Electronic device hardware intelligent heat dissipation dynamic optimization control method, device and storage medium

Abstract

The application discloses an electronic equipment hardware intelligent heat dissipation dynamic optimization control method and device and a storage medium, temperature data of each hardware module of an electronic equipment and operation data of a heat dissipation system under a current heat dissipation condition are acquired; a heat dissipation demand matching degree of the electronic equipment hardware under the current heat dissipation condition is calculated by using a heat dissipation demand matching algorithm according to the temperature data of each hardware module and operation power of the heat dissipation system, and whether the current control parameter needs to be optimized is judged according to the heat dissipation demand matching degree; when it is judged that the control parameter needs to be optimized, a PID algorithm is used to correct a PWM duty cycle, real-time correction of the control parameter under the current heat dissipation condition is realized, dynamic and accurate matching between heat dissipation capacity and actual heat dissipation demand is realized, the operation power consumption of the heat dissipation system is greatly reduced while the heat dissipation effect is ensured, and double optimization of heat dissipation efficiency and energy consumption control is realized.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation control technology, specifically relating to a method, device, and storage medium for intelligent heat dissipation dynamic optimization control of electronic device hardware. Background Technology

[0002] Traditional automotive electronic devices typically employ a single air-cooling or liquid-cooling structure for heat dissipation, using fixed modes or simple threshold control methods. Air-cooling control usually relies on a fan and a fixed air duct, dissipating heat through preset speed settings. Liquid-cooling control uses a constant-speed pump and a fixed circuit, determining whether to start or stop the cooling device based on the detection value of a single temperature sensor and a set temperature threshold, using a temperature threshold comparison mechanism.

[0003] Currently, automobiles are becoming increasingly intelligent, which places higher demands on the operational stability of automotive electronic devices. Traditional, crude heat dissipation control methods can no longer meet the operational needs of automotive electronic devices, cannot adapt to the heat dissipation control requirements in multi-region, high-intensity heat dissipation scenarios, and are difficult to achieve a good balance between heat dissipation power consumption, heat dissipation efficiency, and operational stability. Summary of the Invention

[0004] The purpose of this invention is to provide a method, device and storage medium for intelligent heat dissipation dynamic optimization control of electronic device hardware, so as to solve the problem that traditional heat dissipation control methods cannot adapt to the heat dissipation control requirements in multi-area and high-intensity heat dissipation scenarios.

[0005] This invention is achieved through the following technical solution: A dynamic optimization control method for intelligent heat dissipation of electronic device hardware is used to control the heat dissipation system. The heat dissipation system includes an air cooling system and a liquid cooling system. The air cooling system includes a fan and an electric damper. The liquid cooling system includes a liquid cooling main circuit and a liquid cooling secondary circuit. Both the liquid cooling main circuit and the liquid cooling secondary circuit include a liquid cooling pump and an electrically controlled valve. Both the fan and the liquid cooling pump are controlled by PWM. The intelligent heat dissipation dynamic optimization control method includes the following steps: Acquire temperature data of each hardware module of the electronic device and operating data of the cooling system under the current heat dissipation conditions. The operating data includes the real-time opening of the electric damper, the flow rate of the main liquid cooling circuit, the flow rate of the secondary liquid cooling circuit, the PWM duty cycle, the time of heat dissipation mode switching, and the operating power of the cooling system. The matching degree of heat dissipation demand under the current heat dissipation conditions of electronic equipment hardware is calculated based on the temperature data of each hardware module and the operating power of the heat dissipation system. Based on the matching degree of heat dissipation demand, it is determined whether the control parameters need to be optimized. When it is determined that optimization is needed, the PID algorithm is used to correct the PWM duty cycle of the fan and liquid cooling pump.

[0006] In some embodiments, the step of determining whether the control parameters need to be optimized based on the heat dissipation requirement matching degree includes: The heat dissipation requirement matching degree is calculated using a heat dissipation requirement matching degree algorithm, and is expressed as: ; in, M To match the heat dissipation requirements, Let be the actual temperature of the nth hardware module at time t. The safe temperature control threshold for the nth hardware module. Let t be the total operating power of the cooling system. T This represents the total operating time under the current heat dissipation condition, obtained based on the time of heat dissipation mode switching; when M Value greater than the optimal matching threshold When this happens, it is determined that the current control parameters need to be optimized.

[0007] In some embodiments, the PID algorithm used is represented as: ; in, This is the corrected real-time PWM duty cycle; This is the baseline value for the optimal PWM duty cycle of the previous running cycle; This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients; The temperature deviation at time t is expressed as: ; Let be the actual temperature of the nth hardware module at time t. This refers to the safe temperature control threshold for the hardware module.

[0008] In some embodiments, the basic opening degree, flow guiding ratio, opening degree adjustment rate, and liquid cooling flow distribution coefficient of the electric damper are optimized based on the corrected PWM duty cycle, the temperature deviation ratio of each hardware module, and the operating condition calibration coefficient, and are used as optimized control parameters to control the heat dissipation system.

[0009] In some embodiments, the corrected thermal demand matching deviation is obtained. , is represented as: ;in, M 1 To achieve the corrected heat dissipation requirement matching, The optimal matching threshold; when At the same time, the basic opening degree, flow guiding ratio, opening adjustment rate and liquid cooling flow distribution coefficient of the electric damper are optimized.

[0010] In some embodiments, the steps of optimizing the basic opening degree, flow guiding ratio, opening adjustment rate, and liquid cooling flow distribution coefficient of the electric damper include: The basic opening of the electric damper is optimized, as shown below: ; in, The corrected basic opening of the electric damper; The original opening of the electric damper base; This refers to the calibration coefficient for the basic opening of the electric damper; This represents the maximum value of the PWM duty cycle. This is the corrected real-time PWM duty cycle; And / or, the steps for optimizing the flow ratio of the electric damper include: The baseline value for obtaining the current flow of a specific hardware module is represented as follows: ; in, This is the reference value for the current diversion of the nth hardware module. Let the temperature deviation percentage of the nth hardware module be expressed as... , This represents the real-time temperature deviation of the nth hardware module. This is the flow diversion ratio calibration coefficient; The corrected flow ratio is obtained by normalizing the proportion of the flow reference value of each hardware module. And / or, optimize the opening adjustment rate of the electric damper, expressed as: ; in, This indicates the corrected adjustment rate of the electric damper opening. This indicates the original electric damper opening adjustment rate; This represents the calibration coefficient for the opening adjustment rate; This indicates the real-time rate of change of the PWM duty cycle; And / or, the steps for optimizing the liquid cooling flow distribution coefficient include: Based on the corrected real-time PWM duty cycle Temperature deviation percentage of corresponding hardware modules and liquid cooling flow rate calibration coefficient Calculate the real-time flow rates of the current liquid cooling main circuit and liquid cooling secondary circuit, expressed as: ; ; in, This represents the current real-time flow rate of the liquid cooling main circuit. This represents the current real-time flow rate of the liquid-cooled secondary loop. , … These represent the percentage of temperature deviation for each hardware module whose temperature is regulated via the liquid cooling main circuit. , … These represent the percentage of temperature deviation for each hardware module whose temperature is regulated via the liquid cooling sub-loop. The optimized liquid cooling flow distribution coefficient, obtained based on the real-time flow rates of the main and auxiliary liquid cooling circuits, is expressed as follows: ;in This represents the optimized liquid cooling flow distribution coefficient.

[0011] In some embodiments, after correcting the PWM duty cycle, the start-up temperature threshold of the liquid cooling circuit is corrected, and the start-up temperature threshold of the liquid cooling circuit is dynamically adjusted.

[0012] In some embodiments, the corrected liquid cooling circuit start-up temperature threshold is obtained using a liquid cooling circuit start-up temperature threshold algorithm, and is expressed as: ; in, The corrected start-up temperature threshold for the liquid cooling circuit; This serves as the base temperature threshold for starting the liquid cooling circuit; This is a correction factor for the rate of temperature rise. This is the load factor correction factor; The average temperature rise rate of each hardware module under the current heat dissipation conditions is expressed as: ; Let be the actual temperature of the nth hardware module at time t; Let be the actual temperature of the nth hardware module at time t-1; T This represents the total operating time under the current heat dissipation conditions. This represents the average computing load rate of the electronic device under the current heat dissipation conditions.

[0013] On the other hand, the present invention also provides an electronic device, comprising: Processor; and Memory for storing the executable instructions of the processor; The processor is configured to execute the electronic device hardware intelligent heat dissipation dynamic optimization control method by executing the executable instructions.

[0014] On the other hand, the present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the aforementioned intelligent heat dissipation dynamic optimization control method for electronic device hardware.

[0015] Compared with the prior art, the present invention has the following advantages and beneficial effects: This invention continuously monitors the temperature data of each hardware module and the operating parameters of the heat dissipation control system to evaluate the matching degree of heat dissipation demand under the current heat dissipation conditions of electronic equipment hardware. Based on the evaluation results, it determines whether the control parameters of the heat dissipation control system need to be optimized and corrected. The PID algorithm is used to calculate the corrected PWM duty cycle to achieve real-time correction of the control parameters under the current heat dissipation conditions. This achieves dynamic and accurate matching between heat dissipation capacity and actual heat dissipation demand. While ensuring the heat dissipation effect, it significantly reduces the operating power consumption of the heat dissipation system and achieves dual optimization of heat dissipation efficiency and energy consumption control. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings in the embodiments will be briefly described below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a block diagram of the control structure of the heat dissipation control system according to an embodiment of the present invention.

[0018] Figure 2 This is a hardware architecture diagram of the electric damper control system of the air-cooled system according to an embodiment of the present invention.

[0019] Figure 3 This is a schematic diagram of the drive and control of the electrically controlled valve in the liquid cooling circuit of the liquid cooling system according to an embodiment of the present invention.

[0020] Figure 4 This is a timing diagram of the intelligent heat dissipation control soft start and slope limit control in an embodiment of the present invention. Detailed Implementation

[0021] To make the objectives, technical solutions, and advantages of this application clearer, specific embodiments of this application will be described in further detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely for explaining this application and not for limiting it. It should also be noted that, for ease of description, only the parts relevant to this application are shown in the drawings, not all of them. Before discussing exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although the flowcharts describe operations (or steps) as sequential processes, many of these operations can be performed in parallel, concurrently, or simultaneously. Furthermore, the order of the operations can be rearranged. The process can be terminated when its operation is completed, but may also have additional steps not included in the drawings. The process can correspond to a method, function, procedure, subroutine, subprogram, etc.

[0022] This invention employs a heat dissipation system to cool electronic device hardware. The heat dissipation system includes actuators such as fans, electric dampers, electrically controlled valves, and liquid cooling pumps to achieve air cooling and liquid cooling modes for electronic device hardware.

[0023] The heat dissipation control system controls the heat dissipation system, such as... Figure 1 , Figure 2 and Figure 3 It adopts a fully closed-loop control architecture with the main control chip MCU as the core, and uses temperature sensors, flow sensors and CAN bus as the acquisition terminals to realize the acquisition and transmission of heat source, environmental load and heat dissipation execution status data. The main control chip MCU has built-in intelligent decision algorithm, which determines heat dissipation requirements and generates heat dissipation strategy based on the acquired data. Then, through GPIO and PWM1 / PWM2 signals, it controls the execution components such as fans, electric dampers, electric valves, liquid cooling pumps, etc., to realize intelligent switching and operation regulation of air cooling / liquid cooling modes.

[0024] Meanwhile, the heat dissipation control system continuously collects operational data throughout the entire process and uses PID algorithms and adaptive control strategies to dynamically correct and optimize control parameters.

[0025] The overall control logic of this invention is as follows: First, the current heat dissipation demand condition is determined based on the temperature of each hardware module, such as low heat dissipation demand condition, medium heat dissipation demand condition, or high heat dissipation demand condition. For different heat dissipation demand conditions, corresponding heat dissipation control strategies are adopted to control the operation of actuators such as fans, electric dampers, and liquid cooling pumps. Initial control parameters are set in the heat dissipation control strategy, and corresponding control parameters are used to control each actuator. The temperature and operating data under the current control parameters are monitored, and the heat dissipation demand matching degree is calculated. Based on the heat dissipation demand matching degree, it is determined whether the control parameters need to be optimized. When optimization is required, the PID algorithm is used to correct the PWM duty cycle to achieve dynamic optimization control of the heat dissipation system.

[0026] This embodiment takes an in-vehicle intelligent driving domain ECU as an example. The ECU's core computing chip, IGBT power drive module, and power management module are the three main heat-generating components. To address the ECU's heat dissipation needs, a liquid cooling / air cooling system is configured. Each component requiring cooling has an independent temperature monitoring point, and two liquid cooling circuits (main liquid cooling circuit and auxiliary liquid cooling circuit) and an adjustable air cooling duct are used. The liquid cooling circuit uses a liquid cooling pump to pump the refrigerant and control the flow rate. An electronically controlled valve controls the switching of the liquid cooling circuit. The air cooling duct controls the airflow of the air-cooled fan, and the airflow volume and location are controlled by adjusting the opening and direction of the electric damper. Figure 2 The diagram shows the hardware architecture of the electric damper control system for the air-cooled system. DIR1 / 2 / 3 represent three directional control signal pins, ADC1 / 2 / 3 represent three A / D conversion circuits, and the position sensor is used to detect the opening position of the electric damper.

[0027] High-precision digital temperature sensors are installed in the power module, processor core, and other key heat-generating areas of the automotive electronic control unit (ECU). These sensors continuously collect multi-point temperature data from the corresponding power module temperature TEMP1, processor temperature TEMP2, and other key areas at a preset sampling frequency. The collected analog temperature signals are converted into digital signals by the digital-to-analog converter (ADC).

[0028] The thermal control system employs ambient temperature sensors deployed at the air inlet of the cooling duct and on the ECU housing to continuously monitor the ambient temperature inside the compartment. Simultaneously, it acquires real-time load parameters such as motor drive current, IGBT switching frequency, and processor workload from the vehicle control system ECU via a CAN bus interface. Furthermore, it uses liquid cooling main circuit flow sensors FLOW1 and liquid cooling secondary circuit flow sensors FLOW2 to obtain flow data for the corresponding liquid cooling circuits. Combined with the airflow speed data from the air-cooled duct and the collected temperature data, multi-dimensional operating condition data is generated and transmitted via I / O. 2The C or SPI bus transmits digital signals to the main control chip MCU in real time.

[0029] The main control chip MCU has a built-in intelligent decision-making algorithm. It takes the temperature data and load fluctuation parameters of each monitoring location as input, and combines the temperature-load mapping model or fuzzy control strategy to calculate the heat dissipation requirement level for different functional areas of the ECU. The heat dissipation requirement level is divided into three levels: low, medium and high. The corresponding heat dissipation control strategy is generated, including the air-cooled duct allocation status matched with the electric damper, the configuration of the corresponding liquid cooling main circuit / liquid cooling secondary circuit, and the execution control parameters of various actuators, etc., to control the heat dissipation system.

[0030] For example, when the heat dissipation requirement level is "low," the cooling system only activates the air-cooling module. The main control chip (MCU) controls the fan to run at low speed by outputting PWM1 / PWM2 signals, and adjusts the electric damper to its basic opening through relevant control signals, ensuring that airflow can evenly cover all heat-generating areas of the automotive electronic control unit (ECU). The liquid cooling system, controlling both the main and auxiliary liquid cooling circuits, remains in a closed or standby state throughout. The flow sensors FLOW1 in the main liquid cooling circuit and FLOW2 in the auxiliary liquid cooling circuit do not provide flow signal feedback, and the electronically controlled valves are in a closed state.

[0031] When the heat dissipation requirement level is "medium", the main control chip MCU adjusts the opening of the electric damper according to the temperature monitoring data of each monitoring point, and guides the air-cooled airflow to the heat-generating area with higher temperature first. At the same time, according to the heat dissipation requirements of each zone, it controls the start of either the liquid cooling main circuit or the liquid cooling secondary circuit. The coolant flow rate of the corresponding circuit is precisely controlled by the electronically controlled valve. The flow sensor FLOW1 of the liquid cooling main circuit and the flow sensor FLOW2 of the liquid cooling secondary circuit provide real-time feedback of the flow signal of the corresponding circuit. The main control chip MCU can adjust in real time according to the signal to achieve targeted local heat dissipation of the high-temperature area.

[0032] When the heat dissipation requirement is "high," the heat dissipation control system simultaneously activates two liquid cooling circuits. These circuits operate in parallel or in tandem, controlling the liquid cooling pumps to run at a high duty cycle. The main liquid cooling circuit flow sensor FLOW1 and the secondary liquid cooling circuit flow sensor FLOW2 provide real-time flow signals. Simultaneously, the main control chip (MCU) controls the electric damper to adjust to a centralized airflow state, distributing the air-cooled airflow primarily to the corresponding key heat-generating areas. This controls the air-cooling module to operate at a high duty cycle, achieving full-speed control of the fan speed and realizing the synergy of air and liquid cooling to maximize heat dissipation output.

[0033] Specifically, taking the heat dissipation control of the ECU in the vehicle intelligent driving domain as an example, the computing chip core, IGBT power drive module, and power management module are the three core heat-generating components in this ECU. The heat dissipation control strategy based on the heat dissipation requirements is as follows: Low heat dissipation requirements: The vehicle is in a low-speed cruising state, the ECU computing load is less than 30%, and the real-time temperatures of the computing chip core, IGBT power drive module and power management module are 42℃, 45℃ and 40℃ respectively, all below the low-level threshold of 50℃.

[0034] The main control chip MCU controls the air-cooled fan to run at a low speed with a 30% duty cycle through PWM1 / PWM2 signals, and the electric damper maintains a basic opening of 50% so that the airflow can evenly cover the three parts to be cooled; the electronically controlled valves of the liquid cooling main circuit and the liquid cooling secondary circuit are both in the closed state, the liquid cooling pump is in standby, and the flow sensors of the liquid cooling main and secondary circuits have no flow signal feedback, and heat dissipation is only achieved through the air cooling module.

[0035] Medium heat dissipation requirements: When the vehicle enters the intelligent following mode on urban roads, the ECU computing load rises to 60%. Due to the increased motor drive current, the temperature of the IGBT power drive module rises rapidly to 68℃. The core of the computing chip and the power management module have temperatures of 55℃ and 48℃, respectively. That is, only the IGBT power drive module exceeds the low-level threshold and meets the medium-level heat dissipation requirements.

[0036] The main control chip (MCU) controls the electric damper, adjusting its opening to 70% and biasing it towards the IGBT power drive module area, concentrating 60% of the air-cooled airflow to this area. Simultaneously, it controls the opening of the electronically controlled valve of the liquid cooling main circuit, controlling the liquid cooling pump to operate at a 50% duty cycle. The coolant flows through the liquid cooling main circuit and the heat dissipation channel of the IGBT power drive module, and the flow signal is fed back in real time through the liquid cooling main circuit flow sensor. This achieves coordinated heat dissipation of the IGBT power drive module through a combination of air cooling and single-channel liquid cooling. The power management module is still covered by basic air cooling, while the liquid cooling secondary circuit remains closed.

[0037] High heat dissipation requirements: The vehicle is in a high-speed intelligent driving state, the ECU is running at full load, and the temperatures of the computing chip core, IGBT power drive module and power management module have risen to 85℃, 90℃ and 75℃ respectively, all exceeding the high-level threshold.

[0038] The main control chip (MCU) controls the air-cooled fan to run at full speed with a 100% duty cycle, and the electric damper to its maximum opening of 90%, directing airflow to the three parts to be cooled in a 4:4:2 airflow ratio. Simultaneously, the electrically controlled valves of the main and secondary liquid cooling circuits are opened, controlling the liquid cooling pump to run at high power with a 100% duty cycle. The main liquid cooling circuit cools the computing chip core and IGBT power drive module, while the secondary liquid cooling circuit cools the power management module. The air cooling and the two liquid cooling circuits work together to maximize the heat dissipation capacity of the three core parts, quickly reducing the temperature of each part to within a safe threshold.

[0039] Localized low heat load conditions: When the vehicle exits the intelligent driving mode, the ECU only maintains basic power supply, the power management module provides continuous power supply, and the temperature is 52℃. The temperature of the computing chip core and IGBT power drive module drops to 38℃ and 40℃, respectively.

[0040] The main control chip MCU controls the air-cooled fan to run at 20% duty cycle, controls the electric damper to be slightly biased to the power management module area, and at the same time opens the electronically controlled valve of the liquid cooling sub-circuit, controlling the liquid cooling pump to run at a low speed with a 20% duty cycle. Through small-volume air cooling and liquid cooling sub-circuit, the power management module is locally and precisely cooled to minimize the energy consumption of the cooling system.

[0041] During the switching of air-cooled ducts and the conversion between liquid cooling and air cooling modes, a soft-start and slope limiting mechanism is introduced to smoothly control the changes in the opening of the electric damper, the liquid cooling flow rate of the main / secondary liquid cooling circuit, and the fan speed, so as to avoid thermal shock or electromagnetic interference caused by the switching of cooling modes or sudden power changes.

[0042] During the switching of heat dissipation modes, the heat dissipation control system sets independent rate of change constraints for the opening of the electric damper, the flow rate of the liquid cooling circuit, and the fan speed. Smooth transition adjustment is achieved by limiting the slope of change of each parameter and soft-start logic.

[0043] For the control of electric dampers, the control system gradually adjusts the damper position according to the preset maximum allowable adjustment speed, controls the change range of damper opening per unit time, ensures that the mechanical action of the damper is smooth and without sudden changes, and avoids local thermal shock caused by airflow disturbance and electromagnetic interference caused by instantaneous current fluctuations of the damper motor.

[0044] For the control of the liquid cooling circuit, when the main liquid cooling circuit and the liquid cooling auxiliary circuit are switched on and off, the output power of the liquid cooling pump is controlled to increase slowly according to a fixed gradient. Based on the flow sensor of the liquid cooling circuit, the flow feedback is collected in real time, and the flow rate is dynamically fine-tuned so that the coolant flow gradually stabilizes from the initial state to the target flow. This avoids the pipeline pressure shock and power sudden change caused by the liquid cooling pump starting directly at full load. At the same time, the flow rate increase rhythm is dynamically fine-tuned in combination with the real-time feedback of the flow sensor to ensure that the flow rate change process is continuous and stable.

[0045] The control system achieves soft start by gradually adjusting the output strength of the PWM signal to control the fan speed. The fan speed is gradually increased according to the set speed gradient, so that the fan airflow increases steadily, suppressing electromagnetic interference caused by motor start-up and stop and sudden speed changes. At the same time, it avoids drastic temperature fluctuations in the critical heat-generating areas of the ECU due to sudden changes in airflow.

[0046] The aforementioned soft-start and slope limits for the three types of actuators are independent yet coordinated, each following its own independent rate of change rules, and completing the switching transition within a unified switching cycle. This ensures that the heat dissipation mode switching process is shock-free, disturbance-free, and free of electromagnetic anomalies, thereby improving the operational stability of the heat dissipation system and the service life of the actuators.

[0047] When switching between heat dissipation modes, the control system sets independent parameter change rate constraints for the three types of actuators: electric damper, liquid cooling pump, and fan. The electric damper gradually adjusts its opening according to the limited range to achieve smooth operation. The output power of the liquid cooling pump increases according to a fixed gradient, and the coolant flow rate changes gradually. The fan completes soft-start speed regulation by gradually increasing the PWM duty cycle. The three types of actuators smoothly transition synchronously according to their respective slope rules within the same switching cycle. Smooth control of all components is achieved by relying on slope limits and step-by-step gradual change logic.

[0048] like Figure 4 As shown, after the main control MCU issues the target command, it sets independent change slopes and rising step constraints for the electric damper opening, liquid cooling pump power, and fan speed, and adjusts them synchronously in a time-sharing manner until each control parameter smoothly reaches the target value.

[0049] This invention introduces a soft-start and slope limiting mechanism during the switching of heat dissipation modes and the correction of control parameters. It smoothly regulates the changes in electric damper opening, liquid cooling flow rate in the liquid cooling circuit, and fan speed. From the control logic perspective, it avoids thermal shock and electromagnetic interference caused by structural abrupt changes and power surges, significantly improving the stability of the heat dissipation system. It provides effective protection for the execution components of the heat dissipation system, extends the service life of the heat dissipation system and electronic equipment, and ensures the stable and reliable operation of the vehicle ECU under all operating conditions.

[0050] During this process, the temperature change curves, air duct adjustment status, and operation effects of the liquid cooling main / sub-loop are continuously monitored at each monitoring point. The output duty cycle of PWM1 / PWM2, the electric damper opening adjustment strategy, and the start-up temperature threshold of the liquid cooling loop of the main / sub-loop are dynamically corrected through PID algorithm or adaptive control strategy to optimize the control parameters. At the same time, the optimized control parameters are written into non-volatile memory as the initial heat dissipation strategy for the subsequent operation cycle of the main control chip MCU. Combining the control decisions of the main control chip MCU with the adjustment characteristics of the liquid cooling main / sub-loop, electric valve, electric damper and other structures, the adaptive iteration and long-term performance optimization of the heat dissipation control system are realized.

[0051] The control parameters output by the heat dissipation control system include the weighting of the air-cooled duct, the loop response delay of the liquid-cooled main loop / liquid-cooled secondary loop, and the slope of the temperature control curve.

[0052] Taking the computing chip core, IGBT power drive module, and power management module of the vehicle intelligent driving ECU as the heat dissipation control objects, the heat dissipation control system starts an adaptive iterative optimization process after completing multi-condition heat dissipation operation. It adopts PID algorithm and heat dissipation demand matching degree algorithm and liquid cooling loop switching threshold correction algorithm to realize dynamic correction of control parameters.

[0053] Specifically, the heat dissipation control system continuously collects the temperature data of the computing chip core TEMP1, the IGBT power drive module TEMP2, and the power management module TEMP3 at a sampling frequency of 100ms. Real-time opening of electric damper Liquid cooling main circuit flow rate Liquid cooling secondary loop flow rate PWM1 / PWM2 output duty cycle When switching between heat dissipation demand and operating conditions. Comprehensive operational data, including the timing of changes in heat dissipation demand conditions. It is used to mark the segment boundaries of the heat dissipation demand conditions, so as to calculate the total running time of the current heat dissipation conditions and provide a basis for the segmentation of the conditions for heat dissipation demand matching degree and PID parameter optimization.

[0054] The above data is stored in the operating database according to operating conditions. The heat dissipation control system calls the heat dissipation demand matching algorithm to calculate the heat dissipation demand matching degree, which is expressed as: ; in, M The smaller the value, the higher the degree of matching between the heat dissipation control parameters and the actual heat dissipation requirements. The actual temperature of each hardware module at time t; The safe temperature control threshold for each hardware module is determined by the ECU hardware design standard. The total operating power of the cooling system at time t is obtained by adding the operating power of the fan and the operating power of the liquid cooling pump. T This represents the total operating time under the current heat dissipation conditions.

[0055] Indicates the total operating time for a single operating condition. Calculate the actual temperature of each part to be cooled at each time t within the time frame. With safety temperature control threshold The absolute difference is then summed up at all times to obtain the cumulative temperature deviation. Indicates the total operating time for a single operating condition. At each time t within the time frame, the combined operating power of the cooling system at that time is obtained by superimposing the fan operating power and the liquid cooling pump operating power. Then, the total operating power at all times is summed to obtain the cumulative power consumption of the cooling system.

[0056] M A small value indicates a low cumulative temperature deviation (good temperature control effect, with the actual temperature close to the safe temperature control threshold), or good temperature control achieved with low power input, or both; it indicates that the current control parameters (PWM duty cycle, damper opening, liquid cooling flow rate, etc.) are just right to meet the actual heat dissipation requirements, there is no waste of energy input, the temperature control effect meets the standard, and the matching degree is high.

[0057] M A large value indicates one of two situations, both suggesting a mismatch between the heat dissipation control parameters and actual requirements; namely: Under high power input, the temperature difference control effect is poor. At this time, the cumulative power value is large and the cumulative temperature deviation value is also large. For example, when the ECU is running at low load, opening two liquid cooling circuits will increase energy consumption. At the same time, excessive heat dissipation will cause the component temperature to be too low, far below the safety threshold, resulting in a serious imbalance between power input and effect.

[0058] At low power input, the temperature difference control effect is poor. At this time, the cumulative power value is small, but the cumulative temperature deviation value is large. For example, when the ECU is running at full load, only basic air cooling control is performed. Although the energy consumption is low, the component temperature is far beyond the safety threshold, and the power input cannot meet the actual heat dissipation needs.

[0059] The core purpose of the heat dissipation demand matching degree algorithm is to quantify and determine the matching relationship between the energy input of the heat dissipation system and the temperature control effect under the current control parameters. By calculating the M value under different operating conditions, it can accurately identify the deviation between the current control parameters such as PWM duty cycle, damper opening, and liquid cooling circuit flow rate and the actual heat dissipation demand.

[0060] M The value is a comprehensive quantitative indicator of the matching degree between the combination of control parameters of the heat dissipation control system and the actual heat dissipation requirements. An unreasonable control parameter will affect the performance. M The magnitude of the value, when M The value is less than the optimal matching threshold If the current control parameters match the actual heat dissipation requirements, no optimization or adjustment is needed; if the M value is greater than the optimal matching threshold... If the control parameter deviation warning is triggered, it will be determined that at least one of the control parameters, such as the current PWM duty cycle, damper opening, and liquid cooling circuit flow rate, does not match the actual heat dissipation requirements, and further tracing and positioning are required.

[0061] Specifically, optimization is first triggered based on M > Mopt. After correcting the PWM duty cycle with PID, the deviation ΔM is calculated. Then, the changes in the M value before and after optimization of various parameters such as the electric damper base opening, flow ratio, opening adjustment rate, liquid cooling flow distribution coefficient, and liquid cooling start-up threshold are iteratively verified. Based on the improvement of the optimized M value, the specific control parameters causing the mismatch between heat dissipation supply and demand are identified one by one, achieving source tracing. The liquid cooling pump and fan are driven by the PWM duty cycle, but the electric damper opening is an independent control parameter. The final opening of the electric damper is determined by the two independent parameters of base opening and flow ratio, and is not directly controlled by the PWM duty cycle. The PWM duty cycle only determines the reference output of the liquid cooling pump and fan. The actual liquid cooling flow is also constrained by the pipeline distribution coefficient and the opening of the electronically controlled valve. The liquid cooling flow will still deviate under the same PWM duty cycle. Therefore, when the M value exceeds the standard, it is necessary to trace and investigate the PWM, liquid cooling flow, and damper opening item by item.

[0062] When calculated M The value exceeds the set optimal matching threshold. At that time, the control system immediately starts the PID algorithm to adjust the output duty cycle of PWM1 / PWM2. The correction was made, and the PID algorithm used is expressed as follows: ; in, This is the corrected real-time PWM duty cycle; This is the baseline value for the optimal PWM duty cycle of the previous running cycle; This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients, and all three are calibrated based on the characteristics of the ECU's heat dissipation conditions. After the previous operating cycle completed the heat dissipation requirement matching degree verification and multi-parameter optimization, the matching degree M≤M opt The optimal PWM value is retained during the cycle, and the optimized optimal parameters are stored in non-volatile memory, which is directly retrieved as the reference value in the next cycle. Let t be the temperature deviation value of a certain hardware module at time t, expressed as: .

[0063] The PID algorithm responds quickly to real-time temperature deviations through the proportional element, eliminates accumulated temperature deviations through the integral element, and predicts temperature change trends through the derivative element, thereby achieving continuous and smooth correction of the PWM duty cycle and ensuring precise matching between fan speed, liquid cooling pump operating power, and real-time temperature deviations.

[0064] After correcting the core parameters of the PWM output duty cycle and liquid cooling circuit switching threshold using the aforementioned PID algorithm, the control system synchronously adjusts the basic opening of the electric damper based on the M value and temperature deviation data. Airflow ratio of the air-cooled aisle and opening adjustment rate Simultaneously, the flow distribution coefficient γ of the liquid cooling main circuit / liquid cooling secondary circuit is corrected, where ; This refers to the flow rate of the liquid cooling main circuit. This represents the flow rate of the liquid-cooled secondary loop.

[0065] The PWM duty cycle corrected using the PID algorithm serves as the power benchmark for correcting flow-related parameters of the electric damper and liquid cooling circuit. It provides a power matching basis and operating condition adaptation standard for correcting parameters such as the basic opening degree, guide ratio, opening adjustment rate, and flow distribution coefficient of the electric damper, while also considering the matching deviation of heat dissipation requirements. Temperature deviation percentage of each hardware module The operating condition calibration coefficients are used to optimize the basic opening degree, flow guiding ratio, opening adjustment rate, and liquid cooling flow distribution coefficient of the electric damper through incremental correction logic.

[0066] The basic opening of the electric damper is the initial reference opening ratio of the electric damper, which is the basic airflow of the air-cooling system and determines the overall airflow capacity of the air-cooling system to meet the basic power requirements of the heat dissipation system.

[0067] The airflow distribution ratio is the weighted proportion of air volume allocated by the electric damper to the heat-generating parts of each hardware module of the ECU, used to achieve precise zoning of air volume.

[0068] The opening adjustment rate is the change in the damper's opening from its current opening to its target opening per unit time.

[0069] The above control parameter corrections are all based on the PWM duty cycle. As input, the PWM duty cycle is corrected using a PID algorithm, and then the current duty cycle is recalculated. M Value (denoted as) M 1 ), and compare it with the optimal matching threshold The comparison was performed, and the deviation in heat dissipation requirement matching during the PID algorithm correction process was obtained. , is represented as: ; when If the result is 0, it indicates that there is still a matching deviation and correction is needed; when This indicates that no correction is needed. This means that the corrected heat dissipation matching degree M1 ≤ the optimal threshold M optSince a smaller M value results in a better matching effect, it means that the heat dissipation power consumption and temperature control have already met the standard. Even if there is a numerical difference from the threshold, it is still within the qualified and optimal range, so there is no need to continue to correct it. The optimization range of the electric damper opening is based entirely on the value of ΔM.

[0070] The base opening of the electric damper is the initial opening reference of the electric damper, which is related to the PWM duty cycle. Positive correlation, The larger the opening, the greater the basic opening needs to be to ensure that the total airflow of the air duct matches the heat dissipation power. The optimized basic opening is expressed as: ; in, The basic opening of the damper before PID correction; The calibration coefficient for the basic opening of the damper; This represents the maximum duty cycle of the PWM signal.

[0071] The airflow distribution ratio is the weight of airflow allocation to each part to be cooled. The goal of adjusting the airflow distribution ratio is to make the airflow distribution correspond to the percentage of temperature deviation in each part. It matches the total air volume with the distributed air volume, and uses the PWM duty cycle as the power reference to ensure coordination between the total air volume and the distributed air volume, thus avoiding airflow disturbance.

[0072] First, calculate the reference value for flow guidance at a single location, expressed as: ; in, The percentage of temperature deviation for the nth part to be cooled is expressed as: , Real-time temperature deviation at a certain location; The airflow ratio calibration coefficient is determined based on the physical characteristics of the ECU duct to ensure that the airflow distribution conforms to the duct flow pattern.

[0073] The normalization process yields the final diversion ratio, which, taking three hardware modules as an example, is expressed as follows: ; In the above expression, the numerator is the airflow ratio combination composed of the airflow reference values ​​of the three hardware modules, which represents the original airflow distribution ratio relationship among the computing chip core, IGBT power drive module, and power management module.

[0074] The damper opening adjustment rate is a smoothing coefficient for damper operation. To adapt to soft start and slope limiting requirements, the correction of the opening adjustment rate is correlated with the rate of change of the PWM duty cycle. The faster the PWM duty cycle changes, the more synchronously the damper opening adjustment rate needs to be adjusted to ensure that the damper operation and power change are synchronized and smooth. This is expressed as: ; in, This indicates the damper opening adjustment rate before PID correction; This indicates the calibration coefficient for the opening adjustment rate, which is calibrated based on the mechanical characteristics of the damper motor to avoid mechanical shock caused by excessive speed. This represents the real-time change rate of the PWM duty cycle, reflecting how quickly the heat dissipation power is adjusted. The absolute value is used to avoid positive and negative effects.

[0075] Flow distribution coefficient Its correction uses the PWM duty cycle as the absolute value of the flow rate as the benchmark, so that the liquid cooling flow rate matches the liquid cooling pump power, and at the same time, it allocates the flow rate of the main and auxiliary liquid cooling circuits according to the temperature deviation ratio of each hardware module. The PWM duty cycle D(t) determines the upper limit of the liquid cooling pump output power and serves as a benchmark for the total coolant flow rate. The actual flow rates of the main and auxiliary circuits are based on D(t) and then divided into two flow rates according to the temperature deviation ratio of each hardware component. Finally, the flow distribution coefficient γ is calculated. The power of the liquid cooling pump directly constrains the total coolant supply capacity.

[0076] The real-time flow rates of the new liquid cooling main and auxiliary loops are calculated and expressed as follows: ; ; The corrected flow allocation coefficient is calculated and expressed as follows: ; in, These represent the percentage of temperature deviation for the core of the computing chip and the IGBT module, respectively, corresponding to the hardware modules covered by the liquid cooling main circuit; This indicates the percentage of temperature deviation for the power management module, corresponding to the hardware modules covered by the liquid cooling sub-circuit; The liquid cooling flow rate calibration coefficient is determined by the power characteristics of the liquid cooling loop piping and the liquid cooling pump, converting the PWM duty cycle into the actual flow rate value.

[0077] All the above corrections are based on the corrected PWM duty cycle. Based on this benchmark, the system achieves linkage between "power input" and "energy distribution," preventing parameter adjustments from becoming disconnected from actual heat dissipation power. and operating condition calibration coefficient ( , , , Limit the correction range to avoid system fluctuations caused by sudden parameter changes.

[0078] After completing the PWM duty cycle correction, the control system calls the liquid cooling circuit to start the temperature threshold correction algorithm, which is expressed as: ; in, The corrected start-up temperature threshold for the liquid cooling circuit; The basic temperature threshold for starting the liquid cooling circuit is determined based on the heat resistance characteristics of the ECU hardware. This is a correction factor for the rate of temperature rise. Both are load rate correction coefficients, and are calibrated based on the correlation between historical operating conditions' M values ​​and parameter adjustment amounts. The average temperature rise rate of each hardware module within a single operating condition is expressed as: ; This represents the actual temperature of each part to be cooled at time t. This represents the actual temperature of each part to be cooled at time t-1. This is the average operational load rate of the ECU within a single operating condition, calculated based on the load parameters read from the CAN bus.

[0079] Using ECU average operating load rate As a correction factor, combined with the average temperature rise rate The basic temperature threshold for starting the liquid cooling circuit Dynamic adjustments are made to obtain a liquid cooling circuit start-up temperature threshold that adapts to actual operating conditions. .

[0080] The purpose of adopting the liquid cooling circuit start-up temperature threshold correction algorithm is to dynamically adjust the start-up temperature threshold of the liquid cooling circuit by combining the temperature rise rate and ECU load rate in actual working conditions, so as to avoid energy waste caused by the liquid cooling circuit starting too early due to a fixed threshold, or local high temperature caused by starting too late.

[0081] The liquid cooling circuit start-up temperature threshold correction algorithm incorporates the real-time operating characteristics of temperature rise rate and load rate into the threshold calculation, making the start-up timing of the liquid cooling circuit highly compatible with the actual heat source intensity.

[0082] Based on the calculated start-up temperature threshold of the liquid cooling circuit Based on the differences in the heat resistance and heat generation of the computing chip, IGBT power module, and power management module, the start-up temperature threshold of the partitioned liquid cooling circuit was calibrated for different hardware modules. In actual judgment, TEMP1 and TEMP2 and TEMP3 and A comparison was made to ensure that the threshold determination matched the actual heat dissipation characteristics of each component. The heat dissipation system is configured with main and auxiliary liquid cooling circuits. The main liquid cooling circuit provides heat dissipation for the computing chip and IGBT power modules, while the auxiliary liquid cooling circuit provides heat dissipation for the power management module. Each hardware module is configured with an independent partition threshold. , , When a single hardware module exceeds the threshold, the liquid cooling circuit will not be activated individually. Instead, the corresponding main liquid cooling circuit or auxiliary liquid cooling circuit will be activated uniformly according to the group to which the hardware module that exceeds the threshold belongs.

[0083] After completing the correction of all control parameters, the system will set the corrected PWM duty cycle reference value. Liquid cooling circuit switching temperature threshold Electric damper base opening Flow diversion ratio and opening adjustment rate All optimized parameters, such as the flow distribution coefficient γ, are written into non-volatile memory to ensure that the parameters are not lost after the system is powered off and restarted. When the vehicle intelligent driving ECU starts up and enters the running state again, the main control chip MCU can directly read the above optimized parameters from the non-volatile memory as the initial control strategy for this heat dissipation control.

[0084] In the new operating cycle, the control system collects full-dimensional operating data again at a sampling frequency of 100ms, and repeats the entire process of calculating the heat dissipation matching degree, correcting parameters using the PID algorithm, and correcting the liquid cooling circuit start-up temperature threshold. This optimizes and adjusts the initial control strategy, forming a continuous iterative cycle. This allows the heat dissipation control parameters to be continuously optimized based on the actual conditions such as ECU operating conditions, ambient temperature, and hardware aging, always maintaining a precise match with the heat dissipation requirements.

[0085] On the other hand, the present invention also provides an electronic device, comprising: Processor; and Memory for storing the executable instructions of the processor; The processor is configured to execute the electronic device hardware intelligent heat dissipation dynamic optimization control method by executing the executable instructions.

[0086] On the other hand, the present invention also provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the aforementioned intelligent heat dissipation dynamic optimization control method for electronic device hardware.

[0087] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Any simple modifications or equivalent changes made to the above embodiments based on the technical essence of the present invention shall fall within the protection scope of the present invention.

Claims

1. A method for intelligent heat dissipation dynamic optimization control of electronic device hardware, characterized in that, For controlling the heat dissipation system, the heat dissipation system includes an air cooling system and a liquid cooling system. The air cooling system includes a fan and an electric damper. The liquid cooling system includes a liquid cooling main circuit and a liquid cooling secondary circuit. Both the liquid cooling main circuit and the liquid cooling secondary circuit include a liquid cooling pump and an electrically controlled valve. Both the fan and the liquid cooling pump are controlled by PWM. The intelligent heat dissipation dynamic optimization control method includes the following steps: Acquire temperature data of each hardware module of the electronic device and operating data of the cooling system under the current heat dissipation conditions. The operating data includes the real-time opening of the electric damper, the flow rate of the main liquid cooling circuit, the flow rate of the secondary liquid cooling circuit, the PWM duty cycle, the time of heat dissipation mode switching, and the operating power of the cooling system. The matching degree of heat dissipation demand under the current heat dissipation conditions of electronic equipment hardware is calculated based on the temperature data of each hardware module and the operating power of the heat dissipation system. Based on the matching degree of heat dissipation demand, it is determined whether the control parameters need to be optimized. When it is determined that optimization is needed, the PID algorithm is used to correct the PWM duty cycle of the fan and liquid cooling pump.

2. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 1, characterized in that, The steps to determine whether control parameters need optimization based on the matching degree of heat dissipation requirements include: The heat dissipation requirement matching degree is calculated using a heat dissipation requirement matching degree algorithm, and is expressed as: ； in, M To match the heat dissipation requirements, Let be the actual temperature of the nth hardware module at time t. The safe temperature control threshold for the hardware module. Let t be the total operating power of the cooling system. T This represents the total operating time under the current heat dissipation condition, obtained based on the time of heat dissipation mode switching; when M Value greater than the optimal matching threshold When this happens, it is determined that the current control parameters need to be optimized.

3. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 1 or 2, characterized in that, The PID algorithm used is expressed as follows: ； in, This is the corrected real-time PWM duty cycle; This is the baseline value for the optimal PWM duty cycle of the previous running cycle; This is the proportionality coefficient. The integral coefficient is... These are the differential coefficients; The temperature deviation at time t is expressed as: ; Let be the actual temperature of the nth hardware module at time t. This refers to the safe temperature control threshold for the hardware module.

4. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 2, characterized in that, Based on the corrected PWM duty cycle, the temperature deviation ratio of each hardware module, and the operating condition calibration coefficient, the basic opening degree, flow guiding ratio, opening adjustment rate, and liquid cooling flow distribution coefficient of the electric damper are optimized and used as optimized control parameters to control the heat dissipation system.

5. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 4, characterized in that, Obtain the corrected thermal performance deviation. , is represented as: ;in, M 1 To achieve the corrected heat dissipation requirement matching, The optimal matching threshold; when At the same time, the basic opening degree, flow guiding ratio, opening adjustment rate and liquid cooling flow distribution coefficient of the electric damper are optimized.

6. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 5, characterized in that, The steps for optimizing the basic opening, flow guiding ratio, opening adjustment rate, and liquid cooling flow distribution coefficient of the electric damper include: The basic opening of the electric damper is optimized, as shown below: ； in, The corrected basic opening of the electric damper; The original opening of the electric damper base; This refers to the calibration coefficient for the basic opening of the electric damper. This represents the maximum value of the PWM duty cycle. This is the corrected real-time PWM duty cycle; And / or, the steps for optimizing the flow ratio of the electric damper include: The baseline value for obtaining the current flow of a specific hardware module is represented as follows: ； in, This is the reference value for the current diversion of the nth hardware module. Let the temperature deviation percentage of the nth hardware module be expressed as... , This represents the real-time temperature deviation of the nth hardware module. This is the flow diversion ratio calibration coefficient; The corrected flow ratio is obtained by normalizing the proportion of the flow reference value of each hardware module. And / or, optimize the opening adjustment rate of the electric damper, expressed as: ； in, This indicates the corrected adjustment rate of the electric damper opening. This indicates the original electric damper opening adjustment rate; This represents the calibration coefficient for the opening adjustment rate; This indicates the real-time rate of change of the PWM duty cycle; And / or, the steps for optimizing the liquid cooling flow distribution coefficient include: Based on the corrected real-time PWM duty cycle Temperature deviation percentage of corresponding hardware modules and liquid cooling flow rate calibration coefficient Calculate the real-time flow rates of the current liquid cooling main circuit and liquid cooling secondary circuit, expressed as: ； ； in, This represents the current real-time flow rate of the liquid cooling main circuit. This represents the current real-time flow rate of the liquid-cooled secondary loop. , … These represent the percentage of temperature deviation for each hardware module whose temperature is regulated via the liquid cooling main circuit. , … These represent the percentage of temperature deviation for each hardware module whose temperature is regulated via the liquid cooling sub-loop. The optimized liquid cooling flow distribution coefficient, obtained based on the real-time flow rates of the main and auxiliary liquid cooling circuits, is expressed as follows: ;in This represents the optimized liquid cooling flow distribution coefficient.

7. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 1, characterized in that, After correcting the PWM duty cycle, the start-up temperature threshold of the liquid cooling circuit is corrected, and the start-up temperature threshold of the liquid cooling circuit is dynamically adjusted.

8. The intelligent heat dissipation dynamic optimization control method for electronic device hardware according to claim 7, characterized in that, The corrected liquid cooling loop start-up temperature threshold is obtained using a liquid cooling loop start-up temperature threshold algorithm, and is expressed as follows: ； in, The corrected start-up temperature threshold for the liquid cooling circuit; This serves as the base temperature threshold for starting the liquid cooling circuit; This is a correction factor for the rate of temperature rise. This is the load factor correction factor; The average temperature rise rate of each hardware module under the current heat dissipation conditions is expressed as: ; Let be the actual temperature of the nth hardware module at time t; Let be the actual temperature of the nth hardware module at time t-1; T This represents the total operating time under the current heat dissipation conditions. This represents the average computing load rate of the electronic device under the current heat dissipation conditions.

9. An electronic device, characterized in that, include: processor; as well as Memory for storing the executable instructions of the processor; The processor is configured to execute the electronic device hardware intelligent heat dissipation dynamic optimization control method according to any one of claims 1-8 by executing the executable instructions.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the intelligent heat dissipation dynamic optimization control method for electronic device hardware as described in any one of claims 1-8.

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