A heat sink for a solid state drive

Abstract

The application relates to a hard disk technical field, in particular to a heat dissipation device for a solid state disk, which comprises an upper heat dissipation plate, a lower heat dissipation plate and a connecting piece; the upper heat dissipation plate is provided with heat dissipation fins on the upper surface and a phase change material layer covering a main control chip on the lower surface; the upper surface of the lower heat dissipation plate is in contact with the solid state disk and is provided with a mounting groove; the connecting piece is connected to the two sides of the upper heat dissipation plate at both ends, the middle section is accommodated in the mounting groove, and at least the middle section is made of a shape memory alloy material and is configured to shrink and apply a pulling force to the upper heat dissipation plate in the direction of the lower heat dissipation plate in response to temperature rise. Through the time sequence cooperation of the shape memory alloy and the phase change material layer, the application realizes the staged heat management of 'first heat buffering and then active pressurization': under short-time burst load, the phase change material is melted to absorb heat and delay temperature rise; under continuous heavy load, the connecting piece shrinks to press the liquid phase change material to be thin, eliminate the bulk thermal resistance and avoid frequency reduction.

Description

Technical Field

[0001] This invention relates to the field of solid-state drive (SSD) heat dissipation technology, and in particular to a heat sink for a solid-state drive. Background Technology

[0002] Solid-state drives (SSDs) are used for data storage and are the core component for computer read and write operations. High-end SSD heatsinks incorporate a phase change material (PCT) layer to combat the "hitting the wall" phenomenon of rapid temperature rise in SSDs. During the transition from solid to liquid, the PCT maintains its melting point temperature, thus preventing further temperature increases. If the computer can complete commands during the melting process, the temperature will remain at the melting point, preventing overheating. However, it's impossible for the computer to complete commands precisely before the PCT layer melts every time. Once the PCT layer has completely melted, it becomes a complete obstacle to heat dissipation for the SSD.

[0003] This necessitates a heatsink that can both handle SSD "hitting the wall" and maintain high-power operation while ensuring good heat dissipation performance after the SSD "hit the wall". Summary of the Invention

[0004] To address the aforementioned problems in the prior art, the present invention provides a heat sink for a solid-state drive, comprising: an upper heat sink, a lower heat sink, and a connector; The upper surface of the upper heat sink has heat dissipation fins, and the lower surface is provided with a phase change material layer, which covers the main control chip of the solid-state drive. The upper surface of the lower heat sink contacts the solid-state drive and has a mounting slot; The connector has a first end, a middle section and a second end along its length, the first end and the second end are respectively connected to both sides of the upper heat sink, and the middle section is accommodated in the mounting groove; The connector, at least the middle section, is made of a shape memory alloy material configured to contract in response to a temperature rise in the solid-state drive, thereby applying a tensile force toward the lower heat sink via the first end and the second end.

[0005] Furthermore, the melting point of the phase change material layer is 45-55°C, and the phase change temperature of the shape memory alloy is 55-65°C.

[0006] Furthermore, it also includes a dam structure and multiple overflow holes, wherein the dam structure is disposed on the lower surface of the upper heat dissipation plate and surrounds the phase change material layer; The overflow hole extends through the upper heat sink plate, and multiple overflow holes are located in the coverage area of ​​the phase change material layer; After the connector retracts, the main control chip of the solid-state drive enters the dam structure and squeezes the phase change material layer. The phase change material layer melts and is pressurized before entering the overflow hole.

[0007] Furthermore, it includes: a linkage component, movably connected to the upper heat sink, its receiving end being connected to the connector, and its output end generating displacement in response to the contraction or restoration of the connector; The first auxiliary heat dissipation fin has a rotating shaft, which is rotatably connected to the upper heat dissipation plate and connected to the output terminal. When the connector retracts, the output terminal drives the first auxiliary heat dissipation fins to rotate around the pivot to an upright working state; when the connector retracts, the first auxiliary heat dissipation fins rotate around the pivot to a flat idle state.

[0008] Furthermore, the second auxiliary heat dissipation fins are thermally disconnected from the upper heat dissipation plate; It also includes at least one thermal bridge, which is movably disposed on the upper heat dissipation plate, and the thermal bridge is connected to the connector. When the connector retracts, it drives the thermal bridge to move to a conductive position that simultaneously contacts the upper heat sink and the second auxiliary heat sink fins; when the connector retracts, the thermal bridge moves to a disconnected position, in which the thermal bridge is thermally disconnected from at least one of the upper heat sink and the second auxiliary heat sink fins.

[0009] Furthermore, a reset elastic element is provided between the thermal bridge and the upper heat dissipation plate, and the elastic force of the reset elastic element causes the thermal bridge to move away from the second auxiliary heat dissipation fins. When the connector contracts, the thermal bridge causes the reset elastic element to deform.

[0010] Furthermore, it also includes at least one connecting elastic member, which connects the upper heat sink and the lower heat sink and is configured to provide a basic clamping force; Wherein, the basic clamping force is less than the tensile force applied through the first end and the second end when the shape memory alloy material shrinks above the phase transition temperature.

[0011] Furthermore, at least a portion of the surface of the middle section of the connector is in thermal contact with the inner wall of the mounting groove, so that the heat from the solid-state drive is conducted to the middle section via the lower heat sink.

[0012] Furthermore, the middle section of the connector is a flat strip, and the thickness direction of the flat strip is perpendicular to the length direction of the connector, so as to increase the contact area between the connector and the inner wall of the mounting groove.

[0013] Furthermore, the mounting groove is filled with thermally conductive grease.

[0014] The beneficial effects of this invention are reflected in the fact that, through the timing coordination between the shape memory alloy connector and the phase change material layer, a graded thermal management of "first thermal buffering, then active pressurization" is achieved. Under short-term burst loads, the phase change material layer slows down the temperature rise by melting and absorbing heat, thus providing a window for the solid-state drive to operate at full speed. After continuous heavy loads cause the phase change material to completely melt, the connector automatically contracts and pressurizes, compressing the liquid phase change material to a thinner state, eliminating its bulk thermal resistance, and allowing the heat sink to switch to a low thermal resistance heat conduction mode, avoiding frequency throttling caused by blocked heat dissipation paths. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of the heat sink provided by the present invention; Figure 2 This is a three-dimensional structural diagram of the solid-state drive of the present invention; Figure 3 A three-dimensional structural diagram of a solid-state drive with a thermally conductive silicone grease pad provided by the present invention; Figure 4 This is a schematic diagram of the structure of the lower surface of the upper heat sink provided by the present invention; Figure 5 This is a schematic diagram of the dam structure and overflow hole provided by the present invention; Figure 6 A three-dimensional structural diagram of the back of the heat sink provided by the present invention; Figure 7 A schematic cross-sectional view of the heat sink provided by the present invention; Figure 8 for Figure 7 Enlarged view of point a in the middle; Figure 9 This is a partial structural view of the heat sink provided in Embodiment 3 of the present invention; Figure 10 This is a partial structural view of the heat sink provided in Embodiment 4 of the present invention; Figure 11 This is a partial structural view of the heat sink provided in Embodiment 4 of the present invention from another perspective; Figure 12 This is a structural view of the heat sink provided in Embodiment 5 of the present invention.

[0016] Figure reference numerals: 0, Solid State Drive; 01, Main Controller Chip; 02, Thermal Pad; 1, Upper Heatsink; 11, Heatsink Fins; 111, Basic Heatsink Fins; 112, First Auxiliary Heatsink Fins; 1121, Linkage Components; 1122, Spindle; 113, Second Auxiliary Heatsink Fins; 1131, Thermal Bridge; 1132, Reset Elastic Component; 12, Dam Structure; 13, Overflow Hole; 2. Lower heat sink; 21. Mounting slot; 3. Connector; 31. First end; 32. Middle section; 33. Second end; 4. Phase change material layer; 5. Connecting elastic components. Detailed Implementation

[0017] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] Example 1 Reference Figures 1-8 As shown.

[0019] A heat sink for a solid-state drive 0 includes: an upper heat sink 1, a lower heat sink 2, and a connector 3; The upper surface of the upper heat sink 1 has heat dissipation fins, and the lower surface is provided with a phase change material layer 4, which at least covers the main control chip 01 of the solid-state drive 0. The upper surface of the lower heat sink 2 is in contact with the solid-state drive 0 and has a mounting groove 21; The connector 3 has a first end 31, a middle section 32 and a second end 33 along its length direction. The first end 31 and the second end 33 are respectively connected to the two sides of the upper heat sink 1, and the middle section 32 is accommodated in the mounting groove 21. Wherein, at least the middle section 32 of the connector 3 is made of shape memory alloy material, which is configured to contract in response to a temperature rise in the solid-state drive 0, so as to apply a tensile force toward the lower heat sink 2 to the upper heat sink 1 through the first end 31 and the second end 33.

[0020] This application only targets the M.2 solid-state drive 0, and the M.2 solid-state drive 0 does not generate heat as a whole. The temperature of the solid-state drive 0 mentioned in this application refers only to the local temperature of its main controller chip 01, and other parts will not experience temperature spikes.

[0021] When a computer is performing read / write operations, such as loading large game scene textures or writing a very large cache file, SSD 0 will enter a high-load state. The temperature of the controller and flash memory chips will rise sharply. When the temperature reaches the critical value set by the firmware (usually around 70°C - 80°C), continuing to run at full speed may damage the chips or cause data errors. In response, the controller chip 01 will forcibly reduce the read / write speed to prevent the temperature from rising further and avoid damage to SSD 0. This is the self-protection mechanism of SSD 0, but it will significantly slow down system response. This phenomenon is called "hitting the wall".

[0022] In the design of SSD heatsinks, manufacturers address the issue of "hitting the wall" (or "hitting the wall") by adding phase change materials (PCMs). PCMs only need to be attached to the SSD's controller chip. When the temperature rises, the PCM melts and absorbs heat, slowing down the rate of temperature increase. For example, without PCMs, the SSD's temperature might rise to 75°C within 3 seconds, triggering a throttling. A task that would normally take 5 seconds would take 20 seconds to complete, resulting in a very poor user experience. A heatsink with PCMs can extend the heating time to over 7 seconds, allowing the SSD to maintain full-speed operation for longer in higher temperature ranges. This allows the computer task to complete while the PCM melts. The few seconds gained by the thermal buffer formed by the melting PCM allow the SSD to run most short-duration burst tasks at full performance, instead of constantly running them.

[0023] The aforementioned technology of using phase change materials (PCMs) to form a thermal buffer is relatively mature. However, not all tasks can be completed during the thermal buffering period. Users also have needs for continuous high-intensity read / write tasks, such as 4K video editing, large database imports, or real-time rendering. In such cases, the PCM completely melts, the thermal buffer fails, the temperature spikes again, and a system crash is inevitable. Furthermore, the thermal conductivity of PCMs is far lower than that of metals. Therefore, PCMs are only applied in a very thin layer, providing a few seconds of buffering without significantly hindering the SSD from transferring heat to the heatsink fins. However, once the PCM completely melts, its thermal conductivity is even worse, and it loses its thermal buffering effect. At this point, its presence becomes a complete obstacle to heat dissipation.

[0024] In this embodiment, the shape memory alloy connector 3 is provided so that when the temperature rises, the shape memory alloy contracts to provide tension, causing the upper heat sink 1 and the solid-state drive 0 to squeeze the phase change material, making the phase change material thinner, thereby improving the heat conduction effect.

[0025] Specifically, thermal pads 02 are attached to the front and back of the solid-state drive (SSD) 0 to prevent scratches on components and increase the contact area between the SSD 0 and the heatsink. The heatsink in this embodiment includes an upper heatsink 1, a lower heatsink 2, and a connector 3. Both the upper heatsink 1 and the lower heatsink 2 are made of aluminum alloy. The lower heatsink 2 contacts the back of the SSD 0, and the upper heatsink 1 contacts the front of the SSD 0. The two are connected by the connector 3. The connector 3 is shaped like a metal wire or strip. The middle section 32 of the connector 3 is made of shape memory alloy, while the first end 31 and the second end 33 can be made of ordinary metal. The first end 31 is fixed to one side of the upper heatsink 1, the middle section 32 is installed in the mounting groove 21 on the lower surface of the lower heatsink 2, and the second end 33 is fixed to the other side of the upper heatsink 1. After installation, the connector 3 has a U-shaped structure.

[0026] The upper surface of the upper heat sink 1 is provided with heat dissipation fins, and the lower surface is provided with a phase change material layer 4. The phase change material layer 4 directly contacts the thermal grease pad 02 on the upper surface of the solid-state drive 0. The melting temperature of the phase change material layer 4 is lower than the phase change temperature of the shape memory alloy. For example, the melting point of the phase change material layer 4 is 45-55°C, and the phase change temperature of the shape memory alloy is 55-65°C. When the temperature of the solid-state drive 0 rises, the phase change material layer 4 begins to absorb heat and melt first, providing an initial heat dissipation buffer for the solid-state drive 0. At this time, the shape memory alloy has not yet triggered deformation, and the heat dissipation system maintains normal pressure without pressurizing the phase change material layer 4. When the computer does not complete the task during the heat buffer period, the temperature continues to rise. At this time, the phase change material has completely melted, and the shape memory alloy is triggered to undergo phase change and contraction, pulling the upper heat sink 1 to compress the phase change material layer 4, reducing its thickness and shortening the heat conduction path. This allows the heat dissipation fins to play a full role and significantly improves the heat transfer efficiency to the fins. When the temperature drops below the phase transition temperature of the shape memory alloy, the shape memory alloy returns to its original state, the tension of connector 3 weakens, and the thickness of phase change material layer 4 recovers.

[0027] It is important to note that the connector 3 in this application uses a shape memory alloy for pressurization, rather than a conventional spring to continuously apply significant pressure to the phase change material layer 4. While conventional springs can improve interfacial contact, they cause the solid phase change material layer 4 to thin at room temperature, reducing interfacial thermal resistance and accelerating the rate at which heat is transferred from the chip to the phase change material. This results in the phase change material absorbing its latent heat and melting completely in a shorter time, thus shortening the effective duration of the thermal buffer and weakening the phase change material's ability to withstand short-term sudden loads.

[0028] In this embodiment, the shape memory alloy connector 3 is in a relaxed state at room temperature, providing only a small base pressure (e.g., 10-20N), which is sufficient to ensure initial contact without significantly thinning the solid phase change material layer 4. Therefore, during the entire thermal buffering phase of temperature rise and phase change material melting, the interfacial thermal resistance remains at a relatively high level, and the rate of heat transfer to the phase change material is moderately suppressed, thereby extending the time required for the phase change material to fully melt and providing a longer full-speed operating window for the solid-state drive 0.

[0029] After the phase change material has completely melted and the thermal buffering is complete, connector 3 reaches its phase change temperature and contracts under pressure to compress the molten phase change material, thereby reducing thermal resistance and coping with continuous high load conditions. This graded pressure management strategy of "low pressure for extended life during the buffering phase and high pressure for heat conduction after the buffering is completed" is something that ordinary constant pressure springs cannot achieve.

[0030] Furthermore, the lower surface edge of the upper heat sink 1 is provided with an inner annular groove and an outer annular groove. The inner annular groove is close to the phase change material layer 4, and the outer annular groove is far away from the phase change material layer 4. The inner annular groove and the outer annular groove are connected by a downwardly inclined guide slope. The guide slope is configured such that, after the extrusion pressure is removed, gravity is used to guide the liquid phase change material in the outer annular groove back to the inner annular groove.

[0031] Example 2 Reference Figure 1-8 As shown.

[0032] In this embodiment, as Figure 5 As shown, the radiator in this embodiment also includes a dam structure 12 and a plurality of overflow holes 13. The dam structure 12 is disposed on the lower surface of the upper heat dissipation plate 1, surrounding the phase change material layer 4. The overflow hole 13 is formed on the upper heat sink 1, and multiple overflow holes 13 are located in the coverage area of ​​the phase change material layer 4; After the connector 3 retracts, the main control chip 01 of the solid-state drive 0 enters the dam structure 12 and squeezes the phase change material layer 4. The phase change material layer 4 melts and is pressurized before entering the overflow hole 13.

[0033] The working process of this embodiment is as follows: At room temperature.

[0034] At room temperature, the phase change material layer 4 is a solid sheet, disposed on the lower surface of the upper heat sink 1, and surrounded by the dam structure 12. The connector 3 is in a relaxed state, and the upper heat sink 1 forms thermal contact with the main control chip 01 of the solid-state drive 0 through the phase change material layer 4 and the thermal grease pad 02. At this time, the main control chip 01 has not yet entered the interior of the dam structure 12, the phase change material layer 4 maintains its initial thickness, and the overflow hole 13 is in an unused state.

[0035] The warming phase.

[0036] When the temperature of the solid-state drive 0 rises to the melting temperature range of the phase change material layer 4, the phase change material layer 4 begins to melt, changing from a solid state to a paste or liquid state. When the temperature further rises to the phase change temperature range of the connector 3, the connector 3 contracts, causing the upper heat sink 1 to move towards the solid-state drive 0. As the upper heat sink 1 continues to move downward, the main control chip 01 and the thermal grease pad 02 on its surface gradually enter the cavity defined by the dam structure 12.

[0037] During this process, the lower end face of the dam structure 12 makes close contact with the peripheral area of ​​the thermal grease pad 02 above the solid-state drive 0. At this time, the lower surface of the upper heat sink 1, the inner wall of the dam structure 12, and the upper surface of the thermal grease pad 02 together define a sealed space. The phase change material layer 4 is enclosed within this sealed space.

[0038] like Figure 7 , Figure 8 As shown, as the upper heat sink 1 continues to move downwards and the main control chip 01 further squeezes into the sealed space, the volume of the sealed space gradually decreases, applying pressure to the already melted phase change material layer 4 inside. Since the dam structure 12 prevents the lateral overflow of the liquid phase change material, and the thermal grease pad 02 also does not have the ability to absorb or contain the liquid phase change material, the liquid phase change material is forced to enter the overflow hole 13 upwards along the only path that can release pressure.

[0039] The overflow hole 13 provides a space to contain the liquid phase change material. As the compression continues, the liquid portion of the phase change material layer 4 is gradually squeezed into the overflow hole 13, and the thermally conductive silicone pad 02 above the main control chip 01 eventually comes into direct contact with the lower surface of the upper heat sink 1, forming a low thermal resistance solid-solid contact heat conduction path. At this time, the heat generated by the main control chip 01 can be directly conducted to the upper heat sink 1 through the thermally conductive silicone pad 02, without needing to pass through the volume thermal resistance of the phase change material layer 4.

[0040] Reset phase.

[0041] When the solid-state drive 0 completes a high-load task and its temperature begins to drop, the temperature of the connector 3 also decreases. When the temperature falls below the phase transition temperature range of the connector 3, the connector 3 returns to its length before high-temperature contraction, and the downward pull on the upper heat sink 1 disappears.

[0042] Because the thermal grease pad 02 underwent a certain elastic compression deformation during the previous extrusion process, when the tension of the connector 3 is removed, the elastic restoring force of the thermal grease pad 02 pushes the lower end face of the dam structure 12 upward, thereby driving the upper heat sink 1 to bounce upward and move away from the solid-state drive 0.

[0043] The upward movement of the upper heat sink 1 causes the volume of the sealed space to gradually increase, generating negative pressure within the sealed space. Simultaneously, the phase transition temperature of the shape memory alloy is higher than the melting temperature of the phase change material; therefore, the phase change material layer 4 remains in a liquid state. Under the combined action of the negative pressure and the gravity of the liquid phase change material itself, the liquid phase change material contained in the overflow hole 13 is drawn back or flows back into the sealed space, refilling the space between the lower surface of the upper heat sink 1 and the thermally conductive silicone pad 02.

[0044] As the temperature further decreases below the solidification temperature of the phase change material layer 4, the phase change material flowing back into the sealed space gradually cools and solidifies, restoring its solid sheet form and being re-laid on the lower surface of the upper heat sink 1. The overflow hole 13 returns to an empty state, preparing for the next thermal cycle.

[0045] In this embodiment, the design of the dam structure 12 and the overflow hole 13 completely avoids the risk of liquid phase change material overflowing laterally along the surface of the solid-state drive 0. The formation of the sealed space provides the liquid phase change material with the only upward discharge path, fundamentally eliminating the possibility of contaminating the circuit board of the solid-state drive 0.

[0046] During the high-temperature stage, direct contact between the thermal grease pad 02 and the upper heat sink 1 is achieved. After the phase change material is expelled into the overflow hole 13, the heat of the main control chip 01 can be directly conducted to the upper heat sink 1 through the thermal grease pad 02, eliminating the influence of the phase change material's bulk thermal resistance and further improving the heat dissipation efficiency under continuous heavy load.

[0047] The cooling stage enables the automatic recirculation and recovery of the phase change material. The elastic restoring force of the thermally conductive silicone pad 02 drives the upper heat sink 1 to rebound and generate negative pressure. Combined with gravity, the phase change material in the overflow hole 13 is actively drawn back into the sealed space, completing the closed-loop circulation.

[0048] All actions rely entirely on the material's own physical properties and mechanical structure, requiring no external energy or control components, which aligns with the passive and adaptive design philosophy of this radiator.

[0049] Example 3 Reference Figures 1-9 As shown.

[0050] like Figure 9 As shown, the heat sink in this embodiment also includes: a linkage component 1121, which is movably connected to the upper heat sink 1, its receiving end is connected to the connector 3, and its output end is displaced in response to the contraction or recovery of the connector 3. The first auxiliary heat dissipation fin 112 is rotatably connected to the upper heat dissipation plate 1 via a rotating shaft 1122 and is connected to the output terminal; When the connector 3 retracts, the output end drives the first auxiliary heat dissipation fin 112 to rotate around the rotating shaft 1122 to the upright working state; when the connector 3 returns to its original position, the first auxiliary heat dissipation fin 112 rotates around the rotating shaft 1122 to the flat idle state.

[0051] First, it's important to clarify that a larger heat dissipation area isn't always better; in some scenarios, the "largest heat dissipation area" can actually be detrimental. After all, in typical computer use, the low-power period far outweighs the high-load period. The controller chip 01 has an optimal operating temperature range (typically 40-70°C). At excessively low temperatures: NAND flash memory write / erase operations actually require higher voltages and longer operation times. Some 3D NAND flash memory exhibits 10-15% lower write performance at 25°C compared to 55°C. If maximum heat dissipation is applied immediately upon power-on: the time it takes for the controller chip 01 to rise from room temperature (25°C) to its optimal operating temperature (45°C) is significantly prolonged. During this "warm-up period," the SSD is actually operating in a suboptimal state.

[0052] For example, when a laptop is powered by battery and the SSD is idle, at maximum heat dissipation area: the heatsink continuously dissipates heat to the environment, keeping the temperature of the main controller chip 01 close to room temperature (30°C). When the user suddenly clicks on a file, the main controller chip 01 needs to start heating up from 30°C, increasing response latency. During standby, "heat preservation" keeps the main controller chip 01 at a standby temperature of 35-40°C.

[0053] In this embodiment, the deformation of the shape memory alloy generates tensile force, causing the heat sink to switch from a normal heat dissipation mode to a high-efficiency heat dissipation mode. The middle section 32 of the shape memory alloy is both the power source for the heat sink mode switching and the sensor for the switching timing.

[0054] As a sensor, the intermediate section 32 senses the temperature change of the solid-state drive 0. When the temperature is below the phase transition temperature, the intermediate section 32 remains relaxed, the first auxiliary heat dissipation fins 112 lie flat, and the heat sink operates in normal mode.

[0055] When the temperature rises above the phase change temperature, the intermediate section 32 undergoes a phase change and contracts, directly converting the temperature signal into mechanical tension. As a power source, this tension increases the compressive force on the phase change material layer 4 and, through the linkage component 1121, drives the first auxiliary heat dissipation fin 112 to stand up, automatically switching the heat sink to a high-efficiency heat dissipation mode.

[0056] When the temperature drops below the phase change temperature, the middle section 32 returns to its original length, the first auxiliary heat dissipation fin 112 returns to its flat position by its own gravity, and the heat sink returns to normal mode.

[0057] Reference Figure 9 Specifically, the application of the shape memory alloy's tensile force to the switching of the first auxiliary heat dissipation fin 112 can be achieved through the following design: the first auxiliary heat dissipation fin 112 is connected to the upper heat dissipation plate 1 via a rotating shaft 1122, and the vertical tensile force of the connecting member 3 is converted into torque around the rotating shaft 1122 via a linkage component 1121. The linkage component 1121 can be simply configured as a rigid connecting rod, with its output end fixed to one side of the rotating shaft 1122 and its response end fixedly connected to the connecting member 3. The first auxiliary heat dissipation fin 112 and the linkage component 1121 are located on both sides of the rotating shaft 1122, forming a lever structure; when the linkage component 1121 is subjected to tensile force and rotates, the first auxiliary heat dissipation fin 112 will also rotate accordingly.

[0058] Example 4 Reference Figures 1-8 as well as Figure 10 and Figure 11 As shown.

[0059] It also includes a second auxiliary heat dissipation fin 113, which is thermally disconnected from the upper heat dissipation plate 1; It also includes at least one thermal bridge 1131, which is movably disposed on the upper heat dissipation plate 1, and the thermal bridge 1131 is connected to the connector 3; When the connector 3 retracts, it drives the thermal bridge 1131 to move to a conductive position that simultaneously contacts the upper heat sink 1 and the second auxiliary heat sink 113; when the connector 3 retracts, the thermal bridge 1131 moves to a disconnected position, in which the thermal bridge 1131 is thermally disconnected from at least one of the upper heat sink 1 and the second auxiliary heat sink 113.

[0060] This embodiment provides another implementation method for switching the heat sink's heat dissipation mode, namely, the second heat dissipation.

[0061] The second auxiliary heat dissipation fin 113 is fixed to or integrally formed with the upper heat dissipation plate 1, but is thermally disconnected from the main body of the upper heat dissipation plate 1. Specifically, a heat insulation gap is provided between the root of the second auxiliary heat dissipation fin 113 and the main body of the upper heat dissipation plate 1, or it is mechanically connected by a connector 3 with a low thermal conductivity (such as a plastic clip or a ceramic gasket), so that under natural conditions, heat cannot be effectively conducted from the upper heat dissipation plate 1 to the second auxiliary heat dissipation fin 113.

[0062] The thermal bridge 1131 is movably disposed on the upper heat sink 1, for example, by slidingly mounting it in a guide groove on the side of the upper heat sink 1. The thermal bridge 1131 is made of a highly thermally conductive material, preferably a copper, aluminum, or graphene composite material. The thermal bridge 1131 is connected to the connector 3. Specifically, the connection can be that the first end 31 or the second end 33 of the connector 3 is directly fixed to the thermal bridge 1131, or indirectly connected through intermediate transmission components such as levers or connecting rods.

[0063] At room temperature or under light load, the solid-state drive 0 has a low temperature, which does not reach the phase transition temperature of the connector 3 (shape memory alloy). The connector 3 is in a relaxed state, and the thermal bridge 1131 remains in the disconnected position.

[0064] In the disconnected position, the thermal bridge 1131 is in contact only with the main body of the upper heat sink 1, or only with the second auxiliary heat sink fin 113, or not with either. In any case, the thermal bridge 1131 does not simultaneously bridge the upper heat sink 1 and the second auxiliary heat sink fin 113, and the heat conduction path between them is disconnected.

[0065] At this time, heat is dissipated only through the basic heat dissipation fins 111 of the upper heat sink 1, resulting in a relatively small heat dissipation area. This is beneficial for the solid-state drive 0 to quickly heat up to its optimal operating temperature range during light load or startup phases.

[0066] When the solid-state drive 0 enters a continuous high-load operating condition, its temperature gradually rises and reaches the phase change temperature threshold (e.g., 55°C to 65°C) of the connector 3, the middle section 32 (made of shape memory alloy) of the connector 3 undergoes phase change contraction, generating mechanical tension.

[0067] like Figure 10 , Figure 11 The contraction force is transmitted to the heat-conducting bridge 1131 through the end of the connector 3, driving the heat-conducting bridge 1131 to move from the disconnected position to the connected position along the guide groove.

[0068] At the conductive position, the thermal bridge 1131 simultaneously forms a tight thermal contact with both the main body of the upper heat sink 1 and the root of the second auxiliary heat sink fin 113. Specifically, one side surface of the thermal bridge 1131 is in contact with the upper heat sink 1, and the other side surface is in contact with the second auxiliary heat sink fin 113, thereby establishing a low thermal resistance heat conduction path between the two.

[0069] At this point, after the heat is conducted from the main controller chip 01 of the solid-state drive 0 to the main body of the upper heat sink 1, part of it continues to be dissipated through the basic heat sink fins 111, while the other part is conducted through the thermal bridge 1131 to the second auxiliary heat sink fins 113, which were originally thermally disconnected, thus increasing the effective heat dissipation area. The heat sink automatically switches to a high-efficiency heat dissipation mode to cope with the heat accumulation caused by continuous high load.

[0070] Furthermore, a reset elastic element 1132 is provided between the thermal bridge 1131 and the upper heat sink 1. The elastic force of the reset elastic element 1132 causes the thermal bridge 1131 to move away from the second auxiliary heat sink fin 113. When the connector 3 contracts, the thermal bridge 1131 causes the reset elastic element 1132 to deform.

[0071] For example, the reset elastic element 1132 is a spring sheet. One end of the reset elastic element 1132 is fixedly connected to the heat-conducting bridge 1131 and the other end is fixedly connected to the base heat sink 111. When the heat-conducting bridge 1131 is subjected to the tension of the connector 3, the heat-conducting bridge 1131 moves toward the auxiliary heat sink fin and stretches the reset elastic element 1132. When the temperature drops, the connector 3 elongates, the heat-conducting bridge 1131 loses its tension, and the reset elastic element 1132 restores its deformation and pulls the heat-conducting bridge 1131 away from the auxiliary heat sink fin.

[0072] Example 5 Reference Figure 12 As shown.

[0073] It also includes at least one connecting elastic member 5, which connects the upper heat sink 1 and the lower heat sink 2 and is configured to provide a basic clamping force; Wherein, the basic clamping force is less than the tensile force applied by the first end 31 and the second end 33 when the shape memory alloy material shrinks above the phase transition temperature.

[0074] The basic clamping force is designed to be significantly less than the tensile force applied by the connector 3 when it contracts above the phase transition temperature. For example, the basic clamping force is 10 to 20 N, while the tensile force applied by the connector 3 when it contracts is 100 to 200 N.

[0075] Under normal temperature and light load conditions, the connector 3 is in a relaxed state, with the basic clamping force provided only by the connecting elastic element 5. This basic clamping force is sufficient to ensure interface contact, but will not excessively thin or crush the internal structure of the solid phase change material layer 4, thereby protecting the thermal buffering potential and cycle life of the phase change material layer 4.

[0076] When the temperature of the solid-state drive 0 rises above the phase change temperature of the connector 3, the connector 3 contracts, applying an additional tensile force much greater than the basic clamping force. At this time, the total clamping force on the upper heat sink 1 is the sum of the basic clamping force and the tensile force of the connector 3, achieving high-pressure extrusion of the molten phase change material layer 4 and significantly reducing the interface thermal resistance.

[0077] After the temperature drops and the connector 3 returns to its original length, the total clamping force is restored to the basic clamping force provided only by the connecting elastic element 5, preparing for the next cycle.

[0078] Through the cooperation of the connecting elastic element 5 and the shape memory alloy connector 3, this embodiment achieves graded pressure management of "normal temperature low pressure protection and high temperature high pressure enhancement", taking into account both the long-term reliability of the phase change material layer 4 and the thermal conductivity under continuous heavy load.

[0079] Example 6 Reference Figures 1-8 As shown.

[0080] At least a portion of the surface of the intermediate section 32 of the connector 3 is in thermal contact with the inner wall of the mounting groove 21, so that the heat of the solid-state drive 0 is conducted to the intermediate section 32 via the lower heat sink 2.

[0081] The middle section 32 of the connector 3 and the inner wall of the mounting groove 21 are in direct contact to form an efficient heat conduction interface, which makes the heat conduction path shorter, ensures the sensitivity of the phase change response, avoids phase change lag due to heat conduction delay, and thus ensures that the connector 3 can trigger the phase change action in a timely and accurate manner near the preset temperature threshold. It also ensures that the connector 3 can shrink in time after the phase change material melts and the main control chip 01 continues to heat up, driving the upper heat sink 1 to squeeze the liquid phase change material.

[0082] Furthermore, the middle section 32 of the connector 3 is a flat strip, and the thickness direction of the flat strip is perpendicular to the length direction of the connector 3, so as to increase the contact area between the connector 3 and the inner wall of the mounting groove 21.

[0083] The middle section 32 of the connector 3 is set as a flat strip, thereby increasing the contact area between the middle section 32 and the inner wall of the mounting groove 21 and improving the heat conduction efficiency.

[0084] Furthermore, the mounting groove 21 is filled with thermally conductive grease.

[0085] Thermal grease is filled into the mounting groove 21 to further eliminate the micro gap between the middle section 32 and the groove wall, further reduce the contact thermal resistance, and significantly improve the heat transfer rate from the solid-state drive 0 to the shape memory alloy connector 3.

[0086] In the description of the embodiments of the present invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "center," "top," "bottom," "top," "bottom," "inner," "outer," "inner side," and "outer side," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention. "Inner side" refers to the interior or enclosed area or space. "Outer perimeter" refers to the area surrounding a specific component or specific area.

[0087] In the description of embodiments of the present invention, the terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise stated, "a plurality of" means two or more.

[0088] In the description of the embodiments of the present invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "assembly" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0089] In the description of embodiments of the present invention, specific features, structures, materials or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0090] In the description of the embodiments of the present invention, it should be understood that "-" and "~" represent a range between two numerical values, and this range includes the endpoints. For example, "AB" represents a range greater than or equal to A and less than or equal to B. "A~B" represents a range greater than or equal to A and less than or equal to B.

[0091] In the description of embodiments of the present invention, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0092] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A heatsink for a solid-state drive, characterized in that, include: Upper heat sink, lower heat sink, connectors; The upper surface of the upper heat sink has heat dissipation fins, and the lower surface is provided with a phase change material layer, which covers the main control chip of the solid-state drive. The upper surface of the lower heat sink contacts the solid-state drive and has a mounting slot; The connector has a first end, a middle section and a second end along its length direction. The first end and the second end are respectively connected to both sides of the upper heat sink plate, and the middle section is accommodated in the mounting groove. Wherein, at least the middle section of the connector is made of a shape memory alloy material, which is configured to contract in response to a temperature rise in the solid-state drive to apply a tensile force toward the lower heat sink via the first end and the second end; It also includes a dam structure, multiple overflow holes, and a thermally conductive silicone pad. The dam structure is disposed on the lower surface of the upper heat sink and surrounds the phase change material layer. The thermal grease pad is attached to the front of the solid-state drive; The overflow hole extends through the upper heat sink plate, and multiple overflow holes are located in the coverage area of ​​the phase change material layer; After the connector retracts, the main control chip of the solid-state drive enters the dam structure and squeezes the phase change material layer. The phase change material layer melts and is pressurized before entering the overflow hole; The lower end face of the dam structure is in close contact with the periphery of the thermal grease pad above the solid-state drive. The lower surface of the upper heat sink, the inner wall of the dam structure, and the upper surface of the thermal grease pad together define a sealed space. During the cooling phase, the elastic restoring force of the thermal grease pad pushes the lower end face of the dam structure upward, thereby driving the upper heat sink to bounce upward and move away from the solid-state drive; The upward movement of the upper heat sink causes the volume of the sealed space to gradually increase, generating negative pressure within the sealed space and attracting the phase change material to reset.

2. The heat sink for a solid-state drive according to claim 1, characterized in that: The melting point of the phase change material layer is 45-55°C, and the phase change temperature of the shape memory alloy is 55-65°C.

3. The heat sink for a solid-state drive according to claim 2, characterized in that, include: The linkage component is movably connected to the upper heat sink plate. Its receiving end is connected to the connector, and its output end generates displacement in response to the contraction or restoration of the connector. The first auxiliary heat dissipation fin has a rotating shaft, which is rotatably connected to the upper heat dissipation plate and connected to the output terminal. When the connector retracts, the output terminal drives the first auxiliary heat dissipation fins to rotate around the pivot to an upright working state; when the connector retracts, the first auxiliary heat dissipation fins rotate around the pivot to a flat idle state.

4. A heat sink for a solid-state drive according to claim 2, characterized in that, The second auxiliary heat dissipation fins are thermally disconnected from the upper heat dissipation plate; It also includes at least one thermal bridge, which is movably disposed on the upper heat dissipation plate, and the thermal bridge is connected to the connector. When the connector retracts, it drives the thermal bridge to move to a conductive position that simultaneously contacts the upper heat sink and the second auxiliary heat sink fins; when the connector retracts, the thermal bridge moves to a disconnected position, in which the thermal bridge is thermally disconnected from at least one of the upper heat sink and the second auxiliary heat sink fins.

5. A heat sink for a solid-state drive according to claim 4, characterized in that, A reset elastic element is provided between the thermal bridge and the upper heat sink plate. The elastic force of the reset elastic element causes the thermal bridge to move away from the second auxiliary heat sink fins. When the connector contracts, the thermal bridge causes the reset elastic element to deform.

6. A heat sink for a solid-state drive according to claim 3 or 4, characterized in that, It also includes at least one connecting elastic member that connects the upper heat sink and the lower heat sink and is configured to provide a basic clamping force; Wherein, the basic clamping force is less than the tensile force applied through the first end and the second end when the shape memory alloy material shrinks above the phase transition temperature.

7. A heat sink for a solid-state drive according to claim 6, characterized in that, At least a portion of the surface of the middle section of the connector is in thermal contact with the inner wall of the mounting groove, so that the heat from the solid-state drive is conducted to the middle section via the lower heat sink.

8. A heat sink for a solid-state drive according to claim 7, characterized in that, The middle section of the connector is a flat strip, and the thickness direction of the flat strip is perpendicular to the length direction of the connector, so as to increase the contact area between the connector and the inner wall of the mounting groove.

9. A heat sink for a solid-state drive according to claim 8, characterized in that, The mounting slot is filled with thermally conductive grease.

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