A new energy vehicle protection circuit board etching processing equipment
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU KAINENG HONGGUANG ELECTRONICS CO LTD
- Filing Date
- 2026-05-22
- Publication Date
- 2026-08-07
AI Technical Summary
[0005]本发明技术方案针对现有技术解决方案过于单一的技术问题,提供了显著不同于现有技术的解决方案,具体地本发明的目的在于提供一种新能源汽车用保护线路板蚀刻加工设备,以解决上述背景技术提出的线路板上不需要蚀刻的区域同样会被药液喷淋的问题
[0042]1. This invention utilizes the height difference between the anti-corrosion plate and the copper-clad laminate, allowing the probe wheel to adaptively detect and distinguish between the anti-corrosion plate and the copper-clad laminate as it travels along the main pipeline by changing its height. When encountering the anti-corrosion plate, the probe wheel is raised to the second highest point, thus blocking the chemical solution in the diversion pipe and preventing it from entering the nozzle. When encountering the copper-clad laminate, the probe wheel is lifted to the middle height position, at which point the chemical solution flows normally to the nozzle. This achieves adaptive start and stop of chemical solution spraying, allowing the chemical solution to be sprayed more accurately to the parts that need to participate in the reaction, reducing chemical solution loss. Excessive chemical solution will not remain on the surface of parts that do not need chemical solution reaction, reducing the amount of contact between the anti-corrosion plate and the etching solution, making it easier to dissolve or peel off when the anti-corrosion plate is removed later.
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Figure CN122534769A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of etching technology, specifically to an etching processing equipment for protective circuit boards used in new energy vehicles. Background Technology
[0002] Protection circuit boards for new energy vehicles are key circuit carriers in core components such as battery management systems and motor controllers. They typically employ thick copper foil designs to meet high current carrying requirements, and etching is the core process for forming conductive lines during manufacturing. The basic principle of etching is to use a chemical reaction to remove excess unprotected copper layers from the surface of the copper-clad laminate. Specifically, the copper-clad laminate coated with photoresist is brought into contact with an etching solution, causing the etching solution to undergo an oxidation-reduction reaction with the exposed copper surface, generating soluble copper salts. This achieves selective removal of the copper layer, ultimately leaving the bottom substrate and the copper-clad laminate with a surface pattern consistent with the desired circuitry. Currently, the commonly used etching method involves spraying a chemical solution onto the circuit board surface using several sets of parallel nozzles, ensuring the solution evenly covers the entire board surface.
[0003] However, areas on the circuit board that do not require etching (i.e., those covered by a resist plate matching the desired circuit pattern) are also sprayed with the etching solution. This portion of the solution does not actually participate in the effective reaction, resulting in unnecessary waste. Furthermore, when processing circuit boards of different sizes, especially small ones, the solution sprayed from nozzles located at the edge of the equipment cannot reach the board surface, leaving these nozzles idle during processing and further exacerbating the waste of the etching solution.
[0004] To address the aforementioned issues, there is an urgent need for innovative designs based on existing etching equipment for protective circuit boards used in new energy vehicles. Summary of the Invention
[0005] The present invention addresses the problem of overly simplistic solutions in existing technologies by providing a significantly different solution. Specifically, the present invention aims to provide an etching processing equipment for protective circuit boards used in new energy vehicles, thereby solving the problem mentioned in the background that areas on the circuit board that do not require etching are also sprayed with chemical solution.
[0006] To achieve the above objectives, the present invention provides the following technical solution: an etching processing equipment for protective circuit boards used in new energy vehicles, comprising a work box, a main pipe disposed on the work box, and a clamping plate disposed on the work box, and further comprising:
[0007] Several sets of sleeves installed below the main pipeline, nozzles fixed outside the sleeves, and liquid control components installed on the sleeves are used to adaptively detect the position of the anti-corrosion plate and reduce direct spraying of the liquid onto the anti-corrosion plate.
[0008] The shifting component set on the work box adaptively closes off excess nozzles and makes room for the clamping plate to move by adjusting the displacement of the clamping plate according to the size of the circuit board.
[0009] The liquid control component includes:
[0010] The system includes a shunt pipe located on one side of the casing, a control valve movably inserted inside the casing, a probe rod fixed at the bottom of the casing, a probe wheel rotatably located at the bottom of the probe rod, and a channel opening on one side of the control valve.
[0011] The dialing component includes:
[0012] The push plate is fixed to one end of the clamping plate, the push plate is fixed to the top of one side of the push plate, and the buckle is movably set in the sleeve.
[0013] Preferably, the several groups of nozzles are distributed at equal intervals in a linear array;
[0014] Each set of nozzles is fixed to the bottom end of each set of sleeves, and the nozzles are set in an inclined position;
[0015] The inside of the nozzle is connected to the inside of the liquid control valve via a hose.
[0016] Preferably, the other end of the diversion pipe is fixed to the main pipe, and the interior of the diversion pipe is in communication with the interior of the main pipe;
[0017] The outer diameter of the liquid control valve is the same as the inner diameter of the sleeve;
[0018] The interior of the diverter tube is connected to the interior of the liquid control valve through a channel port.
[0019] Preferably, the length of the outer wall of the control valve at both ends above and below the channel opening is greater than the inner diameter of the diverter pipe;
[0020] There is no gap between the outer wall of the liquid control valve and one end of the diversion pipe.
[0021] Preferably, the liquid control assembly further includes a first spring fixed to the top of the liquid control valve;
[0022] The top of the first spring is fixedly connected to the inner wall of the top of the channel opening;
[0023] Small holes are provided at both the top and bottom of the passage opening, and there are no obstructions at the small holes.
[0024] Preferably, the shifting assembly further includes a first ramp block fixed on the probe rod;
[0025] The outer surface of the probe is fixed with a second slope block above the first slope block;
[0026] Both the No. 1 and No. 2 slope blocks are equipped with several groups of the same number of nozzles.
[0027] Several groups of the No. 1 and No. 2 ramp blocks are distributed in a mirror image with the middle of the main pipeline as the center line;
[0028] The slopes of the second ramp block all face away from the middle of the main pipeline.
[0029] The inclined surfaces of the No. 1 ramp block all face the middle of the main pipeline.
[0030] The slopes of the first and second ramps are staggered.
[0031] Preferably, the clamping plate, the top push plate, and the bottom push plate are each provided in two sets;
[0032] The two sets of clamping plates, push plates, and push plates are mirror images of each other;
[0033] The top side of the push plate is set as an inclined surface facing the middle of the main pipe;
[0034] The inclined surface of the second ramp block is adapted to the inclined surface of the jacking plate;
[0035] One end of the push plate is set as an inclined surface, and the inclined surface of the push plate is adapted to the inclined surface of the first ramp block;
[0036] The inclined length of the top push plate is greater than the inclined length of the first ramp block and the bottom push plate;
[0037] The width of the push plate is less than the interval between every two sets of sleeves.
[0038] Preferably, both the upper and lower sides of the buckle are beveled.
[0039] The bottom side of the liquid control valve has a square groove that matches the buckle.
[0040] A second spring is fixed between one end of the buckle and the inner wall of the sleeve.
[0041] Compared with the prior art, the beneficial effects of the present invention are:
[0042] 1. This invention utilizes the height difference between the anti-corrosion plate and the copper-clad laminate, allowing the probe wheel to adaptively detect and distinguish between the anti-corrosion plate and the copper-clad laminate as it travels along the main pipeline by changing its height. When encountering the anti-corrosion plate, the probe wheel is raised to the second highest point, thus blocking the chemical solution in the diversion pipe and preventing it from entering the nozzle. When encountering the copper-clad laminate, the probe wheel is lifted to the middle height position, at which point the chemical solution flows normally to the nozzle. This achieves adaptive start and stop of chemical solution spraying, allowing the chemical solution to be sprayed more accurately to the parts that need to participate in the reaction, reducing chemical solution loss. Excessive chemical solution will not remain on the surface of parts that do not need chemical solution reaction, reducing the amount of contact between the anti-corrosion plate and the etching solution, making it easier to dissolve or peel off when the anti-corrosion plate is removed later.
[0043] 2. This invention relies on the clamping plate to limit and fix the circuit board while simultaneously closing off excess nozzles at the edge according to the size of the circuit board, further reducing liquid consumption and making the equipment more adaptable. Specifically, when the clamping plate passes under each set of nozzles, each set of probes will be raised to the highest point in advance and will not easily return to its original position. The clamping plate will not touch or lift the probes during movement, and the probes that have been raised to the highest point will no longer be affected by the circuit board. Therefore, the nozzles at the corresponding positions will not spray liquid, and the clamping plate will not be blocked by the probes when moving. Attached Figure Description
[0044] Figure 1 This is a schematic diagram of the first three-dimensional structure of the present invention.
[0045] Figure 2 This is a schematic diagram of the second three-dimensional structure of the present invention.
[0046] Figure 3 This is a schematic diagram of the circuit board of the present invention in a clamped state.
[0047] Figure 4 This is a schematic diagram showing the working state of several groups of probes in the structure of this invention.
[0048] Figure 5 This is a partial structural diagram of the present invention.
[0049] Figure 6 This is a schematic diagram of the state structure of the push plate pushing the probe rod according to the present invention.
[0050] Figure 7 This is a schematic diagram of the structure of the push plate of the present invention pushing the probe rod to the highest point.
[0051] Figure 8 This is a schematic diagram of the probe rod being pulled down when the push plate is reset according to the present invention.
[0052] Figure 9 This is a schematic diagram of the structure of the diversion pipe and the liquid control valve in the initial state of the present invention.
[0053] Figure 10 This is a schematic diagram of the internal connection state between the diversion pipe and the control valve of the present invention.
[0054] Figure 11 This is a schematic diagram of the liquid control valve of the present invention in its highest state.
[0055] Figure 12 This is a schematic diagram of the snap-fit structure of the present invention.
[0056] In the diagram: 1. Working box; 2. Main pipe; 3. Clamping plate; 4. Diversion pipe; 5. Sleeve; 6. Probe rod; 7. Probe wheel; 8. Nozzle; 9. No. 1 ramp block; 10. No. 2 ramp block; 11. Push plate; 12. Push plate; 13. Control valve; 14. No. 1 spring; 15. Channel opening; 16. Buckle; 17. No. 2 spring. Detailed Implementation
[0057] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0058] Please see Figures 1 to 12 This invention provides a technical solution: an etching processing equipment for protective circuit boards used in new energy vehicles, comprising a work box 1, a main pipe 2 disposed on the work box 1, and a clamping plate 3 disposed on the work box 1, and further comprising:
[0059] Several sets of sleeves 5 are installed below the main pipeline 2, nozzles 8 are fixed outside the sleeves 5, and liquid control components are installed on the sleeves 5 to adaptively detect the position of the anti-corrosion plate and reduce direct spraying of the liquid onto the anti-corrosion plate.
[0060] The shifting component set on the work box 1 adaptively closes the excess nozzles 8 and frees up the movement space of the clamping plate 3 according to the size of the circuit board by utilizing the displacement of the clamping plate 3.
[0061] The liquid control components include:
[0062] The system includes a diversion pipe 4 located on one side of the middle of the casing 5, a liquid control valve 13 movably inserted inside the casing 5, a probe rod 6 fixed at the bottom of the casing 5, a probe wheel 7 rotatably located at the bottom of the probe rod 6, and a channel opening 15 opened on one side of the liquid control valve 13.
[0063] The dialing components include:
[0064] The push plate 11 is fixed to one end of the clamping plate 3, the push plate 12 is fixed to the top of one side of the push plate 11, and the buckle 16 is movably disposed in the sleeve 5.
[0065] In its implementation, the working box 1 consists of a body, a liquid storage tank, a liquid pump, an electromagnetic slide rail, an electric push rod, and an adjustable conveying assembly. The top of the main pipe 2 is fixedly connected to the electromagnetic slider in the electromagnetic slide rail. The main pipe 2 moves with the electromagnetic slider, allowing the liquid to be sprayed from one end of the circuit board to the other. The top of the main pipe 2 passes through the electromagnetic slider and connects to the outlet of the liquid pump via a flexible hose, the length of which must be sufficient. Furthermore, one end of the extension rod of the electric push rod is fixedly connected to the clamping plate 3, providing driving force to the clamping plate 3. The electric push rod can be pre-set with a predetermined advance distance or have a built-in pressure sensor. The electric push rod can stop advancing after the clamping plate 3 has clamped the circuit board. Finally, the adjustable conveying assembly can adjust the two conveyor belts to fit the circuit board according to its size, conveying the circuit board to the designated position. All of the above are existing mature technologies. Specific components, their models, and working principles can be found in existing technologies, and will not be elaborated upon further here. It is important to note that since etching involves a large amount of corrosive liquid, key components must be made of Hastelloy, titanium alloy, or other suitable materials that do not react with the etching solution. Additionally, the pump must have a built-in backflow protection device to prevent damage if the outlet is blocked or the flow rate is forcibly reduced. For specific details, please refer to existing mature technologies.
[0066] Several groups of nozzles 8 are distributed at equal intervals in a linear array;
[0067] Each set of nozzles 8 is fixed at the bottom of each set of sleeves 5, and the nozzles 8 are set at an angle.
[0068] In practical implementation, the nozzle 8 can be tilted at a slight angle to maintain the misalignment between the nozzle and the probe wheel 7, preventing excessive spraying of the chemical solution onto the probe wheel 7 and causing damage over time, while also further reducing chemical solution consumption. Furthermore, the spacing between each set of nozzles 8 needs to be appropriate to ensure that when all nozzles 8 are fully open, the entire circuit board surface can be sprayed with the chemical solution, without any gaps between any two sets of nozzles 8. Even when the set of nozzles 8 above the resist board is closed, the exposed copper-clad laminate outside the resist board area can still be properly sprayed with the chemical solution. While it's impossible for the resist board to be completely free of chemical solution, compared to traditional indiscriminate spraying, the amount of chemical solution covering the resist board in this invention is significantly reduced. This is particularly noticeable for etching operations on large-size circuit boards used in new energy vehicles with high chemical consumption, where the chemical solution savings are even more pronounced.
[0069] The inside of the nozzle 8 is connected to the inside of the liquid control valve 13 via a hose.
[0070] In practice, the height of the control valve 13 will vary depending on whether the probe 7 contacts the anti-corrosion plate or the copper-clad plate. To ensure a consistent spraying range, the height of the nozzle 8 remains constant. Therefore, the hose needs to be of sufficient length to accommodate the height difference between the control valve 13 and the nozzle 8. Furthermore, it should be noted that when the channel opening 15 is not aligned with the port of the diversion pipe 4, the liquid needs to be sealed within the diversion pipe 4 by the outer wall of the control valve 13. This means the seal between the outer wall of the control valve 13 and the port of the diversion pipe 4 must be excellent. Since the port of the diversion pipe 4 is fixedly connected to the sleeve 5, the seal between the outer wall of the control valve 13 and the inner wall of the sleeve 5 must also be excellent. Therefore, a groove needs to be provided on one side of the sleeve 5 at the location corresponding to the hose position to allow the hose to move, preventing the hose from being obstructed by the sleeve 5 when the control valve 13 moves. This groove is not connected to the interior of the control valve 13 or the interior of the diversion pipe 4.
[0071] The other end of the diversion pipe 4 is fixed to the main pipe 2, and the interior of the diversion pipe 4 is connected to the interior of the main pipe 2;
[0072] The outer diameter of the control valve 13 is the same as the inner diameter of the sleeve 5;
[0073] The interior of the diverter 4 is connected to the interior of the control valve 13 via the channel port 15.
[0074] In practice, the inside of the liquid control valve 13 is connected to the diversion pipe 4 only through the channel port 15. If the channel port 15 and the diversion pipe 4 are completely misaligned, the liquid in the diversion pipe 4 cannot enter the liquid control valve 13, and consequently the liquid cannot enter the nozzle 8.
[0075] The length of the outer wall of the control valve 13 at both ends above and below the channel opening 15 is greater than the inner diameter of the diversion pipe 4;
[0076] There is no gap between the outer wall of the control valve 13 and one end of the diversion pipe 4.
[0077] In specific implementation, as shown in the appendix Figure 9 To be continued Figure 11As shown, when the channel opening 15 is aligned with one end of the diversion pipe 4, the liquid in the main pipe 2 flows through the diversion pipe 4 and reaches the inside of the control valve 13 after passing through the channel opening 15. When the channel opening 15 is completely misaligned with the diversion pipe 4, the outer wall of the control valve 13 blocks the port of the diversion pipe 4, preventing the liquid from entering. The complete misalignment of the channel opening 15 and the diversion pipe 4 can mean that the control valve 13 is raised to the highest or second highest point, or it can mean that the control valve 13 is lowered to the lowest point. Simply put, the anti-corrosion plate is located above the copper-clad board. When the control valve 13 is raised to the second highest point, it means that the probe 7 is located on the upper surface of the anti-corrosion plate and does not need to be sprayed. Therefore, the liquid cannot enter the nozzle 8. When the control valve 13 is at the lowest point, it means that the probe 7 is not in contact with any part of the circuit board and the equipment is in a waiting state. In other words, the liquid sprayed by the nozzle 8 will not fall on the circuit board. Therefore, the liquid needs to be blocked in the diversion pipe 4.
[0078] The liquid control assembly also includes a first spring 14 fixed to the top of the liquid control valve 13;
[0079] The top of spring 14 is fixedly connected to the inner wall of the top of the channel opening 15;
[0080] In practical implementation, when the control valve 13 moves upward, it is driven by either the rigid lifting force from the circuit board on the probe wheel 7 or the rigid lifting force from the push plate 11 on the second ramp block 10. Therefore, the elastic force of the first spring 14 cannot resist these two lifting forces. The function of the first spring 14 is to help the control valve 13 quickly return to the lowest point when it is not driven by external force. Figure 9 The state shown indicates that, under normal circumstances, the outer wall of the control valve 13 is blocked from the port of the diversion pipe 4 when no external force is used to drive the liquid medicine that needs to enter the control valve 13 through the diversion pipe 4.
[0081] Small holes are provided at both the top and bottom of the passage 15, and there are no obstructions at the small holes.
[0082] In practice, during the lifting and lowering process, the control valve 13 is in close contact with the sleeve 5, and the control valve 13 is like a piston inside the sleeve 5. The gas inside the sleeve 5 needs to be released, so small holes are opened at the upper and lower ends of the sleeve 5 to allow the gas inside the sleeve 5 to be replaced by the outside gas.
[0083] The shifting assembly also includes a first ramp block 9 fixed to the probe 6;
[0084] The outer surface of probe 6 is fixed with ramp 10 above ramp 9;
[0085] Both the No. 1 ramp block 9 and the No. 2 ramp block 10 are equipped with several sets of the same number of nozzles as the No. 8.
[0086] Several groups of No. 1 ramp block 9 and No. 2 ramp block 10 are distributed in a mirror image with the middle of the main pipeline 2 as the center line;
[0087] The slope of the second ramp block 10 is all facing away from the middle of the main pipeline 2.
[0088] The inclined surfaces of ramp 9 all face the middle of the main pipe 2;
[0089] The slopes of ramp 9 (number 1) and ramp 10 (number 2) are staggered.
[0090] In specific implementation, as shown in the appendix Figure 2 and attached Figure 6 As shown, the two sets of clamping plates 3 move in a centered manner, and similarly, the two sets of push plates 11 also move in a centered manner. During this centered movement, the two sets of push plates 11 sequentially push several sets of second-order ramp blocks 10 they have contacted, causing the second-order ramp blocks 10 to move the probe rod 6 upwards. When the two sets of push plates 11 move in opposite directions, that is, when the push plates 11 return to their initial state, the push plate 12 sequentially contacts several sets of first-order ramp blocks 9 at corresponding positions, causing the probe rod 6 to move downwards back to its original position. The push plates 11 do not contact the first-order ramp blocks 9, and the push plate 12 does not contact the second-order ramp blocks 10.
[0091] The clamping plate 3, the top push plate 11, and the bottom push plate 12 are each provided with two sets;
[0092] The two sets of clamping plates 3, the top push plate 11, and the bottom push plate 12 are distributed in a mirror image;
[0093] The top side of the push plate 11 facing the middle of the main pipe 2 is set as an inclined surface;
[0094] The inclined surface of the second ramp block 10 is compatible with the inclined surface of the jacking plate 11.
[0095] One end of the push plate 12 is set as an inclined surface, and the inclined surface of the push plate 12 is adapted to the inclined surface of the first ramp block 9.
[0096] The inclined length of the top push plate 11 is greater than the inclined length of the first ramp block 9 and the bottom push plate 12;
[0097] The width of the push plate 11 is less than the interval between every two sets of sleeves 5.
[0098] In specific implementation, as shown in the appendix Figure 6 To be continued Figure 8As shown, when the push plate 11 pushes the second ramp block 10 to the highest point, the inclined surface of the first ramp block 9 and the inclined surface of the push plate 12 are exactly at the same horizontal height. Because the push plate 11 and the push plate 12 are continuously moving horizontally, and there is originally a height difference between the first ramp block 9 and the push plate 12, the push plate 12 will not contact the inclined surface of the first ramp block 9 when the second ramp block 10 is pushed. When the push plate 11 and the push plate 12 are reset, the second ramp block 10, which is at the highest point, no longer contacts the push plate 11. Instead, the push plate 12 pushes the first ramp block 9, forcing the first ramp block 9 and the probe rod 6 to move down and reset.
[0099] Both the top and bottom sides of buckle 16 are beveled.
[0100] A square groove adapted to the buckle 16 is provided on one side of the bottom of the liquid control valve 13;
[0101] A second spring 17 is fixed between one end of the buckle 16 and the inner wall of the sleeve 5.
[0102] In specific implementation, when the control valve 13 moves to its highest point, the latch 16 inserts into the square groove, limiting the control valve 13 and preventing it from easily moving downwards. Therefore, the elastic force of the second spring 17 must be greater than that of the first spring 14. The first spring 14 attempts to push the control valve 13 downwards, but it cannot allow the latch 16 to compress the second spring 17 and retract from the square groove. It should be noted here that the control valve 13 moving to its highest point as described in this invention refers to the attached... Figure 11 The state shown is that when the clip 16 is inserted into the square groove, the control valve 13 cannot move down to reset, and the liquid cannot enter the control valve 13. The control valve 13 moving to the second highest point means that the control valve 13 has moved up to the point where its outer wall blocks the port of the diversion pipe 4, preventing the liquid from entering the control valve 13. However, since the clip 16 is not inserted into the square groove, the control valve 13 can move down to reset. This means that when the probe wheel 7 is raised to its highest point, the position of the control valve 13 cannot be locked, and the probe wheel 7 can normally move according to the anti-corrosion plate. The trajectory of the copper-clad laminate fluctuates up and down at any time, but the push plate 11 can push the liquid control valve 13 to the highest position, preventing the liquid control valve 13 from moving down to reset. When the clamping plate 3 retracts, the push plate 12 will forcibly move the first ramp block 9, resisting the elastic force of the second spring 17, forcing the buckle 16 to separate from the liquid control valve 13. Therefore, the slope and height of the push plate 11 need to be sufficient to push the liquid control valve 13 to the highest point, while the slope length and height of the push plate 12 only need to pull the buckle 16 out of the square groove.
[0103] Working principle: When using the etching processing equipment for protective circuit boards of new energy vehicles, the circuit board is first conveyed to the designated position, and the two sets of clamping plates 3 are driven to move in the center and clamp the two sides of the circuit board. When the clamping plates 3 drive the push plate 11 and the push plate 12 to move together, the push plate 11 first contacts several sets of second ramp blocks 10 at the edge in sequence. The push plate 11 pushes the second ramp blocks 10 up. The second ramp blocks 10 drive the probe rod 6 and the liquid control valve 13 to be pushed to the highest position. At this time, the buckle 16 is driven by the rebound force of the second spring 17 to insert into the square groove, fixing the liquid control valve 13 at the highest position. The outer wall of the liquid control valve 13 blocks the diversion pipe 4, and the liquid cannot be delivered to the nozzle 8. Until the clamping plates 3 clamp the circuit board, the push plate 11 no longer moves. All the liquid control valves 13 in the area passed by the clamping plates 3 are pushed up to the highest point and block the liquid supply to the nozzle 8 at the corresponding position. Subsequently, the electromagnetic slide rail in the working box 1 drives the main pipe 2 to move. When several sets of probes 7 located above the circuit board contact the circuit board, the probes 7 are lifted. The probes 7 that encounter the copper-clad laminate are lifted to the middle section. At this time, the corresponding sets of liquid control valves 13 also move upwards simultaneously. When the channel opening 15 is aligned with the port of the diversion pipe 4, the liquid enters the nozzle 8 from the diversion pipe 4 along the liquid control valve 13. The liquid is sprayed normally onto the copper-clad laminate. The probes 7 that encounter the anti-corrosion plate are lifted to the second highest point. At this time, the corresponding sets of liquid control valves 13 also rise to the second highest point simultaneously, and the channel opening 15 is misaligned with the diversion pipe 4. The chemical solution cannot enter the nozzle 8, and the surface of the anti-corrosion plate is not covered with a large amount of etching solution. When the probe 7 rolls from the surface of the anti-corrosion plate to the surface of the copper-clad board, the rebound of the first spring 14 pushes the liquid control valve 13 down, so that the channel opening 15 is aligned with the port of the diversion pipe 4 again, and the chemical solution re-enters the nozzle 8 and sprays out. This process is repeated until the main pipe 2 moves from one end of the circuit board to the other end of the circuit board, and all the probes 7 leave the surface of the circuit board. Under the complete rebound reset of the first spring 14, several sets of liquid control valves 13 block all the chemical solution in the diversion pipe 4, and the equipment no longer sprays out the chemical solution.
[0104] After a period of settling, once the chemical solution has reacted with the exposed copper-clad laminate, the clamping plate 3 releases its grip on the circuit board. The top push plate 11 and the bottom push plate 12 retract with the clamping plate 3. Since the top push plate 11 had already pushed the second ramp block 10 to its highest point while the clamping plate 3 was holding the circuit board, the top push plate 11 is not obstructed by the second ramp block 10 during its retraction. Instead, the bottom push plate 12 contacts the first ramp block 9, pushing the first ramp block 9 downwards. This causes the first ramp block 9 to move the probe rod 6 and the liquid control valve 13 downwards simultaneously, forcing the latch 16 to be forced down. The second spring 17 is compressed and slides out of the square groove. The first spring 14, which is in a charged state, quickly pushes the liquid control valve 13 down to the lowest point. The push plate 11 retracts very quickly, so the push plate 11 and the second ramp block 10 will not collide. The liquid control valve 13 moves down and resets very quickly, so the channel opening 15 will quickly pass the port of the diversion pipe 4. There may be a little leakage of the liquid, but the amount of leakage is very small and can be ignored. The push plate 12 passes through the several sets of probes 6 that were previously lifted by the push plate 11 and pushes them down to assist in their reset.
[0105] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.
Claims
1. An etching processing equipment for protective circuit boards used in new energy vehicles, comprising a work box (1), a main pipe (2) disposed on the work box (1), and a clamping plate (3) disposed on the work box (1), characterized in that, Also includes: Several sets of sleeves (5) are set below the main pipe (2), nozzles (8) are fixed outside the sleeves (5), and liquid control components are set on the sleeves (5) to adaptively detect the position of the anti-corrosion plate and reduce the direct spraying of the liquid onto the anti-corrosion plate. The shifting component set on the work box (1) adaptively closes the excess nozzles (8) and frees up the space for the clamp (3) by utilizing the displacement of the clamp (3) according to the size of the circuit board. The liquid control component includes: The connection includes a diversion pipe (4) set on one side of the middle of the sleeve (5), a liquid control valve (13) movably inserted inside the sleeve (5), a probe rod (6) fixed at the bottom of the sleeve (5), a probe wheel (7) rotatably set at the bottom of the probe rod (6), and a channel opening (15) opened on one side of the liquid control valve (13). The dialing component includes: The top push plate (11) is fixed to one end of the clamp (3), the bottom push plate (12) is fixed to the top of one side of the top push plate (11), and the buckle (16) is movably set in the sleeve (5).
2. The etching equipment for protective circuit boards used in new energy vehicles according to claim 1, characterized in that: Several groups of nozzles (8) are equidistantly distributed in a linear array; Each set of nozzles (8) is fixed at the bottom end of each set of sleeves (5), and the nozzles (8) are set in an inclined position; The inside of the nozzle (8) is connected to the inside of the liquid control valve (13) via a hose.
3. The etching equipment for protective circuit boards used in new energy vehicles according to claim 1, characterized in that: The other end of the diversion pipe (4) is fixed to the main pipe (2), and the interior of the diversion pipe (4) is connected to the interior of the main pipe (2); The outer diameter of the liquid control valve (13) is the same as the inner diameter of the sleeve (5); The inside of the diversion pipe (4) is connected to the inside of the liquid control valve (13) through the channel port (15).
4. The etching equipment for protective circuit boards used in new energy vehicles according to claim 1, characterized in that: The length of the outer walls of the control valve (13) located above and below the channel opening (15) is greater than the inner diameter of the diverter pipe (4); There is no gap between the outer wall of the liquid control valve (13) and one end of the diversion pipe (4).
5. The etching equipment for protective circuit boards used in new energy vehicles according to claim 1, characterized in that: The liquid control assembly also includes a first spring (14) fixed to the top of the liquid control valve (13). The top of the first spring (14) is fixedly connected to the inner wall of the top of the channel opening (15); The top and bottom of the channel opening (15) are provided with small holes, and the small holes are unobstructed.
6. The etching equipment for protective circuit boards used in new energy vehicles according to claim 1, characterized in that: The shifting assembly also includes a first ramp block (9) fixed on the probe (6). The outer surface of the probe (6) is fixed with a second ramp block (10) above the first ramp block (9); Both the No. 1 ramp block (9) and the No. 2 ramp block (10) are provided with several groups of the same number as the nozzles (8); Several groups of the No. 1 ramp block (9) and No. 2 ramp block (10) are distributed in a mirror image with the middle of the main pipeline (2) as the center line; The slope of the second ramp block (10) is all facing away from the middle of the main pipeline (2); The inclined surfaces of the first ramp block (9) all face the middle of the main pipeline (2); The slopes of the first slope block (9) and the second slope block (10) are staggered.
7. The etching equipment for protective circuit boards used in new energy vehicles according to claim 6, characterized in that: The clamping plate (3), the top push plate (11), and the bottom push plate (12) are each provided with two sets; The two sets of clamping plates (3), top push plate (11) and bottom push plate (12) are mirror-distributed; The top side of the push plate (11) facing the middle of the main pipe (2) is set as an inclined surface; The inclined surface of the second ramp block (10) is adapted to the inclined surface of the push plate (11); One end of the push plate (12) is set as an inclined surface, and the inclined surface of the push plate (12) is adapted to the inclined surface of the first ramp block (9); The inclined length of the top push plate (11) is greater than the inclined length of the first ramp block (9) and the bottom push plate (12); The width of the push plate (11) is less than the interval between every two sets of sleeves (5).
8. The etching equipment for protective circuit boards for new energy vehicles according to claim 1, characterized in that: Both the upper and lower sides of the buckle (16) are set as bevels; The bottom side of the liquid control valve (13) is provided with a square groove that is compatible with the buckle (16); A second spring (17) is fixed between one end of the buckle (16) and the inner wall of the sleeve (5).