Semiconductor device precision welding apparatus and welding method based on laser welding

Abstract

The application relates to the technical field of semiconductor manufacturing, and particularly relates to a semiconductor device precision welding device and a welding method based on laser welding. The semiconductor device precision welding device comprises a welding table and a receiving frame arranged on the welding table. A laser welding head is arranged on the receiving frame, and a position switching piece is arranged on the receiving frame. A limiting disc is arranged on the welding table, and a limiting groove is arranged along the circumference of the limiting disc. The semiconductor device precision welding device further comprises: turnover clamping pieces which are equidistantly distributed on the welding table along the circumference of the limiting disc; and driving connecting pieces which are connected with the plurality of turnover clamping pieces. The plurality of turnover clamping pieces are driven to move along the limiting disc by the driving connecting pieces. When any one group of turnover clamping pieces is rotated and clamped into the limiting groove, the turnover clamping pieces can be turned by 180 DEG, so that the two turnover clamping pieces enter the double-side welding station area, the laser welding head can continuously weld the front and back sides of the semiconductor device, and the continuous welding of different sides of the plurality of semiconductor devices is realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, specifically to a precision welding apparatus for semiconductor devices and a welding method based on laser welding. Background Technology

[0002] Semiconductor devices are electronic devices that utilize the special electrical properties of semiconductor materials to perform specific functions. Their conductivity is between that of good conductors and insulators, and they are widely used to generate, control, receive, and transform signals.

[0003] High-power semiconductor devices generate a lot of heat when operating. Dual-sided pins, combined with a dual-sided heat dissipation structure, allow heat to be conducted outward from both the top and bottom surfaces of the chip simultaneously. Therefore, it is necessary to solder the pins on both sides separately during the manufacturing process.

[0004] To avoid the pins shifting on the semiconductor device during laser welding, existing technologies can pre-apply a small amount of low-temperature solder paste to the connection point between the pins and the semiconductor. Preheating allows the solder paste to initially melt and wet, forming an adhesive bond. This pre-bonding strength is sufficient to withstand normal deflection and flipping before welding, preventing the pins from falling off. Subsequent laser welding only requires the completion of the final curing process.

[0005] When a laser welding head welds the pins of a semiconductor device, it is necessary to weld the pins on both sides separately. After welding one side, it must be rotated 180 degrees to process the other side. When manually rotating, it relies entirely on manual alignment, which cannot ensure that the pins on the other side are aligned with the laser welding head after rotation. This may cause positional deviation between the laser welding head and the welding part of the semiconductor device. Conventional automated rotation equipment is mostly designed for single-station, single-rotation, and can only complete the single-side rotation of a single semiconductor device at a time. It cannot achieve continuous rotation of multiple semiconductor devices, which increases the waiting time of the laser welding head and reduces welding efficiency. Summary of the Invention

[0006] The purpose of this invention is to provide a precision welding apparatus for semiconductor devices to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: A precision welding apparatus for semiconductor devices includes a welding table and a receiving frame disposed on the welding table. A laser welding head is disposed on the receiving frame, and a position switching component is disposed on the receiving frame to adjust the spatial working position of the laser welding head. The welding table is provided with a limiting plate, and two sets of inwardly recessed limiting grooves are provided along the circumference of the limiting plate. Also includes: Multiple sets of flip clamping components are equidistantly distributed on the welding table along the circumference of the limiting disk to clamp and limit the semiconductor device. When one set of flip clamping components rotates and enters the limiting groove, the flip clamping component can rotate 180°, so that the semiconductor device to be welded mounted on the flip clamping component is flipped. After the two flip clamping components enter the double welding station area respectively, the intelligent sensing system on the welding table sends a signal to the position switching component, so that the laser welding head can adjust its position and continuously complete the welding processing operation on both sides of the semiconductor device. A drive connector is arranged along the axial direction of the limiting disk and connected to a plurality of the flip clamps.

[0008] The position switching component includes a limiting guide rail, which is mounted on the receiving frame. A support frame is slidably arranged on the limiting guide rail, and a drag chain is provided on the receiving frame to push the support frame. The position switching component further includes a vertical lifting component, which is disposed on the support frame and connected to the laser welding head.

[0009] The vertical lifting component includes a lifting plate, which is slidably mounted on the support frame, and the laser welding head is mounted on the lifting plate. A push shaft is rotatably mounted on the support frame, and one end of the push shaft is driven to rotate by a lifting motor mounted on the support frame. The vertical lifting component further includes a slider, which is slidably sleeved on the push shaft and connected to the lifting plate.

[0010] As described above, the precision welding device for semiconductor devices has two sets of baffles on the limiting plate. The baffles are respectively arranged corresponding to the limiting grooves, and the baffles and the limiting grooves together form a positioning groove structure with a cross-section of approximately isosceles triangle.

[0011] The semiconductor device precision welding apparatus as described above: the flipping clamping member includes a movable plate, and two sets of protrusions are provided on the movable plate, the protrusions being in contact with the end face of the limiting disk; The flip-grip further includes a connecting frame, a central shaft connecting the connecting frame to the movable plate, and a clamping structure for limiting the position of the semiconductor device provided on the connecting frame.

[0012] The semiconductor device precision welding apparatus as described above: the clamping structure includes a placement plate, the placement plate is mounted on the connecting frame, a pressure plate is slidably disposed on the connecting frame, a storage space is formed between the pressure plate and the placement plate, and an electric telescopic rod is installed on the connecting frame, the movable rod of the electric telescopic rod is connected to the pressure plate.

[0013] As described above, in the precision welding device for semiconductor devices: a positioning groove is formed by a downward recess in the middle of the limiting groove; when the protrusion moves and is inserted into the groove, the depth of the groove in the vertical direction is greater than the cross-sectional radius of the protrusion.

[0014] The semiconductor device precision welding apparatus as described above: the drive connector includes a turntable, the turntable is rotatably mounted on the welding table, the turntable has a plurality of elastic limiting members that can be connected to the central axis distributed equidistantly along the circumference, and the bottom of the turntable is provided with a rotating shaft; The drive connector further includes a drive motor, which is disposed within the welding station, and the output shaft of the drive motor is connected to the rotating shaft via a coupling.

[0015] The precision welding apparatus for semiconductor devices as described above: the elastic limiting member includes a plug-in cylinder, one end of which is connected to the turntable, and a plug-in rod is slidably inserted into the other end. The end of the plug-in rod away from the plug-in cylinder is rotatably connected to the central shaft. The elastic limiting component further includes a spring, which is disposed inside the insertion cylinder and sleeved on the insertion rod. One end of the spring abuts against the inner end of the insertion cylinder, and the other end abuts against the insertion rod.

[0016] The laser welding-based welding method, employing the aforementioned precision welding apparatus for semiconductor devices, includes the following steps: Step 1: The drive connector drives the flip-grip to rotate in a step-by-step circular motion. When one of the flip-grip pieces that has completed the welding operation rotates to the corresponding station, the side positioning protrusion aligns with the corresponding limiting groove and is engaged in the groove. After the initial positioning of the station is completed, the intelligent sensing system collects the position information of the current flip-grip piece and sends a trigger signal to the drive unit on the clamping structure. After receiving the signal, the drive unit releases the clamping limit on the processed semiconductor device. Then, the automated unloading jaws move to remove the welded semiconductor device from the flip-grip and transfer it to the designated unloading station. After the unloading is completed, the automated loading jaws accurately feed the unprocessed semiconductor device to be welded into the clamping area of ​​the flip-grip piece. The drive unit moves again to control the jaws to clamp and complete the limiting of the new semiconductor device. Step 2: After loading and unloading the new semiconductor device, the flip clamping component rotates in a stepping circular motion with the entire station mechanism. When the flip clamping component rotates and locks into one of the limit slots, the drive connecting component pushes the corresponding flip clamping component to trigger the flipping action. The flip clamping component performs a fixed-angle flipping according to the station requirements. When the two flip clamping components enter the double-sided welding station area respectively, they face the laser welding head from opposite sides, meeting the posture requirements for continuous welding on both sides. Step 3: The position switching unit moves the laser welding head above the current workstation. The laser welding head first completes the precision laser welding operation on the first side of the semiconductor device on the flip clamp. After the welding on one side is completed, the position switching unit moves the laser welding head to the corresponding position of the corresponding flip clamp and performs the welding operation on the other side of the semiconductor device that has been flipped 180°. This enables continuous welding processing on different sides of multiple semiconductor devices without the need for repeated manual adjustment of the semiconductor device posture, thus improving the processing efficiency and accuracy of laser welding of semiconductor devices.

[0017] Compared with the prior art, the beneficial effects of the present invention are: 1. Adopting a stepping circular rotation design, the drive connector drives multiple flipping clamping parts to move in a circular motion along the limiting plate. When any set of flipping clamping parts rotates and is inserted into the limiting groove, it can flip 180°, so that the two flipping clamping parts enter the double-sided welding station area respectively. The laser welding head can perform continuous welding processing on both sides of the semiconductor device, realizing continuous welding processing of different sides of multiple semiconductor devices. This reduces the idle time of the equipment waiting for manual adjustment of the semiconductor device posture in traditional welding, thereby effectively improving the processing efficiency and processing accuracy of laser welding of semiconductor devices. 2. Through the intelligent sensing system, the current position information of the flip-grip can be automatically collected, and a trigger signal is sent to the drive unit. The vision sensor triggers the drive unit to release the clamping limit on the processed semiconductor device. Subsequently, the automated unloading gripper removes the welded semiconductor device from the flip-grip and transfers it to the designated unloading station. After unloading, the automated loading gripper accurately feeds the unprocessed semiconductor device to be welded into the clamping area of ​​the flip-grip. While the two welding stations continuously complete the double-sided welding of semiconductor devices, the loading and unloading stations can simultaneously complete the loading and unloading operations, thereby effectively reducing equipment waiting time. 3. The limiting plate is equipped with two sets of inwardly recessed limiting grooves, which, together with the baffle, form a positioning groove structure with a cross-section of approximately an isosceles triangle. When the protrusion on the flip clamping part moves and gets stuck in the limiting groove, the isosceles triangle positioning groove enclosed by the baffle and the limiting groove can guide and compensate the protrusion. Under the pull of the driving connector, the protrusion will automatically slide along the hypotenuse of the isosceles triangle, causing the overall mechanism to deflect 180°, ensuring that the semiconductor devices on the two welding stations face the laser welding head with their front and back sides facing respectively. Attached Figure Description

[0018] Figure 1 A schematic diagram of a precision welding apparatus for semiconductor devices; Figure 2 This is a schematic diagram of the laser welding head and position switching component in a precision welding device for semiconductor devices. Figure 3This is a schematic diagram of the position switching component in a precision welding apparatus for semiconductor devices. Figure 4 This is a schematic diagram of the vertical lifting component in a precision welding device for semiconductor devices. Figure 5 This is a schematic diagram of the limiting disk in a precision welding device for semiconductor devices. Figure 6 This is a schematic diagram of the structure of a vision sensor in a precision welding apparatus for semiconductor devices. Figure 7 This is a schematic diagram of the clamping structure in a precision welding apparatus for semiconductor devices. Figure 8 This is a schematic diagram of the turntable and insertion cylinder in a precision welding device for semiconductor devices. Figure 9 This is a schematic diagram of the flipping clamping component and the elastic limiting component in a precision welding device for semiconductor devices. Figure 10 This is a schematic diagram of the structure of the limiting disk and the turntable in a precision welding device for semiconductor devices.

[0019] In the diagram: 1. Welding table; 2. Receiving frame; 3. Moving guide rail; 4. Laser welding head; 5. Lifting plate; 6. Slider; 7. Lifting motor; 8. Push shaft; 9. Support frame; 10. Limiting guide rail; 11. Cable chain; 12. Vision sensor; 13. Limiting plate; 1301. Limiting groove; 1302. Groove; 14. Baffle; 15. Turntable; 16. Drive motor; 17. Electric telescopic rod; 18. Movable plate; 1801. Protruding column; 19. Central shaft; 20. Connecting frame; 21. Insertion cylinder; 22. Insertion rod; 23. Spring; 24. Placement plate; 25. Pressure plate. Detailed Implementation

[0020] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0021] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0022] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented even without certain specific details. In some instances, methods, means, and elements well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0023] Please see Figures 1-10 In this embodiment of the invention, a precision welding apparatus for semiconductor devices includes a welding table 1 and a receiving frame 2 disposed on the welding table 1. A laser welding head 4 is disposed on the receiving frame 2, and a position switching component is disposed on the receiving frame 2 to adjust the spatial working position of the laser welding head 4. The welding table 1 is provided with a limiting plate 13, and two sets of inwardly recessed limiting grooves 1301 are provided along the circumference of the limiting plate 13. Also includes: Multiple sets of flip clamping components are equidistantly distributed on the welding table 1 along the circumference of the limiting disk 13 to clamp and limit the semiconductor device. When one set of flip clamping components rotates and is inserted into the limiting groove 1301, the flip clamping component can rotate 180°, so that the semiconductor device to be welded mounted on the flip clamping component is flipped. After the two flip clamping components enter the double welding station area respectively, the intelligent sensing system on the welding table 1 sends a signal to the position switching component, so that the laser welding head 4 can adjust its position and continuously complete the welding processing operation on both sides of the semiconductor device. The drive connector is arranged along the axial direction of the limiting disk 13 and connected to the plurality of the flipping clamping members.

[0024] In one embodiment, the intelligent sensing system includes a visual sensor 12.

[0025] It should be noted that the pins are already arranged on both sides of the semiconductor device at the factory, and there is no need to separate them before soldering. Soldering can be performed directly.

[0026] In this embodiment, the driving connector drives the flipping clamp to perform a step-by-step circular rotation. When the flipping clamp rotates and is engaged in one of the limiting slots 1301, the driving connector pushes the corresponding flipping clamp to flip. The flipping clamp performs a certain angle of flipping. When the two flipping clamps enter the double-sided welding station area respectively, and are facing the laser welding head 4 with their front and back sides respectively, the laser welding head 4 first performs precision laser welding on the semiconductor device at one of the welding stations. After the welding on one side is completed, under the drive of the intelligent sensing system, the position switching component drives the laser welding head 4 to move to another welding station to perform welding on the other side of the semiconductor device that has been flipped 180°. This realizes continuous welding processing of different sides of multiple semiconductor devices without the need for manual repeated adjustment of the semiconductor device posture, thereby effectively improving the processing efficiency and processing accuracy of semiconductor device laser welding.

[0027] When the laser welding head 4 performs welding operations on semiconductor devices at two welding stations, the semiconductor device that has completed welding on both sides is located at the loading and unloading station. The vision sensor 12 installed on the welding table 1 collects the current position information of the flip-grip and sends a trigger signal to the drive unit on the flip-grip. After receiving the signal, the drive unit releases the clamping limit on the processed semiconductor device. Then, the automated unloading jaws move to remove the welded semiconductor device from the flip-grip and transfer it to the designated unloading station. After unloading, the automated loading jaws accurately feed the unprocessed semiconductor device to be welded into the clamping area of ​​the flip-grip. The drive unit moves again to control the jaws to clamp and limit the new semiconductor device. This embodiment realizes a dual-station parallel operation mode by driving the flip-grip to perform step-by-step circumferential rotation through the drive connector. When semiconductor devices on two different sides are continuously welded, the flip-grip at the loading and unloading station can be loaded and unloaded simultaneously, effectively reducing equipment waiting time and achieving continuity of the welding process. Compared with traditional laser welding, which requires manual adjustment of the semiconductor device angle, it significantly improves the precision welding efficiency of semiconductor devices.

[0028] As a further embodiment of the present invention, please refer to... Figures 2-4 The position switching component includes a limiting guide rail 10, which is mounted on the receiving frame 2. A support frame 9 is slidably arranged on the limiting guide rail 10, and a drag chain 11 is provided on the receiving frame 2 to push the support frame 9. The position switching component also includes a vertical lifting component, which is disposed on the support frame 9 and connected to the laser welding head 4.

[0029] The vertical lifting component includes a lifting plate 5, which is slidably disposed on the support frame 9, and the laser welding head 4 is mounted on the lifting plate 5. A push shaft 8 is rotatably mounted on the support frame 9, and one end of the push shaft 8 is driven to rotate by a lifting motor 7 mounted on the support frame 9. The vertical lifting component also includes a slider 6, which is slidably sleeved on the push shaft 8 and connected to the lifting plate 5.

[0030] It should be noted that: the welding table 1 is equipped with a movable guide rail 3, the support frame 9 is slidably mounted on the movable guide rail 3, and the movement of the support frame 9 and the whole is driven by a push electric telescopic rod mounted on the welding table 1.

[0031] In this embodiment, the position adjustment method of the laser welding head 4 adopts the existing technology. After the two flip clamping parts enter the welding station area on both sides respectively, the vision sensor 12 sends a signal to the position switching part. According to the program setting, the laser welding head 4 can complete the welding operation on multiple pins on one side of the semiconductor device. The specific movement path control of the position switching part belongs to the existing technology, and the present invention will not provide further explanation.

[0032] As a further embodiment of the present invention, please refer to... Figures 5-7 The limiting plate 13 is provided with two sets of baffles 14, which are respectively provided with the limiting groove 1301, and the baffles 14 and the limiting groove 1301 together form a positioning groove structure with a cross section of approximately isosceles triangle.

[0033] The flipping clamping component includes a movable plate 18, on which two sets of protrusions 1801 are provided, and the protrusions 1801 are in contact with the end face of the limiting plate 13. The flipping clamping component further includes a connecting frame 20, a central shaft 19 connecting the connecting frame 20 and the movable plate 18, and a clamping structure for limiting the position of the semiconductor device provided on the connecting frame 20.

[0034] The clamping structure includes a placement plate 24, which is mounted on the connecting frame 20. A pressure plate 25 is slidably disposed on the connecting frame 20, and a storage space is formed between the pressure plate 25 and the placement plate 24. An electric telescopic rod 17 is installed on the connecting frame 20, and the movable rod of the electric telescopic rod 17 is connected to the pressure plate 25.

[0035] Preferably, the middle position of the limiting groove 1301 is recessed to form a positioning groove 1302. When the protrusion 1801 moves and is inserted into the groove 1302, the groove depth of the groove 1302 in the vertical direction is greater than the cross-sectional radius of the protrusion 1801.

[0036] To further explain, the isosceles triangular positioning groove enclosed by the baffle 14 and the limiting groove 1301 can guide and compensate for the protrusion 1801. After the protrusion 1801 enters the positioning groove, it will automatically slide along the hypotenuse of the isosceles triangle under the pull of the drive connector. In the movement trajectory, the protrusion 1801 will first enter the groove 1302. At this time, the overall mechanism still maintains the tendency of stepping motion, so that the movable plate 18 is subjected to a continuous forward force, while the protrusion 1801 is subjected to a limiting force of oblique downward of the groove wall in the groove 1302. The constraint that the column 1801 is always in contact with the end face of the limiting plate 13 causes the overall mechanism to self-adaptively deflect around the column 1801 as the center of rotation. During the deflection, the column 1801 located behind the rotation direction deflects toward the other inclined side of the baffle 14, gradually passing over the baffle 14, and finally re-fitting with the end face of the limiting plate 13. The column 1801, which was originally stuck in the groove 1302 and restricted, is released freely. The overall action relies on the cooperation between the column 1801 and the limiting groove 1301 to automatically complete the alignment correction without the need for an additional power adjustment mechanism.

[0037] At the loading and unloading station, the newly installed semiconductor device is placed horizontally, which is convenient for the loading and unloading grippers to pick up and put down. Driven by the drive connector, multiple central shafts 19 make circumferential stepping motion around the axis of the limiting disk 13. Under the limiting of the limiting groove 1301 and the pushing of the drive connector, when the semiconductor device moves to the double welding station, the semiconductor device to be welded is placed vertically. At this time, one side of the semiconductor device pin is completely facing the laser welding head 4, eliminating posture obstruction, which makes it easy for the laser welding head 4 to directly perform welding operations on the single side pin without the need for manual repeated adjustment of the semiconductor device posture.

[0038] As a further embodiment of the present invention, please refer to... Figures 8-10 The drive connector includes a turntable 15, which is rotatably mounted on the welding table 1. Multiple elastic limiting members that can be connected to the central shaft 19 are equidistantly distributed along the circumference of the turntable 15. A rotating shaft is provided at the bottom of the turntable 15. The drive connector further includes a drive motor 16, which is disposed in the welding station 1, and the output shaft formed by the drive motor 16 is connected to the rotating shaft through a coupling.

[0039] The elastic limiting member includes a plug-in cylinder 21, one end of which is connected to the turntable 15, and a plug-in rod 22 is slidably inserted into the other end. The end of the plug-in rod 22 away from the plug-in cylinder 21 is rotatably connected to the central shaft 19. The elastic limiting component further includes a spring 23, which is disposed inside the insertion cylinder 21 and sleeved on the insertion rod 22. One end of the spring 23 abuts against the inner end of the insertion cylinder 21, and the other end abuts against the insertion rod 22.

[0040] In the initial state, the spring 23 inside the plug tube 21 is always in a compressed state. The compressed spring 23 will continuously apply a downward elastic force to the plug rod 22. Since the limiting plate 13 is fixed on the welding table 1, the protrusion 1801 can only fit against the end face of the limiting plate 13. The elastic force of the spring 23 is converted into a pressing force on the protrusion 1801 through the plug rod 22, the central shaft 19, and the movable plate 18, so that the protrusion 1801 always keeps in close contact with the end face of the limiting plate 13, ensuring that the protrusion 1801 will not detach from the contact surface during rotation, and avoiding shaking during the semiconductor device welding process.

[0041] The drive motor 16 is a stepper motor. The drive motor 16 starts and rotates a certain angle each time and then stops automatically, so that the semiconductor device that has been welded on both sides can be moved to the loading and unloading station. The unprocessed semiconductor device can be moved to one of the welding stations. During the process of moving from one welding station to another, the semiconductor device on both sides of the welding station is turned by adaptive deflection based on the cooperation of the protrusion 1801 and the limiting groove 1301, so that the semiconductor device on both welding stations faces the laser welding head 4 with its front and back sides respectively. This achieves precise step-by-step switching of the station, ensures that each station corresponds to the correct processing state, and ensures that the semiconductor device to be welded can be accurately stopped in the correct position of the welding station.

[0042] The laser welding-based welding method, employing the aforementioned precision welding apparatus for semiconductor devices, includes the following steps: Step 1: The drive connector drives the flip clamping component to rotate in a step-by-step circular motion. When one of the flip clamping components that has completed the welding operation rotates to the corresponding station, the side positioning protrusion 1801 aligns with the corresponding limiting groove 1301 and is engaged in the groove 1302. After the initial positioning of the station is completed, the intelligent sensing system collects the position information of the current flip clamping component and sends a trigger signal to the drive unit on the clamping structure. After receiving the signal, the drive unit releases the clamping limit on the processed semiconductor device. Then, the automated unloading jaws move to take the welded semiconductor device out of the flip clamping component and transfer it to the designated unloading station. After the unloading is completed, the automated loading jaws accurately feed the unprocessed semiconductor device to be welded into the clamping area of ​​the flip clamping component. The drive unit moves again to control the jaws to clamp and complete the limit on the new semiconductor device. Step 2: After loading and unloading the new semiconductor device, the flip clamping component rotates in a stepping circular motion with the entire station mechanism. When the flip clamping component rotates and locks into one of the limit slots 1301, the drive connecting component pushes the corresponding flip clamping component to trigger the flipping action. The flip clamping component performs a fixed-angle flipping according to the station requirements. When the two flip clamping components enter the double-sided welding station area respectively, they face the laser welding head from opposite sides, meeting the posture requirements for continuous welding on both sides. Step 3: The position switching unit moves the laser welding head 4 above the current workstation. The laser welding head 4 first completes the precision laser welding operation on the first side of the semiconductor device on the flip clamp. After the welding on one side is completed, the position switching unit moves the laser welding head 4 to the corresponding position of the corresponding flip clamp and performs the welding operation on the other side of the semiconductor device that has been flipped 180°. This enables continuous welding processing of different sides of multiple semiconductor devices without the need for repeated manual adjustment of the semiconductor device posture, thus improving the processing efficiency and accuracy of laser welding of semiconductor devices.

[0043] It will be apparent to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the invention can be implemented in other specific forms without departing from its spirit or essential characteristics. Therefore, the embodiments should be considered in all respects as exemplary and non-limiting, and the scope of the invention is defined by the appended claims rather than the foregoing description. Thus, all variations falling within the meaning and scope of equivalents of the claims are intended to be included within the present invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0044] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A precision welding apparatus for semiconductor devices, comprising a welding table (1) and a receiving frame (2) disposed on the welding table (1), wherein a laser welding head (4) is disposed on the receiving frame (2), and a position switching component is disposed on the receiving frame (2) for adjusting the spatial working position of the laser welding head (4); Its features are: The welding table (1) is provided with a limiting plate (13), and two sets of inwardly recessed limiting grooves (1301) are provided along the circumference of the limiting plate (13). Also includes: Multiple sets of flip clamping components are equidistantly distributed on the welding table (1) along the circumference of the limiting disk (13) to clamp and limit the semiconductor device. When one set of the flip clamping components rotates and is inserted into the limiting groove (1301), the flip clamping component can rotate 180°, so that the semiconductor device to be welded installed on the flip clamping component can be flipped. After the two flip clamping components enter the double welding station area respectively, the intelligent sensing system set on the welding table (1) sends a signal to the position switching component, so that the laser welding head (4) can adjust its position and continuously complete the welding processing operation on both sides of the semiconductor device. The drive connector is arranged along the axial direction of the limiting disk (13) and connected to the plurality of the flip clamping members.

2. The precision welding apparatus for semiconductor devices according to claim 1, characterized in that, The position switching component includes a limiting guide rail (10), which is mounted on the receiving frame (2). A support frame (9) is slidably arranged on the limiting guide rail (10), and a drag chain (11) is provided on the receiving frame (2) to push the support frame (9). The position switching component further includes a vertical lifting component, which is disposed on the support frame (9) and connected to the laser welding head (4).

3. The precision welding apparatus for semiconductor devices according to claim 2, characterized in that, The vertical lifting component includes a lifting plate (5), which is slidably disposed on the support frame (9), and the laser welding head (4) is mounted on the lifting plate (5). A push shaft (8) is rotatably mounted on the support frame (9), and one end of the push shaft (8) is driven to rotate by a lifting motor (7) mounted on the support frame (9). The vertical lifting component further includes a slider (6), which is slidably sleeved on the push shaft (8) and connected to the lifting plate (5).

4. The precision welding apparatus for semiconductor devices according to claim 1, characterized in that, The limiting plate (13) is provided with two sets of baffles (14), which are respectively provided with the limiting groove (1301), and the baffles (14) and the limiting groove (1301) together form a positioning groove structure with a cross section of a quasi-isosceles triangle.

5. The precision welding apparatus for semiconductor devices according to claim 1, characterized in that, The flipping clamping component includes a movable plate (18), on which two sets of protrusions (1801) are provided, and the protrusions (1801) are in contact with the end face of the limiting plate (13). The flip clamping component further includes a connecting frame (20), a central shaft (19) connecting the connecting frame (20) and the movable plate (18), and a clamping structure for limiting the semiconductor device is provided on the connecting frame (20).

6. The precision welding apparatus for semiconductor devices according to claim 5, characterized in that, The clamping structure includes a placement plate (24), which is mounted on the connecting frame (20). A pressure plate (25) is slidably disposed on the connecting frame (20). A storage space is formed between the pressure plate (25) and the placement plate (24). An electric telescopic rod (17) is installed on the connecting frame (20), and the movable rod of the electric telescopic rod (17) is connected to the pressure plate (25).

7. The precision welding apparatus for semiconductor devices according to claim 5, characterized in that, The limiting groove (1301) has a downward recessed positioning groove (1302) at the middle position. When the protrusion (1801) moves and is inserted into the groove (1302), the groove depth of the groove (1302) in the vertical direction is greater than the cross-sectional radius of the protrusion (1801).

8. The precision welding apparatus for semiconductor devices according to claim 5, characterized in that, The drive connector includes a turntable (15), which is rotatably mounted on the welding table (1). Multiple elastic limiting members that can be connected to the central shaft (19) are distributed equidistantly along the circumference of the turntable (15). A rotating shaft is provided at the bottom of the turntable (15). The drive connector further includes a drive motor (16), which is disposed in the welding station (1), and the output shaft formed by the drive motor (16) is connected to the rotating shaft through a coupling.

9. The precision welding apparatus for semiconductor devices according to claim 8, characterized in that, The elastic limiting member includes a plug tube (21), one end of which is connected to the turntable (15), and the other end is slidably inserted with a plug rod (22). The end of the plug rod (22) away from the plug tube (21) is rotatably connected to the central shaft (19). The elastic limiting component further includes a spring (23), which is disposed inside the plug tube (21) and sleeved on the plug rod (22). One end of the spring (23) abuts against the inner end of the plug tube (21), and the other end abuts against the plug rod (22).

10. A welding method based on laser welding, characterized in that, The semiconductor device precision welding apparatus as described in any one of claims 1-9 comprises the following steps: Step 1: The drive connector drives the flip clamping component to perform a step-by-step circumferential rotation. When one of the flip clamping components that has completed the welding operation rotates to the corresponding station, the side positioning protrusion (1801) aligns with the corresponding limiting groove (1301) and is inserted into the groove (1302). After the initial positioning is completed, the intelligent sensing system collects the current position information of the flip clamping component and sends a trigger signal to the drive unit on the clamping structure. After receiving the signal, the drive unit releases the clamping limit on the processed semiconductor device. Then the automated unloading jaws move to take the welded semiconductor device out of the flip clamping component and transfer it to the designated unloading station. After the material is picked up, the automated loading jaws accurately send the unprocessed semiconductor device to be welded into the clamping area of ​​the flip clamping component. The drive unit moves again to control the jaws to clamp and complete the clamping and positioning of the new semiconductor device. Step 2: After loading and unloading the new semiconductor device, the flip clamping component rotates in a stepping circular motion with the entire station mechanism. When the flip clamping component rotates and locks into one of the limit slots (1301), the drive connecting component pushes the corresponding flip clamping component to trigger the flipping action. The flip clamping component performs a fixed-angle flipping according to the station requirements. When the two flip clamping components enter the double-sided welding station area respectively, they face the laser welding head from opposite sides, meeting the posture requirements for continuous welding on both sides. Step 3: The position switching component moves the laser welding head (4) above the current workstation. The laser welding head (4) first completes the precision laser welding operation on the first side of the semiconductor device on the flip clamp. After the welding on one side is completed, the position switching component moves the laser welding head (4) to the corresponding position of the corresponding flip clamp and performs the welding operation on the other side of the semiconductor device that has been flipped 180°, so as to realize the continuous welding processing of different sides of multiple semiconductor devices.

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