Method and system for transmitting data collected by a device, and semiconductor process equipment

Abstract

The embodiment of the present application provides a kind of equipment acquisition data transmission method, system and semiconductor process equipment, method is applied to the bridge layer in equipment acquisition data transmission system, equipment acquisition data transmission system also includes at least two semiconductor equipment ends;Method includes: based on the data packet of specified communication protocol from the at least two semiconductor equipment ends reception;The data packet of the at least two semiconductor equipment ends has not exactly the same field format and data format;According to the data to be transmitted in the data packet determines target data, and the target data is sent to equipment data acquisition system, the target data has the data form that equipment data acquisition system can identify, and has consistent field format and data format.It improves scalability.

Description

Technical Field

[0001] This invention belongs to the field of computer technology, and in particular relates to a method and system for transmitting data collected by a device, as well as semiconductor process equipment. Background Technology

[0002] The Equipment Data Acquisition (EDA / Interface A) standard is a semiconductor equipment communication standard developed by the Semiconductor Equipment and Materials International (SEMI). Currently, most factories use the EDA standard to collect data from their equipment.

[0003] Currently, semiconductor devices often transmit data to EDA systems through middleware. However, in real-world scenarios, semiconductor devices vary widely in type and software, often requiring separate middleware for each device, resulting in poor scalability. Summary of the Invention

[0004] This invention provides a method, system, and semiconductor process equipment for transmitting data acquired by a device, in order to solve the problem of poor scalability of data transmission in related technologies.

[0005] To solve the above-mentioned technical problems, the technical solution of the present invention is implemented as follows: In a first aspect, the present invention provides a method for transmitting data acquired by a device, the method being applied to a bridging layer in a data transmission system for device acquisition, the data transmission system further comprising at least two semiconductor device terminals; the method comprising: Data packets are received from the at least two semiconductor devices based on a specified communication protocol; the data packets from the at least two semiconductor devices have not completely identical field formats and data formats. The target data is determined based on the data to be transmitted in the data packet, and the target data is sent to the device data acquisition system. The target data has a data format that the device data acquisition system can recognize, and has a consistent field format and data format.

[0006] In a second aspect, the present invention provides a data transmission system for device acquisition, the data transmission system for device acquisition includes a bridging layer and at least two semiconductor device ends; Any of the semiconductor devices is used to generate and send data packets based on a specified communication protocol; The bridging layer is used to receive the data packets from the at least two semiconductor devices based on the specified communication protocol; the data packets from the at least two semiconductor devices have not completely identical field formats and data formats. The bridging layer is used to determine target data based on the data to be transmitted in the data packet, and send the target data to the device data acquisition system. The target data has a data format that the device data acquisition system can recognize, and has a consistent field format and data format.

[0007] Thirdly, the present invention provides an electronic device comprising: a processor, a memory, and a computer program stored in the memory and executable on the processor, characterized in that the processor executes the program to implement the method described in the first aspect above.

[0008] Fourthly, the present invention provides a readable storage medium that, when instructions in the storage medium are executed by a processor of an electronic device, enables the electronic device to perform the method described in the first aspect.

[0009] Fifthly, the present invention also provides a semiconductor process apparatus having the bridging layer in the data acquisition transmission system described in the second aspect and a semiconductor device terminal.

[0010] The data transmission method for device acquisition provided in this embodiment of the invention is applied to the bridging layer of a data transmission system for device acquisition. This data transmission system also includes at least two semiconductor device ends. In this embodiment, the control program of any device end can generate data packets and send them to the bridging layer using a specified communication protocol. Therefore, different semiconductor device ends can communicate with the bridging layer using a unified specified communication protocol. Simultaneously, this embodiment of the invention determines target data that is recognizable by the EDA system and has a consistent field and data format based on the data to be transmitted in the data packet. This standardization of data can be achieved within the bridging layer, enabling data to be transmitted from different semiconductor device ends to be sent to the EDA system in a format recognizable by the EDA system. This avoids the problem of needing to develop separate bridging layers for different semiconductor device ends when there are diverse semiconductor device types and significant software differences. By using a specified communication protocol and the bridging layer provided in this embodiment, the differences between different semiconductor device ends can be shielded to a certain extent, achieving unified communication with heterogeneous devices. This greatly reduces the development cost of the bridging layer. Furthermore, when a new semiconductor device end needs to be connected, there is no need to modify the bridging layer again, improving scalability and reducing the cost of system maintenance and upgrades. Attached Figure Description

[0011] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0012] Figure 1 This is a flowchart illustrating the steps of a data transmission method for device acquisition provided in an embodiment of the present invention; Figure 2 This is a communication structure diagram provided in an embodiment of the present invention; Figure 3 This is a schematic diagram illustrating the data transmission process of a device in related technologies. Figure 4 This is a schematic diagram of a CTC device-side data and EDA system data standard provided by an embodiment of the present invention; Figure 5 This is a diagram illustrating the effect of device data acquisition provided in an embodiment of the present invention; Figure 6 This is a schematic diagram of the structure of a data acquisition and transmission system provided in an embodiment of the present invention; Figure 7 This is a schematic diagram of the data transmission process for device acquisition provided in an embodiment of the present invention; Figure 8 This is a structural diagram of an electronic device provided in an embodiment of the present invention. Detailed Implementation

[0013] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0014] The terms "first," "second," etc., used in the specification and claims of this invention are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, the first object can be one or more. Furthermore, the term "and / or" in the specification and claims is used to describe the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. In embodiments of this invention, the term "multiple" refers to two or more, and other quantifiers are similar.

[0015] Figure 1 This is a flowchart illustrating the steps of a device data acquisition and transmission method according to an embodiment of the present invention. This method can be applied to the bridging layer of a device data acquisition and transmission system. The device data acquisition and transmission system may further include at least two semiconductor device ends, such as… Figure 1 As shown, the method may include the following steps: Step 101: Receive data packets from the at least two semiconductor devices based on a specified communication protocol; the data packets from the at least two semiconductor devices have not completely identical field formats and data formats.

[0016] Step 102: Determine the target data based on the data to be transmitted in the data packet, and send the target data to the device data acquisition system. The target data has a data format that the device data acquisition system can recognize, and has a consistent field format and data format.

[0017] Regarding steps 101-102 above, the data transmission system for device acquisition in this embodiment of the invention may include a bridging layer and at least two semiconductor device ends. The semiconductor device ends may be Cluster Tool Controllers (CTCs). The bridging layer refers to the system functional layer used to connect the CTC and the EDA system; it acts as a bridge between the CTC and the EDA system, enabling communication and data transmission between them.

[0018] It should be noted that an EDA system includes an EDA server and an EDA client. For example, Figure 2 This is a communication structure diagram provided in an embodiment of the present invention, such as... Figure 2As shown in the diagram, it includes an EDA server, multiple EDA clients, and a CTC device. Figure 2 As shown, the EDA client and EDA server can communicate using the Interface A standard. The EDA server and CTC device can communicate using the CTCInterface standard. EDA adheres to several SEMI standards, including: SEMI E120 Common Equipment Model (CEM) specification, SEMI E125 Equipment Self Description (EQSD) specification, SEMI E128 Synchronous / Asynchronous Message Header Definition Specification for Sending and Receiving Messages, SEMI E132 Device User Acceptance and Authorization Specification, SEMI E134 Data Collection Management Specification, SEMI E138 Parameter Type Definition Specification, and SEMI E164 EDA Common Metadata Specification.

[0019] Furthermore, the Interface A standard facilitates and improves communication between factory data acquisition software applications and factory equipment. Factories use the EDA standard (SEMI Interface A) to collect specific process parameter data from equipment. The factory then uses this collected data for data analysis to determine how to better improve productivity and achieve cost reduction and efficiency improvement.

[0020] Specifically, the EDA server can receive the Data Collection Plan (DCP) sent by the EDA client, then obtain the corresponding process parameter values ​​from the CTC device and feed them back to the EDA client. Alternatively, the EDA server can obtain device data from the CTC device via EDABridge and upload it to the EDA client. Figure 3 As shown, Figure 3 This diagram illustrates the transmission of data collected by a device in a related technology. The CTC device is activated, and the EDA server establishes communication with the corresponding CTC device. The EDA client also establishes communication with the EDA server. The client defines a Data Collection Plan (DCP) according to the SEMIInterface A standard and sends the DCP activation to the EDA server. Further, after receiving the DCP defined by the EDA client for the corresponding device, the EDA server sends the data to be collected to the CTC device. The CTC device then feeds back the corresponding device data to the EDA server. Finally, the EDA server feeds back the data collected by the client from the corresponding device.

[0021] The aforementioned semiconductor equipment can be the cluster device control program (CTC). It can connect upwards to factory interface software, transmitting relevant equipment information to the factory control center, receiving and executing production instructions from the factory host, and simultaneously feeding back equipment operation information to the factory client. Downwards, it can connect to lower-level software such as Platform Management Component Interconnect (PMCI), controlling the coordinated operation of these lower-level software programs to achieve higher machine productivity.

[0022] Furthermore, the data transmission system for device acquisition in this embodiment of the invention may include at least two semiconductor device ends. These at least two semiconductor device ends may be CTCs of different categories of process equipment, or CTCs of the same category but different models of process equipment. For example, etching equipment and thin film deposition equipment belong to two different categories of process equipment, and correspondingly, their respective CTCs belong to two different CTCs. Alternatively, etching equipment model 1 and etching equipment model 2 belong to the same category but different models of process equipment, and correspondingly, their respective CTCs also belong to two different CTCs. It is understood that the field formats and data formats of data packets from different CTCs often differ; accordingly, the data packets of the aforementioned at least two semiconductor devices have not completely identical field formats and data formats.

[0023] Optionally, in practical scenarios, the bridging layer in this embodiment of the invention can be deployed in each semiconductor device.

[0024] The specified communication protocol can be invoked through a pre-defined communication protocol interface. This interface can be a pre-generated software interface based on the specified communication protocol, which can be used for communication between the bridging layer and the CTC. Specifically, the specified communication protocol may include a standard format for data packets transmitted between the CTC and the bridging layer, and may include at least one of an encoding format and a field naming format. Accordingly, any CTC can invoke the specified communication protocol to generate data packets conforming to the standard format and send them to the bridging layer.

[0025] The specified communication protocol interface can be added as a library to the CTC library file. During operation, CTC can call this specified communication protocol interface contained in the library file to generate data packets and send them to the bridging layer. The bridging layer can then receive these data packets through this specified communication protocol interface.

[0026] The data to be transmitted refers to the device data contained in the data packet. The target data can be device data required by the EDA system, and it must have a consistent field format and data format, and be in a data form recognizable by the EDA system.

[0027] The field format and data format of the target data can be pre-set specified field format and specified data format. In one embodiment, after receiving a data packet, the present invention can convert all the data to be transmitted in the data packet into a data format recognizable by the EDA system, and make its field format and data format specified, so as to obtain data to be transmitted with uniform field format and data format and data format recognizable by the EDA system. Further, the target data can be determined from the converted data to be transmitted based on the acquisition requirements of the EDA system. Optionally, in another embodiment, the present invention can first determine the target data to be transmitted required by the EDA system from the data to be transmitted based on the acquisition requirements of the EDA system, and then convert the target data to be transmitted into a data format recognizable by the EDA system, and make its field format and data format specified, so as to obtain target data with uniform field format and data format and data format recognizable by the EDA system. Of course, other methods can also be selected to determine the target data based on the data to be transmitted, and the present invention does not limit the above methods of determining the target data.

[0028] Specifically, the bridging layer can receive data acquisition requests sent by the EDA system. These requests may carry the category of data the EDA system needs to acquire. Accordingly, this embodiment of the invention can determine the target data required by the EDA system based on the data category carried in the data acquisition request and the data to be transmitted in the data packet. Further, the target data can be sent to the device data acquisition system. Specifically, the target data can be sent through the connection interface between the EDA system and the bridging layer, either by sending the target data to the EDA server, and the EDA server can then further send the target data to the EDA client.

[0029] In summary, the data transmission method for device acquisition provided in this embodiment of the invention is applied to the bridging layer of a data transmission system for device acquisition. This data transmission system also includes at least two semiconductor device ends. In this embodiment, the control program of any device end can generate data packets and send them to the bridging layer using a specified communication protocol. Therefore, different semiconductor device ends can communicate with the bridging layer using a unified specified communication protocol. Furthermore, by determining the target data that the EDA system can recognize and that has a consistent field and data format based on the data to be transmitted in the data packet, this embodiment of the invention can standardize the data within the bridging layer. This allows data to be transmitted from different semiconductor device ends to be sent to the EDA system in a format recognizable by the EDA system, avoiding the need for separate development of a bridging layer for different semiconductor device ends when there are diverse types and significant software differences. By using a specified communication protocol and the bridging layer provided in this embodiment, the differences between different semiconductor device ends can be shielded to a certain extent, achieving unified communication with heterogeneous devices. This significantly reduces the development overhead of the bridging layer. Moreover, when a new semiconductor device end needs to be connected, there is no need to modify the bridging layer again, improving scalability and reducing the cost of system maintenance and upgrades.

[0030] Optionally, the operation of determining the target data based on the data to be transmitted in the data packet in step 102 above may specifically include, in this embodiment of the invention: S1021. Convert the data to be transmitted in the data packets of the at least two semiconductor devices into the target form of the data to be transmitted according to the preset conversion relationship.

[0031] S1022. Determine the target data from the data to be transmitted in the target form.

[0032] The target format can be a data format recognizable by the EDA system, and the field format and data format of the target format can be specified, respectively. The preset conversion relationship can be used to convert the data to be transmitted sent by CTC into the target format. The target format can be determined based on the data standard adopted by the EDA system. Specifically, the preset conversion relationship can be pre-generated and stored in the bridging layer. Accordingly, when the bridging layer receives any data packet, it can convert the data to be transmitted in the data packet based on the preset conversion relationship to obtain the data to be transmitted in the target format.

[0033] Specifically, the aforementioned preset conversion relationship can be generated based on the data format corresponding to the data to be transmitted from the process equipment to which each CTC belongs and the target format recognizable by the EDA system. For example, if the alarm data collected by a CTC includes red, yellow, blue, and green levels, and the EDA system classifies alarm data into high, medium, and low levels, then this embodiment of the invention can generate a preset conversion relationship for the alarm data. For example, red alarm data of the CTC can be converted into high alarm, yellow alarm data and blue alarm data can be converted into medium alarm, and correspondingly, green alarm data can be converted into low alarm.

[0034] Optionally, embodiments of the present invention may further store the target format data to be transmitted in a preset storage area, and then determine the target data from the target format data to be transmitted stored in the preset storage area based on actual needs. The preset storage area may be a cache area in the bridging layer, or other pre-set memory, which can be configured according to actual needs; embodiments of the present invention do not impose any limitations on this. Furthermore, embodiments of the present invention may, after converting the received data to be transmitted into the target format, store the target format data to be transmitted in the preset storage area, achieving unified storage management of the converted standardized data, and thus facilitating quick access and retrieval of data through the preset storage area.

[0035] In this embodiment of the invention, by using a preset conversion relationship, all data to be transmitted sent by any CTC can be converted into data to be transmitted that can be recognized by the EDA system and that has the same field format and data format. This achieves data standardization, which makes it easier to determine the target data from the data to be transmitted and send it. This can improve the convenience of determining the target data based on the data to be transmitted to a certain extent.

[0036] Optionally, in this embodiment of the invention, the data to be transmitted is generated in the following manner: S21. Collect data from the target process equipment to obtain initial equipment data; the target process equipment is the process equipment to which the semiconductor equipment belongs.

[0037] S22. Select the data adaptation interface corresponding to the device data category of the initial device data as the target data adaptation interface.

[0038] S23. The initial device data is converted into the data to be transmitted using the target data adaptation interface.

[0039] The aforementioned equipment data categories refer to the data categories of process equipment. In one scenario, these categories may include alarms, events, parameters, and SEMI objects. Alarms refer to abnormal or warning information from process equipment, along with their immediate processing information. Events can record changes in equipment status or operations. Parameters can include process data and production parameters. Objects can be data objects conforming to SEMI standards. It should be noted that equipment data from different process equipment are often categorized into these equipment data categories.

[0040] The aforementioned target process equipment refers to the process equipment belonging to the semiconductor equipment terminal, meaning that the semiconductor equipment terminal operates on the target process equipment. Furthermore, the CTC can collect data from the target process equipment to obtain initial equipment data. Specifically, the CTC can obtain data from the target process equipment through a host computer or slave computer connected via communication. For example, the initial equipment data may include equipment fault alarm data, system events, operation logs, etc.

[0041] Optionally, the initial device data can be data belonging to the same device data category or data containing different device data categories. It can be set according to the actual needs of CTC, and the embodiments of the present invention do not impose any restrictions on this.

[0042] The aforementioned data adaptation interface can be pre-generated and used to convert initial device data of various device data categories into a predefined unified format. Specifically, different device data categories correspond to different data adaptation interfaces, which can include definitions of interface naming, parameter structure, and calling method. For example, for the alarm category, the corresponding data adaptation interface can define an alarm reporting function interface named ReportAlarm(). The parameter structure of this reporting function can include alarm code, alarm level, timestamp, description, and device ID. The calling method of this reporting function can be synchronous or asynchronous. Accordingly, by calling this data adaptation interface, the semiconductor device can convert the interface, parameter structure, and calling method in the initial device data into data to be transmitted that conforms to the definition of the data adaptation interface.

[0043] Optionally, multiple data adaptation interfaces corresponding to different device data categories can be pre-generated. Accordingly, the interface name of the data adaptation interface for different device data categories can be consistent with its corresponding device data category. Accordingly, the semiconductor device can select the data adaptation interface whose interface name is consistent with the device data category from the multiple data adaptation interfaces as the target data adaptation interface based on the device data category of each initial device data.

[0044] Optionally, pre-generated data adaptation interfaces corresponding to different device data categories can be added as libraries to the library files on the semiconductor device side.

[0045] Furthermore, the semiconductor device side can convert the initial device data into data to be transmitted by calling the corresponding target data adaptation interface based on the data category of the initial device data.

[0046] In this embodiment of the invention, by using data adaptation interfaces for different device data categories, it is possible to convert the initial device data using data adaptation interfaces on different semiconductor device ends. Using the same data adaptation interface to convert data of the same device data category on different devices can, to a certain extent, shield the differences in data of the same device data category on different devices, further improve scalability, and achieve decoupling between the bridging layer and the semiconductor device end.

[0047] Optionally, embodiments of the present invention may further include: S31. Receive a communication connection request; the communication connection request is sent by any of the semiconductor devices through a Uniform Resource Locator included in the specified communication protocol.

[0048] S32. Verify the request parameters carried in the communication connection request.

[0049] S33. If the request parameters pass the verification, establish communication with the semiconductor device through the specified communication protocol.

[0050] The aforementioned communication connection request can be sent by any semiconductor device using a Uniform Resource Locator (URL) included in a specified communication protocol. Specifically, the communication connection request can be triggered by the semiconductor device when there is a data reporting requirement. The URL can be a pre-configured address string for the bridging layer, pre-encapsulated within a specified communication protocol, allowing the semiconductor device to determine whether to establish communication with the bridging layer via the URL based on the specified communication protocol.

[0051] Specifically, when the semiconductor device sends a communication connection request, it can add pre-set verification parameters as request parameters based on the requirements of a specified communication protocol. Further, if the communication connection request received by the bridging layer is generated by calling the specified communication protocol, the aforementioned request parameters carried in the communication connection request can be pre-set verification parameters in the specified communication protocol. Accordingly, upon receiving a communication connection request, the bridging layer can determine whether the request parameters carried in the communication connection request are consistent with the pre-set verification parameters in the specified communication protocol. If they are consistent, the verification is considered successful, and a handshake message is sent to the semiconductor device through the specified communication protocol to establish communication with the semiconductor device. Conversely, if they are inconsistent, the verification is considered unsuccessful, and a handshake message does not need to be sent to the semiconductor device.

[0052] In this embodiment of the invention, by specifying the URL included in the communication protocol, any semiconductor device can establish communication with the bridging layer via the URL, thereby shielding the differences between different device software and realizing unified access with heterogeneous devices.

[0053] Optionally, the data packet in this embodiment of the invention is generated in the following manner: The data to be transmitted is packaged according to the data packet format defined by the specified communication protocol to obtain the data packet; the data packet format includes at least one of the data encoding format and field naming format.

[0054] Specifically, the aforementioned data packet format may include at least one of a data encoding format and a field naming format. The data encoding format may include various encoding definitions within the data packet, and the field naming format may include the definitions of each field within the data packet. For example, in a specified communication protocol, the encoding format of the data packet may be set to a numeric format. Correspondingly, the semiconductor device may convert all data to be transmitted into numeric format according to the specified communication protocol. Optionally, in a specified communication protocol, the field naming format of the data packet may be set as Device Identifier: ID; Device Name: Name…, in which case the semiconductor device may name all device identifiers in the data to be transmitted as ID and all device names as Name according to this field naming format.

[0055] Optionally, the above data packet format may also include an invocation method. The invocation method defines how the specified communication protocol is invoked, and may include synchronous invocation, asynchronous invocation, etc.

[0056] In this way, different semiconductor devices can generate data packets to be transmitted according to the data packet format defined by the specified communication protocol. Through this specified communication protocol, all semiconductor devices can package the data to be transmitted into data packets according to the data encoding format and field naming format defined by the specified communication protocol. This ensures that all semiconductor devices follow the same communication protocol, data encoding format, and field naming format, thus shielding the differences between different device software in terms of communication interface, data encoding format, and field naming format. This allows the semiconductor devices to only implement their own business logic, thereby improving system reusability and development efficiency.

[0057] Optionally, the preset conversion relationship includes a field mapping relationship and a type conversion relationship. The operation of converting the data to be transmitted in the data packets of the at least two semiconductor devices into the target form of the data to be transmitted according to the preset conversion relationship can specifically include, in this embodiment of the invention: S41. Based on the field mapping relationship, convert each field to be converted in the data packet to be transmitted in the data packet of the at least two semiconductor devices into its respective mapped target field.

[0058] S42. Based on the type conversion relationship, convert the data type of each field to be converted in the data to be transmitted in the data packets of the at least two semiconductor devices into the corresponding target type.

[0059] S43. Based on the converted data to be transmitted, generate the data to be transmitted in the target form.

[0060] The aforementioned field mapping relationship can include the mapping relationship between the field names of the data to be transmitted corresponding to different semiconductor devices and the field names of the same meaning field in the target format. The aforementioned type conversion relationship can include the conversion relationship between the data types of the data to be transmitted corresponding to different semiconductor devices and the data types of the same meaning field in the target format.

[0061] The fields to be converted mentioned above can be unconverted fields included in the field mapping relationship and type conversion relationship. The target fields mentioned above refer to the fields in the field mapping relationship that correspond to each field to be converted, and the target types mentioned above are the data types in the type conversion relationship that correspond to the data types of each field to be converted.

[0062] Specifically, based on any field to be converted, the target field corresponding to that field can be found in the field mapping relationship. Then, the target field in the data to be converted is replaced with the found target field. Furthermore, for the data type of any field to be converted, the target type corresponding to that field can be determined from the type conversion relationship. If the two are inconsistent, the field to be converted can be converted to the target type using a preset semantic converter.

[0063] For example, Figure 4 This is a schematic diagram of a CTC device-side data and EDA system data standard provided by an embodiment of the present invention, such as... Figure 4 As shown, etching equipment and thin film equipment are different types of process equipment. The data types and field names of the same data type Alarm differ between them, as follows: Figure 4 As shown, the Alarm structures of etching equipment and thin film equipment are different, and the data types of the same meaning field RecoveryAction are also different. The EDA standard Alarm is a data structure provided in the standard interface (corresponding to the target form mentioned above). When implementing the interface, the device software can standardize and convert the Alarm structure according to the field function.

[0064] For example, with Figure 4 For example, the generated field mapping relationship can include mapping the Id of the etching device Alarm to the AlarmID of the EDA standard Alarm. The generated type conversion relationship can include converting the AlarmSeverity type of the etching or thin film device Alarm to the Severity type in the EDA standard Alarm. Of course, other fields to be converted and their data types can also be mapped and converted, which can be set according to the actual EDA standard, and will not be elaborated here.

[0065] Furthermore, after field mapping and type conversion, the target format of the data to be transmitted can be generated based on the converted data to be transmitted.

[0066] Specifically, in one scenario, if the target format does not impose further restrictions on the data structure, the converted data to be transmitted can be directly used as the data to be transmitted in the target format. Conversely, in another scenario, if the target format specifies a data structure, the converted data to be transmitted needs to be further packaged into data conforming to the data structure in the target format to obtain the data to be transmitted in the target format.

[0067] In this embodiment of the invention, by setting a preset conversion relationship that includes field mapping relationships and type conversion relationships, the data to be transmitted from different CTCs received can be converted into data in the same target form under the same data model within the bridging layer, thereby realizing unified management of data from heterogeneous devices.

[0068] Optionally, the operation of generating the target form of the data to be transmitted based on the converted data to be transmitted may specifically include, in this embodiment of the invention: S51. According to the data structure indicated by the target form, extract each target field and its corresponding target type sequentially from the converted data to be transmitted.

[0069] S52. The extracted target fields and their corresponding target types are sequentially filled into the data structure to obtain the data to be transmitted in the target form.

[0070] The data structures described above can include table structures, nested structures, etc. Understandably, the distribution of fields differs across different data structures. For example, taking a table structure, the data in a table structure could be:

[0071] If the above data is converted into a nested structure, it can be: {"Name": "Xiaoming",} "Contact Information": {"Telephone": "1234", "Address": "City A"} }

[0072] As can be seen from the above examples, the distribution of data varies in different data structures, and correspondingly, the methods for parsing data from the data structure also differ. Based on this, in order to facilitate the EDA system to receive data that conforms to its standards, the data to be transmitted can be further transformed based on the data structure indicated by the target form.

[0073] Specifically, each target field and its corresponding target type can be extracted sequentially from the converted data to be transmitted, according to the data structure indicated by the target format. Furthermore, the extracted target fields and target types can be sequentially filled into the data structure indicated by the target format to obtain the data to be transmitted in the target format.

[0074] Specifically, the distribution positions of each field and type can be determined based on the data structure indicated by the target form. Accordingly, the target fields or target types corresponding to each distribution position can be extracted from the data to be transmitted and filled in sequentially according to the distribution order of the distribution positions.

[0075] In this embodiment of the invention, by extracting and filling the target fields and target types of the data to be transmitted into the corresponding data structure according to the data structure indicated by the target form, the data structure of the converted data to be transmitted can be reorganized, thereby ensuring that the data to be transmitted conforms to a unified data structure, which facilitates subsequent unified storage and management.

[0076] Optionally, embodiments of the present invention may further include: S61. Receive a data acquisition task sent by the device data acquisition system; the data acquisition task includes at least the category to be acquired.

[0077] The operation of determining the target data from the target-form data to be transmitted described above may specifically include, in embodiments of the present invention: S62. From the data to be transmitted in the target form, determine the data to be transmitted that belongs to the data category to be collected as the target data.

[0078] The aforementioned data acquisition task can be a Data Collection Decision (DCP) issued by the EDA server based on the requirements of the EDA client. The DCP can include the data categories to be collected, i.e., the aforementioned categories to be collected. For example, the EDA system can issue a DCP instructing the collection of Alarm data, in which case Alarm can be used as the category to be collected.

[0079] Furthermore, after receiving a data acquisition task, this embodiment of the invention can, according to the data acquisition task, obtain data to be transmitted with the data category of the above-mentioned acquisition category from the data to be transmitted in the above-mentioned target form as target data.

[0080] It should be noted that the aforementioned DCP can be received through a pre-defined subscription interface. Specifically, embodiments of the present invention can pre-design a subscription manager and divide it into different subscription interfaces according to data categories. Each subscription interface can include subscription designs for various types of data, including subscription request methods, unsubscription methods, message push methods, and resource initialization and release methods. Filtering conditions can also be specified in the subscription interface designs for different data categories, such as filtering data in Alarm except for ID and Name. Correspondingly, this subscription interface can be provided to the EDA system, so that the EDA system can call the subscription interface and send a data acquisition task to the bridging layer according to the subscription method in the subscription interface, thereby subscribing to the device data of the category to be collected from the bridging layer through the data acquisition task. Specifically, the EDA system can send DCP and simultaneously receive CTC device data information through the data receiving interface provided in the subscription interface design.

[0081] Furthermore, in this embodiment of the invention, the data category of the data to be transmitted in the target form can be directly compared with the category to be collected, and the data to be transmitted that matches the comparison can be used as the target data.

[0082] In this embodiment of the invention, by receiving the acquisition task issued by the EDA system and obtaining the data to be transmitted that is consistent with the category to be acquired in the acquisition task from the data to be transmitted in the target form as the target data, the data can be filtered based on the acquisition task, and the unified management and filtering of device data can be realized in the bridging layer.

[0083] Optionally, the above data acquisition task also includes a data acquisition interval, which may specifically include, in embodiments of the present invention: S71. Determine the duration between the current time and the historical transmission time as the comparison duration; the historical transmission time is the time when the target data was last sent to the device data acquisition system.

[0084] S72. If the comparison time reaches the collection interval time, perform the operation of determining the data to be transmitted that belongs to the data category to be collected as the target data.

[0085] The aforementioned acquisition interval duration represents the acquisition frequency, meaning that the EDA system needs to acquire device data once every acquisition interval duration. Based on this, the embodiments of the present invention can determine the duration between the current time and the last time the target data was sent to the EDA system. Accordingly, when the comparison duration reaches the acquisition interval duration, it indicates that the target data needs to be sent to the EDA system again, and at this time, the operation of step S62 above can be executed.

[0086] Specifically, in step S71 above, after sending the target data to the EDA system, the present invention can start a preset timer. Accordingly, the timing duration of the preset timer is the comparison duration mentioned above. When the timing duration of the preset timer reaches the collection interval duration, it indicates that the comparison duration has reached the collection interval duration, and at this time, the operation of step S62 above can be performed.

[0087] In this embodiment of the invention, by determining the comparison duration and then performing the operation of acquiring target data when the comparison duration reaches the acquisition interval in the data acquisition task, the effect of periodically sending subscription data to the EDA system can be achieved, realizing efficient control and dynamic management of the data stream, and improving the reliability of data transmission and system response speed.

[0088] Furthermore, Figure 5 This is a diagram illustrating the effect of device data acquisition provided in an embodiment of the present invention, such as... Figure 5As shown, an EDA client refers to a user-end application that uses EDA software, typically for tasks such as chip design, simulation, and verification. It communicates with the EDA server via the Internet and Interface A. Furthermore, the EDA server communicates with the EDA bridging layer via a dedicated interface (EDACTClInterface) between the EDA system and the CTC, and via the Internet. The EDA bridging layer can connect with different CTCs through the interface (EDABridgeDataModel) provided in this embodiment of the invention. This interface can include the aforementioned specified communication protocol interface and data adaptation interface, allowing different CTCs to call the interface by referencing relevant library files to achieve data transmission.

[0089] It should be noted that, Figure 5 The EDA bridging layer and EDABridgeDataModel shown can be deployed on various process equipment along with CTC. At the same time, the bridging layer deployed on different process equipment is the same bridging layer, which is the bridging layer provided by the embodiments of the present invention.

[0090] Furthermore, Figure 6 This is a schematic diagram of the structure of a data transmission system for device acquisition provided in an embodiment of the present invention, as shown below. Figure 6 As shown, the device software corresponds to the aforementioned CTC. The bridging layer may include a communication module, a data management module, and an interface adaptation module. The communication module is the specified communication protocol interface mentioned above. The data storage module within the data management module represents a preset storage area used to store data to be transmitted. The data conversion module converts the data to be transmitted into the target format, and the data filtering module retrieves the target data required by the EDA server from the data storage module. The interface adaptation module represents the aforementioned data adaptation interface. (The text repeats itself here.) Figure 6 As shown, in the embodiments of the present invention, different device software can call the data adaptation interface and the specified communication protocol interface provided by the embodiments of the present invention through the reference library.

[0091] Furthermore, Figure 7 This is a schematic diagram of a data transmission process provided by an embodiment of the present invention, such as... Figure 7As shown, the EDA client in the EDA system can send a data acquisition plan to the EDA server. This data acquisition plan can include acquisition tasks for at least one device data category. Correspondingly, the EDA server can send a subscription request to the bridging layer based on DCP (Data Components). This subscription request can carry a subscription list for different data categories. The EDA bridging layer can then perform subscription message management, cache data information, and filter data. For example, when the lower-level device on the CTC device triggers or cancels alarm data, the CTC upper-level device can send this data to the bridging layer. The lower-level device can also send its parameter data. The lower-level device bridging layer can send lower-level events, lower-level parameters, and the current object to the bridging layer. Simultaneously, the CTC upper-level device can also send its alarms, events, parameters, etc. Correspondingly, the EDA bridging layer can report the data subscribed to by the EDA system to the EDA system based on subscription message management, data caching, and data filtering. The EDA server further reports the received subscription data to the EDA client.

[0092] In another embodiment, the present invention also provides a data transmission system for device acquisition, the data transmission system for device acquisition includes a bridging layer and at least two semiconductor device terminals; Any of the semiconductor devices is used to generate and send data packets based on a specified communication protocol; The bridging layer is used to receive the data packets from the at least two semiconductor devices based on the specified communication protocol; the data packets from the at least two semiconductor devices have not completely identical field formats and data formats. The bridging layer is used to determine target data based on the data to be transmitted in the data packet, and send the target data to the device data acquisition system. The target data has a data format that the device data acquisition system can recognize, and has a consistent field format and data format.

[0093] Optionally, the bridging layer is specifically used to: convert the data to be transmitted in the data packets of the at least two semiconductor devices into the target form of the data to be transmitted according to a preset conversion relationship; Determine the target data from the data to be transmitted in the target form.

[0094] Optionally, the data to be transmitted is generated in the following manner: Data from the target process equipment is collected to obtain initial equipment data; the target process equipment is the process equipment to which the semiconductor equipment belongs. Select the data adaptation interface corresponding to the device data category of the initial device data as the target data adaptation interface; The initial device data is converted into the data to be transmitted using the target data adaptation interface.

[0095] Optionally, the bridging layer is further used for: Receive a communication connection request; the communication connection request is sent by any of the semiconductor devices through a Uniform Resource Locator included in the specified communication protocol; The request parameters carried in the communication connection request are validated; If the request parameters pass verification, communication is established with the device control program through the specified communication protocol interface.

[0096] Optionally, the data packet is generated in the following manner: The data to be transmitted is packaged according to the data packet format defined by the specified communication protocol to obtain the data packet; the data packet format includes at least one of the data encoding format and field naming format.

[0097] Optionally, the preset conversion relationship includes field mapping relationships and type conversion relationships; the bridging layer is specifically used for: Based on the field mapping relationship, each field to be converted in the data packet to be transmitted in the data packet of the at least two semiconductor devices is converted into its respective mapped target field; According to the type conversion relationship, the data type of each field to be converted in the data to be transmitted in the data packets of the at least two semiconductor devices is converted into the corresponding target type; Based on the converted data to be transmitted, the target data to be transmitted is generated.

[0098] Optionally, the bridging layer is specifically used for: According to the data structure indicated by the target form, extract each target field and its corresponding target type sequentially from the converted data to be transmitted; The extracted target fields and their corresponding target types are sequentially filled into the data structure to obtain the data to be transmitted in the target form.

[0099] Optionally, the bridging layer is further used for: Receives a data acquisition task sent by the device's data acquisition system; the data acquisition task includes at least one category to be acquired. From the data to be transmitted in the target form, the data to be transmitted that belongs to the data category to be collected is determined as the target data.

[0100] Optionally, the data acquisition task further includes an acquisition interval duration; the bridging layer is also used for: The duration between the current moment and the historical transmission moment is determined as the comparison duration; the historical transmission moment is the moment when the target data was last sent to the device data acquisition system. If the comparison time reaches the collection interval, the operation of determining the data to be transmitted that belongs to the data category to be collected as the target data is performed.

[0101] Optionally, the device data categories include at least alarms, events, parameters, and objects.

[0102] Optionally, the bridging layer is deployed in each of the semiconductor devices.

[0103] The device data acquisition and transmission system provided in this embodiment of the invention allows any device-side control program to generate data packets and send them to the bridging layer via a specified communication protocol. This enables different semiconductor devices to communicate with the bridging layer using a unified specified communication protocol. Furthermore, by determining the target data with consistent field and data formats recognizable by the EDA system based on the data to be transmitted in the data packets, this embodiment of the invention standardizes the data within the bridging layer. This ensures that data sent by different semiconductor devices can be transmitted to the EDA system in a format recognizable by the EDA system, avoiding the need for separate bridging layer development for different semiconductor device types with significant software differences. By using the specified communication protocol and the bridging layer provided in this embodiment, the differences between different semiconductor devices can be shielded to a certain extent, achieving unified communication with heterogeneous devices. This significantly reduces the development overhead of the bridging layer. Moreover, when a new semiconductor device needs to be connected, there is no need to modify the bridging layer again, improving scalability and reducing system maintenance and upgrade costs.

[0104] The present invention also provides a semiconductor process apparatus, which deploys the bridging layer in the data acquisition transmission system described in the above embodiments and a semiconductor device terminal.

[0105] The present invention also provides an electronic device, see [link to relevant documentation]. Figure 8 The device includes a processor 301, a memory 302, and a computer program 3021 stored in the memory and executable on the processor. When the processor executes the program, it implements the data transmission method for the device acquisition described in the foregoing embodiments.

[0106] It should be noted that the electronic devices in the embodiments of the present invention include mobile electronic devices and non-mobile electronic devices.

[0107] The processor can be a CPU (Central Processing Unit), a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), a FPGA (Field Programmable Gate Array), or other programmable devices, transistor logic devices, hardware components, or any combination thereof. The processor can also be a combination that implements computational functions, such as a combination of one or more microprocessors, or a combination of a DSP and a microprocessor.

[0108] The communication bus may include a path for transmitting information between the memory and the communication interface. The communication bus may be a PCI (Peripheral Component Interconnect) bus or an EISA (Extended Industry Standard Architecture) bus, etc. The communication bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Figure 6 The symbol is represented by only one line, but this does not mean that there is only one bus or one type of bus.

[0109] The memory may be ROM (Read Only Memory) or other types of static storage devices that can store static information and instructions, RAM (Random Access Memory) or other types of dynamic storage devices that can store information and instructions, or it may be EEPROM (Electrically Erasable Programmable Read Only Memory), CD-ROM (Compact Disk Read Only), magnetic tape, floppy disk and optical data storage devices, etc.

[0110] The present invention also provides a readable storage medium, wherein when the instructions in the storage medium are executed by the processor of an electronic device, the electronic device is able to perform the device data acquisition transmission method of the foregoing embodiments.

[0111] The present invention also provides a computer program product containing instructions that, when run on a computer, cause the computer to perform... Figure 1 The method for transmitting data collected by the device is shown.

[0112] The present invention also provides a chip, the chip including a processor and a communication interface, the communication interface being coupled to the processor, the processor being used to run programs or instructions to implement the various processes of the above-described data acquisition and transmission method embodiments, and achieving the same technical effect. To avoid repetition, further details are omitted here.

[0113] As the device embodiment is basically similar to the method embodiment, the description is relatively simple, and relevant parts can be found in the description of the method embodiment.

[0114] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, apparatus, or computer program products. Therefore, embodiments of the present invention can be implemented wholly or partially by software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented wholly or partially as a computer program product. The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of the present invention are generated. The computer can be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions can be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions can be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium can be any available medium accessible to a computer or a data storage device such as a server or data center that integrates one or more available media. The available media may be magnetic media (e.g., floppy disks, hard disks, magnetic tapes), optical media (e.g., DVDs), or semiconductor media (e.g., solid state disks (SSDs)).

[0115] Embodiments of the present invention are described with reference to flowchart illustrations and / or block diagrams of methods, terminal devices (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing terminal device to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing terminal device, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1A device that provides the functions specified in one or more boxes.

[0116] The algorithms and displays provided herein are not inherently related to any particular computer, virtual system, or other device. Various general-purpose systems can also be used in conjunction with the teachings herein. The required structure for constructing such systems is apparent from the above description. Furthermore, this invention is not directed to any particular programming language. It should be understood that the contents of the invention described herein can be implemented using various programming languages, and the above description of specific languages ​​is for the purpose of disclosing the best mode of implementation of the invention.

[0117] Numerous specific details are set forth in the specification provided herein. However, it will be understood that embodiments of the invention may be practiced without these specific details. In some instances, well-known methods, structures, and techniques have not been shown in detail so as not to obscure the understanding of this specification.

[0118] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the embodiments of the present invention.

[0119] The various embodiments in this specification are described in a related manner. Similar or identical parts between embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, the system embodiments are basically similar to the method embodiments, so the description is relatively simple; relevant parts can be referred to the descriptions of the method embodiments.

[0120] Similarly, it should be understood that, in order to simplify the invention and aid in understanding one or more of the various inventive aspects, in the above description of exemplary embodiments of the invention, various features of the invention are sometimes grouped together in a single embodiment, figure, or description thereof. However, this disclosure should not be construed as reflecting an intention that the claimed invention requires more features than are expressly recited in each claim. Rather, as reflected in the following claims, inventive aspects lie in fewer than all features of a single foregoing disclosed embodiment. Therefore, the claims following the detailed description are hereby expressly incorporated into this detailed description, wherein each claim itself is a separate embodiment of the invention.

[0121] Those skilled in the art will understand that modules in the device of the embodiments can be adaptively changed and placed in one or more devices different from that embodiment. Modules, units, or components in the embodiments can be combined into a single module, unit, or component, and further, they can be divided into multiple sub-modules, sub-units, or sub-components. Except where at least some of such features and / or processes or units are mutually exclusive, any combination can be used to combine all features disclosed in this specification (including the accompanying claims, abstract, and drawings) and all processes or units of any method or device so disclosed. Unless expressly stated otherwise, each feature disclosed in this specification (including the accompanying claims, abstract, and drawings) may be replaced by an alternative feature that serves the same, equivalent, or similar purpose.

[0122] The various component embodiments of the present invention can be implemented in hardware, or as software modules running on one or more processors, or a combination thereof. Those skilled in the art will understand that microprocessors or digital signal processors (DSPs) can be used in practice to implement some or all of the functions of some or all of the components in the sorting device according to the present invention. The present invention can also be implemented as a device or apparatus program for performing part or all of the methods described herein. Such a program implementing the present invention can be stored on a computer-readable medium, or can be in the form of one or more signals. Such signals can be downloaded from an Internet website, provided on a carrier signal, or provided in any other form.

[0123] Finally, it should be noted that in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or terminal device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or terminal device. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or terminal device that includes said element.

[0124] Those skilled in the art will understand that, for the sake of convenience and brevity, the specific working processes of the systems, devices, and units described above can be referred to the corresponding processes in the foregoing method embodiments, and will not be repeated here.

[0125] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

[0126] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A method for transmitting data acquired by a device, characterized in that, The method is applied to a bridging layer in a data transmission system for device acquisition, the data transmission system further comprising at least two semiconductor device terminals; the method includes: Data packets are received from the at least two semiconductor devices based on a specified communication protocol; the data packets from the at least two semiconductor devices have not completely identical field formats and data formats. The target data is determined based on the data to be transmitted in the data packet, and the target data is sent to the device data acquisition system. The target data has a data format that the device data acquisition system can recognize, and has a consistent field format and data format.

2. The method according to claim 1, characterized in that, Determining the target data based on the data to be transmitted in the data packet includes: According to a preset conversion relationship, the data to be transmitted in the data packets of the at least two semiconductor devices is converted into the target form of the data to be transmitted. Determine the target data from the data to be transmitted in the target form.

3. The method according to claim 1, characterized in that, The data to be transmitted is generated in the following manner: Data from the target process equipment is collected to obtain initial equipment data; the target process equipment is the process equipment to which the semiconductor equipment belongs. Select the data adaptation interface corresponding to the device data category of the initial device data as the target data adaptation interface; The initial device data is converted into the data to be transmitted using the target data adaptation interface.

4. The method according to claim 1, characterized in that, The method further includes: Receive a communication connection request; the communication connection request is sent by any of the semiconductor devices through a Uniform Resource Locator included in the specified communication protocol; The request parameters carried in the communication connection request are validated; If the request parameters pass verification, communication is established with the semiconductor device via the specified communication protocol.

5. The method according to claim 1, characterized in that, The data packet was generated in the following manner: The data to be transmitted is packaged according to the data packet format defined by the specified communication protocol to obtain the data packet; the data packet format includes at least one of data format and field format.

6. The method according to claim 2, characterized in that, The preset conversion relationship includes field mapping relationship and type conversion relationship; the step of converting the data to be transmitted in the data packets of the at least two semiconductor devices into the target form of the data to be transmitted according to the preset conversion relationship includes: Based on the field mapping relationship, each field to be converted in the data packet to be transmitted in the data packet of the at least two semiconductor devices is converted into its respective mapped target field; According to the type conversion relationship, the data type of each field to be converted in the data to be transmitted in the data packets of the at least two semiconductor devices is converted into the corresponding target type; Based on the converted data to be transmitted, the target data to be transmitted is generated.

7. The method according to claim 6, characterized in that, The process of generating the target-format data to be transmitted based on the converted data to be transmitted includes: According to the data structure indicated by the target form, extract each target field and its corresponding target type sequentially from the converted data to be transmitted; The extracted target fields and their corresponding target types are sequentially filled into the data structure to obtain the data to be transmitted in the target form.

8. The method according to claim 2, characterized in that, The method further includes: Receives a data acquisition task sent by the device's data acquisition system; the data acquisition task includes at least one category to be acquired. Determining the target data from the data to be transmitted in the target format includes: From the data to be transmitted in the target form, the data to be transmitted that belongs to the data category to be collected is determined as the target data.

9. The method according to claim 8, characterized in that, The data acquisition task also includes an acquisition interval; the method further includes: The duration between the current moment and the historical transmission moment is determined as the comparison duration; the historical transmission moment is the moment when the target data was last sent to the device data acquisition system. If the comparison time reaches the collection interval, the operation of determining the data to be transmitted that belongs to the data category to be collected as the target data is performed.

10. The method according to claim 3, characterized in that, The device data categories include at least alarms, events, parameters, and objects.

11. The method according to any one of claims 1-10, characterized in that, The bridging layer is deployed in each of the semiconductor devices.

12. A data transmission system for equipment acquisition, characterized in that, The data transmission system for the device includes a bridging layer and at least two semiconductor device terminals; Any of the semiconductor devices is used to generate and send data packets based on a specified communication protocol; The bridging layer is used to receive the data packets from the at least two semiconductor devices based on the specified communication protocol; The data packets from the at least two semiconductor devices have not completely identical field formats and data formats; The bridging layer is used to determine target data based on the data to be transmitted in the data packet, and send the target data to the device data acquisition system. The target data has a data format that the device data acquisition system can recognize, and has a consistent field format and data format.

13. A semiconductor process apparatus comprising the bridging layer of the data acquisition transmission system of claim 12 and a semiconductor device terminal.

14. An electronic device, characterized in that, include: The system includes a processor, a communication interface, a memory, and a communication bus; the processor, communication interface, and memory communicate with each other via the communication bus. Memory, used to store computer programs; A processor, when executing a program stored in memory, implements the steps of the method as described in any one of claims 1 to 11.

15. A readable storage medium, characterized in that, When the instructions in the readable storage medium are executed by the processor of the electronic device, the electronic device is able to perform the method of any one of claims 1 to 11.

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