camera device

Abstract

The present disclosure provides a camera device capable of suppressing vibration leakage from a vibrating body without increasing the size of a fixing portion. The camera device (100) includes an outermost lens (1), a fixing portion (2), a vibrating body (3), a piezoelectric element (5), and a housing (8). The outermost lens (1) transmits light of a predetermined wavelength. The fixing portion (2) is a cylindrical shape that holds the outermost lens (1). The vibrating body (3) is disposed in the fixing portion (2) to vibrate the outermost lens (1). The piezoelectric element (5) is provided to the vibrating body (3) to vibrate the vibrating body (3). The fixing portion (2) is directly connected to the housing (8) by welding at a side opposite to a side holding the outermost lens (1).

Description

Technical Field

[0001] This disclosure relates to camera devices. Background Technology

[0002] Cameras are installed at the front and rear of the vehicle. The vehicle uses the images obtained from these cameras to control safety devices or perform driver assistance controls. Most of these cameras are located on the outside of the vehicle, so sometimes raindrops (water droplets), mud, dust, and other foreign objects adhere to the light-transmitting materials (protective covers, lenses) covering the outside.

[0003] When a foreign object adheres to a light-transmitting body, the foreign object is reflected in the image obtained by the imaging device, resulting in an unclear image. Therefore, in International Publication No. 2023 / 127197 (Patent Document 1), a vibration device that causes the light-transmitting body to vibrate is provided in the imaging device in order to remove foreign objects attached to the surface of the light-transmitting body.

[0004] Existing technical documents

[0005] Patent documents

[0006] Patent Document 1: International Publication No. 2023 / 127197 Summary of the Invention

[0007] The problem the invention aims to solve

[0008] In the imaging device described in Patent Document 1, a vibration device is constructed by combining the outermost lens (transmitter), the vibrator, the piezoelectric element, and the fixing part.

[0009] However, in the camera device described in Patent Document 1, in order to suppress vibration leakage from the vibrating body, it is necessary to increase the mass of the fixing part itself, which results in the problem that the size of the fixing part becomes larger.

[0010] Therefore, the purpose of this disclosure is to provide a camera device that can suppress vibration leakage from a vibrating body without increasing the size of the fixed part.

[0011] Solution for solving the problem

[0012] The imaging device disclosed herein includes a light-transmitting body, a first housing, a vibrating body, a piezoelectric element, and a second housing. The light-transmitting body allows light of a predetermined wavelength to pass through. The first housing is a cylindrical shape that holds the light-transmitting body. The vibrating body is disposed within the first housing and causes the light-transmitting body to vibrate. The piezoelectric element is disposed within the vibrating body and causes the vibrating body to vibrate. The side of the first housing opposite to the side holding the light-transmitting body is directly connected to the second housing by welding.

[0013] Invention Effects

[0014] According to this disclosure, since the side of the first housing opposite to the side holding the light-transmitting body is directly connected to the second housing by welding, vibration leakage from the vibrating body can be suppressed without increasing the size of the first housing (fixed part). Attached Figure Description

[0015] Figure 1 This is a perspective view of the camera device in the embodiment.

[0016] Figure 2 This is a cross-sectional view of the camera device according to the embodiment.

[0017] Figure 3 This is a diagram illustrating an example of the connection between the retaining member and the fixing part of the inner lens.

[0018] Figure 4 This is a cross-sectional view of the camera device in Modified Example 1.

[0019] Figure 5 This is a cross-sectional view of the camera device in Modified Example 2.

[0020] Figure 6 This is a cross-sectional view of the camera device in variation 3. Detailed Implementation

[0021] The imaging device of this disclosure will now be described in detail with reference to the accompanying drawings. In addition, the same reference numerals in the drawings denote the same or equivalent parts. The imaging device described below is, for example, for vehicle use, and is designed to vibrate a light-transmitting body (e.g., the outermost lens) to remove foreign objects adhering to its surface. The imaging device is not limited to vehicle use. For example, it can also be applied to security surveillance cameras, drones, etc.

[0022] (Implementation Method)

[0023] Figure 1 This is a perspective view of the camera device 100 according to the embodiment. Figure 2 This is a cross-sectional view of the imaging device 100 according to the embodiment. Furthermore, the X, Y, and Z directions in the figure represent the lateral, depth, and height directions of the imaging device 100, respectively. The imaging device 100 includes a fixing part 2 (first housing) that holds the outermost lens 1 and a housing 8 (second housing) directly connected to the fixing part by welding. A vibrator 3, an inner lens 4, and a piezoelectric element 5 are disposed inside the fixing part 2. A sensor substrate 6 (first substrate) on which an imaging element (not shown) is mounted is disposed inside the housing 8. The imaging element is arranged on the sensor substrate 6 such that the outermost lens 1 and the inner lens 4 are aligned in the field of view.

[0024] Furthermore, after aligning and adjusting the outermost lens 1 and the inner lens 4, the holding member 41 of the inner lens 4 is fixed to the fixing part 2. After aligning and adjusting the inner lens 4 and the imaging element, the sensor substrate 6 is fixed to the holding member 41 with the surface facing the holding member 41 of the inner lens 4 using an adhesive. By fixing the sensor substrate 6 and the holding member 41 of the inner lens 4 with adhesive, the sensor substrate 6 can be aligned and adjusted along a 6-axis relative to the inner lens 4, thereby stabilizing optical performance. Furthermore, the adhesive also acts as a buffer between the sensor substrate 6 and the holding member 41 of the inner lens 4, suppressing vibration leakage to the sensor substrate 6, stabilizing optical performance, and reducing the damping of the vibrating body 3.

[0025] The imaging element mounted on the sensor substrate 6 is an image sensor, such as a CCD (Charge Coupled Device) or CMOS (Complementary Metal-Oxide-Semiconductor) sensor. The sensor substrate 6 also houses general-purpose semiconductor components such as ICs (Integrated Circuits) or ASICs (Application Specific Integrated Circuits) for controlling the imaging element. A connector 62 is provided on the sensor substrate 6, through which the sensor substrate 6 communicates with external devices for signal input / output and power supply from an external power source.

[0026] The inner lens 4 (internal lens) is a structure in which multiple lenses are held by a holding member 41 (inner lens barrel). Furthermore, in the accompanying drawings shown in this disclosure, the multiple lenses are illustrated as a single block, referred to as the inner lens 4. Since the multiple lenses constituting the inner lens 4 are held by the holding member 41 in a aligned and adjusted state, it is not necessary to readjust the alignment of each lens when installing it into the imaging device 100.

[0027] The outermost lens 1 is a light-transmitting material that allows light of a specified wavelength (e.g., the wavelength of visible light, the wavelength that can be captured by the imaging element, etc.) to pass through. Examples include borosilicate crown glass (BK7), quartz glass, crown glass, flint glass, and a convex meniscus lens. Alternatively, the imaging device 100 may use a transparent component such as a protective cover instead of the outermost lens 1. The protective cover is made of glass, transparent plastic, or other resins.

[0028] The end of the outermost lens 1 is held by the end of the leaf spring 2a extending from the fixing part 2. Additionally, adhesive is filled between the outermost lens 1 and the retainer 2b located at the end of the leaf spring 2a. The fixing part 2 is formed of aluminum (e.g., A5052).

[0029] Furthermore, the camera device 100 is provided with a vibrator 3 to vibrate the outermost lens 1 held in the fixing part 2. The vibrator 3 is, for example, stainless steel (e.g., SUS304, SUS420, SUS440).

[0030] like Figure 2 As shown, the vibrating body 3 is a cylindrical body, consisting of a connecting part 31 (part 1) connected to the outermost lens 1, a vibrating part 32 (part 2) on which the piezoelectric element 5 is mounted, and a support part 33 (part 3) connecting the connecting part 31 and the vibrating part 32. The cross-sectional shape of the support part 33 is S-shaped. Figure 2 As shown, an inner lens 4 is disposed inside the cylinder of the vibrating body 3.

[0031] The connecting portion 31 is a cylindrical shape that extends along the axial direction (Z direction) of the cylindrical body, and its end extends along the radial direction (X, Y direction) of the cylindrical body. Therefore, the end of the connecting portion 31 can stably contact the periphery of the outermost lens 1. Furthermore, the connecting portion 31 may be only the part that extends along the axial direction (Z direction) of the cylindrical body, or it may be only the part that extends along the radial direction (X, Y direction) of the cylindrical body.

[0032] The vibrating part 32 is the part that vibrates together with the piezoelectric element 5, and its plate thickness is greater than that of the connecting part 31 and the support part 33. As a result, the vibration of the piezoelectric element 5 can be transmitted to the outermost lens 1 more efficiently.

[0033] The support portion 33 supports the connecting portion 31 and transmits the vibration of the vibrating portion 32 to the connecting portion 31. In addition, the connecting portion 31, the vibrating portion 32 and the support portion 33 can be formed integrally or separately.

[0034] The piezoelectric element 5 is disposed on the side of the vibrating section 32 opposite to the side that contacts the outermost lens 1. The piezoelectric element 5 is hollow and circular, and vibrates, for example, by polarization in the thickness direction. The piezoelectric element 5 is made of lead zirconate titanate-based piezoelectric ceramic. However, other piezoelectric ceramics such as (K,Na)NbO3 can also be used. In addition, piezoelectric single crystals such as LiTaO3 can be used.

[0035] The hollow circular piezoelectric element 5 vibrates in the radial direction. This vibration is transformed into a vibration in the Z direction (vertical direction in the figure) by the support part 33 of the vibrating body 3, so that the outermost lens 1 vibrates in the Z direction.

[0036] The vibrating body 3, through the elastic deformation of the support portion 33 like a spring, causes the outermost lens 1 to displace in the Z direction. The vibration of the vibrating body 3 also causes the leaf spring 2a of the fixing portion 2, which holds the outermost lens 1, to elastically deform. Due to the vibration of the vibrating body 3, the displacement of the outermost lens 1 becomes maximum, while the displacement of the central portion of the support portion 33, whose cross-sectional shape is S-shaped, decreases.

[0037] The vibration of the outermost lens 1 is mostly absorbed by the elastic deformation of the leaf spring 2a, but the incompletely absorbed vibration is transmitted to the fixing part 2, causing the fixing part 2 to vibrate itself. This vibration of the fixing part 2 is a vibration leakage from the vibrating body 3. As a method to suppress this vibration leakage, increasing the mass of the fixing part 2 itself is considered. However, if the mass of the fixing part 2 itself is increased, there is a problem that the size of the fixing part 2 becomes larger.

[0038] Therefore, in the imaging device 100 of this embodiment, instead of increasing the mass of the fixing part 2 itself, the housing 8 is directly connected to the fixing part 2 by welding. That is, by connecting the housing 8 to the fixing part 2, the mass of the housing 8 is increased by adding the housing 8 to the fixing part 2, thus suppressing vibration leakage from the vibrating body 3. By directly connecting the fixing part 2 and the housing 8 using the welding part 22, compared with the case where the fixing part 2 and the housing 8 are connected by threaded fastening, the noise generated by vibration friction at the contact part between the components can be suppressed. Furthermore, by directly connecting the fixing part 2 and the housing 8 by welding, the waterproofness of the joint between the fixing part 2 and the housing 8 can be ensured, and deterioration such as galvanic corrosion can be suppressed, thus improving the reliability of the imaging device 100.

[0039] The fixing part 2 and the housing 8 are made of the same metal material. Specifically, if the fixing part 2 is aluminum (e.g., A5052), then the housing 8 is also made of aluminum (e.g., A5052). Thus, when the fixing part 2 and the housing 8 are welded together, since they are made of the same metal, welding becomes easier.

[0040] Even if they are different metals, the fixing part 2 and the housing 8 can be formed from different metals as long as they can be welded. For example, the fixing part 2 and the housing 8 can also be formed from combinations of different metals, such as aluminum (e.g., A5052) and stainless steel (e.g., SUS304, SUS420, SUS440), aluminum and brass, brass and stainless steel, etc. Furthermore, when the fixing part 2 and the housing 8 are formed from different metals, the housing 8 is preferably formed from a metal material with a higher density than the fixing part 2. This further increases the total mass of the fixing part 2 and the housing 8, further improves the vibration containment, and further suppresses vibration leakage from the vibrating body 3.

[0041] The welding portion 22 between the fixing portion 2 and the housing 8 is located near the portion where the retaining member 41 of the inner lens 4 is fixed to the fixing portion 2. Therefore, if heat from welding at the welding portion 22 is transferred to the inner lens 4 and the retaining member 41, it may affect the deformation of the inner lens 4 and the alignment of the inner lens 4 with the outermost lens 1. Therefore, a structure in which heat during welding is less likely to be transferred to the inner lens 4 and the retaining member 41 is preferred. For example, Figure 3 This is a diagram illustrating an example of the connection between the retaining member 41 of the inner lens 4 and the fixing part 2.

[0042] like Figure 3 As shown, the retaining member 41 of the inner lens 4 is not directly held to the fixing part 2, but is held to the fixing part 2 by fasteners 42a and 43a provided at the ends of the buffer layers 42 and 43 of the retaining member 41. Furthermore, a gap 44 is provided between the end of the retaining member 41 of the inner lens 4 and the fixing part 2, and the retaining member 41 of the inner lens 4 is held to the fixing part 2 by the fasteners 42a and 43a. Alternatively, if the heat during welding is low, the end of the retaining member 41 of the inner lens 4 can be held directly by the fixing part 2 without providing the gap 44.

[0043] The retaining member 41 has a buffer layer 42 on the side facing the vibrator 3 and a buffer layer 43 on the side facing the housing 8. A fastener 42a is provided at the end of the buffer layer 42, and a fastener 43a is provided at the end of the buffer layer 43. The buffer layers 42 and 43 are formed, for example, of rubber or resin. By providing buffer layers 42 and 43 on the retaining member 41, vibration leakage from the vibrator 3 can be suppressed, thereby reducing the damping of the vibrator 3. Furthermore, the buffer layers 42 and 43 are preferably made of a material with a lower thermal conductivity than the fixing part 2. Therefore, the buffer layers 42 and 43 can be structured to prevent the transfer of heat during welding to the inner lens 4 and the retaining member 41.

[0044] Fasteners 42a and 43a are preferably made of a material with a lower thermal conductivity than the fixing portion 2. This prevents the fasteners 42a and 43a from transferring heat from welding to the inner lens 4 and the retaining member 41. For example, fasteners 42a and 43a are formed of resin, ceramic, or the like. Although not shown, fasteners 42a and 43a are, for example, annular threaded parts corresponding to the threaded grooves provided on the inner wall surface of the fixing portion 2. By clamping the ends of the retaining member 41, fasteners 42a and 43a can fix the position of the inner lens 4 relative to the fixing portion 2. Alternatively, fasteners 42a and 43a may not be annular threaded parts and can be fixed to the fixing portion 2 by adhesive.

[0045] The camera device 100 also provides a counterweight 21 (first counterweight) between the fixed part 2 and the vibrating body 3. The counterweight 21 can be made of the same metal material as the fixed part 2, but it is preferably made of a metal material with a higher density than the fixed part 2. For example, if the fixed part 2 is made of aluminum (e.g., A5052), the counterweight 21 is made of stainless steel (e.g., SUS304, SUS420, SUS440). This further increases the total mass of the fixed part 2 and the counterweight 21, further improving the vibration sealing and further suppressing vibration leakage from the vibrating body 3.

[0046] (Variation Example 1)

[0047] exist Figure 2 The camera device 100 shown illustrates a structure in which a counterweight 21 is provided between the fixed part 2 and the vibrating body 3, but a counterweight may also be provided in the housing 8. Figure 4 This is a cross-sectional view of the camera device 100a of Modified Example 1. In the camera device 100a, for... Figure 2 The same structure as the camera device 100 shown is labeled with the same reference numerals, and its description will not be repeated.

[0048] The camera device 100a also includes a counterweight 81 (second counterweight) on the housing 8. The counterweight 81 can be made of the same metal material as the housing 8, but is preferably made of a metal material with a higher density than the housing 8. For example, if the housing 8 is made of aluminum (e.g., A5052), the counterweight 81 can be made of stainless steel (e.g., SUS304, SUS420, SUS440). This further increases the combined mass of the housing 8 and the counterweight 81, further improving vibration containment and suppressing vibration leakage from the vibrating body 3.

[0049] The counterweight 81 can be positioned anywhere within the housing 8, as long as it improves the sealing against vibration. Furthermore, to avoid increasing the size of the camera device 100a, it is preferable that the counterweight 81 is positioned inside the housing 8, rather than on the outside.

[0050] (Variation Example 2)

[0051] exist Figure 2 The imaging device 100 shown illustrates a structure in which a sensor substrate 6 is disposed within a housing 8. However, the substrate disposed within the housing 8 is not limited to the sensor substrate 6; other substrates may also be disposed therein. Figure 5 This is a cross-sectional view of the camera device 100b in Modified Example 2. In the camera device 100b, for... Figure 2 The same structure as the camera device 100 shown is labeled with the same reference numerals, and its description will not be repeated.

[0052] like Figure 5 As shown, the imaging device 100b includes a fixing part 2 (first housing) that holds the outermost lens 1 and a housing 8 (second housing) that is directly connected to the fixing part by welding. A vibrator 3, an inner lens 4, and a piezoelectric element 5 are disposed inside the fixing part 2. A sensor substrate 6 (first substrate) on which an imaging element (not shown) is mounted and a drive substrate 70 (second substrate) on which a drive circuit for driving the piezoelectric element 5 is mounted are disposed inside the housing 8.

[0053] The drive substrate 70 is fixed to the cover portion 82, which fits into the housing 8, by a support member 83. Furthermore, the drive substrate 70 is equipped with a drive circuit for driving the piezoelectric element 5, such as a general-purpose IC, ASIC, or other semiconductor component. A flexible substrate 51 is provided for electrically connecting the piezoelectric element 5 to the drive substrate 70.

[0054] The flexible substrate 51 is electrically connected to the piezoelectric element 5 and extends out of the holding member 41 to the side of the holding member 41 opposite to the sensor substrate 6 through a through hole 45 provided in the holding member 41. Furthermore, the through hole 45 is provided in the holding member 41 on the side of the inner lens 4. In order to electrically connect the flexible substrate 51 to the driving substrate 70, a flexible conductive pin 71 is provided on the driving substrate 70. Therefore, when the cover 82 of the holding driving substrate 70 is fitted into the housing 8, the conductive pin 71 contacts the electrode of the flexible substrate 51, enabling the piezoelectric element 5 to be electrically connected to the driving substrate 70 using the flexible substrate 51.

[0055] The drive board 70 communicates with external devices via connector 62 for signal input / output and power supply from an external power source. Therefore, the drive board 70 can supply signals and power to the piezoelectric element 5 via conductive pin 71 and flexible board 51. By fixing the flexible board 51 to the holding member 41, vibrations transmitted through the flexible board 51 are not transmitted to the sensor board 6 or the drive board 70, thus suppressing noise caused by such vibrations.

[0056] Furthermore, although not shown, it is preferable to insert a damping element (e.g., rubber, resin, etc.) between the flexible substrate 51 and the holding member 41 to attenuate vibration. By providing a damping element, the noise of the flexible substrate 51 can be suppressed. In addition, frictional losses caused by vibrations generated between the flexible substrate 51 and the holding member 41 can be reduced, and damping of vibrations caused by fixing the flexible substrate 51 to the holding member 41 can be suppressed.

[0057] In the imaging device 100b, a flexible conductive pin 71 is used to electrically connect the flexible substrate 51 to the drive substrate 70. However, it is not necessary to use a flexible conductive pin 71; instead, the flexible substrate 51 and the drive substrate 70 can be electrically connected by wiring or other means. Furthermore, in the imaging device 100b, the drive substrate 70 is disposed inside the housing 8, but it is also possible to dispose of the drive substrate 70 on the outside of the housing 8. In this case, the flexible substrate 51 extends from the housing 8 and is electrically connected to the drive substrate 70 on the outside of the housing 8.

[0058] (Variation Example 3)

[0059] exist Figure 5 In the imaging device 100b shown, a structure is described in which a through hole 45 is provided in the holding member 41 on the side of the inner lens 4 to allow the flexible substrate 51 to pass through. However, the location of the through hole through the flexible substrate 51 is not limited to the side of the inner lens 4, and it can also be provided in other locations. Figure 6 This is a cross-sectional view of the camera device 100c of Modified Example 3. In the camera device 100c, for... Figure 2 The camera device 100 shown and Figure 5 The same structure as the camera device 100b shown is labeled with the same reference numerals, and its description will not be repeated.

[0060] The flexible substrate 51a is electrically connected to the piezoelectric element 5 and extends out of the holding member 41 to the side of the holding member 41 opposite to the sensor substrate 6 through a through hole 45a provided in the holding member 41. Furthermore, the through hole 45a is provided in the holding member 41 on the fixing part 2 side. In order to electrically connect the flexible substrate 51a to the driving substrate 70, a flexible conductive pin 71 is provided on the driving substrate 70. Therefore, when the cover 82 of the holding driving substrate 70 is fitted into the housing 8, the conductive pin 71 contacts the electrode of the flexible substrate 51a, enabling the piezoelectric element 5 to be electrically connected to the driving substrate 70 using the flexible substrate 51a.

[0061] (Other variations)

[0062] In the vibrating body 3 of the aforementioned embodiment, it was described that the cross-sectional shape of the support portion 33 was set to the shape of the letter S. However, as long as the shape does not cause stress concentration in the vibrating body, the cross-sectional shape of the support portion is not limited to the shape of the letter S. For example, the cross-sectional shape of the support portion 33 may also be a shape formed by connecting multiple letters S, or a curved shape that is half of the shape of the letter S.

[0063] In the imaging devices 100, 100a-100c according to the above embodiments, it has been described that the sensor substrate 6 on which the imaging element is mounted is fixed to the retaining member 41 by an adhesive on the surface opposite to the retaining member 41. However, it is not limited to this, and the imaging devices 100, 100a-100c may also fix the sensor substrate 6 to the housing 8 and the cover 82.

[0064] In the imaging devices 100, 100b-100c described above, a counterweight 21 is provided in the fixing part 2. In imaging device 100a, a structure is described in which a counterweight 21 is provided in the fixing part 2 and a counterweight 81 is provided in the housing 8. However, it is not limited to this. The imaging devices 100, 100a-100c may also have a structure that does not provide a counterweight 21 and a counterweight 81, or a structure that provides at least one of a counterweight 21 and a counterweight 81.

[0065] The imaging devices 100, 100a-100c according to the above embodiments may include cameras, LiDAR, Radar, etc. Alternatively, multiple imaging devices 100, 100a-100c may be arranged in an array.

[0066] The imaging devices 100, 100a to 100c described in the aforementioned embodiments are not limited to imaging devices installed in vehicles. They can be applied in the same way to any imaging device that has an optical device and an imaging element arranged in such a way that the light-transmitting body is the field of view and that it is necessary to remove foreign objects attached to the light-transmitting body.

[0067] (Technical Solution)

[0068] (1) The camera device according to this disclosure includes:

[0069] A light-transmitting body that allows light of a specified wavelength to pass through;

[0070] The first shell is cylindrical in shape, which retains the light-transmitting body;

[0071] A vibrating body, which is disposed within the first housing, causes the light-transmitting body to vibrate;

[0072] A piezoelectric element is placed on a vibrating body to cause the vibrating body to vibrate.

[0073] The second housing is directly connected to the side of the first housing opposite to the side that holds the light-transmitting element by welding.

[0074] Therefore, in the imaging device disclosed herein, the side of the first housing opposite to the side holding the light-transmitting body is directly connected to the second housing by welding, thereby suppressing vibration leakage from the vibrating body without increasing the size of the first housing.

[0075] (2) In the camera device described in (1), the first housing and the second housing are made of the same metal material.

[0076] (3) In the camera device described in (1), the second housing is a different metal material from the first housing, and is a metal material with a higher density than the first housing.

[0077] (4) In any one of (1) to (3) of the imaging device, the first housing further includes an internal lens disposed at a position opposite to the light-transmitting body.

[0078] The internal lens is held in the first housing by a retaining member.

[0079] The surface of the retaining component on the vibrating body side and the surface on the second shell side have a buffer layer.

[0080] A gap is provided between the end of the retaining member and the first housing, and the retaining member is held in the first housing by fasteners provided at the end of the buffer layer.

[0081] (5) In the camera device described in (4), the buffer layer and fasteners are made of a material with a lower thermal conductivity than the first housing.

[0082] (6) In the camera device described in (4) or (5), there is also a camera element arranged such that the light-transmitting body and the internal lens form the field of view.

[0083] The first substrate, on which the camera element is mounted, is fixed to the retaining member by an adhesive on the side opposite to the retaining member.

[0084] (7) In the camera device described in (6), the flexible substrate electrically connected to the piezoelectric element is led out to the side of the holding member opposite to the first substrate through a through hole provided in the holding member.

[0085] (8) In the camera device described in (7), a second substrate for mounting a drive circuit for driving piezoelectric elements is further provided inside the second housing.

[0086] The second substrate is electrically connected to the flexible substrate.

[0087] (9) In any one of (1) to (8) the camera device, the first housing has a first counterweight made of a material with a density higher than that of the first housing.

[0088] (10) In any one of (1) to (9) the camera device, the second housing has a second counterweight made of a material with a density higher than that of the second housing.

[0089] The embodiments disclosed herein should be considered illustrative rather than restrictive in all respects. The scope of this disclosure is set forth in the claims rather than in the foregoing description, and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0090] Explanation of reference numerals in the attached figures

[0091] 1. Outermost lens; 2. Fixing part; 2a. Leaf spring; 2b. Holder; 3. Vibrating body; 4. Inner lens; 5. Piezoelectric element; 6. Sensor substrate; 8. Housing; 21, 81. Counterweight; 22. Welding part; 41. Holding member; 42, 43. Buffer layer; 42a, 43a. Fastener; 44. Gap; 45, 45a. Through hole; 51. Flexible substrate; 70. Drive substrate; 71. Conductive pin; 82. Cover; 83. Support member; 100, 100a~100c. Imaging device.

Claims

1. A camera device, wherein, It possesses: A light-transmitting body that allows light of a specified wavelength to pass through; A first housing in the shape of a cylinder, which holds the light-transmitting body; A vibrating body, disposed within the first housing, causes the light-transmitting body to vibrate; A piezoelectric element is disposed on the vibrating body to cause the vibrating body to vibrate; as well as The second housing is directly connected to the side of the first housing opposite to the side that holds the light-transmitting element by welding.

2. The camera device according to claim 1, wherein, The first housing and the second housing are made of the same metallic material.

3. The camera device according to claim 1, wherein, The second shell is made of a different metal material than the first shell, and is a metal material with a higher density than the first shell.

4. The camera device according to any one of claims 1 to 3, wherein, The camera device also includes an internal lens disposed within the first housing at a position opposite to the light-transmitting element. The internal lens is held in the first housing by a retaining member. The retaining member has a buffer layer on the surface of the vibrating body and the surface of the second housing. A gap is provided between the end of the retaining member and the first housing, and the retaining member is held in the first housing by fasteners provided at the end of the buffer layer.

5. The camera device according to claim 4, wherein, The buffer layer and the fasteners are made of a material with a lower thermal conductivity than the first housing.

6. The camera device according to claim 4 or 5, wherein, The camera device also includes a camera element arranged with the light-transmitting body and the internal lens forming the field of view. The first substrate on which the camera element is mounted is fixed to the retaining member using an adhesive on the side opposite to the retaining member.

7. The camera device according to claim 6, wherein, A flexible substrate electrically connected to the piezoelectric element passes through a through hole provided in the retaining member and extends to the side of the retaining member opposite to the first substrate.

8. The camera device according to claim 7, wherein, The second housing also includes a second substrate in which a drive circuit for driving the piezoelectric element is mounted. The second substrate is electrically connected to the flexible substrate.

9. The camera device according to any one of claims 1 to 8, wherein, The first housing has a first counterweight made of a material with a density higher than that of the first housing.

10. The camera device according to any one of claims 1 to 9, wherein, The second housing has a second counterweight made of a material with a higher density than the second housing itself.

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