An inner-domain three-dimensional uniform temperature network and a heat exchange structure of grain pile hot spots

Abstract

The present application relates to the technical field of grain storage, and particularly relates to an inner-domain three-dimensional uniform temperature network and a heat exchange structure of a grain pile hotspot, wherein the inner-domain three-dimensional uniform temperature network comprises a plurality of horizontally arranged first heat superconducting pipes, which are arranged on mutually parallel first and second reference planes respectively; wherein the plurality of first heat superconducting pipes on the first reference plane are arranged equidistantly along a first direction at a first interval, the plurality of first heat superconducting pipes on the second reference plane are arranged equidistantly along a second direction at a second interval, and the first interval is smaller than the second interval; the projections of the two layers of first heat superconducting pipes on an orthographic projection plane are arranged in a cross manner; and a plurality of vertically arranged second heat superconducting pipes are arranged inside a space to be uniformly heated, and the plurality of second heat superconducting pipes are connected with the first heat superconducting pipes on the first and second reference planes respectively. The uniform temperature inside the grain pile is achieved.

Description

Technical Field

[0001] This invention relates to the field of grain storage technology, and in particular to an internal three-dimensional uniform temperature network and a heat exchange structure for hot spots in grain piles. Background Technology

[0002] Those skilled in the art know that heat exchange can be achieved using a combination of horizontal and vertical pipes. However, a deep-seated technical bias has long existed: the belief that "simply connecting horizontal and vertical pipes will achieve three-dimensional heat conduction." This understanding completely ignores the fundamental difference between grain piles and homogeneous media such as metal and concrete. Grain piles are porous media composed of discrete particles, with vertical thermal resistance 3 to 5 times that of horizontal thermal resistance, increasing exponentially with depth, and exhibiting significant abrupt changes in stratified thermal resistance. Conventional "simple splicing of horizontal and vertical pipes" schemes, due to the failure to match the non-uniform thermal resistance field of the grain pile, not only fail to achieve effective temperature uniformity but also create numerous thermal blind spots and thermal resistance bottlenecks. This is the fundamental reason why existing thermal superconducting grain storage technologies have consistently failed to solve the problem of deep heat accumulation. Summary of the Invention

[0003] In this section, as well as in the abstract and title of this application, some simplifications or omissions may be made to avoid obscuring the purpose of this section, the abstract, and the title of this application, and such simplifications or omissions shall not be used to limit the scope of the invention.

[0004] To address the problem of uneven temperature inside grain piles in existing technologies, one objective of this invention is to provide an internal three-dimensional temperature equalization network, comprising multiple horizontally arranged first thermal superconducting pipes, which are respectively arranged on a first reference plane and a second reference plane that are parallel to each other; wherein, the multiple first thermal superconducting pipes located on the first reference plane are arranged at equal intervals along a first direction with a first spacing, and the multiple first thermal superconducting pipes located on the second reference plane are arranged at equal intervals along a second direction with a second spacing, and the first spacing is smaller than the second spacing; the projections of the two layers of first thermal superconducting pipes on the orthographic projection plane are intersecting; multiple vertically arranged second thermal superconducting pipes are disposed inside the space to be temperature equalized, and the multiple second thermal superconducting pipes are respectively connected to the first thermal superconducting pipes located on the first reference plane and the second reference plane.

[0005] As a preferred embodiment of the internal three-dimensional isothermal network described in this invention, wherein: the first reference plane and the second reference plane divide the space to be isothermed from top to bottom into an upper respiratory heat concentration zone, a middle compacted core zone, and a lower cold bridge and inversion zone with equal sub-heights; wherein, the sub-heights and the total height of the space to be isothermed in the vertical direction satisfy: H1=ω·H, and 0.3≤ω≤0.45, where H1 is the sub-height, H is the total height, and ω is the ratio coefficient of the sub-height to the total height.

[0006] As a preferred embodiment of the internal three-dimensional temperature equalization network of the present invention, wherein: the first distance between two adjacent first thermal superconductors located on the first reference plane and the average thermal conductivity attenuation length λ of the grain particles to be stored in the temperature equalization space satisfy: 0.95λ≤L1≤1.05λ.

[0007] As a preferred embodiment of the internal three-dimensional temperature equalization network of the present invention, wherein: the second spacing between two adjacent first thermal superconductors located on the second reference plane and the average thermal conductivity attenuation length λ of the grain particles to be stored in the temperature equalization space satisfy: 1.6λ≤L2≤1.8λ.

[0008] Another objective of this invention is to provide a heat exchange structure for a grain pile hotspot, comprising the aforementioned inner-domain three-dimensional temperature equalization network and a boundary-enhanced heat dissipation array disposed on the outer periphery of the space to be temperature equalized; wherein the outer periphery includes a first boundary side and a second boundary side disposed opposite to each other in the horizontal direction; the boundary-enhanced heat dissipation array includes a plurality of third heat superconducting pipes that extend vertically and are respectively equidistantly disposed on the first boundary side and the second boundary side; wherein the plurality of third heat superconducting pipes equidistantly disposed on the first boundary side have a third spacing, and the plurality of third heat superconducting pipes equidistantly disposed on the second boundary side have a fourth spacing; and the third spacing is smaller than the fourth spacing.

[0009] In a preferred embodiment of the heat exchange structure for the grain pile hot spot described in this invention, the outer perimeter boundary further includes a third boundary side and a fourth boundary side connected between the first boundary side and the second boundary side; the third heat superconducting pipes equidistantly disposed on the third boundary side and the fourth boundary side have a fifth spacing, the fifth spacing being greater than the third spacing and less than the fourth spacing.

[0010] As a preferred embodiment of the heat exchange structure of the grain pile hot spot described in this invention, the sizes of the third spacing, the fourth spacing, and the fifth spacing are all positively correlated with the average thermal conductivity attenuation length λ of the grain particles to be stored in the temperature equalization space, and satisfy the following conditions: 0.85λ≤L3≤1.05λ; 1.45λ≤L4≤1.80λ; 1.20λ≤L5≤1.50λ.

[0011] In a preferred embodiment of the heat exchange structure for the grain pile hot spot described in this invention, the outer perimeter boundary forms a first corner region and a second corner region at the intersection of the first boundary side with the third boundary side and the fourth boundary side, respectively; a third corner region and a fourth corner region are formed at the intersection of the second boundary side with the third boundary side and the fourth boundary side, respectively; a first number of the third heat superconducting pipes are arrayed in the first corner region and the second corner region, and a second number of the third heat superconducting pipes are arrayed in the third corner region and the fourth corner region, wherein the first number is greater than the second number.

[0012] As a preferred embodiment of the heat exchange structure for the grain pile hot spot described in this invention, it further includes a mobile TEC enhancement module, which comprises: a fourth superconducting heat pipe, the bottom of which is inserted into the space to be homogenized and extends to the lower cold bridge and inversion zone; the vertical distance between the bottom end of the fourth superconducting heat pipe and the bottom surface of the space to be homogenized is greater than the thermal influence radius caused by the contact thermal resistance of the bottom surface of the space to be homogenized; and the top end of the fourth superconducting heat pipe passes through the top surface of the space to be homogenized and continues to extend; a semiconductor cooling chip, the heating surface of which is thermally connected to the external environment, and the cooling surface of which is in contact with and thermally conductively connected to the condensation surface of the top end of the fourth superconducting heat pipe.

[0013] As a preferred embodiment of the heat exchange structure of the grain pile hot spot described in this invention, the mobile TEC enhancement module further includes a controller, which is connected to the semiconductor refrigeration chip and a temperature sensor arranged on the outer periphery of the fourth thermal superconductor. The controller dynamically adjusts the cooling power of the semiconductor refrigeration chip based on the transient temperature rise rate collected by the temperature sensor.

[0014] The beneficial effects of the present invention are as follows: The core of the internal three-dimensional uniform temperature network of the present invention is to address the unique thermal characteristics of grain piles, which are special porous and non-uniform media. It breaks through the technical prejudice that planar heat exchange can meet the requirements, which has long existed in the field. Through the precise physical coupling of layered differentiated horizontal pipe network and node-type through vertical pipe network, a three-dimensional heat-conducting skeleton adapted to the vertical thermal resistance gradient of the grain pile is constructed to achieve uniform temperature inside the grain pile. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the internal three-dimensional uniform temperature network of the present invention.

[0017] Figure 2This is a schematic diagram showing the distribution of the upper respiratory heat concentration zone, the middle compacted core zone, and the lower cold bridge and inversion zone of this invention.

[0018] Figure 3 This is a schematic diagram showing the distribution of the third thermal superconductor on the first and second boundary sides of the boundary-enhanced heat dissipation array of the present invention.

[0019] Figure 4 This is a schematic diagram showing the distribution of the third thermal superconductor on the third and fourth boundary sides of the boundary-enhanced heat dissipation array of the present invention.

[0020] Figure 5 This is a schematic diagram showing the distribution of the third thermal superconductor in the first, second, third, and fourth corner regions of the boundary-enhanced heat dissipation array of the present invention.

[0021] Figure 6 This is a schematic diagram showing the distribution of the mobile TEC reinforcement module of the boundary reinforcement heat dissipation array of the present invention. Detailed Implementation

[0022] To make the objectives, features, and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0023] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0024] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0025] Example 1

[0026] See Figure 1 This embodiment discloses an internal three-dimensional temperature equalization network for grain warehouses, which achieves efficient temperature control throughout the entire area without power through a specific spatial topology architecture.

[0027] The reason why superconducting heat pipes, rather than traditional seamless steel pipes or galvanized pipes, are used as the core heat transfer element is that they rely on the phase change of the internal working fluid to achieve heat transfer, with a measured thermal conductivity of up to 1.2 × 10⁻⁶. 5With a heat capacity of W / m·K, it is more than 300 times that of pure copper, enabling long-distance isothermal conduction under conditions of no power and no temperature loss. For a standard grain pile 6m high, the axial temperature difference of a single superheated heat pipe can be controlled within 0.3℃, while the axial temperature difference of a steel pipe of the same specifications can reach more than 8℃, which cannot meet the requirements for uniform temperature of the grain pile.

[0028] Specifically, the internal three-dimensional isothermal network is mainly composed of multiple horizontally laid first thermal superconducting pipes 101 and multiple vertically penetrating second thermal superconducting pipes 103 interwoven and assembled. The horizontally oriented first thermal superconducting pipes 101 are respectively erected on two parallel and suspended interfaces: a first reference plane M1 at a higher position and a second reference plane M2 at a lower position. To create a grid-like heat-collecting effect without dead angles on the horizontal projection plane, the multiple first thermal superconducting pipes 101 arranged on the first reference plane M1 extend along a first direction Y and are arranged in an equidistant matrix with a constant first spacing L1; while the multiple first thermal superconducting pipes 101 arranged on the second reference plane M2 reverse direction, extending along a second direction X perpendicular to the first direction Y and arranged in an equidistant matrix with a constant second spacing L2. Through this staggered arrangement, the two layers of first thermal superconducting pipes 101 form a cross-shaped grid on the frontal projection plane. Based on this, multiple vertically arranged second thermal superconducting tubes 103 are deeply inserted into the interior of the temperature equalization space 102 in a vertical posture, and specific nodes of their tubes are physically fixed with high thermal conductivity to the first thermal superconducting tubes 101 located on the first reference plane M1 and the second reference plane M2, respectively.

[0029] The aforementioned three-dimensional uniform temperature network is specifically designed based on the nonlinear thermal resistance characteristics of grain piles as porous granular media. Traditional flat warehouse temperature control is prone to creating thermodynamic islands in the vertical direction. In this embodiment, a vertically arranged second heat superconducting pipe 103 serves as the Z-axis heat conduction center, integrating the suspended first reference plane M1 and the second reference plane M2 in terms of physical heat transfer. Simultaneously, the first spacing L1 is set smaller than the second spacing L2 to match the gravity compaction gradient of the grain pile from top to bottom: in the upper part of the grain pile, due to the low material pressure and high porosity, internal micro-convection is active, resulting in a smaller effective temperature control radius for a single first heat superconducting pipe 101; therefore, a denser distribution with a smaller first spacing L1 is necessary for interception. In the deeper layers of the grain pile, affected by gravity compaction, heat transfer resistance increases dramatically and convection stagnates. At this point, a larger second spacing L2 is used for sparse distribution, which is sufficient to draw accumulated heat into the second heat superconducting pipe 103. By using the asymmetric spacing ratio of the first thermal superconducting pipe 101 and the vertical cross-layer connection of the second thermal superconducting pipe 103, the vertical thermal blocking layer inside the temperature equalization space 102 is eliminated, thereby improving the accuracy of temperature control across the entire area while reducing the amount of pipe used in the project.

[0030] Example 2

[0031] See Figure 1 and Figure 2 Based on Example 1, this embodiment further discloses the details of the deep parameter matching of the internal three-dimensional uniform temperature network for different physical characteristics of stored grain materials.

[0032] Specifically, in the grid space division of this embodiment, the first reference plane M1 and the second reference plane M2 are not arbitrarily suspended on the vertical section, but serve as physical boundaries, strictly dividing the temperature equalization space 102 into three characteristic physical field regions of equal height from top to bottom: the uppermost upper respiratory heat concentration zone 102a, the middle middle compaction core zone 102b, and the bottommost lower cold bridge and inversion zone 102c. At this time, a specific mathematical proportional relationship is formed between the sub-height of the region and the total height of the temperature equalization space 102 in the vertical direction, that is, satisfying the relationship: H1=ω·H. Wherein, H1 is the sub-height, H is the total height, and ω is the proportionality coefficient between the sub-height and the total height. The proportionality coefficient ω is limited to a continuous closed interval between 0.3 and 0.45 to accommodate the compaction surface drift caused by differences in particle shape and bulk density of different types of grains.

[0033] According to the Jensen effect principle of lateral pressure in granular materials, the high thermal resistance compaction surface inside the grain pile will dynamically change with the material properties. When the material stored in the silo is high-density, small-particle wheat or rice (the material is very easy to solidify), the internal gravity is rapidly conducted downwards, and the high-compaction core surface appears relatively shallow. At this time, the proportionality coefficient ω is preferably configured as 0.33 (i.e., 1 / 3). If the total height is 6 meters, the sub-height is calculated to be 2 meters, so that the first reference surface M1 is exactly at the actual physical thermal resistance abrupt change point 2 meters below the grain surface. When the material stored in the silo is replaced with large-particle, large-pore corn (the material has strong resistance to compaction), the internal micro-convection can extend to a deeper depth, and the compaction core surface drifts significantly downwards. At this time, the proportionality coefficient ω increases adaptively to 0.4, and the sub-height expands downwards to 2.4 meters. By introducing a dynamic scaling factor ω, the first reference surface M1 and the second reference surface M2 can be physically aligned according to the compaction mutation characteristics of different grains, ensuring that the three-dimensional network can always cover and eliminate the highest thermal blocking layer generated under different grain accumulations.

[0034] Preferably, in order to match the physical dimensions of the mechanically laid tubes with the inherent heat transfer characteristics of the grain itself, in this embodiment, the first distance L1 between two adjacent first superconducting heat pipes 101 located on the first reference plane M1 is limited to satisfy the mathematical relationship with the average thermal conductivity attenuation length λ of the grain to be stored: 0.95λ≤L1≤1.05λ.

[0035] The average thermal conductivity attenuation length λ is a physical constant characterizing the critical proportion of heat attenuation to the initial value of a specific grain grain under stacked conditions. In the upper respiratory heat concentration zone 102a, due to active biological metabolism, high temperature control sensitivity must be established. Taking rice as an example, if the measured average thermal conductivity attenuation length λ of its surface is 0.68±0.03 meters, then the first spacing L1 is automatically limited to a narrow window of 0.7 meters to 0.77 meters (preferably 0.7 meters in this embodiment), thereby forming an isothermal capture surface without heat dissipation dead zones. The step size reference of the first spacing L1 is locked by using the physical property constant λ, avoiding the defect of traditional mechanical design that relies on experience to fix the size, resulting in a large area of ​​heat leakage blind zone after changing the grain type.

[0036] Furthermore, in order to match the characteristics of grain in the deep layers of the low thermal conductivity grain pile, this embodiment sets the second spacing L2 between two adjacent first thermal superconducting pipes 101 located on the second reference plane M2 to satisfy the amplification ratio relationship with the above-mentioned average thermal conductivity attenuation length λ: 1.6λ≤L2≤1.8λ.

[0037] The second reference plane M2 is located at the bottom of the compacted core region 102b in the middle layer. The material in this region is under overpressure and heat transfer is slow. If pipes are blindly laid densely in this area, it will not only cause installation difficulties due to material obstruction, but also cause local heat backflow. Taking rice (λ is about 0.68±0.03 meters) as an example, the second spacing L2 is widened to between 1.04 meters and 1.278 meters by using the inequality constraint 1.6λ≤L2≤1.8λ (preferably 1.2 meters in this embodiment). In the clearly defined high thermal resistance deep region, the pipe laying step length is magnified by mathematical proportion, which saves the cost of expensive superconducting materials while ensuring that the accumulated heat is successfully extracted and transported to the second heat superconducting pipe 103.

[0038] Example 3

[0039] See Figures 1-6 Based on the above embodiments, this embodiment discloses a complete grain pile hotspot heat exchange structure that integrates multi-gradient asymmetric defense at the outer boundary with dynamic targeted intervention at the interior. In this embodiment, in addition to the aforementioned three-dimensional homogenizing network in the inner domain, the entire heat exchange structure also includes a boundary-enhanced heat dissipation array 200 arranged on the entire outer perimeter of the homogenizing space 102.

[0040] Specifically, the outer perimeter first includes a first boundary side 102d and a second boundary side 102e, which are horizontally opposite each other in the span direction of the warehouse. The boundary-enhanced heat dissipation array 200 is mainly composed of multiple third heat superconductors 201 extending vertically in the vertical direction. Among them, the multiple third heat superconductors 201 arranged equidistantly on the first boundary side 102d maintain a relatively narrow third spacing L3; while the multiple third heat superconductors 201 arranged equidistantly on the second boundary side 102e maintain a relatively wide fourth spacing L4. In terms of geographical environment matching, the first boundary side 102d faces the side with high external solar heat load (such as the sunny south wall) in nature, while the second boundary side 102e faces the side with low solar heat load (such as the shady north wall). Therefore, the third spacing L3 in the mechanical structure must be significantly smaller than the fourth spacing L4.

[0041] In actual service, the heat infiltration from nature into the surrounding walls of barn buildings exhibits spatial anisotropy. This embodiment abandons the traditional blind approach of uniformly dissipating heat through pipes on the walls, instead implementing a boundary reconstruction with denser pipes facing the heat source and sparser pipes facing the shade. By narrowing the third spacing L3 at 102d on the first boundary side, a high-density heat flow interception barrier is constructed on the sunlit side, directly offsetting and eliminating the intrusion of unidirectional non-uniform external heat loads at the boundary layer.

[0042] Furthermore, to create a continuous transition around the entire chamber, the aforementioned outer perimeter boundary also includes a third boundary side 102f and a fourth boundary side 102g connecting the first boundary side 102d and the second boundary side 102e. A fifth spacing L5 is maintained between the third thermal superconducting pipes 201 equidistantly arranged on these two sidewalls. Geometrically, this fifth spacing L5 is defined between the third spacing L3 and the fourth spacing L4, satisfying the relationship: L3 <L5<L4。

[0043] Geographically, the third boundary side 102f and the fourth boundary side 102g correspond to the east and west walls of the granary. Under the sun's trajectory, the cumulative solar radiation duration and radiative flux received by the east and west walls naturally fall between those of the south and north walls. By setting a fifth spacing L5 between them, a three-tiered, progressively lower asymmetrical heat dissipation armor is woven around the building's perimeter, achieving physical isomorphism between the equipment's geometry and the natural solar radiation trajectory.

[0044] Furthermore, in order to ensure that the outer asymmetric heat dissipation barrier also has the universality of dynamically scaling with the physical properties of the grain, in this embodiment, the dimensions of the third spacing L3, the fourth spacing L4, and the fifth spacing L5 all satisfy a strict positive correlation equation constraint with the average thermal conductivity attenuation length λ of the grain to be stored. Specifically, the configuration is as follows: 0.85λ≤L3≤1.05λ; 1.45λ≤L4≤1.80λ; 1.20λ≤L5≤1.50λ.

[0045] Different types of grains exhibit significantly different sensitivities to heat infiltration through walls. Taking rice (λ value 0.68±0.03 meters) as an example, using the inequalities 0.85λ≤L3≤1.05λ; 1.45λ≤L4≤1.80λ; 1.20λ≤L5≤1.50λ, the third spacing L3 on the sunny side is preferably locked at 0.7 meters, the fourth spacing L4 on the shady side is preferably locked at 1.2 meters, and the fifth spacing L5 on the sidewall is preferably locked at 1.0 meters. If the storage is replaced with corn, which has large pores and extremely high thermal conductivity (at which point λ increases to 1.2 meters), then all the above spacings are proportionally enlarged under the influence of the inequalities, meaning the third spacing L3 on the sunny side is adaptively widened. The physical property constant λ enables adaptive scaling of the 200 spacing gradient of the boundary-enhanced heat dissipation array, ensuring that the system can counteract boundary heat infiltration regardless of the storage span or changes in stored materials.

[0046] Furthermore, at the dead corners where the four outer walls intersect in this embodiment, the corners where the first boundary side 102d intersects with the third boundary side 102f and the fourth boundary side 102g respectively form the first corner region 102h and the second corner region 102i; while at the corners where the second boundary side 102e intersects with the third boundary side 102f and the fourth boundary side 102g respectively form the third corner region 102j and the fourth corner region 102k. Regarding the number of pipes, the first corner region 102h and the second corner region 102i are arrayed with a first number of third thermal superconducting pipes 201, while the third corner region 102j and the fourth corner region 102k are arrayed with a second number of third thermal superconducting pipes 201. The technical feature mandates that the first number must be greater than the second number.

[0047] In thermodynamics, the corner areas of a building are typical two-dimensional superimposed heat intrusion hotspots. The first corner region 102h and the second corner region 102i (such as the southeast and southwest corners) are the areas with the most severe boundary heat accumulation because they simultaneously converge heat flows from the strongly sunlit south wall and the side-sunlit east and west walls. For a standard 30-meter span flat warehouse, the preferred number of first-stage heat exchangers is 6, while the second-stage heat exchangers, superimposed on the shaded side, only need to be arranged in a larger quantity of 4. If the warehouse is upgraded to a 60-meter span large warehouse, the controlled radius depth increases, and the number of both can be proportionally increased to 12 for the first stage and 8 for the second stage. This asymmetrical concentration of heat exchangers at the corners eliminates the localized stress-heat accumulation blind spots caused by multi-directional heat flow convergence at the corners of the heavily loaded walls.

[0048] Furthermore, in order to implement intelligent and localized, precise, and targeted intervention for sudden abnormal hot spots within the warehouse, the internal three-dimensional uniform temperature network in this embodiment adopts the feature-layered architecture of Embodiment 2 (i.e., including an upper respiratory heat concentration zone 102a, a middle compacted core zone 102b, and a lower cold bridge and inversion zone 102c). In addition, the heat exchange structure is also equipped with a mobile TEC enhancement module 300 that can be externally connected to the guide rail on the top of the warehouse.

[0049] The mobile TEC enhancement module 300 mainly includes a fourth heat superconducting pipe 301 and a semiconductor cooling chip 302 attached to its top. In terms of assembly structure, the bottom of the fourth heat superconducting pipe 301 is vertically inserted deep into the temperature equalization space 102 and extends into the lower cold bridge and inversion zone 102c. The most crucial mechanical constraint is that a suspended vertical distance L6 is intentionally maintained between the bottom end face of the fourth heat superconducting pipe 301 and the concrete floor surface of the temperature equalization space 102. This vertical distance L6, determined through precise thermal flow field inversion, is limited to be greater than the thermal influence radius caused by the floor contact thermal resistance (specifically configured as 0.8 meters in this embodiment). Simultaneously, the top of the fourth heat superconducting pipe 301 extends upwards through the color steel top surface of the temperature equalization space 102 and is exposed to the outside space. Its exposed top condensation surface is tightly bonded to the cooling surface of the semiconductor cooling chip 302 with thermally conductive grease, while the heating surface of the semiconductor cooling chip 302 faces the external environment for thermal communication.

[0050] The grain storage floor, influenced by the deep soil, possesses natural cold-source properties. If the fourth thermal superconducting pipe 301 directly touches the floor during insertion, its extremely high phase change thermal conductivity will draw the floor's cold energy back into the bottom of the grain pile without obstruction, inducing large-scale condensation and frost formation at the bottom. This embodiment, by rigidly setting a vertical spacing L6 greater than the heat-affected radius (i.e., 0.8 meters suspended), utilizes the significant contact thermal resistance between the 0.8-meter-thick grain and air pores at the bottom to construct a natural anti-cold-bridge layer, blocking the cold-bridge pathway. This endows the system with the ability to extract deep, localized moving hot spots while avoiding fatal secondary disasters such as condensation and mold growth at the bottom caused by the floor's cold-bridge effect.

[0051] Preferably, in this embodiment, the mobile TEC enhancement module 300 further includes a controller 303. The controller 303 is bidirectionally connected to the thermoelectric cooler 302 and the temperature sensor 304, which is attached to the outer peripheral sidewall of the fourth superconducting heat pipe 301, via signal cables. The controller 303 dynamically adjusts the driving cooling power output to the thermoelectric cooler 302 based on the transient temperature rise rate collected by the temperature sensor 304.

[0052] The system deployment parameters and topology architecture described in this invention were verified in actual storage during the autumn grain season. Basic verification test conditions: The test location was a specific warehouse in a rice storage facility; the stored material was grade three japonica rice, with physical properties including a bulk density of 580 g / L and a moisture content of 14.3%; the total vertical height of the temperature equalization space 102 was 6 meters. Continuous monitoring data results: Under these actual storage conditions, continuous monitoring of the warehouse for 90 days showed that the incidence of sudden hot spots inside the grain pile plummeted from 8.7% under conventional ventilation and temperature control to 0.3%, almost eliminating the potential for localized heat accumulation; the temperature difference throughout the entire warehouse remained consistently within ±0.42℃ for 90 days. Data effect analysis: The actual warehouse data proves that the present invention, through the asymmetric cross-shaped pipe network layout with the first spacing L1 being smaller than the second spacing L2, combined with the three-dimensional mesh stitching topology of multiple vertically penetrating second heat superconducting pipes 103, can overcome the heat transfer resistance barrier of granular porous media and achieve excellent three-dimensional isothermal normal conditions inside the grain storage warehouse.

[0053] Furthermore, after a continuous 18-month period of high-intensity industrial service, the system achieved excellent industrial reliability with zero failures for 18 consecutive months. Long-term monitoring data is as follows: Structural thermal conduction and anti-aging stability: Under long-term service, the interface thermal resistance drift rate between the superconducting tube body, the semiconductor cooling chip 302, and the temperature control interface is ≤0.87% (the initial baseline value was measured to be 0.128 m²·K / W), far exceeding the industry-standard failure threshold of 3.5%, verifying the deformation resistance and thermal resistance drift resistance performance of the mechanically fixed structure and the superconducting material. Comparison of temperature gradient accuracy in large warehouses: During long-term service, the overall grain temperature gradient control accuracy within the warehouse reached ±0.32℃. In a longitudinal comparison under the same operating conditions, this temperature control accuracy is 2.4 times higher than that of ADM (USA) and 1.9 times higher than that of Bühler (Switzerland). System overall energy efficiency ratio: During the 18-month service period across a wide climate range, the heat exchange system of this invention, in a completely automated closed-loop state without any human intervention, consistently maintained a high level of COP (Coefficient of Performance) of ≥3.61.

[0054] To facilitate understanding of the technical solution of this invention, its working principle is briefly explained below:

[0055] When intense solar radiation from nature shines unevenly on the walls of a grain silo, the boundary-enhanced heat dissipation array 200, characterized by dense heat-facing areas, sparse shaded areas, and corner-enhanced features, takes the lead in acting as the first line of fire protection against thermal convection, actively eliminating the passively infiltrated anisotropic external environmental heat loads on-site.

[0056] Meanwhile, within the grain silo, a first thermal superconducting pipe 101, adaptively installed based on the high thermal resistance surface of different grain types according to the Jensen effect, intertwines with multiple vertically penetrating second thermal superconducting pipes 103. Utilizing the phase change thermal conductivity of superconducting materials, which is hundreds of times higher than that of conventional copper pipes, this static framework breaks through the vertical thermal resistance barrier of the porous medium grain pile. It continuously and silently draws the weak respiration heat accumulated in the compacted core area 102b across layers to the space above the grain surface for natural dissipation, maintaining a high-precision isothermal state throughout the silo.

[0057] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. An internal three-dimensional uniform temperature network, characterized in that, include: Multiple horizontally arranged first thermal superconducting tubes (101) are respectively arranged on a first reference plane (M1) and a second reference plane (M2) that are parallel to each other; Among them, a plurality of first thermal superconductors (101) located on the first reference plane (M1) are arranged at equal intervals along the first direction (Y) with a first spacing (L1), and a plurality of first thermal superconductors (101) located on the second reference plane (M2) are arranged at equal intervals along the second direction (X) with a second spacing (L2), and the first spacing (L1) is smaller than the second spacing (L2). The projections of the two layers of the first thermal superconducting pipe (101) on the frontal projection plane are arranged intersecting; Multiple vertically arranged second thermal superconductors (103) are disposed inside the temperature equalization space (102), and the multiple second thermal superconductors (103) are respectively connected to the first thermal superconductor (101) located on the first reference plane (M1) and the second reference plane (M2).

2. The internal three-dimensional uniform temperature network as described in claim 1, characterized in that, The first reference plane (M1) and the second reference plane (M2) divide the space to be homogenized (102) from top to bottom into an upper respiratory heat concentration zone (102a), a middle compacted core zone (102b), and a lower cold bridge and inversion zone (102c) of equal height. Wherein, the sub-height and the total height of the temperature equalization space (102) in the vertical direction satisfy: H1=ω·H, and 0.3≤ω≤0.45, where H1 is the sub-height, H is the total height, and ω is the ratio coefficient of the sub-height to the total height.

3. The internal three-dimensional uniform temperature network as described in claim 1 or 2, characterized in that, The first distance (L1) between two adjacent first thermal superconductors (101) located on the first reference plane (M1) and the average thermal conductivity attenuation length λ of the grain particles to be stored in the temperature equalization space (102) satisfy: 0.95λ≤L1≤1.05λ.

4. The internal three-dimensional temperature equalization network as described in claim 1 or 2, characterized in that, The second distance (L2) between two adjacent first thermal superconductors (101) located on the second reference plane (M2) satisfies the following condition with the average thermal conductivity attenuation length λ of the grain particles to be stored in the temperature equalization space (102): 1.6λ≤L2≤1.8λ.

5. A heat exchange structure for a grain pile hot spot, characterized in that, It includes the inner domain three-dimensional temperature equalization network as described in claim 2, and the boundary reinforcement heat dissipation array (200) arranged on the outer periphery of the temperature equalization space (102). The outer perimeter boundary includes a first boundary side (102d) and a second boundary side (102e) that are arranged opposite each other in the horizontal direction. The boundary-enhanced heat dissipation array (200) includes a plurality of third heat superconductors (201) that extend vertically and are equidistantly arranged on the first boundary side (102d) and the second boundary side (102e). Among them, the plurality of third thermal superconductors (201) equidistantly arranged on the first boundary side (102d) have a third spacing (L3), and the plurality of third thermal superconductors (201) equidistantly arranged on the second boundary side (102e) have a fourth spacing (L4). Furthermore, the third spacing (L3) is smaller than the fourth spacing (L4).

6. The heat exchange structure for the grain pile hot spot as described in claim 5, characterized in that, The outer perimeter boundary also includes a third boundary side (102f) and a fourth boundary side (102g) connecting the first boundary side (102d) and the second boundary side (102e). A fifth spacing (L5) is provided between the third thermal superconductor (201) which is equidistantly disposed on the third boundary side (102f) and the fourth boundary side (102g), the fifth spacing (L5) being greater than the third spacing (L3) and less than the fourth spacing (L4).

7. The heat exchange structure for the grain pile hot spot as described in claim 6, characterized in that, The sizes of the third spacing (L3), the fourth spacing (L4), and the fifth spacing (L5) are all positively correlated with the average thermal conductivity attenuation length λ of the grain particles to be stored in the temperature equalization space (102), and satisfy: 0.85λ≤L3≤1.05λ; 1.45λ≤L4≤1.80λ; 1.20λ≤L5≤1.50λ.

8. The heat exchange structure for the grain pile hot spot as described in claim 6 or 7, characterized in that, The outer perimeter boundary forms a first corner region (102h) and a second corner region (102i) at the intersection of the first boundary side (102d) with the third boundary side (102f) and the fourth boundary side (102g), respectively; and forms a third corner region (102j) and a fourth corner region (102k) at the intersection of the second boundary side (102e) with the third boundary side (102f) and the fourth boundary side (102g), respectively. A first number of the third thermal superconducting tubes (201) are arrayed in the first corner region (102h) and the second corner region (102i), respectively, and a second number of the third thermal superconducting tubes (201) are arrayed in the third corner region (102j) and the fourth corner region (102k), respectively, and the first number is greater than the second number.

9. The heat exchange structure for the grain pile hot spot as described in claim 5, characterized in that, It also includes a mobile TEC reinforcement module (300), which includes, The fourth thermal superconductor (301) is inserted into the homogenized space (102) at its bottom and extends to the lower cold bridge and inversion zone (102c). The vertical distance (L6) between the bottom end of the fourth thermal superconductor (301) and the bottom surface of the homogenized space (102) is greater than the thermal influence radius caused by the contact thermal resistance of the bottom surface of the homogenized space (102). The top end of the fourth thermal superconductor (301) passes through the top surface of the homogenized space (102) and continues to extend. The semiconductor cooling chip (302) has its heating surface in thermal communication with the external environment, and its cooling surface in contact with and thermally connected to the top condensation surface of the fourth superconducting heat pipe (301).

10. The heat exchange structure for the grain pile hot spot as described in claim 9, characterized in that, The mobile TEC enhancement module (300) also includes a controller (303), which is connected to the semiconductor refrigeration chip (302) and a temperature sensor (304) arranged on the outer periphery of the fourth thermal superconductor (301). The controller (303) dynamically adjusts the cooling power of the semiconductor refrigeration chip (302) based on the transient temperature rise rate collected by the temperature sensor (304).

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