Test system for cabinets

Abstract

A test system for a cabinet is provided. The test system includes a plurality of analog loads, a switch, and a management unit. The plurality of analog loads are disposed within the cabinet, wherein an output power of each analog load is adjustable. The switch is disposed within the cabinet and communicatively coupled to the plurality of analog loads, the switch configured to interact with the plurality of analog loads. The management unit is disposed within the cabinet and communicatively coupled to the switch, the management unit configured to, in response to a test signal, generate a power control signal matching the test signal and transmit the power control signal to at least one of the plurality of analog loads via the switch to adjust the output power of the at least one analog load.

Description

Technical Field

[0001] The examples in this article generally relate to the field of cabinet technology, and more particularly to a test system for cabinets. Background Technology

[0002] As the overall power consumption of server rack equipment continues to rise, the industry's requirements for power density in power systems are constantly increasing, with large server racks reaching megawatt-level power consumption. Currently, power supply solutions adapted to this ultra-high power consumption level are not yet mature in the industry, and related products are still lacking. Before the official product launch, it is urgent to complete reliability verification of core technologies such as power supply architecture and heat dissipation systems under high-power conditions. The inability to conduct load simulation testing before the finished product is available makes it difficult to complete system technical verification in advance, easily leading to unavoidable technical risks. This not only significantly increases potential hidden dangers during productization but can also, in severe cases, hinder project development or even cause product iteration failures. Summary of the Invention

[0003] In a first aspect of this document, a test system for a server rack is provided. The test system includes multiple simulated loads, a switch, and a management unit. The multiple simulated loads are arranged within the server rack, wherein the output power of each simulated load is adjustable. The switch is arranged within the server rack and communicatively connected to the multiple simulated loads; the switch is configured to interact with the multiple simulated loads. The management unit is arranged within the server rack and communicatively connected to the switch; the management unit is configured to generate a power control signal matching the test signal in response to a test signal, and to send the power control signal via the switch to at least one of the multiple simulated loads to adjust the output power of at least one simulated load.

[0004] By setting up multiple analog loads with adjustable output power in the cabinet and sending power control signals to the analog loads via a switch through the management unit, load simulation testing under high power conditions can be carried out before the finished product is released, thereby completing the reliability verification of the power supply architecture and heat dissipation system in advance.

[0005] It should be understood that the content described in this section is not intended to limit the key or essential features of the examples in this article, nor is it intended to restrict the scope of this article. Other features of this article will become readily apparent from the following description. Attached Figure Description

[0006] The above and other features, advantages, and aspects of the examples herein will become more apparent when taken in conjunction with the accompanying drawings and the following detailed description. In the accompanying drawings, the same or similar reference numerals denote the same or similar elements, wherein: Figure 1 An example environment for the test system is shown; Figure 2 A schematic diagram of the test system is shown, which includes multiple simulated loads; Figure 3 A schematic diagram of the test system is shown, which includes multiple simulated loads and a power supply unit. Figure 4 A schematic diagram of the simulated load structure is shown; Figure 5 A schematic diagram of the load unit structure is shown; Figure 6 A schematic diagram of the power distribution circuit is shown; and Figure 7 A schematic diagram of the simulated load and cold plate is shown.

[0007] Explanation of reference numerals in the attached figures: 100. Example environment; 1. Server rack; 10. Rack unit; 2. Simulated load; 21. Load unit; 211. Resistor; 212. Power supply circuit; 22. First controller; 23. Second controller; 24. Third controller; 25. Power distribution circuit; 251. Voltage conversion circuit; 252. Protection circuit; 26. Network interface; 3. Switch; 4. Management Unit; 5. Reinforce the pallet; 6. Power supply unit; 7. Cold plate; 71. Pipe interface. Detailed Implementation

[0008] The examples described herein will now be described in more detail with reference to the accompanying drawings. While examples of this document are shown in the drawings, it should be understood that this document can be implemented in various forms and should not be limited to the examples set forth herein. Rather, these examples are provided to make this document more thorough and complete, and to fully convey the scope of this document to those skilled in the art.

[0009] The term “comprising” and its variations, as used herein, signify open inclusion, i.e., “including but not limited to.” Unless otherwise stated, the term “or” means “and / or.” The term “based on” means “at least partially based on.” The term “one example” means “at least one example.” The term “another example” means “at least one additional example.” The terms “first,” “second,” etc., may refer to different or the same objects.

[0010] With the rapid growth in demand for data center and artificial intelligence computing, the overall power consumption of rack-mount equipment continues to rise. While some racks typically consume around 100 kilowatts, the power requirements of next-generation large racks have reached 500 kilowatts or even megawatts. To meet these ultra-high power consumption demands, high-voltage direct current (HVDC) power supply architectures are gradually becoming the industry trend. For example, 800 volts are directly introduced into the rack to support power consumption of up to 30 kilowatts per node.

[0011] However, several technical bottlenecks exist in the verification process of high-voltage DC power supply architectures. First, some load simulation devices are primarily designed for steady-state load scenarios, i.e., load testing with fixed power consumption values, and cannot simulate the dynamic power consumption changes of real chips during operation. Second, these single-node load devices struggle to reach the 30 kW level and lack the ability to be flexibly configured within the 0-30 kW range. Furthermore, these solutions lack dynamic simulation load devices capable of supporting megawatt-level power consumption across the entire rack, failing to meet the requirements for end-to-end verification of the power supply and cooling systems under high-power conditions.

[0012] Before the finished product is released, without effective load simulation testing, it is difficult to verify the reliability of the power supply architecture and heat dissipation system in advance. This may prevent the early release of technical risks, increase potential hidden dangers during productization, and even lead to problems such as project development setbacks or product iteration failures. The cost of using real chips for verification is extremely high, with the cost of a single rack reaching several million yuan. Therefore, using real chips for large-scale load verification is not economically feasible.

[0013] To address the aforementioned technical challenges, this paper presents a test system for server racks. This system uses simulated loads to replace real chips. By setting up multiple simulated loads with adjustable output power in multiple rack units within the server rack, and sending power control signals to the simulated loads via a switch through a management unit, end-to-end verification of the HVDC power supply architecture can be achieved. In this way, the test system can complete high-power load simulation testing before the finished product is released, thereby mitigating risks in power supply design and selection, and verifying the reliability of the power supply architecture and heat dissipation system.

[0014] To facilitate understanding of the technical solutions presented in this paper, the following explanations are provided for the terms used in this paper.

[0015] The term "rack" as used in this article refers to a frame structure used to house and support electronic equipment. A rack provides standardized installation space for various electronic devices such as servers, network equipment, and power supplies. Racks can use standardized dimensions, such as a 19-inch wide rack-mount structure, to facilitate the installation and interchangeability of different devices.

[0016] The rack unit, as described in this article, refers to a standardized spatial unit within a server rack used for installing equipment. Rack units can be divided according to industry standards, such as using U (Unit), with each U corresponding to a specific height dimension. A server rack may include multiple rack units, arranged sequentially along the height of the rack to form multiple mounting positions.

[0017] The simulated load described in this article refers to a device used to simulate the power consumption characteristics of real electronic devices. A simulated load can generate a power load similar to that of a real device by consuming electrical energy, thereby allowing for the testing and verification of power supply and cooling systems without using the actual device. The output power of the simulated load can be adjustable to simulate power consumption variations under different operating conditions. In some cases, the simulated load can simulate the dynamic power consumption characteristics of a chip or processor during operation.

[0018] The term "switch" as used in this article refers to a network device used for data exchange and communication routing. A switch can receive data from multiple devices and forward it to the appropriate destination device based on the destination address. In a test system, a switch can act as a communication hub, enabling data interaction between the management unit and multiple simulated loads.

[0019] The management unit described herein refers to a device used for centralized management and control of the test system. The management unit can receive externally input test signals and generate corresponding control commands based on these signals. The management unit can communicate with multiple analog loads via a switch, thereby achieving unified scheduling and coordinated control of the analog loads. In some cases, the management unit may include a Baseboard Management Controller (BMC) or other types of management controllers.

[0020] The test signals described herein refer to signals used to trigger the test system to execute specific test tasks. Test signals can originate from external test equipment or a host computer system. Test signals may contain test parameter information, such as target power values, power variation curves, and test duration. The management unit can respond to the test signals by generating power control signals that match the test signals.

[0021] The power control signals described herein refer to signals used to control the output power of a simulated load. These power control signals can be generated by the management unit and transmitted to the simulated load via a switch. In some cases, the power control signals may include a power value signal and a power change slope signal. The power value signal may indicate the target output power of the simulated load or the power adjustment step size. The power change slope signal may indicate the rate at which the output power of the simulated load changes over time, thereby simulating dynamic power consumption characteristics.

[0022] Example Environment Figure 1 An example environment 100 for a test system used in rack 1 is shown. Example environment 100 illustrates the overall configuration of rack 1 with multiple simulated loads 2. Rack 1 can be a 45U rack-mount frame structure, and its interior can include multiple rack units 10. The multiple rack units 10 are arranged sequentially along the height of rack 1, forming a multi-level mounting position. In this configuration, rack 1 can accommodate up to 42 simulated loads 2. In this way, rack 1 provides ample installation space to support large-scale load simulation testing.

[0023] In some cases, multiple analog loads 2 can be directly installed within rack 1 and fixed in an appropriate manner. In other cases, multiple analog loads 2 are respectively installed within corresponding rack units 10 of multiple rack units 10. For example... Figure 1 As shown, multiple simulated loads 2 are stacked along the height of the rack 1, with each simulated load 2 occupying a corresponding rack unit 10 position. The output power of each simulated load 2 is adjustable, thereby simulating power consumption variations under different operating conditions.

[0024] In some cases, such as Figure 2 As shown, the simulated load 2 node can be flexibly positioned within rack 1. Simulated load 2 can be installed in different rack units 10 according to testing requirements. The installation positions of switch 3 and management unit 4 can also be adjusted according to the actual configuration. Therefore, the test system can adapt to different testing scenarios and verification needs.

[0025] In some scenarios, when all 32 kW-level simulated load nodes are configured within rack 1, the test system can support a power capacity of up to 1.2 MW. In this way, example environment 100 can achieve scalable power simulation capabilities, meeting the requirements for end-to-end verification of power supply architecture and cooling systems under megawatt-level power consumption conditions.

[0026] Example test system like Figure 2As shown, the test system includes multiple simulated loads 2, switches 3, and management units 4. In some cases, the multiple simulated loads 2, switches 3, and management units 4 are housed within rack 1 and are fixed in a detachable manner. In other cases, the multiple simulated loads 2, switches 3, and management units 4 are respectively housed within corresponding rack units 10 of multiple rack units 10.

[0027] exist Figure 2 In the configuration shown, multiple rack units 10 are arranged sequentially along the height of the rack. The rack units 10 are numbered 1 to 8 and 43 to 45 from bottom to top, with the middle rack units 10 indicated by ellipses. Multiple simulated loads 2 are distributed at different positions within the rack units 10, including positions 43, 44, and 45 in the upper region and positions 1 to 5 in the lower region. In this way, the simulated loads 2 can be flexibly arranged within the rack to meet different testing configuration requirements.

[0028] Switch 3 is located within a corresponding rack unit 10 among multiple rack units 10. Switch 3 is communicatively connected to multiple simulated loads 2 and is configured to interact with the multiple simulated loads 2. Thus, switch 3 can act as a communication hub, providing data exchange and communication routing functions within the test system.

[0029] like Figure 2 As shown, the management unit 4 is located within a corresponding rack unit 10 among multiple rack units 10. The management unit 4 is situated adjacent to the switch 3. The management unit 4 is communicatively connected to the switch 3, thereby enabling data exchange with multiple analog loads 2 through the switch 3. In this manner, the management unit 4 can centrally manage and uniformly schedule the analog loads 2 distributed across the rack units 10 within the cabinet 1.

[0030] In some cases, multiple analog loads 2, switches 3, and management units 4 are housed in different rack units 10 within multiple rack units 10. In this way, the components are arranged independently within the rack, facilitating installation, maintenance, and replacement.

[0031] In some scenarios, management unit 4 is connected to switch 3 via a management port. Switch 3 is connected to multiple simulated load 2 nodes via a management port. Therefore, management unit 4 can issue management commands and control signals to multiple simulated load 2 nodes via switch 3, achieving centralized network management of the simulated load 2 nodes.

[0032] In some cases, such as Figure 2 and Figure 3As shown, the test system also includes a reinforcing tray 5. The reinforcing tray 5 is disposed within the rack unit 10 and provides structural support for the components within the cabinet 1. The reinforcing tray 5 can be located adjacent to the switch 3 or the management unit 4 to enhance the overall structural stability of the cabinet 1.

[0033] As described above, the management unit 4 is communicatively connected to the switch 3. The management unit 4 is configured to generate a power control signal matching the test signal in response to the test signal, and to send the power control signal via the switch 3 to at least one of the plurality of analog loads 2 to adjust the output power of at least one analog load 2. In this way, the management unit 4 can achieve centralized power management and dynamic adjustment of each analog load 2 within the cabinet 1.

[0034] In some cases, management unit 4 can receive test signals from a host computer or external testing equipment. The test signals may contain test parameter information such as target power value, power change curve, and test duration. In response to the test signals, management unit 4 parses the test parameters in the test signals and generates a power control signal that matches the test signals. Thus, management unit 4 can convert external test requirements into control commands that can be executed by the simulated load 2.

[0035] In some cases, the power control signal includes a power value signal and a power change slope signal. The power value signal indicates the target output power or power adjustment step size of the simulated load 2. The power change slope signal indicates the rate at which the output power of the simulated load 2 changes over time. In this way, the power control signal can simultaneously specify the target power value and the rate of power change of the simulated load 2, thereby simulating the dynamic power consumption characteristics.

[0036] In some cases, the change in output power of at least one simulated load 2 over time corresponds to a power change slope signal. Simulated load 2 can gradually adjust its output power to a target value based on the rate of change indicated by the power change slope signal. Thus, simulated load 2 can simulate the dynamic power consumption characteristics of a real chip during operation, rather than just performing steady-state load.

[0037] In some cases, the output power of at least one simulated load 2 is adjusted in preset steps. The preset step size corresponds to the power value signal. The management unit 4 can specify the power adjustment step size of the simulated load 2 through the power value signal, and the simulated load 2 can adjust its output power step by step according to the preset step size. In this way, the test system can achieve fine-grained power regulation control.

[0038] In some scenarios, Analog Load 2 can support dynamic load change slopes of up to 16 kW per microsecond. This slope represents the change in output power of a single Analog Load 2 node per unit time. In this way, Analog Load 2 can achieve rapid power jumps, thereby simulating the transient power consumption changes of a real chip under high load conditions.

[0039] In some scenarios, when multiple simulated loads 2 are configured within rack 1, the test system can support rack-level dynamic load change slopes of up to 400 kilowatts per microsecond. The management unit 4 can coordinate the synchronous power adjustment of multiple simulated loads 2, thereby achieving large dynamic load simulation at the rack level. Therefore, the test system can meet the requirements for verifying the dynamic response characteristics of the power supply system under megawatt-level power consumption conditions.

[0040] In some scenarios, management unit 4 can issue configuration commands to each simulated load 2 node. These commands may include parameters such as load value, load slope, and operating mode. Management unit 4 can issue different configuration commands to different simulated load 2 nodes, thereby achieving differentiated control over each simulated load 2. In some scenarios, management unit 4 can also issue the same configuration command to multiple simulated load 2 nodes to achieve synchronous operation of multiple simulated load 2 nodes.

[0041] In some scenarios, management unit 4 can designate any number of simulated loads 2 within rack 1 to operate, while the remaining simulated loads 2 can remain in standby mode. Management unit 4 can also designate each simulated load 2 to operate with different power values, thereby achieving flexible power combination configurations. In this way, the test system can simulate different load distribution scenarios according to test requirements.

[0042] Figure 3 A schematic diagram of the test system is shown, which includes multiple simulated loads 2 and a power supply unit 6. Figure 3 The configuration shown illustrates the complete layout relationship of the components within rack 1.

[0043] exist Figure 3 In the configuration shown, rack 1 contains multiple rack units 10, arranged sequentially along the height of rack 1. The rack units 10 are numbered 1 to 8 and 43 to 45 from bottom to top, with the middle rack units 10 indicated by ellipses. Multiple analog loads 2, switches 3, and management units 4 are respectively housed in different rack units 10. In this way, each component is arranged independently within rack 1, facilitating flexible configuration and adjustment according to testing requirements.

[0044] In some cases, the test system also includes a power supply unit 6. The power supply unit 6 is located within a respective rack unit 10 of the plurality of rack units 10 and is electrically connected to a plurality of analog loads 2. The power supply unit 6 is configured to provide operating voltage to the plurality of analog loads 2. Figure 3 In the configuration shown, the power supply unit 6 can be located in the upper area of ​​the cabinet 1, for example, at positions 44 and 45 of rack units 10. In this way, the power supply unit 6 can provide a stable operating voltage from multiple analog loads 2 distributed downwards from the upper part of the cabinet 1. It should be understood that the power supply unit 6 can be located in any rack unit 10 within the cabinet 1, and this solution is not intended to limit it.

[0045] In some cases, power supply unit 6 can take the form of an HVDC power supply node. An HVDC power supply node can receive high-voltage DC input and convert it to a voltage suitable for the operation of the simulated load 2. Therefore, power supply unit 6 can support high-power load simulation testing under an HVDC power supply architecture.

[0046] In some scenarios, rack 1 can be configured with up to eight HVDC power rack nodes as power supply units 6. When rack 1 is configured with eight HVDC power rack nodes, the test system can support simulated load capacity up to 800 kW. In this way, the test system can flexibly configure the number of power supply units 6 according to test requirements, thereby realizing load simulation tests of different power levels.

[0047] In some scenarios, the rack unit 10 positions within rack 1 can be flexibly allocated between power supply units 6 and simulated loads 2. When the test system is configured with more power supply units 6, the number of simulated loads 2 can be reduced accordingly. When the test system is configured with fewer power supply units 6 or no power supply units 6, the number of simulated loads 2 can be increased accordingly. Thus, the test system can adapt to different power supply architecture verification scenarios.

[0048] In some cases, a reinforcing tray 5 is installed inside the rack 1. The reinforcing tray 5 can be located at the top or bottom of the rack 1. Since the total weight of the multiple analog loads 2, power supply units 6, and other components configured inside the rack 1 can exceed one ton, the reinforcing tray 5 can provide structural support for the components inside the rack 1, thereby enhancing the overall load-bearing capacity and structural stability of the rack 1.

[0049] exist Figure 3 In the configuration shown, management unit 4 is located at position 8 of rack unit 10, switch 3 is located at position 6 of rack unit 10, and reinforcement tray is located at position 7 of rack unit 10. Multiple analog loads 2 are distributed at positions 1 to 5 and position 43 of rack unit 10. In this way, management unit 4 and switch 3 are located in the central area of ​​rack 1, facilitating communication connections with the analog loads 2 above and below.

[0050] In some cases, the installation positions of management unit 4, switch 3, power supply unit 6, and simulated load 2 can be adjusted according to actual testing requirements. Each component can be installed in any rack unit 10 within cabinet 1, as long as communication and electrical connections can be maintained between them. Therefore, the test system can provide flexible configuration options to meet the verification needs of different testing scenarios.

[0051] Figure 4 A schematic diagram of the simulated load 2 is shown. (See diagram below.) Figure 4 As shown, the simulated load 2 includes multiple load units 21, a first controller 22, a second controller 23, a third controller 24, and multiple power distribution circuits 25.

[0052] Multiple load units 21 are arranged in an array configuration. Figure 4 In the configuration shown, multiple load units 21 are arranged in a multi-row, multi-column configuration, for example, four columns, with each column containing multiple load units 21. The multiple load units 21 are connected in parallel or series with each other, and the output power of each load unit 21 is adjustable. In this way, the analog load 2 can achieve flexible power configuration by adjusting the output power of each load unit 21.

[0053] In some cases, multiple load units 21 are pluggably mounted on a simulated load board. The simulated load board, as a substrate supporting the multiple load units 21, provides electrical connections and mechanical support between the load units 21 and other components within the simulated load 2. Thus, the load units 21 can support hot-swapping operations, facilitating the replacement or addition / reduction of the number of load units 21 as needed during testing.

[0054] In some cases, the number of load units 21 within each simulated load node is configurable. For example, simulated load 2 can be configured with 16 load units 21, each with a power of 2 kW, achieving a total power capacity of 32 kW per node. In some cases, simulated load 2 can be configured with 32 load units 21, each with a power of 1 kW. In other cases, simulated load 2 can be configured with 8 load units 21, each with a power of 4 kW. In this way, the test system can flexibly adjust the number of load units 21 and the power specifications of individual load units 21 according to test requirements, thereby achieving different power combination configurations.

[0055] In some cases, such as Figure 4As shown, each analog load 2 also includes a first controller 22. The first controller 22 is connected to a plurality of load units 21 and is configured to control the on / off state of at least one of the plurality of load units 21 based on a power control signal. In this way, the first controller 22 can control the on / off state of the corresponding load unit 21, thereby regulating the output power of the analog load 2.

[0056] In some cases, such as Figure 4 As shown, the first controller 22 can be in the form of a microcontroller unit (MCU). As the computing unit responsible for the specific load simulation logic, the microcontroller can control the switching of power switches in the load unit 21, thereby realizing the load modulation function. Therefore, the first controller 22 can precisely control the operating state of each load unit 21 according to the power control signal, realizing dynamic adjustment of the output power of the simulated load 2.

[0057] In some cases, such as Figure 4 As shown, each analog load 2 also includes a second controller 23. The second controller 23 is connected to the first controller 22 and is communicatively connected to the switch 3. The second controller 23 is configured to receive power control signals and transmit them to the first controller 22. In this way, the second controller 23 can serve as a communication interface between the analog load 2 and the switch 3, receiving power control signals from the management unit 4 and forwarding them to the first controller 22 to execute corresponding control operations.

[0058] In some cases, the second controller 23 can be a Baseboard Management Controller (BMC). As a hardware monitoring and management unit, the BMC can monitor and manage the board-level hardware of the analog load 2. Thus, the second controller 23 can implement board-level management and control functions for the load unit 21.

[0059] In some cases, such as Figure 4 As shown, multiple power distribution circuits 25 are arranged below the first controller 22 and the second controller 23. Figure 4 In the configuration shown, multiple power distribution circuits 25 are distributed along the width of the simulated load 2. A third controller 24 is electrically connected to the power distribution circuits 25. The third controller 24 is configured to acquire operating data of the simulated load 2 and adjust the power distribution of the power distribution circuits 25 based on the operating data. In this way, the third controller 24 can coordinate the operation of the first controller 22 and the second controller 23 and perform power management on the power distribution circuits 25.

[0060] As described above, the simulated load 2 adopts a hierarchical control architecture. The second controller 23 receives power control signals from the management unit 4 through the switch 3 and transmits the power control signals to the first controller 22. The first controller 22 controls the on / off states of multiple load units 21 based on the power control signals. The third controller 24 monitors the operating status of the simulated load 2 and adjusts the power distribution of the power distribution circuit 25. In this way, the hierarchical control architecture can achieve flexible management and dynamic adjustment of multiple load units 21, enabling the simulated load 2 to simulate various power consumption modes and dynamic load conditions.

[0061] like Figure 5 As shown, each load unit 21 includes a power supply circuit 212 and a resistor 211 connected to the power supply circuit 212. In some cases, the resistor 211 may be located in the central region of the load unit 21. The resistor 211 is configured to simulate power consumption by drawing current during operation. In some cases, the resistor 211 may include a power switch and a power resistor. The power switch and power resistor are configured to simulate chip power consumption by drawing current when activated. When the power switch is turned on, current flows through the power resistor, thereby generating heat and consuming electrical energy. In this way, the resistor 211 can simulate the power consumption characteristics of a real chip during operation without using an expensive real chip.

[0062] A power supply circuit 212 is arranged around a resistor 211 and provides an operating voltage to the resistor 211. The power supply circuit 212 is configured to supply power to the resistor 211 in response to a power control signal. When the power supply circuit 212 receives a power control signal, it outputs a corresponding voltage and current to the resistor 211 according to the indication of the power control signal. Therefore, the power supply circuit 212 can dynamically adjust the power supplied to the resistor 211 according to the power control signal, thereby controlling the output power of the load unit 21.

[0063] In some cases, load unit 21 can be plugged into and mounted on the analog load board. The analog load board provides electrical connections between load unit 21 and other components within the analog load 2. Thus, load unit 21 can support hot-swapping operations, facilitating the replacement or addition / reduction of the number of load units 21 as needed for testing.

[0064] In some scenarios, each simulated load node 2 can support power regulation within the range of 0 to 32 kW, with an adjustment step of 2 kW. The management unit 4 can specify the operating state of the load unit 21 through power control signals, thereby adjusting the output power of the simulated load 2 in 2 kW steps. In this way, the test system can achieve fine-grained power configuration, thus meeting the power level verification requirements of different test scenarios.

[0065] In some cases, the second controller 23 can control the switching of the power switches in the load unit 21. The second controller 23 sends on / off commands to the power switches in the resistor device 211 according to the power control signal. The power switches turn on or off in response to the on / off commands. When the power switch is on, the load unit 21 draws current and consumes power. When the power switch is off, the load unit 21 stops drawing current. In this way, by controlling the on / off state of the power switches in each load unit 21, the simulated load 2 can achieve dynamic adjustment of the output power, thereby simulating the power consumption characteristics of a real chip under different operating conditions.

[0066] like Figure 4 and Figure 6 As shown, each analog load 2 also includes a power distribution circuit 25. The power distribution circuit 25 is configured to receive a first voltage and output a second voltage, lower than the first voltage, to multiple load units 21. In an HVDC power supply architecture, the input voltage inside the cabinet 1 can reach 800 volts. However, the operating voltage of the resistors 211 and the power supply circuit 212 in the load units 21 is typically in the tens of volts range. Therefore, the power distribution circuit 25 performs the function of converting high-voltage DC to low-voltage DC suitable for the operation of the load units 21.

[0067] In some cases, such as Figure 6 As shown, the power distribution circuit 25 includes a voltage conversion circuit 251 and a protection circuit 252. The protection circuit 252 is located at the input terminal of the voltage conversion circuit 251. The voltage conversion circuit 251 is configured to convert a first voltage to a second voltage. In this way, the power distribution circuit 25 can convert the input high-voltage DC to the low-voltage DC required by the load unit 21.

[0068] The voltage conversion circuit 251 can receive high-voltage DC input from the power supply unit 6 or an external HVDC power supply. In some cases, the voltage conversion circuit 251 can convert 800 volts of high-voltage DC to 12 volts or other voltages suitable for the operation of the load unit 21. Thus, the voltage conversion circuit 251 can provide a stable low-voltage operating power supply for multiple load units 21.

[0069] In some cases, protection circuit 252 may be located at the input of voltage conversion circuit 251 to provide protection for power distribution circuit 25. In some cases, protection circuit 252 may also include a hot-swap unit. The hot-swap unit is configured to achieve smooth switching and protection of the power supply path. In this way, protection circuit 252 can provide protection against overcurrent, overvoltage, or other faults in power distribution circuit 25, preventing the fault from spreading to other nodes.

[0070] In some cases, protection circuit 252 may include a fuse or other protective element. The fuse can blow when the current exceeds a predetermined threshold, thereby disconnecting the faulty circuit from other circuits. Thus, protection circuit 252 can prevent a failure of a single analog load node 2 from affecting other analog load nodes 2 within cabinet 1.

[0071] In some cases, the power distribution circuit 25 may include an intermediate bus converter (IBC). An IBC is a DC / DC conversion module in a power system responsible for voltage conversion between a higher voltage bus and a lower voltage load point. As described above, each analog load 2 also includes a third controller 24. The third controller 24 is electrically connected to the power distribution circuit 25. The third controller 24 is configured to acquire operating data from the analog load 2 and adjust the power distribution of the power distribution circuit 25 based on the operating data.

[0072] In some cases, the third controller 24 can take the form of an integrated backplane controller. The integrated backplane controller, as the core of the single-board-level management and control, is directly connected to the first controller 22 on the analog load board for power status monitoring and command interaction. In this way, the third controller 24 can monitor the operating status of the power distribution circuit 25 in real time and dynamically adjust the power distribution based on the operating data of the analog load 2.

[0073] In some cases, the third controller 24 can collect operational data including parameters such as the input voltage, output voltage, output current, and temperature of the power distribution circuit 25. Based on this operational data, the third controller 24 can determine whether the operating status of the power distribution circuit 25 is normal and take corresponding protective measures when an anomaly is detected. Therefore, the third controller 24 can ensure that the power distribution circuit 25 operates within a safe range, thereby guaranteeing the stable operation of the simulated load 2.

[0074] In some cases, the third controller 24 can communicate with the management unit 4 through the first controller 22. The third controller 24 can report the collected operating data to the management unit 4, and the management unit 4 can monitor and manage the operating status of the simulated load 2 based on the operating data. In this way, the test system can achieve centralized monitoring and management of the power distribution circuit 25.

[0075] like Figure 7As shown, a cold plate 7 is disposed on one side of the simulated load 2. The cold plate 7 is attached to at least one of the multiple simulated loads 2. Under megawatt-level power consumption conditions, the simulated load 2 generates a large amount of heat during operation. Due to the high power level, air cooling is insufficient to meet the heat dissipation requirements. Therefore, the test system uses liquid cooling to dissipate heat from the simulated load 2. The cold plate 7, as the core component of liquid cooling, is in close contact with the heat-generating area of ​​the simulated load 2, thereby achieving efficient heat transfer.

[0076] In some cases, the cold plate 7 includes multiple pipe interfaces 71. For example... Figure 7 As shown, the cold plate 7 is provided with two pipe interfaces 71. The pipe interfaces 71 are configured to connect to the liquid cooling system inside the cabinet 1. In this way, the cold plate 7 can be connected to the cooling system of the cabinet 1 through the pipe interfaces 71, thereby realizing the circulation of the cooling medium.

[0077] In some cases, the pipe interface 71 can be a quick-connect valve. The quick-connect valve is configured to allow for rapid connection and disconnection between the cold plate 7 and the liquid cooling system of the cabinet 1. In this way, the simulated load 2 node can be installed or removed without stopping the entire liquid cooling system, thus facilitating the maintenance and configuration adjustments of the test system.

[0078] In some cases, the cold plate 7 shares cooling pipes and water channels with the liquid cooling system inside the cabinet 1. The cooling medium enters the cold plate 7 through pipe interface 71, absorbs the heat generated by the simulated load 2, and then flows out through pipe interface 71 back to the liquid cooling system for cooling circulation. In this way, the cold plate 7 can continuously remove the heat generated by the simulated load 2 under high-power operation, thereby ensuring the stable operation of the simulated load 2.

[0079] In some cases, each simulated load 2 node is equipped with a cold plate 7. The cold plate 7 is integrated with the corresponding simulated load 2 and connected to the liquid cooling system of rack 1 via a quick-connect valve. In this way, the test system can perform unified thermal management on multiple simulated loads 2 within rack 1, meeting the requirements for end-to-end verification of the heat dissipation system under megawatt-level power consumption conditions.

[0080] like Figure 7 As shown, the simulated load 2 also includes a network interface 26. The network interface 26 is located on one side of the simulated load 2. Each of the plurality of simulated loads 2 has a network interface 26, which is connected to the switch 3 via a network cable.

[0081] In some cases, network interface 26 can take the form of a management port. The management port is configured to enable data communication between the simulated load 2 and the switch 3. The management unit 4 establishes a communication connection with the network interface 26 of each simulated load 2 through the switch 3, thereby enabling it to send power control signals and configuration commands to the simulated load 2. In this way, network interface 26 serves as the communication interface between the simulated load 2 and other components of the test system, realizing centralized network management of the simulated load 2.

[0082] In some cases, network interface 26 can be connected to the corresponding port of switch 3 via a network cable. Switch 3 aggregates network connections from multiple analog loads 2 and interacts with management unit 4. Thus, management unit 4 can simultaneously manage multiple analog loads 2 within rack 1 via switch 3, achieving unified scheduling and coordinated control of each analog load 2.

[0083] As described above, management unit 4 is configured to generate a power control signal that matches the test signal in response to the test signal. In some cases, management unit 4 has an external communication interface. The external communication interface is configured to receive test signals from outside the cabinet 1. In this way, management unit 4 can establish a communication connection with a host computer or test equipment outside the cabinet 1, thereby receiving externally input test commands and test parameters.

[0084] In some cases, the external communication interface can take the form of a network interface. The host computer or external test equipment can send test signals to the management unit 4 via the network interface. These test signals can include test parameter information such as the target power value, power change curve, test duration, and operating mode. After receiving the test signal, the management unit 4 parses the test parameters and generates a power control signal that matches the test signal. Thus, the external communication interface acts as a communication bridge between the test system and the external test environment, enabling the test system to respond to external test requirements and perform corresponding load simulation operations.

[0085] In some cases, the external communication interface can support multiple communication protocols. The host computer can send configuration commands to the management unit 4 through the external communication interface. The configuration commands can specify parameters such as the operating status, target power value, and power change slope of each simulated load 2 in the rack 1. The management unit 4 can generate corresponding power control signals according to the configuration commands and distribute the power control signals to each simulated load 2 via the switch 3. In this way, the test system can realize remote configuration and centralized management of multiple simulated loads 2 in the rack 1.

[0086] In some scenarios, different simulated loads 2 among multiple simulated loads 2 are configured to synchronously output the same power in response to a power control signal. The management unit 4 can send the same power control signal to multiple simulated loads 2, and after receiving the power control signal, the multiple simulated loads 2 synchronously adjust their respective output power to the same target value. In this way, the test system can realize the synchronous operation of multiple simulated loads 2, thereby simulating the working condition of multiple computing nodes in the rack 1 operating at the same power simultaneously.

[0087] In some scenarios, different simulated loads 2 among multiple simulated loads 2 are configured to output different power in response to power control signals. The management unit 4 can issue different power control signals to different simulated loads 2, and each simulated load 2 independently adjusts its output power according to its received power control signal. Thus, the test system can achieve differentiated control of each simulated load 2, thereby simulating the operating conditions of different computing nodes in the rack 1 operating at different power levels.

[0088] In some scenarios, the test system supports a steady-state load simulation mode. In this mode, management unit 4 sends a fixed power value signal to simulated load 2, and simulated load 2 outputs a constant power based on the signal. The steady-state load simulation mode can be used to verify the power supply capability and stability of the power supply system under fixed power consumption conditions. In this way, the test system can simulate a scenario where computing nodes within rack 1 operate continuously at a constant power.

[0089] In some scenarios, the test system supports a dynamic load simulation mode. In this mode, management unit 4 sends a power change slope signal to simulated load 2, and simulated load 2 dynamically adjusts its output power based on the signal. The dynamic load simulation mode can be used to verify the dynamic response characteristics of the power supply system under conditions of rapid power consumption changes. Thus, the test system can simulate the dynamic power consumption characteristics of a real chip during operation, including power step changes and transient responses.

[0090] In some scenarios, management unit 4 can specify that simulated load 2 switches between steady-state load simulation mode and dynamic load simulation mode. Management unit 4 can issue corresponding power control signals to simulated load 2 based on the operating mode parameters in the test signal. When the test signal indicates steady-state load simulation mode, management unit 4 generates a fixed power value signal. When the test signal indicates dynamic load simulation mode, management unit 4 generates a power control signal containing the power change slope. In this way, the test system can flexibly switch operating modes according to test requirements, meeting the verification needs of different test scenarios.

[0091] In some scenarios, under dynamic load simulation mode, simulated load 2 can perform power step changes. Management unit 4 can specify the power transition range and frequency of simulated load 2 via power control signals, and simulated load 2 performs periodic transitions within the specified power range according to the power control signals. Thus, the test system can simulate the transient power consumption changes of a real chip under high load conditions, thereby verifying the power supply system's response capability to rapid power changes.

[0092] In some scenarios, management unit 4 can coordinate multiple simulated loads 2 to synchronously perform dynamic load changes. Management unit 4 simultaneously sends power control signals containing the same power change slope to multiple simulated loads 2, and the multiple simulated loads 2 synchronously adjust their power. In this way, the test system can realize large dynamic load simulation at the rack level, thereby verifying the dynamic response characteristics of the power supply system under rapid changes in rack-level power consumption.

[0093] The examples described above are exemplary and not exhaustive, nor are they limited to the disclosed examples. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the illustrated examples. The terminology used herein is chosen to best explain the principles, practical applications, or technological improvements to the examples in the market, or to enable others skilled in the art to understand the examples disclosed herein.

Claims

1. A testing system for a cabinet (1), comprising: Multiple analog loads (2) are arranged in the cabinet (1), wherein the output power of each analog load (2) is adjustable; A switch (3) is installed in the cabinet (1) and is communicatively connected to the plurality of analog loads (2). The switch (3) is configured to interact with the plurality of analog loads (2) for data exchange. as well as A management unit (4) is located in the cabinet (1) and is communicatively connected to the switch (3). The management unit (4) is configured to generate a power control signal matching the test signal in response to the test signal and send the power control signal to at least one of the plurality of analog loads (2) via the switch (3) to adjust the output power of the at least one analog load (2).

2. The test system according to claim 1, wherein each simulated load (2) comprises a plurality of load units (21) connected in parallel or in series with each other, and the output power of each load unit (21) is adjustable.

3. The test system according to claim 2, wherein each load unit (21) includes a power supply circuit (212) and a resistor (211) connected to the power supply circuit (212), the power supply circuit (212) being configured to supply power to the resistor (211) in response to the power control signal.

4. The test system according to claim 2, wherein each simulated load (2) further includes a first controller (22) connected to the plurality of load units (21) and configured to control the on / off state of at least one of the plurality of load units (21) based on the power control signal.

5. The test system according to claim 4, wherein each simulated load (2) further includes a second controller (23), the second controller (23) being connected to the first controller (22) and communicatively connected to the switch (3), the second controller (23) being configured to receive the power control signal and transmit the power control signal to the first controller (22).

6. The test system according to claim 1, wherein each simulated load (2) further includes a power distribution circuit (25) configured to receive a first voltage and output a second voltage to the plurality of load units (21), the second voltage being lower than the first voltage.

7. The test system according to claim 6, wherein the power distribution circuit (25) includes a voltage conversion circuit (251) and a protection circuit (252), the protection circuit (252) being disposed at the input terminal of the voltage conversion circuit (251), the voltage conversion circuit (251) being configured to convert the first voltage into the second voltage.

8. The test system according to claim 6, wherein each simulated load (2) further includes a third controller (24) electrically connected to the power distribution circuit (25), the third controller (24) being configured to collect operating data of the simulated load (2) and adjust the power distribution of the power distribution circuit (25) based on the operating data.

9. The test system according to claim 1 further includes a power supply unit (6), which is disposed in the cabinet (1) and electrically connected to the plurality of analog loads (2), and the power supply unit (6) is configured to provide operating voltage to the plurality of analog loads (2).

10. The test system according to claim 1, wherein the cabinet (1) includes a plurality of rack units (10), and the plurality of simulated loads (2), the switch (3) and the management unit (4) are respectively disposed in different rack units (10) of the plurality of rack units (10).

11. The test system according to claim 1 further includes a cold plate (7) which is attached to at least one of the plurality of simulated loads (2).

12. The test system according to claim 1, wherein each of the plurality of simulated loads (2) has a network interface (26) connected to the switch (3) via a network cable.

13. The test system according to claim 1, wherein the management unit (4) has an external communication interface configured to receive the test signal from outside the cabinet (1).

14. The test system according to claim 1, wherein different analog loads (2) of the plurality of analog loads (2) are configured to synchronously output the same power in response to the power control signal, or to output different power to each other in response to the power control signal.

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