Wearable band structure with flexible printed circuit strain relief integration and systems and methods of use thereof

Abstract

A wearable band structure is described that includes a flexible printed circuit layer and a strain relief layer. The flexible printed circuit layer is located within the wearable structure and is configured to be coupled with one or more biopotential signal processing components along a coupled length of the flexible printed circuit layer. The strain relief layer is coupled with a portion of the flexible printed circuit layer such that the strain relief layer spans the coupled length of the flexible printed circuit layer. Strain applied to the wearable structure is relieved by the strain relief layer such that the strain is not transmitted to the one or more biopotential signal processing components.

Description

Cross-references to related applications

[0001] This application claims priority to U.S. Provisional Patent Application No. 63 / 626,511, filed January 29, 2024, entitled “A Wearable Band Structure with Flexible Printed Circuit Strain-Relief Integration, and Systems and Methods of Use Thereof,” and U.S. Non-Provisional Patent Application No. 19 / 000,546, filed December 23, 2024. Technical Field

[0002] This disclosure generally relates to wearable electronic devices (e.g., wrist-worn wearable devices), and more specifically to wearable electronic devices having a band portion including one or more flexible printed circuits and electronic components (e.g., components for detecting and / or at least partially processing a user's bioelectric potential signals). Background Technology

[0003] Traditional conductive materials possess inherent stiffness, posing challenges for their application in wearable devices, such as wrist-worn devices, which are subjected to continuous strain and stress during use (e.g., dragging, pulling, and stretching of the wearable band). While flexible electronics, such as flexible printed circuit components, are suitable for wearable devices, their current implementations in wearable devices suffer from shortened lifespans due to continuous strain and stress. Therefore, innovations aimed at improving the strength and durability of flexible printed circuit components are needed when integrating them into wearable devices.

[0004] Existing technologies in this field are limited. Current solutions are typically bulky and require sacrifices in performance and reliability. Therefore, these solutions need to be compact and seamlessly adapt to the current shape elements of wrist-worn wearables without reducing system flexibility.

[0005] Therefore, it is necessary to address one or more of the challenges mentioned above. Summary of the Invention

[0006] The methods, systems, and devices disclosed herein overcome the aforementioned challenges by combining a proper balance of support, flexibility, and electronic integration into wearable devices.

[0007] To enhance the strength and durability of flexible printed circuit (PCB) assemblies in wearable devices, one solution could be to optimize the stacking of the wearable band. For example, in one or more embodiments, the wearable band may include a strain-relieving layer aligned along a neutral axis with the PCB assembly to unload stress, thereby limiting the bending radius and further protecting electronic components. Specifically, the strain-relieving layer (e.g., Vectran, Kevlar, or other polymers) can be integrated into the PCB assembly to improve its rigidity. Furthermore, the strain-relieving layer can be configured to couple with the PCB assembly such that strain and stress caused by dragging, pulling, and stretching on the wearable band can be transferred to the strain-relieving layer before reaching the PCB assembly. Integrating the strain-relieving layer into the PCB assembly also allows for compatibility with current shape elements of the wearable band and facilitates flexibility in sizing. Additionally, a modular approach can be used to achieve alternative configurations based on the same principle, where layers in the wearable band stack are laminated or formed on the exterior of a conventional PCB assembly.

[0008] According to a first aspect of this disclosure, a wearable structure is provided, comprising: a flexible printed circuit (FPC) layer located within the wearable structure, the FPC layer being configured to be coupled to one or more bioelectrical signal processing components along a coupling length of the FPC layer; and a strain relief layer coupled to a portion of the FPC layer such that the strain relief layer spans the coupling length of the FPC layer, wherein strain applied to the wearable structure is relieved by the strain relief layer such that strain is not transmitted to the one or more bioelectrical signal processing components.

[0009] In some embodiments, the torsional force applied to the wearable structure can be eliminated by a strain relief layer, so that the torsional force is not transmitted to one or more bioelectric signal processing components.

[0010] In some embodiments, the strain relief layer may be tensile-resistant, such that the FPC layer is not stretched when a tensile force is applied to the wearable structure.

[0011] In some embodiments, one or more biopotential signal processing components may be electrically coupled to one or more biopotential signal sensing electrodes.

[0012] In some embodiments, the FPC layer and the strain relief layer may be part of the FPC component.

[0013] In some embodiments, the strain relief layer may be coupled to the bottom surface of the FPC layer.

[0014] In some embodiments, the strain relief layer may be coupled between the traces of the FPC layer.

[0015] In some embodiments, the strain relief layer can reduce or eliminate the neutral axis deflection of the FPC layer.

[0016] In some embodiments, the strain relief layer may have a first length, and the FPC layer may have a second length, wherein the first length is greater than the second length.

[0017] In some embodiments, the strain relief layer may not be stretched.

[0018] In some embodiments, the strain relief layer may be formed of Vectran, Kevlar, or other polymers.

[0019] In some embodiments, the wearable structure may further include a metal layer coupled to the strain relief layer, the metal layer being configured to support the FPC layer and the strain relief layer.

[0020] In some embodiments, the wearable structure may further include an outer layer, which has at least an FPC layer, a strain relief layer and one or more biopotential signal processing components embedded in it.

[0021] In some embodiments, the wearable structure may be at least one of the following: a wrist wearable device; a head wearable device; or wearable clothing.

[0022] In some embodiments, the strain relief layer may have a predetermined thickness.

[0023] In some embodiments, the wearable structure can be configured to be coupled to the computing core; and the computing core can be configured to be communicatively coupled to the FPC layer.

[0024] According to a second aspect of this disclosure, a wearable electronic device is provided, comprising: one or more biopotential signal processing components; and a wearable structure including: a flexible printed circuit (FPC) layer located within the wearable structure, the FPC layer being configured to be coupled to one or more biopotential signal processing components along a coupling length of the FPC layer; and a strain relief layer coupled to a portion of the FPC layer such that the strain relief layer spans the coupling length of the FPC layer, wherein strain applied to the wearable structure is relieved by the strain relief layer such that strain is not transmitted to the one or more biopotential signal processing components.

[0025] In some embodiments, the torsional force applied to the wearable structure can be eliminated by a strain relief layer, so that the torsional force is not transmitted to one or more bioelectric signal processing components.

[0026] According to a third aspect of this disclosure, a method of manufacturing a wearable structure is provided, the method comprising: providing a wearable structure including a flexible printed circuit (FPC) and a strain relief layer, wherein: the FPC is within the wearable structure and configured to be coupled to one or more bioelectric signal processing components along a coupling length of the FPC layer; the strain relief layer is coupled to a portion of the FPC layer such that the strain relief layer spans the coupling length of the FPC layer, wherein strain applied to the wearable structure is relieved by the strain relief layer such that strain is not transmitted to the one or more bioelectric signal processing components.

[0027] In some embodiments, the torsional force applied to the wearable structure can be eliminated by a strain relief layer, so that the torsional force is not transmitted to one or more bioelectric signal processing components.

[0028] It will be appreciated that any feature described herein that is suitable for incorporation into one or more aspects or embodiments of this disclosure is intended to be generalizable in any and all aspects and embodiments of this disclosure. Other aspects of this disclosure will be understood by those skilled in the art based on the specification, claims, and drawings of this disclosure. The foregoing general description and the following detailed description are exemplary and illustrative only and are not intended to limit the scope of the claims.

[0029] The features and advantages described in the specification are not necessarily all-encompassing; in particular, certain additional features and advantages will be apparent to those skilled in the art from the drawings, specification, and claims. Furthermore, it should be noted that the language used in the specification has been chosen primarily for readability and instruction purposes.

[0030] Having summarized the examples above, a brief description of the accompanying figures will now be presented. Attached Figure Description

[0031] To better understand the various embodiments described, reference should be made to the following detailed description in conjunction with the accompanying drawings, in which the same reference numerals refer to corresponding parts throughout the drawings.

[0032] Figures 1A to 1C An example wearable device for sensing bioelectric potential signals at a user's skin, according to one or more embodiments of this disclosure, is shown.

[0033] Figure 2 A cross-sectional view of an example wearable device according to one or more embodiments of the present disclosure is shown.

[0034] Figures 3A to 3B Different views of the longitudinal portion of the strip portion according to one or more embodiments of the present disclosure are shown.

[0035] Figure 4 A cross-sectional view of an example receiving structure according to one or more embodiments of the present disclosure is shown.

[0036] Figures 5A to 5D A first example embodiment of a strap portion of a wearable device according to one or more embodiments of the present disclosure is shown.

[0037] Figures 6A to 6D A second example embodiment of a strap portion of a wearable device according to one or more embodiments of the present disclosure is shown.

[0038] Figure 7 Different flexible stacking embodiments according to one or more embodiments of the present disclosure are shown.

[0039] Figure 8 A third example strip portion of a wearable device according to one or more embodiments of the present disclosure is shown, comprising one or more layers.

[0040] Figures 9A to 9B A cross-sectional view of an integrated strain relief layer according to one or more embodiments of the present disclosure is shown.

[0041] Figure 10A An example strip portion of an external analog front end (AFE) of a wearable device according to one or more embodiments of the present disclosure is shown.

[0042] Figure 10B An AFE removed from a flexible printed circuit layer is shown according to one or more embodiments of this disclosure.

[0043] Figure 11 An alternative strap portion of a wearable device according to one or more embodiments of the present disclosure is shown.

[0044] Figure 12 A flowchart illustrating an example method for manufacturing a wearable structure for a wearable device according to one or more embodiments of this disclosure is shown.

[0045] Figure 13 An example artificial reality system according to one or more embodiments of the present disclosure is shown.

[0046] Figures 14A to 14B An example wrist-worn wearable device according to one or more embodiments of the present disclosure is shown.

[0047] By convention, the various features shown in the accompanying drawings may not be drawn to scale. Therefore, for clarity, the dimensions of the various features may be arbitrarily enlarged or reduced. Furthermore, some of these drawings may not depict all parts of a given system, method, or apparatus. Finally, the same reference numerals may be used to denote the same features throughout the specification and the drawings. Detailed Implementation

[0048] Numerous details are described herein to provide a thorough understanding of the exemplary embodiments illustrated in the accompanying drawings. However, some embodiments may be practiced without many of these specific details, and the scope of the claims is limited to those features and aspects specifically recited in the claims. Furthermore, a comprehensive and detailed description of well-known processes, components, and materials is unnecessary to obscure relevant aspects of the embodiments described herein.

[0049] Figures 1A to 1C An example wearable device 100 for sensing bioelectric potential signals at a user's skin, according to some embodiments, is shown. Figure 1A A perspective view of the wearable device 100 is shown. Figure 1B An exploded view of wearable device 100 is shown. Figure 1C A perspective cross-sectional view of a wearable device 100 is shown. The wearable device 100 may be a wrist-worn wearable device (e.g., a smartwatch, a strap) configured to be worn on the wrist of a user (e.g., a wearer). In some embodiments, the wearable device 100 may be an armband, headband, chest strap, and / or other devices that may be worn on the user's body.

[0050] like Figure 1A As shown, the wearable device 100 includes a band portion 102 and one or more bioelectric potential sensing structures 104. Each bioelectric potential sensing structure 104 is distributed along the length of the band portion 102 and configured to contact different portions of the user's skin. The band portion 102 includes one or more inner layers, such as a flexible printed circuit (FPC) layer 106, a strain relief layer 108, and an overmolded metal layer 110. In some embodiments, the one or more inner layers are coupled by adhesive layers. For example, in some embodiments, one or more adhesive layers (in...) Figure 1A (Not shown in the image) The strain relief layer 108 is coupled to one or more other inner layers.

[0051] Go to Figure 1B In some embodiments, the biopotential signal sensing structure 104 is configured to be coupled to the receiving structure 112. The receiving structure 112 may include an exposed portion configured to secure the biopotential signal sensing structure 104 to the wearable device 100 and to connect the biopotential signal sensing structure 104 to other components of the wearable device 100 (e.g., Figure 1A The FPC layer 106 shown is a communication coupling.

[0052] like Figure 1CAs shown, a perspective sectional view 114 of the wearable device 100 illustrates a cross-section AA along the transverse portion of the strap portion 102. The perspective sectional view 114 of the wearable device 100 shows one or more example inner layers of the wearable device 100. For example, as... Figure 1A As shown, one or more inner layers include an FPC layer 106, a strain relief layer 108, and an overmolded metal layer 110.

[0053] Figure 2 A cross-sectional view of an example wearable device 100 according to some embodiments is shown. The wearable device 100 includes an FPC 106, a strain relief layer 108, an adhesive layer 202, an overmolded metal layer 110, an analog front end (AFE) 204, a coupling portion 206 of a biopotential signal sensing structure 104, an edge support portion 216, and a receiving structure 112. The wearable device 100 also includes an overmolded component 210, a low-pressure molded component 212, a textile 214, and... Figure 2 Other components not listed in the diagram.

[0054] The strain relief layer 108 is coupled to the FPC 106 and / or the overmolded metal layer 110 via an adhesive layer 202. In some embodiments, the strain relief layer 108 is sandwiched between one or more adhesive layers 202. The FPC 106 is configured to be communicatively coupled to the AFE 204, the receiving structure 112, and other electronic components of the wearable device 100 (see below). Figure 14A and Figure 14B (Described). The receiving structure 112 is configured to be coupled to the biopotential signal sensing structure 104, such that the biopotential signal sensing structure 104 is electrically coupled to the FPC 106. Specifically, the receiving structure 112 is configured to be coupled to the coupling portion 206 of the biopotential signal sensing structure 104. In some embodiments, an edge support structure 216 is used for adhesion to the receiving structure 112. In some embodiments, molded structures (e.g., low-pressure molded parts 212 and textiles 214) are used to seal and / or encapsulate the stack of components, such as... Figure 1B As shown in the cross-sectional view. In some embodiments, textile 214 may be an elastomeric overmolded part.

[0055] The overmolded metal layer 110 is configured to at least support the FPC 106 and the strain relief layer 108. In some embodiments, the overmolded metal layer 106 includes one or more magnetic retaining portions and / or tabs. The one or more magnetic retaining portions and / or tabs are configured to couple to a buckle or other coupling mechanism that couples the wearable device 100 to a part of a user's body. Additionally, an overmolded band 210 is coupled to the overmolded metal layer 110.

[0056] Figures 3A to 3BDifferent views of the longitudinal portion of the strip portion 102 according to some embodiments are shown. Figure 3A An example cross-sectional view 300 is shown along the longitudinal portion of the strip 102. Figure 3B A cross-sectional view 300 is shown along the longitudinal portion of the strip portion 102, which includes strain-relief layers of varying thicknesses.

[0057] Figure 3A The above reference is shown. Figure 1A An example of a wearable device 100 is described. Specifically, Figure 3A A perspective sectional view 300 of a receiving structure 112 cut along the longitudinal portion of the strip 102 is shown. Perspective sectional view 300 includes a strain relief layer 354, an FPC pad layer 352, an adhesive layer 356, electrode fixing devices 302 (e.g., a first electrode fixing device 302-1 and a second electrode fixing device 302-2), and bridging FPC portions 310 of the FPC pad layer 352. Although not shown, in some embodiments, the bridging strain relief layer is a continuous portion of the strain relief layer 354 that uniformly connects the portions of the strain relief layer 354. In some embodiments, the FPC layer includes one or more FPC pad layers 352 and one or more FPC bridging portions 310.

[0058] As shown in perspective sectional view 300, the FPC pad layer 352 is coupled to the strain relief layer 354. The FPC pad layer 352 is further coupled to the electrode holder 302 via an adhesive layer 356. The length of the bridging FPC portion 310 (e.g., the inter-channel length) is greater than the distance between the edges of the first electrode holder 302-1 and the second electrode holder 302-2, such that there is an additional length between the respective electrode holders to reduce strain (e.g., to provide additional relaxation so that the FPC layer is not stretched). For example, as shown in perspective sectional view 300, the length of the bridging FPC portion 310 is longer than the pad-to-pad distance 312 and the holder edge-to-holder edge distance 314. The pad-to-pad distance 312 is defined as the distance between the edges of the respective FPC pad layers 352 of two adjacent receiving structures 112 along the longitudinal portion of the strip portion 102. The fixture edge-to-fixture edge distance 314 is defined as the distance between the edges of two adjacent receiving structures 112 electrode fixtures 302 (e.g., first electrode fixture 302-1 and second electrode fixture 302-2) along the longitudinal portion of the strip portion 102. In some embodiments, the pad-to-pad distance 312 may be 5.00 mm, and the fixture edge-to-fixture edge distance 316 may be 4.88 mm, resulting in a fixture-to-nominal FPC edge distance 316 of 0.06 mm. In some embodiments, the fixture-to-nominal FPC edge distance 316 includes a fixture tolerance of 0.01 mm and an FPC edge tolerance of 0.05 mm. As those skilled in the art will recognize upon reading the description provided herein, the actual values ​​of the pad-to-pad distance 312, the fixture edge-to-fixture edge distance 314, and the fixture-to-nominal FPC edge distance 316 may vary depending on design specifications and manufacturing tolerances during the assembly process.

[0059] Figure 3B Different combinations of the length of the bridging FPC portion 310 and the thickness of the strain-relieving layer 354 are shown. Specifically, Figure 3BFive different embodiments are shown (e.g., a first sectional view of the longitudinal portion with portion 300a, a second sectional view of the longitudinal portion with portion 300b, a third sectional view of the longitudinal portion with portion 300c, a fourth sectional view of the longitudinal portion with portion 300d, and a fifth sectional view of the longitudinal portion with portion 300e), which include different bridging FPC portion 310 lengths (e.g., first bridging FPC portion 310a, second bridging FPC portion 310b, third bridging FPC portion 310c, fourth bridging FPC portion 310d, and fifth bridging FPC portion 310e) and strain relief layer 354 thicknesses (e.g., first strain relief layer 354a, second strain relief layer 354b, third strain relief layer 354c, fourth strain relief layer 354d, and fifth strain relief layer 354e). Specifically, each combination of the length of the bridging FPC portion 310 and the thickness of the strain relief layer 354 is associated with a corresponding flattening-to-bending length difference (delta) of the bridging FPC portion 310. The flattening-to-bending length difference of the bridging FPC portion 310 is expressed as the difference between the corresponding length of the bridging FPC portion 310 and the corresponding pad-to-pad distance 312.

[0060] Table 1 shows the quantitative relationship between the thickness of the strain relief layer 354 and the difference in flattening to bending length of the bridging FPC portion 310. As shown in Table 1 (shown below), the difference in flattening to bending length of the bridging FPC portion 310 decreases as the thickness of the strain relief layer 354 decreases (e.g., the thinner the strain relief layer 354, the smaller the range of variation in the length of the bridging FPC portion 310). Potential advantages of using a thinner strain relief layer include including a smaller overall band thickness while maintaining the durability of the wearable device, and reduced manufacturing costs due to the use of less material.

[0061]

[0062] Table 1 As shown in Table 1, the flattening-to-bending length difference of the bridging FPC portion 310 is based on the thickness of the strain-relieving layer 354, with a thinner strain-relieving layer 354 causing a lower flattening-to-bending length difference. For example, in a first cross-sectional view of the longitudinal portion of the strip portion 300a, the flattening-to-bending length difference of the first bridging FPC portion 310a is 0.0483 mm, while for a second cross-sectional view of the longitudinal portion of the strip portion 300b, the flattening-to-bending length difference is 0.0357 mm. In other words, a change of 0.05 mm in the thickness of the strain-relieving layer results in a corresponding change of 0.0126 mm in the flattening-to-bending length difference. The change in the flattening-to-bending length difference caused by the strain-relieving layer 354 can be used to design the strip portion 102 of the wearable device 100 based on the expected and / or predicted usage of the wearable device. Specifically, the difference in flattening to bending length of the bridging FPC portion 310 can be used to design wearable devices that position the electrode holder 302 in predetermined locations for specific use cases, such that the electrode holder 302 of the wearable device contacts the user's skin and captures reliable data. In some embodiments, when the wearable device is bent or stretched, the varying thicknesses of these strain-relieving layers 354 minimize the change in pad-to-pad distance 312. Furthermore, these strain-relieving layers are tensile-resistant (e.g., experiencing minimal stretching regardless of thickness).

[0063] Figure 4 A cross-sectional view of an example receiving structure according to some embodiments is shown. The cross-sectional view of the receiving structure illustrates different stacked embodiments (e.g., first stacked embodiment 400a, second stacked embodiment 400b, third stacked embodiment 400c, fourth stacked embodiment 400d, and fifth stacked embodiment 400e). The different stacked embodiments can be referenced above. Figures 1A to 1C The wearable device 100 described is used together. Each layered embodiment includes at least a textile 418 (e.g., or an elastomeric overmolded part), a buckle retaining mechanism 416 (e.g., as described above), and a fastener retaining mechanism 416. Figure 1A and Figure 2 The stacked structure includes an overmolded metal layer 110, an overmolded strip 414, a low-pressure molded part 412, one or more strain-relieving layers 424, one or more adhesive layers 426, an FPC layer 422, an electrode fixing device 402, and a reinforcement 428. The molded structure (e.g., the low-pressure molded part 412, the overmolded strip 414, and the textile 418) is used to seal and / or encapsulate one or more components of the stacked embodiment (e.g., the FPC layer 422, the snap-ring retaining mechanism 416, etc.). In some embodiments, the snap-ring retaining mechanism 416 includes one or more magnetic retaining portions and / or tabs.

[0064] Turning to the first laminated embodiment 400a, a strain-relieving layer 424 is disposed between at least two adhesive layers 426-2 and 426-3. The strain-relieving layer 424 and the FPC layer 422 are configured to be coupled to a reinforcement 428. Specifically, the FPC layer 422 is bent to accommodate the reinforcement 428. The electrode fixing device 402 is coupled to the FPC layer 422 via an adhesive layer 426-1. The first laminated embodiment 400a also includes an AFE 204 attached to the FPC layer 422.

[0065] In the second stacked embodiment 400b, the reinforcement 428 is positioned below the strain relief layer 424 and coupled to the overmolded strip 414 via adhesive layer 426-3. To accommodate this change, the strain relief layer 424 is configured to be coupled to the FPC layer 422 via adhesive layer 426-2, and the combined stack of the strain relief layer 424, adhesive layer 426-2, and FPC layer 422 is bent to accommodate the reinforcement 428. Similar to the first embodiment 400a, the electrode fixing device 402 is coupled to the FPC layer 422 via adhesive layer 426-1. The second stacked embodiment 400b externalizes the AFE 204 (e.g., externally coupled to a computer system communicatively coupled to the wearable device, such as computer system 1460). Figure 14A and Figure 14B This allows for mechanical structure optimization as described below. By externalizing AFE204, the second stack embodiment 400b allows for a reduction in the width of the reinforcement 428 and / or the width of the receiving structure, and improves compatibility with flexible electrodes and / or receivers. Furthermore, the second stack embodiment 400b improves reliability, such as the ability to place the FPC layer 422 on the neutral axis, and mitigates the reliability risks associated with surface-mount technology (SMT) components (e.g., AFE 204). References below... Figure 11 Further details on externalizing the AFE are provided. The second stacked embodiment 400b can be interchanged with the first stacked embodiment 400a (e.g., the first stacked embodiment 400a and / or the second stacked embodiment 400b can be used in the same wearable device architecture).

[0066] In the third stack embodiment 400c, the reinforcement 428 is disposed within the overmolded component 414 (e.g., beneath the different FPC layers 423 and strain relief layers 424). This allows the different FPC layers 423 and strain relief layers 424 to be planarized or substantially flat (e.g., without bending to accommodate one or more components of the third stack embodiment 400c). In some embodiments, the strain relief layer 424 of the third stack embodiment 400-3 is optional. Similar to the first stack embodiment 400a, the strain relief layer 424 of the third stack embodiment 400c is sandwiched between two adhesive layers 426-2 and 426-3, and the electrode fixing device 402 is coupled to the FPC layer 423 via adhesive layer 426-1. Additionally, similar to the second stack embodiment 400b, the third stack embodiment 400c externalizes the AFE 204 (e.g., externally coupled to a computer system communicatively coupled to the wearable device). The third stacked embodiment 400c provides the same benefits as the second stacked embodiment 400b described above. The third stacked embodiment 400c is not interchangeable with the first stacked embodiment 400a and the second stacked embodiment 400b.

[0067] In the fourth stack embodiment 400d, the thickness of the strip portion 102 (e.g., strip thickness 430) is reduced. To reduce the total strip thickness 430, the fourth stack embodiment 400d uses different reinforcements 429 and / or different buckle retaining mechanisms 417. Similar to the third stack embodiment 400c, the different reinforcements 429 are disposed within the strip overmolded member 414 (e.g., below the different FPC layers 423 and strain relief layer 424). Unlike the third stack embodiment 400c, the different buckle retaining mechanisms 417 are not disposed below the different reinforcements 429 (e.g., to reduce the total thickness of the fourth stack embodiment 400d). Furthermore, the different reinforcements 429 are molded into the strip overmolded member 414 and / or include magnetic elements (e.g., which, if positioned in this location, allow the buckle to couple with the different reinforcements 429). The fourth stack embodiment 400d may use the different FPC layers 423 described above with reference to the third stack embodiment 400c. In some embodiments, the tape thickness 430 can be optimized by varying the thickness of each layer shown in the fourth stack embodiment 400d. In some embodiments, the optimization of the tape thickness 430 conforms to design specifications and reliability requirements. Additionally, in some embodiments, the strain relief layer 424 in the fourth stack embodiment 400d is optional (e.g., it reduces the thickness, width, height, and / or other dimensions of the wearable device). The fourth stack embodiment 400d provides the same benefits as the second stack embodiment 400b and the third stack embodiment 400c described above. The fourth stack embodiment 400b is not interchangeable with the first stack embodiment 400b and the second stack embodiment 400c.

[0068] The fifth-layer embodiment 400e includes one or more features described above with reference to the first-layer embodiments 400a through the fourth-layer embodiments 400e. The fifth-layer embodiment 400e includes a strain-relieving sleeve (e.g., formed of a first strain-relieving layer 424-1 and a second strain-relieving layer 424-2). The strain-relieving sleeve is configured to wrap or enclose an FPC layer 422, which is coupled to the first strain-relieving layer 424-1 via a second adhesive layer 426-2 and to the second strain-relieving layer 424-2 via a fourth adhesive layer 426-4. The strain-relieving sleeve is also configured to be coupled to the electrode fixing device 402 and the reinforcement 428 via corresponding adhesive layers (e.g., the first adhesive layer 426-1 and the third adhesive layer 426-3, respectively). The strain-relieving sleeve is configured to improve the reliability, mechanical robustness, and durability of the wearable device. Furthermore, the fifth-layer embodiment 400e provides the same benefits as the second-layer embodiments 400b through the fourth-layer embodiments 400d described above.

[0069] Figures 5A to 5D A first example embodiment of a strap portion 501 of a wearable device 100 according to some embodiments is shown. The first example embodiment of the strap portion 501 and / or its components is referenced above. Figures 1A to 4 Examples of the strip portion 102 and its corresponding components are described. A first example embodiment of the strip portion 501 includes at least an elastomeric overmolded part 502, an overmolded metal layer 504, a first adhesive layer 506, a strain-relieving layer 508, a second adhesive layer 510, an FPC layer 512, one or more receiving structures 112, and one or more biopotential signal sensing structures 104 (coupled to the receiving structure 112). In some embodiments, each receiving structure 112 accommodates one or more AFEs and / or electrode fixation devices (e.g., configured to fix exposed portions of the biopotential signal sensing structures 104, as referenced above). Figure 1C The aforementioned). Alternatively, in some embodiments, the one or more AFEs are externalized to a computing system (e.g., a computer system communicatively coupled to the wearable device, such as computer system 1460); Figure 14A and Figure 14B In some embodiments, the first example embodiment with portion 501 uses textiles instead of elastomeric overmolded part 502.

[0070] Figure 5A An exploded view 500 of a first embodiment of the strap portion 501 of a wearable device 100 is shown. Specifically, Figure 5AExample alignments and orientations of one or more layers of a strip portion 501 according to some embodiments are shown. In a first example embodiment of the strip portion 501, the strain-relieving layer 508 is generally uniform (e.g., generally rectangular in shape) and extends to the length of the FPC layer 512 and / or the overmolded metal layer 504. In some embodiments, the strain-relieving layer 508 is configured to be coupled to the FPC layer 512 and / or the overmolded metal layer 504 via one or more adhesive layers (e.g., a second adhesive layer 510 and a first adhesive layer 506), respectively.

[0071] FPC layer 512 extends along the longitudinal portion of strip portion 102. FPC layer 512 includes one or more portions (e.g., generally elliptical portions) defining the outline of one or more receiving structures 112 and is configured to couple to one or more AFEs and / or electrode fixing devices. While one or more portions of FPC layer 512 are generally elliptical, these portions can be any other shape (e.g., circular, rectangular, etc.) or based on the shape of one or more receiving structures 112. As described above, FPC layer 512 is coupled to strain relief layer 508 via second adhesive layer 510. Furthermore, FPC layer 512 and second adhesive layer 510 have generally similar shapes and lengths.

[0072] One or more receiving structures 112 are configured to be coupled to one or more portions (e.g., generally elliptical portions) of the FPC layer 512. One or more receiving structures 112 are also configured to be coupled to one or more biopotential signal sensing structures 104.

[0073] The overmolded metal layer 504 extends along the longitudinal portion of the strip portion 102. Similar to the strain relief layer 508, the overmolded metal layer 504 is generally regular. For example, the overmolded metal layer 504 is generally rectangular. As described above, the overmolded metal layer 504 is coupled to the strain relief layer 508 via a first adhesive layer 506. The overmolded metal layer 504 and the first adhesive layer 506 have generally similar shapes. In some embodiments, the overmolded metal layer 504 includes one or more magnetic retainers or paramagnetic tabs for coupling with a fastening mechanism (not shown) of the strip portion 102. In this way, the overmolded metal layer 504 and the fastening mechanism allow a user to adjust the size of the wearable device 100.

[0074] An elastomeric overmolded part 502 (or textile) is disposed at least on an overmolded metal layer 504, a first adhesive layer 506, a strain-relieving layer 508, a second adhesive layer 510, and an FPC layer 512. The elastomeric overmolded part 502 is disposed around one or more receiving structures 112 to allow one or more bioelectric potential sensing structures 104 to be coupled to one or more receiving structures 112. The elastomeric overmolded part 502 is configured to protect the internal components of a band portion 102 and provides a surface that can contact the user's skin. In some embodiments, the elastomeric overmolded part 502 is a decorative elastomer or rubber band and is interchangeable with or used in conjunction with textiles.

[0075] Figure 5B A partial stack-up embodiment 520 with portion 501 is shown. The partial stack-up architecture 520 with portion 501 includes at least a strain relief layer 508 and an FPC layer 512 (e.g., as referenced above). Figure 5A As described above, the strain relief layer 508 is coupled to the strain relief layer 508 via a second adhesive layer 510, and one or more receiving structures 112. As described above, the strain relief layer 508 is generally regular (e.g., generally rectangular in shape) and extends along the length of the FPC layer 512, which includes one or more portions for coupling with one or more receiving structures 112. Figure 5B As shown, FPC layer 512 has an irregular width—one or more (elliptical) portions have a first width (w1), while the remaining FPC layer 512 has a second width (w2). The width of strain relief layer 508 is smaller than the first width w1 of FPC layer 512, but larger than the second width w2 of FPC layer 512. In some embodiments, the dimensions of strain relief layer 508 can vary depending on reliability requirements and other design specifications. In some embodiments, enhancing robustness and reliability may require customizing strain relief layer 508, which increases design complexity. For example, as... Figure 3B As shown, the requirement for a smaller overall band thickness necessitates the use of a thinner strain relief layer while maintaining the durability of the wearable device.

[0076] Figure 5C An additional portion stack structure 530 of the strip portion 501 is shown. The additional portion stack structure 530 shows the strip portion 501 further (e.g., via a first adhesive layer 506). Figure 5AThis is a partial stacked embodiment 520 coupled to the overmolded metal layer 504 (e.g., at least the strain relief layer 508, the FPC layer 512, and the receiving structure 112). The overmolded metal layer 504, the strain relief layer 508, and the first adhesive layer 506 have generally similar shapes (e.g., generally regular shapes). For example, the overmolded metal layer 504 is generally rectangular. The overmolded metal layer 506 has a width generally similar to the broadband width of the strain relief layer 508 and may extend beyond the length of the strain relief layer 508. In some embodiments, the dimensions of the overmolded layer 504 may vary depending on reliability requirements and other design specifications.

[0077] Figure 5D An elastomeric overmolded member 502 (forming an encapsulation stack 540 with a portion 501) disposed on an additional portion stack architecture 530 is shown. The elastomeric overmolded member 502 encapsulates at least a portion of an overmolded metal layer 504, a strain relief layer 508, an FPC layer 512, and one or more receiving structures 112. As described above, the elastomeric overmolded member 502 is disposed around one or more receiving structures 112 to allow one or more biopotential signal sensing structures 104 ( Figure 5A It is coupled to one or more receiving structures 112. The elastomeric overmolded part 502 is configured as an internal component of the protective band portion 501 and provides a surface that can be connected to the user's skin.

[0078] Figures 6A to 6D A second example embodiment of the strap portion 601 of a wearable device 100 according to some embodiments is shown. The second example embodiment of the strap portion 501 and / or its components is described above. Figures 1A to 4 Examples of the described strip portion 102 and its corresponding components. Similar to the first example embodiment of strip portion 501, a second example embodiment of strip portion 601 includes at least an elastomeric overmolded part 602, an overmolded metal layer 604, a first adhesive layer 606, a strain relief layer 608, a second adhesive layer 610, an FPC layer 512, one or more receiving structures 112, and one or more bioelectric potential signal sensing structures 104 (coupled to the receiving structure 112). Unlike the strain relief layer 508 of the first example embodiment of strip portion 501, the strain relief layer 608 of the second example embodiment of strip portion 601 is irregular. Similar to the first example embodiment of strip portion 501, in some embodiments, the AFE is housed within the receiving structure 112 or externally attached to a computing system (e.g., a computer system communicatively coupled to a wearable device, such as computer system 1460). Figure 14A and Figure 14B In some embodiments, the second example embodiment with portion 601 uses textiles instead of elastomeric overmolded part 602.

[0079] Figure 6A An exploded view 600 of a second example embodiment of the strap portion 601 of a wearable device 100 is shown. Specifically, Figure 6A Example alignments and orientations of one or more layers of strip portion 601 according to some embodiments are shown. Similar to a first example embodiment of strip portion 501, a second example embodiment of strip portion 601 has an FPC layer 612 extending along a longitudinal portion of strip portion 102. FPC layer 612 includes one or more portions (e.g., generally elliptical portions) defining a contour for coupling with one or more receiving structures 112, and these portions are configured to couple with one or more AFEs and / or electrode fixing devices. (Refer to above) Figures 5A to 5D As described above, one or more portions of the FPC layer 612 may include a shape based on the shape of one or more receiving structures 112. As mentioned above, the FPC layer 612 is coupled to the strain relief layer 608 via a second adhesive layer 610. Similarly, the FPC layer 612 and the second adhesive layer 610 have generally similar shapes and lengths.

[0080] Therefore, unlike the strain relief layer 508 of the first example embodiment with portion 501, the strain relief layer 608 is not regular and includes one or more portions (e.g., generally elliptical portions) that define the contour for the FPC layer 612. Similarly, the strain relief layer 608 extends the length of the FPC layer 612 and / or the overmolded metal layer 604. In other words, the strain relief layer 608 generally replicates or reproduces the contour and / or shape of the FPC layer 612. In some embodiments, the strain relief layer 608 is configured to be coupled to the FPC layer 612 and / or the overmolded metal layer 604 via one or more adhesive layers (e.g., a second adhesive layer 610 and a first adhesive layer 606), respectively.

[0081] The overmolded metal layer 604 extends along the longitudinal portion of the strip portion 102. As described above, the overmolded metal layer 604 is coupled to the strain relief layer 608 via a first adhesive layer 606. Unlike the first example embodiment of the strip portion 501, the overmolded metal layer 604 has a generally regular shape, while the first adhesive layer 606 has a shape generally similar to that of the strain relief layer 608 (e.g., the first adhesive layer 606 follows the contours of the strain relief layer 608 and / or the FPC layer 612). In some embodiments, the overmolded metal layer 604 includes one or more magnetic retainers or paramagnetic tabs for coupling with a fastening mechanism (not shown) of the strip portion 102. In this way, the overmolded metal layer 604 and the fastening mechanism allow a user to adjust the size of the wearable device 100.

[0082] Similar to the first example embodiment of the band portion 501, an elastomeric overmolded member 602 (or textile) is disposed at least on the overmolded metal layer 604, the first adhesive layer 606, the strain-relieving layer 608, the second adhesive layer 610, and the FPC layer 612. The elastomeric overmolded member 602 is disposed around one or more receiving structures 112 to allow one or more bioelectric potential sensing structures 104 to be coupled to one or more receiving structures 112. The elastomeric overmolded member 602 is configured to protect the internal components of the band portion 102 and provide a surface that can be contacted with a user's skin. In some embodiments, the elastomeric overmolded member 602 is a decorative elastomer or rubber band and is interchangeable with or used in conjunction with textiles.

[0083] Figure 6B A partially stacked embodiment 620 with portion 601 is shown. Similar to... Figure 5B The stacked architecture 520 shown, with portion 601, includes at least a strain relief layer 608 and an FPC layer 612 (e.g., as referenced above). Figure 6A The aforementioned layer 612 is coupled to the strain-relieving layer 508 via a second adhesive layer 610, and includes one or more receiving structures 112. The strain-relieving layer 608 includes one or more portions (e.g., generally elliptical portions) that replicate or substantially resemble the outline of the FPC layer 612. As described above, one or more portions of the FPC layer 612 delineate the shape of one or more receiving structures 112 and are configured to be coupled to one or more receiving structures 112. The FPC layer 612 may have the same shape as described above. Figure 5B The FPC layer 512 described has similar dimensions (e.g., FPC layer 612 and strain relief layer 608 may have different widths based on the location and size of the receiving structure 112).

[0084] Figure 6C An additional portion stack structure 630 of the strip portion 601 is shown. The additional portion stack structure 630 shows the strip portion 601 further (e.g., via a first adhesive layer 606). Figure 6AThis is a partially stacked embodiment 620 coupled to the overmolded metal layer 604 (e.g., at least the strain relief layer 608, the FPC layer 612, and the receiving structure 112). The overmolded metal layer 604 is generally regular, while the strain relief layer 608 and the first adhesive layer 506 have a profile generally similar to that of the FPC layer 612. For example, the width (w3) of the overmolded metal layer 604 is greater than the first width (w5) of the strain relief layer 608 and less than the second width (w4) of the strain relief layer 608. As described above, the first width (w5) and the second width (w4) of the strain relief layer 608 depend on the location and size of the receiving structure 112. In some embodiments, the overmolded metal layer 604 may extend beyond the length of the strain relief layer 608. In some embodiments, the dimensions of the overmolded layer 604 may vary depending on reliability requirements and other design specifications.

[0085] Figure 6D An elastomeric overmolded member 602 (forming an encapsulation stack 640 of the strip portion 601, which protects the internal components of the strip portion 601 and provides a surface that can connect with the user's skin) is shown disposed on the additional portion stack architecture 630, similar to Figure 5D The architecture is shown. The elastomeric overmolded member 602 at least encapsulates a portion of the overmolded metal layer 604, the strain relief layer 608, the FPC layer 612, and one or more receiving structures 112. As described above, the elastomeric overmolded member 602 is disposed around one or more receiving structures 112 to allow one or more bioelectric potential signal sensing structures 104 ( Figure 6A It is coupled to one or more receiving structures 112.

[0086] Figure 7 Different flexible stack-up embodiments according to some examples are shown. These different flexible stack-up embodiments can be related to the above references. Figures 1A to 6D Used with any wearable device and / or other components described. Figure 7 Top views of the first to sixth flexible laminated embodiments (e.g., 700a to 700f) are shown. Each flexible laminated embodiment includes at least one FPC layer 706 and at least one other layer for improving the reliability of the FPC layer 706.

[0087] The first flexible laminate embodiment 700a includes at least a strain-relieving layer 704-1 and an FPC layer 706-1, which are coupled by one or more adhesive layers, as referenced above. Figures 1A to 6D The first flexible laminate embodiment 700a, as discussed above, also includes an overmolded part 702 (which may be as described above). Figures 1A to 6DThe textile or elastomer overmolded part is coupled together. The FPC layer 706-1 may extend beyond the length of the strain relief layer 704-1. In some embodiments, the dimensions of the strain relief layer 704-1 and the FPC layer 706-1 may vary depending on reliability requirements and other design specifications.

[0088] The second flexible laminate embodiment 700b includes at least an FPC layer 706-1 and a package 708-1. One or more layers of the second flexible laminate embodiment 700b may be coupled to one or more adhesive layers as described above. The package 708-1 may be used in place of the strain-relieving layer 704-1. Alternatively, in some embodiments, the second flexible laminate embodiment 700b includes a strain-relieving layer 704-1 and a package 708-1. As shown in the second flexible laminate embodiment 700b, the FPC layer 706-1 is encapsulated by the package 708-1. The package 708-1 and the FPC layer 706-1 have generally similar shapes (e.g., rectangular and elliptical portions). In some embodiments, the package 708-1 is larger than the FPC layer 706-1, such that the FPC layer 706-1 is completely covered by the package 708-1. The second flexible laminate embodiment 700b may also include an overmolded band 702 to at least encapsulate the package 708-1 and the FPC layer 706-1. The second flexible laminate embodiment 700b is configured to reduce stress on the FPC layer 706-1. See below for reference. Figure 8 Additional details are provided for the second flexible laminate embodiment 700b. In some embodiments, the package 708b is a polymer or other material for sealing channels.

[0089] The third flexible laminate embodiment 700c includes at least an FPC layer 706-1 and a regularized package 708-2. The regularized package 708-2 is a generally regular shape (e.g., a generally rectangular shape). The regularized package 708-2 is larger than the package 708-1. The regularized package 708-2 establishes a rigid frame by encapsulating the FPC layer 706-1. The regularized package 708-2 can be used in place of the strain-relieving layer 704-1. Alternatively, in some embodiments, the third flexible laminate embodiment 700c also includes a strain-relieving layer 704-1. One or more layers of the third flexible laminate embodiment 700c can be coupled by one or more adhesive layers as described above. In the third flexible laminate embodiment 700c, a band overmolded member 702 is optional. The third flexible laminate embodiment 700c can be used to reduce the thickness of the band portion of a wearable device. The package 708-1 and the regularized package 708-2 are formed of similar materials.

[0090] The fourth flexible laminate embodiment 700d includes at least a strain-relieving layer 704-1 and a separated FPC layer 706-2, which are coupled by one or more adhesive layers. The separated FPC layer 706-2 is separated on one side of the strain-relieving layer 704-1. In some embodiments, the separated FPC layer 706-2 is coupled to a computer system (e.g., computer system 1460) via a single end. Figure 14A and Figure 14B By separating a portion of the FPC layer 706-2, less strain is transferred to the separated FPC layer 706-2. The fourth flexible laminate embodiment 700d includes a band overmolded member 702. In some embodiments, the dimensions of the strain-relieving layer 704-1 and the separated FPC layer 706-2 may vary depending on reliability requirements and other design specifications.

[0091] The fifth flexible laminate embodiment 700e and the sixth flexible laminate embodiment 700f include an integrated strain relief layer. Specifically, the fifth flexible laminate embodiment 700e integrates the first integrated strain relief layer 704-2 with the first single FPC layer 900a and the capping layer 710. Figure 9A The sixth flexible laminate embodiment 700f integrates the second integrated strain relief layer 704-3 with the second single FPC layer 900b and the capping layer 710. Figure 9B Both the fifth flexible laminate embodiment 700e and the sixth flexible laminate embodiment 700f form a single FPC assembly, as shown below. Figure 9A and Figure 9B The fifth flexible laminate embodiment 700e and the sixth flexible laminate embodiment 700f, as discussed below, optimize neutral axis alignment, improve compatibility of the laminate embodiments with other devices, and increase robustness and reliability. Figure 9A and Figure 9B Additional details are provided regarding the corresponding integrated strain relief layer and the corresponding single FPC layer. The fifth flexible laminate embodiment 700e and the sixth flexible laminate embodiment 700f also include an overmolded section 702.

[0092] Figure 8 One or more layers of a third example strip portion 800 of a wearable device 100 according to some embodiments are shown. The third example strip portion 800 includes the above references. Figure 7 The second flexible laminated embodiment 700b is described. The third example strip portion 800 includes at least a strain-relieving layer 803 (similar to the above reference). Figures 1A to 7The described strain relief layer), FPC layer 706-1, package 708-1 (which is formed of at least two layers, such as a first package layer 708-1a and a second package layer 708-1b), one or more package adhesive layers 802, one or more receiver adhesive layers 804, one or more receiver structures 112, one or more AFE 204, LDA 806, one or more biopotential signal sensing structures 104, and buckle retaining element 808 (e.g., similar to the above reference). Figures 1A to 7 The described overmolded metal layer, overmolded strip 702, and textile 810. In some embodiments, textile 810 may be interchangeable with an elastomeric overmolded strip. One or more receiving structures 112 are configured to couple to one or more AFE 204s.

[0093] The third example strip portion 800 of the wearable device 100 illustrates the formation of the wearable device 100. As shown in the third example strip portion 800 of the wearable device 100, the strain relief layer 803 is connected to the first adhesive layer (e.g., adhesive layers 506 and 606); Figure 5A and Figure 6A The first packaging layer 708-1a is coupled to the retaining element 808 (e.g., on the first surface of the strain relief layer 803). The first packaging layer 708-1a is connected via a second adhesive layer (e.g., adhesive layers 510 and 610). Figure 5A and Figure 6A The FPC layer 706-1 is coupled to the strain relief layer 803 (e.g., on the second surface of the strain relief layer 803 opposite to the first surface). The FPC layer 706-1 is coupled to the first packaging layer 708-1a via another adhesive layer (not shown).

[0094] As referenced above Figures 5A to 7 The FPC layer 706-1 includes one or more portions thereon coupled with a receiving structure 112. In some embodiments, prior to the coupling of the receiving structure 112 to these portions of the FPC layer 706-1, the AFE 204 is coupled to these portions of the FPC layer 706-1 via a bonding or other adhesive layer. Similarly, a corresponding packaging adhesive layer 802 may be disposed on the outer edge of these portions of the FPC layer 706-1, such that a second packaging layer 708-1b may be disposed on the FPC layer 706 and coupled to the first packaging layer 708-1a. When the first packaging layer 708-1a and the second packaging layer 708-1b are coupled, a package 708-1 encapsulating the FPC layer 706-1 is formed. In some embodiments, the second packaging layer 708-1b includes one or more cutouts that expose the AFE 204. The package (e.g., referenced above) Figure 7The described packages 708-1 and 708-2 are configured to increase flexibility or to separate the midspan flexible section from the belt section to facilitate a tunnel approach. Furthermore, assuming the package forms a sealed channel, the belt mold 702 may be optional.

[0095] After the package 708-1 is formed, a corresponding receiver adhesive layer 804 can be applied to various portions of the package 708-1 (e.g., the edge portion of the package 708-1 that outlines the receiver placement location). The receiver structure 112 is coupled to the package 708-1 via the corresponding receiver adhesive layer 804. As described above, the receiver structure 112 can receive and accommodate the AFE 204. The strain relief layer 803, the buckle retaining element 808, the package 708-1, the FPC layer 706-1, and various portions of the receiver structure 112 are encapsulated by the overmolded strip 702. In some embodiments, the textile is disposed on the strip mold 702. In some embodiments, LDA 806 can be applied to the receiver structure 112 before the bioelectric potential signal sensing structure 104 is coupled to the receiver structure 112. In some embodiments, LDA 806 is an adhesive or sealant.

[0096] Figures 9A to 9B A cross-sectional view of an integrated strain relief layer according to some embodiments is shown. Figure 9A A similar example to the fifth flexible laminate embodiment 700e is shown. Figure 7 The first integrated strain relief layer (e.g., the first single FPC layer 900). Figure 9B A similar example to the sixth flexible laminate embodiment 700f is shown. Figure 7 The second integrated strain relief layer (e.g., the second single FPC layer 950).

[0097] The first single FPC layer 900 includes a strain relief layer 704-2 embedded between conductive portions. Specifically, the strain relief layer 704-2 is embedded between a first set of copper traces 902a and a second set of copper traces 902b. The conductive portions and the strain relief layer 704-2 form a core region of the first single FPC layer 900. The core region is coupled between at least two capping layers 710. In particular, the core region is sandwiched between a first capping layer 710a and a second capping layer 710b. The at least two capping layers 710 provide electromagnetic interference (EMI) protection. In some embodiments, an adhesive layer 912 couples the at least two capping layers 710 to the core region.

[0098] A cross-sectional view along section AA of the lateral portion of the first single FPC layer 900 shows one or more layers of the first single FPC layer 900. A strain-relieving layer 704-2 is located at the center of the first single FPC layer 900. The strain-relieving layer 704-2 is disposed between at least two conductive portions. Each conductive portion includes a copper trace 902, a polyimide base layer 910, and a copper base layer 904. In some embodiments, at least two conductive portions are coupled to the strain-relieving layer 704-2 via one or more adhesive layers 912-3 and 912-4. The strain-relieving layer 704-2, the at least two conductive portions, and the one or more adhesive layers 912-3 and 912-4 define the lateral portion of the first single FPC layer 900.

[0099] A strain-relieving layer 704-2 and at least two conductive portions are disposed between at least two cover layers 710a and 710b. The strain-relieving layer 704-2, the at least two conductive portions, and the at least two cover layers 710a and 710b define the thickness of a first single FPC layer 900. Each cover layer 710 includes an EMI protection layer 906 (e.g., configured to shield against electromagnetic interference), a polyimide cover layer 908, and an adhesive layer 912 (e.g., 912-1 or 912-2). In some embodiments, the adhesive layer 912 of the cover layer 710 forms an adhesive layer (e.g., 912-3 and 912-4) between the strain-relieving layer 704-2 and the at least two conductive portions.

[0100] In some embodiments, each capping layer 710 has a thickness of about 50 μm (e.g., + / - 10 μm). Each layer in each capping layer 710 may have a corresponding thickness. For example, the EMI protection layer 906 may have a thickness of about 8 µm (e.g., + / - 2 µm), the polyimide capping layer 908 may have a thickness of about 12.5 µm (e.g., + / - 5 µm), and the adhesive layer 912 may have a thickness of about 12 µm (e.g., + / - 5 µm to 10 µm). The strain-relieving layers 704-2 and the conductive portions have a thickness of about 35 μm (e.g., + / - 5 μm). Each layer of the conductive portions may have a corresponding thickness. For example, the copper trace 902 may have a thickness of about 10 µm (e.g., + / - 3 µm), the polyimide base layer 910 may have a thickness of about 12 µm (e.g., + / - 3 µm), and the copper base layer 904 may have a thickness of about 10 µm (e.g., + / - 3 µm). As those skilled in the art will understand upon reading the description provided herein, the actual thickness of each layer may vary depending on design specifications and manufacturing tolerances during assembly.

[0101] The second single FPC layer 950 includes a strain relief layer 704-3 disposed between at least two capping layers 710 and different conductive portions disposed on the surface of the strain relief layer 704-3 (e.g., one side of the strain relief layer 704-3). The different conductive portions include a third set of copper traces 902c. The strain relief layer 704-3 and the conductive portions form different core regions of the second single FPC layer 950. As described above with reference to the first single FPC layer 900, the at least two capping layers 710 provide electromagnetic interference (EMI) protection. In some embodiments, an adhesive layer 912 couples the at least two capping layers 710 to the different core regions.

[0102] A cross-sectional view taken along the lateral portion of the second single FPC layer 950 (BB section) shows one or more layers of the second single FPC layer 950. A strain-relieving layer 704-3 is disposed on the second cover layer 710b and extends along the lateral portion of the second single FPC layer 950. Different conductive portions are disposed on the strain-relieving layer 704-3 (on a surface opposite to the surface coupled to the second cover layer 710b). The different conductive portions include at least a third set of copper traces 902c, a polyimide base layer 910, and a copper base layer 904. An additional adhesive layer 912-5 may be disposed between the different conductive portions and the strain-relieving layer 704-3 to couple the two layers. A first cover layer 710a is disposed on the different conductive portions.

[0103] The second single FPC layer 950 has a thickness approximately similar to that of the first single FPC layer 900. For example, the capping layer 710, the different conductive portions, the strain-relieving layers 704-3, and their respective individual layers have thicknesses similar to those described above. Figure 9A The layers are described as having the same thickness. The additional adhesive layer 912-5 has a thickness of approximately 12 μm (e.g., + / - 5 μm). As those skilled in the art will understand upon reading the description provided herein, the actual thickness of each layer may vary depending on design specifications and manufacturing tolerances during assembly.

[0104] Figure 10A A wearable device 1000 with an external AFE is illustrated according to some embodiments. The externally mounted wearable device 1000 removes the AFE from the middle band. Functions performed by the AFE are controlled by a computer system (e.g., computer system 1460). Figure 14A and Figure 14B ) Execution. The AFE is externally mounted wearable device 1000, similar to the above reference. Figure 8The third example described is the tape portion 800. For example, the externally mounted wearable device 1000 includes at least a strain relief layer 803, an FPC layer 706-1, one or more receiver adhesive layers 804, one or more receiver structures 112, an LDA 806, one or more bioelectric potential signal sensing structures 104, a buckle retaining element 808, a tape overmolded part 702, and a textile 810.

[0105] The externally mounted AFE in the wearable device 1000 reduces constraints and yield losses during overmolding due to AFE damage. Additionally, the externally mounted AFE allows the strain relief layer 803 to mate with the FPC layer 706-1 for further alignment of the neutral axis with the trace. Furthermore, the externally mounted AFE optimizes the bonding of the receiver to the TPSiV. The externally mounted AFE also allows for a flexible biopotential signal sensing structure 104. Moreover, by externalizing the AFE from the mid-band to the computing core, additional space becomes available in the portion below the biopotential signal sensing structure 104, further mitigating rigidity and intrusion caused by surface-mount technology components in the band portion.

[0106] Figure 10B This illustrates an AFE removed from an FPC layer according to some embodiments. A first example FPC layer portion 1040 is shown alongside FPC layer 1006 (similar to the above reference). Figures 1A to 10A One or more AFEs 204 are coupled to the described FPC layer. Due to the additional constraints imposed by the AFEs 204, additional reinforcements 1002-1 are required. Alternatively, by externalizing the AFEs 204, as shown in the second example FPC layer portion 1050, different reinforcements 1002-2 are required (e.g., reinforcements for the receiving structure mounting surface 1012).

[0107] Figure 11 An alternative strap portion of a wearable device according to some embodiments is shown. The alternative strap portion 1100 includes a microcoaxial cable assembly 1112 (e.g., one or more microcoaxial cables), one or more drain wires 1110, one or more termination elements 1104, one or more ground planes 1106, a low-pressure molded part 1108, and a strain relief layer 1102 (similar to the above references). Figure 1AThe system comprises a strain relief layer as shown in Figure 10, a retaining element 808, one or more biopotential signal sensing structures 104, a molding 702, and a textile 810. A microcoaxial cable assembly 1112 and a drain wire 1110 are disposed on the strain relief layer 1102 (e.g., on the same surface). The microcoaxial cable assembly 1112 and the drain wire 1110 are configured to be coupled to one or more termination elements 1104 and / or one or more ground planes 1106. Specifically, the microcoaxial cable 1112 can be terminated via a retaining plate and solder at the annular terminals of the termination element 1104. The shielding of the drain wire 1110 and / or the microcoaxial cable 1112 can be exposed and bundled at each support for common grounding. The microcoaxial cable assembly 1112, the drain wire 1110, the ground plane 1106, and the termination element 1104 are used in place of the FPC layer (see above reference). Figure 1A As shown in Figure 10), the micro coaxial cable assembly 1112 and the drain line 1110 are connected to the computer system (e.g., computer system 1460); Figure 14A and Figure 14B Communication coupling. The micro coaxial cable assembly 1112 is configured to reduce crosstalk, enhance robustness and flexibility, reduce signal loss, improve impedance matching, and improve miniaturization. Additionally, the low-voltage molding 1108 is configured for intrusion protection and joint strain relief.

[0108] The strain relief layer 1102, one or more biopotential signal sensing structures 104, the molded part 702, and the textile 810 are similar to those in the above reference. Figure 1A To the corresponding components shown in Figure 10.

[0109] Figure 12 A flowchart illustrating an example method for manufacturing a wearable structure for a wearable device according to some embodiments is shown. Specifically, Figure 12 The flowchart can be used to create the above reference. Figures 1A to 11 The wearable structure described in the embodiments. In some embodiments, the various operations of the methods described herein are interchangeable and / or optional, and the corresponding operations of each method are performed by any of the aforementioned devices, systems, or combinations of devices and / or systems. For convenience, the method operations will be described below as being performed by a particular component or a particular device, but in all embodiments this should not be construed as limiting the execution of the operations to a particular device.

[0110] Method 1200 includes: coupling (1202) an FPC layer to a wearable structure. The FPC layer is configured to be coupled to one or more bioelectric signal processing components along the coupling length of the FPC layer (e.g., a longitudinal portion of a band portion). Figures 1A to 11Examples of different embodiments of coupling locations for an FPC layer and one or more biopotential signal processing components are provided. Method 1200 includes coupling a strain relief layer to a portion of the FPC layer (1204) such that the strain relief layer spans the coupling length of the flexible printed circuit layer. For example, as referenced above... Figures 1A to 11 As shown and described, the strain relief layer extends along the longitudinal portion of the strip. In some embodiments, method 1200 includes coupling (1222) a metal layer to the strain relief layer. This metal layer is configured to support the FPC layer and the strain relief layer. In some embodiments, the metal layer serves as a retaining mechanism (e.g., a surface of a magnet that allows a user to adjust the size of the wearable structure). References above are at least... Figure 4 , Figure 5A , Figure 6A , Figure 8 , Figure 10A and Figure 11 Different examples of metal layers are provided (e.g., overmolded metal layers). Method 1200 also includes: coupling (1224) an outer layer that at least embeds an FPC layer, a strain relief layer, and one or more signal processing components. For example, as referenced above... Figures 1A to 11 As shown and described, textile and / or elastomer overmolded parts can cover one or more components of a wearable structure.

[0111] In some embodiments, the strain applied to the wearable structure can be eliminated by the strain relief layer (1206) so that the strain is not transmitted to one or more bioelectric signal processing components.

[0112] In some embodiments, the torsional force applied to the wearable structure can be eliminated by the strain relief layer (1208) so that the torsional force is not transmitted to one or more bioelectric signal processing components (e.g., AFE 204); Figure 2 ).

[0113] In some embodiments, the strain relief layer may be (1210) tensile-resistant, such that the FPC layer is not stretched when a tensile force is applied to the wearable structure.

[0114] In some embodiments, one or more biopotential signal processing components may be coupled with one or more biopotential signal sensing electrodes (e.g., biopotential signal sensing structure 104). Figure 1A Electrical coupling.

[0115] In some embodiments, the FPC layer and the strain relief layer may be part of the (1212) FPC component.

[0116] In some embodiments, the strain relief layer may be coupled (1214) to the bottom surface of the flexible printed circuit layer. For example, as described above at least in Figure 5A and Figure 6A As described above, the flexible printed circuit layer is disposed on the corresponding strain relief layer.

[0117] In some embodiments, the strain relief layer may be coupled (1216) between traces of the flexible printed circuit layer. For example, as Figure 9A As shown, the strain relief layer can be disposed between the first set of copper traces 902a and the second set of copper traces 902b.

[0118] In some embodiments, the strain relief layer can reduce (1218) or eliminate the neutral axis deflection of the FPC layer.

[0119] In some embodiments, the strain-relieving layer may have a first length (1220), and the FPC layer may have a second length, the first length being greater than the second length. (Refer to above) Figures 5A to 7 Different examples of flexible printed circuit layers and strain relief layers are provided.

[0120] In some embodiments, the strain relief layer may not be stretched.

[0121] In some embodiments, the strain relief layer may be formed of Vectran, Kevlar, or other polymers.

[0122] In some embodiments, the wearable structure may be at least one of the following: a wrist wearable device; a head wearable device; or wearable clothing.

[0123] In some embodiments, the strain relief layer may have a predetermined thickness.

[0124] In some embodiments, the wearable structure may be configured to be coupled to a computing core, and the computing core may be configured to be communicatively coupled to an FPC layer. The computing core is a computer system (e.g., computer system 1460). Figure 14A and Figure 14B ).

[0125] The devices described above, including systems, wrist-worn wearables, and headset devices, will be described in further detail below. The specific operations described above may occur due to specific hardware, which will be described in more detail below. The devices described below are not limiting, and features on these devices may be removed, or additional features may be added to them. Different devices may include one or more similar hardware components. For the sake of brevity, similar devices and components are described below. Any differences between the devices and components are described in their respective sections below.

[0126] As described herein, a processor (e.g., a central processing unit (CPU) or microcontroller unit (MCU)) is an electronic component responsible for executing instructions and controlling the operation of electronic devices (e.g., wrist-worn wearable device 1400, head-worn wearable device 1360, handheld intermediate processing device (HIPD) 1370, or other computer systems). Various types of processors exist that can be used interchangeably or are specifically required for the embodiments described herein. For example, a processor can be: (i) a general-purpose processor designed to perform a variety of tasks, such as running software applications, managing operating systems, and performing arithmetic and logical operations; (ii) a microcontroller designed for specific tasks, such as controlling electronic devices, sensors, and motors; (iii) a graphics processing unit (GPU) designed to accelerate the creation and rendering of images, videos, and animations (e.g., virtual reality animations such as 3D modeling); (iv) a field-programmable gate array (FPGA) that can be programmed and reconfigured and / or customized after manufacturing to perform specific tasks, such as signal processing, cryptography, and machine learning; and (v) a digital signal processor (DSP) designed to perform mathematical operations on signals such as audio, video, and radio waves. Those skilled in the art will understand that one or more processors of one or more electronic devices can be used in the various embodiments described herein.

[0127] As described herein, a controller is an electronic component that manages and coordinates the operation of other components within an electronic device (e.g., controlling inputs, processing data, and / or generating outputs). Examples of controllers may include: (i) microcontrollers, which include small, low-power controllers commonly used in embedded systems and Internet of Things (IoT) devices; (ii) programmable logic controllers (PLCs), which can be configured for use in industrial automation systems to control and monitor manufacturing processes; (iii) system-on-a-chip (SoC) controllers, which integrate multiple components such as processors, memory, input / output (I / O) interfaces, and other peripherals into a single chip; and / or DSPs. As described herein, a graphics module is a component or software module designed to handle graphics operations and / or processes, and may include hardware and / or software modules.

[0128] As described herein, memory refers to electronic components in a computer or electronic device that store data and instructions for access and operation by a processor. The devices described herein may include volatile memory and non-volatile memory. Examples of memory may include: (i) random access memory (RAM) (e.g., dynamic random access memory (DRAM), static random access memory (SRAM), double data rate RAM (DDR RAM) or other random access solid-state memory devices) configured to temporarily store data and instructions; (ii) read-only memory (ROM) (e.g., one or more portions of system firmware and / or a bootloader) configured to permanently store data and instructions; (iii) flash memory, disk storage devices, optical disc storage devices, or other non-volatile solid-state storage devices that may be configured to store data in electronic devices (e.g., universal serial bus (USB) drives, memory cards, and / or solid-state drives (SSDs)); and (iv) cache memory configured to temporarily store frequently accessed data and instructions. As described herein, storage may include structured data (e.g., Structured Query Language (SQL) databases, MongoDB databases, GraphQL data, or JSON data). Other examples of storage may include: (i) personal profile data, which includes user account data, user settings, and / or other user data stored by the user; (ii) sensor data detected by one or more sensors and / or otherwise acquired; (iii) media content data, which includes stored image data, audio data, and documents, etc.; (iv) application data, which may include data collected and / or otherwise acquired and stored during use of the application; and / or any other types of data described herein.

[0129] As described herein, the power system of an electronic device is configured to convert input power into a form that can be used to operate the device. The power system may include various components, including: (i) a power source, which may be an alternating current (AC) adapter power source or a direct current (DC) adapter power source; (ii) a charger input, which may be configured to use a wired and / or wireless connection (this charger input may be part of a peripheral interface, such as a USB, microUSB, near-field magnetic coupling, magnetic induction and magnetic resonance charging, and / or radio frequency (RF) charging); (iii) a power management integrated circuit configured to distribute power to the various components of the device and ensure that the device operates within safety limits (e.g., regulating voltage, controlling current, and / or managing heat dissipation); and / or (iv) a battery configured to store power to provide usable power to the components of one or more electronic devices.

[0130] As described herein, a peripheral interface is an electronic component (e.g., an electronic component of an electronic device) that allows the electronic device to communicate with other devices or peripheral devices and provides a means for inputting and outputting data and signals. Examples of peripheral interfaces may include: (i) a USB interface and / or a micro USB interface configured to connect a device to an electronic device; (ii) a Bluetooth interface configured to allow multiple devices to communicate with each other, including Bluetooth Low Energy (BLE); (iii) a near-field communication (NFC) interface configured as a short-range wireless interface for operations such as access control; (iv) a POGO pin, which may be a small spring-loaded pin configured to provide a charging interface; (v) a wireless charging interface; (vi) a global positioning system (GPS) interface; (vii) a Wi-Fi interface for providing connectivity between the device and a wireless network; and (viii) a sensor interface.

[0131] As described herein, a sensor is an electronic component (e.g., an electronic component located in and / or otherwise communicating electronically with an electronic device such as a wearable device) configured to detect physical and environmental changes and generate electrical signals. Examples of sensors may include: (i) imaging sensors (e.g., including one or more cameras disposed on a corresponding electronic device) for collecting imaging data; (ii) bioelectric potential sensors; (iii) inertial measurement units (e.g., IMUs) for detecting changes in, for example, angular rate, force, magnetic field, and / or acceleration; (iv) heart rate sensors for measuring a user's heart rate; (v) SpO2 sensors for measuring a user's blood oxygen saturation and / or other biometric data; (vi) capacitive sensors for detecting potential changes in the vicinity of a part of the user's body (e.g., a sensor-skin interface) and / or other devices or objects; and (vii) light sensors (e.g., time-of-flight (ToF) sensors, infrared sensors, or visible light sensors) and / or sensors for sensing data from the user or the user's environment. As described herein, biopotential signal sensing components are devices used to measure electrical activity within the body (e.g., biopotential signal sensors). Some types of biopotential signal sensors include: (i) electroencephalography (EEG) sensors configured to measure electrical activity in the brain to diagnose neurological disorders; (ii) electrocardiography (ECG or EKG) sensors configured to measure electrical activity in the heart to diagnose heart problems; (iii) electromyography (EMG) sensors configured to measure electrical activity in muscles and diagnose neuromuscular disorders; and (iv) electrooculography (EOG) sensors configured to measure electrical activity in eye muscles to detect eye movements and diagnose eye disorders.

[0132] As described herein, applications (e.g., software) stored in the memory of an electronic device include instructions stored in the memory. Examples of such applications include: (i) games; (ii) word processors; (iii) messaging applications; (iv) media streaming applications; (v) financial applications; (vi) calendars; (vii) clocks; (viii) web browsers; (ix) social media applications; (x) camera applications; (xi) web-based applications; (xii) health applications; (xiii) artificial reality (AR) applications; and / or any other applications that may be stored in memory. Applications may operate in conjunction with data and / or one or more components of a device or multiple devices that are communication-coupled to perform one or more operations and / or functions.

[0133] As described herein, the communication interface module may include hardware and / or software capable of data communication using any of the following: various custom or standard wireless protocols (e.g., IEEE 802.15.4, Wi-Fi, ZigBee, 6LoWPAN, Thread, Z-Wave, Bluetooth Smart, ISA100.11a, WirelessHART, or MiWi), custom or standard wired protocols (e.g., Ethernet or HomePlug), and / or any other suitable communication protocol, including those not yet developed as of the filing date of this application. A communication interface is a mechanism that enables different systems or devices to exchange information and data with each other, and may include hardware, software, or a combination of both. For example, a communication interface may refer to a physical connector and / or port on a device that enables communication with other devices (e.g., USB, Ethernet, HDMI, or Bluetooth). In some embodiments, a communication interface may refer to a software layer that enables different software programs to communicate with each other (e.g., an application programming interface (API), and protocols such as Hypertext Transfer Protocol (HTTP) and Transmission Control Protocol / Internet Protocol (TCP / IP)).

[0134] As described herein, a graphics module is a component or software module designed to handle graphics operations and / or processes, and may include hardware modules and / or software modules.

[0135] As described herein, a nontransitory computer-readable storage medium is a physical device or storage medium that can be used to store electronic data in a nontransitory form (e.g., such that the data is permanently stored until it is intentionally deleted or modified).

[0136] Figure 13An example artificial reality system according to some embodiments is shown. Figure 13 The AR system 1300 and a first example user interaction using a wrist wearable device 1400, a head wearable device (e.g., AR device 1360) and / or a handheld intermediary processing device (HIPD) 1370 are illustrated.

[0137] The following is for reference. Figures 14A to 14B Describes a wrist-worn wearable device 1400 and its components. The wrist-worn wearable device 1400, the head-worn wearable device, and / or the HIPD 1370 can be communicatively coupled via a network 1325 (e.g., cellular, near-field, Wi-Fi, personal area network, wireless LAN). Additionally, the wrist-worn wearable device 1400, the head-worn wearable device, and / or the HIPD 1370 can also be communicatively coupled via the network 1325 (e.g., cellular, near-field, Wi-Fi, personal area network, wireless LAN) to one or more servers 1330, one or more computers 1340 (e.g., laptops, computers, etc.), one or more mobile devices 1350 (e.g., smartphones, tablets), and / or other electronic devices.

[0138] Figure 13 The illustration shows a user 1402 wearing a wrist-worn wearable device 1400 and an AR device 1360, with a HIPD 1370 placed on the user's table. The wrist-worn wearable device 1400, AR device 1360, and HIPD 1370 facilitate the user's interaction with the AR environment. Specifically, as shown in the AR system 1400, the wrist-worn wearable device 1400, AR device 1360, and / or HIPD 1370 enable the presentation of one or more avatars 1304, digital representations 1306 of one or more contacts, and one or more virtual objects 1308. As described below, the user 1302 can interact with one or more avatars 1304, digital representations 1306 of one or more contacts, and one or more virtual objects 1308 through the wrist-worn wearable device 1400, AR device 1360, and / or HIPD 1370.

[0139] User 1302 may use any of the following to provide user input: wrist wearable device 1400, AR device 1360, and / or HIPD 1370. For example, user 1302 may perform one or more gestures to provide user input, which may be performed by wrist wearable device 1400 (e.g., using reference below). Figures 14A to 14BThe description refers to one or more EMG sensors and / or IMUs and / or detection by the AR device 1360 (e.g., using one or more image sensors or cameras). Alternatively or additionally, user 1302 may provide user input via one or more touch surfaces of the wrist wearable device 1400, AR device 1360, and / or HIPD 1370 and / or voice commands captured by the microphones of the wrist wearable device 1400, AR device 1360, and / or HIPD 1370. In some embodiments, the wrist wearable device 1400, AR device 1360, and / or HIPD 1370 includes a digital assistant for assisting the user in providing user input (e.g., completing a series of actions, recommending different actions or commands, providing reminders, confirming commands). In some embodiments, user 1302 may provide user input via one or more facial gestures and / or facial expressions. For example, the camera of the wrist wearable device 1400, AR device 1360, and / or HIPD 1370 may track the user 1302's eyes for navigating the user interface.

[0140] The wrist wearable device 1400, AR device 1360, and / or HIPD 1370 can operate individually or in combination to allow user 1302 to interact with the AR environment. In some embodiments, HIPD 1370 is configured to operate as a central hub or control center for the wrist wearable device 1400, AR device 1360, and / or another communication-coupled device. For example, user 1302 can provide input for interacting with the AR environment at any of the wrist wearable device 1400, AR device 1360, and / or HIPD 1370, and HIPD 1370 can identify one or more backend and frontend tasks to perform the requested interaction and issue instructions to perform the one or more backend and frontend tasks at the wrist wearable device 1400, AR device 1360, and / or HIPD 1370. In some embodiments, backend tasks are background processing tasks imperceptible to the user (e.g., rendering content, decompressing, compressing, etc.), while frontend tasks are user-perceptible, user-facing tasks (e.g., presenting information to the user, providing feedback to the user, etc.). HIPD 1370 can perform backend tasks and provide runtime data corresponding to the performed backend tasks to the wrist wearable device 1400 and / or AR device 1360, enabling the wrist wearable device 1400 and / or AR device 1360 to perform frontend tasks. Thus, compared to the wrist wearable device 1400 and / or AR device 1360, HIPD 1370, with its greater computing resources and thermal headroom, performs computationally intensive tasks and reduces the computer resource utilization and / or power consumption of the wrist wearable device 1400 and / or AR device 1360.

[0141] In the example shown in AR system 1300, HIPD 1370 identifies one or more backend and frontend tasks associated with a user request to initiate an AR video call with one or more other users (represented by avatar 1304 and contact's digital representation 1306). Specifically, HIPD 1370 performs backend tasks for processing and / or rendering image data (and other data) associated with the AR video call and provides operational data associated with the performed backend tasks to AR device 1360, causing AR device 1360 to perform frontend tasks for presenting the AR video call (e.g., presenting avatar 1304 and contact's digital representation 1306).

[0142] In some embodiments, HIPD 1370 can function as a focal point or anchor point for information presentation. This allows user 1302 to generally know where the information is presented. For example, as shown in AR system 1300, avatar 1304 and digital representations of contacts 1306 are presented above HIPD 1370. Specifically, HIPD 1370 and AR device 1360 operate in conjunction to determine the location for presenting avatar 1304 and digital representations of contacts 1306. In some embodiments, information can be presented within a predetermined distance from HIPD 1370 (e.g., within five meters). For example, as shown in AR system 1300, virtual object 1308 is presented on a table at a distance from HIPD 1370. Similar to the examples above, HIPD 1370 and AR device 1360 can operate in conjunction to determine the location for presenting virtual object 1308. Alternatively, in some embodiments, the presentation of information is not constrained by HIPD 1370. More specifically, the avatar 1304, the digital representation of the contact 1306, and the virtual object 1308 do not need to be presented within the predetermined distance of the HIPD 1370.

[0143] The user input provided at the wrist wearable device 1400, AR device 1360, and / or HIPD 1370 is coordinated so that the user can use any device to initiate, continue, and / or complete an operation. For example, user 1302 can provide user input to AR device 1360 to cause AR device 1360 to present virtual object 1308, and when virtual object 1308 is presented by AR device 1360, user 1302 can provide one or more gestures via wrist wearable device 1400 to interact with and / or manipulate virtual object 1308.

[0144] The example AR system, the wrist-worn wearable device 1400 for interacting with such an AR system, and other computing systems have been discussed in general terms, and will now be discussed in more detail below. For ease of reference, this document defines some of the devices and components that may be included in some or all of the exemplary devices discussed below. Those skilled in the art will recognize that certain types of components described below may be more suitable for a particular set of devices and less suitable for different sets of devices. However, subsequent references to components defined herein should be considered as being covered by the definitions provided.

[0145] In some embodiments discussed below, exemplary devices and systems, including electronic devices and systems, will be discussed. Such example devices and systems are not intended to be limiting, and those skilled in the art will understand that alternative devices and systems to the example devices and systems described herein can be used to perform the operations described herein and to construct the systems and devices described herein.

[0146] As described herein, an electronic device is a device that uses electrical energy to perform a specific function. An electronic device can be any physical object containing electronic components such as transistors, resistors, capacitors, diodes, and integrated circuits. Examples of electronic devices include smartphones, laptops, digital cameras, televisions, game consoles, and music players, as well as the various example electronic devices discussed herein. As described herein, an intermediate electronic device is a device that is located between two other electronic devices, and / or between subsets of multiple components of one or more electronic devices, and facilitates communication, and / or data processing, and / or data transmission between the respective electronic devices and / or electronic components.

[0147] Example wrist wearable devices Figure 14A and Figure 14B An example wrist-worn wearable device 1400 according to some embodiments is shown. The wrist-worn wearable device 1400 is an example of a wearable device described herein, such that the wearable device should be understood to have the characteristics of the wrist-worn wearable device 1400, and vice versa. Figure 14A Multiple components of a wrist-worn wearable device 1400 are shown, which can be used individually or in combination, including combinations that include other electronic devices and / or electronic components.

[0148] As discussed below, Figure 14A A wearable strap 1410 and a watch body 1420 (or capsule) are shown coupled to form a wrist wearable device 1400. The wrist wearable device 1400 can perform various functions and / or operations associated with navigating a user interface and selectively opening applications.

[0149] As will be described in more detail below, the operations performed by the wrist-worn wearable device 1400 may include: (i) presenting content to a user (e.g., displaying visual content via display 1405); (ii) detecting (e.g., sensing) user input (e.g., sensing touches on peripheral buttons 1423 and / or touches on the touchscreen of display 1405, sensing gestures detected by sensors (e.g., bioelectric sensors); (iii) sensing biometric data (e.g., neuromuscular signals, heart rate, temperature, sleep, etc.) via one or more sensors 1413; messaging (e.g., text, voice, video, etc.); image capture via one or more imaging devices or cameras 1425; wireless communication (e.g., cellular, near-field, Wi-Fi, personal area network); location determination; financial transactions; providing haptic feedback; alarms; notifications; biometric authentication; health monitoring; sleep monitoring, etc.

[0150] The above-described example functions can be performed independently in the watch body 1420, independently in the wearable band 1410, and / or via electronic communication between the watch body 1420 and the wearable band 1410. In some embodiments, the functions can be performed on the wrist wearable device 1400 when an AR environment is presented (e.g., via AR system 1300). As those skilled in the art will recognize upon reading the description provided herein, the novel wearable device described herein can be used with other types of AR environments.

[0151] The wearable band 1410 can be configured to be worn by a user such that the inner (or inner) surface of the wearable structure 1411 of the wearable band 1410 contacts the user's skin. Multiple sensors 1413 contact the user's skin when worn by the user. These sensors 1413 can sense biometric data, such as the user's heart rate, saturated oxygen level, body temperature, sweat level, neuromuscular signals, or combinations thereof. These sensors 1413 can also sense data about the user's environment, including the user's movement, altitude, location, orientation, gait, acceleration, position, or combinations thereof. In some embodiments, these sensors 1413 are configured to track the position and / or movement of the wearable band 1410. One or more sensors 1413 may include those defined above and / or the following regarding... Figure 14B Any of the multiple sensors discussed.

[0152] One or more sensors 1413 may be distributed on the inner and / or outer surface of the wearable band 1410. In some embodiments, the one or more sensors 1413 are evenly spaced along the wearable band 1410. Alternatively, in some embodiments, the one or more sensors 1413 are positioned at different points along the wearable band 1410. Figure 14AAs shown, one or more sensors 1413 may be the same or different. For example, in some embodiments, one or more sensors 1413 may be shaped as a pill (e.g., sensor 1413a), oval, circular, square, elliptical (e.g., sensor 1413c), and / or any other shape that maintains contact with the user's skin (e.g., so that neuromuscular signals and / or other biometric data can be accurately measured at the user's skin). In some embodiments, one or more sensors 1413 are aligned to form sensor pairs (e.g., for sensing neuromuscular signals based on differential sensing within each respective sensor). For example, sensor 1413b is aligned with an adjacent sensor to form sensor pair 1414a, and sensor 1413d is aligned with an adjacent sensor to form sensor pair 1414b. In some embodiments, the wearable band 1410 does not have sensor pairs. Alternatively, in some embodiments, the wearable band 1410 has a predetermined number of sensor pairs (one sensor pair, three sensor pairs, four sensor pairs, six sensor pairs, sixteen sensor pairs, etc.).

[0153] The wearable band 1410 may include any suitable number of sensors 1413. In some embodiments, the number and arrangement of the sensors 1413 depend on the specific application using the wearable band 1410. For example, the wearable band 1410 configured as an armband, wristband, or chest band may include multiple sensors 1413, which may have different numbers and arrangements for different use cases (e.g., medical use cases compared to gaming or general everyday use cases).

[0154] According to some embodiments, the wearable band 1410 also includes an electrically grounding electrode and a shielding electrode. Similar to sensor 1413, the electrically grounding electrode and shielding electrode may be distributed on the inner surface of the wearable band 1410 such that they contact a portion of the user's skin. For example, the electrically grounding electrode and shielding electrode may be located on the inner surface of coupling mechanism 1416 or the inner surface of wearable structure 1411. The electrically grounding electrode and shielding electrode may be formed of and / or use the same components as sensor 1413. In some embodiments, the wearable band 1410 includes more than one electrically grounding electrode and more than one shielding electrode.

[0155] Sensor 1413 may be formed as part of the wearable structure 1411 of the wearable band 1410. In some embodiments, sensor 1413 is flush or substantially flush with the wearable structure 1411 such that these sensors do not extend beyond the surface of the wearable structure 1411. Although flush with the wearable structure 1411, sensor 1413 is still configured to contact the user's skin (e.g., via a skin-contact surface). Alternatively, in some embodiments, sensor 1413 extends beyond the wearable structure 1411 by a predetermined distance (e.g., 0.1 mm to 2 mm) to contact and press into the user's skin. In some embodiments, sensor 1413 is coupled to an actuator (not shown) configured to adjust the extension height of sensor 1413 (e.g., distance from the surface of the wearable structure 1411) such that sensor 1413 contacts and presses into the user's skin. In some embodiments, the actuator adjusts the extension height between 0.01 mm and 1.2 mm. This allows users to customize the position of the sensor 1413 to improve the overall comfort of the wearable band 1410 when worn, while still allowing the sensor 1413 to contact the user's skin. In some embodiments, the sensor 1413 is not distinguishable from the wearable structure 1411 when worn by the user.

[0156] The wearable structure 1411 may be formed of an elastic material, elastomer, or the like, which is configured to be stretched and adapted for wear by a user. In some embodiments, the wearable structure 1411 is a textile or woven fabric. As described above, the sensor 1413 may be formed as part of the wearable structure 1411. For example, the sensor 1413 may be molded into the wearable structure 1411 or integrated into the woven fabric (e.g., the sensor 1413 may be sewn into the textile and mimic the flexibility of the textile (e.g., the sensor 1413 may be composed of a series of woven textile threads)).

[0157] Wearable structure 1411 may include sensors 1413, electronic circuitry and / or other electronic components (hereinafter referred to as...) encapsulated in wearable band 1410. Figure 14B The flexible electronic connector is used for interconnection. In some embodiments, the flexible electronic connector is configured to interconnect sensors 1413, electronic circuitry, and / or other electronic components of the wearable band 1410 with corresponding sensors and / or other electronic components of another electronic device (e.g., the watch body 1420). The flexible electronic connector is configured to move with the wearable structure 1411 such that adjustments made to the wearable structure 1411 by the user (e.g., resizing, pulling, folding) do not stress or strain the electrical couplings of the components of the wearable band 1410.

[0158] As described above, the wearable band 1410 is configured to be worn by a user. Specifically, the wearable band 1410 may be shaped or otherwise manipulated for wear by a user. For example, the wearable band 1410 may be shaped to have a generally circular shape, such that the wearable band can be configured to be worn on the user's forearm or wrist. Alternatively, the wearable band 1410 may be shaped to be worn on another body part of the user, such as the user's upper arm (e.g., around the biceps), forearm, chest, leg, etc. The wearable band 1410 may include a retaining mechanism 1412 (e.g., a buckle, hook-and-loop fastener, etc.) for securing the wearable band 1410 to the user's wrist or other body part. While the wearable band 1410 is worn by the user, the sensor 1413 senses data from the user's skin (referred to as sensor data). Specifically, the sensor 1413 of the wearable band 1410 acquires (e.g., senses and records) neuromuscular signals.

[0159] Sensed data (e.g., sensed neuromuscular signals) can be used to detect and / or determine a user's intention to perform certain motor actions. Specifically, sensor 1413 senses and records neuromuscular signals from the user when the user performs muscle activation (movement, gesture, etc.). The detected and / or determined motor actions (e.g., phalanges (or fingers) movement, wrist movement, hand movement, and / or other muscular intentions) can be used to determine control commands or control information (instructions to execute certain commands after the data is sensed) for causing the computing device to execute one or more input commands. For example, sensed neuromuscular signals can be used to control certain user interfaces displayed on display 1405 of the wrist-worn wearable device 1400, and / or can be sent to a device responsible for rendering an artificial reality environment (e.g., a head-mounted display) to perform actions within the associated artificial reality environment, such as controlling the movement of a virtual device displayed to the user. Muscle activation performed by a user can include: static gestures, such as placing the user's palm down on a table; dynamic gestures, such as grasping a physical or virtual object; and covert gestures that are imperceptible to another person, such as slightly tensing a joint by coordinating the contraction of opposing muscles or using submuscular activation. Muscle activation performed by a user can include symbolic gestures (e.g., gestures that are mapped to other gestures, interactions, or commands based on gesture vocabulary that maps specified gestures to commands).

[0160] The sensor data sensed by sensor 1413 can be used to provide users with enhanced interaction with physical objects (e.g., devices communicatively coupled to wearable strap 1410) and / or virtual objects generated by artificial reality systems in artificial reality applications (e.g., user interface objects presented on display 1405 or another computing device (e.g., smartphone)).

[0161] In some embodiments, the wearable band 1410 includes one or more tactile devices 1446. Figure 14B For example, a vibratory haptic actuator), the one or more haptic devices are configured to provide haptic feedback to a user's skin (e.g., skin sensation and / or kinesthetic perception). Sensor 1413 and / or haptic device 1446 may be configured to operate in conjunction with multiple applications, including but not limited to health monitoring, social media, games, and artificial reality (e.g., applications associated with artificial reality).

[0162] The wearable band 1410 may also include a coupling mechanism 1416 (e.g., the bracket or shape of the coupling mechanism may correspond to the shape of the body 1420 of the wrist wearable device 1400), which is used to detachably couple a compartment (e.g., a computing unit) or the body 1420 to the wearable band 1410 (via the coupling surface of the body 1420). In particular, the coupling mechanism 1416 may be configured to receive the coupling surface of the body 1420 near the bottom side (e.g., the side opposite the front side where the display 1405 of the body 1420 is located), so that a user can push the body 1420 down into the coupling mechanism 1416 to attach the body 1420 to the coupling mechanism 1416. In some embodiments, the coupling mechanism 1416 may be configured to receive the top side of the watch body 1420 (e.g., the side closest to the front side where the display 1405 of the watch body 1420 is located), with the watch body 1420 pushed upward into the bracket rather than downward into the coupling mechanism 1416. In some embodiments, the coupling mechanism 1416 is an integrated component of the wearable strap 1410, such that the wearable strap 1410 and the coupling mechanism 1416 are a single, unified structure. In some embodiments, the coupling mechanism 1416 is a frame or housing that allows the coupling surface of the watch body 1420 to remain within or on the coupling mechanism 1416 of the wearable strap 1410 (e.g., bracket, tracking strap, support base, buckle, etc.).

[0163] The coupling mechanism 1416 allows the watch body 1420 to be detachably coupled to the wearable strap 1410 via friction engagement, magnetic coupling, a rotation-based connector, a scissor pin coupling, a retaining spring, one or more magnets, clips, pins, hook-and-loop fasteners, or combinations thereof. A user can perform any type of action to couple the watch body 1420 to the wearable strap 1410 and to detach the watch body 1420 from the wearable strap 1410. For example, a user can twist, slide, rotate, push, pull, or rotate (or combinations thereof) the watch body 1420 relative to the wearable strap 1410 to attach the watch body 1420 to and detach the watch body 1420 from the wearable strap 1410. Alternatively, as discussed below, in some embodiments, the watch body 1420 can be detached from the wearable strap 1410 by actuation of the release mechanism 1429.

[0164] The wearable band 1410 can be coupled to the watch body 1420 to increase the functionality of the wearable band 1410 (e.g., converting the wearable band 1410 into a wrist wearable device 1400, adding additional computing units and / or batteries to increase the computing resources and / or battery life of the wearable band 1410, adding additional sensors to improve sensed data, etc.). As described above, the wearable band 1410 (and coupling mechanism 1416) is configured to operate independently of the watch body 1420 (e.g., perform functions independently of the watch body). For example, the coupling mechanism 1416 may include one or more sensors 1413 that contact the user's skin when the user wears the wearable band 1410 and provide sensor data for determining control commands.

[0165] Users can detach the watch body 1420 (or compartment) from the wearable strap 1410 to reduce the burden on the user from the wrist wearable device 1400. In embodiments where the watch body 1420 is detachable, the watch body 1420 may be referred to as a detachable structure, such that in these embodiments, the wrist wearable device 1400 includes a wearable portion (e.g., the wearable strap 1410) and a detachable structure (watch body 1420).

[0166] Turning to the watch body 1420, the watch body 1420 may have a generally rectangular or circular shape. The watch body 1420 is configured to be worn by a user on their wrist or another body part. More specifically, the watch body 1420 is sized for easy carrying by a user, easy attachment to a part of a user's clothing, and / or easy coupling to a wearable strap 1410 (thus forming a wrist wearable device 1400). As described above, the watch body 1420 may have a shape corresponding to the coupling mechanism 1416 of the wearable strap 1410. In some embodiments, the watch body 1420 includes a single release mechanism 1429 or multiple release mechanisms (e.g., two release mechanisms 1429 positioned on opposite sides of the watch body 1420, such as spring-supported buttons) to detach the watch body 1420 from the wearable strap 1410. The release mechanism 1429 may include, but is not limited to, buttons, knobs, plugs, handles, levers, fasteners, buckles, dials, latches, or combinations thereof.

[0167] A user can actuate the release mechanism 1429 by pushing, rotating, lifting, pressing, moving, or performing other actions on it. Actuation of the release mechanism 1429 can release (e.g., detach) the watch body 1420 from the coupling mechanism 1416 of the wearable strap 1410, allowing the user to use the watch body 1420 independently of the wearable strap 1410, and vice versa. For example, detaching the watch body 1420 from the wearable strap 1410 allows the user to use the rear camera 1425B to capture images. Although the coupling mechanism 1416 is shown positioned at one corner of the watch body 1420, the release mechanism 1429 can be positioned anywhere on the watch body 1420 that is convenient for user actuation. Additionally, in some embodiments, the wearable strap 1410 may include a corresponding release mechanism for detaching the watch body 1420 from the coupling mechanism 1416. In some embodiments, the release mechanism 1429 is optional, and as described above, the body 1420 can be separated from the coupling mechanism 1416 (by twisting or rotating).

[0168] The watch body 1420 may include one or more peripheral buttons 1423 and 1427 for performing various operations at the watch body 1420. For example, peripheral buttons 1423 and 1427 may be used to turn on or wake up the display 1405 (e.g., to bring the display 1405 from sleep to active state), unlock the watch body 1420, increase or decrease the volume, increase or decrease the brightness, interact with one or more applications, interact with one or more user interfaces, etc. Additionally or alternatively, in some embodiments, the display 1405 operates as a touchscreen and allows the user to provide one or more inputs to interact with the watch body 1420.

[0169] In some embodiments, the watch body 1420 includes one or more sensors 1421. The sensors 1421 of the watch body 1420 may be the same as or different from the sensors 1413 of the wearable strap 1410. The sensors 1421 of the watch body 1420 may be distributed on the inner and / or outer surfaces of the watch body 1420. In some embodiments, the sensors 1421 are configured to contact the user's skin when the user wears the watch body 1420. For example, the sensors 1421 may be placed on the underside of the watch body 1420, and the coupling mechanism 1416 may be a bracket with an opening that allows the underside of the watch body 1420 to directly contact the user's skin. Alternatively, in some embodiments, the watch body 1420 does not include sensors configured to contact the user's skin (e.g., sensors including those inside and / or outside the watch body 1420, configured to sense data from the watch body 1420 and data from the surrounding environment of the watch body 1420). In some embodiments, the sensor 1413 is configured to track the position and / or movement of the watch body 1420.

[0170] The watch body 1420 and the wearable band 1410 can share data using wired communication methods (e.g., Universal Asynchronous Receiver / Transmitter (UART), USB transceiver, etc.) and / or wireless communication methods (e.g., Near Field Communication, Bluetooth, etc.). For example, the watch body 1420 and the wearable band 1410 can share data sensed by sensors 1413 and 1421, as well as application-specific and device-specific information (e.g., active and / or available applications), output devices (e.g., display, speaker, etc.), and input devices (e.g., touchscreen, microphone, imaging sensor, etc.).

[0171] In some embodiments, the watch body 1420 may include, but is not limited to, a front camera 1425A and / or a rear camera 1425B, a sensor 1421 (e.g., a biometric sensor, an IMU sensor, a heart rate sensor, a saturated oxygen sensor, a neuromuscular signal sensor, an altimeter sensor, a temperature sensor, a bioimpedance sensor, a pedometer sensor), and an optical sensor (e.g., an imaging sensor 1463). Figure 14B (e.g., touch sensors, sweat sensors, etc.). In some embodiments, the body 1420 may include one or more tactile devices 1476 ( Figure 14B The sensor 1421 and / or haptic device 1476 may also be configured to operate in conjunction with multiple applications, including but not limited to health monitoring applications, social media applications, gaming applications, and artificial reality applications (e.g., applications associated with artificial reality).

[0172] As described above, the watch body 1420 and the wearable strap 1410, when coupled, can form a wrist wearable device 1400. The watch body 1420 and the wearable strap 1410, when coupled, act as a single device to perform the functions (operation, detection, communication, etc.) described herein. In some embodiments, each device is provided with specific instructions for performing one or more operations of the wrist wearable device 1400. For example, if it is determined that the watch body 1420 does not include a neuromuscular signal sensor, the wearable strap 1410 may include alternative instructions for performing the associated instructions (e.g., providing sensed neuromuscular signal data to the watch body 1420 via different electronic devices). The operations of the wrist wearable device 1400 can be performed by the watch body 1420 alone or by the watch body in conjunction with the wearable strap 1410 (e.g., via a corresponding processor and / or hardware component), or vice versa. In some embodiments, the operation of the wrist wearable device 1400, the watch body 1420, and / or the wearable band 1410 may be performed in conjunction with one or more processors and / or hardware components of another communication-coupled device (e.g., HIPD 1370).

[0173] For reference below Figure 14B As described in the block diagram, the wearable band 1410 and / or the watch body 1420 may each include independent resources required to perform functions independently. For example, the wearable band 1410 and / or the watch body 1420 may each include a power source (e.g., a battery), memory, data storage device, processor (e.g., a central processing unit (CPU)), communication, light source, and / or input / output devices.

[0174] Figure 14B Block diagrams are shown of a computing system 1430 corresponding to a wearable strap 1410 and a computing system 1460 corresponding to a watch body 1420, according to some embodiments. According to some embodiments, the computing system of the wrist wearable device 1400 includes a combination of components of the wearable strap computing system 1430 and components of the watch body computing system 1460.

[0175] The watch body 1420 and / or wearable strap 1410 may include one or more components shown in the watch body computing system 1460. In some embodiments, a single integrated circuit includes all or most of the components of the watch body computing system 1460, which are included in a single integrated circuit. Alternatively, in some embodiments, the components of the watch body computing system 1460 are included in multiple communication-coupled integrated circuits. In some embodiments, the watch body computing system 1460 is configured to be coupled to the wearable strap computing system 1430 (e.g., via a wired or wireless connection), which allows the two computing systems to share components, distribute tasks, and / or (individually or as a single device) perform other operations described herein.

[0176] The computing system 1460 may include one or more processors 1479, controllers 1477, peripheral interfaces 1461, power systems 1495, and memory (e.g., memory 1480), each of which has been defined above and is described in more detail below.

[0177] The power system 1495 may include a charger input 1496, a power-management integrated circuit (PMIC) 1497, and a battery 1498, each of which has been defined above. In some embodiments, the watch body 1420 and the wearable band 1410 may have their own charger inputs (e.g., charger inputs 1496 and 1457), their own batteries (e.g., batteries 1498 and 1459), and may share power with each other (e.g., the watch body 1420 may power and / or charge the wearable band 1410, and vice versa). Although the watch body 1420 and / or the wearable band 1410 may include their own charger inputs, a single charger input may charge both devices when the two devices are coupled. The watch body 1420 and the wearable band 1410 may use various technologies to receive charge. In some embodiments, the watch body 1420 and the wearable band 1410 may use wired charging components (e.g., a power cord) to receive charge. Alternatively or additionally, the watch body 1420 and / or the wearable strap 1410 can be configured for wireless charging. For example, a portable charging device can be designed to mate with a portion of the watch body 1420 and / or a portion of the wearable strap 1410 and wirelessly deliver available power to the battery of the watch body 1420 and / or the battery of the wearable strap 1410. The watch body 1420 and the wearable strap 1410 can have independent power systems (e.g., power systems 1495 and 1456) to enable each to operate independently. The watch body 1420 and the wearable strap 1410 can also share power (e.g., one can charge the other) via their respective PMICs (e.g., PMICs 1497 and 1458), which can share power via power conductors and ground conductors and / or via wireless charging antennas.

[0178] In some embodiments, peripheral interface 1461 may include one or more sensors 1421, many of which are defined above and are listed below. Sensor 1421 may include one or more coupled sensors 1462 for detecting when the watch body 1420 is coupled to another electronic device (e.g., wearable band 1410). Sensor 1421 may include imaging sensors 1463 (one or more of cameras 1425 and / or a single imaging sensor 1463 (e.g., a thermal imaging sensor)). In some embodiments, sensor 1421 includes one or more SpO2 sensors 1464. In some embodiments, sensor 1421 includes one or more bioelectric potential sensors (e.g., EMG sensors 1465, which may be disposed on the user-facing portion of the watch body 1420 and / or wearable band 1410). In some embodiments, sensor 1421 includes one or more capacitive sensors 1466. In some embodiments, sensor 1421 includes one or more heart rate sensors 1467. In some embodiments, sensor 1421 includes one or more IMUs 1468. In some embodiments, one or more IMUs 1468 may be configured to detect movement of the user's hand, or movement of the watch body 1420 in other positions where it is placed or held.

[0179] In some embodiments, the peripheral interface 1461 includes a Near Field Communication (NFC) component 1469, a Global Positioning System (GPS) component 1470, a Long-Term Evolution (LTE) component 1471, and / or a Wi-Fi and / or Bluetooth communication component 1472. In some embodiments, the peripheral interface 1461 includes one or more buttons 1473 (e.g., Figure 14A The peripheral interface 1461 includes peripheral buttons 1423 and 1427, which, when selected by the user, cause an operation to be performed at the body 1420. In some embodiments, the peripheral interface 1461 includes one or more indicators (e.g., light-emitting diodes, LEDs) to provide the user with visual indicators (e.g., received message, low battery, active microphone and / or camera, etc.).

[0180] The watch body 1420 may include at least one display 1405 for displaying a visual representation of information or data to a user, including user interface elements and / or three-dimensional (3D) virtual objects. The display may also include a touchscreen for inputting user input, such as touch gestures and swipe gestures. The watch body 1420 may include at least one speaker 1474 and at least one microphone 1475 for providing audio signals to the user and receiving audio input from the user. The user can provide user input through the microphone 1475 and can also receive audio output from the speaker 1474 as part of a haptic event provided by a haptic controller 1478. The watch body 1420 may include at least one camera 1425, including a front-facing camera 1425A and a rear-facing camera 1425B. The camera 1425 may include an ultra-wide-angle camera, a wide-angle camera, a fisheye camera, a spherical camera, a telephoto camera, a depth-sensing camera, or other types of cameras.

[0181] The watch body computing system 1460 may include one or more haptic controllers 1478 and associated components (e.g., haptic devices 1476) for providing haptic events at the watch body 1420 (e.g., a vibrational sensation or audio output responding to an event at the watch body 1420). The haptic controllers 1478 may communicate with one or more haptic devices 1476 (e.g., electroacoustic devices), which may include speakers in one or more loudspeakers 1474 and / or other audio components and / or electromechanical devices that convert energy into linear motion (e.g., motors, electromagnetic coils, electroactive polymers, piezoelectric actuators, electrostatic actuators, or other haptic output generating components (e.g., components that convert electrical signals into haptic outputs on the device)). The haptic controllers 1478 may provide haptic events that a user of the watch body 1420 can feel. In some embodiments, the one or more haptic controllers 1478 may receive input signals from one of the applications 1482.

[0182] In some embodiments, computer system 1430 and / or computer system 1460 may include memory 1480, which may be controlled by a storage controller of one or more controllers 1477 and / or one or more processors 1479. In some embodiments, software components stored in memory 1480 include one or more applications 1482 configured to perform operations at table body 1420. In some embodiments, one or more applications 1482 include games, word processors, messaging applications, calling applications, web browsers, social media applications, media streaming applications, financial applications, calendars, clocks, etc. In some embodiments, software components stored in memory 1480 include one or more communication interface modules 1483 as defined above. In some embodiments, software components stored in memory 1480 include: one or more graphics modules 1484 for rendering, encoding, and / or decoding audio data and / or video data; and one or more data management modules 1485 for collecting, organizing, and / or providing access to data 1487 stored in memory 1480. In some embodiments, one or more applications and / or one or more modules in application 1482 may work together to perform various tasks at table body 1420.

[0183] In some embodiments, the software components stored in the memory 1480 may include one or more operating systems 1481 (e.g., a Linux-based operating system, an Android operating system, etc.). The memory 1480 may also include data 1487. The data 1487 may include personal profile data 1488A, sensor data 1489A, media content data 1490, and application data 1491.

[0184] It should be recognized that the table body computing system 1460 is an example of a computing system within the table body 1420, and the table body 1420 may have more or fewer components, may combine two or more components, and / or may have different configurations and / or arrangements of these components compared to the components shown in the table body computing system 1460. The various components shown in the table body computing system 1460 are implemented in hardware, software, firmware, or combinations thereof (including one or more signal processing circuits and / or application-specific integrated circuits).

[0185] Turning to wearable band computing system 1430, one or more components that may be included in wearable band 1410 are shown. Compared to the components shown in body computing system 1460, wearable band computing system 1430 may include more or fewer components, may combine two or more components, and / or may have different configurations and / or arrangements of some or all of these components. In some embodiments, all or most of the components of wearable band computing system 1430 are included in a single integrated circuit. Alternatively, in some embodiments, the components of wearable band computing system 1430 are included in multiple communication-coupled integrated circuits. As described above, in some embodiments, wearable band computing system 1430 is configured to be coupled to body computing system 1460 (e.g., via a wired or wireless connection), which allows the two computing systems to share components, assign tasks, and / or (individually or as a single device) perform other operations described herein.

[0186] Similar to the wearable computing system 1460, the wearable computing system 1430 may include: one or more processors 1449; one or more controllers 1447 (including one or more haptic controllers 1448); a peripheral interface 1431, which may include one or more sensors 1413 and other peripheral devices; a power supply (e.g., a power system 1456); and a memory (e.g., a memory 1450), which includes an operating system (e.g., an operating system 1451), data (e.g., data 1454, which includes personal data 1488B, sensor data 1489B, etc.), and one or more modules (e.g., a communication interface module 1452, a data management module 1453, etc.).

[0187] In view of the above limitations, one or more sensors 1413 may be similar to sensor 1421 of computing system 1460. For example, the aforementioned sensor 1413 may include one or more coupled sensors 1432, one or more SpO2 sensors 1434, one or more EMG sensors 1435, one or more capacitive sensors 1436, one or more heart rate sensors 1437, and one or more IMU sensors 1442.

[0188] Peripheral interface 1431 may also include other components similar to those included in peripheral interface 1461 of computer system 1460, as described above with reference to peripheral interface 1461. These other components include NFC component 1439, GPS component 1440, LTE component 1451, Wi-Fi and / or Bluetooth communication component 1442, and / or one or more tactile devices 1476. In some embodiments, peripheral interface 1431 includes one or more buttons 1443, a display 1433, a speaker 1444, a microphone 1445, and a camera 1455. In some embodiments, peripheral interface 1431 includes one or more indicators, such as LEDs.

[0189] It should be recognized that the wearable band computing system 1430 is an example of a computing system within the wearable band 1410, and the wearable band 1410 may have more or fewer components, may combine two or more components, and / or may have different configurations and / or arrangements of these components compared to the components shown in the wearable band computing system 1430. The various components shown in the wearable band computing system 1430 may be implemented in hardware, software, or firmware, or a combination thereof, including one or more signal processing circuits and / or application-specific integrated circuits.

[0190] refer to Figure 14A The wrist wearable device 1400 is an example of a wearable strap 1410 and a watch body 1420 coupled together, and therefore the wrist wearable device 1400 will be understood to include the components shown and described for the wearable strap computing system 1430 and the watch body computing system 1460. In some embodiments, the wrist wearable device 1400 has a split architecture (e.g., a split mechanical architecture or a split electronic architecture) between the watch body 1420 and the wearable strap 1410. In other words, all the components shown in the wearable strap computing system 1430 and the watch body computing system 1460 can be accommodated or otherwise arranged in the combined watch device 1400, or accommodated or otherwise arranged within a single component in the watch body 1420, the wearable strap 1410 and / or portions thereof (e.g., the coupling mechanism 1416 of the wearable strap 1410).

[0191] The above technology can be used with any device for sensing neuromuscular signals (including...). Figures 14A to 14B It can be used with wrist-worn wearables, but it can also be used with other types of wearables for sensing neuromuscular signals, such as body wearables or head wearables that may have neuromuscular sensors closer to the brain or spine.

[0192] In some embodiments, the wrist wearable device 1400 may be used in conjunction with a head wearable device (e.g., AR device 1360 and VR device) and / or HIPD 1370, and the wrist wearable device 1400 may also be configured to allow a user to control aspects of the artificial reality (e.g., by controlling user interface objects in the artificial reality through EMG-based gestures, and / or by allowing a user to interact with a touchscreen on the wrist wearable device in order to also control aspects of the artificial reality).

[0193] Any data collection performed by the devices described herein and / or by any device configured to perform or cause to perform the different embodiments described above with reference to any of the accompanying drawings (hereinafter referred to as "devices") is conducted with the user's consent and in a manner that complies with all applicable privacy laws. Users are provided with options to allow the devices to collect data and options to restrict or refuse the devices' collection of data. Users can choose to enable or disable any data collection at any time. Furthermore, users are provided with the option to request the deletion of any collected data.

[0194] It will be understood that although the terms “first,” “second,” etc., may be used in this document to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another.

[0195] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the scope of the claims. As used in the description of the embodiments and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will also be understood that the term “and / or” as used herein refers to and covers any and all possible combinations of one or more of the associated listed items. It will also be understood that the terms “comprising” and / or “including”, when used in this specification, specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0196] As used herein, the term "if" can be interpreted as meaning "when," "as soon as," "in response to determination," "according to determination," or "in response to detection," depending on the context. Similarly, depending on the context, the phrases "if it is determined [the stated conditional precedent is true]," "if [the stated conditional precedent is true]," or "when [the stated conditional precedent is true]" can be interpreted as meaning: "once determined" the stated conditional precedent is true; or "in response to determination" the stated conditional precedent is true; or "according to determination" the stated conditional precedent is true; or "once detected" the stated conditional precedent is true; or "in response to detection" the stated conditional precedent is true.

[0197] For purposes of explanation, the foregoing description has been given with reference to specific embodiments. However, the illustrative discussion above is not intended to be exhaustive or to limit the claims to the precise forms disclosed. Many modifications and variations are possible in light of the foregoing teachings. The embodiments were chosen and described in order to best explain the principles of operation and practical application, thereby enabling others skilled in the art to implement them.

Claims

1. A wearable structure, comprising: A flexible printed circuit (FPC) layer is located within the wearable structure, the FPC layer being configured to be coupled to one or more biopotential signal processing components along the coupling length of the FPC layer; as well as A strain relief layer is coupled to a portion of the FPC layer such that the strain relief layer spans the coupling length of the FPC layer. The strain applied to the wearable structure is eliminated by the strain relief layer, so that the strain is not transmitted to the one or more biopotential signal processing components.

2. The wearable structure according to claim 1, wherein, The torsional force applied to the wearable structure is eliminated by the strain relief layer, so that the torsional force is not transmitted to the one or more biopotential signal processing components.

3. The wearable structure according to claim 1 or 2, wherein, The strain relief layer is tensile-resistant, such that the FPC layer is not stretched when a tensile force is applied to the wearable structure; and / or wherein the strain relief layer is not stretched.

4. The wearable structure according to any one of the preceding claims, wherein, The one or more biopotential signal processing components are electrically coupled to one or more biopotential signal sensing electrodes.

5. The wearable structure according to any one of the preceding claims, wherein, The FPC layer and the strain relief layer are part of an FPC assembly; and / or wherein... The strain relief layer is formed from Vectran, Kevlar, or other polymers.

6. The wearable structure according to any one of the preceding claims, wherein, The strain relief layer is coupled to the bottom surface of the FPC layer; And / or wherein the strain relief layer is coupled between the traces of the FPC layer.

7. The wearable structure according to any one of the preceding claims, wherein, The strain relief layer reduces or eliminates the neutral axis deflection of the FPC layer.

8. The wearable structure according to any one of the preceding claims, wherein, The strain relief layer has a first length, the FPC layer has a second length, the first length being greater than the second length; and / or wherein the strain relief layer has a predetermined thickness.

9. The wearable structure according to any one of the preceding claims further comprises: A metal layer coupled to the strain relief layer, the metal layer being configured to support the FPC layer and the strain relief layer; and / or The outer layer is at least embedded with the FPC layer, the strain relief layer, and the one or more biopotential signal processing components.

10. The wearable structure according to any one of the preceding claims, wherein, The wearable structure is at least one of the following: a wrist-worn wearable device; a head-worn wearable device; or wearable clothing.

11. The wearable structure according to any one of the preceding claims, wherein: The wearable structure is configured to be coupled to the computing core; and The computing core is configured to be communicatively coupled to the FPC layer.

12. A wearable electronic device, comprising: One or more biopotential signal processing components; as well as Wearable structure, the wearable structure comprising: A flexible printed circuit (FPC) layer is located within the wearable structure, the FPC layer being configured to be coupled to the one or more biopotential signal processing components along a coupling length of the FPC layer; and A strain relief layer is coupled to a portion of the FPC layer such that the strain relief layer spans the coupling length of the FPC layer. The strain applied to the wearable structure is eliminated by the strain relief layer, so that the strain is not transmitted to the one or more biopotential signal processing components.

13. The wearable electronic device according to claim 12, wherein, The torsional force applied to the wearable structure is eliminated by the strain relief layer, so that the torsional force is not transmitted to the one or more biopotential signal processing components.

14. A method for manufacturing a wearable structure, comprising: A wearable structure is provided, the wearable structure comprising a flexible printed circuit (FPC) and a strain relief layer, wherein: The FPC is located within the wearable structure and is configured to be coupled to a biopotential signal processing component along the coupling length of the FPC layer. The strain relief layer is coupled to a portion of the FPC layer such that the strain relief layer spans the coupling length of the FPC layer. The strain applied to the wearable structure is eliminated by the strain relief layer, so that the strain is not transmitted to the one or more biopotential signal processing components.

15. The method of manufacturing a wearable structure according to claim 14, wherein, The torsional force applied to the wearable structure is eliminated by the strain relief layer, so that the torsional force is not transmitted to the one or more biopotential signal processing components.

Images