Laser marking apparatus and method for superconducting quantum chips, superconducting quantum chips

Abstract

The application provides a laser marking device and method for a superconducting quantum chip, and a superconducting quantum chip, and relates to the technical field of superconducting quantum chip processing. The laser marking device comprises: a laser marking component; an intelligent bearing component; a central control component for automatically controlling the laser marking component and the intelligent bearing component, configured to receive a positioning signal emitted by the laser marking component and plan a marking path, drive the intelligent bearing component to complete feeding, transferring and alignment of the superconducting quantum chip; and adjust laser parameters, spot size, focusing position and scanning track of the laser marking component, so that the laser marking component can complete marking on the superconducting quantum chip. The application adopts a laser non-contact marking mode, has no mechanical contact and no chemical residue, can completely avoid damage to the superconducting thin film, microstructure and substrate of the precise superconducting quantum chip, and meets the high-precision processing requirements of the superconducting quantum device.

Description

Technical Field

[0001] This application relates to the field of superconducting quantum chip processing technology, and more specifically, to a laser marking device and method for superconducting quantum chips, and a superconducting quantum chip. Background Technology

[0002] Superconducting quantum chips are core components of quantum computing systems, primarily comprising superconducting qubits and Josephson parametric amplifiers. Their fabrication processes are highly precise, and their device structures are intricate, demanding extremely high levels of processing accuracy and pollution-free operation. Superconducting quantum chips encompass various substrate structures, employing high-resistivity silicon and sapphire as chip substrates, aluminum, niobium, and tantalum superconducting thin films as superconducting circuit materials, and copper and aluminum as the chip's metal encapsulation shell. Each structural layer requires a unique identifier to meet the production needs of traceability, batch management, anti-counterfeiting, and process tracking.

[0003] Currently, on the one hand, traditional marking methods such as mechanical marking and ink printing are prone to causing mechanical damage, chemical contamination, and poor consistency to superconducting quantum chips with precise micro-nano structures, making them unsuitable for the high-precision, damage-free, and pollution-free processing requirements of superconducting quantum chips. On the other hand, existing marking equipment has a low degree of automation and lacks precise visual positioning and alignment adjustment mechanisms, making it difficult to achieve accurate and standardized marking of batch superconducting quantum chips. Furthermore, it cannot adapt to marking operations after multiple process nodes such as chip coating, photolithography, etching, and flip-chip packaging, resulting in large marking position deviations and limited applicability to specific scenarios, which seriously restricts the large-scale and standardized production of superconducting quantum chips. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this application provides a laser marking device and method for superconducting quantum chips, which solves the problems of traditional marking methods such as easy damage to chips, poor positioning accuracy, low degree of automation, and poor adaptability, and realizes contactless, non-destructive, high-precision, and batch automated marking of superconducting quantum chips.

[0005] According to a first aspect of this application, at least one embodiment of this application provides a laser marking device for a superconducting quantum chip, comprising: a laser marking component for outputting a positioning laser to acquire the marking position of the superconducting quantum chip and feedback a positioning signal, and for generating and outputting a marking laser to complete a non-contact marking operation on the superconducting quantum chip; an intelligent carrier component for loading, transferring, and aligning the superconducting quantum chip to be marked; and a central control component for automatically controlling the laser marking component and the intelligent carrier component, wherein the central control component is configured to: receive the positioning signal emitted by the laser marking component and plan a marking path; drive the intelligent carrier component to complete the loading, transfer, and alignment of the superconducting quantum chip; and adjust the laser parameters, spot size, focusing position, and scanning trajectory of the laser marking component so that the laser marking component can automatically complete the marking on the superconducting quantum chip.

[0006] For example, in some embodiments of this application, the laser marking component includes: a laser source for outputting the positioning laser and the marking laser; a focusing lens disposed in the optical path of the marking laser for focusing the marking laser onto the surface of the superconducting quantum chip to be marked; a galvanometer disposed in the optical path of the marking laser for controlling the marking position and offset of the marking laser spot; and a coaxial visual positioning component coaxially disposed with the marking laser optical path for acquiring the feedback signal after the positioning laser is reflected by the superconducting quantum chip to determine the marking position of the superconducting quantum chip and outputting the positioning signal.

[0007] For example, in some embodiments of this application, the intelligent carrier component includes: an array-type material preparation table for batch loading the superconducting quantum chips to be marked; a workpiece transfer table for transferring the superconducting quantum chips to and from the marking station; and a precision alignment table for driving the superconducting quantum chips to adjust their position and, in conjunction with the galvanometer offset, precisely aligning the area to be marked on the superconducting quantum chips with the marking laser.

[0008] For example, in some embodiments of this application, a stabilizing support component is also included, which provides vibration damping support for the intelligent load-bearing component to ensure marking accuracy.

[0009] According to a second aspect of this application, at least one embodiment of this application provides a laser marking method for a superconducting quantum chip, the laser marking method being performed by a laser marking device as described in any one of the first aspects, the laser marking method comprising: transferring the superconducting quantum chip to a marking station; acquiring real-time position information of the superconducting quantum chip and generating a positioning signal based on the real-time position information; adjusting the position of the superconducting quantum chip based on the positioning signal, so that the area to be marked on the superconducting quantum chip is precisely aligned with the marking laser; planning a marking path based on the positioning signal, adjusting the output parameters, spot size, focus position, and scanning trajectory of the marking laser; and using the marking laser to perform non-contact laser marking on the superconducting quantum chip to form an identification, code, and / or anti-counterfeiting mark.

[0010] For example, in some embodiments of this application, the mark can be formed on the surface of the superconducting thin film of the superconducting quantum chip, the surface of the superconducting quantum chip substrate, and / or the surface of the superconducting quantum chip packaging shell.

[0011] For example, in some embodiments of this application, the substrate size of the superconducting quantum chip includes multiple sizes of substrates such as 4 inches, 8 inches, or 12 inches.

[0012] For example, in some embodiments of this application, the laser marking method is performed after any of the process steps in the coating, photolithography, etching, or flip-chip packaging of the superconducting quantum chip.

[0013] For example, in some embodiments of this application, the superconducting thin film of the superconducting quantum chip includes: aluminum, niobium and / or tantalum superconducting thin film; the substrate material of the superconducting quantum chip includes: silicon substrate and / or sapphire substrate; the packaging shell of the superconducting quantum chip includes: copper and / or aluminum.

[0014] According to a third aspect of this application, at least one embodiment of this application provides a superconducting quantum chip, which is prepared by the laser marking method as described in any one of the second aspects.

[0015] Through the above embodiments, the laser marking device and method for superconducting quantum chips provided in this application have at least one of the following beneficial effects: Using a non-contact laser marking method, there is no mechanical contact or chemical residue, which can completely avoid damage to the superconducting thin film, microstructure and substrate of the precision superconducting quantum chip, and is suitable for the high-precision processing requirements of superconducting quantum devices.

[0016] By setting up coaxial visual positioning in conjunction with a precision alignment adjustment mechanism, the chip position can be accurately acquired, fed back in real time, and automatically aligned and corrected. The marking positioning accuracy is high, which can effectively eliminate marking offset and misalignment problems and ensure good marking consistency.

[0017] It has the capability of batch automated processing. Through array-style material preparation, automatic transfer, intelligent path planning and parameter adaptive adjustment, it can realize unmanned batch marking operations, greatly improve production efficiency and adapt to the needs of large-scale production.

[0018] It has excellent process adaptability and can be adapted to marking operations on multiple process nodes, multiple substrates and multiple regions of chips. The marking content is rich and can realize multiple functions such as production traceability, batch differentiation and anti-counterfeiting identification, and has a wide range of applications.

[0019] The vibration-damping support structure effectively isolates external vibration interference, continuously ensuring marking accuracy and positioning stability, and ensuring high equipment reliability.

[0020] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0021] The above and other objects, features, and advantages of this application will become more apparent from the detailed description of exemplary embodiments with reference to the accompanying drawings. The drawings described below are merely some embodiments of this application and are not intended to limit the scope of this application.

[0022] Figure 1 This is a schematic diagram of the structure of a laser marking device for a superconducting quantum chip according to an embodiment of this application; Figure 2 This is a flowchart of a laser marking method for superconducting quantum chips according to an embodiment of this application. Detailed Implementation

[0023] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0024] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0025] The flowcharts shown in the accompanying drawings are merely illustrative and do not necessarily include all content and operations / steps, nor do they necessarily have to be performed in the described order. For example, some operations / steps can be broken down, while others can be combined or partially combined; therefore, the actual execution order may change depending on the specific circumstances.

[0026] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0027] Those skilled in the art will understand that the accompanying drawings are merely schematic diagrams of exemplary embodiments, and the modules or processes in the drawings are not necessarily necessary for implementing this application, and therefore cannot be used to limit the scope of protection of this application.

[0028] Figure 1 This is a schematic diagram of the structure of a laser marking device for a superconducting quantum chip according to an embodiment of this application.

[0029] like Figure 1 As shown, the laser marking device for superconducting quantum chips includes: a laser marking component 101, an intelligent carrier component 102, and a central control component 103.

[0030] The laser marking component 101 outputs a positioning laser to acquire the marking position of the superconducting quantum chip and feed back a positioning signal. It also generates and outputs a marking laser to complete the non-contact marking operation on the superconducting quantum chip. The intelligent carrier component 102 loads, transfers, and aligns the superconducting quantum chip to be marked. The central control component 103, as the control core of the device, automates the control of the laser marking component and the intelligent carrier component. The central control component 103 receives the positioning signal output by the laser marking component 101 in real time, intelligently plans the optimal marking path based on the positioning signal, and drives the intelligent carrier component 102 to complete the loading, transfer, and precise alignment of the superconducting quantum chip. Simultaneously, the central control component 103 can adaptively adjust the laser parameters, spot size, focusing position, and scanning trajectory of the laser marking component 101 to accurately complete the automated marking operation on the surface of the superconducting quantum chip.

[0031] The superconducting quantum chips compatible with this device include core superconducting quantum bits, Josephson parametric amplifiers, and other core superconducting quantum devices, and can meet the labeling requirements of the entire chip structure.

[0032] Specifically, the laser marking component 101 includes: a laser source 1011, a focusing lens 1012, a galvanometer 1013, and a coaxial visual positioning component 1014.

[0033] The laser source 1011 outputs stable positioning and marking lasers. A focusing lens 1012, mounted on the optical path of the marking laser, precisely focuses the laser onto the surface of the superconducting quantum chip to be marked, ensuring marking clarity and accuracy. A galvanometer 1013, also on the optical path of the marking laser, controls the scanning position and offset trajectory of the laser spot in real time, adapting to marking requirements of different sizes and positions. A coaxial vision positioning component 1014 is arranged coaxially with the optical path of the marking laser. After the positioning laser illuminates the surface of the superconducting quantum chip, it collects the light feedback signal reflected by the chip, analyzes it to generate a positioning signal, and transmits this signal to the central control unit 103 to indicate the marking position of the superconducting quantum chip. All components of the laser marking component 101 work together to focus the laser and control its trajectory. Simultaneously, it acquires the chip's position image through coaxial vision and generates a positioning signal, achieving precise visual positioning.

[0034] The intelligent carrier component 102 includes an array-type material preparation table 1021, a workpiece transfer table 1022, and a precision alignment table 1023, which can realize batch material preparation of chips, automatic loading and unloading transfer, and high-precision position fine-tuning alignment.

[0035] The array-type material preparation stage 1021 enables the batch loading of multiple superconducting quantum chips, meeting the needs of mass processing. The workpiece transfer stage 1022 can accurately complete the loading, transfer to the marking station, and unloading of superconducting quantum chips after processing. The precision alignment stage 1023 is a precision motion platform capable of autonomous displacement. It can drive the superconducting quantum chip to make fine adjustments in the X and Y directions according to the instructions of the central control unit 103, and, in conjunction with the offset of the galvanometer 1013, achieve precise alignment between the area to be marked on the superconducting quantum chip and the marking laser.

[0036] According to an example embodiment, the laser marking device also includes a stabilizing support member 104.

[0037] The stabilizing support component 104 is used to support the intelligent support component 102, providing vibration damping support. It can effectively buffer and isolate external vibrations, avoid positioning deviations and marking blurring caused by vibrations, and continuously ensure the accuracy of marking operations.

[0038] This application also provides a laser marking method for superconducting quantum chips.

[0039] like Figure 2 As shown, this laser marking method is performed using the laser marking device described above, and includes the following steps: S201, the superconducting quantum chips to be labeled are placed in batches on the array-type material preparation platform to complete the batch material preparation operation.

[0040] Specifically, the chip array can be prepared in one go, with multiple superconducting quantum chips or Josephson parametric amplifiers arranged in arrays such as 2×2, 3×3...N×N. The number of chips is at least one, so as to realize the orderly placement of multiple devices and meet the needs of continuous batch processing.

[0041] S202, the superconducting quantum chip is transferred to the marking station.

[0042] The single superconducting quantum chip is automatically transferred to the preset marked station by the workpiece transfer table to complete the automatic loading and positioning before processing.

[0043] S203 acquires the real-time position information of the superconducting quantum chip and generates a positioning signal based on the real-time position information.

[0044] The laser marking component activates the laser source to output a positioning laser. This positioning laser is used to determine whether the superconducting quantum chip sample has entered the field of view of the coaxial vision positioning component and to define its boundary range. The coaxial vision positioning component receives the reflected beam of the positioning laser and, in conjunction with a microscope, acquires the position of the chip to be marked. The component internally performs comprehensive analysis of the reflected laser parameters and image data, generates a positioning signal, and transmits it to the central control component in real time.

[0045] S204, adjusts the position of the superconducting quantum chip according to the positioning signal, so that the area to be marked on the superconducting quantum chip is precisely aligned with the marking laser.

[0046] The central control unit generates precise alignment adjustment commands based on the received positioning signals, drives the precision alignment stage to perform micro-position adjustments on the superconducting quantum chip, corrects chip placement deviations, and ensures that the chip's preset marking area is precisely aligned with the marking laser.

[0047] S205 plans the marking path based on the positioning signal and adjusts the output parameters, spot size, focus position and scanning trajectory of the marking laser.

[0048] The central control unit combines the positioning signal with the preset mark size and mark position requirements to intelligently plan the optimal mark scanning path and synchronously and adaptively adjust the output power, spot size, focus position, scanning speed and scanning trajectory of the mark laser to match the marking processing requirements of different chips.

[0049] S206 uses a marking laser to perform non-contact laser marking on a superconducting quantum chip, forming an identification, code, and / or anti-counterfeiting mark.

[0050] By outputting a stable marking laser from a laser source, a non-contact scanning marking is performed on the superconducting quantum chip, forming identification, coding, or anti-counterfeiting marks such as numbers, letters, and QR codes in the corresponding processing area of ​​the chip, thus completing the precise marking operation.

[0051] According to some embodiments, this method can be flexibly adapted to different processing nodes and can perform marking operations after any of the processes of superconducting quantum chip coating, photolithography, etching, and flip-chip packaging is completed.

[0052] Furthermore, the marking location can be selected according to requirements and can be formed on the surface of the superconducting thin film of the superconducting quantum chip, the surface of the superconducting quantum chip substrate, and / or the surface of the superconducting quantum chip packaging shell. The superconducting thin film of the superconducting quantum chip includes aluminum, niobium, and / or tantalum superconducting thin films. The substrate material of the superconducting quantum chip includes silicon and / or sapphire substrates. The packaging shell material of the superconducting quantum chip includes copper and / or aluminum. The substrate size of the superconducting quantum chip is compatible with 4-inch, 8-inch, or 12-inch substrates, or even larger.

[0053] This embodiment provides a superconducting quantum chip, which is fabricated using the laser marking method described above. The chip surface has precise traceability markings, batch codes, and / or anti-counterfeiting marks. The markings are undamaged, residue-free, highly clear, and can be stored for a long time. The overall accuracy and performance of the chip are not affected by the marking process, thus meeting the requirements for standardized mass production and traceability management of superconducting quantum chips.

[0054] Through the above examples and embodiments, the laser marking device and method for superconducting quantum chips provided in this application employ a non-contact, precise laser marking method. This method can complete standardized marking processing on different areas of the chip without contact or damage to the superconducting quantum chip structure, effectively avoiding the mechanical damage and chemical contamination problems caused by traditional mechanical marking and ink printing methods. It utilizes a synergistic approach combining coaxial visual positioning with precise alignment adjustment and optical path scanning control to achieve high-precision, programmable automated alignment and marking operations. This method can precisely adapt to the processing requirements of precision superconducting quantum devices such as superconducting qubits and Josephson parametric amplifiers, without damaging the chip's superconducting thin film, substrate, or microcircuit structure throughout the process. The array-type batch material preparation and automatic transfer station structure enables continuous automated loading, unloading, alignment, and marking operations for superconducting quantum chips, significantly improving batch processing efficiency. The system boasts high processing efficiency and product consistency. Furthermore, the laser beam's components are readily available and maturely mass-produced, with a simplified and universal optical path structure. Compared to marking schemes like electron beams and ion beams, it offers lower equipment manufacturing and production line maintenance costs, thus reducing the overall production cost of mass marking superconducting quantum chips and facilitating large-scale industrialization. The entire device is structurally stable and highly adaptable to various processes, including silicon, sapphire, aluminum, niobium, tantalum superconducting thin films, and copper-aluminum metal packaging shells. It can also adapt to marking processes following multiple process nodes such as coating, photolithography, etching, and flip-chip packaging. This enables traceability coding, batch differentiation, and anti-counterfeiting identification during superconducting quantum chip production, making it widely applicable in the precision machining of various superconducting quantum chips. This significantly improves the standardized preparation level, production control efficiency, and finished product reliability of superconducting quantum chips.

[0055] It should be clearly understood that this application describes how specific examples are formed and used, but this application is not limited to any details of these examples. Rather, based on the teachings of the disclosure of this application, these principles can be applied to many other embodiments.

[0056] Furthermore, it should be noted that the above figures are merely illustrative representations of the processes included in the method according to exemplary embodiments of this application, and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.

[0057] Exemplary embodiments of this application have been specifically shown and described above. It should be understood that this application is not limited to the detailed structures, arrangements, or implementation methods described herein; rather, this application is intended to cover various modifications and equivalent arrangements that fall within the objectives and scope of the appended claims.

Claims

1. A laser marking device for superconducting quantum chips, characterized in that, include: The laser marking component is used to output positioning laser to determine the marking position of the superconducting quantum chip and feed back positioning signal. It is also used to generate and output marking laser to complete the non-contact marking operation on the superconducting quantum chip. Intelligent carrier components are used to load, transfer, and align the superconducting quantum chip to be marked; A central control unit is used to automatically control the laser marking unit and the intelligent carrier unit, wherein the central control unit is configured as follows: The system receives the positioning signal emitted by the laser marking component and plans the marking path, driving the intelligent carrier component to complete the loading, transfer, and alignment of the superconducting quantum chip; it adjusts the laser parameters, spot size, focusing position, and scanning trajectory of the laser marking component so that the laser marking component can automatically complete the marking on the superconducting quantum chip.

2. The laser marking device as described in claim 1, characterized in that, The laser marking component includes: A laser source is used to output the positioning laser and the marking laser; A focusing lens is disposed in the optical path of the marking laser to focus the marking laser onto the surface of the superconducting quantum chip to be marked; A galvanometer is placed in the optical path of the marking laser to control the marking position and offset of the marking laser spot; A coaxial vision positioning component is arranged coaxially with the optical path of the marking laser. It is used to collect the feedback signal after the positioning laser is reflected by the superconducting quantum chip to determine the position to be marked on the superconducting quantum chip and output the positioning signal.

3. The laser marking device as described in claim 2, characterized in that, The intelligent load-bearing component includes: An array-type loading platform is used for batch loading of the superconducting quantum chips to be labeled; A workpiece transfer stage is used to transfer the superconducting quantum chip to and from the marking station; A precision alignment stage is used to drive the superconducting quantum chip to adjust its position and, in conjunction with the galvanometer offset, to precisely align the area to be marked on the superconducting quantum chip with the marking laser.

4. The laser marking device as described in claim 1, characterized in that, Also includes: A stabilizing support component is used to provide vibration damping support for the intelligent load-bearing component, ensuring marking accuracy.

5. A laser marking method for superconducting quantum chips, characterized in that, The laser marking method is performed by the laser marking apparatus as described in any one of claims 1-4, and the laser marking method includes: The superconducting quantum chip is transferred to the marking station; The real-time position information of the superconducting quantum chip is obtained, and a positioning signal is generated based on the real-time position information; The superconducting quantum chip is positioned according to the positioning signal so that the area to be marked on the superconducting quantum chip is precisely aligned with the marking laser. Based on the positioning signal, a marking path is planned, and the output parameters, spot size, focus position, and scanning trajectory of the marking laser are adjusted. The superconducting quantum chip is marked non-contactly using the marking laser to form an identification, code, and / or anti-counterfeiting mark.

6. The laser marking method as described in claim 5, characterized in that, The marking can be formed on the surface of the superconducting thin film of the superconducting quantum chip, the surface of the substrate of the superconducting quantum chip, and / or the surface of the packaging shell of the superconducting quantum chip.

7. The laser marking method as described in claim 6, characterized in that, The substrate size of the superconducting quantum chip includes multiple sizes such as 4 inches, 8 inches, or 12 inches.

8. The laser marking method as described in claim 5, characterized in that, The laser marking method is performed after any of the process steps in the coating, photolithography, etching, or flip-chip packaging of the superconducting quantum chip.

9. The laser marking method as described in claim 6, characterized in that, The superconducting thin film of the superconducting quantum chip includes: aluminum, niobium and / or tantalum superconducting thin film; The substrate material of the superconducting quantum chip includes: a silicon substrate and / or a sapphire substrate; The encapsulation shell of the superconducting quantum chip includes copper and / or aluminum.

10. A superconducting quantum chip, characterized in that, It is prepared by the laser marking method as described in any one of claims 5-9.

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