Double-working-condition underwater bonding quick clamping test platform with semiconductor temperature control water tank

Abstract

This invention discloses a dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank. The bench includes a main body, comprising a semiconductor temperature-controlled water tank module, a rapid clamping fixture module, and a temperature and test control system. The semiconductor temperature-controlled water tank module includes a water tank, a Peltier semiconductor temperature control component, a heat exchange condenser tube, a high-precision temperature sensor, and a water pump. The Peltier semiconductor temperature control component is attached to the outer wall of the heat exchange condenser tube, and the high-precision temperature sensor is attached to the heat exchange condenser tube. Both the Peltier semiconductor temperature control component and the high-precision temperature sensor are electrically connected to the temperature and test control system. The water pump's suction port is connected to the water tank, and the water pump's outlet is connected to the water tank via the heat exchange condenser tube. This invention provides a dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank that offers high temperature control accuracy, ensures accurate test data, and avoids environmental pollution.

Description

Technical Field

[0001] This invention relates to the field of underwater adhesion strength testing, specifically to a dual-condition underwater adhesion rapid clamping test bench equipped with a semiconductor temperature-controlled water tank. Background Technology

[0002] Underwater bonding technology is widely used in marine engineering, ship repair, and hydraulic facilities. Its bonding performance directly affects the stability and safety of engineering structures. Therefore, accurate evaluation of underwater bonding strength using specialized testing equipment is of significant engineering importance. However, existing underwater bonding testing equipment still has many shortcomings in practical applications. Regarding temperature control, traditional testing platforms often rely on external cooling or heating devices to control the water temperature. The water temperature is adjusted to the target value before being added to the testing platform. This method results in poor temperature controllability, significant deviations between actual and ideal temperatures, slow temperature response, poor uniformity, and difficulty in simulating real-time temperature changes in complex aquatic environments. Although some equipment uses external resistance wires to directly heat the water, it generally lacks efficient direct cooling methods and insulation measures, leading to large temperature fluctuations during testing and affecting the accuracy of bonding strength test data. Furthermore, some equipment using chemical adsorption cooling often uses chloride composite adsorbents. These chemical media easily pollute the testing environment, and their harmless treatment is costly, failing to meet the requirements of green testing. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a dual-condition underwater bonding rapid clamping test station with a semiconductor temperature-controlled water tank that has high temperature control accuracy, ensures the accuracy of test data, and avoids environmental pollution.

[0004] The technical solution adopted by this invention to solve the above problems is as follows: a dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank, comprising a main body, the main body including a semiconductor temperature-controlled water tank module, a rapid clamping fixture module, and a temperature and test control system; the semiconductor temperature-controlled water tank module includes a water tank, a Peltier semiconductor temperature control component, a heat exchange condenser tube, a high-precision temperature sensor, and a water pump; the Peltier semiconductor temperature control component is attached to the outer wall of the heat exchange condenser tube to regulate the temperature of the heat exchange condenser tube; the high-precision temperature sensor is attached to the heat exchange condenser tube to monitor the temperature change of the heat exchange condenser tube; both the Peltier semiconductor temperature control component and the high-precision temperature sensor are electrically connected to the temperature and test control system; the water pump's suction port is connected to the water tank through a suction hose to draw water from the water tank; the water pump's outlet is connected to the water tank through an outlet hose via the heat exchange condenser tube and then to the water tank to discharge water with a changed temperature; the rapid clamping fixture module is used to place the bonding sample to be tested in the water tank for testing.

[0005] Compared with the prior art, the advantages of this invention are as follows: Through the connection design of the water pump, suction hose, and outlet hose, water circulation within the pool is achieved. The circulating water passes through a heat exchange condenser tube, and the heating and cooling ends of the Peltier semiconductor temperature control component attached to the heat exchange condenser tube are switched, thereby heating and cooling the water passing through the heat exchange condenser tube, thus regulating the water temperature in the pool. A high-precision temperature sensor is used to promptly feed back the temperature information of the heat exchange condenser tube to the temperature and testing control system. The temperature and testing control system then controls the current direction of the Peltier semiconductor temperature control component to adjust the water towards the target temperature. After the water temperature in the pool is regulated, a quick-clamping fixture module is used to perform the corresponding adhesion strength test.

[0006] As an improvement of the present invention, the outer side of the Peltier semiconductor temperature control component is provided with a heat dissipation structure, which includes a heat sink and a cooling fan. The heat sink has multiple arrayed aluminum heat sinks, and the cooling fan is fixedly connected to the heat sink and abuts against the aluminum heat sinks. Through this improvement, when the water temperature in the pool is higher than the target temperature, cooling is required. The contact surface between the Peltier semiconductor temperature control component and the heat exchange condenser tube is the cooling surface, and the contact surface between the Peltier semiconductor temperature control component and the heat sink is the heating surface. At this time, through... The design of the heat sink and cooling fan enables rapid cooling of the heating surface, effectively avoiding the interference of temperature fluctuations on the performance of underwater bonded specimens and test force data, ensuring the accuracy and repeatability of test results. When the water temperature in the pool is lower than the target temperature, it needs to be heated. The contact surface between the Peltier semiconductor temperature control component and the heat exchange condenser tube is the heating surface, and the contact surface between the Peltier semiconductor temperature control component and the heat sink is the cooling surface. At this time, the design of the heat sink and cooling fan can form airflow circulation, preventing frost formation on the cooling surface and ensuring continuous temperature control.

[0007] As an improvement of the present invention, the side of the water tank is provided with a placement groove for placing the heat exchange condenser tube, and the port of the placement groove is provided with a heat insulation plate. With the improvement, when heating is working, the heat insulation plate is wrapped around the heat exchange condenser tube, reducing the loss of heat to the ambient air and maintaining the cooling surface in a temperature range where it does not frost.

[0008] As an improvement of the present invention, two heat exchange condenser tubes are provided, which are respectively located on opposite sides of the water tank. The Peltier semiconductor temperature control component includes two Peltier semiconductor chips, which are arrayed on the heat exchange condenser tubes. The high-precision temperature sensor is located between the two Peltier semiconductor chips. Through this improvement, the heating and cooling efficiency is increased, and the design of placing the high-precision temperature sensor between the two Peltier semiconductor temperature control components ensures the effectiveness and real-time performance of temperature regulation.

[0009] As an improvement of the present invention, the water outlet hose includes a water outlet section, two water distribution sections, and a water return section. One end of the water outlet section is connected to a water pump, and the other end of the water outlet section is connected to the two water distribution sections. The two water distribution sections are arranged in parallel and are respectively connected to two heat exchange condenser tubes. The ends of the two water distribution sections away from the water outlet section are connected to the water return section. The end of the water return section away from the water distribution section is located at the upper end of the water tank, and the end of the water suction hose away from the water pump is located at the bottom of the water tank. Through this improvement, water circulation installation of the two heat exchange condenser tubes is realized.

[0010] As an improvement of the present invention, the quick clamping fixture module includes a base located below the water tank and a movable stretching platform that is vertically connected to the top of the water tank. A first sample is fixed at the upper end of the base, and a second sample is fixed at the lower end of the movable stretching platform. The first sample and the second sample are adhered to each other, and the adhesion point between the first sample and the second sample is located in the water in the water tank. Through this improvement, the test installation of the quick clamping fixture module is realized.

[0011] As an improvement of the present invention, a split seat is provided on the axis of the base, and the axial contact surface between the base and the split seat is conical. An upper end cap is threadedly connected to the end of the base near the water tank. A fixing bolt is provided between the split seat and the upper end cap. A hexagonal hole that matches the head of the fixing bolt is provided at the end of the split seat near the upper end cap. The threaded post of the fixing bolt passes through the upper end cap. The first sample is fixedly connected to the fixing bolt. A chuck is provided at the end of the movable tensile platform near the water tank, and the second sample is fixedly connected to the chuck. Through this improvement, firstly, because the testing environment is in water, if the fixing bolts for fixing the test pieces are directly placed in the water, the fixing bolts are prone to rusting, thus causing... Since the fixing bolts need to be replaced frequently, they are designed as separate units from the water tank to prevent them from being submerged in water. To ensure the connection strength of the fixing bolts, a base design is added. The separate base design reduces the individual weight of the base, while the tapered axial contact surface between the base and the separate base ensures the coaxiality of the connection. The hexagonal hole design provides circumferential positioning for the fixing bolts, preventing circumferential rotation. The upper end cap design axially limits the head of the fixing bolts, and the added weight of the upper end cap enhances the overall stability of the base. This ensures the stability of the fixing bolts, and consequently, the stability of the first sample fixedly connected to the fixing bolts, guaranteeing the test quality.

[0012] As an improvement of the present invention, a test column is threadedly fixed to the threaded post of the fixing bolt. The test column passes through the bottom of the water tank. A groove sealing ring is provided between the test column and the water tank. The inner side of the groove sealing ring is fixedly connected to the test column, and the outer side of the groove sealing ring is used to fit into the water tank. Multiple support columns are provided at the bottom of the water tank. The ends of the multiple support columns away from the water tank abut against the upper end cover. Through this improvement, the fixed installation of the test column and the sealing performance of the connection between the water tanks are achieved, preventing water leakage in the test column area. The design of the support columns is used to ensure the abutment stability between the water tank and the upper end cover, preventing the upper end cover from abutting against the groove sealing ring and affecting the sealing structure stability of the groove sealing ring.

[0013] As an improvement of the present invention, the top end of the test column is flat, and a test movable column is fixedly connected to the clamp. The end of the test movable column away from the clamp is also flat and is bonded to the top end of the test column by test adhesive. Through this improvement, the vertical bonding strength test can be achieved.

[0014] As an improvement of the present invention, the top of the test column is provided with a test groove, a test piece is fixedly connected in the test groove, a test movable piece is fixedly connected to the clamp, and the side of the test movable piece away from the clamp and the side of the test piece away from the test groove are bonded together by test adhesive. Through the improvement, the shear bond strength test can be realized. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention.

[0016] Figure 2 This is the control circuit diagram of the semiconductor temperature-controlled water tank module of the present invention.

[0017] Figure 3 This is a schematic diagram of the connection structure of the semiconductor temperature-controlled water tank module according to Embodiment 1 of the present invention.

[0018] Figure 4 This is a schematic diagram of the heat dissipation structure connection of the present invention.

[0019] Figure 5 This is a schematic diagram of the connection structure of the high-precision temperature sensor of the present invention.

[0020] Figure 6 This is a schematic diagram of the connection structure between the water intake hose and the water outlet hose of the present invention.

[0021] Figure 7 This is a schematic diagram of the connection structure between the test column and the test movable column in Embodiment 1 of the present invention.

[0022] Figure 8 This is a schematic diagram of the connection structure between the test piece and the test movable piece in Embodiment 2 of the present invention.

[0023] The diagram shows: 1. Semiconductor temperature-controlled water tank module; 1.1 Water tank; 1.1.1 Placement slot; 1.1.2 Support column; 1.2 Peltier semiconductor temperature control component; 1.3 Heat exchange condenser tube; 1.4 High-precision temperature sensor; 1.5 Water pump; 1.6 Suction hose; 1.7 Outlet hose; 1.7.1 Outlet section; 1.7.2 Diversion section; 1.7.3 Return section; 1.8 Observation window; 2. Quick-clamping fixture module; 2.1 Base. 2.2 Movable tensioning platform; 2.3 Split base; 2.3.1 Hexagonal hole; 2.4 Top cover; 2.5 Fixing bolt; 2.6 Clamp; 2.7 Test column; 2.8 Slot sealing ring; 2.9 Test moving column; 2.10 Test piece; 2.11 Test moving piece; 3 Temperature and test control system; 3.1 Current controller; 4 Heat dissipation structure; 4.1 Heat sink; 4.2 Cooling fan; 5 Insulation board; 6 Water temperature sensor. Detailed Implementation

[0024] The embodiments of the present invention will be further described below with reference to the accompanying drawings.

[0025] like Figure 1 , Figure 2 As shown, a dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank includes a main body. The main body includes a semiconductor temperature-controlled water tank module 1, a rapid clamping fixture module 2, and a temperature and test control system 3. The semiconductor temperature-controlled water tank module 1 includes a water tank 1.1, a Peltier semiconductor temperature control component 1.2, a heat exchange condenser tube 1.3, a high-precision temperature sensor 1.4, and a water pump 1.5. The Peltier semiconductor temperature control component 1.2 is attached to the outer wall of the heat exchange condenser tube 1.3 to regulate the temperature of the heat exchange condenser tube 1.3. The high-precision temperature sensor 1.4 is attached to the outer wall of the heat exchange condenser tube 1.3. A heat exchange condenser tube 1.3 is used to monitor temperature changes in the condenser tube. The Peltier semiconductor temperature control component 1.2 and the high-precision temperature sensor 1.4 are both electrically connected to the temperature and testing control system 3. The water pump 1.5's suction port is connected to the water tank 1.1 via a suction hose 1.6 to draw water from the water tank 1.1. The water pump 1.5's outlet is connected to the water tank 1.1 via an outlet hose 1.7, passing through the heat exchange condenser tube 1.3, and then back to the water tank 1.1 to discharge water that has changed temperature into the water tank 1.1. The quick-clamping fixture module 2 is used to place the bonded sample to be tested in the water tank 1.1 for testing. A water temperature sensor 6, electrically connected to the temperature and testing control system 3, is also installed in the water tank 1.1 to provide feedback on water temperature changes within the water tank 1.1, ensuring the water temperature remains at the target temperature.

[0026] The temperature and test control system 3 includes a current controller 3.1, a data acquisition card, a host computer, and a power supply module; a high-precision temperature sensor 1.4 collects real-time water temperature data flowing through the heat exchange condenser tube 1.3 and a water temperature sensor 6 collects real-time water temperature data in the water tank 1.1, which is fed back to the current controller 3.1. The working current of the Peltier semiconductor temperature control component 1.2 is adjusted through a PID algorithm to achieve closed-loop control of the water temperature; the data acquisition card simultaneously collects temperature data and tensile test data, and generates test curves and reports on the host computer.

[0027] like Figure 3-6 As shown, the Peltier semiconductor temperature control component 1.2 has a heat dissipation structure 4 on its outer side. The heat dissipation structure 4 includes a heat sink 4.1 and a cooling fan 4.2. The heat sink 4.1 has a plurality of aluminum heat sinks arranged in an array. The cooling fan 4.2 is fixedly connected to the heat sink 4.1 and abuts against the aluminum heat sinks. The side of the water tank 1.1 has a placement slot 1.1.1 for placing the heat exchange condenser tube 1.3. The port of the placement slot 1.1.1 is provided with a heat insulation plate 5, and the heat dissipation structure 4 passes through the heat insulation plate 5. Two heat exchange condenser tubes 1.3 are provided, respectively located on opposite sides of the water tank 1.1. The Peltier semiconductor temperature control component 1.2 includes two Peltier semiconductor wafers, arrayed on the heat exchange condenser tubes 1.3. The high-precision temperature sensor 1.4 is located between the two Peltier semiconductor wafers. The water outlet hose 1.7 includes a water outlet section 1.7.1, two water distribution sections 1.7.2, and a water return section 1.7.3. One end of the outlet section 1.7.1 is connected to the water pump 1.5, and the other end of the outlet section 1.7.1 is connected to two water distribution sections 1.7.2. The two water distribution sections 1.7.2 are arranged in parallel and are respectively connected to two heat exchange condenser tubes 1.3. The ends of the two water distribution sections 1.7.2 away from the outlet section 1.7.1 are both connected to the return section 1.7.3. The end of the return section 1.7.3 away from the water distribution section 1.7.2 is located at the upper end of the water tank 1.1, and the end of the suction hose 1.6 away from the water pump 1.5 is located at the bottom of the water tank 1.1.

[0028] The Peltier semiconductor temperature control component 1.2 has a temperature control range of 0℃ to 80℃, achieving precise temperature regulation with an accuracy of ±0.5℃ by adjusting the current. Through water circulation, the water in pool 1.1 is also in a flowing state, effectively avoiding localized temperature differences and ensuring uniform water temperature throughout pool 1.1. Temperature deviation is strictly controlled to ≤1℃. Compared to traditional external temperature control devices, the temperature response speed is improved by ≥50%, and the water temperature uniformity deviation is low. It can accurately simulate complex water environment temperature changes, solving the problems of poor temperature control and slow response of traditional equipment. Furthermore, it eliminates the need for chemical refrigerants, employing a semiconductor temperature control and water circulation system with no pollutant emissions, conforming to the concept of green testing. Compared to chemical adsorption refrigeration methods, it saves on harmless treatment costs, reduces operating costs by ≥30%, and avoids contamination of the testing environment and specimens by chemical media.

[0029] An observation window 1.8 is provided on the side of the water tank 1.1 away from the water pump 1.5 for real-time observation of the test process.

[0030] like Figure 1 , Figure 3 As shown, the quick-clamping fixture module 2 includes a base 2.1 located below the water tank 1.1 and a movable stretching platform 2.2 vertically connected above the water tank 1.1. A first sample is fixed to the upper end of the base 2.1, and a second sample is fixed to the lower end of the movable stretching platform 2.2. The first sample and the second sample are adhered together, and the adhesion point between the first sample and the second sample is located in the water within the water tank 1.1. A split seat 2.3 is provided on the axis of the base 2.1, and the axial contact surface between the base 2.1 and the split seat 2.3 is conical. A top cover 2.4 is threadedly connected to one end of the base 2.1 near the water tank 1.1. A fixing bolt 2.5 is provided between the split base 2.3 and the top cover 2.4. A hexagonal hole 2.3.1 that matches the head of the fixing bolt 2.5 is provided at one end of the split base 2.3 near the top cover 2.4. The threaded post of the fixing bolt 2.5 passes through the top cover 2.4. The first sample is fixedly connected to the fixing bolt 2.5. A chuck 2.6 is provided at one end of the movable stretching platform 2.2 near the water tank 1.1. The second sample is fixedly connected to the chuck 2.6.

[0031] Example 1: like Figure 1 , Figure 3 , Figure 7As shown, the first sample is a test column 2.7, and the second sample is a test movable column 2.9. The test column 2.7 is threadedly fixed to the threaded post of the fixing bolt 2.5. The test column 2.7 passes through the bottom of the water tank 1.1. A groove sealing ring 2.8 is provided between the test column 2.7 and the water tank 1.1. The inner side of the groove sealing ring 2.8 is fixedly connected to the test column 2.7, and the outer side of the groove sealing ring 2.8 is used to fit into the water tank 1.1. The bottom of the water tank 1.1 is provided with multiple support columns 1.1.2. The ends of the multiple support columns 1.1.2 away from the water tank 1.1 abut against the upper end cover 2.4. The top of the test column 2.7 is flat. The test movable column 2.9 is fixedly connected to the clamp 2.6. The end of the test movable column 2.9 away from the clamp 2.6 is also flat and is bonded to the top of the test column 2.7 by test adhesive. During the vertical bonding test, the test moving column 2.9 is pulled upward by the moving tensile platform 2.2, and the change of force value is recorded until the bonding between the test column 2.7 and the test moving column 2.9 fails.

[0032] Example 2: like Figure 8 As shown, the first sample is test piece 2.10, and the second sample is test movable piece 2.11. A test post 2.7 is threadedly connected to the threaded post of the fixing bolt 2.5. The test post 2.7 passes through the bottom of the water tank 1.1. A retaining ring 2.8 is provided between the test post 2.7 and the water tank 1.1. The inner side of the retaining ring 2.8 is fixedly connected to the test post 2.7, and the outer side of the retaining ring 2.8 is used to fit into the water tank 1.1. The bottom of the 1.1 structure is provided with multiple support columns 1.1.2. The ends of the multiple support columns 1.1.2 away from the water tank 1.1 abut against the upper end cover 2.4. The top of the test column 2.7 is provided with a test groove, and a test piece 2.10 is fixedly connected in the test groove. A test movable piece 2.11 is fixedly connected to the clamp 2.6. The side of the test movable piece 2.11 away from the clamp 2.6 is bonded to the side of the test piece 2.10 away from the test groove by test adhesive. During the shear bonding test, the test movable piece 2.11 is pulled upward by moving the tensile platform 2.2, and the change in force value is recorded until the bonding between the test piece 2.10 and the test movable piece 2.11 fails.

[0033] During the assembly of water tank 1.1, the preset installation position of the slot sealing ring 2.8 can be used as a precise positioning reference to complete the alignment and assembly of water tank 1.1, ensuring the coaxiality and installation compatibility of water tank 1.1, slot sealing ring 2.8, and test column 2.7.

[0034] The invention utilizes a dual-condition underwater bonding rapid clamping test stand with a semiconductor temperature-controlled water tank, resulting in high data acquisition accuracy, support for historical data retrieval, full controllability of the testing process, and high data accuracy and repeatability. It meets the requirements for precise underwater bonding strength testing of soft materials and is suitable for testing applications in marine engineering, ship repair, and water conservancy facilities. Furthermore, it eliminates the need for chemical refrigerants, employing a semiconductor temperature control and water circulation system, resulting in zero pollutant emissions and adhering to green testing principles. Compared to chemical adsorption refrigeration methods, it eliminates the cost of harmless treatment, reduces operating costs by ≥30%, and avoids contamination of the testing environment and specimens by chemical media.

[0035] The above description only illustrates the preferred embodiments of the present invention and should not be construed as limiting the scope of the claims. The present invention is not limited to the above embodiments, and variations in its specific structure are permitted. All modifications made within the scope of the independent claims of this invention are also within the scope of protection of this invention.

Claims

1. A dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank, comprising a main body, characterized in that: The main body includes a semiconductor temperature-controlled water tank module (1), a quick-clamping fixture module (2), and a temperature and test control system (3). The semiconductor temperature-controlled water tank module (1) includes a water tank (1.1), a Peltier semiconductor temperature control component (1.2), a heat exchange condenser tube (1.3), a high-precision temperature sensor (1.4), and a water pump (1.5). The Peltier semiconductor temperature control component (1.2) is attached to the outer wall of the heat exchange condenser tube (1.3) to regulate the temperature of the heat exchange condenser tube (1.3). The high-precision temperature sensor (1.4) is attached to the heat exchange condenser tube (1.3) to monitor the temperature change of the condenser tube. The Peltier semiconductor temperature control component (1.2) and the high-precision temperature sensor (1.4) are electrically connected to the temperature and test control system (3). The water pump (1.5) is connected to the water tank (1.1) through the water suction hose (1.6) to draw water from the water tank (1.1). The water pump (1.5) is connected to the water tank (1.1) through the water outlet hose (1.7) and the heat exchange condenser (1.3) to discharge water with a changed temperature into the water tank (1.1). The quick clamping fixture module (2) is used to place the bonding sample to be tested in the water tank (1.1) for testing.

2. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 1, characterized in that: The Peltier semiconductor temperature control component (1.2) has a heat dissipation structure (4) on its outer side. The heat dissipation structure (4) includes a heat sink (4.1) and a cooling fan (4.2). The heat sink (4.1) is provided with a plurality of aluminum heat sinks arranged in an array. The cooling fan (4.2) is fixedly connected to the heat sink (4.1) and abuts against the aluminum heat sinks.

3. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 2, characterized in that: The side of the water tank (1.1) is provided with a placement slot for placing the heat exchange condenser tube (1.3). 1.1.1), the port of the placement slot (1.1.1) is provided with a heat insulation plate (5).

4. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 1, characterized in that: There are two heat exchange condenser tubes (1.3), which are respectively located on opposite sides of the water tank (1.1). The Peltier semiconductor temperature control assembly (1.2) includes two Peltier semiconductor chips, which are arrayed on the heat exchange condenser tubes (1.3). The high-precision temperature sensor (1.4) is located between the two Peltier semiconductor chips.

5. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 4, characterized in that: The outlet hose (1.7) includes an outlet section (1.7.1), two branch sections (1.7.2), and a return section (1.7.3). One end of the outlet section (1.7.1) is connected to the water pump (1.5), and the other end of the outlet section (1.7.1) is connected to the two branch sections (1.7.2). The two branch sections (1.7.2) are arranged in parallel and are respectively connected to two heat exchange condenser tubes (1.3). The ends of the two branch sections (1.7.2) away from the outlet section (1.7.1) are both connected to the return section (1.7.3). The end of the return section (1.7.3) away from the branch section (1.7.2) is located at the upper end of the water tank (1.1). The end of the suction hose (1.6) away from the water pump (1.5) is located at the bottom of the water tank (1.1).

6. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 1, characterized in that: The quick clamping fixture module (2) includes a base (2.1) located below the water tank (1.1) and a movable stretching platform (2.2) that is vertically connected above the water tank (1.1). A first sample is fixed at the upper end of the base (2.1), and a second sample is fixed at the lower end of the movable stretching platform (2.2). The first sample and the second sample are adhered to each other, and the adhesion point between the first sample and the second sample is located in the water in the water tank (1.1).

7. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 6, characterized in that: A split seat (2.3) is provided on the axis of the base (2.1). The axial contact surface of the base (2.1) and the split seat (2.3) is conical. A top cover (2.4) is threadedly connected to one end of the base (2.1) near the water tank (1.1). A fixing bolt (2.5) is provided between the split seat (2.3) and the top cover (2.4). A hexagonal hole (2.3.1) that matches the head of the fixing bolt (2.5) is provided at one end of the split seat (2.3) near the top cover (2.4). The threaded post of the fixing bolt (2.5) passes through the top cover (2.4). The first sample is fixedly connected to the fixing bolt (2.5). A chuck (2.6) is provided at one end of the movable stretching platform (2.2) near the water tank (1.1). The second sample is fixedly connected to the chuck (2.6).

8. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 7, characterized in that: The threaded post of the fixing bolt (2.5) is threadedly fixed to a test post (2.7). The test post (2.7) passes through the bottom of the water tank (1.1). A groove sealing ring (2.8) is provided between the test post (2.7) and the water tank (1.1). The inner side of the groove sealing ring (2.8) is fixedly connected to the test post (2.7), and the outer side of the groove sealing ring (2.8) is used to fit into the water tank (1.1). The bottom of the water tank (1.1) is provided with multiple support posts (1.1.2). The end of the multiple support posts (1.1.2) away from the water tank (1.1) abuts against the upper end cover (2.4).

9. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 8, characterized in that: The top of the test column (2.7) is flat, and a test moving column (2.9) is fixedly connected to the clamp (2.6). The end of the test moving column (2.9) away from the clamp (2.6) is also flat and is bonded to the top of the test column (2.7) with test adhesive.

10. The dual-condition underwater bonding rapid clamping test bench with a semiconductor temperature-controlled water tank according to claim 8, characterized in that: The top of the test column (2.7) is provided with a test groove, and a test piece (2.10) is fixedly connected in the test groove. A test moving piece (2.11) is fixedly connected on the clamp (2.6). The side of the test moving piece (2.11) away from the clamp (2.6) is bonded to the side of the test piece (2.10) away from the test groove by test adhesive.

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