Semiconductor voltage regulating module

Abstract

The utility model relates to a semiconductor voltage regulating module relates to semiconductor device technical field, include: casing, anode base plate, power chip group, cathode electrode assembly, compound elastic compression subassembly and integrated control unit. The inside of casing is equipped with installation cavity, and one side of casing is equipped with wiring port;Anode base plate is fixed in installation cavity bottom, and its top surface is equipped with chip mounting area;Power chip group, paste in chip mounting area, power chip group includes at least one semiconductor power device, and power chip group is electrically connected with anode base plate through bonding wire;Cathode electrode assembly is equipped with above power chip group, and with power chip group top surface elastic contact;Compound elastic compression subassembly, be equipped with cathode electrode assembly away from power chip group one side, for adjusting the compression force of main spring to cathode electrode assembly;Integrated control unit, fixed in installation cavity inside one side, be applicable to industrial heating, motor control, new energy power supply and so on to the scene of voltage regulating precision, environmental adaptability requirement higher.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, specifically to a semiconductor voltage regulation module. Background Technology

[0002] As a core component of power electronic systems, semiconductor voltage regulator modules achieve precise regulation of voltage and power through power semiconductor devices, and are widely used in industrial production, home appliances, new energy and other fields.

[0003] Traditional modules use a single disc spring to elastically press the power chip and electrodes together. This has limited elastic deformation compensation capabilities, and the spring is prone to fatigue after long-term operation. At the same time, the thermal expansion coefficients of the chip, electrodes and packaging structure differ greatly. The thermal stress generated during operation will disrupt the tight contact between them, leading to increased contact resistance and voltage drop, which in turn generates more heat and can easily cause module failure.

[0004] Existing modules mostly rely on external controllers for pressure regulation control, lacking an independent intelligent control core and unable to adapt to load changes autonomously. Furthermore, they do not integrate monitoring functions for key parameters such as pressure and temperature, making it impossible to achieve automatic calibration of contact pressure and fault early warning. Most modules lack communication interfaces, making it difficult to integrate into industrial IoT systems and failing to meet the needs for remote parameter setting, operation data uploading, and fault diagnosis. Summary of the Invention

[0005] In view of the above situation and to overcome the defects of the prior art, the present invention provides a semiconductor voltage regulation module, which at least partially solves the problems mentioned in the background art.

[0006] The technical solution adopted in this invention is as follows: A semiconductor voltage regulating module, comprising: The housing has an internal mounting cavity and a wiring port on one side. An anode substrate is fixed to the bottom of the mounting cavity, and its top surface is provided with a chip mounting area; A power chipset is mounted on the chip mounting area. The power chipset includes at least one semiconductor power device and is electrically connected to the anode substrate via bonding wires. A cathode electrode assembly is disposed above the power chipset and is in elastic contact with the top surface of the power chipset. A composite elastic clamping assembly is located on the side of the cathode electrode assembly away from the power chip group, and is used to adjust the clamping force of the main spring on the cathode electrode assembly; An integrated control unit is fixed inside one side of the mounting cavity.

[0007] Furthermore, the composite elastic clamping assembly includes a main spring, an auxiliary elastic pad, and an adjustment unit. The main spring is sleeved on the electrode post of the cathode electrode assembly, the auxiliary elastic pad is sandwiched between the main spring and the cathode electrode assembly, and the adjustment unit passes through the top of the housing and abuts against the main spring.

[0008] Furthermore, the integrated control unit includes a control chip, a drive circuit, and a sampling circuit. The sampling circuit is electrically connected to the power chipset and the cathode electrode assembly and is used to collect voltage and current signals. The drive circuit is electrically connected to the power chipset and is used to output drive signals.

[0009] In a further embodiment, the semiconductor voltage regulating module further includes a pressure detection unit disposed between the auxiliary elastic pad and the cathode electrode assembly.

[0010] In a further embodiment, the integrated control unit further includes a pressure feedback module electrically connected to the pressure detection unit.

[0011] In a further embodiment, the control chip of the integrated control unit has a built-in adaptive load identification algorithm, which can switch the voltage regulation control strategy according to the load impedance data collected by the sampling circuit.

[0012] In a further embodiment, the integrated control unit also includes a communication module that supports RS485, CAN or Ethernet communication protocols, enabling remote parameter setting, uploading of operating data and fault alarms.

[0013] In a further embodiment, the integrated control unit also includes a fault diagnosis module, which is electrically connected to the pressure detection unit and the sampling circuit. The fault diagnosis module can generate fault codes based on abnormal pressure and excessive voltage and current data, and output them through the communication module.

[0014] In a further embodiment, the adjustment unit includes an adjustment screw, a locking nut, and a pressure plate. The adjustment screw is threaded to the top of the housing, and its bottom end abuts against the main spring through the pressure plate. The locking nut is located on the outside of the adjustment screw to fix the adjusted position.

[0015] In a further embodiment, a heat dissipation boss is provided at the bottom of the mounting cavity, and the bottom surface of the anode substrate is in contact with the heat dissipation boss, and heat dissipation fins are provided on the outer side of the heat dissipation boss.

[0016] The beneficial effects achieved by the present invention using the above structure are as follows: The composite elastic clamping structure of disc springs and shape memory alloy elastic pads effectively compensates for thermal stress deformation, maintains stable contact pressure, and solves the vicious cycle of poor contact and subsequent temperature rise caused by thermal stress deformation, thus extending the module's service life. The anode substrate, heat dissipation bumps, and fins form an efficient heat dissipation path, significantly reducing the chip junction temperature. The integrated control unit has a built-in adaptive load identification algorithm that can automatically switch voltage regulation strategies to adapt to multiple types of loads and improve voltage regulation accuracy. The pressure feedback, fault diagnosis, and multi-protocol communication modules work together to achieve accurate fault alarms and remote control, simplifying operation and maintenance. Attached Figure Description

[0017] Figure 1 This is a cross-sectional view of the overall structure of the semiconductor voltage regulation module proposed in an embodiment of the present invention; Figure 2 This is a functional block diagram of the integrated control unit proposed in an embodiment of the present invention.

[0018] in, 1. Housing; 11. Mounting cavity; 12. Wiring port; 13. Heat dissipation boss; 14. Heat dissipation fins; 2. Anode substrate; 3. Power chipset; 4. Cathode electrode assembly; 5. Composite elastic clamping assembly, 51. Main spring, 52. Auxiliary elastic pad, 53. Adjustment unit, 531. Adjustment screw, 532. Locking nut, 533. Pressure plate; 6. Integrated control unit; 61. Control chip; 62. Drive circuit; 63. Sampling circuit; 64. Pressure detection unit; 65. Pressure feedback module; 66. Communication module; 67. Fault diagnosis module.

[0019] The accompanying drawings are provided to further understand the embodiments and form part of the specification. They are used together with the embodiments for explanation and do not constitute a limitation on the embodiments. Detailed Implementation

[0020] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection.

[0021] In the description of the embodiments, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings. They are only for the convenience of describing the embodiments and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments.

[0022] In the highly corrosive environment of sulfuric acid, the lining of conventional stirred tanks is prone to peeling off and the substrate is easily corroded, resulting in a short service life. Furthermore, the corrosion products will contaminate the sulfuric acid product and reduce its purity. The high viscosity of sulfuric acid makes it extremely easy to adhere to the bottom and walls of the tank. Existing stirred tanks cannot completely scrape off the adhered material. The residual material solidifies after cooling, which not only affects the reaction efficiency of the next batch, but also leads to a decrease in the product qualification rate due to material deterioration.

[0023] After recognizing the above problems, this application proposes and discloses a semiconductor voltage regulation module that combines high reliability, intelligence and wide adaptability, which is especially suitable for scenarios with high requirements for voltage regulation accuracy and environmental adaptability, such as industrial heating, motor control and new energy power supply.

[0024] like Figure 1 Figure 2 As shown in the figure, a semiconductor voltage regulating module provided in this disclosure includes: The housing 1 has an internal mounting cavity 11 and a wiring port 12 on one side. Anode substrate 2 is fixed to the bottom of the mounting cavity 11, and its top surface is provided with a chip mounting area; A power chip set 3 is mounted on the chip mounting area. The power chip set 3 includes at least one semiconductor power device and is electrically connected to the anode substrate 2 via bonding wires. The cathode electrode assembly 4 is disposed above the power chip group 3 and is in elastic contact with the top surface of the power chip group 3. The composite elastic clamping component 5 is located on the side of the cathode electrode assembly 4 away from the power chip group 3, and is used to adjust the clamping force of the main spring 51 on the cathode electrode assembly 4. An integrated control unit 6 is fixed inside one side of the mounting cavity 11.

[0025] In this embodiment, the anode substrate 2 is made of a composite material with high thermal conductivity and low coefficient of thermal expansion.

[0026] In this embodiment, the composite elastic clamping component 5 compensates for the thermal stress deformation caused by the difference in thermal expansion coefficients between the anode substrate 2, the power chip group 3, and the cathode electrode assembly 4 through elastic deformation, thereby maintaining a stable contact pressure between the power chip group 3 and the cathode electrode assembly 4.

[0027] As shown in Figure 1, the composite elastic compression assembly 5 includes a main spring 51, an auxiliary elastic pad 52, and an adjustment unit 53. The main spring 51 is sleeved on the electrode post of the cathode electrode assembly 4, the auxiliary elastic pad 52 is sandwiched between the main spring 51 and the cathode electrode assembly 4, and the adjustment unit 53 passes through the top of the housing 1 and abuts against the main spring 51.

[0028] In this embodiment, the main spring 51 of the composite elastic compression assembly 5 is a disc spring, and the auxiliary elastic pad 52 is a shape memory alloy elastic pad. The shape memory alloy elastic pad can adaptively adjust its elastic coefficient with temperature changes.

[0029] like Figure 2 As shown, the integrated control unit 6 includes a control chip 61, a drive circuit 62, and a sampling circuit 63. The sampling circuit 63 is electrically connected to the power chip group 3 and the cathode electrode assembly 4, and is used to collect voltage and current signals. The drive circuit 62 is electrically connected to the power chip group 3 and is used to output drive signals.

[0030] like Figure 1 and Figure 2 As shown, the semiconductor voltage regulation module also includes a pressure detection unit 64, which is disposed between the auxiliary elastic pad 52 and the cathode electrode assembly 4.

[0031] In this embodiment, the pressure detection unit 64 is used to collect contact pressure data in real time and transmit the data to the integrated control unit 6.

[0032] like Figure 2 As shown, the integrated control unit 6 also includes a pressure feedback module 65, which is electrically connected to the pressure detection unit 64.

[0033] In this embodiment, the pressure feedback module 65 can provide external feedback based on the detection data from the pressure detection unit 64.

[0034] In this embodiment, the control chip 61 of the integrated control unit 6 has a built-in adaptive load identification algorithm, which can switch the voltage regulation control strategy according to the load impedance data collected by the sampling circuit 63.

[0035] like Figure 2 As shown, the integrated control unit 6 also includes a communication module 66, which supports RS485, CAN or Ethernet communication protocols and can realize remote parameter setting, operation data uploading and fault alarm.

[0036] In this embodiment, the communication module 66 supports remote parameter setting without the need for on-site disassembly or shutdown for adjustment, thereby improving the continuous operation efficiency of the industrial production line. At the same time, it can upload key data such as voltage, current, contact pressure, and chip temperature in real time, making it easy for users to monitor the module's operating status through a host computer, enabling preventive maintenance and avoiding sudden failures.

[0037] like Figure 2 As shown, the integrated control unit 6 also includes a fault diagnosis module 67, which is electrically connected to the pressure detection unit 64 and the sampling circuit 63. It can generate fault codes based on abnormal pressure and excessive voltage and current data, and output them through the communication module 66.

[0038] In this embodiment, after a fault occurs, an alarm signal can be quickly output through the communication module 66. At the same time, in conjunction with the internal protection logic of the module, the fault can be prevented from escalating to avoid serious consequences such as chip burnout and circuit short circuit, thereby improving the reliability of the module operation. Maintenance personnel can quickly locate and handle the problem through the fault code, reducing maintenance manpower costs and extending the overall service life of the module.

[0039] like Figure 1 As shown, the adjustment unit 53 includes an adjustment screw 531, a locking nut 532 and a pressure plate 533. The adjustment screw 531 is threaded to the top of the housing 1, and its bottom end abuts against the main spring 51 through the pressure plate 533. The locking nut 532 is located on the outside of the adjustment screw 531 and is used to fix the adjusted position.

[0040] In this embodiment, the pressure plate 533 makes large-area contact with the main spring 51, avoiding spring deformation or uneven chip force caused by local pressure concentration, ensuring full and tight contact between the power chip group 3 and the cathode electrode assembly 4, and reducing contact resistance.

[0041] In this embodiment, the anti-loosening locking nut 532 can firmly fix the adjusted position, preventing the module from shifting pressure due to vibration under vibration and high temperature conditions, and ensuring stable contact pressure.

[0042] like Figure 1 As shown, the bottom of the mounting cavity 11 is provided with a heat dissipation boss 13, and the bottom surface of the anode substrate 2 is in contact with the heat dissipation boss 13. Heat dissipation fins 14 are provided on the outer side of the heat dissipation boss 13.

[0043] In this embodiment, the bottom surface of the anode substrate 2 is tightly attached to the protrusion with thermally conductive silicone grease, which greatly increases the thermal contact area and reduces the contact thermal resistance, enabling rapid heat conduction from the anode substrate 2 to the housing 1 and reducing heat retention points; the heat dissipation fins 14 can avoid airflow obstruction, ensure smooth airflow, and further improve heat dissipation efficiency.

[0044] It should be noted that, in this document, relational terms such as “first” and “second” are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0045] Although embodiments have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the material and spirit.

[0046] The embodiments have been described above, and such description is not restrictive. The figures shown are only one embodiment, and the actual structure is not limited to this. In short, if those skilled in the art are inspired by this description and design similar structures and embodiments without departing from the inventive spirit, they should all fall within the scope of protection.

Claims

1. A semiconductor voltage regulation module, characterized in that, include: The housing (1) has an installation cavity (11) inside and a wiring port (12) on one side. An anode substrate (2) is fixed to the bottom of the mounting cavity (11), and its top surface is provided with a chip mounting area; A power chip group (3) is mounted on the chip mounting area. The power chip group (3) includes at least one semiconductor power device and is electrically connected to the anode substrate (2) via bonding wires. The cathode electrode assembly (4) is disposed above the power chip group (3) and is in elastic contact with the top surface of the power chip group (3); A composite elastic clamping assembly (5) is located on the side of the cathode electrode assembly (4) away from the power chip group (3) and is used to adjust the clamping force of the main spring (51) on the cathode electrode assembly (4). An integrated control unit (6) is fixed inside one side of the mounting cavity (11).

2. The semiconductor voltage regulating module according to claim 1, characterized in that, The composite elastic compression assembly (5) includes a main spring (51), an auxiliary elastic pad (52) and an adjustment unit (53). The main spring (51) is sleeved on the electrode post of the cathode electrode assembly (4), the auxiliary elastic pad (52) is sandwiched between the main spring (51) and the cathode electrode assembly (4), and the adjustment unit (53) penetrates the top of the housing (1) and abuts against the main spring (51).

3. The semiconductor voltage regulating module according to claim 2, characterized in that, The integrated control unit (6) includes a control chip (61), a drive circuit (62) and a sampling circuit (63). The sampling circuit (63) is electrically connected to the power chip group (3) and the cathode electrode assembly (4) and is used to collect voltage and current signals. The drive circuit (62) is electrically connected to the power chip group (3) and is used to output drive signals.

4. The semiconductor voltage regulating module according to claim 3, characterized in that, The semiconductor voltage regulation module also includes a pressure detection unit (64), which is located between the auxiliary elastic pad (52) and the cathode electrode assembly (4).

5. The semiconductor voltage regulating module according to claim 4, characterized in that, The integrated control unit (6) further includes a pressure feedback module (65), which is electrically connected to the pressure detection unit (64).

6. The semiconductor voltage regulating module according to claim 3, characterized in that, The control chip (61) of the integrated control unit (6) has a built-in adaptive load identification algorithm, which can switch the voltage regulation control strategy according to the load impedance data collected by the sampling circuit (63).

7. The semiconductor voltage regulating module according to claim 5, characterized in that, The integrated control unit (6) also includes a communication module (66), which supports RS485, CAN or Ethernet communication protocols and can realize remote parameter setting, operation data uploading and fault alarm.

8. The semiconductor voltage regulating module according to claim 7, characterized in that, The integrated control unit (6) also includes a fault diagnosis module (67), which is electrically connected to the pressure detection unit (64) and the sampling circuit (63). It can generate fault codes based on abnormal pressure and excessive voltage and current data, and output them through the communication module (66).

9. The semiconductor voltage regulating module according to claim 1, characterized in that, The adjustment unit (53) includes an adjustment screw (531), a locking nut (532) and a pressure plate (533). The adjustment screw (531) is threaded to the top of the housing (1), and the bottom end abuts against the main spring (51) through the pressure plate (533). The locking nut (532) is located on the outside of the adjustment screw (531) and is used to fix the adjusted position.

10. The semiconductor voltage regulating module according to claim 1, characterized in that, The mounting cavity (11) has a heat dissipation boss (13) at the bottom, and the bottom surface of the anode substrate (2) is in contact with the heat dissipation boss (13). The heat dissipation boss (13) has heat dissipation fins (14) on its outer side.

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