An encoder fault locating method, system, terminal and storage medium

Abstract

The application relates to an encoder fault positioning method, a system, a terminal and a storage medium, and relates to the field of engineering machinery.The method comprises the following steps: obtaining a pulse signal of a fault encoder in response to a detection signal sent by an encoder testing device; judging whether the pulse signal in a period is empty; if yes, determining that a fault point is located at a first fault position; if no, respectively counting actual pulse numbers of A and B phases; if the actual pulse number of the A phase is equal to a theoretical pulse number of the A phase, the actual pulse number of the B phase is equal to a theoretical pulse number of the B phase, and waveforms of the A-phase pulse signal and the B-phase pulse signal are all chaotic, determining that the fault point is located at a second fault position; if the actual pulse number of the A phase is less than the theoretical pulse number of the A phase or the actual pulse number of the B phase is less than the theoretical pulse number of the B phase, determining that the fault point is located at a third fault position; and generating a maintenance suggestion of the encoder according to the fault position.The application has the effects of improving fault positioning accuracy and guaranteeing fault positioning reliability.

Description

Technical Field

[0001] This application relates to the field of engineering machinery, and in particular to an encoder fault location method, system, terminal and storage medium. Background Technology

[0002] In industrial operation and maintenance systems, accurate encoder fault location is a key technical support for improving the accuracy and reliability of fault location.

[0003] In related technologies, when encoders fail in high temperature and high humidity environments, they are usually sent directly for manual repair, and the repair personnel rely solely on their experience to guess the cause of the failure.

[0004] Regarding the aforementioned technologies, when encoder malfunctions, there are issues with subjective diagnostic criteria and a single analytical dimension, leading to ambiguous fault location determination and unclear repair directions. Summary of the Invention

[0005] To improve the accuracy and reliability of fault location, this application provides an encoder fault location method, system, terminal, and storage medium.

[0006] Firstly, this application provides an encoder fault location method, which adopts the following technical solution: An encoder fault location method, comprising: In response to the detection signal sent by the encoder testing device, the pulse signal of the faulty encoder is acquired. The pulse signal includes the A-phase pulse signal, the B-phase pulse signal and the Z-phase pulse signal. Determine whether the pulse signal within the period is empty; If so, then the fault point is determined to be located at the first fault location; If not, then count the actual pulse count of phase A and the actual pulse count of phase B respectively; Compare the actual pulse count of phase A with the theoretical pulse count of phase A, and compare the actual pulse count of phase B with the theoretical pulse count of phase B; If the actual number of pulses in phase A is equal to the theoretical number of pulses in phase A, and the actual number of pulses in phase B is equal to the theoretical number of pulses in phase B, and the waveforms of both phase A and phase B pulse signals are disordered, then the fault point is determined to be located at the second fault location. If the actual number of pulses in phase A is less than the theoretical number of pulses in phase A, or the actual number of pulses in phase B is less than the theoretical number of pulses in phase B, then the fault point is determined to be located at the third fault location. Based on the location of the fault, a preset maintenance strategy library is invoked to generate maintenance suggestions.

[0007] By employing the above technical solution, the A-phase, B-phase, and Z-phase pulse signals of the encoder are analyzed. Combined with a pre-set fault feature library, the fault type is identified and the fault location is pinpointed. Simultaneously, corresponding handling solutions are matched from the maintenance strategy library, and maintenance suggestions are pushed out. This solution significantly improves the accuracy of fault location and reduces misjudgments and incorrect replacements.

[0008] Optionally, record the first missing angle coordinates of the A-phase pulse signal and the second missing angle coordinates of the B-phase pulse signal; Cluster the first missing angle coordinates and the second missing angle coordinates respectively to form a set of first missing angle intervals and a set of second missing angle intervals; Determine whether both the first missing angle interval set and the second missing angle interval set are not empty sets; If not, the fault point is determined to be located in the independent photoelectric sensing unit or signal conditioning circuit corresponding to the non-empty set; If so, compare the first set of missing angle intervals with the second set of missing angle intervals, and determine whether there are overlapping angle intervals; If it exists, the fault point is determined to be the encoder, and the fault point is located in the circumferential area corresponding to the overlapping angle interval; If not, it is determined that both the A-phase signal link and the B-phase signal link have independent local faults, and the fault points correspond to the photoelectric sensing units or signal conditioning circuits of their respective links.

[0009] By employing the above technical solution, the missing angle coordinates of phase A and phase B pulse signals are recorded. Cluster analysis is then used to identify the missing angle intervals, and the overlap between the missing intervals of the two phases is compared to determine the fault location. Simultaneously, a corresponding maintenance strategy is matched based on the determination results. This solution significantly improves the accuracy of distinguishing between code disk damage and independent optoelectronic link faults, reducing misjudgments.

[0010] Optionally, the center angle of each sub-interval in the first missing angle interval set is obtained to form the first center angle sequence; Obtain the center angle of each sub-interval in the second missing angle interval set to form the second center angle sequence; Sort the first center angle sequence and calculate the first angle interval between adjacent angles to obtain the first angle interval sequence; Sort the second center angle sequence and calculate the second angle interval between adjacent angles to obtain the second angle interval sequence; Determine whether each angular interval in the first angular interval sequence and the second angular interval sequence is periodic, and whether the first period length of the first angular interval sequence and the second period length of the second angular interval sequence are within a preset tolerance range. If so, the fault is located in the bearing or mounting base.

[0011] By employing the above technical solution, the center angles of the missing angle intervals of phase A and phase B are obtained. Combined with the sorting and adjacent angle interval calculations, periodic features are identified, and the consistency of the period lengths of the two-phase angle interval sequences is compared to determine the location of mechanical faults. Based on the determination results, the location is then pointed to the bearing or mounting base. This solution significantly improves the accuracy of identifying periodic mechanical faults and reduces the likelihood of misidentifying bearings or mounting bases as encoder or circuit faults.

[0012] Optionally, the first rise time and first fall time of each pulse signal in phase A pulse signal and the second rise time and second fall time of each pulse signal in phase B pulse signal are extracted. Calculate the first ratio sequence of the first rise time to the first fall time, and the second ratio sequence of the second rise time to the second fall time, respectively; Determine whether the first ratio sequence and the second ratio sequence are within the preset tolerance threshold and whether their changing trends are consistent; If not, the primary fault point is determined to be the common LED inside the encoder; If so, then check whether there is a level abnormality between the A-phase pulse signal and the B-phase pulse signal during the high-level or low-level period; If present, the fault is identified as the signal conditioning circuit.

[0013] By employing the above technical solution, the rise and fall times of the A-phase and B-phase pulse signals are extracted. The consistency of the ratio sequence is used to identify shared LED faults. Furthermore, when the ratios are consistent, high / low level anomalies are detected to pinpoint signal conditioning circuit problems. This solution significantly improves the accuracy of distinguishing between light source and circuit faults, reducing the likelihood of misidentifying shared LEDs as circuit faults.

[0014] Optionally, calculate the first ratio sequence and the second ratio sequence within N cycles, and simultaneously collect the encoder average rotation speed corresponding to N cycles, where N≥5; Periodic data with speed fluctuations exceeding the preset speed tolerance range are removed to obtain the first effective ratio sequence and the second effective ratio sequence; Calculate the correlation coefficient between the changes in the first effective ratio sequence and the second effective ratio sequence; Determine whether the correlation coefficient of the change is greater than the preset synchronization threshold; If so, the fault is determined to be located in the common LED inside the encoder; If not, calculate the first decay rate of the first effective ratio sequence and the second decay rate of the second effective ratio sequence respectively. If the first attenuation rate is greater than the second attenuation rate, the fault point is determined to be located in the independent photoelectric sensing path that generates the pulse signal corresponding to the first ratio sequence. If the second attenuation rate is greater than the first attenuation rate, the fault point is determined to be located in the independent photoelectric sensing path that generates the pulse signal corresponding to the second ratio sequence.

[0015] By employing the above technical solution, the A-comparison value sequence and the B-comparison value sequence are calculated, and the instantaneous encoder speed of the corresponding period is simultaneously acquired. Valid data is then filtered based on speed tolerance, and the correlation between the changes in the two comparison values ​​is analyzed. Furthermore, when asynchronous, the decay rate is compared to locate the fault path. This solution significantly improves the accuracy of distinguishing between aging of the shared LED and degradation of the independent photoelectric sensing path, reducing misjudgments caused by speed fluctuations.

[0016] Optionally, the environmental parameters and static status information of the fault encoder can be obtained. The environmental parameters include the outer surface temperature of the fault encoder and the relative humidity of the ambient air. Based on the preset thermal-humidity coupling model, the internal temperature of the code disk area inside the fault encoder and the dew point temperature of the cavity air are calculated. Determine if the internal temperature is below the dew point temperature; If so, calculate the condensation risk index; (the condensation risk index is the weighted product of (dew point temperature - internal temperature) and ambient humidity) Determine whether the condensation risk index exceeds the risk threshold; If so, initiate a drying process until the condensation risk index does not exceed the risk threshold.

[0017] By employing the above technical solution, the external surface temperature and relative humidity of the faulty encoder are obtained. Combined with model calculations of the internal temperature and dew point temperature, and a condensation risk index is used to determine whether to initiate a drying process. This solution significantly improves the accuracy of identifying condensation interference and reduces the likelihood of misjudging temporary signal anomalies caused by moisture as device damage.

[0018] Optionally, the target temperature and maximum allowable heating rate of the drying purge gas are determined based on the condensation risk index. The initial target temperature increases with the increase of the condensation risk index, but does not exceed the maximum safe temperature allowed by the encoder. Based on the external surface temperature and ambient air relative humidity, the temperature of the drying purge gas is controlled to rise to the target temperature at a rate not exceeding the maximum allowable heating rate, and the condensation risk index is updated. When the internal temperature is higher than the dew point temperature and the condensation risk index drops to the risk threshold, the temperature of the drying purge gas is stabilized at a level higher than the dew point temperature and maintained for a preset stabilization time. If the condensation risk index rises after maintaining the preset stable time, repeat the above three steps. If the condensation risk index is lower than the risk threshold after maintaining a preset stable time, the drying process is considered complete.

[0019] By adopting the above technical solution, the target temperature and maximum allowable heating rate of the drying purging gas are dynamically determined based on the condensation risk index. The purging process is then controlled in a closed loop based on real-time monitoring of the external surface temperature and ambient humidity. During the stable phase, the risk is continuously verified and automatically repeated until the target is met. This solution significantly improves the accuracy and safety of condensation removal, reducing damage or misjudgment caused by insufficient purging or overheating.

[0020] Secondly, this application provides an encoder fault location system, which adopts the following technical solution: An encoder fault location system, comprising: The acquisition module is used to acquire detection signals and pulse signals; A memory for storing the program of the encoder fault location method; The processor and the program in the memory can be loaded and executed by the processor to implement the encoder fault location method.

[0021] By adopting the above technical solution, the acquisition module collects the encoder's detection signal and pulse signal in real time, the processor executes the preset fault location logic, and the memory stores complete diagnostic rules and maintenance strategies. This realizes intelligent processing of the entire process from signal acquisition, environmental interference suppression, missing pattern recognition to fault location and maintenance suggestion generation. While ensuring the accuracy of positioning, it significantly improves maintenance efficiency and provides an efficient and reliable solution for intelligent operation and maintenance of industrial equipment.

[0022] Thirdly, this application provides a smart terminal, which adopts the following technical solution: A smart terminal includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as described above.

[0023] Fourthly, this application provides a computer storage medium capable of storing corresponding programs, which facilitates improving the accuracy and reliability of fault location, and adopts the following technical solution: A computer-readable storage medium storing a computer program that can be loaded by a processor and executed by any of the encoder fault location methods described above.

[0024] In summary, this application includes at least one of the following beneficial technical effects: 1. The algorithm analyzes the A-phase, B-phase, and Z-phase pulse signals of the encoder, identifies the fault type and locates the fault location by combining them with a preset fault feature library, and simultaneously matches the corresponding handling plan from the maintenance strategy library and pushes maintenance suggestions. This solution significantly improves the accuracy of fault location and reduces misjudgment and incorrect replacement. 2. Obtain the center angles of the missing angle intervals in phase A and phase B, calculate and identify periodic features by combining the sorting and adjacent angle intervals, and compare the consistency of the period lengths of the two phase angle interval sequences to determine the location of mechanical faults. Based on the determination results, the fault location is pointed to the bearing or mounting base. This scheme significantly improves the accuracy of identifying periodic mechanical faults and reduces the possibility of misidentifying bearings or mounting bases as encoder or circuit faults. 3. Calculate the A-comparison value sequence and the B-comparison value sequence, and synchronously acquire the encoder instantaneous speed of the corresponding period. Combine the speed tolerance to filter valid data, analyze the correlation of the changes in the two comparison values, and further compare the decay rate to locate the fault path when they are asynchronous. This scheme significantly improves the accuracy of distinguishing between the aging of the shared light-emitting diode and the degradation of the independent photoelectric sensing path, and reduces misjudgments caused by speed fluctuations. Attached Figure Description

[0025] Figure 1 This is a flowchart illustrating an encoder fault location method provided in an embodiment of this application.

[0026] Figure 2 This is a flowchart illustrating an encoder pulse missing fault location method provided in an embodiment of this application.

[0027] Figure 3 This is a flowchart illustrating an encoder mechanical fault location method provided in an embodiment of this application.

[0028] Figure 4 This is a flowchart illustrating a method for locating encoder light source and circuit faults according to an embodiment of this application.

[0029] Figure 5 This is a flowchart illustrating an encoder light source fault location method provided in an embodiment of this application.

[0030] Figure 6 This is a flowchart illustrating an encoder condensation state detection method provided in an embodiment of this application.

[0031] Figure 7 This is a flowchart illustrating an encoder drying control method provided in an embodiment of this application.

[0032] Figure 8 This is a schematic diagram of the structure of an encoder fault location system provided in an embodiment of this application. Detailed Implementation

[0033] To make the purpose, technical solution, and advantages of this application clearer, the following description is provided in conjunction with the appendix. Figures 1 to 8 The present application will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and are not intended to limit the scope of the application.

[0034] This application discloses an encoder fault location method. (Refer to...) Figure 1 The method includes: Step S101: In response to the detection signal sent by the encoder testing device, acquire the pulse signal of the faulty encoder. The pulse signal includes the A-phase pulse signal, the B-phase pulse signal and the Z-phase pulse signal.

[0035] An encoder testing device is a device that simulates the mechanical input acting on the encoder under actual working conditions, so that the faulty encoder outputs pulse signals in a state close to the real working condition, thereby realizing offline detection and diagnosis of the faulty encoder.

[0036] A faulty encoder refers to an encoder that has experienced signal abnormalities or functional failures during actual use, has been disassembled, and needs to be placed on an encoder testing device to continue detecting the fault location.

[0037] The pulse signal refers to the level transition signal output by the encoder during rotation. The A-phase pulse signal and the B-phase pulse signal are signals with a 90-degree phase difference, used for speed measurement and direction determination. The Z-phase is a zero-position reference signal that outputs one pulse per revolution.

[0038] Step S102: Determine whether the pulse signal within the period is empty.

[0039] The period refers to the signal acquisition time period corresponding to the encoder completing one mechanical rotation, which is usually defined by the time interval between two adjacent Z-phase index pulses.

[0040] Determining whether the pulse signal is empty within a cycle is to identify whether the encoder has a fault of no pulse signal output at all, thereby determining whether the encoder is in a state of overall failure.

[0041] Step S103: If yes, then the fault point is determined to be located at the first fault location.

[0042] The first fault location refers to a fault state in which there is no pulse signal output inside the encoder, mainly caused by damage to the detection laser head or failure of the light-emitting diode.

[0043] Step S104: If not, count the actual number of pulses in phase A and the actual number of pulses in phase B respectively.

[0044] The actual pulse count of phase A refers to the number of pulses obtained by counting the level transitions of the phase A pulse signal within one complete rotation cycle of the encoder.

[0045] The actual pulse count of phase B refers to the number of pulses obtained by counting the level transitions of the phase B pulse signal within one complete rotation cycle of the encoder.

[0046] Step S105: Compare the actual number of pulses in phase A with the theoretical number of pulses in phase A, and compare the actual number of pulses in phase B with the theoretical number of pulses in phase B.

[0047] Comparing the actual number of pulses with the theoretical number of pulses is to determine whether there is pulse loss during the encoder's rotation.

[0048] Step S106: If the actual number of pulses in phase A is equal to the theoretical number of pulses in phase A, and the actual number of pulses in phase B is equal to the theoretical number of pulses in phase B, and the waveforms of both phase A and phase B pulse signals are disordered, then the fault point is determined to be located at the second fault location.

[0049] The second fault location refers to a state where the encoder pulse count is complete but the waveform is distorted or unstable. This is usually caused by damage to the internal amplifier circuit, interference from the shielding wire, or poor grounding, which leads to signal distortion without causing pulse loss.

[0050] Step S107: If the actual number of pulses in phase A is less than the theoretical number of pulses in phase A or the actual number of pulses in phase B is less than the theoretical number of pulses in phase B, then the fault point is determined to be located at the third fault location.

[0051] The third fault location refers to the fault state of the encoder where the number of A-phase pulse signals or B-phase pulse signals is reduced due to cracks, dirt, or partial obstruction of the code disk.

[0052] Step S108: Based on the fault location, call the preset maintenance strategy library to generate maintenance suggestions.

[0053] Based on the determined first, second, or third fault location, the corresponding handling plan is retrieved from a pre-established maintenance strategy library, and targeted maintenance suggestions are generated to guide subsequent repair operations. These suggestions include a description of the fault location and recommended handling measures.

[0054] By employing the above technical solution, the A-phase, B-phase, and Z-phase pulse signals of the encoder are analyzed. Combined with a pre-set fault feature library, the fault type is identified and the fault location is pinpointed. Simultaneously, corresponding handling solutions are matched from the maintenance strategy library, and maintenance suggestions are pushed out. This solution significantly improves the accuracy of fault location and reduces misjudgments and incorrect replacements.

[0055] This application discloses a method for locating encoder pulse loss faults. (Refer to...) Figure 2 The method includes: Step S201: Record the first missing angle coordinates of the A-phase pulse signal and the second missing angle coordinates of the B-phase pulse signal.

[0056] The first missing angle coordinate refers to the angle position corresponding to the A-phase pulse signal that should have appeared but was not actually detected during the encoder rotation process. An angle coordinate system is set on the circumference of the encoder code disk, with the position where the Z-phase pulse signal appears as the reference starting point.

[0057] The second missing angle coordinate is defined in the same way as the first missing angle coordinate, the only difference being the corresponding pulse signal. It refers to the angle position corresponding to the B phase pulse signal that should have been output but is actually missing in the angular coordinate system of the encoder code disk circumference, with the position where the Z phase pulse signal appears as the reference starting point.

[0058] Step S202: Cluster the first missing angle coordinates and the second missing angle coordinates respectively to form the first missing angle interval set and the second missing angle interval set.

[0059] The first set of missing angle intervals refers to the set of several consecutive angle intervals formed by merging points with similar positions among all missing angle coordinates of the A-phase pulse signal.

[0060] The second set of missing angle intervals refers to a set of several consecutive angle intervals formed by merging points with similar positions among all missing angle coordinates of the B-phase pulse signal.

[0061] Clustering refers to merging adjacent missing angular coordinates in the same pulse signal into a continuous angular interval.

[0062] Step S203: Determine whether both the first missing angle interval set and the second missing angle interval set are not empty sets.

[0063] Determining whether both the first and second missing angle interval sets are not empty sets is to determine whether there is a missing pulse signal in phase A or phase B, thereby determining whether the fault only affects a single-phase signal link or involves both phase A and phase B pulse signals.

[0064] Step S204: If not, then determine that the fault point is located in the independent photoelectric sensing unit or signal conditioning circuit corresponding to the non-empty set.

[0065] Independent photoelectric sensing units refer to photoelectric signal acquisition paths for phase A pulse signals and phase B pulse signals, each with its own independent path.

[0066] In cases where only the A-phase pulse signal or only the B-phase pulse signal has a missing angle range, the fault is located to the independent photoelectric sensing unit or signal conditioning circuit corresponding to the pulse signal in the missing angle range, because the two-phase signal links are independent of each other in the receiving and subsequent processing parts.

[0067] Step S205: If yes, compare the first set of missing angle intervals and the second set of missing angle intervals, and determine whether there are overlapping angle intervals.

[0068] Determining whether two sets of missing angle intervals overlap is to distinguish whether the missing pulse signal is caused by a shared code disk fault or by independent local faults in phase A and phase B pulse signals.

[0069] Step S206: If it exists, the fault point is determined to be the encoder disk, and the fault point is located in the circumferential area corresponding to the overlapping angle interval.

[0070] The circumferential region refers to a physical arc segment on the encoder code disk that corresponds to the overlapping angle range. Scratches, stains, or damage in the circumferential region can cause both phase A and phase B pulse signals to lose pulses simultaneously at the same angular position.

[0071] Step S207: If not, it is determined that both the A-phase signal link and the B-phase signal link have independent local faults, and the fault points correspond to the photoelectric sensing unit or signal conditioning circuit of their respective links.

[0072] When the missing angle intervals of phase A pulse signal and phase B pulse signal do not overlap, it is determined that each of the two phase signal links has an independent local fault, and the fault point is located in the photoelectric sensing unit or signal conditioning circuit corresponding to phase A pulse signal or phase B pulse signal, respectively.

[0073] By employing the above technical solution, the missing angle coordinates of phase A and phase B pulse signals are recorded. Cluster analysis is then used to identify the missing angle intervals, and the overlap between the missing intervals of the two phases is compared to determine the fault location. Simultaneously, a corresponding maintenance strategy is matched based on the determination results. This solution significantly improves the accuracy of distinguishing between code disk damage and independent optoelectronic link faults, reducing misjudgments.

[0074] This application discloses a method for locating mechanical faults in an encoder. (Refer to...) Figure 3 The method includes: Step S301: Obtain the center angle of each sub-interval in the first missing angle interval set to form the first center angle sequence.

[0075] The center angle refers to the average of the starting and ending angles of a missing angle sub-interval, used to represent the representative position of the sub-interval on the circumference of the code disk.

[0076] The first central angle sequence refers to a set of angle values ​​composed of the central angles of each sub-interval in the first missing angle interval set.

[0077] The center angle of each sub-interval is obtained by calculating the average of the starting and ending angles of each sub-interval in the first set of missing angle intervals.

[0078] Step S302: Obtain the center angle of each sub-interval in the second missing angle interval set to form the second center angle sequence.

[0079] The calculation method for the center angle of each sub-interval in the second missing angle interval set is the same as that for the first missing angle interval, that is, the average value of the starting angle and the ending angle of each sub-interval is calculated, and the resulting center angles constitute the second center angle sequence.

[0080] Step S303: Sort the first center angle sequence and calculate the first angle interval between adjacent angles to obtain the first angle interval sequence.

[0081] The first angular interval refers to the difference between two adjacent central angles in the first central angle sequence.

[0082] The first angular interval sequence refers to the sequence consisting of the differences between adjacent angles in the first central angle.

[0083] Step S304: Sort the second center angle sequence and calculate the second angle interval between adjacent angles to obtain the second angle interval sequence.

[0084] The second angular interval refers to the difference between adjacent angles after the second central angle sequence is sorted. The second angular interval sequence is obtained in the same way as the first angular interval sequence, that is, it is a sequence composed of the differences between adjacent angles in the second central angle.

[0085] Step S305: Determine whether each angular interval in the first angular interval sequence and the second angular interval sequence exhibits periodicity, and whether the first period length of the first angular interval sequence and the second period length of the second angular interval sequence are within a preset tolerance range.

[0086] This is used to determine whether the pulse loss of phase A and phase B pulse signals repeats with the same or similar period during rotation, thereby identifying whether there is periodic interference caused by mechanical structure.

[0087] Step S306: If so, the fault is located in the bearing or mounting base.

[0088] When both the first angular interval sequence and the second angular interval sequence exhibit a fixed periodicity, and the difference between the first period length and the second period length is within the preset tolerance range, it indicates that the pulse signal loss of phase A pulse signal and phase B pulse signal repeats with a basically consistent period. This synchronous periodicity characteristic points to the encoder being affected by the mechanical structure as a whole, and the fault point is usually located in the bearing or mounting base.

[0089] By employing the above technical solution, the center angles of the missing angle intervals of phase A and phase B are obtained. Combined with the sorting and adjacent angle interval calculations, periodic features are identified, and the consistency of the period lengths of the two-phase angle interval sequences is compared to determine the location of mechanical faults. Based on the determination results, the location is then pointed to the bearing or mounting base. This solution significantly improves the accuracy of identifying periodic mechanical faults and reduces the likelihood of misidentifying bearings or mounting bases as encoder or circuit faults.

[0090] This application discloses a method for locating encoder light source and circuit faults. (Refer to...) Figure 4 The method includes: Step S401: Extract the first rise time and first fall time of each pulse signal in phase A pulse signal and the second rise time and second fall time of each pulse signal in phase B pulse signal.

[0091] The first rise time refers to the time it takes for the A-phase pulse signal to rise from a low level to a high level.

[0092] The first fall time refers to the time it takes for the A-phase pulse signal to fall from a high level to a low level.

[0093] The second rise time refers to the time it takes for the B-phase pulse signal to rise from a low level to a high level.

[0094] The second fall time refers to the time it takes for the B-phase pulse signal to fall from a high level to a low level.

[0095] Based on the displayed waveform, the rise time is defined as the horizontal time span between the 10% amplitude point and the 90% amplitude point of each pulse signal, and the fall time is defined as the horizontal time span between the 90% amplitude point and the 10% amplitude point. The rise time and fall time of each pulse signal are then read and recorded.

[0096] Step S402: Calculate the first ratio sequence of the first rise time to the first fall time, and the second ratio sequence of the second rise time to the second fall time, respectively.

[0097] The first ratio sequence refers to the sequence composed of the ratios of the first rise time to the first fall time of each pulse signal in phase A pulse signal, arranged in order.

[0098] The second ratio sequence refers to the sequence formed by the ratios of the second rise time to the second fall time of each pulse signal in the B-phase pulse signal.

[0099] Step S403: Determine whether the first ratio sequence and the second ratio sequence are within the preset tolerance threshold and whether their changing trends are consistent.

[0100] Determine whether the rise time to fall time ratios of both phase A and phase B pulse signals fall within a preset tolerance range and change synchronously, in order to distinguish whether the fault originates from a shared light source or subsequent circuitry.

[0101] Step S404: If not, the main fault point is determined to be the common LED inside the encoder.

[0102] The dominant fault point refers to the component most likely to cause abnormality under the current fault characteristics. In this case, it means that due to aging, the common light-emitting diode is more likely to cause the rise-fall time ratio of the A-phase pulse signal and the B-phase pulse signal to deviate from the normal range and the trend of change is inconsistent.

[0103] Step S405: If yes, then detect whether there is a level abnormality in the A-phase pulse signal and the B-phase pulse signal during the high-level or low-level period.

[0104] Assuming the first and second ratio sequences are normal and have consistent trends, further check whether there are voltage deviations, fluctuations, glitches, or other abnormal level phenomena in the A-phase pulse signal and B-phase pulse signal during the high-level or low-level maintenance period.

[0105] Step S406: If it exists, the fault point is determined to be the signal conditioning circuit.

[0106] If there are abnormal levels in the A-phase pulse signal and the B-phase pulse signal during the high-level or low-level period, if the high-level amplitude is too low, it is usually due to insufficient power supply to the signal conditioning circuit; if there are glitches or multiple jumps in the signal, it is mostly caused by external electromagnetic interference or poor grounding; if the pulse waveform is distorted into a non-rectangular shape, it is commonly due to internal faults in the signal conditioning circuit, such as failure of the shaping circuit or comparator misalignment.

[0107] By employing the above technical solution, the rise and fall times of the A-phase and B-phase pulse signals are extracted. The consistency of the ratio sequence is used to identify shared LED faults. Furthermore, when the ratios are consistent, high / low level anomalies are detected to pinpoint signal conditioning circuit problems. This solution significantly improves the accuracy of distinguishing between light source and circuit faults, reducing the likelihood of misidentifying shared LEDs as circuit faults.

[0108] This application discloses a method for locating encoder light source faults. (Refer to...) Figure 5 The method includes: Step S501: Calculate the first ratio sequence and the second ratio sequence within N cycles, and simultaneously collect the encoder average rotation speed corresponding to N cycles, where N≥5.

[0109] Average speed refers to the average speed of the encoder within a single rotation cycle, calculated based on the time interval between two adjacent Z-phase pulse signals.

[0110] Setting N≥5 is to ensure that the collected data has sufficient statistical representativeness, avoid misjudgment due to interference or fluctuation in individual periods, and improve the reliability of fault diagnosis.

[0111] Step S502: Remove periodic data whose speed fluctuations exceed the preset speed tolerance range to obtain the first effective ratio sequence and the second effective ratio sequence.

[0112] The first effective ratio sequence refers to the sequence formed by excluding cycles where the rotational speed exceeds the preset tolerance range, and then arranging the ratios of the rise time and fall time of the A-phase pulse signal in the remaining cycles in their original order.

[0113] The second effective ratio sequence refers to the sequence formed by excluding cycles where the rotational speed exceeds the preset tolerance range, and then arranging the ratios of the rise time and fall time of the B-phase pulse signal in the remaining cycles in their original order.

[0114] Step S503: Calculate the correlation coefficient between the changes in the first effective ratio sequence and the second effective ratio sequence.

[0115] The correlation coefficient is used to measure the consistency between the first effective ratio sequence and the second effective ratio sequence in terms of periodic change trends. The closer the correlation coefficient is to 1, the more synchronous the changes of the two sequences are.

[0116] The correlation coefficient is calculated as follows: After calculating the mean of both sequences, substitute it into the formula: ,in, The mean of the first effective ratio sequence, The second effective ratio sequence is the mean. For example, in 5 effective periods of an encoder, the A ratio sequence is [0.90, 0.88, 0.86, 0.84, 0.82] and the B ratio sequence is [0.91, 0.89, 0.87, 0.85, 0.83]. The calculated correlation coefficient is approximately 0.999, indicating that the degradation of the two phase signals is highly synchronized.

[0117] Step S504: Determine whether the correlation coefficient of the change is greater than the preset synchronization threshold.

[0118] By determining whether the correlation coefficient exceeds a preset synchronization threshold, it is possible to determine whether the degradation trend of the ratio sequence of phase A pulse signal and phase B pulse signal is sufficiently consistent, thereby distinguishing whether the fault is caused by a shared light source or by their respective independent paths.

[0119] Step S505: If yes, then the fault point is determined to be the common LED inside the encoder.

[0120] When the changes in the two ratio sequences are highly synchronized, it indicates that the signal degradation is caused by a shared light source. Therefore, the fault point is determined to be the shared LED inside the encoder.

[0121] Step S506: If not, calculate the first decay rate of the first effective ratio sequence and the second decay rate of the second effective ratio sequence respectively.

[0122] The first decay rate refers to the average rate at which the ratios in the first effective ratio sequence decrease as the number of periods increases.

[0123] The second decay rate refers to the average rate at which the ratios in the second effective ratio sequence decrease as the number of periods increases.

[0124] Using the period number as the independent variable and the ratio of the corresponding period in the first effective ratio sequence as the dependent variable, a univariate linear regression is performed to fit a straight line. The slope of this line is the first decay rate. Similarly, the same process is performed with the ratios of the second effective ratio sequence, and the resulting slope is the second decay rate. For example, for an encoder with 6 effective periods, the first effective ratio sequence is [0.92, 0.89, 0.86, 0.83, 0.80, 0.77], corresponding to period numbers 1 to 6. The fitted equation after linear regression is y = −0.03x + 0.95, with a slope of -0.03, so the first decay rate is 0.03. If the second effective ratio sequence is [0.91, 0.90, 0.89, 0.88, 0.87, 0.86], with a fitted slope of -0.01, then the second decay rate is 0.01.

[0125] Step S507: If the first attenuation rate is greater than the second attenuation rate, then the fault point is determined to be located in the independent photoelectric sensing path that generates the pulse signal corresponding to the first ratio sequence.

[0126] When the first attenuation rate is greater than the second attenuation rate, it indicates that the waveform distortion of the A-phase pulse signal is faster, and the corresponding independent photoelectric sensing path has more significant aging or contamination. Therefore, it is determined that the fault point is located in the independent photoelectric sensing path that generates the A-phase pulse signal.

[0127] Step S508: If the second attenuation rate is greater than the first attenuation rate, then the fault point is determined to be located in the independent photoelectric sensing path that generates the pulse signal corresponding to the second ratio sequence.

[0128] When the first attenuation rate is greater than the second attenuation rate, it indicates that the waveform distortion of the B-phase pulse signal is faster, and the corresponding independent photoelectric sensing path has more significant aging or contamination. Therefore, it is determined that the fault point is located in the independent photoelectric sensing path that generates the B-phase pulse signal.

[0129] By employing the above technical solution, a first ratio sequence is calculated, and the instantaneous encoder speed of the corresponding period is simultaneously acquired. Valid data is then filtered using speed tolerance, and the correlation between the changes in the two ratio sequences is analyzed. Furthermore, when asynchronous, the decay rate is compared to locate the fault path. This solution significantly improves the accuracy of distinguishing between aging of the shared LED and degradation of the independent photoelectric sensing path, reducing misjudgments caused by speed fluctuations.

[0130] This application discloses a method for detecting condensation state of an encoder. (Refer to...) Figure 6 The method includes: Step S601: Obtain the environmental parameters and static status information of the fault encoder. The environmental parameters include the outer surface temperature of the fault encoder and the relative humidity of the ambient air.

[0131] Environmental parameters refer to physical quantities in the external environment of the fault encoder that can affect the internal state of the fault encoder. Among them, the relative humidity of the ambient air is the ratio of the actual water vapor content in the air in the environment where the fault encoder is located to the maximum amount of water vapor that the air can hold at the current temperature, expressed as a percentage.

[0132] The static state information refers to the downtime from when the encoder stops running due to a fault until the time when environmental parameters are collected.

[0133] Environmental parameters are obtained directly through temperature and humidity sensors, and the shutdown duration is determined by obtaining the time difference between the fault encoder shutdown time and the current detection time.

[0134] The blowing device includes a fan and a drying module. The drying module is arranged on the air outlet side of the fan so that the blowing airflow passes through the drying module before entering the fault encoder, thereby reducing its moisture content.

[0135] Step S602: Based on the preset thermal-humidity coupling model, calculate the internal temperature of the code disk area inside the fault encoder and the dew point temperature of the cavity air.

[0136] The thermal-humidity coupling model refers to the estimation of the internal temperature of the internal code disk area based on the temperature of the encoder's outer surface and the relative humidity of the ambient air. This model is trained using a large amount of experimental data.

[0137] Internal temperature refers to the actual temperature of the area where the code disk is located inside the encoder's sealed cavity, which is calculated from the outer shell temperature and ambient humidity using a thermal-humidity coupling model.

[0138] Dew point temperature refers to the temperature at which air begins to condense into liquid water under current humidity conditions. First, calculate the actual partial pressure of water vapor at that temperature using a formula for saturated vapor pressure, such as the Magnus formula. Then, deduce the saturation temperature corresponding to that partial pressure and use the Magnus formula to calculate the saturated vapor pressure at a given temperature: e s (T) = 6.1049 × exp(17.625 / T + 243.04), where e s (T) represents the saturated vapor pressure at temperature T, 6.1049 represents the baseline value of the saturated vapor pressure at 0°C, and 17.625 and 243.04 are empirical coefficients of the Magnus formula; substituting into the Magnus formula: Where e is the actual water vapor pressure, which is obtained by multiplying the saturated water vapor pressure by the relative humidity of the ambient air; T d This is the dew point temperature.

[0139] For example, the measured temperature of the faulty encoder housing is 20.0°C and the relative humidity of the ambient air is 80%. The temperature of its internal code disk area is estimated to be 18.5°C using a thermal-humidity coupling model. Based on the internal temperature and the relative humidity of the ambient air, the actual water vapor pressure of the air inside the cavity is calculated, and the dew point temperature is further calculated to be approximately 14.8°C.

[0140] Step S603: Determine whether the internal temperature is lower than the dew point temperature.

[0141] Determine whether the internal temperature of the code disk area within the sealed cavity of the faulty encoder has dropped below the dew point, thereby identifying whether the internal environment is in a state where water vapor may condense.

[0142] Step S604: If so, calculate the condensation risk index.

[0143] The condensation risk index is an indicator used to quantify the probability of condensation inside a faulty encoder. Its value is the weighted product of the difference between the dew point temperature and the internal temperature and the relative humidity of the ambient air.

[0144] For example, when the measured internal temperature is 15.0°C, the dew point temperature is 17.2°C, and the relative humidity of the ambient air is 85%, the temperature difference is 2.2°C. The condensation risk index is calculated as (17.2−15.0)×0.85, and the result is 1.87.

[0145] Step S605: Determine whether the condensation risk index exceeds the risk threshold.

[0146] The calculated condensation risk index is compared with the preset risk threshold to determine whether there is a high condensation risk inside the fault encoder that requires intervention.

[0147] Step S606: If so, start the drying process until the condensation risk index does not exceed the risk threshold.

[0148] When the condensation risk index exceeds the risk threshold, a drying process is initiated, and the faulty encoder is continuously blew until the condensation risk index falls back below the risk threshold.

[0149] If the condensation risk index does not exceed the risk threshold, there is no need to start the drying process. Instead, the subsequent pulse signal analysis and processing will be performed in response to the detection signal sent by the encoder testing device.

[0150] By employing the above technical solution, the external surface temperature and relative humidity of the faulty encoder are obtained. Combined with model calculations of the internal temperature and dew point temperature, and a condensation risk index is used to determine whether to initiate a drying process. This solution significantly improves the accuracy of identifying condensation interference and reduces the likelihood of misjudging temporary signal anomalies caused by moisture as device damage.

[0151] This application discloses an encoder drying control method. (Refer to...) Figure 7 The method includes: Step S701: Based on the condensation risk index, determine the target temperature and maximum allowable heating rate of the drying purge gas. The target temperature increases with the increase of the condensation risk index, but does not exceed the maximum safe temperature allowed by the fault encoder.

[0152] The target temperature refers to the set temperature that the drying and purging gas needs to reach. It is used to effectively eliminate condensation without damaging the faulty encoder. The target temperature value increases with the condensation risk index, but does not exceed the maximum safe temperature allowed by the faulty encoder.

[0153] The maximum permissible heating rate refers to the highest possible increase in temperature of the drying and purging gas per unit time, used to prevent damage to the internal structure of the encoder due to excessively rapid temperature rise.

[0154] The target temperature and maximum allowable heating rate are a set of control parameters pre-set for each risk level by conducting temperature rise tests on encoders of the same type under different condensation risk indices, recording the internal temperature changes and structural stability performance of the encoder, and combining them with the manufacturer's specified maximum safe temperature, while ensuring that thermal damage is not caused.

[0155] Step S702: Based on the external surface temperature and ambient air relative humidity, control the temperature of the drying purge gas to rise to the target temperature at a rate not exceeding the maximum allowable heating rate, and update the condensation risk index.

[0156] Based on the real-time measured surface temperature of the fault encoder and the relative humidity of the environment, the temperature of the drying and purging gas is controlled to gradually rise to the target temperature at a slope not exceeding the maximum allowable heating rate, and the condensation risk index is continuously updated during the heating process to reflect the current changes in the condensation risk index.

[0157] Step S703: When the internal temperature is higher than the dew point temperature and the condensation risk index drops to the risk threshold, stabilize the temperature of the drying purge gas at a level higher than the dew point temperature and maintain it for a preset stabilization time.

[0158] After confirming that the internal temperature is higher than the dew point temperature and the condensation risk index has dropped to a safe range, the temperature of the drying purging gas is maintained at a level slightly higher than the dew point temperature, and purging is continued for a preset period of time to ensure that condensation is completely eliminated and to prevent short-term rebound.

[0159] Step S704: If the condensation risk index rises after maintaining the preset stable time, repeat the above three steps.

[0160] If the condensation risk index rises after the preset stabilization time, the entire process from determining the target temperature to stabilizing the purging will be repeated to deal with the increased condensation risk caused by repeated humidity or environmental disturbances.

[0161] Step S705: If the condensation risk index is lower than the risk threshold after maintaining a preset stable time, the drying process is deemed complete.

[0162] If the condensation risk index is lower than the risk threshold after the preset stabilization time, it is determined that the condensation inside the faulty encoder has been eliminated and the drying process is completed.

[0163] By adopting the above technical solution, the target temperature and maximum allowable heating rate of the drying purging gas are dynamically determined based on the condensation risk index. The purging process is then controlled in a closed loop based on real-time monitoring of the external surface temperature and ambient humidity. During the stable phase, the risk is continuously verified and automatically repeated until the target is met. This solution significantly improves the accuracy and safety of condensation removal, reducing damage or misjudgment caused by insufficient purging or overheating.

[0164] Based on the same inventive concept, embodiments of this application provide an encoder fault location system, referencing... Figure 8 The system includes: Acquisition module 801 is used to acquire detection signals and pulse signals; The memory 802 is used to store the program of the encoder fault location method; The processor 803 can load and execute the program in the memory to implement the encoder fault location method.

[0165] By adopting the above technical solution, the acquisition module collects the encoder's detection signal and pulse signal in real time, the processor executes the preset fault location logic, and the memory stores complete diagnostic rules and maintenance strategies. This realizes intelligent processing of the entire process from signal acquisition, environmental interference suppression, missing pattern recognition to fault location and maintenance suggestion generation. While ensuring the accuracy of positioning, it significantly improves maintenance efficiency and provides an efficient and reliable solution for intelligent operation and maintenance of industrial equipment.

[0166] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0167] This application provides a computer-readable storage medium storing a computer program that can be loaded by a processor and executed as an encoder fault location method.

[0168] Computer storage media include, for example, USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, optical disks, and other media that can store program code.

[0169] Based on the same inventive concept, embodiments of this application provide a smart terminal, including a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as an encoder fault location method.

[0170] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0171] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Any feature disclosed in this specification (including the abstract and drawings) may be replaced by other equivalent or similar features unless specifically stated otherwise. That is, unless specifically stated otherwise, each feature is only one example of a series of equivalent or similar features.

Claims

1. A method for encoder fault location, characterized in that, include: In response to the detection signal sent by the encoder testing device, the pulse signal of the faulty encoder is acquired. The pulse signal includes the A-phase pulse signal, the B-phase pulse signal and the Z-phase pulse signal. Determine whether the pulse signal within the period is empty; If so, the fault point is determined to be located at the first fault location; If not, then count the actual pulse count of phase A and the actual pulse count of phase B respectively; Compare the actual pulse count of phase A with the theoretical pulse count of phase A, and compare the actual pulse count of phase B with the theoretical pulse count of phase B; If the actual number of pulses in phase A is equal to the theoretical number of pulses in phase A, and the actual number of pulses in phase B is equal to the theoretical number of pulses in phase B, and the waveforms of both phase A and phase B pulse signals are disordered, then the fault point is determined to be located at the second fault location. If the actual number of pulses in phase A is less than the theoretical number of pulses in phase A, or the actual number of pulses in phase B is less than the theoretical number of pulses in phase B, then the fault point is determined to be located at the third fault location. Based on the location of the fault, a preset maintenance strategy library is invoked to generate maintenance suggestions.

2. The encoder fault location method according to claim 1, characterized in that, If the actual number of pulses in phase A or phase B is less than the theoretical number of pulses corresponding to the actual number of pulses in phase A or phase B, the following applies: Record the first missing angle coordinates of the A-phase pulse signal and the second missing angle coordinates of the B-phase pulse signal; Cluster the first missing angle coordinates and the second missing angle coordinates respectively to form a set of first missing angle intervals and a set of second missing angle intervals; Determine whether both the first missing angle interval set and the second missing angle interval set are not empty sets; If not, the fault point is determined to be located in the independent photoelectric sensing unit or signal conditioning circuit corresponding to the non-empty set; If so, compare the first set of missing angle intervals with the second set of missing angle intervals, and determine whether there are overlapping angle intervals; If it exists, the fault point is determined to be the encoder, and the fault point is located in the circumferential area corresponding to the overlapping angle interval; If not, it is determined that both the A-phase signal link and the B-phase signal link have independent local faults, and the fault points correspond to the photoelectric sensing units or signal conditioning circuits of their respective links.

3. The encoder fault location method according to claim 2, characterized in that, Following the non-overlapping angle intervals, the following are included: Obtain the center angle of each sub-interval in the first set of missing angle intervals to form the first center angle sequence; Obtain the center angle of each sub-interval in the second missing angle interval set to form the second center angle sequence; Sort the first center angle sequence and calculate the first angle interval between adjacent angles to obtain the first angle interval sequence; Sort the second center angle sequence and calculate the second angle interval between adjacent angles to obtain the second angle interval sequence; Determine whether each angular interval in the first angular interval sequence and the second angular interval sequence is periodic, and whether the first period length of the first angular interval sequence and the second period length of the second angular interval sequence are within a preset tolerance range. If so, the fault is located in the bearing or mounting base.

4. The encoder fault location method according to claim 1, characterized in that, If the actual number of pulses in phase A equals the theoretical number of pulses in phase A, and the actual number of pulses in phase B equals the theoretical number of pulses in phase B, and the waveforms of both phase A and phase B pulse signals are disordered, then the following applies: Extract the first rise time and first fall time of each pulse signal in phase A pulse signal, and the second rise time and second fall time of each pulse signal in phase B pulse signal; Calculate the first ratio sequence of the first rise time to the first fall time, and the second ratio sequence of the second rise time to the second fall time, respectively; Determine whether the first ratio sequence and the second ratio sequence are within the preset tolerance threshold and whether their changing trends are consistent; If not, the primary fault point is determined to be the common LED inside the encoder; If so, then check whether there is a level abnormality between the A-phase pulse signal and the B-phase pulse signal during the high-level or low-level period; If present, the fault is identified as the signal conditioning circuit.

5. The encoder fault location method according to claim 4, characterized in that, Before determining that the primary fault point is the LED inside the encoder, the process includes: Calculate the first ratio sequence and the second ratio sequence within N cycles, and simultaneously collect the average encoder speed corresponding to N cycles, where N≥5; Periodic data with speed fluctuations exceeding the preset speed tolerance range are removed to obtain the first effective ratio sequence and the second effective ratio sequence; Calculate the correlation coefficient between the changes in the first effective ratio sequence and the second effective ratio sequence; Determine whether the correlation coefficient of the change is greater than the preset synchronization threshold; If so, the fault is determined to be located in the common LED inside the encoder; If not, calculate the first decay rate of the first effective ratio sequence and the second decay rate of the second effective ratio sequence respectively. If the first attenuation rate is greater than the second attenuation rate, the fault point is determined to be located in the independent photoelectric sensing path that generates the pulse signal corresponding to the first ratio sequence. If the second attenuation rate is greater than the first attenuation rate, the fault point is determined to be located in the independent photoelectric sensing path that generates the pulse signal corresponding to the second ratio sequence.

6. The encoder fault location method according to claim 1, characterized in that, The blower is integrated into the encoder testing device; Before acquiring the pulse signal of the faulty encoder within a period in response to the detection signal sent by the encoder testing device, the method further includes: Acquire the environmental parameters and static status information of the fault encoder. The environmental parameters include the outer surface temperature of the fault encoder and the relative humidity of the ambient air. Based on the preset thermal-humidity coupling model, the internal temperature of the code disk area inside the fault encoder and the dew point temperature of the cavity air are calculated. Determine if the internal temperature is below the dew point temperature; If so, calculate the condensation risk index; Determine whether the condensation risk index exceeds the risk threshold; If so, initiate a drying process until the condensation risk index does not exceed the risk threshold.

7. The encoder fault location method according to claim 6, characterized in that, The initiation of the drying process includes: Based on the condensation risk index, the target temperature and maximum allowable heating rate of the drying purge gas are determined. The target temperature increases with the increase of the condensation risk index, but does not exceed the maximum safe temperature allowed by the fault encoder. Based on the external surface temperature and ambient air relative humidity, the temperature of the drying purge gas is controlled to rise to the target temperature at a rate not exceeding the maximum allowable heating rate, and the condensation risk index is updated. When the internal temperature is higher than the dew point temperature and the condensation risk index drops to the risk threshold, the temperature of the drying purge gas is stabilized at a level higher than the dew point temperature and maintained for a preset stabilization time. If the condensation risk index rises after maintaining the preset stable time, repeat the above three steps. If the condensation risk index is lower than the risk threshold after maintaining a preset stable time, the drying process is considered complete.

8. An encoder fault location system, characterized in that, The system is used to perform the encoder fault location method as described in any one of claims 1 to 7, including: The acquisition module is used to acquire detection signals and pulse signals; A memory for storing the program of the encoder fault location method; The processor and the program in the memory can be loaded and executed by the processor to implement the encoder fault location method.

9. A smart terminal, characterized in that, It includes a memory and a processor, wherein the memory stores a computer program that can be loaded by the processor and executed as described in any one of claims 1 to 7.

10. A computer-readable storage medium, characterized in that, The computer program is stored that can be loaded by a processor and execute the method as described in any one of claims 1 to 7.

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