A cylindrical battery cell winding method and apparatus

Abstract

The application discloses a kind of cylindrical battery cell winding method and equipment, it is related to battery core processing technical field.The steps include, step one: continuous cell sheet substrate is cut, obtains several independent cell sheet monomer, step two: between every two adjacent cell sheet monomer, through adhesive tape is pasted fixed, make adhesive tape cover the cut end of two adjacent cell sheet monomer simultaneously, step three: the adhesive tape between adjacent cell sheet monomer is sheared, make the end of every cell sheet monomer retain a preset length adhesive tape section.The application is reserved adhesive tape section by adhesive tape integrated design and winding process innovation, independent center needle process is saved, to form center support structure by winding, greatly simplify production process, reduce manufacturing cost;Adhesive tape full coverage cutting notch, completely block the core powder drop path, solve self-discharge and micro short circuit hidden danger from the root, improve battery safety and cycle life.

Description

Technical Field

[0001] This invention relates to the field of battery cell processing technology, specifically to a method and apparatus for winding cylindrical battery cells. Background Technology

[0002] Cylindrical battery cells are the core structure of power batteries and energy storage devices for consumer electronics. Winding is the core process in their preparation. Traditional winding processes and supporting equipment have significant technical shortcomings in large-scale production.

[0003] Traditional battery cell winding requires a separate center pin as an internal support structure. This center pin needs to be individually processed, loaded, and assembled, resulting in cumbersome procedures and low production efficiency. Furthermore, when the battery cell substrate is cut into individual units, burrs and core powder are easily generated at the cut edges. This detached core powder can cause safety issues such as battery self-discharge and micro-short circuits. Simultaneously, traditional insulating tape only provides basic insulation and lacks structural support, making it difficult for equipment to precisely control the chip gap and tape adhesion accuracy, further reducing the battery cell yield and lifespan. Therefore, to address these issues, this invention proposes a battery winding method to improve the above problems and provides a set of supporting equipment to implement the key steps of the battery winding method. Summary of the Invention

[0004] The purpose of this invention is to provide a method and apparatus for winding cylindrical battery cells to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a method and apparatus for winding a cylindrical battery cell, comprising the following steps: Step 1: Cut the continuous electrical chip substrate to obtain several independent electrical chip units; Step 2: Secure each pair of adjacent electrical chip units with adhesive tape, ensuring that the tape covers the cut ends of both adjacent electrical chip units simultaneously. Step 3: Cut the tape between adjacent electrical chip units so that one end of each electrical chip unit retains a tape segment of a preset length; Step 4: Starting from the tape segment at one end of the battery cell, wind the battery cell so that the tape segment forms a central support structure in the middle of the cell.

[0006] Further, in step two, the hardness scale of the tape is Shore 00-Shore 00 / A.

[0007] Further, in step two, the tape used in this scheme is either PET tape or PI tape.

[0008] Furthermore, in step two, the spacing between two adjacent electrical chip units is 0.5-15cm.

[0009] Further, in step three, the preset length of the tape segment retained at one end of each individual electrical chip is 5-15mm.

[0010] An electrical chip processing apparatus for implementing the method described above, characterized in that it comprises: Equipment side panel; Conveyor group one is installed on the side plate of the equipment and is located at the feed end of the processing equipment. It is used to pull the electronic chips into the processing equipment. Conveyor group two, installed on the side panel of the equipment, is positioned opposite to conveyor group one and follows the same conveying path; it is used to pull the cut electrical chip units. Two adhesive bonding mechanisms are respectively set on the upper and lower sides of the equipment side panel, used to apply adhesive tape between adjacent electrical chip units.

[0011] Further, both conveyor group one and conveyor group two consist of two rows of rollers, one above the other. The surface of the rollers is made of soft rubber material, and the gap between the two rows of rollers is smaller than the thickness of a single chip.

[0012] Furthermore, the solution also includes a slide rail, which is located on the side panel of the equipment at the second conveyor group. The second conveyor group adjusts its distance from the first conveyor group by sliding on the slide rail, so as to form a gap between adjacent electronic chip units for applying adhesive tape.

[0013] Furthermore, the solution also includes two sets of belt supply mechanisms. Each set of belt supply mechanisms includes a belt roller, two take-up and release shafts, a support plate, and a blade. The support plate is located on one side of the belt conveying path, and a spring is installed below the support plate. The blade is located between the support plate and the take-up and release shafts.

[0014] Further, each of the two adhesive mechanisms includes a support platform. The support platform moves to the support plate via a slide and presses the support plate, causing the blade to cut the tape. The top plate of the support platform is a suction cup surface, which uses negative pressure to transfer the cut tape between adjacent electrical chip units for adhesive bonding.

[0015] Compared with the prior art, the beneficial effects of the present invention are: This cylindrical battery cell winding method and equipment, through integrated tape design and innovative winding process, eliminates the need for an independent center pin process. It uses a pre-reserved tape segment to form a central support structure, which greatly simplifies the production process, reduces manufacturing costs, and ensures that the tape fully covers the cut, completely blocking the path of cell powder falling, solving the hidden dangers of self-discharge and micro-short circuit, and improving battery safety and cycle life.

[0016] Meanwhile, the use of high-hardness, high-temperature resistant tape balances support and flexibility, providing stable support in the middle of the battery cell to resist the expansion and contraction of the charging and discharging electrode plates and prevent collapse and deformation. The supporting equipment enables adjustable gaps and high fit, achieving a highly automated operation from tape supply to cutting to bonding. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the electrical chip processing equipment of the present invention; Figure 2 This is a schematic diagram of the electrical chip tape adhesive state structure of the present invention.

[0018] In the diagram: 1. Equipment side plate; 2. Support platform; 3. Conveyor group one; 4. Conveyor group two; 5. Slide rail; 6. Belt roller; 7. Take-up and untake-down shaft; 8. Blade; 9. Support plate; 10. Spring component. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] This embodiment provides a method for manufacturing battery cells, aiming to solve the technical problems in the prior art where powder shedding during the battery cell cutting process leads to battery self-discharge and the need to separately set the center pin results in cumbersome processes. The specific implementation steps are as follows: Step 1: Cutting the electrical chip First, following the conventional battery chip manufacturing process, a continuous battery chip substrate is prepared, with a length ranging from tens to hundreds of meters. After the battery chip is manufactured, a cutting device is used to cut the continuous battery chip substrate into several independent battery chip units. During the cutting process, the cutting speed and cutting force of the cutting device are controlled to reduce the generation of core powder. The cut edges of the battery chip units must be kept flat to avoid burrs, damage, etc., to ensure the effectiveness of subsequent tape sealing.

[0021] Step 2: Attaching the electrical chip A tape with a certain degree of hardness is selected as the bonding and subsequent support component. The hardness of the tape must be sufficient to act as a center pin after subsequent winding, effectively supporting the battery cell and preventing cell collapse during high-power charging and discharging. Preferably, the hardness scale of the tape is Shore 00-Shore 00 / A (Shore hardness), ensuring that it has both support and a certain degree of flexibility, and can adapt to the winding process without breaking or deforming. The tape can be made of high-temperature resistant and electrolyte corrosion-resistant insulating tapes such as PET tape and PI tape, or equivalent alternatives such as rigid film strips with similar performance can be selected to ensure that it does not degrade or age as much as possible during use inside the battery and does not affect the electrochemical performance of the battery.

[0022] The cut-out electronic chip units are arranged in sequence. Between every two adjacent electronic chip units, the above-mentioned tape is used to stick and fix them on both the top and bottom. When sticking, ensure that the tape covers the cut ends of the two adjacent electronic chip units at the same time, and that there is a preset gap between the two adjacent electronic chip units. Preferably, the gap ranges from 0.5 to 15 cm, and can be flexibly adjusted according to the thickness of the electronic chip and the width of the tape.

[0023] During the bonding process, it is necessary to ensure that the tape adheres tightly to the surface of the battery chip without bubbles or wrinkles, and to ensure that the tape can completely seal the cut of the battery chip, thereby preventing the chip powder generated during the cutting process from falling into the battery and avoiding battery self-discharge caused by the chip powder.

[0024] Step 3: Cut the tape After all adjacent battery cell units have been taped together, the tape between adjacent battery cell units is cut using a cutting device according to the preset cell size and winding requirements. This leaves a preset length of tape at one end of each battery cell unit. This length is determined based on the size of the center pin after winding, typically 5-15mm, to ensure a stable central support structure is formed after winding. The cutting line is as follows: Figure 2 As shown.

[0025] Step Four The battery cell with a pre-reserved tape segment is wound. Taking the tape segment at one end of the battery cell as the starting point, the winding equipment is started to perform the winding operation. During the winding process, the winding speed and winding tension are controlled to make the battery cell wound evenly. During the winding process, the pre-reserved tape segment will gradually form a central support structure in the middle of the battery cell as the battery cell is wound, which acts as the central needle in the prior art.

[0026] After winding, a wound battery cell is obtained. At this time, the central support structure formed by the tape is located in the middle of the battery cell, which plays a stable supporting role and can effectively prevent the battery cell from collapsing during high-power charging and discharging. Then, according to the conventional battery cell subsequent processes, the wound battery cell is encapsulated, injected with electrolyte, and formed to finally obtain the finished battery cell.

[0027] like Figure 1 As shown, in order to ensure the smooth implementation of the above embodiments and to achieve the purpose of applying and cutting the battery cell with tape in steps two to three, this embodiment also provides a battery cell processing equipment, specifically including at least one equipment side plate, a first conveyor group 3, a second conveyor group 4, two sets of adhesive mechanisms, and two sets of tape supply structures.

[0028] Specifically, conveyor group 3, conveyor group 4, two support platforms 2, and two conveyor belt supply mechanisms are all installed on the side plate 1 of the equipment. Conveyor group 3 is located at the feed end of the processing equipment. The electronic chip is pulled into the processing equipment by conveyor group 3. Conveyor group 4 is symmetrically arranged with conveyor group 1, and the conveying path is the same as that of conveyor group 3. In this embodiment, both conveyor group 3 and conveyor group 4 are composed of upper and lower rows of rollers. The gap between the upper and lower rows of rollers is at least less than the thickness of a single chip to ensure that the electronic chip can be stably pulled by conveyor group 3 and conveyor group 4 under friction. That is to say, the surface of the rollers that make up conveyor group 3 and conveyor group 4 are all made of soft materials such as rubber to avoid damaging the electronic chip. Damage, in which, a slide rail 5 is also provided on the side plate 1 of the equipment at the location of the second conveyor group 4. The rollers of the second conveyor group 4 are all installed on a side plate, and the side plate slides on the slide rail 5. That is to say, the second conveyor group 4 can control the distance between itself and the first conveyor group 3 by sliding on the slide rail 5. After the cutting is completed, the single cell is guided into the second conveyor group 4 after passing through the first conveyor group 3. For example, suppose that the first piece enters the second conveyor group 4 after passing through the first conveyor group 3, and after the tail end of the first piece leaves the first conveyor group 3, the second conveyor group 4 moves along the slide rail 5. After the end of the second piece is exposed in the first conveyor group 3, the first conveyor group 3 stops pulling. At this time, there is a gap between the first piece and the second piece, and tape can be applied between the first conveyor group 3 and the second conveyor group 4.

[0029] To ensure tape adhesion, it is also necessary to understand that two sets of support platforms 2 are respectively set on the upper and lower sides of the equipment side plate 1. The support platform 2 includes a top plate, a cylinder, and a slide. The slide is installed on the equipment side plate 1 and can slide horizontally. Its sliding path extends from the support plate 9 of the tape supply mechanism to the bonding station between the first conveyor group 3 and the second conveyor group 4. The cylinder is installed on the slide and can move horizontally with the slide. The piston rod of the cylinder extends and retracts vertically. The top plate is fixedly installed at the end of the piston rod of the cylinder. The extension and retraction of the piston rod of the cylinder controls the movement of the top plate toward or away from the electronic chip.

[0030] The side of the top plate facing the electrical chip is set as a suction cup surface. An air pipe is installed inside the top plate. One end of the air pipe is connected to the suction cup surface, and the other end is connected to an external negative pressure source. A negative pressure adsorption effect is formed at the suction cup surface through the air pipe. When it is necessary to transfer the tape, the top plate is driven by the cylinder to extend to the position where it contacts the tape on the support plate 9. The suction cup surface is attached to the non-adhesive surface of the tape. At this time, a negative pressure is formed in the air pipe, so that a negative pressure adsorption is formed between the suction cup surface and the tape, firmly adsorbing and fixing the tape to the working surface of the top plate.

[0031] Subsequently, the slide moves horizontally, moving the top plate along with the adhesive tape from the support plate 9 to the bonding station between conveyor group 3 and conveyor group 4. Once in position, the cylinder drives the top plate to move towards the electronic chip, so that the adhesive side of the tape adheres to the cut end face and upper and lower surfaces of the electronic chip. At this time, the negative pressure in the air pipe is released, the suction cup surface releases the tape, and the top plate retracts and resets under the drive of the cylinder, completing one tape transfer and bonding action.

[0032] Since the two sets of support platforms 2 are located on the upper and lower sides of the electronic chip conveying path, during the bonding process, the top plate of the upper support platform 2 moves downward and the top plate of the lower support platform 2 moves upward. The two sets of top plates simultaneously attach their respective tapes to the upper and lower sides of the electronic chip. When the two top plates are in place, they abut against each other to form opposing supports. On the one hand, this ensures that the tape and the electronic chip are tightly bonded, without bubbles or wrinkles, and that the tape can completely cover and seal the cut edges of the electronic chip. On the other hand, the opposing supports prevent the electronic chip from bending or shifting due to unilateral force when pressure is applied to either side of the top plate, ensuring the accuracy of the bonding position.

[0033] The tape supply mechanism includes a tape roller 6 and two take-up and release shafts 7 arranged vertically. The tape is pulled by friction at the take-up and release shafts 7. It should be noted that because one side of the tape has high adhesion, the roller surface in contact with the adhesive side of the tape is made of polytetrafluoroethylene, making it difficult for the adhesive side of the tape to adhere to the roller surface. The other roller has a soft rubber surface, which pulls the tape by friction. In this case, the tape can be pulled out by rotating the soft rubber surface.

[0034] like Figures 1 to 2 As shown, the tape supply mechanism also includes a support plate 9, located on one side of the tape conveyor. After being pulled by the take-up shaft 7, the tape lies flat on the support plate 9. A spring 10 is installed below the support plate 9, meaning that when the support plate 9 is pressed vertically, it will move downwards. A blade 8 is installed between the support plate 9 and the take-up shaft 7, and the tape will be cut by the blade 8. The spring 10 can be a telescopic spring or an air spring connected to the side plate 1 of the equipment. Specifically, after the take-up shaft 7 pulls the tape to the required length, the tape... The tape is laid flat on the support plate 9. To prevent the tape from sticking to the support plate 9, the top surface of the support plate 9 is also made of polytetrafluoroethylene. Then, the support platform 2 moves to the support plate 9 via a slide table and presses the support plate 9 to disconnect the tape. Then, it moves with the tape between the first conveyor group 3 and the second conveyor group 4 to complete the tape adhesion work. In order to achieve stable transfer of the tape, the side of the top plate of the support platform 2 that contacts the tape is set as a suction cup surface. An air pipe is set on the top plate to connect with the suction cup surface channel to form a negative pressure adsorption, so that the tape can be stably transferred to the adhesion position.

[0035] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended embodiments and their equivalents.

Claims

1. A method for winding a cylindrical battery cell, characterized in that, Includes the following steps: Step 1: Cut the continuous electrical chip substrate to obtain several independent electrical chip units; Step 2: Secure each pair of adjacent electrical chip units with adhesive tape, ensuring that the tape covers the cut ends of both adjacent electrical chip units simultaneously. Step 3: Cut the tape between adjacent electrical chip units so that one end of each electrical chip unit retains a tape segment of a preset length; Step 4: Starting from the tape segment at one end of the battery cell, wind the battery cell so that the tape segment forms a central support structure in the middle of the cell.

2. The method for winding a cylindrical battery cell according to claim 1, characterized in that: In step two, the hardness scale of the tape is Shore 00-Shore 00 / A.

3. The method for winding a cylindrical battery cell according to claim 1, characterized in that: In step two, the tape is either PET tape or PI tape.

4. The method for winding a cylindrical battery cell according to claim 1, characterized in that: In step two, the spacing between two adjacent electrical chip units is 0.5-15cm.

5. The method for winding a cylindrical battery cell according to claim 1, characterized in that: In step three, the preset length of the tape segment retained at one end of each electrical chip unit is 5-15mm.

6. An electrical chip processing apparatus for implementing the method according to any one of claims 1-5, characterized in that, include: Equipment side panel (1); Conveyor group 1 (3) is installed on the side plate (1) of the equipment and is set at the feed end of the processing equipment to pull the electric chip into the processing equipment; Conveyor group two (4), installed on the side plate (1) of the equipment, is set opposite to conveyor group one (3) and the conveying path is consistent, used to pull the cut electrical chip individual units; and Two adhesive bonding mechanisms are respectively set on the upper and lower sides of the equipment side plate (1) for bonding tape between adjacent electrical chip units.

7. The electronic chip processing equipment according to claim 6, characterized in that: Both conveyor group one (3) and conveyor group two (4) consist of two rows of rollers, the surface of which is made of soft rubber material, and the gap between the two rows of rollers is smaller than the thickness of a single chip.

8. The electronic chip processing equipment according to claim 6, characterized in that: It also includes a slide rail (5), which is located on the side plate (1) of the equipment at the second conveyor group (4). The second conveyor group (4) adjusts the distance between itself and the first conveyor group (3) by sliding on the slide rail (5) to form a gap between adjacent electrical chip units for applying adhesive tape.

9. The electronic chip processing equipment according to claim 6, characterized in that: It also includes two sets of tape supply mechanisms. Each set of tape supply mechanisms includes a tape roller (6), two take-up and release shafts (7), a support plate (9), and a blade (8). The support plate (9) is located on one side of the tape conveying path, and a spring (10) is provided below the support plate (9). The blade (8) is located between the support plate (9) and the take-up and release shafts (7).

10. The electronic chip processing equipment according to claim 9, characterized in that: Each of the two adhesive mechanisms includes a support platform (2) that can be vertically extended and vertically translated. The support platform (2) moves to the support plate (9) via a slide table and presses the support plate (9) to make the blade (8) cut the tape. The top plate of the support platform (2) is a suction cup surface. The cut tape is transferred between adjacent electrical chip units for adhesive bonding by negative pressure adsorption.

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