Floating temperature-controlled press device for batch testing of chips

Abstract

The application discloses a floating temperature control press device for batch testing of chips, comprising a detection mechanism and a floating temperature control mechanism, wherein the detection mechanism comprises a detection carrier provided with a plurality of chip detection carriers; the floating temperature control mechanism comprises a temperature control cabin provided with a heat exchange chamber and a plurality of temperature control units; the heat exchange chamber is provided with a cold source circulation loop; the temperature control unit comprises a pressure maintaining top seat, a temperature control press head and a heat exchanger; the pressure maintaining top seat is provided with a pneumatic control floating rod; the heat exchanger is provided with a first end penetrating through the temperature control cabin and connected with the pneumatic control floating rod and a second end penetrating through the temperature control cabin and connected with the temperature control press head. The independent pneumatic control floating temperature control unit array layout is adopted, so that the batch low-temperature detection of multiple chips can be realized synchronously, and the test efficiency is greatly improved. The pneumatic control floating press pressure is constant and controllable, the pressures of the chips are consistent during batch detection, overpressure damage is avoided, and the low-temperature test yield is ensured. Without batch and equipment testing, the single machine can complete the batch low-temperature and high-temperature detection of chips.

Description

Technical Field

[0001] This invention relates to a floating temperature-controlled pressing device for batch testing of chips, belonging to the technical field of high-temperature and low-temperature chip testing. Background Technology

[0002] In chip manufacturing and testing, high and low temperature testing is a crucial step in ensuring chip quality. During testing, a temperature-controlled mold is precisely pressed against the chip to effectively conduct heat or cold, thereby verifying the chip's performance under extreme temperature environments. To avoid damaging the chip during the pressing process, a certain buffer space is typically maintained to achieve flexible pressing.

[0003] In existing technologies, most chip high and low temperature testing crimping protection uses a passive floating structure, relying on springs for buffering. However, this method has significant drawbacks: firstly, the spring's elastic coefficient is unstable and greatly affected by the compression stroke and ambient temperature, causing the crimping pressure to fluctuate. Insufficient pressure leads to poor contact between the temperature control mold and the chip, preventing proper temperature conduction and affecting test results; secondly, excessive pressure directly causes scratches on the chip surface, damage to the package, or even damage to the chip's internal circuitry, significantly reducing test yield.

[0004] On the other hand, in traditional testing equipment, the compatibility between the temperature control head and the chip pressing adjustment is poor. Chips with different packages and thicknesses require individual adjustment of the spring preload, which is cumbersome and inefficient. More importantly, low temperature testing and high temperature testing usually need to be carried out on different equipment. The chips need to be transferred between different equipment, which not only increases the risk of chip bumps and damage, but also prolongs the testing cycle and increases labor costs.

[0005] Meanwhile, in the existing technology, if a floating buffer is to be achieved for the temperature control head, an additional floating structure needs to be designed on the chip carrier. This design will destroy the structural stability of the carrier, causing the chip positioning to shift, which in turn affects the crimping and conduction effect. It cannot meet the high efficiency requirements of batch testing, and it is also difficult to adapt to the testing scenarios of chips of different specifications, resulting in poor practicality. Summary of the Invention

[0006] The purpose of this invention is to address the shortcomings of the prior art. In high and low temperature testing of chips, the traditional spring floating structure has unstable pressing pressure, poor adaptability, and cannot achieve batch testing at low temperatures, which can easily damage the chips. At the same time, the floating design of the carrier affects the conduction stability. Therefore, a floating temperature-controlled pressing device for batch testing of chips is proposed.

[0007] To achieve the above objectives, the technical solution adopted by the present invention is as follows: A floating temperature-controlled pressing device for batch testing of chips includes: The testing mechanism includes a testing carrier with lifting displacement, and the testing carrier is provided with a plurality of chip testing carriers; The floating temperature control mechanism includes a temperature control chamber with a heat exchange chamber located on top of the detection carrier, and a plurality of temperature control units arranged on the temperature control chamber corresponding one-to-one with the chip detection carrier. The heat exchange chamber has a cold source circulation loop. The temperature control unit includes a pressure-holding top seat installed on the top of the temperature control chamber, a heat exchanger located inside the heat exchange chamber, and a temperature control pressure head located at the bottom of the temperature control chamber. The pressure-holding top seat is equipped with a pneumatically controlled floating rod. The heat exchanger has a first end that penetrates through the temperature control chamber and is connected to the pneumatically controlled floating rod, and a second end that penetrates through the temperature control chamber and is connected to the temperature control pressure head. Floating stroke gaps are respectively left between the top wall of the heat exchanger and the top wall of the heat exchange chamber, and between the bottom wall of the heat exchanger and the bottom wall of the heat exchange chamber.

[0008] Preferably, the pressure-holding top seat includes a pressure-holding base and a pressure-holding cover plate spliced ​​with the pressure-holding base. A pneumatic diaphragm is provided between the pressure-holding base and the pressure-holding cover plate. The pressure-holding cover plate is provided with a pressure control channel that cooperates with the pneumatic diaphragm and is connected to an air source. The pressure-holding base is provided with a guide channel for guiding the pneumatically controlled floating rod. The pneumatic diaphragm is drively connected to the pneumatically controlled floating rod.

[0009] Preferably, the heat exchange chamber includes an air inlet and an air outlet, and the cold source circulation loop is connected between the air inlet and the air outlet.

[0010] Preferably, the heat exchanger includes a heat exchanger body, and the heat exchanger body is provided with a plurality of spaced-apart airflow grooves, the groove direction of which is consistent with the airflow direction in the heat exchange chamber.

[0011] Preferably, the heat exchanger body has a detachable top seat with the first end mounted on its top and a detachable bottom seat with the second end mounted on its bottom.

[0012] Preferably, sealing structures are provided between the first end and the temperature control chamber, and between the second end and the temperature control chamber.

[0013] Preferably, the temperature-controlled pressure head includes a pressure head body and a heating base connecting the pressure head body and the second end, wherein the heating base is provided with a heat-conducting connector connecting the pressure head body and the second end.

[0014] Preferably, the testing mechanism includes a testing frame, the testing frame is provided with a plurality of guide columns penetrating the testing base, the testing base is provided with a lifting power source, and the lifting end of the lifting power source penetrates the testing base and is connected to the testing frame for transmission.

[0015] Preferably, the detection carrier includes a carrier top plate, a carrier bottom plate, and a plurality of connecting ribs disposed between the carrier top plate and the carrier bottom plate, and the lifting power source is disposed on the carrier bottom plate; The chip testing carrier is mounted on the top of the carrier top plate, and a power distribution frame is provided at the bottom of the carrier top plate. The power distribution frame is provided with a testing circuit board that is electrically connected to any of the chip testing carriers.

[0016] The beneficial effects of this invention are mainly reflected in: 1. It adopts an independent gas-controlled floating temperature control unit array layout, which can simultaneously realize batch low-temperature testing of multiple chips, greatly improving testing efficiency.

[0017] 2. The air-controlled floating pressure is constant and controllable, ensuring consistent pressure on each chip during batch testing, preventing overpressure damage and guaranteeing yield in low-temperature testing.

[0018] 3. No need for batch or separate equipment testing; a single machine can complete batch low-temperature and high-temperature testing of chips. Attached Figure Description

[0019] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings: Figure 1 This is a schematic diagram of the floating temperature-controlled pressing device for batch testing of chips according to the present invention.

[0020] Figure 2 This is another perspective structural schematic diagram of the floating temperature-controlled pressing device for batch testing of chips according to the present invention.

[0021] Figure 3 This is a schematic diagram of the detection mechanism in the floating temperature-controlled pressing device for batch testing of chips according to the present invention.

[0022] Figure 4 This is a schematic diagram of the overall structure of the floating temperature control mechanism in the floating temperature control pressing device for chip batch testing of the present invention.

[0023] Figure 5 This is a schematic diagram of the floating temperature control mechanism in the floating temperature control pressing device for batch testing of chips according to the present invention.

[0024] Figure 6 This is a top view of the floating temperature control mechanism in the floating temperature control pressing device for batch testing of chips according to the present invention.

[0025] Figure 7 yes Figure 6 Schematic diagram of the cross-sectional structure of AA.

[0026] Figure 8 This is a schematic diagram of the temperature control unit in the floating temperature control pressing device for batch testing of chips according to the present invention. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0028] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in the present application can be combined with each other.

[0029] This invention provides a floating temperature-controlled pressing device for batch testing of chips, such as... Figures 1 to 8 As shown, it includes a detection mechanism 1 and a floating temperature control mechanism 2.

[0030] The testing mechanism 1 includes a testing carrier 3 with lifting displacement, and a number of chip testing carriers 4 are provided on the testing carrier 3.

[0031] The floating temperature control mechanism 2 includes a temperature control chamber 5 with a heat exchange chamber 50 located on top of the detection carrier 3, and a plurality of temperature control units 6 arranged on the temperature control chamber 5 corresponding one-to-one with the chip detection carrier.

[0032] The heat exchange chamber 50 has a cold source circulation loop 500. The temperature control unit 6 includes a pressure-holding top seat 61 set on the top of the temperature control chamber 5, a heat exchanger 62 located in the heat exchange chamber, and a temperature control pressure head 63 located at the bottom of the temperature control chamber. The pressure-holding top seat 61 is provided with a pneumatically controlled floating rod 7. The heat exchanger 62 has a first end 621 that penetrates the temperature control chamber and is connected to the pneumatically controlled floating rod, and a second end 622 that penetrates the temperature control chamber and is connected to the temperature control pressure head. Floating stroke gaps 8 are left between the top wall of the heat exchanger and the top wall of the heat exchange chamber, and between the bottom wall of the heat exchanger and the bottom wall of the heat exchange chamber.

[0033] Detailed implementation process and principle explanation: During the low-temperature chip testing, the chip is mounted on the chip testing carrier 4.

[0034] The cold source circulation loop 500 cools the medium in the heat exchange chamber 50. The medium generally includes liquid or gas phase, which is sufficient to transfer cooling to the heat exchanger 62. The heat exchanger 62 conducts low-temperature conduction in the cold medium state, so that the exposed temperature control head 63 meets the low-temperature requirements of the test.

[0035] During testing, the test carrier 3 is lifted, and the chip inside the chip test carrier 4 comes into contact with the temperature control head 63. At this time, the temperature control head 63 is subjected to a reverse force, which is transmitted to the pneumatic floating rod 7 by the heat exchanger. The pneumatic floating rod 7 achieves floating engagement through air pressure control, so that the temperature control head 63 and the chip maintain a stable contact pressure.

[0036] The temperature control head 63 continuously maintains the chip at a low temperature, thereby meeting the chip's low-temperature testing requirements. This satisfies the needs of batch low-temperature testing, while also enabling stable floating contact of a single unit.

[0037] In one specific embodiment, the pressure-holding top seat 61 includes a pressure-holding base 611 and a pressure-holding cover plate 612 spliced ​​with the pressure-holding base. A pneumatic diaphragm 613 is provided between the pressure-holding base 611 and the pressure-holding cover plate 612. The pressure-holding cover plate is provided with a pressure control channel 614 that cooperates with the pneumatic diaphragm and is connected to an air source. The pressure-holding base 611 is provided with a guide channel for guiding the pneumatically controlled floating rod 7. The pneumatic diaphragm is connected to the pneumatically controlled floating rod in a driving connection.

[0038] Specifically, the pressure of the pressure control channel 614 is controlled according to the actual pressure. At this time, the pneumatic diaphragm 613 will generate pressure deformation. When it comes into contact with the chip, it can achieve relatively sensitive pressure detection, thereby keeping the pressure with the chip within the control range. This ensures stable contact without damaging the chip.

[0039] It should be noted that during batch testing, each temperature control unit 6 can achieve its own floating coordination. That is, when a single lifting displacement occurs, multiple vehicles will be individually controlled and protected by the temperature control unit 6. Batch testing of contact can maintain their respective reliable contact force.

[0040] In this case, due to the need for coordination with a cold source, the design of this pneumatic diaphragm 613 is adopted to achieve pneumatic coordination of the pneumatically controlled floating rod 7 and maintain stable pressure with high precision control. Of course, other mechanisms can also be used to control the pressure of the pneumatically controlled floating rod 7. Any mechanism that satisfies the need to maintain stable chip pressure is within the protection scope of this case.

[0041] In one specific embodiment, the heat exchange chamber 50 includes an air inlet end 51 and an air outlet end 52, and a cold source circulation loop is connected between the air inlet end and the air outlet end.

[0042] Specifically, the cold source circulation loop can be located externally or internally within the heat exchange chamber 50, as long as it satisfies the requirement of conducting fluid medium flow within the heat exchange chamber 50 to cool the heat exchanger. In this embodiment, an external circulation structure is adopted, meaning the cold source circulation loop can form an airflow channel for the internal heat exchanger through the inlet end 51 to the outlet end 52, thereby achieving efficient heat exchange and cooling.

[0043] In one specific embodiment, the heat exchanger 62 includes a heat exchanger body 623, on which a plurality of airflow grooves 624 are provided at intervals, and the direction of the airflow grooves is consistent with the direction of airflow in the heat exchange chamber.

[0044] In order to satisfy the requirements of heat exchange area and efficiency, finned structures and other structures can also be used. As long as the heat exchanger structure meets the requirements of efficient heat exchange for refrigeration, it is within the scope of protection of this case.

[0045] In one specific embodiment, the heat exchanger body 623 has a top seat with a detachable first end mounted on its top and a bottom seat with a detachable second end mounted on its bottom.

[0046] This satisfies the assembly requirements and ensures the transmission requirements.

[0047] In one specific embodiment, sealing structure 9 is provided between the first end and the temperature control chamber and between the second end and the temperature control chamber, respectively.

[0048] The sealing structure 9 can maintain the airtightness of the heat exchange chamber 50 without affecting the floating displacement, thus ensuring operational reliability and reducing energy consumption.

[0049] In one specific embodiment, the temperature-controlled pressure head 63 includes a pressure head body 631 and a heating seat 632 connecting the pressure head body and the second end. The heating seat 632 is provided with a heat-conducting connector that connects the pressure head body and the second end.

[0050] Specifically, chip testing involves extreme temperature tests, such as low and high temperatures. Current technologies typically perform low and high temperature tests separately, and there are also low and high temperature tests on a single chip. However, it is currently impossible to perform batch testing of low and high temperatures simultaneously.

[0051] In this case, a heat exchanger is used for low-temperature conduction, which enables batch low-temperature testing. At the same time, the temperature control head 63 achieves high-temperature testing by mounting a heating seat 632. In addition, the heat-conducting connecting body meets the requirements for low-temperature transfer, thus satisfying the requirements for batch low-temperature testing and high-temperature testing.

[0052] In one specific embodiment, the testing mechanism 1 includes a testing frame 11, which is provided with a plurality of guide columns 12 that penetrate the testing base 3. The testing base 3 is provided with a lifting power source 30, and the lifting end of the lifting power source penetrates the testing base and is connected to the testing frame in a transmission manner.

[0053] The lifting power source 30 drives the detection frame to extend and retract, thereby satisfying the reaction lifting displacement control, and the guide column 12 realizes the lifting displacement guidance, ensuring the lifting displacement accuracy.

[0054] In one specific embodiment, the detection carrier 3 includes a carrier top plate, a carrier bottom plate, and a plurality of connecting ribs disposed between the carrier top plate and the carrier bottom plate. The lifting power source is disposed on the carrier bottom plate. The chip detection carrier is disposed on the top of the carrier top plate, and the bottom of the carrier top plate is provided with a power distribution frame 10. The power distribution frame 10 is provided with a detection circuit board electrically connected to any chip detection carrier.

[0055] The construction of the testing mechanism 1 is thus satisfied. The testing carrier 3 is an existing technology. In this embodiment, the design of the power distribution carrier 10 is added to meet the requirements of mounting the testing circuit boards for low temperature and high temperature testing on the same platform. The space layout is reasonable and compact.

[0056] As described above, the use of an independent pneumatically controlled floating temperature control unit array layout allows for simultaneous batch low-temperature testing of multiple chips, significantly improving testing efficiency. The pneumatically controlled floating pressure is constant and controllable, ensuring consistent pressure across all chips during batch testing, preventing overpressure damage and guaranteeing high yield rates for low-temperature testing. No batch or separate equipment testing is required; a single unit can complete batch low-temperature and high-temperature testing of chips.

[0057] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent in such process, method, article, or apparatus / device.

[0058] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A floating temperature-controlled pressing device for batch testing of chips, characterized in that... include: The testing mechanism includes a testing carrier with lifting displacement, and the testing carrier is provided with a plurality of chip testing carriers; The floating temperature control mechanism includes a temperature control chamber with a heat exchange chamber located on top of the detection carrier, and a plurality of temperature control units arranged on the temperature control chamber corresponding one-to-one with the chip detection carrier. The heat exchange chamber has a cold source circulation loop. The temperature control unit includes a pressure-holding top seat installed on the top of the temperature control chamber, a heat exchanger located inside the heat exchange chamber, and a temperature control pressure head located at the bottom of the temperature control chamber. The pressure-holding top seat is equipped with a pneumatically controlled floating rod. The heat exchanger has a first end that penetrates through the temperature control chamber and is connected to the pneumatically controlled floating rod, and a second end that penetrates through the temperature control chamber and is connected to the temperature control pressure head. Floating stroke gaps are respectively left between the top wall of the heat exchanger and the top wall of the heat exchange chamber, and between the bottom wall of the heat exchanger and the bottom wall of the heat exchange chamber.

2. The floating temperature-controlled pressing device for chip batch testing according to claim 1, characterized in that: The pressure-holding top seat includes a pressure-holding base and a pressure-holding cover plate spliced ​​with the pressure-holding base. A pneumatic diaphragm is provided between the pressure-holding base and the pressure-holding cover plate. The pressure-holding cover plate is provided with a pressure control channel that cooperates with the pneumatic diaphragm and is connected to an air source. The pressure-holding base is provided with a guide channel for guiding the pneumatically controlled floating rod. The pneumatic diaphragm is drively connected to the pneumatically controlled floating rod.

3. The floating temperature-controlled pressing device for batch testing of chips according to claim 1, characterized in that: The heat exchange chamber includes an air inlet and an air outlet, and the cold source circulation loop is connected between the air inlet and the air outlet.

4. The floating temperature-controlled pressing device for chip batch testing according to claim 1, characterized in that: The heat exchanger includes a heat exchanger body, on which a plurality of airflow grooves are provided at intervals, and the direction of the airflow grooves is consistent with the direction of airflow in the heat exchange chamber.

5. The floating temperature-controlled pressing device for chip batch testing according to claim 4, characterized in that: The heat exchanger body has a detachable top seat with the first end mounted on its top and a detachable bottom seat with the second end mounted on its bottom.

6. The floating temperature-controlled pressing device for chip batch testing according to claim 1, characterized in that: Sealing structures are provided between the first end and the temperature control chamber, and between the second end and the temperature control chamber.

7. The floating temperature-controlled pressing device for chip batch testing according to any one of claims 1 to 6, characterized in that: The temperature-controlled pressure head includes a pressure head body and a heating base connecting the pressure head body and the second end. The heating base is provided with a heat-conducting connector that connects the pressure head body and the second end.

8. The floating temperature-controlled pressing device for chip batch testing according to claim 1, characterized in that: The testing mechanism includes a testing frame, on which a plurality of guide columns penetrate the testing base are provided. The testing base is provided with a lifting power source, and the lifting end of the lifting power source penetrates the testing base and is connected to the testing frame in a transmission manner.

9. The floating temperature-controlled pressing device for chip batch testing according to claim 8, characterized in that: The detection carrier includes a carrier top plate, a carrier bottom plate, and a plurality of connecting ribs disposed between the carrier top plate and the carrier bottom plate, and the lifting power source is disposed on the carrier bottom plate; The chip testing carrier is mounted on the top of the carrier top plate, and a power distribution frame is provided at the bottom of the carrier top plate. The power distribution frame is provided with a testing circuit board that is electrically connected to any of the chip testing carriers.

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