term vibration in the vehicle. Simultaneously, the limiting boss of the mounting lug abuts against the vehicle mounting bracket, achieving anti-loosening positioning of the mid-frame assembly and preventing overall displacement or abnormal noise. The exposed copper treatment of the grounding mounting hole reduces grounding resistance, shields electromagnetic interference to meet automotive-grade EMC electromagnetic compatibility requirements, and the heat dissipation fins and heat dissipation holes on both sides of the frame work together to increase the heat dissipation area. Combined with the chip bonding platform, vents, and air exchange holes, a complete three-dimensional heat dissipation system is constructed to solve the high-temperature hazard of long-term operation of the vehicle's main unit. The optimized design of the signal port and power port avoids scratches from wire harness insertion. The overall structure achieves a synergistic effect of stable assembly, efficient heat dissipation, and electromagnetic shielding, meeting the long-term use requirements of automotive intelligent cockpits.

[0015] 2. The mid-frame assembly for automotive intelligent cockpits designed in this invention utilizes a partitioned design of the chip bonding platform and the carrier frame to accommodate electronic component packages of different heights, improving space utilization. The die-cast aluminum alloy material combines excellent thermal conductivity and structural rigidity, enabling rapid heat conduction from the core chip while resisting vehicle vibration and impact. The synergistic action of the positioning and support columns ensures precise PCB board positioning, preventing displacement and solder joint detachment due to vibration. Threaded clamping of the ventilation plate and PCB board enhances installation stability. The bolted connection between the top cover and the frame allows for detachable fixing, facilitating future maintenance. The grip slot and handle reduce disassembly difficulty, and the placement slot ensures stable ventilation and heat dissipation. The assembly plate seamlessly integrates with the cockpit interior. The overall structure balances ease of assembly, structural reliability, and aesthetics, extending the overall lifespan of the mid-frame assembly and improving the operational stability and durability of the automotive intelligent cockpit's onboard equipment. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0017] Figure 2 This is a three-dimensional schematic diagram of the overall structure of the present invention;

[0018] Figure 3 This is a schematic diagram of the assembly frame structure in this invention;

[0019] Figure 4 This is one of the schematic diagrams of the assembled top cover structure in this invention;

[0020] Figure 5 This is the second schematic diagram of the assembled top cover structure in this invention.

[0021] Legend:

[0022] 1. Assembly frame; 11. Frame body; 12. Fixing plate; 13. Fixing hole; 14. Reinforcing frame; 15. Mounting lug; 16. Signal port; 17. Power port; 18. Heat sink fins; 19. Heat dissipation hole; 110. Connecting plate; 111. Connecting hole; 112. Chip bonding platform; 113. Carrier frame; 114. Support hole; 115. Ventilation hole; 116. Positioning post; 117. Vent hole; 118. Through hole; 2. Assembly top cover; 21. Cover body; 22. Assembly hole; 23. Grip slot; 24. Grip bar; 25. Assembly plate; 26. Placement slot; 3. Ventilation plate; 31. Vent hole; 4. Support post. Detailed Implementation

[0023] Reference Figures 1 to 5The present invention provides a mid-frame assembly for an automotive intelligent cockpit, comprising an assembly frame 1, an assembly top cover 2 provided on the top of the assembly frame 1, a plurality of ventilation plates 3 provided inside the assembly top cover 2, the ventilation plates 3 cooperating with the assembly frame 1, and a plurality of support columns 4 provided inside the assembly frame 1, the support columns 4 being connected to the ventilation plates 3.

[0024] As a further implementation of the above technical solution: the assembly frame 1 includes a frame body 11 disposed at the bottom of the assembly top cover 2. Several fixing plates 12 are disposed at the four corners of the frame body 11. Several fixing holes 13 are opened in the middle of the fixing plates 12. A reinforcing frame 14 is disposed on one side of the fixing plate 12 and is connected to the frame body 11. The assembly frame 1 also includes a mounting lug 15 disposed at one end of the frame body 11. A signal port 16 and a power port 17 are opened at the other end of the frame body 11. Several heat dissipation fins 18 are disposed on both sides of the frame body 11, and several heat dissipation holes 19 are opened between adjacent heat dissipation fins 18. In use, the frame body 11 is made of die-cast aluminum alloy ADC12 material, manufactured by high-pressure die casting process, with an overall thickness of 3mm to ensure automotive-grade structural rigidity and thermal conductivity. The fixing plates 12 are integrally formed with the frame body 11, with a thickness of 2.5mm. The fixing holes 13 are M4 threaded holes with a depth of 8mm. The frame 11 is uniformly spaced with bolts, facilitating a secure connection to the automotive intelligent cockpit bracket. The reinforcing frame 14 has a U-shaped structure and is fully welded to the frame 11 with a weld width of 3mm. This disperses the stress on the fixing plate 12, compensates for stress concentration at the four corners of the frame 11, and improves the overall torsional rigidity and fatigue resistance of the assembly frame 1. The mounting lugs 15 are integrally forged with the frame 11, with a thickness of 3mm and a width of 15mm, ensuring load-bearing capacity during auxiliary positioning. The opening sizes of the signal port 16 and power port 17 are adapted to the vehicle signal and power wiring harnesses, respectively, with C0.5mm chamfered edges to prevent scratches during wiring harness insertion. The heat dissipation fins 18 have a comb-like structure, 1mm thick, 15mm high, and 4mm spaced, integrally formed with the frame 11. The heat dissipation holes 19 have a diameter of 2mm and a hole spacing of 4mm, aligned with the direction of the heat dissipation fins 18, increasing the heat dissipation area while ensuring smooth natural airflow inside the center console, accelerating heat dissipation.

[0025] As a further implementation of the above technical solution: The top of the frame 11 is provided with several docking plates 110, each docking plate 110 having a docking hole 111 in the middle, and the docking hole 111 mates with the assembly top cover 2. The interior of the frame 11 is provided with a chip bonding platform 112 and a support frame 113, and several support holes 114 are provided between the chip bonding platform 112 and the support frame 113. The bottom inner surface of the frame 11 is provided with several ventilation holes 115. The top of the chip bonding platform 112 is provided with several... The positioning post 116 has several ventilation holes 117 between each pair of adjacent positioning posts 116. A through hole 118 is provided in the middle of each positioning post 116. The platform height of the chip bonding stage 112 is higher than the platform height of the support frame 113. Both the chip bonding stage 112 and the support frame 113 are made of die-cast aluminum alloy. During use, the mating plate 110 is integrally formed with the frame 11, with a thickness of 2mm. The mating hole 111 is an M3 threaded hole, precisely aligned with the assembly hole 22 of the top cover 2, with a fit tolerance ≤0.1mm. Ensure the top cover 2 and frame 11 are assembled flat and without misalignment or gaps. Both the chip bonding platform 112 and the carrier frame 113 are made of die-cast aluminum alloy ADC12, integrally die-cast with the frame 11. The chip bonding platform 112 is 2mm higher than the carrier frame 113, accommodating electronic component packages of different heights and enabling precise partitioned assembly. The positioning post 116 is 5mm high and 3mm in diameter, with a 0.5mm chamfer on the top to fit snugly against the PCB board positioning holes, with a tolerance of 0.05-0.1mm to prevent scratching. The CB board has copper foil with through holes 118 (2mm diameter) for inserting M2 fixing bolts to further reinforce the PCB board. Meanwhile, ventilation holes 117 (1.5mm diameter, 3mm spacing) and venting holes 115 (2mm diameter, 4mm spacing) are interconnected to form a vertical airflow channel. Together with heat sink fins 18 and heat sink holes 19, they form a complete three-dimensional heat dissipation system. The support hole 114 is a blind hole with a threaded groove, M3 thread specification, and 6mm depth, which precisely matches the thread of the support column 4 to ensure a firm connection of the support column 4.

[0026] As a further implementation of the above technical solution: the assembled top cover 2 includes a cover body 21 disposed on the top of the frame 11. The top of the cover body 21 has several assembly holes 22, the middle of the cover body 21 has a handle groove 23, the top of the handle groove 23 has a handle 24, both sides of the cover body 21 have assembly plates 25, and the bottom of the cover body 21 has several placement grooves 26. In use, the cover body 21 is made of cold-rolled steel plate with a thickness of 1.5mm, manufactured by stamping, and the surface is treated with black powder coating with a thickness of 60-80μm, combining corrosion resistance and aesthetics. The assembly holes 22 and... The mating holes 111 are one-to-one, with a diameter of 3.2mm, which facilitates the through-fixing of M3 bolts. The grip groove 23 is 50mm long, 20mm wide, and 5mm deep. The grip bar 24 is made of 304 stainless steel with a diameter of 8mm and is welded to the cover 21, providing a convenient force point for the assembly and disassembly of the top cover 2 and reducing the difficulty of later maintenance. At the same time, the assembly plate 25 is 2mm thick and is integrally bent and formed with the cover 21 to fit the interior of the car's intelligent cockpit, ensuring a seamless connection after the middle frame components are installed. The placement groove 26 is 2mm deep and its width is adapted to the ventilation plate 3, and it transitions with the ventilation plate 3 to prevent the ventilation plate 3 from shifting when the vehicle vibrates.

[0027] As a further implementation of the above technical solution: the assembly hole 22 and the docking hole 111 are connected by bolts, the placement groove 26 cooperates with the ventilation plate 3, and the top of the ventilation plate 3 is made of metal and has several air outlet holes 31. In use, the assembly hole 22 and the docking hole 111 are connected by M3 flange anti-loosening bolts, and the bolt tightening torque is 5±0.5N・m, so as to realize the detachable fixing of the top cover 2 and the frame 11, while ensuring the sealing after assembly and preventing dust and moisture from entering; the placement groove 26 and the ventilation plate 3 are connected by bolts. The air plate 3 is fitted with a transition tolerance of 0.05-0.1mm to limit its lateral movement. The air plate 3 is made of 304 stainless steel with a thickness of 1mm and a passivated surface. The air outlet 31 has a diameter of 2mm and a spacing of 3mm. It is precisely aligned with the air outlet 115 of the frame 11 and the air vent 117 of the chip bonding platform 112 to form a complete airflow circulation, which helps to conduct heat inside the frame 11. At the same time, the rigidity of the metal material can improve the load-bearing capacity of the air plate 3 and prevent it from deforming due to the pressure of the support column 4.

[0028] As a further implementation of the above technical solution: the bottom of the support column 4 is provided with threads, the support hole 114 is provided with a threaded groove, and the threaded groove inside the support hole 114 is engaged with the thread at the bottom of the support column 4. When in use, the support column 4 is made of 45 steel with a galvanized surface, has a diameter of 3mm, and its length can be adjusted according to the thickness of the PCB board and the ventilation plate 3 (adjustment range 4-8mm). The bottom thread specification is M3, which is fitted with the threaded groove of the support hole 114 with a clearance tolerance ≤0.05mm. This facilitates the disassembly and height adjustment of the support column 4, and the threaded connection has strong rigidity, which can disperse the stress generated by random vibration of the vehicle, prevent the support column 4 from loosening, ensure that the support column 4 firmly clamps the ventilation plate 3 and the PCB board, improve the installation stability of the two, and ensure the connection reliability of each component inside the middle frame assembly.

[0029] As a further implementation of the above technical solution: the mounting lug 15 has an integrally formed limiting boss on the side near the frame 11, and the limiting boss abuts against and limits the vehicle mounting bracket. The mounting lug 15 is provided with a grounding mounting hole, and the grounding mounting hole is treated with exposed copper. In use, the limiting boss and the mounting lug 15 are integrally forged and formed, with a height of 2mm and a width of 5mm. The top is chamfered at C0.3mm, and it is fitted with the vehicle mounting bracket with a clearance tolerance of 0.1mm. This limits the lateral movement of the assembly frame 1 during vehicle vibration, achieves anti-loosening positioning, and avoids the overall displacement of the middle frame assembly or the generation of abnormal noise. The grounding mounting hole is an M3 threaded hole with a hole depth of 6mm. The exposed copper treatment adopts a chemical tin plating process with a tin plating thickness of 0.1mm, which reduces the grounding resistance and enhances the conductivity. It is reliably grounded to the vehicle body through the copper strip, shielding the electromagnetic interference generated by the vehicle electronic equipment, and resisting the influence of external electromagnetic signals on the vehicle host, meeting the automotive-grade EMC electromagnetic compatibility requirements, and ensuring the normal operation of the vehicle host.

[0030] Working principle:

[0031] When using this invention, the assembly frame 1 and the assembly top cover 2 are used as the overall installation base. The assembly frame 1 is firmly connected to the automotive intelligent cockpit bracket with bolts through the fixing plates 12 at the four corners of the frame 11 and the M4 threaded fixing holes 13. The limiting boss of the mounting lug 15 abuts against the vehicle mounting bracket to limit the position, providing stable installation positioning for the entire middle frame assembly. At the same time, the reinforcing frame 14 disperses the force on the fixing plate 12, compensates for the stress concentration at the four corners of the frame 11, ensures the overall torsional rigidity of the assembly frame 1, and provides reliable support for the internal electronic components.

[0032] During normal operation of the mid-frame assembly, the core chip of the vehicle host is attached to the chip bonding platform 112, and the auxiliary electronic components are placed on the carrier frame 113. The height difference between the two is adapted to components with different package heights, achieving precise partitioning and assembly. The positioning post 116 penetrates the positioning hole of the PCB board and, together with the M2 fixing bolt in the through hole 118, firmly fixes the PCB board. At the same time, the support post 4 precisely engages with the thread groove of the support hole 114 through the bottom M3 thread. After adjusting the height according to the thickness of the PCB board and the ventilation plate 3, it firmly clamps the ventilation plate 3 and the PCB board. With the precision thread engagement with a tolerance of ≤0.05mm, it ensures that the two are firmly installed, disperses the stress generated by random vibration of the vehicle, and avoids PCB board displacement, solder joint detachment, and ventilation plate 3 movement.

[0033] When the vehicle host generates heat during operation, the heat from the core chip is quickly conducted to the frame 11 through the die-cast aluminum alloy ADC12 chip bonding platform 112. Part of the heat is directly dissipated to the outside through the comb-shaped heat dissipation fins 18 and heat dissipation holes 19 on both sides of the frame 11; another part of the heat is conducted to the bottom of the frame 11 through the vent holes 117 on the chip bonding platform 112, forming a vertical airflow channel with the ventilation holes 115. Together with the air outlet 31 of the ventilation plate 3, a complete airflow circulation is formed, which accelerates the convection of hot air inside the frame 11, further improves the heat dissipation efficiency, and avoids heat accumulation that could cause the vehicle host to malfunction or be damaged.

[0034] When the vehicle vibrates randomly during driving, the limiting boss and the vehicle mounting bracket are fitted with a clearance to restrict the lateral movement of the assembly frame 1, achieving anti-loosening positioning and preventing the overall displacement of the middle frame assembly or the generation of abnormal noise. At the same time, the full welding connection between the reinforcing frame 14 and the frame 11 and the threaded rigid connection of the support column 4 further improve the vibration resistance of the overall structure, preventing the frame 11 from deforming and the components from loosening. The grounding mounting hole on the mounting lug 15 is treated with exposed copper and reliably grounded to the vehicle body through a copper strip, reducing the grounding resistance, effectively shielding the electromagnetic interference generated by the vehicle electronic equipment, and resisting the influence of external electromagnetic signals, meeting the automotive-grade EMC electromagnetic compatibility requirements, and ensuring the normal operation of the vehicle host.

[0035] Finally, it should be noted that the above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A mid-frame assembly for an automotive smart cockpit, characterized in that, The assembly includes an assembly frame (1), an assembly top cover (2) is provided on the top of the assembly frame (1), a plurality of ventilation plates (3) are provided inside the assembly top cover (2), and the ventilation plates (3) cooperate with the assembly frame (1). A plurality of support columns (4) are provided inside the assembly frame (1), and the support columns (4) are connected to the ventilation plates (3).

2. The mid-frame assembly for an automotive intelligent cockpit according to claim 1, characterized in that: The assembly frame (1) includes a frame (11) located at the bottom of the assembly top cover (2). Several fixing plates (12) are provided at the four corners of the frame (11). Several fixing holes (13) are provided in the middle of the fixing plates (12). A reinforcing frame (14) is provided on one side of the fixing plate (12), and the reinforcing frame (14) is connected to the frame (11).

3. A mid-frame assembly for an automotive smart cockpit according to claim 2, characterized in that: The assembly frame (1) also includes a mounting ear (15) at one end of the frame (11), and a signal port (16) and a power port (17) are provided at the other end of the frame (11). Several heat dissipation fins (18) are provided on both sides of the frame (11), and several heat dissipation holes (19) are provided between each pair of adjacent heat dissipation fins (18).

4. A mid-frame assembly for an automotive intelligent cockpit according to claim 3, characterized in that: The top of the frame (11) is provided with several docking plates (110), and the middle of the docking plate (110) is provided with docking holes (111), and the docking holes (111) cooperate with the assembly top cover (2). The inside of the frame (11) is provided with a chip bonding platform (112) and a carrier frame (113), and several support holes (114) are provided between the chip bonding platform (112) and the carrier frame (113). Several ventilation holes (115) are provided at the bottom of the frame (11).

5. A mid-frame assembly for an automotive intelligent cockpit according to claim 4, characterized in that: The chip bonding stage (112) has a number of positioning posts (116) on its top, and a number of ventilation holes (117) are provided between each pair of adjacent positioning posts (116). A through hole (118) is provided in the middle of the positioning post (116).

6. A mid-frame assembly for an automotive intelligent cockpit according to claim 3, characterized in that: The assembled top cover (2) includes a cover (21) set on the top of the frame (11). The top of the cover (21) is provided with several assembly holes (22). The middle part of the cover (21) is provided with a handle groove (23). The top of the handle groove (23) is provided with a handle bar (24). Both sides of the cover (21) are provided with assembly plates (25). The bottom of the cover (21) is provided with several placement grooves (26).

7. A mid-frame assembly for an automotive intelligent cockpit according to claim 5, characterized in that: The assembly hole (22) and the docking hole (111) are connected by bolts. The placement groove (26) is matched with the ventilation plate (3). The top of the ventilation plate (3) is made of metal and has several air outlet holes (31).

8. A mid-frame assembly for an automotive intelligent cockpit according to claim 5, characterized in that: The bottom of the support column (4) is provided with threads, the support hole (114) is provided with a threaded groove, and the threaded groove inside the support hole (114) is engaged with the threaded bottom of the support column (4).

9. A mid-frame assembly for an automotive smart cockpit according to claim 3, characterized in that: The mounting lug (15) has an integrally formed limiting boss on the side near the frame (11), and the limiting boss abuts against the vehicle mounting bracket for limiting. The mounting lug (15) is provided with a grounding mounting hole, and the grounding mounting hole is treated to expose copper.

10. A mid-frame assembly for an automotive smart cockpit according to claim 4, characterized in that: The height of the chip bonding stage (112) is higher than that of the support frame (113), and the chip bonding stage (112) and the support frame (113) are made of die-cast aluminum alloy.

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