Wafer clamping device

Abstract

This application provides a wafer clamping device, comprising: a cavity with a through hole at the top; a transmission assembly movably disposed within the cavity; clamping members connected to the transmission assembly, wherein the number of clamping members is at least three and spaced apart around the periphery of the through hole, and each clamping member is equidistant from the axis of the through hole; and a driver connected to the transmission assembly for driving the transmission assembly to move, thereby causing the clamping members to clamp the wafer. The present application provides a method that uses a driver to drive all clamping members to move synchronously, enabling the clamping and fixing of wafers of different sizes, improving product applicability. Furthermore, this clamping method allows for precise wafer positioning, eliminating the need for additional alignment processing and significantly improving production efficiency.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a wafer clamping device. Background Technology

[0002] In the semiconductor manufacturing process, wafers need to be precisely positioned within the process chamber. Therefore, after the robotic arm places the wafers on the carrier stage, centering is required.

[0003] Currently, after wafers are transported to the processing platform by robotic arms, a centering device is typically used for alignment. However, because existing production lines contain wafers of different sizes, such as 8-inch and 12-inch, traditional centering devices require readjustment or replacement of fixtures when switching wafer sizes. This method is not only cumbersome and time-consuming, but repeated adjustments can also easily introduce positioning errors, affecting product consistency and production efficiency. Summary of the Invention

[0004] The technical problem to be solved by this application is to provide a wafer clamping device that drives all clamping components to move synchronously through a driver, which can clamp and fix wafers of different sizes, improve the applicability of the product, and enable precise positioning of the wafer without the need for additional centering processing, thus greatly improving production efficiency.

[0005] To address the aforementioned technical problems, in a first aspect, this application provides a wafer clamping device, comprising: The cavity has a through hole at the top; The transmission assembly is movably disposed within the cavity; A clamping member is connected to the transmission assembly. The number of clamping members is at least three and they are spaced apart around the periphery of the through hole. Each clamping member is equidistant from the axis of the through hole. A driver, connected to the transmission assembly, is used to drive the transmission assembly to move so as to cause the clamping member to clamp the wafer. In some embodiments of this application, the sidewall of the clamping member has a clamping portion and a protruding support portion; In operation, the driver drives the transmission assembly to move, thereby bringing the clamping members closer together to a first preset position; after the wafer is placed on the support, the driver drives the transmission assembly to move, thereby bringing the clamping members closer together to a second preset position. When the clamping member is located in the first preset position, the diameter of the circular area formed by at least three of the supporting parts is smaller than the diameter of the wafer, and the diameter of the circular area formed by at least three of the clamping parts is larger than the diameter of the wafer. When the clamping member is located in the second preset position, the clamping part abuts against the sidewall of the wafer.

[0006] In some embodiments of this application, the transmission assembly includes a drive wheel, a slide bar, and a slider; The drive wheel is rotatably disposed in the cavity, and the drive wheel has a circular hole corresponding to the through hole; The driver is connected to the drive wheel and is used to drive the drive wheel to rotate; At least three slide rods are spaced apart around the edge of the support platform. One end of each slide rod is rotatably connected to the cavity, and the other end of each slide rod is connected to a corresponding clamping member. Each slide rod is slidably fitted with a slider. The slider has a connecting part, which is rotatably connected to the drive wheel.

[0007] In some embodiments of this application, the transmission assembly further includes a bearing; The drive wheel has at least three mounting holes along its outline, and the bearing is fixedly installed in each of the mounting holes; The slider is located at the bottom of the drive wheel, and the connecting part passes through the inner ring of the bearing and is fixedly connected to the bearing.

[0008] In some embodiments of this application, the transmission assembly further includes at least three connecting posts; The connecting post is located inside the cavity. One end of the connecting post is connected to the top of the cavity, and the other end of the connecting post is rotatably connected to one end of a corresponding slide rod. The connecting post causes the slide rod to extend horizontally and makes all the supporting parts lie in the same horizontal plane.

[0009] In some embodiments of this application, the transmission assembly further includes rolling components, a plurality of the rolling components being located on the side away from the slider, spaced apart along the contour of the drive wheel, and fixedly connected to the drive wheel; The rolling assembly includes a rotatable roller that abuts against the edge of the circular hole.

[0010] In some embodiments of this application, the edge of the through hole is provided with an arc surface, and the arc surface is arranged circumferentially along the through hole; The outer wall of the roller is provided with an annular arc groove, which is adapted to the arc surface.

[0011] In some embodiments of this application, the wafer clamping device further includes a controller electrically connected to the driver. The controller has a plurality of preset control programs, each control program corresponding to a wafer of a certain size, and each wafer corresponding to a first preset position and a second preset position. In operation, the control program is switched according to the wafer size to clamp and fix wafers of different sizes.

[0012] In some embodiments of this application, the controller stores a pressure safety threshold A; A pressure sensor is provided inside the clamping part, and the pressure sensor is electrically connected to the controller. The pressure sensor is used to detect the abutting force F applied by the clamping part to the wafer. When the controller controls the drive to operate until the pressure sensor detects that the contact force F is equal to the pressure safety threshold A, the controller controls the drive to stop operating.

[0013] In some embodiments of this application, the clamping portion is provided with an abutment groove, and the width of the abutment groove is greater than the thickness of the wafer, the abutment groove being used to abut the edge of the wafer; The pressure sensor is embedded in the abutment groove.

[0014] The advantages of the wafer clamping device provided in this application are as follows: 1. After the robotic gripper picks up the wafer and transports it into the cavity through the transfer port, the driver simultaneously drives at least three clamping elements to clamp and secure the wafer via a transmission assembly. It is understood that since each clamping element is equidistant from the axis of the via, and all clamping elements are driven synchronously by the driver, the center of the wafer is aligned with the center of the via after clamping and securing, ensuring precise wafer positioning. More importantly, this method can adapt to clamping and securing wafers of different sizes while maintaining alignment.

[0015] 2. This application uses a driver in conjunction with a drive wheel, a slide bar, and a slider. When the driver is running, it can drive at least three clamping components to move synchronously, so that the center of the wafer clamping device provided in this application always corresponds to the center of the through hole after the wafer is clamped, thus ensuring the precise positioning of the wafer.

[0016] 3. By setting a rolling component on the drive wheel, this application ensures the stability of the drive wheel during rotation, thereby improving the effect of wafer clamping and wafer calibration.

[0017] 4. The controller in this application adopts a segmented control program, which can accurately adjust the driving voltage in stages according to the magnitude of the resisting force F detected and fed back by the pressure sensor in real time. This effectively balances the efficiency and control accuracy of wafer clamping operations, while also having a complete safety protection system, significantly improving the reliability of device operation and the safety of wafer clamping. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of the wafer clamping device provided in the embodiments of this application; Figure 2 This is a schematic diagram of the structure of the clamping component provided in the embodiments of this application; Figure 3 This is a schematic diagram of the structure of the wafer clamping device after the cavity is disassembled, as provided in the embodiments of this application. Figure 4 for Figure 1 Enlarged view of point A in the middle.

[0019] Figure label: Cavity 1, through hole 11, arc surface 111, transmission port 12, transmission assembly 2, drive wheel 21, round hole 211, mounting hole 212, gear structure 213, slide bar 22, slider 23, connecting part 231, bearing 24, connecting column 25, rolling assembly 26, roller 261, arc groove 262, clamping part 3, clamping part 31, abutment groove 311, support part 32, support surface 321, driver 4, controller 5. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application. Unless otherwise defined, the technical or scientific terms used herein should have the ordinary meaning understood by those skilled in the art to which this application pertains. The terms "comprising" and similar expressions used herein mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, but does not exclude other elements or objects. Unless otherwise specified, the term "connection" as used herein can refer to a direct connection or an indirect connection, i.e., a connection through an intermediate object.

[0021] Furthermore, it should be understood that the orientations or positional relationships indicated by terms such as "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer" in this document are based on the orientations or positional relationships shown in the accompanying drawings and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. The terms "first" and "second" in this document are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "multiple" means two or more.

[0022] To address the problems existing in the prior art, embodiments of this application provide a wafer clamping device, with reference to... Figure 1 As shown, the device includes a cavity 1, a transmission assembly 2, a clamping member 3, and a driver 4. A circular through-hole 11 is formed in the central region of the top of the cavity 1, connecting the interior of the cavity 1 to the outside. A transfer port 12 is formed on the side wall of the cavity 1 for transferring wafers. The transmission assembly 2 is movably disposed within the cavity 1. At least three clamping members 3 are connected to the transmission assembly 2 and are spaced apart around the periphery of the through-hole 11, with each clamping member 3 equidistant from the axis of the through-hole 11. The driver 4 is connected to the transmission assembly 2 and drives the transmission assembly 2 to move, thereby causing the clamping members 3 to clamp the wafer.

[0023] In this embodiment, when the wafer clamping device is installed in the process cavity, the through-hole 11 on the cavity 1 can be used as the mounting and positioning reference to ensure the accuracy of subsequent process processing. Specifically, when the mechanical gripper picks up the wafer and transfers it into the cavity 1 through the transfer port 12, the driver 4 drives the transmission assembly 2 to move, thereby causing all the clamping members 3 to clamp the wafer simultaneously. Since the initial position of each clamping member 3 is equidistant from the axis of the through-hole 11, and all the clamping members 3 are driven by the driver 4 to clamp the wafer synchronously, the center of the wafer is aligned with the center of the through-hole 11 after clamping and fixing, ensuring accurate wafer positioning. More importantly, this method can adapt to clamping and fixing wafers of different sizes and maintain alignment.

[0024] refer to Figure 1 and Figure 2 As shown, in some embodiments, the sidewall of the clamping member 3 has a clamping portion 31 and a protruding support portion 32. The clamping member 3 is generally disc-shaped, the clamping portion 31 is located in the middle region of the sidewall of the clamping member 3, the support portion 32 protrudes from the lower half of the sidewall of the clamping member 3 and extends toward the axial direction of the through hole 11, and the upper surface of the support portion 32 is a support surface 321, which is used to support the wafer.

[0025] In operation, the driver 4 drives the transmission assembly 2 to move, thereby bringing the clamping members 3 closer together to a first preset position. When the mechanical gripper picks up the wafer and transports it into the cavity 1 through the transmission port 12, and places the wafer on the support part 32, the driver 4 drives the transmission assembly 2 to move, thereby bringing the clamping members 3 closer together to a second preset position, thus completing the clamping and fixing of the wafer.

[0026] When the clamping member 3 is in the first preset position, the diameter of the circular area formed by at least three of the support portions 32 is smaller than the diameter of the wafer, and the diameter of the circular area formed by at least three of the clamping portions 31 is larger than the diameter of the wafer. At this time, the upper surfaces of all the support portions 32 cooperate to form a support platform for supporting the wafer. When the clamping member 3 is in the second preset position, all the clamping portions 31 abut against the sidewalls of the wafer from various directions, thereby completing the clamping and fixing of the wafer and keeping the wafer aligned with the through hole 11.

[0027] In this embodiment, the cooperation method between the transmission component 2 and the driver 4 is not specifically limited, as long as all the clamping members 3 provided on the transmission component 2 can clamp the wafer simultaneously.

[0028] refer to Figures 1 to 3 As shown, in some embodiments, the transmission assembly 2 includes a drive wheel 21, a slide bar 22, and a slider 23. The plane containing the drive wheel 21 is parallel to the plane containing the top of the cavity 1. The drive wheel 21 is rotatably disposed within the cavity 1, and a circular hole 211 is formed in the drive wheel 21 corresponding to the through hole 11, the circular hole 211 exposing the clamping member 3. The driver 4 is connected to the drive wheel 21 and is used to drive the drive wheel 21 to rotate. At least three slide bars 22 are evenly spaced around the edge of the support platform. One end of each slide bar 22 is rotatably connected to the cavity 1, and the other end is connected to a corresponding clamping member 3. Each slide bar 22 has a slider 23 slidably fitted on it. The slider 23 has a connecting portion 231, which is rotatably connected to the drive wheel 21.

[0029] In this embodiment, the driver 4 is a motor, and a drive gear is provided on the drive end of the motor, that is, the drive gear is the drive part of the driver 4. The edge sidewall of the drive wheel 21 is provided with a gear structure 213, which meshes with the drive gear. Therefore, when the driver 4 is started to rotate the drive gear, it will drive the drive wheel 21 to rotate. During the rotation of the drive wheel 21, it will apply a force to each slide bar 22 through the slider 23, so that the slide bar 22 rotates with one end as the rotation center, thereby driving the clamping member 3 on each slide bar 22 to move synchronously towards the wafer direction to support and clamp the wafer.

[0030] It is understood that, through the cooperation of the drive wheel 21, the slide bar 22 and the slider 23, this embodiment enables all the clamping components 3 to move using only one driver 4. Most importantly, it ensures the synchronicity of the movement of all the clamping components 3, thereby ensuring the reliability of the wafer clamping device of this application in aligning and calibrating the wafer during the wafer clamping process.

[0031] In some embodiments, the slider 23 is provided with a sliding sleeve, which is fitted onto the slide rod 22 so that the slider 23 and the slide rod 22 are slidably connected.

[0032] In some embodiments, the driver 4 can be a telescopic cylinder, and each driver 4 has a sliding rod 22 connected to its driving end. The other end of the sliding rod 22 is connected to the clamping member 3. By simultaneously driving all the drivers 4 to drive all the clamping members 3 to clamp the wafer synchronously, the desired effect of this application can also be achieved. However, compared to the above embodiments where a single driver 4 can synchronously drive all the clamping members 3 to clamp the wafer, the solution provided in this embodiment is more expensive and requires time to calibrate and verify whether all the drivers 4 operate consistently.

[0033] refer to Figures 1 to 3 As shown, in some embodiments, the transmission assembly 2 further includes a bearing 24. At least three mounting holes 212 are evenly distributed along the contour of the drive wheel 21, and the bearing 24 is fixedly installed in each mounting hole 212. The slider 23 is located below the drive wheel 21, and the connecting portion 231 passes through the inner ring of the bearing 24 and is fixedly connected to the bearing 24.

[0034] In this embodiment, the slider 23 is rotatably connected to the drive wheel 21 via a bearing 24, and a plurality of sliding rods 22 cooperate with the slider 23 to support the drive wheel 21 and allow the drive wheel 21 to rotate within the cavity 1.

[0035] In some embodiments, the transmission assembly 2 further includes at least three connecting posts 25. The connecting posts 25 are located inside the cavity 1, one end of the connecting post 25 is connected to the top of the cavity 1, and the other end of the connecting post 25 is rotatably connected to one end of a corresponding slide rod 22. The connecting posts 25 cause the slide rod 22 to extend horizontally and ensure that all the support portions 32 are located in the same horizontal plane.

[0036] In this embodiment, the connecting post 25 is a cylindrical structure, perpendicular to the inner top wall of the cavity 1 and fixedly connected to it. The other end of the connecting post 25 can be connected to one end of the slide rod 22 via a bearing 24, allowing the slide rod 22 to rotate while extending horizontally, and ensuring that the support surfaces 321 of all the support parts 32 are located in the same horizontal plane. The slide rod 22, in conjunction with the slider 23, supports the drive wheel 21 and allows it to rotate.

[0037] It should be noted that in the above embodiments, the number of clamping members 3, sliders 23, slide rods 22, and connecting posts 25 are all the same. Preferably, there are three clamping members 3, sliders 23, slide rods 22, and connecting posts 25.

[0038] refer to Figures 1 to 4 As shown, in some embodiments, the transmission assembly 2 further includes rolling assemblies 26. A plurality of rolling assemblies 26 are located on the side away from the slider 23, spaced apart along the contour of the drive wheel 21, and fixedly connected to the drive wheel 21. Each rolling assembly 26 includes a rotatable roller 261 that abuts against the edge of the circular hole 211.

[0039] In this embodiment, the through hole 11 can expose the outline of the inner part of the drive wheel 21. A plurality of the rolling components 26 are disposed on the exposed outline of the drive wheel 21 so that the roller 261 abuts against the edge of the circular hole 211. This design can keep the drive wheel 21 stable during rotation and avoid vibration, thereby ensuring the reliability of wafer clamping and alignment.

[0040] In some embodiments, the edge of the through hole 11 is provided with an arc surface 111, which is arranged circumferentially around the through hole 11. The outer side wall of the roller 261 is provided with an annular arc groove 262, which is adapted to the arc surface 111.

[0041] In this embodiment, by providing an arc surface 111 at the edge of the through hole 11 and an annular arc groove 262 on the outer side wall of the roller 261, the smoothness of the roller 261 rolling along the edge of the circular hole 211 is further ensured, thereby improving the stability of the drive wheel 21 during rotation.

[0042] In some embodiments, the wafer clamping device further includes a controller 5 electrically connected to the driver 4. The controller 5 has a plurality of preset control programs, each control program corresponding to a wafer of a certain size, and each wafer having a corresponding first preset position and a second preset position. In operation, the control program is switched according to the wafer size to clamp and fix wafers of different sizes.

[0043] It should be noted that there are currently multiple wafer sizes on the market, such as 2 inches, 4 inches, 6 inches, 8 inches and 12 inches. Therefore, the controller 5 will set the corresponding control program according to the size of different wafers.

[0044] For example, the 8-inch wafer corresponds to the fourth control program. Since the diameter of an 8-inch wafer is 203.2 mm, when the controller 5 implements the fourth control program, the driver 4 drives the transmission assembly 2 to move, causing the clamping members 3 to move closer to each other to a first preset position. At this time, the diameter of the circular area formed by all the support parts 32 is less than 203.2 mm, and the diameter of the circular area formed by the clamping parts 31 is greater than 203.2 mm, so that the support surface 321 of all the support parts 32 can cooperate to form a support platform that can support the wafer. When the mechanical gripper picks up the wafer and enters the cavity through the transfer port 12, the wafer can be placed on the support platform. Then the mechanical gripper is withdrawn from the cavity, and the driver 4 drives the transmission assembly 2 to move, causing the clamping members 3 to move closer to each other to a second preset position.

[0045] In this embodiment, by adopting the above-described control method, wafers of different sizes are clamped and fixed, which greatly improves the applicability of the wafer clamping device of this application.

[0046] In some embodiments, the clamping part 31 is provided with an abutment groove 311, and the width of the abutment groove 311 is greater than the thickness of the wafer. The abutment groove 311 is used to abut the edge of the wafer.

[0047] In this embodiment, the clamping member 3 is generally disc-shaped, and the abutment groove 311 is located in the middle region of the edge of the clamping member 3. Since the width of the abutment groove 311 is greater than the thickness of the wafer, when the clamping member 3 clamps the wafer, the edge of the wafer will enter the abutment groove 311 and contact the abutment groove 311.

[0048] Furthermore, a pressure sensor (not shown in the figure) is embedded in the abutment groove 311. The pressure sensor is used to detect the abutment force F of the clamping member 3 on the edge of the wafer.

[0049] In this embodiment, both the pressure sensor and the driver 4 are electrically connected to the controller 5. The controller 5 stores a pressure safety threshold A for applying force to the wafer. The controller 5 controls the driver 4 to operate so that the clamping member 3 clamps the wafer. When the pressure sensor detects that the contact force F on the edge of the wafer reaches the pressure safety threshold A, the controller 5 controls the driver 4 to stop operating.

[0050] Specifically, the controller 5 stores different pressure safety thresholds A. For example, when clamping a 2-inch wafer, the pressure safety threshold A ranges from 3 to 5 N. When clamping a 4-inch wafer, the pressure safety threshold A ranges from 4 to 6 N. When clamping a 6-inch wafer, the pressure safety threshold A ranges from 8 to 10 N. When clamping an 8-inch wafer, the pressure safety threshold A ranges from 10 to 12 N. When clamping a 12-inch wafer, the pressure safety threshold A ranges from 12 to 15 N.

[0051] In some embodiments, the controller 5 includes a first drive control program, a second drive control program, and a stop program. In the first drive control program, the range of the contact force F detected by the pressure sensor is 0 < F ≤ 0.8 A, and the voltage supplied by the controller 5 to the driver 4 is U. In the second drive control program, the range of the contact force F detected by the pressure sensor is 0.8 A < F < A, and the range of the voltage supplied by the controller 5 to the driver 4 is 0.2 U - 0.5 U. When the contact force F detected by the pressure sensor equals A, the controller 5 initiates the stop program, and the controller 5 controls the driver 4 to immediately stop operating.

[0052] In this embodiment, when the clamping part 31 contacts the edge of the wafer, the controller 5 adopts the above-mentioned segmented control method, which can realize graded and precise adjustment of the driving voltage according to the magnitude of the contact force F detected and fed back by the pressure sensor in real time. This effectively balances the efficiency and control accuracy of wafer clamping operations, while also having a complete safety protection system, significantly improving the reliability of device operation and the safety of wafer clamping.

[0053] Understandably, when the contact force F is between 0 and 0.8A, the controller 5 outputs a full voltage U to drive the driver 4, ensuring that the clamping component 3 responds quickly and feeds efficiently, significantly shortening the clamping cycle time and meeting the high-efficiency operation requirements of automated production scenarios. When the contact force F enters the near-threshold range of 0.8A < F < A, the controller 5 automatically adjusts the driving voltage to a low voltage range of 0.2U-0.5U, allowing the clamping component 3 to decelerate smoothly and feed, effectively reducing motion overshoot and mechanical impact caused by mechanical inertia, thus preventing damage and cracking of the wafer due to excessive clamping force.

[0054] When the clamping force F reaches the set threshold A, the controller 5 immediately starts the stop program and controls the driver 4 to stop running immediately. This can effectively avoid damage to the workpiece such as hidden cracks, chipping, and deformation caused by excessive clamping force. It is especially suitable for clamping and transferring brittle and fragile workpieces such as wafers.

[0055] Furthermore, this segmented control logic features a complete closed loop, from normal, efficient operation and deceleration buffer warning to extreme shutdown protection. Even if the device experiences structural jamming or control deviations during operation, it can stop in time before reaching dangerous pressure, preventing wafer scrapping and hardware damage within the wafer clamping device, thus extending the device's lifespan. Simultaneously, the entire control logic can complete voltage switching and action control through simple numerical range judgments, eliminating the need for complex algorithms. This reduces the computational load on the controller 5, facilitating hardware integration and program debugging, and enabling mass production of the wafer clamping device provided in this application.

[0056] The above description is merely a specific implementation of the embodiments of this application, but the protection scope of the embodiments of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in the embodiments of this application should be covered within the protection scope of the embodiments of this application. Therefore, the protection scope of the embodiments of this application should be determined by the protection scope of the claims.

Claims

1. A wafer clamping device, characterized in that, include: The cavity has a through hole at the top and a transmission port on its side wall. The transmission assembly is movably disposed within the cavity; A clamping member is connected to the transmission assembly. The number of the clamping members is at least three and they are spaced apart around the periphery of the through hole. Each clamping member is equidistant from the axis of the through hole. A driver, connected to the transmission assembly, is used to drive the transmission assembly to move so as to cause the clamping member to clamp the wafer.

2. The wafer clamping device according to claim 1, characterized in that, The sidewall of the clamping member has a clamping portion and a protruding support portion; In operation, the driver drives the transmission assembly to move, thereby bringing the clamping members closer together to a first preset position; after the wafer is placed on the support, the driver drives the transmission assembly to move, thereby bringing the clamping members closer together to a second preset position. When the clamping member is located in the first preset position, the diameter of the circular area formed by at least three of the supporting parts is smaller than the diameter of the wafer, and the diameter of the circular area formed by at least three of the clamping parts is larger than the diameter of the wafer. When the clamping member is located in the second preset position, the clamping part abuts against the sidewall of the wafer.

3. The wafer clamping device according to claim 2, characterized in that, The transmission assembly includes a drive wheel, a slide bar, and a slider; The drive wheel is rotatably disposed in the cavity, and the drive wheel has a circular hole corresponding to the through hole; The driver is connected to the drive wheel and is used to drive the drive wheel to rotate; At least three slide rods are spaced apart around the edge of the support platform. One end of each slide rod is rotatably connected to the cavity, and the other end of each slide rod is connected to a corresponding clamping member. Each slide rod is slidably fitted with a slider. The slider has a connecting part, which is rotatably connected to the drive wheel.

4. The wafer clamping device according to claim 3, characterized in that, The transmission assembly also includes bearings; The drive wheel has at least three mounting holes along its outline, and the bearing is fixedly installed in each of the mounting holes; The slider is located at the bottom of the drive wheel, and the connecting part passes through the inner ring of the bearing and is fixedly connected to the bearing.

5. The wafer clamping device according to claim 3, characterized in that, The transmission assembly also includes at least three connecting posts; The connecting post is located inside the cavity. One end of the connecting post is connected to the top of the cavity, and the other end of the connecting post is rotatably connected to one end of a corresponding slide rod. The connecting post causes the slide rod to extend horizontally and makes all the supporting parts lie in the same horizontal plane.

6. The wafer clamping device according to claim 3, characterized in that, The transmission assembly further includes rolling components, a plurality of which are located on the side away from the slider, are spaced apart along the contour of the drive wheel, and are fixedly connected to the drive wheel; The rolling assembly includes a rotatable roller that abuts against the edge of the circular hole.

7. The wafer clamping device according to claim 6, characterized in that, The edge of the through hole is provided with an arc surface, and the arc surface is arranged in a ring around the circumference of the through hole; The outer wall of the roller is provided with an annular arc groove, which is adapted to the arc surface.

8. The wafer clamping device according to claim 2, characterized in that, It also includes a controller electrically connected to the driver, the controller having a plurality of preset control programs, each control program corresponding to a wafer of a certain size, and each wafer corresponding to a first preset position and a second preset position; In operation, the control program is switched according to the wafer size to clamp and fix wafers of different sizes.

9. The wafer clamping device according to claim 8, characterized in that, The controller stores a pressure safety threshold A. A pressure sensor is provided inside the clamping part, and the pressure sensor is electrically connected to the controller. The pressure sensor is used to detect the abutting force F applied by the clamping part to the wafer. When the controller controls the drive to operate until the pressure sensor detects that the contact force F is equal to the pressure safety threshold A, the controller controls the drive to stop operating.

10. The wafer clamping device according to claim 9, characterized in that, The clamping part is provided with an abutment groove, and the width of the abutment groove is greater than the thickness of the wafer. The abutment groove is used to abut the edge of the wafer. The pressure sensor is embedded in the abutment groove.

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