Low dielectric crosslinking resin, its preparation method and application

Abstract

The application discloses a low-dielectric crosslinking resin and a preparation method and application thereof. The low-dielectric crosslinking resin is obtained by carrying out a silicon-hydrogen addition reaction on a carbon-hydrogen resin containing a carbon-carbon unsaturated bond and a multi-functional silicon-hydrogen compound in the presence of a catalyst and an organic solvent under an inert gas environment, and constructing a three-dimensional crosslinking network by forming a C-Si bond. The method has mild reaction conditions, controllable crosslinking density and strong designability of product structure. The carbon-hydrogen resin cured product prepared by the method has low dielectric constant, low dielectric loss, high heat resistance, controllable mechanical properties, low water absorption, high solvent resistance, and is suitable for electronic packaging fields such as high-frequency high-speed copper-clad plates, 5G communication substrates and flexible circuit boards.

Description

Technical Field

[0001] This invention belongs to the field of low dielectric resin synthesis technology, specifically relating to a low dielectric crosslinked resin and its preparation method and application, particularly its application in high-frequency and high-speed copper clad laminates. Technical Background

[0002] The rapid development of 5G and 6G communication technologies, the accelerated penetration of intelligent driving technologies in new energy vehicles, and the explosive growth in demand for artificial intelligence computing power are continuously driving the development of printed circuit boards (PCBs) towards high frequency and high speed. The core component of a PCB is the copper-clad laminate (CCL). A copper-clad laminate is a plate-like material obtained by immersing reinforcing materials in a resin matrix and covering one or both sides of the resin with copper foil, followed by hot pressing. It mainly consists of three parts: an insulating resin layer, a reinforcing material layer, and a copper foil layer. According to signal transmission theory, the speed of signal transmission in a medium is related to the dielectric constant (D). k The transmission loss is proportional to the square root of the dielectric loss (D). f The dielectric constant and dielectric loss are directly proportional. Therefore, developing polymer resin matrices with low dielectric constant and low dielectric loss is key to improving the performance of copper clad laminates and achieving high-speed, high-quality signal transmission.

[0003] Traditional copper-clad laminate resin materials include epoxy resin (EP), cyanate ester resin (CE), polyphenylene oxide (PPO), polyimide (PI), and polytetrafluoroethylene (PTFE), but all have some defects that limit their application. EP, CE, and PI contain a large number of polar groups, resulting in poor high-frequency dielectric properties that fail to meet application requirements; PPO has a high melting temperature, making processing difficult, and poor solvent resistance; PTFE has poor thermal conductivity, a high coefficient of thermal expansion that easily leads to copper foil cracking, and low surface energy, making it difficult to composite with copper foil materials. Hydrocarbon resins, due to their molecular chains being mainly composed of C-C and CH bonds, possess intrinsically very low polarizability and dielectric loss (D at 1 GHz). k Approximately 2.2-2.5, D f (Approximately 0.0001-0.0005), and is widely recognized as an ideal substrate material for next-generation high-frequency copper-clad laminates.

[0004] However, existing curing methods for hydrocarbon resins mainly rely on free radical cross-linking reactions initiated by peroxides, which generally suffer from limited selection of curing agents, single curing methods, uncontrollable curing processes, and brittle cured products. To address these issues, developing a novel method for curing hydrocarbon resins that offers diverse curing methods, a wide selection of cross-linking agents, controllable cross-linking processes, and designable product structures is of great significance in meeting the increasingly demanding performance requirements of high-frequency, high-speed copper-clad laminates for the resin matrix. Summary of the Invention

[0005] This invention aims to address the technical problems of existing hydrocarbon resin curing methods being limited, crosslinking agent selection being restricted, and crosslinking processes being difficult to control. The primary objective is to provide a method for constructing C-Si crosslinks in polymers via hydrosilylation. This method, by selecting multifunctional silane compounds as crosslinking agents, achieves precise control over crosslinking density, crosslinking point chemical structure, and cured product properties, resulting in cured products with low dielectric properties, high heat resistance, and adjustable mechanical properties.

[0006] Another object of the present invention is to provide a low dielectric crosslinking resin, which is prepared by the above method.

[0007] Another object of the present invention is to provide applications of the above-mentioned low-dielectric crosslinked resin.

[0008] To achieve the above objectives, the present invention provides the following technical solution: A method for preparing a low-dielectric crosslinked resin includes the following steps: reacting a hydrocarbon resin containing carbon-carbon unsaturated bonds with a multifunctional silane compound in the presence of a catalyst and an organic solvent under an inert gas environment via a hydrosilylation reaction, thereby forming a three-dimensional crosslinked network through the formation of C-Si bonds to obtain the low-dielectric crosslinked resin; preferably, the method includes the following steps: (1) Disperse the hydrocarbon resin containing carbon-carbon unsaturated bonds evenly in an organic solvent, then add a multifunctional silane compound, and mix evenly after passing in an inert gas. (2) Next, add the catalyst and then pass in an inert gas; after the gas passage is completed, heat the reaction and pour the reactant solution into a column containing neutral alumina to remove impurities and obtain a clear reactant solution, which is a low dielectric crosslinking resin solution.

[0009] The hydrocarbon resins containing carbon-carbon unsaturated bonds include, but are not limited to, styrene-based block copolymers, polybutadiene, polyisoprene, polyolefin elastomers, styrene-butadiene rubber, nitrile rubber, ethylene propylene rubber, butyl rubber, polybutadiene-acrylonitrile copolymer, polybutadiene-styrene copolymer, and at least one of the hydrogenated or modified products of the above polymers.

[0010] The styrene-based block copolymer is preferably at least one of styrene-butadiene-styrene block copolymer (SBS), styrene-isoprene-styrene block copolymer (SIS), styrene-ethylene-butene-styrene block copolymer (SEBS), and styrene-ethylene-propylene-styrene block copolymer (SEPS).

[0011] The polybutadiene is preferably at least one of 1,2-polybutadiene, 1,4-polybutadiene, vinyl-terminated polybutadiene, and hydrogenated polybutadiene.

[0012] The multifunctional silane compounds mentioned include, but are not limited to, 1,4-di(dimethylsilyl)benzene, 1,3-di(dimethylsilyl)benzene, 1,2-di(dimethylsilyl)benzene, 1,1,3,3-tetramethyldisiloxane, tetraethyldisiloxane, 1,3-dimethyl-1,3-diphenyldisiloxane, diphenylsilane, methylphenylsilane, dimethylsilane, diethylsilane, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, 2,4,6,8-tetramethylcyclotetrasiloxane, 2,4,6,8-tetraethylcyclotetrasiloxane, and sesquioxane compounds containing silane-hydrogen bonds.

[0013] The catalyst is a hydrosilylation reaction catalyst, preferably at least one of chloroplatinic acid, an alcoholic solution of chloroplatinic acid, an olefinic complex of chloroplatinic acid, a vinylsiloxane complex of chloroplatinic acid, a caster catalyst (platinum-divinyltetramethyldisiloxane complex), a platinum-cyclovinylsiloxane complex, a platinum-vinylsiloxane complex, a platinum-olefinic complex, a platinum-carbonyl complex, a palladium-based catalyst, a rhodium-based catalyst, a ruthenium-based catalyst, and a nickel-based catalyst; more preferably a caster catalyst or a vinylsiloxane complex of chloroplatinic acid.

[0014] The organic solvent is selected from at least one of aromatic solvents, alkane solvents, ether solvents, ketone solvents, ester solvents, and halogenated hydrocarbon solvents.

[0015] The aromatic solvent is preferably at least one of toluene, xylene, trimethylbenzene, benzene, and ethylbenzene.

[0016] The alkane solvent is preferably at least one selected from hexane, cyclohexane, heptane, octane, and isooctane.

[0017] The ether solvent is preferably at least one of tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether.

[0018] The ketone solvent is preferably at least one of acetone, butanone, methyl isobutyl ketone, and cyclohexanone.

[0019] The preferred ester solvent is at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate.

[0020] The halogenated hydrocarbon solvent is preferably at least one of dichloromethane, chloroform, carbon tetrachloride, and chlorobenzene.

[0021] The inert gas is preferably nitrogen, argon, or helium.

[0022] The molar ratio of carbon-carbon unsaturated groups in the hydrocarbon resin to silane groups in the polyfunctional silane compound is 1:0.1 to 0.8; preferably 1:0.4 to 0.8.

[0023] The mass ratio of the hydrocarbon resin, the organic solvent, and the catalyst is 10-50: 50-90: 0.0001-0.001; preferably 20: 80: 0.0001-0.0002.

[0024] The dispersion conditions described in step (1) are preferably 20-30 h of stirring; more preferably 23-25 ​​h.

[0025] The preferred time for introducing the inert gas in step (1) is 20 to 30 minutes.

[0026] The mixing conditions described in step (1) are preferably 1 to 2 hours of stirring.

[0027] The preferred time for introducing the inert gas in step (2) is 10 to 20 minutes.

[0028] The preferred conditions for the heating reaction in step (2) are 40-80°C for 6-15 hours; more preferably, 50-60°C for 10-15 hours.

[0029] A low-dielectric crosslinked resin is obtained by the above preparation method.

[0030] The low-dielectric crosslinking resin described above is suitable for use in the field of communications, particularly in the preparation of copper-clad laminates and communication substrates.

[0031] A resin composition comprising an additive and the aforementioned low-dielectric crosslinked resin.

[0032] The additives are preferably at least one selected from fillers, flame retardants, antioxidants, coupling agents, crosslinking aids, toughening agents, leveling agents, defoamers, and solvents.

[0033] The filler is preferably at least one of fiber and inorganic filler.

[0034] The antioxidants are preferably antioxidant 1010 or antioxidant 697.

[0035] The amount of antioxidant is preferably calculated as 0.1% to 1% of the mass of the aforementioned low dielectric crosslinking resin.

[0036] The application of the above resin composition in the preparation of a substrate resin layer preferably includes the following steps: contacting the above resin composition with a substrate and heating and curing it to obtain a low dielectric crosslinked resin layer.

[0037] The curing conditions are a temperature of 50–200℃ and a time of 1–24h; preferably a temperature of 50–160℃ and a time of 9h; the specific curing procedure is preferably as follows: 50℃ for 3h, 80℃ for 2h, 100℃ for 1h, 120℃ for 1h, 140℃ for 1h, and 160℃ for 1h.

[0038] The present invention has the following beneficial effects: (1) This invention provides a method for preparing a low-dielectric crosslinked resin. This invention uses a first component of a hydrocarbon resin containing unsaturated double bonds and a second component of a compound containing polyfunctional silane groups as raw materials, and carries out a hydrosilylation reaction in the presence of a catalyst and an organic solvent to form a C-Si crosslinked curing network. The cured resin exhibits good comprehensive properties.

[0039] (2) This invention innovatively introduces hydrosilylation reaction into the resin curing process, broadens the range of crosslinking agents, makes the crosslinking process precise and controllable, makes the product structure highly designable, and makes the resin properties adjustable and controllable. It effectively solves the problems of limited range of curing agents, single curing system, uncontrollable curing process and brittle cured products in traditional hydrocarbon resins.

[0040] (3) The cured product prepared by this invention has excellent comprehensive properties, including low dielectric properties (D at 10 GHz frequency). k =2.38~2.47, D f = 0.0048~0.0068), high heat resistance (T d5% It exhibits adjustable mechanical properties (tensile modulus from 125 MPa to 425 MPa, elongation at break from 10% to 21%), with a maximum temperature range of >380℃ (preferably 386–415℃) and controllable mechanical properties (tensile modulus from 125 MPa to 425 MPa, elongation at break from 10% to 21%). It also possesses excellent dimensional stability and water resistance (CTE: 103.2–112.6 ppm / ℃; 48h water absorption <0.1%). Furthermore, it has good processability, suitable for various molding processes including casting, coating, impregnation, and compression molding. No small molecule byproducts are generated, and there are no peroxide decomposition residues in the product, which helps maintain the high purity and excellent dielectric properties of the material. Therefore, the low-dielectric crosslinking resin provided by this invention has great application potential in the field of high-frequency, high-speed copper-clad laminates. Detailed Implementation

[0041] The following embodiments are provided to better understand the present invention and are not limited to the preferred embodiments described. They do not constitute a limitation on the content and scope of protection of the present invention. Any product that is the same as or similar to the present invention, derived by any person under the guidance of the present invention or by combining the features of the present invention with other prior art, falls within the protection scope of the present invention.

[0042] For experiments where specific steps or conditions are not specified, the procedures and conditions described in the literature within this field can be followed. Reagents or instruments whose manufacturers are not specified are all commercially available standard products. Example 1

[0043] 20 g (approximately 0.00067 mol, vinyl content approximately 0.33 mol) of polybutadiene resin (PB, catalog number B-3000, Nippon Soda Co., Ltd.) and 80 g of toluene were added to a three-necked flask and magnetically stirred at 30 °C for 24 h to ensure uniform dispersion. Then, 11 g (0.0825 mol) of 1,1,3,3-tetramethyldisiloxane was added to the flask, nitrogen was purged for 20 min, and the mixture was stirred for 1 h. Next, 5 μL of caster catalyst was added, and nitrogen was purged again for 20 min. The flask was sealed, and the reaction was carried out at 60 °C for 15 h. After the reaction was complete, the system was cooled to room temperature, and the reaction solution was poured into a column packed with neutral alumina to remove impurities (such as platinum in the caster catalyst), yielding a clear reaction solution. Then add 0.2 g of antioxidant 1010, stir evenly, pour the resin solution into a polytetrafluoroethylene mold, and place it in an oven to form a film at 50℃ / 3h, 80℃ / 2h, 100℃ / 1h, 120℃ / 1h, 140℃ / 1h, and 160℃ / 1h to obtain the test sample.

[0044] The thermosetting hydrocarbon resin prepared according to the aforementioned formula and process has the following performance indicators: dielectric constant of 2.47 (10GHz), dielectric loss of 0.0068 (10GHz), water absorption rate of less than 0.01% after 48 h, and thermal decomposition temperature T. d5% The temperature is 386℃, the linear thermal expansion coefficient (CTE) (room temperature - 200℃) is 112.6 ppm / ℃, the tensile strength is 24.3 MPa, the elongation at break is 21%, the tensile modulus is 125 MPa, and the tensile toughness is 3.49 MJ / m. 3 . Example 2

[0045] 20 g of PB resin (same as in Example 1) and 80 g of toluene were added to a three-necked flask and magnetically stirred at 30 °C for 24 h to ensure uniform dispersion. Then, 17 g (0.127 mol) of 1,1,3,3-tetramethyldisiloxane was added to the flask, nitrogen was purged for 30 min, and the mixture was stirred for 2 h. Next, 5 μL of caster catalyst was added, and nitrogen was purged again for 30 min. The flask was sealed, and the mixture was heated to 50 °C for 10 h. After the reaction, the system was cooled to room temperature, and the reaction solution was poured into a column containing neutral alumina to remove impurities, resulting in a clear reaction solution. Then, 0.5 g of antioxidant 1010 was added, and the mixture was stirred until homogeneous. The resin solution was then poured into a polytetrafluoroethylene mold and placed in an oven to form films at 50 °C / 3 h, 80 °C / 2 h, 100 °C / 1 h, 120 °C / 1 h, 140 °C / 1 h, and 160 °C / 1 h to obtain the test samples.

[0046] The thermosetting hydrocarbon resin prepared according to the aforementioned formula and process has the following performance indicators: dielectric constant of 2.44 (10GHz), dielectric loss of 0.0052 (10GHz), water absorption rate of less than 0.01% after 48 h, and thermal decomposition temperature T. d5％ The temperature is 406℃, the linear coefficient of thermal expansion (CTE) (room temperature - 100℃) is 104.5 ppm / ℃, the tensile strength is 28.6 MPa, the elongation at break is 18%, the tensile modulus is 179 MPa, and the tensile toughness is 3.15 MJ / m. 3 . Example 3

[0047] 20 g (approximately 0.0044 mol, vinyl content approximately 0.3 mol) of styrene-butadiene-styrene block copolymer resin (SBS, catalog number 1,2-SBS-L42, Nippon Soda Co., Ltd.) and 80 g of xylene were added to a three-necked flask and magnetically stirred at 30 °C for 24 h to ensure uniform dispersion. Then, 14.5 g (0.075 mol) of 1,4-di(dimethylsilyl)benzene was added to the three-necked flask, nitrogen was purged for 20 min, and the mixture was stirred for 1 h. Next, 5 μL of caster catalyst was added, and nitrogen was purged again for 20 min. The three-necked flask was sealed, and the reaction was carried out at 60 °C for 15 h. After the reaction was complete, the system was cooled to room temperature, and the reaction solution was poured into a column packed with neutral alumina to remove impurities, yielding a clear reaction solution. Then add 0.2 g of antioxidant 1010, stir evenly, pour the resin solution into a polytetrafluoroethylene mold, and place it in an oven to form films at 50℃ / 3h, 80℃ / 2h, 100℃ / 1h, 120℃ / 1h, 140℃ / 1h, and 160℃ / 1h to obtain various test samples.

[0048] The thermosetting hydrocarbon resin prepared according to the aforementioned formula and process has the following performance indicators: dielectric constant of 2.43 (10GHz), dielectric loss of 0.0065 (10GHz), water absorption rate of less than 0.01% after 48 h, and thermal decomposition temperature T. d5％ At 395℃, the linear coefficient of thermal expansion (CTE) (room temperature - 200℃) is 106.2 ppm / ℃. The tensile strength is 33.6 MPa, the elongation at break is 17%, the tensile modulus is 244 MPa, and the tensile toughness is 2.85 MJ / m. 3 . Example 4

[0049] 20 g of SBS resin (same as in Example 3) and 80 g of xylene were added to a three-necked flask and magnetically stirred at 30 °C for 24 h to ensure uniform dispersion. Then, 20 g (0.103 mol) of 1,4-di(dimethylsilyl)benzene was added to the three-necked flask, nitrogen was purged for 30 min, and the mixture was stirred for 2 h. Next, 5 μL of caster catalyst was added, and nitrogen was purged again for 20 min. The three-necked flask was sealed, and the temperature was raised to 50 °C for 10 h. After the reaction was complete, the system was cooled to room temperature, and the reaction solution was poured into a column containing neutral alumina to remove impurities, resulting in a clear reaction solution. Then, 0.5 g of antioxidant 1010 was added, and the mixture was stirred until homogeneous. The resin solution was then poured into a polytetrafluoroethylene mold and placed in an oven to form films at 50 °C / 3 h, 80 °C / 2 h, 100 °C / 1 h, 120 °C / 1 h, 140 °C / 1 h, and 160 °C / 1 h, yielding various test samples.

[0050] The thermosetting hydrocarbon resin prepared according to the aforementioned formula and process has the following performance indicators: dielectric constant 2.38 (10GHz), dielectric loss 0.0048 (10GHz), water absorption rate less than 0.01% after 48 h, and thermal decomposition temperature T. d5％ The temperature is 415℃, and the linear coefficient of thermal expansion (CTE) (room temperature - 200℃) is 103.2 ppm / ℃. The tensile strength is 41.3 MPa, the elongation at break is 10%, the tensile modulus is 425 MPa, and the tensile toughness is 2.41 MJ / m. 3 .

[0051] Comparative Example 1 10 g of PB resin, 0.1 g of di-tert-butylperoxyisopropylbenzene, 0.1 g of antioxidant 1010, and 30 g of xylene were added to a round-bottom flask and stirred at 30 °C and 600 rads / min for 24 h to ensure uniform dispersion. The mixture was then poured into a polytetrafluoroethylene mold and cured in an oven at 50 °C / 3 h, 80 °C / 2 h, 100 °C / 1 h, 120 °C / 1 h, 140 °C / 1 h, 160 °C / 1 h, and 180 °C / 1 h. The resulting film exhibited a dielectric constant of 2.56 (10 GHz), a dielectric loss of 0.0061 (10 GHz), a water absorption rate of approximately 0.02% after 48 h, a tensile strength of 11.38 MPa, an elongation at break of 6%, a tensile modulus of 0.248 GPa, and a tensile toughness of 0.419 MJ / m. 3 The cured product exhibits obvious brittle fracture.

[0052] Comparative Example 2 10 g of SBS resin, 0.1 g of di-tert-butylperoxyisopropylbenzene, 0.1 g of antioxidant 1010, and 30 g of xylene were added to a round-bottom flask and stirred at 30 °C and 600 rads / min for 24 h to ensure uniform dispersion. The mixture was then poured into a polytetrafluoroethylene mold and cured in an oven at 50 °C / 3 h, 80 °C / 2 h, 100 °C / 1 h, 120 °C / 1 h, 140 °C / 1 h, 160 °C / 1 h, and 180 °C / 1 h. The resulting film exhibited a dielectric constant of 2.60 (10 GHz), a dielectric loss of 0.0065 (10 GHz), a water absorption rate of approximately 0.02% after 48 h, a tensile strength of 17.43 MPa, an elongation at break of 4%, a tensile modulus of 0.365 GPa, and a tensile toughness of 0.426 MJ / m. 3 The cured product exhibits obvious brittle fracture.

[0053] Comparative Examples 1 and 2 represent traditional hydrocarbon resin curing methods. Compared to Examples 1 to 4, the cured products in Comparative Examples 1 and 2 exhibit significant brittle fracture, with a system toughness of only 0.4 MJ / m. 3 The original materials could not withstand the mechanical impact during the copper-clad laminate (CCL) processing. This invention, based on the hydrosilylation reaction, successfully developed a C-Si crosslinked resin with excellent low dielectric and mechanical properties. The crosslinked C-Si resins prepared using this method exhibit excellent comprehensive properties (as shown in Examples 1-4), meeting the demands of next-generation electronic devices for high-performance substrate materials. They can be widely used in electronic packaging fields such as high-frequency and high-speed copper-clad laminates, 5G communication substrates, and flexible circuit boards.

[0054] The testing methods in this invention adopt the following standards: Dielectric constant Dk and dielectric loss tangent D f Data measured at 10 GHz using a Keysight E5080B oscillator.

[0055] Linear thermal expansion coefficient (CTE): Data were measured from room temperature to 200°C using a NETZSCH TMA 402 F3 thermometer at a heating rate of 5 °C / min under a nitrogen atmosphere.

[0056] 5% thermal decomposition temperature T d5% Data were measured from room temperature to 600°C using a NETZSCH TG 209 F1 thermometer at a heating rate of 20°C / min under a nitrogen atmosphere.

[0057] Tensile strength, elongation at break, tensile modulus, and tensile toughness: The stress-strain curves of the resin film were measured using a KJ-1067 from Dongguan Kejian Co., Ltd. at a rate of 15 mm / min. The tensile modulus was the slope of the stress-strain curve, and the tensile toughness was the integral area of ​​the stress-strain curve.

[0058] Water absorption rate: The sample was immersed in pure water at room temperature for 48 h, weighed and the mass change was recorded.

[0059] The technical contents of this invention and the above embodiments that are not specifically described are the same as those of the prior art, and the raw materials are all commercially available products.

[0060] The present invention is not limited to the above embodiments; all embodiments described herein can be implemented and have the aforementioned good effects.

[0061] The above embodiments are preferred embodiments of the present invention, but the embodiments of the present invention are not limited to the above embodiments. Any changes, modifications, substitutions, combinations, or simplifications made without departing from the spirit and principle of the present invention shall be considered equivalent substitutions and shall be included within the protection scope of the present invention.

Claims

1. A method for preparing a low-dielectric crosslinked resin, characterized in that... The process includes the following steps: a hydrocarbon resin containing carbon-carbon unsaturated bonds is subjected to a hydrosilylation reaction with a multifunctional silane compound in the presence of a catalyst and an organic solvent under an inert gas environment, thereby forming a three-dimensional cross-linked network through the formation of C-Si bonds to obtain a low-dielectric cross-linked resin.

2. The method for preparing the low-dielectric crosslinked resin according to claim 1, characterized in that... Includes the following steps: (1) Disperse the hydrocarbon resin containing carbon-carbon unsaturated bonds evenly in an organic solvent, then add a multifunctional silane compound, and mix evenly after passing in an inert gas. (2) Next, add the catalyst and then pass in an inert gas; after the gas passage is completed, heat the reaction and pour the reactant solution into a column containing neutral alumina to remove impurities and obtain a clear reactant solution, which is a low dielectric crosslinking resin solution.

3. The method for preparing the low-dielectric crosslinked resin according to claim 1 or 2, characterized in that: The hydrocarbon resin containing carbon-carbon unsaturated bonds is at least one of the following: styrene-based block copolymers, polybutadiene, polyisoprene, polyolefin elastomers, styrene-butadiene rubber, nitrile rubber, ethylene propylene rubber, butyl rubber, polybutadiene-acrylonitrile copolymer, polybutadiene-styrene copolymer, and hydrogenated or modified products of the above polymers. The multifunctional silane compounds mentioned are 1,4-di(dimethylsilyl)benzene, 1,3-di(dimethylsilyl)benzene, 1,2-di(dimethylsilyl)benzene, 1,1,3,3-tetramethyldisiloxane, tetraethyldisiloxane, 1,3-dimethyl-1,3-diphenyldisiloxane, diphenylsilane, methylphenylsilane, dimethylsilane, diethylsilane, 1,3,5,7-tetramethylcyclotetrasiloxane, 1,3,5,7,9-pentamethylcyclopentasiloxane, 2,4,6,8-tetramethylcyclotetrasiloxane, 2,4,6,8-tetraethylcyclotetrasiloxane, and sesquioxane compounds containing silane-hydrogen bonds; The catalyst is a hydrosilylation reaction catalyst; The organic solvent is at least one of aromatic solvents, alkane solvents, ether solvents, ketone solvents, ester solvents, and halogenated hydrocarbon solvents; The inert gas is nitrogen, argon, or helium.

4. The method for preparing the low-dielectric crosslinked resin according to claim 3, characterized in that: The styrene-based block copolymer is at least one of styrene-butadiene-styrene block copolymer, styrene-isoprene-styrene block copolymer, styrene-ethylene-butene-styrene block copolymer, and styrene-ethylene-propylene-styrene block copolymer; The polybutadiene is at least one of 1,2-polybutadiene, 1,4-polybutadiene, vinyl-terminated polybutadiene, and hydrogenated polybutadiene; The catalyst is at least one of the following: chloroplatinic acid, an alcoholic solution of chloroplatinic acid, an olefinic complex of chloroplatinic acid, a vinylsiloxane complex of chloroplatinic acid, a cassiterite catalyst (platinum-divinyltetramethyldisiloxane complex), a platinum-cyclovinylsiloxane complex, a platinum-vinylsiloxane complex, a platinum-olefinic complex, a platinum-carbonyl complex, a palladium-based catalyst, a rhodium-based catalyst, a ruthenium-based catalyst, and a nickel-based catalyst. The aromatic solvent is at least one selected from toluene, xylene, trimethylbenzene, benzene, and ethylbenzene; The alkane solvent is at least one selected from hexane, cyclohexane, heptane, octane, and isooctane; The ether solvent is at least one of tetrahydrofuran, dioxane, ethylene glycol dimethyl ether, and diethylene glycol dimethyl ether; The ketone solvent is at least one selected from acetone, butanone, methyl isobutyl ketone, and cyclohexanone; The ester solvent is at least one of ethyl acetate, butyl acetate, and propylene glycol methyl ether acetate; The halogenated hydrocarbon solvent is at least one of dichloromethane, chloroform, carbon tetrachloride, and chlorobenzene.

5. The method for preparing the low-dielectric crosslinked resin according to claim 1 or 2, characterized in that: The molar ratio of carbon-carbon unsaturated groups in the hydrocarbon resin to silane groups in the polyfunctional silane compound is 1:0.1 to 0.

8. The mass ratio of the hydrocarbon resin, the organic solvent, and the catalyst is 10–50: 50–90: 0.0001–0.

001.

6. A low-dielectric crosslinking resin, characterized in that: It is obtained by the preparation method according to any one of claims 1 to 5.

7. The application of the low dielectric crosslinked resin according to claim 6 in the field of communications.

8. A resin composition, characterized in that: It contains additives and the low-dielectric crosslinked resin as described in claim 6.

9. The use of the resin composition of claim 8 in the preparation of a substrate resin layer.

10. The application according to claim 9, characterized in that... The process includes the following steps: contacting the resin composition of claim 8 with the substrate as required, heating and curing to obtain a low-dielectric cross-linked resin layer.