A method and system for evaluating operational amplifier layout to suppress PCB level interference

Abstract

The application relates to a PCB interference inhibition operational amplifier layout evaluation method and system, and relates to the technical field of a PCB, which comprises the following steps: collecting component specifications and detecting a use environment; calling the detection operational amplifier specifications from the component specifications; obtaining detection installation parameters according to the detection operational amplifier specifications and preset circuit board specifications; obtaining other components based on the detection use environment and the component specifications; obtaining other installation parameters by combining the detection installation parameters, the other components and the circuit board specifications; obtaining fixed installation parameters and variable installation parameters based on the other installation parameters; forming a layout scheme through the detection installation parameters, the fixed installation parameters and the variable installation parameters; establishing a layout model according to the layout scheme; inputting the detection use environment into the layout model and combining a preset heat dissipation layout method to simulate detection noise of the detection operational amplifier specifications, and forming an evaluation score according to the detection noise for uploading. The application has the effect of improving the efficiency of operational amplifier layout evaluation of a PCB.

Description

Technical Field

[0001] This invention relates to the technical field of PCB boards, and in particular to an operational amplifier layout evaluation method and system for suppressing PCB board-level interference. Background Technology

[0002] A PCB is a printed circuit board used to provide mechanical support and electrical connections for electronic components.

[0003] During the PCB design and manufacturing process, it is necessary to evaluate the actual performance of the operational amplifiers (op-amps) on the board to ensure their reliability in low-noise applications. First, key sensitive nodes and design constraints are identified manually by consulting the op-amp datasheet and relying on experience. Second, components are manually placed in the PCB design software, following established rules such as functional zoning, placing decoupling capacitors close to pins, and shorting sensitive traces. After completing the layout and routing, a PCB prototype is manually fabricated, powered on, and the op-amp output noise is measured using an oscilloscope or spectrum analyzer. The measured noise is compared with a preset threshold to determine if the layout is acceptable. If the noise exceeds the standard, the source of interference (such as power supply ripple, digital crosstalk, ground plane bounce, etc.) must be manually identified, the layout adjusted, and a new prototype tested until the PCB layout is satisfactory.

[0004] In the PCB design and manufacturing process, the process of manually querying data, forming PCB layout, and making PCB prototypes is cumbersome, time-consuming, and labor-intensive, resulting in low efficiency in the evaluation of PCB op-amp layout. Summary of the Invention

[0005] To improve the efficiency of operational amplifier layout evaluation on PCB boards, this invention provides an operational amplifier layout evaluation method and system for suppressing PCB board-level interference.

[0006] In a first aspect, the present invention provides an operational amplifier layout evaluation method for suppressing PCB board-level interference, employing the following technical solution: An operational amplifier layout evaluation method for suppressing PCB-level interference includes: S10: Collect component specifications and testing environment; S11: Retrieve the operational amplifier specifications from the component specifications; S12: Obtain the test installation parameters based on the test operational amplifier specifications and the preset circuit board specifications; S13: Other components are obtained based on the testing environment and component specifications; S14: Combine the installation parameters, other components, and circuit board specifications to obtain other installation parameters; S15: Obtain fixed installation parameters and variable installation parameters based on other installation parameters; S16: A layout scheme is formed by detecting installation parameters, fixing installation parameters, and changing installation parameters; S17: Establish a layout model based on the layout scheme; S18: The detection environment input layout model is combined with the preset heat dissipation layout method to simulate the detection noise of the operational amplifier specification, and an evaluation score is generated based on the detection noise and uploaded.

[0007] By adopting the above technical solution, the evaluation score is obtained by analyzing the component specifications and testing environment and combining the heat dissipation layout method. The score is then uploaded, and the system can automatically generate the PCB layout and perform automatic evaluation. Finally, the score is uploaded to the operator's terminal for the operator to select and judge. This reduces the process of manually querying data, generating PCB layout, and making PCB prototype boards, thereby improving the efficiency of PCB op-amp layout evaluation.

[0008] Optional, preset heat dissipation layout methods include: S20: Select the heating installation parameters from the fixed installation parameters and the variable installation parameters; S21: Simulate the heating parameters from the layout model based on the heating installation parameters and the testing environment; S22: Combine the detected heating parameters with the detected installation parameters to obtain the parameters affecting heating; S23: Retrieve the reference tolerance parameters from the operational amplifier specifications; S24: Update the layout scheme to re-obtain the detection noise by comparing the impact on the heating parameters with the baseline tolerance parameters.

[0009] By adopting the above technical solution, analyzing fixed installation parameters, variable installation parameters, and testing environment, and updating the layout scheme in conjunction with the heat dissipation of components, and re-obtaining the test noise, it is possible to identify the thermal effects of the scheme during the evaluation of operational amplifier noise, reduce the evaluation deviation caused by thermal effects on operational amplifier noise, and improve the accuracy of PCB board operational amplifier layout evaluation.

[0010] Optionally, methods to update the layout scheme beforehand include: S30: A ventilation model is obtained by detecting the usage environment, the layout scheme before the update, and the layout model; S31: Compare the cases where the parameters affecting heat generation exceed the baseline tolerance parameters and combine them with the heat generation installation parameters to obtain the abnormal installation parameters; S32: Retrieve gap heat dissipation channels from the layout scheme by using abnormal installation parameters and detection installation parameters; S33: The heat dissipation coefficient is obtained by combining the gap heat dissipation channel with the ventilation model; S34: Update the heat dissipation parameters by detecting the heat dissipation coefficient, and re-compare the heat dissipation parameters with the baseline tolerance parameters to obtain the heat dissipation layout scheme and update the layout scheme.

[0011] By adopting the above technical solution, the heat dissipation layout scheme is obtained by updating the parameters affecting the heat generation based on the detection environment, layout scheme, and layout model, and by re-comparing the situation to obtain the heat dissipation layout scheme. This allows the internal airflow distribution of the equipment to be incorporated into the evaluation system to reduce the impact of the surrounding environment on heat generation identification and improve the accuracy of identifying the parameters affecting the heat generation.

[0012] Optionally, methods for obtaining a heat dissipation layout scheme include: S40: Calculate the difference between the parameters affecting heat generation and the baseline tolerance parameters as the heat deviation value; S41: The usage time point is obtained by comparing the heat deviation value with the detection environment; S42: Retrieve the average usage intensity at different time points from the detection environment; S43: Re-compare the abnormal installation parameters with the parameters affecting heat generation and the baseline tolerance parameters; S44: The detection annular flow channel is obtained based on the layout scheme and abnormal installation parameters; S45: Mark the annular flow channel based on the deviation value between the detected annular flow channel and the heat; S46: Based on the marked annular flow channel, average application force, and detection of the application environment, the target annular flow channel is obtained, and the target annular flow channel and the preset guide ball specifications are used as the heat dissipation layout scheme.

[0013] Optionally, methods for obtaining the target annular flow channel include: S50: The detected annular force is obtained based on the marked annular flow channel, average application force, and preset guide ball specifications; S51: The actual movement trajectory is obtained based on the detection ring force component, guide ball specifications, and detection environment. S52: Retrieve the average tilt from the testing environment; S53: The detected movement trajectory is obtained by combining the average tilt angle with the actual movement trajectory; S54: The baseline movement trajectory is obtained based on the average inclination and the marked annular flow channel; S55: Select the target annular flow channel by comparing the detected moving trajectory with the reference moving trajectory to determine if the movement exceeds the limit.

[0014] Alternatively, methods for obtaining a heat dissipation layout scheme may also include: S60: Compare the detected moving trajectory with the reference moving trajectory to calculate the deviation moving trajectory, and select the marked annular flow channel corresponding to the deviation moving trajectory with the smallest distance as the selected annular flow channel; S61: Obtain the magnetic attraction auxiliary point based on the selected annular flow channel and the deviation movement trajectory; S62: The detection auxiliary trajectory is obtained based on the magnetic attraction auxiliary point and the reference movement trajectory of the selected annular flow channel; S63: The auxiliary force is detected by detecting the auxiliary trajectory and the specifications of the guide ball; S64: Combine the detection auxiliary force, detection auxiliary trajectory and detection usage environment to obtain the target magnetic attraction track, and use the target magnetic attraction track, selected annular flow channel and guide ball specifications as heat dissipation layout scheme.

[0015] By adopting the above technical solution, and by analyzing the testing environment and the parameters affecting heat generation, annular flow channels and magnetic tracks are set on the PCB board. This allows for dynamic setting of the heat dissipation scheme based on the environment of the PCB board and usage habits, actively reducing the impact of heat generated by the layout scheme on the noise evaluation of the operational amplifier, thereby improving the accuracy of the operational amplifier layout evaluation on the PCB board.

[0016] Optionally, methods for obtaining the target magnetic track include: S70: The direction of the applied force for detection is retrieved from the average application force in the detection environment; S71: The fixed magnetic force is detected based on the average application force and the preset magnetic ball specifications; S72: Select the detection movement trajectory of the selected annular flow channel as the selected movement trajectory, and obtain the selected movement duration through the selected movement trajectory; S73: Calculate the initial straight-line distance based on the preset starting position and magnetic auxiliary point; S74: Calculate the magnetic attraction speed based on the initial straight-line distance and the selected movement time; S75: A magnetic straight track is obtained by using the magnetic attraction moving speed, initial straight distance and average inclination. S76: The target magnetic track is obtained based on the magnetic linear track, the detection auxiliary trajectory, the detection auxiliary force, and the specifications of the magnetic ball.

[0017] Alternatively, methods for obtaining the target magnetic track may also include: S80: Marking auxiliary magnetic force is obtained by using the specifications of the magnetic ball and the guide ball; S81: Compare the difference between the mark-assisted magnetic force and the detection-assisted force to form the target magnetic attraction track by combining the magnetic attraction linear track, magnetic ball specifications, starting position and detection fixed magnetic force, or calculate the difference between the mark-assisted magnetic force and the detection-assisted force as the force deviation value. S82: Obtain the remaining auxiliary trajectory based on the force deviation value and the detection auxiliary trajectory; S83: Increase auxiliary points by combining the remaining auxiliary trajectory with the selected annular flow channel; S84: Based on the addition of auxiliary points and magnetic attraction auxiliary points, a magnetic attraction arc track is obtained. The target magnetic attraction track is formed by combining the magnetic attraction linear track, the specifications of the magnetic ball, the magnetic attraction arc track, the starting position, and the detection of fixed magnetic force.

[0018] Alternatively, methods for obtaining the target magnetic track may also include: S90: The minimum attraction distance is obtained by detecting the fixed magnetic force and the specifications of the magnetic ball; S91: The detection point of the fallback is obtained based on the minimum attraction distance and the starting position; S92: Retrieve the marked weight from the magnetic ball specifications; S93: Based on the marker weight, the detection drop point, and the magnetic attraction arc track, obtain the marker drop track and add it to the target magnetic attraction track.

[0019] Secondly, this application provides an operational amplifier layout evaluation system for suppressing PCB-level interference, employing the following technical solution: An operational amplifier layout evaluation system for suppressing PCB-level interference includes: The acquisition module is used to acquire component specifications and testing environment information; Memory for storing a program for evaluating operational amplifier layout to suppress PCB-level interference; The processor is used to load and execute programs stored in memory.

[0020] In summary, this application includes at least one of the following beneficial technical effects: 1. By analyzing component specifications and testing environment and combining heat dissipation layout methods, the evaluation score is obtained and uploaded. This allows the system to automatically generate PCB layout and perform automatic evaluation. Finally, the data is uploaded to the operator's terminal for the operator to select and judge, reducing the process of manually querying data, generating PCB layout, and making PCB prototype boards, thus improving the efficiency of PCB op-amp layout evaluation. 2. By analyzing fixed installation parameters, variable installation parameters, and the testing environment, and combining the heat dissipation of components to update the layout scheme and re-obtain the test noise, the thermal effects of the scheme can be identified during the evaluation of operational amplifier noise. This reduces the evaluation deviation caused by thermal effects on operational amplifier noise, thereby improving the accuracy of PCB board operational amplifier layout evaluation. 3. By analyzing the testing environment and the parameters affecting heat generation, annular flow channels and magnetic tracks are set on the PCB board. This allows for dynamic setting of the heat dissipation scheme based on the environment and usage habits of the PCB board, actively reducing the impact of heat generated by the layout scheme on the noise evaluation of the op-amp, thereby improving the accuracy of op-amp layout evaluation on the PCB board. Attached Figure Description

[0021] Figure 1 This is a flowchart of an operational amplifier layout evaluation method for suppressing PCB-level interference according to an embodiment of the present invention. Detailed Implementation

[0022] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0023] Reference Figure 1 This application discloses an operational amplifier layout evaluation method for suppressing PCB-level interference, including the following steps: S10: Collect component specifications and testing environment.

[0024] Component specifications refer to the collection of models, electrical parameters, package dimensions and thermal characteristics of all electronic components involved in PCB layout. They can be obtained by pre-entering by the operator or retrieved from a pre-stored component database.

[0025] The detection environment refers to the physical and electrical environmental parameters of the equipment installed on the PCB board and the equipment when it is used. These parameters include the type of equipment, the temperature, humidity, vibration frequency and amplitude of the environment in which the equipment is located, the average tilt angle of the equipment, the shaking acceleration, the usage time, and the airflow conditions. By collecting data from environmental sensors and participating in user behavior statistical models, accelerometers and gyroscopes can be used to detect and take the time average value in real time, or a preset handheld device usage scenario parameter table can be used to assign values.

[0026] S11: Retrieve the operational amplifier specification from the component specifications.

[0027] Testing op-amp specifications refers to the performance parameters of an operational amplifier (hereinafter referred to as op-amp), including voltage noise density, current noise density, input bias current, common-mode rejection ratio, power supply rejection ratio, offset voltage, operating temperature range, and package type. The performance parameters of the operational amplifier are retrieved from the component specifications to test the op-amp specifications.

[0028] S12: Obtain the test installation parameters based on the test operational amplifier specifications and the preset circuit board specifications.

[0029] Circuit board specifications are the physical and electrical constraints of a PCB board set by technicians, including parameters such as board thickness, number of layers, available area, mounting hole location, prohibited routing areas, distribution of thermal vias, and ground plane integrity.

[0030] The detection installation parameters refer to the specific placement constraints of the operational amplifier on the PCB board, including the installation position coordinates, orientation angle, pad size, heat sink connection method, etc. The analytical automated placement algorithm uses the installation orientation and other parameters of the operational amplifier specification in each circuit board specification as the detection installation parameters.

[0031] S13: Obtain other components based on the testing environment and component specifications.

[0032] Other components refer to the components and their corresponding specifications that need to be installed on the PCB board for equipment installation, excluding operational amplifiers. By detecting the usage environment, all required components are matched from a preset installation reference table. The remaining components after removing operational amplifiers and their corresponding specifications are then referred to as other components.

[0033] The installation reference table stores all the components that need to be installed on the PCB board corresponding to the equipment used in different testing environments. The parameters in the installation reference table are set in advance by those skilled in the art based on experimental records of actual conditions.

[0034] S14: Combine the installation parameters, other components, and circuit board specifications to obtain other installation parameters.

[0035] Other installation parameters refer to the specific placement constraints of other components on the PCB board. The installation parameters are removed from the circuit board specifications, and the remaining installable areas in the circuit board specifications are taken as candidate installation areas. Then, referring to S12, the installation parameters obtained by the candidate installation areas and other components through the analytical automatic placement algorithm are used as other installation parameters.

[0036] S15: Obtain fixed installation parameters and variable installation parameters based on other installation parameters.

[0037] Fixed mounting parameters refer to other components on a PCB board that have only one mounting method, while variable mounting parameters refer to other components on a PCB board that have multiple mounting methods. Under the condition of limiting a circuit board specification and testing mounting parameters, the other mounting parameters that a component has only one type of are called fixed mounting parameters, and the other mounting parameters corresponding to a component are called variable mounting parameters.

[0038] S16: A layout scheme is formed by detecting installation parameters, fixing installation parameters, and changing installation parameters.

[0039] A layout scheme refers to a complete plan for the placement and routing of components on a PCB board. It is formed by inputting the detection mounting parameters, fixed mounting parameters, and variable mounting parameters into the automatic placement function of electronic design automation tools (such as the Auto Place function of Cadence Allegro) or a solution based on constraint satisfaction problems (such as the Z3 SMT solver). The resulting layout scheme consists of various options on the PCB board.

[0040] S17: Establish a layout model based on the layout scheme.

[0041] A layout model is a three-dimensional virtual digital model used to simulate and analyze the operating state of a PCB board. It includes the electrical parasitic parameters of components (parasitic capacitance, inductance), thermal network models (thermal resistance, thermal capacity), fluid channel models (flow resistance, flow velocity distribution), and electromagnetic field radiation models. The layout model is a three-dimensional virtual digital model created by inputting the layout scheme into finite element simulation software (such as COMSOL, ANSYS).

[0042] S18: The detection environment input layout model is combined with the preset heat dissipation layout method to simulate the detection noise of the operational amplifier specification, and an evaluation score is generated based on the detection noise and uploaded.

[0043] The heat dissipation layout method refers to the heat dissipation layout scheme of the PCB board. The heat dissipation layout method is described below.

[0044] Detection noise refers to the total noise of the operational amplifier simulated by the layout model under the detection environment. By taking the detection environment as the excitation condition (such as power supply ripple, temperature, vibration, etc.), the parasitic parameter network is extracted from the layout model. The total noise voltage (root mean square value or peak-to-peak value) at the output of the operational amplifier is calculated as the detection noise using a time-domain transient simulation method (such as transient analysis based on the SPICE engine).

[0045] The evaluation score is a comprehensive indicator that measures the ability of a layout scheme to suppress board-level interference. The value range is 0 to 100. The higher the score, the lower the noise. The evaluation score is obtained by retrieving the noise tolerance threshold from the operational amplifier specifications and then using the detected noise as a ratio to calculate the score.

[0046] Evaluation score = 100 × (1 - detection noise / noise tolerance threshold).

[0047] Pre-defined heat dissipation layout methods include: S20: Select the heating installation parameters from the fixed installation parameters and the variable installation parameters.

[0048] Heat dissipation parameters refer to other components in the PCB layout that generate significant heat. Referring to S17, a power density threshold screening method is used through thermal simulation in the layout model to filter components whose power consumption per unit area exceeds a preset threshold (e.g., 0.5W / cm²). 2 The fixed or variable installation parameters corresponding to other components are used as the heating installation parameters.

[0049] S21: Simulate the heating parameters from the layout model based on the heating installation parameters and the testing environment.

[0050] The detection of heating parameters refers to the parameters such as junction temperature, surface temperature, and thermal gradient distribution of each heating component when it reaches thermal equilibrium under a given operating environment (ambient temperature, airflow velocity, equipment tilt angle, etc.). The temperature field of the component corresponding to the heating installation parameters is calculated by steady-state heat conduction finite element method (such as the heat conduction and convection coupling solver in ANSYS Icepak or COMSOL), and the above parameters are extracted from the temperature field as the detection of heating parameters.

[0051] S22: Combine the detected heating parameters with the detected installation parameters to obtain the parameters affecting heating.

[0052] The influencing parameter for heat generation refers to the temperature change value caused by the heat generated by other heat-generating components on the operational amplifier. The temperature at the detection installation parameter is directly extracted through finite element multiphysics simulation of the layout model (this temperature needs to exclude the heat output of the operational amplifier itself) as the influencing parameter for heat generation.

[0053] S23: Retrieve the reference tolerance parameters from the operational amplifier specifications.

[0054] The baseline tolerance parameter refers to the tolerance value of the op-amp to noise degradation caused by temperature changes in the test operating environment. It is calculated by retrieving the minimum temperature threshold of the op-amp caused by temperature changes from the op-amp specification and calculating the difference between the minimum temperature threshold and the temperature of the op-amp in the test operating environment (simulated from the layout model) as the baseline tolerance parameter.

[0055] S24: Update the layout scheme to re-obtain the detection noise by comparing the impact on the heating parameters with the baseline tolerance parameters.

[0056] The layout scheme is updated by analyzing the deviations of the heating parameters and the baseline tolerance parameters. The steps for updating the layout scheme are described below. S17 and S18 are then re-executed using the updated layout scheme to obtain new detection noise.

[0057] Methods prior to updating the layout scheme include: S30: The ventilation model is obtained by detecting the usage environment, the layout scheme before the update, and the layout model.

[0058] A ventilation model is a three-dimensional virtual digital model of the airflow distribution inside the equipment where the PCB board is located. It is obtained by using a steady-state incompressible Navier-Stokes equations solving algorithm (SIMPLE algorithm or PISO algorithm) in the layout model to detect the airflow conditions in the operating environment (such as fan speed, ventilation hole position, equipment tilt angle) as boundary conditions. After extracting the obstacle geometry from the layout model, a three-dimensional virtual digital model of the wind field distribution is calculated as the ventilation model.

[0059] S31: Compare the cases where the parameters affecting the heating are exceeded with the baseline tolerance parameters and combine them with the heating installation parameters to obtain the abnormal installation parameters.

[0060] Abnormal installation parameters refer to heating installation parameters that affect the heating parameters beyond the baseline tolerance parameters. By analyzing the exceedance of the heating parameters and the baseline tolerance parameters, the heating installation parameters corresponding to the heating parameters that affect the heating parameters beyond the baseline tolerance parameters are identified as abnormal installation parameters.

[0061] S32: Extract the gap heat dissipation channel from the layout scheme by using abnormal installation parameters and detection installation parameters.

[0062] A gap heat dissipation channel refers to the air gap area between abnormal components and operational amplifiers in a PCB layout that is not covered by the components. It includes parameters such as the width, length, height, and position of the gap. Based on a two-dimensional Delaunay triangulation-based blank area identification algorithm, the occupant polygons of all components are extracted from the layout scheme, the complement area is calculated, and then the continuous blank area between the component with abnormal mounting parameters and the operational amplifier with the detected mounting parameters is selected. The geometric parameters (width, length, height, and position) of this area are used as the gap heat dissipation channel.

[0063] S33: The heat dissipation coefficient is obtained by combining the gap heat dissipation channel with the ventilation model.

[0064] The detected heat dissipation coefficient refers to the quantitative value of the actual heat dissipation capacity of the current gap heat dissipation channel to the operational amplifier under the test operating environment. The local heat dissipation coefficient is obtained by directly reading the heat flux density at the surface of the operational amplifier from the coupling results of the ventilation model and thermal simulation using the CFD local heat flux extraction method and dividing it by the temperature difference (the difference between the temperature of the operational amplifier after operation and the ambient temperature).

[0065] S34: Update the heat dissipation parameters by detecting the heat dissipation coefficient, and re-compare the heat dissipation parameters with the baseline tolerance parameters to obtain the heat dissipation layout scheme and update the layout scheme.

[0066] A heat dissipation layout scheme refers to a design scheme that can dissipate heat from the operational amplifier and its surrounding components. By substituting the detected heat dissipation coefficient into the thermal resistance network model in the layout model, the heat dissipation parameters of the operational amplifier are recalculated. The case where the heat dissipation parameters exceed the reference tolerance parameters is re-analyzed to obtain a heat dissipation layout scheme. The specific method for obtaining the heat dissipation layout scheme is described below. After obtaining the heat dissipation layout scheme, it is added to the layout scheme to obtain a new layout scheme.

[0067] Methods for obtaining a heat dissipation layout scheme include: S40: Calculate the difference between the parameters affecting heat generation and the baseline tolerance parameters as the heat deviation value.

[0068] The thermal deviation value refers to the deviation between the influencing heating parameter and the reference tolerance parameter. By analyzing the cases where the influencing heating parameter exceeds the reference tolerance parameter, it is found that when the influencing heating parameter exceeds the reference tolerance parameter, it indicates that even with a heat dissipation channel, the op-amp will still be affected by other heat-generating components in the surrounding area. Therefore, the difference between the influencing heating parameter and the reference tolerance parameter is calculated as the thermal deviation value.

[0069] S41: The usage time point is obtained by comparing the heat deviation value with the usage environment.

[0070] The usage time point refers to the time point at which the operational amplifier exhibits a thermal deviation value during the operation of the device in the detection environment. The device operation is simulated and timed using a layout model through thermal transient simulation. When a thermal deviation value is found, the timing is stopped, the time length corresponding to the occurrence of the thermal deviation value is recorded, and the time length is substituted into the initial startup time point to obtain the usage time point.

[0071] S42: Retrieve the average usage intensity at various time points from the testing environment.

[0072] Average usage force refers to the average shaking acceleration exerted on the device by the user or the surrounding environment at a given time point. It is calculated using a sliding window averaging algorithm based on the accelerometer (with the window length matching the usage time point) to extract the average value of the corresponding usage time point from the historical records of shaking acceleration detected in the usage environment.

[0073] S43: Re-compare the abnormal installation parameters with the parameters affecting heat generation and the baseline tolerance parameters, and update the abnormal installation parameters.

[0074] Using the new impact heating parameters obtained from S34, S31 is re-executed to obtain new abnormal installation parameters.

[0075] S44: The detection annular flow channel is obtained based on the layout scheme and abnormal installation parameters.

[0076] Detecting annular flow channels refers to identifying the geometric parameters of annular fluid channels passing through a heat source on a PCB board. A minimum bounding circle algorithm (such as the Welzl algorithm) is used, with the range of all components within the abnormal mounting parameters as the detection range. The annular parameters formed by passing through each detection range are then considered as the detected annular flow channel. In this embodiment, the height and width of the flow channel are preset static parameter values.

[0077] S45: Mark the annular flow channel based on the deviation value between the detected annular flow channel and the heat.

[0078] A marked annular flow channel refers to a test annular flow channel that can meet the heat dissipation requirements of the heat deviation value or has the highest heat dissipation efficiency. The heat dissipation capacity of the annular flow channel is estimated using the formula P = h × A × ΔT, where P is the heat dissipation of the annular flow channel and h is the convective heat transfer coefficient (preset to 500-1500 W / (m³) of the channel liquid). 2 ·K), A is the contact area between the annular flow channel and the PCB (the detection range of S44), ΔT is the temperature difference between the coolant (ambient temperature) and the PCB board. The ring parameters are iteratively adjusted until the heat dissipation of the annular flow channel is greater than or equal to the heat deviation value.

[0079] In this embodiment, the annular flow channel is filled with coolant, and its convective heat transfer coefficient h is a preset value.

[0080] If the heat dissipation of each detection annular flow channel is less than the heat deviation value, then the detection annular flow channel corresponding to the largest heat dissipation is designated as the marked annular flow channel.

[0081] S46: Based on the marked annular flow channel, average application force, and detection of the application environment, the target annular flow channel is obtained, and the target annular flow channel and the preset guide ball specifications are used as the heat dissipation layout scheme.

[0082] The guide ball specifications are the dimensions, weight, and material specifications of a small ball placed in the flow channel to assist in heat exchange of the liquid, as defined by technicians. The material of the guide ball can be magnetically attracted.

[0083] The target annular flow channel refers to a marked annular flow channel that further meets the heat dissipation requirements during equipment use. The target annular flow channel is obtained by analyzing the marked annular flow channel, average usage force, and testing environment. The specific analysis process is detailed below. The target annular flow channel and the guide ball specifications are used as the heat dissipation layout scheme. In this embodiment, if the marked annular flow channel can directly meet the heat dissipation requirements of the heat deviation value, then there is no need to place a guide ball, and the target annular flow channel can be directly used as the heat dissipation layout scheme.

[0084] Methods for obtaining the target annular flow channel include: S50: The detected annular component force is obtained based on the marked annular flow channel, average application force, and preset guide ball specifications.

[0085] The detected annular component force refers to the effective driving force decomposed from the average applied force into the tangential direction of the marked annular flow channel. Using the dot product projection method: Detected annular component force = Mass derived from the guide ball specifications × Average applied force × cos(angle between the swaying direction and the annular channel tangent). The swaying direction is derived from the average applied force.

[0086] S51: The actual movement trajectory is obtained based on the detection ring force component, the guide ball specifications, and the detection environment.

[0087] The actual trajectory refers to the maximum arc length that the guide ball can move along the marked annular flow channel under the drive of the detected annular component force. The arc length trajectory is calculated using the integration method of Newton's second law and the formula for uniformly accelerated motion, by taking into account the detected annular component force, the duration of the detected annular component force in the environment, and the specifications of the guide ball.

[0088] S52: Retrieve the average tilt from the testing environment.

[0089] The average tilt angle refers to the average angle of tilt of the PCB board surface relative to the horizontal plane during the use of the equipment. Based on the Euler angle calculation algorithm of complementary filtering (such as the Madgwick algorithm), the average tilt angle is extracted from the historical data of the detection environment as the average tilt angle.

[0090] S53: The detected movement trajectory is obtained by combining the average tilt angle with the actual movement trajectory.

[0091] The detected movement trajectory refers to the maximum path trajectory that the guide ball can actually move stably in the inclined annular flow channel after considering the influence of gravity components. The gravity component of the guide ball is calculated by the average inclination, and the arc length trajectory recalculated by substituting the gravity component into S51 is used as the detected movement trajectory.

[0092] S54: The baseline movement trajectory is obtained based on the average inclination and the marked annular flow channel.

[0093] The baseline trajectory refers to the trajectory of a guide ball in a marked annular flow channel that can move in the channel solely by gravity under average inclination.

[0094] In this embodiment, when the marked annular flow channel is tilted, the guide ball will be at the bottom of the marked annular flow channel due to gravity. If the average tilt angle is small, the guide ball will be stationary due to static friction or return to the bottom due to gravity. Therefore, it is necessary to identify the trajectory segment in the marked annular flow channel where the gravity is greater than the static friction of the guide ball in the annular track under the normal direction of guide ball movement, in order to analyze whether the guide ball can form a complete circle of the moving flow channel under the average force applied.

[0095] By analyzing the relationship between the tangential component of gravity and the maximum static friction force on the guide ball at different positions in the annular flow channel, the trajectory in the annular flow channel where the tangential component of gravity is greater than the maximum static friction force is marked first, and the trajectory located in the normal direction of ball movement is used as the reference movement trajectory.

[0096] S55: Select the target annular flow channel by comparing the detected moving trajectory with the reference moving trajectory to determine if the movement exceeds the limit.

[0097] By analyzing the deviations of the detected moving trajectory from the reference moving trajectory, the marked annular flow channel where the detected moving trajectory deviates from the reference moving trajectory is taken as the target annular flow channel.

[0098] Methods for obtaining heat dissipation layout schemes also include: S60: Compare the detected moving trajectory with the reference moving trajectory to calculate the deviation moving trajectory, and select the marked annular flow channel corresponding to the deviation moving trajectory with the smallest distance as the selected annular flow channel.

[0099] The deviation trajectory refers to the deviation trajectory between the detected trajectory and the reference trajectory. By analyzing the deviation of the detected trajectory from the reference trajectory, when the detected trajectory does not exceed the reference trajectory, it means that after the guide ball moves along the detected trajectory, it will return to the bottom of the flow channel due to gravity. The difference between the detected trajectory and the reference trajectory is then calculated as the deviation trajectory. Since there are multiple cases where the detected trajectory does not exceed the reference trajectory, the marked annular flow channel corresponding to the deviation trajectory with the smallest distance is selected as the annular flow channel.

[0100] S61: The magnetic attraction auxiliary point is obtained based on the selected annular flow channel and the deviation movement trajectory.

[0101] Magnetic attraction auxiliary points refer to additional magnetic action points set in the selected annular flow channel to compensate for the deviation movement trajectory segment that the guide ball cannot pass through by its own driving force. The magnetic attraction auxiliary points are the positions of the deviation movement trajectory (the endpoint of the movement trajectory) retrieved from the selected annular flow channel.

[0102] S62: The detection auxiliary trajectory is obtained based on the magnetic attraction auxiliary point and the reference movement trajectory of the selected annular flow channel.

[0103] The detection auxiliary trajectory refers to the trajectory that needs to be moved after passing the magnetic attraction auxiliary point. Starting from the magnetic attraction auxiliary point, the trajectory (deviation movement trajectory) that needs to completely pass through the reference movement trajectory of the selected annular flow channel is used as the detection auxiliary trajectory.

[0104] S63: The detection assist force is obtained by detecting the auxiliary trajectory and the specifications of the guide ball.

[0105] The detection auxiliary force refers to the effective magnetic force component that the magnetic attraction auxiliary point needs to generate on the guide ball. The weight of the guide ball is retrieved from the guide ball specifications as the guide weight. Then, referring to S51, the force value that needs to be directly generated on the guide ball is deduced from the detection auxiliary trajectory and the guide weight as the detection auxiliary force.

[0106] S64: Combine the detection auxiliary force, detection auxiliary trajectory and detection usage environment to obtain the target magnetic attraction track, and use the target magnetic attraction track, selected annular flow channel and guide ball specifications as heat dissipation layout scheme.

[0107] The target magnetic track refers to the track set on the annular flow channel for magnetically assisted movement of the guide ball. The target magnetic track is obtained by analyzing the detection auxiliary force, detection auxiliary trajectory and detection environment. The specific analysis method of the target magnetic track is described below. After obtaining the target magnetic track, the target magnetic track, the selected annular flow channel and the guide ball specifications are used as the heat dissipation layout scheme.

[0108] In this embodiment, the target magnetic track does not contain a cooling liquid, and an insulating layer is provided on the track and the annular flow channel. The track and the annular flow channel are located on the non-wiring area of ​​the PCB board or on the ground plane to avoid electromagnetic interference to the operational amplifier signal.

[0109] Methods for obtaining the target magnetic track include: S70: Retrieve the direction of the average applied force from the testing environment.

[0110] The direction of force application is the projection angle of the main direction of the average applied force (shaking acceleration) onto the PCB plane. It is calculated using the average direction angle within a sliding window (the direction angle of each sampling point is circularly averaged). The average direction angle of the average applied force is retrieved from the testing environment as the direction of force application. In this embodiment, this direction of force application is used to analyze the movement direction (clockwise or counterclockwise) of the guide ball in the selected annular flow channel.

[0111] S71: The fixed magnetic force is detected based on the average application force and the preset magnetic ball specifications.

[0112] The specifications for magnetic spheres are defined by technicians, specifying parameters such as the size, weight, material, and corresponding magnetic force of the small magnetic sphere.

[0113] The test of fixed magnetic force refers to the magnetic force required to fix the magnetic ball in the track under average applied force. Referring to S50, the component force on the magnetic ball is calculated based on the average applied force and the specifications of the magnetic ball, and this component force is used as the test of fixed magnetic force.

[0114] S72: Select the detection trajectory of the annular flow channel as the selected trajectory, and obtain the selected movement time through the selected trajectory.

[0115] Selecting the movement trajectory refers to selecting the detection movement trajectory of the annular flow channel, which is used as the selected movement trajectory.

[0116] The selected movement duration refers to the length of time required for the guide ball to complete the selected movement trajectory. The net acceleration of the guide ball within the selected movement trajectory is derived by referring to the uniform acceleration motion formula in S51, and the time length value obtained by inversely solving the net acceleration is used as the selected movement duration.

[0117] S73: Calculate the initial straight-line distance based on the preset starting position and magnetic auxiliary point.

[0118] The starting position is the initial placement point of the magnetic ball on the track, as set by the technicians.

[0119] The initial straight-line distance refers to the straight-line distance between the starting position and the magnetic attraction auxiliary point. The initial straight-line distance is calculated by taking the straight-line distance between the starting position and the magnetic attraction auxiliary point.

[0120] S74: Calculate the magnetic attraction speed based on the initial straight-line distance and the selected movement time.

[0121] The magnetic attraction moving speed refers to the speed required for the magnetic ball to move from the starting position to the magnetic attraction auxiliary point. The magnetic attraction moving speed is calculated by dividing the initial straight-line distance by the selected moving time.

[0122] S75: A magnetic linear track is obtained by measuring the magnetic attraction moving speed, the initial straight distance, and the average inclination.

[0123] The magnetic linear track refers to the parameters of the linear track designed for the magnetic ball to move from the starting position to the magnetic auxiliary point. The initial linear distance is used as the length of the track, while the width and height remain static parameters to form the initial track. Then, referring to S51, the moving speed of the magnetic ball on the initial track under the test environment is obtained through the initial track and the specifications of the magnetic ball. If it is necessary to make the moving speed consistent with the magnetic moving speed under the average inclination, it is necessary to adjust the initial track to change the angle with the average inclination as the plane (the track can only change the angle in the x and y directions, not in the x and z directions, which will cause an angle between the track and the annular flow channel).

[0124] The difference between the moving speed and the magnetic attraction speed is calculated as the speed deviation value. Based on this speed deviation value and the specifications of the magnetic ball, the angle corresponding to the gravitational component is calculated. Combining the angle with the initial track, a magnetic attraction linear track is obtained. In this embodiment, the magnetic attraction linear track passes through a magnetic attraction auxiliary point.

[0125] S76: The target magnetic track is obtained based on the magnetic linear track, the detection auxiliary trajectory, the detection auxiliary force, and the specifications of the magnetic ball.

[0126] The target magnetic track was obtained by analyzing the magnetic linear track, the detection auxiliary trajectory, the detection auxiliary force, and the specifications of the magnetic ball. The specific process of obtaining the target magnetic track is described below.

[0127] Methods for obtaining the target magnetic track also include: S80: Marking auxiliary magnetic force is obtained by the specifications of the magnetic ball and the guide ball.

[0128] The marker-assisted magnetic force refers to the magnetic force that the magnetic ball can generate on the guide ball at a fixed interval. The marker-assisted magnetic force is matched from a preset magnetic attraction lookup table by the specifications of the magnetic ball, the guide ball, and the fixed interval. The fixed interval is the distance between the magnetic attraction linear track set by the technician and the selected annular flow channel.

[0129] The magnetic attraction reference table stores the magnetic force values ​​corresponding to different specifications of magnetic balls and guide balls at various spacings. The parameters in the magnetic attraction reference table are set in advance by those skilled in the art based on actual conditions through experiments.

[0130] S81: Compare the difference between the mark-assisted magnetic force and the detection-assisted force to form the target magnetic attraction track by combining the magnetic attraction linear track, magnetic ball specifications, starting position, and detection fixed magnetic force, or calculate the difference between the mark-assisted magnetic force and the detection-assisted force as the force deviation value.

[0131] The force deviation value refers to the deviation between the marker auxiliary magnetic force and the detection auxiliary force. By analyzing the excess of the marker auxiliary magnetic force and the detection auxiliary force, when the marker auxiliary magnetic force exceeds the detection auxiliary force, it means that the magnetic ball can fully drive the guide ball to move according to the corresponding distance. Therefore, the fixed setting of the starting position on the magnetic attraction linear track is based on the detection fixed magnetic force, and the target magnetic attraction track is formed in combination with the specifications of the magnetic ball.

[0132] When the marker auxiliary magnetic force does not exceed the detection auxiliary force, it means that the magnetic force of the magnetic ball cannot drive the guide ball to move according to the corresponding distance. The difference between the marker auxiliary magnetic force and the detection auxiliary force is then calculated as the force deviation value.

[0133] S82: Obtain the remaining auxiliary trajectory based on the force deviation value and the detection auxiliary trajectory.

[0134] The remaining auxiliary trajectory refers to the trajectory on the detection auxiliary trajectory that the ball could not move after being guided by the auxiliary magnetic force of the marker. Referring to S63, a new auxiliary trajectory is obtained by reducing the detection auxiliary force (marker auxiliary magnetic force) of the force deviation value, and the difference between the new auxiliary trajectory and the detection auxiliary trajectory is calculated as the remaining auxiliary trajectory.

[0135] S83: Increase auxiliary points by combining the remaining auxiliary trajectory with the selected annular flow channel.

[0136] Adding an auxiliary point refers to an additional location point where a magnetic ball is needed for magnetic attraction assistance. This is achieved by selecting the starting point in the annular flow channel where the remaining auxiliary trajectory appears as the additional auxiliary point.

[0137] S84: Based on the addition of auxiliary points and magnetic attraction auxiliary points, a magnetic attraction arc track is obtained. The target magnetic attraction track is formed by combining the magnetic attraction linear track, the specifications of the magnetic ball, the magnetic attraction arc track, the starting position, and the detection of fixed magnetic force.

[0138] The magnetic arc track refers to the arc track that allows the guide ball to be assisted by the addition of auxiliary points and magnetic auxiliary points. The actual auxiliary trajectory is obtained by calculating and detecting the auxiliary trajectory and the remaining auxiliary trajectory through S82. The time length value of the magnetically assisted guide ball moving on the actual auxiliary trajectory is obtained according to the marked auxiliary magnetic force. Then, referring to S75, the speed of the magnetic ball on the arc track is obtained under the condition of average inclination and time length value. Based on the circular track obtained by the speed (the analysis of the speed of the magnetic ball on the arc track and the circular track is the same as the analysis and calculation process of S75), the circular track is tangent to the magnetic auxiliary point and the arc track obtained by connecting the tangent to the starting position is used as the magnetic arc track.

[0139] Finally, the magnetic linear track, magnetic ball specifications, magnetic arc track, starting position, and detection and fixing magnetic force are integrated into the target magnetic track.

[0140] Methods for obtaining the target magnetic track also include: S90: The minimum attraction distance is obtained by detecting the fixed magnetic force and the specifications of the magnetic ball.

[0141] The minimum attraction distance refers to the minimum distance between which a magnetic ball can spontaneously roll back to its starting position when subjected to a fixed magnetic force. The minimum attraction distance is determined by matching the fixed magnetic force with the specifications of the magnetic ball from a magnetic attraction reference table.

[0142] S91: The detection drop point is obtained based on the minimum attraction distance and the starting position.

[0143] The detection landing point refers to the position point where each magnetic ball can fall back from the starting position. A circle is drawn with the starting position as the center and the minimum attraction distance as the radius. The coordinate points of each auxiliary point are retained in the circle and the retained position points are used as the detection landing points.

[0144] S92: Retrieve the marked weight from the magnetic ball specifications.

[0145] The marked weight refers to the weight of the magnetic ball, which is obtained by retrieving the marked weight from the magnetic ball specifications.

[0146] S93: Based on the marker weight, the detection drop point, and the magnetic attraction arc track, obtain the marker drop track and add it to the target magnetic attraction track.

[0147] The marker return track refers to the track required for the magnetic ball to move to the detection return point after starting from the initial position without changing its direction of movement. The marker return track can be a straight line or an arc, and the marker return track moves spontaneously due to the weight of the magnetic ball. Referring to S84, a straight line or arc (the straight line or arc is tangent to the magnetic attraction arc track) is drawn between the magnetic attraction arc track and the detection return point. The direction of the component force of the marker weight is analyzed to see if it is towards the detection return point at all positions. The track with the shortest distance that is towards the detection return point at all positions is taken as the marker return track, and the marker return track is added to the target magnetic attraction track.

[0148] Based on the same inventive concept, embodiments of the present invention provide an operational amplifier layout evaluation system for suppressing PCB-level interference, comprising: The acquisition module is used to acquire component specifications and testing environment information; Memory for storing a program for evaluating operational amplifier layout to suppress PCB-level interference; The processor is used to load and execute programs stored in memory.

[0149] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0150] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. An operational amplifier layout evaluation method for suppressing PCB-level interference, characterized in that, include: S10: Collect component specifications and testing environment; S11: Retrieve the operational amplifier specifications from the component specifications; S12: Obtain the test installation parameters based on the test operational amplifier specifications and the preset circuit board specifications; S13: Other components are obtained based on the testing environment and component specifications; S14: Combine the installation parameters, other components, and circuit board specifications to obtain other installation parameters; S15: Obtain fixed installation parameters and variable installation parameters based on other installation parameters; S16: A layout scheme is formed by detecting installation parameters, fixing installation parameters, and changing installation parameters; S17: Establish a layout model based on the layout scheme; S18: The detection environment input layout model is combined with the preset heat dissipation layout method to simulate the detection noise of the operational amplifier specification, and an evaluation score is generated based on the detection noise and uploaded.

2. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 1, characterized in that, Pre-defined heat dissipation layout methods include: S20: Select the heating installation parameters from the fixed installation parameters and the variable installation parameters; S21: Simulate the heating parameters from the layout model based on the heating installation parameters and the testing environment; S22: Combine the detected heating parameters with the detected installation parameters to obtain the parameters affecting heating; S23: Retrieve the reference tolerance parameters from the operational amplifier specifications; S24: Update the layout scheme to re-obtain the detection noise by comparing the impact on the heating parameters with the baseline tolerance parameters.

3. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 2, characterized in that, Methods prior to updating the layout scheme include: S30: A ventilation model is obtained by detecting the usage environment, the layout scheme before the update, and the layout model; S31: Compare the cases where the parameters affecting heat generation exceed the baseline tolerance parameters and combine them with the heat generation installation parameters to obtain the abnormal installation parameters; S32: Retrieve gap heat dissipation channels from the layout scheme by using abnormal installation parameters and detection installation parameters; S33: The heat dissipation coefficient is obtained by combining the gap heat dissipation channel with the ventilation model; S34: Update the heat dissipation parameters by detecting the heat dissipation coefficient, and re-compare the heat dissipation parameters with the baseline tolerance parameters to obtain the heat dissipation layout scheme and update the layout scheme.

4. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 3, characterized in that, Methods for obtaining a heat dissipation layout scheme include: S40: Calculate the difference between the parameters affecting heat generation and the baseline tolerance parameters as the heat deviation value; S41: The usage time point is obtained by comparing the heat deviation value with the detection environment; S42: Retrieve the average usage intensity at different time points from the detection environment; S43: Re-compare the abnormal installation parameters with the parameters affecting heat generation and the baseline tolerance parameters; S44: The detection annular flow channel is obtained based on the layout scheme and abnormal installation parameters; S45: Mark the annular flow channel based on the deviation value between the detected annular flow channel and the heat; S46: Based on the marked annular flow channel, average application force, and detection of the application environment, the target annular flow channel is obtained, and the target annular flow channel and the preset guide ball specifications are used as the heat dissipation layout scheme.

5. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 4, characterized in that, Methods for obtaining the target annular flow channel include: S50: The detected annular force is obtained based on the marked annular flow channel, average application force, and preset guide ball specifications; S51: The actual movement trajectory is obtained based on the detection ring force component, guide ball specifications, and detection environment. S52: Retrieve the average tilt from the testing environment; S53: The detected movement trajectory is obtained by combining the average tilt angle with the actual movement trajectory; S54: The baseline movement trajectory is obtained based on the average inclination and the marked annular flow channel; S55: Select the target annular flow channel by comparing the detected moving trajectory with the reference moving trajectory to determine if the movement exceeds the limit.

6. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 5, characterized in that, Methods for obtaining heat dissipation layout schemes also include: S60: Compare the detected moving trajectory with the reference moving trajectory to calculate the deviation moving trajectory, and select the marked annular flow channel corresponding to the deviation moving trajectory with the smallest distance as the selected annular flow channel; S61: Obtain the magnetic attraction auxiliary point based on the selected annular flow channel and the deviation movement trajectory; S62: The detection auxiliary trajectory is obtained based on the magnetic attraction auxiliary point and the reference movement trajectory of the selected annular flow channel; S63: The auxiliary force is detected by detecting the auxiliary trajectory and the specifications of the guide ball; S64: Combine the detection auxiliary force, detection auxiliary trajectory and detection usage environment to obtain the target magnetic attraction track, and use the target magnetic attraction track, selected annular flow channel and guide ball specifications as heat dissipation layout scheme.

7. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 6, characterized in that, Methods for obtaining the target magnetic track include: S70: The direction of the applied force for detection is retrieved from the average application force in the detection environment; S71: The fixed magnetic force is detected based on the average application force and the preset magnetic ball specifications; S72: Select the detection movement trajectory of the selected annular flow channel as the selected movement trajectory, and obtain the selected movement duration through the selected movement trajectory; S73: Calculate the initial straight-line distance based on the preset starting position and magnetic auxiliary point; S74: Calculate the magnetic attraction speed based on the initial straight-line distance and the selected movement time; S75: A magnetic straight track is obtained by using the magnetic attraction moving speed, initial straight distance and average inclination. S76: The target magnetic track is obtained based on the magnetic linear track, the detection auxiliary trajectory, the detection auxiliary force, and the specifications of the magnetic ball.

8. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 7, characterized in that, Methods for obtaining the target magnetic track also include: S80: Marking auxiliary magnetic force is obtained by using the specifications of the magnetic ball and the guide ball; S81: Compare the difference between the mark-assisted magnetic force and the detection-assisted force to form the target magnetic attraction track by combining the magnetic attraction linear track, magnetic ball specifications, starting position and detection fixed magnetic force, or calculate the difference between the mark-assisted magnetic force and the detection-assisted force as the force deviation value. S82: Obtain the remaining auxiliary trajectory based on the force deviation value and the detection auxiliary trajectory; S83: Increase auxiliary points by combining the remaining auxiliary trajectory with the selected annular flow channel; S84: Based on the addition of auxiliary points and magnetic attraction auxiliary points, a magnetic attraction arc track is obtained. The target magnetic attraction track is formed by combining the magnetic attraction linear track, the specifications of the magnetic ball, the magnetic attraction arc track, the starting position, and the detection of fixed magnetic force.

9. The operational amplifier layout evaluation method for suppressing PCB-level interference according to claim 8, characterized in that, Methods for obtaining the target magnetic track also include: S90: The minimum attraction distance is obtained by detecting the fixed magnetic force and the specifications of the magnetic ball; S91: The detection point of the fallback is obtained based on the minimum attraction distance and the starting position; S92: Retrieve the marked weight from the magnetic ball specifications; S93: Based on the marker weight, the detection drop point, and the magnetic attraction arc track, obtain the marker drop track and add it to the target magnetic attraction track.

10. An operational amplifier layout evaluation system for suppressing PCB-level interference, characterized in that, include: The acquisition module is used to acquire component specifications and testing environment information; A memory for storing a program that implements an operational amplifier layout evaluation method for suppressing PCB-level interference as described in any one of claims 1 to 9; The processor is used to load and execute programs stored in memory.

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