A dense bus duct of dynamic heat conduction air duct heat dissipation structure

Abstract

The application relates to the technical field of bus ducts, and discloses a dense bus duct with a dynamic heat-conducting air duct heat dissipation structure, which solves the problem of poor heat dissipation effect of the existing bus ducts, and comprises a bus duct shell and a plurality of conductive rows, the bus duct shell is composed of a bottom plate, a side plate one, a side plate two and a top plate, the bottom end of the bottom plate is provided with a lower sealing plate, a horizontal flow channel one is formed between the lower sealing plate and the bottom plate, rectangular through grooves one are formed at the two sides of the top end of the bottom plate, vertical flow channels are formed in the interiors of the side plate one and the side plate two, rectangular through grooves two are formed at the two sides of the bottom end of the top plate, a horizontal flow channel two is formed in the interior of the top plate, upper sealing plates are arranged at the two ends of the top of the top plate, a side-opening sealing assembly is arranged at the middle position of the top of the top plate, and a plurality of heat dissipation fans are fixedly arranged at the positions close to the upper sealing plates at the two ends in the interior of the horizontal flow channel two; the bus duct can improve the heat dissipation efficiency.

Description

Technical Field

[0001] This invention belongs to the field of busbar technology, specifically a dense busbar with a dynamic heat-conducting air duct heat dissipation structure. Background Technology

[0002] High-density busbar trunking is widely used in power transmission and distribution systems of high-rise buildings, data centers, and industrial plants due to its compact structure, large current carrying capacity, and high power supply reliability. However, with the continuous increase in electrical load, the Joule heat generated by the busbars increases significantly during high-current, long-term heavy-load operation, making heat dissipation a key factor limiting its current carrying capacity and service life.

[0003] Existing high-density busbar trunking systems mostly employ natural heat dissipation or simple air-cooling structures, which have the following drawbacks: 1. High thermal resistance between the busbars and the housing, resulting in low heat transfer efficiency and easy accumulation of high internal temperatures, leading to accelerated aging of the insulation layer and a decrease in current carrying capacity; 2. Traditional heat dissipation duct structures are fixed and cannot dynamically adjust airflow and flow according to load and temperature changes, resulting in excessive heat dissipation under light loads and insufficient heat dissipation under heavy loads; 3. Some air-cooling solutions directly introduce external air into the busbar cavity, which can easily lead to dust and moisture intrusion, reducing insulation performance and posing safety hazards such as short circuits and leakage; 4. Loose bonding of the thermal interface, with air gaps causing excessively high interface thermal resistance, making it difficult to achieve efficient heat transfer.

[0004] The aforementioned problems result in high temperature rise in traditional compact busbar trunking, making it difficult to balance safety performance and heat dissipation efficiency, and failing to meet the usage requirements of high-load and high-reliability applications. Therefore, this application proposes a compact busbar trunking with a dynamic heat conduction air duct heat dissipation structure. Summary of the Invention

[0005] In order to overcome the shortcomings of the prior art, the present invention provides a dense busbar trunking with a dynamic heat-conducting air duct heat dissipation structure, which effectively solves the problem of poor heat dissipation performance of existing busbar trunking.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a dense busbar trunking with a dynamic heat-conducting air duct heat dissipation structure, comprising a busbar trunking shell and several conductive bars, wherein the conductive bars are connected through the busbar trunking shell. The busbar trunking shell is composed of a bottom plate, a first side plate, a second side plate, and a top plate. The first and second side plates are connected to the two sides of the top of the bottom plate, and the top plate is connected to the top of the first and second side plates. Several lower sealing plates are provided at the bottom end of the bottom plate. The lower sealing plates are connected to the bottom plate through an opening and closing control component, and a transverse flow channel is formed between the lower sealing plates and the bottom plate. Both sides of the top of the bottom plate are... The top plate has several rectangular channels 1 that communicate with the transverse flow channels 1. Both the side plate 1 and the side plate 2 have several vertical flow channels that communicate with the rectangular channels 1. Both sides of the bottom of the top plate have several rectangular channels 2 that communicate with the vertical flow channels. The top plate has transverse flow channels 2 that communicate with the rectangular channels 2. Both ends of the top of the top plate are provided with upper sealing plates. The upper sealing plates are connected to the top plate through an opening and closing control component 2. A side-opening sealing component is provided in the middle of the top of the top plate. Several cooling fans are fixedly installed at both ends of the transverse flow channels 2 near the upper sealing plates.

[0007] Preferably, a number of temperature sensors are installed inside the vertical flow channel, and a controller is fixedly installed on the side of one end of the top plate.

[0008] Preferably, both the opening and closing control component one and the opening and closing control component two are composed of several support arms, a synchronizing rod and an electric push rod. The support arms are fixedly connected to the sides of the lower sealing plate and the upper sealing plate. The synchronizing rod is hinged between the support arms. The electric push rod is hinged between the synchronizing rod and the busbar housing. The lower sealing plate, the upper sealing plate and the busbar housing are rotatably connected by a hinge.

[0009] Preferably, the side-opening sealing assembly consists of a side-opening sealing plate, a support plate, and an electric push rod II. The side-opening sealing plate is hinged to the top plate via a hinge II. The support plate is fixedly connected to the middle position of one side of the top of the side-opening sealing plate. The electric push rod II is hinged between the support plate and the top plate. A slot matching the electric push rod II is provided in the middle position of one side of the top plate.

[0010] Preferably, both ends of the top of the top plate are provided with end air inlets and outlets that communicate with the second transverse flow channel and match the upper sealing plate, and the middle position of the top of the top plate is provided with a natural convection exhaust outlet that communicates with the second transverse flow channel and matches the side-opening sealing plate.

[0011] Preferably, the conductive busbar is composed of a silver-plated copper busbar, an insulating layer, and a graphene coating layer, with the insulating layer covering the outer surface of the silver-plated copper busbar and the graphene coating layer covering the outer surface of the insulating layer.

[0012] Preferably, a graphene pad layer one is provided between the conductive busbar and the base plate, and a graphene pad layer two is provided between the conductive busbar and the top plate. Both the graphene pad layer one and the graphene pad layer two are bonded to the graphene coating layer.

[0013] Preferably, the top end of the first graphene pad and the bottom end of the second graphene pad are both formed with several arc-shaped grooves, and several rectangular through grooves are opened on the first and second graphene pads, which are connected to the first and second rectangular through grooves, so as to form a connected state and realize air duct heat dissipation.

[0014] Preferably, both sides of the vertical flow channel are provided with graphene air-cooling heat dissipation thin layers that are in contact with graphene pad one and graphene pad two, and a number of heat dissipation fins are fixedly provided on the side of side plate one and side plate two away from the conductive busbar.

[0015] Preferably, the graphene pad one and graphene pad two are bonded to the graphene coating layer and the graphene air-cooling heat dissipation thin layer by graphene modified thermal conductive adhesive and hot-pressed composite molding, which is used to fill the air gaps, eliminate interfacial thermal resistance, make the intermolecular bonding stronger, and thus improve the thermal conductivity.

[0016] Compared with the prior art, the beneficial effects of the present invention are:

[0017] (1) During operation, the temperature inside the busbar trunking is monitored in real time by a temperature sensor. The controller drives the opening and closing control component and the side-opening sealing component to automatically adjust the flow channel opening and closing and the opening size, so as to realize multi-level dynamic heat dissipation of low temperature natural heat dissipation, medium temperature enhanced convection and high temperature forced air cooling, which improves heat dissipation efficiency and reduces energy consumption. The air duct is set inside the busbar trunking shell and is completely isolated from the conductive busbar cavity. The external air does not directly contact the live parts, effectively avoiding the intrusion of dust, water vapor and foreign objects, ensuring insulation performance and electrical safety, and meeting the requirements of high protection level use.

[0018] (2) The horizontal flow channel 1, vertical flow channel 2 form a three-dimensional air duct, which, together with the cooling fan and external heat dissipation fins, achieves triple heat dissipation coupling of convection, conduction and radiation. The heat dissipation area is large and the airflow distribution is uniform, which effectively eliminates local overheating and reduces the overall temperature rise.

[0019] (3) A graphene coating layer is set on the outside of the conductive busbar, which, together with graphene pad layer one, graphene pad layer two and graphene air-cooling heat dissipation thin layer, forms a continuous and efficient heat conduction path. The graphene layers are bonded and hot-pressed together with graphene modified thermal conductive adhesive to eliminate the air gap at the interface, greatly reduce the contact thermal resistance and realize rapid heat conduction. Attached Figure Description

[0020] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention and do not constitute a limitation thereof.

[0021] In the attached diagram:

[0022] Figure 1 This is a schematic diagram of the dense busbar structure of the dynamic heat conduction air duct heat dissipation structure of the present invention;

[0023] Figure 2 This is a cross-sectional view of the dense busbar channel of the dynamic heat conduction air duct heat dissipation structure of the present invention.

[0024] Figure 3 This is a schematic diagram of the connection structure between the upper sealing plate and the opening and closing control component two of the present invention;

[0025] Figure 4 This is a schematic diagram of the side-opening sealing assembly structure of the present invention;

[0026] Figure 5 For the present invention Figure 1 A magnified view of a section at point A in the middle;

[0027] Figure 6 This is a schematic diagram of a partial structure of the base plate of the present invention;

[0028] Figure 7 This is a partial structural diagram of the side plate of the present invention;

[0029] Figure 8 This is a schematic diagram of the graphene pad structure of the present invention;

[0030] Figure 9 This is a schematic diagram of the conductive busbar structure of the present invention;

[0031] In the diagram: 1. Busbar housing; 2. Conductor bar; 3. Base plate; 4. Side plate 1; 5. Side plate 2; 6. Top plate; 7. Lower sealing plate; 8. Opening / closing control assembly 1; 9. Horizontal flow channel 1; 10. Rectangular through-slot 1; 11. Vertical flow channel; 12. Rectangular through-slot 2; 13. Horizontal flow channel 2; 14. Upper sealing plate; 15. Opening / closing control assembly 2; 16. Side-opening sealing assembly; 17. Cooling fan; 18. Temperature sensor; 19. Controller; 20. Support arm; 21. 1. Synchronizing rod; 22. Electric push rod one; 23. Hinge one; 24. Side-opening sealing plate; 25. Support plate; 26. Electric push rod two; 27. Hinge two; 28. Groove; 29. ​​End air inlet and outlet; 30. Natural convection exhaust outlet; 31. Silver-plated copper busbar; 32. Insulation layer; 33. Graphene coating layer; 34. Graphene pad one; 35. Graphene pad two; 36. Arc-shaped groove; 37. Rectangular through groove three; 38. Graphene air-cooled heat dissipation thin layer; 39. Heat dissipation fins. Detailed Implementation

[0032] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are within the scope of protection of the present invention.

[0033] Example 1, by Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7 The present invention discloses a dense busbar trunking structure with dynamic heat conduction duct cooling, comprising a busbar trunking housing 1 and several conductive bars 2. The conductive bars 2 are connected through the busbar trunking housing 1. The busbar trunking housing 1 is composed of a bottom plate 3, side plates 4, side plates 5, and a top plate 6. Side plates 4 and 5 are connected to the two sides of the top of the bottom plate 3, and the top plate 6 is connected to the top of the side plates 4 and 5. Several lower sealing plates 7 are provided at the bottom of the bottom plate 3. The lower sealing plates 7 are connected to the bottom plate 3 through an opening and closing control component 8, forming a transverse flow channel 9 between the lower sealing plates 7 and the bottom plate 3. Several rectangular through slots 10 communicating with the transverse flow channel 9 are provided on both sides of the top of the bottom plate 3. The interiors of the side plates 4 and 5 are... Each of the top plate 6 has several vertical flow channels 11 connected to the rectangular through slot 10. Both sides of the bottom end of the top plate 6 have several rectangular through slots 12 connected to the vertical flow channels 11. The interior of the top plate 6 has a transverse flow channel 13 connected to the rectangular through slot 12. Both ends of the top of the top plate 6 are provided with upper sealing plates 14. The upper sealing plates 14 are connected to the top plate 6 through an opening and closing control component 15. A side-opening sealing component 16 is provided in the middle of the top of the top plate 6. Several cooling fans 17 are fixedly provided at both ends of the transverse flow channel 13 near the upper sealing plate 14. Several temperature sensors 18 are provided inside the vertical flow channels 11. A controller 19 is fixedly provided on the side of one end of the top of the top plate 6.

[0034] Temperature sensor 18 enables real-time temperature monitoring. When the temperature is in the low-temperature range, the lower sealing plate 7, upper sealing plate 14, and side-opening sealing assembly 16 are all closed, and the cooling fan 17 is off. The entire busbar trunking dissipates heat only through heat conduction and natural convection of external air. When the temperature continues to rise, the lower sealing plate 7, upper sealing plate 14, and side-opening sealing assembly 16 are opened simultaneously. Hot air, being less dense, rises, and ambient air continuously enters from the bottom, forming natural convection cooling. The airflow path is: transverse channel 1 9 → rectangular channel 1 10 → vertical channel 11 → rectangular channel 2 12 → transverse channel 2 13, and is discharged through the top opening of the top plate 6, forming efficient convection cooling. Furthermore, external air will not directly contact the conductive busbar 2, avoiding dust and moisture pollution. When in a high-temperature range, only the lower sealing plate 7 and the upper sealing plate 14 are opened, the side-opening sealing component 16 is closed, and the cooling fan 17 is started. The airflow path is: horizontal flow channel 1 9 → rectangular through slot 1 10 → vertical flow channel 11 → rectangular through slot 2 12 → horizontal flow channel 2 13. At this time, one end of the horizontal flow channel 2 13 actively draws in air through the cooling fan 17. Hot air flows horizontally inside the horizontal flow channel 2 13 and is discharged from the other end of the horizontal flow channel 2 13 to the top, forming a chimney effect. The interior of the vertical flow channel 11 is in a negative pressure state, which accelerates the airflow and achieves forced convection heat dissipation, further improving the heat dissipation efficiency.

[0035] Example 2, based on Example 1, is... Figures 1 to 5 As shown, both the opening and closing control assembly 18 and the opening and closing control assembly 25 consist of several support arms 20, synchronizing rods 21, and electric push rods 22. The support arms 20 are fixedly connected to the sides of the lower sealing plate 7 and the upper sealing plate 14. The synchronizing rods 21 are hinged between the support arms 20. The electric push rods 22 are hinged between the synchronizing rods 21 and the busbar housing 1. The lower sealing plate 7, the upper sealing plate 14, and the busbar housing 1 are rotatably connected by hinges 23. The side-opening sealing assembly 16 consists of a side-opening sealing plate 24, a support plate 25, and an electric push rod 26. The side-opening sealing... Plate 24 is hinged to top plate 6 via hinge 27. Support plate 25 is fixedly connected to the middle position of one side of the top of side-opening sealing plate 24. Electric push rod 26 is hinged between support plate 25 and top plate 6. A slot 28 matching electric push rod 26 is provided in the middle position of one side of top plate 6. Both ends of the top of top plate 6 are provided with end air inlet and outlet ports 29 that communicate with transverse flow channel 23 and match the upper sealing plate 14. A natural convection exhaust port 30 that communicates with transverse flow channel 23 and matches the side-opening sealing plate 24 is provided in the middle position of the top of top plate 6.

[0036] When the opening and closing control component 18 and the opening and closing control component 215 are adjusted, the electric push rod 122 drives the synchronous rod 21 to move, the synchronous rod 21 drives the support arm 20 to rotate, and the support arm 20 drives the lower sealing plate 7 and the upper sealing plate 14 to rotate around the hinge 123. When the side-opening sealing component 16 is adjusted, the electric push rod 26 drives the support plate 25 to move, and the support plate 25 drives the side-opening sealing plate 24 to rotate around the hinge 227. The end air inlet and outlet 29 and the natural convection air outlet 30 can realize exhaust heat dissipation.

[0037] Example 3, based on Example 1, is... Figure 1 , Figure 2 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, the conductive bus 2 is composed of a silver-plated copper bus 31, an insulating layer 32, and a graphene coating layer 33. The insulating layer 32 covers the outer surface of the silver-plated copper bus 31, and the graphene coating layer 33 covers the outer surface of the insulating layer 32. A graphene pad 1 34 is provided between the conductive bus 2 and the base plate 3, and a graphene pad 2 35 is provided between the conductive bus 2 and the top plate 6. Both the graphene pad 1 34 and the graphene pad 2 35 are attached to the graphene coating layer 33. Several arc-shaped grooves 36 are formed at the top of the graphene pad 1 34 and the bottom of the graphene pad 2 35. Several rectangular through grooves 10 are formed on both the graphene pad 1 34 and the graphene pad 2 35. The rectangular through-slot 37, which is connected to the rectangular through-slot 2 12, can form a connected state to achieve air duct-type heat dissipation. Both sides of the vertical flow channel 11 are provided with graphene air-cooling heat dissipation thin layers 38 that are attached to graphene pad 1 34 and graphene pad 2 35. Several heat dissipation fins 39 are fixedly provided on the side of side plate 1 4 and side plate 2 5 away from the conductive busbar 2. Graphene pad 1 34 and graphene pad 2 35 are bonded to graphene coating layer 33 and graphene air-cooling heat dissipation thin layer 38 by graphene modified thermal conductive adhesive and hot-pressed composite molding to fill the air gap, eliminate interfacial thermal resistance, make the intermolecular bonding stronger, and thus improve the thermal conductivity.

[0038] The heat from the silver-plated copper busbar 31 is transferred to the graphene coating layer 33, then from the graphene coating layer 33 to the graphene pad layer 1 34 and the graphene pad layer 2 35, and then from the graphene pad layer 1 34 and the graphene pad layer 2 35 to the busbar housing 1 and the graphene air-cooled heat dissipation thin layer 38. The graphene air-cooled heat dissipation thin layer 38 is in direct contact with the air and can heat up and dissipate heat.

[0039] This invention uses a temperature sensor to monitor the internal temperature of the busbar trunking in real time. A controller drives the opening and closing control components and the side-opening sealing components to automatically adjust the flow channel opening and closing and the opening size. This achieves multi-stage dynamic heat dissipation, including natural heat dissipation at low temperatures, enhanced convection at medium temperatures, and forced air cooling at high temperatures. This improves heat dissipation efficiency while reducing energy consumption. The air duct is located inside the busbar trunking shell, completely isolated from the conductor bar cavity. External air does not directly contact the live parts, effectively preventing dust, moisture, and foreign matter intrusion, ensuring insulation performance and electrical safety, and meeting high protection level requirements. (Transverse flow channel) First, vertical and horizontal flow channels form a three-dimensional airflow channel, which, together with the cooling fan and external heat dissipation fins, achieves triple heat dissipation coupling of convection, conduction and radiation. The heat dissipation area is large and the airflow distribution is uniform, effectively eliminating local overheating and reducing the overall temperature rise. The conductive busbar is covered with a graphene coating layer, which, together with graphene pad layer one, graphene pad layer two and graphene air-cooling heat dissipation thin layer, forms a continuous and efficient heat conduction path. The graphene layers are bonded and hot-pressed together with graphene modified thermal conductive adhesive to eliminate interfacial air gaps, greatly reduce contact thermal resistance and achieve rapid heat conduction.

Claims

1. A dense busbar trunking with a dynamic heat-conducting airflow structure, comprising a busbar trunking housing (1) and a plurality of conductive bars (2), characterized in that: The conductive busbar (2) is connected through the busbar housing (1). The busbar housing (1) is composed of a bottom plate (3), side plate one (4), side plate two (5), and a top plate (6). Side plate one (4) and side plate two (5) are connected to the two sides of the top of the bottom plate (3), and the top plate (6) is connected to the top of side plate one (4) and side plate two (5). The bottom end of the bottom plate (3) is provided with several lower sealing plates (7). The lower sealing plates (7) are connected to the bottom plate (3) through the opening and closing control component one (8). A transverse flow channel one (9) is formed between the lower sealing plates (7) and the bottom plate (3). Several rectangular through slots one (10) communicating with the transverse flow channel one (9) are opened on both sides of the top of the bottom plate (3). Side plate one (4) and The interior of the second side plate (5) is provided with several vertical flow channels (11) that communicate with the first rectangular through channel (10). The bottom of the top plate (6) is provided with several rectangular through channels (12) that communicate with the vertical flow channels (11). The interior of the top plate (6) is provided with a second transverse flow channel (13) that communicates with the second rectangular through channel (12). The top of the top plate (6) is provided with upper sealing plates (14) at both ends. The upper sealing plates (14) are connected to the top plate (6) through the second opening and closing control component (15). The middle position of the top of the top plate (6) is provided with a side-opening sealing component (16). Several cooling fans (17) are fixedly provided at both ends of the second transverse flow channel (13) near the upper sealing plate (14).

2. The dense busbar trunking of the dynamic heat-conducting air duct heat dissipation structure according to claim 1, characterized in that: The vertical flow channel (11) is equipped with several temperature sensors (18), and a controller (19) is fixedly installed on the side of the top end of the top plate (6).

3. The dense busbar trunking of the dynamic heat-conducting air duct heat dissipation structure according to claim 1, characterized in that: The opening and closing control component one (8) and the opening and closing control component two (15) are both composed of several support arms (20), synchronizing rods (21) and electric push rod one (22). The support arms (20) are fixedly connected to the sides of the lower sealing plate (7) and the upper sealing plate (14). The synchronizing rods (21) are hinged between the support arms (20). The electric push rod one (22) is hinged between the synchronizing rods (21) and the busbar housing (1). The lower sealing plate (7), the upper sealing plate (14) and the busbar housing (1) are rotatably connected by hinge one (23).

4. The dense busbar trunking of the dynamic heat-conducting air duct heat dissipation structure according to claim 1, characterized in that: The side-opening sealing assembly (16) consists of a side-opening sealing plate (24), a support plate (25), and an electric push rod (26). The side-opening sealing plate (24) is hinged to the top plate (6) via a hinge (27). The support plate (25) is fixedly connected to the middle position on one side of the top of the side-opening sealing plate (24). The electric push rod (26) is hinged between the support plate (25) and the top plate (6). A slot (28) matching the electric push rod (26) is provided in the middle position on one side of the top plate (6).

5. The dense busbar trunking of the dynamic heat-conducting air duct heat dissipation structure according to claim 4, characterized in that: Both ends of the top plate (6) are provided with end air inlets and outlets (29) that are connected to the second transverse flow channel (13) and matched with the upper sealing plate (14). The middle position of the top plate (6) is provided with a natural convection exhaust outlet (30) that is connected to the second transverse flow channel (13) and matched with the side-opening sealing plate (24).

6. The dense busbar trunking of the dynamic heat-conducting air duct heat dissipation structure according to claim 1, characterized in that: The conductive bus (2) is composed of a silver-plated copper bus (31), an insulating layer (32) and a graphene coating layer (33). The insulating layer (32) covers the outer surface of the silver-plated copper bus (31), and the graphene coating layer (33) covers the outer surface of the insulating layer (32).

7. The dense busbar trunking of a dynamic heat-conducting air duct heat dissipation structure according to claim 6, characterized in that: A graphene pad (34) is provided between the conductive bus (2) and the base plate (3), and a graphene pad (35) is provided between the conductive bus (2) and the top plate (6). Both the graphene pad (34) and the graphene pad (35) are attached to the graphene coating layer (33).

8. The dense busbar trunking of the dynamic heat-conducting air duct heat dissipation structure according to claim 7, characterized in that: The top of the graphene pad one (34) and the bottom of the graphene pad two (35) are both formed with several arc-shaped grooves (36). Several rectangular through grooves three (37) are opened on the graphene pad one (34) and the graphene pad two (35) respectively, which are connected to the rectangular through groove one (10) and the rectangular through groove two (12), so that they can form a connected state and realize air duct heat dissipation.

9. The dense busbar trunking of a dynamic heat-conducting air duct heat dissipation structure according to claim 8, characterized in that: Both sides of the vertical flow channel (11) are provided with graphene air-cooling heat dissipation thin layers (38) that are in contact with graphene pad one (34) and graphene pad two (35). Several heat dissipation fins (39) are fixedly provided on the side of side plate one (4) and side plate two (5) away from the conductive busbar (2).

10. The dense busbar trunking of a dynamic heat-conducting air duct heat dissipation structure according to claim 9, characterized in that: The graphene pads one (34) and two (35) are bonded to the graphene coating layer (33) and the graphene air-cooled heat dissipation thin layer (38) by graphene-modified thermally conductive adhesive and hot-pressed composite molding to fill the air gaps, eliminate interfacial thermal resistance, make the intermolecular bonding stronger, and thus improve the thermal conductivity.

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