Carrier tape, cutting method of carrier tape, and smart card

Abstract

This application discloses a carrier tape, a method for cutting the carrier tape, and a smart card. The carrier tape includes a plurality of first regions spaced apart and a second region surrounding each of the first regions. The carrier tape includes: a base fabric; a plurality of bonding units disposed on one side of the base fabric and correspondingly located in the plurality of first regions, each bonding unit including a plurality of contacts spaced apart; a plurality of anti-corrosion structures disposed on the same side of the base fabric as the bonding units and correspondingly located in the plurality of first regions, and spaced apart from the bonding units; each anti-corrosion structure is annular and surrounds at least a portion of the corresponding bonding unit.

Description

Technical Field

[0001] This application relates to the field of smart card manufacturing technology, specifically to a carrier tape, a method for cutting the carrier tape, and a smart card. Background Technology

[0002] The carrier tape is the core substrate for smart card production, consisting of copper foil and a base fabric. The copper foil is etched to form contacts for information exchange. During production, the roll carrier tape (i.e., roll module) needs to be cut into individual loose modules using a punching process. However, in the actual punching process, factors such as die precision deviations and equipment vibration can easily cause damage to the metal surface of the contacts. Damaged metal contacts will corrode due to moisture, salt, and other substances in the environment during subsequent transportation, storage, and use, leading to poor contact and seriously affecting the product performance and lifespan of the smart card. Summary of the Invention

[0003] The purpose of this application is to provide a carrier tape, a method for cutting the carrier tape, and a smart card.

[0004] This application discloses a carrier tape, comprising a plurality of first regions spaced apart and a second region surrounding each of the first regions. The carrier tape includes a base fabric; a plurality of binding units disposed on one side of the base fabric and corresponding to each of the plurality of first regions, each binding unit including a plurality of contacts spaced apart; a plurality of anti-corrosion structures disposed on the same side of the base fabric as the binding units and corresponding to each of the plurality of first regions, and spaced apart from the binding units; each anti-corrosion structure is annular and surrounds at least a portion of the corresponding binding unit.

[0005] In some alternative embodiments, the anti-corrosion structure has a notch, and the carrier tape further includes a conductive wire. The conductive wire is located on the same side of the base fabric as the anti-corrosion structure and is in direct contact with the anti-corrosion structure. The conductive wire passes through the notch and is in direct contact with the contact point.

[0006] In some optional embodiments, the anti-corrosion structure includes: two first anti-corrosion sections, which are arranged opposite to each other in a first direction and both extend along a second direction, the second direction being perpendicular to the first direction; and two second anti-corrosion sections, which are spaced apart in the second direction and both connected between the two first anti-corrosion sections; wherein the number of notches is two, and they are formed one-to-one in the two second anti-corrosion sections.

[0007] In some optional embodiments, the plurality of first regions are arranged in rows and columns, with the first direction being the column direction and the second direction being the row direction. The conductive wire includes: two first traces, both extending along the first direction and arranged opposite to each other in the second direction, with the plurality of binding units and the plurality of anti-corrosion structures located between the two first traces; a plurality of second traces, spaced apart in the first direction and all connected between the two first traces, with a row of first regions between any two adjacent second traces; and a plurality of third traces passing through the gap, with one end of each third trace connected to a second trace and the other end connected to a contact point.

[0008] In some alternative embodiments, the plurality of contacts of each of the bonding units includes a first contact and a second contact distributed along the second direction, and the straight line connecting the centers of the first contact and the second contact passes through the notch; the first contact and the second contact are located between the two second anti-corrosion sections in the second direction; for two adjacent bonding units in the second direction, the second contact of one bonding unit is connected to one of the two adjacent second lines through the third line, and the first contact of the other bonding unit is connected to the other of the two adjacent second lines through the third line.

[0009] In some alternative embodiments, the conductive line further includes: a fourth trace, one end of which is connected to the end of the second anti-corrosion section away from the first anti-corrosion section, and the other end of which is connected to the portion of the third trace located in the second region.

[0010] In some alternative embodiments, the second anti-corrosion section is smoothly connected to the first anti-corrosion section.

[0011] In some alternative embodiments, along a direction away from the base fabric, both the contact and the anti-corrosion structure include a copper metal layer and a nickel plating layer disposed sequentially, wherein the thickness of the nickel plating layer of the anti-corrosion structure is greater than the thickness of the nickel plating layer of the contact.

[0012] This application discloses a method for cutting a carrier tape, the method being used to cut the carrier tape described in any of the above claims, the method comprising: cutting the carrier tape such that the boundaries of the first region and the second region coincide with the cutting line, or the cutting line is located in the first region and surrounds the inner edge of the anti-corrosion structure.

[0013] This application discloses a smart card, comprising: a base fabric; a binding unit disposed on one side of the base fabric, the binding unit including a plurality of contacts spaced apart; an anti-corrosion structure disposed on the same side of the base fabric as the binding unit, the anti-corrosion structure being annular and surrounding at least a portion of the corresponding binding unit; and an integrated circuit disposed on the side of the base fabric opposite to the binding unit and electrically connected to the contacts.

[0014] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this specification. Attached Figure Description

[0015] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this specification and, together with the description, serve to explain the principles of this specification.

[0016] Figure 1 This is a schematic diagram of the carrier tape in an embodiment of this disclosure.

[0017] Figure 2 This is a schematic diagram of the other direction of the carrier in an embodiment of this disclosure.

[0018] Figure 3 This is a schematic diagram of the anti-corrosion structure of the carrier tape in an embodiment of this disclosure.

[0019] Figure 4 This is a schematic diagram of a single carrier tape in an embodiment of this disclosure.

[0020] Reference numerals: A1, First region; A2, Second region; X, Second direction; Y, First direction; 1, Base fabric; 2, Bonding unit; 20, Contact; 201, First contact; 202, Second contact; 203, Third contact; 204, Fourth contact; 205, Fifth contact; 206, Sixth contact; 3, Corrosion-resistant structure; 301, Notch; 302, First corrosion-resistant section; 303, Second corrosion-resistant section; 4, Conductive wire; 401, First trace; 402, Second trace; 403, Third trace; 404, Fourth trace; 5, Pad hole; 6, Tooth hole. Detailed Implementation

[0021] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0022] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movement of the components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0023] In related technologies, smart card manufacturing mainly includes a module processing stage and a card processing stage. The module processing stage primarily includes surface mount technology (SMT), wire bonding (WB), encapsulation, and final electrical testing (FT). For SMT, adhesive is applied to a pre-defined mounting area (for chip mounting) on ​​a continuous roll carrier tape (also called a roll module) to fix the chip in place. For WB, the chip's pads are connected to the contacts etched from the carrier tape using a gold wire bonding process. For encapsulation, epoxy resin is used to completely encapsulate the chip, forming a protective encapsulation layer. FT testing performs electrical tests on the roll module.

[0024] The card manufacturing process mainly includes adhesive application, card base milling, module punching, hot pressing, and testing. For adhesive application, adhesive is applied to the back of the roll-to-roll module. For card base milling, grooves matching the size of individual modules are created on the card base, which is made of materials such as PVC / PC. For module punching, continuous roll-to-roll modules are punched into individual loose modules using a punching die. For hot pressing, the individual loose modules are inserted into the milled grooves of the card base, allowing the adhesive to bond with the card base. For final testing, the formed cards undergo final testing; those that pass are considered finished smart cards.

[0025] like Figure 1 As shown, this application embodiment provides a carrier tape. The carrier tape includes a plurality of spaced-apart first regions A1 and a second region A2 surrounding each first region A1. The plurality of first regions A1 can be arranged in rows and columns. The column direction can be a first direction Y, and the row direction can be a second direction X. The second direction X is perpendicular or substantially perpendicular to the first direction Y. It should be noted that this carrier tape is a carrier tape before cutting (e.g., gun cutting), and the cutting line is a loop. The boundary between the first region A1 and the second region A2 (i.e., the dividing line between the first region A1 and the second region A2) can coincide with the cutting line, or the cutting line can be located within the first region A1.

[0026] The carrier tape may include: a base fabric 1; a plurality of binding units 2, disposed on one side of the base fabric 1 and located in a plurality of first regions A1, each binding unit 2 including a plurality of contacts 20 spaced apart; a plurality of anti-corrosion structures 3, disposed on the same side of the base fabric 1 as the binding units 2 and located in a plurality of first regions A1, and spaced apart from the binding units 2; each anti-corrosion structure 3 is annular and surrounds at least part of the corresponding binding unit 2.

[0027] The carrier tape of this application embodiment does not require modification of the cutting equipment, nor does it require improving the mold precision or thickening the coating of the contact 20. By setting an annular anti-corrosion structure 3 around the binding unit 2, all mechanical damage during the cutting process can be transferred to the anti-corrosion structure 3. Even if the anti-corrosion structure 3 is damaged, it will not affect the performance of the internal contact 20. At the same time, the anti-corrosion structure 3 can also prevent external corrosive media from penetrating into the contact 20, reducing the risk of contact 20 corrosion. This effectively solves the technical problems of easy damage to the contact 20 during carrier tape cutting and subsequent easy corrosion, thereby improving the product yield and service life of smart cards.

[0028] The embodiments of this application will now be described in detail.

[0029] This application includes a base fabric 1. The base fabric 1 is a supporting carrier for the carrier tape. The base fabric 1 is a flexible material, such as polyethylene terephthalate (PET), polyimide (PI), etc.

[0030] This application includes a bonding unit 2. The bonding unit 2 is disposed on a first side surface of the base fabric 1. Each first region A1 corresponds to one bonding unit 2. The bonding unit 2 is rectangular or approximately rectangular in shape, and its apex corner may be rounded. The bonding unit 2 includes a plurality of contacts 20 spaced apart. The contacts 20 are used to realize information interaction between the smart card and an external reading / writing device. Along the direction away from the base fabric 1, the contacts 20 sequentially include a copper metal layer and a nickel plating layer. The thickness of the nickel plating layer of the contacts 20 is 1.4 μm to 3 μm. Further, a gold plating layer may also be disposed on the side of the nickel plating layer of the contacts 20 away from the base fabric 1.

[0031] Each bonding unit 2 has multiple contacts 20, including a first contact 201 and a second contact 202 distributed along the second direction X. Further, each bonding unit 2's multiple contacts 20 also includes a third contact 203, a fourth contact 204, a fifth contact 205, and a sixth contact 206. The third contact 203 and the fourth contact 204 are distributed along the second direction X. The fifth contact 205 and the sixth contact 206 are distributed along the second direction X. The third contact 203, the first contact 201, and the fifth contact 205 are sequentially distributed along the first direction Y, and the fourth contact 204, the second contact 202, and the sixth contact 206 are sequentially distributed along the first direction Y.

[0032] like Figure 1 and Figure 3 As shown, this application includes an anti-corrosion structure 3. The anti-corrosion structure 3 and the bonding unit 2 are located on the same side of the base fabric 1. Each first region A1 corresponds to one anti-corrosion structure 3. The anti-corrosion structure 3 and the bonding unit 2 are spaced apart, with a spacing of 0.15mm to 0.35mm, for example, 0.2mm. The anti-corrosion structure 3 is annular and surrounds at least part of the corresponding bonding unit 2. The width of the anti-corrosion structure 3 is 0.15mm to 0.35mm, for example, 0.2mm. The spacing between the anti-corrosion structure 3 and the bonding unit 2 (i.e., the width of the etching line) is the same as or approximately the same as the width of the anti-corrosion structure 3, for example, both being 0.2mm. This design allows for rapid visual identification of cutting abnormalities, timely adjustment of process parameters, and reduction of product defect rate. Simultaneously, the etching line reduces the use of copper, nickel, gold, and other materials by one ring (0.2mm wide) of carrier tape. The reduction in nickel material usage is essentially equal to the increase in nickel material usage by the anti-corrosion structure 3. This design reduces the use of raw materials.

[0033] For example, the anti-corrosion structure 3 surrounds the binding unit 2, i.e., the anti-corrosion structure 3 has a notch 301. There can be multiple notches 301, for example, two. Taking two notches 301 as an example, the two notches 301 are located on both sides of the anti-corrosion structure 3 in the second direction X. One of the notches 301 faces the first contact 201, and the other notch 301 faces the second contact 202. The straight line connecting the centers of the first contact 201 and the second contact 202 passes through the notch 301. The dimension of the notch 301 in the first direction Y is larger than the dimensions of the first contact 201 and the second contact 202 in the first direction Y. Parts of the third contact 203 and the fifth contact 205 are exposed through one notch 301, and parts of the second contact 202 and the sixth contact 206 are exposed through the other notch 301. Furthermore, the boundaries of the first region A1 and the second region A2 can coincide with the outer edge of the anti-corrosion structure 3. Taking the boundary of the first region A1 and the second region A2 coinciding with the cutting line as an example, the outer edge of the anti-corrosion structure 3 coincides with the cutting line. Taking the cutting line located within the first region A1 as an example, this cutting line can surround the inner edge of the anti-corrosion structure 3 and be spaced apart from the inner edge of the anti-corrosion structure 3. In addition, the outer edge dimension of the anti-corrosion structure 3 is consistent with the existing single-piece carrier tape, eliminating the need to change the punching die and allowing it to be directly integrated into the existing production line, reducing technical upgrade investment.

[0034] The anti-corrosion structure 3 includes a first anti-corrosion section 302 and a second anti-corrosion section 303. There are two first anti-corrosion sections 302, arranged opposite each other in the first direction Y. The first anti-corrosion sections 302 extend along the second direction X. The sides of the first anti-corrosion sections 302 are parallel or approximately parallel to the edge of the binding unit 2 in the first direction Y. There are also two second anti-corrosion sections 303, spaced apart in the second direction X. The second anti-corrosion sections 303 connect the two first anti-corrosion sections 302. The second anti-corrosion sections 303 and the first anti-corrosion sections 302 are smoothly connected; that is, the connection area between the first and second anti-corrosion sections 302 can be arc-shaped. This design facilitates damage identification and timely troubleshooting of abnormal damage, ensuring product quality. The second anti-corrosion sections 303 are provided with notches 301, meaning the second anti-corrosion sections 303 are not continuous and include two spaced sub-segments, with the notch 301 formed between the two sub-segments. There are two notches 301, one-to-one corresponding to each of the two second anti-corrosion sections 303. The first contact 201 and the second contact 202 are located between two second anti-corrosion sections 303 in the second direction X. Specifically, the edge of the first contact 201 away from the second contact 202 is flush with the inner edge of one second anti-corrosion section 303, and the edge of the second contact 202 away from the first contact 201 is flush with the inner edge of the other second anti-corrosion section 303. Furthermore, the widths of the first and second anti-corrosion sections 302 and 303 can be the same, both equal to the width of the aforementioned anti-corrosion structure 3.

[0035] Along the direction away from the base fabric 1, the anti-corrosion structure 3 sequentially includes a copper metal layer and a nickel plating layer. The thickness of the copper metal layer of the anti-corrosion structure 3 is the same as the thickness of the copper metal layer of the contact 20, and the copper metal layer of the anti-corrosion structure 3 can be formed with the copper metal layer of the contact 20 in a single etching process. The thickness of the nickel plating layer of the anti-corrosion structure 3 is greater than that of the nickel plating layer of the contact 20. The thickness of the nickel plating layer of the anti-corrosion structure 3 can be greater than or equal to 5μm, and its anti-corrosion performance is better than that of the contact 20, especially improving the salt spray resistance time. At the same time, it can avoid setting more nickel metal material on the contact 20, reducing the amount of material used while ensuring anti-corrosion performance. The anti-corrosion structure 3 is used to withstand cutting stress and mechanical damage during the punching process, prevent the contact 20 from being damaged by the punching die, and block the penetration of external corrosive media into the contact 20 area. The anti-corrosion structure 3 is symmetrically distributed with the line connecting the centers of the first contact 201 and the second contact 202 as the axis of symmetry.

[0036] This application includes a conductive wire 4. The conductive wire 4 and the anti-corrosion structure 3 are located on the same side of the base fabric 1. The material of the conductive wire 4 is the same as the copper metal layer material of the contact 20, and the same thickness. The conductive wire 4 is in direct contact with the anti-corrosion structure 3, and the conductive wire 4 passes through the notch 301 to directly contact the contact 20. The conductive wire 4 is used to provide a current path for the contact 20 in the electroplating process, ensuring the uniformity of the plating layer on the contact 20. The direct contact between the conductive wire 4 and the anti-corrosion structure 3 enables simultaneous electroplating of the anti-corrosion structure 3.

[0037] The conductive line 4 includes a first trace 401, a second trace 402, a third trace 403, and a fourth trace 404. There are two first traces 401, both extending along a first direction Y and positioned opposite each other in a second direction X. Multiple bonding units 2 and multiple anti-corrosion structures 3 are located between the two first traces 401. The first traces 401 have a relatively large width to meet the conductivity requirements of high-current electroplating.

[0038] There are multiple second traces 402, spaced apart along the first direction Y. The number of second traces 402 can be one more than the number of rows in the first region A1, which is distributed in rows and columns. A row of the first region A1 is provided between any two adjacent second traces 402, meaning a row of binding units 2 is provided between any two adjacent second traces 402. The width of each second trace 402 is less than the width of the first trace 401.

[0039] There are multiple third traces 403, all passing through the notch 301 of the anti-corrosion structure 3. One end of each third trace 403 is connected to a second trace 402, and the other end is connected to a contact 20. The width of the third trace 403 is smaller than the width of the first trace 401. For each binding unit with multiple contacts 20, each contact 20 is connected to one third trace 403. In two adjacent binding units 2 in the second direction X, the second contact 202 of one binding unit 2 is connected to one of the two adjacent second traces 402 through the third trace 403, and the first contact 201 of the other binding unit 2 is connected to the other of the two adjacent second traces 402 through the third trace 403. This arrangement can avoid wiring interference of the third traces 403, increase the spacing between the third traces 403, and simplify the process.

[0040] There are also multiple fourth traces 404. Each anti-corrosion structure 3 can be provided with two fourth traces 404. One end of the fourth trace 404 is connected to the end of the second anti-corrosion section 303 away from the first anti-corrosion section 302, and the other end is connected to the part of the third trace 403 located in the second region A2. Since the boundary between the first region A1 and the second region A2 is a cutting line, this arrangement allows the anti-corrosion structure 3 and the bonding unit 2 to avoid being connected through the conductive line 4 after the carrier tape is cut. In addition, the fourth trace 404 is used to provide an electroplating current path for the anti-corrosion structure 3, ensuring the uniformity of the coating on the anti-corrosion structure 3.

[0041] This application also provides a method for cutting a carrier tape, used to cut the carrier tape of any of the above embodiments. Figure 4 To Figure 1 A schematic diagram of the structure after it has been cut. (See diagram below.) Figure 1 and Figure 4 As shown, the cutting method includes: cutting the carrier tape, with the boundary of the first region A1 and the second region A2 coinciding with the cutting line, or the cutting line being located in the first region A1 and surrounding the inner edge of the anti-corrosion structure 3. This cutting can be done using a punch cut. The periphery of the single carrier tape obtained after cutting retains the complete anti-corrosion structure 3 or a partially damaged anti-corrosion structure 3. The damaged anti-corrosion structure 3 does not affect the normal use of the contact 20 and can also prevent corrosive media from intruding into the contact 20 area.

[0042] This application also provides a smart card, comprising: a base fabric 1; a binding unit 2 disposed on one side of the base fabric 1, the binding unit 2 including a plurality of contacts 20 spaced apart; an anti-corrosion structure 3 disposed on the same side of the base fabric 1 as the binding unit 2, the anti-corrosion structure 3 being annular and surrounding at least a portion of the corresponding binding unit 2; and an integrated circuit disposed on the side of the base fabric 1 opposite to the binding unit 2 and electrically connected to the contacts 20. The smart card can be applied to various smart card products such as bank cards, transportation cards, and access control cards.

[0043] The integrated circuit (i.e., the chip) is the core control component of the smart card. The integrated circuit is bonded to the side of the base fabric 1 facing away from the bonding unit 2 using conductive adhesive or solder. The base fabric 1 has pad holes 5 and toothed holes 6 (see...). Figure 2 , Figure 2 and Figure 1 One of the diagrams shows the front view of the carrier tape, and the other shows the back view. Contact 20 is electrically connected to the integrated circuit via a wire passing through the pad hole 5. The toothed hole 6 is used for carrier tape drive stepping.

[0044] This application also includes a packaging layer. The packaging layer encapsulates the integrated circuit and the back side of the substrate 1. The material of the packaging layer is epoxy resin, etc. The packaging layer is used to provide mechanical protection and insulation protection for the integrated circuit, preventing the integrated circuit from being damaged by external forces or corroded by moisture.

[0045] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A carrier tape comprising a plurality of first regions (A1) spaced apart and a second region (A2) surrounding each of the first regions (A1), characterized in that, The carrier tape includes: Base fabric (1); Multiple binding units (2) are disposed on one side of the base fabric (1) and are located in the multiple first regions (A1) in a corresponding manner. Each binding unit (2) includes multiple contacts (20) spaced apart. Multiple anti-corrosion structures (3) are located on the same side of the base fabric (1) as the binding unit (2), and are located in the multiple first regions (A1) in a one-to-one correspondence, and are spaced apart from the binding unit (2); each of the anti-corrosion structures (3) is annular and surrounds at least part of the corresponding binding unit (2).

2. The carrier tape according to claim 1, characterized in that, The anti-corrosion structure (3) has a notch (301), and the carrier tape also includes a conductive wire (4). The conductive wire (4) and the anti-corrosion structure (3) are located on the same side of the base fabric (1) and are in direct contact with the anti-corrosion structure (3). The conductive wire (4) passes through the notch (301) and is in direct contact with the contact point (20).

3. The carrier tape according to claim 2, characterized in that, The corrosion-resistant structure (3) includes: Two first anti-corrosion sections (302) are arranged opposite each other in a first direction (Y) and both extend along a second direction (X), which is perpendicular to the first direction (Y); Two second anti-corrosion sections (303) are spaced apart in the second direction (X) and are both connected between the two first anti-corrosion sections (302); There are two notches (301), and they are formed one-to-one in the two second anti-corrosion sections (303).

4. The carrier tape according to claim 3, characterized in that, The plurality of first regions (A1) are arranged in rows and columns, the first direction (Y) is the column direction, the second direction (X) is the row direction, and the conductive line (4) includes: Two first traces (401) extend along the first direction (Y) and are arranged opposite each other in the second direction (X). The plurality of binding units (2) and the plurality of anti-corrosion structures (3) are located between the two first traces (401). Multiple second traces (402) are spaced apart in the first direction (Y) and are all connected between the two first traces (401). A row of the first region (A1) is provided between any two adjacent second traces (402). Multiple third traces (403) pass through the notch (301), one end of each third trace (403) is connected to the second trace (402), and the other end is connected to a contact (20).

5. The carrier tape according to claim 4, characterized in that, Each of the binding units (2) comprises a plurality of contacts (20) including a first contact (201) and a second contact (202) distributed along the second direction (X), wherein the straight line connecting the centers of the first contact (201) and the second contact (202) passes through the notch (301); the first contact (201) and the second contact (202) are located between the two second anti-corrosion sections (303) in the second direction (X); In the second direction (X), the second contact (202) of one of the two adjacent binding units (2) is connected to one of the two adjacent second lines (402) via the third line (403), and the first contact (201) of the other binding unit (2) is connected to the other of the two adjacent second lines (402) via the third line (403).

6. The carrier tape according to claim 4, characterized in that, The conductive wire (4) also includes: The fourth wiring (404) is connected at one end to the end of the second anti-corrosion section (303) away from the first anti-corrosion section (302), and at the other end to the portion of the third wiring (403) located in the second region (A2).

7. The carrier tape according to claim 3, characterized in that, The second anti-corrosion section (303) is smoothly connected to the first anti-corrosion section (302).

8. The carrier tape according to claim 1, characterized in that, Along the direction away from the base fabric (1), both the contact (20) and the anti-corrosion structure (3) include a copper metal layer and a nickel plating layer arranged sequentially, and the thickness of the nickel plating layer of the anti-corrosion structure (3) is greater than the thickness of the nickel plating layer of the contact (20).

9. A method for cutting carrier tape, characterized in that, The cutting method is used to cut the carrier tape according to any one of claims 1-8, and the cutting method includes: The carrier tape is cut such that the boundaries of the first region (A1) and the second region (A2) coincide with the cutting line, or the cutting line is located in the first region (A1) and surrounds the inner edge of the anti-corrosion structure (3).

10. A smart card, characterized in that, include: Base fabric (1); A binding unit (2) is disposed on one side of the base fabric (1), and the binding unit (2) includes a plurality of contacts (20) spaced apart; The anti-corrosion structure (3) is located on the same side of the base fabric (1) as the binding unit (2), and the anti-corrosion structure (3) is annular and surrounds at least part of the corresponding binding unit (2); An integrated circuit is disposed on the side of the base fabric opposite to the bonding unit and is electrically connected to the contact.

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