Local reinforcement chip system against light port deformation

Abstract

The application discloses a local reinforcing chip system capable of preventing deformation of an optical port, which comprises a substrate and a U-shaped reinforcing part, wherein the U-shaped reinforcing part has a U-shaped opening area, the U-shaped opening area has a notch, and the U-shaped opening area makes the upper surface of the substrate have a window surface; the photonic chip has a first end and a second end, the second end is provided with an optical port, the photonic chip is arranged at the window surface, and the second end is outwardly protrudingly arranged through the notch to form a protruding area; the protruding area is provided with a first reinforcing part, the first reinforcing part comprises a plurality of vertical reinforcing areas, each vertical reinforcing area comprises at least one reinforcing element, the vertical length of each vertical reinforcing area gradually decreases in a direction away from the optical port and towards the notch, and each vertical reinforcing area forms a triangular layout. The U-shaped reinforcing part and the first reinforcing part are matched, the overall structural strength is reinforced, the probability of deformation of the optical port is reduced, and the triangular layout is also beneficial to dispersing the stress received in the optical port coupling process.

Description

Technical Field

[0001] This invention relates to the field of optical chip technology, and more specifically to a locally reinforced chip system for preventing optical port deformation. Background Technology

[0002] As core components in optical communication, optical computing, and sensing, the performance and reliability of optical chips directly determine the integration and operational capabilities of the entire optoelectronic system. With the continuous improvement of data transmission rates and integration density, the size of optical chips is increasing to accommodate more photonic and electronic functional modules. However, significant warpage is a common problem for these large optical chips during manufacturing, packaging, and subsequent thermal cycling. This warpage mainly stems from the mismatch in thermal expansion coefficients between different materials within the chip (such as the silicon substrate, silicon dioxide dielectric layer, metal electrodes, and optical waveguide materials), as well as residual stress introduced by processes such as thin film deposition, etching, and bonding. Furthermore, during the packaging stage, the connection between the chip and the substrate or shell (such as eutectic bonding and silver paste curing) also generates a complex thermo-mechanical stress field, further exacerbating the warpage.

[0003] Optical chips typically integrate optical port structures for external optical coupling. These ports need to maintain sub-micron or even nanometer-level shape and positional accuracy to ensure efficient and low-loss alignment and coupling with optical fibers, lenses, or waveguides of opposing chips. However, the overall warpage of large optical chips can cause localized deformation of optical ports located at chip edges or specific areas through structural transmission effects. Once this deformation exceeds the allowable tolerance range (typically hundreds of nanometers), it will severely degrade coupling efficiency, increase insertion loss, and even lead to optical path interruption. In actual packaging processes, to compensate for optical port deformation, active alignment or complex dimming mechanisms are often required, significantly reducing packaging efficiency and yield, and increasing manufacturing costs.

[0004] To address the aforementioned issues, existing technologies attempt to suppress warpage by optimizing chip manufacturing processes (such as adjusting annealing conditions and stress compensation layer design) or using low-stress packaging materials. However, these methods are often limited by process compatibility, material selection range, and cost constraints, making it difficult to completely eliminate warpage on large-size chips. Summary of the Invention

[0005] The purpose of this invention is to provide a locally reinforced chip system for preventing optical port deformation, which partially solves or alleviates the above-mentioned deficiencies in the prior art, strengthens the overall structural strength of the chip, and reduces the probability of optical port deformation.

[0006] To solve the aforementioned technical problems, the present invention specifically adopts the following technical solution: This invention provides a locally reinforced chip system for preventing light port deformation, comprising: substrate; A U-shaped reinforcing member is provided on the upper surface of the substrate. The U-shaped reinforcing member has a U-shaped opening area and a notch. The U-shaped opening area makes the upper surface of the substrate have at least a partial window surface. A photonic chip having a first end and a second end, the second end being provided with an optical port, the photonic chip being disposed at the window surface, and the second end of the photonic chip protruding outward through the notch to form a protruding area; A first reinforcing portion is provided on the protruding area, the first reinforcing portion being disposed between the first end and the optical port, and the first reinforcing portion comprising: Multiple vertical reinforcement zones are arranged along a direction away from the optical aperture, and each vertical reinforcement zone includes at least one reinforcement element. The vertical length of each vertical reinforcement zone gradually decreases along a direction away from the optical aperture and toward the notch, so that the vertical reinforcement zones form a triangular layout, so that stress can be evenly distributed outward from the two sides of the triangle.

[0007] Furthermore, the number of reinforcing elements in each of the vertical reinforcing zones gradually decreases in the direction away from the optical aperture and towards the notch.

[0008] Furthermore, a second reinforcing portion is provided in the area corresponding to the notch within the substrate. The projection portion of the second reinforcing portion and the first reinforcing portion in the height direction of the substrate coincide, and the first reinforcing portion is positioned closer to the light port than the second reinforcing portion.

[0009] Furthermore, the multiple vertical reinforcement zones include: A main reinforcement area is provided adjacent to the optical port, and the length of the main reinforcement area is greater than or equal to the length of the optical port, so as to bear the stress transmitted at the optical port and limit the deformation of the optical port. An auxiliary reinforcement area is provided away from the optical port, and the length of the auxiliary reinforcement area is less than the length of the main reinforcement area and less than the length of the optical port, so as to receive the stress transmitted by the main reinforcement area and disperse the stress in different directions.

[0010] Furthermore, the spacing between any two adjacent vertical reinforcing zones is equal to the width of the reinforcing element.

[0011] Furthermore, the triangle is an isosceles triangle.

[0012] Furthermore, the second reinforcing portion includes a plurality of reinforcing members distributed along the height direction of the substrate, the substrate having through holes disposed along its height direction, and any two adjacent reinforcing members being connected through the through holes.

[0013] Furthermore, the reinforcing elements in any two adjacent vertical reinforcing zones are staggered.

[0014] Furthermore, the centerline of the first reinforcing part in the horizontal direction is collinear with the centerline of the optical port in the horizontal direction.

[0015] Furthermore, both the reinforcing member and the reinforcing element are metal parts.

[0016] Beneficial effects: This invention increases the structural strength of the substrate by setting a U-shaped reinforcing member structure on the top of the substrate, while effectively suppressing the overall warping deformation of the substrate. Combined with the first reinforcing part with a triangular layout set at the optical port of the photonic chip, it effectively suppresses the deformation at the optical port and disperses the stress on both sides during the optical port coupling process, reducing the probability of damage to the photonic chip due to stress concentration.

[0017] The first reinforcing part of the present invention is composed of multiple parallel and staggered reinforcing elements. On the one hand, the staggered reinforcing elements can sequentially transmit the stress during the optical port coupling process to each reinforcing element, and each reinforcing element disperses the stress, preventing the stress from being transmitted from the gaps between the reinforcing elements to the optical waveguide of the photonic chip, thus affecting the normal transmission of the optical signal. On the other hand, it avoids the situation of shielding the signal by setting a whole reinforcing element.

[0018] The present invention provides a second reinforcing part at the corresponding notch inside the substrate, which, together with the U-shaped reinforcing structure, strengthens all four sides of the substrate, reducing the probability of warping deformation around the substrate. The projection of the second reinforcing part and the first reinforcing part in the height direction of the substrate coincides, which can increase the structural strength of the photonic chip protrusion area and reduce the pressure deformation of the photonic chip protrusion area relative to the substrate during optical port coupling. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. The elements or parts in the drawings are not necessarily drawn to scale. Obviously, the drawings described below are some embodiments of the present invention, and those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0020] Figure 1 This is a schematic diagram of the substrate structure; Figure 2 This is a reference diagram showing the actual usage of photonic chips. Figure 3A structural diagram illustrating the positional relationship between the first and second reinforcing parts; Figure 4 This is a schematic diagram of the structure of a photonic chip; Figure 5 This is a schematic diagram of the second reinforcing section.

[0021] Summary of attached labeling and identification: 1. Substrate; 11. Window surface; 12. Second reinforcement; 121. Reinforcing member; 13. Through hole; 2. U-shaped reinforcing member; 21. U-shaped opening area; 3. Photonic chip; 31. Optical port; 32. Protruding area; 33. First reinforcement; 331. Reinforcing element. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0023] In this document, suffixes such as "module," "part," or "unit" used to denote elements are used only for the purpose of illustrative purposes and have no specific meaning in themselves. Therefore, "module," "part," or "unit" may be used interchangeably.

[0024] In this document, the terms "upper," "lower," "inner," "outer," "front," "rear," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0025] In this document, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0026] In this document, "and / or" includes any and all combinations of one or more of the listed related items.

[0027] In this article, "multiple" means two or more, that is, it includes two, three, four, five, etc.

[0028] Example 1: A locally reinforced chip system for preventing light port deformation includes a substrate 1, with a U-shaped reinforcing member 2 disposed on the upper surface of the substrate 1 (see...). Figure 1 and Figure 2 The U-shaped reinforcing member 2 has a U-shaped opening area 21, and the U-shaped opening area 21 has a notch. The U-shaped opening area 21 makes the upper surface of the substrate 1 have at least a partial window surface 11. A photonic chip 3 is disposed at the window surface 11. The photonic chip 3 has a first end and a second end, wherein the first end is disposed on the window surface 11; the second end is provided with an optical port 31, and the second end of the photonic chip 3 protrudes outward through the notch to form a protrusion area 32.

[0029] A first reinforcing part 33 is provided on the protruding area 32. Specifically, the first reinforcing part 33 is disposed between the first end and the optical port 31. The first reinforcing part 33 includes multiple rows of vertical reinforcing areas disposed in a direction away from the optical port 31 (the vertical direction specifically refers to...). Figure 2 (In the direction indicated by the middle arrow a), the vertical reinforcement area includes at least one reinforcement element 331. The vertical length of the vertical reinforcement area gradually decreases in the direction away from the optical port 31 and towards the notch, so that the vertical reinforcement area forms a triangular layout, thereby enabling the stress to be evenly distributed outward from the two sides of the triangle. It should be noted that the stress is the stress generated by the optical port 31 during coupling, and the two sides of the triangle indicated are the two sides that are not parallel to the optical port 31.

[0030] It is important to understand that when the optical fiber and optical port 31 are connected, the area of ​​the photonic chip 3 adjacent to optical port 31 will experience stress changes due to external forces. At this time, the vertical reinforcement area near optical port 31 has a greater length, thus enabling it to initially bear a larger stress when the optical fiber is connected to the optical port.

[0031] Furthermore, this embodiment adopts an interval gradient setting scheme (such as the triangular layout mentioned above), which can reduce or mitigate the negative impact of the strengthening process on the strength of the photonic chip 3 while achieving local strengthening design of the photonic chip 3.

[0032] Specifically, the interval gradient setting scheme refers to: 1) multiple reinforcing elements 331 (which can be metal elements, such as vertically set strip metal areas) are set at intervals in the vertical reinforcing area; 2) the vertical reinforcing area is arranged at intervals along the length direction; 3) the length of the vertical reinforcing area changes in a gradient, that is, it gradually decreases along the direction away from the light port 31.

[0033] It is important to note that photonic chips 3 are often used in intensive big data computing, thus placing very high demands on their structural performance. Adding reinforcing elements 331 to photonic chips 3 also puts greater pressure on their design and fabrication (for example, adding metal elements may cause cracking during fabrication or use due to inconsistent coefficients of thermal expansion). In this application, by using an intermittent gradient setting, it is possible to reduce the potential additional negative impacts while allowing the introduction of additional metal elements for local reinforcement.

[0034] In this embodiment, on the one hand, the spacing of the components in length and direction reduces excessive differences in thermal expansion in local areas of the metal components (reducing crack generation); on the other hand, the decreasing length of the components along the gradient allows for closer absorption of the most direct stress (i.e., the longer vertical reinforcing area is positioned close to the aperture 31), while the two approximately symmetrical hypotenuses (i.e., the two sides of a triangle) created by the reduced length achieve uniform stress transmission and dispersion. Thus, by introducing fewer metal components and arranging a smaller area of ​​the first reinforcing section, relatively efficient stress dispersion is achieved.

[0035] Thus, the interval gradient setting scheme achieves a small amount and small area of ​​reinforcement arrangement, which on the one hand can effectively disperse stress, and on the other hand can avoid the reinforcement as an external additional element from having too much adverse effect on the original strength of the photonic chip 3.

[0036] Based on the above structure, the U-shaped reinforcing member 2 strengthens the overall structural strength of the substrate 1, which can suppress the deformation of the substrate 1 corresponding to the three circumferential sides of the photonic chip 3 (i.e., the three sides of the photonic chip 3 other than the side where the light port 31 is located). In addition, the first reinforcing part 33 provided on the photonic chip 3 can achieve local reinforcement at the light port 31, further ensuring the stability of the overall structure.

[0037] It should be noted that the deformation described in this embodiment specifically refers to the chip warping phenomenon, which causes the chip surface to be uneven.

[0038] Furthermore, the number of reinforcing elements 331 in each vertical reinforcing area gradually decreases as it moves away from the light port 31 and toward the notch. In this embodiment, each vertical reinforcing area extending from the light port 31 toward the notch side is provided with three, two, and one reinforcing elements 331 in sequence. The structural dimensions of each reinforcing element 331 are the same. Based on this structure, the first reinforcing part 33 is arranged in a triangular shape.

[0039] Specifically, in this embodiment, the first reinforcing part 33 is generally in the shape of an isosceles triangle, and the first reinforcing part 33 is horizontal in the direction of (i.e.) Figure 2The centerline (in the direction indicated by the middle arrow b) is collinear with the horizontal centerline of the optical port 31. This design allows the stress on the optical port 31 during coupling to be more evenly distributed to both sides, avoiding stress concentration that could damage the photonic chip 3 structure.

[0040] like Figure 2 and Figure 4 As shown, the length of the vertical reinforcement zone adjacent to the optical port 31 is greater than or equal to the length of the optical port 31. This design can ensure the overall structural strength of the optical port 31 and reduce the probability of deformation due to the lack of support from the vertical reinforcement zone at both ends of the optical port 31.

[0041] In other words, the length of at least one of the outermost (i.e., the closest to the optical port) vertical reinforcement zones (as the main reinforcement zones) is greater than the length of the optical port 31, so as to simultaneously eliminate stress and limit the deformation of the optical port, while the length of the remaining vertical reinforcement zones (as auxiliary reinforcement zones) is less than the length of the optical port 31, so as to mainly bear the stress transmitted by the main reinforcement zones and disperse the stress in different directions.

[0042] Furthermore, in this embodiment, the spacing between any two adjacent vertical reinforcing areas is equal to the width of the reinforcing element 331. That is, the first reinforcing part 33 in this embodiment is composed of multiple parallel and spaced reinforcing elements 331, rather than a single solid reinforcing element 331. This reduces the probability that the reinforcing element 331 is too large and affects the normal signal transmission of the photonic chip 3. In this embodiment, the spacing between any two adjacent vertical reinforcing areas, i.e., the width of the reinforcing element 331, is in the range of 7~15 μm, preferably 10 μm.

[0043] The reinforcing elements 331 in any two adjacent vertical reinforcing zones are staggered (see...). Figure 2 Based on this structural design, when the optical port 31 is subjected to stress, the stress can be sequentially transmitted to each of the reinforcing elements 331 by means of the staggered reinforcing elements 331, which reduces the probability that the stress will be transmitted from the gaps between the reinforcing elements 331 to the optical waveguide of the photonic chip 3 and affect the signal transmission of the photonic chip 3.

[0044] A second reinforcing part 12 is provided in the area corresponding to the notch in the substrate 1. The second reinforcing part 12 and the first reinforcing part 33 are aligned in the height direction of the substrate 1 (i.e., Figure 3 The projection portions (in the direction indicated by the middle arrow c) overlap, and the first reinforcing part 33 is positioned closer to the light port 31 than the second reinforcing part 12 (see [reference]). Figure 3The second reinforcing part 12 strengthens the structural strength at the notch, and the design of the U-shaped reinforcing member 2 reduces the probability of warping around the substrate 1. The projections of the first reinforcing part 33 and the second reinforcing part 12 in the height direction of the substrate 1 overlap, increasing the structural strength of the protruding area 32 and reducing the probability of the protruding area 32 being deformed under pressure.

[0045] It should be noted that the projected area of ​​the second reinforcing part 12 in the height direction of the substrate 1 is larger than the projected area of ​​the first reinforcing part 33 in the height direction of the substrate 1. This design can further ensure the structural strength at the notch, thereby ensuring the alignment accuracy of the optical port 31 with the external optical fiber or other optical components.

[0046] Furthermore, the second reinforcing portion 12 includes a plurality of reinforcing members 121 distributed along the height direction of the substrate 1. The substrate 1 has through holes 13 extending along its height direction, and any two adjacent reinforcing members 121 are connected through the through holes 13 (see [reference]). Figure 5 Through a multi-layer structure design, the structural strength of the substrate 1 at the notch is further enhanced.

[0047] It should be noted that since the thickness (i.e., height) of the substrate 1 itself is greater than the thickness of the photonic chip 3, more layers of the second reinforcing part 12 can be provided in the substrate 1, that is, the thickness of the second reinforcing part 12 is greater than the thickness of the first reinforcing part 33.

[0048] Furthermore, both the reinforcing member 121 and the reinforcing element 331 are metal parts. Relying on the structural strength of the metal itself, deformation at the substrate 1 and the optical port 31 of the photonic chip 3 can be effectively reduced. In addition, the excellent thermal conductivity of metal can assist in heat dissipation, helping the heat in the optical port area to be conducted away more quickly, thus improving the stability of the chip in high-temperature environments. In this embodiment, copper is preferably used as the reinforcing material for both the reinforcing member 121 and the reinforcing element 331.

[0049] It should be noted that in this embodiment, the second reinforcing part 12 is disposed on the substrate 1, but its projection in the height direction overlaps with the first reinforcing part 33 to at least partially. Thus, the positional correspondence between the first reinforcing part 33 and the second reinforcing part 12 is conducive to their synergistic effect, that is, the anti-warping requirements of the chip system are met in a differentiated manner through the cooperation of the first reinforcing part 33 and the second reinforcing part 12.

[0050] Specifically, on substrate 1, the area surrounding photonic chip 3 is reinforced globally (i.e., globally to prevent warping) by external reinforcement (i.e., externally assembled U-shaped reinforcement 2), while the opening area corresponding to photonic chip 3 is locally reinforced by internal reinforcement. Thus, by combining external and internal reinforcement methods, additional pressure on substrate 1 (such as structural design or processing pressure) is reduced while achieving overall reinforcement.

[0051] In other words, this invention achieves a synergy of mild and severe reinforcement through internal and external strengthening methods. External methods (such as the U-shaped reinforcement 2) provide mild global anti-warping on the outside, while the U-shaped reinforcement 2 applies overall anti-warping to the edge area, reducing the difficulty of designing or processing the substrate 1 itself. Severe reinforcement is introduced only as a local effect in a specific area (i.e., the opening area corresponding to the photonic chip 3). Thus, the local severe reinforcement will not excessively affect the processing difficulty of the substrate 1 itself (understandably, similar to the photonic chip 3, adding reinforcement to the substrate 1 may also cause process design pressure), while meeting the key anti-warping requirements by focusing on strengthening the main contact area between the substrate 1 and the photonic chip 3 (especially the optical port area adjacent to the photonic chip that is prone to warping).

[0052] It is understood that the light reinforcement mentioned in this embodiment refers to limiting the stretching of the object (such as substrate 1) by contacting the outer surface of the object through the strength of the U-shaped reinforcement 2 itself, while the heavy reinforcement refers to the reinforcement element being directly embedded in the object itself to enhance the structural strength of the object itself to prevent warping.

[0053] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, the present invention is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of the present invention without departing from the spirit and scope of the claims. All of these forms are within the protection scope of the present invention.

Claims

1. A locally reinforced chip system for preventing light port deformation, characterized in that, include: substrate(1); The upper surface of the substrate is provided with a U-shaped reinforcing member (2), the U-shaped reinforcing member (2) has a U-shaped opening area (21), and the U-shaped opening area (21) has a notch, the U-shaped opening area (21) makes the upper surface of the substrate (1) have at least a partial window surface (11). Photonic chip (3) has a first end and a second end. The second end is provided with an optical port (31). The photonic chip (3) is located at the window surface (11), and the second end of the photonic chip (3) protrudes outward through the notch to form a protrusion area (32). A first reinforcing part (33) is provided on the protruding area (32), the first reinforcing part (33) is disposed between the first end and the optical port (31), and the first reinforcing part (33) includes: Multiple vertical reinforcement zones are arranged along a direction away from the light port (31), and each vertical reinforcement zone includes at least one reinforcement element (331). The vertical length of the vertical reinforcement zone gradually decreases along a direction away from the light port (31) and toward the notch, so that the vertical reinforcement zones form a triangular layout, so that stress can be evenly distributed outward from the two sides of the triangle.

2. The local reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, The number of reinforcing elements in each of the vertical reinforcing zones gradually decreases in the direction away from the optical port (31) and towards the notch.

3. The localized reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, A second reinforcing part (12) is provided in the area corresponding to the notch in the substrate (1). The projection of the second reinforcing part (12) and the first reinforcing part (33) in the height direction of the substrate (1) coincides, and the first reinforcing part (33) is located closer to the light port (31) than the second reinforcing part (12).

4. The localized reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, The multiple vertical reinforcement zones include: A main reinforcement area is provided near the optical port (31), and the length of the main reinforcement area is greater than or equal to the length of the optical port (31) to bear the stress transmitted at the optical port (31) and limit the deformation of the optical port (31); An auxiliary reinforcement area is provided away from the optical port (31), and the length of the auxiliary reinforcement area is less than the length of the main reinforcement area and less than the length of the optical port (31) to receive the stress transmitted by the main reinforcement area and disperse the stress in different directions.

5. The local reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, The spacing between any two adjacent vertical reinforcing zones is equal to the width of the reinforcing element.

6. The localized reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, The triangle is an isosceles triangle.

7. The localized reinforcement chip system for preventing light port deformation according to claim 3, characterized in that, The second reinforcing part (12) includes a plurality of reinforcing members (121) distributed along the height direction of the substrate. The substrate (1) has a through hole (13) that is disposed through it along its height direction. Any two adjacent reinforcing members (121) are connected through the through hole (13).

8. The localized reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, The reinforcing elements (331) in any two adjacent vertical reinforcing zones are staggered.

9. The localized reinforcement chip system for preventing light port deformation according to claim 6, characterized in that, The centerline of the first reinforcing part (33) in the horizontal direction is collinear with the centerline of the optical port (31) in the horizontal direction.

10. The localized reinforcement chip system for preventing light port deformation according to claim 1, characterized in that, Both the reinforcing member (121) and the reinforcing element (331) are metal parts.

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