A package joint detection device, a control method and a control device thereof

Abstract

The application discloses a kind of encapsulation welding spot detection device and its control method, control device, control method includes: encapsulation device is welded on test platform;In the case where encapsulation device welding is completed, test signal is output to encapsulation device by test platform, so that encapsulation device is in normal working condition;First electric signal that encapsulation device is in normal working condition is output under the output of output class welding spot and is acquired;Interference signal is generated and is transmitted towards encapsulation device;Second electric signal that encapsulation device is in interference signal is output under the output of output class welding spot and is acquired;Determine test result based on all first electric signal and all second electric signal;Test result at least includes the degree of influence of each output class welding spot signal output by interference signal.The technical scheme of the application can determine the detection result that the output ability of encapsulation device output class welding spot is influenced by interference signal, and can provide information support for hardware design of back-end interference equipment manufacturer.

Description

Technical Field

[0001] This invention relates to the field of intelligent control technology, specifically to a packaged solder joint detection device and its control method and control device. Background Technology

[0002] The solder joints in the packaging are crucial bridges for electrical connection, mechanical fixation, and heat dissipation between the chip and the external circuit board. They are responsible for leading out signals from the internal circuitry of the chip and realizing electrical interconnection of the circuitry, as well as for firmly binding the chip to the substrate, providing support and fixation. At the same time, they also help dissipate the heat generated by the chip during operation, ensuring stable and reliable operation of the device.

[0003] In related technologies, after the solder joint configuration process of the package is completed, random sampling inspection is used to test the relevant performance of the solder joint, such as appearance integrity, structural shape, internal defects, electrical performance, etc. This inspection method can only test the packaged device in the factory state and cannot predict the problems that may exist in the solder joint after the packaged device is soldered. As packaged devices are used in high-power radio frequency interference equipment, the radio frequency performance of the solder joint has become one of the core factors for whether the packaged device can be successfully applied to high-power radio frequency interference equipment. Summary of the Invention

[0004] This application provides a packaged solder joint detection device and its control method and control device, aiming to solve the problem that the impact of interference signals on the output solder joints of packaged devices cannot be known in advance before product design.

[0005] To achieve the above objectives, this application provides a control method for a packaged solder joint detection device, the control method comprising: Solder the packaged device onto the test platform; After the soldering of the packaged device is completed, the test platform outputs a test signal to the packaged device to ensure that the packaged device is in normal working condition. Obtain the first electrical signal output by the output solder joint when the packaged device is in normal working condition; It generates interference signals and emits them toward the packaged device; Obtain the second electrical signal output by the solder joint of the packaged device under interference signal; Based on all the first electrical signals and all the second electrical signals, the test results are determined; the test results include at least the degree to which the signals output by each output type solder joint are affected by the interference signals.

[0006] Optionally, the step of generating an interference signal and emitting it toward the packaged device includes: Interference signals of different preset frequency bands are generated sequentially in order from low to high frequency. Each generated interference signal is emitted toward the packaged device.

[0007] Optionally, the step of determining the test result based on all the first electrical signals and all the second electrical signals includes: For each output solder joint, the second electrical signal collected under the interference signals of different preset frequency bands will be compared with the first signal. Determine the distortion of the second electrical signal; The output solder joints, distortion, and corresponding preset frequency bands are correlated to generate at least some test results.

[0008] Optionally, determining the distortion of the second electrical signal includes: Determine the error signal between the second electrical signal and the first electrical signal; Calculate the correlation between the error signal and the interference signal; If the correlation is not less than the first preset correlation, then the distortion of the second electrical signal is calculated based on the error signal and the first signal; If the correlation is less than the second preset correlation, the distortion of the second electrical signal is set to 0.

[0009] Optionally, the first preset correlation is 75%; the second preset correlation is 25%.

[0010] Optionally, the step of generating interference signals in different preset frequency bands sequentially in ascending order of frequency bands includes: After each transmission of the interference signal for the current preset frequency band, a preset buffer time is elapsed before generating the interference signal for the next preset frequency band.

[0011] Optionally, the step of generating interference signals in different preset frequency bands sequentially in ascending order of frequency bands further includes: During the preset buffer time, the electrical signal transmitted by each output type solder joint is acquired as the third electrical signal; Determine whether the first and third electrical signals of all output solder joints are matched one-to-one. If so, switch to output the interference signal of the next preset frequency band; If not, based on the preset frequency band of the generated interference signal, at least part of the test results of the packaged device are determined, and other packaged devices of the same type are selected and placed on the test platform to complete the test of the remaining preset frequency band interference signals of the packaged device of that type.

[0012] Optionally, other packaged devices of the same type are selected and placed on the test platform to complete the testing of the remaining preset frequency band interference signals of this type of packaged device, including: Select another packaged device of the same type, place it on the test platform, and perform soldering operation on the selected packaged device using the soldering method; After the soldering of the reselected packaged device is completed, the test platform outputs a test signal to the reselected packaged device to ensure that the reselected packaged device is in normal working condition. Acquire the first electrical signal transmitted by each solder joint when the reselected packaged device is in normal working condition; Starting from the next preset frequency band of the last interference signal generated in the test of the previous packaged device, interference signals of the remaining preset frequency bands are generated in order from low to high frequency and emitted toward the packaged device. Then return to the step of "obtaining the second electrical signal output by the output solder joint of the packaged device under interference signal" and subsequent steps until the remaining preset frequency band test is completed.

[0013] The present invention also proposes a control device for a packaged solder joint detection device, the control device comprising: Memory; Processor; and, The control program for the packaged solder joint detection device, stored in the memory and executed by the processor, implements the control method for the packaged solder joint detection device as described above when executed by the processor.

[0014] The present invention also proposes a package solder joint detection device, including a control device as described above for the package solder joint detection device.

[0015] This invention relates to a method for soldering a packaged device onto a test platform. After soldering, the test platform outputs a test signal to the packaged device to ensure it is in normal operating condition. The method acquires a first electrical signal from the output solder joints of the packaged device in normal operating condition. An interference signal is generated and emitted towards the packaged device. A second electrical signal from the output solder joints of the packaged device under the interference signal is acquired. Based on all the first and second electrical signals, test results are determined, including at least the degree to which the output signals of each output solder joint are affected by the interference signal. This provides information on the adaptability of each output solder joint of this type of packaged device to interference signals, thus providing information support for the subsequent hardware design of interference equipment manufacturers and solving the problem that interference equipment manufacturers cannot know in advance the impact of interference signals on the output solder joints of packaged devices. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this disclosure, the accompanying drawings of the embodiments of this disclosure will be briefly described below. Flowcharts are used in this application to illustrate the operations performed by the apparatus according to the embodiments of this application. It should be understood that the preceding or following operations are not necessarily performed precisely in sequence. Instead, various steps can be processed in reverse order or simultaneously as needed. Furthermore, other operations can be added to these processes, or one or more steps can be removed from these processes.

[0017] Figure 1 This is a flowchart illustrating an embodiment of the control method for the solder joint detection device of the present invention.

[0018] Figure 2 This is a flowchart illustrating step S200 in one embodiment of the control method for the solder joint detection device of the present invention. Figure 3 This is a flowchart illustrating step S410 in one embodiment of the control method for the solder joint detection device of the present invention. Figure 4 This is a flowchart illustrating step S600 in one embodiment of the control method for the solder joint detection device of the present invention. Figure 5 This is a schematic diagram of the structure of a control device of the solder joint detection device of the present invention.

[0019] Explanation of reference numerals in the attached figures: Detailed Implementation

[0020] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0021] In practical applications, it has been found that when packaged devices are used in high-power radio frequency jamming equipment (such as wireless communication jammers and drone jamming equipment), interference signals may couple into the electrical signals transmitted through the solder joints, leading to abnormal output conditions of the packaged device. For example, the period and frequency of the control signals output by the packaged device may become abnormal. Currently, the user manuals provided by packaged device manufacturers do not contain information on the adaptability of the output solder joints of this type of packaged device to interference signals. Therefore, backend jamming equipment manufacturers need to conduct extensive testing during the design and selection phase to determine the appropriate packaged device.

[0022] To address the aforementioned issues, this application proposes a control method for a packaged solder joint detection device. The aim is to test in advance the adaptability of output solder joints of packaged devices to various interference signals, providing a reference for backend interference equipment manufacturers in product design. (Refer to...) Figure 1The control method includes: Step S100: Solder the packaged device onto the test platform; In this embodiment, the packaged solder joint detection device may include a test platform and a welding module. The test platform may have multiple test positions, each with multiple test contacts. These test contacts are used for one-to-one electrical connection with multiple solder joints of the packaged device. The packaged device to be tested can be placed on the test position by a robotic arm or a tester. After ensuring one-to-one contact between the multiple test contacts and the multiple solder joints of the packaged device, the welding module is controlled to weld the packaged device to achieve electrical connection between the solder joints and the test contacts.

[0023] Step S200: After the packaging device is soldered, a test signal is output to the packaging device through the test platform to make the packaging device work normally. In this embodiment, the test platform outputs corresponding test signals to the packaged device through test contacts to enable the simulated packaged device to be in normal working condition. The test signals include the operating voltage, control signals, clock signals, etc. required for the normal operation of the packaged device.

[0024] Step S300: Obtain the first electrical signal output by the output type solder joint when the packaged device is in normal working condition; Based on input / output classification, solder joints can be divided into output solder joints and input solder joints. Output solder joints are used to output electrical signals to test contacts, while input solder joints are used to receive electrical signals transmitted by test contacts. It should be noted that if interference signal coupling occurs, the electrical signals output by output solder joints will simultaneously become abnormal, while the signals transmitted by input solder joints will be less affected, or even virtually unaffected. Therefore, in this embodiment, the detection device can determine the output solder joints within the packaged device's solder joint information, identify the test contacts connected to the output solder joints, and use the electrical signals received by these test contacts as the first electrical signal. It can be understood that the first electrical signal corresponds to the electrical signal output of the output solder joints when the packaged device is operating normally.

[0025] Step S400: Generate an interference signal and emit it toward the packaged device; In this embodiment, the detection device can modulate and generate interference signals of corresponding signal type and frequency band, and transmit them toward the space where the packaged device is located, so that the packaged device is under the action of the interference signal, thereby simulating the working environment of the interference device.

[0026] Step S500: Obtain the second electrical signal output by the output solder joint of the packaged device under interference signal; It is understandable that the second electrical signal corresponds to the electrical signal output of the solder joint of the packaged device under the action of interference signal.

[0027] Step S600: Based on all the first electrical signals and all the second electrical signals, determine the test results; the test results shall at least include the degree to which the signals output by each output type solder joint are affected by the interference signals.

[0028] In this embodiment, by comparing the first electrical signal with the corresponding second electrical signal, the degree to which the output of each output type solder joint is affected by the interference signal can be determined. By associating and storing the degree of influence and the interference signal information, the test results of the degree of influence of the interference signal on all output type solder joints of this type of packaged device can be obtained.

[0029] The technical solution of this invention involves soldering a packaged device onto a test platform; after soldering, the test platform outputs a test signal to the packaged device to ensure it is in normal working condition; acquiring the first electrical signal output by the output solder joints of the packaged device in normal working condition; generating an interference signal and transmitting it towards the packaged device; acquiring the second electrical signal output by the output solder joints of the packaged device under the interference signal; and determining, based on all the first and second electrical signals, at least the degree of influence of the interference signal on the output signals of each output solder joint. In this way, the adaptability information of each output solder joint of this type of packaged device to interference signals can be obtained, thus providing information support for the subsequent hardware design of interference equipment manufacturers and solving the problem that interference equipment manufacturers cannot know in advance the impact of interference signals on the output solder joints of packaged devices.

[0030] Reference Figure 2 The step S400 of generating an interference signal and emitting it toward the packaged device includes: Step S410: Generate interference signals of different preset frequency bands in order from low to high frequency bands; Step S410: Transmit each generated interference signal toward the packaged device.

[0031] In actual testing, it was found that when the power of the interference signal is high, the higher the frequency band of the interference signal, the more likely it is to cause irreversible damage to the packaged device. In order to ensure the consistency of the test hardware, this embodiment uses the frequency band from low to high to generate interference signals of different preset frequency bands in sequence, thereby ensuring that the same packaged device can be tested for as many interference signal frequency bands as possible.

[0032] Reference Figure 4 Step S600, which determines the test result based on all the first electrical signals and all the second electrical signals, includes: Step S610: For each output type solder joint, the second electrical signal collected under the interference signals of different preset frequency bands is compared with the first signal respectively; Step S620: Determine the distortion of the second electrical signal; Step S630: Associate the output solder joints, distortion, and corresponding preset frequency bands to generate at least some test results.

[0033] In this embodiment, an error signal can be obtained by comparing the first and second electrical signals collected from the same output type solder joint. After calculating the first RMS value (Root Mean Square) of the error signal and the RMS value of the first electrical signal, the ratio of the first RMS value to the second RMS value yields the distortion of the second electrical signal. It is understood that when the first and second electrical signals are identical, the distortion is 0, indicating that interference signals in the current preset frequency band do not affect the output of this output type solder joint.

[0034] The test results include the signal distortion of each output solder joint under the influence of interference signals in different preset frequency bands. The test results may also include information about the interference signal (such as signal type and signal power) and information about the test environment (ambient temperature, etc.).

[0035] In actual testing, it was found that although the distortion was mostly caused by the interference signal, there was also a small probability that it was caused by other factors such as the complex communication environment at the scene. In this case, it is easy to mistakenly associate the distortion caused by other factors with the current preset frequency band, thus causing the distortion associated with the current preset frequency band to be incorrect.

[0036] To address the aforementioned problem, step S610, which determines the distortion of the second electrical signal, includes: Step S611: Determine the error signal between the second electrical signal and the first electrical signal; Step S612: Calculate the correlation between the error signal and the interference signal; Step S613: If the correlation is not less than the first preset correlation, then calculate the distortion of the second electrical signal based on the error signal and the first signal; Step S614: If the correlation is less than the second preset correlation, then the distortion of the second electrical signal is determined to be 0.

[0037] In this embodiment, the method for acquiring the error signal and the method for calculating the distortion can be referred to the aforementioned embodiment, and will not be repeated here. The waveforms of the error signal and the interference signal can be compared to determine the overlap between them, thereby obtaining the correlation between the error signal and the interference signal. It is understood that if the error signal is entirely caused by the interference signal, then the waveforms of some signals in the error signal and the interference signal should be completely identical; in this case, the correlation between the two is 100%.

[0038] The first preset correlation can be selected as a relatively high correlation value. When the correlation is not less than the first preset correlation value, it indicates that the cause of the error signal mainly originates from the interference signal. Therefore, the calculated distortion can be used as the distortion of the second electrical signal. The second preset correlation can be selected as a relatively low correlation value. When the correlation is less than the second preset correlation value, it indicates that the cause of the error signal is basically unrelated to the interference signal, and the calculated distortion is highly distorted. Therefore, the distortion of the second electrical signal can be set to 0. It is understandable that if the correlation is less than the first preset correlation but not less than the second preset correlation, it indicates that the degree of influence of the interference signal on the distortion is uncertain. In this case, the distortion can be set to a preset distortion value, or the distortion of this type of solder joint can be temporarily left blank, and the distortion under the influence of interference signals in this preset frequency band can be tested separately after eliminating other influencing factors.

[0039] In one specific embodiment, the first preset relevance is 75%, and the second preset relevance is 25%.

[0040] Reference Figure 3 Step S410, which generates interference signals of different preset frequency bands sequentially in ascending order of frequency band, includes: Step S411: After each transmission of the interference signal of the current preset frequency band, generate the interference signal of the next preset frequency band after a preset buffer time interval.

[0041] In this embodiment, the transmission of interference signals is paused during a preset buffer time, so that the packaged device can use the preset buffer time to eliminate the influence of the previous preset frequency band interference signal on the packaged device, thereby reducing or eliminating the influence of the previous preset frequency band interference signal on the distortion detection result of the next preset frequency band.

[0042] Furthermore, step S410, which generates interference signals of different preset frequency bands sequentially in ascending order of frequency band, also includes: Step S412: During the preset buffer time, acquire the electrical signal transmitted by each output type solder joint as the third electrical signal; Step S413: Determine whether the first and third electrical signals of all output solder joints are matched one-to-one; Step S414: If yes, then switch to output the interference signal of the next preset frequency band; Step S415: If not, then based on the preset frequency band of the generated interference signal, determine at least part of the test results of the packaged device, and reselect other packaged devices of the same type and place them on the test platform to complete the test of the remaining preset frequency band interference signal of the packaged device of that type.

[0043] In this embodiment, the preset buffer time includes a data acquisition time period and a calculation time period. The data acquisition time period is used to acquire the third electrical signal of each output type solder joint, and the calculation time period is used to execute step S413. Whether the two signals match can be determined by judging whether the distortion of the third electrical signal relative to the first electrical signal is less than a third preset correlation. Specifically: If the correlation is less than the third preset correlation, the two are confirmed to match, indicating that the third electrical signal and the first electrical signal are highly matched. If the third electrical signal and the first electrical signal of all output solder joints match, it indicates that the influence of the preset segment interference signal of the previous test has been basically eliminated. At this time, the output can be switched to the interference signal of the next preset frequency band for testing. If the correlation is greater than or equal to the third preset correlation, the two are confirmed to be mismatched, indicating that the third electrical signal and the first electrical signal are significantly different. If the third electrical signal and the first electrical signal of any output solder joint do not match, it indicates that the influence of the preset segment interference signal of the previous test cannot be basically eliminated (at this time, the packaged device is usually damaged to some extent). Testing the interference signal of the next preset frequency band of the packaged device will result in a large error. At this time, partial test results can be generated based on the correlation of the preset frequency band that has been tested, and the same type of packaged device can be reselected and placed on other test positions to repeat the above test operation. The difference from the above test operation is that the preset frequency band of the interference signal emitted by the re-soldered packaged device is not regenerated from the lowest preset frequency band, but rather the interference signal of the next preset frequency band is generated starting from the frequency band that the previous packaged device has been tested.

[0044] Specifically, in step S415, other packaged devices of the same type are selected and placed on the test platform to complete the test of the remaining preset frequency band interference signals of this type of packaged device, including: After the soldering of the reselected packaged device is completed, the test platform outputs a test signal to the reselected packaged device to ensure that the reselected packaged device is in normal working condition. Acquire the first electrical signal transmitted by each solder joint when the reselected packaged device is in normal working condition; Starting from the next preset frequency band of the last interference signal generated in the test of the previous packaged device, interference signals of the remaining preset frequency bands are generated in order from low to high frequency and emitted toward the packaged device. Then return to the step of "obtaining the second electrical signal output by the output solder joint of the packaged device under interference signal" and subsequent steps until the remaining preset frequency band test is completed.

[0045] Understandably, if the replaced packaged device exhibits the condition defined in step S415 again during testing, the packaged device will be replaced again for testing until all remaining interference signals in the preset frequency bands have been tested. Thus, the technical solution of this invention utilizes a preset buffer time to determine whether the packaged device is damaged during testing. This not only avoids using a damaged packaged device for testing without knowing it is damaged, but also eliminates the need for an additional detection time period specifically for detecting packaged device damage. Therefore, it improves both the accuracy and efficiency of test results.

[0046] This invention also proposes a control device for a packaged solder joint detection device. (See reference...) Figure 4 The control device for the solder joint inspection device includes: Memory 11; and, The processor 12 stores a control program for the packaged solder joint detection device in the memory 11 and executes it. When the control program for the packaged solder joint detection device is executed by the processor 12, it implements the control method for the packaged solder joint detection device as described above.

[0047] The specific steps of the control method for the packaged solder joint detection device are as described in the above embodiments. Since the control device of the packaged solder joint detection device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, and will not be repeated here. The memory 11 can be a high-speed RAM memory or a stable memory (non-volatile memory), such as a disk storage device. The memory 11 can also optionally be a storage device independent of the aforementioned control device of the packaged solder joint detection device. The processor 12 can be a CPU. The memory 11 and the processor 12 are connected by a communication bus 13, which can be a UART bus or an I2C bus.

[0048] The present invention also proposes a packaged solder joint detection device, which includes a control device for the packaged solder joint detection device. The specific structure of the control device for the packaged solder joint detection device is as described in the above embodiments. Since the packaged solder joint detection device adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought about by the technical solutions of the above embodiments, which will not be described in detail here.

[0049] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A control method for a packaged solder joint detection device, characterized in that, The control method includes: Solder the packaged device onto the test platform; After the soldering of the packaged device is completed, the test platform outputs a test signal to the packaged device to ensure that the packaged device is in normal working condition. Obtain the first electrical signal output by the output solder joint when the packaged device is in normal working condition; It generates interference signals and emits them toward the packaged device; Obtain the second electrical signal output by the solder joint of the packaged device under interference signal; Based on all the first electrical signals and all the second electrical signals, the test results are determined; the test results include at least the degree to which the signals output by each output type solder joint are affected by the interference signals.

2. The control method as described in claim 1, characterized in that, The steps of generating an interference signal and emitting it toward the packaged device include: Interference signals of different preset frequency bands are generated sequentially in order from low to high frequency. Each generated interference signal is emitted toward the packaged device.

3. The control method as described in claim 2, characterized in that, The steps for determining the test results based on all the first electrical signals and all the second electrical signals include: For each output solder joint, the second electrical signal collected under the interference signals of different preset frequency bands will be compared with the first signal. Determine the distortion of the second electrical signal; The output solder joints, distortion, and corresponding preset frequency bands are correlated to generate at least some test results.

4. The control method as described in claim 3, characterized in that, Determining the distortion of the second electrical signal includes: Determine the error signal between the second electrical signal and the first electrical signal; Calculate the correlation between the error signal and the interference signal; If the correlation is not less than the first preset correlation, then the distortion of the second electrical signal is calculated based on the error signal and the first signal; If the correlation is less than the second preset correlation, the distortion of the second electrical signal is set to 0.

5. The control method as described in claim 4, characterized in that, The first preset relevance is 75%; the second preset relevance is 25%.

6. The control method as described in claim 2, characterized in that, The steps of generating interference signals in different preset frequency bands sequentially from low to high frequency include: After each transmission of the interference signal for the current preset frequency band, a preset buffer time is elapsed before generating the interference signal for the next preset frequency band.

7. The control method as described in claim 6, characterized in that, The step of generating interference signals in different preset frequency bands sequentially from low to high frequency also includes: During the preset buffer time, the electrical signal transmitted by each output type solder joint is acquired as the third electrical signal; Determine whether the first and third electrical signals of all output solder joints are matched one-to-one. If so, switch to output the interference signal of the next preset frequency band; If not, based on the preset frequency band of the generated interference signal, at least part of the test results of the packaged device are determined, and other packaged devices of the same type are selected and placed on the test platform to complete the test of the remaining preset frequency band interference signal of the packaged device of that type.

8. The control method as described in claim 7, characterized in that, Select other packaged devices of the same type and place them on the test platform to complete the test of the remaining preset frequency band interference signals of this type of packaged device, including: Select another packaged device of the same type, place it on the test platform, and perform soldering operation on the selected packaged device using the soldering method; After the soldering of the reselected packaged device is completed, the test platform outputs a test signal to the reselected packaged device to ensure that the reselected packaged device is in normal working condition. Acquire the first electrical signal transmitted by each solder joint when the reselected packaged device is in normal working condition; Starting from the next preset frequency band of the last interference signal generated in the test of the previous packaged device, interference signals of the remaining preset frequency bands are generated in order from low to high frequency and emitted toward the packaged device. Then return to the step of "obtaining the second electrical signal output by the output solder joint of the packaged device under interference signal" and subsequent steps until the remaining preset frequency band test is completed.

9. A control device for a packaged solder joint detection device, characterized in that, The control device includes: Memory; Processor; and, The control program for the packaged solder joint detection device, stored in the memory and executed by the processor, implements the control method for the packaged solder joint detection device as described in any one of claims 1-8 when executed by the processor.

10. A device for detecting solder joints in a package, characterized in that, The control device includes the packaging solder joint detection device as described in claim 9.

Images