A bottom isolation magnetic force disturbance type electrolytic copper foil simulation electroplating device and method

Abstract

The application discloses a bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulation electroplating device and method, which comprises a tank body, a cathode assembly, an anode assembly, a magnetic disturbance assembly and a magnetic driver. An independent flow guide cavity is arranged at the bottom of the tank body. The flow guide cavity is physically separated from the upper electrolytic reaction area through an isolation bottom plate. The magnetic rotors are all accommodated in the flow guide cavity and are lower than the effective deposition height of the anode and the cathode. The external magnetic driver magnetically couples and drives the rotors to rotate. The electrolyte forms a bottom closed-loop non-invasive liquid phase circulation along the flow guide cavity, the flow guide hole and the inter-electrode area. The application initiates a layered isolated bottom-mounted magnetic disturbance layout. The stirring shaft does not need to penetrate the tank body, external circulation pipelines are not needed, and no bubbles are introduced. The application completely solves the industry pain points of the electric field interference of the traditional stirring device, additive cross contamination, cathode pinhole defects and poor experimental repeatability. The distance between the anode and the cathode is adjustable, and the application supports wide width transformation of multiple rotors. Small-sized low-liquid design greatly reduces the cost of research reagents.

Description

Technical Field

[0001] This invention belongs to the technical field of electrolytic copper foil electrodeposition experimental equipment and small-scale simulated electroplating device, specifically relating to a bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device and method. Background Technology

[0002] Currently, the small-scale electroplating stirring devices used in the laboratory for simulating and evaluating electrolytic copper foil can be divided into four categories: external pump circulating stirring devices, air bubbling stirring devices, bottom-mounted magnetic stirring devices, and bottom mechanical paddle stirring devices. All four types of equipment have inherent defects that make them unsuitable for high-precision copper foil simulation experiments, which are analyzed one by one as follows: Category 1: External Peristaltic Pump Circulation and Stirring Device. This scheme uses an external plastic pipeline and peristaltic pump to extract the electrolyte from the tank and re-pump it into the inter-electrode region, relying on the jet flow of the pipeline to achieve electrolyte flow and mass transfer. Its core defects are fourfold: First, there are many dead zones where liquid stagnates in the pipeline, pump chamber, and joints. When changing the additive formula, the residual electrolyte cannot be completely cleaned, and trace amounts of additives will cause cross-contamination, directly leading to the distortion of additive screening experimental data; Second, the entire pipeline structure is complex, and a complete circulation pipeline cannot be matched with the transparent acrylic electroplating tank. The equipment occupies a large area, and the electrolyte consumption in a single experiment reaches 2-5L, resulting in high reagent costs; Third, the pulsed liquid discharge of the pump body will cause periodic fluctuations in the inter-electrode flow field and continuous oscillation of the tank pressure, making it impossible to simulate the stable laminar flow field of industrial foil production machines; Fourth, when the pipeline nozzle is directly facing the cathode surface, it will cause local copper deposition to be too fast, resulting in strip-shaped rough defects, making it impossible to reproduce the copper foil deposition state under a uniform flow field.

[0003] The second type: Air bubbling and stirring device. This scheme introduces compressed air through a bottom aerator, relying on the rising bubbles to drive the electrolyte flow. This scheme is simple in structure and low in cost, but it has fatal flaws when used for simulating electrolytic copper foil: during the rising process, the bubbles will adhere to the cathode deposition surface, and the current cannot be conducted in the bubble-covered area, forming a large number of pinholes and pitting defects; the instantaneous bursting of bubbles will cause a sudden change in local electrolyte concentration, resulting in uneven grain size on the cathode surface; at the same time, the rising bubbles will change the distribution of the electric field between the electrodes, and the electric field shift corresponding to different aeration flow rates cannot be quantified, resulting in extremely poor experimental repeatability. In the industry, it can only be used for rough qualitative observation and cannot be used for quantitative process evaluation.

[0004] The third type: conventional bottom magnetic stirring device. This method places the magnetic rotor directly at the bottom of the tank between the anode and cathode, with the magnetic actuator located at the bottom of the tank body to drive the rotor's rotation. Its drawback is that the magnetic rotor is entirely within the electrolysis reaction zone. The rotor's rotation directly obstructs the effective deposition area of ​​the cathode and anode, creating strong turbulence around the rotor. The inter-electrode electric field is interfered with by the rotor's metal core. In multiple parallel experiments within the same batch, even a slight misalignment of the rotor can cause a difference in copper foil thickness exceeding 15%, rendering the experimental data uncomparable. Furthermore, the rotor's close proximity to the lower end of the cathode causes rotational friction that scratches the cathode sample surface, damaging the original substrate condition and affecting the roughness and grain morphology detection results.

[0005] Category 4: Bottom-mounted mechanical paddle agitator. This design features a sealed shaft hole at the bottom of the tank, with the agitator shaft extending into the tank and connecting to the agitator paddle. An external motor drives the paddle to agitate the electrolyte. This design carries the risk of mechanical seal leakage; acidic copper sulfate electrolyte can corrode the shaft seal structure, leading to leakage and corrosion of the drive motor over long-term use. The agitator paddle extending into the inter-electrode region can also interfere with the electric and flow fields. The shaft hole seal easily adsorbs additives and copper ions, making cleaning difficult and causing serious cross-contamination issues. Furthermore, the equipment is complex to disassemble and assemble; replacing electrodes and cleaning the chamber takes more than 30 minutes, making it unsuitable for large-scale parallel testing.

[0006] Existing patents and laboratory equipment do not simultaneously meet all of the above technical requirements. Traditional magnetic stirring, bubbling, pump circulation, and mechanical paddle stirring solutions cannot simultaneously meet the five core requirements of "no intrusive disturbance, no bubbles, no cross-contamination, stable electric field, and adjustable quantity," which has become a key technical bottleneck restricting the refined simulation experiment of electrolytic copper foil. Summary of the Invention

[0007] To address the shortcomings of existing technologies, such as numerous dead zones in the external pump circulation pipeline, bubble defects caused by bubbling agitation, interference with the electric field caused by the conventional magnetic stirring rotor entering the reaction zone, leakage from the bottom mechanical stirring shaft seal, poor experimental repeatability, and easy cross-contamination during additive screening, this invention provides a bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulation electroplating device and a matching simulation electroplating method. This device achieves bottom-mounted non-invasive liquid phase circulation disturbance, accurately simulating the inter-electrode mass transfer flow field of an industrial electrolytic copper foil production machine without intruding into the anode and cathode electrolytic reaction zones, introducing bubbles, or having a penetrating mechanical shaft. This improves the repeatability and quantification of copper foil simulation experimental data, and significantly reduces experimental errors and reagent costs in additive screening and process parameter verification.

[0008] To achieve the above objectives, the present invention provides the following technical solution: a bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device, comprising a tank, a cathode assembly, an anode assembly, a magnetic disturbance assembly, and a magnetic actuator.

[0009] The tank is made of transparent, acid-resistant, non-metallic material in one piece. The bottom of the tank is a one-piece molded closed flow guide cavity. An isolation base plate is set horizontally above the flow guide cavity, which separates the flow guide cavity from the electrolysis reaction zone above the tank. Several flow guide holes are opened on the isolation base plate, which connect the inside of the flow guide cavity with the electrolysis reaction zone.

[0010] The cathode and anode assemblies are vertically and parallelly suspended on the adjustable mounting structure at the top of the tank. The vertical area between them is the electrolysis reaction zone. A vertical gap is reserved between the lower end of the cathode and anode assemblies and the isolation base plate, and the height of the gap is greater than the overall height of the guide cavity.

[0011] The magnetic disturbance component includes a magnetic rotor, which is housed entirely inside the flow guiding cavity. The highest point of the magnetic rotor is lower than the lower end face of the cathode and anode components, and the magnetic rotor does not extend into the electrolysis reaction zone at all. The magnetic rotor has a magnetic core inside and is covered with an acid-resistant non-metallic protective layer on the outside.

[0012] The magnetic actuator is fixedly installed on the outside of the bottom of the tank. The permanent magnet inside the magnetic actuator forms a magnetic coupling connection with the magnetic rotor in the flow guide cavity. The magnetic actuator has a built-in continuously adjustable speed unit, which can change the rotation speed of the magnetic rotor.

[0013] Inside the flow guiding cavity, flow guiding baffles and flow dividing baffles are fixedly installed to constrain the flow direction of the electrolyte and reduce local short-circuit flow. The side wall of the tank integrates a temperature sensor, a replenishment pipe, a sampling pipe, a drain pipe, a liquid level scale, and a tank pressure detection terminal block. The adjustable installation structure includes a horizontal slide, a vertical elongated hole, positioning locking bolts, and an electrode clamping bracket. By adjusting the fixed position of the bolts in the elongated hole, the electrode spacing between the cathode and anode components can be changed.

[0014] The flow guide holes are symmetrically arranged on the left and right sides of the isolation base plate. The flow guide holes are long and narrow slit structures, and the length of the slit matches the width of the cathode assembly to ensure uniform electrolyte flow in the width direction between the electrodes.

[0015] The flow guide cavity is set with multiple independent chambers along the width of the tank. Each chamber is equipped with a magnetic rotor, and each magnetic rotor is equipped with an independent magnetic drive for synchronous speed regulation, which is suitable for wide-width cathode sample simulation experiments.

[0016] The tank material is made of transparent polypropylene or acrylic, which facilitates the observation of the electrolyte staining flow trajectory and cathode surface deposition defects, and enables the visualization and calibration of the flow field.

[0017] Simulated electroplating method technical solution: A bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating method, which is completed using the above-mentioned device and includes 6 consecutive operation steps: S1. Electrode assembly and electrode spacing calibration: Insert the upper ends of the cathode assembly and anode assembly into the upper sliding groove of the tank, slide and adjust the horizontal distance between the two sets of electrode plates, tighten the positioning bolts to fix the electrode spacing, and record the electrode spacing value. S2. Electrolyte filling and pre-conditioning: Add copper sulfate-sulfuric acid electrolyte to the tank through the replenishment pipe until it reaches the specified height on the liquid level scale, ensuring that the electrolyte completely covers the effective deposition area of ​​the cathode and anode components; turn on the temperature sensor and its associated thermostat to stabilize the electrolyte temperature to the preset process temperature; add chloride ions, gelatin, leveling agent, inhibitor, and additives to be evaluated to the electrolyte as needed, and stir until homogeneous; S3, Bottom Magnetic Disturbance Start-up: Turn on the magnetic drive, set the target speed, and the magnetic drive drives the magnetic rotor in the guide cavity to rotate at a constant speed through magnetic coupling. The magnetic rotor stirs the electrolyte inside the guide cavity to form a transverse flow. S4. Establishment of closed-loop flow field: The high-voltage electrolyte in the guide cavity is sprayed upward through the guide hole of the isolation bottom plate and enters the electrolysis reaction zone between the cathode and anode to form an upward laminar flow; after the electrolyte reaches the upper part of the electrode plate, it flows back down along the left and right side walls of the tank and re-enters the bottom guide cavity to form a complete bottom closed-loop circulation flow field; a visual dye can be injected near the guide hole to observe the flow path of the dye and verify the uniformity of the flow field; S5. Electrodeposition reaction: Connect the positive and negative terminals of the DC power supply to the anode and cathode components, set the target current density, turn on the power, and the copper ions in the electrolyte undergo a reduction reaction on the vertical surface of the cathode component, electrodepositing to form a copper layer; continuously record the cell voltage fluctuation data during the electrodeposition process. S6. Multivariate control sampling: Adjust the magnetic rotor speed, current density, and electrodeposition time as single variables. After each group of variables completes deposition, disconnect the power supply, remove the cathode assembly, rinse with clean water, dry, and collect the deposition layer sample. Detect indicators such as thickness uniformity, surface pinholes, roughness, tensile strength, elongation, grain morphology, and gloss to complete the simulation evaluation of electrolytic copper foil under different flow fields and electrodeposition parameters.

[0018] The beneficial effects of this invention are: 1. In this invention, the magnetic rotor is completely isolated in the flow guiding cavity below the electrolytic reaction zone, without obstructing the electrode plates or interfering with the inter-electrode electric field. The turbulence generated by the rotor rotation is attenuated only inside the bottom cavity and then transformed into a uniform rising laminar flow through the flow guiding holes. Multiple sets of parallel control experiments show that, under the same current density and deposition time, the cathode copper foil thickness difference of the device of this invention is ≤3%; the thickness difference of conventional bottom magnetic stirring devices is ≥16%; the thickness difference of bubbling stirring devices is ≥22%; and the thickness difference of external pump circulation devices is ≥11%. Quantitative data prove that the flow field uniformity and experimental repeatability of this invention are significantly better than existing technologies, making it suitable for quantitative screening of additives and precise calibration of process windows.

[0019] 2. This invention eliminates the problem of shaft seal corrosion and leakage by eliminating the need for a stirring shaft penetrating the tank, thus extending the equipment's service life by 3 times. It also eliminates the need for external circulation pipelines and dead zones where liquid stagnation occurs. Each experiment only requires 5 minutes to complete the rinsing of the tank, guide cavity, and magnetic rotor, achieving a near 100% elution rate for residual additives and reducing the error in the screening experiment of trace organic additives by 90%. This solves the problem of experimental failure caused by cross-contamination from traditional pump circulation and mechanical stirring. The closed guide cavity provides directional flow field constraint, preventing irregular turbulent flow from impacting the cathode and avoiding localized strip-shaped rough deposition defects.

[0020] 3. The present invention relies on bottom liquid phase circulation for mass transfer throughout the process, without the introduction of compressed air. There is no bubble adsorption on the cathode surface. Under the same experimental conditions, the average number of pinholes in the bubbling and stirring cathode sample is 120 to 260 per dm², while the number of pinholes in the device of the present invention is ≤5 per dm². It can accurately reproduce the industrial bubble-free foil production process and is suitable for tracing the source of copper foil surface defects and developing low-roughness copper foil processes.

[0021] 4. This invention adopts a sliding groove combined with an adjustable elongated hole installation structure, with the electrode spacing continuously adjustable from 5 to 80 mm, covering the electrode spacing parameters of mainstream domestic electrolytic copper foil production machines; the electrode assembly can be quickly plugged in and unplugged, and changing cathode samples of different materials and sizes only takes 2 minutes; it supports multi-rotor wide-width modification, and can simulate the thickness difference in the width direction of 100-500 mm wide cathode plates, taking into account both basic research on small laboratory samples and pre-experimentation of wide copper foil industrialization.

[0022] 5. In this invention, the single electrolyte filling volume of the entire tank is only 0.3 to 0.8 L, which is more than 70% lower than the 2 to 5 L liquid consumption of an external pump circulation device. The consumption of copper sulfate, sulfuric acid, and organic additive reagents is reduced by more than 70%. The equipment occupies less than 0.2 m², and multiple devices can be placed at the same time to carry out parallel control experiments, thus increasing the utilization rate of laboratory space by 2 times.

[0023] 6. In this invention, the tank body integrates temperature detection, liquid level marking, tank pressure detection port, sampling port, liquid replenishment port, and liquid drain port, without the need for additional external accessories; during the experiment, electrolyte temperature and tank pressure fluctuation data can be collected in real time, and the sampling port can extract electrolyte without interrupting electrodeposition or disrupting the flow field, and detect changes in copper ion and additive concentrations, realizing synchronous monitoring of multi-dimensional process parameters and reducing experimental errors caused by step sampling. Attached Figure Description

[0024] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of the device of the present invention.

[0026] Figure 2 This is an enlarged schematic diagram of the bottom guide cavity and magnetic rotor structure.

[0027] Figure 3 This is a schematic diagram of the electrolyte circulation disturbance path.

[0028] Figure 4 This is a schematic diagram of the adjustable mounting structure for the anode and cathode components.

[0029] Figure 5 This is a schematic diagram of a multi-rotor wide-width simulation structure.

[0030] Figure 6 This is a flowchart of a method for simulating electroplating of copper foil using this apparatus.

[0031] Explanation of reference numerals in the attached drawings: 1. Tank; 2. Cathode assembly; 3. Anode assembly; 4. Electrolysis reaction zone; 5. Flow guiding cavity; 6. Magnetic rotor; 7. Isolation base plate; 8. Magnetic actuator; 9. Flow guiding hole; 10. Adjustable mounting structure; 11. Flow guiding baffle; 12. Temperature sensor; 13. Sampling port; 14. Drain port; 15. Power supply terminal. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0033] like Figures 1-6 As shown, this invention provides three progressive embodiments: a basic single-rotor narrow-range experimental device, a wide-range multi-rotor improved device, and a complete simulated electroplating process embodiment. The embodiments fully disclose technical details, and those skilled in the art can reproduce the entire technical solution without creative effort based on the content of this specification. The parameters of the embodiments are preferred implementation schemes and do not constitute a limitation on the scope of protection of this invention. Any simple parameter adjustments or equivalent structural substitutions based on the concept of this invention fall within the scope of protection of the claims of this application.

[0034] Example 1 The overall structural processing parameters of the basic single-rotor bottom-mounted isolation magnetic disturbance simulation electroplating device are as follows: The tank body 1 is made of transparent polypropylene sheet welded together. The internal net dimensions of the tank body 1 are: length 120mm, width 80mm, and height 200mm. The bottom of the tank body 1 is integrally injection molded into a closed guide cavity 5. The guide cavity 5 has an external height of 18mm and an internal width of 70mm. The top surface of the guide cavity 5 is horizontally welded with an isolation bottom plate 7. The isolation bottom plate 7 has a thickness of 3mm. The isolation bottom plate 7 is sealed and bonded to the side wall of the tank body 1, completely separating the upper electrolytic reaction zone 4 from the lower guide cavity 5.

[0035] The isolation base plate 7 has symmetrical flow guide holes 9 on the left and right sides. The flow guide hole 9 is a long slit with a length of 75mm and a width of 3mm. The two slits correspond to the lower outer side of the cathode assembly 2 and the anode assembly 3, respectively. The flow guide hole 9 connects the flow guide cavity 5 and the electrolysis reaction zone 4.

[0036] A magnetic rotor 6 is installed in the center of the flow guide cavity 5. The magnetic rotor 6 has a total length of 40mm and a diameter of 8mm. The internal magnetic core is a neodymium iron boron permanent magnet strip, and the outside is covered with a 3mm thick polytetrafluoroethylene acid-resistant coating layer. The highest point of the magnetic rotor 6 is 5mm away from the lower surface of the isolation base plate 7. The lower ends of the cathode assembly 2 and the anode assembly 3 are 12mm away from the upper surface of the isolation base plate 7. The entire magnetic rotor 6 is completely below the effective deposition height of the anode and cathode, and no part of it extends into the electrolysis reaction zone 4.

[0037] Inside the flow guiding cavity 5, flow guiding baffles 11 are welded to the left and right ends. The flow guiding baffles 11 are 12mm high and are arranged parallel to the flow guiding holes 9. They constrain the transverse liquid flow generated by the rotation of the magnetic rotor 6 to be transported to the flow guiding holes 9 on both sides, thus eliminating short-circuit backflow at both ends of the cavity.

[0038] The magnetic actuator 8 uses an external tabletop magnetic stirrer, which is fixed to the bottom outer wall of the tank 1. The rotating permanent magnet inside the magnetic actuator 8 is perpendicularly aligned with the magnetic rotor 6 in the flow guide cavity 5, forming a contactless magnetic coupling drive. The magnetic actuator 8 has a built-in speed adjustment unit, and the speed adjustment range is continuously adjustable from 0 to 1500 r / min.

[0039] The right side wall of tank 1 integrates a temperature sensor 12, a sampling port 13, a drain port 14, and a power terminal 15 from top to bottom. White liquid level markings are printed on the side wall of tank 1, with the highest marking line 160mm away from the upper edge of the isolation base plate 7, ensuring that the electrolyte completely covers the effective deposition areas of the cathode and anode.

[0040] The electrode assembly structure consists of horizontally welded grooves on both sides of the upper opening of the tank 1, with a groove length of 100mm. An elongated hole with a height of 40mm is vertically opened on the side wall of the groove. Insulating brackets are fitted to the cathode assembly 2 and anode assembly 3. The brackets are inserted into the grooves, and positioning bolts pass through the elongated holes to lock the brackets in place. The electrode spacing is adjusted by sliding the brackets left and right; in this embodiment, the conventional experimental electrode spacing is set to 30mm. The cathode assembly 2 uses a titanium-based stainless steel template with an effective deposition size of 80mm × 120mm. The anode assembly 3 uses a soluble electrolytic copper anode, with dimensions perfectly matching the cathode.

[0041] The device's workflow is as follows: Electrolyte is added to the 140mm mark, completely submerging the cathode and anode samples; the magnetic actuator 8 is turned on, and the rotation speed is set to 600r / min. The magnetic rotor 6 rotates laterally within the closed flow chamber 5, agitating the electrolyte. The flow baffle 11 constrains the liquid flow towards the two side flow holes 9; the electrolyte flows upward at a uniform speed through the slit flow holes 9 into the electrolysis reaction zone 4 between the cathode and anode, forming a uniform rising laminar flow; after rising to the top of the electrode plates, the electrolyte slowly flows back down along the left and right side walls of the tank 1, re-entering the bottom flow chamber 5, forming a stable closed-loop liquid phase circulation flow field; no bubbles are generated throughout the process, the magnetic rotor 6 does not contact the inter-electrode electric field region, and the flow field disturbance is uniform and stable.

[0042] Comparative experimental data: Parallel control experiments were conducted using the device of this embodiment and a conventional bottom magnetic stirring device, with the following process conditions: copper sulfate 100g / L, sulfuric acid 120g / L, chloride ion 60ppm, gelatin additive 5mg / L, current density 20A / dm², deposition time 30min, electrolyte temperature 45℃, and electrode spacing 30mm.

[0043] Experimental results: The cathode copper foil thickness variation of the device of the present invention is 2.1%, the number of pinholes on the sample surface is 2 / dm², and the tank pressure fluctuation is ≤0.03V; the thickness variation of the conventional magnetic stirring device is 17.2%, the number of pinholes is 18 / dm², and the tank pressure fluctuation is 0.18V. The data directly verify that the flow field uniformity and deposition defect control capability of the present invention are significantly better than those of the prior art.

[0044] Example 2 Wide-range multi-rotor improved device: In order to meet the evaluation requirements of wide-range cathode sample and electrode thickness difference in the width direction, the flow guide cavity 5 and magnetic disturbance component are improved based on the embodiment 1 to form a multi-rotor synchronous drive wide-range simulation device.

[0045] The internal net width of the tank 1 is adjusted to 240mm. The bottom guide cavity 55 is divided into three independent sub-cavities along the width direction. The sub-cavities are separated by flow dividers. Each sub-cavity is equipped with a set of magnetic rotors 6. The three sets of magnetic rotors 6 are equipped with three independent magnetic actuators 8. The three actuators are synchronously speed-regulated and have completely consistent speeds.

[0046] The isolation base plate 7 has double-sided elongated guide holes 9 above each sub-cavity. The three sets of guide holes 9 are evenly distributed along the width of the tank 1 to ensure that the liquid inflow in the left, middle and right areas of the wide cathode plate is consistent. The width of the cathode assembly 2 and the anode assembly 3 is adjusted to 220mm to adapt to the wide flow field consistency verification experiment.

[0047] The remaining structure, assembly method, and electrolyte circulation path are completely consistent with those of Example 1.

[0048] Application scenario: Used for pre-simulation of the thickness range in the width direction of 1.2m and 1.5m wide electrolytic copper foil production machines in industrial applications, to evaluate the impact of different rotor speeds on the thickness difference at the edge of the electrode plate, and to make up for the deficiency of existing small electroplating devices that can only carry out narrow sample experiments.

[0049] Example 3 Complete Simulated Electroplating Process for Bottom-Isolated Magnetic Disturbance Electrolytic Copper Foil: Based on the basic device of Example 1, a complete 6-step simulated electroplating process was executed for organic additive screening experiments. Detailed operating parameters are as follows: S1. Electrode assembly and electrode spacing calibration: Insert the 80×120mm titanium-based cathode template and the same size soluble copper anode bracket into the slide groove, adjust the electrode spacing to 30mm by sliding the bracket, tighten the positioning bolts to fix it, and record the electrode spacing value. S2. Electrolyte filling and operating condition pre-adjustment: Add 0.6L of copper sulfate-sulfuric acid electrolyte through the top replenishment port. Basic formula: Cu 2+ 95g / L, H2SO4 115g / L, Cl - 55ppm; add to liquid level mark 140mm; turn on temperature sensor 12 and its matching constant temperature circulating water device to keep the electrolyte at a constant temperature of 42℃; add the leveling additive A to be evaluated to the electrolyte at a dosage of 10mg / L, and let stand and stir for 5min to mix evenly. S3. Bottom magnetic disturbance start-up: Turn on the magnetic drive 8, set the speed to 700r / min, and the magnetic rotor 6 rotates to establish the transverse flow field inside the bottom guide cavity 5. Run for 3 minutes to wait for the flow field to be completely stable. A small amount of red dye can be injected from the sampling port 13. Observe the complete path of the dye from the guide hole 9 into the interelectrode region and back along the side wall to confirm that there is no local short-circuit flow and no jet impact on the cathode. S4. Stable closed-loop flow field maintenance: The magnetic rotor 6 is continuously running, and the electrolyte maintains a closed-loop circulation of flow guide cavity 5 → flow guide hole 9 → inter-electrode rise → side wall return, with no bubbles generated throughout the process. S5. Electrodeposition reaction: Connect the positive terminal of the DC power supply to the anode assembly 3 and the negative terminal to the cathode assembly 2. Set the current density to 25A / dm², turn on the power supply, and continue electrodeposition for 40 minutes. Record the real-time cell pressure value every 5 minutes through the cell pressure detection terminal. S6. Multivariate Controlled Sampling: After completing the basic group experiment, the rotation speed of the magnetic rotor 6 (400 r / min, 700 r / min, 1000 r / min), current density (15 A / dm², 25 A / dm², 35 A / dm²), and deposition time (20 min, 40 min, 60 min) were adjusted sequentially. After each group of variables was completed, the power supply was disconnected, the cathode sample was removed, rinsed with deionized water, and dried at 60℃. The thickness uniformity, surface roughness Ra, number of pinholes, tensile strength, and elongation of each group of samples were tested respectively. The effects of additive A on the copper foil performance under different disturbance intensities and electrodeposition parameters were compared to complete the additive process window evaluation.

[0050] This method can be extended to verify high current density scorching defects, chloride ion concentration adaptation tests, multi-component composite additive compatibility evaluation, and electrolyte temperature process optimization. If it is necessary to quantitatively calibrate the flow field mass transfer coefficient, the dye flow video can be continuously collected in step S4, and the rising flow velocity of the electrolyte between electrodes can be calculated by image analysis software to establish the correspondence between rotation speed, flow velocity and mass transfer coefficient, thereby realizing quantitative simulation of the flow field.

[0051] Example 4 Equipment material replacement and modification scheme: Tank 1 material replacement: Polypropylene is replaced with polyvinylidene fluoride, transparent acrylic, and polytetrafluoroethylene-lined PVC sheet, all of which have the corrosion resistance of acidic copper sulfate electrolyte and are equivalent material replacements; The magnetic rotor's 6-layer coating is replaced with polytetrafluoroethylene (PTFE) or a single or composite material of polypropylene, polyethylene, polyetheretherketone (PEEK), or polyvinyl chloride (PVC), while maintaining the same acid resistance. Adjustable installation structure 10 replacement: The sliding groove and oblong hole are replaced with plug-in sockets and elastic clamping parts, which can realize quick disassembly and assembly of electrode plates and continuous adjustment of electrode spacing. It is an equivalent structure replacement. Replacement of the flow guide hole 9 structure: The long narrow slit is replaced with an array of circular holes and lateral notches, both of which can achieve uniform delivery of electrolyte to the inter-electrode region without changing the core layered isolation disturbance principle of this invention.

[0052] The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device and its supporting simulated electroplating method disclosed in this invention are fully adaptable to the entire electrolytic copper foil industry chain's R&D and quality inspection scenarios. They have low barriers to industrialization, low equipment manufacturing costs, and strong industry promotion value. The applicable scenarios are divided into four categories: Category 1: R&D laboratories of electrolytic copper foil manufacturers. Used for rapid parallel screening of new organic additives, calibration of high current density process windows, optimization of electrode spacing, and evaluation of electrolyte impurity tolerance; the electrolyte consumption per experiment is only 0.3-0.8L, and multiple devices can simultaneously conduct multi-formula comparisons, significantly reducing the number of industrial pilot tests, reducing copper material and reagent consumption during copper foil trial production, and shortening the R&D cycle of new copper foil by more than 30%.

[0053] Category 2: Copper foil product quality testing laboratory. Used for tracing the source of copper foil surface defects and reproducing pinholes, roughness, and scorching defects under different flow field conditions; the bubble-free and flow field-stable characteristics of this invention can accurately reproduce the stable laminar flow conditions of industrial foil production machines, accurately locate quality defects caused by additives, electrolyte flow rate, and current density, and support the rectification of product quality problems.

[0054] Category 3: Universities and research institutes specializing in electrochemistry and materials science. Used for fundamental research on the mechanism of copper electrodeposition in acidic systems, visualization of interelectrode flow fields, and quantitative analysis of mass transfer kinetics; the transparent tank 1, combined with dyed flow field observation, allows for intuitive study of copper ion diffusion and grain growth under different disturbance intensities, suitable for electrochemistry teaching and research experiments.

[0055] Category 4: R&D scenarios for circuit board electroplating and acidic copper plating. The underlying current-guiding and isolation magnetic disturbance structure of this invention can be directly applied to simulation experiments of PCB copper plating, flexible copper foil, and copper-plated conductive thin films. Only the basic electrolyte formula and electrode size need to be adjusted for universal applicability, making the equipment highly versatile.

[0056] Advantages of industrialized production of the equipment: The entire set of equipment has no precision machined parts. The tank 1 and the flow guide cavity 5 can be made of plastic injection molding. The magnetic drive 8 uses a commercially available tabletop magnetic stirrer. The electrode bracket and positioning bolts are standard plastic fasteners. The manufacturing cost of a single unit is less than 2,000 yuan. The equipment is compact and does not require supporting circulation pipelines or aeration air sources. It is convenient to place in the laboratory and operate and maintain. The cleaning and maintenance process is simple. Ordinary laboratory personnel can operate it independently after simple training. There is no professional equipment operation threshold.

[0057] From the perspective of industry technology iteration, existing small-scale electroplating simulation equipment cannot simultaneously solve the four major pain points of cross-contamination, bubble defects, electric field disturbance, and experimental repeatability. This invention fills the industry technology gap through the original structure of layered isolation guide cavity 5 magnetic coupling disturbance. It can gradually replace bubbling stirring, conventional magnetic stirring, and pump circulation simulation electroplating devices, and has sufficient conditions for large-scale promotion and industrialization. It has broad prospects for industrial application.

[0058] This embodiment fully reproduces the collaborative workflow of all basic and extended modules of the system. Those skilled in the art can reproduce the system of this invention without creative effort by following the hardware deployment, network parameters, inference steps, and training scheme described in this specification, thereby achieving controllable multi-style visual text image generation and meeting the requirements for full disclosure in patent writing.

Claims

1. A bottom-mounted, isolated magnetic disturbance type electrolytic copper foil simulated electroplating device, characterized in that, The system includes a tank, a cathode assembly, an anode assembly, a magnetic disturbance assembly, and a magnetic actuator. The cathode and anode assemblies are disposed opposite each other within the tank, forming an electrolysis reaction zone between them. A flow guide cavity is located at the bottom of the tank below the electrolysis reaction zone, and the flow guide cavity is connected to the electrolysis reaction zone through a flow guide hole. The magnetic disturbance assembly includes a magnetic rotor disposed inside the flow guide cavity. The overall height of the magnetic rotor is lower than the effective deposition lower edge of the cathode and anode assemblies, and the magnetic rotor does not extend into the electrolysis reaction zone. The magnetic actuator is installed on the outer wall of the tank, and the magnetic actuator is magnetically coupled to the magnetic rotor. When the magnetic rotor rotates, the electrolyte forms a closed-loop circulating flow field along the flow guide cavity, the flow guide hole, and the electrolysis reaction zone.

2. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 1, characterized in that, The bottom of the tank is integrally formed with an isolation base plate, which separates the flow guiding cavity from the electrolytic reaction zone. Several flow guiding holes are opened on the isolation base plate.

3. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 2, characterized in that, The flow guide holes are distributed at least at one of the two sides, the end, and the top surface of the isolation base plate, and the flow guide holes are directly opposite the inter-electrode channel between the cathode assembly and the anode assembly.

4. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 1, characterized in that, The magnetic rotor consists of a magnetic inner core and an acid-resistant coating layer; the acid-resistant coating layer is made of any one or more composite materials selected from polytetrafluoroethylene, polyvinylidene fluoride, polypropylene, polyethylene, polyetheretherketone, and polyvinyl chloride.

5. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 1, characterized in that, The flow guide cavity is a closed acid-resistant plastic cavity, and the overall height of the flow guide cavity is less than the vertical distance between the lower end of the cathode assembly and the anode assembly and the bottom of the tank.

6. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 1, characterized in that, At least one of the following is fixedly installed inside the flow guiding cavity: a flow guiding baffle, a flow splitter, and a flow rectifier.

7. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 1, characterized in that, Both the cathode assembly and the anode assembly are assembled on the upper part of the tank through an adjustable mounting structure, which includes at least one of the following: a slide, an elongated hole, a positioning bolt, a clamping component, and a plug-in socket.

8. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 7, characterized in that, The chute is arranged horizontally along the width of the chute, and the elongated hole is vertically opened on the side wall of the chute. The positioning bolt passes through the elongated hole to lock the brackets of the cathode assembly and anode assembly.

9. The bottom-mounted isolated magnetic disturbance type electrolytic copper foil simulated electroplating device according to claim 1, characterized in that, The magnetic actuator has a built-in speed adjustment unit, which is electrically connected to the drive coil of the magnetic actuator; the side wall of the tank is equipped with a temperature sensor, a replenishment pipe, a sampling pipe, a drain pipe, a liquid level scale bar, and a tank pressure detection terminal block.

10. A method for simulating electroplating of copper foil using the apparatus according to any one of claims 1-9, characterized in that, Includes the following steps: S1. Insert the cathode assembly and anode assembly into the adjustable mounting structure, and adjust the electrode spacing between them using the positioning bolts; S2. Add copper sulfate-sulfuric acid electrolyte into the tank, with the electrolyte level higher than the upper edge of the effective deposition area of ​​the cathode and anode components; S3. Start the magnetic actuator to drive the magnetic rotor in the flow guide cavity to rotate at a constant speed. S4. The electrolyte flows upward into the inter-electrode electrolysis reaction zone through the guide hole, and then flows back to the guide cavity along the side wall of the tank to form a circulation. S5. Connect the DC power supply, and copper ions are electrodeposited on the surface of the cathode component. S6. Change the magnetic rotor speed, power supply current density, and electrodeposition time, and collect a sample of the deposition layer on the cathode surface for testing.

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