Wafer clamping device

Abstract

The application provides a wafer clamping device, comprising: a cavity, a through hole is opened in the top; a telescopic device is arranged in the cavity, the telescopic device has a telescopic end; a bearing table is arranged at the telescopic end and coaxially arranged with the telescopic end, the bearing table is used for bearing a wafer; a clamping centering mechanism is arranged in the cavity, the clamping centering mechanism comprises at least three clamping pieces arranged movably; a working state, the telescopic device drives the bearing table to extend out of the cavity through the through hole, when the wafer is placed on the bearing table, the telescopic device is retracted, and the clamping centering mechanism drives all the clamping pieces to clamp the wafer simultaneously. The wafer clamping device provided by the application can automatically center the wafer during clamping and fixing of the wafer, so that the accuracy of the position of the wafer placed on the bearing table is ensured, and the production efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a wafer clamping device. Background Technology

[0002] In the semiconductor manufacturing process, wafers need to be precisely positioned within the process chamber. Therefore, after the robotic arm places the wafers on the carrier stage, centering is required.

[0003] Currently, after wafers are transported to the processing platform by robotic arms, a centering device is typically used for alignment. However, because existing production lines contain wafers of different sizes, such as 8-inch and 12-inch, traditional centering devices require readjustment or replacement of fixtures when switching wafer sizes. This method is not only cumbersome and time-consuming, but repeated adjustments can also easily introduce positioning errors, affecting product consistency and production efficiency. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide a wafer clamping device that can automatically center the wafer during the clamping and fixing process to ensure the accuracy of the wafer's position on the carrier stage and improve production efficiency.

[0005] To address the aforementioned technical problems, in a first aspect, this application provides a wafer clamping device, comprising: The cavity has a through hole at the top; An expansion joint is disposed within the cavity, and the expansion joint has an expansion end; A support platform is located at the telescopic end and is coaxially arranged with the telescopic end; the support platform is used to support the wafer. A clamping and centering mechanism is provided in the cavity, and the clamping and centering mechanism includes at least three movable clamping members; In operation, the telescopic device drives the carrier platform to extend out of the cavity through the through hole. When the wafer is placed on the carrier platform, the telescopic device retracts, and the clamping and centering mechanism drives all the clamping members to clamp the wafer simultaneously. In some embodiments of this application, the clamping and centering mechanism includes a driver and a transmission assembly; The driver is located in the cavity; The transmission component is connected to the driver; At least three of the clamping members are connected to the transmission assembly and are spaced apart around the edge of the support platform, with each clamping member being equidistant from the support platform; When the driver drives the transmission assembly to move the clamping member, each clamping member simultaneously approaches the support stage to clamp the wafer.

[0006] In some embodiments of this application, the transmission assembly includes a drive wheel, a slide bar, and a slider; The drive wheel is rotatably disposed in the cavity, and the drive wheel has a circular hole corresponding to the through hole; The driver is connected to the drive wheel and is used to drive the drive wheel to rotate; At least three slide rods are spaced apart around the edge of the support platform. One end of each slide rod is rotatably connected to the cavity, and the other end of each slide rod is connected to a corresponding clamping member. Each slide rod is slidably fitted with a slider. The slider has a connecting part, which is rotatably connected to the drive wheel.

[0007] In some embodiments of this application, the transmission assembly further includes a bearing; The drive wheel has at least three mounting holes 4312 along its outline, and the bearing is fixedly installed in each of the mounting holes 4312; The slider is located at the bottom of the drive wheel, and the connecting part passes through the inner ring of the bearing and is fixedly connected to the bearing.

[0008] In some embodiments of this application, the transmission assembly further includes at least three connecting posts; The connecting column is located inside the cavity. One end of the connecting column is connected to the top of the cavity, and the other end of the connecting column is rotatably connected to one end of a corresponding slide rod, such that the extension direction of the slide rod is parallel to the plane of the support platform.

[0009] In some embodiments of this application, the transmission assembly further includes rolling components, a plurality of the rolling components being located on the side away from the slider, spaced apart along the contour of the drive wheel, and fixedly connected to the drive wheel; The rolling assembly includes a rotatable roller that abuts against the edge of the circular hole.

[0010] In some embodiments of this application, the edge of the through hole is provided with an arc surface, and the arc surface is arranged circumferentially along the through hole; The outer wall of the roller is provided with an annular arc groove, which is adapted to the arc surface.

[0011] In some embodiments of this application, the sidewall of the clamping member is provided with an abutment groove, and the width of the abutment groove is greater than the thickness of the wafer, and the abutment groove is used to abut the edge of the wafer.

[0012] In some embodiments of this application, the edge of the drive wheel is provided with a gear structure; The drive unit of the driver meshes with the gear structure.

[0013] In some embodiments of this application, the transmission assembly further includes an adjusting block, which is adjustablely mounted on the slide rod; The clamping member is connected to the adjusting block; The slide bar is etched with a marking portion, which is used to mark the position of the clamping member; By adjusting the position of the slide bar on the adjustment block, it can be adapted to clamp and center different wafers.

[0014] The advantages of the wafer clamping device provided in this application are as follows: 1. After the wafer is placed on the carrier stage by the mechanical gripper, the clamping and alignment mechanism simultaneously clamps and fixes the wafer by driving at least three clamping members. It is understood that since the clamping members are driven to move the same distance by the driver, when the wafer deviates from the carrier stage, the at least three clamping members can work together to calibrate the wafer's position. That is, the wafer clamping device provided in this application simultaneously possesses the functions of wafer clamping and wafer calibration and alignment. More importantly, this method can adapt to clamping, fixing, and calibrating different types of wafers.

[0015] 2. This application utilizes the cooperation of a drive wheel, a slide bar, and a slider to drive at least three clamping components to move synchronously when the driver is running, enabling the wafer clamping device provided in this application to have the function of wafer alignment and centering. Furthermore, the adjusting block in this application is adjustablely mounted on the slide bar. Since the slide bar is equipped with a marking section, when it is necessary to switch between clamping and fixing wafers of different sizes, this application can achieve a quick switching function by adjusting the position of the adjusting block on the slide bar.

[0016] 3. By setting a rolling component on the drive wheel, this application ensures the stability of the drive wheel during rotation, thereby improving the effect of wafer clamping and wafer calibration.

[0017] 4. The controller in this application adopts a segmented control program, which can realize graded and precise adjustment of the driving voltage according to the magnitude of the abutment force F detected and fed back by the pressure sensor in real time. This effectively balances the efficiency and control accuracy of wafer clamping operations, while also having a complete safety protection system, significantly improving the reliability of device operation and the safety of wafer clamping. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the wafer clamping device provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the wafer clamping device after disassembly of the cavity, as provided in the embodiments of this application; Figure 3 for Figure 1 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the structure of the clamping component provided in the embodiments of this application.

[0019] Figure label: Cavity 1, through hole 11, arc surface 111, telescopic device 2, support platform 3, clamping and centering mechanism 4, clamping component 41, abutment groove 411, driver 42, transmission assembly 43, drive wheel 431, round hole 4311, mounting hole 4312, gear structure 4313, slide bar 432, slider 433, bearing 434, connecting column 435, rolling assembly 436, roller 4361, arc groove 4362, adjusting block 437. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0021] Furthermore, it should be understood that the orientations or positional relationships indicated by terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" in this document are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" in this document are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0022] To address the problems existing in the prior art, embodiments of this application provide a wafer clamping device, with reference to... Figure 1As shown, the device includes a cavity 1, a telescopic device 2, a support platform 3, and a clamping and centering mechanism 4. The cavity 1 has a circular through-hole 11 at its top, connecting the interior of the cavity 1 to the outside. The telescopic device 2 is located inside the cavity 1 and has a telescopic end that can move up and down, coaxially with the through-hole 11. The support platform 3 is located at the telescopic end and coaxially with it; the support platform 3 has a disc-shaped structure for supporting the wafer. The clamping and centering mechanism 4 is located in the cavity 1 and includes at least three movable clamping members 41 for clamping the wafer.

[0023] In operation, the telescopic device 2 drives the support platform 3 to extend out of the cavity 1 through the through hole 11. After the robot arm grabs the wafer and places it on the support platform 3, the telescopic device 2 retracts to drive the wafer back into the cavity 1. Then, the clamping and centering mechanism 4 drives all the clamping members 41 to move towards the edge of the wafer at the same time to clamp the wafer.

[0024] In this embodiment, the wafer is clamped and fixed by the clamping and centering mechanism 4. During the clamping and fixing process, all the clamping members 41 cooperate with each other to calibrate and center the wafer position, so that the finally fixed wafer remains concentric with the carrier stage 3.

[0025] For example, when the wafer is placed on the support platform 3 in an offset state, and assuming that the wafer is offset in the first direction, when the clamping and centering mechanism 4 drives all the clamping members 41 to move towards the wafer at the same time, the clamping member 41 closer to the first direction will make contact with the edge of the wafer in advance, and then push the wafer to move in the opposite direction until all the clamping members 41 are in contact with the edge of the wafer to complete the final clamping and fixing.

[0026] In some embodiments, the telescopic device 2 may be a telescopic cylinder.

[0027] refer to Figure 1 and Figure 2 As shown, in some embodiments, the clamping and centering mechanism 4 includes a driver 42 and a transmission assembly 43. The driver 42 is fixedly mounted on the cavity 1. The transmission assembly 43 is located within the cavity 1 and connected to the driver 42. At least three clamping members 41 are connected to the transmission assembly 43 and are evenly spaced around the edge of the support platform 3, with each clamping member 41 having an equal distance from the support platform 3.

[0028] When the driver 42 drives the transmission assembly 43 to move the clamping member 41, each clamping member 41 simultaneously approaches the support platform 3 to clamp the wafer.

[0029] In this embodiment, the cooperation method between the transmission component 43 and the driver 42 is not specifically limited, as long as all the clamping members 41 provided on the transmission component 43 can clamp the wafer simultaneously.

[0030] Continue to refer to Figure 1 and Figure 2 As shown, in some embodiments, the transmission assembly 43 includes a drive wheel 431, a slide bar 432, and a slider 433. The plane containing the drive wheel 431 is parallel to the plane containing the top of the cavity 1. The drive wheel 431 is rotatably disposed within the cavity 1, and a circular hole 4311 is formed in the drive wheel 431 corresponding to the through hole 11, the circular hole 4311 exposing the support platform 3. The driver 42 is connected to the drive wheel 431 and is used to drive the drive wheel 431 to rotate. At least three slide bars 432 are evenly spaced around the edge of the support platform 3. One end of each slide bar 432 is rotatably connected to the cavity 1, and the other end is connected to a corresponding clamping member 41. Each slide bar 432 has a slider 433 slidably fitted onto it. The slider 433 has a connecting portion, which is rotatably connected to the drive wheel 431.

[0031] In this embodiment, the driver 42 is a motor, and a drive gear is provided on the drive end of the motor, that is, the drive gear is the drive part of the driver 42. The edge sidewall of the drive wheel 431 is provided with a gear structure 4313, which meshes with the drive gear. Therefore, when the driver 42 is started to rotate the drive gear, it will drive the drive wheel 431 to rotate. During the rotation, the drive wheel 431 will apply a force to each slide bar 432 through the slider 433, so that the slide bar 432 rotates with one end as the center of rotation, thereby driving the clamping member 41 on each slide bar 432 to move synchronously toward the wafer direction to clamp and fix the wafer.

[0032] It is understood that, through the cooperation of the drive wheel 431, the slide bar 432 and the slider 433, this embodiment enables all the clamping components 41 to move using only one driver 42. Most importantly, it ensures the synchronicity of the movement of all the clamping components 41, thereby ensuring the reliability of the wafer clamping device of this application in aligning and calibrating the wafer during the wafer clamping process.

[0033] In some embodiments, the slider 433 is provided with a sliding sleeve, which is sleeved on the slide rod 432 so that the slider 433 and the slide rod 432 are slidably connected.

[0034] In some embodiments, the driver 42 can be a telescopic cylinder, and each driver 42 is connected to a slide rod 432 at its driving end. The other end of the slide rod 432 is connected to the clamping member 41. By simultaneously driving all the drivers 42 to drive all the clamping members 41 to clamp the wafer synchronously, the desired effect of this application can also be achieved. However, compared to the above embodiments where a single driver 42 can synchronously drive all the clamping members 41 to clamp the wafer, the solution provided in this embodiment is more expensive and requires time to calibrate and verify whether all the drivers 42 operate consistently.

[0035] In some embodiments, the transmission assembly 43 further includes a bearing 434, and at least three mounting holes 4312 are evenly provided along the contour of the drive wheel 431, with the bearing 434 fixedly mounted in each mounting hole 4312. The slider 433 is located at the bottom of the drive wheel 431, and the connecting part passes through the inner ring of the bearing 434 and is fixedly connected to the bearing 434.

[0036] In this embodiment, the slider 433 is rotatably connected to the drive wheel 431 via a bearing 434, and a plurality of sliding rods 432 cooperate with the slider 433 to support the drive wheel 431 and allow the drive wheel 431 to rotate within the cavity 1.

[0037] In some embodiments, the transmission assembly 43 further includes at least three connecting posts 435. The connecting posts 435 are located inside the cavity 1, one end of the connecting post 435 is connected to the top of the cavity 1, and the other end of the connecting post 435 is rotatably connected to one end of a corresponding slide rod 432, such that the extending direction of the slide rod 432 is parallel to the plane of the support platform 3.

[0038] In this embodiment, the connecting post 435 is a cylindrical structure. The connecting post 435 is perpendicular to the inner top wall of the cavity 1 and is fixedly connected to the inner top wall of the cavity 1. The other end of the connecting post 435 can be connected to one end of the slide rod 432 through the bearing 434, so that the slide rod 432 can rotate and the extension direction of the slide rod 432 is parallel to the plane of the support platform 3, thereby cooperating with the slider 433 to support the drive wheel 431 and make the drive wheel 431 rotatable.

[0039] It should be noted that in the above embodiments, the number of clamping members 41, sliders 433, slide rods 432, and connecting posts 435 are all the same. Preferably, there are three clamping members 41, sliders 433, slide rods 432, and connecting posts 435.

[0040] refer to Figures 1 to 3 As shown, in some embodiments, the transmission assembly 43 further includes rolling assemblies 436. A plurality of rolling assemblies 436 are located on the side away from the slider 433, spaced apart along the contour of the drive wheel 431, and fixedly connected to the drive wheel 431. Each rolling assembly 436 includes a rotatable roller 4361, which abuts against the edge of the circular hole 4311.

[0041] In this embodiment, the through hole 11 exposes the outline of the inner part of the drive wheel 431. A plurality of the rolling components 436 are disposed on the exposed outline of the drive wheel 431 so that the roller 4361 abuts against the edge of the circular hole 4311. This design can keep the drive wheel 431 stable during rotation and avoid vibration, thereby ensuring the reliability of wafer clamping and alignment.

[0042] In some embodiments, the edge of the through hole 11 is provided with an arc surface 111, which is arranged circumferentially around the through hole 11. The outer side wall of the roller 4361 is provided with an annular arc groove 4362, which is adapted to the arc surface 111.

[0043] In this embodiment, by providing an arc surface 111 at the edge of the through hole 11 and an annular arc groove 4362 on the outer side wall of the roller 4361, the smoothness of the roller 4361 rolling along the edge of the circular hole 4311 is further ensured, thereby improving the stability of the drive wheel 431 during rotation.

[0044] refer to Figures 1 to 4 As shown, in some embodiments, the sidewall of the clamping member 41 is provided with an abutment groove 411, and the width of the abutment groove 411 is greater than the thickness of the wafer. The abutment groove 411 is used to abut the edge of the wafer.

[0045] In this embodiment, the clamping member 41 is generally disc-shaped, and the abutment groove 411 is located in the middle region of the edge of the clamping member 41. Since the width of the abutment groove 411 is greater than the thickness of the wafer, when the clamping member 41 clamps the wafer, the edge of the wafer will enter the abutment groove 411 and contact the abutment groove 411.

[0046] In some embodiments, the transmission assembly 43 further includes an adjusting block 437, which is adjustablely mounted on the slide rod 432. The clamping member 41 is connected to the adjusting block 437, and the slide rod 432 has an etched marking portion for marking the position of the clamping member 41. By adjusting the position of the adjusting block 437 on the slide rod 432, it can be adapted to clamp and align different wafers.

[0047] In this embodiment, the markings on the slide bar 432 can be etched symbols or numbers, each symbol or number corresponding to a wafer size. For example, the slide bar 432 may be etched with 6, 8, and 12, where 6 corresponds to a 6-inch wafer, 8 to an 8-inch wafer, and 12 to a 12-inch wafer. Therefore, when it is necessary to switch between clamping different wafers, this can be achieved by adjusting the position of the adjusting block 437 on the slide bar 432. This method eliminates the need to change the clamps, making adjustment very convenient and efficient.

[0048] Furthermore, by adjusting the position of the adjusting block 437 on the slide bar 432, the contact area between the clamping member 41 and the edge of the wafer can be indirectly adjusted, which can avoid the notch and positioning edge of the wafer during actual clamping, thereby ensuring the reliability of wafer clamping and fixing.

[0049] In some embodiments, a pressure sensor (not shown) is embedded in the abutment groove 411, the pressure sensor being used to detect the abutment force F of the clamping member 41 on the edge of the wafer.

[0050] In this embodiment, both the pressure sensor and the driver 42 are electrically connected to a controller, which stores a pressure safety threshold A for applying force to the wafer. The controller controls the driver 42 to operate so that the clamping member 41 clamps the wafer. When the pressure sensor detects that the contact force F on the edge of the wafer reaches the pressure safety threshold A, the controller controls the driver 42 to stop operating.

[0051] Specifically, the controller stores different pressure safety thresholds A. For example, when clamping a 2-inch wafer, the pressure safety threshold A ranges from 3 to 5 N. When clamping a 4-inch wafer, the pressure safety threshold A ranges from 4 to 6 N. When clamping a 6-inch wafer, the pressure safety threshold A ranges from 8 to 10 N. When clamping an 8-inch wafer, the pressure safety threshold A ranges from 10 to 12 N. When clamping a 12-inch wafer, the pressure safety threshold A ranges from 12 to 15 N.

[0052] In some embodiments, the controller includes a first control program, a second control program, and a stop program. In the first control program, the range of the contact force F detected by the pressure sensor is 0 < F ≤ 0.8 A, and the voltage supplied by the controller to the driver 42 is U. In the second control program, the range of the contact force F detected by the pressure sensor is 0.8 A < F < A, and the range of the voltage supplied by the controller to the driver 42 is 0.2 U - 0.5 U. When the contact force F detected by the pressure sensor equals A, the controller initiates the stop program, and the controller controls the driver 42 to stop operating.

[0053] In this embodiment, the controller adopts the above-mentioned segmented control program, which can realize graded and precise adjustment of the driving voltage according to the magnitude of the abutment force F detected and fed back by the pressure sensor in real time. This effectively balances the efficiency and control accuracy of wafer clamping operations, while also having a complete safety protection system, significantly improving the reliability of device operation and the safety of wafer clamping.

[0054] Understandably, when the contact force F is between 0 and 0.8A, the controller outputs a full voltage U to drive the driver 42, ensuring rapid response and efficient feeding of the clamping component 41, significantly shortening the clamping cycle time and meeting the high-efficiency operation requirements of automated production scenarios. When the contact force F enters the near-threshold range of 0.8A < F < A, the controller automatically adjusts the driving voltage to a low voltage range of 0.2U-0.5U, causing the clamping component 41 to decelerate smoothly and feed, effectively reducing motion overshoot and mechanical impact caused by mechanical inertia, thus preventing damage and cracking of the wafer due to excessive clamping force.

[0055] When the clamping force F reaches the set threshold A, the controller immediately starts the stop program and controls the driver 42 to stop running. This can effectively avoid damage to the workpiece such as hidden cracks, chipping, and deformation caused by excessive clamping force. It is especially suitable for clamping and transferring brittle and fragile workpieces such as wafers.

[0056] Furthermore, this segmented control logic features a complete closed loop, from normal, efficient operation and deceleration buffer warning to extreme shutdown protection. Even if structural jamming or control deviations occur during equipment operation, it can stop the machine in time before reaching dangerous pressure, preventing wafer scrapping and hardware damage within the wafer clamping device, thus extending the device's lifespan. Simultaneously, the entire control logic can complete voltage switching and action control through simple numerical range judgments, eliminating the need for complex algorithms. This reduces the computational load on the controller, facilitating hardware integration and program debugging, and enabling mass production of the wafer clamping device provided in this application.

[0057] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A wafer clamping device, characterized in that, include: The cavity has a through hole at the top; An expansion joint is disposed within the cavity, and the expansion joint has an expansion end; A support platform is located at the telescopic end and is coaxially arranged with the telescopic end; the support platform is used to support the wafer. A clamping and centering mechanism is provided in the cavity, and the clamping and centering mechanism includes at least three movable clamping members; In operation, the telescopic device drives the carrier stage to extend out of the cavity through the through hole. When the wafer is placed on the carrier stage, the telescopic device retracts, and the clamping and centering mechanism drives all the clamping members to clamp the wafer simultaneously. The clamping and centering mechanism includes a driver and a transmission assembly; The driver is located in the cavity; The transmission component is connected to the driver; At least three of the clamping members are connected to the transmission assembly and are spaced apart around the edge of the support platform, with each clamping member being equidistant from the support platform; When the driver drives the transmission assembly to move the clamping member, each clamping member simultaneously approaches the support stage to clamp the wafer; The transmission assembly includes a drive wheel, a slide bar, and a slider; The drive wheel is rotatably disposed in the cavity, and the drive wheel has a circular hole corresponding to the through hole; The driver is connected to the drive wheel and is used to drive the drive wheel to rotate; At least three slide rods are spaced apart around the edge of the support platform. One end of each slide rod is rotatably connected to the cavity, and the other end of each slide rod is connected to a corresponding clamping member. Each slide rod is slidably fitted with a slider. The slider has a connecting part, which is rotatably connected to the drive wheel; The transmission assembly also includes at least three connecting posts; The connecting column is located inside the cavity. One end of the connecting column is connected to the top of the cavity, and the other end of the connecting column is rotatably connected to one end of a corresponding slide rod, such that the extension direction of the slide rod is parallel to the plane of the support platform.

2. The wafer clamping device according to claim 1, characterized in that, The transmission assembly also includes bearings; The drive wheel has at least three mounting holes along its outline, and the bearing is fixedly installed in each of the mounting holes; The slider is located at the bottom of the drive wheel, and the connecting part passes through the inner ring of the bearing and is fixedly connected to the bearing.

3. The wafer clamping device according to claim 1, characterized in that, The transmission assembly further includes rolling components, a plurality of which are located on the side away from the slider, are spaced apart along the contour of the drive wheel, and are fixedly connected to the drive wheel; The rolling assembly includes a rotatable roller that abuts against the edge of the circular hole.

4. The wafer clamping device according to claim 3, characterized in that, The edge of the through hole is provided with an arc surface, and the arc surface is arranged in a ring around the circumference of the through hole; The outer wall of the roller is provided with an annular arc groove, which is adapted to the arc surface.

5. The wafer clamping device according to claim 1, characterized in that, The clamping member has an abutment groove on its side wall, and the width of the abutment groove is greater than the thickness of the wafer. The abutment groove is used to abut the edge of the wafer.

6. The wafer clamping device according to claim 1, characterized in that, The edge of the drive wheel is provided with a gear structure; The drive unit of the driver meshes with the gear structure.

7. The wafer clamping device according to claim 1, characterized in that, The transmission assembly also includes an adjusting block, which is adjustablely mounted on the slide rod; The clamping member is connected to the adjusting block; The slide bar is etched with a marking portion, which is used to mark the position of the clamping member; By adjusting the position of the slide bar on the adjustment block, it can be adapted to clamp and center different wafers.

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