filter

Abstract

The application relates to the technical field of electronic equipment, and provides a filter which comprises a shell, a conductive row assembly, a nanocrystalline magnetic core, a ferrite magnetic core and a sealing cover; the shell is of an integrated structure, and the shell is provided with a first mounting cabin and a second mounting cabin; the input side of the conductive row assembly is arranged in the nanocrystalline magnetic core; the output side of the conductive row assembly is arranged in the ferrite magnetic core; the nanocrystalline magnetic core is arranged in the first mounting cabin, the sealing cover is detachably arranged at the cabin opening of the first mounting cabin, the ferrite magnetic core comprises a U-shaped first iron core section and an I-shaped second iron core section, the first iron core section and the second iron core section are butt-jointed to form a closed magnetic circuit, and the first iron core section and the second iron core section are both arranged in the second mounting cabin; and the cabin opening of the second mounting cabin is detachably provided with a buckling piece. The filter can greatly reduce the overall volume and occupied space, is suitable for adapting to the miniaturized integrated cavity of a high-voltage system, and can avoid layout interference with surrounding components.

Description

Technical Field

[0001] This invention relates to the field of electronic equipment technology, and more particularly to a filter. Background Technology

[0002] Currently, filters are widely used in high-voltage systems of new energy vehicles (such as high-voltage controllers, power distribution units, electric drive systems, and on-board high-voltage fast charging scenarios) to suppress electromagnetic interference (EMI) and meet the electromagnetic compatibility (EMC) regulations for the entire vehicle. Existing on-board filters typically use a discrete component arrangement, that is, components such as capacitors, inductors, magnetic rings, and copper busbars are installed separately in the cavity and assembled through processes such as secondary injection molding, potting curing, or laser welding.

[0003] The shortcomings of existing technologies are as follows: First, the loose structure and low integration result in a large size and large space occupation, making it difficult to adapt to the increasingly miniaturized integrated cavities of high-voltage systems and prone to layout interference with surrounding components; Second, the production process is complex and inefficient, requiring multiple injection molding, potting, and welding processes, which not only leads to large assembly deviations and high defect rates, but also increases the overall weight and manufacturing cycle due to the secondary injection molding and potting structure, failing to meet the needs of large-scale and efficient mass production; Third, the functions are limited and the degree of matching with the intelligence of the whole vehicle is low. Summary of the Invention

[0004] This invention aims to at least solve one of the technical problems existing in related technologies. To this end, this invention proposes a filter that significantly reduces the overall size and space occupied, adapts to the miniaturized integrated cavity of high-voltage systems, and avoids layout interference with surrounding components.

[0005] A filter according to an embodiment of the present invention includes: The housing is an integral structure, and the housing is provided with a first installation compartment and a second installation compartment; Conductor bus assembly; The nanocrystalline magnetic core, with the input side of the conductive bus assembly passing through the nanocrystalline magnetic core; A ferrite core, wherein the output side of the conductive bus assembly passes through the ferrite core; The nanocrystalline magnetic core is located in the first mounting compartment. The hatch of the first mounting compartment is detachably equipped with a sealing cover. The ferrite magnetic core includes a U-shaped first core segment and an I-shaped second core segment. The first core segment and the second core segment are connected to form a closed magnetic circuit and are both located in the second mounting compartment. The hatch of the second mounting compartment is detachably equipped with a clamping component.

[0006] According to one embodiment of the present invention, the first mounting compartment is disposed on a first side of the housing along the length direction, the second mounting compartment is disposed on a second side of the housing along the length direction, and the input side of the conductive bus assembly is located on the first side of the housing along the length direction, and the output side of the conductive bus assembly is located on the second side of the housing along the length direction.

[0007] According to one embodiment of the present invention, it further includes: The first PCB board is electrically connected to the conductive busbar assembly. The housing is also provided with a third mounting compartment. The third mounting compartment is located on the first side of the housing along the length direction and above the first mounting compartment along the height direction. The first PCB board is disposed in the third mounting compartment.

[0008] According to one embodiment of the present invention, a plurality of surface-mount capacitors are provided on the hatch side of the first PCB board facing the third mounting compartment, and at least one pair of Y capacitors are provided on the hatch side of the first PCB board away from the third mounting compartment.

[0009] According to one embodiment of the present invention, it further includes: The second PCB board is electrically connected to the conductive busbar assembly. The housing is also provided with a fourth mounting compartment. The third mounting compartment has a recessed portion on one side along the width direction of the housing, and the fourth mounting compartment is located in the recessed portion. A high-voltage sampling device is disposed on the second PCB board and electrically connected to the conductive busbar assembly through the second PCB board. The high-voltage sampling device is located on the hatch side of the third installation compartment.

[0010] According to one embodiment of the present invention, it further includes: A current sampling device is electrically connected to the conductive bus assembly. The housing is also provided with a fifth mounting compartment, in which the current sampling device is located.

[0011] According to one embodiment of the present invention, it further includes: An X-capacitor is electrically connected to the conductive busbar assembly. The housing is also provided with a sixth mounting compartment, which is located below the second mounting compartment along the height direction. The X-capacitor is disposed in the sixth mounting compartment.

[0012] According to one embodiment of the present invention, it further includes: The safety device further includes a seventh mounting compartment on the housing, which is located on the same side of the housing along the length of the housing and is adjacent to the second mounting compartment. The safety device is electrically connected to the conductive busbar assembly.

[0013] According to one embodiment of the present invention, at least one end of the fastening member along the width direction is snapped together with the housing, and a buffer pad is provided between the fastening member and the first iron core segment.

[0014] According to one embodiment of the present invention, the busbar assembly includes a first busbar, a second busbar, and a third busbar, wherein the input sides of the first busbar, the second busbar, and the third busbar are all disposed in the nanocrystalline magnetic core, and the output sides of the first busbar, the second busbar, and the third busbar are all disposed in the ferrite magnetic core.

[0015] The above-described one or more technical solutions in the embodiments of the present invention have at least one of the following technical effects: The filter provided by this invention separates the nanocrystalline magnetic core and the ferrite magnetic core in the first and second mounting compartments of the housing, and fixes them with detachable sealing covers and clamping components. At the same time, the input side of the conductor bus assembly passes through the nanocrystalline magnetic core, and the output side passes through the ferrite magnetic core formed by the mating of a U-shaped first iron core segment and an I-shaped second iron core segment. This enables a high degree of integration between multi-stage filtering function and housing structure, significantly reducing the overall volume and space occupied. Moreover, it eliminates the need for complex processes such as secondary injection molding, potting, or laser welding. The magnetic core assembly can be completed simply by clamping and covering. Furthermore, the detachable sealing cover and clamping components facilitate later maintenance and repair. This solves the problems of loose structure, low integration leading to large size, difficulty in adapting to miniaturized cavities, complex manufacturing processes, low efficiency, and high defect rate in the prior art.

[0016] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention and are not considered as limitations on this application. Moreover, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0018] Figure 1 This is one of the schematic structural diagrams of the filter provided in the embodiments of the present invention.

[0019] Figure 2 This is the second schematic structural diagram of the filter provided in the embodiment of the present invention.

[0020] Figure 3 This is the third schematic structural diagram of the filter provided in the embodiment of the present invention.

[0021] Figure 4 This is the fourth schematic structural diagram of the filter provided in the embodiments of the present invention.

[0022] Figure 5 This is one of the schematic structural diagrams of the internal components of the filter housing provided in the embodiments of the present invention.

[0023] Figure 6 This is the second schematic structural diagram of the internal components of the filter housing provided in the embodiment of the present invention.

[0024] Figure 7 This is one of the schematic structural diagrams of the housing in the filter provided in the embodiments of the present invention.

[0025] Figure 8 This is the second schematic structural diagram of the housing in the filter provided in the embodiment of the present invention.

[0026] Figure 9 This is the third schematic structural diagram of the housing in the filter provided in this embodiment of the invention.

[0027] Figure 10 This is a circuit topology diagram of the filter provided in an embodiment of the present invention.

[0028] Figure label: 100. Housing; 110. First mounting compartment; 120. Second mounting compartment; 130. Third mounting compartment; 140. Fifth mounting compartment; 150. Sixth mounting compartment; 160. Seventh mounting compartment; 170. Sealing cover; 180. Clamping component; 190. Buffer pad; 1100. Fourth mounting compartment; 200. Conductor bus assembly; 210. First conductor bus; 220. Second conductor bus; 230. Third conductor bus; 300. Nanocrystalline magnetic core; 400. Ferrite magnetic core; 410. First iron core segment; 420. Second iron core segment; 500. First PCB board; 510. Surface mount capacitor; 520. Y capacitor; 600. Current sampling device; 700. X capacitor; 800. Fuse device; 900. Second PCB board; 910. High voltage sampling device. Detailed Implementation

[0029] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0030] The specific terms used in this specification are for illustrative purposes only and are not intended to limit the illustrated embodiments. For example, expressions such as "same" and "identical" not only indicate a strictly identical state, but also indicate a state with tolerances or differences in the degree of functionality. For example, expressions indicating relative or absolute arrangement such as "in a certain direction," "along a certain direction," "side by side," "perpendicular," "centered on," "concentric," or "coaxial" not only strictly indicate such an arrangement, but also indicate a state of relative displacement by tolerances or angles or distances with the same degree of functionality.

[0031] The terms “center,” “longitudinal,” “lateral,” “length,” “width,” “thickness,” “upper,” “lower,” “front,” “rear,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” “outer,” “clockwise,” “counterclockwise,” “axial,” “radial,” and “circumferential” indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0032] Furthermore, features specified as "first" or "second" may explicitly or implicitly include one or more of those features. In the description of this invention, unless otherwise stated, "multiple" means two or more. In the description of the embodiments of this application, "multiple" means two or more, unless otherwise explicitly specified. In the description of the embodiments of this application, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, B1 and / or B2 can represent: B1 existing alone, B1 and B2 existing simultaneously, and B2 existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0033] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0034] The following is combined with Figures 1 to 10 Describe the filter provided by this invention.

[0035] It should be noted that in the embodiments of the present invention, the length direction, width direction, and height direction can all be referred to as Figure 1 The arrows shown refer to the length, width, and height directions of the housing 100, respectively. These directions are only used to assist in describing the relative positional and assembly relationships between the components and do not constitute any limitation on the installation orientation or spatial layout of the embodiments of the present invention in actual applications. Those skilled in the art can adjust the direction definitions accordingly based on actual needs in different vehicle models or installation locations, as long as they do not depart from the essential technical solution of the embodiments of the present invention.

[0036] See Figures 1 to 9 As shown, the filter provided in this embodiment of the invention includes: a housing 100, a busbar assembly 200, a nanocrystalline magnetic core 300, and a ferrite magnetic core 400.

[0037] The housing 100 is an integral structure, and the housing 100 is provided with a first mounting compartment 110 and a second mounting compartment 120; the input side of the conductive bus assembly 200 passes through the nanocrystalline magnetic core 300; the output side of the conductive bus assembly 200 passes through the ferrite magnetic core 400; wherein, the nanocrystalline magnetic core 300 is located in the first mounting compartment 110, and the hatch of the first mounting compartment 110 is detachably provided with a sealing cover 170; the ferrite magnetic core 400 includes a U-shaped first core segment 410 and an I-shaped second core segment 420, the first core segment 410 and the second core segment 420 are connected to form a closed magnetic circuit, and both are located in the second mounting compartment 120, and the hatch of the second mounting compartment 120 is detachably provided with a clamping member 180.

[0038] The filter provided by this invention, by separately placing the nanocrystalline magnetic core 300 and the ferrite magnetic core 400 in the first mounting compartment 110 and the second mounting compartment 120 of the housing 100, and fixing them respectively with a detachable sealing cover 170 and a clamping member 180, allows the input side of the conductive bus assembly 200 to pass through the nanocrystalline magnetic core 300 and the output side to pass through the ferrite magnetic core 400 formed by the butt joint of the U-shaped first iron core segment 410 and the I-shaped second iron core segment 420. This enables a high degree of integration of multi-stage filtering function with the structure of the housing 100, significantly reducing the overall volume and space occupied. Moreover, it eliminates the need for complex processes such as secondary injection molding, potting, or laser welding, and the magnetic core assembly can be completed simply by clamping and covering. Furthermore, the detachable sealing cover 170 and clamping member 180 facilitate later maintenance and repair. This solves the problems of loose structure, low integration leading to large size, difficulty in adapting to miniaturized cavities, complex production process, low efficiency, and high defect rate in the prior art.

[0039] When assembling the nanocrystalline magnetic core 300, simply place the nanocrystalline magnetic core 300 into the first mounting chamber 110, pass the input side of the busbar assembly 200 through the nanocrystalline magnetic core 300, and then fix it by applying adhesive to the sealing cap 170. There is no need for secondary injection molding or potting processes to encapsulate and cure the nanocrystalline magnetic core 300. When assembling the ferrite magnetic core 400, first place the I-shaped second core segment 420 into the bottom of the second mounting chamber 120. Then, pass the output side of the busbar assembly 200 over the second core segment 420. Next, connect the U-shaped first core segment 410 to the second core segment 420 from above to form a closed magnetic circuit, allowing the output side of the busbar assembly 200 to pass through this closed magnetic circuit. Finally, fix the clamping member 180 at the opening of the second mounting chamber 120, and the clamping member 180 presses the U-shaped first core segment 410 to complete the fixed assembly of the ferrite magnetic core 400. With the above structural design, it is not necessary to pass the busbar assembly 200 through the ferrite core 400 and then weld the lead-out part, nor is it necessary to pot the ferrite core 400, thus significantly simplifying the assembly process and improving assembly efficiency and consistency.

[0040] Specifically, the housing 100 provides a unified mounting base and structural support for the nanocrystalline magnetic core 300, ferrite magnetic core 400, and busbar assembly 200, integrating these components into a single unit. Simultaneously, the first mounting bay 110 and the second mounting bay 120 independently position and fix the nanocrystalline magnetic core 300 and ferrite magnetic core 400, respectively, preventing relative displacement or interference between the components. The housing 100 also replaces the distributed mounting brackets or independent shells in traditional filters with its integrated structure, thereby reducing the overall size and simplifying the vehicle assembly process. Furthermore, it provides an interface for platform-based installation of the filter with onboard high-voltage controllers, power distribution units, or electric drive systems, improving the filter's versatility and adaptability.

[0041] In some embodiments, the housing 100 can be made of glass fiber composite materials such as PPS-GF30 and PPS-GF40 through an integral injection molding process, thereby reducing the overall weight of the filter while ensuring structural strength. The injection-molded integral housing 100 can precisely reserve the first mounting compartment 110, the second mounting compartment 120 and standardized mounting holes to ensure the assembly accuracy of the nanocrystalline magnetic core 300 and the ferrite magnetic core 400. At the same time, the housing 100 material itself has insulation properties and high and low temperature cycling resistance, which can meet the electrical safety and durability requirements in the vehicle environment.

[0042] The busbar assembly 200 is used to realize the electrical connection and power transmission between the filter and the external high-voltage bus. During operation, the busbar assembly 200 can be directly connected to the DC high-voltage side of the battery pack, and the high-voltage DC current is introduced into the filter through the high-voltage positive terminal HV+ and the high-voltage negative terminal HV-. After the current passes through the filter to filter out high-frequency interference and purify the waveform, it outputs low-interference DC power and delivers it to the downstream high-voltage controller, electric drive system and vehicle high-voltage fast charging circuit and other high-voltage electrical equipment.

[0043] In some embodiments, each busbar in the busbar assembly 200 can be an integrally formed embedded copper busbar structure. Its surface can be partially or completely nickel-plated or tin-plated as needed to improve corrosion resistance and solderability. Internal slots or positioning bosses are provided to cooperate with corresponding positioning structures on the housing 100, enabling rapid and precise assembly of the busbar within the housing 100 without additional tooling or adjustment. Furthermore, the thickness and width of the busbar can be customized according to the rated current-carrying capacity of the filter. For high-power electric drives or high-voltage fast charging scenarios, the cross-sectional area of ​​the busbar can be increased accordingly to reduce temperature rise and conduction losses, while maintaining stable magnetic coupling performance with the nanocrystalline magnetic core 300 and the ferrite magnetic core 400.

[0044] In one specific embodiment, the busbar assembly 200 includes a first busbar 210, a second busbar 220, and a third busbar 230. The input sides of the first busbar 210, the second busbar 220, and the third busbar 230 are all connected to the nanocrystalline magnetic core 300, and the output sides of the first busbar 210, the second busbar 220, and the third busbar 230 are all connected to the ferrite magnetic core 400. Specifically, the first busbar 210 is an HV+ copper busbar (DC positive busbar), the second busbar 220 is an HV- copper busbar (DC negative busbar), and the third busbar 230 is a Boost copper busbar (boost-side copper busbar), used to carry the high-voltage current after DC / DC boost, complete power transmission and distribution, and simultaneously reduce line losses and ensure the safe and stable operation of the high-voltage circuit.

[0045] In some embodiments, the first conductive bus 210, the second conductive bus 220 and the third conductive bus 230 can all be bent in a specific manner to adapt to the layout of the mounting compartments on the housing and the spatial relationship between the nanocrystalline magnetic core 300 and the ferrite magnetic core 400.

[0046] The nanocrystalline magnetic core 300 is used to suppress high-frequency common-mode interference on the input side of the busbar assembly 200. Utilizing the high initial permeability and low high-frequency loss of nanocrystalline materials, it converts high-frequency noise energy into heat dissipation, thus forming the first high-frequency filtering barrier at the input stage of the filter. At the same time, the nanocrystalline magnetic core 300 and the input side of the busbar assembly 200 together constitute the first-stage filter inductor, which, together with the capacitor array, effectively attenuates interference in the tens of kilohertz to tens of megahertz frequency bands and provides a clean input current environment for the subsequent low-frequency filtering of the ferrite magnetic core 400, thereby improving the frequency band coverage balance and interference suppression depth of the entire filter.

[0047] It should be noted that the first mounting compartment 110 provided on the housing 100 can be designed to conform to the outline of the nanocrystalline magnetic core 300, so that the nanocrystalline magnetic core 300 can be placed into the first mounting compartment 110 with a clearance fit or transition fit, and the limiting structure of the bottom and walls of the compartment prevents it from shifting or rotating in the horizontal direction; the depth of the first mounting compartment 110 is basically the same as the height of the nanocrystalline magnetic core 300, so that after the sealing cover 170 is fastened, a uniform pre-tightening force can be applied to the nanocrystalline magnetic core 300 from above, so that the nanocrystalline magnetic core 300 can be reliably fixed in the compartment by dispensing glue without relying on potting glue or secondary injection molding.

[0048] The ferrite core 400 is used to suppress low-frequency common-mode interference and some differential-mode interference on the output side of the busbar assembly 200. It utilizes the characteristics of specific materials (such as manganese-zinc ferrite material) with stable permeability and high saturation magnetic flux density in the low-frequency band to effectively absorb and filter out conducted interference energy in the frequency band of several kilohertz to several megahertz, thus forming a multi-level filtering architecture that is frequency complementary with the high-frequency filtering of the nanocrystalline core 300.

[0049] In this embodiment of the invention, the ferrite core 400 forms a closed magnetic circuit by connecting the first core segment 410 of the U-shape and the second core segment 420 of the I-shape. While satisfying the magnetic flux coupling efficiency, the split structure allows the conductive bus assembly 200 to be assembled without breaking it, which ensures both filtering performance and process convenience.

[0050] Similarly, the second mounting compartment 120 can be designed to mimic the overall shape of the ferrite core 400. The bottom of the compartment is provided with a bearing surface for positioning the type I second core segment 420, and the sides of the compartment are provided with guide ribs or limiting bosses for limiting the horizontal displacement of the U-shaped first core segment 410. The depth of the second mounting compartment 120 is configured to be slightly greater than the overall height after the U-shaped first core segment 410 and the type I second core segment 420 are joined together, so that after the type I second core segment 420 is inserted and the conductive busbar assembly 200 is arranged, the U-shaped first core segment 410 can be embedded from above and tightly joined with the type I second core segment 420. Finally, the upper surface of the U-shaped first core segment 410 is pressed from the hatch by the clamping member 180, so that the split ferrite core 400 can be reliably fixed in the compartment without potting or welding.

[0051] Understandably, the arrangement of the first mounting compartment 110 and the second mounting compartment 120 on the housing 100 can be flexibly adjusted according to the specific application scenario of the filter and the cavity shape of the vehicle's high-voltage system. For example, they can be arranged sequentially along the length of the housing 100 so that the busbar assembly 200 is in a straight line, or arranged side by side along the width to shorten the overall length and adapt to the compact space.

[0052] In some embodiments, an isolation rib or shielding structure may be provided between the first mounting compartment 110 and the second mounting compartment 120 as needed to reduce magnetic field coupling interference between the nanocrystalline magnetic core 300 and the ferrite magnetic core 400, and ensure that the two-stage filtering units each operate in the optimal frequency band, thereby taking into account both filtering performance and layout flexibility under the premise of miniaturized integration.

[0053] See Figures 1 to 4 As shown, according to some embodiments of the present invention, a first mounting compartment 110 is disposed on a first side of the housing 100 along the length direction, a second mounting compartment 120 is disposed on a second side of the housing 100 along the length direction, and the input side of the conductive bus assembly 200 is located on the first side of the housing 100 along the length direction, and the output side of the conductive bus assembly 200 is located on the second side of the housing 100 along the length direction.

[0054] By placing the first mounting compartment 110 and the nanocrystalline magnetic core 300 at the first end of the length direction of the housing 100, and the second mounting compartment 120 and the ferrite magnetic core 400 at the second end of the length direction of the housing 100, and placing the input side and output side of the busbar assembly 200 at the two ends respectively, the overall profile of the filter can be extended along the length direction, reducing the space occupied in the width direction. This allows it to adapt to the miniaturized integrated cavity with limited width in the high-voltage system and avoids layout interference with surrounding components in the width direction. At the same time, the nanocrystalline magnetic core 300 and the ferrite magnetic core 400 are placed at the two ends along the length direction, forming natural isolation in space. This can effectively reduce near-field magnetic field coupling interference between the two magnetic cores, prevent high-frequency filtering and low-frequency filtering from affecting each other and causing the filtering characteristics to deteriorate, and thus ensure that the two-stage filtering units can independently perform the best suppression effect.

[0055] Understandably, the first mounting compartment 110 can be located in the middle of the first side of the housing 100 along its length, or at the end of the first side. Alternatively, depending on the interface layout requirements of the vehicle's high-voltage controller or power distribution unit, the first mounting compartment 110 can be arranged on one edge of the housing 100 along its width, so that the input side of the busbar assembly 200 can be connected to the external busbar nearby. The second mounting compartment 120 can be arranged accordingly on the second side of the housing 100 along its length and at an appropriate distance from the first mounting compartment 110. It can also be set in the central area of ​​the housing 100 or off-center, depending on the overall center of gravity distribution and heat dissipation requirements of the filter, as long as it ensures that the busbar assembly 200 can pass through the nanocrystalline magnetic core 300 in the first mounting compartment 110 and extend to the ferrite magnetic core 400 in the second mounting compartment 120 to form a complete filtering path. At the same time, the relative positions of the first mounting compartment 110 and the second mounting compartment 120 can be optimized according to the overall molding process and mold parting surface of the housing 100 to reduce manufacturing difficulty and cost.

[0056] See Figure 2 , Figure 4 and Figure 6 As shown, according to some embodiments of the present invention, the filter further includes: a first PCB board 500, which is electrically connected to the busbar assembly 200, and a third mounting compartment 130 is provided on the housing 100. The third mounting compartment 130 is located on a first side of the housing 100 along the length direction and above the first mounting compartment 110 along the height direction. The first PCB board 500 is disposed in the third mounting compartment 130.

[0057] By placing the first PCB board 500 on the first side of the housing 100 along its length and above the first mounting compartment 110 along its height, the remaining space of the housing 100 in the height direction can be fully utilized, preventing the first PCB board 500 from encroaching on the dimensions in the length or width direction. This allows for the achievement of the filtering function while maintaining the miniaturization of the overall filter profile. Furthermore, placing the first PCB board 500 above the first mounting compartment 110 allows the filtering module and the nanocrystalline magnetic core 300 to form a stacked layout in the height direction, further improving the space utilization of the housing 100 and preventing a significant increase in filter volume.

[0058] In some embodiments, the cross-sectional shape of the third mounting compartment 130 can be designed to mimic the outline of the first PCB board 500, and multiple support columns or slots can be provided inside the compartment for fixing the first PCB board 500.

[0059] See Figure 2 , Figure 4 , Figure 6 and Figure 10 As shown, according to some embodiments of the present invention, a plurality of surface-mount capacitors 510 are provided on the side of the first PCB board 500 facing the hatch of the third mounting compartment 130, and at least one pair of Y capacitors 520 are provided on the side of the first PCB board 500 away from the hatch of the third mounting compartment 130.

[0060] By setting the surface-mount capacitor 510 on the side of the first PCB board 500 facing the third mounting compartment 130 and the Y capacitor 520 on the side of the first PCB board 500 away from the third mounting compartment 130, various types of capacitor components, such as high-frequency surface-mount capacitor 510 and mid-frequency X / Y capacitor 520, can be integrated simultaneously within the limited space of the first PCB board 500 to form a capacitor array covering a wide frequency range. This effectively broadens the filter bandwidth, improves the interference suppression balance across the low, mid, and high frequency bands, and avoids the failure of the vehicle's electromagnetic compatibility test due to insufficient filtering in a certain frequency band. This meets the increasingly stringent requirements of electromagnetic compatibility (EMC) regulations and testing standards, and significantly reduces the cost and verification cycle of vehicle EMC rectification.

[0061] It should be noted that, compared with traditional film capacitors, the surface mount capacitor 510 has the advantages of smaller size, lighter weight, and lower high-frequency equivalent series resistance (ESR) and equivalent series inductance (ESL). It can provide a lower impedance path in the high-frequency range (several megahertz to hundreds of megahertz), thereby significantly improving the filter's ability to suppress high-frequency interference. At the same time, the surface mount capacitor 510 can be directly soldered onto the first PCB board 500 through surface mount technology without additional brackets or pins, which improves assembly efficiency and reduces the impact of parasitic parameters on filtering performance. Furthermore, its miniaturization allows for the arrangement of more capacitors on the first PCB board 500 of the same area, making it easy to flexibly configure capacitance combinations according to the filtering requirements of different frequency bands, thereby optimizing the filtering characteristics across the entire frequency band.

[0062] See Figure 6 and Figure 10 As shown, in a specific embodiment, the first PCB board 500 has eight surface-mount capacitors 510 on the side facing the hatch of the third mounting compartment 130, with capacitances of 680pF, 680pF, 680pF, 2.2nF, 2.2nF, 1nF, 1nF, and 4.7nF respectively. Two Y capacitors 520 are located on the side of the first PCB board 500 away from the hatch of the third mounting compartment 130, each with a capacitance of 100nF.

[0063] See Figure 2 and Figure 6 As shown, according to some embodiments of the present invention, the filter further includes: a second PCB board 900 and a high-voltage sampling component 910. The second PCB board 900 is electrically connected to the busbar assembly 200. The housing 100 is also provided with a fourth mounting compartment 1100. The third mounting compartment 130 has a recess on one side along the width direction of the housing 100, and the fourth mounting compartment 1100 is located in the recess. The high-voltage sampling component 910 is located on the second PCB board 900 and is electrically connected to the busbar assembly 200 through the second PCB board 900. The high-voltage sampling component 910 is located on the hatch side of the fourth mounting compartment.

[0064] By placing the second PCB board 900 within the fourth mounting compartment 1100 formed by the recess on one side of the housing 100 in the width direction, and placing the high-voltage sampling component 910 on the second PCB board 900 and located on the hatch side of the fourth mounting compartment 1100, the high-voltage sampling function can be independently integrated without interfering with the layout of the first PCB board 500. This enables intelligent monitoring and fault warning of the bus voltage. The recessed space on the side of the housing 100 avoids increasing the length or height of the filter. At the same time, the high-voltage sampling component 910 is located on the hatch side, which facilitates signal connection with external connectors or vehicle controllers, shortens the sampling path, and reduces electromagnetic interference with the power circuit. The electrical connection between the second PCB board 900 and the busbar assembly 200 allows for the acquisition of the bus voltage near the input side, providing accurate signals for pre-charge determination, insulation detection, and motor control feedback. This further improves the high-voltage sampling accuracy and system integration flexibility while maintaining the overall miniaturization of the filter.

[0065] It should be noted that the high-voltage sampling component 910 is used to perform voltage division or isolation sampling on the high-voltage bus voltage of the busbar assembly 200, and transmit the sampled signal to the processing circuit on the second PCB board 900 or directly output it to the vehicle controller to support the status determination of the pre-charging circuit, the insulation monitoring of the high-voltage system, and the voltage closed-loop feedback of the motor controller. At the same time, when abnormal voltage fluctuations are detected, the high-voltage sampling component 910 can work with the short-circuit protection device of the filter to achieve rapid fault isolation, thereby completing the triple functions of filtering, sampling and protection in a single integrated unit, further improving the safety and intelligence level of the vehicle's high-voltage system.

[0066] See Figure 5 As shown, according to some embodiments of the present invention, the filter further includes: a current sampling element 600, which is electrically connected to the busbar assembly 200, and a fifth mounting compartment 140 is provided on the housing 100, with the current sampling element 600 located inside the fifth mounting compartment 140.

[0067] By setting the current sampling element 600 to be electrically connected to the busbar assembly 200 and independently arranged in the fifth mounting compartment 140 of the housing 100, the bus current can be accurately measured without interfering with the magnetic circuits of the nanocrystalline magnetic core 300 and the ferrite magnetic core 400. This measurement is used to monitor the real-time operating current, determine the pre-charge completion status, and identify overcurrent faults.

[0068] The fifth mounting compartment 140 can be designed to mimic the shape and installation method of the current sampling component 600, ensuring accurate relative positioning and reliable connection between the sampling component and the busbar assembly 200. Furthermore, by separating the current sampling component 600 from the high-voltage sampling component 910 on the second PCB board 900, signal crosstalk can be reduced, sampling accuracy and system reliability can be improved, thereby adding a critical current monitoring function to the filter without increasing the overall size.

[0069] In some embodiments, a fifth mounting compartment 140 can be formed by utilizing the hollowed-out area of ​​the housing 100 for heat dissipation of the busbar assembly 200, and the current sampling element 600 can be placed in the hollowed-out area. The current sampling function can be integrated using the space of the original heat dissipation structure without increasing the volume of the housing 100 or opening a new mounting compartment.

[0070] See Figure 2 , Figure 5 and Figure 6 As shown, according to some embodiments of the present invention, the filter further includes: an X capacitor 700, which is electrically connected to the busbar assembly 200, and a sixth mounting compartment 150 is provided on the housing 100. The sixth mounting compartment 150 is located below the second mounting compartment 120 in the height direction, and the X capacitor 700 is disposed in the sixth mounting compartment 150.

[0071] By placing the X capacitor 700 within the sixth mounting compartment 150 on the housing 100, with the sixth mounting compartment 150 located below the second mounting compartment 120 along the height direction, the longitudinal space below the ferrite core 400 can be fully utilized. This allows for the addition of differential-mode filtering components without increasing the filter's length or width, effectively suppressing differential-mode interference. Simultaneously, the X capacitor 700 and the ferrite core 400 are arranged in a layered manner along the height direction, creating a compact stack of differential-mode and common-mode filtering functions in space. This shortens the connection path between the X capacitor 700 and the busbar assembly 200, reducing parasitic inductance in the circuit, and avoids layout conflicts with the upper ferrite core 400. Thus, the filter achieves full-band common-mode and differential-mode suppression capabilities within a limited volume.

[0072] Similarly, the X capacitor 700 allows the filter to add an independent differential-mode filtering stage to the existing multi-stage common-mode filter composed of nanocrystalline magnetic core 300 and ferrite magnetic core 400. This facilitates flexible configuration of the X capacitor 700 capacitance value combination according to the filtering requirements of different frequency bands. For example, a larger capacitance value X capacitor 700 can be selected for low-frequency differential-mode interference, a smaller capacitance value X capacitor 700 can be selected for mid-frequency differential-mode interference, or multiple X capacitors 700 with different capacitance values ​​can be used in parallel. This enables frequency band subdivision and targeted suppression in the differential-mode domain, optimizes the filtering characteristics of the entire frequency band, avoids repeated rectification of the vehicle's electromagnetic compatibility test due to excessive differential-mode interference, and further improves the filter's adaptability to stringent EMC standards.

[0073] In one specific embodiment, the capacitance of the X capacitor 700 is 1μF.

[0074] See Figure 2 , Figure 5 , Figure 6 and Figure 8 As shown, according to some embodiments of the present invention, the filter further includes: a safety device 800, and a seventh mounting compartment 160 is provided on the housing 100. The seventh mounting compartment 160 and the second mounting compartment 120 are arranged adjacent to each other on the same side of the housing 100 along the length direction. The safety device 800 is electrically connected to the conductive bus assembly 200.

[0075] By placing the fuse device 800 within the seventh mounting compartment 160 on the housing 100, and arranging the seventh mounting compartment 160 adjacent to the second mounting compartment 120 on the same side along the length of the housing 100, high-voltage short-circuit protection can be integrated inside the filter. This allows the filtering unit and protection unit to be compactly arranged on the same side of the housing 100, shortening the electrical connection path between the fuse device 800 and the busbar assembly 200, reducing connection resistance and heat generation, and avoiding the need for additional installation space in the vehicle due to external protection devices. Simultaneously, the fuse device 800 and the ferrite core 400 are arranged side-by-side along the length, allowing for positioning and heat dissipation using the same side wall of the housing 100. When an overcurrent or short-circuit fault is detected, the fuse device 800 can quickly melt or trigger, rapidly isolating the fault point from the output side of the filter. This achieves integrated filtering, monitoring, and protection while improving the safety of the vehicle's high-voltage system.

[0076] Similarly, the shape of the seventh installation compartment 160 can be designed to mimic the outline of the safety device 800, and the compartment can be provided with a recessed groove for accommodating the main body of the safety device 800 and a limiting slot for positioning the pins of the safety device 800.

[0077] In one specific embodiment, the first conductive bus 210 is divided into two sections, both of which are electrically connected to the pins of the fuse device 800. When an overcurrent or short-circuit fault is detected, the fuse device 800 can melt in a very short time (e.g., within milliseconds), quickly cutting off the high-voltage positive circuit from the output side of the filter.

[0078] See Figure 1 As shown, according to some embodiments of the present invention, at least one end of the clamping member 180 along the width direction is snapped together with the housing 100, and a buffer pad 190 is provided between the clamping member 180 and the first iron core section 410.

[0079] By snapping the clamping member 180 to at least one end of the housing 100 along its width, the clamping member 180 can be quickly installed and removed at the hatch of the second mounting compartment 120. Stable clamping force can be applied to the ferrite core 400 without the need for screws or adhesives, thereby simplifying the assembly process and facilitating later maintenance. At the same time, a buffer pad 190 is provided between the clamping member 180 and the first iron core section 410. On the one hand, it can absorb mechanical shock energy in the vehicle vibration environment and prevent the U-shaped first iron core section 410 and the I-shaped second iron core section 420 from relative displacement or impact due to vibration. On the other hand, the elastic pre-tightening force of the buffer pad 190 can compensate for the thermal expansion and contraction of the material due to temperature changes, so that the ferrite core 400 always maintains a stable magnetic circuit contact state. Thus, while simplifying the fixing structure, it improves the vibration resistance reliability and environmental adaptability of the filter.

[0080] It should be noted that when one end of the clamping member 180 is snapped into the housing 100 along its width, the other end can be configured to be hinged to the housing 100, allowing the clamping member 180 to be flipped open around the hinged end as a rotation axis. This eliminates the need to remove the entire clamping member 180 during the installation or disassembly maintenance of the ferrite core 400. When both ends of the clamping member 180 are snapped into the housing 100 along its width, the clamping member 180 forms an independently detachable cover structure. The symmetrical snap-fit ​​connection at both ends applies a uniform clamping force to the first core segment 410.

[0081] A specific example of the filter provided by this invention will be described below. See [link to documentation]. Figures 1 to 10 As shown.

[0082] In this example, the filter includes: a housing 100, a busbar assembly 200, a nanocrystalline magnetic core 300, a ferrite magnetic core 400, a first PCB board 500, a second PCB board 900, a high-voltage sampling component 910, a current sampling component 600, an X capacitor 700, and a fuse device 800. The housing 100 is an integrally injection-molded plastic structure. A first mounting compartment 110 is provided at the first end along the length direction, and a second mounting compartment 120 is provided at the second end along the length direction. The nanocrystalline magnetic core 300 is fixed in the first mounting compartment 110 by adhesive fastening with a sealing cap 170. The ferrite magnetic core 400, formed by the mating of a U-shaped first iron core segment 410 and an I-shaped second iron core segment 420, is pressed and fixed in the second mounting compartment 120 by a clamping member 180. A buffer pad 190 is provided between the clamping member 180 and the first iron core segment 410. The busbar assembly 200 includes an HV+ copper busbar, an HV- copper busbar, and a Boost (boost side) copper busbar. The input sides of the three busbars are all connected to the nanocrystalline magnetic core 300, and the output sides are all connected to the ferrite magnetic core 400. The three busbars are bent in a specific way within the housing to accommodate the height difference between the two mounting compartments. The HV+ copper busbar is divided into two sections on the output side and connected in series with the safety device 800. A third mounting compartment 130 is provided on the first side of the housing 100 along the length direction and above the first mounting compartment 110. A first PCB board 500 is fixed inside the third mounting compartment 130. Eight surface-mount capacitors 510 (with capacities of 680pF, 680pF, 680pF, 2.2nF, 2.2nF, 1nF, 1nF and 4.7nF respectively) are mounted on the side of the first PCB board 500 facing the hatch. Two Y capacitors 520, each with a capacity of 100nF, are mounted on the side of the first PCB board 500 facing away from the hatch. The housing 100 is also provided with a fourth mounting compartment 1100, a fifth mounting compartment 140, a sixth mounting compartment 150, and a seventh mounting compartment 160. The third mounting compartment 130 has a recess on one side along the width direction of the housing 100. The fourth mounting compartment 1100 is located in the recess. The second PCB board 900 is located in the fourth mounting compartment 1100. The high-voltage sampling component 910 is located on the second PCB board 900 and is electrically connected to the busbar assembly 200 through the second PCB board 900. The high-voltage sampling component 910 is located on one side of the hatch of the fourth mounting compartment. The fifth mounting compartment 140 is formed by utilizing the original heat dissipation hollow area of ​​the housing and a current sampling component 600 is fixed inside. The sixth mounting compartment 150 is located directly below the second mounting compartment 120 and a 1μF X capacitor 700 is fixed inside. The seventh mounting compartment 160 is arranged adjacent to the second mounting compartment 120 on the same side along the length direction and a safety device 800 is fixed inside. The safety device 800 is connected in series between the two sections of the HV+ copper busbar.All the above-mentioned installation compartments are designed to mimic the shape of the corresponding components, and the components are quickly positioned and fixed through buckles, support columns or limiting grooves. No potting, secondary injection molding or laser welding is required. The overall volume is significantly reduced compared with traditional solutions, and it can achieve integrated integration, multi-level filtering, intelligent monitoring and short circuit protection in vehicle high-voltage systems.

[0083] The filters in the examples above have been tested and found to have the following advantages.

[0084] First, in terms of miniaturization and weight reduction, by integrating the nanocrystalline magnetic core 300, ferrite magnetic core 400, first PCB board 500, high-voltage sampling component 910, current sampling component 600, X capacitor 700 and fuse device 800 into multiple mounting compartments of the integrated housing 100, and by using surface mount capacitor 510 to replace traditional film capacitors and eliminating potting and secondary injection molding structures, the overall volume is reduced by 10% to 30% and the weight is reduced by 10% to 20%, which can adapt to the increasingly miniaturized integrated cavity of high-voltage systems.

[0085] Secondly, in terms of assembly process and production efficiency, the nanocrystalline magnetic core 300 is fixed by dispensing and fastening, the ferrite magnetic core 400 adopts a UI-type split structure and is fixed by fastening component 180, and the conductive bus assembly 200 can be installed and assembled without interruption welding. The overall assembly process is shortened by more than 40% compared with the traditional solution, the first-time assembly qualification rate of the product is significantly improved, and complex processes such as secondary injection molding, repeated potting and interruption laser welding are eliminated, the manufacturing cost and rework loss are significantly reduced, and it is suitable for the needs of large-scale mass production.

[0086] Third, in terms of filtering performance and EMC compliance, a two-stage frequency band filtering topology is formed by using nanocrystalline magnetic core 300 (initial permeability 60,000-80,000) and ferrite magnetic core 400 (initial permeability 3,000-5,000). Combined with eight surface-mount capacitors 510 (capacitance values ​​ranging from 680pF to 4.7nF), two Y capacitors 520 (each 100nF), and an independently set X capacitor 700 (1μF) on the first PCB board 500, common-mode and differential-mode interference suppression capabilities covering the low, medium, and high frequency bands are formed. The filtering bandwidth is significantly widened, and the filtering balance across the entire frequency band is improved, which can meet the stringent EMC requirements of Class 4 and Class 5, reducing the risk of failure in vehicle EMC testing and the cost of rectification.

[0087] Fourth, in terms of intelligence and system safety, by integrating the high-voltage sampling component 910 on the second PCB board 900 and the independent current sampling component 600, real-time acquisition of bus voltage and current can be achieved, supporting pre-charge judgment, insulation detection and motor control feedback; the fuse device 800 is connected in series in the HV+ copper busbar, which can quickly blow in the event of overcurrent or short circuit faults, realizing rapid isolation of the fault point; the integration of the above-mentioned intelligent monitoring and protection functions upgrades the filter from a passive device to an intelligent sensing component, improving the safety and maintainability of the vehicle's high-voltage system.

[0088] Fifth, in terms of adaptability to the vehicle environment, the housing 100 is made of high-strength lightweight plastic-coated material, combined with the buffer pad 190, snap-fit ​​connection and other structural designs, and meets the requirements of vehicle environment such as IP67 protection level, high strength vibration resistance and high and low temperature cycling from -40℃ to 125℃. It can be widely used in new energy vehicle electric drive systems, high voltage power distribution units and vehicle high voltage fast charging scenarios.

[0089] Finally, it should be noted that the above embodiments are only for illustrating the present invention and not for limiting the present invention. Although the present invention has been described in detail with reference to the embodiments, those skilled in the art should understand that various combinations, modifications, or equivalent substitutions of the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and should be covered within the scope of the claims of the present invention.

Claims

1. A filter, characterized in that, include: The housing is an integral structure, and the housing is provided with a first installation compartment and a second installation compartment; Conductor bus assembly; The nanocrystalline magnetic core, with the input side of the conductive bus assembly passing through the nanocrystalline magnetic core; A ferrite core, wherein the output side of the conductive bus assembly passes through the ferrite core; The nanocrystalline magnetic core is located in the first mounting compartment. The hatch of the first mounting compartment is detachably equipped with a sealing cover. The ferrite magnetic core includes a U-shaped first core segment and an I-shaped second core segment. The first core segment and the second core segment are connected to form a closed magnetic circuit and are both located in the second mounting compartment. The hatch of the second mounting compartment is detachably equipped with a clamping component.

2. The filter according to claim 1, characterized in that, The first mounting compartment is located on the first side of the housing along the length direction, the second mounting compartment is located on the second side of the housing along the length direction, and the input side of the conductive bus assembly is located on the first side of the housing along the length direction, and the output side of the conductive bus assembly is located on the second side of the housing along the length direction.

3. The filter according to claim 1, characterized in that, Also includes: The first PCB board is electrically connected to the conductive busbar assembly. The housing is also provided with a third mounting compartment. The third mounting compartment is located on the first side of the housing along the length direction and above the first mounting compartment along the height direction. The first PCB board is disposed in the third mounting compartment.

4. The filter according to claim 3, characterized in that, The first PCB board has multiple surface-mount capacitors on the hatch side facing the third mounting compartment, and at least one pair of Y capacitors on the hatch side facing away from the third mounting compartment.

5. The filter according to claim 3, characterized in that, Also includes: The second PCB board is electrically connected to the conductive busbar assembly. The housing is also provided with a fourth mounting compartment. The third mounting compartment has a recessed portion on one side along the width direction of the housing, and the fourth mounting compartment is located in the recessed portion. A high-voltage sampling device is disposed on the second PCB board and electrically connected to the conductive busbar assembly through the second PCB board. The high-voltage sampling device is located on the hatch side of the fourth installation compartment.

6. The filter according to claim 1, characterized in that, Also includes: A current sampling device is electrically connected to the conductive bus assembly. The housing is also provided with a fifth mounting compartment, in which the current sampling device is located.

7. The filter according to any one of claims 1 to 6, characterized in that, Also includes: An X-capacitor is electrically connected to the conductive busbar assembly. The housing is also provided with a sixth mounting compartment, which is located below the second mounting compartment along the height direction. The X-capacitor is disposed in the sixth mounting compartment.

8. The filter according to any one of claims 1 to 6, characterized in that, Also includes: The safety device includes a seventh mounting compartment on the housing, which is located on the same side of the housing along the length of the housing and is adjacent to the second mounting compartment. The safety device is electrically connected to the conductive busbar assembly.

9. The filter according to any one of claims 1 to 6, characterized in that, At least one end of the fastening member along the width direction is snapped into the housing, and a buffer pad is provided between the fastening member and the first iron core segment.

10. The filter according to any one of claims 1 to 6, characterized in that, The busbar assembly includes a first busbar, a second busbar, and a third busbar. The input sides of the first busbar, the second busbar, and the third busbar are all inserted through the nanocrystalline magnetic core, and the output sides of the first busbar, the second busbar, and the third busbar are all inserted through the ferrite magnetic core.

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