A sound production portion

Abstract

One or more embodiments of this specification relate to a sound-generating part, comprising: a housing having at least one sound outlet and one or more pressure relief holes; a transducer including a diaphragm, a coil, a support, and a magnetic circuit assembly; a cavity inside the housing being divided by the diaphragm into a front cavity located on the front side of the diaphragm and a rear cavity located on the rear side of the diaphragm, the at least one sound outlet being acoustically coupled to the front cavity, and the one or more pressure relief holes being acoustically coupled to the rear cavity; the support surrounding the magnetic circuit assembly, the coil being connected to the diaphragm and at least partially located in the magnetic gap formed by the magnetic circuit assembly, wherein the diaphragm includes a main body region and a folded loop region surrounding the main body region; a first portion of the support being connected to the folded loop region, the thickness of the first portion being in the range of 0.5 mm to 2 mm, such that the resonant frequency of the rear cavity is not less than 4 kHz, the thickness of the first portion being the minimum distance between the connection area of ​​the support and the folded loop region and the area of ​​the support directly contacting the magnetic circuit assembly in the vibration direction of the diaphragm; the folded loop region including an arcuate segment, the ratio of the height of the arcuate segment to the span of the arcuate segment being in the range of 0.35 to 0.4.

Description

Cross-references

[0001] This application is a divisional application of Chinese application filed on March 24, 2023, with application number 202310328979.4, entitled "A Sound-Generating Part," which claims priority to Chinese application filed on December 30, 2022, with application number PCT / CN2022 / 144339, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This manual relates to the field of acoustics, and in particular to a sound-producing part. Background Technology

[0003] With the development of acoustic output technology, sound-generating components (such as headphones) have been widely used in people's daily lives. They can be used in conjunction with electronic devices such as mobile phones and computers to provide users with an auditory feast. The output performance of the sound-generating component has a significant impact on user comfort. The structure of the diaphragm and the supporting structure that cooperates with the diaphragm in the sound-generating component generally affect its output performance. Therefore, it is necessary to propose a sound-generating component with high output performance. Summary of the Invention

[0004] This specification provides a sound-generating part, including: a diaphragm; a magnetic circuit assembly; and a coil connected to the diaphragm and at least partially located in the magnetic gap formed by the magnetic circuit assembly. When energized, the coil drives the diaphragm to vibrate and generate sound. The diaphragm includes a main body region and a surround region enclosing the main body region; and a support surrounding the magnetic circuit assembly. A first portion of the support is connected to the surround region, and the thickness of the first portion is in the range of 0.3mm-3mm. The thickness of the first portion represents the minimum distance between the connection area of ​​the support and the surround region and the area where the support directly contacts the magnetic circuit assembly in the vibration direction of the diaphragm. With the above configuration, the sound-generating part can have a higher low-frequency output and a larger flat area in the frequency response curve of the rear cavity, thus improving the sound quality of the sound-generating part.

[0005] In some embodiments, the main body region includes a first inclined segment and a first connecting segment connected to the coil. The first inclined segment is in contact with a portion of the loop region, and the first inclined segment is inclined relative to the first connecting segment in a direction away from the coil. This arrangement prevents adhesive used for bonding the coil to the diaphragm from overflowing into the loop region, which could corrode the loop region and affect the diaphragm's vibration performance.

[0006] In some embodiments, the sound-generating part further includes a bracket surrounding the magnetic circuit assembly, the bracket being connected to a portion of the surround region away from the main body region, and the bracket having multiple vent holes; and a housing having pressure relief holes, wherein sound from the back of the diaphragm is transmitted to the pressure relief holes through the multiple vent holes, the multiple vent holes including at least a first vent hole and a second vent hole, the distance between the center of the first vent hole and the center of the pressure relief hole being greater than the distance between the center of the second vent hole and the center of the pressure relief hole, and the area of ​​the first vent hole being greater than the area of ​​the second vent hole. Through the above arrangement, the air pressure in the rear cavity can be balanced, resulting in more uniform force on the diaphragm and smoother low-frequency vibration of the sound-generating part.

[0007] In some embodiments, the folded ring region includes a second inclined segment, which at least partially abuts against the first inclined segment. This design prevents adhesive used for bonding the coil to the diaphragm from overflowing into the folded ring region, thus avoiding adhesive corrosion and impacting the diaphragm's vibration performance.

[0008] In some embodiments, the second inclined segment is located on the side of the first inclined segment opposite to the coil. This arrangement prevents adhesive from overflowing into the folded ring area when the coil is bonded to the diaphragm, thus avoiding adhesive corrosion of the folded ring area and affecting the diaphragm's vibration performance.

[0009] In some embodiments, the surround region includes an arc-shaped segment, the ratio of the height of the arc-shaped segment to the span of the arc-shaped segment being in the range of 0.35-0.4. This configuration allows the sound-producing part to have better output and lower distortion.

[0010] In some embodiments, the tilt angle of the first inclined segment relative to the first connecting segment is in the range of 5°-30°, and the first connecting segment is perpendicular to the vibration direction of the diaphragm. This configuration reduces the distortion of the sound-generating part and prevents corrosion of the surround area and its impact on vibration.

[0011] In some embodiments, the main body region includes a dome located at the end of the first connecting segment away from the first inclined segment. The span of the dome is in the range of 2mm-8mm, and the height of the dome is in the range of 0.7mm-1.2mm. This configuration allows the sound-generating part to have a suitable overall thickness and improves its vibration characteristics.

[0012] In some embodiments, the ratio of the height to the span of the dome is in the range of 0.1-0.3. This configuration allows the sound-generating part to have an appropriate overall thickness and improves its vibration characteristics.

[0013] In some embodiments, the frequency at which high-frequency segmented vibration occurs is not lower than 20 kHz. This configuration allows the diaphragm to have a wider high-frequency bandwidth while reducing the occurrence of high-frequency segmented vibration within the bandwidth region.

[0014] In some embodiments, the magnetic circuit assembly includes a housing, and the distance from the bottom of the coil to the bottom of the housing is in the range of 0.8mm-0.9mm in the frequency range of 20Hz-6.1kHz at an input voltage of 0.1V-0.7V.

[0015] In some embodiments, the sound-generating part further includes a bracket surrounding the magnetic circuit assembly, a first portion of which is connected to a second connecting segment of the folded ring region. This arrangement allows for the fixation of the bracket and the diaphragm.

[0016] In some embodiments, the second connecting segment of the folded ring region is connected to the first portion of the bracket via a fixing ring. This configuration allows for the fixation of the bracket and the diaphragm.

[0017] In some embodiments, the housing is provided with a pressure relief hole, and a rear cavity is formed between the pressure relief hole and the back surface of the diaphragm. The resonant frequency of the rear cavity is not less than 3.3 kHz. This configuration allows the frequency response curve of the rear cavity to have a large flat region, improving the sound quality of the sound-producing part.

[0018] In some embodiments, the volume of the rear cavity is 60 mm. 3 -110mm 3 Within the range.

[0019] In some embodiments, the sound-generating part further includes a housing with a pressure relief hole, and a plurality of vent holes on the support. Sound from the back of the diaphragm is transmitted to the pressure relief hole through the plurality of vent holes. In the direction of diaphragm vibration, the ratio of the total area of ​​the plurality of vent holes to the projected area of ​​the diaphragm is in the range of 0.008-0.3. This configuration ensures that the diaphragm experiences uniform and low air resistance during vibration, guaranteeing good output performance of the sound-generating part.

[0020] In some embodiments, the projected area of ​​the diaphragm is 90 mm² in the diaphragm vibration direction. 2 -560mm 2 Within the specified range, the total area of ​​the plurality of vent holes is 4.54 mm². 2 -12.96mm 2 Within the specified range. The above settings can provide the rear cavity with a good low-frequency response.

[0021] In some embodiments, the sound-generating part further includes a housing, wherein the ratio of the projected area of ​​the diaphragm to the projected area of ​​the housing in the diaphragm vibration direction is not less than 0.5. With the above arrangement, the diaphragm can have the largest possible area within the limited dimensions of the sound-generating part, thereby enhancing the acoustic output performance of the sound-generating part.

[0022] In some embodiments, the ratio of the projected area of ​​the diaphragm to the projected area of ​​the housing in the diaphragm vibration direction is in the range of 0.8-0.95. With the above configuration, the diaphragm can have the largest possible area within the limited dimensions of the sound-generating part, thereby enhancing the acoustic output performance of the sound-generating part.

[0023] In some embodiments, the major axis dimension of the diaphragm is in the range of 13mm-25mm, and the minor axis dimension of the diaphragm is in the range of 4mm-13mm. This configuration facilitates the insertion of the sound-producing part, either wholly or partially, into the concha to form an effective cavity-like structure, thereby enhancing the acoustic output performance of the sound-producing part.

[0024] In some embodiments, multiple vent holes are formed on the bottom wall of the housing of the magnetic circuit assembly or on the side wall that fits against the bracket. With this arrangement, sound from the back of the diaphragm can be transmitted to the rear cavity and pressure relief hole through the multiple vent holes, providing good sound radiation channels on both sides of the diaphragm.

[0025] In some embodiments, the dome is formed by interlaced carbon fibers, with at least some of the carbon fibers interlaced at a first angle, the first angle being in the range of 45°-90°. This arrangement increases the strength of the main body region and reduces its equivalent density.

[0026] In some embodiments, the thickness of the dome is less than 80 μm in the diaphragm vibration direction. This configuration reduces the weight of the main body region.

[0027] In some embodiments, the minimum distance between the coil and the first inclined section is not less than 0.3 mm. This arrangement ensures a safe distance between the loop area and the coil mounting position, preventing adhesive from overflowing into the loop area.

[0028] In some embodiments, the magnetic circuit assembly includes a magnetic guide plate and a magnet. The magnetic guide plate is located between the magnet and the diaphragm and is attached to the surface of the magnet. In the direction of diaphragm vibration, the distance between the center of the coil and the center of the magnetic guide plate is less than 0.3 mm. This arrangement ensures that, during the up-and-down vibration of the diaphragm, at least a portion of the coil can be located in a region of high magnetic flux density within the magnetic circuit assembly, thereby improving the magnetic field utilization efficiency of the magnetic circuit assembly.

[0029] In some embodiments, the distance from the lowest point of the dome to the upper surface of the magnetic plate is greater than 0.8 mm in the vibration direction of the diaphragm. This setting satisfies the maximum amplitude of the diaphragm, preventing it from colliding with the magnetic plate during vibration.

[0030] In some embodiments, the magnetic circuit assembly includes a housing, and the distance between the bottom of the coil and the bottom wall of the housing is in the range of 0.2mm-4mm in the vibration direction of the diaphragm. This arrangement avoids excessively large sound-generating parts and prevents coil collisions.

[0031] In some embodiments, the distance between the coil and the sidewall of the housing is in the range of 0.1mm-0.5mm. This arrangement helps prevent coil collisions and ensures that the magnetic field provides power to the diaphragm. Attached Figure Description

[0032] This specification will be further described by way of exemplary embodiments, which will be described in detail with reference to the accompanying drawings. These embodiments are not limiting; in these embodiments, the same reference numerals denote the same structures, wherein: Figure 1 This is a schematic diagram of an exemplary ear according to some embodiments of this application; Figure 2 These are exemplary wearing diagrams of open-back headphones according to some embodiments of this specification; Figure 3 These are exemplary wearing diagrams of open-back headphones according to some embodiments of this specification; Figure 4 This is an exemplary wearing diagram of another open-back headphone shown according to some embodiments of this specification; Figure 5 This is an exemplary distribution diagram of a cavity structure arranged around one of the two sound sources according to some embodiments of this specification; Figure 6 This is a schematic diagram of the exemplary internal structure of the sound-generating part according to some embodiments of this specification; Figure 7 These are exemplary external views of transducers shown according to some embodiments of this specification; Figure 8 This is an exemplary exploded view of a transducer shown according to some embodiments of this specification; Figure 9 This is an exemplary internal structure diagram of the sound-generating part shown according to some embodiments of this specification; Figure 10 These are exemplary structural diagrams of the diaphragm shown in some embodiments of this specification; Figure 11AThis is an exemplary high-frequency bandwidth schematic diagram of a sound-generating part according to some embodiments of this specification; Figure 11B This is a schematic diagram of an exemplary carbon fiber braiding structure shown in some embodiments of this specification; Figure 12 These are schematic diagrams illustrating the amplitude of the sound-generating part under different driving voltages according to some embodiments of this specification; Figure 13 This is an exemplary structural diagram of the rear cavity shown according to some embodiments of this specification; Figure 14 These are frequency response curves of the rear cavity corresponding to different thicknesses of the first part as shown in some embodiments of this specification; Figure 15 These are frequency response curves of the sound-generating part under different driving voltages, as shown in some embodiments of this specification. Figure 16 This is a schematic diagram illustrating the exemplary positions of the bracket and the first and second pressure relief holes according to some embodiments of this specification; and Figure 17 These are frequency response curves of the rear cavity corresponding to different total areas of vent holes, as shown in some embodiments of this specification. Detailed Implementation

[0033] To more clearly illustrate the technical solutions of the embodiments in this specification, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some examples or embodiments of this specification. For those skilled in the art, these drawings can be applied to other similar scenarios without creative effort. Unless obvious from the context or otherwise specified, the same reference numerals in the drawings represent the same structures or operations.

[0034] It should be understood that the terms “system,” “device,” “unit,” and / or “module” used herein are one way to distinguish different components, elements, parts, sections, or assemblies at different levels. However, if other terms can achieve the same purpose, they may be replaced by other expressions.

[0035] As indicated in this specification and claims, unless the context clearly indicates otherwise, the words "a," "an," "an," and / or "the" do not specifically refer to the singular and may also include the plural. Generally speaking, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements.

[0036] In the description of this specification, it should be understood that the terms "first," "second," "third," "fourth," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include at least one of that feature. In the description of this specification, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0037] In this specification, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, the term "connection" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this specification according to the specific circumstances.

[0038] Flowcharts are used in this specification to illustrate the operations performed by the system according to embodiments of this specification. It should be understood that the preceding or following operations are not necessarily performed in exact order. Instead, the steps can be processed in reverse order or simultaneously. Furthermore, other operations can be added to these processes, or one or more steps can be removed from them.

[0039] Figure 1 This is a schematic diagram of an exemplary ear according to some embodiments of this application. See also Figure 1The ear 100 may include an external auditory canal 101, a concha 102, a cymba conchae 103, a triangular fossa 104, an antihelix 105, a scaphoid fossa 106, a helix 107, an earlobe 108, and a crus of the helix 109. In some embodiments, the ear 100 may be used to wear and stabilize an acoustic device. In some embodiments, the external auditory canal 101, the concha 102, the cymba conchae 103, the triangular fossa 104, etc., have a certain depth and volume in three-dimensional space, which can be used to meet the wearing requirements of the acoustic device. For example, an acoustic device (e.g., an in-ear headphone) may be worn in the external auditory canal 101. In some embodiments, the ear 100 may be used to wear an acoustic device using other parts of the ear 100 besides the external auditory canal 101. For example, the cymba conchae 103, the triangular fossa 104, the antihelix 105, the scaphoid fossa 106, the helix 107, etc., or combinations thereof, may be used to wear an acoustic device. In some embodiments, to improve the comfort and reliability of the acoustic device during wear, it may be further utilized by the user's earlobe 108 or other parts of the ear. By utilizing parts of the ear 100 other than the external auditory canal 101 to achieve the wearing of the acoustic device and the propagation of sound, the user's external auditory canal 101 can be "liberated," reducing the impact of the acoustic device on the user's ear health. When the user wears the acoustic device on the road, the acoustic device will not block the user's external auditory canal 101, and the user can receive both the sound from the acoustic device and the sound from the environment (e.g., horns, car bells, surrounding voices, traffic signals, etc.), thereby reducing the probability of traffic accidents. For example, when the user wears the acoustic device, the entire or part of the acoustic device structure may be located on the front side of the helix 109 (e.g., Figure 1 The area J enclosed by the dashed line. For example, when a user wears the acoustic device, the entirety or part of the acoustic device may contact the upper part of the external auditory canal 101 (e.g., the location of one or more parts such as the crus of the helix 109, cymba conchae 103, triangular fossa 104, antihelix 105, scaphoid 106, and helix 107). For yet another example, when a user wears the acoustic device, the entirety or part of the acoustic device may be located within one or more parts of the ear (e.g., the cavity of the concha 102, cymba conchae 103, triangular fossa 104, etc.). Figure 1 The areas M1 and M2 are enclosed by the dashed lines.

[0040] Individual differences may exist among users, resulting in variations in ear shape, size, and other dimensional differences. For ease of description and understanding, unless otherwise specified, this specification will primarily use an ear model with a "standard" shape and size as a reference to further describe how the acoustic device in different embodiments is worn on this ear model. For example, a simulator containing the head and its (left and right) ears, such as GRAS KEMAR, HEAD Acoustics, B&K 4128 series, or B&K 5128 series, manufactured based on ANSI: S3.36, S3.25, and IEC: 60318-7 standards, can be used as a reference for wearing the acoustic device, thus representing the scenario of most users normally wearing the acoustic device. Taking GRAS KEMAR as an example, the ear simulator can be any one of GRAS 45AC, GRAS 45BC, GRAS 45CC, or GRAS 43AG. Using HEADAcoustics as an example, the ear simulator can be any one of HMS II.3, HMS II.3 LN, or HMS II.3LN HEC. It should be noted that the data range measured in the embodiments of this specification is based on GRAS 45BC KEMAR measurements. However, it should be understood that differences may exist between different head and ear models, and the relevant data range may fluctuate by ±10% when using other models. As an example only, the ear used for reference may have the following characteristics: the projection of the auricle onto the sagittal plane in the vertical axis direction can be in the range of 49.5mm-74.3mm, and the projection of the auricle onto the sagittal plane in the sagittal axis direction can be in the range of 36.6mm-55mm. The projection of the auricle onto the sagittal plane refers to the projection of the edge of the auricle onto the sagittal plane. The edge of the auricle is composed at least of the outer contour of the helix, the contour of the earlobe, the contour of the tragus, the intertragic notch, the antitragic cusp, and the helix-tragic notch. Therefore, in this application, descriptions such as "user wearing," "in wearing state," and "under wearing state" can refer to the acoustic device described in this application being worn on the ear of the aforementioned simulator. Of course, considering the individual differences among different users, the structure, shape, size, thickness, etc. of one or more parts of the ear 100 can be differentiated according to different ear shapes and sizes. These differentiated designs can be manifested in that the characteristic parameters of one or more parts of the acoustic device (e.g., the sound-emitting part, ear hook, etc. mentioned below) can have different ranges of values ​​to adapt to different ears.

[0041] It should be noted that in medicine, anatomy, and other fields, the human body can be defined by three basic planes: the sagittal plane, the coronal plane, and the horizontal plane; and three basic axes: the sagittal axis, the coronal axis, and the vertical axis. The sagittal plane is a section perpendicular to the ground along the anteroposterior direction of the body, dividing the body into left and right parts. The coronal plane is a section perpendicular to the ground along the left and right direction of the body, dividing the body into anterior and posterior parts. The horizontal plane is a section parallel to the ground along the vertical direction of the body, dividing the body into superior and inferior parts. Correspondingly, the sagittal axis is the axis along the anteroposterior direction of the body and perpendicular to the coronal plane; the coronal axis is the axis along the left and right direction of the body and perpendicular to the sagittal plane; and the vertical axis is the axis along the vertical direction of the body and perpendicular to the horizontal plane. Furthermore, the "anterior side of the ear" mentioned in this application refers to the side of the ear facing the human face along the sagittal axis. Specifically, by observing the ear of the simulator along the coronal axis of the human body, one can obtain... Figure 1 A schematic diagram of the front outline of the ear is shown.

[0042] The description of the ear 100 above is for illustrative purposes only and is not intended to limit the scope of this application. Those skilled in the art can make various changes and modifications based on the description in this application. For example, part of the acoustic device's structure can cover part or all of the external auditory canal 101. These changes and modifications are still within the protection scope of this application.

[0043] Figure 2 These are exemplary wearing diagrams of open-back headphones according to some embodiments of this specification. Figure 3 These are exemplary wearing diagrams of open-back headphones according to some embodiments of this specification. Figure 4 This is an exemplary wearing diagram of another open-back headphone according to some embodiments of this specification. In some embodiments, the open-back headphone 10 may include, but is not limited to, air conduction headphones and bone conduction headphones. In some embodiments, the open-back headphone 10 may be combined with products such as glasses, headphones, head-mounted displays, and AR / VR headsets. Figures 2-4 As shown, the open-back headphones 10 may include a speaker 11 and an ear hook 12. In some embodiments, the speaker 11 of the open-back headphones 10 can be worn on the user's body (e.g., the head, neck, or upper torso) via the ear hook 12.

[0044] In some embodiments, when the open-back headphones 10 are worn, the first part of the ear hook 12 is hung between the user's auricle and head, and the second part extends towards the side of the auricle away from the head and connects to the sound-emitting part 11, for fixing the sound-emitting part 11 in a position near the ear canal without blocking the ear canal. In some embodiments, the ear hook 12 can be an arc structure adapted to the user's auricle, so that the ear hook 12 can be suspended on the user's upper auricle. In some embodiments, the ear hook 12 can also be a clamping structure adapted to the user's auricle, so that the ear hook 12 can be clamped on the user's auricle. In some embodiments, the ear hook 12 can include, but is not limited to, a hook structure, an elastic band, etc., so that the open-back headphones 10 can be better fixed to the user and prevent the headphones from falling off during use.

[0045] In some embodiments, the sound-emitting part 11 can be worn on a user's body, and a transducer (e.g., transducer 112) may be provided within the sound-emitting part 11 to generate sound input to the user's ear 100. In some embodiments, the open-back headphones 10 can be combined with products such as glasses, headphones, head-mounted displays, AR / VR helmets, etc., in which case the sound-emitting part 11 can be worn near the user's ear 100 by suspension or clipping. In some embodiments, the sound-emitting part 11 can be circular, elliptical, polygonal (regular or irregular), U-shaped, V-shaped, or semi-circular, so that the sound-emitting part 11 can be directly attached to the user's ear 100.

[0046] Combination Figure 1 and Figure 2 In some embodiments, when a user wears the open-back headphones 10, at least a portion of the sound-emitting part 11 may be located in... Figure 1 The user's ear 100 is shown in the area J on the front side of the tragus or in the areas M1 and M2 inside the auricle. The following will discuss different wearing positions of the sound-producing part 11 (…). Figure 2 The following examples (11A, 11B, and 11C) are provided for illustrative purposes. It should be noted that, in the embodiments of this specification, the anterolateral surface of the auricle refers to the side of the auricle facing away from the head along the coronal axis; correspondingly, the posteromedial surface of the auricle refers to the side of the auricle facing the head along the coronal axis. In some embodiments, the location of the sound-emitting part 11 (11A) refers to the location of the sound-emitting part 11 on the side of the user's ear 100 facing the facial region along the sagittal axis, i.e., the location of the sound-emitting part 11 in the region J in front of the ear 100.

[0047] Furthermore, a transducer (e.g., transducer 112) is disposed inside the housing of the sound-emitting part 11, and at least one sound outlet (e.g., sound outlet 111a) may be provided on the housing (e.g., housing 111). Figure 2(Not shown in the image) The sound outlet can be located on the side wall of the sound-emitting housing facing or near the user's external auditory canal 101. The transducer can output sound to the user's external auditory canal 101 through the sound outlet. A transducer is a component that can receive electrical signals and convert them into sound signals for output. In some embodiments, the transducer 112 can be classified by frequency, including low-frequency (e.g., 30Hz-150Hz) speakers, mid-low-frequency (e.g., 150Hz-500Hz) speakers, mid-high-frequency (e.g., 500Hz-5kHz) speakers, high-frequency (e.g., 5kHz-16kHz) speakers, or full-range (e.g., 30Hz-16kHz) speakers, or any combination thereof. The terms "low frequency," "high frequency," etc., used here only indicate a general frequency range; different classification methods may be used in different application scenarios. For example, a crossover point can be determined, with low frequency representing the frequency range below the crossover point and high frequency representing the frequency range above the crossover point. The crossover point can be any value within the range of human hearing, such as 500Hz, 600Hz, 700Hz, 800Hz, 1000Hz, etc.

[0048] In some embodiments, the transducer may include a diaphragm (e.g., diaphragm 1121). When the diaphragm vibrates, sound can be emitted from the front and rear sides of the diaphragm, respectively. The chamber inside the housing of the sound-generating part 11 is at least divided by the diaphragm into a front chamber (e.g., front chamber 114) located on the front side of the diaphragm and a rear chamber (e.g., rear chamber 116) located on the rear side of the diaphragm. The sound outlet is acoustically coupled to the front chamber. The vibration of the diaphragm causes the air in the front chamber to vibrate, generating air-conducted sound. The air-conducted sound generated in the front chamber is transmitted to the outside through the sound outlet. In some embodiments, the housing of the sound-generating part 11 may also include one or more pressure relief holes (e.g., a first pressure relief hole 111c and a second pressure relief hole 111d). The pressure relief holes may be located on the sidewall of the housing adjacent to or opposite to the sidewall where the sound outlet is located. The pressure relief holes are acoustically coupled to the rear chamber. The vibration of the diaphragm also causes the air in the rear chamber to vibrate, generating air-conducted sound. The air-conducted sound generated in the rear chamber can be transmitted to the outside through the pressure relief holes. For example, in some embodiments, the transducer in the sound-generating part 11 can output sound with a phase difference (e.g., opposite phase) through the sound outlet and the pressure relief hole. The sound outlet can be located on the side wall of the housing of the sound-generating part 11 facing the user's external auditory canal 101, and the pressure relief hole can be located on the side of the housing of the sound-generating part 11 away from the user's external auditory canal 101. In this case, the housing can act as a baffle to increase the sound path difference between the sound outlet and the pressure relief hole and the external auditory canal 101, so as to increase the sound intensity at the external auditory canal 101 and reduce the volume of far-field sound leakage.

[0049] In some embodiments, the sound-emitting part 11 may have a major axis direction Y and a minor axis direction Z that are perpendicular to the thickness direction X and orthogonal to each other. The major axis direction Y can be defined as the direction with the maximum extension dimension in the shape of the two-dimensional projection surface of the sound-emitting part 11 (e.g., the projection of the sound-emitting part 11 onto the plane containing its outer surface, or its projection onto the sagittal plane). (e.g., when the projection shape is rectangular or approximately rectangular, the major axis direction is the length direction of the rectangle or approximately rectangular shape). The minor axis direction Z can be defined as the direction perpendicular to the major axis direction Y in the shape of the projection of the sound-emitting part 11 onto the sagittal plane (e.g., when the projection shape is rectangular or approximately rectangular, the minor axis direction is the width direction of the rectangle or approximately rectangular shape). The thickness direction X can be defined as a direction perpendicular to the two-dimensional projection surface, for example, consistent with the direction of the coronal axis, both pointing towards the left and right sides of the body. In some embodiments, when the sound-emitting part 11 is tilted while being worn, the major axis direction Y and the minor axis direction Z are still parallel or approximately parallel to the sagittal plane. The major axis direction Y may have a certain angle with the direction of the sagittal axis, that is, the major axis direction Y is also tilted accordingly. The minor axis direction Z may have a certain angle with the direction of the vertical axis, that is, the minor axis direction Z is also tilted. Figure 2 The sound-emitting part 11 shown is worn on 11B and Figure 4 The image shows the wearing configuration of the sound-emitting part 11. In some embodiments, the entirety or a portion of the sound-emitting part 11 may extend into the concha cavity, meaning that the projection of the sound-emitting part 11 onto the sagittal plane overlaps with the projection of the concha cavity onto the sagittal plane. For details regarding the wearing configuration of the sound-emitting part 11 on 11B, please refer to other parts of this specification, for example... Figure 3 And its corresponding instruction manual. In some embodiments, the sound-emitting part 11 may also be in a horizontal or near-horizontal state when worn, such as... Figure 2 The sound-producing part 11 is worn on 11C and Figure 3 As shown in the diagram of the sound-emitting part 11, the major axis direction Y can be aligned with or approximately aligned with the sagittal axis, both pointing in the anterior-posterior direction of the body. The minor axis direction Z can be aligned with or approximately aligned with the vertical axis, both pointing in the vertical direction of the body. It should be noted that when worn, the sound-emitting part 11 is in an approximately horizontal state, which means... Figure 2 The angle between the long axis of the sound-emitting part 11 and the sagittal axis is within a specific range (e.g., no greater than 20°). Furthermore, the wearing position of the sound-emitting part 11 is not limited to... Figure 2 The 11A, 11B, and 11C shown satisfy the following conditions: Figure 1 Region J, region M1, or region M2 as shown in the diagram are acceptable. For example, the entire or part of the sound-emitting part 11 can be located in... Figure 1The area J enclosed by the dotted line. For example, the entirety or part of the structure of the sound-producing part 11 may contact one or more of the following locations within the external auditory canal 101: the crus 109, cymba conchae 103, triangular fossa 104, antihelix 105, scaphoid fossa 106, and helix 107. For another example, the entirety or part of the structure of the sound-producing part 11 may be located within the cavity formed by one or more locations of the ear 100 (e.g., the conchae cavity 102, cymba conchae 103, triangular fossa 104, etc.). Figure 1 The region M1, enclosed by the dashed line, includes at least the cymba conchae 103 and the triangular fossa 104, and the region M2, which includes at least the cavum conchae 102.

[0050] In some embodiments, to improve the stability of the open-back headphones 10 during wear, the open-back headphones 10 may employ any one or a combination of the following methods. For example, at least a portion of the ear hook 12 is configured as a conformal structure that conforms to at least one of the back of the ear and the head, thereby increasing the contact area between the ear hook 12 and the ear and / or the head, thus increasing the resistance to the open-back headphones 10 falling off the ear. For example, at least a portion of the ear hook 12 is configured as an elastic structure, allowing it to deform to a certain extent during wear, thereby increasing the positive pressure of the ear hook 12 on the ear and / or the head, thus increasing the resistance to the open-back headphones 10 falling off the ear. For example, at least a portion of the ear hook 12 is configured to rest against the head during wear, creating a reaction force that presses against the ear, causing the sound-emitting part 11 to press against the front of the ear, thereby increasing the resistance to the open-back headphones 10 falling off the ear. For example, the sound-emitting part 11 and the ear hook 12 are configured to clamp the physiological parts such as the antihelix and conchae from the front and back sides of the ear when worn, thereby increasing the resistance to the open-back headphones 10 falling off the ear. As another example, the sound-emitting part 11 or the auxiliary structure connected to it is configured to at least partially extend into the physiological parts such as the conchae, cymba conchae, triangular fossa, and scaphoid fossa, thereby increasing the resistance to the open-back headphones 10 falling off the ear.

[0051] The sound-producing part 11 may have a connecting end CE that is connected to the ear hook 12 and a free end FE that is not connected to the ear hook 12. Exemplarily, combined with... Figure 4In the wearing state, the free end FE of the sound-generating part 11 can extend into the concha cavity. Optionally, the sound-generating part 11 and the ear hook 12 can be configured to clamp the aforementioned ear area from both the front and rear sides of the ear area corresponding to the concha cavity, thereby increasing the resistance to the open-back headphones 10 falling off the ear and improving the stability of the open-back headphones 10 in the wearing state. For example, the free end FE of the sound-generating part is pressed into the concha cavity in the thickness direction X. As another example, the free end FE abuts against the concha cavity in the major axis direction Y and / or the minor axis direction Z (e.g., abuts against the inner wall of the opposite free end FE of the concha cavity). Here, the free end FE of the sound-generating part 11 refers to the end of the sound-generating part 11 that is disposed opposite to the fixed end connected to the ear hook 12. The sound-generating part 11 can be a regular or irregular structure. Here, an exemplary description is given to further illustrate the free end FE of the sound-generating part 11. For example, when the sound-generating part 11 is a cuboid structure, the end wall of the sound-generating part 11 is a plane. In this case, the free end FE of the sound-generating part 11 is the end sidewall opposite to the fixed end connected to the ear hook 12. Alternatively, when the sound-generating part 11 is a sphere, ellipsoid, or an irregular structure, the free end FE of the sound-generating part 11 can refer to a specific area away from the fixed end obtained by cutting along the YZ plane (the plane formed by the minor axis direction Z and the thickness direction X) of the sound-generating part 11. It should be noted that, in the wearing state, the free end FE of the sound-generating part 11, in addition to extending into the concha, can also be projected onto the antihelix, or onto the left and right sides of the head and located on the front side of the ear along the sagittal axis. In other words, the ear hook 12 can support the sound-generating part 11 when worn in the concha, antihelix, or front of the ear.

[0052] The following is Figure 4 Taking the open-back headphone 10 shown as an example, the open-back headphone 10 will be described in detail. It should be noted that, without violating the corresponding acoustic principles, Figure 4 The structure and parameters of the open-back headphone 10 can also be applied to other open-back headphone configurations mentioned above.

[0053] By extending at least a portion of the sound-emitting part 11 into the concha cavity, the listening volume at the listening position (e.g., at the ear canal opening) can be increased, especially the mid-to-low frequency listening volume, while still maintaining a good far-field leakage cancellation effect. As an example only, when the entire or part of the structure of the sound-emitting part 11 extends into the concha cavity, the sound-emitting part 11 and the concha cavity form a cavity-like structure (hereinafter referred to as a cavity-like structure). In the embodiments described, the cavity-like structure can be understood as a semi-enclosed structure jointly enclosed by the sidewalls of the sound-emitting part 11 and the concha cavity structure. This semi-enclosed structure ensures that the interior is not completely sealed and isolated from the external environment, but rather has a leakage structure (e.g., openings, gaps, channels, etc.) that acoustically communicates with the external environment. When a user wears the open-back earphone 10, one or more sound outlets can be provided on the side of the housing of the sound-generating part 11 near or facing the user's ear canal. One or more pressure relief holes are provided on other sidewalls of the housing of the sound-generating part 11 (e.g., sidewalls away from or opposite to the user's ear canal). The sound outlets are acoustically coupled to the front cavity of the open-back earphone 10, and the pressure relief holes are acoustically coupled to the rear cavity of the open-back earphone 10. Taking a sound-generating part 11 including one sound outlet and one pressure relief hole as an example, the sound output from the sound outlet and the sound output from the pressure relief hole can be approximated as two sound sources with opposite phases. The sound-generating part 11 and the corresponding inner wall of the concha form a cavity-like structure, wherein the sound source corresponding to the sound outlet is located inside the cavity-like structure, and the sound source corresponding to the pressure relief hole is located outside the cavity-like structure, forming... Figure 5 The acoustic model shown.

[0054] Figure 5 This is an exemplary distribution diagram of a cavity structure surrounding one of the two sound sources, as shown in some embodiments of this specification. Figure 5As shown, the cavity-like structure 502 may include a listening position and at least one sound source 501A. Here, "including" can mean that at least one of the listening position and the sound source 501A is inside the cavity-like structure 502, or that at least one of the listening position and the sound source 501A is at the inner edge of the cavity-like structure 502. The listening position can be equivalent to the entrance of the ear canal, or it can be an acoustic reference point of the ear, such as the ear reference point (ERP), ear-drum reference point (DRP), or an entrance structure guiding the listener. Because the sound source 501A is enclosed by the cavity-like structure 502, most of the sound radiated from it will reach the listening position through direct or reflected sound. Conversely, without the cavity-like structure 502, most of the sound radiated from the sound source 501A will not reach the listening position. Therefore, the cavity structure significantly increases the volume of the sound reaching the listening position. Simultaneously, only a small portion of the anti-phase sound radiated by the anti-phase sound source 501B outside the cavity-like structure 502 enters the cavity-like structure 502 through the leakage structure 503. This is equivalent to generating a secondary sound source 501B' at the leakage structure 503, whose intensity is significantly less than that of the sound source 501B and also significantly less than that of the sound source 501A. The sound generated by the secondary sound source 501B' has a weak anti-phase cancellation effect on the sound source 501A within the cavity, significantly increasing the listening volume at the listening position. Regarding sound leakage, the sound radiated by the sound source 501A to the outside through the cavity's leakage structure 503 is equivalent to generating a secondary sound source 501A' at the leakage structure 503. Since almost all the sound radiated by the sound source 501A is output from the leakage structure 503, and the scale of the cavity-like structure 502 is much smaller than the spatial scale for evaluating sound leakage (by at least one order of magnitude), the intensity of the secondary sound source 501A' can be considered comparable to that of the sound source 501A. From the perspective of the external space, the secondary sound source 501A' and the sound source 501B form a dual sound source to cancel out sound leakage.

[0055] In specific application scenarios, the outer wall surface of the housing of the sound-generating part 11 is usually flat or curved, while the contour of the user's concha 102 is an uneven structure. By extending part or all of the sound-generating part 11 into the concha, a cavity-like structure communicating with the outside is formed between the sound-generating part 11 and the contour of the concha. Furthermore, by setting the sound outlet at a position on the housing of the sound-generating part 11 facing the user's ear canal opening and near the edge of the concha 102, and by setting the pressure relief hole at a position on the sound-generating part 11 away from or away from the ear canal opening, a structure can be constructed. Figure 5 The acoustic model shown allows users to improve their listening position at the ear opening when wearing open-back headphones 10, and reduces sound leakage in the far field.

[0056] Figure 6 This is a schematic diagram of the exemplary internal structure of the sound-generating part according to some embodiments of this specification. For example... Figure 6 As shown, in some embodiments, the sound-generating part 11 may include a transducer 112 and a housing 111 accommodating the transducer 112. The transducer 112 may include a diaphragm 1121. A front cavity 114 located on the front side of the diaphragm 1121 and a rear cavity 116 located on the rear side of the diaphragm 1121 may be formed between the diaphragm 1121 and the housing 111. The housing 111 is provided with a sound outlet 111a acoustically coupled to the front cavity 114 and a pressure relief hole (e.g., a first pressure relief hole 111c and a second pressure relief hole 111d, wherein the second pressure relief hole 111d is not in the rear cavity 116) acoustically coupled to the rear cavity 116. Figure 6 (As shown in the figure). A connecting frame 115 may be provided inside the housing 111. An acoustic channel 1151 is provided on the connecting frame 115 for connecting the first pressure relief hole 111c and the rear cavity 116, so that the rear cavity 116 can communicate with the external environment, that is, air can freely enter and exit the rear cavity 116, which helps to reduce the resistance of the transducer 112 diaphragm during vibration.

[0057] Figure 7 These are exemplary external views of transducers shown according to some embodiments of this specification. Figure 8 This is an exemplary exploded view of a transducer according to some embodiments of this specification. Please refer to... Figure 7 and Figure 8 In some embodiments, the sound-generating part 11 may include a diaphragm 1121, a coil 1122, a bracket 1123, a terminal 1124, and a magnetic circuit assembly 1125. The bracket 1123 provides a mounting platform, through which the speaker 112 can be connected to the housing 111. The terminal 1124 is fixed to the bracket 1123 and can be used for circuit connections (e.g., connecting leads). The coil 1122 is connected to the diaphragm 1121 and is at least partially located in the magnetic gap formed by the magnetic circuit assembly 1125. The magnetic circuit assembly 1125 exerts a force on the energized coil 1122, thereby driving the diaphragm 1121 to produce mechanical vibration, which in turn generates sound through propagation via a medium such as air. The magnetic circuit assembly 1125 may include a magnetic guide plate 11251, a magnet 11252, and a receiving member 11253. The magnetic plate 11251 is located between the magnet 11252 and the diaphragm 1121 and is attached to the surface of the magnet 11252.

[0058] Figure 9 This is an exemplary internal structure diagram of the sound-generating part according to some embodiments of this specification. Figure 10This is an exemplary structural diagram of a diaphragm according to some embodiments of this specification. The sound-generating part 11 includes a diaphragm 1121, a coil 1122, a support 1123, and a magnetic circuit assembly 1125. The support 1123 surrounds the diaphragm 1121, the coil 1122, and the magnetic circuit assembly 1125, providing a mounting platform. The sound-generating part 11 can be connected to the housing 111 via the support 1123. The coil 1122 extends into the magnetic circuit assembly 1125 and is connected to the diaphragm 1121. The magnetic circuit assembly 1125 exerts a force on the energized coil 1122, thereby driving the diaphragm 1121 to produce mechanical vibration, which then generates sound through a medium such as air. The sound is output through a sound outlet. In some embodiments, the magnetic circuit assembly 1125 includes a magnetic guide plate 11251, a magnet 11252, and a receiving member 11253. The magnetic guide plate 11251 and the magnet 11252 are interconnected. The side of the magnet 11252 away from the magnetic guide plate 11251 is mounted on the bottom wall of the receiving member 11253, and there is a gap between the periphery of the magnet 11252 and the inner periphery of the receiving member 11253. In some embodiments, the outer periphery of the receiving member 11253 is fixedly connected to the bracket 1123. In some embodiments, both the receiving member 11253 and the magnetic guide plate 11251 can be made of a magnetically conductive material (e.g., iron). In some embodiments, the periphery of the diaphragm 1121 can be connected to the bracket 1123 via a retaining ring 1155. In some embodiments, the retaining ring 1155 can be made of stainless steel or other metal materials to suit the manufacturing process of the diaphragm 1121. Please refer to... Figure 8 The magnetic circuit assembly 1125 may include a magnetically conductive plate 11251, a magnet 11252, and a receiving member 11253. Both the receiving member 11253 and the magnetically conductive plate 11251 may be made of a magnetically conductive material (e.g., iron). In some embodiments, the receiving member 11253 includes a bottom 11253a and a peripheral sidewall 11253b, which form a receiving space in which the magnetically conductive plate 11251 and the magnet 11252 are received. The magnetically conductive plate 11251 and the magnet 11252 are interconnected. The side of the magnet 11252 away from the magnetically conductive plate 11251 is mounted on the bottom 11253a of the receiving member, and a gap exists between the peripheral side of the magnet 11252 and the peripheral sidewall 11253b of the receiving member 11253. In some embodiments, the coil 1122 may extend into the gap between the magnet 11252 and the sidewall 11253b.

[0059] In some embodiments, in order to ensure that at least a portion of the coil 1122 is located in a region with high magnetic flux density within the magnetic circuit assembly 1125 during the up-and-down vibration of the diaphragm 1121, thereby improving the magnetic field utilization efficiency of the magnetic circuit assembly 1125, the distance dd between the center point J of the coil 1122 and the center point K of the magnetic guide plate 11251 is less than 0.3 mm in the vibration direction of the diaphragm 1121. For example, the center point J of the coil 1122 and the center point K of the magnetic guide plate 11251 can be substantially on the same horizontal line, so that the magnetic circuit assembly 1125 exerts a greater force on the coil 1122 to provide power for the vibration of the diaphragm 1121.

[0060] Please refer to Figure 9 and Figure 10 In some embodiments, the diaphragm 1121 may include a main body region 11211 and a folded ring region 11212 surrounding the main body region 11211. In some embodiments, the main body region 11211 includes a first inclined segment 11211a and a first connecting segment 11211b connected to the coil 1122. Figure 9 As shown, the first connecting segment 11211b is used to connect the coil 1122. The first connecting segment 11211b is arranged parallel to the minor axis direction Z and perpendicular to the vibration direction of the diaphragm. The first inclined segment 11211a is in contact with a portion of the loop region 11212. In some embodiments, the first inclined segment 11211a is inclined relative to the first connecting segment 11211b in a direction away from the coil 1122. Figure 9 and Figure 10 As shown, the coil 1122 is located below the first connecting section 11211b, and the first inclined section 11211a is inclined upward (i.e., away from the direction away from the coil 1122) relative to the first connecting section 11211b. This arrangement prevents adhesive used for bonding the coil 1122 to the diaphragm 1121 from overflowing into the loop area 11212, thus avoiding corrosion of the loop area 11212 and affecting the vibration performance of the diaphragm 1121.

[0061] In some embodiments, the magnetic circuit system 1125 mainly includes a magnetic guide plate 11251, a magnet 11252, and a receiving member 11253. The magnetic guide plate 11251 and the magnet 11252 are interconnected. The side of the magnet 11252 away from the magnetic guide plate 11251 is mounted on the bottom wall of the receiving member 11253, and there is a gap between the periphery of the magnet 11252 and the inner periphery of the receiving member 11253. The coil 1122 can extend into the gap between the magnet 11252 and the receiving member 11253. If the distance between the coil 1122 and the side wall of the receiving member 11253 is too large, the coil will not be in the region of high magnetic flux density of the magnetic circuit assembly 1125, weakening the power provided by the magnetic circuit assembly 1125 to the diaphragm 1121; if the distance is too small, the coil 1121 may collide with the receiving member 11253. Therefore, to avoid collisions with the coil 1121 and to ensure the magnetic field provides power to the diaphragm 1121, in some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 can be 0.1mm-0.25mm, and the distance ww between the coil 1122 and the inner peripheral wall of the receiving member 11253 can be 0.1mm-0.5mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 can be 0.12mm-0.24mm, and the distance ww between the coil 1122 and the inner peripheral wall of the receiving member 11253 can be 0.15mm-0.3mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 can be 0.17mm-0.21mm, and the distance ww between the coil 1122 and the inner peripheral wall of the receiving member 11253 can be 0.19mm-0.23mm. In some embodiments, the distance wt between the coil 1122 and the sidewall of the magnet 11252 can be 0.2 mm, and the distance ww between the coil 1122 and the inner peripheral sidewall of the receiving member 11253 can be 0.2 mm. If the distance h3 between the coil 1122 and the bottom 11253a of the receiving member 11253 is too large, the overall volume of the sound-generating part 11 will increase. If the distance h3 between the coil 1122 and the bottom 11253a of the receiving member 11253 is too small along the vibration direction of the diaphragm 1121, the coil 1121 may collide with the receiving member 11253. Therefore, to avoid the sound-generating part 11 becoming too large and to prevent the coil 1121 from colliding, in some embodiments, the distance h3 between the coil 1122 and the bottom 11253a of the receiving member 11253 (i.e., the distance between the end of the coil 1122 away from the diaphragm 1121 and the bottom wall of the receiving member 11253) can be 0.2 mm to 4 mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the receiving member 11253 can be 0.6mm-3mm.In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the receiving member 11253 can be 1mm-2mm. In some embodiments, the distance h3 between the coil 1122 and the bottom wall of the receiving member 11253 can be 1.4mm-1.6mm.

[0062] In some embodiments, by designing the tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b, the relative position of the coil 1122 and the magnetic circuit assembly 1125 can be changed, thereby making the thrust on the coil 1122 approximately the same, thus adjusting the low-frequency distortion of the sound-producing part 11 and making the low-frequency listening experience richer. Furthermore, by designing the tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b, it is also possible to prevent the coil 1122 from overflowing adhesive into the surround area 11212, avoiding corrosion of the surround area 11212 and affecting the vibration of the surround area 11212. The tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b refers to the angle between the first tilted segment 11211a in the direction away from the first connecting segment 11211b and the straight line containing the first connecting segment 11211b, such as... Figure 10 As shown.

[0063] In some embodiments, to reduce the distortion of the sound-generating part 11 and avoid corrosion of the ring region 11212 and its vibration, the tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b can be in the range of 5°-30°. In some embodiments, to further reduce the distortion of the sound-generating part 11, the tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b can be in the range of 10°-25°. For example, the tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b can be 15°. Another example is that the tilt angle β of the first tilted segment 11211a relative to the first connecting segment 11211b can be 22°.

[0064] In some embodiments, the minimum distance between the coil 1122 and the first inclined segment 11212a is not less than 0.3mm, that is, the distance between the connection point of the first inclined segment 11212a and the first connecting segment 11211b and the connection area between the coil 1122 and the first connecting segment 11211b is not less than 0.3mm, so as to maintain a safe distance between the loop area 11212 and the installation position of the coil 1122 and prevent the glue for installing the coil 1122 from overflowing into the loop area 11212.

[0065] In some embodiments, the loop region 11212 includes a second inclined segment 11212a, which is at least partially attached to the first inclined segment 11211a. The main body region 11211 and the loop region 11212 are connected via the first inclined segment 11211a and the second inclined segment 11212a. In some embodiments, to simplify the mounting process, the first inclined segment 11211a and the second inclined segment 11212a can be connected by adhesive. In some embodiments, to achieve the connection between the main body region 11211 and the loop region 11212, the second inclined segment 11212a may be disposed on the side of the first inclined segment 11211a closer to the coil 1122. In some embodiments, in order to connect the main body region 11211 and the loop region 11212, and in order to further reduce the degree of corrosion of the loop region 11212 by the glue during the bonding of the coil 1122, the second inclined segment 11212a may be disposed on the side of the first inclined segment 11211a away from the coil 1122.

[0066] Since the vibration amplitude of the diaphragm 1121 is relatively large at low frequencies, if the loop region 11212 adopts a planar structure, its deformation capability is poor, which will affect the amplitude of the diaphragm 1121 vibration. Therefore, in order to make the diaphragm 1121 have better deformation capability, in some embodiments, the loop region 11212 may include an arc segment 11212c.

[0067] In some embodiments, the ratio of the height h1 to the span w1 of the arc segment 11212c can affect the deformation capability of the arc segment 11212c. The height of the arc segment 11212c refers to the distance between the highest point and the lowest point of the arc segment 11212c in the vibration direction of the diaphragm 1121. Figure 10 As shown, the height of arc segment 11212c is denoted as h1. The span of arc segment 11212c refers to the maximum distance between two points on arc segment 11212c. For example... Figure 10As shown, the span of the arc segment 11212c is denoted as w1. If the ratio of the height h1 to the span w1 of the arc segment 11212c is too small, the convexity of the arc segment 11212c is too small, and its shape may be close to a planar structure, resulting in poor deformation capability. If the ratio of the height h1 to the span w1 of the arc segment 11212c is too large, the convexity of the arc segment 11212c is too large, and the diaphragm 1121 experiences greater resistance during vibration, affecting the output of the sound-generating part 11. Therefore, in some embodiments, to achieve better output and lower distortion in the sound-generating part 11, the ratio of the height h1 to the span w1 of the arc segment 11212c can be in the range of 0.35-0.4. In some embodiments, to further improve the output of the sound-generating part 11, the ratio of the height h1 to the span w1 of the arc segment 11212c can be in the range of 0.36-0.39. In some embodiments, to further reduce the distortion of the sound-generating part 11, the ratio of the height h1 to the span w1 of the arc segment 11212c can be 0.37-0.38. For example, the ratio of the height h1 to the span w1 of the arc segment 11212c can be 0.38.

[0068] In some embodiments, the height h1 of the arc segment 11212c can be in the range of 0.5mm-0.7mm. For example, the height h1 of the arc segment 11212c can be in the range of 0.55mm-0.65mm. In some embodiments, the height h1 of the arc segment 11212c can be 0.6mm. Considering the error dimension, in some embodiments, the height h1 of the arc segment 11212c can be 0.6mm ± 0.05mm. In some embodiments, the span (width) w2 of the arc segment 11212c of the folded ring region 11212 can be less than twice the radius of curvature r1. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the folded ring region 11212 can be 0.7mm-0.9mm. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the folded ring region 11212 can be 0.75mm-0.88mm. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the folded region 11212 can be 0.8mm-0.83mm. In some embodiments, the span w1 of the arc segment 11212c of the folded region 11212 can be 1.2mm-1.7mm. In some embodiments, the span w1 of the arc segment 11212c of the folded region 11212 can be 1.3mm-1.65mm. In some embodiments, the span w1 of the arc segment 11212c of the folded region 11212 can be 1.5mm-1.6mm. In some embodiments, the radius of curvature r1 of the arc segment 11212c of the folded region 11212 can be 0.82mm, and the span w1 of the arc segment 11212c of the folded region 11212 can be 1.58mm. Considering the error size, in some embodiments, the radius of curvature r1 of the arc segment 11212c of the folded ring region 11212 can be 0.82mm±0.05mm, and the span w1 of the arc segment 11212c of the folded ring region 11212 can be 1.58mm±0.1mm.

[0069] In some embodiments, the loop region 11212 may also include a wave-shaped structure composed of multiple arc-shaped segments 11212c, wherein any two adjacent arc-shaped segments 11212c have opposite orientations. The wave-shaped structure allows the diaphragm 1121 to experience symmetrical resistance during upward and downward vibrations, reducing distortion in the sound-generating part 11 and improving its low-frequency output. In some embodiments, the height-to-span ratio of each arc-shaped segment 11212c may be consistent with the height-to-span ratio of a single arc-shaped segment 11212c. In some embodiments, the height-to-span ratio of each arc-shaped segment 11212c may be different. For example, along the radial direction of the diaphragm 1121, the height of each arc-shaped segment 11212c may gradually decrease from the center to the edge of the diaphragm 1121, and the span of each arc-shaped segment 11212c may be the same.

[0070] To constrain the diaphragm 1121 during large-amplitude vibrations and prevent the coil 1122 from colliding with the magnetic circuit assembly 1125, in some embodiments, the main body region 11211 may include an arched dome 11211c located at the end of the first connecting segment 11211b away from the first inclined segment 11211a. The arched dome 11211c has the same arching direction as the arc segment 11212c, meaning it protrudes towards the side away from the coil 1122. The arched dome 11211c prevents the diaphragm 1121 from swaying during large-amplitude vibrations, ensuring that the coil 1122 does not collide with the magnetic assembly 1125. Simultaneously, the arched dome 11211c also possesses high strength and stiffness, which to some extent suppresses the segmented vibration of the main body region 11211, thereby improving the high-frequency vibration characteristics of the transducer 112. Without a front cover, an increase in the dome aspect ratio (i.e., the ratio of height to span) will increase high-frequency bandwidth, but an excessively high dome aspect ratio will cause an increase in unevenness and an increase in overall size.

[0071] In some embodiments, the height h2 of the dome 11211c is related to the dimension of the dome 11211c in the arched extension direction (i.e., the span dimension w2). The height of the dome 11211c refers to the distance between the highest point and the lowest point of the dome 11211c (i.e., the endpoint connected to the first connecting segment 11211b) in the vibration direction of the diaphragm 1121. Figure 10 As shown, the height of sphere 11211c is h2. The span of sphere 11211c refers to the maximum distance between two points on sphere 11211c. For example... Figure 10As shown, the span of the dome 11211c is w2. The larger the span w2 of the dome 11211c, the larger the height h2 of the dome 11211c will be in order to maintain the arched structure of the dome 11211c (e.g., to keep the curvature corresponding to the dome 11211c within a preset curvature range), which may result in an excessively large overall thickness of the transducer 112. Considering both the overall thickness of the transducer 112 and its structural design, in some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 can be 0.5263 rad to 3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 can be 0.7869 rad to 3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 can be 1.0526 rad - 3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 can be 1.5789 rad - 3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 of the diaphragm 1121 can be 2.1053 rad - 3.1416 rad. In some embodiments, the preset curvature range corresponding to the dome 11211c of the main body region 11211 can be 2.6316 rad - 3.1416 rad. In some embodiments, the width w2 of the dome 11211c of the main body region 11211 can be 2 mm - 8 mm. In some embodiments, the width w2 of the dome 11211c of the main body region 11211 can be 3mm-7mm. In some embodiments, the width w2 of the dome 11211c of the main body region 11211 can be 4mm-6mm. In some embodiments, the width w2 of the dome 11211c of the main body region 11211 can be 4.8mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 (i.e., the distance between the highest and lowest points of the dome 11211c in the diaphragm vibration direction) can range from 0.7mm-1.2mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 can be 0.9mm-1.1mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 can be 1mm-1.05mm. In some embodiments, the height h2 of the dome 11211c of the main body region 11211 can be 0.8mm. In some embodiments, due to manufacturing errors, the height h2 of the dome 11211c of the main body region 11211 can be 0.8mm ± 0.08mm.

[0072] In some embodiments, the ratio of the height h2 to the span w2 of the dome 11211c may affect the overall size of the sound-generating part 11 and the vibration of the diaphragm 1121. If the ratio of the height h2 to the span w2 of the dome 11211c is too small, the convexity of the dome 11211c is too small, the shape of the dome 11211c is close to a planar structure, the strength and stiffness of the dome 11211c are low, and the dome 11211c is prone to segmented vibration, resulting in more peaks and valleys in the high-frequency region, affecting the high-frequency vibration characteristics of the transducer 112. If the ratio of the height h2 to the span w2 of the dome 11211c is too large, the convexity of the dome 11211c is too large, the overall thickness of the transducer 112 may be too large, and the non-uniformity and overall size will also increase. Therefore, in order to make the sound-generating part 11 have a suitable overall thickness and improve the high-frequency vibration characteristics of the sound-generating part 11, the ratio of the height h2 to the span w2 of the dome 11211c can be in the range of 0.1-0.6. In some embodiments, in order to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 to the span w2 of the dome 11211c can be in the range of 0.1-0.4. In some embodiments, in order to further improve the high-frequency vibration characteristics of the transducer 112, the ratio of the height h2 to the span w2 of the dome 11211c can be in the range of 0.1-0.3.

[0073] In some embodiments, taking into account structural strength, manufacturing difficulty, and the overall thickness limitation of the sound-generating part 11, while satisfying the maximum amplitude of the diaphragm 1121, so that the diaphragm 1121 does not collide with the magnetic plate 11251 during vibration, the distance between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic plate 11251 in the magnetic circuit assembly 1125 (e.g., ...) is defined as follows: Figure 9 The distance hd shown can be greater than 0.8 mm. In some embodiments, the distance hd between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic plate 11251 in the magnetic circuit system 1125 can be 0.85 mm to 0.95 mm, i.e., 0.9 mm ± 0.05 mm. Here, 0.9 mm is the structural dimension, and 0.05 mm is the error range dimension. In some embodiments, the distance hd between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic plate 11251 in the magnetic circuit system 1125 can be 0.86 mm to 0.93 mm. In some embodiments, the distance hd between the lowest point of the dome 11211c of the main body region 11211 of the diaphragm 1121 and the top of the magnetic plate 11251 in the magnetic circuit system 1125 can be 0.88 mm to 0.92 mm.

[0074] Figure 11AThis is an exemplary high-frequency bandwidth schematic diagram of a sound-generating part according to some embodiments of this specification. For example... Figure 11A As shown, in the frequency response curve of the sound-generating part 11, there is a first inflection point in the low-frequency region. f 0, f 0 is roughly around 300Hz. f The value 0 is related to the stiffness of the folded area 11212 of the diaphragm 1121 and the weight of the vibration (mainly the weight of the main body area 11211). The second inflection point... f h It's around 25kHz. f h It can be determined based on the overall trend of the frequency response curve. f h After 25kHz, although the curve shows some local peaks, it generally exhibits a downward trend. (Selection) f 0 and f h The peak values ​​of the frequency band between 300Hz and 25kHz are averaged to form the first reference line L. m ,like Figure 11A The straight line above the middle is used as a reference line, and the line drops 10dB to form the second straight line L. n ( Figure 11A The straight line at the bottom center indicates the selected bandwidth of 100Hz-45kHz.

[0075] In some embodiments, the frequency of the high-frequency segmented vibration of the diaphragm 1121 is proportional to... E / ρ .in, E The Young's modulus of diaphragm 1121, ρ This is the equivalent density of diaphragm 1121. Therefore... E / ρ This can determine the bandwidth for high frequencies. When E At a given time, the smaller the mass of the diaphragm 1121, the higher its equivalent density. ρ The smaller, E / ρ The larger the value, the wider the high-frequency bandwidth. When ρ At a given time, the Young's modulus of diaphragm 1121 E The larger, E / ρ The larger the value, the higher the high-frequency segmentation vibration frequency of the diaphragm 1121, and the wider the high-frequency bandwidth.

[0076] In some embodiments, the region of high-frequency segmented vibration of the sound-generating part 11 refers to the region where, after the frequency response curve reaches its peak, the frequency response drops sharply and alternates between peaks and troughs. For example... Figure 11A As shown, the frequency response curve reaches its peak (i.e., f h After the corresponding sound pressure level, the frequency response drops sharply and alternates between peaks and troughs. fh The region on the right is the high-frequency segmented vibration region. The frequency at which the corresponding curve reaches its highest peak is the frequency at which high-frequency segmented vibration occurs (e.g., Figure 11A shown f h In some embodiments, to avoid significant differences in vibration among different parts of the main body region 11211, resulting in poor high-frequency performance, the frequency of high-frequency segmented vibration of the main body region 11211 (dome 11211c) can be designed to give the diaphragm 1121 a wide high-frequency bandwidth while reducing the occurrence of high-frequency segmented vibration within the bandwidth region. In some embodiments, the frequency of high-frequency segmented vibration of the dome 11211c can be no less than 20kHz. For example, the frequency of high-frequency segmented vibration of the dome 11211c can be no less than 25kHz. In some embodiments, to ensure high output of the main body region 11211 within the effective frequency band, the mass of the main body region 11211 needs to be small to reduce the vibration difficulty of the main body region 11211 within the effective frequency band. Therefore, the material of the main body region 11211 can be a material and structure with low density and high strength. Therefore, the Young's modulus of the dome 11211c can be no less than 6GPa. In some embodiments, the Young's modulus of the dome 11211c can be in the range of 6GPa-7GPa. For example, the Young's modulus of spherical cap 11211c can be 6.5 GPa. The Young's modulus of spherical cap 11211c can be obtained by static or dynamic methods (such as pulse excitation method, acoustic resonance method, sound velocity method, etc.).

[0077] In some embodiments, the main body region 11211 may be made of carbon fiber material. Figure 11B This is a schematic diagram of an exemplary carbon fiber weaving structure according to some embodiments of this specification. Carbon fiber material has low density and high strength, which is beneficial for reducing the higher-order modes of the speaker 112. In some embodiments, to further increase the strength of the main body region 11211 and reduce the equivalent density of the main body region 11211, the main body region 11211 can be formed by interlacing carbon fibers, with at least some carbon fibers interlaced at a first angle. In some embodiments, the first angle is in the range of 45°-90°. For example, the weaving of multiple independent carbon fibers can be done by interlacing warp and weft fibers at any angle such as 45°, 60°, or 90°. Figure 11BAs shown, multiple carbon fibers 112111 and 112112 can be interwoven at an angle close to 90°. In some embodiments, because the carbon fibers are very thin, the multiple carbon fibers 112111 and 112112 can be laid at an angle close to 90° and connected by adhesive bonding. In some embodiments, the main body region 11211 may include a structure of multiple layers (e.g., 2 layers, 3 layers, etc.) of interwoven carbon fibers. To facilitate the interwoven weaving of carbon fibers, in some embodiments, the length of a single carbon fiber is not less than 5 mm. In some embodiments, the length of a single carbon fiber can be in the range of 5 mm to 10 mm. For example, the length of a single carbon fiber can be 7 mm. Because a single carbon fiber is too thin, it is difficult to weave them one by one, which is not easy to achieve. In some embodiments, multiple carbon fibers can be laid and connected together (e.g., connected by adhesive bonding, etc.) to form multiple sets of carbon fibers, which are interwoven in a warp and weft pattern.

[0078] In some embodiments, to reduce the weight of the main body region 11211, the thickness of the main body region 11211, which employs a super-aligned carbon fiber structure, can be designed to obtain a selected high-frequency bandwidth. In some embodiments, the thickness of the main body region 11211 can be less than 80 μm. In some embodiments, the thickness of the main body region 11211 can be in the range of 10 μm to 60 μm. In some embodiments, the thickness of the main body region 11211 can be 25 μm.

[0079] Figure 12 This is a schematic diagram showing the amplitude of the sound-generating part under different driving voltages according to some embodiments of this specification. For example... Figure 12 As shown, under the same voltage, the diaphragm 1121 of the transducer 112 faces two opposite directions (e.g., Figure 6 The positive and negative directions of the thickness direction X shown are... Figure 12 The amplitude of the vibration differs in the positive and negative directions of the vertical axis (due to the asymmetry of the diaphragm 1121). Figure 12 In this context, the unit Vrms represents the effective voltage value of a sinusoidal AC signal. For example, 0.7Vrms means that the effective voltage value of the input sinusoidal AC signal is 0.7V. Figure 12 As shown, within the input voltage range of 0.4V-0.7V, the amplitude of the diaphragm 1121 vibrating downwards (towards the negative direction of the vertical axis) (approximately 0.8mm) is greater than the amplitude of its vibrating upwards (towards the positive direction of the vertical axis) (approximately 0.6mm). Specifically, upward vibration of the diaphragm 1121 refers to its vibration towards the front cavity 114, while downward vibration refers to its vibration towards the rear cavity 116 (towards the magnetic circuit assembly 1125). Figure 12As shown, as the input voltage continues to increase (e.g., from 0.7V to 1V), the amplitude of the diaphragm 1121 gradually decreases and eventually approaches a threshold value. Specifically, the downward amplitude of the diaphragm 1121 approaches a first threshold value (approximately 0.9mm), and the upward amplitude approaches a second threshold value (approximately 0.8mm). Since the downward amplitude of the diaphragm 1121 is greater than the upward amplitude, the amplitude of the diaphragm 1121 mentioned in this specification refers to the larger downward amplitude. In some embodiments, to prevent the coil 1122 from colliding with the magnetic circuit assembly 1125 during diaphragm 1121 vibration, the maximum amplitude of the diaphragm 1121 can be limited to no more than 0.8mm, i.e., the amplitude of the diaphragm 1121 can be in the range of 0mm-0.8mm. In some embodiments, the amplitude of the diaphragm 1121 can be in the range of 0mm-0.75mm. In some embodiments, the amplitude of the diaphragm 1121 can be in the range of 0mm-0.7mm.

[0080] In some embodiments, within an amplitude range of 0 mm to 0.8 mm, the difference in amplitude between the diaphragm 1121 vibrating in two opposite directions (i.e., upward and downward vibration) can be less than 0.05 mm to reduce the distortion of the transducer 112. In some embodiments, to further reduce the distortion of the transducer 112, the difference in amplitude between the diaphragm 1121 vibrating in two opposite directions (i.e., upward and downward vibration) can be less than 0.04 mm. In some embodiments, to further reduce the distortion of the transducer 112, the difference in amplitude between the diaphragm 1121 vibrating in two opposite directions (i.e., upward and downward vibration) can be less than 0.03 mm.

[0081] Please refer to Figure 8 and Figure 9 In some embodiments, the support 1123 is disposed around the magnetic circuit assembly 1125. For example... Figure 9 As shown, along the vibration direction of the diaphragm, the support 1123 may include a first part 112311, a second part 11232, and a third part 11233. The first part 112311 refers to the portion along the vibration direction of the diaphragm 1121, from the highest point D of the area where the support 1123 connects to the diaphragm 1121 to the highest point of the area where the support 1123 connects to the receiving member 11253. The second part 11232 refers to the area on the support 1123 where ventilation holes are formed, such as... Figure 9As shown, the second part 11232 refers to the portion along the vibration direction of the diaphragm 1121, from the highest point of the connection area between the support 1123 and the housing 11253 to the side wall where the bottom of the vent hole on the support 1123 is located (i.e., the bottom 11253a of the housing 11253). The third part 11233 refers to the portion between the side wall where the bottom of the vent hole on the support 1123 is located and the bottom of the support 1123 near the magnetic circuit assembly 1125 (i.e., near the bottom 11253a of the housing 11253). Figure 10 As shown, a second connecting segment 11212b is provided at one end of the folded ring region 11212 away from the main body region 11211 for connecting the bracket 1123. The second connecting segment 11212b is arranged parallel to the minor axis direction Z and perpendicular to the vibration direction of the diaphragm. In some embodiments, the first portion 112311 of the bracket 1123 is connected to the second connecting segment 11212b of the folded ring region 11212. In some embodiments, the second connecting segment 11212b of the folded ring region 11212 is connected to the first portion 112311 of the bracket 1123 through a fixing ring 1155 to fix the diaphragm 1121 to the bracket 1123.

[0082] Figure 13 This is an exemplary structural diagram of a portion of the rear cavity according to some embodiments of this specification. Please refer to... Figure 6 and Figure 13 In some embodiments, a connecting frame 115 may be provided inside the housing 111. The connecting frame 115 and the support 1123 of the transducer 112 can form a second acoustic cavity, which can serve as a rear cavity 116. The rear cavity 116 is separated from other structures (such as the main control circuit board) within the housing 111, which helps to improve the acoustic performance of the sound-generating part 11. The housing 111 is provided with pressure relief holes (such as a first pressure relief hole 111c and / or a second pressure relief hole 111d), and the connecting frame 115 is provided with an acoustic channel 1151 connecting the pressure relief holes and the rear cavity 116, so that the rear cavity 116 can communicate with the external environment, that is, air can freely enter and exit the rear cavity 116, thereby helping to reduce the resistance of the diaphragm 1121 of the transducer 112 during vibration.

[0083] In some embodiments, the cross-section of the rear cavity 116 may be composed of two perpendicular sides and a curved edge. Connecting the two endpoints of the curved edge, the cross-section (e.g., cross-section ABC) can be approximated as a triangle. The hypotenuse AC is formed by the line connecting the two endpoints of the curved surface formed on the connecting frame 115 and the two straight edges of the support 1123. In some embodiments, the thickness h4 of the first portion 112311 of the support 1123 along the vibration direction of the diaphragm 1121 can affect the volume of the rear cavity 116. Increasing the thickness h4 of the first portion 112311 results in a decrease in the volume of the rear cavity 116 while keeping the overall volume of the sound-generating part 11 constant; conversely, decreasing the thickness h4 of the first portion 112311 results in an increase in the volume of the rear cavity 116. In some embodiments, the thickness of the first portion 112311 of the support 1123 can affect the volume of the rear cavity 116, thereby affecting the resonant frequency of the rear cavity 116. In some embodiments, the rear cavity 116 may refer to the cavity formed on the rear side of the diaphragm. In this case, the thickness h4 of the first part 112311 of the support 1123 increases, and the volume of the rear cavity 116 increases while the volume of the entire sound-generating part 11 remains unchanged; correspondingly, the thickness h4 of the first part 112311 decreases, and the volume of the rear cavity 116 decreases.

[0084] In some embodiments, the combination of the rear cavity 116 and the pressure relief holes (e.g., the first pressure relief hole 111c and / or the second pressure relief hole 111d) provided on the housing 111 can be regarded as a Helmholtz resonant cavity model. The rear cavity 116 can serve as the body of the Helmholtz resonant cavity model, and the pressure relief holes can serve as the neck of the Helmholtz resonant cavity model. In this case, the resonant frequency of the Helmholtz resonant cavity model is the resonant frequency of the rear cavity 116. f 2. In the Helmholtz resonant cavity model, the volume of the cavity (e.g., rear cavity 116) can affect the resonant frequency of the cavity (e.g., rear cavity 116). f The specific relationship is shown in formula (1): (1)

[0085] in, c Represents the speed of sound. S Represents the cross-sectional area of ​​the neck (e.g., the pressure relief port). V Represents the volume of a cavity (e.g., rear cavity 116). L This represents the depth of the neck (e.g., the pressure relief port).

[0086] From formula (1), it can be seen that when the cross-sectional area of ​​the pressure relief hole (e.g., the first pressure relief hole 111c and / or the second pressure relief hole 111d) is... S Depth of the pressure relief hole L When the volume of the rear cavity 116 is increased, the resonant frequency of the rear cavity 116 will increase. f 2. Decrease means shift to lower frequencies.

[0087] Figure 14 This is a frequency response curve of the rear cavity corresponding to different thicknesses of the first portion 112311 as shown in some embodiments of this specification. Figure 14 As the thickness h4 of the first part 112311 of the bracket 1123 gradually increases from 0.3mm to 3mm, the volume of the rear cavity 116 gradually increases, and the resonance peak of the rear cavity 116 gradually shifts to the lower frequency, which reduces the flat range of the frequency response curve and affects the output performance of the sound-generating part 11.

[0088] If the thickness h4 of the first part 112311 is too small, the amplitude of the diaphragm 1121 will be limited by the support 1123. If the thickness h4 of the first part 112311 is too large, the overall size of the sound-generating part 11 will be too large, and the resonant peak of the rear cavity 116 will shift to lower frequencies, reducing the flat area of ​​the frequency response curve of the rear cavity 116 and affecting the sound quality of the sound-generating part 11. The thickness of the first part 112311 refers to the minimum distance between the connection area of ​​the support 1123 and the surround area 11212 and the area directly in contact with the magnetic circuit assembly 1125 in the vibration direction of the diaphragm 1121.

[0089] In some embodiments, to enable the sound-generating part 112 to have a high low-frequency output and to make the frequency response curve of the rear cavity 116 have a large flat region, the thickness h4 of the first portion 112311 of the support 1123 can be in the range of 0.3mm-3mm. In some embodiments, to further improve the low-frequency output of the transducer 112, the thickness h4 of the first portion 112311 can be in the range of 0.5mm-2mm. In some embodiments, to further increase the flat region of the frequency response curve of the rear cavity 116, the thickness h4 of the first portion 112311 can be in the range of 0.8mm-1mm. In some embodiments, the thickness h4 of the first portion 112311 can be 0.9mm, in which case the resonant peak of the rear cavity 116 is around 6.1kHz, the sound-generating part 11 has a good low-frequency output, and the frequency response curve of the rear cavity 116 has a wide flat region.

[0090] In some embodiments, the weight of the transducer 112 is mainly related to the support 1123 and the magnetic circuit assembly 1125, with the magnetic circuit assembly 1125 accounting for a larger proportion of the weight. In some embodiments, an increase in the weight of the support 1123, assuming the material of the support 1123 remains unchanged, indicates an increase in the size of the support 1123, which corresponds to an increase in the area of ​​the diaphragm 1121. In some embodiments, an increase in the weight of the magnetic circuit assembly 1125 will increase the magnetic induction intensity near the coil 1122, increasing the driving force generated on the coil, thereby resulting in a larger vibration amplitude of the diaphragm 1121, giving the transducer 112 higher sensitivity and better low-frequency performance. However, if the weight of the transducer 112 is too large, it will make the weight of the sound-emitting part 11 too large, affecting the wearing stability and comfort of the open-back headphones 10.

[0091] In summary Figure 3 The sound-emitting part 11 shown at least partially covers the antihelix region and Figure 4 In both wearing configurations where the sound-generating part 11 extends entirely or partially into the concha, the volume audible to the ear 100 increases (equivalent to higher sound production efficiency). Therefore, the weight of the transducer 112 can be reduced by decreasing the size of the diaphragm 1121 or the weight of the magnetic circuit assembly 1125, allowing the transducer 112 to have high sensitivity and low-frequency output while the open-back headphones 10 have high wearing stability and comfort. In some embodiments, the weight of the transducer 112 can be in the range of 1.1g-3.3g. In some embodiments, to further improve the sensitivity and low-frequency output of the transducer 112, the weight of the transducer 112 can be in the range of 1.5g-3g. In some embodiments, to further improve the wearing stability and comfort of the open-back headphones 10, the weight of the transducer 112 can be in the range of 2g-2.5g. In some embodiments, the weight of the transducer 112 can be 2.2g.

[0092] Figure 15 This is a frequency response curve of the sound-emitting part under different driving voltages, as shown in some embodiments of this specification. With the diaphragm surface of the speaker 112 facing the test microphone at a distance of 4mm, a voltage in the range of 0.1V-0.7V is applied to the speaker 112. The test frequency range is set to 20Hz-20000Hz to obtain the frequency response curve of the speaker 112 under different driving voltages (e.g., Figure 15 (As shown). Combined Figure 12 and Figure 15 When the input voltage is within the range of 0.1V-0.7V and the frequency is within the range of 20Hz-6.1kHz, the amplitude of the diaphragm 1121 is within the range of 0mm-0.8mm. At this time, to prevent the vibration of the coil 1122 from contacting the bottom 11253a of the receiving component, the distance h3 between the bottom of the coil 1122 and the bottom 11253a of the receiving component (e.g., ...) is... Figure 9 (As shown) can be greater than 0.8 mm. In some embodiments, in order to make the size of the sound-generating part 11 smaller and improve the user's wearing comfort, the distance h3 between the bottom of the coil 1122 and the bottom 11253a of the receiving member (as shown) Figure 9 As shown, the distance (as shown) can not exceed 0.9 mm. Therefore, at an input voltage of 0.1 V-0.7 V, in the range of 20 Hz-6.1 kHz, the distance h3 from the bottom of the coil 1122 to the bottom of the receiver 11253a (as shown) Figure 9 (As shown) can be in the range of 0.8mm-0.9mm.

[0093] like Figure 15 As shown, as the input voltage gradually increases from 100mV to 700mV, the output of the sound-generating part 11 gradually increases, and the sensitivity gradually increases, but the resonant peak frequency remains basically unchanged, located around 6.1kHz. In summary... Figure 3 The sound-emitting part 11 shown at least partially covers the antihelix region and Figure 4 The two wearing scenarios shown involve the sound-emitting part 11 extending entirely or partially into the concha cavity, with the distance h3 from the bottom of the coil 1122 to the bottom 11253a of the receiving member (e.g.) Figure 9 When the thickness (as shown) is controlled within the range of 0.8mm-0.9mm, the sound-generating part 11 has high sensitivity. For example... Figure 15 As shown, when the input voltage is 100mV-700mV, the sound pressure level (SPL) of the sound-emitting part 11 is in the range of 85dB-103dB at a frequency of 1kHz.

[0094] In some embodiments, as described above, the thickness h4 of the first portion 112311 of the support 1123 is in the range of 0.3mm-3mm. When the thickness h4 of the first portion 112311 increases to 3mm, the corresponding resonant frequency of the rear cavity 116... f Reducing the frequency to 3.3kHz decreases the flat area range, affecting sound quality. In some embodiments, to increase the flat area range and improve the sound quality of the sound-emitting part 11, the thickness h4 of the first part 112311 can be less than 3mm, and the resonant frequency of the rear cavity 116... f 2 can be no less than 3.3 kHz. In some embodiments, in order to further improve the sound quality of the sound-emitting part 11, the resonant frequency of the rear cavity 116 is... f 2 can be no less than 3.5kHz. In some embodiments, in order to further improve the sound quality of the sound-emitting part 11, the resonant frequency of the rear cavity 116 is... f 2 can be no less than 4kHz. In some embodiments, in order to further improve the sound quality of the sound-emitting part 11, the resonant frequency of the rear cavity 116 is... f 2 can be no less than 6kHz.

[0095] In some embodiments, according to formula (1), the volume of the rear cavity 116 can affect the resonant frequency of the rear cavity 116. f 2. Furthermore, the volume of the rear cavity 116 is affected by the thickness h4 of the first portion 112311 of the support 1123. This is determined by the range of h4 values ​​for the thickness of the first portion 112311 and the resonant frequency of the rear cavity 116. f The range of values ​​for 2 determines the range of values ​​for the volume of the rear cavity 116. In some embodiments, the volume of the rear cavity 116 can be 60 mm². 3 -110mm 3 .

[0096] Figure 16 This is a schematic diagram illustrating exemplary positions of the bracket and the first and second pressure relief holes according to some embodiments of this specification. Figure 16 As shown, in some embodiments, the bracket 1123 has multiple vent holes 11231. The vent holes 11231 allow sound from the back of the diaphragm 1121 to be transmitted to the rear cavity 116 and the pressure relief hole and propagated to the outside through the multiple vent holes 11231, providing a good channel for radiating sound on both sides of the diaphragm 1121.

[0097] In some embodiments, to better balance airflow and equalize air pressure within the rear cavity 116, the multiple vents 11231 can be designed asymmetrically. For example, the multiple vents 11231 can be asymmetrically arranged with the short axis of the bracket 1123 as the center. Specifically, the bracket 1123 has a first vent 11231a and a second vent 11231b. Figure 16 As shown, the distance La between the center of the first vent 11231a and the center of the second pressure relief hole 111d is greater than the distance Lb between the center of the second vent 11231b and the center of the second pressure relief hole 111d. In some embodiments, the air pressure in the rear cavity 116 is higher at locations farther from the second pressure relief hole 111d. Therefore, to balance the air pressure in the rear cavity 116, the area of ​​the first vent 11231a is larger than the area of ​​the second vent 11231b. That is, to balance the air pressure in the rear cavity 116, the vent closer to the second pressure relief hole 111d (or the first pressure relief hole 111c) has a smaller area, and the vent farther from the second pressure relief hole 111d (or the first pressure relief hole 111c) has a larger area. The distance between the vent 11231 and the pressure relief hole refers to the distance between the center of the vent 11231 and the center of the corresponding pressure relief hole. In this instruction manual, the center of the vent or pressure relief hole refers to the geometric center of the hole-like structure.

[0098] In the rear cavity 116, the air pressure is higher at locations farther from the first pressure relief hole 111c and / or the second pressure relief hole 111d, so the area of ​​the vent hole 11231 can be set larger; conversely, the air pressure is lower at locations closer to the first pressure relief hole 111c and / or the second pressure relief hole 111d, so the area of ​​the vent hole 11231 can be set smaller. If the areas of multiple vent holes 11231 are all the same size, the air pressure will be higher at locations in the rear cavity 116 farther from the first pressure relief hole 111c and / or the second pressure relief hole 111d. Because the area of ​​the vent hole 11231 at these locations is smaller, it cannot effectively balance the air pressure in the rear cavity 116, resulting in greater air resistance when the diaphragm 1121 vibrates. Similarly, the resistance experienced by the diaphragm 1121 is lower at locations in the rear cavity 116 closer to the first pressure relief hole 111c and / or the second pressure relief hole 111d. This results in uneven force on the diaphragm 1121, causing unstable vibration of the diaphragm 1121. Therefore, by adjusting the size of the vent hole 11231, the low-frequency vibration of the sound-generating part 11 can be made more stable.

[0099] In some embodiments, since the vents 11231 can balance the air pressure within the rear cavity 116, affecting the uniformity of air resistance experienced by the diaphragm 1121 during vibration, the total area of ​​the vents 11231 can influence the output performance of the sound-generating section 11. Furthermore, the ratio of the total area of ​​the multiple vents 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction can affect the air resistance experienced by the diaphragm 1121 during vibration. If the ratio of the total area of ​​the multiple vents 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction is too small, it will result in higher air pressure within the rear cavity 116, leading to greater air resistance experienced by the diaphragm 1121 during vibration, thus affecting the low-frequency output performance of the diaphragm 1121. When the ratio of the total area of ​​the multiple vents 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction reaches a certain threshold, further increasing this ratio weakens the influence of the air within the rear cavity 116 on the vibration of the diaphragm 1121, but also affects the structural strength of the support. Therefore, in some embodiments, to ensure that the diaphragm 1121 experiences uniform and low air resistance during vibration, thus guaranteeing good output performance of the sound-generating part 11, the ratio of the total area of ​​the plurality of vent holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction can be in the range of 0.008-0.3. In some embodiments, to further reduce the air resistance experienced by the diaphragm 1121 during vibration, the ratio of the total area of ​​the plurality of vent holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction can be in the range of 0.1-0.25. In some embodiments, to further reduce the air resistance experienced by the diaphragm 1121 during vibration, the ratio of the total area of ​​the plurality of vent holes 11231 to the projected area of ​​the diaphragm 1121 along the vibration direction can be in the range of 0.11-0.23.

[0100] Figure 17 This describes the frequency response curves of the rear cavity corresponding to different total areas of the vent holes, as shown in some embodiments of this specification. The different total areas of the vent holes 11231 can be achieved by blocking the vent holes 11231 with modeling clay. With the diaphragm surface of the speaker 112 facing the test microphone at a distance of 4mm, and a voltage of 0.4V applied to the speaker 112, the frequency response curves of the speaker 112 under different vent hole areas can be obtained (e.g., ...). Figure 17 (As shown). Where 0mm 2 This refers to a situation where the vent 11231 is completely blocked, meaning there are no openings on the support. For example... Figure 17 As shown, as the total area of ​​the vent 11231 decreases from 0 mm², 2 Gradually increased to 4.54mm 2 The frequency response curve of the rear cavity 116 gradually shifts upward in the low-frequency region (e.g., 100Hz-1000Hz), meaning the low-frequency response of the rear cavity 116 gradually increases. When the total area of ​​the vent 11231 increases from 4.54mm... 2 Gradually increased to 12.96mm 2 During the process, the low-frequency response of the rear cavity 116 does not change significantly. This is because when the total area of ​​the vent 11231 increases to a certain area (e.g., 4.54 mm), the response remains relatively stable. 2 After that, under low-frequency vibration, the influence of the air in the rear cavity 116 on the vibration of the diaphragm 1121 gradually weakens. Therefore, even if the total area of ​​the vent hole 11231 is increased, the impact on the frequency response curve of the low-frequency region of the rear cavity 116 is not significant.

[0101] like Figure 17 As shown, as the total area of ​​the vent 11231 decreases from 0 mm², 2 Gradually increased to 12.96mm 2 The resonant peak of the rear cavity 116 gradually shifts towards higher frequencies, while the frequency response curve in the low-frequency region (e.g., 100Hz-1000Hz) gradually flattens out. In some embodiments, to ensure good low-frequency response in the rear cavity 116, the total area of ​​the sound-permeable aperture 11231 can be 4.54 mm². 2 -12.96mm 2 Within the range. In some embodiments, in order to give the rear cavity 116 a good low-frequency response, the total area of ​​the sound-permeable hole 11231 can be 5 mm. 2 -11mm 2 Within the range. In some embodiments, in order to give the rear cavity 116 a good low-frequency response, the total area of ​​the sound-permeable hole 11231 can be 7mm². 2 -10mm 2Within the range. In some embodiments, in order to give the rear cavity 116 a good low-frequency response, the total area of ​​the sound-permeable hole 11231 can be 8 mm. 2 -10mm 2 Within the range.

[0102] In some embodiments, to improve structural strength, the bracket 1123 may have multiple ventilation holes 11231, and the connecting portions between the multiple ventilation holes 11231 form reinforcing ribs. In some embodiments, to simplify the opening process, the number of ventilation holes 11231 may be set to only one, provided that the total area of ​​the ventilation holes 11231 is satisfied.

[0103] In some embodiments, multiple vent holes may be provided on the bottom 11253a or sidewall 11253b of the housing 1125 of the magnetic circuit assembly 1125. Sound from the back of the diaphragm 1121 can be transmitted to the rear cavity 116 and the pressure relief hole through the multiple vent holes, which provide good channels for radiating sound on both sides of the diaphragm 1121.

[0104] In some embodiments, the projected area of ​​the diaphragm 1121 in the vibration direction affects the amount of air propelled by the diaphragm 1121 during vibration, thereby affecting the efficiency of sound generation by the diaphragm 1121 and the acoustic output effect of the sound-generating part 11. If the projected area of ​​the diaphragm 1121 in the vibration direction is too small, the amount of air propelled by the diaphragm 1121 during vibration will be small, resulting in poor acoustic output effect of the sound-generating part 11. If the projected area of ​​the diaphragm 1121 in the vibration direction is too large, the size of the bracket 1123 will be too large, resulting in increased weight of the bracket 1123 and a heavier sound-generating part 11, affecting the structure and weight of the sound-generating part 11, and impacting wearing comfort and stability. Figure 3 The sound-emitting part 11 shown at least partially covers the antihelix region and Figure 4In both wearing scenarios where the sound-generating part 11 extends entirely or partially into the concha cavity, the volume audible to the ear 100 increases (equivalent to higher sound generation efficiency), thus the size of the diaphragm 1121 does not need to be excessively large. In some embodiments, the sound outlet 111a is disposed on the side wall of the housing 111 of the sound-generating part 11 near the user's ear, and the sound outlet 111a is disposed on the front side of the diaphragm 1121 and communicates with the front cavity 114. The vibration direction of the diaphragm 1121 is or approximately equal to the thickness direction X of the sound-generating part 11, and the projected area of ​​the diaphragm 1121 in the vibration direction is or approximately equal to the projected area of ​​the diaphragm 1121 in the sagittal plane. The projected area of ​​the diaphragm 1121 in the vibration direction can affect the projected area of ​​the sound-generating part 11 in the user's sagittal plane. The overlap ratio between the projection area of ​​the sound-generating part 11 onto the user's sagittal plane and the projection area of ​​the concha cavity onto the sagittal plane can affect the cavity-like structure formed by the sound-generating part 11 extending into the concha cavity, thereby affecting the acoustic output effect of the sound-generating part 11. Furthermore, the major axis and minor axis dimensions of the diaphragm 1121 can affect the major axis and minor axis dimensions of the projection of the sound-generating part 11 onto the sagittal plane.

[0105] In some embodiments, the above are combined Figure 3 The sound-emitting part 11 shown at least partially covers the antihelix region and Figure 4 Considering both cases where the sound-generating part 11 extends entirely or partially into the concha cavity, in order to ensure that the sound-generating part 11 has good acoustic output and that its projection on the sagittal plane has a suitable area or its thickness, the projected area of ​​the diaphragm 1121 in the vibration direction can be 90 mm². 2 -560mm 2 Preferably, the projected area of ​​the diaphragm 1121 in the vibration direction can be 120 mm². 2 -300mm 2 Preferably, the projected area of ​​the diaphragm 1121 in the vibration direction can be 150 mm². 2 -200mm 2 .

[0106] In summary Figure 3 The sound-emitting part 11 shown at least partially covers the antihelix region and Figure 4Considering both cases where the sound-generating part 11 extends entirely or partially into the concha cavity, in order to maximize the area of ​​the diaphragm 1121 within the limited size of the sound-generating part 11, thereby enhancing the acoustic output performance of the sound-generating part 11, in some embodiments, when the vibration direction of the diaphragm 1121 is parallel to the thickness direction X of the sound-generating part 11, the ratio of the projected area of ​​the diaphragm 1121 in the diaphragm vibration direction (i.e., the projected area of ​​the diaphragm 1121 in the sagittal plane) to the projected area of ​​the housing 111 in the diaphragm vibration direction (i.e., the projected area of ​​the housing 111 in the sagittal plane) may not be less than 0.5. In some embodiments, in order to maximize the area of ​​the diaphragm 1121 within the limited size of the sound-generating part 11, thereby enhancing the acoustic output performance of the sound-generating part 11, the ratio of the projected area of ​​the diaphragm 1121 in the diaphragm vibration direction to the projected area of ​​the housing 111 in the diaphragm vibration direction may not be less than 0.8. In some embodiments, the diaphragm 1121 is made to have the largest possible area, thereby enhancing the acoustic output performance of the sound-generating part 11. The ratio of the projected area of ​​the diaphragm 1121 in the diaphragm vibration direction to the projected area of ​​the housing 111 in the diaphragm vibration direction can be in the range of 0.8-0.95.

[0107] In some embodiments, in conjunction with the above Figure 3 The wearing method shown, where the sound-emitting part 11 at least partially covers the antihelix region, allows the diaphragm 1121 to have a major axis dimension in the range of 13mm-25mm and a minor axis dimension in the range of 4mm-13mm. Combined with... Figure 4 The wearing method shown, in which the sound-generating part 11 extends entirely or partially into the concha cavity, allows the short axis dimension of the diaphragm 1121 to be in the range of 4mm-13mm to facilitate the formation of an effective cavity-like structure. Based on the aforementioned short axis dimension, and considering the projected area of ​​the diaphragm 1121 (for example, the projected area of ​​the diaphragm 1121 in the vibration direction is 52mm²), the... 2 -325mm 2 Within the specified range, the major axis dimension of the diaphragm 1121 is further determined to be within the range of 13mm-25mm. For example, the major axis dimension of the diaphragm 1121 can be within the range of 15mm-20mm, and the minor axis dimension of the diaphragm can be within the range of 5mm-10mm. As another example, the major axis dimension of the diaphragm 1121 can be within the range of 17mm-18mm, and the minor axis dimension of the diaphragm can be within the range of 7mm-8mm.

[0108] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this application. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this application, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0109] Furthermore, this application uses specific terms to describe embodiments of the application. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic associated with at least one embodiment of the application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this specification do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of the application can be appropriately combined.

[0110] Furthermore, those skilled in the art will understand that aspects of this application can be described and illustrated through several patentable types or situations, including any new and useful combination of processes, machines, products, or substances, or any new and useful improvements thereof. Accordingly, aspects of this application can be implemented entirely by hardware, entirely by software (including firmware, resident software, microcode, etc.), or by a combination of hardware and software. All of the above hardware or software may be referred to as a “data block,” “module,” “engine,” “unit,” “component,” or “system.” Furthermore, aspects of this application may manifest as a computer product located on one or more computer-readable media, the product including computer-readable program code.

[0111] Computer storage media may contain a propagated data signal containing computer program code, for example, on baseband or as part of a carrier wave. This propagated signal may take various forms, including electromagnetic, optical, and suitable combinations thereof. Computer storage media can be any computer-readable medium other than a computer-readable storage medium, which can be connected to an instruction execution system, apparatus, or device to enable communication, propagation, or transmission of a program for use. The program code located on the computer storage medium can be propagated through any suitable medium, including radio, cable, fiber optic cable, RF, or similar media, or any combination of the above media.

[0112] The computer program code required for the operation of each part of this application can be written in any one or more programming languages, including object-oriented programming languages ​​such as Java, Scala, Smalltalk, Eiffel, JADE, Emerald, C++, C#, VB.NET, Python, etc., conventional procedural programming languages ​​such as C, Visual Basic, Fortran 2003, Perl, COBOL 2002, PHP, ABAP, dynamic programming languages ​​such as Python, Ruby, and Groovy, or other programming languages. This program code can run entirely on the user's computer, or as a standalone software package on the user's computer, or partially on the user's computer and partially on a remote computer, or entirely on a remote computer or processing device. In the latter case, the remote computer can be connected to the user's computer through any network, such as a local area network (LAN) or wide area network (WAN), or connected to an external computer (e.g., via the Internet), or in a cloud computing environment, or used as a service such as Software as a Service (SaaS).

[0113] Furthermore, unless expressly stated in the claims, the order of processing elements and sequences, the use of numbers and letters, or other names described in this application are not intended to limit the order of the processes and methods of this application. Although various examples have been discussed in the foregoing disclosure of some embodiments that are currently considered useful, it should be understood that such details are for illustrative purposes only, and the appended claims are not limited to the disclosed embodiments. Rather, the claims are intended to cover all modifications and equivalent combinations that conform to the substance and scope of the embodiments of this application. For example, while the system components described above can be implemented by hardware devices, they can also be implemented solely by software solutions, such as installing the described system on existing processing devices or mobile devices.

[0114] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0115] In some embodiments, numbers describing the quantity of components and attributes are used. It should be understood that such numbers used in the description of embodiments are modified in some examples with the terms "approximately," "approximately," or "generally." Unless otherwise stated, "approximately," "approximately," or "generally" indicates that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may be changed depending on the characteristics required by individual embodiments. In some embodiments, numerical parameters should take into account specified significant digits and employ a general method of digit reservation. Although the numerical ranges and parameters used to confirm their breadth of scope in some embodiments of this application are approximate values, in specific embodiments, such values ​​are set as precisely as feasible.

[0116] For each patent, patent application, patent application publication, and other material such as articles, books, specifications, publications, and documents referenced in this application, the entire contents of that material are incorporated herein by reference. This excludes historical application documents that are inconsistent with or conflict with the content of this application, as well as documents that limit the broadest scope of the claims in this application (currently or subsequently appended to this application). It should be noted that if there is any inconsistency or conflict between the descriptions, definitions, and / or terminology used in the supplementary materials of this application and the content of this application, the descriptions, definitions, and / or terminology used in this application shall prevail.

[0117] Finally, it should be understood that the specific embodiments described in this application are merely exemplary, and one or more technical features in the specific embodiments are optional or additional, and do not constitute essential technical features of the inventive concept of this application. In other words, the scope of protection of this application covers and is far greater than the specific embodiments.

Claims

1. A vocal part, comprising: A housing, wherein the housing is provided with at least one sound outlet and one or more pressure relief holes; A transducer, wherein the transducer is disposed inside the housing, and the transducer includes a diaphragm, a coil, a bracket, and a magnetic circuit assembly; The cavity inside the housing is divided by the diaphragm into a front cavity located on the front side of the diaphragm and a rear cavity located on the rear side of the diaphragm. The at least one sound outlet is acoustically coupled to the front cavity, and the one or more pressure relief holes are acoustically coupled to the rear cavity. The bracket is arranged around the magnetic circuit assembly, the coil is connected to the diaphragm and is at least partially located in the magnetic gap formed by the magnetic circuit assembly, wherein the diaphragm includes a main body region and a loop region surrounding the main body region; The first part of the bracket is connected to the folded ring region. The thickness of the first part is in the range of 0.5mm-2mm, so that the resonant frequency of the rear cavity is not less than 4kHz. The thickness of the first part is the minimum distance between the connection area of ​​the bracket and the folded ring region and the area of ​​the bracket that is directly attached to the magnetic circuit assembly in the vibration direction of the diaphragm.

2. The sound-producing part according to claim 1, characterized in that, The folded ring area is provided with a second connecting section at the end away from the main body area, and the second connecting section is connected to the first part of the bracket through a fixing ring.

3. The sound-generating part according to claim 2, characterized in that, The fixing ring is made of stainless steel or other metals.

4. The sound-producing part according to claim 1, characterized in that, The housing is provided with a connecting frame, and the connecting frame is provided with an acoustic channel connecting the one or more pressure relief holes and the rear cavity.

5. The sound-producing part according to claim 1, characterized in that, The bracket has multiple ventilation holes, and the sound from the back of the diaphragm is transmitted to one or more pressure relief holes through the multiple ventilation holes. The plurality of vents includes at least a first vent and a second vent. The distance between the center of the first vent and the center of the pressure relief hole is greater than the distance between the center of the second vent and the center of the corresponding pressure relief hole, and the area of ​​the first vent is greater than the area of ​​the second vent.

6. The sound-generating part according to claim 5, characterized in that, The multiple vent holes are designed asymmetrically.

7. The sound-producing part according to claim 5, characterized in that, The ratio of the total area of ​​the plurality of vent holes to the projected area of ​​the diaphragm along the vibration direction is in the range of 0.1-0.

25.

8. The sound-producing part according to claim 5, characterized in that, The total area of ​​the sound-permeable holes is 4.54 mm. 2 -12.96mm 2 Within the range.

9. The sound-producing part according to claim 1, characterized in that, The folded area includes an arc segment, and the ratio of the height of the arc segment to the span of the arc segment is in the range of 0.35-0.

4.

10. The sound-producing part according to claim 1, characterized in that, The main area includes a dome, and the ratio of the height of the dome to the span of the dome is in the range of 0.1-0.

3.

11. The sound-producing part according to claim 10, characterized in that, The span of the dome is in the range of 2mm-8mm, and the height of the dome is in the range of 0.7mm-1.2mm.

12. The sound-producing part according to any one of claims 1-11, characterized in that, When worn, the entire or part of the sound-producing part extends into the concha cavity of the user's ear to form a cavity-like structure. The cavity-like structure is a semi-closed structure formed by the sidewall of the sound-producing part and the concha cavity structure. The major axis dimension of the diaphragm is in the range of 15mm-20mm, and the minor axis dimension of the diaphragm is in the range of 5mm-10mm.

13. The sound-producing part according to claim 1, characterized in that, The magnetic circuit assembly includes a housing, and the distance between the bottom of the coil and the bottom wall of the housing is in the range of 0.2mm-4mm in the vibration direction of the diaphragm.

14. The sound-producing part according to claim 13, characterized in that, The distance between the coil and the side wall of the housing is in the range of 0.1mm-0.5mm.

15. The sound-producing part according to claim 14, characterized in that, Multiple ventilation holes are provided on the bottom wall of the receiving component or on the side wall of the receiving component that is in contact with the bracket.

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