A semiconductor detector signal processing method based on pixel diagonal pairing and two-way differential reading

Abstract

The application relates to the technical field of semiconductor detector signal processing, and discloses a semiconductor detector signal processing method based on pixel diagonal pairing and double-path differential reading. The method comprises the following steps: acquiring a pixel array of a pixelated semiconductor detector; dividing the pixel array into a plurality of adjacent pixel modules; connecting two groups of diagonal pixels in each pixel module to form a first reading channel and a second reading channel; reading a first reading signal and a second reading signal; and performing spectral analysis on the two-path differential signals after shaping amplification and selecting the signal with a larger amplitude. Compared with the problem that the low-energy tailing, energy resolution and peak total ratio are reduced due to the small pixel effect of a large-pixel semiconductor detector in the prior art, the application can reduce the low-energy tailing, improve the energy resolution and the peak total ratio without significantly increasing the number of reading channels.

Description

Technical Field

[0001] This invention relates to the field of semiconductor detector signal processing technology, and in particular to a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout. Background Technology

[0002] Currently, pixelated semiconductor detectors are commonly used in applications such as nuclear radiation detection, medical imaging, security inspection, and space radiation measurement. For room-temperature semiconductor detectors such as cadmium zinc telluride (CZN), the ratio of pixel electrode size to detector thickness, p / L, is a crucial factor affecting detection performance, where p represents the pixel electrode feature size and L represents the detector thickness. When p / L is small, the weighted potential change near the pixel electrode is more concentrated, resulting in a more pronounced small-pixel effect, thereby reducing the impact of hole trapping on the energy spectrum.

[0003] However, in high-throughput, large-area, or low-cost pixelated detector applications, pixel sizes are often large to balance manufacturing difficulty, the number of readout channels, and packaging wiring complexity, resulting in p / L > 0.3 being quite common. In such structures, the weighted potential distribution becomes wider, and changes in carrier drift paths and hole trapping can easily lead to pulse amplitude broadening, causing low-energy tails in the energy spectrum peaks, thereby reducing energy resolution and peak-to-peak ratio.

[0004] Existing technologies typically improve energy spectrum performance through cathode signal readout, full waveform digitization, pulse shape discrimination, or complex multi-channel correction algorithms. However, these approaches often require additional readout channels, high-speed analog-to-digital converters, large-scale storage resources, or complex back-end algorithms, which is detrimental to compact design, low power consumption, and application-specific integrated circuit (ASIC) implementation. Therefore, it is necessary to propose a signal processing method that can improve the low-energy tail and energy resolution of the energy spectrum of large-pixel semiconductor detectors without significantly increasing the number of readout channels. Summary of the Invention

[0005] To address the aforementioned technical shortcomings, the present invention aims to propose a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout. This method is intended to solve the technical problems of weakened small pixel effect, significant low-energy tailing, and decreased energy resolution and peak-to-total ratio in existing pixelated semiconductor detectors when reading out larger pixels or performing simple merge readout.

[0006] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The present invention provides a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout.

[0007] The semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout includes: Step S10: Obtain the pixel array of the pixelated semiconductor detector, and perform pixel module partitioning based on the pixel array using an adjacent four-pixel partitioning method, outputting a 2×2 pixel module set; Step S20: Based on the 2×2 pixel module set, execute the dual-channel readout construction task using the diagonal pixel pairing connection method, and output the dual-channel diagonal pairing readout channel set; Step S30: Based on the dual-channel diagonally paired readout channel set, the readout preprocessing task is performed using an independent charge-sensitive preamplifier method, and the dual-channel readout signal set is output; Step S40: Based on the dual-channel readout signal set, perform mutual subtraction processing using an adjustable differential gain cross-cancellation method to output the dual-channel differential readout signal set; Step S50: Based on the dual-channel differential readout signal set, perform the energy spectrum generation task using shaping amplification, candidate pulse amplitude comparison, peak hold, analog-to-digital conversion and multi-channel energy spectrum analysis, and output energy spectrum data.

[0008] Preferably, step S10, which involves obtaining the pixel array of the pixelated semiconductor detector, performing pixel module partitioning based on the pixel array using an adjacent four-pixel partitioning method, and outputting a 2×2 pixel module set, specifically includes: Step S101: Obtain the row position, column position, and pixel electrode feature size of each pixel in the pixel array. and detector thickness ,in, For pixel electrode feature size, The thickness of the detector, and satisfying ; Step S102: Select four pixels with adjacent row and column positions along the row and column directions of the pixel array to obtain a group of four adjacent pixels; Step S103: Determine each of the adjacent four pixel groups as a 2×2 pixel module, and in each of the 2×2 pixel modules, determine the first pixel, the second pixel, the third pixel and the fourth pixel in sequence according to the positional relationship of the upper left, upper right, lower left and lower right.

[0009] Preferably, step S20, which involves constructing a dual-channel readout based on the 2×2 pixel module set using a diagonal pixel pairing connection method, and outputting a dual-channel diagonally paired readout set, specifically includes: Step S201: Based on each of the 2×2 pixel modules, determine the first diagonal pixel group formed by the first pixel and the fourth pixel, and determine the second diagonal pixel group formed by the second pixel and the third pixel; Step S202: Electrically connect the first diagonal pixel group to form a first readout channel. The second diagonal pixel group is electrically connected to form a second readout channel. ; Step S203: For each of the 2×2 pixel modules, the first readout channel is formed and the second readout channel Perform branched wiring to output the set of dual-path diagonally paired readout channels.

[0010] Preferably, in step S202, the first readout channel The second readout channel is used to collect the charge signals generated by the first pixel and the fourth pixel. Used to collect the charge signals generated by the second pixel and the third pixel, so that each of the 2×2 pixel modules outputs two diagonally paired readout channels from four pixels.

[0011] Preferably, step S30, which involves performing readout preprocessing based on the dual-channel diagonally paired readout channel set using an independent charge-sensitive preamplifier method, and outputting a dual-channel readout signal set, specifically includes: Step S301: For each of the 2×2 pixel modules, the first readout channel... Connect to the first charge-sensitive preamplifier, and connect the second readout channel corresponding to each of the 2×2 pixel modules. Connect to a second charge-sensitive preamplifier; Step S302: The first readout channel is connected to the first charge-sensitive preamplifier. The charge signal on the signal is converted into a voltage form as the first readout signal. ; Step S303: The second readout channel is connected to the second charge-sensitive preamplifier. The charge signal on the signal is converted into a second readout signal in the form of voltage. and the first readout signal and the second readout signal A set of dual-channel readout signals is identified as part of the dual-channel readout signal set.

[0012] Preferably, step S40, which involves performing a mutual subtraction processing task based on the dual-channel readout signal set using an adjustable differential gain cross-cancellation method, and outputting the dual-channel differential readout signal set, specifically includes: Step S401: Set the differential gain scan value within the range of 0.5 to 2.0. Obtain different scan values ​​respectively The energy resolution, peak width, and peak-to-total ratio are set, and the optimal differential gain is determined based on the minimum energy resolution, the minimum peak width, and the maximum peak-to-total ratio. This optimal differential gain is then used as the first differential gain. Second differential gain ;in, This is the differential gain scan value. For the first differential gain, This is the second differential gain; Step S402: Based on the first readout signal and through the first differential gain The weighted second readout signal The first differential readout signal is obtained. Its expression is: Step S403: Based on the second readout signal and via the second differential gain The weighted first readout signal The second differential readout signal is obtained. Its expression is: in, This is the first readout signal output in step S302. This is the second readout signal output in step S303. For the first differential gain, For the second differential gain, This is the first differential readout signal. The second differential readout signal; based on the first differential readout signal and the second differential readout signal The dual-channel differential readout signal set is output.

[0013] Preferably, step S50, which involves performing an energy spectrum generation task based on the dual-channel differential readout signal set using shaping amplification, candidate pulse amplitude comparison, peak hold, analog-to-digital conversion, and multichannel energy spectrum analysis, and outputting energy spectrum data, specifically includes: Step S501: Read out the first differential signal respectively and the second differential readout signal Perform shaping and amplification to obtain the first candidate pulse signal and the second candidate pulse signal; Step S502: Compare the pulse amplitudes of the first candidate pulse signal and the second candidate pulse signal; when the pulse amplitude of the first candidate pulse signal is greater than or equal to the pulse amplitude of the second candidate pulse signal, determine the first candidate pulse signal as the gating signal; when the pulse amplitude of the first candidate pulse signal is less than the pulse amplitude of the second candidate pulse signal, determine the second candidate pulse signal as the gating signal. Step S503: Read out the signal based on the first differential signal With the second differential readout signal The relative amplitude is used to perform position correction or sub-pixel position estimation on the position of the radiation event in the 2×2 pixel module to obtain the position correction result. Based on the position correction result, peak holding, analog-to-digital conversion and multichannel energy spectrum analysis are performed on the gating signal to output the energy spectrum data.

[0014] The present invention also provides a semiconductor detector signal processing system based on pixel diagonal pairing and dual-path differential readout, comprising: The pixel module partitioning module is used to obtain the pixel array of the pixelated semiconductor detector, and to perform the pixel module partitioning task based on the pixel array using an adjacent four-pixel partitioning method, and output a 2×2 pixel module set; The dual-channel construction module is used to perform a dual-channel readout channel construction task based on the 2×2 pixel module set by using a diagonal pixel pairing connection method, and output a dual-channel diagonal paired readout channel set; The readout preprocessing module is used to perform readout preprocessing tasks based on the dual-channel diagonally paired readout channel set using an independent charge-sensitive preamplifier method, and output a dual-channel readout signal set; The differential subtraction processing module is used to perform subtraction processing based on the dual-channel readout signal set using an adjustable differential gain cross-cancellation method, and output the dual-channel differential readout signal set. The energy spectrum analysis module is used to perform energy spectrum generation tasks based on the dual-channel differential readout signal set, employing shaping amplification, candidate pulse amplitude comparison, peak hold, analog-to-digital conversion, and multi-channel energy spectrum analysis methods, and output energy spectrum data.

[0015] The present invention also provides a semiconductor detector signal processing device based on pixel diagonal pairing and dual-path differential readout. The semiconductor detector signal processing device based on pixel diagonal pairing and dual-path differential readout includes: a memory, a processor, and a semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout stored in the memory and executable on the processor. When the semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout is executed by the processor, it implements the above-described method.

[0016] The present invention also provides a computer program product, the computer program product including a semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout, the semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout implementing the above method when executed by a processor.

[0017] The beneficial effects of this invention are as follows: 1. This invention divides adjacent four pixels and pairs them with diagonal pixels to form two diagonally paired readout channels. While controlling the number of readout channels, it preserves the signal differences at the diagonal positions within the pixel module, providing a stable input for subsequent differential subtraction processing.

[0018] 2. This invention obtains the first readout signal and the second readout signal by independent charge-sensitive preamplifier, and forms a dual-path differential readout signal by using an adjustable differential gain cross-cancellation method, which can reduce the influence of carrier drift path changes and hole trapping on pulse amplitude in large pixel structures.

[0019] 3. In the differential gain scanning process, this invention combines energy resolution, peak width and peak-to-total ratio to determine the differential gain, so that the subtraction processing parameters match the actual output characteristics of the detector, which is beneficial to improving the stability of the energy spectrum peak shape and the reproducibility of parameter selection.

[0020] 4. This invention generates energy spectrum data through shaping amplification, candidate pulse amplitude comparison, peak holding, analog-to-digital conversion, and multi-channel energy spectrum analysis. It also combines the relative amplitude of the dual-channel differential readout signals to perform position correction or sub-pixel position estimation, which helps to improve low-energy tailing and increase energy resolution and peak-to-total ratio. Attached Figure Description

[0021] Figure 1 This is a flowchart illustrating the first embodiment of a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout according to the present invention.

[0022] Figure 2 This is a schematic diagram comparing the electrode connections of the traditional pixel readout method and the diagonal pairing readout method of the present invention.

[0023] Figure 3 For the present invention Block diagram of the signal processing circuit of the pixel module.

[0024] Figure 4 This is a block diagram illustrating the subsequent signal processing link after the dual-channel differential output of the present invention.

[0025] Figure 5 This is a schematic diagram illustrating the optimized relationship between differential gain and energy resolution in this invention.

[0026] Figure 6This is a schematic diagram illustrating the optimized relationship between differential gain and peak-to-total ratio in this invention.

[0027] Figure 7 This is a schematic diagram showing the waveform relationship between the input signal and the differential output signal during the differential processing of this invention.

[0028] Figure 8 This is a schematic diagram comparing the energy spectrum of the traditional readout method with the optimal differential gain readout method of this invention. Detailed Implementation

[0029] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0030] Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1: As Figure 1 The diagram shown is a flowchart of the first embodiment of a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout according to the present invention. The present invention proposes a first embodiment of a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout.

[0032] In the first embodiment, the semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout includes: Step S10: Obtain the pixel array of the pixelated semiconductor detector, and perform pixel module partitioning based on the pixel array using an adjacent four-pixel partitioning method to output a 2×2 pixel module set; Step S20: Based on the 2×2 pixel module set, execute the dual-channel readout construction task using the diagonal pixel pairing connection method, and output the dual-channel diagonal pairing readout channel set; Step S30: Based on the dual-channel diagonally paired readout channel set, the readout preprocessing task is performed using an independent charge-sensitive preamplifier method, and the dual-channel readout signal set is output; Step S40: Based on the dual-channel readout signal set, perform mutual subtraction processing using an adjustable differential gain cross-cancellation method to output the dual-channel differential readout signal set; Step S50: Based on the dual-channel differential readout signal set, perform the energy spectrum generation task using shaping amplification, candidate pulse amplitude comparison, peak hold, analog-to-digital conversion and multi-channel energy spectrum analysis, and output energy spectrum data.

[0033] Specifically, such as Figure 2 As shown, Figure 2The traditional pixel readout method shown in the left figure usually draws out an independent channel for each pixel in the pixel array, or performs ordinary grouping readout in a row and column manner; Figure 2 The diagonal pairing readout method of the present invention shown in the right figure divides the pixel array into multiple adjacent pixel modules and performs diagonal pairing readout within each pixel module.

[0034] Specifically, each The pixel module includes a first pixel, a second pixel, a third pixel, and a fourth pixel. Taking the top-left pixel as the first pixel, the top-right pixel as the second pixel, the bottom-left pixel as the third pixel, and the bottom-right pixel as the fourth pixel as an example, the first and fourth pixels are located on the same diagonal, while the second and third pixels are located on the other diagonal. The first and fourth pixels are electrically connected to form the first readout channel. The second and third pixels are electrically connected to form the second readout channel. .

[0035] like Figure 3 As shown, the first readout channel Connected to the first charge-sensitive preamplifier, the second readout channel It is connected to the second charge-sensitive preamplifier. The first charge-sensitive preamplifier outputs the first readout signal. The second charge-sensitive preamplifier outputs the second readout signal. Then, the first readout signal... Second readout signal Simultaneously, the data is fed into two differential processing branches.

[0036] The first differential processing branch is based on the first readout signal. and the first differential gain Weighted second readout signal The first differential readout signal is obtained. : The second differential processing branch is based on the second readout signal. and the second differential gain The first readout signal after weighting The second differential readout signal is obtained. : in, For the first differential gain, This is the second differential gain. It can be set in the symmetrical pixel module. When there are differences in gain, pixel response, or wiring parasitics between the two diagonally paired channels, they can be adjusted separately. and This is to compensate for channel inconsistencies.

[0037] like Figure 4 As shown, the first differential readout signal Second differential readout signal After being amplified by either the main amplifier or the shaping amplifier, the signal is input to the signal comparison and gating unit. The signal comparison and gating unit compares the amplitudes of the two candidate pulses and outputs the candidate pulse with the larger amplitude as the gating signal. This gating signal then sequentially enters the peak hold unit, the analog-to-digital converter, and the multichannel analysis unit, ultimately forming the energy spectrum data.

[0038] In this embodiment, dual-path differential output does not require adding an independent readout channel for each pixel, but rather... Within the pixel module, two complementary channels are formed by diagonal pairing. Since the two diagonal channels have different responses to the radiation event location and carrier collection process, subtraction between them can highlight the differential component related to the event location, thereby mitigating the low-energy tail caused by hole trapping and broadening of the weighted potential distribution.

[0039] For example, combining Figure 3 The circuit used in this invention may include a pixelated semiconductor detector, a charge-sensitive preamplifier unit, a dual-path gain-adjustable differential unit, and a subsequent signal processing unit. The pixel array of the pixelated semiconductor detector is divided into multiple... Pixel module, each The first and fourth pixels within the pixel module are either shorted or connected to the first readout channel via a low-resistance interconnect. The second and third pixels are either shorted or connected to the second readout channel via a low-resistance interconnect. .

[0040] The charge-sensitive preamplifier unit includes a first charge-sensitive preamplifier and a second charge-sensitive preamplifier. The input terminal of the first charge-sensitive preamplifier is connected to the first readout channel. The input of the second charge-sensitive preamplifier is connected to the second readout channel. The first charge-sensitive preamplifier outputs the first readout signal. The second charge-sensitive preamplifier outputs the second readout signal. .

[0041] The dual-gain adjustable differential unit includes a first differential branch and a second differential branch. The first differential branch is used for execution. The differential operation outputs the first differential readout signal. The second differential branch is used for execution. The differential operation outputs the second differential readout signal. Differential gain and It can be set via a variable resistor, digital potentiometer, programmable gain amplifier, field-programmable gate array, or application-specific integrated circuit register.

[0042] like Figure 7 As shown, when the first readout signal With the second readout signal When there are differences in amplitude and time response, differential processing can generate differential outputs that are related to the event space location and charge collection process. By adjusting the differential gain, the amplitude of the differential output and the low-energy tail suppression effect can be changed.

[0043] The subsequent signal processing unit may include two main amplifiers, a signal comparison and gating unit, a peak hold unit, an analog-to-digital converter unit, and a multichannel analysis unit. The two main amplifiers respectively read out the first differential signal. Second differential readout signal The system performs shaping and amplification; the signal comparison and gating unit is used to select candidate pulses with larger amplitudes; the peak hold unit is used to hold the peak value of the gating signal; the analog-to-digital conversion unit is used to output digitized energy information; and the multichannel analysis unit is used to form the energy spectrum.

[0044] For example, with The implementation process of the method of the present invention is illustrated using a pixel-based cadmium zinc telluride detector as an example. The detector crystal size is... The pixel size is The cathode bias voltage is The detector's The pixel array is divided into indivual Pixel module.

[0045] For any The pixel module connects the first pixel and the fourth pixel to form the first readout channel. Connect the second and third pixels to form a second readout channel. First readout channel Second readout channel The first readout signal is output by the charge-sensitive preamplifier. Second readout signal Initially, it can be set to... And during the debugging process and The adjustable range is set to to .

[0046] To determine the optimal differential gain, the following methods can be used: Characteristic peaks are calibrated. Specifically, let... ,exist to Within the range Step scan differential gain And record the energy resolution and peak-to-total ratio for each gain.

[0047] like Figure 5 As shown, when the differential gain As the value is gradually increased from a smaller value, the energy resolution half-width at half-maximum (FWHM) first decreases and then increases, indicating the existence of a better gain range. Figure 5 Under the implementation conditions shown, the optimal differential gain is located at nearby.

[0048] like Figure 6 As shown, the peak-to-total ratio varies with the differential gain. The increase also shows a trend of first rising and then falling. Combining the two indicators of energy resolution and peak-to-total ratio, the differential gain can be... Selected in Nearby. When there is a slight inconsistency between the two diagonally paired channels, further... Set as ,Will Set as This allows for more precise channel calibration.

[0049] like Figure 8 As shown, Figure 8 The left figure shows the energy spectrum under the traditional readout method. Figure 8 The right figure shows the energy spectrum under the optimal differential gain readout method of this invention. Compared with the traditional pixel readout method, this invention can significantly reduce low-energy tailing and improve the concentration of the main peak under better differential gain conditions. Under the test conditions of this embodiment, The energy resolution of the energy peak can be approximately Improve to approximately The peak ratio can be determined by approximately Increase to approximately .

[0050] As can be seen from the above embodiments, the present invention, through pixel diagonal pairing, dual-path adjustable gain differential, and large-amplitude signal gating, enables large-pixel semiconductor detectors to obtain superior energy spectrum output without significantly increasing the number of channels. In addition to cadmium zinc telluride detectors, the present invention can also be applied to pixelated semiconductor detectors such as cadmium telluride, mercuric iodide, gallium arsenide, thallium bromide, cadmium selenide, gallium phosphide, mercuric sulfide, and lead iodide.

[0051] Example 2: Furthermore, the semiconductor detector signal processing system based on pixel diagonal pairing and dual-path differential readout provided by this invention employs a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout from the above embodiments, and can solve the technical problem of semiconductor detector signal processing based on pixel diagonal pairing and dual-path differential readout. The beneficial effects of the semiconductor detector signal processing system based on pixel diagonal pairing and dual-path differential readout provided by this invention are the same as those of the semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout provided in the above embodiments, and other technical features of the semiconductor detector signal processing system based on pixel diagonal pairing and dual-path differential readout are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0052] Example 3: This invention provides a semiconductor detector signal processing device based on pixel diagonal pairing and dual-channel differential readout. The device includes at least one processor and a memory communicatively connected to the processor. The memory stores instructions executable by the processor, which are then executed to enable the processor to perform the semiconductor detector signal processing method based on pixel diagonal pairing and dual-channel differential readout described in Example 1. The semiconductor detector signal processing device based on pixel diagonal pairing and dual-channel differential readout in this invention can include, but is not limited to, mobile terminals such as mobile phones, laptops, digital radio receivers, PDAs (Personal Digital Assistants), PADs (Portable Application Description), PMPs (Portable Media Players), and in-vehicle terminals (e.g., in-vehicle navigation terminals), as well as fixed terminals such as digital TVs and desktop computers. This semiconductor detector signal processing device based on pixel diagonal pairing and dual-channel differential readout is merely an example and should not limit the functionality or scope of the invention. A semiconductor detector signal processing device based on pixel diagonal pairing and dual-channel differential readout may include a processing unit (e.g., a central processing unit, a graphics processing unit, etc.) that can perform various appropriate actions and processes according to a program stored in a read-only memory or a program loaded from a storage device into a random access memory. The random access memory also stores various programs and data required for the operation of the semiconductor detector signal processing device based on pixel diagonal pairing and dual-channel differential readout. The processing unit, read-only memory, and random access memory are interconnected via a bus. An I / O interface is also connected to the bus. Typically, the following systems can be connected to the I / O interface: input devices including touchscreens, touchpads, keyboards, mice, image sensors, microphones, accelerometers, gyroscopes, etc.; output devices including liquid crystal displays (LCDs), speakers, vibrators, etc.; storage devices including magnetic tapes, hard disks, etc.; and communication devices. The communication device allows the semiconductor detector signal processing device based on pixel diagonal pairing and dual-channel differential readout to exchange data with other devices wirelessly or via wired communication. While a semiconductor detector signal processing apparatus based on pixel diagonal pairing and dual-path differential readout with various systems has been described, it should be understood that implementation of or possession of all the described systems is not required. Alternatively, more or fewer systems may be implemented.

[0053] Example 4: This invention also provides a computer program product, including a computer program that, when executed by a processor, implements the steps of the semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described above. The computer program product provided by this invention can solve the technical problem of semiconductor detector signal processing based on pixel diagonal pairing and dual-path differential readout. Compared with the prior art, the beneficial effects of the computer program product provided by this invention are the same as those of the semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout provided in the above embodiments, and will not be repeated here.

[0054] In particular, according to the embodiments disclosed in this invention, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, embodiments of this invention include a computer program product comprising a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts. In such embodiments, the computer program can be downloaded and installed from a network via a communication device, or installed from a storage device, or installed from a read-only memory. When the computer program is executed by a processing device, it performs the functions defined in the methods of the embodiments disclosed in this invention.

[0055] It should be understood that the various parts disclosed in this invention can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0056] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the present invention and its equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout, characterized in that, The methods include: Step S10: Obtain the pixel array of the pixelated semiconductor detector, and perform pixel module partitioning based on the pixel array using an adjacent four-pixel partitioning method to output a 2×2 pixel module set; Step S20: Based on the 2×2 pixel module set, a dual-channel readout construction task is performed using a diagonal pixel pairing connection method, outputting a dual-channel diagonally paired readout channel set; Step S20 specifically includes: Step S201: Based on each of the 2×2 pixel modules, determine the first diagonal pixel group formed by the first pixel and the fourth pixel, and determine the second diagonal pixel group formed by the second pixel and the third pixel; Step S202: Electrically connect the first diagonal pixel group to form a first readout channel. The second diagonal pixel group is electrically connected to form a second readout channel. ; Step S30: Based on the dual-channel diagonally paired readout channel set, an independent charge-sensitive preamplifier is used to perform the readout preprocessing task, outputting a dual-channel readout signal set; Step S30 specifically includes: Step S301: For each of the 2×2 pixel modules, the first readout channel... Connect to the first charge-sensitive preamplifier, and connect the second readout channel corresponding to each of the 2×2 pixel modules. Connect to a second charge-sensitive preamplifier; Step S302: The first readout channel is connected to the first charge-sensitive preamplifier. The charge signal on the signal is converted into a voltage form as the first readout signal. ; Step S303: The second readout channel is connected to the second charge-sensitive preamplifier. The charge signal on the signal is converted into a second readout signal in the form of voltage. and the first readout signal and the second readout signal A set of dual-channel readout signals is identified as part of the dual-channel readout signal set; Step S40: Based on the dual-channel readout signal set, perform mutual subtraction processing using an adjustable differential gain cross-cancellation method to output the dual-channel differential readout signal set; Step S40 specifically includes: Step S401: Set the differential gain scan value within the range of 0.5 to 2.

0. Obtain different scan values ​​respectively The energy resolution, peak width, and peak-to-total ratio are set, and the optimal differential gain is determined based on the minimum energy resolution, the minimum peak width, and the maximum peak-to-total ratio. This optimal differential gain is then used as the first differential gain. Second differential gain ; Step S402: Based on the first readout signal and after the first differential gain The weighted second readout signal The first differential readout signal is obtained. Its expression is: ； Step S403: Based on the second readout signal and via the second differential gain The weighted first readout signal The second differential readout signal is obtained. Its expression is: ； Based on the first differential readout signal and the second differential readout signal Output the set of dual-channel differential readout signals; Step S50: Based on the dual-channel differential readout signal set, the energy spectrum generation task is performed using shaping amplification, candidate pulse amplitude comparison, peak hold, analog-to-digital conversion, and multi-channel energy spectrum analysis to output energy spectrum data; Step S50 specifically includes: Step S501: Read out the first differential signal respectively and the second differential readout signal Perform shaping and amplification to obtain the first candidate pulse signal and the second candidate pulse signal; Step S502: Compare the pulse amplitudes of the first candidate pulse signal and the second candidate pulse signal.

2. The semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in claim 1, characterized in that, Step S10, which involves obtaining the pixel array of the pixelated semiconductor detector, performing pixel module partitioning based on the pixel array using an adjacent four-pixel partitioning method, and outputting a 2×2 pixel module set, specifically includes: Step S101: Obtain the row position, column position, and pixel electrode feature size of each pixel in the pixel array. and detector thickness ,in, For pixel electrode feature size, The thickness of the detector, and satisfying ; Step S102: Select four pixels with adjacent row and column positions along the row and column directions of the pixel array to obtain a group of four adjacent pixels; Step S103: Determine each of the adjacent four pixel groups as a 2×2 pixel module, and in each of the 2×2 pixel modules, determine the first pixel, the second pixel, the third pixel and the fourth pixel in sequence according to the positional relationship of the upper left, upper right, lower left and lower right.

3. The semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in claim 2, characterized in that, Step S20 further includes: Step S203: For each of the 2×2 pixel modules, the first readout channel is formed and the second readout channel Perform branched wiring to output the set of dual-path diagonally paired readout channels.

4. The semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in claim 3, characterized in that, In step S202, the first readout channel The second readout channel is used to collect the charge signals generated by the first pixel and the fourth pixel. Used to collect the charge signals generated by the second pixel and the third pixel, so that each of the 2×2 pixel modules outputs two diagonally paired readout channels from four pixels.

5. The semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in claim 1, characterized in that, Step S502 further includes: when the pulse amplitude of the first candidate pulse signal is greater than or equal to the pulse amplitude of the second candidate pulse signal, determining the first candidate pulse signal as a gating signal; when the pulse amplitude of the first candidate pulse signal is less than the pulse amplitude of the second candidate pulse signal, determining the second candidate pulse signal as a gating signal. Step S50 further includes: Step S503: Reading out the signal based on the first differential signal With the second differential readout signal The relative amplitude is used to perform position correction or sub-pixel position estimation on the position of the radiation event in the 2×2 pixel module to obtain the position correction result. Based on the position correction result, peak holding, analog-to-digital conversion and multichannel energy spectrum analysis are performed on the gating signal to output the energy spectrum data.

6. A semiconductor detector signal processing system based on pixel diagonal pairing and dual-path differential readout, applied to the semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in any one of claims 1 to 5, characterized in that, The semiconductor detector signal processing system includes: The pixel module partitioning module is used to obtain the pixel array of the pixelated semiconductor detector, and to perform the pixel module partitioning task based on the pixel array using an adjacent four-pixel partitioning method, and output a 2×2 pixel module set; The dual-channel construction module is used to perform a dual-channel readout channel construction task based on the 2×2 pixel module set by using a diagonal pixel pairing connection method, and output a dual-channel diagonal paired readout channel set; The readout preprocessing module is used to perform readout preprocessing tasks based on the dual-channel diagonally paired readout channel set using an independent charge-sensitive preamplifier method, and output a dual-channel readout signal set; The differential subtraction processing module is used to perform subtraction processing based on the dual-channel readout signal set using an adjustable differential gain cross-cancellation method, and output the dual-channel differential readout signal set. The energy spectrum analysis module is used to perform energy spectrum generation tasks based on the dual-channel differential readout signal set, employing shaping amplification, candidate pulse amplitude comparison, peak hold, analog-to-digital conversion, and multi-channel energy spectrum analysis methods, and output energy spectrum data.

7. A semiconductor detector signal processing device based on pixel diagonal pairing and dual-path differential readout, characterized in that, The semiconductor detector signal processing device based on pixel diagonal pairing and dual-path differential readout includes: a memory, a processor, and a semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout stored in the memory and executable on the processor. When the semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout is executed by the processor, it implements a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in any one of claims 1 to 5.

8. A computer program product, characterized in that, The computer program product includes a semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout. When the semiconductor detector signal processing program based on pixel diagonal pairing and dual-path differential readout is executed by the processor, it implements a semiconductor detector signal processing method based on pixel diagonal pairing and dual-path differential readout as described in any one of claims 1 to 5.

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