Lead assembly jig and assembly method for electronic components

Abstract

The application discloses a wire assembling tool and assembling method for electronic components, the wire assembling tool comprises a wire guide component, at least one fixing part is arranged on one side surface of the wire guide component, the connecting end of at least one wire is positioned on the corresponding fixing part, and the one side surface of the wire guide component is arranged towards the electronic component during use, each connecting end is connected together in alignment with the corresponding assembling end on the electronic component and is separated from the wire guide component, each wire is electrically connected with the electronic component, compared with a traditional manual alignment assembling mode, the wire connecting end can be greatly reduced in deviation, misalignment, deflection and the like, the alignment precision and assembling consistency of the wire and the electronic component are greatly improved, the defect occurrence rate of wrong connection, virtual connection and poor contact is reduced, and stable electrical connection of the electronic component is ensured.

Description

Technical Field

[0001] This invention relates to the field of electronic component manufacturing technology, and in particular to a wire assembly fixture and assembly method for electronic components. Background Technology

[0002] In the field of electronic component manufacturing, the precise assembly of wires and electronic components ensures the electrical performance and operational stability of electronic products. Currently, most wire assembly operations for electronic components in the industry are completed manually or using simple auxiliary fixtures.

[0003] In existing conventional assembly processes, operators first hold the wire to be assembled and, relying on visual observation and operational experience, align the wire terminals with the pre-set connection points of the electronic components. Then, they complete the fixed connection between the wire and the electronic component through methods such as welding and crimping. Some simple assembly fixtures have basic wire clamping functions, but they can only fix the main body of the wire and cannot accurately position or limit the terminals.

[0004] Therefore, existing traditional assembly methods have significant technical defects. Due to the lack of precise positioning and guiding structures, the placement of wire terminals relies entirely on manual operation, which easily leads to problems such as offset, misalignment, and skewness, making it difficult to ensure precise alignment between the wire terminals and the electronic components. This is especially true for small and micro precision electronic components, whose assembly end spacing is small and dimensional accuracy is high. The error of manual visual alignment is further amplified, making it very easy for assembly defects such as alignment deviation, connection misalignment, and overlapping misalignment to occur.

[0005] For example, in the assembly of wires for electronic components on the elastomer of a six-dimensional force sensor, the electronic components need to be attached to the narrow and easily obscured surface of the strain beam. The limited space for manual wire welding and the obstructed viewing angle greatly increase the difficulty of manual wire welding. Moreover, such narrow scenarios cannot be adapted to automated wire welding equipment.

[0006] In fact, inaccurate assembly alignment not only directly leads to poor contact, loose connections, and incorrect connections between wires and electronic components, causing abnormal circuit conduction, affecting the conductivity and signal transmission accuracy of electronic components, and significantly reducing product yield, but also makes misaligned wires prone to detachment, short circuits, and open circuits during equipment use, seriously affecting the normal use of electronic components and the entire equipment, and shortening product lifespan. Summary of the Invention

[0007] The purpose of this invention is to solve the problem in the prior art where the terminals of wires cannot be accurately positioned and constrained when assembling electronic components. This easily leads to problems such as offset, misalignment, and skewness, making it difficult to ensure precise alignment between the wire terminals and the electronic component connection. This is especially true for small and micro-precision electronic components, whose assembly end spacing is small and dimensional accuracy is high, further amplifying the error of manual visual alignment and easily resulting in technical problems such as alignment deviation, connection offset, and overlapping misalignment.

[0008] To solve the above-mentioned technical problems, embodiments of the present invention disclose a wire assembly fixture for electronic components, including a wire guiding component, one side surface of the wire guiding component is provided with at least one fixing part, and at least one wire connection end is positioned in a corresponding fixing part, wherein each fixing part is located at a preset position on the wire guiding component.

[0009] Furthermore, one side surface of the wire guiding component is positioned facing the electronic component, and each connection end is aligned and connected to the corresponding mounting end on the electronic component, while being detached from the wire guiding component, and each wire is electrically connected to the electronic component.

[0010] By adopting the above technical solution, a fixing part can be set at a preset position on the wire guide component to achieve positioning and limiting constraints on the wire connection end. Compared with the traditional manual alignment assembly method, this can greatly reduce problems such as wire connection end offset, misalignment, and skewness. Furthermore, this guide component precisely matches the assembly end position of the electronic component, ensuring high-precision alignment between the wire connection end and the assembly end. This effectively solves the technical problems of large alignment errors and poor assembly caused by the small spacing and high precision of the assembly ends of micro and small precision electronic components. It significantly improves the alignment accuracy and assembly consistency of the wire and electronic component assembly, reduces the incidence of defects such as misconnection, loose connection, and poor contact, and ensures stable electrical connection of electronic components. This wire assembly fixture is particularly suitable for electronic components located in confined installation spaces or concealed structures in devices such as multi-dimensional force sensors, effectively solving the problems of difficult terminal positioning, insufficient manual operation space, and high wire assembly difficulty under such special working conditions.

[0011] Furthermore, this wire guiding component can simultaneously assemble and position multiple wires, significantly improving assembly efficiency. After the wires are assembled with the electronic components, they detach from the wire guiding component, preventing obstruction, compression, or interference with the connection structure. This minimizes the impact of residual stress from the assembly fixtures on the deformation of the precision electronic component assembly structure, ensuring the structural stability of the product during long-term use.

[0012] The present invention also discloses a wire assembly fixture for electronic components, wherein the wire guiding component is provided with a receiving portion communicating with each fixing portion, and the receiving portion contains a connector.

[0013] In this configuration, one side surface of the wire guiding component faces the electronic component, each connecting end is aligned and abuts against the corresponding mounting end, and the adhesive in the receiving part connects each connecting end and the corresponding mounting end together.

[0014] By adopting the above technical solution, and by setting up a receiving part that communicates with the fixing part and containing a bonding agent, the connection between the connection end and the assembly end can be solidified through the bonding agent in the receiving part while ensuring precise alignment of the wire connection end. This eliminates the need for additional manual application of bonding medium and simplifies the assembly process. The receiving part set on the wire guiding component can ensure that the amount of bonding agent used at each connection point is uniform and consistent during multiple connection processes, ensuring the firmness of the connection between the wire and the electronic component each time and avoiding problems such as loosening or falling off of the wire after assembly.

[0015] Meanwhile, the connecting structure between the receiving part and the fixing part can realize the directional filling of the adhesive, accurately covering the mating gap between the wire connection end and the assembly end. Compared with traditional manual gluing or welding, it greatly reduces the problems of overflowing adhesive, poor welding and missing welding, and improves the insulation and sealing of the connection point.

[0016] Furthermore, by pre-installing the wires on the wire guide component and filling the housing with a bonding agent, the subsequent wire connection process can be simplified, thereby simplifying the structure of the wire assembly equipment.

[0017] Embodiments of the present invention also disclose a wire assembly fixture for electronic components, wherein the connector is made of a hot-melt material.

[0018] Furthermore, it also includes a heating element that heats the housing portion of the wire guiding element, causing the adhesive in the housing portion to melt and flow to a preset position.

[0019] Using the above technical solution, the hot-melt adhesive can be stably pre-placed and housed inside the receiving part at room temperature and under normal conditions, without flowing, leaking, or shifting, and will not interfere with the wire positioning function of the fixing part, thus ensuring the precise positioning accuracy of the wire connection end throughout the process. Only after the heating component applies preset heat can the hot-melt adhesive be heated and melted, and under the structural guidance of the receiving part, it flows precisely to the preset assembly position. After cooling and solidification, the solidification connection between the wire connection end and the corresponding assembly end of the electronic component is completed.

[0020] Meanwhile, the molten adhesive can fully fill the tiny gaps between the wire connection end and the assembly end, greatly improving the tightness of the connection and the stability of the electrical connection.

[0021] The present invention also discloses a wire assembly fixture for electronic components, wherein a wire guiding component is provided with a plurality of receiving portions, each receiving portion being disposed on the wire guiding component and communicating with a corresponding preset position.

[0022] Furthermore, the heating element heats each containment section, and the binder in each containment section melts and flows to the corresponding preset position.

[0023] By adopting the above technical solution, by setting independent receiving parts at each preset assembly position of the wire guide component, independent material supply and independent heating and curing of multiple sets of wire connection points can be realized, ensuring that the connection dosage, melting degree and curing effect of each connection point are uniform and consistent, avoiding the problems of insufficient local connection and uneven curing during multi-channel assembly, and adapting to the assembly needs of precision electronic components with multiple assembly ends.

[0024] The embodiments of the present invention also disclose a wire assembly fixture for electronic components, wherein the wire guiding component is configured as a plate-shaped structure, and each fixing part is located at a preset position on one side surface of the wire guiding component in the thickness direction.

[0025] Furthermore, the electronic component has a sheet-like structure and includes multiple mounting ends, with at least one mounting end located on one side surface of the electronic component.

[0026] The above technical solution provides a flat and uniformly rigid plate-shaped wire guide component, ensuring that all fixing parts are on the same assembly plane. This matches the planar assembly structure of chip electronic components, enabling precise multi-point fitting and alignment, and meeting the flattened assembly requirements of chip microelectronic components. Furthermore, the plate-shaped structure has no protruding irregularities, resulting in uniform overall stress distribution. This prevents squeezing, scratching, or deformation damage to the thin walls and delicate surface layers of the chip electronic components during assembly.

[0027] The present invention also discloses a wire assembly fixture for electronic components, wherein each receiving portion is configured as a recess extending along the thickness direction of the wire guiding component at a predetermined position on one side surface of the wire guiding component, and the connector is received within the receiving portion.

[0028] Furthermore, the opening end of each receiving part serves as a fixing part, and the connection end of the wire is positioned at the opening end of the corresponding receiving part.

[0029] Using the above technical solution, the recess extending along the thickness direction serves as the receiving part, and the open end serves as the fixing part. Under the premise of ensuring stable reception of the binder and preventing the binder from being exposed, it ensures that the melted binder can accurately flow to the fixing part.

[0030] The present invention also discloses a wire assembly fixture for electronic components, wherein each receiving portion is configured as a through hole opened at a predetermined position on one side surface of the wire guiding component and extending along the thickness direction of the wire guiding component, and the connector is received at the other end of the through hole away from the electronic component.

[0031] Furthermore, the opening end of each housing section near the electronic component serves as a fixing part, and the connection end of the wire is positioned at the opening end of the corresponding housing section.

[0032] By adopting the above technical solution, a through hole extending along the thickness direction is used as a receiving part, one end of the through hole is used as a fixing part to position the end of the wire, and the connector is pre-placed at the other end of the through hole away from the electronic component. This can achieve precise alignment of the wire, and the connector can flow and fill the assembly end in a directional manner, avoiding adhesion or contamination that may be caused by the connector contacting the electronic component in advance, and ensuring the cleanliness of the assembly end face of the electronic component.

[0033] Meanwhile, through holes can guide the molten binder, improving the uniformity of filling.

[0034] The present invention also discloses a wire assembly fixture for electronic components, wherein the diameter of each through hole gradually increases from the opening end near the electronic component toward the other end away from the electronic component.

[0035] By adopting the above technical solution, the diameter of the through hole gradually increases from one end to the other, which can provide a smooth flow channel for the molten binder after heating. This allows the binder to flow evenly to the joint gap between the wire and the electronic component under pressure and fluidity, ensuring full filling without gaps and improving the connection strength and conductivity.

[0036] Meanwhile, the gradient pore size structure allows for slow filling of the binder, avoiding overflow and piling issues that might occur with rapid flow of the binder in equal pore size structures, thus precisely controlling the filling amount. Additionally, the larger pore size at the other end can accommodate more pre-placed binder, adapting to assembly scenarios with different thicknesses and gaps, and improving the versatility of assembly tooling.

[0037] The present invention also discloses a wire assembly fixture for electronic components, wherein each fixing part is located on one side surface of the wire guiding component and at one end near the electronic component.

[0038] Furthermore, the heating element is located at the end of the wire guiding element near the electronic component.

[0039] With the above technical solution, both the fixing part and the heating part are located at the end of the guiding part close to the electronic component. The heating part can concentrate heat to heat the binder in the housing part, reduce heat loss, quickly melt the binder at the corresponding position, improve curing efficiency, and ensure the connection effect between the wire connection end and the corresponding assembly end.

[0040] Furthermore, this heating method prevents heat from spreading extensively to the main body of the wire-guided component, protecting the main structure of the assembly fixture and non-assembly areas of electronic components, and preventing high-temperature aging of the assembly fixture or damage to precision components. Simultaneously, close-range heating enables precise temperature control, making it suitable for assembling heat-sensitive precision electronic components.

[0041] The present invention also discloses a wire assembly fixture for electronic components, wherein each fixing part is located on one side surface of the wire guiding member, and a heating member heats the receiving part from the other side of the wire guiding member.

[0042] Using the above technical solution, the heating component heats the receiving part from the back side of the wire guide component, which can realize non-contact front assembly and back side heating operation. There is no heating structure interference in the front assembly area, so it will not interfere with the wire alignment and bonding assembly steps.

[0043] The present invention also discloses a wire assembly fixture for electronic components, wherein a wire guiding component and a heating component are stacked.

[0044] Each receiving portion is located at a predetermined position on one side surface of the wire guiding component. Furthermore, the heating component has a plate-like structure and is attached to the other side surface of the wire guiding component in the thickness direction.

[0045] By adopting the above technical solution, the plate-shaped heating component and the wire guiding component are laminated together, which can achieve uniform heat conduction, ensure that the heating temperature of each housing part is consistent, avoid the difference in curing speed and connection effect caused by single-point temperature difference, and improve the consistency of multi-point assembly.

[0046] Furthermore, the laminated structure has no thermally conductive gaps, resulting in high heat transfer efficiency and low energy consumption, enabling rapid and uniform heating and curing. Simultaneously, the laminated structure boasts strong overall integrity and higher rigidity, enhancing the overall structural stability of the tooling assembly, reducing alignment deviations caused by tooling deformation during assembly, and further improving assembly accuracy.

[0047] The present invention also discloses a wire assembly fixture for electronic components, wherein each receiving portion is configured as a through hole extending along the thickness direction at a predetermined position on one side surface of the wire guiding component.

[0048] Furthermore, the heating element heats the adhesive inside the through-hole from the end away from the electronic component.

[0049] By adopting the above technical solution, directional heating from the back side away from the electronic component through the hole can realize the gradual melting and flow of the connector from the far end to the near end, accurately guide the connection gap between the wire and the electronic component, ensure that the connector fills in an orderly manner without residual air bubbles, and improve the tightness of the connection.

[0050] Furthermore, this heating method avoids defects such as bubbles and voids caused by localized rapid heating and boiling of the binder, ensuring the conductivity stability of the electrical connection. Simultaneously, back-side directional heating allows for precise control of the heating range, acting only on the pre-placed binder area, maximizing the protection of the delicate structure of electronic components from temperature effects.

[0051] The present invention also discloses a wire assembly fixture for electronic components, wherein the diameter of each through hole gradually increases from the opening end near the electronic component toward the other end away from the electronic component.

[0052] Furthermore, the connector in each containment section is pre-placed at the end of the through-hole away from the electronic component.

[0053] Using the above technical solution, the heating component is heated from the back side away from the electronic component through the through hole. The flow guiding advantage of the gradually changing hole structure allows the binder to fill the assembly gap at a uniform speed, which is suitable for high-precision sealing and conductive connection requirements.

[0054] Embodiments of the present invention also disclose a wire assembly fixture for electronic components, wherein the wire body is positioned on one side surface of a wire guiding component in a predetermined extension direction.

[0055] By adopting the above technical solution, the extension direction of the conductor is preset and positioned, which not only fixes the position of the conductor end, but also constrains the overall routing posture of the conductor, avoids conductor twisting, skewing, and stacking, ensures that multiple conductors are arranged in a neat manner, and prevents conductors from interfering with each other and short-circuiting.

[0056] The present invention also discloses a wire assembly fixture for electronic components. A protective part is provided on one side surface of the wire guiding component at the outer periphery of each fixing part and the corresponding assembled wire to protect each fixing part, the connecting end located in each fixing part and the corresponding wire.

[0057] By adopting the above technical solution, the protective part can protect the wire guide component from easily coming into contact with other items during transportation or operation, ensure that the corresponding connection end in the fixing part does not shift, and ensure that the wire can be stably mounted on the wire guide component in a predetermined extension direction, thereby reducing the risk of the wire falling off the wire guide component.

[0058] Furthermore, when the protective unit is aligned with the corresponding position of the electronic component, it can be held in place on the outer peripheral wall of the electronic component during wire assembly. This reduces the risk of tooling misalignment or displacement during assembly, ensuring stable alignment accuracy throughout the process and avoiding alignment deviations caused by manual operation. In other words, the protective unit can also achieve precise positioning of the tooling and electronic component, making it compatible with automated and semi-automated batch assembly equipment and improving the adaptability and versatility of the assembly tooling. Simultaneously, it can compensate for external force vibration errors during assembly.

[0059] Embodiments of the present invention also disclose a method for assembling wires for electronic components. The assembly method utilizes any of the above-described wire assembly fixtures for electronic components, including:

[0060] At least one wire is positioned on a wire guiding member, wherein the connecting end of each wire is fixed at a predetermined position on one side surface of the wire guiding member.

[0061] Move the wire guide component so that one side surface of the wire guide component faces the electronic component, and the connection end of each wire is aligned and in contact with the corresponding mounting end on the electronic component.

[0062] Use a connector to connect the ends of each wire to the corresponding assembly ends.

[0063] Move the wire guide component so that each wire is detached from the wire guide component and electrically connected to the electronic component.

[0064] By employing the above technical solution, this wire assembly method involves several steps: positioning the wire using a wire guide component, precise alignment, connection and curing, and detachment from the assembly fixture. This results in a simple and compact wire assembly process. Compared to traditional assembly methods, which may suffer from high randomness, poor precision, and low yield, this method significantly improves assembly efficiency and product consistency. Furthermore, this wire assembly method allows for the repeated use of tooling, reducing production material costs.

[0065] Embodiments of the present invention also disclose a method for assembling wires for electronic components, which further includes the following steps after positioning at least one wire in a wire guiding component and before moving the wire guiding component:

[0066] The first position is the location of the connection end of each wire on the acquisition wire guide component, and the second position is the location of each assembly end on the acquisition electronic component.

[0067] Furthermore, when moving the wire guide component, the first position on the wire guide component moves toward the corresponding second position on the electronic component.

[0068] By adopting the above technical solution, the movement path of the wire guide component can be accurately planned by pre-collecting the first and second positions, ensuring that the first position on the wire guide component and the corresponding second position on the electronic component are aligned after movement, which is beneficial to the accurate installation of the connection end of the wire and the corresponding assembly end on the electronic component.

[0069] The present invention also discloses a method for assembling wires for electronic components, wherein a connector is disposed in a corresponding receiving portion before the connecting end of each wire is positioned in a fixed portion at a preset position on a wire guiding component, or after the connecting end of each wire is aligned and contacted with the corresponding assembly end on the electronic component.

[0070] And / or, after aligning the connection ends of each wire with the corresponding mounting ends on the electronic component, use a connector to connect the connection ends to the corresponding mounting ends.

[0071] Using the above technical solution, this wire assembly method can select two operation modes, namely pre-filler and post-filler alignment, according to the needs, to flexibly adapt to the production process, ensure reliable curing effect, and avoid problems such as overheating damage to components and underheating incomplete curing.

[0072] Of course, a connector can also be pre-applied to the surface of the assembly end of the electronic component. After the connection end of the wire is aligned and in contact with the corresponding assembly end on the electronic component, the wire can be connected by the connector, which can simplify the structure of the wire guiding component.

[0073] In existing technologies, conventional wire bonding processes are only suitable for open assembly scenarios with ample height and no obstructions above the assembly surface. For enclosed and confined assembly scenarios with limited space above the welding surface and structural obstructions, automated wire bonding operations are completely impossible. However, the wire assembly method in this embodiment, through wire-guided tooling for aligning the connection end and assembly end, followed by heating, curing, and detachment, is not limited by the assembly space or structural obstructions above electronic components. This fills the technological gap in automated welding of precision leads in confined and obstructed spaces, and represents a significant technological difference from traditional wire bonding processes.

[0074] The present invention also discloses a wire assembly method for electronic components. When connecting the connecting end to the corresponding assembly end using a connector, the connector in each receiving part is heated at a predetermined temperature and for a predetermined time, so that the connector melts and enters the area where each connecting end and the corresponding assembly end are aligned and contacted, and then cools and solidifies.

[0075] By adopting the above technical solution, precise heating and curing at a predetermined temperature and time can adapt to the assembly requirements of different production conditions and different binder properties, ensuring that the binder after cooling and curing can connect the connection end of the wire to the corresponding assembly end on the electronic component.

[0076] Embodiments of the present invention also disclose a method for assembling wires for electronic components, wherein positioning at least one wire on a wire guiding member further includes positioning each wire on one side surface of the wire guiding member in a predetermined extension direction.

[0077] By adopting the above technical solution, the extension direction of the conductor can be determined, and the positioning constraint can be achieved from the posture of the conductor, thereby reducing various offset errors in the assembly process and greatly ensuring the assembly accuracy.

[0078] The present invention also discloses a method for assembling wires for electronic components, the electronic components including strain gauges disposed on the strain beam of an elastic body of a multidimensional force sensor.

[0079] In this process, after the strain gauge is fixed to a predetermined position on the strain beam, the position of each assembly end on the strain gauge is collected.

[0080] Furthermore, positioning at least one wire in the wire guiding member also includes positioning the wire body of each wire on one side surface of the wire guiding member according to a predetermined extension direction. Moreover, when the wire guiding member is moved such that each wire detaches from the wire guiding member, the wire guiding member is disengaged from the wire body, connecting end, and assembly end of each wire.

[0081] Using the above technical solution, this wire assembly method is used for the assembly of strain gauge wires in the elastic strain beam of a multidimensional force sensor. It can achieve high-precision, non-destructive assembly of strain gauge wires, ensure stable electrical connection between the strain gauge and the wire, and guarantee accurate sensor signal transmission.

[0082] Furthermore, strain gauges are ultra-high precision sensing elements, which are extremely sensitive to assembly stress, temperature damage, and alignment deviation. This wire assembly method can greatly avoid sensor zero-point drift and sensitivity deviation caused by assembly deformation and high-temperature damage, significantly improve the measurement accuracy, repeatability, and long-term stability of multi-dimensional force sensors, and extend the service life of precision sensing equipment.

[0083] The beneficial effects of this invention are as follows:

[0084] This invention discloses a wire assembly fixture for electronic components, including a wire guiding component. One side surface of the wire guiding component has at least one fixing part, and at least one wire connection end is positioned at the corresponding fixing part. During use, one side surface of the wire guiding component faces the electronic component, and each connection end is aligned and connected to the corresponding assembly end on the electronic component, while simultaneously disengaging from the wire guiding component. Each wire is electrically connected to the electronic component. Compared to traditional manual alignment assembly methods, this significantly reduces problems such as wire connection end offset, misalignment, and skewness, greatly improving the alignment accuracy and consistency of the wire and electronic component assembly, reducing the incidence of defects such as misconnections, loose connections, and poor contact, and ensuring stable electrical connection of the electronic component. This wire assembly fixture is particularly suitable for electronic components located in confined installation spaces or concealed structures in devices such as multi-dimensional force sensors, effectively solving the problems of difficult terminal positioning, insufficient manual operation space, and high wire assembly difficulty under such special working conditions. Attached Figure Description

[0085] Figure 1 This is a three-dimensional structural schematic diagram of the wire guiding component of the wire assembly fixture for electronic components provided in Embodiment 1 of the present invention;

[0086] Figure 2 for Figure 1 A partial cross-sectional schematic diagram of the middle section located between the fixing part and the receiving part;

[0087] Figure 3 This is a three-dimensional structural schematic diagram of a second type of wire guiding component for a wire assembly fixture for electronic components provided in Embodiment 1 of the present invention;

[0088] Figure 4 This is a three-dimensional structural schematic diagram of a third type of wire guiding component for a wire assembly fixture for electronic components provided in Embodiment 1 of the present invention;

[0089] Figure 5 for Figure 4 A partial cross-sectional schematic diagram of the middle section located between the fixing part and the receiving part;

[0090] Figure 6 This is a three-dimensional structural schematic diagram of the fourth type of wire guiding component for wire assembly tooling of electronic components provided in Embodiment 1 of the present invention;

[0091] Figure 7 This is a three-dimensional structural schematic diagram of the fifth type of wire guiding component of the wire assembly fixture for electronic components provided in Embodiment 1 of the present invention;

[0092] Figure 8 This is a schematic diagram of the assembly of the wire assembly fixture for electronic components and the strain gauge of the strain beam on the multidimensional force sensor provided in Embodiment 1 of the present invention.

[0093] Figure 9 This is another assembly diagram of the wire assembly fixture for electronic components and the strain gauge of the strain beam on the multidimensional force sensor provided in Embodiment 1 of the present invention.

[0094] Figure 10 for Figure 9 A partial cross-sectional schematic diagram of the center conductor guide component, strain beam, and strain gauge;

[0095] Figure 11 This is a flowchart of a wire assembly method for electronic components provided in Embodiment 2 of the present invention.

[0096] Explanation of reference numerals in the attached figures:

[0097] 100. Wire guiding components;

[0098] 110. Fixing part;

[0099] 120. Receiving section; 121. Recess; 122. Through hole;

[0100] 130. Heating components;

[0101] 141. Mounting slot; 142. Mounting hole;

[0102] 150. Protective part; 151. Protective protrusion;

[0103] 200, strain gauge; 300, elastic body; 310, strain beam;

[0104] Z, thickness direction. Detailed Implementation

[0105] As mentioned in the background section, existing technologies cannot accurately position and constrain the terminals of wires when assembling electronic components. This easily leads to problems such as misalignment, displacement, and skewness, making it difficult to ensure precise alignment between the wire terminals and the connection points of the electronic components.

[0106] To address this, the present invention provides a wire assembly fixture for electronic components. By providing a fixing part on one side surface of the wire guiding component, the connection end of the wire is positioned in the corresponding fixing part, and the connection end of the wire is guided to align and connect with the corresponding assembly end on the electronic component, thereby greatly reducing problems such as offset, misalignment, and skewness of the wire connection end.

[0107] To make the objectives, technical solutions, and advantages of the present invention clearer, the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0108] Example 1:

[0109] This embodiment discloses a wire assembly fixture for electronic components. The electronic components may be strain gauges, precision chip resistors, miniature chip capacitors, chip inductors, Hall effect sensors, temperature sensing chips, miniature crystal oscillators, precision photodiodes, etc. This embodiment does not limit them to a single type.

[0110] like Figure 1 As shown, this wire assembly fixture includes a wire guiding component 100, and at least one fixing part 110 is provided on one side surface of the wire guiding component 100. At least one wire connection end is positioned in the corresponding fixing part 110, wherein each fixing part 110 is located at a preset position on the wire guiding component 100.

[0111] It should be noted that the wire guiding component 100 can be configured as a plate-shaped, rod-shaped, or roller-shaped structure. When the wire guiding component 100 is configured as a plate-shaped or rod-shaped structure, it can approach the electronic component by translation or rotation. When the wire guiding component 100 is configured as a roller-shaped structure, it can approach the electronic component by rotation combined with translation; or by rotation, the fixing part 110 at a preset position on the wire guiding component 100 can approach the electronic component.

[0112] Depending on the specific number of wires to be assembled, one, two, three, or other numbers of fixing parts 110 can be provided on one side surface of the wire guide component 100. Taking the assembly of two wires as an example, two fixing parts 110 are provided at intervals on one side surface of the wire guide component 100.

[0113] During use, one side surface of the wire guiding component 100 faces the electronic component. Each connecting end is aligned and connected to the corresponding mounting end on the electronic component, and is detached from the wire guiding component 100. Each wire is electrically connected to the electronic component. The wire connecting end and the corresponding mounting end on the electronic component can be connected by welding, pressing, or conductive adhesive. When welding, auxiliary welding agent needs to be pre-placed at the corresponding position of the fixing part 110 of the wire guiding component 100, or welding agent can be pre-placed on the mounting end of the electronic component. The same applies to conductive adhesive. When pressing, the connecting end and the corresponding mounting end on the electronic component need to be aligned and then pressed together. This embodiment does not specifically limit this.

[0114] This assembly fixture, by setting a fixing part 110 at a preset position on the wire guide component 100, can achieve positioning and limiting constraints on the wire connection end. Compared with the traditional manual alignment assembly method, it can greatly reduce problems such as wire connection end offset, misalignment, and skewness. Furthermore, this guide component precisely matches the assembly end position of the electronic component, ensuring high-precision alignment between the wire connection end and the assembly end. This effectively solves the technical problems of large alignment errors and poor assembly caused by the small spacing and high precision of the assembly ends of micro and small precision electronic components. It significantly improves the alignment accuracy and assembly consistency of wire and electronic component assembly, reduces the incidence of defects such as misconnection, loose connection, and poor contact, and ensures stable electrical connection of electronic components. This wire assembly fixture is particularly suitable for electronic components located in confined installation spaces or concealed structures in devices such as multi-dimensional force sensors, effectively solving the problems of difficult terminal positioning, insufficient manual operation space, and high wire assembly difficulty under such special working conditions.

[0115] Furthermore, this wire guiding component 100 can simultaneously assemble and position multiple wires, significantly improving assembly efficiency. Simultaneously, after the wires are assembled with the electronic components, each wire detaches from the wire guiding component 100, preventing obstruction, compression, or interference with the connection structure between the wires and electronic components. This minimizes the impact of residual stress from the assembly fixtures on the deformation of the precision electronic component assembly structure, ensuring the structural stability of the product during long-term use.

[0116] Furthermore, by pre-installing the wires on the wire guide component 100 and filling the receiving part 120 with a bonding agent, the subsequent wire connection process can be simplified, thereby simplifying the structure of the wire assembly equipment.

[0117] Furthermore, such as Figure 1 As shown, in this embodiment, the wire guiding component 100 is also provided with a receiving portion 120 that communicates with each fixing portion 110. The receiving portion 120 contains a connector. It should be noted that the receiving portion 120 may be communicated with multiple fixing portions 110, or multiple receiving portions 120 may be provided, each corresponding to and communicating with multiple fixing portions 110. This embodiment does not limit this to a single type.

[0118] In this configuration, one side surface of the wire guiding component 100 faces the electronic component, each connecting end is aligned and abuts against the corresponding mounting end, and the adhesive in the receiving part 120 connects each connecting end to the corresponding mounting end together.

[0119] At this point, while ensuring precise alignment of the wire connection ends, the bonding agent within the housing 120 can achieve a solidified connection between the connection ends and the assembly ends, eliminating the need for additional manual application or placement of the bonding medium and simplifying the assembly process. The housing 120, located on the wire guide component 100, ensures that the amount of bonding agent applied to each connection point is uniform and consistent during multiple connection processes, guaranteeing the firmness of the connection between the wire and the electronic component each time and preventing the wire from loosening or falling off after assembly.

[0120] Meanwhile, the connection structure between the receiving part 120 and the fixing part 110 enables the directional filling of the adhesive, accurately covering the mating gap between the wire connection end and the assembly end. Compared with traditional manual gluing or welding, this greatly reduces the problems of overflowing adhesive, poor welding, and missing welding, and improves the insulation and sealing of the connection point.

[0121] It should be noted that the molten binder in the receiving part 120 can flow toward the fixing part 110 under the action of gravity, or it can flow toward the fixing part 110 by being blown by airflow, or it can flow toward the fixing part 110 under the action of swinging inertia by the swinging guide wire. This embodiment does not limit this to a single one.

[0122] Specifically, the connector is made of a hot-melt material. For example, when the wire connection end is soldered to the assembly end of the corresponding electronic component, the connector can be a hot-melt flux connector. This type of material is mainly based on tin-based hot-melt flux, and is solid paste, block, or granular at room temperature. It can be stably pre-placed in the receiving part 120, has no self-flowing property, and does not interfere with the wire positioning. After being heated by the heating element 130, it melts and liquefies, and flows to the docking position under the guidance of the receiving part 120 to achieve a precise solder connection. Specifically, it can be low-temperature solid solder paste, solid pre-formed solder sheet / solder particles, or hot-melt flux composite solder, etc. The solder paste is a solid hot melt solder paste using a low-temperature tin-bismuth and tin-silver-copper alloy system. It is dried and cured at room temperature and can be stably stored in the housing 120. It can be melted and wetted by heating to a preset low temperature range. It is suitable for soldering electronic components that are not resistant to high temperatures, such as strain gauges and precision sensing elements, to avoid high-temperature heat damage. The solid pre-formed solder sheet includes a micro-sheet structure, and the solder particles include spherical solid solder medium. It can be pre-placed at the far end of the housing 120 of the through hole 122. After heating, it melts and fills the gap between the wire and the assembly end, resulting in uniform solder joints. It is suitable for multi-point, high-precision micro-connection end soldering.

[0123] It should be noted that after soldering is completed and the connector (e.g., solder paste) connects the wires to the electronic component assembly terminals, the wire guide component 100 must not be connected to any part of the connector, the wires, or the electronic component assembly terminals. Therefore, the material of the wire guide component 100 should be a material with low adhesion to the connector (solder paste), such as titanium alloy or aluminum alloy. Alternatively, a plating or protective coating can be applied to the surface of the wire guide component 100 that contacts the connector, the wires, and the electronic components; this embodiment does not specifically limit this.

[0124] Of course, when the wire connection end and the corresponding electronic component assembly end are bonded with adhesive, the connector can be a hot melt conductive adhesive. This type of material is a polymer composite material that combines hot melt bonding performance and conductivity. It has no risk of high-temperature welding and forms a flexible connection structure after curing. It is suitable for wire connections of precision, shockproof, and heat-sensitive electronic components. Specifically, it can be silver-based hot melt conductive adhesive, copper-based low-temperature hot melt conductive adhesive, etc. Silver-based hot melt conductive adhesive is a hot melt conductive adhesive with high-purity silver powder as conductive filler and hot melt resin as matrix. It is solidified at room temperature, melts when heated and flows to fill the gap between the joints. After cooling and curing, it has excellent conductivity and stable impedance, making it suitable for high-precision signal transmission scenarios such as strain gauges and precision sensors. Copper-based low-temperature hot melt conductive adhesive is a low-cost hot melt conductive adhesive with copper powder modified filler. It has good conductivity, high bonding strength and strong oxidation resistance, making it suitable for mass assembly production of conventional precision electronic components.

[0125] And, as Figure 1As shown, in order to facilitate the melting of the binder, this assembly tooling also includes a heating element 130, which heats the receiving portion 120 of the wire guiding component 100, and the binder in the receiving portion 120 melts and flows to a preset position.

[0126] In this embodiment, the hot-melt adhesive can be stably pre-placed and housed inside the receiving part 120 at room temperature without flowing, leaking, or shifting, and will not interfere with the wire positioning function of the fixing part 110, thus ensuring the precise positioning accuracy of the wire connection end throughout the process. Only after the heating component 130 applies preset heat can the hot-melt adhesive be heated and melted, and under the structural guidance of the receiving part 120, it flows precisely to the preset assembly position. After cooling and solidification, the solidification connection between the wire connection end and the corresponding assembly end of the electronic component is completed.

[0127] Meanwhile, the molten adhesive can fully fill the tiny gaps between the wire connection end and the assembly end, greatly improving the tightness of the connection and the stability of the electrical connection.

[0128] It should be noted that, as Figure 1 As shown, in this embodiment, the wire guiding component 100 is provided with a plurality of receiving portions 120, and the plurality of receiving portions 120 correspond one-to-one with a plurality of fixing portions 110. Each receiving portion 120 is disposed on the wire guiding component 100 and communicates with a corresponding preset position.

[0129] Furthermore, the heating element 130 heats each receiving portion 120, and the binder in each receiving portion 120 melts and flows to the corresponding preset position.

[0130] In this example, by setting independent receiving parts 120 at each preset assembly position corresponding to the wire guiding component 100, independent material supply and independent heating and curing of multiple sets of wire connection points can be realized, ensuring that the connection dosage, melting degree and curing effect of each connection point are uniform and consistent, avoiding the problem of insufficient local connection and uneven curing during multi-channel assembly, and adapting to the assembly needs of precision electronic components with multiple assembly ends.

[0131] The following describes the specific structure of the housing 120 in detail, taking the wire guiding component 100 as an example of a plate-shaped structure.

[0132] In this embodiment, a pair of fixing portions 110 and a pair of receiving portions 120 are provided on the wire guiding member 100, and each fixing portion 110 is located at a preset position on one side surface of the wire guiding member 100 in the thickness direction Z.

[0133] Furthermore, the electronic component has a sheet-like structure and includes a pair of mounting ends, which are located on one side surface of the electronic component. Alternatively, the electronic component may have only one mounting end located on one side surface, and the wire guiding component 100 may only mount wires to that mounting end. Of course, the electronic component may also be configured as a columnar or spherical structure; this embodiment does not specifically limit this.

[0134] In this embodiment, the plate-shaped wire guide component 100 has a flat and uniformly rigid structure, providing a flat positioning reference surface to ensure that all fixing parts 110 are on the same assembly plane. This matches the planar assembly structure of the chip electronic component, achieving precise fitting and alignment at multiple points on the plane, and adapting to the flattened assembly requirements of chip microelectronic components. At the same time, the plate-shaped structure has no protruding irregular structures, and the overall force is uniform, preventing squeezing, scratching, or deformation damage to the thin-walled and precision surface structure of the chip electronic component during assembly.

[0135] Furthermore, such as Figure 2 As shown, each receiving portion 120 is configured as a recess 121 that is opened at a preset position on one side surface of the wire guiding member 100 and extends along the thickness direction Z of the wire guiding member 100, and the adhesive is received in the receiving portion 120.

[0136] Furthermore, the opening end of each receiving part 120 serves as a fixing part 110, and the connection end of the wire is positioned at the opening end of the corresponding receiving part 120.

[0137] In this embodiment, the recess 121 extending along the thickness direction Z serves as the receiving portion 120, and the open end serves as the fixing portion 110. Under the premise of ensuring stable reception of the binder and preventing the binder from being exposed, it ensures that the melted binder can accurately flow to the fixing portion 110.

[0138] Of course, such as Figure 5 As shown, each receiving portion 120 may also be configured as a through hole 122 extending along the thickness direction Z of the wire guiding member 100 at a preset position on one side surface of the wire guiding member 100, with the adhesive being received at the other end of the through hole 122 away from the electronic component.

[0139] Furthermore, the opening end of each receiving part 120 near the electronic component serves as a fixing part 110, and the connection end of the wire is positioned at the opening end of the corresponding receiving part 120.

[0140] In this embodiment, a through hole 122 extending along the thickness direction Z is used as a receiving part 120. One end of the through hole 122 serves as a fixing part 110 to position the end of the wire. The adhesive is pre-placed at the other end of the through hole 122 away from the electronic component. This allows the adhesive to flow and fill the assembly end after the wire is accurately aligned, avoiding adhesion or contamination that may be caused by the adhesive contacting the electronic component in advance, and ensuring the cleanliness of the assembly end face of the electronic component.

[0141] Meanwhile, the through hole 122 can guide the molten binder and improve the uniformity of filling.

[0142] Furthermore, the diameter of each through hole 122 gradually increases from the opening end closest to the electronic component toward the other end furthest from the electronic component. This provides a smooth flow channel for the molten binder after heating, allowing the binder to flow evenly to the joint between the wire and the electronic component under pressure and fluidity, ensuring full filling without gaps, and improving the connection strength and conductivity.

[0143] Meanwhile, the gradient pore size structure allows for slow filling of the binder, avoiding overflow and piling issues that might occur with rapid flow of the binder in equal pore size structures, thus precisely controlling the filling amount. Additionally, the larger pore size at the other end can accommodate more pre-placed binder, adapting to assembly scenarios with different thicknesses and gaps, and improving the versatility of assembly tooling.

[0144] It should be noted that when the wire guiding component 100 is in use, its thickness direction Z is usually parallel to the vertical direction, and the side of the wire guiding component 100 closer to the electronic component is the lower surface, and the side away from the electronic component is the upper surface. Whether the receiving part 120 is set as a recess 121 or a through hole 122, the binder flows towards the preset position on the lower surface under the action of gravity after melting. Of course, the flow of the binder can also be assisted by the airflow blown out by the blowing structure. If the thickness direction Z of the wire guiding component 100 is not parallel to the vertical direction when in use, and the natural flow tendency of the binder is insufficient to flow to the preset position, then the blowing structure or other pushing structure must be set to assist the flow of the binder.

[0145] Furthermore, the plurality of receiving portions 120 on the wire guiding component 100 may partially adopt a recessed structure 121 and the remaining portions adopt a through-hole structure 122. For example, one of the two receiving portions 120 adopts a recessed structure 121 and the other receiving portion 120 adopts a through-hole structure 122. This embodiment does not limit this to a single structure.

[0146] The specific heating method for the binder is explained in detail below.

[0147] In this embodiment, as Figure 1 As shown, each fixing part 110 is located on one side surface of the wire guiding member 100, at the end near the electronic component.

[0148] It should be noted that, as Figure 1 As shown, the wire guiding component 100 can be configured as a flat plate structure, with one end extending parallel to the main body of the wire guiding component 100. Of course, as... Figure 6As shown, one end of the wire guide component 100 can also be bent and extended relative to the main body of the wire guide component 100 to adapt to wire assembly in different operating spaces. The bending angle of one end of the wire guide component 100 relative to the main body can be in the range of 30° to 75°. For example, the bending angle of one end of the wire guide component 100 relative to the main body is 30°, 45°, 50°, 75° or other angles within the above range. This embodiment does not limit this to a single angle.

[0149] Furthermore, the movement of the wire guiding component 100 can be achieved by a drive component driving a transmission component in conjunction. For example, the other end of the wire guiding component 100 can be connected to the transmission component, which can be achieved by using a robotic arm or a three-dimensional motion structure (see [link]). Figure 4 The movement of the wire guiding component 100 can also be achieved by hand by a worker; this embodiment does not limit this to a single method.

[0150] In this embodiment, the heating component 130 is disposed at the end of the wire guiding component 100 near the electronic component, and can be snapped, bonded or welded to the main body of the wire guiding component 100, specifically using a heating block or the like.

[0151] In this embodiment, as Figure 1 As shown, both the fixing part 110 and the heating part 130 are provided at the end of the guide part near the electronic component. Specifically, the fixing part 110 is located on the side surface of the heating part 130 near the electronic component. The heating part 130 can concentrate heat to heat the binder in the receiving part 120, reduce heat loss, quickly melt the binder at the corresponding position, improve curing efficiency, and ensure the connection effect between the wire connection end and the corresponding assembly end.

[0152] Furthermore, this heating method prevents heat from spreading extensively to the main body of the wire guiding component 100, protecting the main structure of the assembly fixture and the non-assembly areas of electronic components, and preventing high-temperature aging of the assembly fixture or damage to precision components. Simultaneously, close-range heating enables precise temperature control, making it suitable for assembling heat-sensitive precision electronic components.

[0153] In this embodiment, as Figure 3 As shown, each fixing part 110 may also be located on one side surface of the wire guiding member 100, and the heating member 130 heats the receiving part 120 from the other side of the wire guiding member 100, which can realize non-contact front assembly and back heating operation. There is no heating structure interference in the front assembly area, and it will not interfere with the wire alignment and bonding assembly steps.

[0154] Specifically, the wire guiding component 100 and the heating component 130 are stacked.

[0155] Each receiving portion 120 is located at a predetermined position on one side surface of the wire guiding member 100. Furthermore, the heating member 130 has a plate-like structure and is attached to the other side surface of the wire guiding member 100 in the thickness direction Z.

[0156] In this embodiment, the plate-shaped heating component 130 and the wire guiding component 100 are laminated together to achieve uniform heat conduction, ensure that the heating temperature of each receiving part 120 is consistent, avoid the uneven curing speed and connection effect caused by single-point temperature difference, and improve the consistency of multi-point assembly.

[0157] Furthermore, the laminated structure has no thermally conductive gaps, resulting in high heat transfer efficiency and low energy consumption, enabling rapid and uniform heating and curing. Simultaneously, the laminated structure boasts strong overall integrity and higher rigidity, enhancing the overall structural stability of the tooling assembly, reducing alignment deviations caused by tooling deformation during assembly, and further improving assembly accuracy.

[0158] Of course, when each receiving part 120 is also configured as a through hole 122 extending along the thickness direction Z at a preset position on one side surface of the wire guiding component 100, the heating component 130 can heat the adhesive in the through hole 122 from the other end away from the electronic component, that is, directional heating from the back side away from the electronic component of the through hole 122, so that the adhesive can be melted and flowed gradually from the far end to the near end, accurately guiding the mating gap between the wire and the electronic component, ensuring that the adhesive is filled in an orderly manner, without residual air bubbles, and improving the tightness of the connection.

[0159] At this time, as Figure 10 As shown, the heating component 130 can be a hot air gun (not shown) spaced apart from the main body of the wire guiding component 100. By blowing hot air onto the connector disposed at the other end of the through hole 122 away from the electronic component, the connector can not only be melted, but the melted connector can also flow towards the end of the through hole 122 closer to the electronic component. Of course, the heating component 130 can also be a laser heater. By irradiating the connector disposed at the other end of the through hole 122 away from the electronic component with a laser, the connector is heated and melted, and flows towards the end of the through hole 122 closer to the electronic component under the action of gravity or other auxiliary guiding structures. This embodiment does not limit this to a single method.

[0160] Furthermore, this heating method avoids defects such as bubbles and voids caused by localized rapid heating and boiling of the binder, ensuring the conductivity stability of the electrical connection. Simultaneously, back-side directional heating allows for precise control of the heating range, acting only on the pre-placed binder area, maximizing the protection of the delicate structure of electronic components from temperature effects.

[0161] Specifically, the diameter of each through hole 122 gradually increases from the opening end closest to the electronic component toward the other end furthest from the electronic component.

[0162] Furthermore, the adhesive in each housing 120 is pre-placed at the end of the through hole 122 away from the electronic component.

[0163] In this embodiment, the heating component 130 heats the back side of the through hole 122 away from the electronic component, utilizing the guiding advantage of the gradually changing aperture structure to allow the adhesive to fill the assembly gap uniformly and evenly, meeting the requirements for high-precision sealing and conductive connection. Meanwhile, compared to the receiving portion 120 configured as a recess 121, the receiving portion 120 configured as a through hole 122 allows the adhesive to be pre-placed at the end of the through hole 122 away from the electronic component, avoiding interference with the end of the through hole 122 closer to the electronic component. This reduces the difficulty of positioning the wire connection end in the fixing portion 110, making it easier to achieve high-precision and stable wire assembly.

[0164] It should be noted that the bonding agent of each receiving portion 120 on the wire guiding component 100 can be heated by any of the above-mentioned heating methods. For example, both receiving portions 120 can be heated by any of the above-mentioned heating methods, or by any combination of two heating methods. This embodiment does not limit this to a single method.

[0165] Furthermore, each wire is positioned on one side surface of the wire guide component 100 according to a predetermined extension direction. This not only fixes the position of the wire end but also constrains the overall routing posture of the wire, preventing the wire from twisting, skewing, or stacking, ensuring that multiple wires are arranged neatly, and preventing interference, overlap, or short circuits between wires. Regarding the predetermined extension direction of the wire, it can extend along the length of the wire guide component 100, with one end bent towards the width of the wire guide component 100, thereby positioning the connection end on the fixing part 110 at a predetermined position. Of course, the predetermined extension direction of the wire can also extend only along the length of the wire guide component 100; this embodiment does not limit this to a single direction.

[0166] It should be noted that the wire body may have multiple adhesive parts in its extension direction, and be bonded to the corresponding part on one side surface of the wire guide component 100 by weak adhesive, so as to maintain a predetermined posture on the wire guide component 100.

[0167] Furthermore, such as Figure 1 and Figure 3 As shown, a mounting groove 141 extending along a predetermined extension direction may also be provided on one side surface of the wire guiding component 100. The mounting groove 141 is recessed inward relative to one side surface of the wire guiding component 100, and the mounting groove 141 does not penetrate the wire guiding component 100 in the thickness direction Z of the wire guiding component 100 (see...). Figure 2One end of the mounting groove 141 is connected to the fixing part 110 at a preset position on the wire guide component 100. The wire body is embedded in the mounting groove 141, and its connecting end extends from one end of the mounting groove 141 into the fixing part 110 located at the preset position. Of course, the wire body can also be glued into the mounting groove 141 with a weak adhesive.

[0168] Furthermore, such as Figure 7 As shown, a mounting hole 142 penetrating the wire guide component 100 can also be provided on one side surface of the wire guide component 100 in the thickness direction Z. At the same time, when viewed along the thickness direction Z of the wire guide component 100, the side of the wire guide component 100 away from the electronic component has a connecting portion that partially covers the mounting hole 142, so that the wire body portion of the wire located in the mounting hole 142 can be bonded to the connecting portion.

[0169] Therefore, this embodiment does not impose a unique limitation on the assembly method of the wire body on the wire guiding component 100.

[0170] In this embodiment, as Figure 4 and Figure 5 As shown, a protective part 150 is provided on one side surface of the wire guiding member 100 at the outer periphery of each fixing part 110 and the corresponding assembled wire, so as to protect each fixing part 110, the connecting end located in each fixing part 110 and the corresponding wire.

[0171] Specifically, the protection part 150 can protect the wire guide component 100 during transportation or operation, preventing the wire mounted on it from easily coming into contact with other items, ensuring that the corresponding connection end in the fixing part 110 will not shift, and that the wire can be stably mounted on the wire guide component 100 in a predetermined extension direction, thereby reducing the risk of the wire falling off the wire guide component 100.

[0172] Furthermore, when the protective unit 150 is aligned with the corresponding position of the electronic component, it can be held in place on the outer peripheral wall of the electronic component during wire assembly. This reduces the risk of tooling misalignment or displacement during assembly, ensuring stable alignment accuracy throughout the process and avoiding alignment deviations caused by manual shaking. In other words, the protective unit 150 can also achieve precise positioning of the tooling and electronic component, making it compatible with automated and semi-automated batch assembly equipment and improving the adaptability and versatility of the assembly tooling. Simultaneously, it can compensate for external force shaking errors during assembly.

[0173] Specifically, the protective portion 150 can be configured as protective protrusions 151 on both sides of one side surface of the wire guiding member 100 in a vertical direction perpendicular to the wire extension direction. Each protective protrusion 151 extends toward the electronic component along the thickness direction Z and is typically held in place by the component on which the electronic component is mounted, thereby limiting the displacement of the wire guiding member 100 relative to the electronic component in a vertical direction perpendicular to the wire extension direction (see [link]). Figure 9 ).

[0174] Of course, the protective part 150 can also be configured as a protective protrusion 151 on one side surface of the wire guiding member 100 in a vertical direction perpendicular to the wire extension direction.

[0175] Alternatively, the protection part 150 can also limit the displacement of the wire guiding part 100 relative to the electronic component in the wire extension direction by changing the position of the protection protrusion 151. This embodiment does not limit this only.

[0176] Example 2:

[0177] like Figure 11 As shown, this embodiment discloses a wire assembly method for electronic components. The assembly method utilizes any of the wire assembly fixtures for electronic components described in Embodiment 1, including:

[0178] At least one wire is positioned on the wire guide member 100, wherein the connecting end of each wire is positioned at a fixed part 110 at a predetermined position on one side surface of the wire guide member 100.

[0179] Move the wire guide component 100 so that one side surface of the wire guide component 100 faces the electronic component, and the connection end of each wire is aligned and in contact with the corresponding mounting end on the electronic component.

[0180] Use a connector to connect the ends of each wire to the corresponding assembly ends.

[0181] Move the wire guide component 100 so that each wire is detached from the wire guide component 100 and electrically connected to the electronic component.

[0182] This wire assembly method involves several steps: positioning the wire using a wire guide component 100, precise alignment, connection and curing, and detachment from the assembly fixture. This results in a simple and compact assembly process. Compared to traditional assembly methods, which may suffer from high randomness, poor precision, and low yield, this method significantly improves assembly efficiency and product consistency. Furthermore, this wire assembly method allows for the repeated use of tooling, reducing production material costs.

[0183] It should be noted that before assembling the wires, the electronic components can be pre-fixed on the positioning stand to prevent them from shaking during the assembly process.

[0184] In this embodiment, after positioning at least one wire in the wire guiding component and before moving the wire guiding component, the following steps are further included:

[0185] The position of each wire connection end on the acquisition wire guide component 100 is the first position, and the position of each assembly end on the acquisition electronic component is the second position.

[0186] Furthermore, when moving the wire guide component, the first position on the wire guide component moves toward the corresponding second position on the electronic component.

[0187] In this embodiment, by pre-collecting the first and second positions, the movement path of the wire guide component can be accurately planned, ensuring that the first position on the wire guide component and the corresponding second position on the electronic component are aligned after movement. This is beneficial for the accurate installation of the subsequent wire connection end and the corresponding assembly end on the electronic component.

[0188] When determining the first and second positions, positioning can be achieved using visual measurement technology. Specifically, images of the electronic component and the wire guiding component are acquired using a camera, and the position coordinates of the first and second positions are identified using visual recognition. When moving the first position toward the second position, the movement path of the wire guiding component 100 is first determined based on the first and second positions, and the first position can be moved toward the second position along this movement path.

[0189] Of course, a matching positioning structure can also be provided at the corresponding positions of the wire guiding component 100 and the electronic component. For example, a positioning pin (not shown in the figure) can be provided on the wire guiding component 100, and a positioning hole (not shown in the figure) that matches the positioning pin can be provided on the electronic component. When assembling the connection end of the wire, it is necessary to ensure that the relative position of the connection end of the wire and the positioning pin on the wire guiding component 100 is consistent with the relative position of the corresponding assembly end on the electronic component and the positioning hole. When the first position is moved toward the second position, the positioning pin is brought close to the positioning hole on the electronic component. When the two are in contact and engaged, the connection end of the wire corresponds to the corresponding assembly end on the electronic component. Compared with directly positioning the connection end of the wire and the corresponding assembly end on the electronic component, both the connection end of the wire and the assembly end on the electronic component are easily blocked. This positioning structure can greatly reduce the positioning difficulty.

[0190] Furthermore, the specific positions of the positioning pins on the wire guide component 100 and the positioning holes on the electronic components in three-dimensional space can be confirmed by imaging with a vision camera, thereby confirming the movement path of the wire guide component 100. Compared with measuring the positions of the connection ends of multiple wires and the positions of multiple assembly ends, this simplifies the calculation difficulty.

[0191] In summary, the wire guiding component 100 can achieve accurate positioning of the wire guiding component 100 and electronic components during the assembly process through any one of the following methods: visual acquisition, positioning structure positioning, or a combination of visual acquisition and positioning structure positioning. Of course, those skilled in the art can also design according to actual conditions and specific needs, and this embodiment does not limit it to a single method.

[0192] It should be noted that, as mentioned in Example 1, the wire connection end and the corresponding assembly end on the electronic component can be connected together by welding, pressing, or adhesive bonding, etc., which will not be elaborated here.

[0193] Furthermore, before the connection ends of each wire are positioned at the fixed part 110 at a preset position on the wire guiding member 100, or after the connection ends of each wire are aligned and contacted with the corresponding mounting ends on the electronic component, the connector is placed in the corresponding receiving part 120.

[0194] In this embodiment, after aligning and contacting the connection ends of each wire with the corresponding assembly ends on the electronic component, a connector is used to connect the connection ends to the corresponding assembly ends.

[0195] It should be noted that when using a bonding agent to connect the connecting end to the corresponding assembly end, the bonding agent in each receiving part 120 is heated at a predetermined temperature and for a predetermined time, so that the bonding agent melts and enters the area where each connecting end and the corresponding assembly end are aligned and contacted, and then cools and solidifies.

[0196] In this embodiment, precise heating and curing at a predetermined temperature and duration can adapt to different production conditions and assembly requirements with different binder properties, ensuring that the binder after cooling and curing can connect the connection end of the wire to the corresponding assembly end on the electronic component. Regarding the predetermined temperature and time, those skilled in the art can design according to the actual situation and specific needs, and this embodiment does not limit them to a single one.

[0197] It should be noted that this wire assembly method can be adjusted only according to the two filling methods mentioned above, or it can be precisely heated only by a predetermined temperature and time, or it can be a combination of filling method and precise heating at a predetermined temperature and time. This embodiment does not limit this to a single method.

[0198] This wire assembly method allows for the selection of two operating modes: pre-filler and post-filler alignment, depending on the requirements. Combined with precise heating and curing at predetermined temperatures and durations, it can adapt to different production conditions and the assembly needs of different binder properties, flexibly adapt to the production process, ensure reliable curing effect, and avoid problems such as overheating damage to components and underheating incomplete curing.

[0199] Of course, a connector can also be pre-installed on the surface of the assembly end of the electronic component. After the connection end of the wire is aligned and in contact with the corresponding assembly end on the electronic component, the wire is connected by the connector. There is no need to set the structure of the assembly connector on the wire guide component 100, which simplifies the structure of the wire guide component 100.

[0200] In existing technologies, conventional wire bonding processes are only suitable for open assembly scenarios with ample height and no obstructions above the assembly surface. For enclosed and confined assembly scenarios with limited space above the welding surface and structural obstructions, automated wire bonding operations are completely impossible. However, the wire assembly method in this embodiment, through wire-guided tooling for aligning the connection end and assembly end, followed by heating, curing, and detachment, is not limited by the assembly space or structural obstructions above electronic components. This fills the technological gap in automated welding of precision leads in confined and obstructed spaces, and represents a significant technological difference from traditional wire bonding processes.

[0201] Furthermore, positioning at least one wire on the wire guide member 100 also includes positioning each wire on one side surface of the wire guide member 100 in a predetermined extension direction.

[0202] Furthermore, after moving the wire guide member 100 so that one side surface of the wire guide member 100 faces the electronic component, the wire guide member 100 is further positioned with respect to a pair of protective protrusions 151 provided on one side surface of the wire guide member 100 to limit the displacement of the wire guide member 100 relative to the electronic component in a vertical direction perpendicular to the wire extension direction.

[0203] Similarly, this wire assembly method can assemble the wire only in a predetermined extension direction, or it can restrict the guiding component only by a pair of protective protrusions 151, or it can assemble the wire in a predetermined extension direction and limit it by a pair of protective protrusions 151. This embodiment does not limit it to a single method.

[0204] This wire assembly method enables the wire extension direction to be defined and the assembly tooling and electronic components to be positioned. It achieves all-round positioning constraints from two dimensions: wire posture and assembly tooling position, reducing various offset errors in the assembly process and thus greatly ensuring alignment and assembly accuracy.

[0205] It should be noted that the electronic components used in this wire conversion method include strain gauges 200 disposed on the strain beam 310 of the elastic body 300 of the multidimensional force sensor. After the strain gauges 200 are fixed to a predetermined position on the strain beam, the positions of each mounting end on the strain gauges 200 are collected.

[0206] Furthermore, positioning at least one wire in the wire guide member 100 also includes positioning the wire body of each wire on one side surface of the wire guide member 100 according to a predetermined extension direction. Additionally, when the wire guide member 100 is moved such that each wire is disengaged from the wire guide member, the wire guide member 100 is disengaged from the wire body, connecting end, and assembly end of each wire.

[0207] This wire assembly method enables high-precision, non-destructive assembly of the strain gauge 200 wires, ensuring stable electrical connection between the strain gauge 200 and the wires, and guaranteeing accurate sensor signal transmission.

[0208] Furthermore, the strain gauge 200 is an ultra-high precision sensing element, which is extremely sensitive to assembly stress, temperature damage, and alignment deviation. This wire assembly method can greatly avoid sensor zero-point drift and sensitivity deviation caused by assembly deformation and high temperature damage, significantly improve the measurement accuracy, repeatability, and long-term stability of the multi-dimensional force sensor, and extend the service life of precision sensing equipment.

[0209] like Figure 8 As shown, taking the strain gauge 200 disposed on the surface of the strain beam 310 parallel to the axial direction of the elastic body 300 as an example, the wire guiding component 100 is configured as a flat plate structure, with one end extending parallel to the body portion of the wire guiding component 100, thereby conveniently extending into the gap of the elastic body 300 located beside the strain beam 310, thus aligning the wire connection end with the corresponding mounting end on the strain gauge 200. Of course, as... Figure 9 As shown, for the strain gauge 200 disposed on the surface of the strain beam 310 parallel to the end face of the elastic body 300, at this time, one end of the wire guiding component 100 is bent and extended relative to the body part of the wire guiding component 100. Under the premise that the body part of the wire guiding component 100 does not interfere with the elastic body 300, it is ensured that the wire connection end can be aligned with the corresponding assembly end on the strain gauge 200.

[0210] It should be noted that, in addition to the specific embodiments described above, those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Although the description of the present invention is presented in conjunction with preferred embodiments, this does not mean that the features of the invention are limited to these embodiments. On the contrary, the purpose of describing the invention in conjunction with the embodiments is to cover other options or modifications that may be derived based on the claims of the present invention. To provide a deep understanding of the invention, many specific details are included in the above description, and the invention may also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of the invention, some specific details will be omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of the present invention can be combined with each other.

[0211] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0212] In the description of this embodiment, it should be noted that the terms "upper", "lower", "inner", "bottom", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship that the product of the invention is usually placed in during use. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting the present invention.

[0213] The terms “first”, “second”, etc., are used only to distinguish descriptions and should not be interpreted as indicating or implying relative importance.

[0214] In the description of this embodiment, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set up," "connected," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this embodiment based on the specific circumstances.

[0215] While the present invention has been illustrated and described with reference to certain preferred embodiments, those skilled in the art should understand that the above description is a further detailed explanation of the invention in conjunction with specific embodiments, and should not be construed as limiting the specific implementation of the invention to these descriptions. Various changes in form and detail can be made by those skilled in the art, including several simple deductions or substitutions, without departing from the spirit and scope of the invention.

Claims

1. A wire assembly fixture for electronic components, characterized in that, include: A wire guiding component, wherein at least one fixing part is provided on one side surface of the wire guiding component, and at least one connection end of a wire is positioned at a corresponding fixing part, wherein each fixing part is located at a predetermined position on the wire guiding component; and One side surface of the wire guiding component is disposed facing the electronic component, each of the connecting ends is aligned and connected to the corresponding mounting end on the electronic component and is detached from the wire guiding component, and each wire is electrically connected to the electronic component.

2. The wire assembly fixture for electronic components as described in claim 1, characterized in that, The wire guiding component is further provided with a receiving portion communicating with each of the fixing portions, and the receiving portion contains a connector; wherein... One side surface of the wire guiding component is disposed facing the electronic component, each of the connecting ends is aligned and abuts against the corresponding mounting end, and the connector in the receiving part connects each of the connecting ends and the corresponding mounting end together.

3. The wire assembly fixture for electronic components as described in claim 2, characterized in that, in, The binder is made of a hot-melt material; and... It also includes a heating element that heats the housing portion of the wire guiding element, causing the bonding agent in the housing portion to melt and flow to the preset position.

4. The wire assembly fixture for electronic components as described in claim 3, characterized in that, The wire guiding component is provided with a plurality of receiving portions, each receiving portion being disposed on the wire guiding component and communicating with a corresponding preset position; and... The heating element heats each of the receiving portions, and the binder in each of the receiving portions melts and flows to the corresponding preset position.

5. The wire assembly fixture for electronic components as described in claim 4, characterized in that, The wire guiding component is configured as a plate-like structure, and each of the fixing parts is located at a predetermined position on one side surface of the wire guiding component in the thickness direction; and... The electronic component has a sheet-like structure and includes multiple mounting ends, with at least one mounting end located on one side surface of the electronic component.

6. The wire assembly fixture for electronic components as described in claim 5, characterized in that, Each of the aforementioned receiving portions is configured as a recess located at a predetermined position on one side surface of the wire guiding member and extending along the thickness direction of the wire guiding member, and the adhesive is received within the receiving portion; and, The opening end of each of the receiving portions serves as the fixing portion, and the connecting end of the wire is positioned at the opening end of the corresponding receiving portion.

7. The wire assembly fixture for electronic components as described in claim 5, characterized in that, Each of the aforementioned receiving portions is configured as a through hole extending along the thickness direction of the wire guiding member at a predetermined position on one side surface of the wire guiding member, and the adhesive is received at the other end of the through hole away from the electronic component; and, Each of the aforementioned receiving portions has its opening end near the electronic component as the fixing portion, and the connecting end of the wire is positioned at the opening end of the corresponding receiving portion.

8. The wire assembly fixture for electronic components as described in claim 7, characterized in that, The diameter of each of the through holes gradually increases from the opening end closest to the electronic component toward the other end furthest from the electronic component.

9. The wire assembly fixture for electronic components as described in claim 5, characterized in that, Each of the fixing portions is located on one side surface of the wire guiding member, near the side end of the electronic component; and the heating component is provided at the side end of the wire guiding member near the electronic component.

10. The wire assembly fixture for electronic components as described in claim 5, characterized in that, Each of the fixing parts is located on one side surface of the wire guiding member, and the heating member heats the receiving part from the other side of the wire guiding member.

11. The wire assembly fixture for electronic components as described in claim 10, characterized in that, The wire guiding component and the heating component are stacked together; wherein... Each of the aforementioned receiving portions is located at a predetermined position on one side surface of the wire guiding member; and, The heating element has a plate-like structure and is attached to the other side surface of the wire guiding element in the thickness direction.

12. The wire assembly fixture for electronic components as described in claim 10, characterized in that, Each of the aforementioned receiving portions is configured as a through hole extending along the thickness direction at a predetermined position on one side surface of the wire guiding member; and The heating element heats the binder inside the through-hole from the other end away from the electronic component.

13. The wire assembly fixture for electronic components as described in claim 12, characterized in that, The diameter of each of the through holes gradually increases from the opening end closest to the electronic component toward the end furthest from the electronic component; and, The connector within each of the aforementioned receiving portions is pre-placed at the end of the through-hole away from the electronic component.

14. The wire assembly fixture for electronic components as described in any one of claims 5 to 13, characterized in that, Each of the wires is positioned on one side surface of the wire guiding component in a predetermined extension direction.

15. The wire assembly fixture for electronic components as described in any one of claims 5 to 13, characterized in that, A protective portion is provided on one side surface of the wire guiding component at the outer periphery of each fixing part and the corresponding assembled wire to protect the connection end of each fixing part and the corresponding wire.

16. A method for assembling wires for electronic components, characterized in that, The assembly method utilizes the wire assembly fixture for electronic components as described in any one of claims 1 to 15, comprising: At least one wire is positioned on a wire guiding member, wherein the connecting end of each wire is positioned at a fixed position on a predetermined position on one side surface of the wire guiding member; Move the wire guiding component so that one side surface of the wire guiding component faces the electronic component, and the connection end of each wire is aligned and in contact with the corresponding mounting end on the electronic component; The connecting ends of each of the wires are connected together with the corresponding assembly ends using a connector; Move the wire guide component so that each wire is detached from the wire guide component and electrically connected to the electronic component.

17. The wire assembly method for electronic components as described in claim 16, characterized in that, After positioning at least one wire and before moving the wire guiding component, the following steps are also included: The position of the connection end of each wire on the wire guiding component is collected as the first position, and the position of each assembly end on the electronic component is collected as the second position; and When the wire guide component is moved, the first position on the wire guide component moves toward the corresponding second position on the electronic component.

18. The wire assembly method for electronic components as described in claim 16, characterized in that, Before the connection end of each of the wires is positioned at the fixed part of the preset position on the wire guiding component, or after the connection end of each of the wires is aligned and contacted with the corresponding mounting end on the electronic component, the connector is placed in the corresponding receiving part. and / or After aligning the connecting ends of each wire with the corresponding mounting ends on the electronic component, the connecting ends are connected to the corresponding mounting ends using the adhesive.

19. The wire assembly method for electronic components as described in claim 18, characterized in that, When the connecting end is connected to the corresponding assembly end using the adhesive, the adhesive in each of the receiving parts is heated at a predetermined temperature and for a predetermined time, so that the adhesive melts and enters the area where each of the connecting ends and the corresponding assembly ends are aligned and contacted, and then cools and solidifies.

20. The method for assembling wires for electronic components as described in any one of claims 17 to 19, characterized in that, The electronic component includes strain gauges disposed on the strain beam of the elastic body of the multidimensional force sensor; wherein, after the strain gauges are fixed to predetermined positions on the strain beam, the positions of each of the mounting ends on the strain gauges are acquired; and Positioning at least one wire in the wire guiding member further includes positioning the body of each wire on one side surface of the wire guiding member according to a predetermined extension direction; and When the wire guide component is moved so that each wire is detached from the wire guide component, the wire guide component is disconnected from the wire body, the connecting end, and the assembly end of each wire.

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