Grinding mechanism for wafer thinning, wafer thinning device and control method

Abstract

The application discloses a grinding wheel mechanism for wafer thinning, a wafer thinning device and a control method, and relates to the technical field of semiconductor devices. The grinding wheel mechanism comprises a grinding wheel, a flange and a rotating shaft. The upper surface of the grinding wheel is provided with a groove, and the groove is provided with cooling holes. The flange is coaxially connected with the grinding wheel. The inside of the flange is provided with a cooling flow channel. The cooling flow channel extends from the mounting hole to the edge of the flange and downwardly at the edge. The inside of the rotating shaft is provided with a liquid injection part along the axial direction, and a first flow channel and a second flow channel in communication with the liquid injection part. The rotating shaft is rotated to a position where the first flow channel is in communication with the cooling flow channel. The cooling liquid flows into the cooling flow channel from the liquid injection part through the first flow channel, flows into the groove through the cooling flow channel, and then flows out through the cooling holes to cool the grinding wheel. The rotating shaft is rotated so that the second flow channel protrudes from the bottom surface of the flange. The cleaning liquid is discharged through the second flow channel to clean the dust attached to the bottom surface of the flange. The grinding wheel mechanism can clean the dust attached to the bottom surface of the flange.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more specifically, to a grinding wheel mechanism, wafer thinning equipment, and control method for wafer thinning. Background Technology

[0002] The inventors discovered that during the grinding process, silicon powder accumulates on the annular stepped surface where the mounting flange mates with the grinding wheel, especially in the area near the shaft of the mounting flange, where silicon powder continuously deposits.

[0003] When silicon powder accumulates to a certain extent on the bottom surface of the grinding wheel flange, the lowest point of the accumulated silicon powder may fall below the lowest position of the grinding wheel teeth. The silicon powder may impact the wafer, causing wafer breakage and resulting in serious losses. It can also cause spindle vibration, affecting spindle dynamic balance, reducing spindle rotation accuracy, decreasing grinding effect, and even causing the spindle to jam.

[0004] The content in the background section is merely technology known to the public and does not necessarily represent existing technology in this field. Summary of the Invention

[0005] This application aims to provide a grinding wheel mechanism for wafer thinning, in order to solve at least one of the above-mentioned technical problems.

[0006] According to one aspect of this application, a grinding wheel mechanism for wafer thinning is provided. The grinding wheel mechanism includes a grinding wheel, a flange, and a rotating shaft; a groove is provided on the upper surface of the grinding wheel, and a cooling hole is provided in the groove; the flange is coaxially connected to the grinding wheel, and the lower surface of the flange contacts the upper surface of the grinding wheel; the flange is provided with a mounting hole, and a cooling channel is provided inside the flange, extending from the mounting hole to the edge of the flange and downward at the edge; the rotating shaft passes through the mounting hole, and a liquid injection part is provided axially inside the rotating shaft, as well as a first channel and a second channel communicating with the liquid injection part; when the rotating shaft rotates to the position where the first channel communicates with the cooling channel, a first liquid flows from the liquid injection part through the first channel into the cooling channel, flows through the cooling channel into the groove, and then flows out through the cooling hole; the rotating shaft rotates so that the second channel protrudes from the bottom surface of the flange, and the second liquid is discharged from the liquid injection part through the second channel to clean dust adhering to the bottom surface of the flange.

[0007] According to some embodiments of this application, the wall of the mounting hole is provided with a guide positioning groove; a guide rod is provided on the outer peripheral surface of the rotating shaft; wherein the guide rod is capable of moving inside the guide positioning groove and is locked at both ends of the guide positioning groove, so as to switch the grinding wheel mechanism between a first state and a second state.

[0008] According to some embodiments of this application, the guide positioning groove includes a first positioning groove and a second positioning groove located in different horizontal directions, and the first positioning groove and the second positioning groove are interconnected.

[0009] According to some embodiments of this application, the guide positioning groove is configured as a Z-shaped structure; or, the guide positioning groove is configured as a U-shaped structure placed laterally.

[0010] According to some embodiments of this application, the guide rod is disposed along the axial direction of the rotating shaft between the drain hole of the first flow channel and the drain hole of the second flow channel.

[0011] According to some embodiments of this application, the second flow channel includes a first section and a second section; the first section extends from the bottom of the injection part at an angle to the axial direction of the rotating shaft to the bottom of the rotating shaft; the second section extends from the end of the first section upward at an angle to the horizontal direction to the outer peripheral surface of the rotating shaft.

[0012] According to some embodiments of this application, the bottom surface of the flange is provided with a guide surface; the mounting hole is located in the middle of the guide surface.

[0013] According to some embodiments of this application, the guide surface is configured as a smooth, inwardly concave curved surface.

[0014] According to some embodiments of this application, the guide surface is configured as a smooth, inwardly concave slope.

[0015] According to some embodiments of this application, the rotating shaft has a first injection section, a second injection section, a first flow channel, and a second flow channel arranged axially inside; the first injection section and the second injection section are coaxially arranged, and the first injection section is sleeved on the outer peripheral surface of the second injection section; the first injection section communicates with the first flow channel, and the second injection section communicates with the second flow channel; a first impeller is arranged inside the first injection section; a second impeller is arranged inside the second injection section, and the first impeller and the second impeller are arranged in opposite bending directions; when liquid enters the first injection section, the liquid applies a thrust to the first impeller. This causes the rotating shaft to rotate until the guide rod slides along the extension direction of the arc-shaped guide positioning groove to one end of the guide positioning groove, where the first flow channel is connected to the cooling flow channel. Liquid flows from the first injection part into the cooling flow channel through the first flow channel, then into the groove through the cooling flow channel, and finally out through the cooling hole. When liquid enters the second injection part, the liquid exerts a thrust on the second impeller, thereby causing the rotating shaft to rotate until the guide rod slides along the extension direction of the arc-shaped guide positioning groove to the other end of the guide positioning groove, where the second flow channel protrudes from the bottom surface of the flange, and the liquid is discharged through the second flow channel.

[0016] According to another aspect of this application, this application also provides a wafer thinning apparatus. The wafer thinning apparatus includes an adsorption platform and a grinding device; the adsorption platform is used to support the wafer and drive the wafer to rotate; the grinding device is lifted and disposed above the adsorption platform, and the grinding device includes the grinding wheel mechanism for wafer thinning as described above.

[0017] According to another aspect of this application, a control method for a grinding wheel mechanism for wafer thinning is also provided. Applied to any of the above-mentioned grinding wheel mechanisms for wafer thinning, the method includes a grinding wheel cleaning and cooling step. The grinding wheel cleaning and cooling step includes sending a first command to cause the shaft to rotate in response to the first command to a position where a first flow channel communicates with a cooling flow channel; sending a second command to control a first switch to open, allowing a first liquid to flow from the injection section through the first flow channel into the cooling flow channel, then into a groove in the cooling flow channel, and finally out through cooling holes to cool the grinding wheel and rinse the grinding wheel teeth.

[0018] According to some embodiments of this application, the method further includes a flange cleaning step of the grinding wheel mechanism; the flange cleaning step of the grinding wheel mechanism includes sending a third command to cause the rotating shaft to rotate in response to the third command so that the second flow channel protrudes from the bottom surface of the flange; sending a fourth command to control the second switch to open so that the second liquid is discharged from the injection part through the second flow channel to clean the dust adhering to the bottom surface of the flange.

[0019] The technical solution of this application allows the rotating shaft to switch between a first state and a second state, enabling the grinding wheel mechanism to have cooling and cleaning functions. This achieves timely cleaning of dust adhering to the bottom surface of the flange, improving the situation where accumulated dust impacts the wafer and causes damage. It also mitigates the problem of dust causing spindle vibration, affecting spindle dynamic balance, and consequently leading to decreased spindle rotation accuracy, reduced grinding effect, or even spindle jamming. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 A schematic diagram of a grinding wheel mechanism for wafer thinning according to an embodiment of this application is shown;

[0022] Figure 2 A top view of a grinding wheel according to an embodiment of this application is shown;

[0023] Figure 3 A perspective structural schematic diagram of a flange according to an embodiment of this application is shown;

[0024] Figure 4 A front view of a flange according to an embodiment of this application is shown;

[0025] Figure 5 Show Figure 4Cross-sectional view of the middle flange along the DD direction;

[0026] Figure 6 A three-dimensional structural schematic diagram of a rotating shaft according to an embodiment of this application is shown;

[0027] Figure 7 Show Figure 6 One of the cross-sectional views of the transfer shaft along the AA direction;

[0028] Figure 8 A schematic diagram showing a rotating shaft protruding from the bottom surface of a flange according to an embodiment of this application is shown;

[0029] Figure 9 Show Figure 8 Enlarged view of part B in the middle section;

[0030] Figure 10 This invention provides a schematic diagram of the structure of a guide positioning groove according to an embodiment of the present application.

[0031] Figure 11 A second schematic diagram of the structure of a guide positioning groove according to an embodiment of this application is shown;

[0032] Figure 12 Show Figure 6 Second cross-sectional view of the transfer shaft along the AA direction;

[0033] Figure 13 The third schematic diagram shows the structure of a guide positioning groove according to an embodiment of this application;

[0034] Figure 14 This diagram illustrates the structure of a wafer thinning apparatus according to an embodiment of the present application.

[0035] Figure 15 A side view of the grinding apparatus and adsorption platform of a wafer thinning apparatus according to an embodiment of this application is shown;

[0036] Figure 16 This invention illustrates a control method 1000 for a grinding wheel mechanism for wafer thinning according to an embodiment of the present application;

[0037] Figure 17 This invention illustrates a control method 2000 for a grinding wheel mechanism for wafer thinning according to an embodiment of this application.

[0038] Explanation of reference numerals in the attached figures:

[0039] 50. Grinding wheel mechanism; 1. Grinding wheel; 11. Groove; 111. Cooling hole;

[0040] 2. Flange; 21. Mounting hole; 211. Guide positioning groove; 2111. First positioning groove; 2112. Second positioning groove; 22. Cooling flow channel; 23. Guide surface;

[0041] 3. Rotating shaft; 31. First flow channel; 32. Second flow channel; 321. First section; 322. Second section; 33. Injection section; 331. First injection section; 3311. First impeller; 332. Second injection section; 3322. Second impeller; 34. Guide rod; 35. Operating hole;

[0042] 4. Adsorption platform; 41. Chuck spindle; 42. Worktable; 43. Adsorption plate;

[0043] 5. Grinding device; 51. Rotary shaft;

[0044] 6. Rotating disk. Detailed Implementation

[0045] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein; rather, they are provided so that this application will be thorough and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0046] The described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. Numerous specific details are provided in the following description to give a full understanding of embodiments of this disclosure. However, those skilled in the art will recognize that the technical solutions of this disclosure can be practiced without one or more of these specific details, or other methods, components, materials, devices, etc. In these cases, well-known structures, methods, devices, implementations, materials, or operations will not be shown or described in detail.

[0047] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the steps or units listed, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to such process, method, product, or apparatus.

[0048] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order.

[0049] In existing technologies, grinding wheels are one of the core process execution components in wafer thinning equipment. The performance of the grinding wheel determines the thinning accuracy, efficiency, and cost. The grinding wheel mounting flange is the core interface component connecting the grinding wheel and the spindle. The performance of the grinding wheel mounting flange determines the stability of the grinding wheel, the machining accuracy, and the safety of the equipment.

[0050] The inventors discovered that due to the high-speed rotation of the grinding wheel and flange, the surrounding gas is driven to rotate along with the flange. The outer edge of the flange has a high linear velocity, forming a high-pressure zone; the area closer to the flange's axis has a low linear velocity, forming a low-pressure zone. The fluid flows from the high-pressure zone to the low-pressure zone, and the suspended silica powder is carried by the airflow from the outer edge of the flange towards the axis.

[0051] Furthermore, the bottom of the flange is a closed structure, forming a stagnant vortex zone. The rotating airflow forms a swirling vortex in the stagnant vortex zone, causing a sharp drop in flow velocity. As the silicon powder's flow velocity decreases, it loses its suspending ability and settles at the bottom of the flange, accumulating thicker and thicker over time.

[0052] When silicon powder accumulates to a certain extent on the bottom surface of the flange, the lowest point of the accumulated silicon powder will be lower than the lowest position of the grinding wheel teeth. The silicon powder will impact the wafer, causing wafer breakage and resulting in serious losses. It will also cause spindle vibration, affecting the spindle dynamic balance, which in turn reduces the spindle rotation accuracy, reduces the grinding effect, and may even cause the spindle to jam.

[0053] In the prior art, a fluid pipeline is usually installed inside the grinding wheel mounting flange. A grinding fluid with a certain temperature and flow rate is introduced into the fluid pipeline. When dressing the grinding wheel, it is cooled through the fluid channel. However, it does not have the function of flushing the flange and cannot clean the silica powder on the bottom surface of the flange.

[0054] To address this, this application provides a grinding wheel mechanism for wafer thinning, wherein the internal rotating shaft includes two sets of fluid channels. By switching the flow direction of the fluid, the flange bottom surface can be flushed during wafer grinding, and the grinding wheel can be cooled during grinding wheel dressing.

[0055] The technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0056] Please refer to the above. Figure 1 and Figure 2 , Figure 1 A schematic diagram of a grinding wheel mechanism for wafer thinning according to an embodiment of this application is shown. Figure 2 A top view of a grinding wheel according to an embodiment of this application is shown.

[0057] According to an example embodiment, this application provides a grinding wheel mechanism for wafer thinning. For example... Figure 1 As shown, the grinding wheel mechanism includes a grinding wheel 1, a flange 2, and a rotating shaft 3.

[0058] The function of the grinding wheel 1 is to use the abrasive grains on its surface to grind the surface of the object to be ground to a target smoothness or to grind the object to a target thickness by rotating at high speed. For example, in the embodiments of this application, the grinding wheel 1 uses the abrasive grains on its surface to grind the surface of the wafer to a target smoothness or to grind the wafer to a target thickness.

[0059] like Figure 2 As shown, a groove 11 is provided on the upper surface of the grinding wheel 1. The specific shape of the groove 11 is not limited in this embodiment of the application, as long as it is arranged around the circumference of the grinding wheel 1. For example, the specific shape of the groove 11 is a circular structure.

[0060] In addition, the groove 11 is provided with cooling holes 111. The number of cooling holes 111 can be multiple. In this embodiment, multiple cooling holes 111 specifically refers to two or more cooling holes 111. For example, two cooling holes 111, three cooling holes 111, four cooling holes 111, five cooling holes 111, six cooling holes 111, etc. Specifically, the multiple cooling holes 111 are spaced apart and evenly distributed along the extending direction of the groove 11.

[0061] Flange 2 is coaxially connected to grinding wheel 1, and the lower surface of flange 2 is in contact with the upper surface of grinding wheel 1. Specifically, in this embodiment, the coaxial connection of flange 2 and grinding wheel 1 means that the axis of flange 2 and the axis of grinding wheel 1 are on the same straight line, so that flange 2 and grinding wheel 1 rotate around the same axis during rotation.

[0062] Please refer to the above. Figure 4 and Figure 5 , Figure 4 A front view of a flange according to an embodiment of this application is shown. Figure 5 It shows Figure 4 Cross-sectional view of the middle flange along the DD direction.

[0063] like Figure 4 and Figure 5 As shown, flange 2 is provided with mounting holes 21. Cooling channels 22 are provided inside flange 2. The number of cooling channels 22 can be multiple. In this embodiment, multiple cooling channels 22 specifically refers to two or more cooling channels 22. For example: two cooling channels 22, three cooling channels 22, four cooling channels 22, five cooling channels 22, six cooling channels 22, etc.

[0064] Specifically, multiple cooling channels 22 extend from the mounting holes 21 to the edge of the flange 2 and downward at the edge.

[0065] Please refer to the above. Figure 6 and Figure 7 , Figure 6 A three-dimensional structural schematic diagram of a rotating shaft according to an embodiment of this application is shown. Figure 7 It shows Figure 6 Cross-sectional view of the transfer shaft along the AA direction.

[0066] like Figure 1 , Figure 3 and Figure 7 As shown, the rotating shaft 3 passes through the mounting hole 21. The interior of the rotating shaft 3 is provided with an injection section 33 along the axial direction, as well as a first flow channel 31 and a second flow channel 32 communicating with the injection section 33.

[0067] The number of first flow channels 31 can be set to multiple. In this embodiment, multiple first flow channels 31 specifically refers to two or more first flow channels 31. For example: two first flow channels 31, three first flow channels 31, four first flow channels 31, five first flow channels 31, six first flow channels 31, etc. It should be understood that the number of first flow channels 31 is equal to the number of cooling flow channels 22.

[0068] The number of second flow channels 32 can be set to multiple. In this embodiment of the application, multiple second flow channels 32 specifically refers to two or more second flow channels 32. For example: two second flow channels 32, three second flow channels 32, four second flow channels 32, five second flow channels 32, six second flow channels 32, etc.

[0069] like Figure 2 , Figure 5 and Figure 7 As shown, during the operation of the grinding wheel mechanism, the rotating shaft 3 rotates to the position where the first flow channel 31 and the cooling flow channel 22 are connected. The grinding wheel mechanism is in the first state. The first liquid flows from the injection part 33 into the cooling flow channel 22 through the first flow channel 31, flows into the groove 11 through the cooling flow channel 22, and then flows out through the cooling hole 111 to cool the grinding wheel 1.

[0070] It should be noted that the first liquid can be a coolant, which in this embodiment specifically refers to water or a liquid synthesized through a special chemical formula. For example, a fully synthetic water-based coolant composed of high-purity deionized water and various chemical additives.

[0071] Please refer to the above. Figure 8 and Figure 9 , Figure 8 A schematic diagram showing a rotating shaft protruding from the bottom surface of a flange according to an embodiment of this application is shown. Figure 9 It shows Figure 8 Enlarged view of part B in the middle section.

[0072] like Figure 8 and Figure 9As shown, the rotating shaft 3 rotates so that the second flow channel 32 protrudes from the bottom surface of the flange 2, the grinding wheel mechanism is in the second state, and the second liquid is discharged from the injection part 33 through the second flow channel 32 to clean the dust adhering to the bottom surface of the flange 2.

[0073] It should be noted that the second liquid can be a cleaning solution. In the embodiments of this application, the cleaning solution specifically refers to a liquid used for physical rinsing, which can be water or high-purity deionized water. The first liquid and the second liquid can be the same liquid or different liquids.

[0074] In existing technologies, dust adhering to the bottom of flanges is often cleaned using external cleaning fluid pipelines. However, this cleaning method requires the manufacture of additional cleaning equipment, which is inconvenient to use; and it does not completely remove the dust adhering to the bottom of the flange.

[0075] In the above embodiment, the rotating shaft 3 switches between two working states: cooling the grinding wheel 1 and cleaning the dust adhering to the bottom of the flange 2. This enables the grinding wheel mechanism to have both cooling and cleaning functions. It achieves timely cleaning of the dust adhering to the bottom surface of the flange 2, improving the situation where accumulated dust impacts the wafer and causes damage. It also mitigates the problem of dust causing spindle vibration, affecting spindle dynamic balance, and consequently leading to decreased spindle rotation accuracy, reduced grinding effect, or even spindle jamming.

[0076] In addition, the grinding wheel mechanism of this application does not require external cleaning equipment to clean the flange, saving the space occupied by the grinding wheel mechanism during operation.

[0077] In the embodiments of this application, such as Figure 3 As shown, the mounting hole 21 has a guide positioning groove 211 on its wall. The guide positioning groove 211 serves to constrain or guide the moving part to move along a specific trajectory and lock it in place.

[0078] In addition, such as Figure 6 As shown, a guide rod 34 is provided on the outer circumferential surface of the rotating shaft 3. The guide rod 34 can move inside the guide positioning groove 211 and is locked at both ends of the guide positioning groove 211 to allow the grinding wheel mechanism to switch between a first state and a second state.

[0079] In the above embodiment, the guide rod 34 on the outer peripheral surface of the rotating shaft 3 moves in the guide positioning groove 211 on the hole wall of the mounting hole 21 inside the flange 2, and can be locked at both ends of the positioning groove 211, so that the rotation between the rotating shaft 3 and the flange 2 is set to a specific route, and the rotation between the rotating shaft 3 and the flange 2 can be controlled more precisely, so that the grinding wheel mechanism can quickly switch between the first state and the second state.

[0080] Please refer to the above. Figure 10and Figure 11 , Figure 10 One of the structural schematic diagrams of a guide positioning groove according to an embodiment of this application is shown. Figure 11 A second schematic diagram of the structure of a guide positioning groove according to an embodiment of this application is shown.

[0081] In the embodiments of this application, such as Figure 10 and Figure 11 As shown, the guide positioning groove 211 includes a first positioning groove 2111 and a second positioning groove 2112 located in different horizontal directions, and the first positioning groove 2111 and the second positioning groove 2112 are interconnected so that the guide rod 34 can move inside the guide positioning groove 211.

[0082] As an feasible approach, such as Figure 10 As shown, the guide positioning groove 211 is configured as a Z-shaped structure.

[0083] As another feasible approach, such as Figure 11 As shown, the guide positioning groove 211 is configured as a horizontally placed U-shaped structure.

[0084] In the above embodiment, the groove walls at the turning positions of the first positioning groove 2111 and the second positioning groove 2112 in different horizontal directions will guide the guide rod 34 to drive the rotating shaft 3 to move axially and rotate circumferentially, thereby enabling the grinding wheel mechanism to switch between the first state and the second state.

[0085] In the embodiments of this application, such as Figure 6 As shown, the guide rod 34 is arranged along the axial direction of the rotating shaft between the drain hole of the first flow channel 31 and the drain hole of the second flow channel 32, so that the guide rod 34 can drive the rotating shaft 3 as a whole to move axially.

[0086] In the embodiments of this application, such as Figure 7 As shown, the second flow channel 32 includes a first section 321 and a second section 322.

[0087] Specifically, the first segment 321 extends from the bottom of the injection section 33 at an angle to the axis of the rotating shaft 3. The angle can be 0°, meaning the first segment 321 extends vertically from the bottom of the injection section 33 to the bottom of the rotating shaft 3. Alternatively, the angle can be greater than 0° and less than 180°, meaning the first segment 321 extends inclinedly from the bottom of the injection section 33 to the bottom of the rotating shaft 3.

[0088] The second segment 322 extends upward from the end of the first segment 321 at an angle to the horizontal direction to the outer circumferential surface of the rotating shaft 3. The angle can be 0°, meaning the second segment 322 extends horizontally from the end of the first segment 321 to the outer circumferential surface of the rotating shaft 3. Alternatively, the angle can be greater than 0° and less than 180°, meaning the second segment 322 extends obliquely upward from the end of the first segment 321 to the outer circumferential surface of the rotating shaft 3.

[0089] In the prior art, the flow channel is set to be straight or curved, and the drainage direction of the flow channel drainage hole cannot be adjusted.

[0090] In the above embodiment, the second flow channel 32 includes a first section 321 and a second section 322 that is bent relative to the first section 321, which changes the spray direction of the drain hole of the second flow channel 32 in order to facilitate cleaning the dust on the bottom surface of the flange 2.

[0091] In the embodiments of this application, such as Figure 3 As shown, the bottom surface of flange 2 is provided with a guide surface 23 to guide the flow direction of the cleaning fluid sprayed from the drain hole of the second flow channel 32, so as to better clean the guide surface 23 and the dust attached around the guide surface 23.

[0092] The mounting hole 21 is located in the middle of the guide surface 23. The cleaning fluid sprayed from the multiple second flow channels 32 drainage holes is sprayed outward from the outer circumference of the rotating shaft 3, so as to better clean the dust adhering to various directions and parts of the bottom surface of the flange 2.

[0093] As one feasible approach, the guide surface 23 is configured as a smooth, inwardly concave curved surface.

[0094] As another feasible approach, the guide surface 23 is configured as a smooth, inwardly concave slope.

[0095] In existing technologies, the guiding surface is set as a plane, resulting in a weak guiding effect.

[0096] In the above embodiment, the guide surface 23 is configured as a smooth curved surface or inclined surface that is concave inward, so that the cleaning liquid sprayed from the drain hole of the second flow channel 32 can be effectively converged in the concave part and accelerated and guided; at the same time, it can also reduce energy loss and turbulence.

[0097] In the embodiments of this application, such as Figure 7 As shown, the bottom of the rotating shaft 3 is provided with an operating hole 35 so that an external tool can be inserted coaxially into the operating hole 35 to drive the rotating shaft 3 to rotate.

[0098] Please refer to the above. Figure 12 and Figure 13 , Figure 12 It shows Figure 6 The second cross-sectional view of the transfer shaft along the AA direction. Figure 13 The third schematic diagram of the guide positioning groove according to an embodiment of this application is shown.

[0099] In another embodiment of this application, such as Figure 12 As shown, the interior of the rotating shaft 3 is provided with a first liquid injection section 331, a second liquid injection section 332, a first flow channel 31, and a second flow channel 32 along the axial direction.

[0100] Specifically, the first injection section 331 and the second injection section 332 are coaxially arranged. The first injection section 331 is sleeved on the outer peripheral surface of the second injection section 332. The first injection section 331 is connected to the first flow channel 31, and the second injection section 332 is connected to the second flow channel 32.

[0101] The number of first flow channels 31 can be set to multiple. In this embodiment, multiple first flow channels 31 specifically refers to two or more first flow channels 31. It should be understood that the number of first flow channels 31 is equal to the number of cooling flow channels 22.

[0102] The number of second flow channels 32 can be set to multiple. In this embodiment of the application, multiple second flow channels 32 specifically refers to two or more second flow channels 32.

[0103] In the embodiments of this application, such as Figure 12 As shown, a first impeller 3311 is provided inside the first injection section 331. The number of first impellers 3311 can be set to multiple, and in this application, multiple first impellers 3311 specifically refers to two or more first impellers 3311.

[0104] The second injection section 332 is provided with a second impeller 3322. The number of second impellers 3322 can be set to multiple, and in this application, multiple second impellers 3322 specifically refers to two or more second impellers 3322.

[0105] Specifically, the first impeller 3311 and the second impeller 3322 are arranged in opposite directions of bending.

[0106] Accordingly, such as Figure 13 As shown, the guide positioning groove 211 is set as an arc-shaped groove.

[0107] In the above embodiment, when it is necessary to cool the grinding wheel 1 and rinse its teeth, liquid is controlled to enter the first injection section 331. Since the first injection section 331 has a first impeller 3311 inside, the liquid exerts a thrust on the first impeller 3311 during the process of entering the first injection section 331. This pushes the rotating shaft 3 to rotate until the guide rod 34 slides along the extension direction of the arc-shaped guide positioning groove 211 to one end of the guide positioning groove 211. At this time, the rotating shaft 3 stops rotating, and the first flow channel 31 communicates with the cooling flow channel 22. The liquid flows from the first injection section 331 into the cooling flow channel 22 through the first flow channel 31, flows into the groove 11 through the cooling flow channel 22, and then flows out through the cooling hole 111 to cool the grinding wheel 1 and rinse its teeth.

[0108] When it is necessary to clean the dust at the bottom of flange 2, the liquid is controlled to enter the second injection section 332. Since the second injection section 332 contains a second impeller 3322, the liquid exerts a thrust on the second impeller 3322 during its entry. This pushes the rotating shaft 3 to rotate until the guide rod 34 slides along the extension direction of the arc-shaped guide positioning groove 211 to the other end of the guide positioning groove 211. At this point, the rotating shaft 3 stops rotating, and the second flow channel 32 protrudes from the bottom surface of flange 2. The liquid is discharged through the second flow channel 32 to clean the dust adhering to the bottom surface of flange 2.

[0109] Please refer to the above. Figure 14 and Figure 15 , Figure 14 A schematic diagram of a wafer thinning apparatus according to an embodiment of this application is shown. Figure 15 A side view of the grinding apparatus and adsorption platform of a wafer thinning apparatus according to an embodiment of this application is shown.

[0110] According to an example embodiment, this application also provides a wafer thinning apparatus. For example... Figure 14 As shown, the wafer thinning equipment includes an adsorption platform 4 and a grinding device 5.

[0111] The adsorption platform 4 supports the wafer and rotates it. The grinding device 5 is vertically mounted above the adsorption platform 4. Figure 15 As shown, the grinding apparatus 5 includes a grinding wheel mechanism 50 for wafer thinning, as described in any of the above embodiments. Specifically, the lower part of the grinding apparatus 5 is provided with a grinding wheel mechanism 50 capable of circumferential rotation to grind the wafer.

[0112] In one embodiment of this application, a column is provided at the end of the wafer thinning equipment, and a grinding device 5 is provided on the side of the column. There are two grinding devices 5. The two grinding devices 5 correspond to a rough grinding section and a fine grinding section, respectively. The rough grinding section and the fine grinding section have similar structures and are both provided with a grinding wheel mechanism 50 for grinding the wafer.

[0113] In the embodiments of this application, such as Figure 14 and Figure 15 As shown, the grinding device 5 includes a feed assembly and a rotary shaft 51.

[0114] The feeding component (not shown in the figure) is vertically connected to the adsorption platform 4 above it.

[0115] The rotating shaft 51 is driven by the feed assembly for lifting and lowering, and the grinding wheel mechanism 50 is connected to the lower end of the rotating shaft 51.

[0116] Specifically, the feeding assembly includes a lifting motor (not shown), which is slidably connected to the housing of the rotating shaft 51 via a lead screw. The housing is slidably connected to the side of the column so that the vertical movement of the rotating shaft 51 can be achieved by driving the lifting motor, thereby changing the position of the grinding wheel mechanism 50 relative to the adsorption platform 4.

[0117] A grinding wheel mechanism 50 is mounted at the lower end of a rotating shaft 51, which rotates the grinding wheel mechanism 50 about its axis of rotation. A feed assembly drives the rotating shaft 51 and the grinding wheel mechanism 50 to move synchronously up and down. When the wafer needs grinding, the grinding wheel mechanism 50 moves down to its bottom surface and contacts the wafer, driven by the feed assembly. At this time, both the grinding wheel mechanism 50 and the wafer are rotating in the same direction but at different speeds, and the grinding wheel mechanism 50 grinds the wafer. The feed assembly has a known construction and includes, for example, multiple linear guides that guide the movement direction of the rotating shaft 51 and a ball screw-slider mechanism that moves the rotating shaft 51 up and down.

[0118] In the above embodiments, the feed assembly and the rotary axis 51 work together to ensure the flatness of the wafer surface during grinding. The feed assembly provides a stable vertical feed path for the rotary axis 51 to drive the grinding wheel mechanism 50; the rotary axis 51 can control the radial runout to a very small range, ensuring that the grinding wheel mechanism 50 maintains uniform contact with the wafer surface throughout the rotation process. The coordinated operation of the feed assembly and the rotary axis 51 results in a thinned wafer with good flatness.

[0119] In the embodiments of this application, such as Figure 15 As shown, the adsorption platform 4 includes a worktable 42 and an adsorption plate 43.

[0120] The bottom of the worktable 42 is provided with a chuck spindle 41, which is used to drive the worktable 42 to rotate.

[0121] The adsorption disk 43 is set on the worktable disk 42 and is used to adsorb the wafer. The adsorption disk 43 can drive the wafer to rotate synchronously under the action of the worktable disk 42.

[0122] During the operation of the wafer thinning equipment, the chuck spindle 41, the worktable 42, and the adsorption plate 43 work together to provide stable adsorption for the grinding wheel mechanism 50 to grind the wafer.

[0123] The chuck spindle 41 controls the rotational speed and direction of the worktable 42. The worktable 42 then stably drives the adsorption disk 43 and the wafer to rotate synchronously. The adsorption disk 43 firmly holds the wafer, ensuring that the wafer maintains a stable position even at high speeds. This synergistic effect prevents poor wafer surface flatness caused by wafer displacement during grinding.

[0124] In one embodiment of this application, such as Figure 14 As shown, the wafer thinning equipment may include multiple adsorption platforms 4. Specifically, in this embodiment, multiple adsorption platforms 4 refer to two or more adsorption platforms 4. The multiple adsorption platforms 4 are used to adsorb different wafers. The multiple adsorption platforms 4 are mounted on the same rotating disk 6 and spaced apart circumferentially on the rotating disk 6. The rotating disk 6 can drive the different adsorption platforms 4 to rotate below the grinding device 5, thereby grinding the corresponding wafers.

[0125] The rotating disk 6 can rotate around its own central axis to change the position of the adsorption platform 4, so that the wafer supported by the adsorption platform 4 can switch between the rough grinding station, the fine grinding station and the loading and unloading station.

[0126] like Figure 14 As shown, the wafer thinning equipment includes three adsorption platforms 4. The three adsorption platforms 4 are arranged circumferentially on a rotating disk 6. Simultaneously, two grinding devices 5 are provided, one for rough grinding of the wafer and the other for fine grinding of the wafer. The rotating disk 6 can drive the adsorption platforms 4 to rotate, so that the wafers on the same adsorption platform 4 can be subjected to rough grinding and fine grinding sequentially, which helps to improve the wafer grinding efficiency.

[0127] refer to Figure 16 , Figure 16 A control method 1000 for a grinding wheel mechanism for wafer thinning according to an embodiment of this application is shown.

[0128] According to the example embodiment, such as Figure 16 As shown, this application also provides a control method 1000 for a grinding wheel mechanism for wafer thinning. The control method 1000 is applied to a grinding wheel mechanism for wafer thinning as described in any of the embodiments above; and the control method 1000 is executed by the grinding wheel mechanism of any of the embodiments above, and the control method 1000 includes the steps of cleaning and cooling the grinding wheel of the grinding wheel mechanism.

[0129] The grinding wheel cleaning and cooling mechanism includes steps S100 and S200.

[0130] In step S100, a first command is sent, causing the shaft to rotate to a position where the first flow channel and the cooling flow channel are connected.

[0131] According to the example embodiment, such as Figure 5 and Figure 6 As shown, the rotating shaft 3 rotates to the position where the first flow channel 31 connects with the cooling flow channel 22.

[0132] As an feasible approach, such as Figure 7 As shown, for the rotating shaft 3 with an operating hole 35 at the bottom, the operator can use an external tool to coaxially insert into the operating hole 35 to drive the rotating shaft 3 to rotate.

[0133] As another feasible approach, such as Figure 12 and Figure 13 As shown, for the rotating shaft 3 without an operating hole 35 at the bottom, control liquid enters the first injection section 331. During the process of the first liquid entering the first injection section 331, the liquid applies a thrust to the first impeller 3311. This pushes the rotating shaft 3 to rotate until the guide rod 34 slides along the extension direction of the arc-shaped guide positioning groove 211 to one end of the guide positioning groove 211. At this time, the rotating shaft 3 stops rotating, and the first flow channel 31 communicates with the cooling flow channel 22.

[0134] In step S200, a second command is sent to control the first switch to open. The first liquid flows from the injection part into the cooling channel through the first flow channel, then into the groove through the cooling channel, and finally flows out through the cooling hole to cool the grinding wheel and wash the grinding wheel teeth.

[0135] As one possible approach, the first switch is turned on, and the first liquid flows from the injection section 33 into the cooling channel 22 through the first flow channel 31, flows into the groove 11 through the cooling channel 22, and then flows out through the cooling hole 111 to cool the grinding wheel 1 and wash the grinding wheel teeth of the grinding wheel 1.

[0136] As another possible implementation, the first switch is opened, and the first liquid flows from the first injection section 331 into the cooling channel 22 via the first flow channel 31, then into the groove 11 via the cooling channel 22, and finally flows out through the cooling hole 111 to cool the grinding wheel 1 and wash the grinding wheel teeth. The first switch can be the switch of a first liquid pipeline valve. The first liquid includes, but is not limited to, cleaning fluid and coolant.

[0137] refer to Figure 17 , Figure 17 A control method 2000 for a grinding wheel mechanism for wafer thinning according to an embodiment of this application is shown.

[0138] According to the example embodiment, such as Figure 17As shown, this application also provides a control method 2000 for a grinding wheel mechanism for wafer thinning. The control method 2000 is applied to a grinding wheel mechanism for wafer thinning as described in any of the embodiments above; and the control method 2000 is executed by the grinding wheel mechanism of any of the embodiments above, including a flange cleaning step of the grinding wheel mechanism.

[0139] The flange cleaning step of the grinding wheel mechanism includes steps S300 and S400.

[0140] In step S300, a third command is sent to cause the shaft to rotate in response to the third command, so that the second flow channel protrudes from the bottom surface of the flange.

[0141] According to the example embodiment, such as Figure 8 and Figure 9 As shown, the rotating shaft 3 rotates so that the second flow channel 32 protrudes from the bottom surface of the flange 2, the grinding wheel mechanism is in the second state, and the second liquid is discharged through the second flow channel 32 to clean the dust adhering to the bottom surface of the flange 2.

[0142] As an feasible approach, such as Figure 7 As shown, for the rotating shaft 3 with an operating hole 35 at the bottom, the operator can use an external tool to coaxially insert into the operating hole 35 to drive the rotating shaft 3 to rotate.

[0143] As another feasible approach, such as Figure 12 and Figure 13 As shown, for the rotating shaft 3 without an operating hole 35 at the bottom, the second liquid is controlled to enter the second injection section 332. During the process of the second liquid entering the second injection section 332, the second liquid applies a thrust to the second impeller 3322. This pushes the rotating shaft 3 to rotate until the guide rod 34 slides along the extension direction of the arc-shaped guide positioning groove 211 to the other end of the guide positioning groove 211. At this time, the rotating shaft 3 stops rotating, and the second flow channel 32 protrudes from the bottom surface of the flange 2.

[0144] In step S400, a fourth command is sent to control the second switch to open, so that the second liquid is discharged from the injection section through the second flow channel to clean the dust adhering to the bottom surface of the flange.

[0145] As one feasible approach, the second switch is turned on, and the second liquid is discharged from the injection section 33 through the second flow channel 32 to clean the dust adhering to the bottom surface of the flange 2.

[0146] As another feasible approach, the second switch is opened, and the second liquid is discharged from the second injection section 332 through the second flow channel 32 to clean the dust adhering to the bottom surface of the flange 2. The second switch can be the switch for a second liquid pipeline valve. The second liquid includes, but is not limited to, cleaning fluid and coolant.

[0147] In the above embodiment, the rotating shaft 3 switches between two working states by rotation: cleaning and cooling the grinding wheel 1, and cleaning the dust adhering to the bottom of the flange 2. This enables the grinding wheel mechanism to have both cooling and cleaning functions. It achieves timely cleaning of the dust adhering to the bottom surface of the flange 2, improving the situation where accumulated dust impacts the wafer and causes damage. It also mitigates the problem of dust causing spindle vibration, affecting spindle dynamic balance, and consequently leading to decreased spindle rotation accuracy, reduced grinding effect, or even spindle jamming.

[0148] In addition, the grinding wheel mechanism of this application does not require external cleaning equipment to clean the flange, saving the space occupied by the grinding wheel mechanism during operation.

[0149] Finally, it should be noted that the above description is merely a preferred embodiment of this application and is not intended to limit this application. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions of the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A grinding wheel mechanism for wafer thinning, characterized in that, include: The grinding wheel has a groove on its upper surface, and the groove has cooling holes; A flange is coaxially connected to the grinding wheel, and the lower surface of the flange contacts the upper surface of the grinding wheel. The flange is provided with a mounting hole, and a cooling channel is provided inside the flange. The cooling channel extends from the mounting hole to the edge of the flange and downward at the edge. The wall of the mounting hole is provided with a guide positioning groove. The guide positioning groove includes a first positioning groove and a second positioning groove in different horizontal directions, and the first positioning groove and the second positioning groove are interconnected. The guide positioning groove is configured with a Z-shaped structure. A rotating shaft passes through the mounting hole. An axially arranged liquid injection section is provided inside the rotating shaft, along with a first flow channel and a second flow channel communicating with the liquid injection section. A guide rod is provided on the outer circumferential surface of the rotating shaft, positioned axially between the drain holes of the first and second flow channels. The guide rod is movable within the guide positioning groove to allow the grinding wheel mechanism to switch between a first and a second state. When the rotating shaft is rotated to a position where the first flow channel and the cooling flow channel are connected, the first liquid flows from the injection part into the cooling flow channel through the first flow channel, flows into the groove through the cooling flow channel, and then flows out through the cooling hole; The shaft rotates so that the second flow channel protrudes from the bottom surface of the flange, and the second liquid is discharged from the injection part through the second flow channel to clean the dust adhering to the bottom surface of the flange.

2. The grinding wheel mechanism for wafer thinning according to claim 1, characterized in that, The second flow channel includes: The first section extends from the bottom of the injection section at an angle to the axis of the rotating shaft to the bottom of the rotating shaft; The second segment extends upward at an angle to the horizontal direction from the end of the first segment to the outer circumferential surface of the rotating shaft.

3. The grinding wheel mechanism for wafer thinning according to claim 1, characterized in that, The bottom surface of the flange is provided with a flow guide surface; The mounting hole is located in the middle of the guide surface.

4. The grinding wheel mechanism for wafer thinning according to claim 3, characterized in that, The guide surface is configured as a smooth, inwardly concave curved surface.

5. The grinding wheel mechanism for wafer thinning according to claim 3, characterized in that, The guide surface is configured as a smooth, inwardly concave slope.

6. A wafer thinning apparatus, characterized in that, include: An adsorption platform is used to support the wafer and drive the wafer to rotate. A grinding device is raised and lowered above the adsorption platform, and the grinding device includes the grinding wheel mechanism for wafer thinning as described in any one of claims 1-5.

7. A control method for a grinding wheel mechanism used in wafer thinning, characterized in that, A grinding wheel mechanism for wafer thinning according to any one of claims 1-5; the method includes: The steps for cleaning and cooling the grinding wheel of the grinding wheel mechanism are as follows: Send a first command to cause the rotating shaft to rotate to a position where the first flow channel and the cooling flow channel are connected; A second command is sent to control the first switch to open. The first liquid flows from the injection part into the cooling channel through the first flow channel, then into the groove through the cooling channel, and finally flows out through the cooling hole to cool the grinding wheel and rinse the grinding wheel teeth.

8. The control method for the grinding wheel mechanism for wafer thinning according to claim 7, characterized in that, The method further includes: Steps for cleaning the flange of the grinding wheel mechanism: A third command is sent to cause the shaft to rotate in response to the third command, so that the second flow channel protrudes from the bottom surface of the flange; A fourth command is sent to control the second switch to open, so that the second liquid is discharged from the injection section through the second flow channel to clean the dust adhering to the bottom surface of the flange.

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