Radio frequency introduction mechanism, carrier boat support device, and semiconductor processing equipment

Abstract

The application discloses a radio frequency introduction mechanism, a carrier boat supporting device and a semiconductor process equipment, and belongs to the technical field of semiconductor processing. The semiconductor process equipment comprises a wafer carrier boat with a first boat leg, a second boat leg and a third boat leg, the first boat leg and the second boat leg are arranged front and back, and the first boat leg and the third boat leg are arranged left and right. The radio frequency introduction mechanism comprises a first electrode assembly, a second electrode assembly and a third electrode assembly with adjustable polarity of at least one of the three. When the wafer carrier boat is introduced front and back, the first electrode assembly is electrically connected with the first boat leg, the second electrode assembly is electrically connected with the second boat leg, and the polarity of the first electrode assembly and the second electrode assembly is opposite. When the wafer carrier boat is introduced left and right, the first electrode assembly is electrically connected with the first boat leg, the third electrode assembly is electrically connected with the third boat leg, and the polarity of the first electrode assembly and the third electrode assembly is opposite. The radio frequency introduction mechanism in the scheme is suitable for introducing wafer carrier boats of different types of boat legs.

Description

Technical Field

[0001] This application belongs to the field of semiconductor processing technology, specifically relating to a radio frequency introduction mechanism, a carrier boat support device, and semiconductor process equipment. Background Technology

[0002] In semiconductor processing technology, such as in the manufacturing of crystalline silicon solar cells, surface passivation and antireflection processes can increase light absorption and reduce carrier recombination, thereby improving the photoelectric conversion efficiency of solar cells. Currently, the industry commonly uses semiconductor processing equipment, such as PECVD (Plasma Enhanced Chemical Vapor Deposition) equipment, to prepare SiNx passivation and antireflection films. This PECVD equipment places a silicon wafer between a wafer carrier boat composed of positive and negative electrodes, introduces a reactive gas, and uses an RF introduction mechanism to increase the RF voltage between the two electrodes to generate glow discharge plasma, ultimately producing a SiNx thin film on the silicon wafer surface.

[0003] In existing technologies, either left-right or front-back wafer carriers are generally used as silicon wafer carriers in the process. Left-right wafer carriers refer to carriers with left and right feet for polarity feeding, while front-back wafer carriers refer to carriers with front and back feet for polarity feeding. However, existing semiconductor process equipment's RF introduction mechanisms are either only suitable for left-right or front-back wafer carriers, and cannot be used simultaneously for both types of wafer carriers. Therefore, when different wafer carriers are used, the RF introduction mechanism of the semiconductor process equipment needs to be changed accordingly. This leads to more complex operation, longer process time, and reduced process efficiency.

[0004] Therefore, existing RF introduction mechanisms have the drawback of being unable to adapt to different boat-feed configurations of the wafer carrier boat. Summary of the Invention

[0005] The purpose of this application is to provide an RF introduction mechanism, a carrier boat support device, and semiconductor process equipment, which can solve the problem that RF introduction mechanisms in related technologies cannot be applied to wafer carrier boats with different boat foot feed forms.

[0006] In a first aspect, embodiments of this application provide a radio frequency (RF) introduction mechanism applied to semiconductor process equipment. The semiconductor process equipment includes a wafer carrier boat with at least three feet, including a first foot, a second foot, and a third foot. The first foot and the second foot are spaced apart in a front-to-back direction, and the first foot and the third foot are spaced apart in a left-to-right direction. The RF introduction mechanism includes at least three electrode components, including a first electrode component, a second electrode component, and a third electrode component. The polarity of at least one of the first electrode component, the second electrode component, and the third electrode component is adjustable. When the wafer carrier boat is a carrier boat introduced from the front and back, the first electrode assembly is used to be electrically connected to the first boat foot, the second electrode assembly is used to be electrically connected to the second boat foot, and the polarity of the first electrode assembly is opposite to that of the second electrode assembly. When the wafer carrier boat is a carrier boat introduced from the left and right, the first electrode assembly is used to be electrically connected to the first carrier foot, and the third electrode assembly is used to be electrically connected to the third carrier foot, wherein the polarity of the first electrode assembly is opposite to that of the third electrode assembly.

[0007] Secondly, embodiments of this application also provide a carrier boat support device, including at least two support rods and the aforementioned radio frequency introduction mechanism. The support rods are used to support the wafer carrier boat. The at least two support rods include a first support rod and a second support rod. The first electrode assembly and the second electrode assembly of the radio frequency introduction mechanism are both disposed on the first support rod, and the third electrode assembly of the radio frequency introduction mechanism is disposed on the second support rod.

[0008] Thirdly, embodiments of this application also provide a semiconductor process apparatus, including a reaction chamber and the aforementioned support boat device, wherein the support boat device is disposed within the reaction chamber.

[0009] In this embodiment, the first and second feet of the wafer carrier boat are spaced apart in the front-to-back direction, and the first and third feet are spaced apart in the left-to-right direction. The radio frequency (RF) introduction mechanism includes at least three electrode components, namely a first electrode component, a second electrode component, and a third electrode component. By electrically connecting the first electrode component to the first foot and the second electrode component to the second foot, and making the polarity of the first electrode component opposite to that of the second electrode component, power can be introduced to the carrier boat in the front and back directions. This allows the RF introduction mechanism to adapt to the form in which the wafer carrier boat is powered through the front and rear feet. By electrically connecting the first electrode component to the first foot and the third electrode component to the third foot, and making the polarity of the first electrode component opposite to that of the third electrode component, power can be introduced to the carrier boat in the left and right directions. This allows the RF introduction mechanism to adapt to the form in which the wafer carrier boat is powered through the left and right feet.

[0010] With this configuration, users can set the polarity of the first electrode assembly, the second electrode assembly, and the third electrode assembly as needed, so that the radio frequency introduction mechanism can adapt to different types of chip carrier boats with different boat feet. Attached Figure Description

[0011] Figure 1 This is a perspective view of the support device for the carrying boat disclosed in the embodiments of this application; Figure 2 This is a perspective view of the radio frequency introduction mechanism disclosed in the embodiments of this application; Figure 3 This is a partial perspective view of the semiconductor process equipment disclosed in the embodiments of this application; Figure 4 yes Figure 3 Enlarged view of section A; Figure 5 yes Figure 3 Enlarged view of section B; Figure 6 This is one of the partial cross-sectional views of the introduced components disclosed in the embodiments of this application; Figure 7 This is a second partial cross-sectional view of the introduced component disclosed in the embodiments of this application; Figure 8 This is one of the perspective views of the semiconductor process equipment disclosed in the embodiments of this application (hidden chamber body); Figure 9 yes Figure 8 Enlarged view of section C; Figure 10 yes Figure 8 Enlarged view of section D; Figure 11 This is a second perspective view of the semiconductor process equipment disclosed in the embodiments of this application (hidden chamber body); Figure 12This is the third perspective view of the semiconductor process equipment disclosed in the embodiments of this application (hidden chamber body); Figure 13 yes Figure 12 Enlarged view of section E in the middle; Figure 14 This is one of the positional relationship diagrams of the electrode ring and the boat foot disclosed in the embodiments of this application; Figure 15 This is the second diagram showing the positional relationship between the electrode ring and the boat foot as disclosed in the embodiments of this application; Figure 16 This is a cross-sectional view of the electrode ring sleeve disclosed in the embodiments of this application; Figure 17 This is one of the perspective views of the front and rear introduction of the carrier boat disclosed in the embodiments of this application; Figure 18 This is the second perspective view of the front and rear introduction of the carrier boat disclosed in the embodiments of this application; Figure 19 This is one of the perspective views of the left and right introduced support boats disclosed in the embodiments of this application; Figure 20 This is the second perspective view of the left and right introduced support boat disclosed in the embodiments of this application; Figure 21 This is a schematic diagram of the structure of the first polar boat plate disclosed in the embodiments of this application; Figure 22 This is a schematic diagram of the structure of the second polar boat plate disclosed in the embodiments of this application; Figure 23 This is a schematic diagram of the structure of the first connecting boat piece disclosed in the embodiments of this application; Figure 24 This is a schematic diagram of the structure of the second connecting boat piece disclosed in the embodiments of this application; Figure 25 This is a schematic diagram of the structure of the first boat piece disclosed in the embodiments of this application; Figure 26 This is a schematic diagram of the structure of the second boat sheet disclosed in the embodiments of this application.

[0012] Explanation of reference numerals in the attached figures: 100 - Reaction chamber; 110 - First flange; 120 - Second flange; 130 - Tailgate panel; 140 - Support base; 200 - Support rod; 201 - First support rod; 202 - Second support rod; 210 - Rod body; 220 - First support sleeve; 230 - Second support sleeve; 240 - Insulating support component; 250 - First insulating sleeve; 260 - Second insulating sleeve; 300 - Electrode assembly; 310 - Electrode ring sleeve; 311 - Plane; 312 - Connecting part; 313 - Arc-shaped part; 314 - Protrusion; 3141 - Second flat plate part; 3142 - Third plate section; 315 - Guide section; 316 - First plate section; 320 - Introduction component; 321 - Electrode rod; 322 - First insulating inner sleeve; 323 - Second insulating inner sleeve; 324 - Insulating outer sleeve; 325 - Cable introduction; 326 - Plug introduction; 301 - First electrode assembly; 302 - Second electrode assembly; 303 - Third electrode assembly; 304 - Fourth electrode assembly; 400 - Flange electrode; 410 - First flange electrode; 420 - Second flange electrode; 430 - Third flange electrode; 440 - Fourth flange electrode; 500 - First fixing member; 510 - Retaining ring; 520 - Limiting part; 600 - Second fastener; 610 - First through hole; 620 - Second through hole; 700 - Third fastener; 800 - Fourth fixing component; 900 - Insertion electrode assembly; 910 - Positive electrode rod; 920 - Negative electrode rod; 1000 - Chip carrier boat; 1010 - Boat foot; 1011 - Boat foot plane; 1012 - Support foot; 1013 - First foot; 1014 - Second foot; 1015 - Third foot; 1016 - Fourth foot; 1017 - First polarity boat piece; 1018 - Second polarity boat piece; 10171 - First power terminal; 10181 - Second power terminal; 1019 - Graphite block; 1020 - First connecting boat; 10201 - First lower power terminal; 10202 - First upper power terminal; 10203 - Second lower power terminal; 1021-Second connecting piece; 10211-Second upper electrical terminal; 10212-Third lower electrical terminal; 10213 - Third upper power terminal; 1022 - First boat piece; 10221 - Fourth lower power terminal; 10222 - Fourth upper power terminal; 1023 - Second boat piece; 10231 - Fifth upper power terminal; 10232 - Fifth lower electrical terminal; 1024 - Third boat piece; 1025 - Fourth boat piece; 1001 - Front support boat; 1002 - Stern-mounted boat. Detailed Implementation

[0013] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0014] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0015] The radio frequency introduction mechanism, carrier boat support device, and semiconductor process equipment provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0016] refer to Figures 1-26 This application provides an embodiment of a radio frequency introduction mechanism, which is applied to semiconductor process equipment.

[0017] Semiconductor process equipment includes a wafer carrier boat 1000, which may have at least three feet 1010, including a first foot 1013, a second foot 1014, and a third foot 1015, as shown below. Figure 18 and Figure 20 As shown, the first boat foot 1013 and the second boat foot 1014 can be arranged at intervals along the front-to-back direction, and the first boat foot 1013 and the third boat foot 1015 can be arranged at intervals along the left-to-right direction.

[0018] The radio frequency introduction mechanism may include at least three electrode assemblies 300, which may include a first electrode assembly 301, a second electrode assembly 302 and a third electrode assembly 303, and the polarity of at least one of the first electrode assembly 301, the second electrode assembly 302 and the third electrode assembly 303 is adjustable.

[0019] In the case where the wafer carrier 1000 is a front-and-rear introduction carrier, the first electrode assembly 301 can be electrically connected to the first carrier pin 1013, and the second electrode assembly 302 can be electrically connected to the second carrier pin 1014, with the polarity of the first electrode assembly 301 being opposite to that of the second electrode assembly 302. This allows the radio frequency introduction mechanism to adapt to the form where the wafer carrier 1000 is powered via the front and rear carrier pins. Here, the polarity of the first electrode assembly 301 can be positive, and the polarity of the second electrode assembly 302 can be negative.

[0020] When the wafer carrier 1000 is a left-right introduction carrier, the first electrode assembly 301 can be electrically connected to the first carrier pin 1013, and the third electrode assembly 303 can be electrically connected to the third carrier pin 1015. The polarities of the first electrode assembly 301 and the third electrode assembly 303 are opposite. This allows the radio frequency introduction mechanism to adapt to the form where the wafer carrier 1000 is powered via the left and right carrier pins. Here, the polarity of the first electrode assembly 301 can be positive, and the polarity of the third electrode assembly 303 can be negative.

[0021] In this embodiment, the user can set the polarity of the first electrode assembly 301, the second electrode assembly 302, and the third electrode assembly 303 as needed, so that the radio frequency introduction mechanism can adapt to the wafer carrier boat 1000 with different types of boat introduction, thereby improving the versatility of the radio frequency introduction mechanism. When using different wafer carrier boats 1000, there is no need to replace the radio frequency introduction mechanism, which is beneficial to improving process efficiency.

[0022] In an optional embodiment of this application, when the wafer carrier boat 1000 is a front-to-back introduction carrier boat, the third electrode assembly 303 can be used to electrically connect with the third boat pin 1015. When the third boat pin 1015 is electrically connected to the first boat pin 1013, the polarity of the third electrode assembly 303 can be the same as the polarity of the first electrode assembly 301. Alternatively, when the third boat pin 1015 is electrically connected to the second boat pin 1014, the polarity of the third electrode assembly 303 can be the same as the polarity of the second electrode assembly 302. With this configuration, since the wafer carrier boat 1000 is also electrically connected to the third electrode assembly 303 through the third boat pin 1015, the contact area between the RF introduction mechanism and the wafer carrier boat 1000 can be effectively increased, thereby reducing the current density per unit area. This can prevent negative problems such as electrode burn-through, arcing, and dust caused by abnormal electrode contact due to high current, which affect the process, and effectively extend the service life of the RF introduction mechanism.

[0023] When the wafer carrier boat 1000 is introduced into the left and right carrier boats, the second electrode assembly 302 can be used to electrically connect with the second carrier foot 1014. When the second carrier foot 1014 and the third carrier foot 1015 are electrically connected, the polarity of the second electrode assembly 302 can be the same as the polarity of the third electrode assembly 303. Alternatively, when the second carrier foot 1014 and the first carrier foot 1013 are electrically connected, the polarity of the second electrode assembly 302 can be the same as the polarity of the first electrode assembly 301.

[0024] With this configuration, since the wafer carrier boat 1000 is also electrically connected to the second electrode assembly 302 via the second boat foot 1014, the contact area between the radio frequency introduction mechanism and the wafer carrier boat 1000 can be effectively increased, and the current density per unit area can be reduced. This can prevent negative issues affecting the process, such as electrode burn-through, arcing, and dust caused by abnormal electrode contact due to high current, and effectively extend the service life of the radio frequency introduction mechanism.

[0025] In other embodiments, when the wafer carrier boat 1000 is a carrier boat introduced from the front and back, the third electrode assembly 303 may not be electrically connected to the third boat foot 1015. Here, the third boat foot 1015 may only be used as a support foot.

[0026] When the wafer carrier boat 1000 is introduced into the left and right carrier boats, the second electrode assembly 302 may not be electrically connected to the second boat foot 1014. Here, the second boat foot 1014 can be used only as a support foot.

[0027] Optionally, each electrode assembly 300 can be independent of each other without the need for connecting plates. This can prevent debris from the reaction chamber 100 from falling onto the connecting plates, which could cause abnormal discharge and process abnormalities, and also eliminate the need for frequent cleaning of debris from the deposits, which would lead to extended operating time.

[0028] In an optional embodiment, the wafer carrier boat 1000 may also have a fourth boat foot 1016, which may be spaced apart from the second boat foot 1014 in the left-right direction, and the fourth boat foot 1016 and the third boat foot 1015 may be spaced apart in the front-back direction. The at least three electrode assemblies 300 mentioned above may also include a fourth electrode assembly 304, which may be used to electrically connect with the fourth boat foot 1016.

[0029] In the case where the wafer carrier boat 1000 is a carrier boat introduced from the front and back, and when the fourth boat pin 1016 and the second boat pin 1014 are electrically connected, the polarity of the fourth electrode assembly 304 can be the same as the polarity of the second electrode assembly 302, or when the fourth boat pin 1016 and the first boat pin 1013 are electrically connected, the polarity of the fourth electrode assembly 304 is the same as the polarity of the first electrode assembly 301.

[0030] When the wafer carrier boat 1000 is introduced into the left and right carrier boats, and when the fourth carrier pin 1016 and the first carrier pin 1013 are electrically connected, the polarity of the fourth electrode assembly 304 can be the same as the polarity of the first electrode assembly 301, or when the fourth carrier pin 1016 and the third carrier pin 1015 are electrically connected, the polarity of the fourth electrode assembly 304 can be the same as the polarity of the third electrode assembly 303.

[0031] With this configuration, since the wafer carrier boat 1000 is also electrically connected to the fourth electrode assembly 304 via the fourth boat foot 1016, the contact area between the radio frequency introduction mechanism and the wafer carrier boat 1000 can be further increased, thereby further reducing the current density per unit area and further preventing negative issues affecting the process, such as electrode burn-through, arcing, and dust caused by abnormal electrode contact due to high current.

[0032] In other embodiments, the radio frequency introduction mechanism may also exclude the fourth electrode assembly 304.

[0033] It should be noted that the front and rear introduced carrier boats refer to the wafer carrier boats 1000 with the positive and negative terminals respectively located at the front and rear ends, such as... Figure 17 and Figure 18 As shown, the front and rear introduced support boat may include multiple first polarity boat pieces 1017 and multiple second polarity boat pieces 1018, with each first polarity boat piece 1017 and each second polarity boat piece 1018 alternately spaced along the width direction of the wafer support boat 1000, such as... Figure 21 As shown, the first end of the first polarized boat plate 1017 is provided with a first electrical terminal 10171, as follows: Figure 22As shown, the second end of the second polarized boat 1018 is provided with a second electrical terminal 10181. The first boat foot 1013 and the third boat foot 1015 are respectively electrically connected to the first electrical terminals 10171 of the plurality of first polarized boat feet 1017 through graphite blocks 1019, so that the first boat foot 1013 and the third boat foot 1015 are electrically conductive. The second boat foot 1014 and the fourth boat foot 1016 are respectively electrically connected to the second electrical terminals 10181 of the plurality of second polarized boat feet 1018 through graphite blocks 1019, so that the second boat foot 1014 and the fourth boat foot 1016 are electrically conductive. Here, by connecting electrode assemblies 300 of different polarities to the first boat foot 1013 and the second boat foot 1014, adjacent first polarity boat pieces 1017 and second polarity boat pieces 1018 can be formed as positive and negative electrode plates, respectively. An electric field can be generated between the positive and negative electrode plates to ionize the reactive gas, thereby enabling the processing of the silicon wafer between the positive and negative electrode plates. Of course, in other embodiments, the second boat foot 1014 can also be electrically connected to the third boat foot 1015, and the fourth boat foot 1016 can also be electrically connected to the first boat foot 1013.

[0034] Left and right introduction carrier boats refer to wafer carrier boats with positive and negative terminals respectively located at the left and right ends, such as... Figure 19 and Figure 20 As shown, the left and right connecting boats may include a first connecting boat piece 1020, a second connecting boat piece 1021, a first boat piece 1022, a second boat piece 1023, a third boat piece 1024, and a fourth boat piece 1025, as follows: Figure 23 As shown, the first end of the first connecting boat piece 1020 is provided with a first lower electrical terminal 10201, and the second end of the first connecting boat piece 1020 is provided with a first upper electrical terminal 10202 and a second lower electrical terminal 10203, as follows. Figure 24 As shown, the first end of the second connecting boat piece 1021 is provided with a second upper power terminal 10211 and a third lower power terminal 10212, and the second end of the second connecting boat piece 1021 is provided with a third upper power terminal 10213, as shown. Figure 25 As shown, the first end of the first boat piece 1022 is provided with a fourth lower power terminal 10221, and the second end of the first boat piece 1022 is provided with a fourth upper power terminal 10222, as shown. Figure 26As shown, the first end of the second boat piece 1023 is provided with a fifth upper power terminal 10231, the second end of the second boat piece 1023 is provided with a fifth lower power terminal 10232, the first end of the third boat piece 1024 is provided with a sixth upper power terminal, the second end of the third boat piece 1024 is provided with a sixth lower power terminal, the first end of the fourth boat piece 1025 is provided with a seventh lower power terminal, and the second end of the fourth boat piece 1025 is provided with a seventh upper power terminal. The first connecting boat piece 1020 and the second connecting boat piece 1021 are located in the middle of the left and right guide boats. The first connecting boat piece 1020 and the second connecting boat piece 1021 are spaced apart. An insulating element is provided between the first lower electrical terminal 10201 of the first connecting boat piece 1020 and the third lower electrical terminal 10212 of the second connecting boat piece 1021. An insulating element is also provided between the first upper electrical terminal 10202 of the first connecting boat piece 1020 and the third upper electrical terminal 10213 of the second connecting boat piece 1021 to prevent the first connecting boat piece 1020 from being connected to the second connecting boat piece 1021. Electrical conduction is formed between 020 and the second connecting boat 1021; a plurality of first boats 1022 and a plurality of second boats 1023 are provided on the left side of the first connecting boat 1020, and each first boat 1022 and each second boat 1023 is alternately spaced along the width direction of the wafer carrier boat 1000; a plurality of third boats 1024 and a plurality of fourth boats 1025 are provided on the right side of the second connecting boat 1021, and each third boat 1024 and each fourth boat 1025 is alternately spaced along the width direction of the wafer carrier boat 1000.

[0035] Specifically, the first boat foot 1013 is electrically connected to the first lower electrical terminal 10201 of the first connecting boat piece 1020 via the graphite block 1019 and the fourth lower electrical terminal 10221 of the multiple first boat pieces 1022. The first upper electrical terminal 10202 of the first connecting boat piece 1020 is electrically connected to the sixth upper electrical terminal of the third boat piece 1024 via the graphite block 1019. The fourth boat foot 1016 is electrically connected to the second lower electrical terminal 10203 of the first connecting boat piece 1020 via the graphite block 1019 and the sixth lower electrical terminal of the multiple third boat pieces 1024. The first upper electrical terminal 10202 of the first connecting boat piece 1020 is electrically connected to the fourth upper electrical terminal 10222 of the multiple first boat pieces 1022 via the graphite block 1019. This arrangement allows the first boat foot 1013 and the fourth boat foot 1016 to be electrically connected.

[0036] The third boat foot 1015 is electrically connected to the third lower electrical terminal 10212 of the second connecting boat piece 1021 via the graphite block 1019 and the seventh lower electrical terminal of multiple fourth boat pieces 1025. The second upper electrical terminal 10211 of the second connecting boat piece 1021 is electrically connected to the fifth upper electrical terminal 10231 of the second boat piece 1023 via the graphite block 1019. The second boat foot 1014 is electrically connected to the fifth lower electrical terminal 10232 of multiple second boat pieces 1023 via the graphite block 1019. The third upper electrical terminal 10213 of the second connecting boat piece 1021 is electrically connected to the seventh upper electrical terminal of the fourth boat piece 1025 via the graphite block 1019. This arrangement allows the third boat foot 1015 and the second boat foot 1014 to be electrically connected.

[0037] Here, the structure of the first boat piece 1022 is the same as that of the fourth boat piece 1025, the structure of the second boat piece 1023 is the same as that of the third boat piece 1024, and the first boat piece 1022 can be rotated 180° to form the second boat piece 1023.

[0038] Of course, the first foot 1013 of the left and right support boat can also be electrically connected to the second foot 1014, and the third foot 1015 of the left and right support boat can also be electrically connected to the fourth foot 1016.

[0039] Optionally, the radio frequency introduction mechanism may include only three electrode assemblies 300, namely a first electrode assembly 301, a second electrode assembly 302, and a third electrode assembly 303. The third electrode assembly 303 may be a telescopic structure. When the wafer carrier boat 1000 is a left and right introduction carrier boat, and the wafer carrier boat 1000 is only powered through the first boat foot 1013 and the third boat foot 1015, the first boat foot 1013 and the third boat foot 1015 may both be front boat feet. The first electrode assembly 301 is electrically connected to the first boat foot 1013, and the third electrode assembly 303 may retract to face the third boat foot 1015 for electrical connection. When the first boat foot 1013 and the third boat foot 1015 are both rear boat feet, the second electrode assembly 302 may be electrically connected to the first boat foot 1013, and the third electrode assembly 303 may extend to face the third boat foot 1015 for electrical connection.

[0040] In an optional embodiment of this application, the semiconductor process equipment may further include a support rod 200, which can be used to support the wafer carrier boat 1000. Specifically, the boat feet 1010 of the wafer carrier boat 1000 can be attached to the support rod 200.

[0041] The electrode assembly 300 may include an inlet assembly 320 and an electrode ring 310. The two ends of the inlet assembly 320 can be electrically connected to an RF power supply and the electrode ring 310, respectively. The electrode ring 310 can be fitted over the support rod 200 and may have a flat surface 311. This flat surface 311 is used to mate with the foot 1010 of the wafer carrier boat 1000. Specifically, the flat surface 311 mates with the foot surface 1011 of the foot 1010, which helps to increase the contact area between the electrode ring 310 and the foot 1010 of the wafer carrier boat 1000. Alternatively, the electrode ring 310 may not have a flat surface 311; for example, the outer wall of the electrode ring 310 may be an arc surface, which makes line contact with the foot 1010 of the wafer carrier boat 1000.

[0042] Furthermore, the electrode ring 310 can rotate relative to the support rod 200. Thus, when the electrode ring 310 is connected to the boat foot 1010 of the wafer carrier boat 1000, the electrode ring 310 rotates due to the torque generated by the pressure of the wafer carrier boat 1000 until it fits against the boat foot 1010. This ensures that the electrode ring 310 and the boat foot 1010 of the wafer carrier boat 1000 fit together automatically, which helps to prevent abnormal discharge caused by contact gaps between the two.

[0043] Here, a movable gap is left between the electrode ring 310 and the support rod 200 to ensure that the electrode ring 310 has a certain amount of movement in its circumference, so that the electrode ring 310 can rotate relative to the support rod 200. Furthermore, because of the movable gap between the electrode ring 310 and the support rod 200, the electrode ring 310 can move relative to the support rod 200, thus facilitating the installation and removal of the electrode assembly 300.

[0044] Of course, the electrode ring 310 can also be fixedly connected to the support rod 200.

[0045] In an optional embodiment, the electrode ring 310 may include a connecting portion 312, an arc-shaped portion 313, a protrusion 314, a guide portion 315, and a first flat plate portion 316, and the connecting portion 312, the arc-shaped portion 313, the protrusion 314, the guide portion 315, and the first flat plate portion 316 may be connected end to end to form a ring structure.

[0046] The connecting portion 312 can be connected to the introducing component 320. Specifically, the connecting portion 312 can protrude away from the protrusion 314 to facilitate connection with the introducing component 320. The protrusion 314 may include a second flat plate portion 3141 and a third flat plate portion 3142. One end of the second flat plate portion 3141 is connected to the guide portion 315, one end of the third flat plate portion 3142 is connected to the arc-shaped portion 313, and the other ends of the second flat plate portion 3141 and the third flat plate portion 3142 are connected.

[0047] Here, plane 311 can be the side of the first flat plate 316 facing away from the support rod 200.

[0048] The guide portion 315 can be inclined, and the distance between the guide portion 315 and the connecting portion 312 gradually increases along the direction from the first flat plate portion 316 to the connection point of the arc-shaped portion 313 and the protrusion 314. The guide portion 315 can also be used to fit against the support leg 1012 of the boat foot 1010. In this way, the guide portion 315 can guide the support leg 1012 of the boat foot 1010, facilitating the boat foot 1010 to fall onto the electrode ring sleeve 310. Simultaneously, the support leg 1012 of the boat foot 1010 can apply a force to the electrode ring sleeve 310, causing the electrode ring sleeve 310 to rotate, ensuring that the plane 311 fits against the boat foot 1010. Furthermore, because the guide portion 315 fits against the support leg 1012 of the boat foot 1010, the contact area between the electrode ring sleeve 310 and the boat foot 1010 can be increased, thereby further reducing the current density per unit area.

[0049] Of course, the electrode ring sleeve 310 may not include the guide part 315. The first flat plate part 316 and the protrusion part 314 can be connected by an arc-shaped connecting part, which can fit with the support rod 200.

[0050] In addition, the arc-shaped portion 313 can be used to fit against the support rod 200, thus ensuring that the electrode ring 310 rotates along the support rod 200.

[0051] The protrusion 314 can protrude away from the connecting part 312. In this way, installation space can be reserved for connecting the inlet component 320 or other connecting cables and other components, and the center of gravity of the electrode ring 310 can be adjusted to ensure that the electrode ring 310 can rotate relative to the support rod 200 within a preset angle range.

[0052] Of course, the electrode ring 310 may not include the protrusion 314. Specifically, the electrode ring 310 may be a circular structure.

[0053] In an optional embodiment, the introduction component 320 may include an electrode rod 321, an introduction cable 325, and an introduction plug 326. The first end of the electrode rod 321 can be electrically connected to the electrode ring 310, the first end of the introduction cable 325 can be electrically connected to the second end of the electrode rod 321, and the first end of the introduction plug 326 can be electrically connected to the second end of the introduction cable 325. The second end of the introduction plug 326 can be used for electrical connection to an RF power supply. The introduction cable 325 can be a flexible cable, allowing the introduction component 320 to adapt to the rotation of the electrode ring 310, ensuring good contact between the wafer carrier boat 1000 and the electrode ring 310. This eliminates abnormal RF discharge caused by poor contact, thereby improving process stability, increasing product yield and production capacity, and reducing stress on the electrode assembly 300, thus extending its service life.

[0054] Of course, in other embodiments, the introduced cable 325 can be a rigid structure.

[0055] Optionally, both the second end of the electrode rod 321 and the first end of the connector 326 may be provided with threaded holes, and both ends of the connector cable 325 may be provided with external threads. The two ends of the connector cable 325 can be inserted into the threaded holes of the electrode rod 321 and the connector cable 326 respectively, and connected threadedly to the threaded holes. This improves the stability of the connection between the connector cable 325 and the electrode rod 321 and the connector cable 326, and also facilitates maintenance of the connector assembly 320.

[0056] In addition, the inlet assembly 320 may also include a first insulating inner sleeve 322, a second insulating inner sleeve 323, and an insulating outer sleeve 324. The first insulating inner sleeve 322 may be fitted over a portion of the electrode rod 321 and the inlet cable 325, and the second insulating inner sleeve 323 may be fitted over another portion of the inlet cable 325 and a portion of the inlet plug 326. This ensures the electrical insulation of the inlet assembly 320 structure. The insulating outer sleeve 324 may be fitted over the first insulating inner sleeve 322 and the second insulating inner sleeve 323, and the insulating outer sleeve 324 may cover the gap between the first insulating inner sleeve 322 and the second insulating inner sleeve 323. This ensures that after at least one of the electrode rod 321, the inlet cable 325, the inlet plug 326, the first insulating inner sleeve 322, and the second insulating inner sleeve 323 expands due to heat, the joint between the first insulating inner sleeve 322 and the second insulating inner sleeve 323 will not be exposed, thereby improving the electrical insulation of the inlet assembly 320 and ensuring the integrity of the electrical insulation.

[0057] In other embodiments, the introducing component 320 may also exclude the insulating jacket 324.

[0058] Based on the radio frequency introduction mechanism provided in the embodiments of this application, the embodiments of this application also provide a carrier boat support device. The carrier boat support device may include at least two support rods 200 and the radio frequency introduction mechanism described in any of the above embodiments. The support rods 200 are used to support the wafer carrier boat 1000. The at least two support rods 200 may include a first support rod 201 and a second support rod 202. The first electrode assembly 301 and the second electrode assembly 302 of the radio frequency introduction mechanism may both be disposed on the first support rod 201, and the third electrode assembly 303 of the radio frequency introduction mechanism may be disposed on the second support rod 202.

[0059] The beneficial effects achieved by the carrier boat support device provided in this application embodiment are consistent with the beneficial effects achieved by the radio frequency introduction mechanism provided in this application embodiment, so they will not be repeated here.

[0060] In an optional embodiment of this application, the electrode assembly 300 may include an introduction assembly 320 and an electrode ring 310 electrically connected to the introduction assembly 320. The electrode ring 310 may be sleeved on the support rod 200. The introduction assembly 320 of the first electrode assembly 301 and the introduction assembly 320 of the second electrode assembly 302 may be arranged at circumferential intervals along the first support rod 201. Furthermore, the introduction assembly 320 of the second electrode assembly 302 may be disposed on the side of the first support rod 201 away from the wafer carrier boat 1000. This increases the distance between the introduction component 320 of the second electrode assembly 302 and the wafer carrier boat 1000, thereby increasing the discharge gap and insulation strength between them. This prevents abnormal discharge between the introduction component 320 and the wafer carrier boat 1000 due to excessive proximity. Simultaneously, it also increases the distance between the introduction component 320 of the first electrode assembly 301 and the introduction component 320 of the second electrode assembly 302, preventing interference between them and preventing radio frequency coupling. Here, the introduction component 320 of the first electrode assembly 301 can be disposed on the side of the first support rod 201 near the wafer carrier boat 1000. Specifically, the introduction component 320 of the first electrode assembly 301 can be disposed on the upper side of the first support rod 201, and the introduction component 320 of the second electrode assembly 302 can be disposed on the lower side of the first support rod 201.

[0061] In other embodiments, the introduction component 320 of the second electrode assembly 302 may not be disposed on the side of the first support rod 201 away from the wafer carrier boat 1000. Specifically, the introduction component 320 of the second electrode assembly 302 may be disposed on the side of the first support rod 201 close to the wafer carrier boat 1000.

[0062] Optionally, the electrode ring 310 of the first electrode assembly 301 and the electrode ring 310 of the second electrode assembly 302 can be spaced apart along the axial direction of the first support rod 201. Furthermore, the distance between the electrode ring 310 of the first electrode assembly 301 and the electrode ring 310 of the second electrode assembly 302 can be consistent with the distance between the first foot 1013 and the second foot 1014 of the wafer carrier boat 1000. In this way, it can be ensured that the electrode ring 310 of the first electrode assembly 301 and the electrode ring 310 of the second electrode assembly 302 are electrically connected to the first foot 1013 and the second foot 1014 of the wafer carrier boat 1000, respectively.

[0063] In an optional embodiment, the radio frequency introduction mechanism may further include a fourth electrode assembly 304, which may be disposed on the second support rod 202. The introduction component 320 of the fourth electrode assembly 304 and the introduction component 320 of the third electrode assembly 303 may be disposed at circumferential intervals along the second support rod 202, and the introduction component of the fourth electrode assembly 304 may be disposed on the side of the second support rod 202 away from the wafer carrier boat 1000. This arrangement increases the distance between the introduction component 320 of the fourth electrode assembly 304 and the wafer carrier boat 1000, thereby increasing the discharge gap and insulation strength between them. This prevents abnormal discharge between the introduction component 320 and the wafer carrier boat 1000 due to excessive proximity. Simultaneously, it also increases the distance between the introduction components 320 of the third electrode assembly 303 and the fourth electrode assembly 304, preventing interference between them and preventing radio frequency coupling. Specifically, the introduction component 320 of the third electrode assembly 303 can be positioned on the side of the second support rod 202 closest to the wafer carrier boat 1000, and the introduction component 320 of the fourth electrode assembly 304 can be positioned on the lower side of the second support rod 202.

[0064] In other embodiments, the introduction component 320 of the fourth electrode assembly 304 may not be disposed on the side of the second support rod 202 away from the wafer carrier boat 1000. Specifically, the introduction component 320 of the fourth electrode assembly 304 may be disposed on the side of the second support rod 202 close to the wafer carrier boat 1000.

[0065] In an optional embodiment of this application, the support device for the carrier boat may further include a first fixing member 500 and a third fixing member 700. Both the first fixing member 500 and the third fixing member 700 may include a fixing ring 510 and a limiting portion 520. The limiting portion 520 is connected to the fixing ring 510, and the limiting portion 520 and the fixing ring 510 may be an integral structure. The fixing ring 510 of the first fixing member 500 may be sleeved on the outside of the introduction component 320 of the first electrode assembly 301, and the fixing ring 510 of the third fixing member 700 may be sleeved on the outside of the introduction component 320 of the third electrode assembly 303. The outer walls of both the fixing ring 510 of the first fixing member 500 and the fixing ring 510 of the third fixing member 700 can be used to abut against the cavity wall of the reaction chamber 100. The limiting portions 520 of the first fixing member 500 and the third fixing portion 700 can respectively abut against the first support rod 201 and the second support rod 202. Thus, the initial angle of the electrode ring 310 of the first electrode assembly 301 can be limited by the interaction between the fixing ring 510 and the limiting part 520 of the first fixing member 500 and the cavity wall of the reaction chamber 100 and the first support rod 201, respectively. Similarly, the initial angle of the electrode ring 310 of the third electrode assembly 303 can be limited by the interaction between the fixing ring 510 and the limiting part 520 of the third fixing member 700 and the cavity wall of the reaction chamber 100 and the second support rod 202, respectively. This prevents the initial angle of the electrode rings 310 of the first electrode assembly 301 and the third electrode assembly 303 from changing. If the size is too large, when the first foot 1013 and the third foot 1015 of the wafer carrier boat 1000 press down on the electrode rings 310 of the first electrode assembly 301 and the third electrode assembly 303 respectively, the planes 311 of the electrode rings 310 of the first electrode assembly 301 and the third electrode assembly 303 cannot rotate to a position that is flush with the first foot 1013 and the third foot 1015 respectively. This makes it easier for the electrode rings 310 of the first electrode assembly 301 and the third electrode assembly 303 to be flush with the first foot 1013 and the third foot 1015 of the wafer carrier boat 1000 respectively.

[0066] In other embodiments, the support device for the carrier boat may not include the first fixing member 500 and the third fixing member 700. The introduction component 320 of the first electrode assembly 301 may not be connected to the first support rod 201, and the introduction component 320 of the third electrode assembly 303 may not be connected to the second support rod 202. The first electrode assembly 301 and the third electrode assembly 303 are only connected to the first support rod 201 and the second support rod 202 through the electrode ring sleeve 310, respectively.

[0067] In addition, the support device for the carrier boat may also include a second fixing member 600 and a fourth fixing member 800. Both the second fixing member 600 and the fourth fixing member 800 may be provided with a first through hole 610 and a second through hole 620. The first through hole 610 of the second fixing member 600 may allow the first support rod 201 to pass through, the first through hole 610 of the fourth fixing member 800 may allow the second support rod 202 to pass through, the second through hole 620 of the second fixing member 600 may allow the introduction component 320 of the second electrode assembly 302 to pass through, and the second through hole 620 of the fourth fixing member 800 may allow the introduction component 320 of the fourth electrode assembly 304 to pass through. Furthermore, the outer walls of the second fixing member 600 and the fourth fixing member 800 may be used to abut against the cavity wall of the reaction chamber 100. In this way, the interaction between the second fixing member 600 and the cavity wall of the reaction chamber 100 and the first support rod 201 respectively can limit the initial angle of the electrode ring 310 of the second electrode assembly 302. This prevents the initial angle of the electrode ring 310 from being too large, which would prevent the plane 311 of the electrode ring 310 from rotating to a position flush with the second boat foot 1014 when the second boat foot 1014 of the wafer carrier boat 1000 presses down on the electrode ring 310. This makes it easier for the electrode ring 310 to contact the second boat foot 1014 of the wafer carrier boat 1000. The interaction between the fourth fixing member 800 and the cavity wall of the reaction chamber 100 and the second support rod 202 can limit the initial angle of the electrode ring 310 of the fourth electrode assembly 304, preventing the initial angle of the electrode ring 310 from being too large, which would prevent the plane 311 of the electrode ring 310 from rotating to a position flush with the fourth boat foot 1016 when the fourth boat foot 1016 of the wafer carrier boat 1000 presses down on the electrode ring 310. This makes it easier for the electrode ring 310 to flush with the fourth boat foot 1016 of the wafer carrier boat 1000. Furthermore, the second fixing member 600 can support the introduction component 320 of the second electrode assembly 302 to prevent it from bending downwards and protruding due to gravity; the fourth fixing member 800 can also support the introduction component 320 of the fourth electrode assembly 304 to prevent it from bending downwards and protruding due to gravity.

[0068] Of course, the support device for the carrier boat may not include the second fixing member 600 and the fourth fixing member 800. The introduction component 320 of the second electrode assembly 302 may not be connected to the first support rod 201, and the introduction component 320 of the fourth electrode assembly 304 may not be connected to the second support rod 202. The second electrode assembly 302 and the fourth electrode assembly 304 may be connected to the first support rod 201 and the second support rod 202 respectively only through the electrode ring sleeve 310.

[0069] It should be noted that the initial angle of the electrode ring 310 mentioned above refers to the angle at which the electrode ring 310 is located when the boat foot 1010 of the wafer carrier boat 1000 is not in contact with the electrode ring 310.

[0070] Optionally, when the boat foot 1010 of the wafer carrier boat 1000 is not connected to the electrode ring 310, the angle α between the plane 311 of the electrode ring 310 and the boat foot plane 1011 of the boat foot 1010 is 0-5°. That is, the rotation angle range of the electrode ring 310 is 0-5°. This can eliminate the influence of installation error and prevent the rotation angle range of the electrode ring 310 from being too large, which would cause the plane 311 of the electrode ring 310 to fail to fit with the boat foot plane 1011 of the boat foot 1010 when the wafer carrier boat 1000 is pressed down.

[0071] In an optional embodiment, the support device for the support boat may further include an insulating support member 240. The insulating support member 240 can be sleeved over the support rod 200 and can be used to contact the cavity wall of the reaction chamber 100 and support the support rod 200. This can prevent the support rod 200 from deforming under load, thereby helping to extend the service life of the support rod 200. Of course, the support device for the support boat may not include the insulating support member 240.

[0072] Optionally, the support device for the support boat may include a plurality of insulating support members 240, which may be distributed along the axial direction of the support rod 200 and are all used to support the support rod 200. Here, the bottom of the insulating support member 240 may contact the bottom of the reaction chamber 100.

[0073] It should be noted that the insulating support 240 can be spaced apart from the electrode ring 310 to prevent the insulating support 240 and the electrode ring 310 from interfering with each other.

[0074] In an optional embodiment of this application, the carrier boat support device may further include a first insulating sleeve 250 and a second insulating sleeve 260. Both the first insulating sleeve 250 and the second insulating sleeve 260 may be sleeved on the support rod 200. The first insulating sleeve 250 may be used to support the first foot 1013 or the third foot 1015 of the wafer carrier boat 1000, and the second insulating sleeve 260 may be used to support the second foot 1014 or the fourth foot 1016 of the wafer carrier boat 1000. Optionally, the first insulating sleeve 250 may be used to support the first foot 1013 or the third foot 1015 of the wafer carrier boat 1000 with an insertion method for radio frequency feeding, and the second insulating sleeve 260 may be used to support the second foot 1014 or the fourth foot 1016 of the wafer carrier boat 1000 with an insertion method for radio frequency feeding. In this way, the first insulating sleeve 250 and the second insulating sleeve 260 can respectively insulate the foot 1010 of the wafer carrier 1000. At the same time, the first insulating sleeve 250 and the second insulating sleeve 260 can also support the foot 1010 of the wafer carrier 1000 to ensure that the height of the wafer carrier 1000 is consistent with that of the other wafer carriers 1000. Here, the wall thickness of the first insulating sleeve 250 and the second insulating sleeve 260 can be consistent with the thickness of the first flat plate portion 316 mentioned above, so as to ensure that the height of the wafer carrier 1000 with the RF feed method of insertion after being placed on the first insulating sleeve 250 and the second insulating sleeve 260 is consistent with the height of the other wafer carriers 1000 after being placed on the electrode ring sleeve 310.

[0075] It should be noted that the RF feed method of the insert-type wafer carrier 1000 can be a wafer carrier 1000 electrically connected to the plug-in electrode assembly 900 through electrode holes. Specifically, the wafer carrier 1000 can be provided with electrode holes, and the reaction chamber 100 is provided with the plug-in electrode assembly 900 for electrical connection with the RF power supply. The plug-in electrode assembly 900 can be plugged into the electrode holes to provide RF power to the wafer carrier 1000. Here, the plug-in electrode assembly 900 can be provided on the tailgate plate 130 of the reaction chamber 100, and the plug-in electrode assembly 900 can include a positive electrode rod 910 and a negative electrode rod 920. The wafer carrier 1000 can be provided with positive electrode holes and negative electrode holes. The positive electrode rod 910 can be plugged into the positive electrode hole, and the negative electrode rod 920 can be plugged into the negative electrode hole. The RF feed method is an insertion type of wafer carrier boat 1000, which can be a wafer carrier boat 1000 close to the tail plate 130 of the reaction chamber 100, i.e., the tail carrier boat 1002.

[0076] In other embodiments, the carrier boat support device may not include the first insulating sleeve 250 and the second insulating sleeve 260, and the boat foot 1010 of the wafer carrier boat 1000 with the radio frequency feed method of insertion can directly contact the support rod 200.

[0077] In an optional embodiment, the support rod 200 may include a rod body 210 and a support sleeve, with the support sleeve fitted over the rod body 210. The support sleeve can be used to electrically insulate the wafer carrier boat 1000 from the rod body 210.

[0078] Optionally, the support sleeve may include a first support sleeve 220 and a second support sleeve 230. The first support sleeve 220 may be fitted over the rod body 210, and the second support sleeve 230 may be fitted over the first support sleeve 220. In this way, the insulation performance between the wafer carrier boat 1000 and the rod body 210 can be improved, and the strength of the support rod 200 can also be improved.

[0079] Here, both the first support sleeve 220 and the second support sleeve 230 can be made of ceramic material.

[0080] Based on the carrier boat support device provided in this application, this application embodiment also provides a semiconductor process equipment, which may include a reaction chamber 100 and a carrier boat support device as described in any of the above embodiments, wherein the carrier boat support device may be disposed within the reaction chamber 100.

[0081] The beneficial effects achieved by the semiconductor process equipment provided in this application embodiment are consistent with the beneficial effects achieved by the carrier boat support device provided in this application embodiment, so they will not be repeated here.

[0082] In an optional embodiment of this application, at least three flange electrodes 400 may be provided on the reaction chamber 100. The first end of each flange electrode 400 may be located outside the reaction chamber 100 and used for electrical connection with the radio frequency power supply. The second end of each flange electrode 400 may be located inside the reaction chamber 100 and can be used for insertion with each electrode assembly 300. This arrangement facilitates the connection of each electrode assembly 300 to the radio frequency power supply. Furthermore, since the first end of each flange electrode 400 is located outside the reaction chamber 100, the wiring position can be selected according to the feed type of the wafer carrier boat 1000, facilitating the change of electrode polarity. This allows the radio frequency introduction mechanism to adapt to two wafer carrier boats 1000 with different structures, achieving structural universality and compatibility when switching processes and wafer carrier boats 1000, and eliminating the need to consider changes in electrode structure. Consequently, it can eliminate the negative impact on production capacity caused by downtime for hardware replacement and re-debugging tasks during process and wafer carrier boat 1000 switching.

[0083] Here, since each electrode assembly 300 is plugged into each flange electrode 400, it is convenient to disassemble and assemble the electrode assembly 300 for subsequent maintenance or replacement.

[0084] In other embodiments, the flange electrode 400 may not be provided on the reaction chamber 100, and the introduction component 320 of each electrode assembly 300 may extend out of the reaction chamber 100 along its axial direction to connect to the radio frequency power supply.

[0085] Optionally, at least three flange electrodes 400 may include a first flange electrode 410, a second flange electrode 420, a third flange electrode 430, and a fourth flange electrode 440. The first flange electrode 410 can be inserted into the first electrode assembly 301, the second flange electrode 420 can be inserted into the second electrode assembly 302, the third flange electrode 430 can be inserted into the third electrode assembly 303, and the fourth flange electrode 440 can be inserted into the fourth electrode assembly 304. This configuration facilitates the electrical connection of the first electrode assembly 301, the second electrode assembly 302, the third electrode assembly 303, and the fourth electrode assembly 304 to the radio frequency power supply, thereby enabling all four electrode assemblies 300 to be powered.

[0086] In an optional embodiment, the reaction chamber 100 may include a chamber body, a front door panel, a first flange 110, a rear door panel 130, and a second flange 120. The front door panel can be connected to a first end of the chamber body via the first flange 110, and the rear door panel 130 can be connected to a second end of the chamber body via the second flange 120. Furthermore, the first end of the chamber body and the first flange 110 can be sealed with a sealing ring, and the second end of the chamber body and the second flange 120 can be sealed with a sealing ring. The chamber body, front door panel, first flange 110, rear door panel 130, and second flange 120 together form a sealed vacuum environment. When the wafer carrier boat 1000 needs to enter or exit the reaction chamber 100 before or after the process, the front door panel can be opened or closed.

[0087] Optionally, each flange electrode 400 can be disposed on the first flange 110. Specifically, the first flange 110 can be provided with at least three mounting holes, each mounting hole penetrating the first flange 110 radially and spaced apart circumferentially along the first flange 110. The at least three mounting holes may include a first mounting hole, a second mounting hole, a third mounting hole, and a fourth mounting hole. The first end of the first flange electrode 410 can pass through the first mounting hole and extend out of the reaction chamber 100, the first end of the second flange electrode 420 can pass through the second mounting hole and extend out of the reaction chamber 100, and the first end of the third flange electrode 430 can pass through the third mounting hole and extend out of the reaction chamber. In the reaction chamber 100, the first end of the fourth flange electrode 440 can pass through the fourth mounting hole and extend out of the reaction chamber 100. In this way, the first flange electrode 410, the second flange electrode 420, the third flange electrode 430 and the fourth flange electrode 440 can extend out of the reaction chamber 100 radially, so as to prevent the first flange electrode 410, the second flange electrode 420, the third flange electrode 430 and the fourth flange electrode 440 from interfering with the entry and exit of the wafer carrier boat 1000. Furthermore, it is not necessary to disassemble the first flange electrode 410, the second flange electrode 420, the third flange electrode 430 and the fourth flange electrode 440 when the wafer carrier boat 1000 enters and exits, which helps to simplify the process operation.

[0088] In an optional embodiment, at least two support seats 140 can be provided on both the first flange 110 and the second flange 120. The two ends of the support rod 200 can be connected to the first flange 110 and the second flange 120 respectively via the support seats 140. The support seats 140 on the first flange 110 can be connected to the inner wall of the first flange 110 via fixing screws or the like. Each support seat 140 of the first flange 110 can have an arc-shaped structure to adapt to the shape of the first flange 110. Here, a groove can be provided on the side of the support seat 140 facing away from the first flange 110, and the support rod 200 can be embedded in the groove.

[0089] Optionally, the first mounting hole and the second mounting hole can be respectively provided on both sides of the support base 140 for supporting the first support rod 201 in the circumferential direction of the first flange 110, and the third mounting hole and the fourth mounting hole can be respectively provided on both sides of the support base 140 for supporting the second support rod 202 in the circumferential direction of the first flange 110. Furthermore, the first mounting hole and the second mounting hole are both provided close to the support base 140 for supporting the first support rod 201, and the third mounting hole and the fourth mounting hole are both provided close to the support base 140 for supporting the second support rod 202. This facilitates the first flange electrode 410 and the second flange electrode 420 to dock with the first electrode assembly 301 and the second electrode assembly 302, respectively, and facilitates the third flange electrode 430 and the fourth flange electrode 440 to dock with the third electrode assembly 303 and the fourth electrode assembly 304, respectively.

[0090] During the process, the wafer carrier boat 1000 enters the reaction chamber 100. The wafer carrier boat 1000 near the tail plate 130 can be referred to as the tail carrier boat 1002. The radio frequency feed method of the tail carrier boat 1002 can be an insertion type. Specifically, the tail carrier boat 1002 is provided with electrode holes, and the tail plate 130 is provided with a plug-in electrode assembly 900. The plug-in electrode assembly 900 is plugged into the electrode holes. When the tail carrier boat 1002 rests on the support rod 200, the first boat foot 1013 or the third boat foot 1015 of the tail carrier boat 1002 can contact the first insulating sleeve 250, and the second boat foot 1014 or the fourth boat foot 1016 of the tail carrier boat 1002 can contact the second insulating sleeve 260. The wafer carrier boat 1000 near the front panel can be referred to as the front carrier boat 1001. The first foot 1013 and the third foot 1015 of the front carrier boat 1001 can correspond to the electrode rings 310 of the first electrode assembly 301 and the third electrode assembly 303, respectively. The second foot 1014 and the fourth foot 1016 of the front carrier boat 1001 can correspond to the electrode rings 310 of the second electrode assembly 302 and the fourth electrode assembly 304, respectively. Correspondingly, due to assembly and processing errors, the plane 311 of the electrode ring sleeve 310 has an angle of 0-5° with the horizontal plane when it is not in contact with the boat foot 1010 of the front support boat 1001. During the boat lowering process, when the boat foot 1010 of the front support boat 1001 contacts the electrode ring sleeve 310, a torque is generated due to the downward pressure, causing the electrode ring sleeve 310 to rotate around the support rod 200 until the plane 311 on the electrode ring sleeve 310 fits with the boat foot 1010.When the front support boat 1001 is a front-to-back introduction support boat, that is, the polarity of the first boat foot 1013 and the third boat foot 1015 of the front support boat 1001 are the same, the polarity of the second boat foot 1014 and the fourth boat foot 1016 of the front support boat 1001 are the same, and the polarity of the first boat foot 1013 and the second boat foot 1014 are opposite, then the polarity of each electrode assembly 300 is adjusted. Specifically, the polarity of the first electrode assembly 301 is the same as the polarity of the third electrode assembly 303, the polarity of the second electrode assembly 302 is the same as the polarity of the fourth electrode assembly 304, and the polarity of the first electrode assembly 301 is opposite to the polarity of the second electrode assembly 302; when the front support boat 1001 is a left-to-right introduction support boat, that is, the polarity of the front support boat 1001 is... The polarity of the first foot 1013 of 01 is opposite to that of the third foot 1015. The polarity of the second foot 1014 of the front support boat 1001 is opposite to that of the fourth foot 1016. When the polarity of the first foot 1013 is the same as that of the fourth foot 1016, and the polarity of the second foot 1014 is the same as that of the third foot 1015, the polarity of each electrode assembly 300 is adjusted. Specifically, the polarity of the first electrode assembly 301 is the same as that of the fourth electrode assembly 304, the polarity of the third electrode assembly 303 is the same as that of the second electrode assembly 302, and the polarity of the first electrode assembly 301 is opposite to that of the third electrode assembly 303, and the polarity of the second electrode assembly 302 is opposite to that of the fourth electrode assembly 304. In this way, it can be applied to various types of wafer carrier boats 1000, while increasing the contact area. When the discharge power of the wafer carrier boat 1000 is the same, the current density of the electrode ring 310 of the electrode assembly 300 can be reduced, which can significantly reduce the ablation of the electrode ring 310 and thus extend the service life of the electrode ring 310 by more than 50%.

[0091] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A radio frequency introduction mechanism, characterized in that, An application is made in semiconductor process equipment, the semiconductor process equipment including a wafer carrier boat (1000), the wafer carrier boat (1000) having at least three boat feet (1010), the at least three boat feet (1010) including a first boat foot (1013), a second boat foot (1014) and a third boat foot (1015), the first boat foot (1013) and the second boat foot (1014) being spaced apart in a front-back direction, the first boat foot (1013) and the third boat foot (1015) being spaced apart in a left-right direction, the radio frequency introduction mechanism including at least three electrode assemblies (300), the at least three electrode assemblies (300) including a first electrode assembly (301), a second electrode assembly (302) and a third electrode assembly (303), the polarity of at least one of the first electrode assembly (301), the second electrode assembly (302) and the third electrode assembly (303) being adjustable; When the wafer carrier boat (1000) is a carrier boat introduced from the front and back, the first electrode assembly (301) is used to be electrically connected to the first boat foot (1013), and the second electrode assembly (302) is used to be electrically connected to the second boat foot (1014). The polarity of the first electrode assembly (301) is opposite to that of the second electrode assembly (302). When the wafer carrier boat (1000) is introduced into the left and right carrier boats, the first electrode assembly (301) is used to be electrically connected to the first boat foot (1013), and the third electrode assembly (303) is used to be electrically connected to the third boat foot (1015). The polarity of the first electrode assembly (301) is opposite to that of the third electrode assembly (303).

2. The radio frequency introduction mechanism according to claim 1, characterized in that, When the wafer carrier boat (1000) is the front and rear introduced carrier boat, the third electrode assembly (303) is used to be electrically connected to the third boat foot (1015), and when the third boat foot (1015) is electrically connected to the first boat foot (1013), the polarity of the third electrode assembly (303) is the same as the polarity of the first electrode assembly (301), or when the third boat foot (1015) is electrically connected to the second boat foot (1014), the polarity of the third electrode assembly (303) is the same as the polarity of the second electrode assembly (302). When the wafer carrier boat (1000) is the left and right introduced carrier boat, the second electrode assembly (302) is used to be electrically connected to the second boat foot (1014), and when the second boat foot (1014) and the third boat foot (1015) are electrically connected, the polarity of the second electrode assembly (302) is the same as the polarity of the third electrode assembly (303), or when the second boat foot (1014) and the first boat foot (1013) are electrically connected, the polarity of the second electrode assembly (302) is the same as the polarity of the first electrode assembly (301).

3. The radio frequency introduction mechanism according to claim 1, characterized in that, The wafer carrier boat (1000) also has a fourth boat foot (1016), which is spaced apart from the second boat foot (1014) in the left-right direction and spaced apart from the third boat foot (1015) in the front-back direction. The at least three electrode assemblies (300) also include a fourth electrode assembly (304), which is used to electrically connect with the fourth boat foot (1016). When the wafer carrier boat (1000) is the front and rear introduced carrier boat, and when the fourth boat foot (1016) and the second boat foot (1014) are electrically connected, the polarity of the fourth electrode assembly (304) is the same as the polarity of the second electrode assembly (302), or when the fourth boat foot (1016) and the first boat foot (1013) are electrically connected, the polarity of the fourth electrode assembly (304) is the same as the polarity of the first electrode assembly (301); When the wafer carrier boat (1000) is the left and right introduced carrier boat, and when the fourth boat foot (1016) is electrically connected to the first boat foot (1013), the polarity of the fourth electrode assembly (304) is the same as the polarity of the first electrode assembly (301), or when the fourth boat foot (1016) is electrically connected to the third boat foot (1015), the polarity of the fourth electrode assembly (304) is the same as the polarity of the third electrode assembly (303).

4. The radio frequency introduction mechanism according to claim 1, characterized in that, The semiconductor process equipment also includes a support rod (200) for supporting the wafer carrier boat (1000). The electrode assembly (300) includes an introduction component (320) and an electrode ring (310). The two ends of the introduction component (320) are respectively used for electrical connection with the radio frequency power supply and the electrode ring (310). The electrode ring (310) is sleeved outside the support rod (200) and can rotate relative to the support rod (200). The electrode ring (310) is provided with a plane (311) for fitting with the boat foot (1010).

5. The radio frequency introduction mechanism according to claim 4, characterized in that, The electrode ring (310) includes a connecting part (312), an arc-shaped part (313), a protrusion (314), a guide part (315), and a first flat plate part (316) connected end to end, wherein: The connecting part (312) is connected to the introducing component (320), and the plane (311) is the side of the first flat plate part (316) facing away from the support rod (200); The guide portion (315) is inclined, and along the direction from the first flat plate portion (316) to the connection point of the arc-shaped portion (313) and the protrusion (314), the distance between the guide portion (315) and the connecting portion (312) gradually increases, and the guide portion (315) is used to fit against the support leg (1012) of the boat foot (1010); The arc-shaped portion (313) is used to fit against the support rod (200), and the protrusion (314) protrudes away from the connecting portion (312).

6. The radio frequency introduction mechanism according to claim 4, characterized in that, The introduced component (320) includes: Electrode rod (321), the first end of which is electrically connected to the electrode ring (310); An inlet cable (325) is introduced, the first end of which is electrically connected to the second end of the electrode rod (321), and the inlet cable (325) is a flexible cable; The connector (326) is introduced, the first end of which is electrically connected to the second end of the cable (325), and the second end of the connector (326) is used to be electrically connected to the radio frequency power supply. The first insulating inner sleeve (322) is sleeved on a portion of the electrode rod (321) and the lead cable (325); The second insulating inner sleeve (323) is fitted over another part of the lead cable (325) and part of the lead plug (326); An insulating outer sleeve (324) is fitted over the first insulating inner sleeve (322) and the second insulating inner sleeve (323), and the insulating outer sleeve (324) covers the gap between the first insulating inner sleeve (322) and the second insulating inner sleeve (323).

7. A support device for a load-bearing boat, characterized in that, The device includes at least two support rods (200) and a radio frequency introduction mechanism as described in any one of claims 1-6. The support rods (200) are used to support a wafer carrier boat (1000). The at least two support rods (200) include a first support rod (201) and a second support rod (202). The first electrode assembly (301) and the second electrode assembly (302) of the radio frequency introduction mechanism are both disposed on the first support rod (201). The third electrode assembly (303) of the radio frequency introduction mechanism is disposed on the second support rod (202).

8. The support device for the carrying boat according to claim 7, characterized in that, The electrode assembly (300) includes an introduction component (320) and an electrode ring (310) electrically connected to the introduction component (320), the electrode ring (310) being sleeved outside the support rod (200); The introduction component (320) of the first electrode assembly (301) and the introduction component (320) of the second electrode assembly (302) are arranged circumferentially spaced along the first support rod (201), and the introduction component (320) of the second electrode assembly (302) is disposed on the side of the first support rod (201) away from the wafer carrier boat (1000).

9. The support device for the carrying boat according to claim 8, characterized in that, The radio frequency introduction mechanism further includes a fourth electrode assembly (304), which is disposed on the second support rod (202). The introduction component (320) of the fourth electrode assembly (304) and the introduction component (320) of the third electrode assembly (303) are arranged circumferentially apart along the second support rod (202), and the introduction component (320) of the fourth electrode assembly (304) is disposed on the side of the second support rod (202) away from the wafer carrier boat (1000).

10. The support device for the carrying boat according to claim 9, characterized in that, The support device for the load-bearing boat also includes: The first fixing member (500) and the third fixing member (700) each include a fixing ring (510) and a limiting part (520) connected to the fixing ring (510). The fixing ring (510) of the first fixing member (500) is sleeved outside the introduction part (320) of the first electrode assembly (301), and the fixing ring (510) of the third fixing member (700) is sleeved outside the introduction part (320) of the third electrode assembly (301). In addition to the introduction component (320) of 303), the outer wall of the fixing ring (510) of the first fixing member (500) and the outer wall of the fixing ring (510) of the third fixing member (700) are both used to abut against the cavity wall of the reaction chamber (100), and the limiting part (520) of the first fixing member (500) and the limiting part (520) of the third fixing member (700) are respectively used to abut against the first support rod (201) and the second support rod (202); The second fixing member (600) and the fourth fixing member (800) are provided with a first through hole (610) and a second through hole (620). The first through hole (610) of the second fixing member (600) is for the first support rod (201) to pass through, the first through hole (610) of the fourth fixing member (800) is for the second support rod (202) to pass through, the second through hole (620) of the second fixing member (600) is for the introduction component (320) of the second electrode assembly (302) to pass through, and the second through hole (620) of the fourth fixing member (800) is for the introduction component (320) of the fourth electrode assembly (304) to pass through. The outer walls of the second fixing member (600) and the fourth fixing member (800) are both used to abut against the cavity wall of the reaction chamber (100).

11. The support device for the carrying boat according to claim 7, characterized in that, The carrier boat support device further includes an insulating support member (240), which is sleeved outside the support rod (200) and is used to contact the cavity wall of the reaction chamber (100) and to support the support rod (200).

12. The support device for the carrying boat according to claim 7, characterized in that, The support device for the wafer carrier boat further includes a first insulating sleeve (250) and a second insulating sleeve (260). The first insulating sleeve (250) and the second insulating sleeve (260) are both sleeved on the outside of the support rod (200). The first insulating sleeve (250) is used to support the first foot (1013) or the third foot (1015) of the wafer carrier boat (1000), and the second insulating sleeve (260) is used to support the second foot (1014) or the fourth foot (1016) of the wafer carrier boat (1000).

13. A semiconductor process apparatus, characterized in that, It includes a reaction chamber (100) and a support vessel as described in any one of claims 7-12, wherein the support vessel is disposed within the reaction chamber (100).

14. The semiconductor process equipment according to claim 13, characterized in that, At least three flange electrodes (400) are provided on the reaction chamber (100). The first end of each flange electrode (400) is located outside the reaction chamber (100) and is used for electrical connection with the radio frequency power supply. The second end of each flange electrode (400) is located inside the reaction chamber (100) and is used for insertion into each of the electrode assemblies (300).

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