Radioluminescent imaging system and method

Abstract

The application discloses a kind of ray luminescence imaging systems and methods, including: ray source module, luminescence conversion module and electron bombardment type active pixel sensor imaging module, ray source module is set to emit ray, luminescence conversion module is set in the emission direction of ray source module, and luminescence conversion module is set to receive the ray after penetrating measured object and is converted into luminescence distribution, measured object is located between ray source module and luminescence conversion module, electron bombardment type active pixel sensor imaging module is set after luminescence conversion module, and electron bombardment type active pixel sensor imaging module is set to collect weak luminescence image generated by luminescence conversion module and output image signal.Ray luminescence imaging system according to the embodiment of the application, clear imaging can be obtained under lower ray dose conditions, with energy-saving effect.

Description

Technical Field

[0001] This application relates to the field of X-ray imaging technology, and more specifically, to a X-ray emission imaging system and method. Background Technology

[0002] This section provides only background information relevant to this disclosure and is not necessarily prior art.

[0003] Against the backdrop of the increasing demand for green upgrades in medical imaging equipment and low-dose safe imaging, traditional X-ray imaging methods still generally suffer from problems such as heavy radiation burden, high system energy consumption, and difficulty in stably acquiring weak emission signals under low-dose conditions. X-ray imaging, as an important technique in clinical diagnosis, bioimaging, and non-destructive testing, can achieve non-invasive internal observation by leveraging the differential information generated by the interaction between rays and the internal structure of biological tissues or materials. It has significant application value in disease screening, efficacy evaluation, drug development, and structural inspection.

[0004] In practical applications, traditional X-ray imaging often relies on high-dose irradiation and conventional image acquisition links. While obtaining relatively clear images, this also easily leads to a heavy radiation burden and high system energy consumption. Especially under low-dose conditions, the output signal of the luminescent layer is extremely weak, making it difficult for conventional imaging devices to simultaneously achieve image clarity, stability, and real-time performance, thus limiting the further application of low-dose imaging technology. Simply increasing the radiation dose to enhance luminescence would increase energy consumption and radiation risks, and in medical applications, it would also increase potential harm to the human body, hindering its widespread application. Summary of the Invention

[0005] The main objective of this application is to provide a X-ray emission imaging system to solve the problems in existing technologies where the emission signal is too weak, invisible to the naked eye, and cannot be clearly captured by ordinary cameras under low-dose radiation conditions. By combining the X-ray source module, the emission conversion module, and the electron bombardment type active pixel sensor imaging module in a specific positional relationship, and placing the object under test between the X-ray source module and the emission conversion module, clear imaging can be obtained under low-dose radiation conditions, while also achieving energy-saving effects.

[0006] To achieve the above objectives, the first aspect of this application proposes a X-ray emission imaging system, comprising: A radiation source module, wherein the radiation source module is configured to emit radiation; A light emission conversion module is disposed in the emission direction of the X-ray source module, and the light emission conversion module is configured to receive X-rays after penetrating the test object and convert them into light emission distribution, wherein the test object is located between the X-ray source module and the light emission conversion module; An electron-bombardment active pixel sensor imaging module is disposed after the light emission conversion module, and the electron-bombardment active pixel sensor imaging module is configured to acquire the weak light emission image generated by the light emission conversion module and output the image signal.

[0007] According to the X-ray emission imaging system provided in this application, the X-ray source module is an X-ray source module or a gamma-ray source module.

[0008] According to the X-ray emission imaging system provided in this application, the emission conversion module is fitted to the object being measured.

[0009] According to the X-ray emission imaging system provided in this application, the X-ray emission imaging system further includes a light-shielding and shielding module, which is configured to isolate ambient stray light and suppress direct irradiation of the electron bombardment type active pixel sensor imaging module by X-rays.

[0010] According to the X-ray emission imaging system provided in this application, the light-shielding and shielding module includes one or more of the following: a dark box, a light-shielding cavity, a direct-light shielding plate, or a beam-limiting structure.

[0011] According to the X-ray emission imaging system provided in this application, the emission conversion module is a detachable and replaceable structure, and the emission conversion module is a scintillation single crystal, a phosphor thin film, or a combination thereof.

[0012] According to the X-ray emission imaging system provided in this application, a folding optical path structure is provided between the emission conversion module and the electron bombardment active pixel sensor imaging module. The folding optical path structure is configured to allow the emitted image to enter the electron bombardment active pixel sensor imaging module after reflection.

[0013] According to the X-ray emission imaging system provided in this application, the X-ray emission imaging system further includes an image acquisition and output module, which is configured to display, store, photograph, record, or transmit the image signal.

[0014] According to the X-ray emission imaging system provided in this application, the X-ray source module emits a radiation dose rate greater than or equal to 0.00162 mGy / s.

[0015] A second aspect of this application proposes a X-ray emission imaging method, employing any of the X-ray emission imaging systems described above, comprising the following steps: Receive the object under test and move the object under test between the X-ray source module and the light emission conversion module; The X-ray source module is controlled to start emitting X-rays towards the object under test; The electron-bombardment type active pixel sensor imaging module is controlled to acquire the luminescent image generated by the luminescence conversion module; The luminescent image is processed to obtain an image of the object under test.

[0016] The X-ray emission imaging method of this invention has the same advantages as the X-ray emission imaging system described above, and will not be repeated here.

[0017] The technical solution provided by the embodiments of this application includes the following beneficial effects: After the X-ray passes through the test object, the transmission intensity varies due to differences in the internal structure, thickness, and absorption capacity of the sample. After absorbing the energy of the transmitted X-ray, the light emission conversion module generates electrons and holes through photoelectric effect, Compton scattering, and other effects. These electrons and holes then undergo migration, energy dissipation, and recombination processes within the material, ultimately releasing weak light signals with different brightness distributions at the light emission center. This signal then enters the electron bombardment type active pixel sensor imaging module, where it forms an image after high-sensitivity detection, electron multiplication, and digital readout. The image clarity and stability are improved by combining background subtraction, noise reduction, and other processing methods, thus completing the experimental link from low-dose X-ray transmission differences to digital image output.

[0018] Experimental results show that this invention can achieve clear imaging of various analytes at an ultra-low dose rate of 0.00162 mGy / s, while traditional X-ray imaging methods require a minimum dose of 0.02528 mGy / s and a maximum of 1.009 mGy / s for the same sample. This invention reduces the required dose by 93.59% to 99.84%. This breakthrough significantly reduces the radiation dose received by patients in medical testing, lowering potential health risks. In industrial non-destructive testing and scientific imaging, it effectively reduces system energy consumption and operating costs, while extending the lifespan of the radiation source module. Furthermore, since this invention can obtain effective images with a single exposure without repeatedly increasing operating conditions, it avoids the extra time and energy consumption caused by repeated shooting due to insufficient image quality in traditional methods. The overall energy consumption for a single imaging session is as low as 2.25 J, a reduction of up to 99.63% compared to traditional methods. This invention achieves low-dose, low-energy, and highly sensitive X-ray imaging with a simple structural combination, providing a new technical path for green medical equipment and portable testing devices. Attached Figure Description

[0019] The accompanying drawings, which form part of this application, are used to provide a further understanding of the application and to make other features, objects, and advantages of the application more apparent. The illustrative embodiments and descriptions of this application are used to explain the application and do not constitute an undue limitation of the application. In the drawings: Figure 1 This is a schematic diagram of a X-ray emission imaging system according to an embodiment of the present invention.

[0020] Figure 2 This is a flowchart of the X-ray emission imaging method according to an embodiment of the present invention.

[0021] Figure 3 The comparison results of using the X-ray emission imaging system of this invention with conventional X-ray imaging conditions for sample 1 are shown.

[0022] Figure 4 The comparison results of using the X-ray emission imaging system of this invention with conventional X-ray imaging conditions for sample 2 are shown.

[0023] Figure 5 The comparison results of using the X-ray emission imaging system of this invention with conventional X-ray imaging conditions for sample 3 are shown.

[0024] Figure 6 This is a graph showing the number of images taken using the X-ray emission imaging system according to an embodiment of the present invention.

[0025] Figure 7 This is a sample radiation stability diagram using the X-ray emission imaging system of this embodiment of the invention.

[0026] Figure labels: 1. X-ray source module; 2. Light emission conversion module; 3. Electron impact type active pixel sensor imaging module; 4. Light shielding and shielding module; 5. Folding optical path structure; 6. Control module; 7. Object under test. Detailed Implementation

[0027] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present application.

[0028] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate for the embodiments of this application described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0029] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "middle," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0030] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0031] Furthermore, the terms "installation," "setup," "equipped with," "connection," "linked," and "socketing" should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] like Figure 1 As shown, this invention provides a radiation emission imaging system. The system includes a radiation source module, a radiation conversion module, an electron bombardment type active pixel sensor imaging module, a light-shielding and shielding module, an image acquisition and output module, and a control module.

[0033] The control module is electrically connected to the X-ray source module, the electron bombardment active pixel sensor imaging module, and the image acquisition and output module. The control module includes at least a processor and a memory. The memory stores an executable computer program. When the processor executes the computer program, it performs the following functions: receiving user commands, controlling the on / off state and energy adjustment of the X-ray source module, synchronously triggering the electron bombardment active pixel sensor imaging module to acquire images, receiving image data and performing preprocessing, transmitting the image to the output module, monitoring equipment status, and executing safety interlock logic. The control module is also equipped with a closed-loop parameter optimization unit for real-time adjustment of imaging parameters to adapt to different objects under test and dynamic scenarios.

[0034] The radiation source module is used to emit radiation and can be either an X-ray source module or a gamma-ray source module. In practical applications, portable X-ray source modules, such as miniature X-ray tubes, can be used, with tube voltage adjustable from 30kV to 100kV and tube current adjustable from 0.1mA to 5mA. Gamma-ray source modules can use radioactive isotope sources and are suitable for detecting thick materials. The emission direction of the radiation source module is towards the object being measured and the radiation conversion module.

[0035] The light emission conversion module is positioned in the emission direction of the X-ray source module to receive the X-rays that have penetrated the object under test and convert them into a light emission distribution. The light emission conversion module can be a scintillation single crystal, a phosphor film, or a composite light emission structure composed of both. Under low-dose X-ray irradiation conditions, after the light emission conversion module absorbs the transmitted X-ray energy, the intensity distribution of the transmitted X-rays varies due to the different absorption capacities of different parts of the object under test, ultimately releasing weak light signals with varying brightness distributions. The light emission conversion module is designed to be detachable and replaceable, allowing users to select different types of scintillation materials based on the type of object under test and imaging requirements. For example, a cesium iodide scintillation screen can be selected for high-resolution imaging needs; a gadolinium oxysulfate phosphor film can be selected for high-sensitivity requirements.

[0036] This application uses an electron-bombardment active pixel sensor imaging module as the core imaging unit. Addressing the critical issue of the difficulty in stably acquiring weak luminous signals under low-dose radiation conditions, it proposes a technical concept for a high-sensitivity low-dose radiation imaging system. The system uses scintillation single crystals, phosphor films, or combinations thereof as the luminescence conversion carrier. By improving the detection capability of weak light signals and image enhancement capabilities, it enhances signal utilization efficiency under low-dose conditions. While ensuring image availability, it reduces the radiation source output requirements and overall system energy consumption, thus achieving a coordinated balance between improved imaging quality and energy saving. This provides an engineering-feasible technical path for low-dose medical imaging equipment and small-scale detection systems.

[0037] In some embodiments of the present invention, the light-emitting conversion module is fitted to the object under test to minimize the divergence of rays during propagation and improve image clarity and spatial resolution. This fitting can be achieved through mechanical clamps, vacuum adsorption, or elastic straps, ensuring close contact between the light-emitting conversion module and the surface of the object under test. In another embodiment, a small gap can be maintained between the light-emitting conversion module and the object under test to adapt to online inspection in automated production lines and high-temperature testing scenarios.

[0038] An electron-impact active pixel sensor imaging module is positioned after the light-emitting conversion module to acquire and output the weak light emitted by the conversion module. This module consists of a multi-alkali cathode material, a microchannel plate, a high-vacuum precision housing, an anode output terminal, and a small high-voltage power supply. Its spectral characteristics exhibit a wide response range from visible to near-infrared, meeting the requirements for acquiring weak light signals from the emitting layer. Due to its extremely high sensitivity, even when the light emitted by the conversion module is extremely weak under low-dose conditions, it can still be effectively acquired and output as a clear grayscale or grayscale image.

[0039] The light-shielding and shielding module is used to isolate stray ambient light and suppress direct radiation exposure to the electron-bombardment active pixel sensor imaging module. Specifically, the light-shielding and shielding module may include one or more of the following: a dark box, a light-shielding cavity, a direct-radiation shielding plate, or a beam-limiting structure. The light-emitting conversion module and the electron-bombardment active pixel sensor imaging module can be housed within the dark box or light-shielding cavity, allowing the imaging module to primarily receive the weak light emitted from the light-emitting conversion module, thus improving the image signal-to-noise ratio and imaging stability. The direct-radiation shielding plate, made of lead or tungsten alloy, can be placed between the radiation source module and the electron-bombardment active pixel sensor imaging module. It is used to block direct radiation exposure to the electron-bombardment active pixel sensor imaging module by radiation propagating along a straight path, reducing performance degradation caused by long-term radiation exposure. The beam-limiting structure can be a lead slit or a pinhole aperture, used to limit the radiation beam's irradiation range and reduce scattered radiation interference.

[0040] In some embodiments of the present invention, a folded optical path structure is provided between the light emission conversion module and the electron bombardment active pixel sensor imaging module. This folded optical path structure includes one or more reflectors, positioned behind the light emission conversion module, so that the emitted image is reflected before entering the imaging module, thereby preventing direct linear radiation to the electron bombardment active pixel sensor imaging module. This structure is particularly suitable for scenarios with high-energy and highly penetrating radiation, reducing the radiation dose received by the electron bombardment active pixel sensor imaging module by more than 90%, significantly extending the lifespan of the electron bombardment active pixel sensor imaging module.

[0041] The image acquisition and output module connects to the electron bombardment type active pixel sensor imaging module for displaying, storing, photographing, recording, or transmitting image signals. The image acquisition and output module may include an LCD screen, SD card memory, USB interface, and Wi-Fi or Bluetooth communication module. The display function supports real-time preview and playback, the storage function supports multiple image formats, the photographing and recording functions can record dynamic processes, and the transmission function can send images to a remote terminal or the cloud. Furthermore, the image acquisition and output module integrates an image processing unit that can perform algorithms such as background subtraction, multi-frame accumulation, noise reduction, grayscale enhancement, and contrast enhancement to improve image quality. Background subtraction removes dark current noise and fixed pattern noise; multi-frame accumulation improves the signal-to-noise ratio by summing and averaging multiple frames; noise reduction uses median filtering or Gaussian filtering to remove random noise; and grayscale enhancement and contrast enhancement stretch the dynamic range and highlight details.

[0042] The control module, as the core of the entire device, is electrically connected to the radiation source module, the electron bombardment active pixel sensor imaging module, and the image acquisition and output module. Its main functions include: receiving user commands (such as start, stop, parameter setting); controlling the opening, closing, and energy adjustment of the radiation source module; synchronously triggering the electron bombardment active pixel sensor imaging module to acquire images; receiving image data and performing necessary preprocessing; transmitting images to the output module; monitoring equipment status (such as temperature, high voltage, and radiation dose rate); and executing safety interlock logic (such as door switch protection and dose over-limit alarm), etc.

[0043] The X-ray emission imaging method of the present invention will now be described in detail with reference to the above-described apparatus. Figure 2 As shown, the method includes the following steps: The device receives the object to be tested and moves it between the X-ray source module and the light conversion module. This step can be done manually by the operator or by an automated conveyor. For medical applications, the patient's limb is placed directly on the stage; for industrial testing, the sample is fed into the testing area via a conveyor belt. The control module's positioning assistance system (such as laser pointer or visual guidance) helps the operator accurately align the object to be tested with the center of the X-ray beam.

[0044] The control unit activates the X-ray source module to emit X-rays onto the object under test. Depending on the type, thickness, and density of the object, the operator can select preset imaging parameters on the control interface, or the system can automatically recommend parameters. The operating voltage of the X-ray source module determines the energy of the X-rays; the higher the voltage, the stronger the penetration. The tube current and irradiation time together determine the X-ray dose; the greater the current and the longer the irradiation time, the higher the image brightness but also the higher the dose.

[0045] The control module of the electron-impact active pixel sensor acquires the luminescent image generated by the luminescence conversion module. After the X-ray penetrates the object under test, it illuminates the luminescence conversion module, exciting a luminescence distribution. Due to the high sensitivity of the electron-impact active pixel sensor imaging module, it can effectively acquire images even at extremely low luminescence intensities. The control module triggers the electron-impact active pixel sensor imaging module to begin integration exposure simultaneously with the X-ray irradiation time; the exposure time is synchronized with the X-ray irradiation time. After exposure, the electron-impact active pixel sensor imaging module outputs a digital signal corresponding to the luminescence image.

[0046] Image processing is performed on the acquired luminescent images to obtain the image of the object under test. Image processing includes, but is not limited to, background subtraction, multi-frame accumulation, noise reduction, grayscale enhancement, and contrast enhancement. Specifically, background subtraction uses a pre-acquired dark-field image to subtract the background noise; multi-frame accumulation performs a weighted average of 2-10 consecutively acquired images, which can further improve the signal-to-noise ratio; noise reduction uses a non-local mean algorithm to preserve edge details; grayscale enhancement and contrast enhancement improve visibility through histogram equalization or gamma correction. The processed image can be immediately displayed, stored, printed, or transmitted.

[0047] This application constructs a highly sensitive imaging link suitable for low-dose conditions. After low-dose rays pass through the object under test, their intensity distribution changes due to differences in internal structure, and they irradiate the surface of the luminescent layer. A scintillation single crystal, a phosphor film, or a combination thereof converts the transmitted rays into a weak light signal as input information for subsequent imaging. Considering the weak luminescent signal under low-dose conditions, the system selects an electron-bombardment type active pixel sensor imaging module as the core imaging device to perform highly sensitive detection, electron multiplication, and image readout of the weak light signal, thereby improving the system's response capability and utilization efficiency to weak signals.

[0048] A low-dose, high-sensitivity imaging system is constructed with an electron bombardment-type active pixel sensor imaging module as its core. By improving the detection capability of weak luminous signals, the system reduces the dependence of traditional imaging on high-dose irradiation and conventional camera acquisition, thereby reducing the radiation dose and system operating energy consumption while ensuring image availability.

[0049] The X-ray source module, light emission conversion module, electron bombardment active imaging module, and control module are integrated according to the imaging process, and a safety protection and stable operation are achieved through an external shielding structure. The overall size of the imaging unit is compact, and the electron bombardment active pixel sensor imaging module is small in size, which helps to reduce the system space occupation and improve the miniaturization and integration level of the device.

[0050] This system can achieve observable or clear imaging of three different samples under conditions of 15kV, 50μA, and 0.00162mGy / s. For sample 1 (a small object containing a spring), the basic imaging outline of the internal spring can be observed under these conditions; for sample 2 (a more complex electronic component) and sample 3 (a high-density packaged device), clearer structural information can be obtained.

[0051] Compared to traditional X-ray imaging methods, this system achieved effective imaging with significantly lower doses on all three groups of samples. Specific comparative data are as follows: like Figure 3 As shown in Sample 1, this system can observe imaging under conditions of 15kV, 50μA, and 0.00162mGy / s, while the traditional method requires increasing to 10kV, 10mA, and 0.02528mGy / s to obtain effective images. The dose of this system is reduced by approximately 93.59%.

[0052] like Figure 4 As shown in Sample 2, this system can achieve clear imaging under the same low-dose conditions, while the traditional method requires increasing to 10kV, 20mA, and 0.05153mGy / s. The dose of this system is reduced by about 96.86%.

[0053] like Figure 5 As shown in Sample 3, this system can also produce clear images under the same low-dose conditions, while the traditional method requires further increases to 20kV, 10mA, and 1.009mGy / s to obtain effective images. The dose of this system is reduced by about 99.84%.

[0054] Therefore, it is evident that this system can achieve imaging with a lower radiation dose under the same sample conditions, and the greater the difficulty in imaging the sample, the more obvious its advantages over traditional methods become. In particular, at an extremely low dose rate of 0.00162 mGy / s, this system can still obtain images that meet the detection requirements. This dose rate is far lower than the minimum effective dose of traditional X-ray imaging systems, making this system very suitable for applications in pediatric medical care, prenatal examinations, and the detection of radiation-sensitive samples.

[0055] In terms of imaging stability and repeatability, the electron-bombardment active pixel sensor imaging module exhibits high responsiveness to weak light signals, ensuring stable acquisition of luminescence information under low-dose conditions. Image processing effectively optimizes background noise and contrast, reducing the impact of weak signal fluctuations on the results. Compared to traditional solutions that are prone to producing overly dark images and insufficient contrast at low doses, requiring repeated exposure to higher conditions, this system can complete the imaging test under the first low-dose condition, reducing the time and energy consumption associated with repeated shooting. Experiments show that this system also demonstrates good consistency in repeated testing, providing reliable assurance for continuous observation and repeated experiments.

[0056] The energy-saving benefits of this system are mainly reflected in two aspects: reducing the output requirements of the X-ray source module and reducing repeated shooting. For ease of comparison, the power of the X-ray source module is expressed in P. x =U×I is calculated; energy consumption for a single imaging session is calculated as E=(P x +P s )×t calculation, where P x P represents the power of the X-ray source module. s Here, t represents the power consumption at the imaging end, and t represents the exposure time per exposure. Considering that traditional methods require multiple upgrades to obtain a valid image on some samples, the energy consumption per unit of valid image is calculated based on the cumulative energy consumption for obtaining the first valid image.

[0057] The following key data were obtained from the experiment: Under the conditions of 15kV and 50μA, the power P of the X-ray source module of this system was... x =15000V×0.00005A=0.75W; Imaging end power consumption P s The power consumption is approximately 1.5W; the single exposure time is t=1s; and the single imaging energy consumption is E=(0.75+1.5)×1=2.25J. Furthermore, this system does not require repeated imaging on any of the three samples, obtaining effective images in a single exposure. Table 1.1 shows a comparison of power consumption between the traditional imaging scheme and this system.

[0058] Table 1.1 Comparison of power consumption between traditional imaging schemes and this system

[0059] As shown in Table 1.1, our system can achieve effective imaging on all three samples under conditions of 15kV, 50μA, and 0.00162mGy / s, with a radiation source power of only 0.75W; while traditional X-ray imaging methods require X-ray source power in the range of 100W or 200W. Particularly on samples 2 and 3, the traditional method, due to repeated imaging, has a total energy consumption of 406.00J and 609.00J per effective image, respectively, while our system consumes only 2.25J. This indicates that our system not only reduces the dose required for imaging but also significantly reduces the total energy consumption required to obtain effective images, demonstrating a significant energy-saving advantage.

[0060] Furthermore, the emission reduction and safety benefits of this system are reflected in three aspects: reduced imaging dose, reduced radiation burden, and reduced cumulative energy consumption. For the two schemes, the dose reduction rate and energy saving rate are defined respectively. , Where D0 and D1 represent the doses required to obtain effective images using the traditional method and the present system, respectively, and E0 and E1 represent the combined energy consumption per unit effective image using the traditional method and the present system, respectively. If a single device completes N imaging tasks per year, the annual energy saving can be expressed as... Further calculated using the local power grid emission factor k, the corresponding annual emission reduction is: .

[0061] For ease of explanation, the following calculations are based on a single device completing 10,000 imaging tasks per year and a power grid emission factor of 0.57 kg CO2 / kWh.

[0062] Table 1.2 Energy Saving and Emission Reduction Benefit Calculation Table

[0063] As shown in Table 1.2, compared with traditional X-ray imaging methods, the dose reduction rates of this system on samples 1, 2, and 3 reached 93.59%, 96.86%, and 99.84%, respectively; the energy consumption per unit effective image was reduced by 97.82%, 99.45%, and 99.63%, respectively. If calculated based on 10,000 imaging tasks per unit per year, the annual energy savings for samples 1, 2, and 3 would reach 0.2799 kWh, 1.1215 kWh, and 1.6854 kWh, respectively, corresponding to emission reductions of 0.1595 kg CO2, 0.6392 kg CO2, and 0.9607 kg CO2. This indicates that this system can not only significantly reduce radiation output during the imaging process but also reduce cumulative energy consumption and indirect carbon emissions under long-term, repeated use conditions. For medical testing scenarios, this means lower radiation risk and a higher level of environmental friendliness; for biological experiments and small-scale non-destructive testing, it demonstrates significant emission reduction and safety value. Furthermore, this also demonstrates that the system can significantly reduce radiation output during the imaging process, as well as reduce cumulative energy consumption and indirect carbon emissions under long-term, repeated use conditions. For medical testing scenarios, this means lower radiation risk and a higher level of environmental friendliness; for biological experiments and small-scale non-destructive testing, it demonstrates significant emission reduction and safety value.

[0064] In one embodiment of the present invention, the system further includes a pre-scan mode and a parameter calibration unit. Before formal imaging, the control module initiates the pre-scan mode: rapidly acquiring a frame image at an extremely low dose, and analyzing the grayscale distribution, contrast, and noise level of the image. Specifically, the pre-scan uses a fixed low dose to obtain a raw image with relatively high noise. The control module calculates the average grayscale value, signal-to-noise ratio, and contrast of the region of interest in the image. Based on the pre-scan results, the control module automatically calculates the optimal radiation dose rate, irradiation time, and optimal gain of the electron bombardment active pixel sensor imaging module required for formal imaging using a pre-stored calibration database or mathematical model. For example, if the contrast of the pre-scan image is low, it is recommended to increase the radiation energy or illuminance; if the noise is too high, it is recommended to extend the exposure time or increase the gain. The correspondence between these parameters can be obtained through experimental calibration and stored as a multidimensional lookup table. During formal imaging, the control module automatically calls the optimal parameter combination based on the pre-scan analysis results, driving the radiation source module and the electron bombardment active pixel sensor imaging module to work together.

[0065] In one embodiment of the present invention, for continuous imaging or dynamic perspective scenarios, the control module incorporates a closed-loop parameter optimization unit. This unit is configured to execute a closed-loop feedback control strategy based on a dual-objective cost function to minimize radiation dose while ensuring image quality. The specific implementation is as follows: (a) Real-time image quality assessment The image processing unit in the image acquisition and output module calculates at least one of the following quality indicators in real time for each frame of the output image: signal-to-noise ratio, contrast-to-noise ratio, and target edge intensity. The current image quality comprehensive score Q(t) is defined as the weighted sum of the above indicators, or the ratio of the above indicators to a preset target value.

[0066] (ii) Bi-objective cost function The control module sets the cost function J(t): J(t) = α·[1-Q(t) / Q max ]+β·[D(t) / D max ] Where: Q(t) is the current overall image quality score, Q max D(t) represents the theoretically achievable maximum quality score; D(t) represents the current radiation dose rate; D max The maximum allowable dose rate for safety; α and β are weighting coefficients, which can be preset to default ratios (e.g., α=0.6, β=0.4) or adjusted according to user preferences.

[0067] The significance of this cost function is that when J(t) is minimized, the system achieves the optimal balance of "obtaining the highest possible image quality with the lowest dose", which is a dual objective.

[0068] (III) Controller and Parameter Adjustment Rules The control module employs a proportional-integral-derivative (PI-DI) controller, using the cost function J(t) as a derived index of the control deviation. The error term e(t) is defined as e(t) = J(t) - Jt. target J target The target cost (preset to an acceptable compromise level). The controller output adjustment ΔU(t) is calculated according to the PID control law: ΔU(t)=Kp·[e(t)-e(t-1)]+Ki·e(t)+Kd·[e(t)-2e(t-1)+e(t-2)] Kp, Ki, and Kd are PID parameters, which can be obtained through step response experiments. ΔU(t) is normalized to the interval [-1, 1].

[0069] The control module adjusts the following execution parameters in coordination based on the sign and magnitude of ΔU(t): If ΔU(t) > 0 (the current cost is too high, i.e. the image quality is insufficient or the dose is too high), the EBAPS gain and voltage are increased first. When the gain is close to the maximum safe gain allowed by the device, the dose rate is increased slightly (the step size is proportional to ΔU(t) and does not exceed the preset maximum increment).

[0070] If ΔU(t) < 0 (the current cost is too low, i.e., the image quality is too good or the dose is too low), the dose rate should be reduced first. When the dose rate is close to the safe lower limit, the gain should be reduced appropriately.

[0071] The adjustment step size is proportional to |ΔU(t)|, and the adjustment period matches the image frame rate. All adjustments are made while ensuring continuous and stable image output. By tuning appropriate PID parameters, the system can converge to a stable state in a short time. This closed-loop control enables the system to adapt to changes in the thickness of the measured object or motion artifacts, always maintaining a balance between optimal image quality and minimum dose. For moving measured objects, the closed-loop control can dynamically track them, avoiding image blurring or overexposure that may occur with fixed parameters. Through the above closed-loop control, this system can automatically track changes in the measured object and adjust imaging parameters in real time in dynamic scenarios, always maintaining a dynamic balance between minimum dose and high-quality image. Compared with simple "fixed parameters" or "control methods based solely on image brightness feedback," the dual-target PID control of this invention significantly reduces the cumulative dose during continuous imaging and greatly reduces the fluctuation range of image quality.

[0072] like Figure 6 and Figure 7 As shown, in addition to its low-dose imaging capabilities, this system also demonstrates good performance in image stability and consistency of repeated tests. The electron-bombardment active pixel sensor imaging module has a high response capability to weak light signals, ensuring stable acquisition of luminescence information under low-dose conditions. Simultaneously, the image processing module effectively optimizes background noise and contrast, reducing the impact of weak signal fluctuations on the results. Compared to traditional solutions that are prone to producing overly dark images and insufficient contrast at low doses, requiring repeated exposure to higher conditions, this system can complete the imaging test under the first low-dose condition, reducing the time and energy consumption associated with repeated shooting, demonstrating good experimental stability and application feasibility.

[0073] This system has significant application potential in medical auxiliary detection, biological experimental imaging, and small-scale non-destructive testing in laboratories. For medical detection, low-dose imaging helps reduce the radiation burden on the subject during imaging; for biological experiments and scientific research imaging, it improves safety during continuous observation and repeated experiments; and for small-scale non-destructive testing, it enhances the flexibility and applicability of portable testing devices. This invention is expected to drive the development of low-dose medical imaging equipment towards miniaturization, portability, and engineering, providing crucial technical support for upgrading green medical equipment and achieving energy conservation and emission reduction goals.

[0074] Obviously, those skilled in the art should understand that the various units or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. Optionally, they can be implemented using computer-executable program code, thereby storing them in a storage device for execution by a computing device, or fabricating them separately as individual integrated circuit modules, or fabricating multiple modules or steps into a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0075] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A X-ray emission imaging system, characterized in that, include: A radiation source module, wherein the radiation source module is configured to emit radiation; A light emission conversion module is disposed in the emission direction of the X-ray source module, and the light emission conversion module is configured to receive X-rays after penetrating the test object and convert them into light emission distribution, wherein the test object is located between the X-ray source module and the light emission conversion module; An electron-bombardment active pixel sensor imaging module is disposed after the light emission conversion module, and the electron-bombardment active pixel sensor imaging module is configured to acquire the weak light emission image generated by the light emission conversion module and output the image signal.

2. The X-ray emission imaging system according to claim 1, characterized in that, The radiation source module is an X-ray source module or a gamma-ray source module.

3. The X-ray emission imaging system according to claim 1, characterized in that, The light emission conversion module is fitted to the object being tested.

4. The X-ray emission imaging system according to claim 1, characterized in that, The X-ray emission imaging system also includes a light-shielding and shielding module, which is configured to isolate stray ambient light and suppress direct irradiation of the electron bombardment type active pixel sensor imaging module by X-rays.

5. The X-ray emission imaging system according to claim 4, characterized in that, The light-shielding and shielding module includes one or more of the following: dark box, light-shielding cavity, direct-light shielding plate, or beam-limiting structure.

6. The X-ray emission imaging system according to claim 1, characterized in that, The light-emitting conversion module is a detachable and replaceable structure, and the light-emitting conversion module is a scintillation single crystal, a phosphor thin film, or a combination thereof.

7. The X-ray emission imaging system according to claim 1, characterized in that, A folded optical path structure is provided between the light emission conversion module and the electron bombardment active pixel sensor imaging module. The folded optical path structure is configured to allow the light emission image to enter the electron bombardment active pixel sensor imaging module after reflection.

8. The X-ray emission imaging system according to claim 1, characterized in that, The X-ray emission imaging system also includes an image acquisition and output module, which is configured to display, store, photograph, record, or transmit the image signal.

9. The X-ray emission imaging system according to claim 1, characterized in that, The radiation dose rate emitted by the radiation source module is greater than or equal to 0.00162 mGy / s.

10. A method for X-ray emission imaging, characterized in that, The X-ray emission imaging system according to any one of claims 1-9 includes the following steps: Receive the object under test and move the object under test between the X-ray source module and the light emission conversion module; The X-ray source module is controlled to start emitting X-rays towards the object under test; The electron-bombardment type active pixel sensor imaging module is controlled to acquire the luminescent image generated by the luminescence conversion module; The luminescent image is processed to obtain an image of the object under test.

Images