Intelligent measuring switch with adaptive heat dissipation structure

Abstract

The application relates to the technical field of intelligent measurement switches, and discloses an intelligent measurement switch with a self-adaptive heat dissipation structure, which comprises a bottom shell, two phase-change energy storage heat dissipation components and multiple heat conduction components, the inside of the bottom shell is provided with a mounting plate, the mounting plate divides the inside space of the bottom shell into chamber one and chamber two, two heat conduction partitions are arranged in the chamber two, and the two heat conduction partitions divide the chamber two into a mounting cavity and a heat dissipation cavity; the phase-change energy storage heat dissipation component comprises multiple film bags, the film bags are filled with composite phase-change materials; the heat conduction component comprises a spring, a driving plate, a heat conduction rod, a heat conduction touch plate one, a heat conduction touch plate two and a heat conduction plate, the spring is connected with the heat conduction touch plate one, the heat conduction rod is connected with the mounting plate and the heat conduction touch plate one at the same time, the heat conduction plate is arranged on the inner wall of the bottom shell, the heat conduction touch plate two is arranged on the heat conduction plate, and the driving plate is used for driving the heat conduction touch plate one to contact with the heat conduction touch plate two. The application can form multiple heat dissipation paths, and the heat dissipation performance and stability of the measurement switch are improved.

Description

Technical Field

[0001] This invention relates to the field of intelligent measurement switch technology, and more specifically, to an intelligent measurement switch with an adaptive heat dissipation structure. Background Technology

[0002] With the development of IoT technology, smart measurement switches have been widely used in industrial control, smart homes, power systems, and other fields. These switches typically integrate multiple functional modules such as measurement, control, and communication. Their internal electronic components generate a significant amount of heat during operation. If this heat cannot be dissipated effectively and promptly, it can lead to overheating of the electronic components, affecting the switch's performance, reliability, and lifespan, and even causing safety accidents.

[0003] In related technologies, existing intelligent measurement switches are typically installed inside electrical cabinets. In summer, when temperatures are high, or in some high-temperature environments, fans installed at the bottom of the electrical cabinet are usually used to force-cool the interior of the cabinet, thereby expelling heat from the inside of the cabinet to the top. However, the airflow generated by the fan can usually only remove heat from the outer surface of the intelligent measurement switch, and it is difficult to quickly remove the internal heat of the intelligent measurement switch, resulting in slow heat dissipation. To address this, we propose an intelligent measurement switch with an adaptive heat dissipation structure. Summary of the Invention

[0004] This invention provides an intelligent measurement switch with an adaptive heat dissipation structure, which solves the technical problem in related technologies that the airflow generated by the fan can usually only remove the heat from the outer surface of the intelligent measurement switch, and it is difficult to quickly remove the internal heat of the intelligent measurement switch, resulting in slow heat dissipation.

[0005] This invention provides an intelligent measurement switch with an adaptive heat dissipation structure, including a bottom shell with a mounting plate parallel to the inner wall of the bottom shell. The mounting plate divides the internal space of the bottom shell into an inner chamber 1 and an outer chamber 2. Two thermally conductive baffles parallel to the side walls of the bottom shell are spaced apart in chamber 2, dividing chamber 2 into a middle mounting cavity and two side heat dissipation cavities. Two phase change energy storage heat dissipation components correspond one-to-one with the two heat dissipation cavities. Each phase change energy storage heat dissipation component is disposed within its corresponding heat dissipation cavity and includes multiple thin film bags filled with composite phase change... The materials include a composite phase change material used to absorb heat from the interior of the heat dissipation cavity; multiple sets of heat-conducting components are arranged inside the first chamber, each including a spring, a drive plate, a heat-conducting rod, a first heat-conducting contact plate, a second heat-conducting contact plate, and a heat-conducting plate. The spring is mounted on the mounting plate, with its free end connected to the first heat-conducting contact plate. The two ends of the heat-conducting rod are connected to the mounting plate and the first heat-conducting contact plate, respectively. The heat-conducting plate is mounted on the inner wall of the bottom shell, and the second heat-conducting contact plate is mounted on the heat-conducting plate. The drive plate is used to drive the first heat-conducting contact plate to contact the second heat-conducting contact plate when the temperature rises; and an outer shell connected to the bottom shell to form a closed shell.

[0006] As a further improvement of the present invention, the thermally conductive partition is provided with a plurality of heat dissipation holes.

[0007] As a further improvement of the present invention, the phase change energy storage heat dissipation component further includes multiple boxes, each of which corresponds to a multiple film bag. The film bag is disposed in the corresponding box, and each of the multiple boxes is fixedly connected to the heat-conducting partition. The side of each box facing the heat-conducting partition is open.

[0008] As a further improvement of the present invention, a heat insulation pad is provided inside the chamber.

[0009] As a further improvement of the present invention, the heat-conducting component further includes a mounting cylinder, which is fixedly connected to the mounting plate. The spring portion is disposed inside the mounting cylinder, and the other portion extends to the outside of the mounting cylinder. The outer diameter of the spring is less than or equal to the inner diameter of the mounting cylinder.

[0010] As a further improvement of the present invention, the intelligent measuring switch further includes multiple protective shells, each of which corresponds to a multiple heat-conducting components. The two ends of each protective shell are respectively connected to the inner walls of the mounting plate and the bottom shell to seal the interior of the protective shell. The heat-conducting components are disposed inside the corresponding protective shells to isolate the heat-conducting components from the heat insulation pad in the chamber.

[0011] As a further improvement of the present invention, the initial state of the drive plate is a bent state, and one end of the drive plate is fixedly connected to the mounting plate, and the other end is fixedly connected to the heat-conducting contact plate; the drive plate includes an iron-nickel-chromium alloy plate and an Invar alloy plate, and the iron-nickel-chromium alloy plate is disposed on the side of the Invar alloy plate close to the mounting plate.

[0012] As a further improvement of the invention, a plurality of the heat-conducting plates are connected together and extend to the sidewall edge of the bottom shell to contact the outside air.

[0013] As a further improvement of the present invention, the bottom and top sides of the bottom shell are symmetrically provided with multiple air inlets and one air outlet respectively; the intelligent measuring switch also includes two fan-assisted cooling components, both of which are disposed in the mounting cavity and are respectively disposed close to the two heat-conducting baffles. The fan-assisted cooling components include multiple micro fans, multiple air supply pipes and a connecting box. The connecting box is disposed in the inner top of the bottom shell and communicates with the corresponding air outlet. The multiple air supply pipes are fixedly connected to the corresponding heat-conducting baffles, and the tops of the multiple air supply pipes are all connected to the interior of the connecting box. The multiple micro fans correspond one-to-one with the multiple air supply pipes and the multiple air inlets. The micro fans are disposed at the bottom of the bottom shell and located between the bottom of the corresponding air inlet and the bottom of the air supply pipe. Filter plate one and filter plate two are fixedly connected to the air inlet and the air outlet respectively to reduce impurities entering the air supply pipe.

[0014] As a further improvement of the present invention, an air inlet is provided at the bottom of the air supply pipe along its axial direction.

[0015] The beneficial effects of this invention are as follows: 1. This invention utilizes a phase change energy storage and heat dissipation component, taking advantage of the heat absorption characteristics of composite phase change materials during phase change, to absorb the heat entering the heat dissipation cavity through the heat dissipation holes in the mounting cavity, thereby reducing the overall temperature inside the measuring switch. At the same time, the drive plate in the heat conduction component can automatically drive the first heat conduction contact plate to contact the second heat conduction contact plate according to temperature changes, forming an additional heat conduction path, realizing adaptive heat dissipation when the temperature rises, without the need for external control, and improving the reliability of heat dissipation.

[0016] 2. By setting a fan-assisted cooling component inside the mounting cavity, the present invention can actively dissipate heat from the mounting cavity. The fan-assisted cooling component, together with the phase change energy storage heat dissipation component and the heat conduction component, can form multiple heat dissipation paths, thereby better dissipating heat from the inside of the measurement switch and improving the overall heat dissipation performance and stability of the measurement switch.

[0017] 3. In this invention, the mounting plate divides the internal space of the bottom shell into chamber one and chamber two. The two heat-conducting baffles in chamber two can further divide chamber two into a mounting cavity and a heat dissipation cavity, making the arrangement of the phase change energy storage heat dissipation component, electronic components and heat conduction components more reasonable and making full use of the internal space. Attached Figure Description

[0018] Figure 1 This is a three-dimensional structural schematic diagram of the present invention; Figure 2 This is a three-dimensional structural schematic diagram of the first front cross-section of the present invention; Figure 3 yes Figure 2 Enlarged view of point A in the middle; Figure 4 This is a schematic diagram of the first front cross-sectional structure of the present invention; Figure 5 This is a schematic diagram of the second front view cross-sectional structure of the present invention; Figure 6 This is a three-dimensional structural schematic diagram of the first side view sectional view of the present invention; Figure 7 This is a schematic diagram of the second side cross-sectional structure of the present invention; Figure 8 yes Figure 7 Enlarged view of point B in the middle; Figure 9 This is a three-dimensional structural schematic diagram of the first top-view cross-section of the present invention; Figure 10 This is a schematic diagram of the second top cross-section of the present invention; Figure 11 yes Figure 10 Enlarged view of point C in the middle.

[0019] In the diagram: 1. Bottom shell; 11. Mounting plate; 12. Chamber 1; 13. Chamber 2; 131. Mounting cavity; 132. Heat dissipation cavity; 14. Thermal conductive baffle; 141. Heat dissipation hole; 15. Air inlet; 16. Air outlet; 2. Phase change energy storage heat dissipation component; 21. Membrane bag; 22. Box body; 3. Thermal conductive component; 31. Spring; 32. Drive plate; 321. Iron-nickel-chromium alloy plate; 322. Invar alloy plate; 33. Thermal conductive rod; 34. Thermal conductive contact plate 1; 35. Thermal conductive contact plate 2; 36. Thermal conductive plate; 37. Mounting cylinder; 4. Outer shell; 5. Protective shell; 6. Fan auxiliary cooling component; 61. Miniature fan; 62. Air supply pipe; 621. Air inlet; 63. Connecting box; 7. Filter plate 1; 8. Filter plate 2. Detailed Implementation

[0020] The subject matter described herein will now be discussed with reference to exemplary embodiments. It should be understood that these embodiments are discussed only to enable those skilled in the art to better understand and implement the subject matter described herein, and changes may be made to the function and arrangement of the elements discussed without departing from the scope of this specification. Various processes or components may be omitted, substituted, or added as needed in the examples. Furthermore, features described in some examples may be combined in other examples.

[0021] like Figures 1-11 As shown, an intelligent measurement switch with an adaptive heat dissipation structure includes a base shell 1, two phase change energy storage heat dissipation components 2, multiple sets of heat conduction components 3, and an outer shell 4. The base shell 1 primarily serves to support and provide installation space, offering mounting positions for electronic components. The outer shell 4 is bolted to the base shell 1 to form a closed enclosure, protecting the internal electronic components from external environmental influences. The two phase change energy storage heat dissipation components 2 are mainly used to absorb and store heat inside the measurement switch. The heat conduction components 3 are mainly used to dissipate heat from inside the measurement switch to the outside.

[0022] Specifically, such as Figure 2 and Figure 6 The bottom shell 1 is fixedly connected to a mounting plate 11 parallel to its inner wall. The mounting plate 11 divides the internal space of the bottom shell 1 into an internal chamber 12 and an external chamber 13 communicating with the outer shell 4. The mounting plate 11 is used to mount electronic components, and both chambers 12 and 13 provide mounting space. Inside chamber 13, two heat-conducting baffles 14 parallel to the side walls of the bottom shell 1 are fixedly connected at intervals. These two heat-conducting baffles 14 further divide chamber 13 into a central mounting cavity 131 and two side heat dissipation cavities 132, with the electronic components housed within the mounting cavity 131.

[0023] During use, the heat-conducting baffle 14 can conduct heat from the mounting cavity 131 to the heat dissipation cavity 132, facilitating subsequent heat dissipation. The heat-conducting baffle 14 can be made of copper-aluminum alloy, or other suitable materials.

[0024] In addition, such as Figures 4-6 As shown, the two phase change energy storage heat dissipation components 2 correspond one-to-one with the two heat dissipation cavities 132, and the two phase change energy storage heat dissipation components 2 are respectively installed in the corresponding heat dissipation cavities 132.

[0025] Each phase change energy storage and heat dissipation component 2 includes multiple thin film bags 21, each filled with a composite phase change material. The composite phase change material can be a paraffin-based phase change heat storage material, and its specific phase change temperature can be set according to actual operating conditions. The thin film bags 21 can be made of aluminum-plastic film, which provides excellent sealing for the composite phase change material and facilitates the transfer of external heat to the composite phase change material inside the thin film bags 21.

[0026] During operation, when the load suddenly increases or there is a short-term overload, and the temperature inside the heat dissipation cavity 132 reaches the phase change point of the composite phase change material, the composite phase change material begins to absorb a large amount of heat and melts from a solid to a liquid state, while maintaining a relatively constant temperature throughout this process. This slows down the rapid rise in temperature inside the measuring switch. When the load decreases or the heat dissipation measures take effect and the internal temperature drops, the composite phase change material begins to slowly solidify, releasing the stored heat into the environment to prepare for the next heat absorption. Phase change energy storage and heat dissipation methods have advantages such as large heat capacity, small temperature fluctuations, and no need for additional energy consumption.

[0027] In addition, such as Figure 7 , Figure 8 and Figure 10 As shown, multiple sets of heat-conducting components 3 are disposed within chamber 12, and a heat-insulating pad is also disposed within chamber 12. The heat-insulating pad can be made of high-temperature resistant plastic material, or other suitable materials can be used.

[0028] It should be noted that, under normal conditions, the heat generated by the internal electronic components of the measuring switch is limited. If chamber 12 and mounting cavity 131 are directly thermally conductive, the base shell 1 may remain at a temperature significantly higher than the ambient temperature for an extended period, increasing heat accumulation within the electrical cabinet and thus raising the risk of affecting other electrical components. Furthermore, heat conduction is a potential-driven process. If chamber 12 is already preheated to a high temperature under normal conditions, the temperature difference between the base shell 1 and the environment will decrease when the measuring switch experiences heavy overheating, weakening the heat dissipation efficiency of the heat-conducting component 3 at high temperatures. Moreover, for the internal composite phase change material, normal-condition thermal insulation helps it remain in a solid state for a longer period, reducing the likelihood of premature phase change failure due to continuous small heat leaks.

[0029] Each heat-conducting assembly 3 includes a spring 31, a drive plate 32, a heat-conducting rod 33, a first heat-conducting contact plate 34, a second heat-conducting contact plate 35, and a heat-conducting plate 36. The spring 31 is fixedly connected to the mounting plate 11, and the free end of the spring 31, i.e., the end of the spring 31 furthest from the mounting plate 11, is fixedly connected to the first heat-conducting contact plate 34. The heat-conducting rod 33 can be a flexible heat pipe or a solid flexible tube made of braided copper wire, or other suitable materials can be used. This facilitates the movement of the heat-conducting rod 33, and both ends of the heat-conducting rod 33 are fixedly connected to the mounting plate 11 and the first heat-conducting contact plate 34, respectively. It should be noted that one end of the heat-conducting rod 33 can pass through the mounting plate 11 and be positioned close to the electronic components, allowing the heat-conducting rod 33 to better conduct the heat generated by the electronic components to the first heat-conducting contact plate 34.

[0030] The heat-conducting plate 36 is fixedly connected to the inner wall of the bottom shell 1, and the second heat-conducting contact plate 35 is fixedly connected to the heat-conducting plate 36. The driving plate 32 is used to drive the first heat-conducting contact plate 34 to contact the second heat-conducting contact plate 35 when the temperature rises. That is to say, in the initial state, there is a gap between the first heat-conducting contact plate 34 and the second heat-conducting contact plate 35, which can reduce the loss of heat in the mounting cavity 131 under normal conditions.

[0031] Specifically, the initial state of the drive plate 32 is a bent state, and one end of the drive plate 32 is fixedly connected to the mounting plate 11, and the other end is fixedly connected to the heat-conducting contact plate 34. The drive plate 32 includes an iron-nickel-chromium alloy plate 321 and an Invar alloy plate 322, with the iron-nickel-chromium alloy plate 321 fixedly connected to the side of the Invar alloy plate 322 closest to the mounting plate 11. The iron-nickel-chromium alloy plate 321 and the Invar alloy plate 322 have different coefficients of thermal expansion, and the coefficient of thermal expansion of the iron-nickel-chromium alloy plate 321 is much greater than that of the Invar alloy plate 322. When the temperature rises, the two expand at different degrees, resulting in bending deformation of the drive plate 32.

[0032] During use, when the temperature inside the mounting cavity 131 rises, the drive plate 32 senses the heat through the mounting plate 11 and begins to bend and deform. Since the coefficient of thermal expansion of the iron-nickel-chromium alloy plate 321 is greater than that of the Invar alloy plate 322, and the iron-nickel-chromium alloy plate 321 is fixedly connected to the side of the Invar alloy plate 322 closest to the mounting plate 11, the drive plate 32 bends away from the mounting plate 11. This causes the first heat-conducting contact plate 34 and the second heat-conducting contact plate 35 to come into contact. The heat-conducting rod 33 then conducts the heat from the mounting cavity 131 to the second heat-conducting contact plate 35 via the first heat-conducting contact plate 34. The heat from the second heat-conducting contact plate 35 is then transferred to the inner wall of the bottom shell 1 via the heat-conducting plate 36, thus dissipating the heat into the air. At this time, the spring 31 is in a stretched state. When the temperature drops, the spring 31, under the action of the restoring force, assists the drive plate 32 in returning to its original position, thereby separating the first heat-conducting contact plate 34 and the second heat-conducting contact plate 35. Both the first thermal contact plate 34 and the second thermal contact plate 35 can be made of copper, or other suitable thermal conductive materials.

[0033] This design enables adaptive heat dissipation when the temperature rises, eliminating the need for external power supply control and improving the reliability of heat dissipation.

[0034] In addition, such as Figure 2 As shown, the thermally conductive partition 14 has multiple heat dissipation holes 141. These heat dissipation holes 141 can promote air circulation between the mounting cavity 131 and the heat dissipation cavity 132, so that the heat generated by the electronic components in the mounting cavity 131 can be better transferred to the heat dissipation cavity 132, and can be absorbed by the phase change energy storage heat dissipation component 2.

[0035] In addition, such as Figures 4-6 As shown, the phase change energy storage heat dissipation assembly 2 also includes multiple housings 22, each corresponding to a different film bag 21. The film bags 21 are placed inside their respective housings 22. All housings 22 are fixedly connected to the heat-conducting partition 14, with an opening on the side facing the partition 14. This allows for a more uniform distribution of the film bags 21 and provides both positioning and protection for the film bags 21. Furthermore, the fixed connection between the housings 22 and the heat-conducting partition 14, and the opening on the side facing the partition 14, facilitates heat transfer from the mounting cavity 131 through the heat dissipation holes 141 on the partition 14 to the interior of the housing 22, where it is absorbed by the composite phase change material inside the film bags 21. The open design of the housings 22 also makes it easier to install and replace the film bags 21.

[0036] Furthermore, such as Figure 8As shown, the heat-conducting assembly 3 also includes a mounting cylinder 37. The mounting cylinder 37 is fixedly connected to the mounting plate 11, with part of the spring 31 disposed inside the mounting cylinder 37 and the other part extending outside the mounting cylinder 37. In this way, the mounting cylinder 37 can be used to support and limit the spring 31, thereby making the setting of the spring 31 more stable.

[0037] The outer diameter of the spring 31 is less than or equal to the inner diameter of the mounting sleeve 37. This facilitates the installation of the spring 31 inside the mounting sleeve 37.

[0038] Furthermore, such as Figure 8 As shown, the intelligent measuring switch also includes multiple protective housings 5. Each protective housing 5 corresponds one-to-one with a multiple heat-conducting component 3. The two ends of each protective housing 5 are fixedly connected to the inner walls of the mounting plate 11 and the bottom housing 1, respectively, to seal the interior of the protective housing 5. The heat-conducting component 3 is disposed inside the corresponding protective housing 5 to isolate the heat-conducting component 3 from the heat insulation pad inside the chamber 12. This design prevents the heat insulation pad from affecting the normal operation of the heat-conducting component 3, while also ensuring that the heat conduction path of the heat-conducting component 3 is not obstructed by the heat insulation pad.

[0039] As an optional embodiment, such as Figure 10 As shown, multiple heat-conducting plates 36 are connected, and the multiple heat-conducting plates 36 extend to the side wall edge of the bottom shell 1 to contact the outside air. It should be noted that when the measuring switch is installed, the inner wall of its bottom shell 1 is usually fitted to the electrical board of the electrical cabinet. Therefore, extending the heat-conducting plates 36 to the side wall edge of the bottom shell 1 to contact the outside air is more conducive to dissipating the heat on the heat-conducting plates 36 into the air.

[0040] In addition, such as Figure 5 and Figure 11 As shown, multiple air inlets 15 and one air outlet 16 are symmetrically provided on both sides of the bottom and top of the bottom shell 1, respectively, providing channels for air circulation. Both the air inlets 15 and the air outlets 16 are connected to the mounting cavity 131, which facilitates heat dissipation within the mounting cavity 131.

[0041] like Figures 2-5 and Figure 11 As shown, the intelligent measurement switch also includes two fan-assisted cooling components 6 for auxiliary heat dissipation. Both fan-assisted cooling components 6 are disposed within the mounting cavity 131 and are positioned close to the two heat-conducting baffles 14. This allows the fan-assisted cooling components 6 to directly dissipate heat from the mounting cavity 131.

[0042] Each fan-assisted cooling assembly 6 includes multiple miniature fans 61, multiple air ducts 62, and a connecting box 63. The connecting box 63 is fixedly connected to the inner top of the bottom shell 1 and communicates with the corresponding air outlet 16 for collecting and discharging hot air. The multiple air ducts 62 are fixedly connected to the corresponding heat-conducting baffles 14, and the tops of the multiple air ducts 62 communicate with the interior of the connecting box 63, forming an upward channel for hot air. The multiple miniature fans 61 correspond one-to-one with the multiple air ducts 62 and the multiple air inlets 15. The miniature fans 61 are fixedly connected to the bottom of the bottom shell 1 and are located between the bottom of the corresponding air inlet 15 and the bottom of the air duct 62. It should be noted that there is a gap between the bottom of the miniature fan 61 and the air duct 62 to facilitate the entry of hot air into the air duct 62. The miniature fans 61 can be miniature low-power fans, and their specific size can be set according to the size of the measuring switch. Of course, other suitable fans can also be selected.

[0043] It should be noted that in this embodiment, the number of miniature fans 61 can be four, or of course, other suitable numbers.

[0044] During use, when the temperature inside the mounting cavity 131 rises, the miniature fan 61 is activated. External cool air is drawn in through the air inlet 15 and, propelled by the miniature fan 61, flows upwards along the air supply duct 62, thus carrying away the heat generated by the electronic components inside the mounting cavity 131. The hot air then enters the connecting box 63 and is exhausted through the air outlet 16. This forced convection cooling method improves heat dissipation efficiency.

[0045] Furthermore, such as Figure 3 As shown, an air inlet 621 is provided at the bottom of the air supply duct 62 along its axial direction. The air inlet 621 can increase the air intake area of ​​the air supply duct 62, allowing more hot air in the mounting cavity 131 to enter the air supply duct 62 and be discharged.

[0046] In addition, such as Figure 1 and Figure 11 As shown, filter plate 7 and filter plate 8 are fixedly connected to the air inlet 15 and air outlet 16 respectively, to reduce impurities entering the air supply duct 62.

[0047] It should be noted that the measuring switch may also include a controller and a temperature sensor. The temperature sensor can be fixedly connected inside the mounting cavity 131, and the controller can be fixedly connected inside the electrical cabinet or on the mounting plate 11. The controller is electrically connected to both the temperature sensor and multiple miniature fans 61. The controller can receive signals sent by the temperature sensor, analyze and process them, and then control the multiple miniature fans 61 to perform corresponding actions.

[0048] The embodiments of this example have been described above. However, this example is not limited to the specific implementation methods described above. The specific implementation methods described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms based on the guidance of this example, and all of them are within the protection scope of this example.

Claims

1. An intelligent measurement switch with an adaptive heat dissipation structure, characterized in that, include: The bottom shell (1) has an installation plate (11) parallel to the inner wall of the bottom shell (1) inside. The installation plate (11) divides the internal space of the bottom shell (1) into an inner chamber one (12) and an outer chamber two (13). Two heat-conducting baffles (14) parallel to the side wall of the bottom shell (1) are arranged at intervals in the chamber two (13). The two heat-conducting baffles (14) divide the chamber two (13) into a middle installation cavity (131) and two heat dissipation cavities (132) on both sides. Two phase change energy storage heat dissipation components (2) are corresponding one-to-one with two heat dissipation cavities (132). The phase change energy storage heat dissipation components (2) are set in the corresponding heat dissipation cavities (132). They include multiple thin film bags (21). The thin film bags (21) are filled with composite phase change materials. The composite phase change materials are used to absorb the heat inside the heat dissipation cavities (132). Multiple sets of heat-conducting components (3) are arranged in the first chamber (12). The heat-conducting components (3) include a spring (31), a drive plate (32), a heat-conducting rod (33), a heat-conducting contact plate one (34), a heat-conducting contact plate two (35), and a heat-conducting plate (36). The spring (31) is arranged on the mounting plate (11), and its free end is connected to the heat-conducting contact plate one (34). The two ends of the heat-conducting rod (33) are respectively connected to the mounting plate (11) and the heat-conducting contact plate one (34). The heat-conducting plate (36) is arranged on the inner wall of the bottom shell (1). The heat-conducting contact plate two (35) is arranged on the heat-conducting plate (36). The drive plate (32) is used to drive the heat-conducting contact plate one (34) to contact the heat-conducting contact plate two (35) when the temperature rises. The outer shell (4) is connected to the bottom shell (1) to form a closed shell.

2. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 1, characterized in that, The heat-conducting partition (14) has multiple heat dissipation holes (141).

3. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 2, characterized in that, The phase change energy storage heat dissipation component (2) also includes multiple boxes (22), each of which corresponds to a multiple film bag (21). The film bag (21) is placed inside the corresponding box (22). All of the multiple boxes (22) are fixedly connected to the heat-conducting partition (14), and the side of the box (22) facing the heat-conducting partition (14) is open.

4. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 1, characterized in that, A heat insulation pad is provided inside the first chamber (12).

5. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 1, characterized in that, The heat-conducting component (3) also includes a mounting cylinder (37), which is fixedly connected to the mounting plate (11). The spring (31) is partially disposed inside the mounting cylinder (37) and extends to the outside of the mounting cylinder (37). The outer diameter of the spring (31) is less than or equal to the inner diameter of the mounting cylinder (37).

6. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 5, characterized in that, The intelligent measuring switch also includes multiple protective shells (5), each of which corresponds to a multiple heat-conducting components (3). The two ends of each protective shell (5) are connected to the inner walls of the mounting plate (11) and the bottom shell (1) respectively to seal the interior of the protective shell (5). The heat-conducting components (3) are disposed inside the corresponding protective shell (5) to isolate the heat-conducting components (3) from the heat insulation pad in the first chamber (12).

7. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 1, characterized in that, The initial state of the drive plate (32) is a bent state, and one end of the drive plate (32) is fixedly connected to the mounting plate (11), and the other end is fixedly connected to the heat-conducting contact plate (34). The drive plate (32) includes an iron-nickel-chromium alloy plate (321) and an invar alloy plate (322), wherein the iron-nickel-chromium alloy plate (321) is disposed on the side of the invar alloy plate (322) near the mounting plate (11).

8. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 1, characterized in that, Multiple heat-conducting plates (36) are connected together and extend to the sidewall edge of the bottom shell (1) to contact the outside air.

9. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 1, characterized in that, The bottom shell (1) has multiple air inlets (15) and an air outlet (16) symmetrically opened on both sides of the bottom and the top. The intelligent measuring switch also includes two fan-assisted cooling components (6), both of which are disposed within the mounting cavity (131) and are respectively positioned close to the two heat-conducting baffles (14). Each fan-assisted cooling component (6) includes multiple miniature fans (61), multiple air supply pipes (62), and a connecting box (63). The connecting box (63) is disposed at the inner top of the bottom shell (1) and communicates with the corresponding air outlet (16). The multiple air supply pipes (62) are fixedly connected to the corresponding heat-conducting baffles (14). The top of each of the multiple air supply pipes (62) is connected to the interior of the connecting box (63). Each of the multiple miniature fans (61) corresponds to each of the multiple air supply pipes (62) and the multiple air inlets (15). The miniature fans (61) are located at the bottom of the bottom shell (1) and between the bottom of the corresponding air inlet (15) and the bottom of the air supply pipe (62). Filter plates 1 (7) and 2 (8) are fixedly connected to the air inlet (15) and the air outlet (16) respectively to reduce impurities from entering the air supply pipe (62).

10. The intelligent measurement switch with an adaptive heat dissipation structure according to claim 9, characterized in that, The bottom of the air supply pipe (62) is provided with an air inlet (621) along its axial direction.

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