Contouring lapping device

CN122518191APending Publication Date: 2026-08-07浙江盾源聚芯半导体科技有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
浙江盾源聚芯半导体科技有限公司
Filing Date
2026-06-05
Publication Date
2026-08-07

AI Technical Summary

Technical Problem

[0004]本申请主要解决现有技术所存在的曲面硅电极研磨时无法有效贴合曲面几何轮廓导致出现研磨精度低的技术问题

Benefits of technology

[0016]Compared with the prior art, the contour grinding device of this application is used to grind the workpiece to be processed. The workpiece to be processed is rotatable along a first rotation axis, which extends along a first direction. The workpiece to be processed has a surface to be processed at the top along the first direction. The shortest path from the first rotation axis to the edge of the workpiece to be processed is the first path. The first path is the grinding path of the grinding assembly on the surface to be processed. The grinding assembly has a grinding surface at the bottom along the first direction. The grinding surface is always in contact with the surface to be processed, and grinding is formed under the rotation of the workpiece to be processed. The contour grinding device includes a contouring assembly, which comprises contouring parts and contouring needles. The contouring parts are spaced apart along a second direction. The contouring parts have a contouring surface at their top along a first direction. The contouring surface forms a second path from a straight line in a third direction. Both the first and second paths are along the third direction and are aligned end-to-end in the third direction. The first and second paths have the same shape, and the first path is higher than the second path in the first direction. The height difference between the first and second paths in the first direction is the machining allowance. The contouring needles always abut against the contouring surface and can move along the second path. The contour grinding device also includes a moving assembly, which is connected to both the grinding assembly and the contouring needles. The moving assembly can synchronously drive the grinding assembly to move along the first path and the contouring needles to move along the second path, thereby forming a machining mode in which the grinding assembly references the shape of the contouring surface to process the surface to be processed, thus achieving precise machining of the surface to be processed.

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Abstract

The application relates to the field of mechanical processing and discloses a profiling grinding device, wherein a grinding assembly is provided with a grinding surface at the bottom along a first direction, the grinding surface is always in abutment with a surface to be processed, and grinding is formed under the rotation of a part to be processed; a profiling surface is arranged at the top of the profiling assembly along the first direction, the profiling surface forms a second path in a third direction, the first path and the second path are arranged along the third direction, the first path and the second path are aligned at the head and tail in the third direction, the first path and the second path are identical in shape, a profiling needle is always in abutment with the profiling surface and can move along the second path; a moving assembly is connected with the grinding assembly and the profiling needle, the moving assembly synchronously drives the grinding assembly to move along the first path and the profiling needle to move along the second path, so as to process the surface to be processed by referring to the profiling surface. The profiling grinding device effectively matches the surface to be processed in the profiling grinding mode.
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Description

Technical Field

[0001] This application relates to the field of machining, and in particular to profile grinding apparatus. Background Technology

[0002] Curved silicon electrodes refer to silicon electrode products with three-dimensional curved surface geometry (non-planar) and are used in semiconductor process equipment. Curved silicon electrodes require a grinding process during processing. The grinding process refers to the subsequent grinding or polishing treatment of silicon material after the completion of previous processing (such as cutting, etching, thinning, etc.) to remove processing marks, reduce surface roughness, and achieve a specified surface finish.

[0003] The grinding process is generally carried out manually or using polishing machines. Manual grinding refers to a process where operators hold grinding tools (such as grinding stones, sandpaper, and flexible grinding heads) and rely on visual judgment and touch to manually grind the surface of the workpiece. Polishing machines refer to automated grinding and polishing equipment suitable for planar silicon products, which typically uses the principle of mechanochemical polishing. Neither of these methods can effectively conform to the geometric contours of curved surfaces, resulting in low grinding accuracy. Summary of the Invention

[0004] This application primarily addresses the technical problem of low grinding accuracy caused by the inability of existing technologies to effectively conform to the geometric contours of curved silicon electrodes during grinding. It provides a contour grinding apparatus that effectively conforms to the surface to be processed through contour grinding.

[0005] To address the aforementioned technical problems, this application provides a contour grinding apparatus for grinding a workpiece. The workpiece has a circular cross-section and is rotatable along a first rotation axis extending in a first direction. A surface to be processed is provided on the top of the workpiece along the first direction. The shortest path from the first rotation axis to the edge of the workpiece is the first path. The contour grinding apparatus includes... A rotating assembly having a rotating area, wherein the workpiece to be processed is disposed on the rotating area to drive the workpiece to be processed to rotate along a first rotating axis; A grinding assembly is provided along the first direction, and the bottom of the grinding assembly along the first direction has a grinding surface, which is always in contact with the surface to be processed, and grinding is formed under the rotation of the part to be processed; The contouring assembly includes a contouring component and a contouring pin. The contouring component and the rotating area are spaced apart along a second direction. The contouring component has a contouring surface at its top along the first direction. The contouring surface forms a second path from a third-direction straight line. Both the first path and the second path are arranged along the third direction. The first path and the second path are aligned end-to-end in the third direction, and the first path and the second path have the same shape. In the first direction, the first path is higher than the second path. The height difference between the first path and the second path in the first direction is the machining allowance. The contouring pin always abuts against the contouring surface and can move along the second path. A moving component is connected to the grinding component and the profiling needle respectively. The moving component synchronously drives the grinding component to move along a first path and the profiling needle to move along a second path, so as to process the surface to be processed with reference to the profiling surface.

[0006] A driving component is connected to the moving component and provides a driving force to the grinding component to always move toward the surface to be processed, and a driving force to the profiling needle to always move toward the profiling surface.

[0007] In one possible implementation, the moving component includes, A connecting frame, the connecting frame including a first connecting rod and a second connecting rod, the first connecting rod being arranged along the third direction, the second connecting rod being arranged along the first direction, and the first connecting rod being connected to the rotating assembly through the second connecting rod; A first driving member is disposed on the first connecting rod. The profiling needle is connected to the grinding assembly. The first driving member is connected to the grinding assembly to drive the grinding assembly and the profiling needle to move along the third direction.

[0008] In one possible implementation, the moving component further includes, A guide member, comprising a guide groove and a guide protrusion, both extending along the third direction, wherein the guide protrusion forms a sliding connection within the guide groove along the third direction, the guide groove being disposed on one of the first connecting rod and the grinding assembly, and the guide protrusion being disposed on the other of the first connecting rod and the grinding assembly.

[0009] In one possible implementation, the moving component includes The third connecting rod and the fourth connecting rod are arranged along the first direction and connected to the first driving member. The fourth connecting rod is arranged along the second direction and connected to the third connecting rod. The two ends of the fourth connecting rod along the second direction are respectively connected to the grinding assembly and the profiling needle.

[0010] In one possible implementation, the driving component includes, A guide rod is provided along the first direction, the guide rod is connected to the third connecting rod, and the guide rod is slidably connected to the fourth connecting rod; A first elastic element is sleeved outside the guide rod. The first elastic element abuts against the third connecting rod and the fourth connecting rod respectively to form a driving force that always drives the fourth connecting rod away from the surface to be processed. The second driving member abuts against the fourth connecting rod and drives the fourth connecting rod to move toward the surface to be processed, so as to simultaneously ensure that the grinding surface abuts against the surface to be processed and that the contouring needle abuts against the contouring surface.

[0011] In one possible implementation, the driving component further includes, A first support rod and a second support rod are provided at intervals along the first direction. Both the first support rod and the second support rod are connected to the third connecting rod. A guide rod is provided between the first support rod and the second support rod and is connected to both the first support rod and the second support rod.

[0012] In one embodiment, both the profiling needle and the profiling surface are made of a material with the same hardness.

[0013] In one embodiment, lubricating oil is present between the profiling needle and the profiling surface.

[0014] In one embodiment, the contour grinding apparatus further includes, A cooling assembly is disposed at the top of the rotation area along the first direction, and the cooling assembly is used to output coolant to the workpiece to be processed.

[0015] In one possible implementation, the rotating assembly includes, The base, and the second connecting rod is connected to the base; A rotating platform is provided on the base, and the rotating platform is provided with the rotating area.

[0016] Compared with the prior art, the contour grinding device of this application is used to grind the workpiece to be processed. The workpiece to be processed is rotatable along a first rotation axis, which extends along a first direction. The workpiece to be processed has a surface to be processed at the top along the first direction. The shortest path from the first rotation axis to the edge of the workpiece to be processed is the first path. The first path is the grinding path of the grinding assembly on the surface to be processed. The grinding assembly has a grinding surface at the bottom along the first direction. The grinding surface is always in contact with the surface to be processed, and grinding is formed under the rotation of the workpiece to be processed. The contour grinding device includes a contouring assembly, which comprises contouring parts and contouring needles. The contouring parts are spaced apart along a second direction. The contouring parts have a contouring surface at their top along a first direction. The contouring surface forms a second path from a straight line in a third direction. Both the first and second paths are along the third direction and are aligned end-to-end in the third direction. The first and second paths have the same shape, and the first path is higher than the second path in the first direction. The height difference between the first and second paths in the first direction is the machining allowance. The contouring needles always abut against the contouring surface and can move along the second path. The contour grinding device also includes a moving assembly, which is connected to both the grinding assembly and the contouring needles. The moving assembly can synchronously drive the grinding assembly to move along the first path and the contouring needles to move along the second path, thereby forming a machining mode in which the grinding assembly references the shape of the contouring surface to process the surface to be processed, thus achieving precise machining of the surface to be processed. Attached Figure Description

[0017] Appendix Figure 1 This is a schematic diagram of the structure of the part to be processed in this application; Appendix Figure 2 This is a schematic diagram of one type of profiled part in this application; Appendix Figure 3 This is a schematic diagram of one structure of the contour grinding device of this application; Appendix Figure 4 This is a schematic diagram of the structure between the driving component, the grinding component, and the contouring component of this application; Appendix Figure 5 This is another structural diagram of the driving component, grinding component, and contouring component in this application.

[0018] Explanation of the labels in the diagram: X, first direction; Y, second direction; Z, third direction; 10. Contouring grinding device; 100. Rotating assembly; 110. Base; 120. Rotating platform; 121. Rotating area; 130. Control panel; 200. Grinding assembly; 210. Grinding surface; 300. Phimosis component; 310. Phimosis part; 311. Phimosis surface; 312. Second path; 320. Phimosis pin; 400. Moving component; 410. Connecting frame; 411. First connecting rod; 412. Second connecting rod; 420. First driving component; 421. Drive motor; 422. Transmission screw; 430. Guide component; 431. Guide groove; 432. Guide protrusion; 440. Third connecting rod; 450. Fourth connecting rod; 500, Drive assembly; 510, Guide rod; 520, First elastic element; 530, Second drive element; 540, First support rod; 550, Second support rod; 600. Cooling components; 20. Part to be processed; 21. First axis of rotation; 22. Surface to be processed; 23. First path. Detailed Implementation

[0019] To make the objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] The existing technology has a technical problem that the curved silicon electrode cannot effectively fit the curved surface geometry during grinding, resulting in low grinding accuracy.

[0021] Therefore, this application provides a contour grinding apparatus for grinding a workpiece. The workpiece has a circular cross-section and is rotatable along a first rotation axis extending in a first direction. A surface to be processed is provided on the top of the workpiece along the first direction. The shortest path from the first rotation axis to the edge of the workpiece is the first path. The contour grinding apparatus includes... A rotating assembly having a rotating area, wherein the workpiece to be processed is disposed on the rotating area to drive the workpiece to be processed to rotate along a first rotating axis; A grinding assembly is provided along the first direction, and the bottom of the grinding assembly along the first direction has a grinding surface, which is always in contact with the surface to be processed, and grinding is formed under the rotation of the part to be processed; The contouring assembly includes a contouring component and a contouring pin. The contouring component and the rotating area are spaced apart along a second direction. The contouring component has a contouring surface at its top along the first direction. The contouring surface forms a second path from a third-direction straight line. Both the first path and the second path are arranged along the third direction. The first path and the second path are aligned end-to-end in the third direction, and the first path and the second path have the same shape. In the first direction, the first path is higher than the second path. The height difference between the first path and the second path in the first direction is the machining allowance. The contouring pin always abuts against the contouring surface and can move along the second path. A movable component is connected to both the grinding component and the profiling needle. The movable component synchronously drives the grinding component to move along a first path and the profiling needle to move along a second path, so as to process the surface to be processed with reference to the profiling surface. A driving component is connected to the moving component and provides a driving force to the grinding component to always move toward the surface to be processed, and a driving force to the profiling needle to always move toward the profiling surface.

[0022] Example 1: Curved silicon electrodes refer to silicon electrode products with three-dimensional curved surface geometry (non-planar) and are used in semiconductor process equipment. Curved silicon electrodes require a grinding process during processing. The grinding process refers to the subsequent grinding or polishing treatment of silicon material after the completion of previous processing (such as cutting, etching, thinning, etc.) to remove processing marks, reduce surface roughness, and achieve a specified surface finish.

[0023] The general grinding process is carried out manually or using polishing machines. Manual grinding refers to a process in which operators hold grinding tools (such as grinding stones, sandpaper, flexible grinding heads, etc.) and rely on visual judgment and touch to manually grind the surface of the workpiece. Polishing machines refer to automated grinding and polishing equipment suitable for planar silicon products, which usually uses the principle of mechano-chemical polishing. Chemical-mechanical polishing is suitable for polishing planar surfaces. Neither of these methods can effectively conform to the geometric contours of curved surfaces, resulting in low grinding accuracy.

[0024] Please refer to the attached document. Figure 1 To be continued Figure 5As shown, the first direction X of this application refers to the height direction of the contour grinding device 10, that is, the direction from top to bottom or from bottom to top. In this application, the moving component 400 is positioned higher than the rotating component 100, and the rotating component 100 is positioned lower than the moving component 400. The second direction Y of this application refers to the length direction of the contour grinding device 10, that is, the direction from left to right or from right to left. The third direction Z of this application refers to the direction from front to back or from back to front of the contour grinding device 10, that is, the direction from front to back or from back to front.

[0025] Appendix Figure 1 This is a structural schematic diagram of part 20 to be processed according to this application. Please refer to the attached diagram. Figure 1 As shown, the contour grinding apparatus 10 of this application is used to grind the workpiece 20 to be processed. More specifically, the contour grinding apparatus 10 is used to grind the workpiece surface 22 in the workpiece 20. The workpiece 20 is a disc-shaped part, that is, the cross-section of the workpiece 20 is circular, and the workpiece 20 has a certain thickness in the first direction X. The workpiece 20 can rotate along the first rotation axis 21 under the drive of the contour grinding apparatus 10. The first rotation axis 21 is set along the first direction X and passes through the center of the workpiece 20. The workpiece surface 22 is set at the top of the workpiece 20 along the first direction X. The shortest path from the workpiece surface 22 to the edge of the workpiece 20 from the first rotation axis 21 is the first path 23, which runs along the radius of the workpiece 20. The first path 23 can be a straight line or a curve. In this application, the first path 23 is a curve. In this application, the surface to be processed 22 is ground by the contour grinding device 10 after the previous processing is completed.

[0026] Appendix Figure 2 This is a structural schematic diagram of the contouring part 310 of this application. Please refer to the attached diagram. Figure 2As shown, the contouring component 310 is part of the contouring assembly 300 and is an important structure for the contouring grinding device 10 to achieve contouring grinding. The contouring component 310 is a long strip structure. The top of the contouring component 310 along the first direction X has a contouring surface 311. The contouring component 310 forms a second path 312 from a straight line in the third direction Z. That is, the first direction X and the third direction Z together form a cross section. The intersection line between the cross section and the contouring surface 311 is the second path 312. The first path 23 and the second path 312 have the same length in the third direction Z, and the first path 23 and the second path 312 are aligned end to end in the third direction Z. The first path 23 and the second path 312 have the same shape, thereby realizing the contouring grinding of the surface 22 to be processed. Furthermore, the height difference between the first path 23 and the second path 312 in the first direction X is the processing allowance, and the first path 23 is higher than the second path 312 in the first direction X to accurately realize the processing of the part 20 to be processed.

[0027] Appendix Figure 3 This is a schematic diagram of one structure of the contour grinding device 10 of this application. Please refer to the attached diagram. Figure 3 As shown, the contour grinding apparatus 10 of this application includes a rotating assembly 100, which is used to rotate the workpiece 20 to be processed. Simultaneously, the grinding assembly 200, after contacting the surface 22 to be processed, undergoes radial displacement to achieve grinding of the surface 22. The rotating assembly 100 includes a base 110 and a rotating table 120. The base 110 is used to support the other components of the contour grinding apparatus 10 besides the base 110. Further, a second connecting rod 412 is connected to the base 110, and the rotating table 120 is disposed on the base 110 and can rotate relative to the base 110. A rotating area 121 is provided on the rotating assembly 100, and further, a rotating area 121 is provided on the rotating table 120. The rotating area 121 is used to support the workpiece 20 to be processed, and the rotating assembly 100 is used to drive the workpiece 20 to be processed to rotate along a first rotating axis 21. The rotating assembly 100 includes a control panel 130. The control panel 130 is connected to the rotating assembly 100 and the first driving member 420 to control the on / off state of the rotating assembly 100 and the first driving member 420.

[0028] Please refer to the attached document. Figure 3 As shown, the contour grinding apparatus 10 of this application includes a grinding component 200, which is disposed along a first direction X. The grinding component 200 can move along the first direction X. The bottom of the grinding component 200 along the first direction X has a grinding surface 210. During the grinding process, the grinding surface 210 is always in contact with the surface to be processed 22, and grinding is formed under the rotation of the part to be processed 20.

[0029] Please refer to the attached document. Figure 3As shown, the contour grinding apparatus 10 of this application further includes a contour assembly 300, which includes a contour needle 320 and a contour member 310. The contour member 310 is attached to the... Figure 2 As already described, it will not be repeated here. The contour pins 320 are used to rotate the area 121 at intervals along the second direction Y. The contour pins 320 have a long strip structure. During the grinding process of the contour grinding device 10 on the surface 22 to be processed, the contour pins 320 are always in contact with the contour surface 311 and can move along the second direction Y.

[0030] In one embodiment, the profiling needle 320 and the profiling part 310 are both made of materials with the same hardness. Further, the profiling needle 320 and the profiling part 310 are made of martensitic stainless steel with relatively high hardness.

[0031] In one embodiment, lubricating oil is provided between the contour surface 311 and the contour needle 320 to achieve lubrication when the contour needle 320 moves relative to the direction surface.

[0032] Please refer to the attached document. Figure 3 As shown, the contour grinding apparatus 10 of this application also includes a cooling assembly 600, which is disposed at the top of the rotating area 121 along the first direction X. The cooling assembly 600 is used to output coolant to the workpiece 20 to achieve lubrication and cooling of the grinding assembly 200 during grinding.

[0033] Please refer to the attached document. Figure 3 As shown, the contour grinding apparatus 10 of this application further includes a moving component 400 and a driving component 500. The moving component 400 is connected to the grinding component 200 and the contouring needle 320 respectively. The moving component 400 synchronously drives the grinding component 200 to move along the first path 23 and the contouring needle 320 to move along the second path 312. The driving component 500 is connected to the moving component 400 and provides a driving force to the grinding component 200 always facing the surface to be processed 22, and a driving force to the contouring needle 320 always moving towards the contouring surface 311. At the same time, the workpiece 20 to be processed rotates under the rotation of the rotating component 100. Therefore, the moving path of the grinding component 200 is always referenced to the moving path of the contouring needle 320, that is, the grinding component 200 and the contouring needle 320 synchronously form the same displacement in the first direction X, thereby realizing the processing mode of processing the surface to be processed 22 with reference to the contouring surface 311, so as to achieve effective contact between the grinding component 200 and the surface to be processed 22.

[0034] Please refer to the attached document. Figure 3As shown, the moving component 400 includes a connecting frame 410, which supports the grinding component 200 and the profiling needle 320. The connecting frame 410 includes a first connecting rod 411 and a second connecting rod 412. The first connecting rod 411 is arranged along a third direction Z, and the second connecting rod 412 is arranged along a first direction X. The first connecting rod 411 is connected to the rotating component 100 through the second connecting rod 412, and the second connecting rod 412 is further connected to the base 110. The moving component 400 also includes a first driving member 420, which is disposed on the first connecting rod 411. The profiling needle 320 is connected to the grinding component 200, and the first driving member 420 is connected to the grinding component 200 to drive the grinding component 200 and the profiling needle 320 to move synchronously along a third direction Z.

[0035] In one embodiment, the first driving member 420 further includes a driving motor 421 and a transmission screw 422. The driving motor 421 is connected to the transmission screw 422 to drive the transmission screw 422 to rotate. The transmission screw 422 is connected to the grinding assembly 200 for transmission. Under the rotation of the transmission screw 422, the grinding assembly 200 can move in the third direction Z.

[0036] Please refer to the attached document. Figure 3 As shown, the movable component 400 of this application further includes a guide 430, which is used to guide the grinding component 200 during its movement along the third direction Z. Further, the guide 430 includes a guide groove 431 and a guide protrusion 432, both extending along the third direction Z. The guide protrusion 432 forms a sliding connection along the third direction Z within the guide groove 431. The guide groove 431 is disposed on one of the first connecting rod 411 and the grinding component 200, and the guide protrusion 432 is disposed on the other of the first connecting rod 411 and the grinding component 200.

[0037] Please refer to the attached document. Figure 3 As shown, the movable component 400 of this application also includes a third connecting rod 440 and a fourth connecting rod 450. The third connecting rod 440 is arranged along the first direction X and is connected to the first driving member 420. Furthermore, the third connecting rod 440 is connected to the transmission screw 422 in the first driving member 420. The fourth connecting rod 450 is arranged along the second direction Y and is connected to the third connecting rod 440. Furthermore, the third connecting rod 440 and the fourth connecting rod 450 are movably connected. The two ends of the fourth connecting rod 450 along the second direction Y are respectively connected to the grinding component 200 and the profiling needle 320.

[0038] Appendix Figure 4 This is a schematic diagram of a structure between the drive component 500, the grinding component 200, and the contouring component 300 of this application. Figure 5This is another structural diagram showing the relationship between the drive assembly 500, the grinding assembly 200, and the contouring assembly 300 in this application. Please refer to the attached diagram. Figure 4 and appendix Figure 5 As shown, the drive assembly 500 of this application includes a guide rod 510, which is disposed along a first direction X. The guide rod 510 is connected to a third connecting rod 440 and slidably connected to a fourth connecting rod 450 to achieve a movable connection between the third connecting rod 440 and the fourth connecting rod 450. The drive assembly 500 also includes a first elastic member 520, which is sleeved on the outside of the guide rod 510. The first elastic member 520 abuts against the third connecting rod 440 and the fourth connecting rod 450 respectively to form a driving force that always drives the fourth connecting rod 450 to move towards the surface 22 to be processed. The drive assembly 500 also includes a second drive member 530, which abuts against the fourth connecting rod 450 and drives the fourth connecting rod 450 to move toward the surface to be processed 22, so as to simultaneously ensure that the grinding surface 210 abuts against the surface to be processed 22 and the contouring needle 320 abuts against the contouring surface 311.

[0039] In one embodiment, the first elastic element 520 is made of a compression spring.

[0040] In one embodiment, the second driving member 530 is formed by a driving rod arranged along the first direction X. The driving rod is rotatably connected to the third connecting rod 440. When the driving rod and the third connecting rod 440 rotate, the driving rod can move up and down along the first direction X. The driving rod abuts against the fourth connecting rod 450, thereby driving the fourth connecting rod 450 to move along the first direction X.

[0041] Please refer to the attached document. Figure 4 and appendix Figure 5 As shown, the drive assembly 500 of this application also includes a first support rod 540 and a second support rod 550. The first support rod 540 and the second support rod 550 are spaced apart along a first direction X. Both the first support rod 540 and the second support rod 550 are connected to a third connecting rod 440. A guide rod 510 is disposed between the first support rod 540 and the second support rod 550 and is connected to the first support rod 540 and the second support rod 550.

[0042] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of those different embodiments or examples.

[0043] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "a plurality of" means two or more, unless otherwise explicitly specified.

[0044] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A contour grinding apparatus, wherein the contour grinding apparatus is used to grind a part to be processed, the part to be processed has a circular cross-section, the part to be processed is rotatable along a first rotation axis, the first rotation axis extends along a first direction, a surface to be processed is provided on the top of the part to be processed along the first direction, and the shortest path from the surface to be processed along the first rotation axis to the edge of the part to be processed is a first path, characterized in that, The contour grinding device includes A rotating assembly having a rotating area, wherein the workpiece to be processed is disposed on the rotating area to drive the workpiece to be processed to rotate along a first rotating axis; A grinding assembly is provided along the first direction, and the bottom of the grinding assembly along the first direction has a grinding surface, which is always in contact with the surface to be processed, and grinding is formed under the rotation of the part to be processed; The contouring assembly includes a contouring component and a contouring pin. The contouring component and the rotating area are spaced apart along a second direction. The contouring component has a contouring surface at its top along the first direction. The contouring surface forms a second path from a third-direction straight line. Both the first path and the second path are arranged along the third direction. The first path and the second path are aligned end-to-end in the third direction, and the first path and the second path have the same shape. In the first direction, the first path is higher than the second path. The height difference between the first path and the second path in the first direction is the machining allowance. The contouring pin always abuts against the contouring surface and can move along the second path. A movable component is connected to both the grinding component and the profiling needle. The movable component synchronously drives the grinding component to move along a first path and the profiling needle to move along a second path, so as to process the surface to be processed with reference to the profiling surface. A driving component is connected to the moving component and provides a driving force to the grinding component to always move toward the surface to be processed, and a driving force to the profiling needle to always move toward the profiling surface.

2. The contour grinding apparatus according to claim 1, characterized in that, The mobile component includes, A connecting frame, the connecting frame including a first connecting rod and a second connecting rod, the first connecting rod being arranged along the third direction, the second connecting rod being arranged along the first direction, and the first connecting rod being connected to the rotating assembly through the second connecting rod; A first driving member is disposed on the first connecting rod. The profiling needle is connected to the grinding assembly. The first driving member is connected to the grinding assembly to drive the grinding assembly and the profiling needle to move along the third direction.

3. The contour grinding apparatus according to claim 2, characterized in that, The moving component also includes, A guide member, comprising a guide groove and a guide protrusion, both extending along the third direction, wherein the guide protrusion forms a sliding connection within the guide groove along the third direction, the guide groove being disposed on one of the first connecting rod and the grinding assembly, and the guide protrusion being disposed on the other of the first connecting rod and the grinding assembly.

4. The contour grinding apparatus according to claim 2, characterized in that, The mobile component includes The third connecting rod and the fourth connecting rod are arranged along the first direction and connected to the first driving member. The fourth connecting rod is arranged along the second direction and connected to the third connecting rod. The two ends of the fourth connecting rod along the second direction are respectively connected to the grinding assembly and the profiling needle.

5. The contour grinding apparatus according to claim 4, characterized in that, The driving component includes, A guide rod is provided along the first direction, the guide rod is connected to the third connecting rod, and the guide rod is slidably connected to the fourth connecting rod; A first elastic element is sleeved outside the guide rod. The first elastic element abuts against the third connecting rod and the fourth connecting rod respectively to form a driving force that always drives the fourth connecting rod away from the surface to be processed. The second driving member abuts against the fourth connecting rod and drives the fourth connecting rod to move toward the surface to be processed, so as to simultaneously ensure that the grinding surface abuts against the surface to be processed and that the contouring needle abuts against the contouring surface.

6. The contour grinding apparatus according to claim 5, characterized in that, The driving component also includes A first support rod and a second support rod are provided at intervals along the first direction. Both the first support rod and the second support rod are connected to the third connecting rod. A guide rod is provided between the first support rod and the second support rod and is connected to both the first support rod and the second support rod.

7. The contour grinding apparatus according to claim 1, characterized in that, Both the profiling needle and the profiling surface are made of materials with the same hardness.

8. The contour grinding apparatus according to claim 7, characterized in that, The contouring needle and the contouring surface are lubricated with oil.

9. The contour grinding apparatus according to claim 1, characterized in that, The contour grinding device also includes, A cooling assembly is disposed at the top of the rotation area along the first direction, and the cooling assembly is used to output coolant to the workpiece to be processed.

10. The contour grinding apparatus according to claim 2, characterized in that, The rotating assembly includes, The base, and the second connecting rod is connected to the base; A rotating platform is provided on the base, and the rotating platform is provided with the rotating area.