A semiconductor device loading device

Abstract

A semiconductor device feeding device relates to semiconductor device production equipment technology, including vibration plate, rotating mechanism and receiving track. The inner end of the vibration plate is inclined upward and the top surface thereof is provided with a baffle. The top surface of the vibration plate is provided with at least one guide rib, and the inner end of the vibration plate is provided with a plurality of first accommodation grooves parallel to the guide rib. The rotating mechanism is arranged outside the inner end of the vibration plate and includes a pair of coaxial and spaced rotating rings. A plurality of trays are arranged in an array along the circumference between the two rotating rings. The two ends of the tray are provided with rotating shafts connected with the corresponding end rotating ring. The rotating shafts are parallel to the axis of the rotating ring. The side of the tray facing the vibration plate is provided with a plurality of holding claws. The receiving track is horizontally arranged in the two rotating rings. A plurality of second accommodation grooves are horizontally arranged on the side of the receiving track away from the vibration plate. The device can ensure the consistency of the feeding position and feeding posture of the product. On the basis of not improving the labor intensity of the operator, a plurality of devices can be equipped with only one operator. The structure is simple and the cost is low.

Description

Technical Field

[0001] This application relates to the field of semiconductor device manufacturing equipment technology, and in particular to a semiconductor device feeding device. Background Technology

[0002] Among semiconductor device products, there is an electronic device with the model number 220F, such as... Figure 6 As shown, in its semi-finished state, the product consists of 20 units connected together by a bracket. Each unit has one side encased in plastic, referred to as a molding compound. In this semi-finished state, the molding compound has two support holes and one screw hole. The support holes allow the platform encased in the molding compound to communicate with the outside, while the screw hole is used to engage with screws to fix the device onto the circuit board. To prevent the exposed platform portion inside the support holes from generating electricity with the screws and burning out the circuit, the support holes are typically coated with adhesive or filled with thermosetting material in subsequent operations.

[0003] To prevent misalignment of the adhesive or filler, accurate alignment of the support holes with the adhesive or filler equipment is generally required. Therefore, it's essential to ensure consistency in the product's loading position and posture. In actual production, the product's loading position can be determined by setting the width of the loading track surface, and consistency in the loading posture can be corrected using complex mechanical structures. However, this method is costly. While manual loading by operators is also an option, it requires one operator per piece of equipment, consuming significant manpower. Summary of the Invention

[0004] To address the shortcomings of the prior art, this application provides a semiconductor device loading device that not only ensures the consistency of the loading position and loading posture of the products, but also allows multiple devices to be equipped with only one operator without increasing the labor intensity of the operators. It has a simple structure and low cost.

[0005] To achieve the above objectives, the present invention employs the following techniques: A semiconductor device loading device includes: The vibrating plate has an inner end that is inclined upward. A baffle is provided on the top surface of the inner end of the vibrating plate. At least one guide rib is provided on the top surface of the vibrating plate. The length direction of the guide rib is consistent with the direction of the line connecting the inner and outer ends of the vibrating plate. The guide rib is used to match the gap between two adjacent plastic seals. Multiple first clearance grooves parallel to the guide ribs are opened at the inner end of the vibrating plate. The rotating mechanism is located outside the inner end of the vibrating plate and includes a pair of coaxial and spaced rotating rings. The two rotating rings are arranged to rotate synchronously around the axis. Multiple trays are arranged in a circumferential array between the two rotating rings. Each tray has a rotating shaft at both ends that is rotatably connected to the corresponding rotating ring. The rotating shaft is parallel to the axis of the rotating ring. Multiple grippers are provided on the side of the tray facing the vibrating plate. When the rotating rings rotate, the top surface of the grippers is in a horizontal position. The grippers are used to match the first clearance groove when the tray they belong to docks with the inner end of the vibrating plate. The receiving track is horizontally set inside the two rotating rings. Multiple second clearance grooves are horizontally opened on the side of the receiving track away from the vibrating plate. When the pallet is connected to the receiving track, the gripper on the pallet matches the second clearance groove.

[0006] The beneficial effects of this invention are as follows: (1) The operator adjusts the posture of multiple products in advance, and then puts multiple products directly into the vibrating plate in the required posture at one time, so that the vibrating plate sends the products one by one to its inner end, and waits to dock with the pallet in the required posture. This design can configure one operator for multiple machines and reduce the labor intensity of the operator. (2) By setting guide ribs and blocks, the position of the product during the feeding process can be determined, thereby ensuring the subsequent correspondence with the receiving track; (3) Through the rotating mechanism, the product can be loaded one by one into the inner end of the vibrating plate, the tray and the receiving track in the required posture; (4) It has a simple structure, low cost, and is easy to maintain later. Attached Figure Description

[0007] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0008] Figure 1 This is a perspective view of the overall structure of an embodiment of this application.

[0009] Figure 2 This is a front view structural diagram of an embodiment of this application.

[0010] Figure 3 This is a schematic diagram of the material receiving track in an embodiment of this application.

[0011] Figure 4 This is a schematic diagram of the structure when the product of this application embodiment is combined with the guide rib.

[0012] Figure 5 yes Figure 2 Enlarged view of point A in the middle.

[0013] Figure 6 This is a schematic diagram of the product structure in the embodiments of this application.

[0014] Reference numerals in the attached drawings: 1-Vibrating plate, 11-Baffle, 12-Guide rib, 13-First clearance groove, 14-Side plate, 15-Limiting plate, 16-Baffle, 17-Elastic element, 2-Rotating mechanism, 21-Rotating ring, 22-Pattern, 221-Holder, 222-Stop block, 223-Guide strip, 23-Support gear, 24-Gear frame, 25-First motor, 26-Balance gear ring, 27-First gear, 28-Second gear, 29-Second motor, 3-Receiving track, 31-Second clearance groove, 32-Pushing cylinder, 33-Feeding track, 4-Pressure ring wheel, 41-Rotating rod, 5-Vibrator, 6-Fixing frame. Detailed Implementation

[0015] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0016] This application provides a semiconductor device loading device, such as... Figures 1-5 As shown, it includes a vibrating plate 1, a rotating mechanism 2, and a receiving track 3.

[0017] The inner end of the vibrating plate 1 is inclined upward, preferably at an angle of 0°-5°. A vibrator 5 is provided below the vibrating plate 1. Side plates 14 extend upward from the outer end and both sides of the vibrating plate 1. A limiting plate 15 is connected between the inner ends of the side plates 14 on both sides. The distance between the limiting plate 15 and the inner end of the vibrating plate 1 is greater than the width of the product. Figure 6 As shown, the product consists of 20 encapsulated units connected by a lead frame. The distance between the limiting plate 15 and the top surface of the vibrating plate 1 is greater than the product height. A baffle 16 is rotatably connected to the bottom of the limiting plate 15. An elastic element 17 is provided at the rotatable mounting point of the baffle 16. The elastic element 17 is preferably a spring. When the spring is in its natural state, the distance between the baffle 16 and the vibrating plate 1 is less than the product height. A baffle 11 is provided on the top surface of the inner end of the vibrating plate 1. At least one guide rib 12 is provided on the top surface of the vibrating plate 1. Its length direction is consistent with the direction of the line connecting the inner and outer ends of the vibrating plate 1. The guide rib 12 is used to match the gap between two adjacent encapsulated units. Multiple first clearance grooves 13 parallel to the guide rib 12 are opened at the inner end of the vibrating plate 1.

[0018] The rotating mechanism 2 is located outside the inner end of the vibrating plate 1 and includes a pair of coaxial and spaced rotating rings 21. The two rotating rings 21 are arranged to rotate synchronously around the axis. Multiple trays 22 are arranged in a circumferential array between the two rotating rings 21. In this embodiment, four trays 22 are provided. Both ends of the trays 22 are provided with rotating shafts that are rotatably connected to the corresponding end rotating rings 21. The rotating shafts are parallel to the axis of the rotating rings 21. Multiple grippers 221 are provided on the side of the trays 22 facing the vibrating plate 1. The top surface of the grippers 221 is lower than the top surface of the trays 22. A stop block 222 is formed by protruding from the top surface of the end of the grippers 221. The distance between the stop block 222 and the tray 22 matches the width of the product. When the tray 22 is connected to the inner end of the vibrating plate 1, the outer side of the baffle 11 is flush with the side of the tray 22 facing the vibrating plate 1. At least one guide strip 223 is provided on the gripper 221. Its length direction is consistent with the length direction of the gripper 221. When the tray 22 is connected to the inner end of the vibrating plate 1, the guide strip 223 is used to match the gap between two adjacent plastic seals. When the rotating ring 21 rotates, the top surface of the gripper 221 is in a horizontal position. The gripper 221 is used to match the first clearance groove 13 when the tray 22 it is on docks with the inner end of the vibrating plate 1.

[0019] When a product is placed on the pallet 22, the stop block 222 and the top surface of the pallet 22 being higher than the top surface of the gripper 221 are designed to prevent the product from moving back and forth, while the guide bar 223 is designed to prevent the product from moving left and right. In other words, the above structure effectively limits the product's movement, preventing it from shaking or falling off as it moves with the pallet 22, thus improving the stability of the feeding device.

[0020] The receiving track 3 is horizontally mounted within the two rotating rings 21 via a fixed frame 6. In this embodiment, the receiving track 3 is positioned at the same height as the axis of the rotating rings 21. A metal proximity sensor is also provided on the receiving track 3. Multiple second clearance grooves 31 are horizontally opened on the side of the receiving track 3 away from the vibrating plate 1. When the tray 22 docks with the receiving track 3, the gripper 221 on the tray 22 matches the second clearance groove 31. The rear end of the receiving track 3 is connected to the loading track 33. The width of the loading track 33 matches the width of the product. Specifically, the fixed frame 6 is located outside the rotating rings 21 and connected to the rear end of the loading track 33. The front end of the receiving track 3 is provided with a pushing cylinder 32. The movable end of the pushing cylinder 32 is used to push the product onto the loading track 33 in a direction parallel to the axis of the rotating rings 21 when the tray 22 docks with the receiving track 3.

[0021] When applying, as follows Figure 2 Multiple products are placed in the posture shown (the side containing the plastic seal is the outer side). Vibrator 5 starts vibrating, and the products begin to move towards the inner end of vibrating plate 1; during vibration, as... Figure 4 As shown, the product will gradually vibrate until the guide rib 12 and its two adjacent plastic seals are in a state of clearance fit; as Figure 5As shown, when the product passes through the baffle 16, it will squeeze the baffle 16 to rotate inward, so as to form a larger opening for the product to pass through, delaying the product's passage time. The product that has passed through the baffle 16 will quickly reach the inner end of the vibrating plate 1 and wait for feeding. This setting is to provide a buffer for feeding and prevent multiple products from reaching the inner end of the vibrating plate 1 at the same time.

[0022] When the metal proximity sensor at the inner end of the vibrating plate 1 senses the arrival of a product, that is, when the inner side of the product comes into contact with the baffle 11, such as Figure 2 The rotating ring 21 shown starts to rotate clockwise. When the tray 22 passes the inner end of the vibrating plate 1, the gripper 221 of the tray 22 will pass through the first clearance groove 13 and lift the product through the stop block 222. At this time, the stop block 222 will also play the role of hooking and lifting the product.

[0023] Then, the product will pass through the receiving track 3 along with the tray 22. The gripper 221 will pass through the second clearance groove 31 and leave the product on the receiving track 3. When the metal proximity sensor on the receiving track 3 senses the presence of the product, the moving end of the pusher cylinder 32 will push the product to the loading track 33. When the pusher cylinder 32 pushes the product, the product can not only smoothly enter the loading track 33, but also be limited by the loading track 33, thus facilitating the subsequent processing of the product.

[0024] Specifically, the outer circumference of the rotating ring 21 has an external toothed surface, and a pair of support gears 23 mesh with each other on the outer circumference of the rotating ring 21. The two support gears 23 are symmetrically arranged on the lower sides of both sides of the rotating ring 21, and both support gears 23 are rotatably mounted on the gear carrier 24. One of the support gears 23 is driven to rotate by a first motor 25, which is mounted on the gear carrier 24. A pressure ring wheel 4 is rolled in contact with the inner ring surface of the rotating ring 21. The axis of the pressure ring wheel 4 is parallel to the axis of the rotating ring 21, and is located directly below the axis of the rotating ring 21. The pressure ring wheel 4 is rotatably mounted on the fixed frame 6 via a rotating rod 41. The above structure, through the two support gears 23 and the pressure ring wheel 4, presses the corresponding rotating ring 21 together, so that the rotating ring 21 will not move, but can rotate stably.

[0025] Specifically, a balance gear ring 26 is rotatably mounted on the outer side of one of the rotating rings 21. The rotating shaft at one end of the tray 22 passes through the rotating ring 21 and is coaxially mounted with a first gear 27 that meshes with the outer tooth surface of the balance gear ring 26. A second gear 28 meshes with the outer tooth surface of the balance gear ring 26. The second gear 28 is driven to rotate by a second motor 29, which is mounted on the fixed frame 6.

[0026] To achieve the rotational speed difference between the rotating ring 21 and the balancing toothed ring 26 when the rotating ring 21 rotates, it is necessary to determine the actual speed difference based on the actual situation. As long as the tray 22 can always be kept horizontal, it is acceptable. Since this is existing technology, it will not be described in detail here.

[0027] To further ensure that the tray 22 always remains horizontal, a pair of light sensors are provided on the inner side of each of the two rotating rings 21 corresponding to the tray 22. When the tray 22 is horizontal, the light sensors can align with the light. When the tray 22 is tilted, the light sensors cannot align with the light. After a control system connected to the device identifies the side that cannot align with the light, it automatically adjusts the rotation direction and speed of the first gear 27 until the tray 22 returns to a horizontal state.

[0028] In application, the above description is only a preferred embodiment of this application and is not intended to limit this application. Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application.

Claims

1. A semiconductor device feeding device, characterized in that, include: The vibrating plate (1) has an inner end that is inclined upward. A baffle (11) is provided on the top surface of the inner end of the vibrating plate (1). At least one guide rib (12) is provided on the top surface of the vibrating plate (1). The length direction of the guide rib (12) is consistent with the direction of the line connecting the inner and outer ends of the vibrating plate (1). The guide rib (12) is used to match the gap between two adjacent plastic seals. Multiple first clearance grooves (13) parallel to the guide rib (12) are opened at the inner end of the vibrating plate (1). The rotating mechanism (2) is located outside the inner end of the vibrating plate (1) and includes a pair of coaxial and spaced rotating rings (21). The two rotating rings (21) are arranged to rotate synchronously around the axis. Multiple trays (22) are arranged in a circumferential array between the two rotating rings (21). Both ends of the tray (22) are provided with rotating shafts that are rotatably connected to the corresponding end rotating rings (21). The rotating shafts are parallel to the axis of the rotating rings (21). Multiple grippers (221) are provided on the side of the tray (22) facing the vibrating plate (1). When the rotating rings (21) rotate, the top surface of the grippers (221) is in a horizontal position. The grippers (221) are used to match the first clearance groove (13) when the tray (22) it belongs to is connected to the inner end of the vibrating plate (1). The receiving track (3) is horizontally set inside the two rotating rings (21). Multiple second clearance grooves (31) are horizontally opened on the side of the receiving track (3) away from the vibrating plate (1). When the pallet (22) is connected to the receiving track (3), the gripper (221) on the pallet (22) matches the second clearance groove (31).

2. The semiconductor device feeding device according to claim 1, characterized in that, The top surface of the tray (22) is higher than the top surface of the gripper (221). The top surface of the end of the gripper (221) protrudes to form a stop (222). The distance between the stop (222) and the tray (22) matches the width of the product. When the tray (22) is connected to the inner end of the vibrating plate (1), the outer side of the baffle (11) is flush with the side of the tray (22) facing the vibrating plate (1).

3. The semiconductor device feeding device according to claim 1, characterized in that, Side plates (14) extend upward from the outer end and both sides of the vibrating plate (1). A limiting plate (15) is connected between the inner ends of the side plates (14) on both sides. The distance between the limiting plate (15) and the inner end of the vibrating plate (1) is greater than the product width. The distance between the limiting plate (15) and the top surface of the vibrating plate (1) is greater than the product height. A baffle (16) is rotatably connected to the bottom of the limiting plate (15). An elastic element (17) is provided at the rotatable mounting point of the baffle (16). When the elastic element (17) is in its natural state, the distance between the baffle (16) and the vibrating plate (1) is less than the product height.

4. The semiconductor device feeding device according to claim 1, characterized in that, The gripper (221) is provided with at least one guide strip (223), the length direction of which is consistent with the length direction of the gripper (221). When the tray (22) is connected to the inner end of the vibrating plate (1), the guide strip (223) is used to match the gap between two adjacent plastic seals.

5. A semiconductor device feeding device according to claim 1, characterized in that, The outer circumference of the rotating ring (21) has an external tooth surface. A pair of support gears (23) mesh with each other on the outer circumference of the rotating ring (21). The two support gears (23) are symmetrically arranged on the lower sides of the rotating ring (21). The support gears (23) are rotatably mounted on the gear carrier (24). One of the support gears (23) is driven to rotate by a first motor (25). The first motor (25) is mounted on the gear carrier (24).

6. A semiconductor device feeding device according to claim 5, characterized in that, One of the rotating rings (21) is coaxially mounted with a balancing gear ring (26) on its outer side. The rotating shaft at one end of the tray (22) passes through the rotating ring (21) and is coaxially mounted with a first gear (27) that meshes with the outer tooth surface of the balancing gear ring (26). The outer tooth surface of the balancing gear ring (26) is meshed with a second gear (28), which is driven to rotate by a second motor (29).

7. A semiconductor device feeding device according to claim 5, characterized in that, The inner ring surface of the rotating ring (21) is fitted with a pressure ring wheel (4), the axis of which is parallel to the axis of the rotating ring (21), and the gap is located directly below the axis of the rotating ring (21).

8. A semiconductor device feeding device according to claim 1, characterized in that, The receiving track (3) is connected to the loading track (33) at the rear end. The width of the loading track (33) matches the width of the product. The receiving track (3) is equipped with a pusher cylinder (32) at the front end. The movable end of the pusher cylinder (32) is used to push the product onto the loading track (33) in a direction parallel to the axis of the rotating ring (21) when the tray (22) is connected to the receiving track (3).

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