Conformal methods, systems, computer devices, and media

Abstract

The application discloses a bonding method, a bonding system, a computer device and a medium, and relates to the technical field of semiconductor packaging. The bonding method comprises the following steps: acquiring first image data of a substrate, wherein the first image data comprises image data of a window and a mark feature; determining a relative position relationship between the mark feature and the window according to the first image data; acquiring second image data of the substrate, wherein the second image data is image data comprising the window; determining a relative position relationship between a collection reference point of the second image data and the window according to the second image data, and pre-calibrating a relative position relationship between the collection reference point of the second image data and a bonding head; and determining a target bonding position according to the relative position relationships, wherein the target bonding position corresponds to the mark feature. According to the scheme, the window is used as a reference, and the problem that a bonding station cannot be provided with a visual device for positioning in the related art can be solved in the case that the mark feature is arranged on one side of the substrate.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging technology, and more specifically, to a bonding method, system, computer device, and medium. Background Technology

[0002] Window BGA (Window Ball Grid Array) is a special form of BGA (Ball Grid Array) encapsulation. Its encapsulation structure contains a specific window area, which requires higher encapsulation precision.

[0003] In the window BGA process, the chip needs to be bonded to a substrate and connected to the chip via window leads on the substrate. The substrate used for the window BGA process has a first side and a second side. The first side has lead pads for the leads, and the second side is used for bonding the chip. During chip bonding, the support platform of the bonding station is supported on the first side of the substrate, making it impossible to install positioning devices below the substrate at the bonding station.

[0004] In related technologies, to address the technical problem of installing a positioning device beneath the substrate at the bonding station, positioning marks are provided on both the first and second surfaces of the substrate. The positional relationship between the marks on the first and second surfaces is pre-defined, allowing the chip to be positioned relative to the substrate during chip bonding by monitoring the marks on the second surface. However, this solution is only applicable to substrates with positioning marks on both the first and second surfaces; it is not suitable for substrates with positioning marks only on the first surface. Summary of the Invention

[0005] This invention discloses a bonding method, system, computer equipment, and medium to solve the technical problem in the related art that a positioning camera cannot be installed under the substrate of the bonding station during the chip bonding process.

[0006] To solve the above problems, the present invention adopts the following technical solution: Some embodiments of this application provide bonding methods. These bonding methods include: First image data of a substrate is acquired at a pre-calibrated first position. The substrate includes a window, a first surface and a second surface facing away from each other. The first surface is the surface on which the chip is attached to the substrate. The window extends from the first surface to the second surface. The second surface is provided with a marking feature for positioning. The first image data is the image data of the second surface including the window and the marking feature. A first relative positional relationship is determined based on the first image data. The first relative positional relationship is the relative positional relationship between the marker feature and the window. Second image data of the substrate is acquired at a pre-calibrated second position. The second image data is image data of the first surface including the window. The second position and the first position are distributed at intervals on the transport path of the substrate. The second relative positional relationship is determined based on the second image data. The second relative positional relationship is the relative positional relationship between the acquisition reference point of the second image data and the window. The acquisition reference point of the second image data and the bonding head have a pre-calibrated third relative positional relationship. The target fitting position on the first surface is determined based on the first relative position relationship, the second relative position relationship, and the third relative position relationship. The target fitting position corresponds to the marking feature.

[0007] In some embodiments, before acquiring the first image data of the substrate at a pre-calibrated first position, the bonding method further includes: The control board moves to the first position.

[0008] In some embodiments, the bonding method further includes, before acquiring the second image data of the substrate: The control board moves to the second position.

[0009] This application also provides a bonding system. This bonding system can be applied to the bonding method provided in this application.

[0010] This application also provides a computer device. Exemplarily, the computer device includes at least one computer storage medium and at least one processor, wherein the at least one computer storage medium stores a control program for the bonding method provided in any embodiment of this application. The at least one processor is used to execute the control program stored on the at least one computer storage medium.

[0011] This application also provides a computer-readable storage medium. Exemplarily, the computer-readable storage medium stores a program that can be loaded by a processor and execute the bonding method provided in any embodiment of this application.

[0012] The technical solution adopted in this invention can achieve the following beneficial effects: The bonding method provided in this application can be applied to window BGA processes. When applied to window BGA processes, this bonding method utilizes the window features on the substrate as a reference, enabling chip alignment with the substrate during the bonding process. During chip bonding, there is no need to place a vision device below the bonding station, nor is it necessary to place positioning marking features on the top surface of the substrate. Therefore, this bonding method solves the problem in related technologies where the bonding station cannot be equipped with a vision device for positioning, even when marking features are only placed on one side of the substrate. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram from a first-view perspective of the bonding system provided in some embodiments of this application; Figure 2 This is a schematic diagram of the bonding system provided in some embodiments of this application from a second perspective; Figure 3 This is a schematic diagram of the second surface of the substrate provided in some embodiments of this application. Figure 1 ; Figure 4 This is a schematic diagram of the second surface of the substrate provided in some embodiments of this application. Figure 2 ; Figure 5 This is a schematic diagram of the first surface of the substrate provided in some embodiments of this application. Figure 1 ; Figure 6 This is a schematic diagram of the first surface of the substrate provided in some embodiments of this application. Figure 2 ; Figure 7 This is a flowchart of a bonding method provided in some embodiments of this application; Figure 8 This is a schematic diagram of the bonding station disclosed in some embodiments of this application.

[0015] Explanation of reference numerals in the attached figures: 10-Substrate; 11-First surface; 12-Second surface; 13-Window; 14-Marking feature; 15-Target bonding area; 16-Adhesive; 20-chip; 100 - Transmission mechanism; 200 - First vision device; 300 - Second vision device; 400 - Third vision device; 500 - Flip head; 600 - Bonding head; 700 - Bonding table. Detailed Implementation

[0016] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0017] In the following embodiments, many details are described to facilitate a better understanding of this application. However, those skilled in the art will recognize without inventive effort that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to this application are not shown or described in the specification. This is to avoid obscuring the core parts of this application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0018] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0019] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0020] To facilitate the explanation of the inventive concept of this application, the chip bonding technology will be briefly described below.

[0021] In related technologies, during the window BGA process, in order to achieve precise positioning, positioning marking features are provided on both the first and second surfaces of the substrate to solve the problem that a positioning device cannot be installed below the substrate at the bonding position. However, this method is not applicable to substrates where only the first surface has positioning marking features.

[0022] This application provides a bonding method, system, computer equipment, and medium. Specifically, the bonding method utilizes the feature of a window penetrating the substrate in a window BGA process as a reference. Before the substrate reaches the bonding station, the position of the positioning markings on the bottom surface of the substrate is calibrated relative to the window, obtaining the relative positional relationship between the markings and the window. When the substrate moves to the bonding station, the relative positional relationship between the bonding head used for chip bonding and the window is calibrated to achieve chip bonding positioning. This bonding method can be applied to bonding systems where the positioning vision device cannot be installed at the bonding station, and it eliminates the need to pre-mark the positioning markings on the top surface of the substrate. Therefore, this bonding method is applicable to more types of substrates.

[0023] For ease of understanding, the following is in conjunction with the appendix. Figure 1 and Figure 2 First, the bonding system provided in this application will be described in detail through specific embodiments and application scenarios.

[0024] Reference Figure 1 and Figure 2 This application provides a bonding system. This bonding system can be applied to the bonding method provided herein. Specifically, this bonding system can be used for chip bonding, especially for Window BGA processes.

[0025] For example, such as Figure 1 As shown, the bonding system includes a transfer mechanism 100, a first vision device 200, a second vision device 300, and a bonding head, wherein the transfer mechanism 100 is used to transfer the substrate 10.

[0026] Reference Figure 1 The first vision device 200 can be used to acquire image data of the second surface 12 of the substrate 10. Specifically, the first vision device 200 can be used to acquire first image data of the substrate 10. The second vision device 300 can be used to acquire image data of the first surface 11 of the substrate 10. Figure 1 Image data (not shown in the image). Specifically, the second vision device 300 can be used to acquire second image data of the substrate 10.

[0027] Reference Figure 5 and Figure 6 The first surface 11 of the substrate 10 is provided with adhesive 16 for bonding the chip. Specifically, the first surface 11 is the top surface of the substrate 10 for chip bonding. (See reference...) Figure 3 and Figure 4 In some embodiments, the second surface 12 of the substrate 10 is provided with a marking feature 14 for positioning. Exemplarily, the first surface 11 and the second surface 12 are two opposing surfaces in the thickness direction of the substrate 10. Exemplarily, the second surface 11 is the bottom surface of the substrate 10.

[0028] In some embodiments, the bottom surface of the substrate has lead pads for wire bonding, and the top surface is for bonding with a chip. Marking feature 14 can be, but is not limited to, lead pads for wire bonding in the substrate 10.

[0029] Reference Figures 3 to 6 In some embodiments, the substrate 10 has a window 13, and the window 13 penetrates the first surface 11 and the second surface 12 of the substrate 10 along the thickness direction of the substrate 10. The thickness direction of the substrate 10 can be... Figure 1 The direction indicated by the z-axis.

[0030] For example, such as Figure 1 As shown, the conveying mechanism 100 is provided with a window opposite to the first vision device 200 so that the first vision device 200 can take pictures of the substrate 10 located on the bearing surface.

[0031] Reference Figure 1 and Figure 2 In some embodiments, the first vision device 200 and the second vision device 300 are spaced apart along the transmission direction of the transmission mechanism 100. For example, the transmission direction of the transmission mechanism 100 can be... Figure 1 The direction indicated by the x-axis.

[0032] In some embodiments, the transmission mechanism 100 has a bearing surface for supporting the substrate 10. Specifically, the second surface 12 of the substrate 10 ( Figure 1 (Not shown) A bearing surface supported by the transmission mechanism 100. The transmission mechanism 100 has multiple bearing surfaces supporting the substrate 10. Specifically, the multiple bearing surfaces supporting the substrate 10 include a first bearing surface and a second bearing surface. When the substrate 10 moves relative to the transmission mechanism 100 to a first position, the substrate 10 is supported on the first bearing surface, and the first vision device 200 is located on the side of the first bearing surface opposite to the substrate 10. For example, the first bearing surface faces upward, and the first vision device 200 is located below the first bearing surface. When the substrate 10 moves relative to the transmission mechanism 100 to a second position, the substrate 10 is supported on the second bearing surface, and the second vision device 300 is located on the side of the second bearing surface close to the substrate 10. For example, the second bearing surface faces upward, and the second vision device 300 is located above the second bearing surface.

[0033] In some embodiments, the bonding head and the second vision device 300 have a pre-defined third relative positional relationship, and the bonding head bonds the chip to be bonded to the target bonding position on the substrate 10.

[0034] There are many methods for calibrating the positional relationship between two components. This embodiment will not elaborate on the calibration method for the relative position between the bonding head and the second vision device 300.

[0035] In some embodiments, the bonding head and the second vision device 300 are movable relative to each other, and the relative positional relationship between the bonding head and the second vision device 300 can be calibrated using calibration methods in the prior art. Exemplarily, the bonding head and the second vision device 300 can be calibrated using, but not limited to, teaching calibration, optical calibration plate method, N-point calibration method, indirect physical calibration method, and coordinate mapping method.

[0036] In some embodiments, the bonding head is configured to be fixed relative to the second vision device 300.

[0037] Reference Figure 1In some embodiments, the framing direction of the first visual device 200 and / or the second visual device 300 is perpendicular to the bearing surface of the transmission mechanism 10. For example, the framing direction of the first visual device 200 and the second visual device 300 is their respective optical axis direction.

[0038] Reference Figure 2 The substrate 10 includes a plurality of target bonding regions 15, which are arranged in a rectangular array. Exemplarily, each target bonding region 15 includes a window 13 and a marking feature 14. Specifically, by moving relative to the substrate 10, the first vision device 200 can sequentially acquire first image data for each target bonding region 15.

[0039] In some embodiments, the first vision device 200 may be movable relative to the transmission mechanism 100. For example, as... Figure 2 As shown, the first vision device 200 can move relative to the transmission mechanism 100 in a direction perpendicular to the transmission direction. Specifically, the first vision device 200 can move relative to the transmission mechanism 100 in a direction perpendicular to the transmission direction. Figure 2 The y-axis movement is shown in the diagram.

[0040] Specifically, a row of target bonding areas 15 arranged along the y-axis in the substrate 10 constitutes a column. During the acquisition of the first image data, the substrate 10 is moved by the conveying mechanism 100 so that the first vision device 200 can be aligned with the first column of target bonding areas 15 on the substrate 10. Then, the first vision device 200 moves along... Figure 2 The device moves along the y-axis and takes pictures of each target bonding area 15 in the column in turn. After the first image data corresponding to the column of target bonding areas 15 is acquired, the conveying mechanism 100 moves the substrate 10 so that the first vision device 200 can be aligned with the next column of target bonding areas 15 on the substrate 10.

[0041] In some embodiments, the second vision device 300 may be movable relative to the transmission mechanism 100. For example, as... Figure 2 As shown, the second vision device 300 can move relative to the transmission mechanism 100 in a direction perpendicular to the transmission direction. Specifically, the second vision device 300 can move relative to the transmission mechanism 100 in a direction perpendicular to the transmission direction. Figure 2 The y-axis movement is shown in the diagram.

[0042] Reference Figure 2 In some embodiments, the bonding system further includes a third vision device 400. Exemplarily, the third vision device 400 is fixedly disposed. Specifically, the third vision device 400 is configured to be fixed relative to the bonding station. Exemplarily, the third vision device 400 is disposed on one side of the transmission mechanism 100, and the third vision device 400 can be used to acquire image data of the chip to be bonded located on the bonding head.

[0043] In some embodiments, after picking up the chip, the bonding head moves to a first calibration position. Specifically, when the bonding head moves to the first calibration position, the third vision device 400 is opposite to the bonding head. The first calibration position can be preset as needed; therefore, this embodiment does not limit the relative positional relationship between the first calibration position and other components.

[0044] During the bonding process, the bonding head first moves to the first calibration position, which can realize the initial position calibration of the bonding head, so as to accurately control the movement of the bonding head. For example, the third vision device 400 is used to acquire image information of the chip on the bonding head, so as to calibrate the relative position between the bonding head and the chip through the image information, in order to compensate for the alignment error between the chip and the bonding head and improve the bonding accuracy.

[0045] Reference Figure 8 In some embodiments, the bonding system further includes a flipping head 500 and a bonding table 700. The bonding head 600 and bonding table 700 are located at the bonding station, and the bonding head 600 is used to provide support for the substrate 10 during the bonding process between the chip 20 and the substrate 10. At least a portion of the flipping head 500 and / or the third vision device 400 is located below and / or to one side of the bonding table 700. The flipping head 500 is used to flip the chip 20 to be bonded before bonding it to the substrate 10, so that the bumped side of the chip 20 can be adapted to the substrate 10 located at the bonding station. Specifically, when the substrate 10 is moved to the second position, at least a portion of the substrate 10 is supported by the bonding table 700.

[0046] In some embodiments, the first vision device 200 is disposed on a linear module so that the first vision device 200 can move along a direction perpendicular to the conveying direction of the substrate 10 under the drive of the linear module. During the Window BGA process, the flipping head 500 flips the chip 20 so that the bonding surface of the chip 20 faces the bonding surface of the substrate 10 adapted to the Window BGA process, so that the bonding head 600 can bond the chip 20 onto the substrate 10. In the embodiments of this application, the first vision device 200 and the second vision device 300 are spaced apart along the conveying direction of the conveying mechanism 100. That is, the first vision device 200 for acquiring image data of the second surface 12 of the substrate 10 is spaced apart from the bonding station, so that the first vision device 200 for bonding positioning can avoid the flipping head 500 and / or the third vision device 400, solving the problem in related technologies where the bonding station space is too cramped to allow the positioning device to be placed below the surface of the substrate 10 supported by the bonding table 700.

[0047] The inventive concept of this application will be further explained below in conjunction with the chip bonding method.

[0048] This application provides a bonding method that can be implemented based on the bonding system of any of the above embodiments.

[0049] For example, this bonding method can be used for chip bonding, especially for Window BGA processes.

[0050] Please refer to Figure 7 In some embodiments, the method provided in this application includes: Step S100: Obtain first image data of the substrate at a pre-calibrated first position. The substrate includes a window, a first surface and a second surface facing away from each other. The first surface is the surface on which the chip is attached to the substrate. The window extends from the first surface to the second surface. The second surface is provided with a marking feature for positioning. The first image data is the image data of the second surface including the window and the marking feature.

[0051] Reference Figure 1 The substrate 10 moves to a first position under the transmission of the conveying mechanism 100. Specifically, when the substrate 10 is in the first position, at least a portion of the target bonding area 15 on the substrate 10 is within the visual range of the first vision device 200, so that the first vision device 200 can acquire first image data of the target bonding area 15 corresponding to it.

[0052] In some embodiments, before acquiring the first image data of the substrate at the pre-calibrated first position in step S100, the bonding method further includes: step S600, controlling the substrate to move to the first position for calibration, so that the substrate 10 can be moved into the visual range of the first vision device 200.

[0053] Step S200: Determine the first relative positional relationship based on the first image data. The first relative positional relationship is the relative positional relationship between the marker feature and the window.

[0054] Specifically, the first image data can be processed using one or more image processing techniques in the prior art, and the relative positional relationship between the marker features in the first image data and the window can be obtained. Therefore, this embodiment does not limit the specific method and steps for determining the first relative positional relationship based on the first image data.

[0055] Reference Figure 4 In some embodiments, step S200, determining a first relative positional relationship based on the first image data, wherein the first relative positional relationship is the relative positional relationship between the marker feature and the window, includes: Step S210: Determine the center and marker features of the window based on the first image data; Step S220: Determine the first relative positional relationship based on the center of the window and the marker features.

[0056] In some embodiments, such as Figure 4 As shown, the first image data includes image data of window 13 and labeled features 14. The image processing unit first extracts the edge contour of the window and obtains the pixel coordinates of the window center by least-squares circle fitting. For example, Figure 4 The intersection of the cross-shaped markers within window 13 indicates the center of window 13 within the target fitting area 15. Then, the center coordinates of the marker features are identified through template matching or corner detection. Finally, the pixel offset between the pixel coordinates of the window center and the center coordinates of the marker features is calculated, and this offset is converted into actual physical distance using a pre-calibrated pixel equivalent, serving as the first relative positional relationship.

[0057] Step S300: Acquire second image data of the substrate at a pre-calibrated second position. The second image data is image data of the first surface including the window. The second position and the first position are distributed at intervals on the transport path of the substrate.

[0058] Reference Figure 1 and Figure 2 After the first image data corresponding to each target bonding area 15 on the substrate 10 is acquired, the control transmission mechanism 100 moves the substrate 10 to a second position, so that at least a portion of the substrate 10 is within the visual range of the second vision device 300. Exemplarily, the second position is the bonding station where the bonding head bonds the chip to the substrate 10. Specifically, refer to... Figure 1 The substrate 10 is moved to the second position by the transport mechanism 100. When the substrate 10 is in the second position, at least a portion of the target bonding area 15 on the substrate 10 is within the visual range of the second vision device 300, so that the second vision device 300 can acquire the second image data of the target bonding area 15 corresponding to it.

[0059] In some embodiments, before acquiring the second image data of the substrate in step S300, the bonding method further includes step S1200, controlling the substrate to move to a second position for bonding. For example, moving the substrate 10 to the second position means moving the substrate 10 to the bonding station, and the substrate 10 is located within the visual range of the second vision device 300.

[0060] Step S400: Determine the second relative positional relationship based on the second image data. The second relative positional relationship is the relative positional relationship between the acquisition reference point of the second image data and the window. The acquisition reference point of the second image data and the bonding head have a pre-calibrated third relative positional relationship.

[0061] For example, the acquisition reference point of the second vision device 300 is the visual center of the second vision device 300, the pixel coordinate center of the second image data, the optical center of the second vision device 300, or the visual center of the second vision device 300.

[0062] Specifically, the second image data can be processed using, but is not limited to, one or more image processing techniques in the prior art, to obtain the relative positional relationship between the acquisition reference point corresponding to the second image data and the window within the second image data. Therefore, this embodiment does not limit the specific method and steps for determining the second relative positional relationship based on the second image data.

[0063] For example, such as Figure 6 As shown, the image processing unit first extracts the pixel coordinates of the window's center in the image using edge detection and fitting algorithms. The intersection of the red "+" mark within window 13 indicates the center of the window in the target fitting area 15. Then, the pixel coordinates of the pixel coordinate center (i.e., the image acquisition reference point) are obtained. The pixel offset between the window's center and the pixel coordinate center is calculated and converted into actual physical distance using pixel equivalents, serving as a second relative positional relationship.

[0064] For example, the relative positional relationship between the fitting head and the acquisition reference point of the second image data can be predetermined by hand-eye calibration, but not limited to.

[0065] Step S500: Determine the target fitting position on the first surface based on the first relative position relationship, the second relative position relationship and the third relative position relationship. The target fitting position corresponds to the marking feature.

[0066] For example, when the chip is bonded to the target bonding position, the chip can achieve the alignment accuracy on the substrate 10 that meets the process requirements.

[0067] The bonding method provided in the above embodiments uses the window 13 within the target bonding area of ​​the substrate 10 as a reference. During chip bonding, the second vision device 300 can obtain the position of the marking feature 14 on the second surface 12 when the substrate 10 is transferred to the bonding station by acquiring an image of the first surface 11 of the substrate 10, thus facilitating precise positioning during chip bonding. Furthermore, the position for acquiring the first image data can be omitted at the bonding station, solving the problem in related technologies where the bonding station cannot be equipped with a vision device for positioning. Moreover, since there is no relative movement between the marking feature 14 and the window 13 in the substrate 10 during transfer, the movement error during the transfer mechanism 100's movement of the substrate 10 does not affect the positioning accuracy between the chip and the substrate 10. In other words, this bonding method does not require a high-precision transfer mechanism.

[0068] In some embodiments, before acquiring the first image data of the substrate at a pre-calibrated first position in step S100, the bonding method further includes: Step S700: Control the substrate and the first vision device to move relative to each other, so that the first vision device is initially aligned with the target bonding area on the substrate, wherein the first vision device is used to acquire the first image data. Step S900: Acquire a first initial positioning image through a first vision device. The first initial positioning image includes at least a portion of the image data of the target fitting area. Step S1000: Based on the first initial positioning image, determine the first initial alignment deviation between the acquisition reference point of the first vision device and the target fitting area; Step S1100: If the first initial alignment deviation is less than or equal to the first preset threshold, step S100 is executed to obtain the first image data of the substrate.

[0069] In some embodiments, step S1000, determining the first initial alignment deviation between the acquisition reference point of the first vision device and the target fitting area based on the first initial positioning image, includes: Step S1010: Determine the center of the target fitting area based on the first initial positioning image; Step S1020: Determine the first initial alignment deviation based on the center of the target fitting area and the acquisition reference point of the first vision device.

[0070] In some embodiments, the acquisition reference point of the first vision device 200 is the pixel coordinate center of the first image data, the optical center of the first vision device 200, or the visual center of the first vision device 200.

[0071] In some embodiments, the substrate 10 has a plurality of target bonding areas 15 arranged in a rectangular array. Before executing step S100 and acquiring the first image data of the substrate, initial positioning is first performed. Exemplarily, the control unit drives the first vision device to move substantially opposite one of the target bonding areas 15 on the substrate 10. The first vision device captures a first initial positioning image. Exemplarily, as... Figure 3 As shown, the first initial localization image includes at least a portion of the contour of the target fitting region. Exemplarily, the target fitting region 15 is rectangular, and the first initial localization image includes at least three corner features of the target fitting region 15. An image processing unit corner detection algorithm (such as Harris corner detection or Shi-Tomasi algorithm) extracts the pixel coordinates of the three corner points of the contour of the target fitting region in the image, and obtains the geometric center coordinates of the target fitting region 15 based on the pixel coordinates of the three corner points in the image. Exemplarily, Figure 3The intersections of the red cross-shaped markers outside window 13 represent three corner features. The intersections of the red cross-shaped markers inside window 13 indicate the geometric center coordinates of the target fitting area 15. Then, the coordinates of the acquisition reference point of the first vision device 200 in the image are obtained. For example, Figure 3 The intersection of the blue "+" shaped mark indicates the acquisition reference point of the first vision device 200. The pixel deviation between the geometric center coordinates of the target bonding area 15 and the coordinates of the acquisition reference point of the first vision device 200 is calculated. If the absolute value of this deviation is less than or equal to a preset threshold, the initial alignment of the substrate 10 and the target bonding area 15 in the first vision device 200 is considered successful. Step S100 is then executed to acquire the first image data of the substrate. Specifically, the first image data of the target bonding area 15 in the substrate can be acquired through the first vision device 200.

[0072] If the absolute value of the deviation is greater than the preset threshold, the first vision device 200 is driven to move based on the pixel deviation between the geometric center coordinates of the target fitting area 15 and the coordinates of the acquisition reference point of the first vision device 200, and the first initial positioning image is re-captured and judged again until the pixel deviation between the geometric center coordinates of the target fitting area 15 and the coordinates of the acquisition reference point of the first vision device 200 meets the requirements.

[0073] Before acquiring the first image data, the above embodiment first aligns the first vision device 200 and the corresponding target bonding area 15. This helps to ensure that the center of the target bonding area 15 is located near the center of the image, which can effectively utilize the central area with less distortion for measurement, reduce the positioning error caused by lens distortion, and thus improve the final bonding accuracy.

[0074] In some embodiments, before acquiring the second image data of the substrate at the pre-calibrated second position in step S300, the bonding method further includes: Step S1300: Control the substrate and the second vision device to move relative to each other, so that the second vision device is initially aligned with the target bonding area on the substrate, wherein the second vision device is used to acquire second image data. Step S1400: Acquire a second initial positioning image through a second vision device. The second initial positioning image includes at least a portion of the image data of the target fitting area. Step S1500: Based on the second initial positioning image, determine the second initial alignment deviation between the acquisition reference point of the second vision device and the target fitting area; In step S1600, if the second initial alignment deviation is less than or equal to the second preset threshold, step S300 is executed to obtain the second image data of the substrate.

[0075] In some embodiments, step S1500, determining the second initial alignment deviation between the acquisition reference point of the second vision device and the target fitting area based on the second initial positioning image, includes: Step S1510: Determine the center of the target fitting area based on the second initial positioning image; Step S1520: Determine the second initial alignment deviation based on the center of the target fitting area and the acquisition reference point of the second vision device.

[0076] Exemplarily, the control unit drives the second vision device 300 to move substantially relative to a target bonding region 15 in the substrate 10. The second vision device captures a second initial positioning image. Exemplarily, this second initial positioning image includes at least a partial outline of the target bonding region. Exemplarily, as... Figure 5 As shown, the target fitting region 15 is rectangular, and the second initial localization image includes at least three corner features of the target fitting region 15. An image processing unit corner detection algorithm (such as Harris corner detection or Shi-Tomasi algorithm) extracts the pixel coordinates of the three corner points of the contour of the target fitting region in the image, and obtains the geometric center coordinates of the target fitting region 15 based on the pixel coordinates of the three corner points in the image. For example, Figure 5 The intersections of the red cross-shaped markers outside window 13 represent three corner features. The intersections of the red cross-shaped markers inside window 13 indicate the geometric center coordinates of the target fitting area 15. Then, the coordinates of the acquisition reference point of the second vision device 300 in the image are obtained. For example, Figure 5 The intersection of the blue "+" shaped mark indicates the acquisition reference point of the first vision device 200. The pixel deviation between the geometric center coordinates of the target bonding area 15 and the coordinates of the acquisition reference point of the second vision device 300 is calculated. If the absolute value of this deviation is less than or equal to a preset threshold, the initial alignment of the substrate 10 and the target bonding area 15 in the second vision device 300 is considered successful. Step S300 is then executed to acquire the second image data of the substrate at a pre-marked second position. Specifically, the second image data of the target bonding area 15 in the substrate can be acquired through the second vision device 300.

[0077] If the absolute value of the deviation is greater than the preset threshold, the second vision device 300 is driven to move based on the pixel deviation between the geometric center coordinates of the target fitting area 15 and the coordinates of the acquisition reference point of the second vision device 300, and the second initial positioning image is re-captured and judged again until the pixel deviation between the geometric center coordinates of the target fitting area 15 and the coordinates of the acquisition reference point of the second vision device 300 meets the requirements.

[0078] Before acquiring the second image data, the above embodiment first aligns the second vision device 300 and the corresponding target bonding area 15. This helps to ensure that the center of the target bonding area 15 is located near the center of the image, which can effectively utilize the central area with less distortion for measurement, reduce the positioning error caused by lens distortion, and thus improve the final bonding accuracy.

[0079] In some embodiments, step S500 involves determining the target bonding position on the first surface based on a first relative positional relationship, a second relative positional relationship, and a third relative positional relationship. The target bonding position corresponds to the marking feature. Prior to this, the bonding method includes: Step S1700: Obtain the third image data, which is the image data of the chip to be bonded located on the bonding head; Step S1800: Determine the fourth relative positional relationship based on the third image data. The fourth relative positional relationship is the relative positional relationship between the chip to be bonded and the bonding head.

[0080] Reference Figure 2 After the bonding head picks up the chip, it moves to the calibrated third position. Specifically, when the bonding head moves to the calibrated third position, the third vision device 400 is opposite to the bonding head, and the chip picked up by the bonding head is within the visual range of the third vision device 400. Furthermore, the third vision device 400 is fixedly set, that is, the positional relationship between the third vision device 400 and the calibrated third position remains unchanged, so as to calibrate the relative position between the chip and the bonding head through the third vision device 400.

[0081] Specifically, when the bonding head moves to the calibrated third position, third image data can be acquired through the third vision device 400.

[0082] For example, when the bonding head moves to the third position, the axis of the main shaft of the bonding head passes through the visual center of the third vision device 400.

[0083] In some embodiments, step S1800, determining a fourth relative positional relationship based on the third image data, wherein the fourth relative positional relationship is the relative positional relationship between the chip to be bonded and the bonding head, includes: Step S1810: Determine the fifth relative position relationship based on the third image data. The fifth relative position relationship is the relative position relationship between the center of the chip to be bonded and the acquisition reference point of the third image data. Step S1820: Obtain the pre-calibrated sixth relative position relationship, which is the relative position relationship between the acquisition reference point of the third image data and the fitting head reference point; Step S1830: Determine the fourth relative position relationship based on the fifth and sixth relative position relationships.

[0084] In the above embodiment, after the bonding head picks up the chip, the relative position between the chip and the bonding head can be calibrated by the third vision device 400, so as to compensate for the matching error between the chip and the bonding head in the subsequent bonding process and improve the bonding accuracy.

[0085] In some embodiments, the bonding method further includes: step S1900, controlling the bonding head to bond the chip to be bonded to the target bonding position based on the target bonding position and the fourth relative positional relationship.

[0086] The above embodiments are beneficial for compensating for the misfitting error between the chip and the bonding head, and improving the bonding accuracy.

[0087] In some embodiments, the substrate includes multiple target bonding areas arranged in a rectangular array, and each target bonding area includes a window and a marking feature. Step S100: First image data of the substrate is acquired at a pre-marked first position. The substrate includes a window, a first surface opposite to the substrate, and a second surface. The first surface is the surface on which the substrate is bonded to the chip. The window extends from the first surface to the second surface. The second surface is provided with a marking feature for positioning. The first image data is image data of the second surface including the window and the marking feature, including: Step S110: Control the substrate and the first vision device to move relative to each other, so that the first vision device is sequentially aligned with the target bonding area; Step S120: At each target bonding area, first image data corresponding to the target bonding area is acquired from one side of the second surface, wherein the target bonding area is the target bonding area opposite to the first vision device; Step S130: Associate the first image data with its corresponding target fitting area.

[0088] For example, when the substrate 10 moves to the first position, the first image data corresponding to each target bonding area 15 is acquired sequentially by the first vision device 200, and these data are associated with each target bonding area 15 so as to determine the relative positional relationship between the marker feature 14 and the window 13 in each target bonding area in subsequent steps.

[0089] In the above embodiments, the first image data of all target bonding positions are acquired in batches, avoiding frequent movement of the substrate 10 between the first and second positions during the bonding process, which is beneficial to improving overall production efficiency. Furthermore, by moving the first vision device 200 relative to the substrate 10, the first image within each target bonding area is captured when the first vision device is directly facing the target bonding area, resulting in minimal image distortion and high data consistency. Moreover, by decoupling the acquisition of first image data from the bonding action, pre-stored data is only needed during bonding, eliminating the need to wait for the acquisition of first image data, which helps to shorten the cycle time for bonding a single chip.

[0090] In some embodiments, step S200, determining a first relative positional relationship based on the first image data, wherein the first relative positional relationship is the relative positional relationship between the marker feature and the window, includes: Step S230: Based on the first image data obtained at each target fitting area, determine the first relative positional relationship corresponding to the target fitting area, wherein the first relative positional relationship corresponding to the target fitting area is the relative positional relationship between the marker feature and the window located within the target fitting area; Step S240: Associate and store each target fitting area with its corresponding first relative position relationship.

[0091] For example, the control unit processes the first image data of each target fitting region 15 sequentially. For the first image data of each target fitting region 15, the center of window 13 and the center of marker feature 14 are extracted respectively through edge detection and fitting algorithms. The pixel offset between the two is calculated and converted into actual physical distance using a pre-calibrated pixel equivalent to obtain the first relative positional relationship of the position. Then, this relative positional relationship is associated with the coordinates (e.g., row number, column number) of the corresponding target fitting region 15 and stored in the memory of the control unit to form a mapping table of the position of the target fitting region 15 and the first relative positional relationship. In the above implementation, the relative position between the marker feature 14 corresponding to each target fitting region 15 and window 13 is bound to facilitate quick retrieval and recall during fitting.

[0092] In some embodiments, step S300, acquiring second image data of the substrate at a pre-marked second position, wherein the second image data is image data of the first surface including a window, and the second position and the first position are spaced apart on the transport path of the substrate, includes: Step S310: Obtain the second image data corresponding to the target bonding area to be bonded. The second image data corresponding to the target bonding area to be bonded includes the image data of the window located within the target bonding area to be bonded.

[0093] For example, the second vision device 300 and the substrate 10 can be controlled to move relative to each other, so that the second vision device 300 can move above the target bonding area 15 of the chip to be bonded. After the second vision device 300 moves above the target bonding area 15 of the chip to be bonded, second image data is acquired through the second vision device 300.

[0094] In some embodiments, step S400, determining a second relative positional relationship based on the second image data, wherein the second relative positional relationship is the relative positional relationship between the acquisition reference point of the second image data and the window, and the acquisition reference point of the second image data and the bonding head have a pre-calibrated third relative positional relationship, includes: Step S410: Based on the second image data corresponding to the target bonding area to be bonded, determine the second relative positional relationship corresponding to the target bonding area to be bonded. The acquisition reference point of the second image data and the bonding head have a pre-calibrated third relative positional relationship.

[0095] In some embodiments, step S500, determining the target bonding position on the first surface based on the first relative positional relationship, the second relative positional relationship, and the third relative positional relationship, wherein the target bonding position corresponds to the marking feature, includes: Step S510: Determine the target bonding position on the first surface corresponding to the target bonding area to be bonded, based on the first relative position relationship, the second relative position relationship, and the third relative position relationship corresponding to the target bonding area to be bonded.

[0096] In some embodiments, after step S240, which associates and stores each target bonding area with its corresponding first relative positional relationship, and before step S510, which determines the target bonding position on the first surface corresponding to the target bonding area to be bonded according to the first relative positional relationship, the second relative positional relationship, and the third relative positional relationship corresponding to the target bonding area to be bonded, the bonding method further includes: Step S2000: Based on the target bonding area to be bonded, call the first relative position relationship corresponding to the target bonding area to be bonded.

[0097] For example, after the substrate 10 is moved to the bonding station, the bonding head sequentially bonds the chip to each qualified target bonding area 15 on the substrate 10.

[0098] In some embodiments, after acquiring the first image data of the substrate at a pre-calibrated first position in step S100, and before acquiring the second image data of the substrate at a pre-calibrated second position in step S300, the bonding method further includes: Step S2100: Detect defect features in the corresponding target bonding area based on the first image data, and obtain a quantitative index corresponding to each defect feature; In step S2200, if the quantitative index of any of the defect features exceeds a preset threshold, the target fitting area is deemed unqualified, the area is skipped, an alarm is issued, and subsequent processing steps for the area are terminated.

[0099] For example, defect features include, but are not limited to, one or more of scratches, dents, stains, broken wires, and deformed pins. Specifically, each defect feature has a preset corresponding threshold. The threshold for each defect feature can be set according to process requirements; however, this embodiment does not limit the threshold range for each defect feature.

[0100] One embodiment of this application provides a computer device, including at least one computer storage medium and at least one processor. The at least one computer storage medium stores a control program for any of the bonding methods described in the above embodiments, and the at least one processor is used to execute the control program stored on the at least one computer storage medium.

[0101] One embodiment of this application provides a computer-readable storage medium storing a program, the stored program including methods that can be loaded by a processor and processed in any of the above embodiments.

[0102] Those skilled in the art will understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc., and can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0103] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any changes or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in the present invention should be included within the scope of protection of the present invention.

Claims

1. A bonding method, characterized in that, include: First image data of a substrate is acquired at a pre-calibrated first position. The substrate includes a window, a first surface and a second surface facing away from each other. The first surface is the surface on which the chip is attached to the substrate. The window extends from the first surface to the second surface. The second surface is provided with a positioning mark feature. The first image data is the image data of the second surface including the window and the mark feature. A first relative positional relationship is determined based on the first image data, wherein the first relative positional relationship is the relative positional relationship between the marker feature and the window; A second image data of the substrate is acquired at a pre-calibrated second position. The second image data is image data of the first surface including the window. The second position and the first position are distributed at intervals on the transport path of the substrate. A second relative positional relationship is determined based on the second image data. The second relative positional relationship is the relative positional relationship between the acquisition reference point of the second image data and the window. The acquisition reference point of the second image data and the bonding head have a pre-calibrated third relative positional relationship. The target fitting position on the first surface is determined based on the first relative position relationship, the second relative position relationship, and the third relative position relationship, and the target fitting position corresponds to the marking feature.

2. The bonding method according to claim 1, characterized in that, Before acquiring the first image data of the substrate at a pre-calibrated first position, the bonding method further includes: The control board moves to the first position.

3. The bonding method according to claim 2, characterized in that, Before acquiring the first image data of the substrate at a pre-calibrated first position, the bonding method further includes: The substrate is controlled to move relative to the first vision device, so that the first vision device is initially aligned with the target bonding area on the substrate, wherein the first vision device is used to acquire the first image data. A first initial positioning image is acquired through the first vision device, and the first initial positioning image includes at least a portion of the image data of the target fitting area. Based on the first initial positioning image, a first initial alignment deviation between the acquisition reference point of the first vision device and the target fitting area is determined; If the initial alignment deviation is less than or equal to the first preset threshold, the first image data of the substrate is acquired.

4. The bonding method according to claim 3, characterized in that, Based on the first initial positioning image, a first initial alignment deviation is determined between the acquisition reference point of the first vision device and the target fitting area, including: Based on the first initial positioning image, determine the center of the target fitting area; The first initial alignment deviation is determined based on the center of the target fitting area and the acquisition reference point of the first vision device.

5. The bonding method according to claim 4, characterized in that, The acquisition reference point of the first vision device is the visual center of the first vision device.

6. The bonding method according to claim 2, characterized in that, Determining a first relative positional relationship based on the first image data, wherein the first relative positional relationship is the relative positional relationship between the marker feature and the window, includes: The center of the window and the marker features are determined based on the first image data; The first relative positional relationship is determined based on the center of the window and the marker features.

7. The bonding method according to any one of claims 2 to 6, characterized in that, Before acquiring the second image data of the substrate at a pre-calibrated second position, the bonding method further includes: The control board moves to the second position.

8. The bonding method according to any one of claims 2 to 6, characterized in that, Before acquiring the second image data of the substrate at a pre-calibrated second position, the bonding method further includes: The substrate and the second vision device are controlled to move relative to each other, so that the second vision device is initially aligned with the target bonding area on the substrate, wherein the second vision device is used to acquire the second image data. A second initial positioning image is acquired through the second vision device, the second initial positioning image including at least a portion of the image data of the target fitting area; Based on the second initial positioning image, a second initial alignment deviation between the acquisition reference point of the second vision device and the target fitting area is determined; If the second initial alignment deviation is less than or equal to the second preset threshold, the second image data of the substrate is acquired.

9. The bonding method according to claim 8, characterized in that, Based on the second initial positioning image, a second initial alignment deviation is determined between the acquisition reference point of the second vision device and the target fitting area, including: Based on the second initial positioning image, determine the center of the target fitting area; The second initial alignment deviation is determined based on the center of the target fitting area and the acquisition reference point of the second vision device.

10. The bonding method according to claim 8, characterized in that, The acquisition reference point of the second vision device is the visual center of the second vision device; And / or, the second vision device is configured to be fixed relative to the bonding head.

11. The bonding method according to any one of claims 1 to 6, characterized in that, The target bonding position on the first surface is determined based on the first relative positional relationship, the second relative positional relationship, and the third relative positional relationship. The target bonding position corresponds to the marking feature. Prior to this, the bonding method includes: Acquire third image data, which is image data of the chip to be bonded located on the bonding head; A fourth relative positional relationship is determined based on the third image data. The fourth relative positional relationship is the relative positional relationship between the chip to be bonded and the bonding head.

12. The bonding method according to claim 11, characterized in that, A fourth relative positional relationship is determined based on the third image data. This fourth relative positional relationship refers to the relative positional relationship between the chip to be bonded and the bonding head, including: A fifth relative positional relationship is determined based on the third image data, wherein the fifth relative positional relationship is the relative positional relationship between the center of the chip to be bonded and the acquisition reference point of the third image data. Obtain the pre-calibrated sixth relative positional relationship, which is the relative positional relationship between the acquisition reference point of the third image data and the fitting head reference point; The fourth relative position relationship is determined based on the fifth relative position relationship and the sixth relative position relationship.

13. The bonding method according to claim 12, characterized in that, The third image data is acquired through the fixedly configured third vision device.

14. The bonding method according to claim 13, characterized in that, The bonding method further includes: Based on the target bonding position and the fourth relative positional relationship, the bonding head is controlled to bond the chip to be bonded to the target bonding position.

15. The bonding method according to claim 1, characterized in that, The substrate includes multiple target bonding areas, which are arranged in a rectangular array. Each target bonding area includes the window and the marking feature. First image data of a substrate is acquired at a pre-calibrated first position. The substrate includes a window, a first surface opposite to the substrate, and a second surface. The first surface is the surface on which the chip is attached to the substrate. The window extends from the first surface to the second surface. The second surface is provided with positioning marking features. The first image data is image data of the second surface including the window and the marking features, including: The substrate is controlled to move relative to the first vision device, so that the first vision device is sequentially aligned with the target bonding area; At each of the target bonding areas, first image data corresponding to the target bonding area is acquired from one side of the second surface, wherein the target bonding area is the target bonding area opposite to the first visual device; Associate the first image data with its corresponding target fitting area.

16. The bonding method according to claim 15, characterized in that, Determining a first relative positional relationship based on the first image data, wherein the first relative positional relationship is the relative positional relationship between the marker feature and the window, includes: Based on the first image data obtained at each of the target fitting areas, a first relative positional relationship corresponding to the target fitting area is determined, wherein the first relative positional relationship corresponding to the target fitting area is the relative positional relationship between the marker feature and the window located within the target fitting area; Each target fitting area is associated with and stored in relation to its corresponding first relative position.

17. The bonding method according to claim 16, characterized in that, The step of acquiring second image data of the substrate at a pre-marked second position, wherein the second image data is image data of the first surface including the window, includes: acquiring second image data corresponding to the target bonding area to be bonded at the pre-marked second position, wherein the second image data corresponding to the target bonding area to be bonded is image data including the window located within the target bonding area to be bonded.

18. The bonding method according to claim 17, characterized in that, A second relative positional relationship is determined based on the second image data. This second relative positional relationship is the relative positional relationship between the acquisition reference point of the second image data and the window. The acquisition reference point of the second image data and the bonding head have a pre-calibrated third relative positional relationship, including: Based on the second image data corresponding to the target bonding area to be bonded, a second relative positional relationship corresponding to the target bonding area to be bonded is determined, and the acquisition reference point of the second image data has a pre-calibrated third relative positional relationship with the bonding head.

19. The bonding method according to claim 18, characterized in that, The target fitting position on the first surface is determined based on the first relative positional relationship, the second relative positional relationship, and the third relative positional relationship. The target fitting position corresponds to the marking feature and includes: The target bonding position on the first surface corresponding to the target bonding area to be bonded is determined based on the first relative position relationship, the second relative position relationship, and the third relative position relationship corresponding to the target bonding area to be bonded.

20. The bonding method according to claim 19, characterized in that, After associating and storing each target bonding area with its corresponding first relative positional relationship, and before determining the target bonding position on the first surface corresponding to the target bonding area to be bonded based on the first relative positional relationship, second relative positional relationship, and third relative positional relationship corresponding to the target bonding area to be bonded, the bonding method further includes: Based on the target bonding area to be bonded, the first relative position relationship corresponding to the target bonding area to be bonded is invoked.

21. A bonding system, characterized in that, The bonding system can be applied to the bonding method described in claims 1 to 20.

22. The bonding system according to claim 21, characterized in that, include: The components include a transmission mechanism, a first vision device, a second vision device, and a bonding head, wherein: The first vision device is used to acquire first image data of the substrate; The second vision device is used to acquire the second image data of the substrate, and the first vision device and the second vision device are distributed at intervals along the transmission direction of the transmission mechanism. The bonding head and the second vision device have a pre-calibrated third relative positional relationship, and the bonding head bonds the chip to be bonded to the target bonding position on the substrate.

23. The bonding system according to claim 22, characterized in that, The bonding system also includes a third vision device, which is disposed on one side of the transmission mechanism and is used to acquire third image data, which is image data of the chip to be bonded located on the bonding head.

24. The bonding system according to claim 22, characterized in that, The bonding system further includes a flipping head and a bonding table, which are located at the bonding station. The bonding head is used to provide support for the substrate during the bonding process between the chip and the substrate. At least part of the flipping head and / or the third vision device is located below and / or to one side of the bonding table. The flipping head is used to flip the chip to be bonded before bonding it to the substrate, so that the side of the chip to be bonded with the protrusions can be adapted to the substrate located at the bonding station.

25. A computer device comprising at least one computer storage medium and at least one processor, wherein the at least one computer storage medium stores a control program for the bonding method as described in any one of claims 1 to 20, and the at least one processor is configured to execute the control program stored on the at least one computer storage medium.

26. A computer-readable storage medium, characterized in that, The medium stores a program that can be loaded by a processor and executed as the bonding method as described in any one of claims 1 to 20.

Images