Terminal device housing and applications thereof, solid-phase composite joining method and products prepared thereby

Abstract

The application discloses a terminal device shell and application thereof, a solid-phase composite connecting method and a product prepared by the method. The terminal device shell comprises a first shell part, a second shell part, and a connecting part. The second shell part is annularly arranged around the outer side edge of the first shell part, and the second shell part is connected with the outer side edge of the first shell part through the connecting part. The connecting part is configured as a filling layer formed between the outer side edge of the first shell part and the second shell part through a stir friction deposition device. The outer side edge of the first shell part and the second shell part are connected through the connecting part, the filling connection between materials of a large gap structure can be realized, one-time forming can be realized, the process is simple, the connecting efficiency is relatively high, the direct connection of the same or different materials can be realized, and better adaptability is achieved.

Description

Cross-references to related applications

[0001] This application is based on and claims priority to Chinese Patent Application No. 202510731867.2, filed on June 3, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This invention relates to the field of equipment housing technology, and in particular to a terminal equipment housing and its application, a solid-phase composite bonding method, and the products prepared therefrom. Background Technology

[0003] In related technologies, for some equipment housings, the connection methods between different materials of the housing are usually arc welding, high-energy beam welding, hot isostatic pressing, etc. Arc welding is suitable for situations with a large aspect ratio and the need for beveling, but it requires a large heat input and is difficult to weld dissimilar materials, such as aluminum-titanium and aluminum-steel. High-energy beam welding also requires a large heat input and is also difficult to weld dissimilar materials. Hot isostatic pressing is cumbersome, requires expensive equipment, and has complex process requirements. Secondly, the above connection methods have high requirements for the butt joint gap between materials, and for some large-sized butt joints, it is difficult to guarantee the reliability of the connection between materials. Summary of the Invention

[0004] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a terminal device housing that enables seamless connection between identical or dissimilar materials, while also ensuring reliable connection between the materials.

[0005] According to an embodiment of the present invention, a terminal device housing includes: a first housing portion; a second housing portion, the second housing portion being arranged in a ring around the outer edge of the first housing portion, the second housing portion being connected to the outer edge of the first housing portion via a connecting portion, the connecting portion being configured as a filling layer formed between the outer edge of the first housing portion and the second housing portion by a stirring friction deposition device.

[0006] According to an embodiment of the present invention, the outer edge of the first shell and the second shell are connected by a connecting part, which can realize the gap filling connection between materials with large gap structures, and can be formed in one step. The process is simple, the connection efficiency is relatively high, and it can also realize the direct connection of the same or different materials, which has better adaptability.

[0007] In some embodiments of the present invention, the first shell portion is one of an annular component, a concave component, or a plate-shaped component.

[0008] In some embodiments of the present invention, the second shell portion is an integrally formed part, or the second shell portion includes multiple separate portions, which are spliced ​​together to form an annular structure surrounding the outer edge of the first shell portion.

[0009] In some embodiments of the present invention, the second shell portion includes a plurality of material layers stacked together, wherein any two adjacent material layers are made of different materials, and the innermost material layer among the plurality of material layers is connected to the first shell portion through the connecting portion.

[0010] According to an embodiment of the present invention, the terminal device housing described above is used in the manufacture of a terminal device.

[0011] According to an embodiment of the present invention, a solid-phase composite bonding method is used to fill the gap between a first component and a second component using a friction stir deposition apparatus to form a filling layer connecting the first component and the second component. The friction stir deposition apparatus includes a shoulder and a deposit material. The shoulder is provided with a feeding channel, and the deposit material is disposed in the feeding channel. The method includes: placing a lower pad below the gap between the first component and the second component to form a filling space between the lower pad and the gap; rotating the deposit material and frictionally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, and causing the thermoplasticized portion of the deposit material to fill the filling space; and moving the shoulder along the trajectory of the filling space.

[0012] According to the solid-phase composite bonding method of the present invention, gap filling bonding between materials with large gap structures can be achieved by stirring friction deposition. It can be formed in one step, with simple process, high bonding efficiency, and can also realize direct bonding of the same or different materials, thus having better adaptability.

[0013] In some embodiments of the present invention, prior to the step of placing a pad below the gap between the first component and the second component, the method includes: machining microstructures or coatings on the sides of the first component and the second component used to form the gap.

[0014] In some embodiments of the present invention, prior to the step of placing a lower pad below the gap between the first component and the second component, the method includes: machining a first surface on the upper section of the side of the first component and / or the second component used to form the gap, the first surface being configured as a vertical surface opposite to the first surface, wherein the distance between the first surface and the vertical surface gradually decreases in a top-to-bottom direction.

[0015] In some embodiments of the present invention, prior to the step of providing a lower pad below the gap between the first component and the second component, the method includes: machining a second surface on the lower segment of the side of the first component and / or the second component used to form the gap, the second surface being configured as a vertical surface opposite to the second surface, wherein the distance between the second surface and the vertical surface gradually decreases or gradually increases in a top-to-bottom direction; or, machining a groove in the lower pad at the position corresponding to the first component and the second component, wherein the side of the first component and the second component used to form the gap is located above the groove.

[0016] In some embodiments of the invention, prior to the step of rotating the deposit and tribothermally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, the method includes preheating the first component, the second component, and the lower pad.

[0017] In some embodiments of the invention, before the steps of rotating the deposit and frictionally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, and before the steps of preheating the first component, the second component, and the lower pad, the method includes: adding a protective gas to protect the working area containing the filler space, the deposit, and the shoulder.

[0018] In some embodiments of the present invention, prior to the step of placing a pad below the gap between the first component and the second component, the method includes: pre-depositing a material layer of the same material as the deposit on the sides of the first component and the second component used to form the gap.

[0019] In some embodiments of the present invention, after the step of moving the shoulder along the trajectory of the packing space, the method includes: spot welding at the joint between the packing and the first component and at the joint between the packing and the second component within the packing space.

[0020] In some embodiments of the present invention, after the step of moving the shoulder along the trajectory of the filler space, the method includes: performing friction stir welding on the filler connection area of ​​the first component and the second component.

[0021] In some embodiments of the present invention, before the step of providing a lower pad below the gap between the first component and the second component, the method includes: providing ventilation holes on the lower pad.

[0022] In some embodiments of the present invention, when the width of the feeding channel is greater than the width of the gap between the first component and the second component, the step of rotating the deposit and rubbing it against at least one of the first component, the second component and the lower pad to thermoplasticize it, and filling the thermoplasticized portion of the deposit into the filler space, includes: rotating the deposit and rubbing it against the tops of the first component and the second component to thermoplasticize it; and filling the gap with the thermoplasticized portion of the deposit from top to bottom.

[0023] In some embodiments of the present invention, when the width of the feeding channel is less than or equal to the width of the gap between the first component and the second component, the step of rotating the deposit and rubbing it against at least one of the first component, the second component, and the lower pad to thermoplasticize it, and filling the thermoplasticized portion of the deposit into the filler space, includes: extending the deposit into the gap between the first component and the second component; rotating the deposit and rubbing it against the lower pad to thermoplasticize it; and filling the gap with the thermoplasticized portion of the deposit from bottom to top.

[0024] In some embodiments of the present invention, after the step of providing a lower pad below the gap between the first component and the second component, the method includes: providing an upper pad on top of the first component and the second component.

[0025] In some embodiments of the present invention, the deposit is one of the following: filamentous, granular, powdery, or rod-shaped.

[0026] In some embodiments of the present invention, the step of rotating the deposit and frictionally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, and causing the thermoplasticized portion of the deposit to fill the filler space, and moving the shoulder along the trajectory of the filler space includes: dividing the gap into a first space and a second space arranged vertically; constructing the lower pad to partially protrude into the second space; rotating the deposit and frictionally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, causing the thermoplasticized portion of the deposit to fill the first space; moving the shoulder along the trajectory of the filler space; flipping the first component and the second component, and machining away the protruding portion of the lower pad located in the second space; rotating the deposit and frictionally thermoplasticizing it with at least one of the first component, the second component, and the filler deposit layer in the first space, causing the thermoplasticized portion of the deposit to fill the second space; and moving the shoulder along the trajectory of the filler space.

[0027] In some embodiments of the present invention, prior to the step of rotating the deposit and rubbing it against at least one of the first component, the second component, and the filler deposit layer in the first space to thermoplasticize it, so that the thermoplasticized portion of the deposit fills the second space, the method includes: machining chamfers or rounded corners on both sides of the filler deposit layer in the first space.

[0028] In some embodiments of the present invention, prior to the step of rotating the deposit and tribothermally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, the method further includes: rotating the deposit and first tribothermally thermoplasticizing it in a non-filled area.

[0029] In some embodiments of the present invention, after rotating the deposit and first performing frictional thermoplasticization in the non-filled area, the method further includes: the direction of movement of the deposit from the non-filled area to the gap has an angle with the length direction of the gap, the angle being greater than 0° and less than 90°.

[0030] According to an embodiment of the present invention, a product is prepared using the solid-phase composite bonding method described in any of the preceding descriptions.

[0031] According to the product of the present invention, it is possible to fill and connect large gaps between different materials of the product, and it can be formed in one step. The process is simple, the connection efficiency is relatively high, and it can also realize the direct connection of the same or different materials, which has better adaptability.

[0032] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0033] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 A top view of the casing of a terminal device provided in some embodiments of the present invention; Figure 2 A cross-sectional view of the casing of a terminal device provided in some embodiments of the present invention; Figure 3 A top view of a terminal device housing provided in another embodiment of the present invention; Figure 4 Schematic diagram of the caulking connection of the first and second components provided for some embodiments of the present invention Figure 1 ; Figure 5 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 1 ; Figure 6A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 2 ; Figure 7 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 3 ; Figure 8 Schematic diagram of the first component, the second component, and the lower pad provided for some embodiments of the present invention. Figure 1 ; Figure 9 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 4 ; Figure 10 Schematic diagram of the first component, the second component, and the lower pad provided for some embodiments of the present invention. Figure 2 ; Figure 11 Schematic diagram of the first component, the second component, and the lower pad provided for some embodiments of the present invention. Figure 3 ; Figure 12 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 5 ; Figure 13 Schematic diagram of the first component, the second component, and the lower pad provided for some embodiments of the present invention. Figure 4 ; Figure 14 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 6 ; Figure 15 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 7 ; Figure 16 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 8 ; Figure 17 Schematic diagram of the caulking connection of the first and second components provided for some embodiments of the present invention Figure 2 ; Figure 18 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 9 ; Figure 19 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 10 ; Figure 20 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 10 one; Figure 21Schematic diagram of the caulking connection of the first and second components provided for some embodiments of the present invention Figure 3 ; Figure 22 Schematic diagram of the caulking connection of the first and second components provided for some embodiments of the present invention Figure 4 ; Figure 23 A method block diagram of a solid-phase composite bonding method provided in some embodiments of the present invention Figure 10 two; Figure 24 Schematic diagram of the first and second components provided for some embodiments of the present invention Figure 1 ; Figure 25 Schematic diagram of the first and second components provided for some embodiments of the present invention Figure 2 ; Figure 26 Schematic diagram of the first and second components provided for some embodiments of the present invention Figure 3 ; Figure 27 The diagram illustrates the effect of the caulking connection between the first and second components, as provided in some embodiments of the present invention. Figure 28 A diagram illustrating the caulking connection effect of the first and second components provided in another embodiment of the present invention.

[0034] Figure label: 100. Terminal equipment casing; 1. First casing section; 2. Second casing section; 21. Separate section; 3. Connecting section; 11. First component; 12. Second component; 101. Gap; 1011. First space; 1011a. Chamfer; 1011b. Rounded corner; 1012. Second space; 102. First surface; 103. Second surface; 104. Material layer; 20. Stirred friction deposition apparatus; 201. Shaft shoulder; 2011. Feeding channel; 202. Deposited material; 30. Lower pad; 30a. Groove; 40. Upper pad. Detailed Implementation

[0035] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0036] In the description of this invention, it should be understood that the terms "center," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0037] Furthermore, features specified as "first" or "second" may explicitly or implicitly include one or more of the same feature, used to distinguish and describe features, without any order or distinction of importance.

[0038] In the description of this invention, unless otherwise stated, "a plurality of" means two or more. In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0039] Friction stir deposition (FSD) is an emerging and important solid-phase additive manufacturing technology. In FSD, a non-consumable, hollow, rotating jig is used, and a feedstock (such as a metal rod) is delivered via a feeding device. The jig and feedstock rotate synchronously at high speed, generating dynamic contact friction and extrusion upon contact, causing the feedstock to rapidly heat up and plasticize. Under the shearing force of the jig and the forging force of the feeding device, the plasticized feedstock is extruded and filled into the gap between the tool head and the substrate to form a deposition layer. As the tool head moves, the deposition layer accumulates layer by layer, eventually forming the desired geometry.

[0040] The following is for reference. Figures 1-3 The following describes a terminal device housing 100 according to an embodiment of the present invention.

[0041] like Figure 1 and Figure 2 As shown, a terminal device housing 100 according to an embodiment of the present invention includes a first housing portion 1 and a second housing portion 2. The second housing portion 2 is arranged in a ring around the outer edge of the first housing portion 1. The second housing portion 2 is connected to the outer edge of the first housing portion 1 through a connecting portion 3. The connecting portion 3 is configured as a filling layer formed between the outer edge of the first housing portion 1 and the second housing portion 2 by a stirring friction deposition device.

[0042] The terminal device casing 100 can refer to a shell structure that completely encloses the terminal device, or it can refer to a partial shell component of the overall shell structure of the terminal device. The terminal device casing 100 can also be, but is not limited to, a mobile phone casing, a tablet casing, or a computer casing, etc., and no specific limitation is made here. The first shell part 1 and the second shell part 2 can be made of the same or different materials. Optionally, the material of the first shell part 1 can refer to the second component 12 described below, and the material of the second shell part 2 can refer to the first component 11 described below. For example, the first shell part 1 is made of aluminum, and the second shell part 2 is made of titanium. The forming method of the connecting part 3 can refer to the solid-state composite connection method in the embodiments described below, and will not be repeated here.

[0043] According to the terminal device housing 100 of the present invention, the outer edge of the first housing part 1 and the second housing part 2 are connected by the connecting part 3, which can realize the gap filling connection between materials with large gap structure, and can be formed in one step. The process is simple, the connection efficiency is relatively high, and it can also realize the direct connection of the same or different materials, which has better adaptability.

[0044] In some embodiments of the present invention, the first shell portion 1 is one of an annular component, a concave component, or a plate-like component. It can be understood that both the first shell portion 1 and the second shell portion 2 can be annular components; for example, the first shell portion 1 and the second shell portion 2 together constitute the frame structure of the outer shell. The first shell portion 1 can be a concave component, and the second shell portion 2 can be an annular component, thus the second shell portion 2 is a frame structure connected to the outside of the concave component, thereby making the outer shell structure formed by the first shell portion 1 and the second shell portion 2 an open-top shell structure. The first shell portion 1 can also be a plate-like component, and the second shell portion 2 can be an annular structure, thus the second shell portion 2 is a frame structure connected to the outside of the plate-like component, and the first shell portion 1 constitutes an inner plate connected within the second shell portion 2.

[0045] In some embodiments of the present invention, the second shell portion 2 is a one-piece molded part. This can be understood as the second shell portion 2 being a one-piece molded annular structure.

[0046] In some embodiments of the present invention, such as Figure 3 As shown, the second shell portion 2 includes multiple sub-portions 21, which are assembled together to form a ring structure surrounding the outer edge of the first shell portion 1. It can be understood that the second shell portion 2 is composed of multiple sub-portions 21. The structures of the multiple sub-portions 21 can be identical, for example, all being straight structures; or the structures of the multiple sub-portions 21 can be different, for example, one part being straight and another part being U-shaped (see...). Figure 3 Optionally, any two adjacent parts 21 can be connected by means of, but not limited to, welding, bonding, snap-fitting or screwing, or when multiple parts 21 are joined together in a solid-phase composite connection, they can be limited and clamped by a clamping mechanism.

[0047] In some embodiments of the present invention, the second shell portion 2 includes multiple material layers stacked together, with any two adjacent material layers having different materials, and the innermost material layer among the multiple material layers being connected to the first shell portion 1 via a connecting portion 3. For example, there may be two material layers, with the inner layer being an aluminum layer and the outer layer being a titanium layer or a steel layer, and the aluminum layer of the inner layer being connected to the first shell portion 1 via the connecting portion 3.

[0048] In some embodiments of the present invention, an application of a terminal device housing according to any of the foregoing embodiments is proposed in the manufacture of a terminal device. In this embodiment, the terminal device may be, but is not limited to, a mobile phone, tablet, computer, etc.

[0049] The following is for reference. Figures 4-26 This describes a solid-phase composite bonding method according to embodiments of the present invention.

[0050] like Figure 4 As shown, according to an embodiment of the solid-phase composite joining method of the present invention, the method employs a friction stir deposition apparatus 20 to fill the gap between a first component 11 and a second component 12 to form a filling layer connecting the first component 11 and the second component 12. The friction stir deposition apparatus 20 includes a shoulder 201 and a deposit 202. The shoulder 201 is provided with a feeding channel 2011, and the deposit 202 is disposed within the feeding channel 2011. The shoulder 201 is at least a partial structure of the welding fixture described above. The deposit 202 is configured to rotate at high speed within the feeding channel 2011, and the deposit 202 can move axially relative to the shoulder 201 under axial pressure. The axial pressure on the deposit 202 can be a normal pressure along the axial direction or a frictional force on the side of the deposit 202.

[0051] Other components and operations of the agitation and friction deposition apparatus 20 of this invention are known to those skilled in the art and will not be described in detail here.

[0052] like Figure 4 and Figure 5 As shown, the solid-phase composite bonding method of this invention includes: A lower pad 30 is provided below the gap 101 between the first component 11 and the second component 12, so that a filling space is formed between the lower pad 30 and the gap 101.

[0053] The deposit 202 is rotated and rubbed thermoplasticized with at least one of the first component 11, the second component 12 and the lower pad 30, and the thermoplasticized portion of the deposit 202 fills the filler space, and the shoulder 201 moves along the trajectory of the filler space.

[0054] In the above technical solution, the first component 11 and the second component 12 can be, but are not limited to, a flat plate, an arc plate, or a curved plate, etc. Optionally, the materials of the first component 11 and the second component 12 can be the same or different. The material of the deposit 202 can be the same as or different from that of the first component 11 and the second component 12, and the deposit 202 can also be the same as the material of one of the first component 11 and the second component 12. The material of the lower pad 30 can be the same as or different from that of the first component 11 and the second component 12.

[0055] For example, the first component 11 and the second component 12 are made of aluminum alloy, see reference. Figure 27 , Figure 27 (a) is a schematic diagram of the aluminum plate after the groove has been cut. Figure 27 (b) is a cross-sectional metallographic image of the joint after filling using the solid-phase composite bonding method.

[0056] For example, the first component 11 is made of titanium alloy, the second component 12 is made of 6061 aluminum alloy, the deposited material 202 is made of 6013 aluminum alloy, and the lower backing plate 30 is made of other grades of aluminum alloy. As another example, the first component 11 is made of titanium alloy, the second component 12 is made of steel, the deposited material 202 is made of aluminum alloy, and the lower backing plate 30 is made of other grades of aluminum alloy. (See reference...) Figure 28 , Figure 28 The image shows the effect of filling the gap after applying a solid-phase composite bonding method to titanium and aluminum parts.

[0057] In the above-described connection method, the deposit 202, after being thermoplasticized by frictional heating with any of the first component 11, the second component 12, the lower pad 30, and the shoulder 201, is filled into the gap 101 between the first component 11 and the second component 12, continuing to fill up to the lower pad 30 and compacting the entire filler space under pressure. Then, the shoulder 201 carries the deposit 202 along the trajectory of the filler space, ultimately achieving the connection between the first component 11 and the second component 12. Because the first component 11 and the second component 12 are connected using a stirring friction deposition method, the thermoplasticized filler can achieve a more thorough metallurgical bond with the first component 11 and the second component 12, thereby enabling the connection of a wider gap 101. For example, the above method can achieve a gap-filled connection between two components with a gap width greater than 2 mm.

[0058] According to the solid-phase composite bonding method of the present invention, gap filling bonding between materials with large gap structures can be achieved by stirring friction deposition. It can be formed in one step, with simple process, high bonding efficiency, and can also realize direct bonding of the same or different materials, thus having better adaptability.

[0059] In some embodiments of the present invention, such as Figure 6As shown, before the step of setting the lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: machining microstructures or coatings on the sides of the first component 11 and the second component 12 used to form the gap 101.

[0060] Microstructure can refer to structures that increase lateral surface roughness, and can be, but is not limited to, groove / stripe structures, dot / grid structures, sandblasting / shot peening structures, etc. The coating can be, but is not limited to, tin plating, silver plating, or nickel plating, etc.

[0061] In the above technical solution, by processing microstructures on the sides of the first component 11 and the second component 12 used to form the gap 101, the surface roughness of the first component 11 and the second component 12 can be improved, thereby improving the bonding between the filler material and the first component 11 and the second component 12, and increasing the connection strength between the first component 11 and the second component 12. Similarly, by processing a coating on the sides of the first component 11 and the second component 12 used to form the gap 101, the bonding between the filler material and the first component 11 and the second component 12 can also be improved.

[0062] In some embodiments of the present invention, such as Figure 7 and Figure 8 As shown, before the step of setting the lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: machining a first surface 102 on the upper section of the first component 11 and the second component 12 used to form the side of the gap 101, the first surface 102 being constructed as a vertical surface opposite to the first surface 102, the distance between the first surface 102 and the vertical surface gradually decreasing in the top-to-bottom direction.

[0063] The step of “processing the first surface 102 on the upper part of the side of the first component 11 and the second component 12 to form the gap 101” can be combined with any of the preceding embodiments. For example, it can be combined with the step of “processing microstructures or coatings on the side of the first component 11 and the second component 12 to form the gap 101”, and the two steps have no order.

[0064] "A vertical plane is constructed opposite to the first surface 102, and the distance between the first surface 102 and the vertical plane gradually decreases from top to bottom." This means that the first surface 102 can be, but is not limited to, an inclined plane, an arc surface, or a curved surface, etc. For example, when the first surface 102 is an inclined plane, the inclined plane can be 45 degrees.

[0065] In the above technical solution, by processing the first surface 102 on the upper section of the side of the first component 11 and the second component 12 used to form the gap 101, the top of the gap 101 can be made to have an flared structure, and the space on the upper side of the gap 101 is larger. This can increase the fluidity of the filling material, improve the situation of root defects appearing at the top of the gap 101, and reduce the risk of root defects. It can also improve the reliability of the filling connection between the first component 11 and the second component 12, and thus improve the connection strength between the first component 11 and the second component 12.

[0066] In some embodiments of the present invention, prior to the step of providing a lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: machining a first surface 102 on the upper section of the side of the first component 11 or the second component 12 used to form the gap 101, the first surface 102 being configured as a vertical surface opposite to the first surface 102, wherein the distance between the first surface 102 and the vertical surface gradually decreases in the top-to-bottom direction.

[0067] In some embodiments of the present invention, the first surface 102 may also be the first component 11 and / or the second component 12 used to form the entire side of the gap 101.

[0068] In some embodiments of the present invention, such as Figures 9 to 11 As shown, before the step of setting the lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: machining a second surface 103 on the lower section of the first component 11 and the second component 12 used to form the side of the gap 101, the second surface 103 being constructed as a vertical surface opposite to the second surface 103, the distance between the second surface 103 and the vertical surface gradually decreasing or gradually increasing in the top-to-bottom direction.

[0069] Reference Figure 10 A vertical plane is constructed opposite to the second surface 103. The distance between the second surface 103 and the vertical plane can gradually increase from top to bottom. (Refer to...) Figure 11 A vertical surface is formed opposite to the second surface 103, and the distance between the second surface 103 and the vertical surface can gradually decrease from top to bottom. The second surface 103 can be, but is not limited to, an inclined surface, an arc surface, or a curved surface, etc.

[0070] In some embodiments of the present invention, prior to the step of providing a lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: machining a second surface 103 on the lower section of the first component 11 or the second component 12 used to form the side of the gap 101, the second surface 103 being configured as a vertical surface opposite to the second surface 103, wherein the distance between the second surface 103 and the vertical surface gradually decreases or gradually increases in the top-to-bottom direction.

[0071] Both of the above structures can prevent right-angled edges from appearing at the bottom of the gap 101, which helps reduce the risk of root defects and increases the fluidity of the filling material at the bottom of the gap 101. Figure 10 The second surface 103 of this structure can also increase the volume of the filler space, thereby improving the reliability of the connection between the filler material and the bottom of the first component 11 and the second component 12.

[0072] In some embodiments of the present invention, such as Figure 12 and Figure 13 As shown, before the step of setting the lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: machining a groove 30a on the lower pad 30 at the position corresponding to the first component 11 and the second component 12, wherein the side of the first component 11 and the second component 12 used to form the gap 101 is located directly above the groove 30a.

[0073] Optionally, the groove 30a can be, but is not limited to, a rectangular groove, a semi-circular groove, a trapezoidal groove, etc.

[0074] In the above technical solution, by machining grooves 30a on the lower pad 30 at the positions corresponding to the first component 11 and the second component 12, the filling space of the filling material can be increased, the fluidity of the filling material can be increased, and the hole defects at the right angle can be directed to the position of the groove 30a. After the first component 11 and the second component 12 are filled and joined, the lower pad 30 can be directly machined away, thereby removing the root defects. This further reduces the risk of root defects and improves the connection reliability of the first component 11 and the second component 12.

[0075] In some embodiments of the present invention, such as Figure 14 As shown, prior to the step of rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12, and the lower pad 30, the method includes preheating the first component 11, the second component 12, and the lower pad 30.

[0076] Understandably, by preheating the first component 11, the second component 12, and the lower pad 30 before filling and joining, the heat input can be supplemented, the flow of the filling material between the gap 101 and the lower pad 30 can be increased, the connection efficiency can be improved, and defects can be reduced, thereby improving the connection reliability of the first component 11 and the second component 12.

[0077] In some embodiments of the present invention, such as Figure 15As shown, before the steps of rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12 and the lower pad 30, and before the steps of preheating the first component 11, the second component 12 and the lower pad 30, the method includes: adding a protective gas to protect the working area where the filler space, the deposit 202 and the shoulder 201 are located.

[0078] Optionally, the protective gas may refer to an inert gas, and may be, but is not limited to, gases that do not react with the filling material, such as argon and nitrogen.

[0079] In the above technical solution, since the temperature is high during the preheating process and the friction deposition process, an oxide film is easily formed on the surface of the filler material. Therefore, by adding a protective gas to protect the working area where the filler space, the deposit 202 and the shoulder 201 are located, the formation of the oxide film can be reduced. This can reduce defects and improve the connection reliability between the first component 11 and the second component 12 and the filler material.

[0080] In some embodiments of the present invention, such as Figure 16 and Figure 17 As shown, before the step of setting the lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: pre-depositing a material layer 104 of the same material as the deposit 202 on the sides of the first component 11 and the second component 12 used to form the gap 101.

[0081] It is understandable that by first pre-depositing a material layer 104 of the same material as the deposit 202 on the sides of the first component 11 and the second component 12 used to form the gap 101, and then filling the gap, the connection performance and efficiency between the filling material and the first component 11 and the second component 12 can be improved.

[0082] In some embodiments of the present invention, such as Figure 18 As shown, after the step of moving the shoulder 201 along the trajectory of the packing space, the method includes: spot welding at the joint between the packing and the first component 11, and at the joint between the packing and the second component 12 within the packing space. The spot welding method can be backfill-type friction stir spot welding. In this technical solution, by spot welding at the joint between the packing and the first component 11, and at the joint between the packing and the second component 12 within the packing space, the interface connection between the filling material and the first component 11 and the second component 12 can be further strengthened, improving the connection reliability.

[0083] In some embodiments of the present invention, after the step of moving the shoulder 201 along the trajectory of the packing space, the method includes: spot welding at the joint within the packing space, wherein the spot welding method can be backfill friction stir spot welding. In this technical solution, by spot welding at the joint within the packing space after the filler joint is connected, the interface connection can be further strengthened and the connection reliability can be improved.

[0084] In some embodiments of the present invention, such as Figure 19 As shown, after the step of moving the shoulder 201 along the trajectory of the packing space, the method includes: performing friction stir welding on the packing connection area of ​​the first component 11 and the second component 12. In this technical solution, by performing friction stir welding on the packing connection area of ​​the first component 11 and the second component 12, the interface connection between the filler material and the first component 11 and the second component 12 can be further strengthened, and the connection reliability can be improved.

[0085] In some embodiments of the present invention, such as Figure 20 As shown, before the step of setting the lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes: setting vent holes on the lower pad 30.

[0086] The vent holes can be arranged in a dot matrix or array on the lower pad 30, or on one or both sides of the lower pad 30 away from the gap 101, or in the filling area between the first component 11 and the second component 12 on the lower pad 30. The vent holes can be, but are not limited to, round holes, strip holes, square holes, or arc holes, etc.

[0087] In this technical solution, by setting vent holes on the lower pad 30, air can be prevented from being rolled to the bottom during the connection process, and the air in the filling space can be smoothly discharged, reducing the probability of air being trapped at the interface and unable to be discharged, thereby reducing the risk of forming defects and improving the connection reliability between the filling material and the first component 11 and the second component 12.

[0088] In some embodiments of the present invention, when the width of the feeding channel 2011 is greater than the width of the gap 101 between the first component 11 and the second component 12, the step of rotating the deposit 202 and rubbing it against at least one of the first component 11, the second component 12 and the lower pad 30 to thermoplasticize it, and filling the thermoplasticized portion of the deposit 202 into the filler space, includes: rotating the deposit 202 and rubbing it against the top of the first component 11 and the second component 12 to thermoplasticize it; and filling the gap 101 with the thermoplasticized portion of the deposit 202 from top to bottom.

[0089] Reference Figure 4When the width of the feeding channel 2011 is greater than the width of the gap 101 between the first component 11 and the second component 12, after the deposit 202 is extruded from the feeding channel 2011, the lower end face of the deposit 202 rubs against the upper surface of the first component 11 and the second component 12 to generate heat. As the deposit 202 thermoplasticizes and enters the gap 101, the deposit 202 can also rub against the two sides of the gap 101 to generate heat. The softened filler can be squeezed onto the lower pad 30 to form a metallurgical bond, thereby achieving top-to-bottom gap filling.

[0090] In some embodiments of the present invention, when the width of the feeding channel 2011 is less than or equal to the width of the gap 101 between the first component 11 and the second component 12, the step of rotating the deposit 202 and rubbing it against at least one of the first component 11, the second component 12 and the lower pad 30 to thermoplasticize it, and filling the thermoplasticized portion of the deposit 202 into the filler space, includes: extending the deposit 202 into the gap 101 between the first component 11 and the second component 12; rotating the deposit 202 and rubbing it against the lower pad 30 to thermoplasticize it; and filling the gap 101 with the thermoplasticized portion of the deposit 202 from bottom to top.

[0091] like Figure 21 As shown, the maximum dimension of the lower end face of the feeding channel 2011 is smaller than the width of the gap 101. After the deposit 202 is extruded from the feeding channel 2011, the deposit 202 mainly generates heat through friction with the upper surface of the lower pad 30. After softening, the thermoplastic material is squeezed upward and forms a metallurgical bond with the first component 11, the second component 12, and the lower pad 30. When the maximum dimension of the lower end face of the deposit 202 is equal to the width of the gap 101, the deposit 202 generates heat not only through friction with the upper surface of the lower pad 30 but also through friction with the two sides of the gap 101. In both of these cases, the material flow process is from bottom to top, filling the gap.

[0092] In some embodiments of the present invention, such as Figure 22 As shown, after the step of providing a lower pad 30 below the gap 101 between the first component 11 and the second component 12, the method includes providing an upper pad 40 on top of the first component 11 and the second component 12.

[0093] The upper pad 40 and the lower pad 30 can be made of the same or different materials. The upper pad 40 can also be made of the same or different materials as the first component 11 and the second component 12. The upper pad 40 can also be made of the same or different materials as the deposit material 202. The material of the upper pad 40 can be, but is not limited to, steel, aluminum, titanium, etc.

[0094] In the above technical solution, by providing a pad 40 on the top of the first component 11 and the second component 12, the upper surfaces of the first component 11 and the second component 12 can be protected, avoiding material contamination and preventing further processing and removal due to the filler filling the upper surfaces of the first component 11 and the second component 12. This can improve production efficiency, expand the process window, adapt to a wider range of process parameters, and help withstand the flow caused by greater changes in external conditions, thus ensuring the stability of the filling performance.

[0095] In some embodiments of the present invention, the deposit 202 is one of filaments, granules, powders, or rods.

[0096] When the deposit material 202 is filamentous, granular, or powdered, a feeding port communicating with the feeding channel 2011 can be provided on the side of the shoulder 201. Filamentous, powdered, or granular materials can be fed into the feeding channel 2011 through the feeding port. A component inside the feeding channel 2011 applies pressure in the axial direction and rotates, causing the deposit material 202 formed from the filamentous, granular, or powdered raw materials to undergo frictional thermoplasticization with at least one of the first component 11, the second component 12, and the lower pad 30, thereby filling the filler space. Using any one of filamentous, granular, or powdered deposit materials for the deposit material 202, due to the relatively small volume of the filamentous, granular, or powdered deposit material, facilitates the filling and connection of smaller gaps 101.

[0097] Reference Figure 4 , Figure 17 , Figure 21 and Figure 22 The deposit material 202 can also be made of rod-shaped raw material, such as, but not limited to, cylindrical, square column, etc. After the rod material is rotated, it is frictionally thermoplasticized with at least one of the first component 11, the second component 12, and the lower pad 30, filling the filler space. When the deposit material 202 is rod-shaped, the rod-shaped deposit material can be directly placed in the feeding channel 2011 and fed from top to bottom, which can eliminate the need for opening holes on the side of the shoulder 201, simplify the feeding mechanism, and reduce equipment costs. Moreover, the rod-shaped deposit material itself has a dense internal structure, and the composition is relatively uniform and consistent after frictional thermoplasticization, which can enhance the bonding with the first component 11 and the second component 12 and improve the connection reliability of the first component 11 and the second component 12.

[0098] It is understood that the solid-phase composite bonding method of the present invention described above uses additive deposition through deposit material 202 to achieve gap filling bonding. The feeding method of additive deposition in the solid-phase composite bonding method can be, but is not limited to, feeding wire, feeding particles, feeding powder, feeding rods, etc., all of which can achieve deposition gap filling bonding.

[0099] In some embodiments of the present invention, such as Figure 23 and Figure 24 As shown, the steps of rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12, and the lower pad 30, and causing the thermoplasticized portion of the deposit 202 to fill the filler space, and moving the shoulder 201 along the trajectory of the filler space include: dividing the gap 101 into a first space 1011 and a second space 1012 arranged vertically; configuring the lower pad 30 to partially protrude within the second space 1012; rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12, and the lower pad 30. Plasticizing, causing the thermoplasticized portion of the deposit 202 to fill the first space 1011; moving the shoulder 201 along the trajectory of the filling space; flipping the first component 11 and the second component 12, and machining away the protruding portion of the lower pad 30 located in the second space 1012; rotating the deposit 202 and rubbing it against at least one of the first component 11, the second component 12 and the filler deposit layer in the first space 1011 to thermoplasticize, causing the thermoplasticized portion of the deposit 202 to fill the second space 1012; moving the shoulder 201 along the trajectory of the filling space.

[0100] In the above technical solution, refer to Figure 24 In (a), (b) and (c), for deeper gaps 101, double-sided filling and connection can be performed. That is, first, the first space 1011 is filled, then it is rotated 180 degrees and the protruding part of the lower pad 30 located in the second space 1012 is removed by machining or the entire lower pad 30 is removed. Then, the second space 1012 is filled. The dense connection of the entire gap 101 is achieved through two fillings, which can improve the connection efficiency and ensure the connection performance.

[0101] Optionally, the sizes of the first space 1011 and the second space 1012 may be equal or unequal.

[0102] In some embodiments of the present invention, such as Figure 25 and Figure 26 Before the step of rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12 and the joint filler deposit layer in the first space 1011, so that the thermoplasticized portion of the deposit 202 fills the second space 1012, the method includes: processing chamfers 1011a or fillets 1011b on both sides of the joint filler deposit layer in the first space 1011.

[0103] In the above technical solution, by processing chamfers 1011a or rounded corners 1011b on both sides of the filler deposition layer in the first space 1011, the filling space of the second space 1012 can be increased, the fluidity of the filling material can be increased, the situation of root defects in the second space 1012 can be improved, and the risk of root defects can be reduced. This can improve the reliability of the filler connection between the first component 11 and the second component 12, and improve the connection strength between the first component 11 and the second component 12.

[0104] In some embodiments of the invention, prior to the step of rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12, and the lower pad 30, the method further includes rotating the deposit 202 and first performing frictional thermoplasticizing in the non-filled area.

[0105] Before frictional deposition begins, the pressure and heat input are unstable, which can easily lead to defects such as cracks and poor deposition on the substrate. Therefore, by rotating the deposit 202 and first subjecting it to frictional thermoplasticization in contact with the non-filled area, defects can be formed as much as possible in the non-filled area, reducing the risk of defects occurring during frictional thermoplasticization deposition of the deposit 202 with at least one of the first component 11, the second component 12, and the lower pad 30. Here, the non-filled area can refer to a region in the first component 11, the second component 12, or the lower pad 30 that is far from the filler space, or it can refer to a separately provided inlet plate.

[0106] In some embodiments of the present invention, after rotating the deposit 202 and first performing frictional thermoplasticization in the non-filled area, the method further includes: the direction of movement of the deposit 202 from the non-filled area to the gap has an angle with the length direction of the gap, the angle being greater than 0° and less than 90°.

[0107] It is understandable that by setting the direction of movement of the deposit 202 from the non-filling area to the gap to have an angle with the length direction of the gap, and then rotating the deposit 202 and frictionally thermoplasticizing it with at least one of the first component 11, the second component 12 and the lower pad 30, it is beneficial to improve the filling quality between the first component 11 and the second component 12 and improve the connection reliability.

[0108] According to an embodiment of the present invention, a product is prepared using a solid-phase composite bonding method as described in any of the preceding embodiments.

[0109] The aforementioned products may refer to, but are not limited to, casings (such as device casings, mobile phone casings, tablet casings, or computer casings, etc.), sheet products (sheets made of different materials), or products with a certain cross-sectional shape (columnar components with a square cross-section, columnar components with an L-shaped cross-section, etc.).

[0110] According to the product of the present invention, it is possible to fill and connect large gaps between different materials of the product, and it can be formed in one step. The process is simple, the connection efficiency is relatively high, and it can also realize the direct connection of the same or different materials, which has better adaptability.

[0111] In the description of this specification, references to terms such as "some embodiments," "optionally," "furthermore," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0112] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A terminal device housing, characterized in that, include: First shell section; The second shell portion is arranged in a ring around the outer edge of the first shell portion. The second shell portion is connected to the outer edge of the first shell portion through a connecting portion, which is configured as a filling layer formed between the outer edge of the first shell portion and the second shell portion by a stirring friction deposition device.

2. The terminal device housing according to claim 1, characterized in that, The first shell portion is one of an annular component, a concave component, or a plate-shaped component.

3. The terminal device housing according to claim 1 or 2, characterized in that, The second shell is a one-piece molded part, or the second shell includes multiple separate parts, which are spliced ​​together to form an annular structure surrounding the outer edge of the first shell.

4. The terminal device housing according to claim 1, characterized in that, The second shell includes multiple material layers stacked together, with any two adjacent material layers having different materials, and the innermost material layer among the multiple material layers being connected to the first shell through the connecting portion.

5. The use of a terminal device housing according to any one of claims 1 to 4 in the manufacture of a terminal device.

6. A solid-phase composite bonding method, characterized in that, The method employs a friction stir deposition apparatus to fill the gap between a first component and a second component, forming a filling layer connecting the first and second components. The friction stir deposition apparatus includes a shoulder and a deposit material. The shoulder is provided with a feeding channel, and the deposit material is disposed within the feeding channel. The method includes: A lower pad is provided below the gap between the first component and the second component, so that a filling space is formed between the lower pad and the gap; The deposit is rotated and rubbed thermoplasticized with at least one of the first component, the second component, and the lower pad, and the thermoplasticized portion of the deposit fills the filler space, while the shoulder moves along the trajectory of the filler space.

7. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of placing a lower pad below the gap between the first component and the second component, the method includes: Microstructures or coatings are machined on the sides of the first and second components used to form the gaps.

8. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of placing a lower pad below the gap between the first component and the second component, the method includes: The upper section of the side of the first component and / or the second component used to form the gap is machined to form a first surface, the first surface being constructed as a vertical surface opposite to the first surface, the distance between the first surface and the vertical surface gradually decreasing in the top-to-bottom direction.

9. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of placing a lower pad below the gap between the first component and the second component, the method includes: A second surface is machined onto the lower segment of the side of the first component and / or the second component used to form the gap. This second surface is configured as a vertical surface opposite to the first component, wherein the distance between the second surface and the vertical surface gradually decreases or increases in a top-to-bottom direction; or... A groove is machined into the lower pad at the position corresponding to the first component and the second component, wherein the sides of the first component and the second component used to form the gap are located above the groove.

10. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of rotating the deposit and thermoplasticizing it by friction with at least one of the first component, the second component, and the lower pad, the method includes: Preheat the first component, the second component, and the lower pad.

11. The solid-phase composite bonding method according to claim 10, characterized in that, Before the steps of rotating the deposit and frictionally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, and before the steps of preheating the first component, the second component, and the lower pad, the method includes: Protective gas is added to protect the working area where the filler space, the deposit, and the shaft shoulder are located.

12. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of placing a lower pad below the gap between the first component and the second component, the method includes: A layer of material of the same material as the deposit is pre-deposited on the sides of the first and second components used to form the gap.

13. The solid-phase composite bonding method according to claim 6, characterized in that, After the step of moving the shoulder along the trajectory of the filler space, the method includes: Spot welding is performed at the joint between the filler and the first component within the filler space, and at the joint between the filler and the second component.

14. The solid-phase composite bonding method according to claim 6, characterized in that, After the step of moving the shoulder along the trajectory of the filler space, the method includes: Friction stir welding is performed on the filler connection area of ​​the first component and the second component.

15. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of placing a lower pad below the gap between the first component and the second component, the method includes: Ventilation holes are provided on the lower pad.

16. The solid-phase composite bonding method according to claim 6, characterized in that, When the width of the feeding channel is greater than the width of the gap between the first component and the second component, the step of rotating the deposited material and rubbing it against at least one of the first component, the second component, and the lower pad to thermoplasticize it, and causing the thermoplasticized portion of the deposited material to fill the filler space, includes: The deposit is rotated and thermoplasticized by friction against the tops of the first and second components; The thermoplastic portion of the deposit is filled into the gap from top to bottom.

17. The solid-phase composite bonding method according to claim 6, characterized in that, When the width of the feeding channel is less than or equal to the width of the gap between the first component and the second component, the step of rotating the deposited material and rubbing it against at least one of the first component, the second component, and the lower pad to thermoplasticize it, and causing the thermoplasticized portion of the deposited material to fill the filler space, includes: The deposit is inserted into the gap between the first component and the second component, and the deposit is rotated and thermoplasticized by friction with the lower pad. The thermoplastic portion of the deposit is filled into the gap from bottom to top.

18. The solid-phase composite bonding method according to claim 6, characterized in that, After the step of placing a lower pad below the gap between the first component and the second component, the method includes: A pad is provided on top of the first component and the second component.

19. The solid-phase composite bonding method according to any one of claims 6 to 18, characterized in that, The deposited material is one of the following: filamentous, granular, powdery, or rod-shaped.

20. The solid-phase composite bonding method according to any one of claims 6 to 18, characterized in that, The step of rotating the deposit and rubbing it against at least one of the first component, the second component, and the lower pad to thermoplasticize it, and causing the thermoplasticized portion of the deposit to fill the filler space, and moving the shoulder along the trajectory of the filler space includes: The gap is divided into a first space and a second space, which are arranged vertically. The lower pad is configured to protrude partially within the second space; The deposit is rotated and rubbed thermoplasticized with at least one of the first component, the second component and the lower pad, so that the thermoplasticized portion of the deposit fills the first space; The shoulder is moved along the trajectory of the filler space; The first and second components are flipped over, and the protruding portion of the lower pad located in the second space is removed by machining. The deposit is rotated and rubbed thermoplasticized with at least one of the first component, the second component, and the filler deposit layer in the first space, so that the thermoplasticized portion of the deposit fills the second space; The shoulder is moved along the trajectory of the filler space.

21. The solid-phase composite bonding method according to claim 20, characterized in that, Prior to the step of rotating the deposit and rubbing it against at least one of the first component, the second component, and the filler deposit layer in the first space to thermoplasticize it, so that the thermoplasticized portion of the deposit fills the second space, the method includes: Chamfers or rounded corners are processed on both sides of the filler deposit layer in the first space.

22. The solid-phase composite bonding method according to claim 6, characterized in that, Prior to the step of rotating the deposit and frictionally thermoplasticizing it with at least one of the first component, the second component, and the lower pad, the method further includes: rotating the deposit and first performing frictional thermoplasticization in a non-filled area.

23. The solid-phase composite bonding method according to claim 22, characterized in that, After rotating the deposit and first performing frictional thermoplasticization in the non-filled area, the method further includes: the direction of movement of the deposit from the non-filled area to the gap has an angle with the length direction of the gap, the angle being greater than 0° and less than 90°.

24. A product characterized in that, Prepared using the solid-phase composite bonding method as described in any one of claims 6 to 23.

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