Photosensitive resin composition, photosensitive element, cured product, method for producing cured product pattern, and method for producing conductor pattern

Abstract

A photosensitive resin composition comprising an adhesive polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein the photopolymerizable compound comprises a polyfunctional monomer having two or more free radical reactive groups and 8 to 16 oxoethylene groups, and the content of the polyfunctional monomer is 90% by mass or more based on the total amount of the photopolymerizable compound; the mass ratio of the adhesive polymer to the photopolymerizable compound is greater than 0 and less than 1.35; and the absorbance of the photosensitive layer formed using the photosensitive resin composition per 1 μm thickness for light at a wavelength of 365 nm is less than 0.0220. A photosensitive element (10) comprising a support (12) and a photosensitive layer (14) disposed on the support (12), the photosensitive layer (14) comprising the photosensitive resin composition.

Description

Technical Field

[0001] This invention relates to a photosensitive resin composition, a photosensitive element, a cured product, a method for manufacturing a pattern of the cured product, a method for manufacturing a conductor pattern, etc. Background Technology

[0002] In the manufacture of wiring boards and the like, a cured pattern is formed as a resist pattern in order to obtain a desired conductor pattern (e.g., a wiring pattern). For example, the cured pattern can be formed by forming a photosensitive layer (photosensitive resin layer) on a substrate using a photosensitive resin composition, followed by exposure and development of the photosensitive layer. Various photosensitive resin compositions have been investigated. For example, Patent Document 1 described below discloses a photosensitive resin composition containing anthracene derivatives.

[0003] Previous technical documents Patent documents Patent Document 1: International Publication No. 2007 / 004619 Summary of the Invention

[0004] The technical problem to be solved by the invention When a cured pattern is obtained on a substrate using a photosensitive resin composition, it is required that no gaps form between the substrate and the cured pattern, and that the cured pattern exhibits excellent conformability to the substrate. In particular, when a cured pattern is obtained on a substrate with recesses using a photosensitive resin composition, gaps tend to form between the substrate and the cured pattern. Therefore, the photosensitive resin composition is required to produce a cured pattern with excellent conformability to substrates with recesses.

[0005] One object of the present invention is to provide a photosensitive resin composition capable of obtaining a cured pattern with excellent conformability to a substrate having recesses. Another object of the present invention is to provide a photosensitive element using such a photosensitive resin composition. Another object of the present invention is to provide a cured product of the above-described photosensitive resin composition. Another object of the present invention is to provide a method for manufacturing a cured pattern using the above-described photosensitive resin composition. Another object of the present invention is to provide a method for manufacturing a conductor pattern using this method for manufacturing cured patterns.

[0006] means for solving technical problems The present invention relates in several aspects to [1] to

[16] below.

[0007] [1] A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein, The photopolymerizable compound comprises a polyfunctional monomer having two or more free radical reactive groups and 8 to 16 oxoethylides. Based on the total amount of the photopolymerizable compound, the content of the polyfunctional monomer is 90% by mass or more. The mass ratio of the adhesive polymer to the photopolymerizable compound is greater than 0 and less than 1.35. The absorbance of the photosensitive layer formed using the photosensitive resin composition per 1 μm thickness for light at a wavelength of 365 nm is less than 0.0220.

[0008] [2] According to the photosensitive resin composition described in [1], wherein, The absorbance of the photosensitive layer per 1 μm thickness for light with a wavelength of 405 nm is less than 0.0220.

[0009] [3] The photosensitive resin composition according to [1] or [2], wherein, Based on the total amount of the photopolymerizable compound, the content of the multifunctional monomer is 96% by mass or more.

[0010] [4] The photosensitive resin composition according to any one of [1] to [3], wherein, The mass ratio of the adhesive polymer to the photopolymerizable compound is greater than 0 and less than 1.25.

[0011] [5] The photosensitive resin composition according to any one of [1] to [4], wherein, The molecular weight of the multifunctional monomer is 600 to 1200.

[0012] [6] The photosensitive resin composition according to any one of [1] to [5], wherein, The multifunctional monomer further has a bisphenol A backbone.

[0013] [7] The photosensitive resin composition according to any one of [1] to [6], wherein, The adhesive polymer has styrene compounds as monomer units, and the content of the styrene compounds as monomer units exceeds 30% by mass, based on the total amount of monomer units constituting the adhesive polymer.

[0014] [8] The photosensitive resin composition according to any one of [1] to [7], wherein, The adhesive polymer has styrene compounds and (meth)acrylate arylates as monomer units.

[0015] [9] According to the photosensitive resin composition of [8], wherein, The adhesive polymer further comprises (meth)acrylate hydroxyalkyl ester as a monomer unit.

[0016]

[10] The photosensitive resin composition according to any one of [1] to [9] further contains a sensitizer.

[0017]

[11] According to the photosensitive resin composition of

[10] , wherein, The sensitizer comprises a dialkylaminobenzophenone compound.

[0018]

[12] The photosensitive resin composition according to

[10] or

[11] , wherein, The content of the sensitizer is less than 0.100 parts by mass relative to the total of 100 parts by mass of the adhesive polymer and the photopolymerizable compound.

[0019]

[13] A photosensitive element having a support and a photosensitive layer disposed on the support, the photosensitive layer comprising any one of [1] to

[12] of the photosensitive resin composition.

[0020]

[14] A cured product, which is a cured product of any one of the photosensitive resin compositions described in [1] to

[12] .

[0021]

[15] A method for manufacturing a cured pattern, comprising the following steps: A photosensitive layer is formed on a substrate using any one of the photosensitive resin compositions [1] to

[12] ; Photocuring a portion of the photosensitive layer; and At least a portion of the uncured portion of the photosensitive layer is removed to form a cured pattern.

[0022]

[16] A method for manufacturing a conductor pattern, comprising the following steps: The cured pattern obtained by the method for manufacturing the cured pattern described in

[15] is used as a mask to form a conductor pattern.

[0023] Invention Effects According to one aspect of the present invention, a photosensitive resin composition capable of obtaining a cured pattern with excellent conformability to a substrate having recesses can be provided. According to another aspect of the present invention, a photosensitive element using this photosensitive resin composition can be provided. According to another aspect of the present invention, a cured product of the above-described photosensitive resin composition can be provided. According to another aspect of the present invention, a method for manufacturing a cured pattern using the above-described photosensitive resin composition can be provided. According to another aspect of the present invention, a method for manufacturing a conductor pattern using this method of manufacturing a cured pattern can be provided. Attached Figure Description

[0024] Figure 1 This is a schematic cross-sectional view showing an example of a photosensitive element.

[0025] Figure 2 This is a schematic cross-sectional view illustrating an example of a method for manufacturing a conductor pattern. Detailed Implementation

[0026] The embodiments of the present invention will now be described in detail. However, the present invention is not limited to the following embodiments.

[0027] In this specification, the numerical range indicated by "~" represents the range encompassed by the values ​​before and after "~" as the minimum and maximum values, respectively. "Above A" in a numerical range refers to A and the range exceeding A. "Below A" in a numerical range refers to A and the range less than A. In the numerical ranges described in stages in this specification, the upper or lower limit of a certain stage's numerical range can be arbitrarily combined with the upper or lower limits of other stages' numerical ranges. The upper or lower limit of the numerical ranges described in this specification can be replaced with the values ​​shown in the examples. Regarding "A or B," either A or B is sufficient, or both may be included. The materials exemplified in this specification, unless otherwise stated, can be used alone or in combination with two or more. When multiple substances conforming to each component are present in the composition, unless otherwise stated, the content of each component in the composition refers to the total amount of the multiple substances present in the composition. When viewed in a top view, the term "layer" includes not only structures formed on an entire surface but also structures formed on a portion of a surface. The term "process" includes not only independent processes, but also processes that cannot be clearly distinguished from others, as long as the desired effect of the process is achieved. "(Meth)acrylate" refers to at least one of acrylates and their corresponding methacrylates. The same applies to other similar expressions such as "(meth)acrylic acid". The content of monomer units of (meth)acrylic acid refers to the total amount of monomer units of acrylic acid and monomer units of methacrylic acid. The same applies to other similar contents such as the content of monomer units of alkyl (meth)acrylic acid esters. Unless otherwise stated, "alkyl" can be any of linear, branched, or cyclic. "Hydroxy" does not include the OH group contained in the carboxyl group. The solid component of the photosensitive resin composition refers to the non-volatile component other than volatile components (water, organic solvents, etc.). That is, the solid component refers to the component that does not volatilize and remains after drying of the photosensitive resin composition, and also includes components that are liquid, syrupy, waxy, etc. at room temperature (25°C). "EO modification" refers to a compound having (poly)oxyethylidene. "(Poly)oxyethylidene" refers to polyoxyethylidene formed by oxyethylidene or two or more ethylidenes linked by ether bonds. "PO modified" refers to compounds containing (poly)oxypropylene groups. "(Poly)oxypropylene" refers to polyoxypropylene formed by oxypropylene groups or two or more propylene groups linked by ether bonds.

[0028] The photosensitive resin composition according to this embodiment contains (A) an adhesive polymer (hereinafter referred to as "component (A)" as appropriate), (B) a photopolymerizable compound (hereinafter referred to as "component (B)" as appropriate), and (C) a photopolymerization initiator (hereinafter referred to as "component (C)" as appropriate). In the photosensitive resin composition according to this embodiment, component (B) contains a polyfunctional monomer having two or more free radical reactive groups and 8 to 16 oxoethylene groups (hereinafter referred to as "component (b)" as appropriate), and based on the total amount of component (B), the content of component (b) is 90% by mass or more, and the mass ratio of component (A) to component (B) (content of component (A) / content of component (B)) is greater than 0 and less than 1.35. In the photosensitive resin composition according to this embodiment, the absorbance of a photosensitive layer formed using this photosensitive resin composition per 1 μm thickness for light at a wavelength of 365 nm is less than 0.0220.

[0029] According to the photosensitive resin composition of this embodiment, a cured pattern with excellent followability to a substrate having recesses can be obtained. After obtaining a photosensitive layer (photosensitive resin layer) on a substrate having recesses using the photosensitive resin composition, the photosensitive layer is exposed (light with a wavelength of 365 nm) and developed, resulting in a cured pattern with excellent followability. According to the photosensitive resin composition of this embodiment, in the evaluation of followability (depth of recess (etching depth): 3.5 μm) described in the later examples, a result of "A" or "B" can be obtained.

[0030] While the main reasons for obtaining a cured pattern with excellent conformability to substrates with recesses are not clearly defined, they are speculated as follows. However, the main reasons are not limited to the following. It is speculated that since the content of component (b) is 90% or more by mass based on the total amount of component (B), and the mass ratio of component (A) to component (B) is greater than 0 and less than 1.35, the photosensitive layer obtained using the photosensitive resin composition tends to be soft, and the melt viscosity of the photosensitive layer is reduced, thereby easily obtaining excellent conformability to substrates with recesses. Furthermore, it is speculated that since the absorbance of the photosensitive layer formed by using the photosensitive resin composition is less than 0.0220 per 1 μm thickness for light at a wavelength of 365 nm, the bottom curing properties during exposure are sufficiently high, and the contact areas of the photosensitive layer with the substrate can be easily patterned, thereby easily obtaining excellent conformability to substrates with recesses.

[0031] According to one embodiment of the photosensitive resin composition, in the evaluation of followability (depth of the recess (etching depth): 5.0 μm) described in the following examples, a result of "A" or "B" can be obtained.

[0032] According to one embodiment of the photosensitive resin composition, the hardness of the photosensitive layer can be reduced. According to one embodiment of the photosensitive resin composition, in the evaluation of the hardness of the photosensitive layer described in the following examples, a pressing depth of 9.0 μm or more (preferably 9.5 μm or more, 10.0 μm or more, 10.5 μm or more, 11.0 μm or more, etc.) can be obtained.

[0033] When forming a photosensitive layer on a substrate using a photosensitive resin composition, sometimes the photosensitive layer (film-like photosensitive resin composition) is formed on the substrate by laminating a film-like photosensitive resin composition onto the substrate. According to one embodiment of the photosensitive resin composition, after obtaining a photosensitive layer on a substrate having recesses using a film-like photosensitive resin composition, the photosensitive layer is exposed and developed, thereby obtaining a cured pattern with excellent followability.

[0034] By photocuring the photosensitive resin composition according to this embodiment, a cured product can be obtained. The cured product according to this embodiment is a cured product of the photosensitive resin composition according to this embodiment. One aspect of the photosensitive resin composition according to this embodiment can be used as a negative photosensitive resin composition. Another aspect of the photosensitive resin composition according to this embodiment can be used for manufacturing cured product patterns, for manufacturing resist patterns, for manufacturing conductor patterns, and for manufacturing wiring boards.

[0035] From the viewpoint of obtaining a cured pattern with excellent followability to a substrate having recesses, the absorbance of the photosensitive layer formed using this photosensitive resin composition per 1 μm thickness for light at a wavelength of 365 nm is less than 0.0220. From the viewpoint of easily obtaining a cured pattern with excellent followability to a substrate having recesses, the absorbance of the photosensitive layer per 1 μm thickness for light at a wavelength of 365 nm can be within the following ranges: absorbance can be 0.0210 or less, 0.0200 or less, 0.0190 or less, 0.0180 or less, 0.0150 or less, 0.0130 or less, 0.0120 or less, 0.0110 or less, 0.0100 or less, 0.0095 or less, or 0.0092 or less. The absorbance can exceed 0, 0.0010 or more, 0.0030 or more, 0.0050 or more, 0.0070 or more, 0.0090 or more, or 0.0092 or more. In these respects, the absorbance can exceed 0 and be less than 0.0220, exceed 0.0010 and be less than 0.0220, exceed 0 and be less than 0.0220, exceed 0 and be less than 0.0150, be between 0.0010 and 0.0150, be between 0.0050 and 0.0150, exceed 0 and be less than 0.0100, be between 0.0010 and 0.0100, or be between 0.0050 and 0.0100.

[0036] From the viewpoint that the photosensitive resin composition according to this embodiment can easily obtain a cured pattern with excellent followability to a substrate having recesses, the absorbance of the photosensitive layer formed using this photosensitive resin composition for light with a wavelength of 405 nm per 1 μm thickness can be within the following ranges: Absorbance can be less than 0.0220, 0.0210 or less, 0.0200 or less, 0.0170 or less, 0.0150 or less, 0.0120 or less, 0.0100 or less, 0.0080 or less, 0.0050 or less, 0.0040 or less, or 0.0035 or less. Absorbance can be greater than 0, 0.0001 or more, 0.0005 or more, 0.0010 or more, 0.0020 or more, 0.0025 or more, or 0.0030 or more. According to these views, absorbance can be greater than 0 and less than 0.0220, greater than 0.0001 and less than 0.0220, greater than 0 and less than 0.0010, greater than 0 and less than 0.0100, 0.0001 to 0.0100, 0.0010 to 0.0100, greater than 0 and less than 0.0050, 0.0001 to 0.0050, or 0.0010 to 0.0050.

[0037] The photosensitive layer having the above-mentioned absorbance can be obtained by drying the photosensitive resin composition according to this embodiment. The absorbance of the photosensitive layer for light with wavelengths of 365 nm and 405 nm can be measured by the method described in the examples below. The absorbance of the photosensitive layer for light with wavelengths of 365 nm and 405 nm can be adjusted by the type and content of the components contained in the photosensitive layer (adhesive polymer, sensitizer, etc., described below).

[0038] The photosensitive resin composition according to this embodiment contains an adhesive polymer as component (A). Component (A) can have a polymerizable monomer as a monomer unit (structural unit), for example, it can be obtained by free radical polymerization of the polymerizable monomer.

[0039] From the perspective of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate with recesses, component (A) may contain (meth)acrylic acid as a monomer unit. From the perspective of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate with recesses, based on the total amount of monomer units constituting component (A), the content of (meth)acrylic acid monomer units in component (A) may be within the following ranges: The content of (meth)acrylic acid monomer units may be 5% by mass or more, 10% by mass or more, 15% by mass or more, 20% by mass or more, or 25% by mass or more. The content of (meth)acrylic acid monomer units may be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, or 30% by mass or less. In view of these points, the content of monomer units of (meth)acrylic acid can be 5-50% by mass, 5-40% by mass, 5-30% by mass, 10-50% by mass, 10-40% by mass, 10-30% by mass, 20-50% by mass, 20-40% by mass or 20-30% by mass.

[0040] From the perspectives of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent followability to a substrate with recesses, component (A) may have an alkyl (meth)acrylate as a monomer unit. Examples of alkyl groups that can be used as alkyl (meth)acrylates include methyl, ethyl, propyl, butyl, pentyl, hexyl, heptyl, octyl, nonyl, decyl, undecyl, and dodecyl. The alkyl group can be various structural isomers.

[0041] Alkyl methacrylates can have unsubstituted alkyl groups or alkyl groups containing substituents. Examples of substituents include hydroxyl, carboxyl, carboxylate, aldehyde, alkoxy, ester, substituted or unsubstituted amino, amide (except hydroxyamide), hydroxyamide, nitro, cyano, mercapto, and halogen (fluorine, chloro, bromine, iodo, etc.).

[0042] From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent followability to a substrate with recesses, the number of carbon atoms of the alkyl group of (meth)acrylate (including the number of carbon atoms of the substituents) can be 1 to 4, 1 to 3, or 1 to 2.

[0043] From the perspective of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent followability to a substrate with recesses, component (A) may have a hydroxyalkyl methacrylate as a monomer unit. Examples of hydroxyalkyl methacrylates include methyl methacrylate, ethyl methacrylate, propyl methacrylate, butyl methacrylate, pentyl methacrylate, and hexyl methacrylate.

[0044] Based on the total amount of monomer units constituting component (A), the content of alkyl (meth)acrylate monomer units in component (A) can be within the following ranges. From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of alkyl (meth)acrylate monomer units can be 0.5% by mass or more, 1.0% by mass or more, 1.5% by mass or more, 2.0% by mass or more, 2.5% by mass or more, 3.0% by mass or more, 3.5% by mass or more, 4.0% by mass or more, 4.5% by mass or more, or 5.0% by mass or more. From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of alkyl (meth)acrylate monomer units can be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8.0% by mass or less, 7.0% by mass or less, 6.0% by mass or less, or 5.0% by mass or less. The monomer content of alkyl (meth)acrylates can be less than 4.5% by mass, less than 4.0% by mass, less than 3.5% by mass, or less than 3.0% by mass. In these respects, the monomer content of alkyl (meth)acrylates can be 0.5–20% by mass, 0.5–10% by mass, 0.5–8.0% by mass, 2.0–20% by mass, 2.0–10% by mass, 2.0–8.0% by mass, 4.0–20% by mass, 4.0–10% by mass, or 4.0–8.0% by mass.

[0045] From the perspective of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of (meth)acrylate hydroxyalkyl ester monomer units in component (A) can be within the following ranges, based on the total amount of monomer units constituting component (A). The content of (meth)acrylate hydroxyalkyl ester monomer units can be 0.5% by mass or more, 1.0% by mass or more, 1.5% by mass or more, 2.0% by mass or more, 2.5% by mass or more, or 3.0% by mass or more. The content of (meth)acrylate hydroxyalkyl ester monomer units can be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8.0% by mass or less, 7.0% by mass or less, 6.0% by mass or less, 5.0% by mass or less, 4.5% by mass or less, 4.0% by mass or less, 3.5% by mass or less, or 3.0% by mass or less. In view of these points, the content of monomer units in hydroxyalkyl (meth)acrylate can be 0.5–20% by mass, 0.5–10% by mass, 0.5–8.0% by mass, 1.0–20% by mass, 1.0–10% by mass, 1.0–8.0% by mass, 2.0–20% by mass, 2.0–10% by mass, or 2.0–8.0% by mass.

[0046] From the perspective of easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent conformability to substrates with recesses, component (A) may contain a styrene compound as a monomer unit. Examples of styrene compounds include styrene and styrene derivatives. Examples of styrene derivatives include vinyltoluene and α-methylstyrene. From the perspective of easily reducing the hardness of the photosensitive layer or easily obtaining cured patterns with excellent conformability to substrates with recesses, component (A) may contain styrene as a monomer unit.

[0047] Based on the total amount of monomer units constituting component (A), the content of styrene compound monomer units in component (A) can be within the following ranges. From the viewpoint of easily obtaining a cured pattern with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to substrates with recesses, the content of styrene compound monomer units can be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, more than 30% by mass, 31% by mass or more, 32% by mass or more, 33% by mass or more, 35% by mass or more, 40% by mass or more, or 45% by mass or more. From the viewpoint of easily obtaining a cured pattern with excellent resolution, the content of styrene compound monomer units can exceed 45% by mass, 46% by mass or more, 47% by mass or more, 48% by mass or more, or 50% by mass or more. From the perspectives of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, the content of monomer units in the styrene compound can be 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, 48% by mass or less, 47% by mass or less, 46% by mass or less, or 45% by mass or less. From these perspectives, the content of monomer units in the styrene compound can be 10–80% by mass, 10–60% by mass, 10–48% by mass, 20–80% by mass, 20–60% by mass, 20–48% by mass, more than 30% by mass and less than 80% by mass, more than 30% by mass and less than 60% by mass, more than 30% by mass and less than 48% by mass, 35–80% by mass, 35–60% by mass, or 35–48% by mass.

[0048] From the perspective of easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent conformability to substrates with recesses, component (A) may contain aryl methacrylate as a monomer unit. Examples of aryl methacrylates include benzyl methacrylate, phenyl methacrylate, and naphthyl methacrylate. From the perspective of easily reducing the hardness of the photosensitive layer or easily obtaining cured patterns with excellent conformability to substrates with recesses, component (A) may contain benzyl methacrylate as a monomer unit.

[0049] Based on the total amount of monomer units constituting component (A), the content of aryl methacrylate monomer units in component (A) can be within the following ranges. From the viewpoint of easily obtaining a cured pattern with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to substrates with recesses, the content of aryl methacrylate monomer units can be 5% by mass or more, 10% by mass or more, 15% by mass or more, 18% by mass or more, 20% by mass or more, 22% by mass or more, or 23% by mass or more. From the viewpoint of easily obtaining a cured pattern with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to substrates with recesses, the content of aryl methacrylate monomer units can be 50% by mass or less, 45% by mass or less, 40% by mass or less, 35% by mass or less, 30% by mass or less, 28% by mass or less, 25% by mass or less, or 23% by mass or less. From the viewpoint of easily obtaining cured patterns with excellent resolution, the content of monomer units in aryl (meth)acrylate can be 22% by mass or less, or 20% by mass or less. From these viewpoints, the content of monomer units in aryl (meth)acrylate can be 5–50% by mass, 5–35% by mass, 5–25% by mass, 10–50% by mass, 10–35% by mass, 10–25% by mass, 22–50% by mass, 22–35% by mass, or 22–25% by mass.

[0050] From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, component (A) may have at least one monomer unit selected from the group consisting of (meth)acrylic acid, alkyl (meth)acrylate, styrene compounds, and aryl (meth)acrylate; it may also have styrene compounds and aryl (meth)acrylate as monomer units; it may also have alkyl (meth)acrylate, styrene compounds, and aryl (meth)acrylate as monomer units; or it may have hydroxyalkyl (meth)acrylate, styrene compounds, and aryl (meth)acrylate as monomer units. In this case, the content of at least one monomer unit selected from the group consisting of (meth)acrylic acid, alkyl (meth)acrylate, styrene compounds, and aryl (meth)acrylate can be within the aforementioned ranges.

[0051] (A) The component may have monomers other than those mentioned above as monomer units. Examples of such monomers include ethers of vinyl alcohol (such as vinyl-n-butyl ether), (meth)acrylonitrile, maleic acid, maleic anhydride, maleic acid monoesters (such as monomethyl maleate, monoethyl maleate, monoisopropyl maleate), fumaric acid, cinnamic acid, α-cyanocinonic acid, itconic acid, crotonic acid, propynic acid, etc.

[0052] The (A) component in the photosensitive resin composition involved in this embodiment may not have a structure represented by the following general formula (1) (the photosensitive resin composition involved in this embodiment may not contain an adhesive polymer having a structure represented by the following general formula (1)).

[0053] In equation (1), R 11 and R 12 Each of these units independently represents an isobutylene unit, a styrene unit, a vinyl methyl ether unit, or a (meth)acrylate unit, R 13 Represents a hydrogen atom, an alkyl group that may have substituents, a cyclohexyl group that may have substituents, or a phenyl group that may have substituents; Z represents -OH, -NH-R. 14 or -OR 15 R 14 and R 15 The group represents an olefinically unsaturated bond, an alkyl group that may have substituents, or a phenyl group that may have substituents; n and m each independently represent an integer of 1 or more. From the viewpoints of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the acid value of component (A) can be 100 mg KOH / g or more, 120 mg KOH / g or more, 140 mg KOH / g or more, 150 mg KOH / g or more, 160 mg KOH / g or more, 170 mg KOH / g or more, or 175 mg KOH / g or more. From the viewpoints of easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the acid value of component (A) can be 250 mg KOH / g or less, 240 mg KOH / g or less, 230 mg KOH / g or less, 200 mg KOH / g or less, 190 mg KOH / g or less, or 180 mg KOH / g or less. In view of these points, the acid value of component (A) can be 100–250 mg KOH / g, 100–200 mg KOH / g, 100–180 mg KOH / g, 150–250 mg KOH / g, 150–200 mg KOH / g, 150–180 mg KOH / g, 170–250 mg KOH / g, 170–200 mg KOH / g, or 170–180 mg KOH / g. The acid value of component (A) can be adjusted by the content of the monomer units constituting component (A) (e.g., monomer units of (meth)acrylic acid). The acid value can be determined by the method described in the examples described later.

[0054] From the viewpoints of easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the weight-average molecular weight (Mw) of component (A) can be 10,000 or more, 15,000 or more, 20,000 or more, 25,000 or more, 30,000 or more, 35,000 or more, 40,000 or more, 45,000 or more, or 50,000 or more. From the viewpoints of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the weight-average molecular weight (Mw) of component (A) can be 100,000 or less, 80,000 or less, 70,000 or less, 60,000 or less, 55,000 or less, or 50,000 or less. From the viewpoint of easily improving developability (e.g., alkaline developability), the weight-average molecular weight (Mw) of component (A) can be 45,000 or less, 40,000 or less, or 35,000 or less. From these viewpoints, the weight-average molecular weight (Mw) of component (A) can be 10,000–100,000, 10,000–80,000, 10,000–60,000, 30,000–100,000, 30,000–80,000, 30,000–60,000, 40,000–100,000, 40,000–80,000, or 40,000–60,000.

[0055] From the viewpoints of easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the number average molecular weight (Mn) of component (A) can be 5000 or more, 10000 or more, 12000 or more, 15000 or more, 16000 or more, 18000 or more, 20000 or more, or 21000 or more. From the viewpoints of easily improving developability (e.g., alkaline developability), easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the number average molecular weight (Mn) of component (A) can be 50000 or less, 45000 or less, 40000 or less, 35000 or less, 30000 or less, 25000 or less, 22000 or less, or 21000 or less. From the viewpoint of easily improving developability (e.g., alkaline developability), the number average molecular weight (Mn) of component (A) can be 20,000 or less, 18,000 or less, or 16,000 or less. From these viewpoints, the number average molecular weight (Mn) of component (A) can be 5,000–50,000, 5,000–40,000, 5,000–30,000, 10,000–50,000, 10,000–40,000, 10,000–30,000, 20,000–50,000, 20,000–40,000, or 20,000–30,000.

[0056] From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the dispersion (Mw / Mn) of component (A) can be 1.0 or more, 1.5 or more, 2.0 or more, 2.1 or more, 2.2 or more, or 2.3 or more. From the viewpoint of easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, easily obtaining a cured pattern with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the dispersion (Mw / Mn) of component (A) can be 3.0 or less, 2.8 or less, 2.6 or less, 2.5 or less, or 2.4 or less. From the viewpoint of easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the dispersion (Mw / Mn) of component (A) can be 2.3 or less or 2.2 or less. In view of these points, the dispersion (Mw / Mn) of component (A) can be 1.0–3.0, 1.0–2.8, 1.0–2.5, 1.5–3.0, 1.5–2.8, 1.5–2.5, 2.0–3.0, 2.0–2.8 or 2.0–2.5.

[0057] Weight-average molecular weight (Mw), number-average molecular weight (Mn), and dispersion (Mw / Mn) can be determined by gel permeation chromatography (GPC) using a calibration curve of standard polystyrene, and can be determined by the methods described in the examples below. For compounds with low molecular weights that are difficult to determine using this method, other methods can be used to determine the molecular weight and calculate its average.

[0058] Based on the total solid content of the photosensitive resin composition, the content of component (A) can be within the following ranges. From the viewpoint of easily obtaining excellent film-forming properties, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of component (A) can be 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 45% by mass or more, 50% by mass or more, or 52% by mass or more. From the viewpoint of easily obtaining excellent film-forming properties, the content of component (A) can be 53% by mass or more, or 54% by mass or more. From the perspective of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, the content of component (A) can be 90% by mass or less, 85% by mass or less, 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 54% by mass or less, or 53% by mass or less. From these perspectives, the content of component (A) can be 20–90% by mass, 20–70% by mass, 20–60% by mass, 40–90% by mass, 40–70% by mass, 40–60% by mass, 50–90% by mass, 50–70% by mass or 50–60% by mass.

[0059] Relative to a total of 100 parts by mass of components (A) and (B), the content of component (A) can be within the following ranges. From the viewpoint of easily obtaining excellent film-forming properties, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of component (A) can be 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, 40 parts by mass or more, 45 parts by mass or more, 50 parts by mass or more, or 55 parts by mass or more. From the viewpoint of easily obtaining excellent film-forming properties, the content of component (A) can be 56 parts by mass or more, or 57 parts by mass or more. From the perspective of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, the content of component (A) can be 90 parts by mass or less, 85 parts by mass or less, 80 parts by mass or less, 75 parts by mass or less, 70 parts by mass or less, 65 parts by mass or less, 60 parts by mass or less, 58 parts by mass or less, 57 parts by mass or less, 56 parts by mass or less, or 55 parts by mass or less. From these perspectives, the content of component (A) can be 20 to 90 parts by mass, 20 to 70 parts by mass, 20 to 60 parts by mass, 40 to 90 parts by mass, 40 to 70 parts by mass, 40 to 60 parts by mass, 50 to 90 parts by mass, 50 to 70 parts by mass, or 50 to 60 parts by mass.

[0060] The photosensitive resin composition according to this embodiment contains a photopolymerizable compound as component (B). From the viewpoint of obtaining a cured pattern with excellent conformability to a substrate having a recess, component (B) contains a polyfunctional monomer having two or more free radical reactive groups (reactive groups that react via free radicals) and 8 to 16 oxoethylene groups as component (b).

[0061] Groups with olefinic unsaturated bonds can be used as free radical reactive groups, such as (meth)acryloyl groups. (b) In terms of the view that it is easy to obtain a cured pattern with excellent resolution, easy to reduce the hardness of the photosensitive layer, or easy to obtain a cured pattern with excellent followability to a substrate with recesses, the number of free radical reactive groups or the number of (meth)acryloyl groups (the total of acryloyl and methacryloyl groups) can be 2 to 6, 2 to 5, 2 to 4, or 2 to 3.

[0062] From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the number of oxyethylides in component (b) (the total number of oxyethylides in component (b)) can be within the following ranges: The number of oxyethylides can be 8 or more or 10 or more. The number of oxyethylides can be 16 or less, 14 or less, 12 or less, or 10 or less. From these viewpoints, the number of oxyethylides can be 8 to 16, 8 to 14, 8 to 12, 8 to 10, 10 to 16, 10 to 14, or 10 to 12. From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, component (b) may not contain oxypropylene groups.

[0063] From the viewpoints of easily improving the toughness of the cured pattern, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the molecular weight of component (b) can be within the following ranges. The molecular weight of component (b) can be 600 or more, 650 or more, 700 or more, 750 or more, 780 or more, or 800 or more. The molecular weight of component (b) can be 1200 or less, 1150 or less, 1100 or less, 1050 or less, 1000 or less, 950 or less, 900 or less, or 850 or less. From these viewpoints, the molecular weight of component (b) can be 600–1200, 600–1000, 600–900, 700–1200, 700–1000, 700–900, 800–1200, 800–1000, or 800–900.

[0064] From the perspectives of easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent conformability to substrates with recesses, component (b) may contain at least one selected from the group consisting of a bisphenol A backbone and a dimethylolpropane backbone, or may contain a bisphenol A backbone. Component (b) may contain a (meth)acrylate compound having a bisphenol A backbone as a multifunctional monomer having a bisphenol A backbone. Examples of (meth)acrylate compounds having a bisphenol A backbone include EO-modified bisphenol A di(meth)acrylate (EO groups: 8 to 16). Component (b) may contain a (meth)acrylate compound having a dimethylolpropane backbone as a multifunctional monomer having a dimethylolpropane backbone. Examples of (meth)acrylate compounds having a dimethylolpropane backbone include EO-modified dimethylolpropane tetra(meth)acrylate (EO groups: 8 to 16). From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent followability to a substrate with recesses, (b) component may include at least one selected from the group consisting of a (meth)acrylic acid compound having a bisphenol A backbone and a (meth)acrylic acid compound having a di(tri)methylolpropane backbone, or may include a (meth)acrylic acid compound having a bisphenol A backbone.

[0065] (B) Component may include photopolymerizable compounds other than (b). Examples of such photopolymerizable compounds include monofunctional monomers, polyfunctional monomers having 7 or fewer oxyethylidenes, and polyfunctional monomers having 17 or more oxyethylidenes.

[0066] From the viewpoint of obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of component (b) is 90% by mass or more, based on the total amount of component (B). From the viewpoint of easily obtaining a cured pattern with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of component (b) can be 92% by mass or more, 95% by mass or more, 96% by mass or more, 97% by mass or more, 98% by mass or more, or 99% by mass or more, based on the total amount of component (B). From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, component (B) may not contain monofunctional monomers.

[0067] Based on the total solid content of the photosensitive resin composition, the content B1, which is the content of component (B) or component (b), can be within the following ranges. From the viewpoint of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent conformability to substrates with recesses, the content B1 can be 10% by mass or more, 15% by mass or more, 20% by mass or more, 25% by mass or more, 30% by mass or more, 35% by mass or more, 40% by mass or more, 41% by mass or more, or 42% by mass or more. From the viewpoint of easily obtaining excellent film-forming properties, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent conformability to substrates with recesses, the content B1 can be 80% by mass or less, 75% by mass or less, 70% by mass or less, 65% by mass or less, 60% by mass or less, 55% by mass or less, 50% by mass or less, or 45% by mass or less. From the viewpoint of easily obtaining excellent film formability, the content of B1 can be 43% by mass or less, 42% by mass or less, or 41% by mass or less. From these viewpoints, the content of B1 can be 10–80% by mass, 10–60% by mass, 10–50% by mass, 30–80% by mass, 30–60% by mass, 30–50% by mass, 40–80% by mass, 40–60% by mass, or 40–50% by mass.

[0068] The content B2, which is the content of component (B) or component (b) relative to the total of 100 parts by mass of components (A) and (B), can be within the following ranges. From the viewpoints of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, the content B2 can be 10 parts by mass or more, 15 parts by mass or more, 20 parts by mass or more, 25 parts by mass or more, 30 parts by mass or more, 35 parts by mass or more, 40 parts by mass or more, 42 parts by mass or more, 43 parts by mass or more, 44 parts by mass or more, or 45 parts by mass or more. From the viewpoints of easily obtaining excellent film-forming properties, easily reducing the hardness of the photosensitive layer, or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the content of B2 can be 80 parts by weight or less, 75 parts by weight or less, 70 parts by weight or less, 65 parts by weight or less, 60 parts by weight or less, 55 parts by weight or less, 50 parts by weight or less, or 45 parts by weight or less. From the viewpoints of easily obtaining excellent film-forming properties, the content of B2 can be 44 parts by weight or less or 43 parts by weight or less. From these viewpoints, the content of B2 can be 10 to 80 parts by weight, 10 to 60 parts by weight, 10 to 50 parts by weight, 30 to 80 parts by weight, 30 to 60 parts by weight, 30 to 50 parts by weight, 40 to 80 parts by weight, 40 to 60 parts by weight, or 40 to 50 parts by weight.

[0069] From the viewpoint of obtaining a cured pattern with excellent conformability to a substrate having recesses, the mass ratio of component (A) to component (B) (content of component (A) / content of component (B): hereinafter referred to as "mass ratio A / B") is greater than 0 and less than 1.35. From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the mass ratio A / B can be less than 1.33, less than 1.30, less than 1.28, less than 1.27, less than 1.25, less than 1.23, or less than 1.22. From the perspective of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate with recesses, the mass ratio A / B can be 0.10 or higher, 0.30 or higher, 0.50 or higher, 0.60 or higher, 0.80 or higher, 1.00 or higher, exceeding 1.00, 1.05 or higher, 1.10 or higher, 1.15 or higher, 1.20 or higher, or 1.22 or higher. The mass ratio A / B can be 1.23 or higher, 1.25 or higher, 1.27 or higher, 1.28 or higher, 1.30 or higher, or 1.33 or higher. In these respects, the mass ratio A / B can be greater than 0 and less than 1.30, greater than 0 and less than 1.25, 1.00 to 1.35, 1.00 to 1.30, 1.00 to 1.25, 1.10 to 1.35, 1.10 to 1.30, 1.10 to 1.25, 1.20 to 1.35, 1.20 to 1.30, or 1.20 to 1.25.

[0070] From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the mass ratio of component (A) to component (b) (content of component (A) / content of component (b): hereinafter referred to as "mass ratio A / b") can be 1.35 or less, 1.33 or less, 1.30 or less, 1.28 or less, 1.27 or less, 1.25 or less, 1.23 or less, or 1.22 or less. From the viewpoint of easily reducing the hardness of the photosensitive layer or easily obtaining a cured pattern with excellent conformability to a substrate having recesses, the mass ratio A / b can exceed 0, 0.10 or more, 0.30 or more, 0.50 or more, 0.60 or more, 0.80 or more, 1.00 or more, exceeding 1.00, 1.05 or more, 1.10 or more, 1.15 or more, 1.20 or more, or 1.22 or more. The mass ratio A / b can be 1.23 or higher, 1.25 or higher, 1.27 or higher, 1.28 or higher, 1.30 or higher, or 1.33 or higher. In these respects, the mass ratio A / b can be greater than 0 and less than 1.35, greater than 0 and less than 1.30, greater than 0 and less than 1.25, 1.00–1.35, 1.00–1.30, 1.00–1.25, 1.10–1.35, 1.10–1.30, 1.10–1.25, 1.20–1.35, 1.20–1.30, or 1.20–1.25.

[0071] The photosensitive resin composition according to this embodiment contains a photopolymerization initiator as component (C). As component (C), a photopolymerization initiator capable of polymerizing component (B) can be used.

[0072] As component (C), examples include: hexaaryl diimidazole compounds; benzophenone, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-1-butanone, 2-(dimethylamino)-2-[(4-methylphenyl)methyl]-1-[4-(4-morpholino)phenyl]-1-butanone, 4-(2-hydroxyethoxy)phenyl-2-(hydroxy-2-propyl)one, 2-methyl-1-[4-(methylthio)phenyl]-2-morpholino Aromatic ketones such as -acetone-1; quinones such as alkyl anthraquinones; benzoin ethers such as benzoin alkyl ethers; benzoin compounds such as benzoin and alkylbenzoin; benzyl derivatives such as benzyl dimethyl ketal; phosphine oxide compounds such as bis(2,4,6-trimethylbenzoyl)-phenylphosphine oxide, bis(2,6-dimethylbenzoyl)-2,4,4-trimethyl-pentylphosphine oxide, and (2,4,6-trimethylbenzoyl)ethoxyphenylphosphine oxide.

[0073] From the perspectives of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily improving the adhesion of the cured photosensitive resin composition to the substrate (developer resistance), easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, component (C) may contain a hexaarylbisimidazole compound. The aryl group in the hexaarylbisimidazole compound may be phenyl or the like. The hydrogen atom bonded to the aryl group in the hexaarylbisimidazole compound may be replaced by a halogen atom (chlorine atom, etc.).

[0074] The hexaarylbisimidazole compound can be a 2,4,5-triarylimidazolium dimer. Examples of 2,4,5-triarylimidazolium dimers include 2-(o-chlorophenyl)-4,5-diphenylimidazolium dimer, 2-(o-chlorophenyl)-4,5-bis-(m-methoxyphenyl)imidazolium dimer, and 2-(p-methoxyphenyl)-4,5-diphenylimidazolium dimer. From the viewpoints of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily improving the adhesion of the cured photosensitive resin composition to the substrate (developer resistance), easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, the hexaarylbisimidazole compound can contain a 2-(o-chlorophenyl)-4,5-diphenylimidazolium dimer, or it can contain 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-bisimidazole.

[0075] From the perspectives of easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, easily reducing the hardness of the photosensitive layer, or easily obtaining cured patterns with excellent followability to substrates with recesses, the content of hexaarylbisimidazole compound can be 90% by mass or more, 92% by mass or more, 93% by mass or more, 95% by mass or more, 97% by mass or more, or 99% by mass or more, based on the total amount of component (C). The content of hexaarylbisimidazole compound can be 100% by mass or less, based on the total amount of component (C).

[0076] From the perspectives of easily achieving a good balance between improving sensitivity and resolution, easily reducing the hardness of the photosensitive layer, and easily obtaining cured patterns with excellent followability to substrates with recesses, the content of component (C) can be within the following ranges, based on the total solid content of the photosensitive resin composition: The content of component (C) can be 0.1% by mass or more, 0.5% by mass or more, 1.0% by mass or more, 1.5% by mass or more, 2.0% by mass or more, 2.5% by mass or more, or 3.0% by mass or more. The content of component (C) can be 20% by mass or less, 15% by mass or less, 10% by mass or less, 8.0% by mass or less, 6.0% by mass or less, 5.0% by mass or less, 4.5% by mass or less, 4.0% by mass or less, or 3.5% by mass or less. In view of these points, the content of component (C) can be 0.1–20% by mass, 0.1–10% by mass, 0.1–5.0% by mass, 1.0–20% by mass, 1.0–10% by mass, 1.0–5.0% by mass, 3.0–20% by mass, 3.0–10% by mass, or 3.0–5.0% by mass.

[0077] From the perspectives of easily achieving a good balance between improving sensitivity and resolution, easily reducing the hardness of the photosensitive layer, and easily obtaining a cured pattern with excellent followability to substrates with recesses, the content of component (C) can be within the following ranges relative to a total of 100 parts by mass of components (A) and (B). The content of component (C) can be 0.1 parts by mass or more, 0.5 parts by mass or more, 1.0 parts by mass or more, 1.5 parts by mass or more, 2.0 parts by mass or more, 2.5 parts by mass or more, 3.0 parts by mass or more, or 3.5 parts by mass or more. The content of component (C) can be 20 parts by mass or less, 15 parts by mass or less, 10 parts by mass or less, 8.0 parts by mass or less, 6.0 parts by mass or less, 5.0 parts by mass or less, 4.5 parts by mass or less, or 3.5 parts by mass or less. In view of these points, the content of component (C) can be 0.1–20 parts by mass, 0.1–10 parts by mass, 0.1–5.0 parts by mass, 1.0–20 parts by mass, 1.0–10 parts by mass, 1.0–5.0 parts by mass, 3.0–20 parts by mass, 3.0–10 parts by mass, or 3.0–5.0 parts by mass.

[0078] The photosensitive resin composition according to this embodiment may contain a sensitizer as component (D). In this case, the absorption wavelength of the active light used for exposure can be easily and effectively utilized.

[0079] As components (D), examples include dialkylaminobenzophenone compounds, pyrazoline compounds, coumarin compounds, anthracene compounds, xanthone compounds, thioxanthone compounds, oxazole compounds, benzoxazole compounds, thiazole compounds, benzothiazole compounds, triazole compounds, stilbene compounds, triazine compounds, thiophene compounds, naphthalimide compounds, triarylamine compounds, and aminoacridine compounds.

[0080] Examples of dialkylaminobenzophenone compounds include 4,4'-bis(diethylamino)benzophenone and 4-methoxy-4'-dimethylaminobenzophenone.

[0081] Examples of pyrazoline compounds include 1-phenyl-3-(4-methoxystyryl)-5-(4-methoxyphenyl)pyrazoline, 1-phenyl-3-(4-tert-butylstyryl)-5-(4-tert-butylphenyl)pyrazoline, and 1-phenyl-3-biphenyl-5-(4-tert-butylphenyl)pyrazoline.

[0082] Examples of coumarin compounds include 3-benzoyl-7-diethylaminocoumarin, 7-diethylamino-4-methylcoumarin, 3,3'-carbonylbis(7-diethylaminocoumarin), 2,3,6,7-tetrahydro-9-methyl-1H,5H,11H-[1]benzopyrano[6,7,8-ij]quinazino-11-one, etc.

[0083] Examples of anthracene compounds include 9,10-dimethoxyanthracene, 9,10-diethoxyanthracene, 9,10-dipropoxyanthracene, 9,10-dibutoxyanthracene, and 9,10-dipentoxyanthracene.

[0084] From the viewpoint of easily obtaining cured patterns with excellent resolution, component (D) may contain dialkylaminobenzophenone compounds, 4,4'-bis(diethylamino)benzophenone, or compounds that do not conform to tertiary amino compounds.

[0085] The photosensitive resin composition involved in this embodiment may not contain the compound represented by the following general formula (2-1). The content of the compound represented by general formula (2-1) may be less than 0.01 parts by mass, less than 0.01 parts by mass, less than 0.001 parts by mass, less than 0.001 parts by mass, or less than 0.0001 parts by mass, or substantially 0 parts by mass, relative to a total of 100 parts by mass of components (A) and (B).

[0086] In equation (2-1), R 21 R22 and R 23 Each of the following groups independently represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 4 carbon atoms, a phenyl group (which may be substituted by one or more of an alkyl group having 1 to 4 carbon atoms, a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, a phenyl group, an alkoxy group having 1 to 4 carbon atoms, a phenoxy group, and an alkoxycarbonyl group having 2 to 6 carbon atoms), a hydroxyl group, a halogen atom, a cyano group, a carboxyl group, an alkoxy group having 1 to 6 carbon atoms, a phenoxy group, an alkoxycarbonyl group having 2 to 6 carbon atoms, or a benzyl group (which may be substituted by one or more of an alkyl group having 1 to 6 carbon atoms). The following groups may be substituted with alkyl, hydroxyl, halogen, cyano, carboxyl, phenyl, alkoxy, phenoxy, or alkoxycarbonyl groups having 1 to 6 carbon atoms (which may be substituted with 1 to 6 alkyl, hydroxyl, halogen, cyano, carboxyl, phenyl, alkoxy, phenoxy, or alkoxycarbonyl groups having 2 to 6 carbon atoms) or groups represented by the following general formula (2-2), R 21 R 22 and R 23 At least two of them represent groups represented by the following general formula (2-2), where a, b, and c represent integers from 0 to 5 chosen such that the value of a+b+c is 2 or greater. In equation (2-2), R 24 The radical (d) represents an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 1 to 4 carbon atoms, a phenyl group (which may be substituted with one or more of the following: alkyl group having 1 to 4 carbon atoms, hydroxyl group, halogen atom, cyano group, carboxyl group, phenyl group, alkoxy group having 1 to 4 carbon atoms, phenoxy group, and alkoxycarbonyl group having 2 to 6 carbon atoms), a benzyl group (which may be substituted with one or more of the following: alkyl group having 1 to 6 carbon atoms, hydroxyl group, halogen atom, cyano group, carboxyl group, phenyl group, alkoxy group having 1 to 6 carbon atoms, phenoxy group, and alkoxycarbonyl group having 2 to 6 carbon atoms), or an alkylyl group or benzoyl group having 2 to 10 carbon atoms (which may be substituted with one or more of the following: alkyl group having 1 to 6 carbon atoms, hydroxyl group, halogen atom, cyano group, carboxyl group, phenyl group, alkoxy group having 1 to 6 carbon atoms, phenoxy group, and alkoxycarbonyl group having 2 to 6 carbon atoms), where d represents an integer from 1 to 10. The photosensitive resin composition involved in this embodiment may not contain the compound represented by the following general formula (3). The content of the compound represented by general formula (3) may be less than 0.01 parts by mass, less than 0.01 parts by mass, less than 0.001 parts by mass, less than 0.001 parts by mass, or less than 0.0001 parts by mass, or substantially 0 parts by mass, relative to a total of 100 parts by mass of components (A) and (B).

[0087] In equation (3), R31 R 32 R 33 and R 34 Each alkyl group, having 1 to 6 carbon atoms, is represented independently. From the perspective of easily obtaining cured patterns with excellent followability to substrates with recesses, easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (D) can be within the following ranges, based on the total amount of solid components in the photosensitive resin composition. The content of component (D) can be 0.001% by mass or more, 0.005% by mass or more, 0.010% by mass or more, 0.020% by mass or more, 0.025% by mass or more, 0.030% by mass or more, 0.035% by mass or more, or 0.040% by mass or more. (D) The content of component can be less than 3.000% by mass, less than 2.000% by mass, less than 1.000% by mass, less than 0.500% by mass, less than 0.300% by mass, less than 0.200% by mass, less than 0.150% by mass, less than 0.140% by mass, less than 0.120% by mass, less than 0.100% by mass, less than 0.080% by mass, less than 0.050% by mass, or less than 0.045% by mass. In view of these points, the content of component (D) can be 0.001–3.000% by mass, 0.001–1.000% by mass, 0.001–0.100% by mass, 0.010–3.000% by mass, 0.010–1.000% by mass, 0.010–0.100% by mass, 0.030–3.000% by mass, 0.030–1.000% by mass, or 0.030–0.100% by mass.

[0088] From the viewpoints of easily obtaining cured patterns with excellent followability to substrates with recesses, easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (D) can be within the following range relative to a total of 100 parts by mass of components (A) and (B). The content of component (D) can be 0.001 parts by mass or more, 0.005 parts by mass or more, 0.010 parts by mass or more, 0.020 parts by mass or more, 0.030 parts by mass or more, 0.040 parts by mass or more, more than 0.040 parts by mass, 0.041 parts by mass or more, 0.042 parts by mass or more, or 0.043 parts by mass or more. (D) The content of component can be less than 3,000 parts by weight, less than 2,000 parts by weight, less than 1,000 parts by weight, less than 0.500 parts by weight, less than 0.300 parts by weight, less than 0.150 parts by weight, less than 0.150 parts by weight, less than 0.140 parts by weight, less than 0.120 parts by weight, less than 0.100 parts by weight, less than 0.090 parts by weight, less than 0.080 parts by weight, less than 0.070 parts by weight, less than 0.060 parts by weight, less than 0.050 parts by weight, less than 0.048 parts by weight, less than 0.045 parts by weight, less than 0.044 parts by weight, or less than 0.043 parts by weight. In view of these points, the content of component (D) can be 0.001–3.000 parts by mass, 0.001–1.000 parts by mass, 0.001–0.100 parts by mass, 0.010–3.000 parts by mass, 0.010–1.000 parts by mass, 0.010–0.100 parts by mass, 0.030–3.000 parts by mass, 0.030–1.000 parts by mass, or 0.030–0.100 parts by mass.

[0089] From the viewpoints of easily obtaining cured patterns with excellent followability to substrates with recesses, easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (D) relative to 100 parts by weight of component (A) can be within the following ranges: The content of component (D) can be 0.001 parts by weight or more, 0.005 parts by weight or more, 0.010 parts by weight or more, 0.020 parts by weight or more, 0.030 parts by weight or more, 0.040 parts by weight or more, 0.050 parts by weight or more, 0.060 parts by weight or more, 0.065 parts by weight or more, 0.070 parts by weight or more, 0.075 parts by weight or more, or 0.077 parts by weight or more. (D) The content of component can be less than 1,000 parts by weight, less than 0.500 parts by weight, less than 0.300 parts by weight, less than 0.250 parts by weight, less than 0.210 parts by weight, less than 0.200 parts by weight, less than 0.180 parts by weight, less than 0.150 parts by weight, less than 0.120 parts by weight, less than 0.100 parts by weight, less than 0.095 parts by weight, less than 0.090 parts by weight, less than 0.085 parts by weight, less than 0.080 parts by weight, or less than 0.077 parts by weight. In view of these points, the content of component (D) can be 0.001–1.000 parts by mass, 0.001–0.500 parts by mass, 0.001–0.100 parts by mass, 0.010–1.000 parts by mass, 0.010–0.500 parts by mass, 0.010–0.100 parts by mass, 0.050–1.000 parts by mass, 0.050–0.500 parts by mass, or 0.050–0.100 parts by mass.

[0090] From the viewpoints of easily obtaining cured patterns with excellent followability to substrates with recesses, easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (D) relative to 100 parts by weight of component (B) can be within the following ranges: The content of component (D) can be 0.001 parts by weight or more, 0.005 parts by weight or more, 0.010 parts by weight or more, 0.020 parts by weight or more, 0.030 parts by weight or more, 0.040 parts by weight or more, 0.050 parts by weight or more, 0.060 parts by weight or more, 0.070 parts by weight or more, 0.075 parts by weight or more, 0.080 parts by weight or more, 0.085 parts by weight or more, 0.090 parts by weight or more, 0.095 parts by weight or more, or 0.100 parts by weight or more. (D) The content of component (D) may be less than 1,000 parts by weight, less than 0.500 parts by weight, less than 0.450 parts by weight, less than 0.400 parts by weight, less than 0.350 parts by weight, less than 0.330 parts by weight, less than 0.300 parts by weight, less than 0.270 parts by weight, less than 0.250 parts by weight, less than 0.200 parts by weight, less than 0.180 parts by weight, less than 0.150 parts by weight, less than 0.120 parts by weight, less than 0.100 parts by weight, less than 0.095 parts by weight, or less than 0.090 parts by weight. In view of these points, the content of component (D) can be 0.001–1.000 parts by mass, 0.001–0.500 parts by mass, 0.001–0.150 parts by mass, 0.010–1.000 parts by mass, 0.010–0.500 parts by mass, 0.010–0.150 parts by mass, 0.050–1.000 parts by mass, 0.050–0.500 parts by mass, or 0.050–0.150 parts by mass.

[0091] From the viewpoints of easily obtaining cured patterns with excellent followability to substrates with recesses, easily obtaining excellent sensitivity, easily obtaining cured patterns with excellent resolution, or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (D) relative to 100 parts by weight of component (C) can be within the following ranges: The content of component (D) can be 0.01 parts by weight or more, 0.05 parts by weight or more, 0.10 parts by weight or more, 0.30 parts by weight or more, 0.50 parts by weight or more, 0.70 parts by weight or more, 0.80 parts by weight or more, 0.90 parts by weight or more, 1.00 parts by weight or more, 1.05 parts by weight or more, 1.10 parts by weight or more, 1.15 parts by weight or more, or 1.20 parts by weight or more. The content of component (D) may be less than 10.00 parts by weight, less than 9.00 parts by weight, less than 8.00 parts by weight, less than 7.00 parts by weight, less than 6.00 parts by weight, less than 5.00 parts by weight, less than 4.00 parts by weight, less than 3.00 parts by weight, less than 2.50 parts by weight, less than 2.00 parts by weight, less than 1.80 parts by weight, less than 1.50 parts by weight, or less than 1.30 parts by weight. In these respects, the content of component (D) may be 0.01–10.00 parts by weight, 0.01–5.00 parts by weight, 0.01–3.00 parts by weight, 0.10–10.00 parts by weight, 0.10–5.00 parts by weight, 0.10–3.00 parts by weight, 1.00–10.00 parts by weight, 1.00–5.00 parts by weight, or 1.00–3.00 parts by weight.

[0092] From the viewpoint of easily obtaining cured patterns with excellent resolution, the photosensitive resin composition according to this embodiment may contain a polymerization inhibitor as component (E). Examples of polymerization inhibitors include 4-tert-butylcatechol, 4-hydroxy-2,2,6,6-tetramethylpiperidin-N-oxy, p-methoxyphenol, diphenyl-p-benzoquinone, benzoquinone, hydroquinone, gallol, phenothiazine, resorcinol, o-dinitrobenzene, p-dinitrobenzene, m-dinitrobenzene, phenanthraquinone, N-phenyl-2-naphthylamine, cupferron, 2,5-methylquinone, tannic acid, p-benzylaminophenol, tris(4-tert-butyl-3-hydroxy-2,6-dimethylbenzyl)isocyanuric acid, and nitrosamines. From the viewpoint of easily obtaining a cured pattern with excellent resolution, component (E) may contain at least one selected from the group consisting of 4-tert-butylcatechol and 4-hydroxy-2,2,6,6-tetramethylpiperidine-N-oxy.

[0093] Based on the total solid content of the photosensitive resin composition, the content of component (E) can be within the following ranges. From the viewpoint of easily obtaining excellent sensitivity or easily obtaining cured patterns with excellent resolution, the content of component (E) can be 0.001% by mass or more, 0.005% by mass or more, 0.01% by mass or more, 0.02% by mass or more, 0.03% by mass or more, or 0.035% by mass or more. From the viewpoint of easily obtaining excellent sensitivity or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (E) can be 3.0% by mass or less, 2.0% by mass or less, 1.0% by mass or less, 0.5% by mass or less, 0.3% by mass or less, 0.1% by mass or less, 0.08% by mass or less, 0.05% by mass or less, or 0.04% by mass or less. In view of these points, the content of component (E) may be 0.001–3.0% by mass, 0.001–1.0% by mass, 0.001–0.1% by mass, 0.01–3.0% by mass, 0.01–1.0% by mass, 0.01–0.1% by mass, 0.03–3.0% by mass, 0.03–1.0% by mass, or 0.03–0.1% by mass.

[0094] The content of component (E) can be within the following ranges relative to the total of 100 parts by mass of components (A) and (B). From the viewpoint of easily obtaining excellent sensitivity or easily obtaining a cured pattern with excellent resolution, the content of component (E) can be 0.001 parts by mass or more, 0.005 parts by mass or more, 0.01 parts by mass or more, 0.02 parts by mass or more, 0.03 parts by mass or more, or 0.04 parts by mass or more. From the viewpoint of easily obtaining excellent sensitivity or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the content of component (E) can be 3.0 parts by mass or less, 2.0 parts by mass or less, 1.0 parts by mass or less, 0.5 parts by mass or less, 0.3 parts by mass or less, 0.1 parts by mass or less, 0.08 parts by mass or less, 0.05 parts by mass or less, or 0.04 parts by mass or less. In view of these points, the content of component (E) can be 0.001 to 3.0 parts by mass, 0.001 to 1.0 parts by mass, 0.001 to 0.1 parts by mass, 0.01 to 3.0 parts by mass, 0.01 to 1.0 parts by mass, 0.01 to 0.1 parts by mass, 0.03 to 3.0 parts by mass, 0.03 to 1.0 parts by mass, or 0.03 to 0.1 parts by mass.

[0095] From the viewpoint of easy viscosity adjustment, the photosensitive resin composition according to this embodiment may contain an organic solvent. Examples of organic solvents include methanol, ethanol, acetone, methyl ethyl ketone, methyl cellosolve, ethyl cellosolve, toluene, N,N-dimethylformamide, and propylene glycol monomethyl ether.

[0096] The photosensitive resin composition described in this embodiment may contain other components besides those mentioned above. Examples of such components include hydrogen donors (bis[4-(dimethylamino)phenyl]methane, bis[4-(diethylamino)phenyl]methane, N-phenylglycine, colorless crystal violet, etc.), dyes (malachite green, etc.), tribromophenyl sulfone, photochromic agents, heat-resistant color-developing agents, plasticizers (p-toluenesulfonamide, etc.), pigments, fillers, defoamers, flame retardants, stabilizers, adhesion promoters (mixtures of carboxybenzotriazole, 5-amino-1H-tetrazole, and methoxypropanol, etc.), leveling agents, peel accelerators, antioxidants, fragrances, developers, and thermal crosslinking agents. Relative to the total of 100 parts by mass of component (A) and component (B), the content of each component may be more than 0.001 parts by mass, more than 0.005 parts by mass, or more than 0.01 parts by mass, and may be less than 20 parts by mass, less than 10 parts by mass, or less than 5 parts by mass.

[0097] The photosensitive resin composition involved in this embodiment can be in the form of a film. From the viewpoint of easily improving productivity, the thickness of the film-like photosensitive resin composition can be 1 μm or more, 5 μm or more, 10 μm or more, 15 μm or more, more than 15 μm, 16 μm or more, 18 μm or more, 20 μm or more, or 25 μm or more. From the viewpoint of easily obtaining cured patterns with excellent resolution or easily improving the adhesion (developer resistance) of the cured photosensitive resin composition to the substrate, the thickness of the film-like photosensitive resin composition can be 100 μm or less, 80 μm or less, 60 μm or less, 50 μm or less, 40 μm or less, 30 μm or less, or 25 μm or less. In view of these points, the thickness of the film-like photosensitive resin composition can be 1–100 μm, 1–60 μm, 1–30 μm, 10–100 μm, 10–60 μm, 10–30 μm, 20–100 μm, 20–60 μm, or 20–30 μm.

[0098] The photosensitive element according to this embodiment includes a support and a photosensitive layer (photosensitive resin layer) disposed on the support, the photosensitive layer comprising the photosensitive resin composition according to this embodiment. The photosensitive element according to this embodiment may include a protective layer disposed on the photosensitive layer. Figure 1 This is a schematic cross-sectional view showing an example of a photosensitive element. Figure 1 The photosensitive element 10 includes a support 12, a photosensitive layer 14 disposed on the support 12, and a protective layer 16 disposed on the photosensitive layer 14. The protective layer 16 is disposed on the side of the photosensitive layer 14 opposite to the support 12.

[0099] The support can be a polymer film with heat resistance and solvent resistance. Examples of supports include: polyester films such as polyethylene terephthalate (PET) film, polybutylene terephthalate (PBT) film, and polyethylene 2,6-naphthalenedicarboxylate (PEN) film; and polyolefin films such as polyethylene film and polypropylene film.

[0100] From the viewpoint of easily suppressing damage to the support when peeling it from the photosensitive layer, the thickness of the support can be 1 μm or more, 5 μm or more, 10 μm or more, or 15 μm or more. From the viewpoint of easily and appropriately exposing the image with the support in between, the thickness of the support can be 100 μm or less, 50 μm or less, 30 μm or less, or 20 μm or less. From these viewpoints, the thickness of the support can be 1 to 100 μm.

[0101] The photosensitive layer comprises the photosensitive resin composition according to this embodiment, and can be formed from the photosensitive resin composition according to this embodiment. Regarding the thickness of the photosensitive layer (the thickness after evaporation of the organic solvent when the photosensitive resin composition contains organic solvent), the thickness of the film-like photosensitive resin composition can be within the ranges described above.

[0102] The protective layer can be made of polymer films that are heat-resistant and solvent-resistant. Examples of protective layers include: polyester films such as polyethylene terephthalate (PET), polybutylene terephthalate (PBT), and polyethylene 2,6-naphthalenedicarboxylate (PEN); and polyolefin films such as polyethylene and polypropylene.

[0103] From the viewpoint of easily suppressing damage to the protective layer when laminating the photosensitive layer and the support onto the substrate while simultaneously peeling off the protective layer, the thickness of the protective layer can be 1 μm or more, 5 μm or more, 10 μm or more, 15 μm or more, 20 μm or more, or 25 μm or more. From the viewpoint of easily improving productivity, the thickness of the protective layer can be 100 μm or less, 50 μm or less, 40 μm or less, or 30 μm or less. From these perspectives, the thickness of the protective layer can be 1 to 100 μm.

[0104] The photosensitive element involved in this embodiment may have a buffer layer, an adhesive layer, a light-absorbing layer, a gas barrier layer, etc.

[0105] The method for manufacturing a cured pattern (e.g., a method for manufacturing a resist pattern) according to this embodiment includes the following steps: forming a photosensitive layer on a substrate using the photosensitive resin composition according to this embodiment (photosensitive layer formation step); photocuring a portion of the photosensitive layer (exposure step); and removing at least a portion (partial or complete) of the uncured portion of the photosensitive layer to form a cured pattern (e.g., a resist pattern) (development step). The resist pattern may be referred to as a photocurable pattern of the photosensitive resin composition, a relief pattern, etc.

[0106] The substrate may have a conductor layer, or it may have an insulating layer and a conductor layer disposed on the insulating layer. There are no particular limitations on the substrate, and examples include: circuit board for forming circuits having an insulating layer and a conductor layer disposed on the insulating layer; chip pads (lead frame substrates) such as alloy substrates, etc.

[0107] In the photosensitive layer formation process, a photosensitive layer is formed on a substrate using the photosensitive resin composition according to this embodiment. In this process, the photosensitive layer can be formed on the substrate by laminating a film-like photosensitive resin composition onto the substrate, or by laminating the photosensitive layer of the photosensitive element according to this embodiment onto the substrate. In this process, the photosensitive layer and the support can be formed on the substrate by laminating the photosensitive layer of the photosensitive element according to this embodiment onto the substrate with the photosensitive layer positioned closer to the substrate than the support. When the photosensitive element according to this embodiment has a protective layer, the photosensitive layer can be laminated onto the substrate after removing the protective layer from the photosensitive element. When the photosensitive layer of the photosensitive element according to this embodiment is laminated onto the substrate, the photosensitive layer can be pressed onto the substrate while being heated. The heating temperature during crimping can be 70–130℃, and the crimping pressure can be 0.1–1.0 MPa (1–10 kgf / cm²). 2 These conditions can be selected appropriately as needed. The photosensitive layer formation process can be carried out under reduced pressure.

[0108] In the exposure process, a portion of the photosensitive layer is photocured. This can be achieved by exposing the photosensitive layer to active light, or by exposing the photosensitive layer to active light through a support. In the exposure process, a photocured portion (latent image) is formed by photocuring the exposed portion exposed to active light.

[0109] As for exposure methods, known exposure techniques can be applied, including methods such as illuminating active light in an image-like manner through a negative or positive mask pattern called the artwork (mask exposure method), LDI (Laser Direct Imaging) exposure method, and methods that use active light projecting an image onto a mask and illuminating it in an image-like manner through a lens (projection exposure method). Among these, from the viewpoint of easily obtaining excellent resolution, LDI exposure method or projection exposure method can be used. Projection exposure method can also be called an exposure method using active light with attenuated energy.

[0110] As for the light source of active light, there are no particular restrictions as long as it is a commonly used and known light source, and a light source that effectively emits ultraviolet light can be used. Examples of light sources that effectively emit ultraviolet light include carbon arc lamps, mercury vapor arc lamps, ultra-high pressure mercury lamps, high pressure mercury lamps, xenon lamps, gas lasers (argon lasers, etc.), solid-state lasers (YAG lasers, etc.), and semiconductor lasers (gallium nitride-based blue-violet lasers, etc.). Among these, from the viewpoint of easily achieving a good balance in improving resolution and alignment, a light source capable of emitting i-ray monochromatic light with an exposure wavelength of 365 nm, a light source capable of emitting h-ray monochromatic light with an exposure wavelength of 405 nm, or a light source capable of emitting active light with an exposure wavelength of i-, h-, and g-, mixed rays, can be used. Alternatively, a light source capable of emitting i-ray monochromatic light with an exposure wavelength of 365 nm or h-ray monochromatic light with an exposure wavelength of 405 nm can be used. Examples of light sources capable of emitting i-ray monochromatic light with an exposure wavelength of 365 nm include ultra-high pressure mercury lamps. Examples of light sources capable of emitting h-ray monochromatic light with an exposure wavelength of 405 nm include blue-violet laser diodes with an exposure wavelength of 405 nm.

[0111] In the developing process, at least a portion of the uncured portion of the photosensitive layer is removed to form a cured pattern (the photocured portion of the photosensitive layer). When a support is placed on the photosensitive layer during the exposure process, the developing process can be performed after the support is peeled off. The developing method can be wet developing or dry developing.

[0112] In the case of wet development, a developer solution compatible with the photosensitive resin composition can be used, and development can be performed using known wet development methods. Examples of wet development methods include immersion, rotary immersion, high-pressure spraying, brushing, scrubbing, and agitation immersion. One wet development method can be used alone, or two or more methods can be used in combination.

[0113] The developer can be appropriately selected based on the composition of the photosensitive resin composition. Examples of developers include alkaline aqueous solutions and organic solvent developers.

[0114] From the perspective of safety, stability, and ease of operation, alkaline aqueous solutions can be used as developers. Examples of alkaline aqueous solutions include: hydroxides such as lithium, sodium, or potassium hydroxides; carbonates such as lithium, sodium, potassium, or ammonium carbonates or bicarbonates; alkali metal phosphates such as potassium phosphate and sodium phosphate; alkali metal pyrophosphates such as sodium pyrophosphate and potassium pyrophosphate; sodium borate; sodium metasilicate; tetramethylammonium hydroxide; ethanolamine; ethylenediamine; diethylenetriamine; 2-amino-2-hydroxymethyl-1,3-propanediol; 1,3-diamino-2-propanol; morpholine, etc.

[0115] Examples of alkaline aqueous solutions include dilute solutions of 0.1–5% by mass sodium carbonate, 0.1–5% by mass potassium carbonate, 0.1–5% by mass sodium hydroxide, and 0.1–5% by mass sodium tetraborate. The pH of the alkaline aqueous solution used for development can be in the range of 9–11. The temperature of the alkaline aqueous solution can be adjusted according to the developability of the photosensitive layer. Alkaline aqueous solutions may contain surfactants, defoamers, and small amounts of organic solvents to promote development.

[0116] Examples of organic solvents used in alkaline aqueous solutions include 3-propanone alcohol, acetone, ethyl acetate, alkoxyethanol (containing alkoxy groups with 1 to 4 carbon atoms), ethanol, isopropanol, butanol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether.

[0117] Examples of organic solvents used in organic solvent developers include 1,1,1-trichloroethane, N-methyl-2-pyrrolidone, N,N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, and γ-butyrolactone. From the viewpoint of preventing ignition, the content of the organic solvent can be adjusted to a range of 1–20% by mass by adding water to the organic solvent developer.

[0118] In the method for manufacturing cured patterns according to this embodiment, post-exposure bake (PEB) can be performed after the exposure step and before the development step. The temperature of the post-exposure bake can be 50 to 100°C. Hot plates, box dryers, heating rollers, etc., can be used as the heating device.

[0119] In the method for manufacturing a cured pattern according to this embodiment, at least a portion of the uncured portion can be removed during the developing process, followed by heating at 60–250°C or 0.2–10 J / cm². 2 The exposure amount further solidifies the pattern of the solidified material.

[0120] The conductor pattern manufacturing method according to this embodiment includes a step of forming a conductor pattern by using a cured pattern (resist pattern) obtained by the cured pattern manufacturing method according to this embodiment as a mask. In the conductor pattern manufacturing method according to this embodiment, the conductor pattern can be formed by performing a plating or etching process using the cured pattern (resist pattern) obtained by the cured pattern manufacturing method according to this embodiment as a mask, or by performing a plating or etching process on a substrate on which the cured pattern obtained by the cured pattern manufacturing method according to this embodiment is formed. Examples of constituent materials for the conductor pattern include copper, tin alloy (solder), nickel, and gold.

[0121] In the method for manufacturing a conductor pattern according to the first embodiment, a cured pattern obtained by the method for manufacturing a cured pattern according to this embodiment is used as a mask, and a plating process is performed on at least a portion (or all) of the portion of the substrate where no cured pattern is formed, thereby forming a conductor pattern. In the method for manufacturing a conductor pattern according to the first embodiment, when the substrate has a conductor layer and a cured pattern obtained by the method for manufacturing a cured pattern according to this embodiment is formed on the conductor layer, the cured pattern can be used as a mask, and a plating process is performed on at least a portion (or all) of the portion of the conductor layer of the substrate where no cured pattern is formed to form a conductor pattern. The materials of the conductor layer of the substrate and the plating layer (conductor layer) formed in the plating process can be the same or different. When the materials of the conductor layer of the substrate and the plating layer (conductor layer) formed in the plating process are the same, the conductor layer and the plating layer can be integrated. The plating process can be electroplating or electroless plating. Examples of plating processes include copper plating, tin alloy plating, nickel plating, and gold plating.

[0122] In the method for manufacturing a conductor pattern according to the second embodiment, with a substrate having a conductor layer and a cured pattern obtained by the method for manufacturing a cured pattern according to this embodiment formed on the conductor layer, the cured pattern (resist pattern) is used as a mask to etch away at least a portion (partial or all) of the conductor layer not covered by the cured pattern, thereby forming a conductor pattern covered by the cured pattern. The etching method can be appropriately selected depending on the conductor layer to be removed.

[0123] The method for manufacturing conductor patterns according to this embodiment may include a step of removing the cured pattern on the substrate after the above-described plating or etching process. The cured pattern can be removed, for example, by an aqueous solution that is more alkaline than the alkaline aqueous solution used in the developing process.

[0124] In the method for manufacturing a conductor pattern according to the first embodiment, if the substrate has a conductor layer, the portion of the conductor layer of the substrate covered by the cured pattern can be removed by etching (e.g., flash etching) after the cured pattern has been removed. The etching method can be appropriately selected depending on the conductor layer to be removed.

[0125] One aspect of the conductor pattern manufacturing method according to this embodiment is a wiring substrate manufacturing method (e.g., a printed wiring board manufacturing method). This wiring substrate manufacturing method includes a step of using a cured pattern obtained by the cured pattern manufacturing method according to this embodiment as a mask to form a wiring pattern (e.g., a circuit) as a conductor pattern. The wiring substrate according to this embodiment can be obtained by the wiring substrate manufacturing method according to this embodiment. The wiring substrate according to this embodiment can be a single-layer printed wiring board, a multi-layer printed wiring board, or a printed wiring board with small-diameter through-holes.

[0126] Figure 2 This is a schematic cross-sectional view illustrating an example of a method for manufacturing a conductor pattern (semi-additive method). Figure 2 In (a), a substrate 20 is prepared. The substrate 20 has an insulating layer 22 and a conductor layer 24 disposed on the insulating layer 22. The conductor layer 24 is, for example, a copper layer. Figure 2 In (b), in the case of Figure 1 After the protective layer 16 of the photosensitive element 10 is peeled off, the photosensitive layer 14 and the support 12 of the photosensitive element 10 are laminated on the substrate 20 (photosensitive layer formation process). Figure 2 In (c), the active light L that projects the image of the photomask onto the photosensitive layer 14 through the support 12 (exposure process of projection exposure method). Figure 2 In (d), the portion of the photosensitive layer 14 other than the photocurable portion is removed from the substrate 20, thereby forming a cured pattern 14a (the photocurable portion of the photosensitive layer 14) on the substrate 20 (development process). Figure 2 In (e), by using the cured pattern 14a as a mask for plating, a plating layer 30 is formed on the conductor layer 24 not covered by the cured pattern 14a in the substrate 20. Figure 2 In (f), after removing the cured pattern 14a, the portion of the conductor layer 24 not covered by the cured pattern 14a is removed, thereby forming the conductor layer 24a. Thus, a conductor pattern 40 consisting of the conductor layer 24a and the plating layer 30 is formed.

[0127] Example The present invention will be further described in detail below through embodiments, but the present invention is not limited to these embodiments.

[0128] <Production of Adhesive Polymers> (Adhesive polymer A1) Solution (a) was prepared by mixing 27 parts by mass of methacrylic acid, 45 parts by mass of styrene, 23 parts by mass of benzyl methacrylate, 5 parts by mass of methyl methacrylate, and 0.9 parts by mass of azobisisobutyronitrile. Solution (b) was prepared by dissolving 0.5 parts by mass of azobisisobutyronitrile in 50 parts by mass of a mixture of 30 parts by mass of 1-methoxy-2-propanol and 20 parts by mass of toluene.

[0129] 500 parts by mass of a mixture (x1) consisting of 300 parts by mass of 1-methoxy-2-propanol and 200 parts by mass of toluene were added to a flask equipped with a stirrer, reflux cooler, thermometer, dropping funnel, and nitrogen inlet tube. Nitrogen gas was then purged into the flask, and the mixture (x1) was heated to 80°C while being stirred. Next, the above solution (a) was added dropwise to the mixture (x1) at a constant rate over 4 hours to obtain mixture (x2), and then mixture (x2) was stirred at 80°C for 2 hours. Next, the above solution (b) was added dropwise to the mixture (x2) at a constant rate over 10 minutes to obtain mixture (x3), and then mixture (x3) was stirred at 80°C for 3 hours. Next, while stirring the mixture (x3), the mixture (x3) was heated to 95°C over 30 minutes and then maintained at 95°C for 2 hours. After stirring was stopped, the mixture (x3) was cooled to room temperature (25°C), thus obtaining a solution of adhesive polymer A1. The non-volatile component (solid component) of the adhesive polymer A1 solution was 49% by mass. The weight-average molecular weight (Mw) of adhesive polymer A1 was 50,000, the number-average molecular weight (Mn) was 21,000, and the acid value was 176 mg KOH / g.

[0130] The weight-average molecular weight and number-average molecular weight mentioned above were determined by gel permeation chromatography (GPC) under the following conditions and derived by conversion using a calibration curve of standard polystyrene.

[0131] [GPC Conditions] Pump: Hitachi L-6000 model (manufactured by Hitachi, Ltd., product name) Chromatographic columns: Gelpack GL-R420, Gelpack GL-R430, Gelpack GL-R440 (all manufactured by Resonac Holdings Corporation). Eluent: Tetrahydrofuran Measurement temperature: 40℃ Flow rate: 2.05 mL / min Detector: Hitachi L-3300 RI (manufactured by Hitachi, Ltd., product name) The acid value was determined using the following procedure. First, 1 g of the adhesive polymer, the subject of the acid value test, was accurately weighed. Next, 30 g of acetone was added to the adhesive polymer to dissolve it uniformly, thus obtaining a solution. Then, an appropriate amount of phenolphthalein, as an indicator, was added to the solution, and titration was performed using a 0.1 N aqueous solution of potassium hydroxide (KOH). The mass of potassium hydroxide (mg) required to neutralize the acetone solution of the adhesive polymer was calculated, and the acid value was thus determined.

[0132] (Adhesive polymer A2) Solution (a) was prepared by mixing 27 parts by mass of methacrylic acid, 50 parts by mass of styrene, 20 parts by mass of benzyl methacrylate, 3 parts by mass of 2-hydroxyethyl methacrylate, and 0.9 parts by mass of azobisisobutyronitrile. Otherwise, a solution of adhesive polymer A2 was obtained in the same manner as adhesive polymer A1. The non-volatile component (solids) of the solution of adhesive polymer A2 was 49% by mass. The weight-average molecular weight (Mw) of adhesive polymer A2 was 35,000, the number-average molecular weight (Mn) was 16,000, and the acid value was 176 mg KOH / g.

[0133] (Adhesive polymer A3) Solution (a) was prepared by mixing 25 parts by mass of methacrylic acid, 25 parts by mass of styrene, 50 parts by mass of methyl methacrylate, and 0.9 parts by mass of azobisisobutyronitrile. Otherwise, a solution of adhesive polymer A3 was obtained in the same manner as adhesive polymer A1. The weight-average molecular weight (Mw) of adhesive polymer A3 was 40,000.

[0134] <Preparation of Photosensitive Resin Compositions> The adhesive polymers listed in Table 1, the photopolymerizable compounds listed in Table 1, the photopolymerization initiator (BCIM: 2,2'-bis(o-chlorophenyl)-4,4',5,5'-tetraphenyl-1,2'-bisimidazole, manufactured by Hampford), the sensitizers listed in Table 1, 0.03 parts by weight of 4-tert-butylcatechol (polymerization inhibitor, manufactured by DIC Corporation, product name "DIC-TBC"), 0.01 parts by weight of 4-hydroxy-2,2,6,6-tetramethylpiperidin-N-oxy (polymerization inhibitor, manufactured by Adeka Corporation, product name "LA-7RD"), 0.7 parts by weight of colorless crystal violet (manufactured by Yamada Chemical Co., Ltd.), 0.05 parts by weight of malachite green (manufactured by OSAKAORGANIC CHEMICAL INDUSTRY LTD.), and the adhesion promoter (a mixture of carboxybenzotriazole, 5-amino-1H-tetrazole and methoxypropanol, SANWA KASEI) A photosensitive resin composition was prepared by mixing 1.0 parts by weight of CORPORATION (manufactured under the product name "SF-808H"). The adhesive polymer was supplied using a solution of the above-mentioned adhesive polymer. Table 1 shows the proportions of the adhesive polymer, photopolymerizable compound, photopolymerization initiator, and sensitizer (mass of non-volatile components (solid content), in parts by weight).

[0135] The following components were used as photopolymerizable compounds as shown in Table 1.

[0136] B1: EO-modified bisphenol A dimethacrylate (a compound conforming to component (b), EO groups: 10 (total), molecular weight: 804, manufactured by Resonac Holdings Corporation, product name "FA-321M") B2: EO-modified bisphenol A dimethacrylate (compounds that do not conform to component (b), EO groups: 4 (total value), manufactured by Shin-Nakamura Chemical Co., Ltd., product name "BPE-200") B3: (PO)(EO)(PO) modified dimethacrylate (a compound that does not conform to component (b), EO groups: 6 (total), PO groups: 12 (total), molecular weight: 1114, manufactured by Resonac Holdings Corporation, product name "FA-024M") The following components were used as sensitizers as shown in Table 1.

[0137] D1: 4,4'-Bis(diethylamino)benzophenone, manufactured by Hodogaya Chemical Co., Ltd. D2: A compound represented by the following formula <Fabrication of Photosensitive Elements> A polyethylene terephthalate film (manufactured by TORAY INDUSTRIES, INC., product name "FB-40", thickness: 16 μm) was prepared as a support. The aforementioned photosensitive resin composition was uniformly coated onto the support, and then dried sequentially using a hot air convection dryer at 80°C and 120°C, thereby forming a photosensitive layer (a film-like photosensitive resin composition, dried thickness: 25 μm). A polyethylene film (manufactured by TAMAPOL CHEMICAL Co., Ltd., product name "NF-15A", thickness: 28 μm) was adhered to the photosensitive layer as a protective layer, thus obtaining a photosensitive element having a support, a photosensitive layer, and a protective layer in sequence.

[0138] <Determination of absorbance> Using a UV-Vis spectrophotometer (manufactured by Hitachi High-Tech Corporation, product name "Hitachi Spectrophotometer U-3310"), the absorbance of the above-mentioned photosensitive element was measured under the following measurement conditions, and the absorbance of each 1 μm thickness of the photosensitive layer for light at wavelengths of 365 nm and 405 nm was obtained. Furthermore, the individual absorbance of the support and protective layer in the above-mentioned photosensitive element was obtained using the same method. The absorbance of each 1 μm thickness of the photosensitive layer was obtained by subtracting the absorbance of the support and protective layer from the absorbance of the photosensitive element, and the results are shown in Table 1.

[0139] [Measurement Conditions] Temperature: 20℃ (in cleanroom environment) Slit width: 2nm Scanning speed: 300nm / minute Sampling interval: 0.50nm Wavelength range: 500nm to 200nm <Evaluation> (Hardness of the photosensitive layer) While peeling off the protective layer, the photosensitive element was laminated at room temperature (25°C) with the photosensitive layer attached to the glass plate, thereby obtaining a laminate consisting of a glass plate, a photosensitive layer, and a support in sequence. Lamination was performed using a 110°C hot roller at a pressing pressure of 0.4 MPa and a roller speed of 1.0 m / min.

[0140] The hardness of the photosensitive layer was evaluated using a pressure-type hardness tester (Fischerscope HCV, Model H100SMC device, manufactured by Fischer Technology, Inc.) following the procedure below. First, the tip of a pyramidal jig was brought into contact with the surface of the support of the laminate, and then the jig was pressed along the lamination direction of the laminate with a load of 300 mN for 10 seconds. Next, the maximum load was maintained for 5 seconds, and then the load was released. The indentation depth (in μm) at the point when the maximum load was maintained for 5 seconds was obtained and used as an indicator of the hardness of the photosensitive layer. The results are shown in Table 1.

[0141] (Following) A copper-clad laminate (manufactured by Resonac Holdings Corporation, product name "MCL-E67") with copper foil (thickness: 35 μm) on both sides of a glass epoxy material was pickled and washed, and then dried with airflow. Next, the copper-clad laminate was heated to 80°C, and while peeling off the protective layer, the photosensitive layer was laminated to the copper foil of the copper-clad laminate, thereby obtaining a laminate A1 comprising a copper-clad laminate, a photosensitive layer, and a support in sequence. Lamination was performed using a 110°C hot roller at a pressing pressure of 0.4 MPa and a roller speed of 1.0 m / min.

[0142] After placing a negative mask with a pattern of line width (L) / line spacing (S) (hereinafter referred to as "L / S") = 100μm / 100μm on the support of the above-mentioned laminate A1, the photosensitive layer is exposed through the support using a projection exposure device (manufactured by Ushio Inc., product name "UX-2240") that uses an ultra-high pressure mercury lamp (wavelength 365nm) as the light source. The exposure amount (irradiation energy) is 11 grids after the number of residual grids after development of the 41-step exposure scale. This results in laminate A2. Regarding the exposure amount where the number of residual grids after development of the 41-grid staged exposure ruler becomes 11 grids, after placing the 41-grid staged exposure ruler (manufactured by Resonac Holdings Corporation) on the support of the aforementioned laminate A1, the exposure amount where the number of residual grids after development of the 41-grid staged exposure ruler becomes 11 grids is obtained in advance using a projection exposure device (manufactured by Ushio Inc., product name "UX-2240") that uses an ultra-high pressure mercury lamp (wavelength 365nm) as the light source.

[0143] Next, the photosensitive layer was exposed by peeling the support from the laminate A2. Then, the unexposed areas were removed by spraying a 1.0% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time, thereby obtaining a resist pattern (exposed area of ​​the photosensitive layer) with L / S = 100μm / 100μm on the copper-clad laminate. The minimum development time was evaluated beforehand using the following procedure: First, the laminate A2 was cut into a rectangular shape (12.5cm × 4.0cm), and the support was peeled off, thus obtaining a test piece. Next, the unexposed photosensitive layer in the test piece was spray-developed using a 1.0% by mass sodium carbonate aqueous solution at 30°C at a pressure of 0.18MPa. The shortest time at which the complete removal of the unexposed photosensitive layer could be visually confirmed was taken as the minimum development time.

[0144] After obtaining the aforementioned resist pattern, the entire copper foil (copper foil of the copper-clad laminate) exposed from the resist pattern was etched using an aqueous copper chloride solution, thereby obtaining two laminates A3 with recesses extending in one direction at depths (etch depths) of 3.5 μm and 5.0 μm. Subsequently, the resist pattern of laminate A3 was stripped using an aqueous sodium hydroxide solution, resulting in two substrates X with different recess depths in the area exposed from the copper foil.

[0145] After heating the substrate X to 80°C, the protective layer was peeled off, and the photosensitive element was laminated in a direction perpendicular to the length direction of the recess, with the photosensitive layer in contact with the substrate X, thereby obtaining a laminate B1 having the substrate X, the photosensitive layer, and the support in sequence. Lamination was performed using a 110°C hot roller at a pressing pressure of 0.4 MPa and a roller speed of 1.0 m / min.

[0146] After placing a negative mask with a pattern of L / S = 10μm / 10μm (a pattern orthogonal to the length direction of the recess) on the support of the aforementioned laminate B1, the photosensitive layer was exposed through the support using a projection exposure apparatus (manufactured by Ushio Inc., product name "UX-2240") using an ultra-high pressure mercury lamp (wavelength 365nm) as the light source, with an exposure amount (irradiation energy) of 11 frames remaining after development of a 41-frame staged exposure scale, thereby obtaining laminate B2. Regarding the exposure amount of 11 frames remaining after development of the 41-frame staged exposure scale, after placing a 41-frame staged exposure scale (manufactured by Resonac Holdings Corporation) on the support of the aforementioned laminate B1, the exposure amount of 11 frames remaining after development of the 41-frame staged exposure scale was obtained in advance using a projection exposure apparatus (manufactured by Ushio Inc., product name "UX-2240") using an ultra-high pressure mercury lamp (wavelength 365nm) as the light source.

[0147] Next, the photosensitive layer was exposed by peeling the support from the laminate B2. Then, the unexposed areas were removed by spraying a 1.0% by mass sodium carbonate aqueous solution at 30°C for twice the minimum development time, thereby obtaining an evaluation laminate (two evaluation laminates with recess depths of 3.5 μm and 5.0 μm in substrate X) on substrate X, exhibiting a resist pattern (exposed areas of the photosensitive layer) with L / S = 10 μm / 10 μm. The minimum development time was pre-evaluated according to the following procedure: First, the laminate B2 was cut into a rectangular shape (12.5 cm × 4.0 cm), and the support was peeled off, thus obtaining a test piece. Next, the unexposed photosensitive layer in the test piece was spray-developed using a 1.0% by mass sodium carbonate aqueous solution at 30°C at a pressure of 0.18 MPa. The shortest time at which the complete removal of the unexposed photosensitive layer could be visually confirmed was taken as the minimum development time.

[0148] For two evaluation laminates with recess depths of 3.5 μm and 5.0 μm in substrate X, SEM and fluorescence microscopy were used to observe 160 points at the interface between substrate X and the resist pattern (L / S = 10 μm / 10 μm) to confirm the presence or absence of voids at the interface. Cases where no voids were detected in more than 90% of the measured areas were classified as "A", cases where no voids were detected in more than 80% but less than 90% of the measured areas were classified as "B", and cases where no voids were detected in less than 80% of the measured areas were classified as "C". The results are shown in Table 1.

[0149] [Table 1]

[0150] Symbol Explanation 10-Photosensitive element, 12-Support, 14-Photosensitive layer, 14a-Curated pattern, 16-Protective layer, 20-Substrate, 22-Insulating layer, 24, 24a-Conductor layer, 30-Platinum layer, 40-Conductor pattern, L-Active light ray.

Claims

1. A photosensitive resin composition comprising a binder polymer, a photopolymerizable compound, and a photopolymerization initiator, wherein, The photopolymerizable compound comprises a polyfunctional monomer having two or more free radical reactive groups and 8 to 16 oxoethylidenes. Based on the total amount of the photopolymerizable compound, the content of the multifunctional monomer is 90% by mass or more. The mass ratio of the adhesive polymer to the photopolymerizable compound is greater than 0 and less than 1.

35. The absorbance of the photosensitive layer formed using the photosensitive resin composition for light at a wavelength of 365 nm is less than 0.0220 per 1 μm thickness.

2. The photosensitive resin composition according to claim 1, wherein, The absorbance of the photosensitive layer per 1 μm thickness for light with a wavelength of 405 nm is less than 0.0220.

3. The photosensitive resin composition according to claim 1, wherein, Based on the total amount of the photopolymerizable compound, the content of the multifunctional monomer is 96% by mass or more.

4. The photosensitive resin composition according to claim 1, wherein, The mass ratio of the adhesive polymer to the photopolymerizable compound is greater than 0 and less than 1.

25.

5. The photosensitive resin composition according to claim 1, wherein, The molecular weight of the multifunctional monomer is 600 to 1200.

6. The photosensitive resin composition according to claim 1, wherein, The multifunctional monomer further has a bisphenol A backbone.

7. The photosensitive resin composition according to claim 1, wherein, The adhesive polymer has styrene compounds as monomer units. Based on the total amount of monomer units constituting the adhesive polymer, the content of monomer units of the styrene compound exceeds 30% by mass.

8. The photosensitive resin composition according to claim 1, wherein, The adhesive polymer has styrene compounds and (meth)acrylate arylates as monomer units.

9. The photosensitive resin composition according to claim 8, wherein, The adhesive polymer further comprises (meth)acrylate hydroxyalkyl ester as a monomer unit.

10. The photosensitive resin composition according to claim 1, further comprising a sensitizer.

11. The photosensitive resin composition according to claim 10, wherein, The sensitizer comprises a dialkylaminobenzophenone compound.

12. The photosensitive resin composition according to claim 10, wherein, The content of the sensitizer is less than 0.100 parts by mass relative to the total of 100 parts by mass of the adhesive polymer and the photopolymerizable compound.

13. A photosensitive element comprising a support and a photosensitive layer disposed on the support, The photosensitive layer comprises the photosensitive resin composition according to any one of claims 1 to 12.

14. A cured product, which is a cured product of the photosensitive resin composition according to any one of claims 1 to 12.

15. A method for manufacturing a cured pattern, comprising the following steps: A photosensitive layer is formed on a substrate using the photosensitive resin composition according to any one of claims 1 to 12; Photocuring a portion of the photosensitive layer; and At least a portion of the uncured portion of the photosensitive layer is removed to form a cured pattern.

16. A method for manufacturing a conductor pattern, comprising the following steps: The cured pattern obtained by the method for manufacturing the cured pattern according to claim 15 is used as a mask to form a conductor pattern.

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