Flexible solar wing cell chip bonding material for satellites and preparation method thereof
CN122503078BActive Publication Date: 2026-10-27ZHEJIANG SHANGLIN TECH INC
Patent Information
- Application Number
- CN202610956044.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2026-06-30
- Publication Date
- 2026-10-27
- Estimated Expiration
- 2046-06-30
AI Technical Summary
Technical Problem
该发明能承受外部较高的剪切推力高，胶层产生的应力低，粘结力强，但其力学性能有待提高
Benefits of technology
[0017]综上，本申请制备的卫星用柔性太阳翼电池芯片粘接材料具有优异的硬度、拉伸强度、断裂伸长率、剪切强度和导热系数、冷热循环强度保持率。
✦ Generated by Eureka AI based on patent content.
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Figure CN122503078B_ABST
Abstract
The application discloses a satellite flexible solar wing battery chip bonding material and a preparation method thereof, and relates to the technical field of chip bonding materials.The satellite flexible solar wing battery chip bonding material is prepared by mixing an A component and a B component according to a mass ratio of 1:(0.05-0.1).The A component comprises the following raw materials in parts by weight: 100 parts of special resin, 5-8 parts of diluent, 30-40 parts of modified functional filler, 0.1-0.5 parts of defoaming agent and 0.1-0.5 parts of leveling agent.The B component comprises the following raw materials in parts by weight: 50-70 parts of polysilazane, 20-30 parts of crosslinking agent and 0.1-2 parts of catalyst.The satellite flexible solar wing battery chip bonding material prepared by the application has excellent hardness, tensile strength, elongation at break, shear strength and thermal conductivity.
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Citation Information
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