Trapezoidal section variable-diameter heat pipe and high-end notebook computer heat dissipation module thereof

Abstract

The application discloses a trapezoidal section variable-diameter heat pipe and a high-end notebook computer heat dissipation module, and belongs to the technical field of heat transfer. The heat pipe comprises an evaporation section, an adiabatic section and a condensation section which are sequentially arranged along the length direction; the external section of the heat pipe as a whole is in a trapezoidal structure with the upper part being wide and the lower part being narrow, and is axially and variably-diametered along the length direction of the heat pipe; the pipe diameter of the evaporation section is larger than that of the condensation section; and the lower base of the trapezoidal structure of the evaporation section constitutes a heat source adhering surface. The application greatly increases the contact area of the heat pipe and the heat source, and reduces the contact thermal resistance through the trapezoidal section; the liquid storage, vaporization space of the evaporation section and the flow rate of the condensation section are optimized through the variable-diameter design, and the heat exchange efficiency is strengthened; meanwhile, the trapezoidal profile can perfectly adapt to the internal inclined angle space of the notebook computer, and the space utilization rate is improved. The heat dissipation module adopting the application has the advantages of fast thermal response and strong heat dissipation capacity, and is particularly suitable for high-performance and light-thin notebook computers.

Description

Technical Field

[0001] This invention relates to the field of heat transfer technology, and more specifically to a trapezoidal cross-section variable diameter heat pipe and its high-end laptop cooling module. Background Technology

[0002] As laptops become thinner, lighter, and more powerful, the power consumption of CPUs and GPUs continues to rise, placing increasingly higher demands on cooling systems. Currently used heat pipe cooling solutions often involve line contact or small-area surface contact when the traditional circular or rectangular heat pipes come into contact with flat heat sources (such as the CPU / GPU chip surface), resulting in high contact thermal resistance and impacting cooling efficiency. Furthermore, single-diameter heat pipes require a large liquid storage space in the evaporation section to ensure resistance to drying out, while in the condensation section, the spacing between the cooling fins limits the ability to insert a thicker pipe into the dense fin gaps, leading to low space utilization. In addition, laptops often have angled spaces (such as the transition area between the B and C sides of the chassis), which traditional circular or rectangular heat pipes cannot fully utilize, causing structural interference or wasted space. Therefore, there is an urgent need for a heat pipe structure that can increase the heat source contact area, optimize the flow characteristics within the pipe, and improve space utilization. Summary of the Invention

[0003] The present invention aims to provide a trapezoidal cross-section variable diameter heat pipe and heat dissipation module to solve the problems of high thermal resistance between heat pipe and heat source, mismatch between pipe diameter and heat dissipation fin space, and low utilization rate of internal oblique space in the prior art.

[0004] To achieve the above objectives, the present invention provides a trapezoidal cross-section variable diameter heat pipe, comprising an evaporation section, an adiabatic section, and a condensation section arranged sequentially along the length of the heat pipe; the overall external cross-section of the heat pipe is a trapezoidal structure that is wider at the top and narrower at the bottom; and the heat pipe is axially variable in diameter along its own length, with the diameter of the evaporation section being larger than that of the condensation section; the lower base of the trapezoidal structure of the evaporation section forms a heat source contact surface for contacting a heat source, thereby increasing the contact area and reducing the contact thermal resistance.

[0005] Furthermore, the width of the upper base of the trapezoidal cross-section is smaller than the width of the lower base, and the two side walls of the trapezoid are smooth inclined surfaces or arc-shaped transition surfaces with an inclination angle of 3° to 45° to adapt to the inclined installation space inside the laptop.

[0006] Furthermore, the ratio of the pipe diameter of the evaporation section to that of the condensation section is 1.2:1 to 2:1; the adiabatic section is a gradually changing pipe diameter transition section without abrupt steps, thus avoiding an increase in the flow resistance of the working fluid.

[0007] Furthermore, the inner wall of the heat pipe is provided with a capillary structure, which is a groove, wire mesh, copper wire or powder sintered body, to adapt to the trapezoidal cross section and variable diameter structure, and enhance the working fluid reflux capability.

[0008] Furthermore, the multiple heat pipes are installed in a reverse parallel configuration, with one heat pipe being wider at the top and narrower at the bottom, and the other heat pipe being narrower at the top and wider at the bottom, with the bottom surfaces of the two heat pipes flush and touching each other, in order to expand the heat source coverage area.

[0009] Furthermore, the heat pipe is a flat heat pipe with an overall thickness ranging from 1.5mm to 4.0mm, which is suitable for ultra-thin laptop bodies.

[0010] The present invention also provides a high-end laptop cooling module, including a trapezoidal cross-section variable diameter heat pipe, a heat dissipation fin assembly, and a fan as described in any of the above claims; the evaporation section of the heat pipe is attached to the CPU or GPU heat source surface of the laptop; the condensation section of the heat pipe is inserted into or fixed inside or on the surface of the heat dissipation fin assembly; the fan is provided corresponding to the heat dissipation fin assembly for forced heat dissipation.

[0011] Furthermore, the space between the evaporation section of the heat pipe and the heat source is filled with thermally conductive gel or liquid metal to further reduce the interfacial thermal resistance.

[0012] The technical effects and advantages of this invention are as follows:

[0013] 1. Advantages of its shape (trapezoidal):

[0014] Utilizing a trapezoidal geometry that is wider at the top and narrower at the bottom, the heat pipes achieve surface contact / close contact with the heat source (CPU / GPU) base within the slanted space of the chassis, significantly reducing the thermal resistance at the contact interface. Pipe diameter advantage (variable diameter): The heating section (evaporation section) has a larger diameter, providing a large capacity for liquid storage and vapor channels, and strong resistance to drying out; the condensation section has a smaller diameter, adapting to the Fin area (finned area) space to ensure efficient heat dissipation. 2. Fluid Dynamics Optimization (Flow Resistance): The variable diameter structure naturally accelerates the steam flow velocity as it moves from the coarse to the fine tube, improving the efficiency of steam discharge from the evaporation section and reducing the thermal resistance caused by steam retention. During the liquid reflux stage, the fine tube section generates a slight capillary suction effect, which, combined with the high capillary force of the trapezoidal channel, doublely enhances the circulation rate. 3. Maximizing Space Utilization (Body Fit): Traditional heat pipes are mostly circular or rectangular with a constant cross-section, occupying a large amount of horizontal space. This structure is narrow at the top, perfectly fitting the angled interior of the laptop's B / C side, without encroaching on the space under the keyboard or battery. The wide bottom structure allows for improved performance by increasing the contact area without increasing the overall thickness, achieving a balance between "thinness and performance". 4. Improved thermal response speed (temperature uniformity): The large-diameter evaporation section has a large heat capacity and can absorb instantaneous peak heat; the small-diameter condensation section has a fast heat dissipation response. Combined with the large-area heat uniformity of the trapezoidal shape, the temperature jump (Delta T) of the whole unit from low load to full load is significantly reduced. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of the trapezoidal cross-section variable diameter heat pipe in an embodiment of the present invention. Figure 2 This is an enlarged schematic diagram of the trapezoidal cross-section of the evaporation section in an embodiment of the present invention. Figure 3 This is a comparison diagram of the contact area of ​​the embodiment of the present invention and a traditional rectangular cross-section heat pipe. Detailed Implementation

[0016] The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0017] Example 1

[0018] This embodiment provides a trapezoidal cross-section variable diameter heat pipe suitable for high-performance gaming laptops. Overall structure:

[0019] like Figure 1 As shown, the heat pipe is generally flat, and its diameter is divided into three sections along its length. Evaporation section 1 (40mm long): pipe diameter Φ8mm (equivalent diameter), cross-section is a trapezoid with a wider top and narrower bottom.

[0020] Insulation section 2 (100mm long): The pipe diameter gradually changes from Φ8mm to Φ6mm. Condensation section 3, also known as heat dissipation section (60mm long): Pipe diameter Φ6mm, cross-section is standard rectangle or narrow trapezoid, inserted into the fin gap.

[0021] The heat pipe has an overall external cross-section that is trapezoidal, wider at the top and narrower at the bottom, with the width of the upper base W1 being smaller than the width of the lower base W2. The two side walls are smooth, sloping surfaces. The inner wall of the heat pipe is equipped with a powder sintered capillary structure. Working principle:

[0022] When heat is conducted to the evaporation section, the large contact area between the bottom edge (W2) and the processor base results in a contact area several times larger than that of traditional circular heat pipes, leading to extremely high heat transfer efficiency. The working fluid inside the heat pipe rapidly vaporizes within its large diameter, and the vapor flows towards the condensation section. Because the diameter of the condensation section narrows, the vapor flow rate increases, enhancing condensation heat exchange. Simultaneously, the trapezoidal structure allows the heat pipe to be perfectly integrated into the angled space of the chassis without affecting the internal structural layout.

[0023] Example 2

[0024] The heat pipe, heat sink fins, and fan of this embodiment are assembled into a cooling module. The evaporation section of the heat pipe is attached to the CPU surface via thermally conductive gel, the condensation section penetrates into the heat sink fins, and the fan blows air directly onto the fins. This module can be directly applied to high-end laptops to achieve efficient heat dissipation.

[0025] Example 3

[0026] This embodiment provides a reverse parallel installation method. It employs two trapezoidal cross-section variable diameter heat pipes, one of which is wider at the top and narrower at the bottom (same as in Embodiment 1), while the other is narrower at the top and wider at the bottom (i.e., an inverted trapezoid). The bottom surfaces (i.e., the wider side) of the two heat pipes are aligned and attached to the same heat source surface, thereby doubling the heat source coverage area, suitable for cooling large-size GPUs or server chips.

[0027] Example 4

[0028] In this embodiment, the capillary structure on the inner wall of the heat pipe adopts axial grooves, and the depth and width of the grooves are adapted along the trapezoidal cross-section to further reduce the resistance to liquid backflow. The overall thickness of the heat pipe is 1.8mm, which is suitable for ultra-thin laptops.

[0029] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A trapezoidal cross-section variable diameter heat pipe, characterized in that, It includes an evaporation section, an insulation section, and a condensation section arranged sequentially along the length of the heat pipe; The heat pipe has an overall external cross-section that is wider at the top and narrower at the bottom, with the width of the upper base being smaller than the width of the lower base, and the two side walls being smooth inclined surfaces. The heat pipe is configured with an axially variable diameter along its length, and the diameter of the evaporation section is larger than the diameter of the condensation section. The lower edge of the trapezoidal structure of the evaporation section forms a heat source contact surface for contacting the heat source.

2. The trapezoidal cross-section variable diameter heat pipe according to claim 1, characterized in that, The upper base of the trapezoidal cross section is narrower than the lower base, and the two side walls of the trapezoid are smooth inclined surfaces or arc-shaped transition surfaces with an inclination angle of 3° to 45°.

3. The trapezoidal cross-section variable diameter heat pipe according to claim 1, characterized in that, The ratio of the pipe diameter of the evaporation section to that of the condensation section is 1.2:1 to 2:1; the insulation section is a gradually changing pipe diameter section without abrupt changes.

4. The trapezoidal cross-section variable diameter heat pipe according to claim 1, characterized in that, The multiple heat pipes are installed in a reverse parallel configuration, with one heat pipe being wider at the top and narrower at the bottom, and the other heat pipe being narrower at the top and wider at the bottom. The bottom surfaces of the two heat pipes are flush and attached to each other to expand the heat source coverage area.

5. The trapezoidal cross-section variable diameter heat pipe according to claim 1, characterized in that, The heat pipe is a flat heat pipe with an overall thickness ranging from 1.5 mm to 4.0 mm.

6. A high-end laptop cooling module, characterized in that, Includes the trapezoidal cross-section variable diameter heat pipe, heat dissipation fin assembly, and fan as described in any one of claims 1 to 5; The evaporation section of the heat pipe is attached to the surface of the CPU or GPU heat source of the laptop. The condensation section of the heat pipe is inserted into or fixed inside or on the surface of the heat dissipation fin assembly; The fan is positioned corresponding to the heat dissipation fin assembly and is used for forced heat dissipation.

7. The high-end laptop cooling module according to claim 6, characterized in that, The space between the evaporation section of the heat pipe and the heat source is filled with thermally conductive gel or liquid metal.

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