Sensor package based on a surface acoustic wave device

Abstract

A surface acoustic wave device-based sensor package is provided. The surface acoustic wave device-based sensor package includes a substrate; and a sensor disposed on one face of the substrate, wherein the sensor includes a die including a device disposition face connected to the one face of the substrate by at least one solder; and a plurality of IDT electrodes disposed in parallel on the device disposition face opposite the one face of the substrate, at least a portion of a surface of which is formed with a sensing film.

Description

Technical Field

[0001] The present invention relates to a sensor package based on a surface acoustic wave device, and more specifically, to a sensor package comprising a sensor based on a surface acoustic wave device, which detects a specific substance by converting changes in the state of acoustic waves propagating along the sensor surface into electrical signals. Background Technology

[0002] Surface acoustic waves (SAWs) are waves that propagate along the surface of an elastic solid. Their energy is concentrated near the surface, and they are classified as mechanical waves. SAW devices are electromechanical devices that utilize the interaction between SAWs and conduction electrons, taking advantage of the SAW propagating on the surface of a piezoelectric crystal. These SAW devices have a wide range of industrial applications, such as sensors, oscillators, and filters. They can be miniaturized and lightweight, and offer advantages such as robustness, stability, sensitivity, low cost, and real-time performance.

[0003] In particular, a sensor based on surface acoustic wave devices has recently been introduced, which forms a sensing membrane (e.g., containing biomolecules such as antibodies and enzymes) on the surface of IDT (Interdigital Transducer) electrodes that reacts with specific substances such as viruses and toxic substances, and is able to detect these substances. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a sensor package including a sensor based on a surface acoustic wave device, which detects a specific substance by converting the state change of an acoustic wave propagating along the sensor surface into an electrical signal.

[0005] The technical issues of this invention are not limited to those described above, and those skilled in the art can clearly understand other technical issues not mentioned in the following description.

[0006] To address the aforementioned technical challenges, a sensor package based on a surface acoustic wave (SAW) device according to an embodiment of the present invention includes: a substrate; and a sensor disposed on one side of the substrate, wherein the sensor includes: a die including a device arrangement surface connected to one side of the substrate by at least one solder; and a plurality of IDT electrodes disposed parallel to the device arrangement surface and opposite to one side of the substrate, and at least a portion of the surface of the electrode having a sensing film formed thereon.

[0007] In some embodiments of the present invention, the sensor may include a test solution injection gap formed between the die and the substrate by the solder.

[0008] In some embodiments of the present invention, when a test solution is dropped onto one side of the substrate, the test solution can move through the test solution injection gap by means of capillary action and come into contact with the plurality of IDT electrodes.

[0009] In some embodiments of the present invention, the substrate may include a through-hole that penetrates the substrate and overlaps with the sensor in the vertical direction.

[0010] In some embodiments of the present invention, the through-hole is empty, so when the test solution is dropped onto the opposite side of one side of the substrate, i.e., the other side, the test solution can move through the through-hole to the test solution injection gap by means of capillary action.

[0011] In some embodiments of the present invention, the sensor can measure the frequency changes caused by the detection object contained in the test solution attaching to the plurality of IDT electrodes.

[0012] To address the aforementioned technical challenges, a sensor package based on a surface acoustic wave (SAW) device according to other embodiments of the present invention includes: a substrate; and a first sensor and a second sensor disposed on one side of the substrate, wherein the first sensor includes: a first die including a device arrangement surface connected to one side of the substrate by at least one first solder; and a plurality of first IDT electrodes disposed parallel to the device arrangement surface and opposite to one side of the substrate, with at least a portion of their surfaces having a first sensing film formed thereon; and the second sensor includes: a second die including a device arrangement surface connected to one side of the substrate by at least one second solder; and a plurality of second IDT electrodes disposed parallel to the device arrangement surface and opposite to one side of the substrate, with at least a portion of their surfaces having a second sensing film of a different type than the first sensing film.

[0013] In some embodiments of the present invention, the first sensor may include a first test solution injection gap formed between the first die and the substrate by the first solder, and the second sensor may include a second test solution injection gap formed between the second die and the substrate by the second solder.

[0014] In some embodiments of the present invention, when a test solution is dropped onto a test area defined on one side of the substrate, the test solution can move to the first and second test solution injection gaps respectively by means of capillary action and contact the plurality of first and second IDT electrodes respectively.

[0015] In some embodiments of the present invention, the test area may be located between the first sensor and the second sensor.

[0016] In some embodiments of the present invention, the substrate may include: a first through-hole that penetrates the substrate and overlaps with the first sensor in a vertical direction; and a second through-hole that penetrates the substrate and overlaps with the second sensor in a vertical direction.

[0017] In some embodiments of the present invention, the interiors of the first and second through holes are empty, so when the test solution is dropped onto the opposite side of one side of the substrate, i.e. the other side, the test solution can move through the first and second through holes by means of capillary action and move to the first and second test solution injection gaps respectively.

[0018] In some embodiments of the invention, the other side of the substrate may be exposed to the outside for the drop of the test solution, and the first and second bare wafers may be located on the bottom surface.

[0019] In some embodiments of the present invention, the first and second sensors can measure the frequency changes caused by the detection object contained in the test solution attaching to the plurality of first and second IDT electrodes.

[0020] Specific details of other embodiments are included in the detailed description and accompanying drawings.

[0021] According to embodiments of the present invention, a sensor package based on a surface acoustic wave device can detect a detection object by measuring the frequency change generated when the detection object in the test solution attaches to multiple IDT electrodes.

[0022] The sensor package of this invention, because the sensor is bonded to the substrate via flip-chip bonding, can better avoid durability issues that may result from exposed IDT electrodes. In this case, to allow the test solution to reach the unexposed IDT electrodes, a method is used to move the test solution into the gap formed by the solder using capillary action.

[0023] Furthermore, by injecting the coating liquid used to form the sensing film through the through-holes formed on the substrate, damage to the sensing film that may be caused by the reflow soldering process can be eliminated.

[0024] The effects of the present invention are not limited to those described above, and those skilled in the art can clearly understand other effects not mentioned from the description in the claims. Attached Figure Description

[0025] Figure 1 This is a diagram of a sensor package based on a surface acoustic wave device according to some embodiments of the present invention.

[0026] Figure 2 It is along Figure 1 A sectional view cut off by line A-A'.

[0027] Figure 3 It is used for explanation Figure 1 and Figure 2 The diagram shows the detection process using a test solution in the sensor packaging based on a surface acoustic wave device.

[0028] Figure 4 This is a diagram of a sensor package based on a surface acoustic wave device according to other embodiments of the present invention.

[0029] Figure 5 It is along Figure 4 A sectional view cut off by line A-A'.

[0030] Figure 6 It is used for explanation Figure 4 and Figure 5 The diagram shows the process of injecting coating liquid and test solution into the sensor package based on surface acoustic wave devices.

[0031] Figure 7 This is a diagram of a sensor package based on a surface acoustic wave device according to some embodiments of the present invention.

[0032] Figure 8 It is along Figure 7 A sectional view cut off by line A-A'.

[0033] Figure 9 It is used for explanation Figure 7 and Figure 8 The diagram shows the process of injecting coating liquid and test solution into the sensor package based on surface acoustic wave devices.

[0034] Figure 10 This is a flowchart illustrating a manufacturing method for a sensor package based on a surface acoustic wave device according to an embodiment of the present invention.

[0035] Label Explanation 1, 2, 3: Sensor Packaging Based on Surface Acoustic Wave Devices 10: Test solution 11: Coating solution 100: Substrate; 111: Test area 200, 400: Sensors; 210, 410: Raw wafers 220, 420: Device layout surfaces; 230, 430: Test solution injection gaps 250, 450: Solder; 260, 270, 460, 470: Through-hole 300, 500: Multiple IDT electrodes Detailed Implementation

[0036] The advantages, features, and implementation methods of this invention will be explained by reference to the appendix. Figure 1The embodiments described in detail below become clear. However, the invention is not limited to the embodiments disclosed below, but can be implemented in various different forms. These embodiments are only used to complete the disclosure of the invention and to fully convey the scope of the invention to those skilled in the art, to which the invention pertains, as defined only by the scope of the claims. Throughout the specification, the same reference numerals refer to the same constituent elements.

[0037] When a component is referred to as "connected to" or "coupled to" another component, this includes cases where it is directly connected to or coupled to another component, as well as cases where there are other components in between. Conversely, when a component is referred to as "directly connected to" or "directly coupled to" another component, this means that there are no other components in between. "And / or" includes each of the items mentioned, as well as all combinations of more than one.

[0038] The terminology used in this specification is for descriptive purposes only and is not intended to limit the invention. In this specification, the singular form includes the plural form unless specifically mentioned herein. The use of the terms "comprising" and / or "including" in this specification to refer to constituent elements, steps, operations, and / or devices does not exclude the presence or addition of one or more other constituent elements, steps, operations, and / or devices.

[0039] Although terms such as "first" and "second" can be used to describe various constituent elements, these constituent elements are certainly not limited to these terms. These terms are only used to distinguish one constituent element from another. Therefore, the first constituent element mentioned below can certainly also be a second constituent element within the scope of the technical concept of this invention.

[0040] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) are to be understood in the sense commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms defined in commonly used dictionaries should not be idealized or over-interpreted unless explicitly defined.

[0041] Figure 1 This is a diagram of a sensor package based on a surface acoustic wave device according to some embodiments of the present invention. Figure 2 It is along Figure 1 A sectional view cut off by line A-A'. Figure 3 It is used for explanation Figure 1 and Figure 2 The diagram shows the detection process using a test solution in the sensor packaging based on a surface acoustic wave device.

[0042] First refer to Figure 1 and Figure 2According to an embodiment of the present invention, the sensor package 1 based on a surface acoustic wave device may include a substrate 100 and a first sensor 200.

[0043] The substrate 100 supports the first sensor 200 and may include a lead frame, a PCB (Printed Circuit Board), etc. Additionally, although... Figure 1 Although not shown, peripheral circuits and / or semiconductor chips electrically connected to the first sensor 200 may be additionally arranged on the substrate 100.

[0044] A mounting area for the first sensor 200 can be defined on one side 110 of the substrate 100. That is, the mounting area is the area where the first sensor 200 overlaps with one side 110 of the substrate in the third direction Z.

[0045] The first sensor 200 may include a surface acoustic wave (SAW)-based biosensor. Specifically, the first sensor 200 may be a sensor comprising a plurality of independent thermal oscillators (IDTs) 300 disposed on a device arrangement surface 220 and opposite one side 110 of a substrate, and detecting a target substance by measuring the frequency change generated by a sensing membrane attached to the plurality of IDTs 300 by a target substance contained in a test solution. The test solution may include bodily fluids collected from the human body, and the target substance may include antigens such as viruses, drugs, and pathogens, or antibodies produced by the human body in response to them.

[0046] Multiple IDT electrodes 300 may include input-side IDT electrodes and output-side IDT electrodes, which extend along a first direction X and are spaced apart from each other in a second direction Y on a piezoelectric substrate. In some embodiments of the invention, at least a portion of the surface of the multiple IDT electrodes 300 may be formed with a sensing membrane. The sensing membrane may, for example, contain an antigen (when the target being detected contains an antibody) or an antibody (when the target being detected contains an antigen) to facilitate antigen-antibody binding. In some embodiments, the antigen or antibody contained in the sensing membrane may be immobilized on the surface of the multiple IDT electrodes 300 using BSA (Bovine Serum Albumin) or similar substances.

[0047] The surfaces of the multiple IDT electrodes 300 may contain a metal, such as gold (Au), that is easy to form a sensing film.

[0048] exist Figure 1 In the above, the number of multiple IDT electrodes 300 included in the first sensor 200 is simplified for ease of explanation, but the actual number of multiple IDT electrodes 300 can reach tens to hundreds.

[0049] Multiple IDT electrodes 300 can be arranged on the die 210. The die 210 may include a piezoelectric substrate such as LiTaO3 (LT) or LiNbO3 (LN), or single-crystal quartz, for propagating surface acoustic waves generated by the multiple IDT electrodes 300. In addition, it may include at least one of the following stacked structures: a high-velocity acoustic layer with a propagation speed faster than the surface acoustic wave propagating through the piezoelectric substrate, a low-velocity acoustic layer with a propagation speed slower, and a support substrate supporting them.

[0050] The first sensor 200 can be bonded to one side 110 of the substrate 100 via solder 250 using flip-chip bonding. Therefore, the external exposure of the multiple IDT electrodes 300 arranged on the die 210 can be minimized.

[0051] Solder 250 can mechanically and electrically connect the first sensor 200 and the substrate 100.

[0052] The solder 250 formed by the SMT (Surface Mount Technology) process has a thickness of tens to hundreds of micrometers, thus forming a space with a certain gap between the first sensor 200 and the substrate 100. In this specification, this space between the first sensor 200 and the substrate 100 is defined as the test solution injection gap 230.

[0053] The test solution injection gap 230 can have a gap of tens to hundreds of micrometers similar to the thickness of the solder 250, which can correspond to the vertical distance between the device arrangement surface 220 of the die 210 and one side 110 of the substrate 100.

[0054] Regarding the test solution injection gap 230 and the test method using it, it will be combined with Figure 3 Further explanation is required.

[0055] Figure 3 This is a diagram illustrating the test solution injection and detection method in a sensor package based on a surface acoustic wave device according to some embodiments of the present invention.

[0056] refer to Figure 3 In the sensor package 1 based on surface acoustic wave device in this embodiment of the invention, the test solution injection gap 230 can become the path for the test solution 10, which is the object of detection, to move.

[0057] Specifically, the test solution injection gap 230 can be a path through which the test solution 10, dropped onto one side 110 of the substrate 100, particularly on the test area 111 defined adjacent to the sensor 200, moves by capillary action to contact the multiple IDT electrodes 300 on the device arrangement surface 220. That is, the thickness of the test solution injection gap 230 is formed to be tens to hundreds of micrometers, small enough to generate capillary action, and the test solution 10 can be drawn into the test solution injection gap 230 and contact the multiple IDT electrodes 300 without additional means of guiding its movement.

[0058] Therefore, in order to allow the movement of the test solution 10, the test solution injection gap 230 can be retained as a cavity without the need for separate bottom filling.

[0059] If the test solution 10 contains antigens or antibodies related to the target being tested, they will bind to the antibodies or antigens on the sensing membrane formed on the surfaces of the multiple IDT electrodes 300, which manifests as frequency changes and can be sensed by the first sensor 200.

[0060] According to an embodiment of the present invention, the sensor package 1 based on a surface acoustic wave device mounts a first sensor 200 on a substrate 100 via flip-chip bonding, thereby minimizing the exposure of multiple IDT electrodes 300 coated with a sensing film sensitive to external environmental conditions. Furthermore, to provide test solution 10 to the multiple IDT electrodes 300 isolated from the outside, the capillary effect of the test solution injection gap 230 generated by the solder 250 allows the injected test solution to contact the multiple IDT electrodes 300 without the need for additional means of providing test solution 10.

[0061] Figure 4 This is a diagram of a sensor package based on a surface acoustic wave device according to other embodiments of the present invention. Figure 5 It is along Figure 4 A sectional view cut off by line A-A'. Figure 6 It is used for explanation Figure 4 and Figure 5 The diagram shows the process of injecting coating liquid and test solution into the sensor package based on surface acoustic wave devices.

[0062] refer to Figure 4 and Figure 5 According to an embodiment of the present invention, the sensor package 2 based on a surface acoustic wave device is characterized in that it includes holes, namely through holes 260 and 460, that enable the substrate 100 to communicate with the outside.

[0063] Specifically, a via 260 may be formed on the substrate 100 at a position overlapping with the sensor 200 in the third direction Z. The via 260 preferably overlaps with a plurality of IDT electrodes 300 in the third direction Z and is formed at a position that does not overlap with the solder 250.

[0064] In the sensor package 1 and 2 based on surface acoustic wave device of the present invention, in order to form a sensing film on the surface of multiple IDT electrodes 300, after the coating liquid containing antigen or antibody arrives at the surface of multiple IDT electrodes 300, it is necessary to allow the antigen or antibody to adhere to the surface of multiple IDT electrodes 300 for a certain period of time.

[0065] However, as mentioned earlier, when the sensor 200 is attached to the substrate 100 via SMT process, a reflow soldering process for fixing the solder 250 must be performed. Since the reflow soldering process is carried out at temperatures of up to 200 to 250 degrees Celsius, the sensing film containing various proteins may be damaged during the SMT process.

[0066] Therefore, the sensing film formed on the surface of the multiple IDT electrodes 300 needs to be formed after the sensor 200 and the substrate 100 are connected. The coating liquid is injected through the through hole 260 of the substrate 100 to reach the surface of the multiple IDT electrodes 300.

[0067] The via 260 can be formed with a diameter of tens to hundreds of micrometers, penetrating the substrate 100 and being hollow inside. Therefore, the space between the substrate 100 and the sensor 200, i.e. the test solution injection gap 230, can be connected to the outside of the package 2 through the via 260.

[0068] refer to Figure 6 This diagram illustrates the process of drop-feeding the coating solution 11 into the through-hole 260 and allowing it to reach the surfaces of multiple IDT electrodes 300. For ease of understanding, Figure 6 yes Figure 5 A portion of it is shown upside down.

[0069] When the coating solution 11 is dropped onto the via 260 on the substrate 100, due to the capillary action generated by the via 260, the coating solution 11 will enter the test solution injection gap 230 along the via 260 and diffuse inside the test solution injection gap 230, thereby contacting the multiple IDT electrodes 300. Subsequently, when the coating solution 11 dries, a sensing film containing antigens or antibodies can be formed on the surface of the multiple IDT electrodes 300.

[0070] The test solution can be like Figure 3As in the example, after being dropped into the test area 111, the solution moves along the test solution injection gap 230. The test solution can react with the sensing membrane on the surface of the multiple IDT electrodes 300 within the test solution injection gap 230. If it adheres to the sensing membrane and antigen-antibody binding occurs, the sensor 200 can sense the frequency change of the surface acoustic wave.

[0071] On the other hand, the sensor package 2 based on surface acoustic wave device according to an embodiment of the present invention may include a plurality of sensors 200, 400 connected to the substrate 100.

[0072] The first sensor 200 and the second sensor 400 can be arranged on the substrate 100 and spaced apart by the test area 111. The second sensor 400 may include a plurality of IDT electrodes 500 arranged on the device placement surface 420 of the die 410, and can form a test solution injection gap 430 due to being connected to the substrate 100 by solder 450.

[0073] exist Figure 4 The diagram shows a total of four sensors, including a first sensor 200 and a second sensor 400, arranged around the test area 111 on the substrate 100. However, the invention is not limited to this; the number of sensors arranged on the substrate 100 may vary depending on the type of object to be detected during a single test solution injection, such as a virus, bacteria, or drug. Figure 4 As shown, if four sensors are arranged around the test area 111, it may correspond to a sensor package designed to detect a total of four detection objects by a single injection of test solution.

[0074] The arrangement of sensors around test area 111 can vary depending on the number of sensors. If n sensors are arranged around test area 111, an imaginary n-sided polygon can be formed around test area 111, with one sensor placed on each side of the n-sided polygon. If only two sensors are arranged, they can be arranged in parallel on both sides of test area 111.

[0075] like Figure 4 As shown, if four sensors are arranged, the test area 111 can, for example, have a rectangular or square shape with a width and length of several millimeters. Of course, the width and length of the test area 111 can vary depending on the size of the sensors 200 and 400. In the test area 111, the surface of the substrate 100, where no individual circuit elements are arranged, can be exposed.

[0076] When the test solution is dropped into the test area 111, the test solution can move along the test solution injection gaps 230 and 430 contained in the first sensor 200 and the second sensor 400 arranged around the test area 111, respectively.

[0077] Different types of sensing films can be formed on the surfaces of the multiple first IDT electrodes 300 and the multiple second IDT electrodes 500. Here, different types of sensing films refer to sensing films with different antigens or antibodies attached for detecting different target objects. Therefore, during the manufacturing process of the sensor package 2, different sensing films can be formed by injecting different coating liquids into each through-hole 260, 460.

[0078] As mentioned earlier, during the testing of the target object, a test solution is added once to the test area 111, and different sensors 200 and 400 are tested simultaneously.

[0079] Figure 7 This is a diagram of a sensor package based on a surface acoustic wave device according to some embodiments of the present invention. Figure 8 It is along Figure 7 A sectional view cut off by line A-A'. Figure 9 It is used for explanation Figure 7 and Figure 8 The diagram shows the process of injecting coating liquid and test solution into the sensor package based on surface acoustic wave devices.

[0080] refer to Figure 7 and Figure 8 According to further embodiments of the present invention, the sensor package 3 based on a surface acoustic wave device may have the same characteristics as described above. Figures 4 to 6 The sensor package described herein has different sensor arrangement structures, and the injection methods of the coating liquid and test solution can be different.

[0081] In particular, in the sensor package 3 based on surface acoustic wave devices of this embodiment, the other side of the substrate 100, i.e., the side not opposite to the sensor 200, is exposed to the outside, and detection is performed by dripping a test solution onto a test area 112 defined on the other side. That is, when the product is installed into a housing or the like, the substrate 100 is on top, while the sensors 200 and 400 are in contact with the bottom surface of the corresponding housing, thereby preventing the bare chips 210 and 410 of the sensors from being exposed to the outside, thus improving product reliability.

[0082] As shown, there is no aforementioned test area 111 between the first sensor 200 and the second sensor 400. Therefore, the first sensor 200 and the second sensor 400 can be separated only by a small gap for separating circuit elements.

[0083] Through holes 270 and 470 corresponding to each sensor 200 and 400 are formed on the substrate 100. As shown in the previous embodiment, the through holes 270 and 470 penetrate the substrate 100 and overlap with the sensors 200 and 400, preferably with the multiple IDT electrodes 300 and 500 in the third direction Z, and are formed at a position that does not overlap with the solder 250 and 450.

[0084] refer to Figure 9 In the sensor package 3 based on surface acoustic wave (SAW) devices according to this embodiment, both the coating liquid 11 and the test solution 12 can move through the through-hole 270. That is, during the manufacturing process of the sensor package 3, the coating liquid 11 is injected through the through-hole 270, and the coating liquid 11 moves along the test solution injection gap 230 to reach the surface of the multiple IDT electrodes 300. At this time, different coating liquids are injected through the through-holes 270 and 470 for different sensors 200 and 400, so that different types of sensing films can be formed, which is the same as in the previous embodiment.

[0085] During the detection process, test solution 12 is dripped into test area 112 and can move along through hole 270 and test solution injection gap 230. As shown in the figure, when four different sensors are arranged, the four sensors can simultaneously detect different objects with one drop of test solution.

[0086] The sensor package 3 can contain n sensors. The arrangement of the n sensors is different from that described above. There is no need to consider the test area where the test solution is added. Therefore, the sensors can be arranged as densely as possible according to their size.

[0087] The vias 270 and 470 corresponding to each sensor can also be formed overlapping with the sensor in the third direction Z, but they need to be clustered and formed at the position corresponding to the test area 112 on the other side of the substrate.

[0088] On the other hand, in other embodiments of the present invention, with Figure 7 Alternatively, a single sensor (e.g., 200) may be formed on the substrate 100. In this case, the sensor 200 and the die 210 are located below, and the coating liquid for forming the sensing film and the test solution can be injected through the through-hole 270 formed on the substrate 100.

[0089] Figure 10 This is a flowchart illustrating a sensor packaging manufacturing method based on a surface acoustic wave device according to an embodiment of the present invention.

[0090] refer to Figure 10 According to an embodiment of the present invention, a method for manufacturing a sensor package based on a surface acoustic wave device may include: a step of loading a substrate; a step of coating solder on a mounting area of ​​the substrate and arranging a sensor; a step of soldering the sensor onto the substrate by a reflow soldering process; and a step of injecting a coating liquid through a via of the substrate to form a sensing film on an IDT electrode; and a step of injecting a coating liquid through a via of the substrate to form a sensing film on an IDT electrode.

[0091] From the substrate loading step to the soldering steps S110~S130, the process can be carried out according to commonly known SMT processes.

[0092] In step S140, the step of forming a sensing film on at least a portion of the plurality of IDT electrodes is performed. For example... Figure 6 and Figure 9 As shown, a coating liquid for forming a sensing film can be injected through vias 260 and 270 on the substrate 100 at positions overlapping with sensors 200 and 400. This method improves durability without exposing the multiple IDT electrodes 300 of the flip-chip bonded sensor 200 to the outside, and prevents heat-induced damage to the sensing film by forming the sensing film after the reflow soldering process.

[0093] Although embodiments of the invention have been described above with reference to the accompanying drawings, those skilled in the art will understand that the invention can be implemented in other specific forms without altering its technical concept or essential characteristics. Therefore, the above embodiments should be understood as exemplary and not restrictive in all respects.

Claims

1. A sensor package based on a surface acoustic wave device, characterized in that, include: substrate; as well as Sensors arranged on one side of the substrate, The sensor includes: A bare die, comprising a device arrangement surface connected to one side of the substrate by at least one solder; as well as Multiple IDT electrodes are arranged in parallel on the device arrangement surface and opposite one side of the substrate, and at least a portion of their surfaces are formed with a sensing film.

2. The sensor packaging based on surface acoustic wave devices according to claim 1, characterized in that, The sensor includes a test solution injection gap formed between the die and the substrate by the solder.

3. The sensor packaging based on surface acoustic wave devices according to claim 2, characterized in that, When the test solution is dropped onto one side of the substrate, the test solution moves through the test solution injection gap by means of capillary action and comes into contact with the plurality of IDT electrodes.

4. The sensor packaging based on surface acoustic wave devices according to claim 2, characterized in that, The substrate includes a through-hole that penetrates the substrate and overlaps with the sensor in the vertical direction.

5. The sensor packaging based on a surface acoustic wave device according to claim 4, characterized in that, The through-hole is hollow, so when the test solution is dropped onto the opposite side of one side of the substrate, i.e., the other side, the test solution moves through the through-hole to the test solution injection gap by means of capillary action.

6. The sensor packaging based on surface acoustic wave devices according to claim 1, characterized in that, The sensor measures the frequency changes caused by the detection object in the test solution attaching to the plurality of IDT electrodes.

7. A sensor package based on a surface acoustic wave device, characterized in that, include: substrate; as well as A first sensor and a second sensor are arranged on one side of the substrate. The first sensor includes: A first die, comprising a device arrangement surface connected to one side of the substrate via at least one first solder; and A plurality of first IDT electrodes are arranged in parallel on the device arrangement surface and opposite one side of the substrate, and at least a portion of their surfaces are formed with a first sensing film. Furthermore, the second sensor includes: The second die includes a device arrangement surface connected to one side of the substrate via at least one second solder; and A plurality of second IDT electrodes are arranged in parallel on the device arrangement surface and opposite one side of the substrate, and at least a portion of their surfaces are formed with a second sensing film of a different type than the first sensing film.

8. The sensor packaging based on a surface acoustic wave device according to claim 7, characterized in that, The first sensor includes a first test solution injection gap formed between the first die and the substrate by the first solder, and The second sensor includes a second test solution injection gap formed between the second die and the substrate by the second solder.

9. The sensor packaging based on a surface acoustic wave device according to claim 8, characterized in that, When the test solution is dropped onto a test area defined on one side of the substrate, the test solution moves to the first and second test solution injection gaps by means of capillary action and comes into contact with the plurality of first and second IDT electrodes respectively.

10. The sensor packaging based on a surface acoustic wave device according to claim 9, characterized in that, The test area is located between the first sensor and the second sensor.

11. The sensor packaging based on a surface acoustic wave device according to claim 8, characterized in that, The substrate includes: A first through-hole penetrates the substrate and overlaps with the first sensor in the vertical direction; and The second through-hole penetrates the substrate and overlaps with the second sensor in the vertical direction.

12. The sensor packaging based on a surface acoustic wave device according to claim 11, characterized in that, The first and second through holes are hollow, so when the test solution is dropped onto the opposite side of one side of the substrate, i.e. the other side, the test solution moves through the first and second through holes by means of capillary action and moves to the first and second test solution injection gaps respectively.

13. The sensor packaging based on a surface acoustic wave device according to claim 12, characterized in that, The other side of the substrate is exposed to the outside for the test solution to be dropped on, and the first and second bare wafers are located on the bottom surface.

14. The sensor packaging based on a surface acoustic wave device according to claim 7, characterized in that, The first and second sensors measure the frequency changes produced when the detection object contained in the test solution attaches to the plurality of first and second IDT electrodes.

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